JPWO2014024368A1 - Mounting device, mounting head replacement method and substrate manufacturing method - Google Patents

Abstract

The mounting apparatus according to the present technology includes a head support unit, a moving mechanism, and a control unit. The head support portion can support a mounting head for mounting an electronic component on a substrate, and the supported mounting head can be replaced with another mounting head. The moving mechanism moves the head support portion in the height direction. The control unit adjusts the height of the mounting head by adjusting the height of the head support unit by the moving mechanism when the mounting head is replaced. Thereby, workability | operativity when exchanging a mounting head can be improved.

Description

  The present technology relates to a technology such as a mounting apparatus for mounting electronic components on a substrate.

  2. Description of the Related Art Conventionally, mounting apparatuses that mount various electronic components such as resistors and capacitors on a substrate are widely known. In general, this type of mounting apparatus uses a suction nozzle to suck and hold a transport unit that transports a substrate, a supply unit that supplies electronic components, and an electronic component that is supplied from the supply unit. Including the mounting head mounted above.

  Currently, there are various types of mounting heads. A mounting apparatus in which such various mounting heads are configured to be replaceable with respect to the mounting apparatus is known (for example, see Patent Document 1). Thus, by making the mounting head replaceable, for example, the mounting head can be replaced according to the type of the substrate.

JP 2003-218589 A

  By the way, the mounting head moves the suction nozzle of the mounting head in the vertical direction to hold the electronic component in the supply unit or mount the electronic component on the substrate. Therefore, the closer the distance from the upper surface of the substrate to the tip of the suction nozzle, the higher the mounting speed of the electronic component. That is, the mounting position of the electronic component is improved when the height position of the mounting head is lower.

  However, if the height position of the mounting head is set low, there is a problem that when the mounting head is replaced, the conveyance unit, the supply unit, and the like become obstructive and workability is poor. In the worst case, the mounting head may come into contact with the transport unit or the supply unit, resulting in damage.

  In view of the circumstances as described above, an object of the present technology is to provide a technology such as a mounting device that can improve workability when a mounting head is replaced.

The mounting apparatus according to the present technology includes a head support unit, a moving mechanism, and a control unit.
The head support portion can support a mounting head for mounting an electronic component on a substrate, and the supported mounting head can be replaced with another mounting head.
The moving mechanism moves the head support portion in the height direction.
The control unit adjusts the height of the mounting head by adjusting the height of the head support unit by the moving mechanism when the mounting head is replaced.

  In this mounting apparatus, the height of the mounting head can be adjusted when the mounting head is replaced. Accordingly, when exchanging the mounting head, the mounting head can be moved to an appropriate height position, so that workability at the time of exchanging the mounting head can be improved.

  In the mounting apparatus, the head support unit may replace the supported mounting head with another mounting head of a different type.

  In the mounting apparatus, the control unit determines the type of the mounting head that is newly supported by the head support unit by replacement, and when the electronic component is mounted on the substrate, the type of the mounting head The height of the mounting head may be adjusted to a height according to the above.

  Thereby, various mounting heads can be adjusted to an appropriate height, and an electronic component can be mounted on the substrate by the mounting head adjusted to the appropriate height.

In the mounting apparatus, the mounting head may include a memory in which a type of the mounting head is stored.
In this case, the control unit may determine the type of the mounting head by reading the type of the mounting head from the memory of the mounting head that is newly supported by the head support unit by replacement.

  Thereby, the control part can discriminate | determine the kind of mounting head appropriately.

In the mounting apparatus, the mounting head may include a recording medium on which the type of the mounting head is recorded.
In this case, the mounting apparatus reads information on the type of the mounting head from the recording medium of the mounting head that is newly supported by the head support by replacement, and sends the information on the type of the mounting head to the control unit. You may further comprise the reading part to output.

  Thereby, the control part can discriminate | determine the kind of mounting head appropriately.

  In the mounting apparatus, the control unit may adjust the height of the mounting head to a constant height regardless of the type of the mounting head when the mounting head is replaced.

  As a result, the operator can replace the mounting head with good workability regardless of the type of mounting head.

A mounting head replacement method according to an embodiment of the present technology can support a mounting head for mounting an electronic component on a substrate, and the supported head can be replaced with another mounting head. Adjusting the height to adjust the height of the mounting head.
After the height of the mounting head is adjusted, the mounting head supported by the head support portion is replaced with the other mounting head.

The substrate manufacturing method according to the present technology is capable of supporting a mounting head for mounting an electronic component on a substrate, and is capable of replacing the mounted mounting head with another mounting head. Adjusting the height of the mounting head.
After the height of the mounting head is adjusted, the mounting head supported by the head support portion is replaced with the other mounting head.
The electronic component is mounted on the substrate by the mounting head newly supported by the head support portion by replacement.

  As described above, according to the present technology, it is possible to improve workability when replacing the mounting head.

It is a front view showing a mounting device concerning one embodiment of this art. It is a side view of a mounting apparatus. It is a top view of a mounting apparatus. It is a block diagram which shows the structure of a mounting apparatus. It is a figure which shows a mode when a mounting head is replaced | exchanged. It is a figure which shows an example of the kind of mounting head. It is a figure which shows the operation | movement by the process of a mounting apparatus (control part), and the operation | movement by the replacement | exchange work of the mounting head by an operator. It is a figure which shows the height of a mounting head when a mounting head is replaced | exchanged.

  Hereinafter, embodiments according to the present technology will be described with reference to the drawings.

<First Embodiment>
[Overall Configuration of Mounting Device 100 and Configuration of Each Part]
FIG. 1 is a front view showing a mounting apparatus 100 according to the first embodiment of the present technology. FIG. 2 is a side view of the mounting apparatus 100, and FIG. 3 is a top view of the mounting apparatus 100. FIG. 4 is a block diagram illustrating a configuration of the mounting apparatus 100. FIG. 5 is a diagram illustrating a state when the mounting head 30 is replaced.

  As shown in these drawings, the mounting apparatus 100 includes a frame structure 10 and a transport unit 15 that is provided in the mounting apparatus 100 along the X-axis direction and transports the substrate 1 in the X-axis direction. Prepare. The mounting apparatus 100 is provided on both sides of the mounting apparatus 100 in the front-rear direction of the mounting apparatus 100 with the back-up unit 20 supporting the substrate 1 transported to a predetermined position by the transport unit 15 from below and the transport unit 15 therebetween. 2 is provided.

  The mounting apparatus 100 holds the electronic component 2 supplied from the supply unit 25, mounts the held electronic component 2 on the substrate 1, and a head moving mechanism that moves the mounting head 30 in the XYZ directions. 40.

  Referring to FIG. 4, mounting device 100 further includes control unit 3, storage unit 4, display unit 5, input unit 6, imaging unit 7, communication unit 8, air compressor 9, and the like.

  The frame structure 10 (see FIG. 1 to FIG. 3) includes a base 11 provided at the bottom, four vertical frames 12 fixed to the base 11, and an upper portion of the vertical frame 12 along the X-axis direction. It has two horizontal frames 13 passed.

  The conveyance part 15 (refer FIG.2, FIG3, FIG.4) contains the guide 16 arrange | positioned along the X-axis direction, and the conveyor belt 17 provided in the inner surface side of the guide 16. As shown in FIG. The conveyance unit 15 drives the conveyor belt 17 to carry the substrate 1 and position it at a predetermined position, or discharge the substrate 1 on which the electronic component 2 has been mounted. The guide 16 is formed so that the upper end portion is bent inward, and the upper end portion of the guide can support the substrate 1 from above when the substrate 1 is moved upward by the backup unit 20. it can.

  The backup unit 20 (see FIG. 2) includes a backup plate 21, a plurality of support pins 22 erected on the backup plate 21, and a plate lifting mechanism 23 that lifts and lowers the backup plate 21.

  When the board 1 on which the electronic component 2 is scheduled to be mounted is transported to a predetermined position by the transport unit 15, the backup plate 21 is moved upward by the plate lifting mechanism 23. Thereby, the board | substrate 1 is pinched | interposed between the backup part 20 and the upper end part of the guide 16, and the board | substrate 1 is fixed to a predetermined position. In this state, the electronic component 2 is mounted on the substrate 1.

  The supply unit 25 (see FIGS. 1 to 4) includes a plurality of tape cassettes 26 arranged along the X-axis direction. The tape cassette 26 can be attached to and detached from the mounting apparatus 100, and stores a carrier tape (not shown) therein. Each of the tape cassettes 26 includes a reel around which the carrier tape is wound, and a feed mechanism that feeds the carrier tape by step feed.

  Inside the carrier tape, for example, electronic components 2 of the same type such as resistors, capacitors, inductors, and IC chips (ICs: Integrated Circuit) are housed. A supply window 27 is formed on the upper surface of the end of the tape cassette 26 (center side of the mounting apparatus 100), and the electronic component 2 is supplied to the mounting head 30 through the supply window 27.

  The head moving mechanism 40 (see FIGS. 1, 2, 4, and 5) includes a Y-axis moving mechanism 41 for moving the mounting head 30 in the Y-axis direction, the X-axis direction, and the Z-axis direction. A mechanism 44 and a Z-axis moving mechanism 51 are provided.

  The Y-axis moving mechanism 41 includes a Y-axis frame 42 spanned along the Y-axis direction with respect to the two horizontal frames 13 of the frame structure 10, and a Y-axis movement at a position below the Y-axis frame 42. And a Y-axis moving body 43 attached to the frame 42 so as to be movable in the Y-axis direction. The Y-axis moving mechanism 41 has a Y-axis driving unit for driving the Y-axis moving body 43 along the Y-axis direction.

  The X-axis moving mechanism 44 has a shape that is long in the X-axis direction. The X-axis frame 45 is attached to the side surface of the Y-axis moving body 43, and the X-axis frame 45 An X-axis moving body 46 attached to be movable in the X-axis direction. The X-axis moving mechanism 44 has an X-axis drive unit for driving the X-axis moving body 46 along the X-axis direction. Two rails 47 are provided in parallel on the side surface of the X-axis frame 45 along the X-axis direction, and a slide member 48 that can slide on the rail 47 is provided on the rail 47. . The X-axis moving body 46 is attached to the position of the side surface of the X-axis frame 45 via the rail 47 and the slide member 48.

  The Z-axis moving mechanism 51 can move to the position of the side surface of the X-axis moving body 46 in the Z-axis direction (height direction: direction perpendicular to the mounting surface of the substrate 1) with respect to the X-axis moving body 46. It has a head support 52 attached. Further, the Z-axis moving mechanism 51 has a Z-axis drive unit for driving the head support unit 52 along the Z-axis direction.

  Two rails 53 are provided in parallel along the Z-axis direction on the side surface of the X-axis moving body 46, and a slide member 54 that can slide on the rail 53 is provided on the rail 53. Yes. The head support 52 is attached to the position of the side surface of the X-axis moving body 46 via the rail 53 and the slide member 54.

  The head support portion 52 can support the mounting head 30 and can replace the supported mounting head 30 with another mounting head 30 of a different type. In the present embodiment, the head support portion 52 is configured such that the mounting head 30 can be exchanged between different types of mounting heads 30. However, the present invention is not limited to this, and the head support portion 52 may be configured such that the mounting heads 30 can be replaced only between the same type of mounting heads 30.

  Examples of the X-axis drive unit, the Y-axis drive unit, and the Z-axis drive unit include a ball screw drive mechanism, a belt drive mechanism, and a linear motor drive mechanism. The head moving mechanism 40 moves the mounting head 30 in the XY direction by driving the X-axis driving unit and the Y-axis driving unit, and moves the mounting head 30 in the Z-axis direction (height direction) by driving the Z-axis driving unit. : Move in a direction perpendicular to the mounting surface of the substrate 1).

  The mounting head 30 (see FIGS. 1 to 5) is detachable from the head support portion 52. The mounting head 30 includes a head housing 31, a base shaft 32 that is inclined in an oblique direction and is provided on the head housing 31, and a head portion 33 that is rotatably attached to the base shaft 32. In addition, the mounting head 30 includes a detachable portion 34 that is provided at a position on the side surface of the head housing 31 and that is detachable from the head support portion 52. Furthermore, the mounting head 30 includes a head control unit 35, a head storage unit 36, a turret driving unit 37, and a nozzle driving unit 38.

  The head portion 33 includes a turret 33a that is rotatably attached to the base shaft 32, and a plurality of suction nozzles 33b that are attached to the turret 33a at equal intervals along the circumferential direction of the turret 33a.

  The turret 33a is rotatable with the base shaft 32 disposed obliquely in the oblique direction as the center axis of rotation. The turret 33 a is rotated about the base shaft 32 by the drive of the turret driving unit 37.

  The suction nozzle 33b is attached to the turret 33a so that the axis of the suction nozzle 33b is inclined with respect to the central axis of rotation of the turret 33a. The suction nozzle 33b is supported to be movable along the axial direction with respect to the turret 33a, and the suction nozzle 33b is supported to be rotatable with respect to the turret 33a. The suction nozzle 33b is moved along the axial direction (vertical direction) at a predetermined timing or rotated around the axis at a predetermined timing by driving the nozzle driving unit 38.

  Among the plurality of suction nozzles 33b, the suction nozzle 33b located at the lowest position has its axis oriented in the vertical direction. Hereinafter, the position of the suction nozzle 33b in which the axis is oriented in the vertical direction is referred to as an operation position. By moving the suction nozzle 33b positioned at this operation position in the vertical direction, the electronic component 2 is sucked by the supply unit 25, or the electronic component 2 is mounted on the substrate 1. The suction nozzle 33b located at the operation position is sequentially switched by the rotation of the turret 33a.

  The suction nozzle 33b is connected to the air compressor 9 (see FIG. 4). The suction nozzle 33b can suck and desorb the electronic component 2 in accordance with the switching of the negative pressure and the positive pressure of the air compressor 9.

  The head control unit 35 receives a command from the control unit 3, and controls the respective units (head storage unit 36, nozzle drive unit 38, turret drive unit 37) of the mounting head 30 together with the control unit 3.

  The head storage unit 36 includes a non-volatile memory in which various programs necessary for the processing of the head control unit 35 are stored, and a volatile memory used as a work area of the head control unit 35. The head storage unit 36 stores information indicating the type of the head, so that the control unit 3 of the mounting apparatus 100 can determine which type of mounting head 30 currently mounted on the mounting apparatus 100. It is possible to recognize whether the mounting head 30 is.

  Referring to FIG. 5, the detachable portion 34 of the mounting head 30 includes a first connector 34a for supplying power and a first connector 34b for communication. On the other hand, the head support portion 52 includes a second connector 52a for power supply connected to the first connector 34a for power supply, and a second connector 52b for communication connected to the first connector 34b for communication. have. When the mounting head 30 is mounted on the head support portion 52, these connectors 34a, 34b, 52a, 52b are connected. As a result, power is supplied to the mounting head 30 and the mounting apparatus 100 and the mounting head 30 can communicate with each other.

  A convex first engaging portion 34c is provided at a lower position of the mounting / demounting portion 34 of the mounting head 30, and a first engaging portion 34c is provided at a lower position of the head support portion 52. A concave second engagement portion 52c is provided to engage with the second engagement portion 52c. When the mounting head 30 is replaced, the mounting head 30 is rotated with the first engagement portion 34c as the central axis of rotation.

  A lock mechanism 52 d for fixing the mounting head 30 to the head support 52 is provided at a position above the head support 52. The lock mechanism 52d includes a pivotable lever 52e and a convex first lock portion 52f that moves up and down in accordance with the movement of the pivoted lever 52e. A concave second lock portion 34d that engages with the first lock portion 52f on the head support portion 52 side is provided on the top of the mounting / demounting portion 34 of the mounting head 30.

  When the lever 52e is rotated downward, the first lock portion 52f is moved downward, the first lock portion 52f engages with the second lock portion 34d, and the locked state is established. Become. On the other hand, when the lever 52e is rotated upward, the first lock portion 52f is moved upward, and the locked state is released.

  The control part 3 (refer FIG. 4) is comprised by CPU (Central processing Unit), for example. The control unit 3 executes various calculations based on various programs stored in the storage unit 4 and controls each unit of the mounting apparatus 100 in an integrated manner. The processing of the control unit 3 will be described in detail later.

  The storage unit 4 (see FIG. 4) includes a nonvolatile memory in which various programs necessary for the processing of the control unit 3 are stored, and a volatile memory used as a work area for the control unit 3. The various programs may be read from a portable recording medium such as an optical disk or a semiconductor memory.

  The display unit 5 (see FIG. 4) includes a liquid crystal display, an EL (Electro-Luminescence) display, and the like, and displays various data related to the mounting apparatus 100 and operation icons for operating the mounting apparatus 100 on the screen. To display. The input unit 6 includes, for example, a touch sensor arranged on the screen, a hardware button, and the like, and inputs various instructions from the operator.

  The imaging unit 7 (see FIG. 4) is a variety of imaging units such as the imaging unit 7 that images the alignment mark provided on the substrate 1 and the imaging unit 7 that images the electronic component 2 adsorbed to the tip of the adsorption nozzle 33b. Part 7 is included. These imaging units 7 are provided, for example, in the head housing 31 of the mounting head 30 and move together with the mounting head 30 according to the movement of the mounting head 30. The imaging unit 7 includes, for example, an imaging element such as a charge coupled device (CCD) sensor or a complementary metal oxide semiconductor (CMOS) sensor, an imaging lens that forms an image on the imaging element, and the like.

  The communication unit 8 (see FIG. 4) transmits information to other devices in the mounting line, such as other mounting devices 100 and board inspection devices, and receives information from other devices.

"Type of mounting head 30"
As described above, the mounting apparatus 100 according to the present technology can replace the mounting head 30 supported by the head support portion 52. Here, an example of the type of the mounting head 30 will be described.

  FIG. 6 is a diagram illustrating an example of the type of the mounting head 30. FIG. 6 shows type A, type B, type C, and type D mounting heads 30 in order from the left. The mounting head 30 described above corresponds to the type B mounting head 30B in FIG. In FIG. 6, the height of the mounting head 30 when each type of mounting head 30 mounts the electronic component 2 is also shown.

  As with the type B mounting head 30B, the type A and type C mounting heads 30A and 30C are configured such that the head portion 33 is rotatable. However, the type A and C mounting heads 30A and 30C are different from the type B mounting head 30B in that the rotation axis of the head portion 33 faces the vertical direction. Unlike the other types of mounting heads 30, the type D mounting head 30 </ b> D does not rotate the head portion 33 itself, and has fewer suction nozzles 33 b than the other types of mounting heads 30.

  The type A mounting head 30A is a mounting head 30 for mounting the electronic component 2 having a relatively small size. The type B, type C, and type D mounting heads 30B, 30C, and 30D are mounting heads for mounting the electronic component 2 that is relatively larger in size than the electronic component 2 that is mounted by the type A mounting head 30A. 30.

  Each mounting head 30 moves the suction nozzle 33 b in the vertical direction, thereby holding the electronic component 2 on the supply unit 25 or mounting the electronic component 2 on the substrate 1. Therefore, the mounting speed of the electronic component 2 is faster when the distance from the upper surface of the substrate 1 to the tip of the suction nozzle 33b is shorter. Therefore, the mounting head 30A of type A for mounting the electronic component 2 smaller than the other mounting apparatus 100 is mounted at the time of mounting the electronic component 2 as compared with the mounting heads 30B, 30C, 30D of types B, C, and D. The height of the head 30 is set low. In the example here, the mounting heads 30B, 30C, and 30D of types B, C, and D have the same height of the mounting head 30 when the electronic component 2 is mounted.

  Each mounting head 30 has a detachable portion 34 on the side surface of the head housing 31. The configuration of the detachable portion 34 is common to each mounting head 30. Further, the height from the tip of the suction nozzle 33 b to the detachable part 34 is also common to each mounting head 30.

[Description of operation]
Next, the operation by the processing of the mounting apparatus 100 (control unit 3) and the operation by the replacement work of the mounting head 30 by the operator will be described. FIG. 7 is a diagram illustrating an operation by the processing of the mounting apparatus 100 (control unit 3) and an operation by an operator to replace the mounting head 30.

  First, the control unit 3 of the mounting apparatus 100 determines whether or not the start of replacement of the mounting head 30 has been notified from the operator via the input unit 6 (step 101). In this case, for example, the control unit 3 displays an exchange start button (icon) on the screen of the display unit 5 and determines whether an operation on the exchange start button is detected by the touch sensor (input unit 6).

  When the operator replaces the mounting head 30 supported by the head support unit 52 with another type of mounting head 30, the operator notifies the mounting apparatus 100 of the start of replacement of the mounting head 30 via the input unit 6. (Step 201). For example, the user touches a place where a replacement start button displayed on the screen is displayed.

  When the operator notifies the start of replacement of the mounting head 30 (YES in step 101), the control unit 3 adjusts the height of the mounting head 30 while moving the mounting head 30 to the replacement position (step 102). ). The replacement position is, for example, a position on the front side of the mounting apparatus 100 and a position where the operator can easily work.

  In step 102, the control unit 3 controls the X-axis moving mechanism 44 and the Y-axis moving mechanism 41 to move the mounting head 30 in the XY direction so that the mounting head 30 is moved to the replacement position in the XY plane. Move. In parallel with this operation, the control unit 3 controls the Z-axis moving mechanism 51 to adjust the height of the head support unit 52 and adjust the height of the mounting head 30.

  FIG. 8 is a diagram illustrating the height of the mounting head 30 when the mounting head 30 is replaced. As shown in FIG. 8, the height of the mounting head 30 (distance from the upper surface of the substrate 1 to the tip of the suction nozzle 33 b) when the mounting head 30 is replaced is set to a common height for each mounting head 30. ing. Therefore, when the head replacement button is touched by the operator and the mounting head 30 is replaced, the control unit 3 adjusts the height of the mounting head 30 to a constant height regardless of the type of the mounting head 30. In addition, since the height of the mounting head 30 at the time of head replacement is common, the height of the head support portion 52 at the time of head replacement is also common.

  6 and 8, typically, the height of the mounting head 30 when the mounting head 30 is replaced (common to each mounting head 30) is the mounting head when the electronic component 2 is mounted. The height is set higher than 30. However, the height of the mounting head 30 when the mounting head 30 is replaced does not necessarily need to be set higher than the height of the mounting head 30 when the electronic component 2 is mounted. For example, the height (common) of the mounting head 30 when the mounting head 30 is replaced is higher than the height when the mounting head 30A of type A mounts the electronic component 2, and the mounting heads of types B, C, and D 30B, 30C, and 30D may be set at positions lower than the height at which the electronic component 2 is mounted.

  When the mounting head 30 is moved to the replacement position and the height of the mounting head 30 is adjusted, the operator changes the mounting head 30 currently supported by the head support portion 52 to another type of mounting head 30. Exchange (step 202).

  As an example, it is assumed that an operator replaces a type A mounting head 30A with a type B mounting head 30B. At this time, first, the user operates the lever 52e of the lock mechanism 52d to release the locked state of the type A mounting head 30A, and then removes the type A mounting head 30A from the head support portion 52. At this time, since the type A mounting head 30A has been moved to an appropriate height, the operator can remove the type A mounting head 30A with good workability. In addition, the tip of the suction nozzle 33b of the mounting head 30A does not come into contact with other members such as the transport unit 15 and the supply unit 25, and damage does not occur.

  When the operator removes the type A mounting head 30 </ b> A from the head, the type B mounting head 30 </ b> B is attached to the head support 52. At this time, first, the operator uses the convex first engaging portion 34c provided on the lower side of the attaching / detaching portion 34 of the mounting head 30B to the concave second shape provided on the lower side of the head supporting portion 52. It is inserted and engaged with the engaging portion 52c. Then, the operator rotates the type B mounting head 30B with the first engagement portion 34c as a fulcrum, and presses the type B mounting head 30B toward the head support portion 52 side.

  At this time, the first connector 34a and the second connector 52a for power supply are connected, and power is supplied to the type B mounting head 30B. In addition, the first connector 34b and the second connector 52b for communication are connected, and the mounting apparatus 100 and the mounting head 30B can communicate with each other. When the operator presses the type B mounting head 30B toward the head support portion 52 side, the operator rotates the lever 52e of the lock mechanism 52d to place the type B mounting head 30B in the locked state.

  As described above, in this embodiment, the height of the mounting head 30 (the height of the head support portion 52) when the mounting head 30 is replaced is common to the mounting heads 30 of each type. Therefore, the operator can attach the type B mounting head 30B to the head support portion 52 with good workability. That is, the operator can attach the mounting head 30 to the head support 52 with good workability regardless of the type of the mounting head 30 newly attached to the head support 52.

  After moving the mounting head 30 to the replacement position, the control unit 3 of the mounting apparatus 100 determines whether the mounting head 30 has been replaced and a new mounting head 30 has been attached to the head support 52 (step 103). . When a new mounting head 30 is attached to the head support portion 52 (YES in step 103), the control unit 3 determines the type of the mounting head 30 newly attached to the head support portion 52 (step 104).

  In step 104, first, the control unit 3 transmits a read command signal for information on the type of the mounting head 30 to the head control unit 35. Upon receiving this signal, the head control unit 35 reads out information on the type of the mounting head 30 stored in the head storage unit 36 and transmits the information to the control unit 3. Thereby, the control part 3 can recognize the kind of the mounting head 30 newly attached.

  Next, the control unit 3 determines whether or not completion of replacement of the mounting head 30 has been notified from the operator via the input unit 6 (step 105). In this case, for example, the control unit 3 displays an exchange completion button (icon) on the screen of the display unit 5 and determines whether an operation on the exchange completion button is detected by the touch sensor (input unit 6).

  When the replacement of the mounting head 30 is completed, the operator notifies the mounting apparatus 100 of the replacement of the mounting head 30 via the input unit 6 (step 203). For example, the user touches a place where a replacement start button displayed on the screen is displayed.

  When the operator notifies the completion of the replacement of the mounting head 30 (YES in step 105), the control unit 3 proceeds to the next step 106. In step 106, the control unit 3 adjusts the height of the mounting head 30 to a height (see FIG. 6) corresponding to the type of the mounting head 30 while moving the mounting head 30 from the replacement position to the standby position (step 6). 102). The standby position may be any location as long as the mounting head 30 can easily restart the mounting operation, for example. The relationship (FIG. 6) between the type of the mounting head 30 and the height of the mounting head 30 is stored in the storage unit 4 in advance. When the mounting operation of the electronic component 2 is resumed, the mounting head 30 mounts the electronic component 2 on the substrate 1 at a height corresponding to the type of the mounting head 30.

<Various modifications>
In the above-described example, the case where the mounting head 30 supported by the head support portion 52 is replaced with a different type of mounting head 30 has been described. On the other hand, the mounting heads 30 can be exchanged between the same types of mounting heads 30. For example, the type A mounting head 30A can be replaced with another type A mounting head 30A. Even in this case, the workability when the mounting head 30 is replaced can be improved by adjusting the height of the mounting head 30 when the mounting head 30 is replaced. Further, it is possible to prevent the tip end portion of the suction nozzle 33b of the mounting head 30 from coming into contact with other members such as the transport unit 15 and the supply unit 25 and causing damage.

  In the example described above, the replacement start button and the replacement completion button are described as icons displayed on the screen. However, the replacement start button and the replacement completion button may be push-type hardware buttons.

  In the above example, as a method for the control unit 3 to recognize the type of the mounting head 30 newly attached to the head support unit 52, the control unit 3 uses the information on the type of the mounting head 30 stored in the head storage unit 36. The reading method has been described as an example. However, it is not limited to this method.

  As another method, for example, a recording medium storing the type of the mounting head 30 is provided on the mounting head 30 side, and further, a reading unit that reads information recorded on the recording medium and outputs the information to the control unit 3 Is provided on the mounting apparatus 100 side. Examples of the recording medium include a bar code and a non-contact type IC. Examples of the reading unit include a barcode reader and a non-contact IC reader. The reading unit is typically configured to be held by an operator and moved to the position of the recording medium.

  The recording medium may be provided anywhere on the mounting head 30 as long as it does not interfere with the recording medium. For example, the recording medium is provided on the side surface of the head casing 31. The position where the reading unit is provided may be obtained anywhere on the mounting apparatus 100 as long as it does not interfere with the reading unit. For example, the reading unit is provided on the head support unit 52.

  As another method, there is a form in which a sensor is provided on the surface of the detachable portion 34 on the head support portion 52 side on the mounting head 30 side. When the mounting head 30 is attached to the head support portion 52, this sensor is turned on. The position of the sensor differs for each type of mounting head 30. By determining the address of the I / O board connected to this sensor for each type of mounting head 30, the type of mounting head 30 can be determined.

This technique can also take the following composition.
(1) a head support portion capable of supporting a mounting head for mounting an electronic component on a substrate and exchanging the supported mounting head with another mounting head;
A moving mechanism for moving the head support in the height direction;
A mounting apparatus comprising: a control unit that adjusts the height of the mounting head by adjusting the height of the head support unit by the moving mechanism when the mounting head is replaced.
(2) The mounting device according to (1) above,
The head support section can replace the supported mounting head with another mounting head of a different type.
(3) The mounting device according to (2) above,
The control unit determines the type of the mounting head that is newly supported by the head support unit by replacement, and when the electronic component is mounted on the substrate, the height according to the type of the mounting head And a mounting device for adjusting the height of the mounting head.
(4) The mounting device according to (3) above,
The mounting head has a memory in which the type of the mounting head is stored,
The control unit reads the type of the mounting head from the memory of the mounting head that is newly supported by the head support unit by replacement, and determines the type of the mounting head.
(5) The mounting device according to (3) above,
The mounting head has a recording medium on which the type of the mounting head is recorded,
The mounting apparatus reads the information on the type of the mounting head from the recording medium of the mounting head that is newly supported by the head support by replacement, and outputs the information on the type of the mounting head to the control unit The mounting apparatus further comprising a unit.
(6) The mounting apparatus according to any one of (2) to (5) above,
The control unit adjusts the height of the mounting head to a constant height regardless of the type of the mounting head when the mounting head is replaced.
(7) Adjusting the height of a head support portion that can support a mounting head for mounting an electronic component on a substrate and replace the supported mounting head with another mounting head; Adjust the height of the mounting head,
After the height of the mounting head is adjusted, the mounting head supported by the head support portion is replaced with another mounting head.
(8) Adjusting the height of a head support portion that can support a mounting head for mounting an electronic component on a substrate and replace the supported mounting head with another mounting head; Adjust the height of the mounting head,
After the height of the mounting head is adjusted, the mounting head supported by the head support portion is replaced with the other mounting head,
A method for manufacturing a substrate, wherein the electronic component is mounted on the substrate by the mounting head newly supported by the head support portion by replacement.

DESCRIPTION OF SYMBOLS 1 ... Board | substrate 2 ... Electronic component 3 ... Control part 30, 30A, 30B, 30C, 30D ... Mounting head 33a ... Turret 33b ... Adsorption nozzle 34 ... Detachable part 35 ... Head control part 36 ... Head memory | storage part 40 ... Head moving mechanism 52 ... Head support part 100 ... Mounting device

Claims (8)

A head support part capable of supporting a mounting head for mounting an electronic component on a substrate and replacing the supported mounting head with another mounting head;
A moving mechanism for moving the head support in the height direction;
A mounting apparatus comprising: a control unit that adjusts the height of the mounting head by adjusting the height of the head support unit by the moving mechanism when the mounting head is replaced. The mounting apparatus according to claim 1,
The head support section can replace the supported mounting head with another mounting head of a different type. The mounting apparatus according to claim 2,
The control unit determines the type of the mounting head that is newly supported by the head support unit by replacement, and when the electronic component is mounted on the substrate, the height according to the type of the mounting head And a mounting device for adjusting the height of the mounting head. The mounting apparatus according to claim 3,
The mounting head has a memory in which the type of the mounting head is stored,
The control unit reads the type of the mounting head from the memory of the mounting head that is newly supported by the head support unit by replacement, and determines the type of the mounting head. The mounting apparatus according to claim 3,
The mounting head has a recording medium on which the type of the mounting head is recorded,
The mounting apparatus reads the information on the type of the mounting head from the recording medium of the mounting head that is newly supported by the head support by replacement, and outputs the information on the type of the mounting head to the control unit The mounting apparatus further comprising a unit. The mounting apparatus according to claim 2,
The control unit adjusts the height of the mounting head to a constant height regardless of the type of the mounting head when the mounting head is replaced. A height of a head support portion that can support a mounting head for mounting an electronic component on a substrate and that can replace the supported mounting head with another mounting head is adjusted. Adjust the height,
After the height of the mounting head is adjusted, the mounting head supported by the head support portion is replaced with another mounting head. A height of a head support portion that can support a mounting head for mounting an electronic component on a substrate and that can replace the supported mounting head with another mounting head is adjusted. Adjust the height,
After the height of the mounting head is adjusted, the mounting head supported by the head support portion is replaced with the other mounting head,
A method for manufacturing a substrate, wherein the electronic component is mounted on the substrate by the mounting head newly supported by the head support portion by replacement.

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