TWI522022B - Apparatus for removing carrier cu foil and method for the same - Google Patents

Description

Carrier copper foil removing device and method

The present invention relates to a carrier copper foil removal apparatus and method.

As the circuit surface of the printed circuit board becomes more and more refined, the thickness of the copper foil layer of the substrate such as Copper Clad Laminate (CCL) is also thinned. In the past, the thick copper foil layer was applied to the H/L method, and the fine circuit surface was specifically presented. However, the ultra-thin plate (below 5 μm) of the new state has recently been favored as a copper foil base plate (CCL) or a multilayer printed circuit. The copper foil layer used for the board is used to specifically represent the fine circuit surface.

However, by using the above-mentioned ultra-thin copper (Cu), it is not possible to directly process the copper (Cu) plate by hand. Therefore, a carrier Cu foil substrate is used to protect the double-sided copper (Cu). board.

When the work is performed using the substrate to which the carrier copper foil is attached, the worker removes the copper foil by hand, and the force applied during the removal process is not uniform, causing problems such as warpage, breakage, contamination, and increase of work time of the substrate.

In addition, in the process of removing the carrier copper foil, if the substrate warps and a crack occurs on the surface of the substrate, the manufacturing process of the printed circuit board will result. There is a problem that the substrate is damaged and the final product is also bent. In addition, the fine cracks which occur when the carrier copper foil is removed will oxidize the surface of the copper (Cu) which is not subjected to the rust-preventing treatment in the baking process, and thus the product after the baking occurs. Strong bending stress may cause overall warpage and damage of the substrate.

On the other hand, the structure in which the carrier copper foil is formed in the transfer copper foil has been disclosed in Japanese Patent Application No. 4710031.

One aspect of the present invention provides a carrier copper foil removing apparatus and method for stably removing a carrier copper foil attached to a substrate.

Another aspect of the present invention provides a carrier copper foil removing apparatus and method for preventing damage to a substrate copper foil layer during removal of a carrier copper foil.

According to still another aspect of the present invention, there is provided a carrier copper foil removing apparatus and method which can automatically remove a carrier copper foil on a substrate, and reduce engineering time and productivity.

According to an embodiment of the present invention, a carrier copper foil removing apparatus includes: a working table on which a substrate on which a first carrier copper foil and a second carrier copper foil are attached is disposed on both sides; and a cutting means, the cutting Cutting means cutting the two corner portions of the substrate disposed on the work table, each of the first carrier copper foil and the second carrier copper foil, and removing the first carrier copper foil and the removing means Second carrier The copper foil is removed from the substrate; and the turning means rotates the substrate disposed on the working table by 180°; a control unit controls the cutting means, the removing means and the driving means of the turning means .

Moreover, the substrate input unit to which the substrate is placed and the substrate to be loaded into the substrate input unit may be transferred to the first transfer unit of the work table.

In addition, the substrate input unit may further include a first detecting unit, wherein the first detecting unit detects that the substrate is inserted into the substrate input unit, and the control unit receives the signal from the first detecting unit to drive the first detecting unit. The transfer unit transfers the substrate loaded in the substrate input unit to the work table.

Further, the substrate take-out portion may be obtained by taking out the substrate after the removal of the first carrier copper foil and the second carrier copper foil, and removing the substrate from the work table by the second transfer portion The substrate of the carrier copper foil and the second carrier copper foil is transferred to the substrate take-out portion.

Further, the second detecting unit further includes a second detecting unit that detects whether the substrate is damaged after removing the first carrier copper foil and the second carrier copper foil, and the disposal portion is taken out and received. In the damaged substrate, the control unit receives the message from the second detecting unit, determines whether the substrate is damaged, and if damaged, drives the second transfer unit to transfer the damaged substrate to the disposal unit. If there is no damage, the second transfer unit is driven to transfer the substrate to the substrate take-out unit.

Here, the removing means may include a sandwiching member that sandwiches the first carrier copper foil and the second carrier copper foil, and a moving member that moves the sandwiching member at a constant speed.

In addition, the cutting means may include: one of the corner portions of the substrate The support member disposed on the surface, the cut member on the other side of the corner portion of the substrate, and the moving member that moves the cut member up and down.

At this time, the cutting member may be formed of a circular shape.

In addition, the cutting means is a pair, which are respectively located on the substrate. In the two corner portions, the pair of cutting means may be respectively located in a diagonal direction and opposed to each other.

In addition, the work table can be a vacuum table.

According to another embodiment of the present invention, a carrier copper foil removal method is a substrate in which the first carrier copper foil and the second carrier copper foil are adhered to each other on both sides, and is arranged on the workbench, and the two corner portions of the substrate are respectively directed to the first carrier copper foil and a step of cutting the remaining thickness direction of the carrier copper foil, removing the first first carrier copper foil from the substrate, and stepping the substrate 180°, and removing the second carrier copper foil from the substrate The steps.

Herein, the method may include: arranging the substrate on the workbench and arranging the column In the step of feeding the substrate into the substrate input portion and transferring the input substrate to the work table.

In addition, the two corner portions of the substrate are respectively directed to the first carrier The step of cutting the remaining thickness direction of the copper foil and the second carrier copper foil may be performed by including the following members: a support member disposed on each of the two corner portions of the one surface and the other surface of the substrate, and the support member The cutting member in the relative position and the moving member that moves the cutting member up and down.

At this time, the cutting member may be formed of a circular shape.

In addition, the corner portions of the substrate different from each other are respectively directed to the first The step of cutting the remaining thickness direction of the carrier copper foil and the second carrier copper foil may be performed simultaneously on one surface and the other surface of the substrate.

Further, the step of removing the first carrier copper foil from the substrate may be The method includes the steps of sandwiching the first carrier copper foil with a clamping member, and moving the clamping member at a constant speed.

In addition, the step of removing the second carrier copper foil from the substrate may The method includes the steps of clamping the second carrier copper foil with a clamping member, and moving the clamping member at a constant speed.

Further, after the step of removing the second carrier copper foil from the substrate, The step of taking out the substrate may be further included.

In addition, before the step of taking out the substrate, the method further includes determining Whether the substrate is damaged or not.

In addition, after determining whether the substrate is damaged or not, it may be subject to The damaged substrate is discarded and the undamaged substrate is taken out.

The invention relates to a carrier copper foil attached to a substrate by mechanical means Automatic removal, it is possible to improve the substrate warpage, breakage, contamination and adverse induction caused by manual work, and improve the reliability of the project.

In addition, the present life is by the side of the carrier copper foil to be attached to the substrate. The corner portion is circularly cut to prevent the copper foil on the substrate from being damaged when the carrier copper foil is peeled off from the substrate.

In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:

100‧‧‧ Carrier copper foil removal device

110‧‧‧Working table

120‧‧‧ cutting means

130‧‧‧Removal means

140‧‧‧Flip means

150‧‧‧Control means

160‧‧‧Substrate Input Department

165‧‧‧1st Transfer Department

170‧‧‧Substrate removal unit

175‧‧‧2nd Transfer Department

180‧‧‧Disposal Department

190‧‧‧1st detection department

195‧‧‧2nd Detection Department

121‧‧‧Supporting materials

123‧‧‧Cutting parts

131‧‧‧Clamping parts

200‧‧‧Substrate

201‧‧‧Insulation

203a, 203b‧‧‧ copper foil layer

205a, 205b‧‧‧ carrier copper foil

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a block diagram showing the construction of a carrier copper foil removing apparatus according to an embodiment of the present invention.

Fig. 2 is a perspective view showing a cutting means in a carrier copper foil removing device according to an embodiment of the present invention.

Fig. 3 is a perspective view showing a cutting member in a cutting method according to an embodiment of the present invention.

Fig. 4 is a flow chart showing a method for removing a carrier copper foil according to an embodiment of the present invention.

Fig. 5 is a cross-sectional view showing the process of cutting the corner portion of the substrate and the peeling of the carrier copper foil in the method for removing the carrier copper foil according to the embodiment of the present invention.

The objects, advantages and features of the present invention will become more apparent from the accompanying drawings and appended claims. In the present specification, when the constituent elements of the respective drawings are given the same reference numerals, the same reference numerals are used as far as possible in the different drawings. In addition, terms such as "one side", "the other side", "first", and "second" are used to distinguish one component from another component, and the component is not limited by the term.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

<Carrier copper foil removal device>

1 is a block diagram showing a structure of a carrier copper foil removing device according to an embodiment of the present invention, and FIG. 2 is a cutting process of a carrier copper foil removing device according to an embodiment of the present invention. 3 is a perspective view of a cutting member in a cutting method according to an embodiment of the present invention.

Referring to Fig. 1, the carrier copper foil removing device 100 of the present embodiment is packaged The work table 110 for arranging the substrate, the cutting means 120 for cutting the corner portion of the substrate disposed on the work table 110, the removing means 130 for removing the carrier copper foil from the substrate, and the placing means 130 are disposed on the work table 110. The flipping means 140 for inverting the substrate by 180°, and the control unit 150 for controlling the driving of the cutting means 120, the removing means 130 and the turning means 140.

In this embodiment, the substrate can be a double-sided copper foil laminate (Copper) Clad Laminate, abbreviated as CCL), but is not limited thereto.

In general, on a double-sided copper foil laminate (CCL), the carrier is attached. Copper foil (Carrier Cu foil) to protect copper (Cu) plates.

As described above, the present invention automatically removes and adheres to it by mechanical means. The carrier copper foil for protecting the substrate on one or both sides of the substrate can prevent the substrate from being damaged when the carrier copper foil is peeled off by hand.

In this embodiment, the workbench 110 can be a vacuum table, but is not limited thereto. It is here.

In general, the vacuum table is equipped for vacuum adsorption and fixation. The table of the substrate is further provided with a porous adsorption sheet (not shown) to prevent damage to the substrate. The porous adsorption sheet (not shown) may have a porous adsorption member. (not shown).

a plurality of pores are formed on the porous adsorbing member, and the porous adsorbing sheet On the opposite side of the contact surface, a suction tube (not shown) for attracting air may be provided.

That is, the air is sucked through the suction pipe, and the air is uniformly attracted from the upper side of the porous absorbent sheet. The air thus sucked is attracted to the suction pipe through a plurality of small holes in the porous adsorbing member.

Thereby, after the substrate is placed on the work table 110, the suction is started, and the substrate can be adsorbed by the porous adsorption sheet by the almost uniform pressure applied from the upper portion, and is fixed to the work table 110.

Further, the carrier copper foil removing apparatus 100 of the present embodiment may further include a substrate loading portion 160 into which the substrate is placed, and a first transfer portion 165 that transfers the substrate loaded into the substrate loading portion 160 to the work table 110.

In addition, the first detecting unit 190 may be further included, and the first detecting unit 190 may be configured to detect that the substrate is loaded into the substrate input unit 160. The control unit 150 receives the signal corresponding to the input substrate from the first detecting unit 190, drives the first transfer unit 165, and transfers the substrate from the substrate input unit 160 to the work table 110.

Further, the carrier copper foil removing device 100 of the present embodiment may further include a substrate take-out portion 170 and a second transfer portion 175. The substrate take-out portion 170 is a substrate from which the carrier copper foil has been removed, and the second transfer portion 175 is The transfer is transferred from the work table 110 to the substrate of the substrate take-out unit 170.

Further, the disposal processing unit 180 may be further included, and when the substrate on which the carrier copper foil has been removed is damaged, the damaged substrate can be taken out.

In addition, the second detecting unit 195 that detects whether the substrate on which the carrier copper foil has been removed may be detected. The control unit 150 can receive the second detecting unit 195. The signal determines whether the substrate on which the carrier copper foil has been removed is damaged.

At this time, it is judged whether or not the damaged control unit 150 is driven when it is damaged. The second transfer unit 175 transfers the damaged substrate from the work table 110 to the disposal unit 180. If there is no damage, the second transfer unit 175 is driven to transfer the substrate from the work table 110 to the substrate take-out unit 170.

On the other hand, in the embodiment, the second detecting unit 195 is permeable. Confirm if the carrier copper foil has been removed.

Specifically, the control unit 150 receives the second detecting unit 195. The signal determines whether there is a portion of the substrate on which the carrier copper foil has not been removed. If there is any unremoved portion, the operator is warned of the result of the determination, and the operator directly removes the unremoved portion by manual work.

In this embodiment, the cutting means 120 may include: being configured on the base The supporting member 1211 on one side of the corner portion of the board, the cutting member 123 on the other side of the corner portion of the substrate, and a moving member (not shown) for moving the cutting member 123 up and down.

At this time, the cutting means 120 can be a pair, respectively located in two different The pair of corner cutting portions 120 may be located at a direction opposite to the diagonal direction of the cutting members 123.

That is, one of the two corner portions of the substrate is different, one One of the cutting members 123 is located on one side, and the other cutting member 123 is located on the other side.

This is to make the two corners of the substrate different at the same time / Cut in the down direction.

In this embodiment, the cutting member 123 can be as shown in FIG. It is circular, but this is only an embodiment, and the shape is not limited thereto.

However, the cutting member 123 is rounded, thereby making the corner portion of the substrate The cut surface is formed into a circular shape, so that the carrier copper foil is more easily separated from the substrate than when the cut surface is formed into a straight line.

In addition, the carrier copper is formed by cutting the corner portion of the substrate in a circular shape. When the foil is peeled off from the substrate, scratches such as scratches on the copper foil on the substrate can be prevented, and the electrical reliability of the printed circuit board formed using the substrate can be improved.

In this embodiment, the removing means 130 may include: clamping the carrier a clamping member (not shown) of the copper foil, a moving member (not shown) that is coupled to the clamping member (not shown) and moves the clamping member (not shown) at a constant speed, but this is only For an embodiment, it is not limited to this.

As described above, the carrier copper foil removing device 100 of the present embodiment, On the substrate with the carrier copper foil on both sides, the two corner portions are cut in the up/down direction, and only the carrier copper foil is left, and the portion where the carrier copper foil is left is peeled off. The mechanical method is automatically performed, and compared with the case where the carrier copper foil is peeled off by manual work, the engineering time is shortened and the copper foil layer of the substrate is prevented from being damaged.

<Carrier copper foil removal method>

4 is a block diagram of a method for removing a carrier copper foil according to an embodiment of the present invention, and FIG. 5 is a view showing a method for removing a carrier copper foil according to an embodiment of the present invention. The process of cutting the corner portions of the substrate and the engineering sectional view of the process of peeling off the carrier copper foil.

Referring to Fig. 4, first, the substrate 200 to which the carrier copper foils 205a and 205b are attached is placed on the work table 110 (see Fig. 1) and arranged in a row (S303).

In this embodiment, one or both sides of the substrate may be a copper foil laminate (CCL), but is not limited thereto.

Further, in the present embodiment, the carrier copper foils 205a, 205b are attached to one or both sides of the substrate to protect the copper foil layers 203a, 203b from the outside.

In the present embodiment, there is a method of automatically removing the carrier copper foils 205a, 205b from the substrate 200 before using the substrate.

As described above, the carrier copper foils 205a and 205b may be attached to one surface or both surfaces of the substrate 200. Although it is attached to both surfaces of the substrate in the description of the embodiment, the present invention is not limited thereto, and may be applied to the substrate. The situation.

Therefore, in the present embodiment, the carrier copper foils 205a and 205b adhering to both surfaces of the substrate are designated as the first carrier copper foil 205a and the second carrier copper foil 205b, respectively.

At this time, the substrate 200 is placed on the work table 110 (see FIG. 1) and is arranged in a row. The step (S301) may be included. When the substrate is loaded into the substrate input unit 160, the substrate is transferred to the first transfer unit 165. The input substrate is transferred from the substrate input unit 160 to the work table 110.

Next, the two opposite corner portions of the substrate 200 are respectively cut in the thickness direction to leave the first carrier copper foil 205a and the second carrier copper foil 205b. (S305).

That is, as shown in FIG. 5, the two corners of the substrate 200 are Some of the branches were cut from the top down and the bottom up. At this time, the first carrier copper foil 205a is left in the B portion, and the second carrier copper foil 205b is left in the C portion.

At this time, the cutting stage as described above can be cut through the cutting means 120. (Refer to Fig. 2), but it is not limited thereto. The cutting means 120 includes: a support member 121 (see FIG. 2) disposed on each of the corners of the one surface and the other surface of the panel 200, a cutting member 123 corresponding to the support member 121 (see FIG. 2), and the cutting member 123 Moving parts (not shown).

Here, as shown in FIG. 3, the cutting member 123 may be circular Cutter A.

By forming the circular shape by cutting the member 123 as described above, the corners of the substrate are made The portion of the cut surface is rounded, so that it has an advantage that the carrier copper foil can be easily separated from the substrate in comparison with the case where the cut surface is straight.

In addition, by cutting the corner portion of the substrate into a circular shape, the carrier When the copper foil is peeled off from the substrate, scratches such as scratches on the copper foil on the substrate can be prevented, and the electrical reliability of the printed circuit board formed using the substrate can be improved.

In addition, in the embodiment, the two corner portions of the substrate 200 can be The steps of cutting in the thickness direction may be performed simultaneously, but are not limited thereto.

Specifically, in the embodiment, the transmission is respectively disposed on the substrate 200 The cutting means 120 of the two corner portions can cut one of the two corner portions toward the top-down direction, and the other corner portion is cut toward the bottom-up direction.

Next, the first carrier copper foil 205a is removed from the substrate 200. (S307).

In this embodiment, the following steps can be performed: the first load a step of removing the bulk copper foil 205a from the substrate 200, a step of holding the remaining portion B of the first carrier copper foil 205a through the sandwiching member 131, and a step of transferring the sandwiching member 131 at an equal speed in the direction of the arrow, but not Limited to this.

Next, the substrate 200 is turned over by 180 (S309).

At this time, the flipping of the substrate 200 can be made by the technical field to which the present invention pertains. Those having ordinary knowledge can carry out various methods which can be used according to their usual knowledge, and a detailed description thereof will be omitted herein.

As described above, by flipping the substrate 200 180°, In the entire row, the surface on which the second carrier copper foil 205b is attached faces upward.

Next, the second carrier copper foil 205b is removed from the substrate 200. (S311).

In the embodiment, the second carrier copper foil 205b is self-substrate 200 The step of removing is the same as the method of removing the first carrier copper foil 205a described above, and thus the detailed method thereof will be omitted herein.

Next, the removed first carrier copper foil 205a and the second carrier copper are removed. The substrate 200 of the foil 205b (S313).

At this time, in the present embodiment, before the step of taking out the substrate 200, It may further include determining whether the substrate on which the carrier copper foil 205a and the carrier copper foil 205b have been removed is damaged. If the result of the judgment is that the substrate 200 is damaged, it is disposed of, and if it is not damaged. The injury can be taken out to the substrate take-out portion 170 (see Fig. 1).

In addition, when the first carrier copper foil 205a or the second carrier copper foil is removed After 205b, it is judged whether or not the portion of the first carrier copper foil 205a or the second carrier copper foil 205b is not removed, and if there is an unremoved portion, the operator of the apparatus is warned to manually remove the unremoved portion.

The above description is based on the embodiments, but this is a specific description of the present invention. The present invention is not limited thereto, and any modifications or improvements may be made without departing from the spirit and scope of the invention.

In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100‧‧‧ Carrier copper foil removal device

110‧‧‧Working table

120‧‧‧ cutting means

130‧‧‧Removal means

140‧‧‧Flip means

150‧‧‧Control means

160‧‧‧Substrate Input Department

165‧‧‧1st Transfer Department

170‧‧‧Substrate removal unit

175‧‧‧2nd Transfer Department

180‧‧‧Disposal Department

190‧‧‧1st detection department

195‧‧‧2nd Detection Department

Claims (20)

A carrier copper foil removing device includes: a working table, wherein a substrate is disposed, and a first carrier copper foil and a second carrier copper foil are disposed on both sides of the substrate; and a cutting means is respectively cut and disposed on the working table The first carrier copper foil and the second carrier copper foil remain in the two corner portions of the substrate; and a removing means removes the first carrier copper foil and the second carrier copper foil from the substrate; And rotating the substrate disposed on the workbench 180°; and a control unit controlling the cutting means, the removing means, and the driving of the turning means. The carrier copper foil removing device according to claim 1, further comprising: a substrate loading portion into which the substrate is placed; and a first transfer portion that transfers the substrate loaded into the substrate loading portion to the work table. The carrier copper foil removing device according to claim 2, further comprising a first detecting portion, wherein the detecting portion is input to the substrate input portion; wherein the control portion receives the The signal of the first detecting unit drives the first detecting unit to transfer the substrate loaded into the substrate input unit to the working table. The carrier copper foil removing device according to claim 1 of the patent application scope, further includes a substrate take-out portion for taking out a substrate from which the first carrier copper foil and the second carrier copper foil have been removed, and a second transfer portion for removing the first carrier copper foil and the second carrier copper foil The substrate is transferred from the work table to the substrate take-out portion. The carrier copper foil removing device according to claim 4, further comprising: a second detecting portion for detecting whether the substrate on which the first carrier copper foil and the second carrier copper foil have been removed is damaged; The disposal unit removes the damaged substrate; the control unit receives the signal from the second detection unit to determine whether the substrate is damaged, and if it is damaged, the second transfer unit is driven and damaged. The substrate is transferred to the disposal processing unit, and if it is not damaged, the second transfer unit is driven to transfer the substrate to the substrate take-out unit. The carrier copper foil removing device according to claim 1, wherein the removing means comprises: a clamping member that sandwiches the first carrier copper foil or the second carrier copper foil; and the clamping member is at a constant speed Moving parts of the movement. The carrier copper foil removing device according to claim 1, wherein the cutting means comprises: a clamping member disposed on one side of the corner portion of the substrate; and cutting on the other side of the corner portion of the substrate Parts; A moving member that moves the cutting member up and down. The carrier copper foil removing device according to claim 7, wherein the cutting member has a circular shape. The carrier copper foil removing device according to claim 7, wherein the cutting means is a pair, respectively located at two corner portions of the substrate, and the cutting members of the pair of cutting means are located at each other The diagonal direction is opposite. The carrier copper foil removing device according to claim 1, wherein the working table is a vacuum table. A method for removing a carrier copper foil, comprising: arranging and arranging a step of disposing a substrate on which both the first carrier copper foil or the second carrier copper foil are adhered on the working surface, and arranging them; the cutting step is respectively performed toward the thickness Cutting the two corner portions of the substrate to separate the first carrier copper foil or the second carrier copper foil; the first removing step is to remove the first carrier copper foil from the substrate; The substrate is inverted by 180°, and the second removal step is performed by removing the second carrier copper foil from the substrate. The method for removing a carrier copper foil according to claim 11, wherein the step of disposing the substrate on the workbench and arranging the steps includes: inserting the substrate into the substrate input portion; and transferring the input substrate The transfer step to the workbench. The carrier copper foil removing method according to claim 11, wherein the two corner portions of the substrate are cut in a thickness direction to respectively make the first carrier The remaining steps of the copper foil and the second carrier copper foil are performed by the cutting means, and the cutting means includes: a support member disposed on each of the two corner portions of the substrate and the other surface, and the supporting member The cutting member is a cutting member facing the facing surface, and a moving member for moving the cutting member up and down. The carrier copper foil removing method according to claim 13, wherein the cutting member has a circular shape. The method for removing a carrier copper foil according to claim 11, wherein the step of cutting the two corner portions of the substrate in the thickness direction and respectively remaining the first carrier copper foil and the second carrier copper foil One side of the substrate and the other side are simultaneously performed. The method for removing a carrier copper foil according to claim 11, wherein the step of removing the first carrier copper foil from the substrate comprises: clamping the first carrier copper foil with a clamping member; And the step of moving the clamping member at a constant speed. The method for removing a carrier copper foil according to claim 11, wherein the step of removing the second carrier copper foil from the substrate comprises: clamping the second carrier copper foil with a clamping member; And the step of moving the clamping member at a constant speed. The method for removing a carrier copper foil according to claim 11, wherein the step of removing the second carrier from the substrate further comprises the step of removing the substrate. a method for removing a carrier copper foil according to claim 18, which Before the step of taking out the substrate, the method further comprises the step of determining whether the substrate is damaged. The carrier copper foil removing method according to claim 19, wherein after the step of determining whether the substrate is damaged or not, if it is damaged, it is disposed of, and if it is not damaged, the substrate is taken out.