TW201913852A - Adhesive tape stripping method and adhesive tape stripping device - Google Patents

Abstract

The present invention provides a method and apparatus for peeling adhesive tape, which can peel off the adhesive tape from a wafer with high precision without using a peeling tape. The peeling unit 23A comprises a first holding member 29A and a second holding member 31 that cooperatively hold the peripheral portion of the protective tape PT. The first holding member 29A includes a sharp front end 51, wherein the front end 51 extends into a joining interface K between the wafer W and the protective tape PT so that a part of the peripheral portion of the protective tape PT is peeled off from the wafer W as the peeling portion Pa. Then, while the front portion 51 is maintained in the state of entering a joining interface K, the second holding member 31A is brought into contact with the non-adhesive surface of the protective tape PT, so that the peeling portion Pa is held by the peeling unit 23A. Because the protective tape PT is peeled off while being held, even the protective tape even having high adhesion can be peeled off from the wafer W with high precision.

Description

   Adhesive tape peeling method and adhesive tape peeling device   

The present invention relates to an adhesive tape peeling method and an adhesive tape peeling device for peeling an adhesive tape attached to a semiconductor wafer (hereinafter, appropriately referred to as a "wafer").

After the circuit pattern forming process is performed on the surface of the wafer, the entire back surface of the wafer is uniformly polished, and a thinner back surface polishing process is performed. Before the back surface polishing is performed, an adhesive tape (protective tape) for protecting the circuit is attached to the surface of the wafer. After the wafer is thinned, the protective tape is peeled for each process such as a dicing process.

Regarding a conventional method for peeling a protective tape from a wafer, after the back surface is polished, a peeling tape is attached by attaching a peeling adhesive tape (peeling tape) to the surface of the protective tape and peeling the peeling tape. A method of peeling the protective tape integrally (for example, refer to Patent Document 1). Moreover, regarding another method of peeling a protective tape from a wafer, the method of attracting and peeling a protective tape using a suction roll etc. is proposed (for example, refer patent document 2).

Prior art literature

Patent Document 1 Japanese Patent Application Publication No. 2012-89647

Patent Document 2 Japanese Patent Application Publication No. 2016-39301

However, the above conventional device has the following problems.

That is, in the conventional peeling method of Patent Document 1, since the peeling tape is required every time the protective tape is peeled, there is a concern that the running cost of the peeling device increases.

In recent years, with regard to adhesive tapes such as protective tapes, there has been a tendency to use a material having a stronger adhesive force as an adhesive material for the tape. Therefore, especially in the peeling method of the protective tape of patent document 2, the adhesive force of a protective tape to a wafer may exceed the adsorption force of a suction roll. In this case, it becomes difficult to peel the protective tape from the wafer by the suction force of the suction roll.

In addition, regarding the method of Patent Document 2, in order to prevent the peeling error caused by insufficient adsorption force and increase the adsorption force of the adsorption roller, there is a concern that even the wafer may be sucked together with the protective tape due to the increase of the adsorption force. This can cause wafer deformation / breakage. In addition, the protective tape that is peeled off by the strong adsorption force is attracted to the adsorption hole of the adsorption roller, and there is a concern that even if the adsorption of the adsorption roller is stopped after the peeling, the protection tape cannot be separated from the adsorption roller.

The present invention has been made in view of such circumstances, and its main object is to provide an adhesive tape peeling method and an adhesive tape peeling device capable of peeling and removing an adhesive tape from a wafer with high accuracy without using a peeling tape.

In order to achieve this object, the present invention adopts the following configuration.

That is, the adhesive tape peeling method of the present invention peels the adhesive tape attached to a semiconductor wafer from the semiconductor wafer, and the adhesive tape peeling method is characterized by including a holding process to hold the semiconductor wafer with a holding stage. In the first peeling process, a first holding member having a sharp front end and provided in the peeling unit enters a bonding interface between the semiconductor wafer and the adhesive tape, and at least a part of a peripheral portion of the adhesive tape is used as a peeling start end. Peeling from the semiconductor wafer; during the holding process, while maintaining the state where the first holding member is in the bonding interface, the second holding member provided in the peeling unit is brought into contact with the non-adhesive surface of the peeling start end, The peeling start end is held by the first gripping member and the second gripping member; and in the second peeling process, the peeling portion is gripped by the first gripping member and the second gripping member while the peeling is performed. The unit and the holding table are relatively moved in a predetermined tape peeling direction to peel the adhesive from the semiconductor wafer. .

(Action / Effect) According to this method, the peeling unit includes the first holding member and the second holding member. Next, at least a part of the peripheral portion of the adhesive tape is peeled from the semiconductor wafer as a peeling start end by allowing a first holding member having a sharp tip to enter a bonding interface between the semiconductor wafer and the adhesive tape. Then, the peeling unit is relatively moved in the tape peeling direction while the peeling start end is held by the first gripping member and the second gripping member, thereby peeling the adhesive tape from the semiconductor wafer.

In this case, since the peeling unit peels the adhesive tape while holding the peeling start end belonging to the peripheral portion of the adhesive tape, the peeling unit can hold the adhesive tape by a strong holding force. As a result, even if an adhesive tape with strong adhesive force is attached to the semiconductor wafer, the holding force of the peeling unit does exceed the adhesive force of the adhesive tape acting on the bonding interface. Therefore, it is possible to surely avoid such situations that the adhesive tape is not peeled from the semiconductor wafer or that the adhesive tape is detached from the peeling unit and dropped during the process of peeling from the semiconductor wafer.

When the peeling unit is to grip the peeling start end, the second gripping member is brought into contact with the non-adhesive surface of the peeling start end while maintaining the state where the first gripping member enters the interface. Therefore, it is possible to prevent the peeling start end from continuing to the semiconductor wafer again. In addition, in a state where the adhesive surface at the peeling start end is supported by the first gripping member, the second gripping member is in contact with the non-adhesive surface at the peeling start end, so the peeling start end can be avoided from the first gripping member and the second gripping member. Separation from time to time, a situation of mishandling occurred.

In the above invention, it is preferable that the first peeling process is such that the pressing member is brought into the bonding interface in a state where the pressing member is in contact with the non-adhesive surface of the adhesive tape, and the pressing member is disposed. The distance between the thickness direction of the semiconductor wafer and the front end portion is a position that becomes the length of the thickness of the adhesive tape.

(Action / Effect) According to this configuration, the leading end portion is brought into the adhering interface while the pressing member is brought into contact with the non-adhesive surface of the adhesive tape. The pressing member is disposed at a position where the distance from the front end portion in the thickness direction of the semiconductor wafer is the length of the thickness of the adhesive tape. Therefore, in a state where the pressing member is brought into contact with the non-adhesive surface of the adhesive tape, the position of the tip portion is maintained with high accuracy so as to be a position that can be accurately entered toward the interface. Therefore, it is possible to surely prevent the tip portion from being stuck in the layer of the adhesive tape or the semiconductor wafer, causing peeling errors or damage to the semiconductor wafer.

In order to achieve this object, the present invention can also adopt the following configurations.

That is, the adhesive tape peeling method of the present invention peels an adhesive tape having a diameter larger than that of the semiconductor wafer attached to the semiconductor wafer from the semiconductor wafer. The method for peeling the adhesive tape is characterized in that it includes a holding process. The holding stage holds the semiconductor wafer; in the holding process, at least a part of the part of the adhesive tape exposed from the semiconductor wafer to the outside is used as a peeling start end and is held by a pair of holding members provided in the peeling unit; In the peeling process, the peeling unit and the holding table are relatively moved in a predetermined tape peeling direction to peel the adhesive tape from the semiconductor wafer while the peeling start end is held by the pair of holding members.

(Action / Effect) According to this method, for an adhesive tape having a larger diameter than the semiconductor wafer attached to a semiconductor wafer, at least a part of a portion exposed from the semiconductor wafer to the outside is used as a peeling start end and is provided at A pair of grasping members of the peeling unit are grasped. Then, in a state where the pair of holding members are holding the peeling start end, the peeling unit and the holding table are relatively moved in a predetermined tape peeling direction to peel the adhesive tape from the semiconductor wafer.

In this case, since the peeling unit peels off the adhesive tape while holding the peeling start end of the peripheral portion of the adhesive tape, the peeling unit can hold the adhesive tape with a strong holding force. As a result, even if the adhesive tape with strong adhesive force is attached to the semiconductor wafer, the holding force of the peeling unit does exceed the adhesive force of the adhesive tape. Therefore, it is possible to reliably avoid the situation where the adhesive tape is not peeled from the semiconductor wafer or the situation where the adhesive tape is detached from the peeling unit and dropped during the process of peeling from the semiconductor wafer.

In the above invention, preferably, in the second peeling process, the peeling unit is moved in a direction away from the holding table while the peeling unit and the holding table are relatively moved in a predetermined tape peeling direction. The adhesive tape is peeled from the semiconductor wafer.

(Operation / Effect) According to this configuration, by moving the peeling unit not only in the tape peeling direction but also in a direction away from the holding table, a moderate tension is applied to the part of the adhesive tape peeled from the semiconductor wafer, so that it can be more Properly peel off the adhesive tape.

In addition, by moving the stripping unit in a direction away from the holding table, it is possible to more surely avoid the interference between the stripping unit and the semiconductor wafer. Furthermore, since it is driven in the direction of stripping of the tape and also in the direction of leaving from the holding table, it is possible to avoid causing the adhesive tape to be caused by the excessive tension acting on the adhesive tape due to the movement only in the direction of leaving from the holding table. Deformation / fracture state of affairs.

Further, it is preferable that the invention includes: a tape holding process, wherein the tape holding member holds the opposite side of the peeling start end to the adhesive tape peeled from the semiconductor wafer in the second peeling process; and In the recovery process, the adhesive tape is transported to the tape recovery unit in a flat state and recovered by the tape holding member and the peeling unit.

(Action / Effect) According to this configuration, since both ends of the peeled adhesive tape are held by the peeling unit and the tape holding member, the peeled adhesive tape can be stably conveyed. Furthermore, since the adhesive tape is conveyed and recovered toward the tape recovery section in a flat state, the waste of space in the tape recovery section is reduced. As a result, the quantity of the adhesive tape which can accommodate a tape collection part can be greatly increased.

In order to achieve this object, the present invention can also adopt the following configurations.

That is, the adhesive tape peeling device of the present invention peels an adhesive tape attached to a semiconductor wafer from the semiconductor wafer, and the adhesive tape peeling device is characterized by comprising: a holding table that holds the semiconductor wafer; and a peeling unit. Peeling from the semiconductor wafer while holding at least a part of a peripheral portion of the adhesive tape; and a first driving mechanism that relatively moves the peeling unit and the holding table in a predetermined tape peeling direction, and the peeling unit The first holding member has a sharp front end portion, and enters a bonding interface between the adhesive tape and the semiconductor wafer, and at least a part of a peripheral portion of the adhesive tape is used as a peeling start end to peel from the semiconductor wafer; The second gripping member holds the peeling start end in cooperation with the first gripping member; and the second driving mechanism causes the second gripping member to face the adhesive tape in a state where the first gripping member is entering the bonding interface. It is driven in the thickness direction and abuts on the non-adhesive surface of the peeling start end.

(Action / Effect) According to this configuration, the peeling unit includes the first holding member and the second holding member. Next, at least a part of the peripheral edge portion of the adhesive tape is peeled from the semiconductor wafer as a peeling start end by allowing the first holding member having a sharp tip to enter the bonding interface between the semiconductor wafer and the adhesive tape. Then, the peeling unit and the holding table are relatively moved in the tape peeling direction while the peeling start end is held by the first gripping member and the second gripping member, and the adhesive tape is peeled from the semiconductor wafer. Therefore, the above method can be appropriately implemented.

Further, in the above invention, it is preferable that the peeling unit includes a pressing member, and the pressing member is disposed in a thickness direction of the semiconductor wafer and a distance from the front end portion is a length that is a thickness of the adhesive tape. Position, and abuts the non-adhesive surface of the adhesive tape when the front end portion enters the bonding interface. In this case, by contacting the pressing member, the front end portion can be correctly entered toward the bonding interface without being offset. Therefore, the above method can be appropriately implemented.

In order to achieve this object, the present invention can also adopt the following configurations.

That is, the adhesive tape peeling device of the present invention peels the adhesive tape having a larger diameter than the semiconductor wafer attached to the semiconductor wafer from the semiconductor wafer, and the adhesive tape peeling device is characterized by having: Holding the semiconductor wafer; a peeling unit peeling the semiconductor wafer from the semiconductor wafer in a state where at least a portion of the adhesive tape exposed from the semiconductor wafer to the outside is held as a peeling start end; The peeling unit and the holding table are relatively moved in a predetermined tape peeling direction.

(Action / Effect) According to this configuration, at least a part of a portion exposed from the semiconductor wafer to the outside is used as a peeling start end and is held by a pair of holding members provided in the peeling unit. Then, in a state where the pair of holding members are holding the peeling start end, the peeling unit and the holding table are relatively moved in a predetermined tape peeling direction to peel the adhesive tape from the semiconductor wafer. Therefore, the above method can be appropriately implemented.

Further, in the above invention, it is preferable that the first driving mechanism moves the peeling unit in a direction away from the holding table, while the peeling unit and the holding table face each other in a predetermined tape peeling direction. The adhesive tape is peeled from the semiconductor wafer by moving.

(Action / Effect) According to this configuration, when the adhesive tape is peeled from the semiconductor wafer, the peeling unit is moved not only in the tape peeling direction but also in a direction away from the holding table. Therefore, since a moderate tension is applied to a part of the adhesive tape to be peeled from the semiconductor wafer, the adhesive tape can be more appropriately peeled.

Further, it is preferable that the invention includes: a tape holding member that holds the opposite side of the peeling start end of the adhesive tape peeled from the semiconductor wafer; and a tape recovery unit that houses the peeled from the semiconductor wafer. The adhesive tape and the tape holding member are held in cooperation with the peeling unit so that the adhesive tape can be flattened and stored in a tape recovery unit.

(Operation / Effect) According to this configuration, since both ends of the peeled adhesive tape are held by the peeling unit and the tape holding member, the peeled adhesive tape can be stably conveyed. Furthermore, since the adhesive tape is conveyed and recovered toward the tape recovery section in a flat state, the waste of space in the tape recovery section is reduced. As a result, the quantity of the adhesive tape which can accommodate a tape collection part can be greatly increased.

According to the adhesive tape peeling method and the adhesive tape peeling device of the present invention, the peeling unit moves the peeling unit to peel the adhesive tape from the semiconductor wafer while the peeling unit holds at least a part of the edge portion of the adhesive tape. In this case, since the adhesive tape can be peeled from the semiconductor wafer without attaching the release tape to the adhesive tape, the running cost can be reduced. In addition, since a strong holding force acts on the adhesive tape at the time of peeling, the adhesive tape can be reliably peeled from the semiconductor wafer even when a strong adhesive tape is used. In addition, since the peeling unit holds the adhesive tape with a strong holding force, it is possible to avoid the situation where the peeled adhesive tape is detached and dropped.

1‧‧‧ Adhesive tape peeling device

3‧‧‧ holding station

5‧‧‧ with stripping mechanism

6‧‧‧ with testing agency

19‧‧‧ Mobile

23‧‧‧ stripping unit

25‧‧‧Motor

29‧‧‧The first holding member

31‧‧‧The second holding member

37‧‧‧ Motor

39‧‧‧light sensor

41‧‧‧Control Department

51‧‧‧Front end

53‧‧‧ the third holding member

55‧‧‧Press roller

W‧‧‧Semiconductor wafer

PT‧‧‧Protection tape

K‧‧‧ Adhesive Interface

FIG. 1 is a front view showing a basic configuration of an adhesive tape peeling device of Example 1. FIG.

FIG. 2 is a right side view showing the basic configuration of the adhesive tape peeling device of Example 1. FIG.

FIG. 3 is a top view showing a basic configuration of the adhesive tape peeling device of the first embodiment.

FIG. 4 is a front view showing the configuration of a peeling unit and a tape detection mechanism of Example 1. FIG.

FIG. 5 is a diagram showing the operation of the adhesive tape peeling device of Example 1 in step S2.

FIG. 6 is a diagram showing the operation of the adhesive tape peeling device of Example 1 in step S3.

FIG. 7 is a diagram showing the operation of the adhesive tape peeling device of Example 1 in step S4.

FIG. 8 is a diagram showing the operation of the adhesive tape peeling device of Example 1 in step S4.

FIG. 9 is a diagram showing the operation of the adhesive tape peeling device of Example 1 in step S5.

FIG. 10 is a diagram showing the operation of the adhesive tape peeling device of Example 1 in step S6.

FIG. 11 is a diagram showing a configuration of a peeling unit of Example 2. FIG.

FIG. 11 (a) is a front view showing the peeling unit, and FIG. 11 (b) is a perspective view showing a characteristic part of the peeling unit.

FIG. 12 is a diagram showing the operation of the adhesive tape peeling device of Example 2 in step S4.

FIG. 13 is a diagram showing the operation of the adhesive tape peeling device of the second embodiment in step S4.

FIG. 14 is a diagram showing the operation of the adhesive tape peeling device of Example 2 in step S4.

FIG. 15 is a diagram showing the operation of the adhesive tape peeling device of the second embodiment in step S5.

FIG. 16 is a diagram showing a configuration of a peeling unit of Example 3. FIG.

Fig. 16 (a) is a front view of the peeling unit, and Fig. 16 (b) is a cross-sectional view of the peeling unit in the A-A cross section of Fig. 16 (a).

FIG. 17 is a diagram showing the operation of the adhesive tape peeling device of the third embodiment in step S4.

FIG. 18 is a diagram showing the operation of the adhesive tape peeling device of the third embodiment in step S4.

FIG. 19 is a diagram showing a configuration of a peeling unit according to a modification.

FIG. 19 (a) is a front view showing the peeling unit, and FIG. 19 (b) is a perspective view showing a characteristic part of the peeling unit.

FIG. 20 is a diagram showing the operation of the adhesive tape peeling device according to the modification.

FIG. 20 (a) is a diagram of the operation in step S6, and FIG. 20 (b) is a diagram of the operation in step S7.

    Example 1    

Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a front view of the adhesive tape peeling device 1 of Embodiment 1, FIG. 2 is a right side view of the adhesive tape peeling device 1, and FIG. 3 is a top view of the adhesive tape peeling device 1. In the first embodiment, a configuration in which the protective tape PT is peeled from the semiconductor wafer W (hereinafter, simply referred to simply as “wafer W”) to which the protective tape PT is affixed on the surface in advance will be described as an example.

    <Explanation of the overall structure>    

This adhesive tape peeling device 1 includes a holding table 3 for holding and holding a wafer W transferred by a transfer robot (not shown), a tape peeling mechanism 5, a tape detection mechanism 6, a tape recovery section 7, and the like. A specific configuration of each of the structural units and mechanisms described above is described below with reference to FIGS. 1 to 12.

The holding table 3 is a metal chuck table, as shown in FIG. 3, and has a plurality of suction holes 9 on its surface. Each of the adsorption holes 9 is connected to and connected to the external flow path 10 and the external vacuum device 11. That is, by performing vacuum suction using the vacuum device 11, the holding table 3 sucks and holds the wafer 1 placed thereon. Further, the holding table 3 is equipped with a plurality of support pins 13, and a heater 14 for heating the wafer W and the protective tape PT is built in.

The holding table 3 is not limited to a metal, and may be suitably replaced with a structure made of a porous ceramic material. In addition, the suction hole 9 and the vacuum device 11 are not essential structures, and as long as the structure can stably hold the wafer W, the holding stage 3 may not be a structure that sucks the wafer W.

The support pins 13 are arranged at regular intervals on a predetermined circumference of the holding table 3. That is, the support pin 13 is configured to be raised and lowered by the cylinder 15 so as to be exposed and retracted relative to the holding surface of the holding table 3. The tip of the support pin 13 is made of or covered by an insulator.

The protective tape PT attached to the wafer W has substantially the same shape as the wafer W (a circular shape in Example 1), and the diameter of the protective tape PT is longer than the diameter of the wafer W. Therefore, as shown in FIGS. 1 to 4 and the like, the end edge of the protective tape PT is exposed from the end edge WS of the wafer W to the outside. In Example 1 below, an exposed portion PS is defined as a portion of the protective tape PT that is exposed to the outside of the wafer W. The length of the exposed portion PS is preferably from 3 mm to 5 mm. Furthermore, in Example 1, the protective tape PT was formed as an adhesive layer having thermal peelability. In Example 1, the exposed portion PS corresponds to the peeling start end in the present invention.

As shown in FIG. 2 and FIG. 3, the stripping mechanism 5 is provided with a stripping unit 23 through a lifting shaft 21 extending downward from a movable table 19 that can be reciprocated horizontally along the rail 17 in the x direction.

The movable table 19 is configured to move horizontally by an endless belt that is wound around an idler pulley and a drive pulley mounted on a drive shaft of a motor. The lifting shaft 21 is configured to lift and lower the entire peeling unit 23 by forward and reverse rotation of the motor 25. The movable table 19 corresponds to a driving mechanism and a first driving mechanism in the present invention.

As shown in FIG. 4 and the like, the peeling unit 23 includes a vertical wall 27, a first holding member 29, a second holding member 31, and the like. The vertical wall 27 is connected to the lower end of the elevating shaft 21 and includes a rail 33 arranged vertically. The peeling unit 23 moves back and forth in the x direction along with the horizontal movement of the movable table 19.

As described later, the first holding member 29 and the second holding member 31 function as a pair of holding members to hold the exposed portion PS of the protective tape PT. The first holding member 29 is a plate-shaped member connected to the lower end of the vertical wall 27 and extending horizontally in the stripping direction shown by the symbol P. At least the upper surface of the first holding member 29 is subjected to a non-adhesive treatment using fluorine processing or the like.

The second holding member 31 is configured so that the partition rail 33 and the vertical wall 27 are connected to each other and can move up and down along the rail 33. The second holding member 31 is a plate-shaped member that extends horizontally in the tape peeling direction P similarly to the first holding member 29. The first holding member 29 and the second holding member 31 each extend to approximately the same position in the x direction.

The second holding member 31 is supported by the lifting shaft 35. The lifting shaft 35 is configured to lift and lower the second gripping member 31 by forward and reverse rotation driving of the motor 37. The second gripping member 31 can grip the exposed portion PS in cooperation with the first gripping member 29 by moving up and down along the rail 33. Each of the first holding member 29 and the second holding member 31 is made of a material having sufficient hardness, such as a metal or a resin. The motor 37 and the elevating shaft 35 correspond to a second driving mechanism in the present invention.

As shown in FIG. 1 or FIG. 4 and the like, the tape detection mechanism 6 is provided at a position more forward than the tape peeling mechanism 5 in the tape peeling direction P. The tape detection mechanism 6 is for detecting the edge of the protective tape PT attached to the wafer W, and includes a reflective photo sensor 39. The belt detection mechanism 6 is configured to reciprocate in a predetermined direction (the x direction in the first embodiment) by a track, a drive mechanism, and the like, which are not shown.

The light sensor 39 projects the laser light LS of a predetermined wavelength toward the surface of the protective tape PT. By receiving the reflected light, the position of the edge of the protective tape PT can be detected in a non-contact manner. The position information of the edge of the protective tape PT detected by the tape detection mechanism 6 is transmitted to the control unit 41 described later. In addition, the sensor included in the belt detection mechanism 6 is not limited to a light sensor, and an optical camera, an ultrasonic sensor, a touch sensor, or the like may be used to detect the position of the end edge of the protective tape PT.

As shown in FIG. 1 and the like, the tape recovery section 7 is provided in the tape peeling direction P in front of the holding table 3 and is used as a recovery box for recovering the protective tape PT peeled from the wafer W.

The control unit 41 controls the horizontal movement of the movable unit 19, the lifting movement of the peeling unit 23 by the motor 25, the lifting movement of the second holding member 31 by the motor 37, the heating by the heater 14, and the Various operations of the adhesive tape peeling device 1 as an example of horizontal movement.

    <Description of Action>    

Next, a series of operations for peeling the protective tape PT from the wafer W using the adhesive tape peeling device 1 of Example 1 will be described. In addition, in the initial state, it is assumed that the second holding member 31 is a person who moves in advance at an upper position along the rail 33.

    Step S1 (input of condition setting)    

First, an operation section (not shown) is operated and various condition settings are input. Examples of various condition settings include information related to the heating temperature and heating time of the heater 14 or the height of the holding surface of the holding table 3, the length of the diameter of the wafer W, and the thickness of the protective tape PT. The heating temperature or heating time of the heater 14 is set to a degree that the adhesive layer of the protective tape PT is foamed and expanded by heating and reduces the adhesive force.

    Step S2 (wafer transfer and holding)    

When the various settings are completed, the adhesive tape peeling device 1 is operated. As a result of the operation, the wafer W with the protective tape PT affixed in advance is transferred to the holding table 3 after being aligned on the orientation table by a robot arm (not shown). At this time, heating is started by the heater 14, and the holding table 3 is heated by the heater 14.

As shown in FIG. 5, the wafer W sucked by the robot arm on the back is placed on a plurality of support pins 13 protruding from the holding table 3. After that, the support pin 13 is lowered, and the entire back surface of the wafer W is placed on the upper surface of the holding table 3 in a predetermined posture and position. The wafer W is held and aligned from the outer periphery by a positioning mechanism disposed on the outer periphery of the holding table 3. Thereafter, the vacuum device 11 is operated to start vacuum suction, and the wafer W is sucked and held on the holding table 3. The protective tape PT on the wafer W held by the suction is heated by the heater 14, and the heat-peelable adhesive layer in the protective tape PT is foamed and expanded to reduce the adhesive force.

    Step S3 (detection with end)    

When the heating for a predetermined time is completed, as shown in FIG. 6, the control unit 41 operates the tape detection mechanism 6. The belt detection mechanism 6 that has been activated is configured to project the laser light LS from the light sensor 39 while moving horizontally in the x direction from the standby position indicated by the dotted line. Next, the belt detection mechanism 6 detects the position of the end edge Ph of the protective tape PT by receiving the reflected light of the laser light LS. The position information of the detected edge Ph is transmitted to the control unit 41.

In addition, the position of the center on which the wafer W is placed is determined in advance. Since information related to the height of the holding surface of the holding table 3 and the length of the diameter of the wafer W is input through the operation unit, the control unit 41 can calculate The correct position of the edge WS of the wafer W. Therefore, based on the position information of the edge WS of the wafer W and the position information of the end edge Ph of the protective tape PT, the length of the exposed portion PS in the protective tape PT and the correct position information are calculated by the control unit 41.

    Step S4 (holding of the end portion)    

After the detection by the tape detection mechanism 6 is completed, the control unit 41 operates the tape peeling mechanism 5 while retracting the tape detection mechanism 6 from above the holding table 3. In accordance with the instruction to start the operation, the control unit 41 controls the movable table 19 and the motor 25 to move the peeling unit 23 with the peeling mechanism 5 in the horizontal direction and the vertical direction as appropriate. As a result of the control by the control unit 41, as shown in FIG. 7, the peeling unit 23 moves from the standby position shown by the broken line to the peeling start position shown by the solid line.

The peeling start position of the peeling unit 23 is determined based on the position information of the edge WS of the wafer W and the position information of the exposed portion PS calculated in advance. That is, the upper surface of the first gripping member 29 of the peeling unit 23 abuts (or approaches) the lower surface of the exposed portion PS, and the position where the front end of the first gripping member 29 is close to the end edge WS is determined to be peeling. Start position.

When the peeling unit 23 moves to the peeling start position, as shown in FIG. 8, the control unit 41 lowers the second holding member 31 by controlling the motor 37. According to this control, the second holding member 31 moves from the starting position shown by the dotted line to the holding position shown by the solid line.

The second holding member 31 comes into contact with the surface (non-adhesive surface) of the exposed portion PS by moving toward the holding position, and presses the exposed portion PS downward. Along with this pressing, the back surface (adhesive surface) of the exposed portion PS abuts against the upper surface of the first gripping member 29 with certainty. As a result, the first gripping member 29 and the second gripping member 31 grip the exposed portion PS of the adhesive tape PT in cooperation. The holding force by the first holding member 29 and the second holding member 31 is preferably 2N or more and 10N or less.

    Step S5 (peeling of the belt)    

When the gripping by the first gripping member 29 and the second gripping member is completed, in a state where the exposed portion PS of the holding tape PT is gripped, the control unit 41 causes the peeling unit 23 as shown by arrow D in FIG. 9. Move obliquely upward in front of the stripping direction P. That is, the peeling unit 23 is driven in a tape peeling direction P parallel to the surface of the protective tape PT, and the peeling unit 23 is also driven in a direction away from the semiconductor wafer W. The peeling unit 23 moves in a direction D diagonally upward. .

As the peeling unit 23 is driven forward in the tape peeling direction P, the protective tape PT is peeled from the wafer W. In addition, after the lift-off unit 23 is raised slightly to prevent the interference between the first gripping member 29 and the wafer W, the height of the bottom surface of the first gripping member 29 becomes higher than the surface of the wafer W, and then the lift-off unit is caused. 23 moves in the direction D which is the oblique upward direction of the front. Alternatively, the peeling unit 23 may be raised slightly before moving horizontally in the tape peeling direction P.

When the peeling unit 23 is to be moved in the direction D, the peeling unit 23 is driven not only in the strip direction P in the horizontal direction but also in a direction away from the wafer W (z direction in the figure). The peeling unit 23 is also driven in the z direction, and a stronger force can be applied to the bonding interface K between the wafer W and the protective tape PT than when the peeling unit 23 is driven only in the tape peeling direction P. Therefore, the protective tape PT can be quickly and accurately peeled from the wafer W.

Since the peeling unit 23 is also driven in the z-direction, a moderate tension is applied to the portion Pk peeled from the wafer W in the protective tape PT. Therefore, it is possible to more surely avoid troubles in conveying the protective tape PT after peeling due to the occurrence of wrinkles in the portion Pk.

Furthermore, when the peeling unit 23 is peeled while moving the protective tape PT obliquely upward, the peeling unit 23 can be prevented from moving horizontally, that is, the peeling unit 23 and the peeling unit 23 are driven only in the tape peeling direction P. The state of wafer W interference. It is also possible to avoid excessive upward movement from the peeling start position, that is, the peeling unit 23 is excessively driven in a direction separated from the wafer W, and the protective tape PT is pulled to have excessive tension, which results Deformation / fracture of the protective belt PT.

After the peeling unit 23 is moved obliquely upward to a certain position, the control unit 41 moves the peeling unit 23 horizontally forward of the tape peeling direction P as shown in FIG. 10. The protective tape PT is completely peeled from the wafer W by this horizontal movement. The peeling unit 23 is moved further above the tape recovery portion 7 in a state where the exposed portion PS of the protective tape PT is held.

    Step S6 (recycling of belt)    

When the peeling unit 23 is moved above the tape recovery unit 7, the control unit 41 controls the motor 37 to return the second gripping member 31 from the gripping position to the starting position. Since the holding of the protective tape PT is released by returning the second holding member 31 toward the home position, the holding tape PT is dropped to the tape recovery unit 7 and recovered.

    Step S7 (removal of wafer)    

Next, the support pin 13 is raised and protruded from the holding table 3, and the wafer W is separated from the holding table 3. The front end of the robot arm enters between the wafer W and the holding table 3, and sucks and holds the wafer W from the back side and carries it out to the next process. This completes one round of action, and then repeats the same action.

    <Effects of the structure according to the first embodiment>    

According to the adhesive tape peeling device of Example 1, the end of the protective tape PT attached to the wafer W is peeled from the wafer W while being held by the first holding member 29 and the second holding member. The end portion of the grasped protective tape PT corresponds to a portion of the protective tape PT that is wider than the wafer diameter and is exposed from the wafer W to the outside. In addition, since the first holding member 29 and the second holding member 31 are each made of a material having sufficient hardness, such as metal or resin, it is possible to reliably prevent the gripped protective tape PT from being detached from the peeling unit 23 and falling. situation.

Therefore, even when the adhesive material of the protective tape PT is made of a material with strong adhesive force, when the protective tape PT is peeled off, the holding force by the first holding member 29 and the second holding member 31 will indeed exceed the acting force on the wafer W. Adhesion to the interface with protective tape PT. Therefore, even when a protective tape PT having a strong adhesive force is used, the situation where the protective tape PT is not peeled from the wafer W or the protective tape PT is detached from the peeling unit 23 and dropped during the peeling from the wafer W can be reliably avoided. Things happen.

In addition, the peeling method of Example 1 is different from the conventional method, and it is not necessary to use a peeling tape. Therefore, the running cost of the adhesive tape peeling device can be greatly reduced.

In addition, in the configuration of the first embodiment in which the protective tape is peeled from the wafer W while the protective tape is held, it is not necessary to suck the protective tape by an adsorption roller or the like when the protective tape is peeled. Therefore, it is possible to prevent the peeling of the protective tape from clogging the suction hole and preventing it from being detached, so that it is possible to reliably prevent the protective tape from being recovered incorrectly.

    Example 2    

Next, a second embodiment of the present invention will be described. The configuration of the adhesive tape peeling device 1A of Example 2 is basically the same as the configuration of the adhesive tape peeling device 1 of Example 1. However, the configurations of the first holding member 29 and the second holding member 31 in the peeling unit 23 are different from those in the first embodiment and the second embodiment. In the adhesive tape peeling device 1A of the second embodiment, the tape detection mechanism 6 can be omitted. Therefore, the same symbols are assigned to the configurations common to the first and second embodiments, and the following describes the characteristic configuration of the second embodiment with reference to the drawings.

FIG. 11 (a) is a front view showing the structure of the peeling unit 23A of Example 2, and FIG. 11 (b) is a perspective view showing the structure of the peeling unit 23A. In the peeling unit 23A of Example 2, the first holding member 29A is a tapered plate-like blade member, and is subjected to a non-adhesive treatment. That is, the first holding member 29A includes a tip portion 51 having a sharp edge shape.

The first holding member 29A is formed by being inserted into the front end 51 toward the bonding interface K between the wafer W and the protective tape PT, and a part of the peripheral portion of the protective tape PT is separated from the wafer W to form a peeled unit. The peeling part Pa of the part held by 23A. That is, the first holding member 29A and the second holding member 31A of Example 2 function as a pair of holding members to hold the peeling site Pa. Moreover, although the front-end | tip part 51 is a wide plate shape extended in the y direction, it may be a needle shape which tapers toward the tape peeling direction P.

As shown in FIG. 11 (a), in the peeling unit 23A, the shape of the lower surface 31 h of the second holding member 31A is configured to be fitted to the shape of the upper surface 29 h of the first holding member 29A including the front end portion 51. Better. By forming the shape in which the upper surface 29h of the first holding member 29A and the lower surface 31h of the second holding member 31A are fitted, the protective tape PT can be held in a more stable state by the first holding member 29A and the second holding member 31A.

In addition, as described above, when the adhesive tape peeling device 1 of Example 1 is used, since it is necessary to hold the exposed portion PS, the protective tape PT having a diameter larger than the length of the wafer W is used as a peeling target. On the other hand, as for the adhesive tape peeling device 1A of Example 2, as shown in FIG. 12 and the like, a protective tape PT having a length substantially the same as the diameter of the wafer W can also be used as a peeling target. The composition is different.

Next, a series of operations for peeling the protective tape PT from the wafer W using the adhesive tape peeling device 1A of Example 2 will be described. Regarding steps S4 and S5 in a series of processes from step S1 to step S7, the process of the first embodiment is different from the process of the second embodiment. The process of step S3 may be omitted in the second embodiment. Therefore, the following describes steps S4 and S5 of the second embodiment that are mainly different from the first embodiment.

    Step S4 (holding of the end portion)    

The step S4 of the second embodiment is different from the step S4 of the first embodiment in that a part of the peripheral portion of the protective tape PT having the same size as the wafer W is formed and a peeling portion is held. That is, the control unit 41 controls the movable table 19 and the motor 25 to move the peeling unit 23A with the peeling mechanism 5 in the horizontal direction and the vertical direction as appropriate.

As a result of the control by the control unit 41, as shown in FIG. 12, the peeling unit 23A moves from the standby position shown by the broken line to the peeling start position shown by the solid line. The peeling start position of the peeling unit 23A is determined such that the height of the front end portion 51 of the first holding member 29 is the same height as the bonding interface K of the wafer W and the protective tape PT, and the front end portion 51 becomes the wafer edge WS Such a position near the outside. In step S1, information on the height of the holding surface of the holding table 3, the wafer W, and the thickness of the protective tape PT are input. Therefore, the control unit 41 can calculate the correct height of the interface K in advance.

When the peeling unit 23A moves to the peeling start position, as shown in FIG. 13, the control unit 41 moves the peeling unit 23A horizontally in the tape peeling direction P by controlling the movable table 19. According to this control, the sharp blade-shaped front end portion 51 is inserted into the interface K between the wafer W and the protective tape PT.

After the front end portion 51 is inserted into the interface K, the control unit 41 moves the peeling unit 23A horizontally in the tape peeling direction P. With this horizontal movement, the sharp front end portion 51 enters along the bonding interface K toward the tape peeling direction P, and a part of the peripheral edge portion of the protective tape PT is peeled from the wafer W by the front end portion 51. As a result, the peeling part Pa is formed by the peripheral part of the protective tape PT peeled from the wafer W. At this time, the lower surface (adhesive surface) of the peeling part Pa peeled from the wafer W is supported by the upper surface 29h of the first holding member 29A. In addition, the peeling part Pa corresponds to the peeling start end in this invention.

When the peeling portion Pa is formed, the peeling portion Pa is gripped with the first holding member 29A supporting the lower surface of the peeling portion Pa. That is, as shown in FIG. 14, the control unit 41 lowers the second holding member 31A while maintaining the state where the first holding member 29A enters the interface K by controlling the motor 37. With this control, the second holding member 31A moves from the starting position shown by the dotted line to the holding position shown by the solid line.

The second holding member 31A comes into contact with the surface (non-adhesive surface) of the peeling portion Pa by moving toward the holding position, and presses the peeling portion Pa downward. With this pressing, the lower surface of the peeling part Pa is pressed toward the upper surface 29h of the first holding member 29A.

In the second embodiment, the second gripping member 31A is lowered while the first gripping member 29A is held in the state of being stuck to the interface K. That is, when the second holding member 31A is lowered, the first holding member 29A is a first holding member that is inserted between the lower surface of the peeling portion Pa and the upper surface of the wafer W without retreating from the bonding interface K. State of 29A. Therefore, when the second holding member 31A is lowered in order to hold the peeling portion Pa by the peeling unit 23A, it is possible to prevent the peeling portion Pa from continuing to the wafer W again. In a state where the lower surface of the peeling portion Pa is supported by the first gripping member 29A, the second gripping member 31A is in contact with the upper surface of the peeling portion Pa. Therefore, it is also possible to prevent the peeling part Pa from being detached and dropped from between the first holding member 29A and the second holding member 31A. Therefore, the peeling part Pa which belongs to the edge part of the protective tape PT is hold | maintained stably and reliably by the 1st holding member 29A and the 2nd holding member 31A.

    Step S5 (peeling of the belt)    

When the peeling portion Pa is gripped by the first gripping member 29A and the second gripping member 31A, in a state where the peeling portion Pa is gripped, the control unit 41 peels the peeling unit 23A toward the belt as shown by arrow D in FIG. 15. The forward direction of the direction P moves diagonally upward. That is, the control unit 41 drives the peeling unit 23A in the tape peeling direction P, and also drives the peeling unit 23A in a direction away from the wafer W. As the peeling unit 23A moves, the protective tape PT is peeled from the wafer W. Alternatively, the peeling unit 23A may be moved horizontally in the tape peeling direction.

After the protective tape PT is completely peeled from the wafer W, the processes of steps S6 and S7 are performed in the same manner as in Example 1 to recover the peeled protective tape PT and carry out the wafer W.

    <Effects of the structure according to the second embodiment>    

In the second embodiment, the first holding member 29A has a sharp front end portion 51, and the front end portion 51 is brought into the bonding interface K between the protective tape PT and the wafer W, and at least a part of the peripheral portion of the protective tape is used as the peeling portion Pa from The wafer W is peeled. Then, the first holding member 29A and the second holding member 31A cooperate to hold the peeling portion Pa.

With this configuration, even when a protective tape PT having a size substantially the same as that of the wafer W is attached to the wafer W, a part of the peripheral portion of the protective tape PT can be peeled as the peeling portion Pa at the peeling start end. Therefore, by holding the peeling portion Pa formed by peeling, the peeling unit 23A can hold the protective tape PT by a strong gripping force. As a result, the holding force of the peeling unit 23A still exceeds the adhesive force of the protective tape PT acting on the interface K. Therefore, even in the case of using a protective tape PT having a strong adhesive force and the same size as the wafer W, the situation where the protective tape PT is not peeled from the wafer W or the protective tape PT during the peeling from the wafer W can be reliably avoided. A state of occurrence such as detachment from the peeling unit 23A and falling.

In addition, when the second holding member 31A is lowered to abut against the upper surface of the protective tape PT, the first holding member 29A is maintained below the protective tape PT without the first holding member 29A being retracted from the bonding interface K. State of surface support. With this configuration, since the peeling portion Pa is placed on the upper surface of the first holding member 29A in a stable posture, it is possible to prevent the peeling portion Pa from being separated from the first holding member 29A and the second holding member 31A. .

In addition, during the period until the peeling portion Pa is gripped, the first holding member 29A is inserted between the peeling portion Pa and the wafer W, so the peeling portion Pa does not adhere to the wafer W again. Therefore, the first holding member 29A and the second holding member 31A can stably and reliably hold the peeling portion Pa at the end portion of the protective tape PT.

    Example 3    

Next, a third embodiment of the present invention will be described. The configuration of the adhesive tape peeling device 1B of Example 3 is basically the same as the configuration of the adhesive tape peeling device 1A of Example 2. However, the peeling unit 23B of Example 3 is different from the peeling unit 23A of Example 2 in that it further includes a pressing roller 55. Therefore, the same symbols are assigned to the configurations common to the second embodiment, and the characteristic configuration of the third embodiment will be described below.

As shown in FIG. 16 (a), the pressing roller 55 is configured to be rotatable by a rotating shaft 59 attached to the support plate 57. The support plates 57 are attached to both outer sides in the y-direction of the longitudinal wall 27. That is, the vertical movement of the second holding member 31A is not restricted by the support plate 57, the rotating shaft 59, and the pressing roller 55.

The support plate 57 is extended in the tape peeling direction P, and the length of the support plate 57 is set so that the pressing roller 55 is arranged further forward than the front end portion 51 of the first gripping member 29A. The mounting positions of the support plate 57 and the rotation shaft 59 in the z direction are set such that the height of the lower surface of the pressing roller 55 is higher than the height of the front end portion 51 by the amount of the thickness F of the protective tape PT. That is, the distance between the pressing roller 55 and the front end portion 51 in the thickness direction of the wafer W is configured to match the thickness F of the protective tape PT. The pressing roller 55 corresponds to a pressing member in the present invention.

Next, a series of operations for peeling the protective tape PT from the wafer W using the adhesive tape peeling device 1B of Example 3 will be described. Regarding step S4 in a series of processes from step S1 to step S7, the process of the third embodiment is different from the process of the second embodiment. Therefore, the process of step S4 which is a characteristic of the third embodiment will be described below.

    Step S4 (holding of the end portion)    

When step S4 is started, the control unit 41 controls the movable table 19 and the motor 25 to move the peeling unit 23B with the peeling mechanism 5 in the horizontal direction and the vertical direction as appropriate. As a result, the peeling unit 23B moves from the starting position to the peeling start position shown in FIG. 17. The peeling start position of the peeling unit 23B is determined in advance such that the pressing roller 55 is in contact with the upper surface of the protective tape PT, and the leading end portion 51 is positioned near the outside of the wafer edge WS.

As shown in FIG. 16 (a), the pressing roller 55 is disposed more forward than the front end portion 51 in the tape peeling direction P. Therefore, when the peeling unit 23B is moved toward the peeling start position, the pressing roller 55 can be brought into contact with the upper surface of the protective tape PT in a state where the leading end portion 51 is not inserted into the bonding interface K. The height of the lower surface of the pressing roller 55 is configured to be higher than the height of the front end portion 51 by the amount of the thickness F of the protective tape PT. Therefore, when the pressing roller 55 abuts on the upper surface of the protective tape PT, the height of the front end portion 51 does exactly match the height of the contact interface K.

When the peeling unit 23A is moved to the peeling start position, as shown in FIG. 18, the control unit 41 controls the movable table 19 and the motor 25 to apply a driving force to the peeling unit 23B while lowering the peeling unit 23B toward the peeling unit 23B. The stripping direction P moves horizontally. Under the control of the movable table 19, the pressing roller 55 is continuously rotated toward the tape peeling direction P along the upper surface of the protective tape PT. At this time, under the control of the motor 25, the protective tape PT is slightly pressed by the pressing roller 55.

With the movement of the peeling unit 23B, the sharpened blade-shaped front end portion 51 is inserted into the bonding interface K between the wafer W and the protective tape PT. In Example 3, the pressing roller 55 rotates horizontally along the upper surface of the flat protective tape PT toward the tape peeling direction P while slightly pressing the protective tape PT. Then, the height of the lower surface of the pressing roller 55 is fixed so as to be higher than the height of the front end portion 51 by the amount of the thickness F of the protective tape PT.

Therefore, the front end portion 51 is continuously inserted into the bonding interface K while maintaining a constant height with high accuracy. That is, when the front end portion 51 is moved toward the tape peeling direction P and enters the bonding interface K, the position of the front end portion 51 is deviated in the z direction, and the height of the front end portion 51 is deviated from the height of the bonding interface K. The front end portion 51 is inserted into the layer of the protective tape PT or the wafer W.

After the front end portion 51 is inserted into the bonding interface K, the control unit 41 moves the peeling unit 23B horizontally in the tape peeling direction P in the same manner as in the second embodiment. Along with this horizontal movement, the sharp tip portion 51 travels along the bonding interface K in the tape peeling direction P and is inserted between the lower surface of the protective tape PT and the upper surface of the wafer W. Therefore, along with this progress, a part of the peripheral portion of the protective tape PT is peeled from the wafer W by the front end portion 51. As a result, the peripheral portion of the protective tape PT peeled from the wafer W is formed as a peeling portion Pa.

When the peeling part Pa is formed, similarly to Example 2, the peeling part Pa is gripped with the 1st holding member 29A supporting the lower surface of the peeling part Pa. While maintaining the state where the first gripping member 29A enters the interface K, the second gripping member 31A is lowered to a height contacting the upper surface of the peeling portion Pa. By lowering the second holding member 31A, the peeling portion Pa in the protective tape PT is stably and reliably held by the first holding member 29A and the second holding member 31A.

After holding the peeling portion Pa of the protective tape PT, the processes of steps S5 to S7 are performed in the same manner as in Example 2 to peel the protective tape PT, recover the peeled protective tape PT, and carry out the wafer W.

In the adhesive tape peeling device of Example 3, a pressing roller 55 is provided in the peeling unit 23B. The pressing roller 55 rotates on the surface of the protective tape PT while causing the sharp front end portion 51 to enter and enter the interface K. A peeling site Pa is formed. The pressing roller 55 is located in the thickness direction (z direction) of the wafer W, and is disposed at a position where the distance from the front end portion 51 becomes the thickness F of the protective tape PT.

Therefore, when the pressing roller is rotated along the surface of the protective tape PT, when the leading end portion 51 is inserted into and enters the contact interface K, the height of the leading end portion 51 can be maintained to exactly match the height of the interface K. status. Therefore, it is possible to prevent the relative positional relationship between the front end portion 51 and the adhering interface K from being shifted due to a slight deviation in the position where the wafer W is placed or the vibration generated when the peeling unit 23B is moved, so that the front end portion 51 faces the protective tape. A situation where the side of the PT or the side of the wafer W is stuck.

That is, in the configuration of Example 3, it is possible to more reliably prevent the protective tape PT from being inserted into the front end portion 51, and only the surface layer portion of the protective tape PT is peeled from the wafer W as the peeling portion Pa, and a part of the protective tape PT becomes A state where the wafer W cannot be separated. In addition, it is possible to surely prevent the wafer W or the front end portion 51 from being damaged by being inserted into the side surface of the wafer W by the front end portion 51.

The present invention is not limited to the above embodiments, and can be modified and implemented as described below.

(1) In the packaging device of each of the above embodiments, although the peeling unit 23 is a structure in which one part of the protective tape PT is gripped and peeled from the wafer W as an example, the number of gripped parts is described. Not limited to one site. That is, a plurality of holding members including a pair of the first holding member and the second holding member may be provided, and the protective tape PT may be peeled from the wafer W while clamping a plurality of positions in the protective tape PT simultaneously. Since the plural parts are peeled while being gripped, the magnitude of the force acting on the protective tape PT can be dispersed during the gripping, so that the situation of deformation or damage of the protective tape can be reliably avoided.

(2) In the packaging device of each of the above embodiments, the upper surface 29h of the first holding member 29 or the lower surface 31h of the second holding member 31 is a smooth surface, but the shape of the upper surface 29h or the lower surface 31h may be appropriately changed. As another example, as shown in FIGS. 19 (a) and 19 (b), a configuration in which the upper surface 29 h is provided with the convex portion 61 may be mentioned. In this case, in accordance with the shape of the upper surface 29h, the lower surface 31h is preferably provided with a recessed portion 63 that fits into the convex portion 61.

In this modification, since the convex portion 61 is provided, the frictional force between the protective tape PT and the gripping member is greatly changed. Therefore, the end portion of the protective tape PT can be more stably by the first gripping member 29 and the second gripping member 31. maintain. However, as long as the first holding member 29 and the second holding member 31 can properly hold the ends of the protective tape PT, the shape is not limited to the structure in which the upper surface 29h and the lower surface 31h are fitted together, and the respective shapes can be appropriately changed. .

(3) In the packaging device of each of the above embodiments, the protective tape PT that has been peeled from the wafer W is recovered toward the tape in a state where it is suspended from the peeling unit 23 holding the protective tape PT on one end side as shown in FIG. 10. The unit 7 is transported, but it is not limited to this. That is, as shown in FIG. 20 (a), a third holding member 53 may be provided by holding the protective tape PT peeled from the wafer W in cooperation with the peeling unit 23 and holding the protective tape PT in a flat state.

In this modification, the third gripping member 53 grips the other end side of the protective tape PT. Next, the peeling unit 23 and the third gripping member 53 cooperatively transport the protective tape PT toward the upper part of the tape recovery unit 7 while maintaining the distance that the protective tape PT can be flat. Next, as shown in FIG. 20 (b), the third gripping member 53 descends in cooperation with the peeling unit 23 and moves to the vicinity of the bottom surface of the tape recovery unit 7.

Next, the grip of the protective tape PT is released near the bottom surface of the tape recovery section 7. The released protective tape PT is attached to the bottom surface of the tape recovery section 7 or is stored on the protective tape PT both stored in the tape recovery section 7 in a flat state. The structure holding the other end side of the protective tape PT is not limited to the structure held by the third holding member 53 or the like. For example, the other end of the protective tape PT may be a transfer arm having a suction hole or the like. Structure of side adsorption holding.

In this modification, the protective tape PT peeled from the wafer W is held not only by one end side by the peeling unit 23 but also by the third holding member 53 at the other end side. Therefore, since the protective tape PT is held in a more stable posture, it is possible to reliably prevent the peeling unit 23 from dropping the protective tape PT when the protective tape PT is transported / recovered to the tape recovery unit.

Also in this modification, since both ends of the protective tape PT are held, the protective tape PT can be transported / recovered in a flat state. That is, the protective tapes PT can be laminated in a flat state and stored in the tape recovery section. Therefore, after the protection tape PT is held by the peeling unit 23 until the protective tape PT is stored in the tape recovery section 7, During this period, deformation of the protective tape PT can be avoided. Therefore, since the waste of space in the tape recovery section 7 can be reduced, the recovery efficiency of the protective tape PT can be improved.

(4) In the packaging devices of the above embodiments and modifications, the heat-peelable protective tape PT is taken as an example, and the configuration in which the adhesive force of the protective tape PT is reduced by heating is exemplified, but it is not limited to this. . That is, the ultraviolet-curable protective tape PT can be used to reduce the adhesive force by ultraviolet irradiation, and the end of the protective tape PT can be held and the protective tape PT can be held without reducing the adhesive force of the protective tape PT. Detach from wafer W.

(5) In the packaging devices of the above embodiments and modifications, although an example of the adhesive tape to be peeled has been described using the protective tape PT for circuit protection as an example, the adhesive tape to be peeled is not limited to The protective tape may also be an adhesive tape used for other purposes such as a dicing tape.

(6) In the packaging apparatus of each of the above embodiments and modifications, in step S5, the protective tape PT is moved by moving the peeling unit 23 holding the end portion of the protective tape PT toward the tape peeling direction P. Stripping from the wafer W is not limited to this. That is, in a state where the end of the protective tape PT is held by the peeling unit 23, the protective tape PT can be peeled from the wafer W by moving the holding table 3 to the side opposite to the tape peeling direction P. Even with this configuration, since the peeling unit 23 and the holding table 3 are relatively moved in the tape peeling direction P, the protective tape PT can be appropriately peeled.

(7) In each of the above-mentioned embodiments 3, although the pressing roller 55 rotating on the surface of the protective tape PT while pressing the protective tape PT is used to maintain the height of the front end portion 51 with high accuracy, it is not limited to this. Limited. For example, a block-shaped pressing member may be used instead of the pressing roller 55. In this case, a block-shaped pressing member arranged at a degree of thickness F of the protective tape PT from above the front end portion 51 slides on the surface of the protective tape PT while pressing the protective tape PT. As the pressing member slides, the front end portion 51 is horizontally moved in the tape peeling direction P and is inserted into the bonding interface K, so that the end portion of the protective tape PT is appropriately peeled from the wafer W as the peeling portion Pa.

Claims (10)

    A method for peeling an adhesive tape is to peel an adhesive tape attached to a semiconductor wafer from the aforementioned semiconductor wafer. The method for peeling the adhesive tape is characterized by comprising: a holding process for holding the semiconductor wafer with a holding stage; and a first peeling process. The first holding member provided with a sharp front end and provided in the peeling unit enters a bonding interface between the semiconductor wafer and the adhesive tape, and at least a part of a peripheral portion of the adhesive tape is used as a peeling start end from the semiconductor crystal. During the holding process, while maintaining the state where the first holding member is in the bonding interface, the second holding member provided in the separating unit is brought into contact with the non-adhesive surface of the peeling start end, and the first holding The member and the second holding member hold the peeling start end; and in the second peeling process, the first holding member and the second holding member hold the peeling portion while holding the peeling unit and the holding table facing each other. The predetermined tape peeling direction is relatively moved to peel the adhesive tape from the semiconductor wafer.         For example, the method for peeling an adhesive tape according to claim 1, wherein the first peeling process is to make the pressing member enter the bonding interface in a state where the pressing member abuts on a non-adhesive surface of the adhesive tape, and the pressing member is disposed on The distance between the thickness direction of the semiconductor wafer and the front end portion is a position that becomes the length of the thickness of the adhesive tape.         A method for peeling an adhesive tape is to peel an adhesive tape having a larger diameter than a semiconductor wafer attached to a semiconductor wafer from the semiconductor wafer. The method for peeling the adhesive tape is characterized by: The semiconductor wafer; a holding process in which at least a part of a part of the adhesive tape exposed from the semiconductor wafer to the outside is used as a peeling start end and is held by a pair of holding members provided in a peeling unit; and a peeling process in In a state in which the pair of holding members are holding the peeling start end, the peeling unit and the holding table are relatively moved in a predetermined tape peeling direction to peel the adhesive tape from the semiconductor wafer.         For example, the method for peeling an adhesive tape according to claim 1 or 2, wherein in the second peeling process, the peeling unit is moved in a direction away from the holding table while the peeling unit and the holding table are opposed to each other in a predetermined tape peeling direction. The adhesive tape is peeled from the semiconductor wafer by moving.         The adhesive tape peeling method according to claim 1 or 3, further comprising: a tape holding process, wherein the tape peeling member holds the opposite side of the peeling start end of the adhesive tape peeled from the semiconductor wafer in the second peeling process; and In the tape recovery process, the adhesive tape is transported to the tape recovery unit in a flat state and recovered by the tape holding member and the peeling unit.         An adhesive tape peeling device is used for peeling an adhesive tape attached to a semiconductor wafer from the semiconductor wafer. The adhesive tape peeling device is provided with: a holding table for holding the semiconductor wafer; and a peeling unit for applying the adhesive Peeling off the semiconductor wafer with at least a part of a peripheral portion of the tape held; and a first driving mechanism for relatively moving the peeling unit and the holding table in a predetermined tape peeling direction, the peeling unit having: a first grip A member having a sharpened front end portion, which enters a bonding interface between the adhesive tape and the semiconductor wafer, and peels at least a part of a peripheral portion of the adhesive tape from the semiconductor wafer as a peeling start end; a second holding member, Holding the peeling start end in cooperation with the first gripping member; and a second driving mechanism that drives the second gripping member toward the thickness direction of the adhesive tape while the first gripping member is entering the bonding interface, and abuts against it. The non-adhesive surface connected to the peeling start end.         According to the adhesive tape peeling method of claim 6, wherein the peeling unit includes a pressing member, the pressing member is disposed in a thickness direction of the semiconductor wafer and a distance between the pressing member and the front end portion is a length that becomes a thickness of the adhesive tape. Position, and abuts the non-adhesive surface of the adhesive tape when the front end portion enters the bonding interface.         An adhesive tape peeling device is used for peeling an adhesive tape having a larger diameter than a semiconductor wafer attached to a semiconductor wafer from the semiconductor wafer. The adhesive tape peeling device is characterized by comprising: a holding table for holding the semiconductor crystal; A peeling unit that peels from the semiconductor wafer in a state where at least a part of the adhesive tape exposed from the semiconductor wafer to the outside is held as a peeling start end; and a driving mechanism that holds the peeling unit and the holding The stage is relatively moved toward a predetermined tape peeling direction.         According to the adhesive tape peeling device of claim 6 or 7, wherein the first driving mechanism moves the peeling unit in a direction away from the holding table, while moving the peeling unit and the holding table in a predetermined tape peeling direction The relative movement moves to peel the adhesive tape from the semiconductor wafer.         The adhesive tape peeling device according to claim 6 or 8, further comprising: a tape holding member that holds the opposite side of the peeling start end of the adhesive tape peeled from the semiconductor wafer; and a tape recovery unit that stores the semiconductor wafer from the semiconductor wafer. The peeled adhesive tape and the tape holding member hold the adhesive tape in a flat state in cooperation with the peeling unit and store the adhesive tape in a tape recovery unit.