JP4222074B2 - Circuit board manufacturing method and manufacturing apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a circuit board manufacturing method and apparatus.
[0002]
[Prior art]
In the conventional method for manufacturing a circuit board, the flexible film is a protective film, and the rigid board from which the flexible film has been peeled is a board on which a circuit is formed. Therefore, peeling of the flexible film is focused on reliably peeling the flexible film, and no attention has been paid to peeling while maintaining the quality of the flexible film itself.
[0003]
In recent years, it has been proposed to form a very fine circuit pattern by laminating a flexible film on a reinforcing plate and maintaining dimensional accuracy, and then mount an electronic component such as an IC chip (for example, Patent Document 1). In this technology, a flexible film on which electronic components are mounted is peeled off from the reinforcing plate. However, if the static electricity when peeling the flexible film from the reinforcing plate is large, the flexible film is mounted on the flexible film. Electronic components may be destroyed. In addition, due to the generation of static electricity, a fine circuit is broken by discharge, and the film becomes difficult to handle due to electrification, and dust is easily adsorbed, which causes a reduction in production yield. Therefore, it is required to peel the flexible film without generating electrostatic charge as much as possible.
[0004]
On the other hand, as a method of peeling the flexible film while suppressing electrostatic charging, a method of blowing air ionized by an ionizer or the like is known (for example, see Patent Document 2). In addition, a method has been proposed in which the peeling process is performed in a partitioned space and the humidity is always set to 60% RH or higher (see, for example, Patent Document 3). However, in these methods, the peeling interface that appears in turn by peeling is in the back of an extremely narrow space sandwiched between the flexible film and the reinforcing plate, and sufficient ionized air or It is difficult to supply water vapor.
[0005]
[Patent Document 1]
International Publication No. 03/009657 Pamphlet
[0006]
[Patent Document 2]
JP 2002-69395 A (page 2)
[0007]
[Patent Document 3]
JP 2000-26019 A (page 3)
[0008]
[Problems to be solved by the invention]
The objective of this invention is providing the peeling method and peeling apparatus which can suppress the damage by the static electricity to the mounted electronic component by suppressing generation | occurrence | production of the charge of the flexible film at the time of peeling.
[0009]
[Means for Solving the Problems]
That is, the present invention relates to (1) a method for producing a circuit board, in which a flexible film having a circuit pattern attached to a reinforcing plate via an organic layer that can be peeled off is peeled from the reinforcing plate. A method of manufacturing a circuit board, wherein a liquid is present between flexible films and the reinforcing plate and the flexible film are peeled off.
(2) The method for producing a circuit board according to (1), wherein the liquid is supplied by a nozzle.
(3) The method of manufacturing a circuit board according to (1), wherein an electronic component is bonded to the circuit pattern.
(4) Circuit board manufacturing apparatus for peeling a flexible film after forming a circuit pattern on a surface opposite to a bonding surface of the flexible film attached to the reinforcing plate via an organic layer that can be peeled off An apparatus for manufacturing a circuit board, comprising means for supplying a liquid between the reinforcing plate and the flexible film.
(5) A nozzle for supplying a liquid, a holding means for holding the flexible film, a means for fixing the reinforcing plate, a container for containing the liquid, and the flexible film and the reinforcing plate are fixed in the container. The circuit board manufacturing apparatus according to (4), further comprising a fixing unit.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a schematic front view of a peeling apparatus 1 which is an aspect of the present invention, and FIG. 2 is a schematic front view of a peeling apparatus 20 which is another aspect of the present invention.
[0011]
First, the peeling apparatus 1 in FIG. 1 will be described. Using a flexible film substrate 7 (a general term for the flexible film 6, the peelable organic material layer 5, and the reinforcing plate 4) bonded to the reinforcing plate through the organic material layer 5 that can peel the flexible film 6, There is a peeling device 1 for peeling the flexible film 6 from the reinforcing plate 4. The peeling apparatus 1 includes a container 2 filled with a liquid 3 and a peeling unit 12 that peels the flexible film 6 from the reinforcing plate 4.
[0012]
The container 2 has a peeling unit 12 inside, and the liquid 3 is filled so that the peeling position of the flexible film 6 and the reinforcing plate 4 is located in the liquid.
[0013]
The peeling unit 12 includes a peeling roll 8, a substrate fixing roll 10 that holds a reinforcing plate of a non-attached portion of the flexible film substrate 7 at the time of peeling, a flexible film holding portion 11, and a flexible film moving belt 13. The belt driving roll 9 is used. The flexible film moving belt 13 is rotated by a belt driving roll 9 that is rotated by a driving source (not shown) to move the flexible film substrate 7. After completion of the peeling, the reinforcing plate 4 and the flexible film 6 are transferred to the next step by the substrate moving belt 13 or a transfer means (not shown). The peeling roll 8, the substrate fixing roll 10, and the substrate moving belt 13 can be independently rotated by a driving source (not shown), and are synchronized so that the peeling position of the reinforcing plate 4 and the flexible film 6 is constant. Control is performed. The flexible film holding part 11 is installed at one end of the peeling roll 8 and holds the end part of the flexible film 6 in a hook shape. The flexible film holding part 11 operates so as to reduce the space between the hook-shaped part of the flexible film holding part 11 and the peeling roll 8 by a driving source (not shown). The flexible film 6 is held at one end of the peeling roll 8 by sandwiching the flexible film 6 between the mold part and the peeling roll 8. After the completion of peeling, the flexible film holding unit 11 releases the flexible film 6 and transfers it to the substrate moving belt 13. The peeling unit 12 is mounted in the container 2 so as to freely move up and down, and can be moved up and down freely by a drive source (not shown). It is also possible to use a double-sided tape or the like instead of the hook portion of the film holding portion 11.
[0014]
The peeling method of the flexible film 6 using the peeling apparatus 1 shown in FIG. 1 is demonstrated.
[0015]
After raising the peeling unit 12 to the highest point, the flexible film substrate 7 is placed on the substrate moving belt 13 by transfer means (not shown). Subsequently, the flexible film substrate 7 is lowered to a predetermined height while being placed on the substrate moving belt 13. Thereafter, the flexible film substrate 6 is moved by rotating the substrate moving belt 13, moved to a position where it is sandwiched by the substrate fixing roll 10, and is sandwiched and fixed by the substrate fixing roll 10. Subsequently, the substrate fixing roll 10 and the substrate moving belt 13 are rotated and moved to a position where the flexible film holding unit 11 can hold the film, and the flexible film holding unit 11 moves the film to the peeling roll 8. Hold. At this time, it is preferable that a part of the flexible film protrudes from the front end side in the substrate traveling direction because the flexible film can be easily held by the holding unit 11. Further, as a method of fixing the flexible film substrate 7, a method of suppressing the width direction of the substrate traveling direction with a rod-shaped one is also effective. Thereafter, the peeling roll 8, the substrate moving belt 13, and the substrate fixing roll 10 are rotated synchronously so that the peeling position becomes constant, and the flexible film 7 is moved while the reinforcing plate 4 is moved. Peel off and wind up. When the peeling is completed, the substrate moving roll 9 is raised to a predetermined position, and the reinforcing plate 4 is transferred to the next step. Further, the flexible film 6 is released from the flexible film holding portion 11 and placed on the substrate moving belt 13. Thereafter, the flexible film 6 is moved by the substrate moving belt 13, and the flexible film 6 is transferred to the next step. Subsequently, the same operation is repeated thereafter, and the next flexible film substrate 7 is peeled off.
[0016]
Next, the peeling apparatus 20 described in FIG. 2 is demonstrated as another aspect of this invention. The peeling device 20 includes a peeling unit 12 that peels the container 22, the liquid spraying portion 21, and the flexible film 6 from the reinforcing plate 4.
[0017]
The liquid blowing unit 21 supplies the liquid so that the liquid enters between the reinforcing plate 4 and the flexible film 6. It is also preferable to supply to the part where peeling is proceeding. In this case, the outlet direction is adjusted and the discharge pressure is adjusted.
[0018]
The container 22 is provided for the purpose of not affecting the environment of the process chamber, and the flexible film substrate carry-in port 23 and the flexible film substrate carry-out port 24 are adjusted to the size of the flexible film substrate 7. Adjust. The shape of the drainage port 25 is appropriately determined so that the drainage speed is greater than the water discharge speed of the liquid 26 in the liquid spraying part 21.
[0019]
Next, the peeling method of the flexible film 6 using the peeling apparatus 20 is demonstrated. The flexible film substrate 7 is inserted from the flexible film substrate entrance 23, moved by the substrate moving belt 13, and moved to a position where it is sandwiched by the substrate fixing roll 10, and the substrate fixing roll 10 and the substrate moving belt are moved. 13 and fix it. Subsequently, the substrate fixing roll 10 is moved to a position where the flexible film holding unit 11 can hold the film, and the flexible film holding unit 11 holds the film. At this time, the liquid 26 starts to be discharged from the liquid spraying portion 21. Thereafter, the peeling roll 8, the substrate moving belt 13, and the substrate fixing roll 10 are rotated synchronously so that the peeling position is constant, and the flexible film 6 is moved while the reinforcing plate 4 is moved. Remove at 8 and take up. While peeling is in progress, the liquid 26 is supplied between the reinforcing plate 4 and the flexible film 6 at the peeled portion due to the discharge of the liquid from the sprayed portion 21. When the peeling is completed, the discharge is stopped from the liquid spraying part 21. The reinforcing plate 4 on the substrate moving belt 13 is transferred to the next step. Further, the flexible film 6 is released from the flexible film holding portion 11 and placed on the substrate moving belt 13. Thereafter, the flexible film 6 is moved by the substrate moving belt 13, and the flexible film 6 is transferred to the next step. Subsequently, the same operation is repeated thereafter, and the next flexible film substrate 7 is peeled off.
[0020]
When an electronic component such as an IC chip is mounted, as shown in FIG. 3, the peeling roll 8 may be provided with an electronic component storage recess 30 so that the electronic component 31 does not interfere. preferable. The electronic component storage recess 30 may be resized by providing an adapter.
[0021]
The present invention not only controls the charging of the flexible film but also does not lead to a discharge between the flexible film and the reinforcing plate even if there is a charge. Can be prevented. That is, when positive and negative charges are opposed to each other with a narrow gap between the reinforcing plate and the flexible film immediately after peeling, a capacitor is formed in the narrow gap between the reinforcing plate and the flexible film. When the opposite positive and negative charges are the same, the voltage appearing in the gap is inversely proportional to the capacitance of the capacitor, and the capacitance is proportional to the relative dielectric constant of the substance in the gap. Therefore, the voltage that appears is inversely proportional to the relative permittivity of the material in the gap. Therefore, since the relative permittivity of the liquid is larger than the relative permittivity of air, the present invention can reduce the voltage appearing in the gap and prevent the occurrence of discharge.
[0022]
The liquid 3 used in the present invention is preferably water because it is easy to handle, does not damage the reinforcing plate 4, the flexible film 6, and the peelable organic layer 5. There may be additives in the liquid for the purpose of lowering the surface tension and improving the conductivity. The volume resistance of the liquid is preferably 18 MΩ · cm or less so that it exhibits sufficient conductivity and the electric charge generated by peeling can be flowed quickly, and the volume resistance of the liquid is 1 MΩ · cm in order to reduce the charge of the liquid itself. More preferably, it is not more than cm. Additives added for the purpose of reducing the surface tension are preferably those having a low surface tension such as n-heptane, ethyl ether, hexane, acetone, methanol, ethanol and the like. Additives added to improve conductivity include tetrachloroethylene, methyl formate, propyl formate, isobutyl formate, ethyl propionate, methyl benzoate, succinonitrile, carbon disulfide, 2-ethoxyethanol, triethylene glycol, 2 -Ethoxyethyl acetate, ethyl sanoacetate and the like are preferred. It is also preferable to inject carbon dioxide into the liquid.
[0023]
The reinforcing plate 4 used in the present invention is made of inorganic glass such as soda lime glass, borosilicate glass, quartz glass, ceramics such as alumina, silicon nitride, zirconia, stainless steel, invar alloy, titanium, etc. Those having a small linear expansion coefficient and hygroscopic expansion coefficient such as a plate made of metal or glass fiber reinforced resin are preferable. In addition, it has excellent heat resistance and chemical resistance, has a large area with high surface smoothness, is easily available at low cost, is less likely to generate particles when in contact with transport equipment, and is electroplated with an insulator. A plate made of inorganic glass is particularly preferable because of no precipitation due to the above.
[0024]
When a glass substrate is used for the reinforcing plate, if the thickness of the glass substrate is small, it is difficult to maintain flatness by the holding means at the time of peeling of the present invention. Further, warping and twisting increase due to the expansion / contraction force of the flexible film, and the glass substrate may be broken when vacuum-adsorbed on a flat mounting table. Moreover, a flexible film will deform | transform by vacuum adsorption | suction and removal | desorption, and there exists a tendency for ensuring of position accuracy to become difficult. On the other hand, when the glass substrate is thick, flatness is lowered due to uneven thickness, and the exposure accuracy is also lowered. In addition, the handling load by the robot or the like becomes large, and it becomes impossible to operate quickly, resulting in a decrease in productivity and an increase in transportation cost. From these points, the thickness of the glass substrate is preferably in the range of 0.3 mm to 1.1 mm.
[0025]
When a metal is used for the reinforcing plate, if the thickness of the metal substrate is small, it is difficult to maintain flatness by the holding means at the time of peeling of the present invention. Also, warping and twisting increase due to the expansion / contraction force of the flexible film, and the flexible film cannot be vacuum-adsorbed on a flat mounting table, or the flexible film is deformed by the amount of warping or twisting of the metal substrate. As a result, a predetermined positional accuracy cannot be ensured. Further, if there is a fold, it becomes a defective product at that time. On the other hand, when the metal substrate is thick, the flatness is lowered due to uneven thickness, and the exposure accuracy is also lowered. In addition, the handling load by a robot or the like increases, and it becomes impossible to operate quickly, resulting in a decrease in productivity and an increase in transportation cost. Therefore, the thickness of the metal plate is preferably in the range of 0.1 mm to 0.7 mm.
[0026]
In the present invention, a plastic film is used as the flexible film. For example, films such as polycarbonate, polyether sulfide, polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyimide, polyamide, and liquid crystal polymer can be employed. Among them, a polyimide film is suitably employed because it is excellent in heat resistance and chemical resistance. In addition, a liquid crystal polymer is preferably used in terms of excellent electrical characteristics such as low dielectric loss and low hygroscopicity. It is also possible to employ a flexible glass fiber reinforced resin plate. Moreover, these films may be laminated.
[0027]
Examples of the resin for the glass fiber reinforced resin plate include epoxy, polyphenylene sulfide, polyphenylene ether, maleimide (co) polymer resin, polyamide, and polyimide.
[0028]
The thickness of the flexible film is preferably thin for light weight, downsizing, or formation of fine via holes, while the thicker one is required to ensure mechanical strength and maintain flatness. From a preferable point, the range of 4 μm to 125 μm is preferable.
[0029]
As the peelable organic layer used in the present invention, an adhesive or a pressure-sensitive adhesive is used. Examples of the peelable adhesive or pressure-sensitive adhesive include a pressure-sensitive adhesive called an acrylic or urethane-based re-peeling agent. Adhesive strength in the region called weak to medium adhesive is preferable in order to have sufficient adhesive force during flexible film processing, and can be easily peeled off during peeling and does not cause distortion in the flexible film substrate. . A silicone resin having tackiness can also be used. It is also possible to use an epoxy resin having tackiness.
[0030]
As organic materials that can be peeled, those whose adhesive strength and adhesive strength are reduced at low temperatures, those whose adhesive strength and adhesive strength are reduced by ultraviolet irradiation, and those whose adhesive strength and adhesive strength are reduced by heat treatment are suitably used. . Among these, those caused by ultraviolet irradiation are preferable because of large changes in adhesive strength and adhesive strength. An example of a material whose adhesive strength and adhesive strength are reduced by ultraviolet irradiation is a two-component cross-linking acrylic pressure-sensitive adhesive. Examples of those in which adhesive strength and adhesive strength decrease in a low temperature region include acrylic pressure-sensitive adhesives that reversibly change between a crystalline state and an amorphous state, and are preferably used.
[0031]
In this invention, peeling force is measured by 180 degree direction peel strength when peeling the 1-cm-wide flexible film bonded with the reinforcement board through the peelable organic substance layer. The peeling speed when measuring the peeling force is 300 mm / min. In the present invention, the peel force is preferably in the range of 0.1 g / cm to 100 g / cm.
[0032]
The thickness of the peelable organic layer is preferably in the range of 0.1 μm to 20 μm, and more preferably in the range of 0.3 μm to 10 μm.
[0033]
In the present invention, a flexible film in which a circuit pattern is formed is used. After the flexible film is attached to the reinforcing plate through an organic material layer that can be peeled off, May form a circuit pattern on the opposite surface. At this time, it is preferable to peel the peelable organic layer without transferring it to the circuit board. This is because it is possible to suppress problems such as contamination of the chemical solution and the circuit board due to the desorption of the adhesive in the subsequent process, and a decrease in productivity due to the addition of a flexible film cleaning process.
[0034]
In addition, by making the adhesive strength between the peelable organic layer and the reinforcing plate greater than the peel strength between the peelable organic layer and the flexible film, the peelable organic layer is transferred to the flexible film after peeling. Can be prevented. As such a means, after applying the adhesive to the reinforcing plate, the crosslinking is allowed to proceed for a predetermined period in a state where the air is shut off, and the adhesive force on the surface opposite to the reinforcing plate in the adhesive layer is mentioned. Can be selectively reduced.
[0035]
An example of a method for manufacturing a circuit board in the present invention will be described below, but the present invention is not limited to this.
[0036]
A peelable organic substance is applied to an aluminoborosilicate glass having a thickness of 1.1 mm using a spin coater, a blade coater, a roll coater, a bar coater, a die coater, screen printing, or the like. Use of a die coater is preferable in order to uniformly apply to a single-wafer substrate sent intermittently. After applying the peelable organic material, drying is performed by heat drying or vacuum drying to obtain a peelable organic material layer having a thickness of 2 μm. An air barrier film composed of a release film in which a silicone resin layer is provided on a polyester film is applied to the applied glass substrate with a peelable organic layer, and left at room temperature for one week. This period is called aging, and the cross-linking of the peelable organic substance proceeds and the adhesive force gradually decreases. The standing period and the storage temperature are selected so that a desired adhesive strength can be selected. Instead of laminating the air blocking film, it can be stored in a nitrogen atmosphere or in a vacuum. It is also possible to apply a peelable organic substance to a long film substrate, dry it, and then transfer it to a reinforcing plate.
[0037]
Next, a polyimide film having a thickness of 25 μm is prepared. The air blocking film on the glass substrate is peeled off, and the polyimide film is attached to the glass substrate. A metal layer may be formed in advance on one or both sides of the polyimide film.
[0038]
When the metal layer is not provided on the surface opposite to the bonding surface of the polyimide film, the metal layer is formed by a full additive method, a semi-additive method, or a subtractive method. Furthermore, gold, nickel, tin or the like is plated as necessary to obtain a circuit pattern.
[0039]
In the circuit pattern, a connection hole can be provided in the polyimide film. That is, it is possible to provide a via hole for electrical connection with a metal layer provided on the bonding surface side with the single wafer substrate, or to provide a ball grounding hole for the ball grid array. Laser holes and chemical etching can be employed as the method for providing the connection holes. When electrical connection is made, it is preferable that the inner surface of the hole is made into a conductor by plating after the formation of the connection hole and simultaneously with the formation of the circuit pattern. The diameter of the ball grounding hole is preferably 50 μm to 800 μm, more preferably 80 μm to 800 μm.
[0040]
Next, electronic components such as an IC chip, a resistor and a capacitor are mounted on the formed circuit pattern. As the electronic component mounting apparatus, an apparatus having an optical position detection function and a positioning function such as a movable stage, which can ensure mounting accuracy is preferably used. The present invention is particularly effective in ensuring mounting accuracy of a large-scale LSI having a small connection pitch and a large number of pins. The package form of the LSI is not particularly limited, and can be applied to either a bare chip or a ball grid array type.
[0041]
In addition, as a method for connecting the electronic component and the circuit board, there is a method in which a metal layer formed on the connection portion of the circuit board and a metal layer formed on the connection portion of the electronic component are thermocompression bonded to perform metal bonding. Also, the anisotropic conductive adhesive or non-conductive adhesive placed between the circuit board and the electronic component is cured while crimping the metal layer formed at the connection part of the circuit board and the metal layer formed at the joint of the electronic component. And a method of mechanically joining them.
[0042]
After connecting the circuit board and the electronic component, the circuit board and the glass substrate are peeled using the peeling method of the present invention. The circuit board on which the electronic component is mounted can be peeled off from the glass substrate after the polyimide film with a circuit pattern is cut into pieces or an assembly of pieces using a laser, a high-pressure water jet, a cutter, or the like.
[0043]
In the present invention, it is permissible to insert a resistance element or a capacitance block into a circuit pattern. In addition, an insulating layer and a wiring layer can be laminated on at least one surface of the flexible film substrate to form a multilayer.
[0044]
The use of the circuit board obtained by the production method of the present invention is not particularly limited, but it is preferably used for a wiring board of an electronic device, an IC package interposer, a wafer level burn-in socket wiring board, and the like.
[0045]
【Example】
EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited thereto. The film charging potential was measured with an electrometer Model-523 (manufactured by TRek Co., Ltd.). The volume resistance of the liquid is measured by placing the liquid container / electrode LP-05 (manufactured by Kawaguchi Electric Co., Ltd.) in a shield box and connecting it to the universal electrometer MMAII-17B (manufactured by Kawaguchi Electric Co., Ltd.). It was measured.
[0046]
Example 1
A polyimide film (“Kapton” 100EN manufactured by Toray DuPont Co., Ltd.) having a thickness of 25 μm and a 290 mm square was prepared as a flexible film. A 1.1 mm thick, 300 mm square single-side polished soda glass prepared as a reinforcing plate is coated with an ultraviolet curable adhesive “SK Dyne” SW-22 (manufactured by Soken Chemical Co., Ltd.) and a curing agent L45 (Soken Chemical). (Mixed) was mixed at 100: 3 (weight ratio) and dried at 80 ° C. for 2 minutes. The peelable organic layer thickness after drying was 2 μm. Next, an air-blocking film made of a film in which a silicone resin layer that can be easily released was provided on a polyester film was attached to the peelable organic material layer and left for 1 week.
[0047]
While peeling off the air blocking film composed of the polyester film and the silicone resin layer, a polyimide film was attached to the glass on which the peelable organic layer was formed with a roll laminator.
[0048]
Subsequently, a 6 nm thick chromium: nickel = 20: 80 (weight ratio) alloy film and a 200 nm thick copper film were laminated on the polyimide film in this order by sputtering. A positive photoresist was applied onto the copper film with a spin coater and dried at 90 ° C. for 30 minutes. The photoresist was exposed and developed through a photomask to form a photoresist having a thickness of 10 μm in a portion where a plating film was unnecessary.
[0049]
The test photomask pattern has 60 connection pads (width 25 μm, length 80 μm) arranged in a square with 4 rows arranged in a square with a pitch of 50 μm, and a width of 20 μm and a length of 5 mm from the center of the width of each connection pad 25 μm. The wirings extending toward the outside of the square were taken as one unit, and this was equally arranged in 6 rows and 6 columns at a pitch of 40 mm on a 290 mm square substrate.
[0050]
Next, a copper film was used as an electrode, and a thickness of 5 μm was formed by electrolytic plating in a copper sulfate plating solution. The photoresist was stripped with a photoresist stripping solution, and then the copper film and the chromium-nickel alloy film under the resist layer were removed by soft etching with a hydrogen peroxide-sulfuric acid aqueous solution. Subsequently, a 0.4 μm thick tin layer was formed on the copper plating film by electroless plating to obtain a flexible film substrate on which a single-sided circuit pattern was formed. Next, a model IC chip in which 60 gold-plated bumps at a pitch of 50 μm are arranged in a row and 4 rows are arranged in a square shape is heated to 300 ° C. from the IC chip side by a plip chip bonder FC-70 (manufactured by Toray Engineering Co., Ltd.). While heating, metal bonding was performed to the connection pads on the circuit board.
[0051]
In a state where the film was bonded to the glass substrate, the charge was removed with a static eliminating blower, and the charged potential of the film was measured to be 0.02 to 0.06 kV. A flexible film substrate 7 having an IC chip connected thereto was placed on the substrate moving belt 13 shown in FIG. As shown in FIG. 3, the peeling roll 8 was provided with a recess (5 × 5 mm, depth 1 mm) corresponding to the IC chip. Next, using the peeling apparatus 1 shown in FIG. 1, the polyimide film with a circuit pattern to which the IC chip was connected was peeled from the glass substrate 4. A polyurethane rubber having a hardness of 70 ° was used for the flexible film holding part 11. As the liquid 3, ion exchange water having a volume resistance of 12 MΩ · cm was used. The peeling speed was 300 mm / min. When the charge potential of the film was measured after peeling, it was 0.04 to 0.1 kV.
[0052]
Example 2
As a flexible film, a polyimide film (“Kapton” 100EN manufactured by Toray Du Pont Co., Ltd.) having a thickness of 25 μm and a width of 290 mm was prepared. A 6 nm thick chromium: nickel = 20: 80 (weight ratio) alloy film and a 200 nm thick copper film were laminated on the polyimide film in this order by sputtering. Using the alloy film as an electrode, electrolytic plating was performed in a copper sulfate solution to form a copper plating film having a thickness of 3 μm. While laminating a dry resist film on the copper plating film, it was cut into 290 mm square, and the dry film resist was exposed and developed through a photomask having a predetermined pattern to form a dry film resist pattern. A polyimide film on which a dry film resist pattern was formed was immersed in a copper etching solution of iron chloride, and the copper film was patterned, and at the same time, the chromium-nickel alloy film under the copper film was also patterned. Thereafter, the dry film resist was stripped with a stripping agent.
[0053]
In the same manner as in Example 1, a glass on which a peelable organic layer was formed was obtained. The polyimide film patterned copper film was affixed with a roll laminator to glass on which a peelable organic material layer was formed such that the surface patterned copper film was opposed to the glass surface. Next, a carbon dioxide laser was used to form connection holes having a diameter of 100 μm arranged in a grid at a pitch of 10 mm. The connection holes were formed from the opposite side of the polyimide film glass substrate attachment surface, and reached the patterned copper film on the attachment surface side. Next, in the same manner as in Example 1, an alloy film and a copper film were formed, and a photoresist was further formed.
[0054]
A test photomask pattern was prepared in the same manner as in Example 1. Next, a copper film was used as an electrode, and a thickness of 5 μm was formed by electrolytic plating in a copper sulfate plating solution. The photoresist was stripped with a photoresist stripping solution, and then the copper film and the chromium-nickel alloy film that were under the resist layer were removed by soft etching with a hydrogen peroxide-sulfuric acid aqueous solution. Subsequently, a 0.4 μm thick tin layer was formed on the copper plating film by electroless plating to obtain a double-sided circuit pattern.
[0055]
In a state where the film was bonded to the glass substrate, the charge was removed with a static eliminating blower, and the charged potential of the film was measured to be 0.02 to 0.06 kV. A polyimide film with a double-sided circuit pattern was placed on the substrate moving belt 13 shown in FIG. Subsequently, the peeling apparatus 1 shown in FIG. 1 was used, and the polyimide film with a double-sided circuit pattern was peeled from the glass substrate. A polyurethane rubber having a hardness of 70 ° was used for the flexible film holding part 11. As the liquid 3, ion exchange water having a volume resistance of 12 MΩ · cm was used. The peeling speed was 300 mm / min. When the charging potential of the film was measured after peeling, it was 0.02 to 0.1 kV.
[0056]
Example 3
A circuit pattern was obtained in the same manner as in Example 1, and the model IC chip was metal bonded. In a state where the film was bonded to the glass substrate, the charge was removed with a static eliminating blower, and the charged potential of the film was measured to be 0.02 to 0.06 kV. A polyimide film with a circuit pattern in which an IC chip was connected was placed on the substrate moving belt 13 shown in FIG. As shown in FIG. 3, the peeling roll 8 was provided with a recess (5 × 5 mm, depth 1 mm) corresponding to the IC chip. Next, using the peeling apparatus 20 shown in FIG. 2, the polyimide film with a circuit pattern to which the IC chip was connected was peeled from the glass substrate. A polyurethane rubber having a hardness of 70 ° was used for the flexible film holding part 11. As the liquid 26, ion-exchanged water having a volume resistance of 12 MΩ · cm was used. The water discharge angle was 30 degrees, and the water discharge speed was 1.2 L / min. The peeling speed was 300 mm / min. When the charge potential of the film was measured after peeling, it was 0.04 to 0.1 kV.
[0057]
Example 4
In the same manner as in Example 2, a double-sided circuit pattern was obtained. In a state where the film was bonded to the glass substrate, the charge was removed with a static eliminating blower, and the charged potential of the film was measured to be 0.02 to 0.06 kV. Next, a polyimide film with a single-sided circuit pattern was placed on the substrate moving belt 13 shown in FIG. Subsequently, the peeling apparatus 20 shown in FIG. 2 was used, and the polyimide film with a single-sided circuit pattern was peeled from the glass substrate. A polyurethane rubber having a hardness of 70 ° was used for the flexible film holding part 11. As the liquid 26, ion-exchanged water having a volume resistance of 12 MΩ · cm was used. The water discharge angle was 30 degrees, and the water discharge speed was 1.2 L / min. The peeling speed was 300 mm / min. When the charging potential of the film was measured after peeling, it was 0.02 to 0.1 kV.
[0058]
Example 5
A circuit pattern was obtained in the same manner as in Example 1, and the model IC chip was metal bonded. In a state where the film was bonded to the glass substrate, the charge was removed with a static eliminating blower, and the charged potential of the film was measured to be 0.02 to 0.06 kV. A polyimide film with a circuit pattern in which an IC chip was connected was placed on the substrate moving belt 13 shown in FIG. Next, using the peeling apparatus 20 shown in FIG. 2 and using isopropyl alcohol having a volume resistance of 0.3 MΩ · cm instead of water as a liquid, the glass chip was replaced with an IC chip. The polyimide film with a circuit pattern connected to was peeled off. When the charging potential of the film was measured after peeling, it was 0.02 to 0.1 kV.
[0059]
Comparative Example 1
Except not using a liquid, it carried out similarly to Example 1, and peeled the polyimide film with a circuit pattern which connected the IC chip from the glass substrate. In a state where the film was bonded to the glass substrate, the charge was removed with a static eliminating blower, and the charged potential of the film was measured to be 0.02 to 0.06 kV. When the charging potential of the film was measured after peeling, it was 6 to 14 kV. The film was strongly charged by peeling, and damage to the electronic parts and disconnection of the wiring due to discharge were observed.
[0060]
Comparative Example 2
Except not using liquid, it carried out similarly to Example 2, and peeled the polyimide film with a double-sided circuit pattern from the glass substrate. In a state where the film was bonded to the glass substrate, the charge was removed with a static eliminating blower, and the charged potential of the film was measured to be 0.02 to 0.06 kV. When the charging potential of the film was measured after peeling, it was 6 to 14 kV. The film was strongly charged by peeling, and damage to the electronic parts and disconnection of the wiring due to discharge were observed.
[0061]
【The invention's effect】
According to the present invention, it is possible to peel without being charged by static electricity at the time of peeling, and it is possible to prevent damage to electronic components and wiring due to electric discharge. Further, according to the circuit board manufacturing method of the present invention, it is possible to manufacture a high-quality circuit board.
[Brief description of the drawings]
FIG. 1 is a schematic front view of a peeling apparatus 1 according to the present invention.
FIG. 2 is a schematic front view of a peeling apparatus 20 according to the present invention.
FIG. 3 is a schematic front view showing a uniform state of a peeling roll 8;
[Explanation of symbols]
1,20 Peeling device
2, 22 containers
3 Liquid
4 Reinforcement plate
5 Peelable organic layer
6 Flexible film
7 Flexible film substrate
8 Peeling roll
9 Belt drive roll
10 Substrate fixing roll
12 Peeling unit
13 Substrate moving belt
21 Liquid spraying part
23 Flexible film substrate inlet
24 Flexible film substrate exit
25 Drainage port
30 Electronic component storage recess
31 Electronic components

Claims (4)

A method for manufacturing a circuit board, in which a flexible film having a circuit pattern attached to a reinforcing plate via a peelable organic layer is peeled from the reinforcing plate, wherein a liquid is applied between the reinforcing plate and the flexible film. A method for producing a circuit board, comprising the step of removing a reinforcing plate and a flexible film. 2. The circuit board manufacturing method according to claim 1, wherein an electronic component is bonded to the circuit pattern. A circuit board manufacturing apparatus for peeling a flexible film after forming a circuit pattern on a surface opposite to a bonding surface of a flexible film attached to a reinforcing plate through an organic layer that can be peeled off. An apparatus for manufacturing a circuit board, comprising means for supplying a liquid between the reinforcing plate and the flexible film. A nozzle for supplying a liquid; a holding means for holding the flexible film; a means for fixing the reinforcing plate; a container for storing the liquid; and a fixing means for fixing the flexible film and the reinforcing plate in the container. 4. The circuit board manufacturing apparatus according to claim 3, further comprising:

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