JP2950636B2 - Lead bending machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead bending apparatus.

[0002]

2. Description of the Related Art In some surface mount type lead frame products, outer leads are plated with solder for mounting at the stage of the lead frame or at the stage after resin sealing. When these products are formed by bending, they are formed in a state where solder plating is applied. in this way,
When bending a product that has been subjected to solder plating in advance, a problem arises in that the solder plating peels off from the surface of the lead and adheres to a punch or a die of the forming apparatus during bending. The lead bending machine repeats punching to process a large number of products, so even if the solder plating is peeled off little by little, after many times processing, the solder is burned and welded to the punched or die processed surface State. In this way, if solder plating adheres to the punch or die, lead bending will not be performed with regular dimensional accuracy, adversely affecting bending accuracy, or solder plating attached to the punch or die will adhere to the lead frame on the contrary. A problem such as a short between leads occurs.

Therefore, in the conventional lead bending apparatus, after performing punching a predetermined number of times, the mold is removed from the molding apparatus, the solder plating adhered to the mold is removed by a scraper or the like, and the apparatus is set again in the molding apparatus. Have done that. As described above, in the conventional molding apparatus, the mold must be cleaned each time the solder plating adheres, and these operations are very complicated.

Accordingly, the present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a method of forming a metal mold by bending a product in which an outer lead has been subjected to solder plating in advance. An object of the present invention is to provide a lead bending apparatus capable of performing processing without attaching solder plating to a surface and capable of efficiently performing lead bending.

[0005]

The present invention has the following arrangement to achieve the above object. That is, in a lead bending apparatus for bending and forming a lead frame in which an outer lead has been subjected to solder plating in advance, a cleaning mechanism that removes solder plating that peels off from the surface of the lead frame and adheres to a mold during bending of the outer lead. Are provided in conjunction with a product transfer mechanism. Further, a lead bending apparatus for separating a product into individual pieces from a lead frame after resin sealing, sequentially transferring each product to a processing stage, and bending and forming an outer lead, wherein the product is gripped and processed. A cleaning mechanism is provided on an arm transferred to the stage. In addition,
As the cleaning mechanism, a mechanism in which a brush for brushing the processing surface of the bending mold is attached to the end of the arm, or a mechanism in which an air blow for blowing an air flow toward the processing surface of the bending mold is attached is effective.

[0006]

When a lead is formed by bending, a transfer mechanism for transferring a product to a processing stage is provided with a cleaning mechanism for cleaning a processing surface of a bending die. The surface is cleaned and the solder plating that peels off from the lead frame when the lead is bent is removed so that the solder plating does not adhere to the bending mold. As a result, lead bending with high precision can be performed, and the operation of removing the bending die from the processing machine and removing the solder plating can be eliminated. The solder plating adhered to the bending mold is removed by a brush provided at the tip of the arm or an air blow provided at the arm, and the cleaning is performed.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is an explanatory view showing one configuration example of a lead bending apparatus according to the present invention. In the lead bending apparatus of this embodiment, brushes 14 are set on the upper and lower surfaces of an end of an arm 12 for transferring a product onto a bending die 10, and a bending is performed when the arm 12 moves back and forth to transfer the product. By brushing the processing surface of the die 10 and the punch 16 with the brush 14, the solder plating adhered to the bending die 10 and the punch 16 is removed. The lead bending apparatus of this embodiment is of a type in which a lead is bent and formed after separating a product from a lead frame into individual pieces, and the arm 12 sucks the product at its tip and transfers it to the bending die 10. After the mounting, it is retracted to a position where the processing by the punch 16 and the bending die 10 is not hindered, and after the processing is completed, it advances again onto the bending die 10 to adsorb the product and transfer it to the next processing stage. Works as follows. Therefore, when the arm 12 is moved, the processing surfaces of the bending die 10 and the punch 16 can be brushed and cleaned by the brush 14. Reference numeral 18 denotes an air blow, and reference numeral 20 denotes a dust suction unit. The air blow 18 has a function of cleaning the processed surface by blowing the solder plating residue. It should be noted that an air flow path 22 for dust absorption is provided on the bending die 10 side.
May be provided to discharge solder plating residue.

FIGS. 2 to 5 show a specific example of a lead bending apparatus provided with a solder plating cleaning mechanism.
FIG. 2 is a plan view of the apparatus, and FIG. 3 is a side view. First, FIG.
The overall configuration of the apparatus will be described with reference to FIG. In FIG. 2, reference numeral 30 denotes a lead frame supply unit after resin sealing, and 32 denotes a lead frame extracting stage.
This is a feed mechanism for feeding a fixed size to the feeding unit 4. The lead frame is transferred from the supply section 30 to the feed mechanism section 32 and separated into individual pieces by the punching stage 34. Reference numerals 40 and 42 denote a first bending stage and a second bending stage arranged on the side of the punching stage 34. The punching stage 34, the first bending stage 40, and the second bending stage 42 are arranged in series so that the pick-up positions of the products are arranged in a straight line. The first bending stage 40 is a stage for performing a first bending process on a product separated into individual pieces, and the second bending stage 42 is a stage for performing a second bending process on a product subjected to the first bending.

Products are transferred from the punching stage 34 to the first bending stage 40 by the arms 50a and 50b. This embodiment is an example of processing a matrix frame, and handles two products at a time. Therefore, transfer is performed using two arms 50a and 50b. 52a, 52b are arms for transferring the product from the first bending stage 40 to the second bending stage 42, and 54a, 54b are arms for transferring the product from the second bending stage 42 to the discharge stage. .
Arms 50a, 50b, 52a, 52b, 54a, 54
b is supported to be able to move left and right, back and forth, and up and down in order to pick up a product at each stage and transfer it to the next stage. An operation unit 56 supports these arms and performs a pickup operation and the like. The operating section 56 is supported by a slide section 60, and the slide section 60 is slidably guided by the LM guide 62 and connected to a support section 66. A ball screw 64 is screwed into the support portion 66, and the ball screw 64 is connected to a servomotor 67 shown in FIG. The LM guide 62 and the ball screw 64 are connected to the first bending stage 40 and the second bending stage 4.
Install it in parallel with the position of 2. By operating the servo motor 67, the ball screw 64 rotates, and the support portion 66
The slide unit 60 moves left and right via the. Thus, the movement of the arm in the left-right direction can be controlled.

The forward and backward movement of the arm is performed by the following mechanism. That is, the slide portion 60, the LM guide 62,
The entire left-right movement mechanism such as the ball screw 64 and the servomotor 67 is supported by a support plate 70.
LM guide 7 installed in a direction orthogonal to M guide 62
It is guided and supported by 2, 74. Reference numeral 74 denotes a forward / backward moving cylinder that moves the support plate 70 in the guide direction of the LM guides 72 and 74. Thus, the support plate 70 can be moved back and forth by operating the back and forth movement cylinder 74. The forward and backward movement means that the operation unit 56 supporting the arm is moved to the first position.
The arm is moved in a direction in which the arm moves toward and away from the bending stage 40 and the second bending stage 42. As a result, the arm moves back and forth.

The vertical movement of the arm is performed by the following mechanism. That is, the LM guides 72 and 74 are
0, and the whole of the front-back movement mechanism and the left-right movement mechanism is supported by the substrate 80. As shown in FIG. 2, the substrate 80 is supported by a vertically movable cylinder 84 fixed to a machine frame 82, and the substrate 80 is vertically guided by guide rods 86 and 87. By driving the vertical movement cylinder 84, the substrate 80 is guided up and down by the guide rods 86 and 87, whereby the arm is moved up and down. The arms 50a, 50b, 52a, 5a
2b, 54a, 54b can be moved left and right, back and forth, and up and down. The operation of these arms is performed by the punching stage 34,
The control is performed in accordance with the processing operation and timing of the first bending stage 40 and the second bending stage 42, and the lead can be bent while sequentially transferring the product from the preceding process to the subsequent process.

Next, the arms 50a, 50b, 52
A description will be given of a cleaning mechanism attached to each of a, 52b, 54a, and 54b. FIG. 4 is an enlarged plan view showing the arm portion, and FIG. 5 is a side view of the arm. Each arm 50a, 50b, 52a, 52b, 54a, 54
A brush 90 is attached to the upper and lower surfaces of the tip of b. FIG.
As shown in (1), a suction portion 92 for sucking the product is provided on the lower surface of the tip portion of the arm. The suction section 92 communicates with an air flow path 94 provided inside the arm, and the air flow path 94 communicates with an air suction mechanism. Also, as shown in FIG. 4, air blows 96 are provided on the upper and lower surfaces of each arm.

In the processing of the embodiment of the lead bending apparatus shown in FIGS. 2 to 5, the arms 50a, 50b, 52a,
2b, 54a, and 54b perform the processing while transferring the product to each processing stage. The operation of the arm is as follows. , Move down, set the product on the processing stage, move up, retreat from the processing stage, and move back and forth to return to the original position. The arm is at the retracted position during bending so as not to hinder the processing. As described above, the arm moves forward and backward with respect to the processing stage when transferring the product. Therefore, at the time of the forward and backward movement, the working surface of the bending die and the punch is brushed with the brush 90, and By blowing air flow on the processing surface,
Clean the solder plating that peels off from the lead frame during lead bending.

In the lead bending apparatus according to this embodiment, the brush 90 and the air blow 96 clean the processing surface of the bending die every time the arm moves in and out of the processing stage when the product is transferred to the processing stage. Since it is possible to hold the mold surface so that solder plating or the like does not adhere, it is possible to always maintain the dimensional accuracy of the bending process with high accuracy. Further, it is possible to prevent the occurrence of defective products due to, for example, the occurrence of short-circuiting between the leads due to the solder plating adhered to the mold surface adhering to the lead frame during bending. Furthermore, since the bending mold surface is always cleaned, when solder plating adheres, it is not necessary to remove the bending mold from the processing machine and remove the solder plating each time, thereby greatly improving workability. There is an advantage. Although the above embodiment has been described with respect to an apparatus for processing two products at a time, the same applies to an apparatus for processing one product at a time or an apparatus for processing three or more products at the same time.

In the above-described embodiment, the example in which the lead is bent and formed after separating the product from the lead frame into individual pieces has been described. However, as shown in these embodiments, a processing machine for bending and forming the individualized product uses an arm. Since the product is configured to be gripped and set on the processing stage, it is preferable that a cleaning mechanism can be easily configured by installing a brush or an air blow on these setting arms. However, a mechanism for cleaning the working surface of the bending mold is not intended to be limited to the embodiments described above, but it may also be provided separately from the cleaning mechanism and the transfer mechanism even when conveyed into pieces. For example, identify the product
Brush or separate from the arm for holding and transferring
Provide a cleaning arm with air blow,
Each time a process such as bending molding is performed,
The cleaning can be performed by operating the arm. Ma
And, it is possible to process not to attach the solder plating in a mold by also attaching a cleaning mechanism for the type of machine performing the lead bending not separate into individual pieces, such as removal of the mold without complicated operations can be performed with good lead bending accuracy.

[0016]

According to the lead bending apparatus of the present invention, as described above, the bending can be performed while preventing the solder plating applied to the lead frame from adhering to the bending mold. In addition, it is possible to perform accurate lead bending. In addition, since the solder plating does not adhere to the bending mold, a complicated operation of removing the bending mold from the processing machine and removing the solder plating is not required, and the workability can be improved.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a configuration example of a lead bending apparatus.

FIG. 2 is a plan view of an embodiment of a lead bending apparatus.

FIG. 3 is a side view of an embodiment of the lead bending apparatus.

FIG. 4 is a plan view of an arm portion of the lead bending apparatus.

FIG. 5 is a side view of an arm portion of the lead bending apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Bending die 12 Arm 14 Brush 16 Punch 18 Air blow 20 Dust absorbing part 34 Punching stage 40 First bending stage 42 Second bending stage 50a, 50b Arm 52a, 52b Arm 54a, 54b Arm 56 Working part 60 Slide part 62 LM guide 64 Ball screw 67 Servo motor 70 Support plate 72, 74 LM guide 76 Front / rear moving cylinder 80 Substrate 84 Vertical moving cylinder 86, 87 Guide rod 90 Brush 92 Suction unit 94 Air flow path 96 Air blow 97, 98 LM guide

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-62-97734 (JP, A) JP-A-62-154767 (JP, A) JP-A-1-16645 (JP, A) JP-A-3-3 212964 (JP, A) JP-A-3-62596 (JP, A) JP-A-3-296251 (JP, A) JP-A-61-53946 (JP, U) JP-A-1-146915 (JP, U) (58) Field surveyed (Int. Cl. ⁶ , DB name) H05K 13/04

Claims (4)

(57) [Claims] 1. A lead bending apparatus for bending and forming a lead frame in which outer leads are pre-soldered with solder is removed from the surface of the lead frame during the bending of the outer leads to remove the solder plating adhered to a mold. A lead cleaning device in which a cleaning mechanism is provided in conjunction with a product transfer mechanism. 2. A lead bending apparatus for separating a product from a lead frame after resin sealing into individual pieces, sequentially transferring each product to a processing stage, and bending and forming an outer lead. 2. A cleaning mechanism is provided on an arm to be transferred to a processing stage.
The lead bending apparatus according to the above. 3. The lead bending apparatus according to claim 2, wherein a brush for brushing a processing surface of the bending die is attached to a tip of the arm as a cleaning mechanism. 4. The lead bending apparatus according to claim 2, wherein an air blow for blowing an air flow toward a processing surface of the bending die is attached as a cleaning mechanism.