JP7245970B2 - COMPONENT MOUNTING APPARATUS AND MOUNTING BOARD MANUFACTURING METHOD - Google Patents

Description

The present invention relates to a component mounting apparatus for mounting components on a board and a method for manufacturing a mounted board.

In the component mounter, a mounting head that moves horizontally at high speed by means of a mounting head movement mechanism repeats the mounting operation of picking up components from a component supply device and mounting them on the board, thereby mounting a plurality of components on the board. Manufacture the substrate. In a component mounting apparatus, displacement of the mounting position of a component mounted on a board occurs due to fluctuations in the apparatus such as thermal deformation of a mounting head moving mechanism that occurs in the process of repeatedly executing mounting operations (see, for example, Patent Document 1). In the component mounting system described in Patent Document 1, a board on which all components have been mounted is transported to an inspection device arranged downstream of the component mounting device, and the inspection device measures the mounting positions of the components, based on the measurement results. The amount of correction is calculated by Then, when mounting a component on the next board, the component mounting apparatus mounts the component at the mounting position corrected based on this correction amount, thereby ensuring component mounting accuracy.

JP 2016-58604 A

By the way, in a substrate or the like composed of a plurality of individual substrates that are individually separated after component mounting, there are cases where a large number of components exceeding 10,000 in total are mounted. With such a board, the time required for the mounting work is long, and the state of the device may change during the mounting work, causing the displacement amount of the mounting position to fluctuate. However, in the prior art including that described in Patent Document 1, the correction amount is calculated based on the mounting positions of all the components that are measured after mounting all the components. There is a possibility that the state may not be reflected, and there is a problem that the mounting accuracy of the parts cannot be ensured.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a component mounting apparatus and a method for manufacturing a mounted board, which can accurately correct deviations in component mounting positions due to the influence of apparatus fluctuations.

A component mounting apparatus according to the present invention is a component mounting apparatus that mounts a plurality of components on a board by means of a mounting head, and when a predetermined number of components out of the plurality of components are mounted on the board by the mounting head, the inspection means for measuring mounting positions of the predetermined number of components mounted on the board; correction amount calculation means for calculating a correction amount of the mounting positions based on the measurement result by the inspection means; mounting position correcting means for correcting the mounting position of an unmounted component out of the plurality of components based on the above ; and input means for inputting the predetermined number; The unmounted component is mounted at the mounting position.
A component mounting apparatus according to the present invention is a component mounting apparatus that mounts a plurality of components on a board by means of a mounting head, and when a predetermined number of components out of the plurality of components are mounted on the board by the mounting head, the inspection means for measuring mounting positions of the predetermined number of components mounted on the board; correction amount calculation means for calculating a correction amount of the mounting positions based on the measurement result by the inspection means; an input for inputting a mounting position correcting means for correcting the mounting position of an unmounted component out of the plurality of components based on the base, and a continuous mounting time for continuously mounting the plurality of components on the substrate by the mounting head. means, and predetermined number calculation means for calculating the predetermined number based on the continuous mounting time, and the mounting head mounts the unmounted component at the corrected mounting position.
A component mounting apparatus according to the present invention is a component mounting apparatus that mounts a plurality of components on a board by means of a mounting head, and when a predetermined number of components out of the plurality of components are mounted on the board by the mounting head, the inspection means for measuring mounting positions of the predetermined number of components mounted on the board; correction amount calculation means for calculating a correction amount of the mounting positions based on the measurement result by the inspection means; mounting position correcting means for correcting the mounting position of an unmounted component out of the plurality of components, input means for inputting the number of times of correction per board, and based on the number of times of correction, and a predetermined number calculation means for calculating a predetermined number, wherein the mounting head mounts the unmounted component at the corrected mounting position.

A method for manufacturing a mounted board according to the present invention is a method for manufacturing a mounted board in which a plurality of components are mounted on a board by a component mounting apparatus that mounts a plurality of components on the board using a mounting head, wherein the mounting head mounts the plurality of components on the board. a first mounting step of mounting a predetermined number of components among the components on the substrate; an inspection step of measuring mounting positions of the predetermined number of components mounted on the substrate by an inspection means; a correction amount calculation step of calculating a correction amount of the mounting position based on the measurement result in; and correcting the mounting position of the unmounted non-mounted component among the plurality of components based on the calculated correction amount. A mounting position correcting step, a second mounting step of mounting the unmounted part at the corrected mounting position by the mounting head, and an inputting step of inputting the predetermined number .
A method for manufacturing a mounted board according to the present invention is a method for manufacturing a mounted board in which a plurality of components are mounted on a board by a component mounting apparatus that mounts a plurality of components on the board using a mounting head, wherein the mounting head mounts the plurality of components on the board. a first mounting step of mounting a predetermined number of components among the components on the substrate; an inspection step of measuring mounting positions of the predetermined number of components mounted on the substrate by an inspection means; a correction amount calculation step of calculating a correction amount of the mounting position based on the measurement result in; and correcting the mounting position of the unmounted non-mounted component among the plurality of components based on the calculated correction amount. a mounting position correcting step; a second mounting step of mounting the unmounted component at the corrected mounting position by the mounting head; and a continuous mounting time of continuously mounting a plurality of components on the substrate by the mounting head. and a predetermined number calculating step of calculating the predetermined number based on the input continuous wearing time.
A method for manufacturing a mounted board according to the present invention is a method for manufacturing a mounted board in which a plurality of components are mounted on a board by a component mounting apparatus that mounts a plurality of components on the board using a mounting head, wherein the mounting head mounts the plurality of components on the board. a first mounting step of mounting a predetermined number of components among the components on the substrate; an inspection step of measuring mounting positions of the predetermined number of components mounted on the substrate by an inspection means; a correction amount calculation step of calculating a correction amount of the mounting position based on the measurement result in; and correcting the mounting position of the unmounted non-mounted component among the plurality of components based on the calculated correction amount. a mounting position correcting step; a second mounting step of mounting the unmounted component at the corrected mounting position by the mounting head; an inputting step of inputting the number of corrections per board; and a predetermined number calculation step of calculating the predetermined number based on the number of corrections.

ADVANTAGE OF THE INVENTION According to this invention, the mounting position shift of components by the influence of an apparatus fluctuation|variation can be corrected with sufficient precision.

1 is a plan view showing the configuration of a component mounting apparatus according to one embodiment of the present invention; 1(a) shows a state before component mounting and (b) shows a state after component mounting of an example of a multi-panel board on which components are mounted in a component mounting apparatus according to an embodiment of the present invention. FIG. 1 is a block diagram showing the configuration of a control system of a component mounting apparatus according to one embodiment of the present invention; FIG. FIG. 4 is a diagram showing an example of an inspection condition setting screen displayed on a display unit provided in the component mounting apparatus according to one embodiment of the present invention; FIG. 1 is a flowchart of a method for manufacturing a mounting board according to one embodiment of the present invention; FIG. 2 is a plan view showing the configuration of a second example of a component mounting apparatus according to one embodiment of the present invention;

An embodiment of the present invention will be described in detail below with reference to the drawings. The configuration, shape, etc. described below are examples for explanation, and can be changed as appropriate according to the specifications of the component mounting apparatus. In the following, the same reference numerals are given to the corresponding elements in all the drawings, and redundant explanations are omitted. In FIG. 1 and a part described later, the two axial directions perpendicular to each other in the horizontal plane are the X direction of the substrate transfer direction (horizontal direction in FIG. 1) and the Y direction perpendicular to the substrate transfer direction (vertical direction in FIG. 1). is shown.

First, the configuration of a component mounting apparatus 1 will be described with reference to FIG. In FIG. 1, a substrate transfer mechanism 2 is installed in the X direction at the center of the base 1a. The substrate transport mechanism 2 transports the substrate 3 carried in from the upstream side in the X direction, and positions and holds it at a mounting work position by the mounting head described below. Further, the board transfer mechanism 2 carries out the board 3 on which the component mounting work is completed to the downstream side.

A component supply section 4 is installed on one side of the board transfer mechanism 2 (on the upper side in the drawing). A plurality of tape feeders 5 are mounted in the component supply section 4 in parallel in the X direction. The tape feeder 5 pitch-feeds the carrier tape in which pockets for storing components are formed in a direction (tape feeding direction) from the outside of the component supply unit 4 toward the substrate transport mechanism 2, whereby the mounting head picks up the components. Parts are supplied to the parts pick-up position.

In FIG. 1, a Y-axis table 6 having a linear driving mechanism is arranged at both ends in the X direction on the upper surface of the base 1a. Between the two Y-axis tables 6, a first beam 7A and a second beam 7B similarly provided with linear mechanisms are coupled so as to be movable in the Y direction. A mounting head 8 is mounted movably in the X direction on the first beam 7A on the component supply section 4 side. The mounting head 8 includes a plurality of suction units (not shown) that can move up and down while holding components by suction nozzles attached to the lower end.

The Y-axis table 6 and the first beam 7A constitute a mounting head moving mechanism 9 for moving the mounting head 8 in horizontal directions (X direction and Y direction). A mounting head moving mechanism 9 and a mounting head 8 pick up a component from the component picking position of the tape feeder 5 mounted in the component supply unit 4, and mount the component at the mounting position of the substrate 3 held by the substrate transport mechanism 2. Carry out the installation work. In the component mounting operation, the mounting head 8 moves above the component supply unit 4, picks up predetermined components with the respective suction nozzles, moves above the substrate 3, and mounts the components held by the respective suction nozzles. Repeat a series of wearing turns to implement in position.

In FIG. 1, the first beam 7A is equipped with a head camera 10 positioned on the lower surface side of the first beam 7A and moving integrally with the mounting head 8. As shown in FIG. As the mounting head 8 moves, the head camera 10 moves above the board 3 positioned at the mounting work position of the board conveying mechanism 2 and picks up a board mark (not shown) provided on the board 3 . to recognize the position of the substrate 3.

A component recognition camera 11 is installed between the component supply section 4 and the board transfer mechanism 2 . The component recognition camera 11 takes an image of the component held by the suction nozzle from below when the mounting head 8 that has taken out the component from the component supply unit 4 is positioned above the component recognition camera 11 . In the component mounting operation of the component on the board 3 by the mounting head 8, the mounting position is corrected in consideration of the recognition result of the board 3 by the head camera 10, the recognition result of the component by the component recognition camera 11, and the correction amount described later. will be In this manner, the component mounting apparatus 1 mounts a plurality of components on the substrate 3 using the mounting head 8 .

In FIG. 1, an inspection camera 12 is mounted movably in the X direction on the second beam 7B on the side opposite to the component supply section 4. As shown in FIG. The inspection camera 12 moves in the X and Y directions by driving the Y-axis table 6 and the second beam 7B. The inspection camera 12 takes an image of the component mounted on the board 3 held by the board transport mechanism 2 and inspects the mounted state. Thus, the inspection camera 12, the Y-axis table 6, and the second beam 7B constitute a mounting inspection section 13 for inspecting the mounting state of the components mounted on the board 3 held by the board transfer mechanism 2. FIG.

Next, with reference to FIGS. 2(a) and 2(b), an example of the substrate 3 on which components are mounted by the component mounting apparatus 1 will be described. 2A shows the board 3 before the component D is mounted, and FIG. 2B shows the board 3 after the component D is mounted. In FIG. 2A, the substrate 3 is formed with a plurality of individual substrates 3a (here, 12 pieces) on which a circuit pattern (not shown) including electrodes 3b to be joined to the terminals of the component D is formed. . As shown in FIG. 2B, the component D is mounted on the circuit pattern so that the electrode 3b and the terminal of the component D are joined. The board 3 on which all the components D are mounted is carried out from the component mounting apparatus 1 and separated into individual boards 3a. Thus, the substrate 3 is a multi-panel substrate including a plurality of individual substrates 3a.

Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to FIG. A control device 20 provided in the component mounting apparatus 1 includes a substrate transport mechanism 2, a component supply unit 4, a mounting head 8, a mounting head moving mechanism 9, a head camera 10, a component recognition camera 11, a mounting inspection unit 13, an input unit 14, A display unit 15 is connected. The input unit 14 is an input device such as a keyboard, touch panel, mouse, etc., and is used for inputting operation commands and data. The display unit 15 is a display device such as a liquid crystal panel, and displays various data stored in each storage unit, as well as an operation screen for operation by the input unit 14, a data input screen, and the like.

The control device 20 includes a mounting data storage section 21 , an inspection control section 22 , a mounting control section 23 , a correction amount calculation section 24 and a display processing section 25 . The mounting data storage unit 21 is a storage device, and stores production data 21a, inspection reference data 21b, measurement data 21c, mounting failure data 21d, correction amount data 21e, and the like. The production data 21a includes the production model name of the mounting board, the name (kind) of the component D to be mounted on the board 3, the size of the component D, the mounting position (XY coordinates), the mounting order, and the expected mounting work time. , the timing information of the wearing inspection, and the like. The mounting inspection timing information includes the number of corrections per substrate (number of mounting inspections), the number of consecutive mountings between mounting inspections, and the like.

In FIG. 3, the inspection reference data 21b is a reference for judging whether the mounting state of the component D mounted on the board 3 is good or bad, and includes information such as the allowable positional deviation amount and the allowable attitude. The inspection control unit 22 controls the mounting inspection unit 13 based on the mounting position and the inspection reference data 21b included in the production data 21a to determine the mounting position of the component D mounted on the board 3 (hereinafter referred to as "inspection mounting position"). ) is measured, and a wearing inspection is performed to inspect the wearing state. Based on the mounting inspection timing information included in the production data 21a, when a predetermined number of components D are mounted on the board 3, the inspection control unit 22 performs a mounting inspection on the components D mounted after the previous mounting inspection. to run.

That is, the mounting inspection unit 13 (the inspection camera 12, the Y-axis table 6, the second beam 7B) and the inspection control unit 22 are configured to mount some of the plurality of components D on the board 3 by the mounting head 8. It is an inspection means for measuring the mounting position of a part of the components D mounted on the substrate 3 when it is mounted. The inspection control unit 22 calculates an inspection mounting position (hereinafter referred to as "mounting position shift amount") with respect to the planned mounting position, and stores it in the mounting data storage unit 21 as measurement data 21c. Further, when the inspection control unit 22 detects a component D whose mounting state is defective, the inspection control unit 22 associates the information specifying the individual board 3a on which the component D is mounted, the mounting position, etc. 21.

In FIG. 3, the correction amount calculation unit 24 statistically processes the mounting position deviation amount of the component D mounted after the previous mounting inspection included in the measurement data 21c, and determines the mounting position when the component D is mounted on the board 3. Calculate the amount of correction for . As statistical processing, for example, an average of mounting position deviation amounts excluding abnormal data such as a poor mounting state or a mounting position deviation amount larger than a predetermined value is used.

That is, the correction amount calculation unit 24 is a correction amount calculation unit that calculates the correction amount of the mounting position based on the measurement result (measurement data 21c) by the inspection means (mounting inspection unit 13, inspection control unit 22). The calculated correction amount is stored in the mounting data storage unit 21 as the correction amount data 21e. Further, when old data is stored in the correction amount data 21e, it is updated to a newly calculated correction amount.

In FIG. 3, the mounting control section 23 has a mounting position correction section 23a as an internal processing section. The mounting control unit 23 controls the component supply unit 4, the mounting head 8, and the mounting head moving mechanism 9 based on the mounting position and the mounting order included in the production data 21a, and mounts the component D on the substrate 3. get the work done. The mounting position correcting unit 23a recognizes the position of the board 3 by the head camera 10, the recognition result of the component D held by the suction nozzle by the component recognition camera 11, and the correction amount data 21e during the component mounting work. Based on the correction amount, the mounting position when mounting the component D on the board 3 is corrected.

That is, the mounting position correction unit 23a is mounting position correcting means for correcting the mounting position of the unmounted component among the plurality of components D based on the calculated correction amount (correction amount data 21e). Then, the mounting head 8 mounts the unmounted component at the corrected mounting position. Further, the mounting control unit 23 does not mount the component D on the individual board 3a for which the mounting defect is detected, based on the information on the individual board 3a with the mounting defect included in the mounting defect data 21d. That is, when there is a defective component D in the measurement result (defective mounting data 21d) obtained by the inspection means, the mounting head 8 does not mount the unmounted component on the individual substrate 3a having the defective component D. FIG.

In FIG. 3, the display processing section 25 has a predetermined number calculation section 25a as an internal processing section. The display processing unit 25 causes the display unit 15 to display an inspection condition setting screen for setting the timing and number of mounting inspections to be performed during the mounting operation of mounting a plurality of components D on one substrate 3 . The timing and number of mounting inspections are appropriately set in consideration of the total number of components mounted on the board 3 (the number of mounted components), the mounting work time, the required mounting accuracy, and the like.

Here, an example of the inspection condition setting screen displayed on the display unit 15 by the display processing unit 25 will be described with reference to FIG. A production model setting frame 30, an inspection condition setting frame 31, an inspection timing display frame 32, a calculation button 33, and an enter button 34 are displayed on the display screen 15a of the display unit 15 shown in FIG.

The production model setting frame 30 has columns for production model name, number of mounted parts, and expected mounting work time. A pull-down button 30a is provided in the production model name column. By operating the pull-down button 30a using the input unit 14, a production model list is displayed, and a production model name can be selected. Here, "AA002" is selected as the production model name. When the production model name is selected, the display processing unit 25 acquires the number of parts to be installed and the estimated installation work time included in the production data 21 a and displays them in the production model setting frame 30 . In this example, the number of parts to be mounted is 11568, and the expected mounting work time is 19.3 minutes.

In FIG. 4, the inspection condition setting frame 31 has columns for maximum continuous mounting number, maximum continuous mounting time, and number of corrections. The maximum continuous mounting number is the maximum number of parts that can be mounted between mounting inspections. The maximum continuous wearing time is the maximum continuous wearing time that can be worked between wearing tests. The number of times of correction is the number of mounting inspections performed during the mounting operation of one substrate 3 . Up-down buttons 31a are provided in the columns of maximum continuous mounting number, maximum continuous mounting time, and number of corrections, respectively. By operating the pull-down button 30a using the input unit 14, it is possible to change (increase or decrease) the numbers entered in the columns of the maximum number of continuous wearing, the maximum continuous wearing time, and the number of times of correction.

That is, the input unit 14, the display unit 15, and the display processing unit 25 select a predetermined number of components D (a part of the plurality of components D) to be mounted on the board 3 between mounting inspections. Input means for inputting a predetermined number. Further, the continuous mounting time for continuously mounting a plurality of components D on the board 3 by the mounting head 8 is input by the input means. Further, the number of corrections (the number of mounting inspections) per board is input by the input means.

In FIG. 4, when the calculation button 33 is operated, the predetermined number calculation unit 25a calculates the number of times of correction (number of times of wearing inspection), the number of consecutive wearing times, and the expected contact wearing time that satisfy the conditions input in the inspection condition setting frame 31. calculate. It should be noted that the inspection condition setting frame 31 does not need to provide all the columns for the maximum number of continuous attachments, the maximum continuous attachment time, and the number of times of correction, and at least any one of the columns is sufficient.

Moreover, it is not necessary to use all the conditions displayed in the inspection condition setting frame 31 when the predetermined number calculation unit 25a calculates the number of times of correction, the number of consecutive wearing times, and the expected contact wearing time. For example, when the calculation button 33 is operated in FIG. An expected contact wearing time may be calculated. As described above, the predetermined number calculation unit 25a is a predetermined number calculation unit that calculates a predetermined number (continuous wearing number) based on the continuous wearing time. Further, the predetermined number calculation unit 25a is a predetermined number calculation means for calculating a predetermined number (the number of continuous wearing) based on the number of times of correction (the number of times of wearing inspection).

When the number of times of correction, the number of consecutive wearing times, and the expected contact wearing time are calculated, the timing of the wearing inspection is displayed in the inspection timing display frame 32 . Specifically, the examination timing display frame 32 displays the examination number, the number of continuous wearing, and the expected continuous wearing time. In this example, the first placement inspection is performed after 3876 parts D have been placed (expected continuous placement time is 6.5 minutes), and then after 3852 parts D have been placed (expected continuous placement time is 6.4 minutes), and after mounting 3840 parts D (estimated continuous mounting time is 6.4 minutes), the third mounting test is performed. The timing of inspection is calculated.

In FIG. 4, when the decision button 34 is operated, the timing of the wearing inspection displayed in the inspection timing display frame 32, that is, the number of times of correction calculated by the predetermined number calculation unit 25a, the number of continuous wearing, and the expected contact wearing time are displayed. is stored in the production data 21a. By using the inspection condition setting screen in this way, it is possible to easily set the timing of the mounting inspection for one substrate 3 .

Next, along with the flow of FIG. 5, a method for manufacturing a mounting board in which a component D is mounted on the board 3 by the component mounting apparatus 1 will be described. Here, the number of times of correction (3 times) and the number of continuous mountings (3876, 3852, 3840) between mounting inspections are set so as to match the timing of the mounting inspection displayed in the inspection timing display frame 32 of FIG. It is assumed that it is stored in the production data 21a. It is also assumed that the initial value of the correction amount is stored in the correction amount data 21e.

In FIG. 5, first, the board 3 loaded by the board transport mechanism 2 is transported to the mounting work position and held (ST1: board loading step). Next, the mounting position correction unit 23a mounts based on the recognition result of the position of the board 3 by the head camera 10, the recognition result of the component D held by the suction nozzle by the component recognition camera 11, and the correction amount included in the correction amount data 21e. The position is corrected (ST2: mounting position correction step). Next, the mounting control unit 23 controls the mounting head 8 and the mounting head moving mechanism 9 to mount the component D at the corrected mounting position of the board 3 (ST3: component mounting step).

Next, the mounting control unit 23 determines whether or not the set number of continuously mounted parts D (predetermined number of parts D) has been mounted (ST4). If the predetermined number of components D have not been mounted (No in ST4), the process returns to the mounting position correction step (ST2) and the next component D is mounted (ST3). That is, the mounting turns (ST2, ST3) are repeatedly executed until a predetermined number of parts D are mounted. When a predetermined number of components D (here, 3876 pieces) have been mounted (Yes in ST4), the inspection control unit 22 controls the mounting inspection unit 13 so that a plurality of components D (11568 pieces) to be mounted on the board 3 ), the mounting positions of some of the components D (3876 pieces) are measured, and the amount of mounting position deviation is calculated (ST5: inspection step).

That is, in the inspection step (ST5), the inspection means measures the mounting positions of some of the components D mounted on the substrate 3, and calculates the amount of mounting position deviation. The calculated mounting position deviation amount is stored in the mounting data storage unit 21 as the measurement data 21c. Also, the mounting state of the component D is inspected in the inspection step (ST5). When a mounting defect is detected, the mounting data storage unit 21 stores information on the component D with the mounting defect and the individual board 3a with the mounting defect as the mounting defect data 21d. In this way, in the component mounting process (ST3) executed up to the first inspection process (ST5), some of the plurality of components D (3876 pieces) are placed on the board 3 by the mounting head 8. This is the first mounting step of mounting.

In FIG. 5, the correction amount calculator 24 then calculates the correction amount of the mounting position based on the measurement result (measurement data 21c) in the inspection step (ST5) (ST6: correction amount calculation step). The calculated correction amount is stored in the mounting data storage unit 21 as the correction amount data 21e (or updated to the calculated correction amount). Next, the mounting control section 23 determines whether or not all the components D have been mounted on the board 3 (ST7).

If there is an unmounted component D (No in ST7), the process returns to the mounting position correction step (ST2) and the unmounted component is mounted (ST3). That is, in the mounting position correction step (ST2), based on the calculated correction amount (correction amount data 21e), the number of unmounted parts (here, 3852 parts) among the plurality of parts (11568 parts) is determined. The mounting position is corrected and mounted on the board 3 in the component mounting step (ST3). As a result, it is possible to accurately correct the displacement of the mounting position of the component D due to the influence of device fluctuations. After the first inspection process (ST5), the second inspection process (ST5) is executed when the set unmounted parts (3852 pieces) are mounted.

That is, in the component mounting process (ST3) executed by the second inspection process (ST5) after the first inspection process (ST5), the unmounted parts (3852 pieces) are placed in the corrected mounting position by the mounting head 8. ) is the second mounting step. In the second mounting process, if there is a defective component D in the measurement result (defective mounting data 21d) in the first inspection process (ST5), the mounting head 8 moves the individual substrate 3a on which the defective component D is present. Do not attach unattached parts to As a result, it is possible to reduce the number of parts D that are wastefully discarded after being mounted on the individual board 3a with mounting defects, and also to shorten the mounting time.

In FIG. 5, when the second inspection step (ST5) is finished, the second correction value calculation step (ST6) is executed to update the correction amount (correction amount data 21e). If there are further unmounted parts D (No in ST7), the process returns to the mounting position correction step (ST2) and all remaining unmounted parts (here, 3840 pieces) are mounted (third component mounting step (ST3)). Then, the third inspection step (ST5) and the third correction value calculation step (ST6) are performed. In this example, the set number of corrections (the number of inspection steps) is 3, and all the components D have been mounted on the substrate 3 (Yes in ST7), so the components D have been mounted by the substrate transport mechanism 2. The substrate 3 is unloaded (ST8: substrate unloading step).

Next, if the production of the planned mounting board has not been completed (No in ST9), the process returns to the board carrying-in step (ST1), and the component mounting operation for the next board 3 is performed. In the first mounting position correction step (ST2) for the next substrate 3, the correction amount (correction amount data 21e) calculated in the third correction value calculation step (ST6) for the previous substrate 3 is used. When the planned number of mounting boards is produced (Yes in ST9), the manufacturing of the mounting boards is completed.

As described above, in the component mounting apparatus 1 of the present embodiment, after some of the plurality of components D are mounted on the board 3 by the mounting head 8 , some of the components D mounted on the board 3 are mounted on the board 3 . Inspection means (mounting inspection unit 13, inspection control unit 22) for measuring the mounting position of component D, and correction amount calculation means (correction Mounting position correcting means (mounting position correcting unit 23a) and. Then, the mounting head 8 mounts the unmounted component at the corrected mounting position. As a result, it is possible to accurately correct the displacement of the mounting position of the component D due to the influence of device fluctuations.

Next, with reference to FIG. 6, a second example of the component mounting apparatus of this embodiment (hereinafter referred to as "second component mounting apparatus 16") will be described. The second component mounting apparatus 16 has a component supply section 4 with a plurality of tape feeders 5 mounted on both sides of the substrate transport mechanism 2 and a component recognition camera 11. Instead of the inspection camera 12, the second beam 7B It differs from the component mounting apparatus 1 in that a mounting head 8 and a head camera 10 are mounted. Hereinafter, the description of the parts common to the component mounting apparatus 1 will be omitted, and the different parts will be described. For convenience of explanation, among the mechanisms for horizontally moving the two mounting heads 8, the Y-axis table 6 and the first beam 7A are referred to as the first mounting head moving mechanism 9A, the Y-axis table 6 and the second beam. 7B is called a second mounting head moving mechanism 9B.

In FIG. 6, in the component mounting operation (component mounting step (ST3)), the second component mounting apparatus 16 moves the mounting head 8 mounted on the first mounting head moving mechanism 9A and the second mounting head moving mechanism 9A. The component D is mounted on the substrate 3 by alternately using the mounting heads 8 mounted on the 9B. In the mounting inspection (inspection step (ST5)), either the head camera 10 mounted on the first mounting head moving mechanism 9A or the head camera 10 mounted on the second mounting head moving mechanism 9B is used. Then, the component D mounted on the substrate 3 is imaged.

That is, in the second component mounting apparatus 16, the head camera 10, the first mounting head moving mechanism 9A and the inspection control unit 22, or the head camera 10, the second mounting head moving mechanism 9B and the inspection control unit 22, It is an inspection means for measuring the mounting position of the component D mounted on the 3. In the mounting inspection, it is desirable to use the head camera 10 that moves integrally with the mounting head 8 different from the mounting head 8 on which the component D was mounted immediately before. This can suppress the influence of thermal deformation of the mounting head moving mechanism (the first mounting head moving mechanism 9A or the second mounting head moving mechanism 9B) that causes an error in the measurement result.

INDUSTRIAL APPLICABILITY The component mounting apparatus and the method for manufacturing a mounting board according to the present invention have the effect of being able to accurately correct component mounting position deviations due to the influence of fluctuations in the apparatus, and are useful in the field of mounting components on boards.

REFERENCE SIGNS LIST 1 component mounting device 3 substrate 3a individual substrate 8 mounting head 9 mounting head moving mechanism (inspection means)
9A First mounting head moving mechanism (inspection means)
9B Second mounting head moving mechanism (inspection means)
10 head camera (inspection means)
12 inspection camera (inspection means)
16 Second component mounting device (component mounting device)
D parts

Claims (8)

A component mounting apparatus that mounts a plurality of components on a substrate with a mounting head,
inspection means for measuring mounting positions of the predetermined number of components mounted on the board when the mounting head mounts a predetermined number of the components on the board;
correction amount calculation means for calculating a correction amount of the mounting position based on the measurement result by the inspection means;
mounting position correcting means for correcting a mounting position of an unmounted component among the plurality of components based on the calculated correction amount;
and input means for inputting the predetermined number ,
The component mounting apparatus, wherein the mounting head mounts the unmounted component at the corrected mounting position. A component mounting apparatus that mounts a plurality of components on a substrate with a mounting head,
inspection means for measuring mounting positions of the predetermined number of components mounted on the board when the mounting head mounts a predetermined number of the components on the board;
correction amount calculation means for calculating a correction amount of the mounting position based on the measurement result by the inspection means;
mounting position correcting means for correcting a mounting position of an unmounted component among the plurality of components based on the calculated correction amount;
input means for inputting a continuous mounting time during which the mounting head continuously mounts a plurality of components on the substrate;
a predetermined number calculation means for calculating the predetermined number based on the continuous wearing time,
The component mounting apparatus, wherein the mounting head mounts the unmounted component at the corrected mounting position. A component mounting apparatus that mounts a plurality of components on a substrate with a mounting head,
inspection means for measuring mounting positions of the predetermined number of components mounted on the board when the mounting head mounts a predetermined number of the components on the board;
correction amount calculation means for calculating a correction amount of the mounting position based on the measurement result by the inspection means;
mounting position correcting means for correcting a mounting position of an unmounted component among the plurality of components based on the calculated correction amount;
input means for inputting the number of times of correction per substrate;
a predetermined number calculation means for calculating the predetermined number based on the number of corrections,
The component mounting apparatus, wherein the mounting head mounts the unmounted component at the corrected mounting position. The substrate comprises a plurality of individual substrates,
4. The method according to any one of claims 1 to 3, wherein, when a result of measurement by said inspecting means includes a defective component, said mounting head does not mount said unmounted component on said individual substrate having said defective component. component mounting equipment. A method for manufacturing a mounting board in which components are mounted on the board by a component mounting apparatus that mounts a plurality of components on the board by means of a mounting head,
a first mounting step of mounting a predetermined number of components among the plurality of components on the substrate by the mounting head;
an inspection step of measuring mounting positions of the predetermined number of components mounted on the substrate by an inspection means;
a correction amount calculation step of calculating a correction amount of the mounting position based on the measurement result in the inspection step;
a mounting position correcting step of correcting a mounting position of an unmounted component among the plurality of components based on the calculated correction amount;
a second mounting step of mounting the unmounted component at the corrected mounting position by the mounting head;
and an input step of inputting the predetermined number . A method for manufacturing a mounting board in which components are mounted on the board by a component mounting apparatus that mounts a plurality of components on the board by means of a mounting head,
a first mounting step of mounting a predetermined number of components among the plurality of components on the substrate by the mounting head;
an inspection step of measuring mounting positions of the predetermined number of components mounted on the substrate by an inspection means;
a correction amount calculation step of calculating a correction amount of the mounting position based on the measurement result in the inspection step;
a mounting position correcting step of correcting a mounting position of an unmounted component among the plurality of components based on the calculated correction amount;
a second mounting step of mounting the unmounted component at the corrected mounting position by the mounting head;
an input step of inputting a continuous mounting time for continuously mounting a plurality of components on a substrate by the mounting head;
a predetermined number calculating step of calculating the predetermined number based on the input continuous mounting time. A method for manufacturing a mounting board in which components are mounted on the board by a component mounting apparatus that mounts a plurality of components on the board by means of a mounting head,
a first mounting step of mounting a predetermined number of components among the plurality of components on the substrate by the mounting head;
an inspection step of measuring mounting positions of the predetermined number of components mounted on the substrate by an inspection means;
a correction amount calculation step of calculating a correction amount of the mounting position based on the measurement result in the inspection step;
a mounting position correcting step of correcting a mounting position of an unmounted component among the plurality of components based on the calculated correction amount;
a second mounting step of mounting the unmounted component at the corrected mounting position by the mounting head;
an input step of inputting the number of corrections per substrate;
and a predetermined number calculating step of calculating the predetermined number based on the inputted number of corrections. The substrate comprises a plurality of individual substrates,
6. When a measurement result in said inspection step includes a defective component, said mounting head does not mount said unmounted component on said individual substrate having said defective component in said second mounting step. 8. The method of manufacturing a mounting substrate according to any one of 1 to 7.

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