JP2010076875A - Film peeling device and film peeling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently perform a film peeling treatment by favorably and orderly stacking the film peeled off a substrate by a simple step and configuration. <P>SOLUTION: This support body peeling device 130 includes: a substrate holding mechanism 132 for forcibly holding a pasted substrate 24a in a flat shape; a film grasping mechanism 134 for grasping both ends of the base film 26 projecting to the outside of a glass substrate 24; a moving mechanism 136 for peeling the base film 26 from the pasted substrate 24a by moving the film grasping mechanism 134 from a film peeling station PS to a film disposing station DS; and a controller 137 for drivingly controlling the moving mechanism 136 and moving the film grasping mechanism 134 downward while the base film 26 is transferred to the film disposing station DS. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a film peeling apparatus and method for peeling off a film from an attached substrate having a film attached to the substrate.

  For example, a liquid crystal panel substrate, a printed wiring substrate, and a PDP panel substrate are configured by attaching a photosensitive sheet (photosensitive web) having a photosensitive material (photosensitive resin) layer to the substrate surface. In the photosensitive sheet body, a photosensitive material layer and a protective film are sequentially laminated on a flexible plastic support.

  In this type of photosensitive sheet body, after the protective film is partially or completely peeled off, the photosensitive material layer is attached to a substrate such as a glass substrate or a resin substrate. Next, the support is peeled from the substrate, whereby an attached substrate on which the photosensitive material layer is attached is obtained.

  For example, in the film peeling method and peeling apparatus disclosed in Patent Document 1, as shown in FIG. 21, a substrate suction hand 2 that sucks and moves the glass substrate 1 and is attached to the glass substrate 1. 21, a cylinder 4 that moves the first clamper 3 to the left and right in FIG. 21, and a horizontal guide 5a that moves the cylinder 4 in the front-rear direction. And a vertical guide 5b that moves in the vertical direction, a second clamper 6 that sandwiches the peeled film F, and a film pusher 7 that pushes the peeled film F in a horizontal direction.

  Therefore, first, when the substrate suction hand 2 is arranged in a horizontal posture indicated by a two-dot chain line in FIG. 21 and the glass substrate 1 is placed, the substrate suction hand 2 stands by sucking the glass substrate 1. .

  Next, the first clamper 3 grips a part of the film F protruding outside from the glass substrate 1, and the first clamper 3 moves in an arbitrary direction via the cylinder 4. For this reason, the film F is peeled off from the corner portion of the glass substrate 1.

  Further, the first clamper 3 moves in the direction of the arrow under the guiding action of the horizontal guide 5a and the vertical guide 5b, peels off the film F from the glass substrate 1, and then the film F is delivered to the second clamper 6. . At that time, the peeled film F is spread in the horizontal direction via the film pusher 7, and the films F are overlapped and accommodated in the container 8.

JP 2002-234667 A

  In the peeling apparatus, the peeled film F is spread in the horizontal direction via the film pusher 7 and is then sequentially stacked and accommodated in the container 8. However, the film F is dropped into the container 8 from a relatively high place under the opening action of the second clamper 6. For this reason, in the container 8, there exists a problem that each film F cannot be laminated | stacked flatly and orderly.

  As a result, the film F cannot be satisfactorily accommodated in the container 8, and there is a problem that the disposal operation of the film F becomes complicated and an efficient film peeling process is not performed.

  The present invention solves this type of problem, and with a simple process and configuration, the film peeled off from the attached substrate can be integrated well and orderly, and the film peeling process can be performed efficiently. An object of the present invention is to provide a film peeling apparatus and method.

  The present invention relates to a film peeling apparatus for peeling off a film from an attached substrate having a film attached to the substrate.

  The film peeling apparatus includes a substrate holding mechanism for positioning and holding a bonded substrate disposed at the film peeling station, a film holding mechanism for holding an end portion of the film, and the film holding mechanism from the film peeling station. A moving mechanism for separating the film from the pasted substrate held by the substrate holding mechanism and discarding the film to the film disposal station, and driving and controlling the moving mechanism. A control mechanism for lowering the film gripping mechanism in the course of being transferred to the film disposal station.

  Moreover, this film peeling apparatus is preferably provided with a nip roller that is arranged in the course of film transfer from the film peeling station to the film disposal station and guides the film peeled off from the attached substrate.

  Further, it is preferable that the film disposal station is provided with a film collecting carriage for collecting films, and an elevating mechanism for detachably holding the film collecting carriage and raising and lowering the film collecting carriage.

  Furthermore, it is preferable that the film stacking carriage is provided with a plurality of rotatable rollers on the film stacking surface for stacking the film, and at least a part of the frame plate that goes around the film stacking surface is configured to be openable and closable. .

  The substrate holding mechanism preferably includes a suction portion that sucks and holds the attached substrate in a flat shape by sucking a surface of the substrate opposite to the film attachment surface.

  Furthermore, this invention relates to the film peeling method which peels the said film from the adhesion board | substrate with which the film was affixed on the board | substrate.

  The film peeling method includes a step of positioning and holding an adhesive substrate disposed at a film peeling station, a step of gripping an end of the film by a film gripping mechanism, and a step of removing the film gripping mechanism from the film peeling station. And moving the film to the film disposal station and peeling the film to the film disposal station, and lowering the film gripping mechanism while the film is being transferred to the film disposal station. It is operating.

  Furthermore, in this film peeling method, it is preferable that the film peeled off from the attached substrate is guided by a nip roller disposed in the course of transferring the film from the film peeling station to the film disposal station.

  The film peeling method may further include a step of stacking the film on a film stacking carriage that is detachably held at the film disposal station, and lowering the film stacking carriage according to the stacking height of the film. preferable.

  Further, in the film peeling station, it is preferable to suck and hold the attached substrate in a flat state by sucking the surface opposite to the film attaching surface of the substrate.

  In the present invention, the film is peeled from the attached substrate by moving the film gripping mechanism from the film stripping station to the film discarding station in a state where the end of the film is gripped by the film gripping mechanism.

  At that time, since the film gripping mechanism is lowered while the film is being transferred to the film disposal station, the film gripped by the film gripping mechanism has a low transfer height. Accordingly, the film gripped by the film gripping mechanism is transported along and close to the film stacking surface of the film disposal station.

  As a result, when the film gripping action by the film gripping mechanism is released, the film is stacked well and orderly on the film stacking surface of the film disposal station. For this reason, it becomes possible to perform a film peeling process efficiently.

  FIG. 1 is a schematic configuration diagram of a manufacturing apparatus 20 in which a film peeling apparatus according to an embodiment of the present invention is incorporated. The manufacturing apparatus 20 is a process of thermally transferring a photosensitive resin layer 29 (described later) of a long photosensitive web (long web) 22 to a glass substrate 24 in a manufacturing process of a liquid crystal or an organic EL color filter or the like. I do.

  FIG. 2 is a cross-sectional view of the photosensitive web 22 used in the manufacturing apparatus 20. The photosensitive web 22 is formed by laminating a flexible base film (film) 26, a cushion layer (thermoplastic resin layer) 27, an intermediate layer (oxygen barrier film) 28, a photosensitive resin layer 29, and a protective film 30. Is done. The photosensitive web 22 may be composed of a base film 26, a photosensitive resin layer 29, and a protective film 30.

  The base film 26 is formed of polyethylene terephthalate (PET), the cushion layer 27 is formed of ethylene and vinyl oxide copolymer, the intermediate layer 28 is formed of polyvinyl alcohol, and the photosensitive resin layer 29 is alkali-soluble. The protective film 30 is formed of polyethylene, polypropylene, or the like, and is formed of a colored photosensitive resin composition containing a binder, a monomer, a photopolymerization initiator, and a colorant.

  As shown in FIG. 1, the manufacturing apparatus 20 accommodates a photosensitive web roll 22a in which a photosensitive web 22 is wound in a roll shape, and a web feed mechanism 32 that feeds the photosensitive web 22 from the photosensitive web roll 22a. And a half-cut mechanism 36 for forming a half-cut portion 34 that can be cut in the width direction on the protective film 30 of the fed photosensitive web 22, and an adhesive label 38 having a non-adhesive portion 38a in part (FIG. 3). And a label adhering mechanism 40 for adhering the protective film 30 to the protective film 30.

  Downstream of the label adhering mechanism 40, a reservoir mechanism 42 for changing the photosensitive web 22 from tact feeding to substantially continuous feeding, and a protective film for peeling the protective film 30 from the photosensitive web 22 at a predetermined length interval. A peeling mechanism 44, a heating mechanism 45 that transports the glass substrate 24 to a pasting position in a state where the glass substrate 24 is heated to a predetermined temperature, and a photosensitive resin layer 29 exposed by the peeling of the protective film 30 are pasted to the glass substrate 24. An affixing mechanism 46 is provided. The laminated body in which the photosensitive web 22 is bonded to the glass substrate 24 by the bonding mechanism 46 is hereinafter referred to as a bonded substrate 24a.

  A detection mechanism 47 that directly detects a half-cut portion 34 that is a boundary position of the photosensitive web 22 is disposed in the vicinity of the pasting position in the pasting mechanism 46, and downstream of the pasting mechanism 46. An inter-substrate web cutting mechanism 48 for cutting the photosensitive web 22 between the glass substrates 24 is disposed. Upstream of the inter-substrate web cutting mechanism 48, a web cutting mechanism 48a used at the start of operation and at the end of operation is provided.

  In the vicinity of the downstream side of the web feed mechanism 32, a joining base 49 for joining the rear end of the photosensitive web 22 that has been substantially used and the tip of the photosensitive web 22 that is newly used is disposed. A film end position detector 51 is disposed downstream of the joining base 49 in order to control the deviation in the width direction due to the winding deviation of the photosensitive web roll 22a.

  The half-cut mechanism 36 is disposed downstream of the roller pair 50 for calculating the roll diameter of the photosensitive web roll 22a accommodated and wound in the web feed mechanism 32. The half-cut mechanism 36 includes a slide base 52 that can be moved back and forth in a direction orthogonal to the conveyance direction (arrow A direction) of the photosensitive web 22. A rotating round blade (cutter) 54 is fixed to the slide base 52, and a cut receiving base 56 is disposed at a position facing the rotating round blade 54 with the photosensitive web 22 interposed therebetween.

  As shown in FIG. 2, the half-cut portion 34 needs to cut at least the protective film 30, and in practice, the photosensitive resin layer 29 to the intermediate layer 28 are cut to securely cut the protective film 30. In addition, the cutting depth of the rotating round blade 54 is set.

  The half-cut part 34 sets the space | interval of the glass substrate 24, for example, is set in the position which respectively entered 10 mm each to the said glass substrate 24 of both sides. A portion sandwiched between the half cut portions 34 between the glass substrates 24 functions as a mask when the photosensitive resin layer 29 is attached to the glass substrate 24 in a frame shape in an attaching mechanism 46 described later.

  The label bonding mechanism 40 supplies an adhesive label 38 that connects the peeling portion 30aa on the front side of the peeling side and the peeling portion 30ab on the back side of the peeling side in order to leave the remaining portion 30b of the protective film 30 correspondingly between the glass substrates 24. . As shown in FIG. 2, the protective film 30 has a remaining portion 30 b sandwiched between the first peeled portion 30 aa and the later peeled portion 30 ab.

  As shown in FIG. 3, the adhesive label 38 is formed in a strip shape, and is formed of, for example, the same resin material as the protective film 30. The adhesive label 38 has a non-adhesive portion (including a slight adhesion) 38a to which a pressure-sensitive adhesive is not applied at the center, and the front side of the non-adhesive portion 38a, that is, both ends in the longitudinal direction of the adhesive label 38 It has the 1st adhesion part 38b adhered to exfoliation part 30aa, and the 2nd adhesion part 38c adhered to back exfoliation part 30ab.

  As shown in FIG. 1, the label adhering mechanism 40 includes adsorbing pads 58a to 58g to which a maximum of seven adhering labels 38 can be attached at predetermined intervals, and the adhering labels by the adsorbing pads 58a to 58g. At the attachment position 38, a pedestal 59 for holding the photosensitive web 22 from below is disposed so as to be movable up and down.

  The reservoir mechanism 42 absorbs the difference in speed between the tact conveyance of the upstream photosensitive web 22 and the continuous conveyance of the downstream photosensitive web 22, but in order to further prevent fluctuations in tension, the reservoir mechanism 42 is a oscillating duplex unit. It is preferable to provide a dancer 61 composed of the roller 60.

  The protective film peeling mechanism 44 is disposed downstream of the reservoir mechanism 42, and includes a suction drum 62 and a peeling roller 64 that contacts the suction drum 62 with the photosensitive web 22 interposed therebetween. The protective film 30 that is peeled off from the photosensitive web 22 at an acute peeling angle via the peeling roller 64 is wound around the protective film winding shaft 66 except for the remaining portion 30b. The protective film take-up shaft 66 is connected to, for example, a torque motor 68 in order to apply a predetermined tension to the protective film 30.

  A tension control mechanism 76 that can apply tension to the photosensitive web 22 is disposed on the downstream side of the protective film peeling mechanism 44. The tension control mechanism 76 includes a cylinder 78, and the tension of the photosensitive web 22 with which the tension pickup roller 80 is slidably contacted can be adjusted by oscillating and displacing the tension pickup roller 80 under the driving action of the cylinder 78. is there. The tension control mechanism 76 may be used as necessary, and can be deleted.

  The detection mechanism 47 includes a photoelectric sensor 82 such as a laser sensor or a photosensor. The photoelectric sensor 82 is a wedge-shaped groove-shaped portion of the half-cut portion 34, a step due to the thickness of the protective film 30, or these A change due to the combination is directly detected, and this detection signal is used as a boundary position signal. The photoelectric sensor 82 is disposed to face the backup roller 83.

  The heating mechanism 45 includes a transport mechanism 84 for transporting the glass substrate 24 in the direction of arrow C and a plurality of heating furnaces 86, and the transport mechanism 84 has a plurality of resin disk shapes arranged in the direction of arrow C. A conveyance roller 88 is included.

  The affixing mechanism 46 is provided with rubber rollers 110a and 110b for laminating that are arranged vertically and heated to a predetermined temperature. The backup rollers 112a and 112b are slidably contacted with the rubber rollers 110a and 110b, and the backup roller 112b is pressed toward the rubber roller 110b via the roller clamp portion 114.

  In the vicinity of the rubber roller 110a, a contact prevention roller 116 for preventing the photosensitive web 22 from contacting the rubber roller 110a is disposed. The contact prevention roller 116 is movable via an actuator (not shown).

  A film transport roller 118a and a substrate transport roller 118b are disposed between the attaching mechanism 46 and the inter-substrate web cutting mechanism 48. A transport system 120 in which a plurality of rollers 120 a are arranged is provided on the downstream side of the inter-substrate web cutting mechanism 48. At the end of the conveyance system 120 in the arrow C direction (downstream side), as shown in FIG. 4, a direction changing conveyor 122 that converts the conveyance direction of the attached substrate 24a from the arrow C direction to the arrow B direction is provided.

  A transfer robot 124 is disposed downstream of the direction change conveyor 122, and the transfer robot 124 transfers the pasting substrate 24 a from the direction change conveyor 122 to the transfer system 126. The transport system 126 includes a plurality of rollers 126a, and transports the adhered substrate 24a in the direction of arrow C.

  A cooling mechanism 128 is disposed upstream of the transport system 126. The cooling mechanism 128 supplies cooling air to the pasting substrate 24a to perform a cooling process. Specifically, the wind speed is set to 1.0 to 2.0 m / min, and on the downstream side of the cooling mechanism 128, the support peeling device according to the present embodiment (corresponding to the film peeling station PS ( A film peeling device 130 is disposed.

  As shown in FIGS. 5 and 6, the support peeling device 130 includes a substrate holding mechanism 132 for forcibly holding the bonded substrate 24a in a flat shape, and a conveyance direction of the glass substrate 24 constituting the bonded substrate 24a. A film gripping mechanism 134 that grips both ends of the base film 26 protruding outward from both ends, and the base film by moving the film gripping mechanism 134 from the film peeling station PS to the film disposal station DS (in the direction of arrow D). The moving mechanism 136 that peels the film 26 from the pasting substrate 24a, and the driving mechanism of the moving mechanism 136 are controlled, and the film gripping mechanism 134 is moved downward while the base film 26 is transferred to the film disposal station DS. A controller (control mechanism) 137.

  As shown in FIGS. 7 to 9, the substrate holding mechanism 132 includes a first suction portion 138 that sucks four corners of the surface opposite to the base film attaching surface of the glass substrate 24, and the base film peeling direction of the glass substrate 24. A second suction part 140 that sucks both ends in the direction of arrow D and a third suction part 142 that sucks the central part of the glass substrate 24 are provided.

  The first suction unit 138 includes suction pads 144a arranged at the four corners of the glass substrate 24, more preferably outside the attachment region of the base film 26 (photosensitive web 22). Each suction pad 144a is individually movable in the direction of arrow E via a cylinder (actuator) 146.

  Each suction pad 144a is formed of, for example, a resin material such as PEEK (polyetheretherketone) or a rubber material, and has a suction hole 148. The suction hole 148 is a vacuum suction (not shown). Communicate with the system. The same applies to each suction pad described below.

  As shown in FIGS. 8 and 9, four second suction portions 140 are arranged at both ends of the glass substrate 24 in the direction of the arrow D, more preferably, outside the attachment region of the base film 26. A suction pad 144b. The third suction unit 142 includes a plurality of suction pads 144c arranged in the region where the base film 26 of the glass substrate 24 is attached.

  Each suction pad 144b, 144c is attached to a single lifting platform 150, and the lifting platform 150 is movable back and forth in the direction of arrow E through a cylinder 151 which is a single actuator (see FIG. 9). . In addition, you may provide the 1st adsorption | suction part 138a and the 2nd adsorption | suction part 140a corresponding to the sticking board | substrate 24a from which a shape differs.

  As shown in FIGS. 8 and 9, the substrate holding mechanism 132 positions the substrate lift mechanism 147 that temporarily lifts the loaded bonded substrate 24 a and the bonded substrate 24 a lifted by the substrate lift mechanism 147. A substrate positioning mechanism 149.

  The substrate lift mechanism 147 includes a plurality of substrate receiving rollers 147a arranged on the glass substrate 24 side, and the substrate receiving rollers 147a can be moved up and down via an actuator such as a cylinder (not shown).

  The substrate positioning mechanism 149 is provided with four positioning rollers 149 a arranged corresponding to the four corners of the glass substrate 24. The positioning roller 149a can advance and retreat in the direction of arrow D with respect to the glass substrate 24 under the action of a driving mechanism (not shown), and the positioning rollers 149a each sandwich the glass substrate 24 for positioning. The positioning roller 149a preferably has at least two positioning positions corresponding to the glass substrates 24 having different shapes.

  As shown in FIGS. 5 and 6, the moving mechanism 136 includes a frame member 154 that extends in the arrow D direction from the substrate holding mechanism 132 to a film discard mechanism 152 described later.

  On the frame member 154, upper guide rails 156a and 156b extending in an arrow D direction orthogonal to the conveyance direction (arrow C direction) of the attached substrate 24a extend in parallel with a predetermined distance from each other. Below the upper guide rails 156a and 156b, lower guide rails 158a and 158b that are shorter than these extend in the direction of the arrow D and are provided in parallel to each other. The upper guide rails 156a and 156b support self-propelled movable members 162a and 162b that can advance and retract along the direction of arrow D via the motors 160a and 160b.

  The movable members 162a and 162b extend in the vertical direction (the direction of arrow E), and guide rails 164a and 164b extending in the vertical direction are provided on side surfaces facing each other. Lift rails 166a and 166b are supported on the guide rails 164a and 164b, and the lift rails 166a and 166b can be lifted and lowered via motors 168a and 168b.

  The chucks 170a and 170b constituting the film gripping mechanism 134 are fixed to the lower ends of the lifting platforms 166a and 166b. The chucks 170a and 170b are positioned at positions where the both sides of the base film 26 projecting outward from both ends of the glass substrate 24 constituting the attachment substrate 24a can be gripped at the base film peeling position of the attachment substrate 24a. It can be adjusted.

  As the motors 160a, 160b and 168a, 168b, various rotational driving sources capable of controlling speed or acceleration are used. For example, in addition to a servo motor and a linear motion linear motor, a linear motion robot or the like is employed.

  Slide bases 174a and 174b are supported by the lower guide rails 158a and 158b, and both ends of the peel roller 176 are supported by the slide bases 174a and 174b so as to be movable up and down. The slide bases 174a and 174b are configured to be movable back and forth between predetermined positions in the arrow D direction integrally with the movable members 162a and 162b. Note that the peel roller 176 is provided as necessary, and can be omitted.

  As shown in FIG. 6, a nip roller 178 is disposed in the vicinity of the film discard mechanism 152. The nip roller 178 includes a fixed lower roller 178 a and an upper roller 178 b that can be moved up and down via a cylinder 180. The upper roller 178b is preferably made of urethane rubber.

  When the upper roller 178b is lowered, a predetermined clearance (for example, 1 mm to 2 mm) is formed between the upper roller 178b and the lower roller 178a. This clearance varies depending on the rigidity (waist strength) of the base film 26 and the peeling conditions (trajectory pattern such as peeling speed, chuck height, etc.), and the base film 26 is actually peeled and the base film 26 is tested. It is preferable to set an appropriate condition capable of suppressing the 26 flutter.

  As will be described later, when the base film 26 is gripped by the chucks 170a and 170b and peeled from the glass substrate 24 constituting the attachment substrate 24a, a predetermined tension (tension) is applied, while the glass substrate 24 is provided. Immediately after being completely peeled off, the tension is released. For this reason, a rebound or a restoring force acts on the base film 26 depending on the characteristics of the material and the like, and the base film 26 is likely to flutter. Therefore, it is preferable to set the clearance between the upper roller 178b and the lower roller 178a so that this kind of fluttering can be suppressed.

  If the base film 26 is not detached from the chucks 170a and 170b and the dropping behavior of the base film 26 does not become unstable, the nip roller 178 adopts a configuration with a low inertia roller and no clearance. You can also.

  As shown in FIG. 10, the substrate holding mechanism 132 includes a first imaging mechanism 182 a that images both corners in the transport direction between the base film 26 and the glass substrate 24 in order to measure the position where the base film 26 is gripped. 182b and second imaging mechanisms 184a and 184b for measuring the attaching position of the attaching substrate 24a on the leading end side in the transport direction are arranged.

  As shown in FIG. 11, the first imaging mechanisms 182a and 182b include CCD cameras 186a and 186b, and illumination units 188a and 188b for irradiating the attachment substrate 24a with illumination light L from the glass substrate 24 side. The illumination units 188a and 188b are red light, and the wavelength is set near 660 nm, for example, where film covering does not occur.

  Note that the second imaging mechanisms 184a and 184b are configured in the same manner as the first imaging mechanisms 182a and 182b, and a detailed description thereof will be omitted.

  As shown in FIG. 10, in the vicinity of the first imaging mechanism 182a, a deceleration sensor, for example, a reflection type photoelectric sensor 190a, 190b, for detecting the front end of the glass substrate 24 in the conveyance direction and performing a deceleration process is arranged. The An overrun detection sensor that detects an overrun of the glass substrate 24, for example, a reflective photoelectric sensor 192, is disposed at a predetermined position downstream of the reflective photoelectric sensor 190b. The reflective photoelectric sensors 190 a, 190 b and 192 are arranged to be spaced downward from the lower surface of the glass substrate 24. A plurality of sets of reflective photoelectric sensors 190a, 190b, and 192 may be provided corresponding to the glass substrates 24 having different shapes.

  As shown in FIGS. 12 and 13, the film discarding mechanism 152 is detachably provided with a film stacking carriage 200. The film stacking cart 200 is movable by four wheels 202 and has a box-shaped stacking portion 204. A plurality of rollers 206 are rotatably disposed in the stacking unit 204, and a film stacking surface on which the base film 26 is stacked is configured by the outer periphery of the rollers 206.

  The frame plate 208 constituting the stacking unit 204 has an open / close door 210 that can be opened and closed by a hinge or the like on one end side, and a handle 212 is provided on the other end side. Two support portions 214 are formed on each of the left and right sides of the frame plate 208, while one support portion 214 is provided with positioning holes 214a. The wheel 202 is provided with a stopper (not shown), and a simple elevator (not shown) is provided on the handle 212 side to incline the stacking unit 204 so that the opening / closing door 210 faces downward. It is also possible.

  A pair of left and right guide members 218 are provided at the carriage set portion of the film disposal mechanism 152 to guide the film accumulation carriage 200 to the set position, and a pair of lifters 220a corresponding to the left and right of the film accumulation carriage 200, 220b is disposed.

  The lifter 220a supports a pair of support portions 214 on the right side (in the direction of arrow C) of the film stacking carriage 200 and a pair of lifting brackets 222a that holds the film stacking carriage 200 so as to be movable up and down, and lifts and lowers the lifting bracket 222a. And a motor 224a. As shown in FIG. 14, one lifting bracket 222a is provided with a positioning hole 226, and a fixing pin 228 is integrally inserted into the positioning hole 226 and the positioning hole 214a, so that the film integrated carriage 200 positioning is performed. One lifting bracket 222a is provided with a pin holder 229 for disposing a fixing pin 228.

  The lifter 220b includes a pair of elevating brackets 222b that support the pair of support portions 214 on the left side of the film stacking carriage 200 and hold the film stacking carriage 200 so as to be movable up and down, and a motor 224b that moves the lifting bracket 222b up and down. .

  As shown in FIG. 4, an inspection conveyor 230 for inspecting whether or not the base film 26 has been peeled downstream of the support peeling device 130, and a laminated substrate from which the base film 26 has been peeled are provided in the next stage. And a discharge conveyor 232 for discharging to each other.

  As shown in FIG. 1, in the manufacturing apparatus 20, the web feed mechanism 32, the half cut mechanism 36, the label adhesion mechanism 40, the reservoir mechanism 42, the protective film peeling mechanism 44, the tension control mechanism 76, and the detection mechanism 47 are combined with a pasting mechanism. The detection mechanism 47 is disposed below the attaching mechanism 46 from the web delivery mechanism 32, and the photosensitive web 22 is inverted upside down. The functional resin layer 29 may be affixed to the lower side of the glass substrate 24, and the whole manufacturing apparatus 20 may be configured on a straight line.

  The inside of the manufacturing apparatus 20 is partitioned into a first clean room 242a and a second clean room 242b through a partition wall 240. The first clean room 242a accommodates the web feed mechanism 32 to the tension control mechanism 76, and the second clean room 242b accommodates the detection mechanism 47 and the subsequent elements. The first clean room 242a and the second clean room 242b communicate with each other through the penetrating portion 244.

  The operation of the manufacturing apparatus 20 configured as described above will be described below in relation to the film peeling method according to the present embodiment.

  First, as shown in FIG. 1, the photosensitive web 22 is fed out from a photosensitive web roll 22 a attached to the web feed mechanism 32, and the photosensitive web 22 is sent to a half-cut mechanism 36.

  In the half-cut mechanism 36, the slide base 52 moves in the width direction of the photosensitive web 22 (direction orthogonal to the transport direction). For this reason, the rotating round blade 54 rotates while moving in a state where it is cut into the half cut portion 34 of the photosensitive web 22 to a desired depth. As a result, a half-cut portion 34 cut from the protective film 30 to a desired depth is formed in the photosensitive web 22 (see FIG. 2).

  As shown in FIG. 1, the half-cut photosensitive web 22 is conveyed in the direction of arrow A corresponding to the dimension of the remaining portion 30 b of the protective film 30, and then temporarily stopped to run the rotating round blade 54. The next half-cut portion 34 is formed under the action. For this reason, the photosensitive web 22 is provided with a front peeling portion 30aa and a rear peeling portion 30ab across the remaining portion 30b (see FIG. 2).

  Further, the photosensitive web 22 is conveyed to the label adhering mechanism 40, and a predetermined application portion of the protective film 30 is disposed on the receiving table 59. In the label adhering mechanism 40, a predetermined number of adhesive labels 38 are adsorbed and held by the adsorbing pads 58a to 58g, and each adhering label 38 straddles the remaining portion 30b of the protective film 30, and the front peeling portion 30aa and the rear peeling portion 30ab. Are integrally bonded to each other (see FIG. 3).

  For example, as shown in FIG. 1, the photosensitive web 22 to which the seven adhesive labels 38 are bonded prevents the fluctuation on the feeding side via the reservoir mechanism 42, and then continues to the protective film peeling mechanism 44. Be transported.

  In the protective film peeling mechanism 44, the photosensitive web 22 is sandwiched between the suction drum 62 and the peeling roller 64, and the base film 26 of the photosensitive web 22 is adsorbed and held on the suction drum 62. In this state, the suction drum 62 is rotated, and a predetermined torque is applied to the protective film 30 via the torque motor 68.

  Therefore, the protective film 30 is peeled off from the photosensitive web 22 leaving the remaining portion 30 b, and taken up on the protective film take-up shaft 66 via the peeling roller 64. In addition, it is preferable to spray static elimination air on a peeling site | part.

  Under the action of the protective film peeling mechanism 44, after the protective film 30 is peeled off from the base film 26 leaving the remaining portion 30b, the tension of the photosensitive web 22 is adjusted by the tension control mechanism 76, and the detection mechanism 47 is further detected. Thus, the half-cut portion 34 is detected by the photoelectric sensor 82.

  Based on the detection information of the half-cut portion 34, the photosensitive web 22 is affixed under the rotating action of the film conveying roller 118a at the start of operation, and thereafter under the rotating action of the substrate conveying roller 118b that sandwiches the bonding substrate 24a. A fixed amount is conveyed to the attaching mechanism 46. At that time, the contact prevention roller 116 waits upward, and the rubber roller 110b is disposed below.

  On the other hand, in the heating mechanism 45, the heating temperature in each heating furnace 86 is set corresponding to the lamination temperature in the attaching mechanism 46. The glass substrate 24 is tact-conveyed sequentially to each heating furnace 86 under the rotating action of the conveyance roller 88 constituting the conveyance mechanism 84. The glass substrate 24 is temporarily disposed between the rubber rollers 110a and 110b corresponding to the portion where the photosensitive resin layer 29 of the photosensitive web 22 is attached.

  In this state, by raising the backup roller 112b and the rubber roller 110b via the roller clamp portion 114, the glass substrate 24 is sandwiched between the rubber rollers 110a and 110b with a predetermined pressing pressure. Further, the photosensitive resin layer 29 is transferred (laminated) to the glass substrate 24 by heating and melting under the rotating action of the rubber roller 110a.

  Here, as lamination conditions, the speed is 1.0 m / min to 10.0 m / min, the temperature of the rubber rollers 110a and 110b is 80 ° C. to 150 ° C., the rubber hardness of the rubber rollers 110a and 110b is 40 ° to 90 °, The pressing pressure (linear pressure) of the rubber rollers 110a and 110b is 50 N / cm to 400 N / cm.

  When the lamination of one photosensitive web 22 on the glass substrate 24 is completed via the rubber rollers 110a and 110b, the rotation of the rubber roller 110a is stopped. On the other hand, the bonded substrate 24a in which the photosensitive web 22 is laminated on the glass substrate 24 is clamped by the substrate transport roller 118b. Then, the rubber roller 110b is retracted in a direction away from the rubber roller 110a, and the clamp is released.

  Thereby, the glass substrate 24 heated to a predetermined temperature via the heating mechanism 45 in the time from the end of the laminating process for one sheet to the start of the next laminating process, the rubber rollers 110a and 110b. The photosensitive web 22 that is conveyed and disposed between the rubber rollers 110a and that is in sliding contact with the rubber roller 110a is finely fed.

  Affixed substrate 24a having photosensitive web 22 affixed to glass substrate 24 is quantitatively conveyed in the direction of arrow C. Then, the attached substrate 24 a obtained by cutting the photosensitive web 22 between the glass substrates 24 via the inter-substrate web cutting mechanism 48 is conveyed to the direction changing conveyor 122 via the conveyance system 120.

  As shown in FIG. 4, the affixing substrate 24 a on the direction changing conveyor 122 is moved by changing the transport direction to the arrow B direction, and then is held by the transfer robot 124 and carried into the cooling mechanism 128. The affixed substrate 24a cooled by the cooling mechanism 128 is transported in the direction of arrow C through a transport system 126 having a roller 126a, and transferred to the support peeling device 130.

  As shown in FIG. 10, in the substrate holding mechanism 132 that is the film peeling station PS, the reflective photoelectric sensors 190a and 190b are arranged along the transport direction. For this reason, when the reflection photoelectric sensor 190a first detects the leading end of the glass substrate 24 in the conveyance direction of the adhesion substrate 24a conveyed in the direction of arrow C (see deceleration detection ON in FIG. 15), the adhesion substrate 24a is detected. The first deceleration process is performed at 24a. Next, when the reflective photoelectric sensor 190b detects the front end of the glass substrate 24 in the transport direction (see stop detection ON in FIG. 15), the attached substrate 24a is further decelerated. Since the size of the glass substrate 24 is large and the glass substrate 24 is conveyed at a high speed, the inertial force is relatively large. By performing the above-described two-stage deceleration process, the bonded substrate 24a is accurately positioned at a predetermined position. Can be stopped.

  Then, the attached substrate 24a is stopped at a predetermined stop position while monitoring the position of the attached substrate 24a via the first imaging mechanisms 182a and 182b. In addition, when the pasting board 24a overruns in the direction of arrow C from a predetermined stop position, it is detected by the reflective photoelectric sensor 192.

  When the bonded substrate 24a is stopped at a predetermined stop position (step S1 in FIG. 16), the bonded substrate 24a is positioned (step S2). Specifically, when the substrate receiving roller 147a constituting the substrate lifting mechanism 147 is raised, the substrate receiving roller 147a lifts up the attached substrate 24a. In this state, the four positioning rollers 149a constituting the substrate positioning mechanism 149 move to the glass substrate 24 side constituting the attached substrate 24a. Accordingly, the glass substrate 24 is sandwiched and held by the four positioning rollers 149a.

  Next, the substrate holding mechanism 132 is driven. In the substrate holding mechanism 132, first, each cylinder 146 constituting the first suction unit 138 is driven, and the suction pad 144a is raised (see FIG. 17).

  Each suction pad 134a is disposed at the four corners of the glass substrate 24 so as to correspond to the outside of the base film 26 attachment region, and contacts the surface of the glass substrate 24 opposite to the base film attachment surface. At that time, each suction pad 144a sucks the four corners of the glass substrate 24 because it is sucked through the suction hole 148 under the action of a vacuum suction system (not shown).

  The suction pad 144a may be configured to be tiltable according to the curved shape of the glass substrate 24, and may be provided with a spring.

  Next, after the positioning roller 149a moves away from the glass substrate 24 and the nipping of the glass substrate 24 is released, the suction pads 144a move the four corners of the glass substrate 24 under the driving action of each cylinder 146. It descends while adsorbed. Therefore, the glass substrate 24 is forcibly held flat by the four corners being sucked and held by the suction pads 144a. Here, the second suction unit 140 and the third suction unit 142 are integrally raised under the action of the single cylinder 151.

  In this state, both end portions of the glass substrate 24 in the base film peeling direction are sucked by the second suction portion 140. When a predetermined time has elapsed after the adsorption by the second adsorption unit 140 is started, the third adsorption unit 142 performs adsorption on the central portion side of the glass substrate 24. For this reason, the glass substrate 24 is flatly and reliably held by the first suction unit 138, the second suction unit 140, and the third suction unit 142 (step S3).

  Next, in the state where the bonded substrate 24a is forcibly positioned and held by the substrate holding mechanism 132, the vicinity of the base film gripping position is imaged by the first imaging mechanisms 182a and 182b.

  As shown in FIG. 11, in the first imaging mechanisms 182a and 182b, the illumination light L is irradiated from the glass substrate 24 side of the pasting substrate 24a via the illumination units 188a and 188b, and is arranged on the base film 26 side. The CCD cameras 186a and 186b image the vicinity of the chuck position by the chucks 170a and 170b. Accordingly, the position of the pasting substrate 24a is detected based on the image information captured by the CCD cameras 186a and 186b.

  Then, when it is confirmed that the pasting substrate 24a is disposed within the predetermined stop position range, the positions of the chucks 170a and 170b constituting the film gripping mechanism 134 are adjusted. Further, as shown at position P1 in FIG. 18, the chucks 170a and 170b grip the end portions of the base film 26 that protrude outward from both ends of the glass substrate 24 in the transport direction (step S4).

  Therefore, as shown in FIG. 5, the movable members 162a and 162b and the lifting platforms 166a and 166b are driven and controlled in a predetermined direction under the action of the motors 160a, 160b and 168a and 168b. As a result, the chucks 170a and 170b move along the peeling locus shown at positions P1 to P6 in FIG. 18, and the base film 26 held by the chucks 170a and 170b is separated from the cushion layer 27 and pasted. It peels from the board | substrate 24a (step S5).

  Specifically, the chucks 170a and 170b are controlled to move along the speed pattern shown in FIG. 19 and the chuck height position pattern shown in FIG. At that time, it is desirable to perform cushion start and cushion stop of the chucks 170a and 170b by setting to an S-curve pattern.

  When the base film 26 is peeled off, the peel roller 176 moves integrally with the movable members 162a and 162b to a predetermined position in the direction of arrow D, and the base film 26 is peeled off smoothly and satisfactorily. Here, the peel roller 176 performs the peeling process of the base film 26 in a state in which the peel film 176 is loosened to the extent that the base film 26 that is gripped by the chucks 170a and 170b and peeled from the glass substrate 24 is not pulled.

  When the chucks 170a and 170b move from the position P3 to the position P4, the upper roller 178b of the nip roller 178 is raised in advance. When the chucks 170a and 170b pass between the upper roller 178b and the lower roller 178a (YES in step S6), the process proceeds to step S7, the cylinder 180 is driven, and the upper roller 178b is lowered. Therefore, a predetermined clearance (for example, 1 mm to 2 mm) is held between the lower roller 178a and the upper roller 178b, and the base film 26 passes through this clearance. As a result, the base film 26 immediately after being peeled from the glass substrate 24 and released from the tension can satisfactorily prevent the occurrence of flutter due to the clearance between the lower roller 178a and the upper roller 178b.

  After passing through the position P4 (YES in step S8), the chucks 170a and 170b move to the stacking unit 204 of the film stacking carriage 200 and descend from the film stacking surface of the stacking unit 204 to a predetermined height H. (Step S9), the position P5 is moved to the position P6.

  When it is detected that the chucks 170a and 170b have moved to the position P6 (YES in step S10), the gripping action of the base film 26 is released (step S11). As a result, the base film 26 is transferred onto a roller 206 that is a free roller provided in the stacking unit 204 of the film stacking carriage 200.

  In this case, in this embodiment, the chucks 170a and 170b are moved from the film peeling station PS to the film disposal station DS in a state in which the end portions of the base film 26 are gripped by the chucks 170a and 170b constituting the film gripping mechanism 134. As a result, the base film 26 is peeled off from the glass substrate 24.

  At that time, since the chucks 170a and 170b are moved downward while the base film 26 is transferred to the film disposal station DS, the base film 26 held by the chucks 170a and 170b has a low transfer height. (See height H). Accordingly, the base film 26 held by the chucks 170a and 170b is moved along the film stacking surface in the vicinity of the film stacking surface of the film stacking carriage 200 disposed in the film disposal station DS.

  Accordingly, when the gripping action of the base film 26 by the chucks 170a and 170b is released, the base film 26 is well and orderly accumulated on the film accumulation surface of the film disposal station DS, and the base film peeling process is efficiently performed. The effect that it becomes possible is acquired.

  On the other hand, in the film stacking cart 200, the base film 26 is stacked on the stacking unit 204, so that the film stacking surface is gradually increased. Therefore, the film stacking cart 200 is lowered under the driving action of the pair of lifters 220a and 220b so that the chucks 170a and 170b always maintain a predetermined height H from the film stacking surface of the stacking unit 204.

  Accordingly, the chucks 170a and 170b can maintain a predetermined height H from the uppermost base film 26 on the film stacking surface of the stacking unit 204, and the base film 26 is sequentially improved on the film stacking surface. Moreover, there is an advantage that it is possible to integrate in an orderly manner.

  The height adjustment of the film stacking cart 200 may be performed according to the number of times the base film 26 is discarded, and the height and amount of the base film 26 are detected by an ultrasonic sensor, a reflective photoelectric sensor, or the like. This can be done.

  Further, when a predetermined number of base films 26 are stacked on the film stacking cart 200, the film stacking cart 200 descends under the driving action of the pair of lifters 220a and 220b, and the positioning hole 226 and the positioning hole The fixing pin 228 is removed from 214a. Then, the film stacking cart 200 is pulled out from the cart set portion of the film discarding mechanism 152, and an empty film stacking cart 200 for replacement is attached to the cart set portion.

  After the film stacking carriage 200 on which a predetermined number of base films 26 are stacked is transferred to a disposal place, the opening / closing door 210 constituting the stacking unit 204 is opened. For this reason, the base film 26 in the stacking unit 204 is easily discarded from the stacking unit 204 to a disposal site under the guiding action of the plurality of rollers 206.

  On the other hand, the sticking substrate 24a from which the base film 26 has been peeled is released from the suction by the first to third suction portions 138, 140 and 142, and then transferred to the inspection conveyor 230 as a laminate substrate (see FIG. 4). ). The laminated substrate is discharged from the discharge conveyor 232 to the next step after the peeled state is inspected.

It is a schematic block diagram of the manufacturing apparatus with which the film peeling apparatus which concerns on embodiment of this invention is integrated. It is sectional drawing of the elongate photosensitive web used for the said manufacturing apparatus. It is explanatory drawing of the state by which the adhesive label was adhere | attached on the said elongate photosensitive web. It is a schematic plan view of the manufacturing apparatus. It is a schematic perspective explanatory drawing of the said support body peeling apparatus. It is principal part side surface explanatory drawing of the said support body peeling apparatus. It is a perspective explanatory view of a substrate holding mechanism which constitutes the support peeling device. It is a plane explanatory view of the substrate holding mechanism. It is a schematic perspective view of the substrate holding mechanism. It is explanatory drawing of the arrangement | positioning state of an imaging mechanism. FIG. 2 is a configuration explanatory diagram of the imaging mechanism. It is a perspective explanatory view of a film discard mechanism constituting the support peeling device. It is a plane explanatory view of the film discard mechanism. It is a partial perspective explanatory view of the film discard mechanism. It is explanatory drawing of the conveyance speed control of a sticking board | substrate. It is a flowchart explaining the film peeling method which concerns on this invention. It is operation | movement explanatory drawing of the said board | substrate holding mechanism. It is operation | movement explanatory drawing of the film holding | grip mechanism which comprises the said support body peeling apparatus. It is an explanatory view of the relationship between the chuck position and the moving speed. It is a relation explanatory view of the above-mentioned chuck position and height. It is explanatory drawing of the peeling method and peeling apparatus of the film currently disclosed by patent document 1. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 20 ... Manufacturing apparatus 22 ... Photosensitive web 22a ... Photosensitive web roll 24 ... Glass substrate 24a ... Pasting substrate 26 ... Base film 29 ... Photosensitive resin layer 30 ... Protective film 32 ... Web delivery mechanism 34 ... Half cut part 36 ... Half-cut mechanism 40 ... Label adhesion mechanism 45 ... Heating mechanism 46 ... Pasting mechanism 122 ... Direction changing conveyor 126 ... Conveying system 128 ... Cooling mechanism 130 ... Support body peeling device 132 ... Substrate holding mechanism 134 ... Film gripping mechanism 136 ... Moving mechanism 137: Controllers 138, 138a, 140, 140a, 142 ... Adsorption parts 144a to 144c ... Adsorption pads 146, 151 ... Cylinder 147 ... Substrate lift mechanism 147a ... Substrate receiving roller 149 ... Substrate positioning mechanism 149a ... Positioning roller 152 ... Film discard mechanism 170a, 170b Chuck 178 ... nip rollers 182a, 182b, 184a, 184b ... imaging mechanism 190a, 190b, 192 ... reflective photoelectric sensor 200 ... film integrated carriage 204 ... integrated unit 214 ... supporting portion 220a, 220b ... lifter 222a, 222b ... lift bracket

Claims (9)

A film peeling apparatus for peeling the film from an attached substrate in which the film is attached to the substrate,
A substrate holding mechanism for positioning and holding the bonded substrate disposed at the film peeling station;
A film gripping mechanism for gripping an end of the film;
Moving the film gripping mechanism from the film peeling station to the film disposal station, thereby peeling the film from the attached substrate held by the substrate holding mechanism and discarding the film to the film disposal station;
A drive mechanism for controlling the moving mechanism, and a control mechanism for lowering the film gripping mechanism while the film is being transferred to the film disposal station;
A film peeling apparatus comprising:   2. The film peeling apparatus according to claim 1, further comprising a nip roller that is disposed in the course of transferring the film from the film peeling station to the film disposal station and guides the film peeled off from the attached substrate. Peeling device. The film peeling apparatus according to claim 1 or 2, wherein the film disposal station includes a film stacking carriage for stacking the film,
An elevating mechanism for detachably holding the film accumulation carriage and raising and lowering the film accumulation carriage;
A film peeling apparatus characterized in that is provided. The film peeling apparatus according to claim 3, wherein the film stacking carriage is provided with a plurality of rotatable rollers on a film stacking surface on which the film is stacked,
At least a part of the frame plate that circulates on the film stacking surface is configured to be openable and closable.   5. The film peeling apparatus according to claim 1, wherein the substrate holding mechanism flattens the bonded substrate by adsorbing a surface opposite to a film bonding surface of the substrate. A film peeling apparatus comprising an adsorbing part for adsorbing and holding. A film peeling method for peeling the film from an attached substrate in which a film is attached to a substrate,
A step of positioning and holding the attachment substrate disposed in the film peeling station;
Gripping an end of the film with a film gripping mechanism;
Moving the film gripping mechanism from the film peeling station to the film disposal station, thereby peeling the film from the attached substrate and discarding the film in the film disposal station;
Have
A film peeling method, wherein the film gripping mechanism is lowered while the film is transferred to the film disposal station.   7. The film peeling method according to claim 6, wherein the film peeled from the attached substrate is guided by a nip roller disposed in the course of transferring the film from the film peeling station to the film disposal station. Peeling method. The film peeling method according to claim 6 or 7, wherein the film is stacked on a film stacking carriage that is detachably held at the film disposal station.
A film peeling method comprising the step of lowering the film stacking cart in accordance with the stacking height of the film.   9. The film peeling method according to claim 6, wherein, in the film peeling station, the surface of the substrate to be bonded is flattened by adsorbing a surface opposite to the film bonding surface of the substrate. A film peeling method characterized by holding by adsorption.

Images