JP6684991B2 - Part placement determining method and management device - Google Patents

Description

  The present invention relates to a component placement determination method for determining placement of component supply means in a component mounting apparatus that constitutes a component mounting system, and a management apparatus that manages the component mounting system.

  A component mounting system that mounts electronic components on a substrate to produce a mounted substrate is a component mounting device that mounts electronic components on a substrate after solder for component bonding is printed, and a substrate that is mounted after heating. Thus, a reflow device for solder-bonding the electronic component to the substrate is provided. When multiple types of mounting boards are produced by such a component mounting system, electronic components used for manufacturing multiple types of boards are collectively placed in the component mounting device for the purpose of minimizing setup change work. There is a so-called common arrangement. At that time, it is common to determine the board type to be commonly arranged in consideration of the commonality of the electronic components to be mounted (for example, refer to Patent Document 1).

  In Japanese Patent Laid-Open No. 2004-163242, mounting boards of a type having a high degree of commonality of mounted components are grouped so as to be in the same group. Then, based on the production plan, when producing a plurality of types of mounting boards, the arrangement of the component supply means for supplying the components is determined so that the cumulative value of the replacement time of the component supply means in the group becomes small. There is.

Japanese Patent No. 3830642

  However, in the related art including the above-mentioned patent document examples, due to reflow conditions such as a heating profile at the time of solder joining by a reflow device, loss time occurs during setup change work, and improvement in productivity is impeded. There were challenges. That is, even if the common placement of electronic components is applied to the component mounting apparatus as described above, if the reflow condition is targeted for a plurality of types of substrates, the reflow condition is changed every time the substrate type is switched. It requires a preparation time to adapt to the board type. Therefore, even if the common layout is applied in consideration of the commonality of parts and the work time at the time of switching the board type is shortened as much as possible, if the reflow conditions are different, the production will be continued until the reflow conditions are adapted. It was not possible to start, and the advantage of having a common arrangement of electronic components was diminished.

  Therefore, the present invention manages a component placement determination method and a component placement system that can improve productivity by reducing the work time at the time of switching substrate types in a component mounting system that produces a plurality of types of mounting boards. It is an object of the present invention to provide a management device that operates.

  A component placement determining method according to the present invention is a component placement determining method for determining placement of component supply means used for production of a plurality of types of boards in a component mounting apparatus, and a reflow preparation for each of the plurality of types of boards. Based on the time taken to divide the plurality of types of substrates into a plurality of groups that can be produced without changing the arrangement of the component supply means, and for each of the plurality of groups, the types of substrates belonging to the group The step of deciding the arrangement of the component supply means for supplying the components required for the production of in the component mounting apparatus.

Management apparatus of the present invention is a management device connected to the plurality of component supply means positionable component mounting apparatus and a network, a storage unit for storing the time for reflowing preparation in each of the substrates of multiple varieties , The plurality of types of boards are divided into a plurality of groups that can be produced without changing the arrangement of the component supply means based on the time required for the reflow preparation, and each of the plurality of groups belongs to the group A control unit that determines the arrangement of the component supply means in the component mounting apparatus, which supplies components necessary for the production of the board.

  According to the present invention, in a component mounting system that produces a plurality of types of mounting boards, it is possible to shorten the work time when switching the board types and improve the productivity.

Structure explanatory drawing of the component mounting system of one embodiment of this invention 1 is a partial plan view of a component mounting apparatus which constitutes a component mounting system according to an embodiment of the present invention. Structure explanatory drawing of the reflow apparatus which comprises the component mounting system of one embodiment of this invention Block diagram showing the configuration of the control system of the component mounting system of one embodiment of the present invention Explanatory drawing of production board type data in the component mounting system of one embodiment of the present invention Explanatory drawing of the reflow temperature profile in the component mounting system of one embodiment of this invention. Flow diagram of component placement determination processing in the component mounting system according to the embodiment of the present invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the configuration of the component mounting system 1 will be described with reference to FIG. The component mounting system 1 has a function of mounting electronic components on a substrate by soldering and producing a mounted substrate. In order to execute this component mounting work, the component mounting system 1 includes a substrate supply device M1, a substrate transfer device M2, a printing device M3, an inspection device M4, component mounting devices M5, M6, an inspection device M7, a reflow device M8, and a substrate recovery device. A component mounting line 1a having a configuration in which M9 is connected, and a management device 3 connected to the component mounting line 1a via a network 2 are provided. That is, each device including the component mounting devices M5 and M6 forming the component mounting line 1a is connected to the management device 3 by the network 2, and the management device 3 determines the arrangement of the component supply means in the component mounting devices M5 and M6. , And controls the production management in the component mounting line 1a.

  The board supply device M1 supplies the board 6 which is a target of component mounting. The supplied substrate 6 is carried into the printing device M3 via the substrate transfer device M2. The printing device M3 screen-prints paste-like solder such as cream solder on the electrodes for joining components formed on the substrate. The inspection device M4 performs a print inspection including determination of the print state of the solder printed on the substrate and detection of a print position shift of the solder with respect to the electrodes.

  The component mounting apparatuses M5 and M6 sequentially mount electronic components on the board 6 on which solder is printed by the printing apparatus M3. The inspection device M7 inspects the component mounting state on the board 6 after the electronic components are mounted. The reflow device M8 melts the solder by heating the substrate 6 after mounting the electronic component according to a predetermined reflow temperature profile, and solder-bonds the electronic component to the substrate. The board collecting device M9 collects the board 6 after the reflow, that is, the completed board 6 on which the electronic components are mounted.

  Next, the configurations of the component mounting apparatuses M5 and M6 will be described with reference to FIG. FIG. 2 shows a front-side plane of the component mounting apparatuses M5 and M6, and a board transfer mechanism 5 is arranged on the base 4 in the X direction (board transfer direction). The board carrying mechanism 5 carries the board 6 after solder printing transferred from the upstream side device, and positions and holds the board 6 at the mounting work position by the component mounting mechanism 13 described below.

  A component supply unit 7 is arranged on the side of the board transport mechanism 5. A dolly 8 on which a tape feeder 9 serving as a plurality of component supply means is mounted is set in the component supply unit 7. The tape feeder 9 feeds the electronic components to the component pick-up position by the component mounting mechanism 13 described below by feeding the carrier tape holding the electronic components to be mounted by pitch. That is, a plurality of component supply means can be arranged in the component mounting apparatuses M5 and M6.

  The tape feeder 9 is replaceably mounted in a plurality of feeder slots 8a provided on the carriage 8. The setup change work associated with the switching of the board type, that is, the work of changing the component placement for changing the placement of the component feeding means such as the tape feeder 9 in the component feeding unit 7 for each board type is based on the component placement data created in advance. Done. In the present embodiment, when creating the component placement data, the component placement data is created in consideration of the similarity of the reflow conditions, with the aim of performing the preparatory work in the reflow device M8 as efficiently as possible. .

  A Y-axis moving beam 10 is arranged at an end of the base 4 in the X direction, and an X-axis moving beam 11 is mounted on the Y-axis moving beam 10 so as to be freely movable in the Y direction. The mounting head 12 is mounted on the X-axis moving beam 11 so as to be freely movable in the Y direction. By driving the Y-axis moving beam 10 and the X-axis moving beam 11, the mounting head 12 moves in the X and Y directions. By moving, the electronic component is taken out from the component supply unit 7, transferred to the substrate 6 positioned and held by the substrate transport mechanism 5, and mounted. The Y-axis moving beam 10, the X-axis moving beam 11, and the mounting head 12 configure a component mounting mechanism 13 that mounts electronic components on the substrate 6.

  A board recognition camera 14 that moves integrally with the mounting head 12 is arranged on the X-axis moving beam 11 with its imaging surface facing downward. By moving the mounting head 12 above the substrate 6, the substrate recognition camera 14 takes an image of the recognition mark formed on the substrate 6. A component recognition camera 15 is provided on the movement path along which the mounting head 12 that takes out the electronic component from the component supply unit 7 moves above the substrate 6. The component recognition camera 15 captures an image of the electronic component held by the mounting head 12 from below. In the component mounting operation by the component mounting mechanism 13, the positional deviation of the substrate 6 and the position of the electronic component held by the mounting head 12 obtained by recognizing the image pickup results by the substrate recognition camera 14 and the component recognition camera 15. The displacement is corrected and the mounting head 12 is positioned with respect to the substrate 6.

  Next, the configuration of the reflow device M8 will be described with reference to FIG. In the reflow apparatus M8, a transfer path 21 for transferring the substrate 6 is horizontally arranged in a reflow furnace 22 provided on the base 20. The inside of the reflow furnace 22 is partitioned into a plurality of heating zones 22a, and each heating zone 22a is provided with a heating device 23 whose temperature can be adjusted by a temperature adjusting section 24. Further, the atmosphere conditions such as the oxygen concentration and nitrogen concentration of the atmosphere inside each heating zone 22a can be adjusted by the atmosphere adjusting unit 25. This makes it possible to match the atmosphere composition and temperature in each heating zone 22a to the preset reflow conditions.

  The atmosphere in each heating zone 22a is adjusted by the atmosphere adjusting unit 25, and the heating device 23 is driven to heat each heating zone 22a to a predetermined temperature condition. By sequentially passing 6 through the heating zone from the upstream side, the solder component in the solder paste is heated and melted. As a result, the electronic component is soldered to the substrate 6.

  In order to perform good solder joining in the reflow process described above, the temperature distribution in the plurality of heating zones 22a is stable in conformity with the reflow temperature profile defined in advance according to the board type of the board 6 to be produced. It is hoped that it is in a state. A plurality of measurement points TP1 to TP4 are set in the reflow furnace 22 for measuring the ambient temperature in each heating zone 22a, and the temperature measurement results measured at these measurement points are used as a preset reflow temperature profile. While comparing, by adjusting the heating of the heating device 23 by the temperature adjusting unit 24, a predetermined temperature distribution is realized.

  Next, the configuration of the control system of the component mounting system 1 will be described with reference to FIG. In FIG. 4, the management device 3 includes a control unit 30, a storage unit 31, an operation / input unit 32, a display unit 33, and a communication unit 34. The control unit 30 is a CPU device that executes the processing function of the management device 3, and controls each unit described below based on various programs and data stored in the storage unit 31. As a result, the management device 3 manages the work of each device constituting the component mounting line 1a.

  Furthermore, the control unit 30 in the present embodiment includes a grouping processing unit 30a and a component placement determination processing unit 30b as processing functions. The grouping processing unit 30a can produce a plurality of types of boards to be produced based on the similarity of the reflow conditions in the reflow device M8 without changing the arrangement of the tape feeder 9 in the component supply unit 7. Perform the process of grouping into. The component placement determination processing unit 30b, for each of the plurality of groups grouped by the grouping processing unit 30a, the component placement, that is, of the tape feeder 9 that supplies the components necessary for producing a board of a type belonging to the group, A process of determining the arrangement in the component supply unit 7 of the component mounting apparatuses M5 and M6 is performed. The determined component placement is stored in the storage unit 31 as the component placement data 45.

  That is, the control unit 30 of the management device 3 in the component mounting system 1 according to the present embodiment changes the arrangement of component supply means such as the tape feeder 9 for a plurality of types of boards based on the similarity of reflow conditions. Component grouping devices M5 and M6 of component supplying means such as a tape feeder 9 which supplies a component necessary for producing a substrate of a type belonging to each group to each group. Has the function of determining the arrangement.

  The storage unit 31 stores various data including production facility information 40, production board type data 41, mounting data 42, reflow temperature profile data 43, grouping data 44, and component placement data 45. The production equipment information 40 is information about the production equipment in the component mounting system 1, that is, each device that constitutes the component mounting line 1a, and includes types of component supply means such as the tape feeder 9 used for the component mounting devices M5 and M6. Includes quantity.

  The production board type data 41 is production plan data created when a production plan is created in the component mounting system 1. That is, as shown in FIG. 5, a plurality of production schedules 41b (production schedule 1, production schedule 2, ...) For each scheduled production date 41a set for a predetermined planning period (here, monthly). Is prescribed. Then, for each production schedule 41b, a plurality of board types 41c to be produced are specified.

  The mounting data 42 is data referred to when mounting the target board type in the production board type data 41, and is board data indicating the size and type of each board type, and mounting indicating the component mounting position on each board. It includes coordinate data, component data indicating the type of component mounted at each component mounting position, and the like.

  Here, the reflow condition in the reflow device M8, that is, the reflow temperature profile data 43 regarding the reflow temperature profile will be described with reference to FIG. In FIG. 6A, a “board type” 43a is a board type to be produced defined in FIG. 5, and each “board type” 43a has a “profile name” 43b that specifies a corresponding reflow temperature profile. Is attached. Then, in each "profile name" 43b, a "measurement point temperature" 43c that specifies the temperature for each of the measurement points TP1 to TP4 shown in FIG. 3 is defined.

  FIG. 6B shows a profile pattern 43d that graphically displays these reflow temperature profiles. Here, the temperatures of the measurement points TP1 to TP4 in the reflow temperature profile specified by the “profile name” 43b are shown in a graph. That is, the storage unit 31 in the management device 3 according to the present embodiment stores the reflow conditions for each of a plurality of types of boards to be produced.

  The grouping data 44 is data that is referred to when the grouping processing unit 30a performs grouping. The grouping data 44 includes data defining the allowable range of the temperature difference for allowing inclusion in the same group, that is, the allowable range of the temperature difference at each measurement point shown in FIG. The component placement data 45 supplies components required for production of boards of types belonging to each of the component placements determined by the component placement determination processing unit 30b, that is, a plurality of groups grouped by the grouping processing unit 30a. 6 is data showing the arrangement of the tape feeder 9 in the component supply unit 7 of the component mounting apparatuses M5 and M6.

  The operation / input unit 32 is an input device such as a touch panel or a keyboard, and performs an input operation such as an operation command or data input to the management device 3. The display unit 33 is a display device such as a liquid crystal panel, and displays a guide screen and various notification screens at the time of input operation by the operation / input unit 32. The communication unit 34 is a communication interface, and is connected to each device constituting the component mounting line 1a via the network 2 to send and receive control signals and data.

  The component mounting apparatuses M5 and M6 include a communication unit 50, a mounting control unit 51, and a storage unit 52. The communication unit 50 is a communication interface, and is connected via the network 2 to other devices that form the component mounting line 1a. As a result, the mounting control unit 51 and the storage unit 52 are connected to the network 2 via the communication unit 50. The storage unit 52 stores the mounting data 42 and the component placement data 45 transmitted from the management apparatus 3 via the network 2. When the mounting control unit 51 controls the board transport mechanism 5 and the component mounting mechanism 13. , These data are referenced.

  The reflow device M8 includes a communication unit 53, a reflow control unit 54, and a storage unit 55. The communication unit 53 is a communication interface, and is connected via the network 2 to other devices that form the component mounting line 1a. The reflow controller 54 controls the temperature controller 24 and the atmosphere controller 25. This makes it possible to perform a preparatory work for adjusting the temperature and atmosphere in each heating zone 22a to a predetermined condition prior to the start of production.

  The reflow temperature profile data 43 and the atmosphere data 56 are stored in the storage unit 55. The reflow temperature profile data 43 is similar to the reflow temperature profile data 43 stored in the storage unit 31 of the management device 3, and is transmitted from the management device 3 via the network 2. The atmosphere data 56 is data relating to the oxygen concentration and the nitrogen concentration in the atmosphere in the heating zone 22a of the reflow furnace, which is defined in advance by the management device 3 according to the type of substrate to be produced, and is similarly transmitted via the network 2. It The reflow temperature profile data 43 is referred to when the reflow control unit 54 controls the temperature adjustment unit 24, and the atmosphere data 56 is referred to when the reflow control unit 54 controls the atmosphere adjustment unit 25.

  Next, with reference to FIG. 7, the component placement determination process (component placement determination method) that determines the placement of component supply means such as the tape feeder 9 used in the production of boards of a plurality of types in the component mounting apparatuses M5 and M6. Explain. First, reflow conditions and parts to be used for each of a plurality of types of boards to be produced are specified (ST1). That is, a plurality of types of boards to be produced are specified from the production board type data 41 stored in the storage unit 31, and the reflow conditions and the used parts for the board are specified from the reflow temperature profile data 43 and the mounting data 42. .

  Next, a plurality of types of boards are divided into groups based on the similarity of the reflow conditions (ST2). Here, the grouping processing unit 30a executes a grouping process that divides a plurality of types of boards into a plurality of groups that can be produced without changing the arrangement of the component supply means based on the similarity of the reflow conditions. This grouping is performed based on the similarity of the reflow temperature profile shown in FIG.

  At the time of grouping, a well-known clustering method is used to perform grouping in the descending order of similarity among a plurality of “profile names” 43b corresponding to a plurality of target boards. In applying this clustering method, when a group consisting of a plurality of "profile names" 43b is to be compared, well-known methods such as the shortest distance method, the longest distance method, and the group averaging method are used as the representative points of the groups. May be appropriately selected from, and is not limited to a particular method.

  It is to be noted that this grouping is required to satisfy the grouping conditions described below. This grouping condition is included in the grouping data 44 stored in the storage unit 31. First, the condition is that the temperature difference at each measurement point shown in FIG. 3 is within a predetermined temperature range set in advance. That is, each time the “profile name” 43b that is sequentially combined into the same group by clustering is specified, the reflow temperature profile defined in the “profile name” 43b and the other “profile name” 43b already grouped together. It is determined whether the temperature difference at each measurement point from the specified reflow temperature profile is within the range that can be handled as the same group. That is, here, as a criterion for determining the similarity of the reflow conditions, a determination item whether the temperature difference of the reflow temperature profile is within a predetermined range is included.

  In addition to the similarity of the reflow temperature profile described above, the types of components required for producing a plurality of types of boards grouped into the same group can be arranged in the component supply unit 7 of the component mounting apparatuses M5 and M6. It is determined whether the maximum number of arrangements is exceeded. That is, each time the "profile name" 43b to be sequentially combined into the same group by clustering is specified, the board type corresponding to the "profile name" 43b may be added to other board types already grouped. It is determined whether or not all the component types required for manufacturing the board type in the group can be arranged in the component supply units 7 of the component mounting apparatuses M5 and M6.

  Then, in the process of sequentially adding new “profile names” 43b based on the degree of similarity and combining them, it is checked each time whether or not the above two grouping conditions are satisfied, and grouping is performed. When the condition is not satisfied, the grouping process for the one group is completed. For example, in the example shown in FIG. 6, the board types A and B whose "profile name" 43b corresponds to two profile names [A] and [B] are grouped into one group.

  Next, among the target plural types of boards, the remaining “profile names” 43b that have not been grouped into the above-described one group are grouped by the same method as described above. In the example shown in FIG. 6, it corresponds to two profile names of [D] and [E] among [C], [D] and [E] excluding [A] and [B] which are already grouped. The board types D and E to be processed are grouped into other groups. As a result, the five types of board types A to E are grouped into three groups: (board types A and B), (board types D and E), and (board type C). Here, for convenience of explanation, an example in which there are five types of board types has been described, but in reality, more types of board types than this are targeted.

  Next, the arrangement of the component supply means in each of the groups described above is determined (ST3). That is, for each of the plurality of groups divided in (ST2), the arrangement of the component supply means such as the tape feeder 9 for supplying the components necessary for the production of the board belonging to the group in the component mounting apparatuses M5 and M6. To decide. This component placement determination is performed by the component placement determination processing unit 30b included in the control unit 30 of the management device 3, and the determination result is stored in the storage unit 31 as the component placement data 45.

  In the above-described component placement determination process, an example in which the reflow temperature profile shown in FIG. 6 is used as the reflow condition has been shown, but the atmosphere in the reflow furnace 22 may be used as the reflow condition in combination with or independently of the reflow temperature profile. You may Specifically, for example, the grouping condition can be that the difference in the concentration of the gas that constitutes the atmospheric condition among the plurality of types of substrates falls within a predetermined concentration range. That is, in the component placement determination process shown in this embodiment, at least one of the reflow temperature profile and the atmosphere in the reflow furnace 22 is used as the reflow condition.

  In the above-described embodiment, the grouping condition has been described as an example in which the temperature difference of the reflow temperature and the concentration difference of the gas that constitutes the atmospheric condition fall within a predetermined range, but the grouping condition is not limited to this. For example, the time required for the reflow preparation for each of a plurality of types of substrates (the time until the temperature profile becomes stable and the atmospheric conditions are satisfied) is stored in the storage unit 31 of the management device 3, and this time is within a predetermined range. It may be a grouping condition. The time required for the reflow preparation for each of a plurality of types of boards here means the time required for the reflow preparation when performing the setup change between the boards to be grouped.

  That is, when the target boards are three kinds, that is, board kind A, board kind B, and board kind C, board kind A to board kind B, board kind B to board kind C, board kind B to board kind A, The board type C to the board type B and the board type C to the board type A indicate the time required for the reflow preparation for the setup change. The time required for reflow preparation for a plurality of types of boards may be acquired in advance before the production plan is executed, the time actually taken during production may be stored, or the value set virtually. May be used.

  As described above, in the component placement determination in the component mounting system 1 according to the present exemplary embodiment, the control processing function provided in the management device 3 determines a plurality of types of boards to be produced based on the similarity of the reflow conditions. The component supply means such as the tape feeder 9 is divided into a plurality of groups that can be produced without changing the arrangement of the component supply means, and the component supply means that supplies the components necessary for the production of the types of substrates belonging to each of the plurality of groups. The arrangement in the component mounting apparatuses M5 and M6 is determined. This makes it possible to minimize the preparation time required for adapting the reflow condition to the board type of the production target each time the board type is switched. Therefore, in a component mounting system that manufactures a plurality of types of mounting boards, it is possible to shorten the working time when switching the board type and improve the productivity.

  INDUSTRIAL APPLICABILITY The component placement determination method and management device of the present invention have the effect that in a component mounting system that produces a plurality of types of mounting boards, it is possible to shorten the work time when switching the board types and improve productivity. However, it is useful in the field of producing a mounting board by mounting electronic components on the board.

1 Component Mounting System 6 Board 7 Component Supply Section 9 Tape Feeder (Component Supply Means)
M5, M6 component mounting equipment M8 reflow equipment

Claims (2)

A method of deciding a component arrangement for deciding an arrangement of component supply means used for producing a plurality of types of boards in a component mounting apparatus,
Dividing the plurality of types of boards into a plurality of groups that can be produced without changing the arrangement of the component supply means, based on the time required for reflow preparation in each of the plurality of types of boards,
A component placement determining method, comprising: determining, in each of the plurality of groups, placement of the component feeding unit that feeds a component required to produce a board of a type belonging to the group in the component mounting apparatus. A management device connected to a component mounting device capable of arranging a plurality of component supply means via a network ,
A storage unit for storing the time for reflowing preparation in each of the substrate of several varieties,
Based on the time required for the reflow preparation, the plurality of types of boards are divided into a plurality of groups that can be produced without changing the arrangement of the component supply means, and each of the plurality of groups is classified into a type belonging to the group. And a control unit that determines the arrangement of the component supply means in the component mounting apparatus, which supplies the components necessary for the production of the board.

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