JP4075652B2 - Manufacturing method of semiconductor device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a semiconductor device having a high-accuracy circuit pattern and excellent in bonding accuracy with semiconductor components and other circuit boards.
[0002]
[Prior art]
As electronics products become lighter and smaller, printed circuit board patterning needs to be highly accurate. Among them, the demand for flexible film substrates is increasing because three-dimensional wiring is possible due to its flexibility and it is suitable for downsizing of electronic products. For example, TAB (Tape Automated Bonding) technology used for IC connection to a liquid crystal display panel can obtain a fine pattern of the highest level as a resin substrate by processing a relatively narrow wide polyimide film substrate. However, the progress of miniaturization is approaching the limit. For miniaturization, there are an index represented by a line width and a space width between lines, and an index represented by a position of a pattern on a substrate. The latter index, so-called positional accuracy, is related to the alignment of the electrode pad and the circuit board pattern when connecting the circuit board and the electronic component such as an IC, and the required accuracy is severe as the number of pins of the IC increases. It has become to.
[0003]
In view of the above positional accuracy, the flexible film substrate processing is becoming difficult to improve. Circuit board processing includes heat treatment processes such as drying and curing, and wet processes such as etching and development, and the flexible film repeatedly expands and contracts. The hysteresis at this time causes displacement of the circuit pattern on the substrate. In addition, when there are a plurality of processes that require alignment, if there is expansion or contraction between these processes, positional deviation occurs between the formed patterns. Deformation due to expansion and contraction of the flexible film has an even greater effect in the case of an FPC (Flexible Printing Circuit) in which processing is performed with a relatively large substrate size. Further, the positional shift is caused by an external force such as pulling or twisting, and special attention is required when a thin substrate is used to increase flexibility. On the other hand, it has been proposed to form a very fine circuit pattern by bonding a flexible film to a reinforcing plate and maintaining dimensional accuracy (for example, patents). Reference 1).
[0004]
The TAB or FPC to which the semiconductor components are bonded is further bonded to a liquid crystal display panel or a printed wiring board. Bonding of semiconductor components is called ILB (Inner Lead Bonding), while bonding to a liquid crystal display panel or printed wiring board is called OLB (Outer Lead Bonding). Conventionally, the bonding pitch of OLB has not been very fine and has not been a problem. However, as the liquid crystal panel has become highly precise, bonding accuracy has become a problem. According to Patent Document 1, ILB can be carried out with very high accuracy, but degradation of positional accuracy due to temperature / humidity change after circuit pattern fabrication to OLB and stress due to handling are considered. It wasn't.
[0005]
[Patent Document 1]
International Publication No. 03/009657 Pamphlet
[0006]
[Problems to be solved by the invention]
An object of the present invention is to solve the above-mentioned problems and to provide a method capable of carrying out high-precision semiconductor component mounting on a flexible film circuit board and bonding with other circuit patterns with high accuracy. is there.
[0007]
[Means for Solving the Problems]
  In order to achieve the above object of the present invention, the present invention comprises the following constitution.
(1) Via an organic layer on one side of the flexible filminorganicAfter bonding a reinforcing plate made of glass and then forming a circuit pattern on the other surface of the flexible film, the circuit plate is bonded to the semiconductor component and the liquid crystal display panel with the reinforcing plate bonded. A method of manufacturing a semiconductor device, comprising bonding a formed circuit pattern.
(2) The method for manufacturing a semiconductor device according to (1), wherein the flexible film is peeled off from the reinforcing plate after the circuit pattern is joined to the circuit pattern formed on the liquid crystal display panel.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, the flexible film is a plastic film, and it is important that the film has a heat resistance sufficient to withstand a thermal process in a circuit pattern manufacturing process and electronic component mounting, such as polycarbonate, polyether sulfide, Films such as polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyimide, polyamide, and liquid crystal polymer can be used. Among these, a polyimide film is preferably used because it is excellent in heat resistance and chemical resistance. In addition, a liquid crystal polymer is preferably used because it has excellent electrical characteristics such as low dielectric loss. It is also possible to employ a flexible glass fiber reinforced resin plate. Examples of the resin for the glass fiber reinforced resin plate include epoxy, polyphenylene sulfide, polyphenylene ether, maleimide, polyamide, and polyimide.
[0009]
The thickness of the flexible film is preferably thin in order to reduce the weight and size of electronic devices, or to form fine via holes. On the other hand, to ensure mechanical strength and maintain flatness. From the viewpoint that the thicker one is preferable, the range of 4 to 125 μm is preferable.
[0010]
In the present invention, the method of forming the circuit pattern is not particularly limited. For example, the circuit pattern can be formed by attaching a metal foil such as a copper foil with an adhesive layer, or by sputtering, plating, or a combination thereof. be able to. Alternatively, a flexible film with a metal layer can be obtained by coating, drying, and curing a raw film resin or a precursor thereof on a metal foil such as copper.
[0011]
  Substrates used as reinforcing plates in the present invention include inorganic glasses such as soda lime glass, borosilicate glass, and quartz glass, metals such as invar alloy, stainless steel, and titanium, ceramics and glass such as alumina, zirconia, and silicon nitride. A fiber-reinforced resin plate can be used. Both are preferable because of their low linear expansion coefficient and hygroscopic expansion coefficient, but they are excellent in heat resistance and chemical resistance in the circuit pattern manufacturing process, and are easy to obtain inexpensively because of their large area and high surface smoothness. A substrate made of inorganic glass is preferable in that it is difficult to be plastically deformed. Among these, borosilicate glass represented by aluminoborosilicate glass has a high elastic modulus and a small coefficient of thermal expansion.Used in LCD panelsTherefore, it is particularly preferable.
[0012]
When a metal or glass fiber reinforced resin is used for the reinforcing plate, it can be manufactured as a long continuous body, but the method for manufacturing a circuit board of the present invention should be a single wafer type because it is easy to ensure positional accuracy. Is preferred. A sheet means a state where it is handled as an individual sheet, not a long continuous body.
[0013]
When a glass substrate is used for the reinforcing plate, it is difficult to maintain flatness by the holding means during circuit pattern processing or when semiconductor components are joined if the thickness of the glass substrate is small. Further, warping and twisting increase due to the expansion / contraction force of the flexible film, and the glass substrate may be broken when vacuum-adsorbed on a flat mounting table. Moreover, a flexible film will deform | transform by vacuum adsorption | suction and removal | desorption, and there exists a tendency for ensuring of position accuracy to become difficult. On the other hand, when the glass substrate is thick, flatness is lowered due to uneven thickness, and the exposure accuracy is also lowered. In addition, the handling load by the robot or the like becomes large, and it becomes impossible to operate quickly, resulting in a decrease in productivity and an increase in transportation cost. From these points, the thickness of the glass substrate is preferably in the range of 0.3 mm to 1.1 mm.
[0014]
When a metal is used for the reinforcing plate, if the thickness of the metal substrate is small, it is difficult to maintain flatness by the holding means during circuit pattern processing or when joining semiconductor components. Also, warping and twisting increase due to the expansion / contraction force of the flexible film, and the flexible film cannot be vacuum-adsorbed on a flat mounting table, or the flexible film is deformed by the amount of warping or twisting of the metal substrate. As a result, a predetermined positional accuracy cannot be ensured. Further, if there is a fold, it becomes a defective product at that time. On the other hand, when the metal substrate is thick, the flatness is lowered due to uneven thickness, and the exposure accuracy is also lowered. In addition, the handling load by a robot or the like increases, and it becomes impossible to operate quickly, resulting in a decrease in productivity and an increase in transportation cost. Therefore, the thickness of the metal plate is preferably in the range of 0.1 mm to 0.7 mm.
[0015]
An adhesive or a pressure-sensitive adhesive is used as the organic layer that bonds the flexible film and the reinforcing plate used in the present invention. When the semiconductor device manufacturing process includes a process of peeling the flexible film from the reinforcing plate, examples of the adhesive or pressure-sensitive adhesive include an acrylic or urethane-based pressure-sensitive adhesive. Adhesive strength in the region called weak to medium adhesive is preferable in order to have sufficient adhesive force during flexible film processing, and can be easily peeled off during peeling and does not cause distortion in the flexible film substrate. . A silicone resin having tackiness can also be used. It is also possible to use an epoxy resin having tackiness.
[0016]
Adhesives called re-peelable are those that have reduced adhesive strength and adhesive strength at low temperatures, those that have reduced adhesive strength and adhesive strength by UV irradiation, and those that have reduced adhesive strength and adhesive strength by heat treatment. Used for. Among these, those caused by ultraviolet irradiation are preferable because of large changes in adhesive strength and adhesive strength. An example of a material whose adhesive strength and adhesive strength are reduced by ultraviolet irradiation is a two-component cross-linking acrylic pressure-sensitive adhesive. Examples of those in which adhesive strength and adhesive strength decrease in a low temperature region include acrylic pressure-sensitive adhesives that reversibly change between a crystalline state and an amorphous state, and are preferably used.
[0017]
In this invention, peeling force is measured by 180 degree direction peel strength when peeling the flexible film of 1 cm width bonded with the reinforcement board through the organic substance layer. The peeling speed when measuring the peeling force is 300 mm / min. In the present invention, the peel force is preferably in the range of 0.1 g / cm to 100 g / cm.
[0018]
The thickness of the organic layer of the present invention is preferably in the range of 0.1 μm to 20 μm, and more preferably in the range of 0.3 μm to 10 μm.
[0019]
In order to improve the adhesive force between the reinforcing plate and the organic layer, the reinforcing plate may be subjected to a primer treatment such as application of a silane coupling agent. In addition to the primer treatment, cleaning by ultraviolet treatment, ultraviolet ozone treatment, etc., surface roughening treatment such as chemical etching treatment, sand blast treatment or fine particle dispersion layer formation is also preferably used.
[0020]
In the flexible film used in the present invention, a circuit pattern may be formed on one surface which is a pasting surface prior to pasting with the reinforcing plate. In this case, it is preferable to form an alignment mark with the circuit pattern formed on the other surface simultaneously with the pattern formation. In order to make use of the high definition of the high definition pattern formed on the surface opposite to the bonding surface, it is very effective for the production of the high definition pattern to provide the alignment mark. The alignment mark reading method is not particularly limited, and for example, an optical method, an electrical method, or the like can be used. The alignment mark can also be used for alignment when the flexible film is bonded to the reinforcing plate. The shape of the alignment mark is not particularly limited, and a shape generally used in an exposure machine or the like can be suitably used.
[0021]
After the flexible film is attached to the reinforcing plate, the circuit pattern formed on the surface opposite to the attaching surface of the flexible film is not deformed by the reinforcing plate and the metal layer during processing. In particular, a highly accurate pattern can be formed.
[0022]
According to the present invention, it is possible to easily provide a circuit board with double-sided wiring in which a particularly fine pattern is formed on one side. Advantages of using double-sided wiring include crossover through through-holes, increasing the degree of freedom in wiring design, and LSI that operates at high speed by propagating the ground potential to the vicinity of the required location with thick wiring In addition, the power supply potential can be propagated to the vicinity of the necessary location with thick wiring as well, so that the potential drop can be prevented even at high-speed switching, the operation of the LSI can be stabilized, and external noise can be blocked as an electromagnetic wave shield. This is very important as the LSI speeds up and the number of pins is increased due to the increased functionality.
[0023]
Furthermore, in the present invention, it is possible to use a reinforcing plate when processing both sides of a flexible film, and to form a pattern with particularly high precision on both sides. For example, the first reinforcing plate and the second surface of the flexible film are bonded together via an ultraviolet curable organic material layer to form a circuit pattern on the first surface of the flexible film. After the first surface and the second reinforcing plate are bonded together via an ultraviolet curable organic material layer, the flexible film is peeled off from the first reinforcing plate, and then the circuit is formed on the second surface of the flexible film. There is a method of peeling the flexible film from the second reinforcing plate after forming the pattern, and high-precision circuit pattern processing can be realized on both sides.
[0024]
An example of the method for producing a circuit board of the present invention will be described below, but the present invention is not limited to this.
[0025]
A silane coupling agent is applied to an aluminoborosilicate glass having a thickness of 0.7 mm using a spin coater, blade coater, roll coater, bar coater, die coater, screen printer or the like. In order to uniformly apply a thin film of a silane coupling agent having a relatively low viscosity to a single substrate that is intermittently sent, it is preferable to use a spin coater. After application of the silane coupling agent, drying is performed by heat drying or vacuum drying to obtain a silane coupling agent layer having a thickness of 20 nm.
[0026]
Next, an ultraviolet curable organic substance is applied onto the silane coupling agent layer by a spin coater, blade coater, roll coater, bar coater, die coater, screen printer or the like. In order to uniformly apply an organic substance having a relatively high viscosity to a single-wafer substrate sent intermittently, it is preferable to use a die coater. After the organic substance is applied, it is dried by heat drying or vacuum drying to obtain an organic substance layer having a thickness of 2 μm. An air blocking film in which a silicone resin layer is provided on a polyester film is attached to the organic material layer and aged for one week. Instead of laminating an air blocking film, it can be stored in a nitrogen atmosphere or in a vacuum. It is also possible to apply the organic layer to a long film substrate, transfer it to a single substrate after drying.
[0027]
In the present invention, the organic layer may be initially formed on the flexible film side, may be formed on the reinforcing plate side, or may be formed on both. In order to control the ease of formation and the peeling interface so as to be a flexible film and an organic layer, it is preferably formed on the reinforcing plate side.
[0028]
Next, the air blocking film is peeled off, and a polyimide film is attached. The thickness of the polyimide film is preferably in the range of 4 μm to 125 μm. As described above, a metal layer may be formed in advance on one side or both sides of the polyimide film. It is preferable to provide a metal layer on the side of the polyimide film on which the reinforcing plate is attached because it can be used as a ground layer for shielding electromagnetic waves. The polyimide film may be pasted in a cut sheet of a predetermined size, or may be pasted and cut while being unwound from a long roll. A roll-type laminator or a vacuum laminator can be used for such a pasting operation.
[0029]
After the polyimide film is attached to the glass substrate, the ultraviolet curable organic layer is irradiated with ultraviolet rays to cause crosslinking.
[0030]
When the metal layer is not provided in advance on the surface opposite to the bonding surface of the polyimide film, the metal layer can be formed by a full additive method or a semi-additive method.
[0031]
The full additive method is, for example, the following process. The surface on which the metal layer is to be formed is treated with a catalyst such as palladium, nickel or chromium and dried. The catalyst referred to here does not act as a nucleus for plating growth as it is, but it becomes a nucleus for plating growth by activation treatment. Next, the photoresist is applied by a spin coater, a blade coater, a roll coater, a bar coater, a die coater, a screen printer or the like, and dried. The photoresist is exposed and developed through a photomask having a predetermined pattern to form a resist layer in a portion where a plating film is unnecessary. Thereafter, after activating the catalyst, the polyimide film is immersed in an electroless plating solution composed of a combination of copper sulfate and formaldehyde to form a copper plating film having a thickness of 2 μm to 20 μm. Get.
[0032]
The semi-additive method is, for example, the following process. On the surface on which the metal layer is to be formed, chromium, nickel, copper or an alloy thereof is sputtered to form an underlayer. The thickness of the underlayer is usually in the range of 1 nm to 1000 nm. It is preferable to stack a copper sputtered film on the underlayer of 50 nm to 3000 nm in order to ensure sufficient conduction for subsequent electrolytic plating, to improve the adhesion of the metal layer, and to prevent pinhole defects. Prior to the formation of the underlayer, plasma treatment, reverse sputtering treatment, primer layer coating, and adhesive layer coating are suitably used to improve the adhesive strength on the polyimide film surface. Among them, the application of an adhesive layer such as epoxy resin, acrylic resin, polyamide resin, polyimide resin, and NBR is preferable because it has a great effect of improving the adhesive force. These treatments and application may be performed before the glass substrate is pasted, or may be performed after the glass substrate is pasted. It is preferable that continuous processing is performed roll-to-roll with respect to a long polyimide film before the glass substrate is attached in order to improve productivity. A photoresist is applied onto the underlayer thus formed by a spin coater, blade coater, roll coater, die coater, screen printer, or the like and dried. The photoresist is exposed and developed through a photomask having a predetermined pattern to form a resist layer in a portion where a plating film is unnecessary. Next, electrolytic plating is performed using the base layer as an electrode. As the electrolytic plating solution, a copper sulfate plating solution, a copper cyanide plating solution, a copper pyrophosphate plating solution, or the like is used. After forming a copper plating film with a thickness of 2 μm to 20 μm, the photoresist is peeled off, and then the underlying layer is removed by a light etching, and further, gold, nickel, tin, etc. are plated if necessary, and a circuit pattern Get.
[0033]
After the air blocking film on the glass substrate is peeled off, the surface on which the circuit pattern is formed is used as the bonding surface, and after the polyimide film is attached to the glass substrate, the above-mentioned semi-additive method, full additive method, or subtractive method By using this method, a high-definition circuit pattern is formed on the surface opposite to the bonding surface.
[0034]
The subtractive method is a method in which a circuit pattern is formed using a photoresist and an etching solution when a solid metal layer is formed on a polyimide film, and the manufacturing process is short and the cost is low. .
[0035]
In particular, in order to obtain a high-definition circuit pattern, it is preferable to employ a semi-additive method or a full additive method.
[0036]
Furthermore, a connection hole can be provided in the polyimide film. That is, it is possible to provide a via hole for electrical connection with the metal layer provided on the bonding surface side with the glass substrate, or to provide a ball mounting hole for the ball grid array. As a method for providing the connection hole, laser drilling such as a carbon dioxide laser, YAG laser, or excimer laser, or chemical etching can be employed. In the case of employing laser etching, it is preferable that a metal layer is present on the glass film attachment surface side of the polyimide film as an etching stopper layer.
[0037]
As the chemical etching solution for the polyimide film, hydrazine, potassium hydroxide aqueous solution, or the like can be used. Further, a patterned photoresist or a metal layer can be employed as the chemical etching mask. When electrical connection is made, it is preferable that after the connection hole is formed, the inner surface of the hole is made into a conductor by plating at the same time as the formation of the metal layer pattern. The diameter of the connection hole for electrical connection is preferably 15 μm to 200 μm. The hole for installing the ball preferably has a diameter of 80 μm to 800 μm.
[0038]
Although the timing for forming the connection holes is not limited, it is preferable to form the connection holes from the opposite side of the polyimide film bonding surface after the polyimide film is bonded to the glass substrate.
[0039]
If necessary, a solder resist film is formed on the circuit pattern. For fine circuit patterns, it is preferable to use a photosensitive solder resist. A photosensitive solder resist is applied onto the circuit pattern with a spin coater, blade coater, roll coater, bar coater, die coater, screen printing machine, etc., dried, and then exposed to ultraviolet rays through a predetermined photomask and developed. Thus, a solder resist pattern is obtained. Next, curing is performed at 100 ° C. to 200 ° C.
[0040]
When forming a high-definition circuit pattern on both sides of a flexible film, the flexible film is bonded to the glass substrate, and the subtractive method, semi-additive method or full additive method is opposite to the glass substrate bonding surface. A circuit pattern is formed on the side surface, and then the circuit forming surface side of the flexible film is bonded to another glass substrate, then the first glass substrate is peeled off, and the other surface is subjected to a subtractive method. A method of forming a circuit pattern by a semi-additive method or a full additive method and then peeling the glass substrate is preferably used.
[0041]
A semiconductor component such as an LSI is bonded to a high-accuracy circuit pattern processed by being bonded to glass. As the semiconductor component mounting apparatus, a device having an optical position detection function and a positioning function such as a movable stage, which can ensure mounting accuracy is preferably used. The present invention is particularly effective in ensuring the mounting accuracy of a large-scale LSI with a small joining pitch and a large number of pins. In addition, as a method for joining the semiconductor component and the circuit board, there is a method in which a metal layer formed at the joint portion of the circuit board and a metal layer formed at the joint portion of the semiconductor component are thermocompression bonded to perform metal joining. In addition, the anisotropic conductive adhesive or non-conductive adhesive placed between the circuit board and the semiconductor component is cured while the metal layer formed at the junction of the circuit board and the metal layer formed at the joint of the semiconductor component are crimped. And a method of mechanically joining them.
[0042]
The circuit board on which the semiconductor component is mounted is bonded to a circuit pattern formed on another board. This process is called OLB, and other substrates include liquid crystal display panels in which wiring is formed on a glass substrate and printed wiring boards. The bonding device for OLB has an optical position detection function. And a movable stage having a positioning function and ensuring mounting accuracy are preferably used. This is the output or input side of the semiconductor device of the present invention. As a method of joining a circuit board on which a semiconductor component is mounted and a circuit pattern formed on another board, a metal layer formed on a joint portion of the circuit board on which the semiconductor part is mounted and a circuit on another board There is a method in which a metal layer formed on a bonding portion on a pattern is thermocompression-bonded to perform metal bonding. In addition, the anisotropic is arranged between the circuit board and the electronic component while crimping the metal layer at the junction of the circuit board on which the electronic component is mounted and the metal layer formed at the junction on the circuit pattern on the other substrate. The method of hardening | curing a conductive adhesive or a nonelectroconductive adhesive, and making it join mechanically can also be mentioned.
[0043]
After the circuit board on which the semiconductor component is mounted is joined to a circuit pattern formed on another board, the reinforcing plate is peeled off from the flexible film as necessary. At this time, it is preferable that ILB and OLB are applied to the same surface of the flexible film in terms of easy peeling of the reinforcing plate.
[0044]
Forming a plurality of circuit patterns on a flexible film and joining them together with a circuit pattern formed on another substrate is a preferred embodiment of the present invention because the number of steps can be greatly reduced. That is, a large-sized liquid crystal display is equipped with a plurality of driver ICs. According to the present invention, a semiconductor device made of a flexible substrate having a plurality of driver ICs can be bonded to the liquid crystal display substrate at a time. It is.
[0045]
【Example】
  Example 1
  As a flexible film, thickness 25μm, 290mmwidthPolyimide film (“Kapton” 100EN manufactured by Toray DuPont Co., Ltd.) was prepared. A long polyimide film is mounted on a reel-to-reel sputtering device, and an alloy film of 6 nm thickness chromium: nickel = 20: 80 (weight ratio) and a copper film thickness of 100 nm are laminated on the polyimide film in this order. did.
[0046]
A 0.7 mm thick, 300 mm square aluminoborosilicate glass prepared as a reinforcing plate is coated with an ultraviolet curable adhesive “SK Dyne” SW-22 (manufactured by Soken Chemical Co., Ltd.) and a curing agent L45 (Soken). (Chemical Co., Ltd.) mixed at 100: 3 (weight ratio) was applied and dried at 80 ° C. for 2 minutes. The organic layer thickness after drying was set to 2 μm. Next, an air blocking film made of a film in which a silicone resin layer that is easy to release was provided on a polyester film was attached to the organic material layer and left for one week.
[0047]
  The air blocking film was peeled off, and a polyimide film with a copper film formed was attached to the glass organic layer side with a roll laminator with a cutter.The polyimide film bonded to the glass was cut according to the glass end.The surface opposite to the bonding surface of the polyimide film with the glass was the copper film surface.Thereafter, the organic layer was cured by irradiating ultraviolet rays from the glass substrate side.
[0048]
Next, a positive photoresist was applied onto the copper film with a spin coater and dried at 90 ° C. for 30 minutes. The photoresist was exposed and developed through a photomask to form a photoresist having a thickness of 10 μm in a portion where a plating film was unnecessary.
[0049]
The test photomask pattern was as follows. As the IL part, 400 connection pads (width 20 μm, length 200 μm) were provided in parallel at two rows at a pitch of 40 μm. The two connection pad rows were arranged so that the centers of the opposite connection pads were 1.5 mm apart. Further, as the OL part, the connection pad row was separated by 14 mm in parallel, and the connection pad row was centered in the length direction, and 400 connection pads (width 30 μm, length 500 μm) were provided at a pitch of 70 μm. . The connection pad row of the IL part and the connection pad row of the OL part and the wiring of 17 μm width connecting the corresponding connection pads are regarded as one unit, and this is arranged in 6 rows × 6 columns at a pitch of 40 mm on a 300 square substrate. Evenly arranged.
[0050]
Next, a copper film having a thickness of 5 μm was formed by electrolytic plating in a copper sulfate plating solution using the copper film as an electrode. The photoresist was stripped with a photoresist stripping solution, and then the copper film and the chromium-nickel alloy film that were under the resist layer were removed by soft etching with a hydrogen peroxide-sulfuric acid aqueous solution. Subsequently, a 0.4 μm thick tin film was formed on the copper plating film by electroless plating. The solder resist was screen printed except for the IL and OL portions of the circuit board, dried at 60 ° C. for 30 minutes, and then cured at 140 ° C. for 60 minutes. The solder resist thickness after drying was 20 μm. Thus, a circuit board member was obtained.
[0051]
A model IC chip, in which 400 gold-plated bumps are arranged in a line at the 50 μm pitch and arranged in parallel at 1.5 mm intervals on the IL part of the circuit pattern, is heated to 300 ° C. from the IC chip side by a flip chip bonder. Then, the connection pad on the polyimide film was metal-bonded. After the IC bonding, the glass and polyimide film were cut, and 36 unit circuit patterns on the substrate were cut into individual pieces. The circuit board member was left in an atmosphere of 30 ° C. and 80% RH for one week.
[0052]
The liquid crystal display panel was adsorbed on the stage of a flip chip bonder, and an anisotropic conductive film was temporarily bonded onto a 70 μm pitch electrode pad array made of a transparent conductive film provided on the glass of the liquid crystal display panel. The glass surface of the obtained circuit board member for circuit pattern mounting was adsorbed to the heating head side. The electrode pad of the liquid crystal display panel and the connection pad on the polyimide film were joined while heating to 230 ° C. from the heating head side. The alignment at the time of joining was good, and all 36 units could be joined without any problem.
[0053]
Example 2
In the same manner as in Example 1, a circuit board member with a solder resist was obtained, and a model IC was joined to the IL portion. Thereafter, 36 unit circuit patterns were cut into individual pieces. The circuit board member was left in an atmosphere of 30 ° C. and 80% RH for one week.
[0054]
The liquid crystal display panel was adsorbed on the stage of a flip chip bonder, and a non-conductive paste was applied onto a 70 μm pitch electrode pad array made of a transparent conductive film provided on the glass of the liquid crystal display panel. The glass surface of the obtained circuit board member for circuit pattern mounting was adsorbed to the heating head side. The electrode pad of the liquid crystal display panel and the OL partial connection pad on the polyimide film were joined while heating to 240 ° C. from the heating head side. The alignment at the time of joining was good, and all 36 units could be joined without any problem.
[0055]
Example 3
In the same manner as in Example 1, a circuit board member with a solder resist was obtained, and a model IC was joined to the IL portion. Then, about 36 units of circuit patterns, the glass and polyimide film were cut | disconnected in the state which continued 3 units in the electrode pad row | line | column length direction. That is, 12 samples were produced. The circuit board member was left in an atmosphere of 30 ° C. and 80% RH for one week.
[0056]
The liquid crystal display panel was adsorbed on the stage of a flip chip bonder, and an anisotropic conductive film was temporarily bonded onto a 70 μm pitch electrode pad array made of a transparent conductive film provided on the glass of the liquid crystal display panel. The glass surface of the obtained 3 units of circuit pattern-mounted circuit board members was adsorbed to the heating head side. While heating from the heating head side to 240 ° C., the electrode pads of the liquid crystal display panel and the connection pads on the polyimide film were bonded together for 3 units. The alignment at the time of the 12-time joint of the 3 unit batch performed was good, and all could be joined without any problem.
[0057]
Example 4
In the same manner as in Example 1, a circuit board member with a solder resist was obtained, and a model IC was joined to the IL portion. Thereafter, 36 unit circuit patterns were cut into individual pieces. The circuit board member was left in an atmosphere of 30 ° C. and 80% RH for one week.
[0058]
In the same manner as in Example 1, the electrode pad of the liquid crystal display panel and the OL partial connection pad on the polyimide film were joined. The alignment at the time of joining was good, and all 36 units could be joined without any problem. Subsequently, the edge part on the opposite side to the location joined with the liquid crystal display of a polyimide film was vacuum-sucked, and it peeled from the glass substrate gradually from the film edge part.
[0059]
Comparative Example 1
In the same manner as in Example 1, a circuit board member with a solder resist was obtained, and a model IC was joined to the IL portion. Thereafter, one end of the flexible film was vacuum-adsorbed and gradually peeled off from the end. The circuit pattern of 36 units of the circuit board peeled from the glass was cut into individual pieces. The circuit board member was left in an atmosphere of 30 ° C. and 80% RH for one week.
[0060]
The liquid crystal display panel was adsorbed on the stage of a flip chip bonder, and an anisotropic conductive film was temporarily bonded onto a 70 μm pitch electrode pad array made of a transparent conductive film provided on the glass of the liquid crystal display panel. The polyimide film surface of the obtained circuit board was adsorbed to the heating head side. While heating from the heating head side to 230 ° C., an attempt was made to join the electrode pad of the liquid crystal display panel and the OL partial connection pad on the polyimide film. Of the 36 units, 5 units did not complete alignment.
[0061]
【The invention's effect】
According to the present invention, the deformation of a circuit board based on a flexible film due to temperature, humidity, or external force such as pulling or twisting is suppressed, and a semiconductor component and a circuit pattern formed on another board are bonded. This is very effective in improving the positional accuracy related to the alignment accuracy between the electrode pad and the circuit board pattern on the flexible film.

Claims (2)

A reinforcing plate made of inorganic glass is bonded to one side of the flexible film with an organic layer interposed therebetween, and then a circuit pattern is formed on the other surface of the flexible film, and then the reinforcing plate is bonded. A method of manufacturing a semiconductor device, comprising: bonding a semiconductor component and a circuit pattern formed on a liquid crystal display panel to the circuit pattern. 2. The method of manufacturing a semiconductor device according to claim 1, wherein the flexible film is peeled off from the reinforcing plate after the circuit pattern is joined to the circuit pattern formed on the liquid crystal display panel.