JP6661231B2 - Work head unit, mounting apparatus, and control method of work head unit - Google Patents

Description

  The present invention relates to a work head unit, a mounting device, and a method for controlling a work head unit.

  Conventionally, as a mounting head that mounts components on a board, a plurality of slits are formed on a rotating plate by changing the slit angle θ of each other, and each nozzle of the mounting head is made to correspond to the position of these slits. There has been proposed an arrangement provided with a control unit which is disposed and in which the angle θ between the slits is registered in advance (for example, see Patent Document 1). In this mounting head, the original position in the rotation direction of the mounting head can be detected at a high speed. Further, as the mounting head, the rotating member is at the reaction position of the sensor at the zero count position of the encoder of the motor that rotationally drives the rotary head, the reference spindle is directly below the pressing member, and the motor that rotates the spindle axially Has been proposed in which the angle of each spindle is at 0 degree at the zero count position of the encoder included in JP-A No. 2000-131 (see, for example, Patent Document 2). According to this mounting head, the origin position can be adjusted without performing data backup.

JP-A-5-206691 JP 2013-143396 A

  However, in the mounting heads described in Patent Literatures 1 and 2, although the rotational position of the mounting head can be detected, information directly connected to the attitude of the held component has not been sufficiently considered. In the mounting process, when the posture of the component held by the mounting head is rotated around the rotation axis of the nozzle, for example, the mounting process may not be performed properly. For this reason, the working head unit has been required to accurately acquire information on the orientation of the held component, such as the rotational position of the component.

  The present invention has been made in view of such a problem, and provides a work head unit, a mounting device, and a control method of a work head unit that can more accurately acquire information on a posture of a held component. The main purpose is.

  The present invention employs the following means in order to achieve the above main object.

  The working head unit of the present invention is provided with a sampling member for sampling a component, a sampling member holding unit capable of mounting and dismounting the sampling member, and a position facing the sampling member, and adjusting a posture of the sampling member. And a detecting unit for detecting.

  In this work head unit, the detection unit detects the attitude of the sampling member holding the component. As described above, since the posture of the part holding the component is detected, information that more reflects the posture of the component is obtained. Here, the “posture of the sampling member” may be a rotational position of the sampling member.

The control method of the working head unit of the present invention includes:
A work head comprising: a component holding unit rotatable about a rotation axis and used for holding a component; and a detection unit disposed at a position facing the component holding unit and configured to detect a posture of the component holding unit. A method for controlling a unit, the method including: (a) correcting a posture of the component holding unit based on information on a posture of the component holding unit detected by the detection unit.

  In this control method, since the attitude of the component holding unit that holds the component is detected, information that reflects the attitude of the component more than, for example, a method of detecting an attitude other than the component holding unit is obtained. Therefore, it is possible to more accurately acquire information on the held posture of the component. Further, since the attitude of the component holding unit is corrected using the result of detecting the attitude of the part holding the component, the attitude of the component can be corrected more correctly. Note that, in this control method, various aspects of the working head unit described above may be employed, or a configuration that realizes each function of the working head unit described above may be added.

FIG. 1 is a schematic explanatory diagram of a mounting system 10. FIG. 3 is an explanatory diagram of an outline of a mounting head unit 17. FIG. 3 is an explanatory diagram of a mounting head unit 17 having a mounting head 50. FIG. 2 is a block diagram illustrating an electrical connection relationship of the mounting apparatus 11. 9 is a flowchart illustrating an example of a component collection and arrangement processing routine.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic explanatory diagram of the mounting system 10. FIG. 2 is an explanatory diagram of an outline of the mounting head unit 17. FIGS. 3A and 3B are explanatory diagrams of the mounting head unit 17 having the mounting head 50. FIG. 3A is a side view of the mounting head 50, and FIG. FIG. 4 is a block diagram illustrating an electrical connection relationship of the mounting apparatus 11. The mounting system 10 according to the present embodiment includes a mounting apparatus 11 that includes a mounting processing unit 12 and that mounts a component P (see FIG. 2) on a substrate S, and a management computer that manages information (for example, production job data) related to the mounting processing. 90. In this embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS. The mounting process includes a process of arranging, mounting, inserting, joining, bonding, and the like the component P on the substrate S.

  The mounting apparatus 11 includes a substrate transport unit 14 that transports the substrate S, a substrate support unit 15 that supports the substrate S from the lower surface side, a mounting head unit 17 that sucks (collects) the component P and arranges the component P on the substrate S. A head moving unit 16 for moving the mounting head unit 17 in the XY directions (see FIG. 1). The mounting apparatus 11 includes a supply unit 18 on which a reel accommodating the component P is mounted, an operation panel 19 including a display unit 24 that displays a display screen, and an operation unit 25 that allows various input operations by a worker. (See FIG. 4) and a control device 80 (see FIG. 4) for executing various controls.

  The substrate transport unit 14 transports the substrate S from left to right by the conveyor belts 22, 22 attached to the pair of front and rear support plates 21, 21, respectively. The substrate support unit 15 includes a plurality of support pins 23 that support the substrate S from below, and supports the substrate S from the back side of the substrate S transported and fixed by the substrate transport unit 14.

  The head moving unit 16 includes an X-axis slider 26, a Y-axis slider 30, and the like. The X-axis slider 26 is mounted on the front surface of a Y-axis slider 30 that is slidable in the front-rear direction so as to be slidable in the left-right direction. The Y-axis slider 30 is slidably attached to a pair of left and right guide rails 32 extending in the front-rear direction. The guide rails 32 are fixed inside the mounting device 11. A pair of upper and lower guide rails 28, 28 extending in the left-right direction are provided on the front surface of the Y-axis slider 30, and the X-axis slider 26 is attached to the guide rails 28, 28 so as to be slidable in the left-right direction. The mounting head unit 17 moves in the left-right direction as the X-axis slider 26 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 30 moves in the front-rear direction. Each of the sliders 26 and 30 is driven by a drive motor (not shown).

  The mounting head unit 17 is mounted on the front surface of the X-axis slider 26. The mounting head unit 17 includes a head holder 40 disposed on the X-axis slider 26 for holding the mounting head 50, a suction nozzle 42 for sucking the component P, and a mounting head 50 on which one or more suction nozzles 42 can be mounted and detached. And As shown in FIG. 3, the head holder 40 includes a holder main body 45 attached to the X-axis slider 26, and an engagement shaft 46 provided below the holder main body 45. The engagement shaft 46 is rotatably disposed on the holder main body 45, and is inserted into a bottomed hole formed at the center of the mounting head 50 (Q-axis gear 53) to engage the mounting head 50. An R-axis motor 60, a Q-axis motor 63, and a Z-axis motor 66 that rotationally drive the mounting head 50 are provided in the holder main body 45. The R-axis motor 60 is provided with an encoder 61 (see FIG. 3), and the encoder 61 controls the basic rotational position. Note that the encoder 61 may be a transmission type optical encoder. The Q-axis motor 63 is similar to the R-axis motor 60 and includes an encoder 64. The Z-axis motor 66 moves the suction nozzle 42 up and down by moving the horizontal portion 68 along a Z-axis guide 67 extending vertically downward. The rotation axis of the mounting head 50 (the rotary unit 51) is referred to as an R axis, and the rotation axis of the suction nozzle 42 (the component holding unit 55) is referred to as a Q axis.

  The head holder 40 holds the mounting head 50. The mounting head 50 includes, for example, 16 component holding sections 55, and can mount 16 suction nozzles 42 (see FIGS. 2 and 3). The mounting head 50 is configured as a rotary work head that is rotatably held on the head holder 40. The mounting head 50 includes a rotary portion 51 which is a columnar member, an R-axis gear 52 disposed below the rotary portion 51, a Q-axis gear 53 disposed above the rotary portion 51, and a lower end. A plurality of long cylindrical syringe members 56 to which the suction nozzles 42 are attached are provided. The mounting head 50 has a component holding portion 55 having a suction nozzle 42 for collecting the component P and a syringe member 56 to which the suction nozzle 42 can be attached and detached, and is provided so as to be able to move up and down. The mounting head 50 is held by the head holder 40 so as to be rotatable about a rotation axis (R axis), and includes a rotary portion 51 having the same center axis as the rotation axis. The rotary part 51 is a member that supports the sixteen syringe members 56 so as to be rotatable around the central axis of the syringe member 56 and vertically movable, for example. The R-axis gear 52 is a disk-shaped member having an outer diameter larger than that of the rotary part 51, and has a gear groove formed on the outer peripheral surface. The R-axis gear 52 meshes with a small gear 62 connected to the rotation shaft of the R-axis motor 60, and is driven to rotate by the R-axis motor 60 via the small gear 62. The Q-axis gear 53 is a cylindrical member having an outer diameter smaller than that of the rotary part 51, and has a gear groove formed on the outer peripheral surface. The syringe member 56 is a member in which the small gear 57 is disposed on the upper end side and the suction nozzle 42 is mounted on the lower end side. The small gear 57 meshes with a gear groove formed on the outer periphery of the Q-axis gear 53. The syringe members 56 are arranged at equal intervals along the outer periphery of the Q-axis gear 53.

  The suction nozzle 42 uses the pressure to suck the component P at the nozzle tip or release the component P sucked at the nozzle tip. The suction nozzle 42 has a disc-shaped flange 43 and a tubular portion 44 formed on the tip side (see FIGS. 2 and 3). The suction nozzle 42 and the syringe member 56 constitute a component holder 55. The component holder 55 is rotatable about a rotation axis (Q axis) and is used for holding the component P. The component holding portion 55 (suction nozzle 42) is connected to the Q-axis motor 63, the small gear 65, the Q-axis gear 53, and the Q-axis transmitted via the small gear 57 disposed on the upper end side of the syringe member 56. The component P is rotated (rotated) about the rotation axis by the driving force of the motor 63, and the angle of the sucked component P can be adjusted. The component holder 55 is moved up and down in the Z-axis direction (vertical direction) along the Z-axis guide 67 by the driving force of the Z-axis motor 66 transmitted via the horizontal portion 68. In the mounting head 50, the component holder 55 is moved up and down in the Z-axis direction at one elevating position (see FIG. 3) located on the front end side of the mounting head unit 17 in the Y-axis direction. The sampling member for sampling the component P is described here as the suction nozzle 42, but is not particularly limited as long as the component P can be sampled, and may be a mechanical chuck or the like that sandwiches and samples the component P. In addition, the syringe member 56 serving as a collection member holding portion can be attached and detached with the suction nozzle 42 serving as a collection member at a lower end side.

  A prism-shaped support member 47 that supports the R-axis encoder 70, the first Q-axis encoder 73, the second Q-axis encoder 76, and the like is provided in front of the holder main body 45 downward. . The support member 47 extends to a position facing the suction nozzle 42. A horizontal portion 48 is formed on the lower end side of the support member 47 toward the suction nozzle 42 side, and a first Q-axis encoder 73 is disposed at the tip of the horizontal portion 48. The R-axis encoder 70 is a detection unit that directly detects the rotational position of the mounting head 50 (the rotary unit 51), and is configured as a reflective optical encoder. The R-axis encoder 70 is disposed at a position facing the rotary portion 51 as a cylindrical portion of the mounting head 50. The R-axis encoder 70 includes a code section 71 formed over the center of the outer periphery of the rotary section 51 and an element section 72 disposed at a position facing the code section 71 in the support member 47. . The code section 71 has an area that reflects light emitted from the element section 72 and an area that does not reflect the light. The element unit 72 includes an irradiation unit that irradiates light and a light receiving unit that receives light reflected by the code unit 71. The R-axis encoder 70 irradiates the code unit 71 with light from the element unit 72 and detects the pattern of the reflected light from the code unit 71, thereby grasping the rotational position of the rotary unit 51.

  The first Q-axis encoder 73 is a detection unit that directly detects the rotational position of the suction nozzle 42 mounted on the lower end of the component holding unit 55, and is configured as a reflective optical encoder. The first Q-axis encoder 73 is provided at a position facing the flange 43 of the suction nozzle 42. The first Q-axis encoder 73 includes a cord portion 74 formed over the outer periphery of the flange 43 and an element portion 75 provided at a position of the support member 47 facing the cord portion 74. The first Q-axis encoder 73 is configured to select either the initial position of the suction nozzle 42 (see the solid line in the blowout in FIG. 3) or the extension position of the suction nozzle 42 (see the dotted line) when moving the component holding unit 55 up and down. Also, the element portion 75 formed in the moving direction of the suction nozzle 42 so as to face the flange 43 is fixed to the support member 47. The second Q-axis encoder 76 is a detection unit that directly detects the rotational position of the syringe member 56 near the small gear 57 at the upper end of the component holding unit 55, and is configured as a reflective optical encoder. The second Q-axis encoder 76 is provided in a cylindrical portion on the upper end side of the syringe member 56. The second Q-axis encoder 76 includes a cord portion 77 formed over the outer periphery of the syringe member 56 and an element portion 78 provided at a position of the support member 47 facing the cord portion 77. Note that the code section 74, the code section 77, the element section 75, and the element section 78 have the same configuration as the code section 71 and the element section 72, respectively, and thus description thereof will be omitted. The element section 72 of the R-axis encoder 70, the element section 75 of the first Q-axis encoder 73, and the element section 78 of the second Q-axis encoder 76 are arranged from the outer peripheral side of the mounting head unit 17 (mounting head 50) to the component holding section 55 and the rotary section. It is arranged facing 51.

  The mounting head unit 17 has a storage unit 41a for storing information, and includes a control unit 41 for controlling the entire mounting head unit 17 (see FIG. 4). The control unit 41 includes a CPU, a ROM, a RAM, and the like. The storage unit 41a stores information on the mounting head 50, information on the suction nozzles 42, and the like. The control unit 41 is electrically connected to detection units such as the R-axis encoder 70, the first Q-axis encoder 73, and the second Q-axis encoder 76, and acquires signals from these detection units.

  As shown in FIG. 4, the control device 80 is configured as a microprocessor mainly including a CPU 81, a ROM 82 for storing a processing program, an HDD 83 for storing various data, a RAM 84 used as a work area, an external device and an electric device. An input / output interface 85 for exchanging signals is provided, and these are connected via a bus. The control device 80 is connected to the substrate transport unit 14, the substrate support unit 15, the head moving unit 16, the mounting head unit 17, the supply unit 18, the operation panel 19, and the like so as to be capable of bidirectional communication. Exchange signals.

  Next, the operation of the mounting system 10 of the present embodiment thus configured, and first, the mounting process of the mounting apparatus 11 will be described. The mounting processing routine is stored in the HDD 83 of the control device 80, and is executed according to a production start instruction from an operator. When this routine is executed, the CPU 81 controls the substrate transport unit 14 and the substrate support unit 15 to transport the substrate S into the apparatus and fix the substrate S at the mounting position. Next, the CPU 81 performs a process of reading out the production job data, setting a component P to be arranged on the substrate S, and mounting the mounting head 50 and the suction nozzle 42 for collecting the component P on the head holder 40. Next, the CPU 81 controls the head moving unit 16 and the mounting head unit 17 to cause the suction nozzle 42 to collect the component P and execute the process of arranging the component P on the substrate S. Then, when the mounting process of the current substrate S is completed, the substrate S is discharged, the next substrate S is loaded, and fixed at the mounting position. The CPU 81 repeatedly executes the above-described processing until the production of all the substrates S is completed.

  Next, a description will be given of a process executed by the mounting process routine, in which the component P is collected by the suction nozzle 42 and arranged on the substrate S. FIG. 5 is a flowchart illustrating an example of a component collection and arrangement processing routine executed by the CPU of the control unit 41 included in the mounting head unit 17. This routine is stored in the storage unit 41a of the control unit 41 and is executed at a predetermined timing. In this routine, processing for correcting the rotational position of the component P and detecting the degree of deformation such as twisting of the syringe member 56 is performed. When this routine is started, the CPU of the control unit 41 drives the R-axis motor 60 to rotate the rotary unit 51 so that the component holding unit 55 to be lifted and lowered is located at a predetermined lifting position. R-axis, which is the axis, is roughly positioned (step S100). The rough positioning uses the value of the encoder 61 provided on the R-axis motor 60 to drive and control the R-axis motor 60 so that the rotary unit 51 is at the set rotational position. Next, the CPU acquires the value of the R-axis encoder 70, corrects the rotational position of the R-axis based on this value, and controls the driving of the R-axis motor 60 so that the rotary unit 51 is positioned at the correct rotational position. (Step S110).

  Next, the CPU of the control unit 41 performs rough positioning of the Q axis, which is the rotation axis of the component holding unit 55 (suction nozzle 42) (step S120). This coarse positioning uses the value of the encoder 64 provided on the Q-axis motor 63 to drive and control the Q-axis motor 63 so that the suction nozzle 42 is at the set rotational position. Next, the CPU acquires the value of the first Q-axis encoder 73, corrects the rotational position of the Q-axis based on this value, and controls the driving of the Q-axis motor 63 so that the syringe member 56 is positioned at the correct rotational position. (Step S130). At this time, the control unit 41 may acquire the value of the first Q-axis encoder 73 at the extended position where the suction nozzle 42 is lowered. In this way, the control unit 41 can acquire the rotational position of the suction nozzle 42 in a state where the component P is arranged.

  Next, the CPU of the control unit 41 acquires a value from the second Q-axis encoder 76 (step S140), and associates the values of the first Q-axis encoder 73 and the second Q-axis encoder 76 with the component holding unit 55 currently used. And store it in the storage unit 41a (step S150). As described above, the CPU saves the state of the component holding unit 55 as a history. Subsequently, the CPU obtains a difference value between the values of the first Q-axis encoder 73 and the second Q-axis encoder 76, and determines which of the allowable range, the warning range, and the abnormal range is included in the difference value (step S160). The allowable range may be empirically determined as, for example, a range that does not significantly affect the mounting process among the degrees of deformation such as torsion of the component holding unit 55. The warning range may be empirically determined, for example, as a range in which the degree of deformation of the component holder 55 is relatively large and requires attention. The abnormal range may be, for example, a range empirically determined as a range in which the component holder 55 is to be replaced.

  When the difference value between the first Q-axis encoder 73 and the second Q-axis encoder 76 is within the allowable range, the CPU of the control unit 41 directly executes the processing from step S190. On the other hand, when the difference value is within the warning range, the CPU outputs a command to display a warning or the like on the operation panel 19 on the operation panel 19 to the control device 80 (step S170). The control device 80 having received this causes the display unit 24 of the operation panel 19 to display a message indicating that the maintenance of the component holding unit 55 is required. On the other hand, when the difference value is within the abnormal range, the CPU outputs a command to interrupt the mounting process and a command to display an error display to that effect on the operation panel 19 to the control device 80 (step S180), and directly executes this routine. finish. Upon receiving this command, the control device 80 interrupts the mounting process and causes the display unit 24 of the operation panel 19 to display a message indicating that the component replacement of the component holding unit 55 is required.

  After step S170 or when the difference value is within the allowable range in step S160, the CPU of the control unit 41 performs a process of collecting the component P (step S190). In this process, the CPU drives the Z-axis motor 66 so as to lower the suction nozzle 42 to the extension position after the mounting head unit 17 is arranged at the component collection position of the specified supply unit 18, and By applying a negative pressure, the component P is attracted to this tip. Subsequently, the CPU determines whether or not the component P to be collected by the mounting head 50 has been collected (whether all components have been collected) (step S200). Execute the process. On the other hand, when the sampling of the component P is completed, the CPU drives the R-axis motor 60 to move the component holding unit 55 holding the component P to be arranged on the substrate S to the elevating position, and rotates the component P. The Q-axis motor 63 is driven so that the position becomes a correct rotation position (step S210). At this time, the CPU may perform the same processing as in steps S100 to S140 described above, or correct and position the rotational positions of the R axis and the Q axis by using the correction values used in steps S100 to S140 again. May be performed.

  Subsequently, the CPU of the control unit 41 determines whether or not the mounting head unit 17 has been moved to the arrangement position where the component P is arranged on the substrate S (step S220). I do. When the mounting head unit 17 has been moved to the disposition position, the CPU lowers the component holding unit 55 and executes the disposition processing of the component P (step S230). Then, the CPU determines whether or not the component P that has been collected and not yet arranged on the mounting head 50 is present on the mounting head 50 (step S240). If there is, the processing after step S210 is repeatedly executed. On the other hand, when there is no component P that has been collected and has not been arranged, the CPU ends this routine as it is. The CPU repeatedly executes such processing until the placement of the components P on all the boards S is completed.

  Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The first Q-axis encoder 73 and the second Q-axis encoder 76 of the present embodiment correspond to a detection unit, the suction nozzle 42 corresponds to a sampling member, the flange 43 corresponds to a cylindrical portion of the sampling member, and the mounting head 50 is a work head. , The support member 47 corresponds to the support member, the rotary portion 51 corresponds to the cylindrical portion of the working head, and the R-axis encoder 70 corresponds to the position detection portion. In the present embodiment, an example of a control method of the mounting apparatus of the present invention is also clarified by describing an operation of the mounting apparatus 11.

  According to the mounting head unit 17 of the present embodiment described above, the first Q-axis encoder 73 detects the rotation position of the suction nozzle 42 at a position facing the suction nozzle 42 holding the component P. As described above, since the rotational position of the part holding the component P is directly detected, information on the rotational position of the component P held by the suction nozzle 42 can be acquired with higher accuracy. In addition, for example, the suction nozzle 42 can be positioned at a more accurate position as compared with using the encoder 64 that is separated from the suction nozzle 42. In addition, since the attitude of the component holding unit 55 is corrected using the result of detecting the attitude of the part holding the component P, the attitude of the component P can be corrected more correctly. Further, since the first Q-axis encoder 73 is disposed at a position facing the flange 43, the rotation position of the suction nozzle 42 closest to the held component P can be detected, and the rotation position of the component P can be determined. Further, it can be obtained with high accuracy. Further, since the second Q-axis encoder 76 is disposed at a position facing the cylindrical portion of the syringe member 56, the second Q-axis encoder 76 has a relatively small diameter compared to when the rotation position is detected by the suction nozzle 42 having a relatively small diameter. 55 is easier to detect the rotational position. In addition, in the mounting head unit 17, since the posture of the component holding portion 55 is detected at two positions, that is, the suction nozzle 42 and the syringe member 56, the state (for example, deformation) of the component holding portion 55 (including the syringe member 56). , The displacement between the syringe member 56 and the suction nozzle 42 can be detected.

  Further, the mounting head unit 17 controls the syringe based on the rotational position of the suction nozzle 42 and the rotational position of the cylindrical portion of the syringe member 56, which are obtained by the control unit 41 from the first Q-axis encoder 73 and the second Q-axis encoder 76. Information on the state of the member (for example, deformation such as twist) is stored in the storage unit 41a. Therefore, the mounting head unit 17 can also manage the state of the syringe member 56. Further, the mounting head unit 17 includes an element portion 75 formed so as to face the flange 43 (cord portion 74) at both the initial position and the extended position of the suction nozzle 42 when the component holding portion 55 is moved up and down. Is provided. For this reason, the mounting head unit 17 can detect the attitude of the component P according to the position of the component holder 55 when the component holder 55 moves up and down while holding the component P. Furthermore, the mounting head unit 17 has the element section 72 of the R-axis encoder 70 that detects the rotational position of the rotary section 51 at a position facing the rotary section 51 (cylindrical section). The rotational position can be directly obtained, and the rotary unit 51 can be positioned at a more accurate position as compared with using the encoder 64 that is separated from the rotary unit 51. The mounting head unit 17 includes a first Q-axis encoder 73 disposed facing the suction nozzle 42 (one end) and a second Q-axis encoder 73 disposed facing the other end of the syringe member 56. 76, the deformation of the syringe member 56 such as twisting can be detected in more detail. Further, in the mounting head unit 17, since the detection units such as the first Q-axis encoder 73 and the second Q-axis encoder 76 are arranged to face the component holding unit 55 from the outer peripheral side of the mounting head 50, the detection unit Can be arranged relatively easily.

  It should be noted that the present invention is not limited to the above-described embodiment at all, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  For example, in the above-described embodiment, the first Q-axis encoder 73 is provided at a position facing the suction nozzle 42, and the second Q-axis encoder 76 is provided at a position facing the cylindrical portion of the syringe member 56. The present invention is not particularly limited to this, and one of the first Q-axis encoder 73 and the second Q-axis encoder 76 may be omitted. Also in this case, since the rotation position of the component holding unit 55 can be directly detected, information on the rotation position of the component P held by the suction nozzle 42 can be acquired with higher accuracy. When the number of the detection units is one, the mounting head unit 17 omits the management of the information on the deformation of the syringe member 56 described above.

  In the above-described embodiment, the code portion 74 of the first Q-axis encoder 73 is formed on the flange 43. However, if the code portion 74 is formed on the cylindrical outer surface of the suction nozzle 42, it is not particularly limited to this. Instead, for example, a cord portion may be formed in the tubular portion 44. In this case, the same effect as in the above-described embodiment can be obtained. Further, although the code portion 77 of the second Q-axis encoder 76 is formed on the upper end side of the syringe member 56, it may be formed on any part of the syringe member 56.

  In the above-described embodiment, the rotation position is detected at the lower end side and the upper end side of the component holding unit 55, and the deformation or the like of the component holding unit 55 is detected. However, this process may be omitted. Even in this case, information on the rotational position of the component P held by the suction nozzle 42 can be acquired with higher accuracy.

  In the above-described embodiment, the first Q-axis encoder 73 includes the element unit 75 formed so as to be able to detect the rotational position of the suction nozzle 42 at any of the initial position and the extended position. The present invention is not limited to this. For example, a configuration may be adopted in which the element unit 75 is moved up and down in accordance with the up and down movement of the suction nozzle 42. Even in this case, the rotational position of the component P according to the position at which the suction nozzle 42 moves up and down can be acquired with higher accuracy.

  In the embodiment described above, the R-axis encoder 70 is provided, but this may be omitted. Even in this case, the correction of the rotational position of the rotary unit 51 is omitted, but information about the rotational position of the component P held by the suction nozzle 42 can be acquired with higher accuracy.

  In the embodiment described above, the rotary type mounting head 50 held in the head holder 40 in a rotatable state has been described as an example. However, the fixed work head held in the head holder 40 in a non-rotatable state. May be provided. Although not specifically described in the above-described embodiment, the mounting apparatus 11 may include a mounting head unit that the plurality of types of mounting heads are exchangeably held by the head holder 40.

  In the above-described embodiment, each detection unit is described as a reflection type optical encoder. However, the detection unit is not particularly limited as long as it detects the posture of the component holding unit 55. It may be an encoder or a magnetic encoder. In addition, each detecting unit detects the rotational position of the component holding unit 55, but is not limited thereto. In addition, a distance sensor is provided in each detection unit to measure a distance from the suction nozzle 42 with the suction nozzle 42 serving as a sampling member being rotated, and a suction nozzle at an initial position and an extended position of the suction nozzle 42. The inclination of the rotation axis, which is the attitude of the suction nozzle 42, may be detected by measuring the distance to the suction nozzle 42, respectively. Similarly, the inclination of the rotation axis of the syringe member 56 as the sampling member holding unit may be detected. In this case, the amount of displacement in the horizontal direction at the extension position of the suction nozzle 42 due to the detected inclination of the rotating shaft can be calculated. Therefore, the electronic components can be mounted with high accuracy by correcting the displacement. Can be.

  In the above-described embodiment, the mounting apparatus 11 including the mounting head unit 17 has been described. However, the mounting apparatus is not particularly limited thereto, and the mounting head unit 17 may be used. In the above-described embodiment, the mounting device 11 is described. However, a method of controlling the mounting head unit 17 may be used.

  INDUSTRIAL APPLICABILITY The present invention can be used in the field of mounting electronic components.

Reference Signs List 10 mounting system, 11 mounting device, 12 mounting processing unit, 14 substrate transport unit, 15 substrate support unit, 16 head moving unit, 17 mounting head unit, 18 supply unit, 19 operation panel, 21 support plate, 22 conveyor belt, 23 Support pin, 24 display unit, 25 operation unit, 26 X-axis slider, 28 guide rail, 30 Y-axis slider, 32 guide rail, 40 head holder, 41 control unit, 41a storage unit, 42 suction nozzle, 43 flange, 44 Tubular part, 45 holder main body, 46 engaging shaft, 47 support member, 48 horizontal part, 50 mounting head, 51 rotary part, 52 Q-axis gear, 53 R-axis gear, 55 parts holding part, 56 syringe member, 57 small Gear, 60 R axis motor, 61 encoder, 63 Q axis motor, 64 encoder, 65 small Gear, 66 Z axis motor, 67 Z axis guide, 68 horizontal section, 70 R axis encoder, 71 code section, 72 element section, 73 first Q axis encoder, 74 code section, 75 element section, 76 second Q axis encoder, 77 Code section, 78 element section, 80 control device, 81 CPU, 82 ROM, 83 HDD, 84 RAM, 85 input / output interface, 90 management computer, P component, S board.

Claims (4)

A collecting member for collecting parts,
A sampling member holding unit that is capable of mounting and removing the sampling member,
A detection unit that is disposed at a position facing the collection member and detects a posture of the collection member,
A work head in which a component holding unit having the sampling member and the sampling member holding unit is disposed so as to be able to move up and down,
A head holding body for holding the work head,
The detection unit,
Disposed on the head holder, fixed to the distal end side of a support member extending to a position facing the sampling member of the component holding unit,
A work head unit fixed to the support member so as to face the sampling member at both an initial position of the sampling member and an extended position of the sampling member when the component holding unit is moved up and down . A collecting member for collecting parts,
A sampling member holding unit that is capable of mounting and removing the sampling member,
A detection unit that is disposed at a position facing the collection member holding unit and detects a posture of the collection member holding unit,
Working head unit with. A collecting member for collecting parts,
A sampling member holding unit that is capable of mounting and removing the sampling member,
A component holding unit having the sampling member and the sampling member holding unit,
A detection unit that is disposed at a position facing the collection member and a position facing the collection member holding unit, and detects a posture of the collection member and a posture of the collection member holding unit,
Having a storage unit for storing information, a control unit electrically connected to the detection unit,
With
The work head unit, wherein the control unit causes the storage unit to store information related to a state of the component holding unit based on a posture of the collection member and a posture of the collection member holding unit acquired from the detection unit. A sampling member that is rotatable about a rotation axis and has a cylindrical portion for sampling a component, and a sampling member holding portion that has a cylindrical portion and is capable of mounting and dismounting the sampling member is used for holding the component. A component holding unit, a detecting unit disposed at a position facing the cylindrical portion of the sampling member and a position facing the cylindrical portion of the sampling member holding unit and configured to detect an attitude of the component holding unit, and store information. A control unit having a storage unit and electrically connected to the detection unit, comprising:
(A) storing, in the storage unit, information regarding the state of the collection member holding unit based on the rotation position of the cylindrical unit of the collection member and the rotation position of the cylindrical unit of the collection member holding unit, obtained from the detection unit; Step to make
And a control method of the working head unit.

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