WO2022185428A1 - Substrate transfer apparatus and substrate transfer method - Google Patents
Substrate transfer apparatus and substrate transfer method Download PDFInfo
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- WO2022185428A1 WO2022185428A1 PCT/JP2021/008069 JP2021008069W WO2022185428A1 WO 2022185428 A1 WO2022185428 A1 WO 2022185428A1 JP 2021008069 W JP2021008069 W JP 2021008069W WO 2022185428 A1 WO2022185428 A1 WO 2022185428A1
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- 239000000758 substrate Substances 0.000 title claims abstract description 358
- 238000012546 transfer Methods 0.000 title claims abstract description 57
- 238000000034 method Methods 0.000 title claims description 13
- 238000001514 detection method Methods 0.000 claims abstract description 85
- 238000012544 monitoring process Methods 0.000 claims abstract description 30
- 230000032258 transport Effects 0.000 claims description 177
- 230000005856 abnormality Effects 0.000 claims description 22
- 238000000926 separation method Methods 0.000 claims description 8
- 230000007423 decrease Effects 0.000 claims description 7
- 230000007246 mechanism Effects 0.000 description 8
- 230000008859 change Effects 0.000 description 4
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- 238000004891 communication Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
Definitions
- the present specification relates to a substrate transport apparatus for transporting a substrate to a predetermined stop position on a transport path, and a substrate transport method.
- a board-oriented work machine includes a board transfer device.
- the substrate transport device transports the substrate loaded from the upstream side of the line to a predetermined stop position on the transport path, and transports the substrate after the substrate work is performed at the stop position to the downstream side of the line.
- Many substrate transfer apparatuses are equipped with a substrate passage sensor that detects the position of the substrate to be transferred. A technical example related to this type of substrate transfer apparatus is disclosed in Japanese Unexamined Patent Application Publication No. 2002-200013.
- the substrate detection sensor disclosed in Patent Document 1 compares the level of the received light signal with a first threshold value when determining "no substrate”, and determines "with substrate” when the level is equal to or lower than the first threshold. Further, the board detection sensor compares the level of the received light signal with a second threshold larger than the first threshold when determining that "there is a board”, and determines that the level is equal to or higher than the second threshold as "there is no board”. According to this, even if the board moves from a predetermined position due to vertical vibration after the determination of "board present", the determination of "board present” can be maintained, and erroneous determinations with respect to positional fluctuations of the board can be reduced. It is
- detection light is projected toward the substrate, and the presence or absence of the substrate is detected based on changes in the amount of passage or reflection of the detection light.
- the passing amount of detection light temporarily increases or the amount of reflection decreases in the gap, making it difficult to accurately detect the presence or absence of the substrate.
- a substrate having deformation such as warpage may cause an erroneous determination of the presence or absence of the substrate because the area that blocks the detection light may change as the substrate is transported.
- a timer was set to avoid the effects of temporary fluctuations in the amount of detected light passing through or reflected.
- the detection of the trailing edge of the substrate is delayed by the distance obtained by multiplying the timer time by the transport speed of the substrate. distance adjustment).
- the present specification aims to provide a board transfer apparatus and a board transfer method that can reduce the error stoppage of a work machine for a board due to a transfer abnormality and the decrease in accuracy of the stop position of the board. It should be an issue to be addressed.
- the present specification includes a transport unit that transports a substrate from a loading end of a transport path to a predetermined stop position, and a detection light directed toward the substrate passing through a specified position on the loading end side of the transport path relative to the stop position. and a substrate passage sensor that detects the presence or absence of the substrate at the specified position based on the amount of passage or reflection of the detection light; a setting unit for setting a future transport distance for transporting the substrate to the stop position when the detection result changes from "no substrate” through “substrate present” to “no substrate”; a monitoring unit for monitoring whether or not the detection result changes to "substrate present” again until reaching , and if the detection result changes to "substrate present” again, then the detection result changes to "substrate absent” and a resetting unit that resets the set transport distance and resets the future transport distance when the transport distance changes to .
- a transport unit that transports a substrate from the loading end of a transport path to a predetermined stop position, and a substrate that passes through a specified position on the loading end side of the transport path from the stop position.
- a substrate passage sensor that projects detection light and detects the presence or absence of the substrate at the specified position based on the amount of passage or reflection of the detection light, and controls the transport unit based on the detection result of the substrate passage sensor.
- the control unit changes the detection result from “no substrate” to “no substrate” via “substrate present” when the transport unit transports the substrate.
- a future transport distance for transporting the substrate to the stop position is set, and it is monitored whether the detection result changes to "substrate presence” again until the substrate reaches the stop position. , when the detection result changes to "substrate present” again, and when the detection result subsequently changes to "substrate absent", the set transport distance is reset and the future transport distance is set again.
- FIG. 1 is a plan view schematically showing a substrate transfer device according to a first embodiment
- FIG. 1 is a side view schematically showing a substrate transfer device according to a first embodiment
- FIG. 3 is a block diagram showing a control configuration of the substrate transfer device
- FIG. 10 is a plan view showing a state in which the rear end of a normal substrate reaches a specified position (carry-in end) of the transport path;
- FIG. 11 is a plan view showing a state in which a normal substrate reaches a stop position on the transport path and stops;
- FIG. 4 is a plan view showing a state before starting a transport operation of a broken substrate;
- FIG. 10 is a plan view showing a state in which the trailing edge of the small substrate piece on the front side of the broken substrate has reached a specified position (carry-in end) of the transport path;
- FIG. 10 is a plan view showing a state in which the front edge of the small piece substrate on the rear side of the broken substrate has reached a specified position (carry-in end) of the transport path;
- FIG. 10 is a plan view showing a state in which the rear end of the cracked substrate has reached a specified position (carry-in end) of the transport path;
- FIG. 4 is a plan view showing a state in which a broken substrate has reached a stop position on the transport path and stopped. It is a top view which shows typically the board
- FIG. 11 is a side view schematically showing a state in the middle of transporting a warped substrate in the second embodiment. It is a front view which shows typically the board
- FIG. 1 A solder printing machine or the like is arranged on the upstream side of the component mounting machine 1, and a substrate inspection machine or the like is arranged on the downstream side to constitute a work line for substrates.
- the direction from the left side to the right side of FIG. 1 is the X-axis direction for transporting the substrate K, and the direction from the bottom side (front side) to the top side (rear side) of the page is the Y-axis direction.
- the component mounting machine 1 is configured by assembling a board conveying device 2 , a component supply device 3 , a component transfer device 4 , a component recognition camera 49 , a control device 5 (see FIG. 4 ), and the like on a base 10 .
- the board transfer device 2 has a pair of guide rails 21 .
- the pair of guide rails 21 extend in the X-axis direction on the base 10 and are arranged parallel to each other and spaced apart in the Y-axis direction. The separation distance between the pair of guide rails 21 can be adjusted according to the width of the substrate K.
- a pair of guide rails 21 and a space therebetween constitute a transport path for the substrate K.
- the substrate conveying device 2 conveys the horizontally positioned substrate K from the carry-in end 22 of the guide rail 21 (conveyance path) to a predetermined stop position PS (see FIG. 2).
- a positioning mechanism (not shown) provided below the stop position PS positions and releases the substrate K. As shown in FIG. The details of the substrate transfer device 2 will be described later.
- the component supply device 3 is composed of a plurality of feeders 31 arranged side by side in the X-axis direction. Each feeder 31 sends out a carrier tape in which a large number of components are stored in a line toward a supply position 32 on the leading end side. A carrier tape provides a pickable supply of parts at a supply position 32 .
- the component transfer device 4 is composed of a Y-axis moving body 41, an X-axis moving body 42, a mounting head 43, an automatic tool 44, a suction nozzle 45, a board recognition camera 46, a side view camera 47, and the like.
- the Y-axis moving body 41 is driven by a linear motion mechanism to move in the Y-axis direction.
- the X-axis moving body 42 is mounted on the Y-axis moving body 41 and driven by the linear motion mechanism to move in the X-axis direction.
- the mounting head 43 is attached to a clamping mechanism (not shown) provided on the front surface of the X-axis moving body 42 and moves in two horizontal directions together with the X-axis moving body 42 .
- An automatic tool 44 is rotatably provided below the mounting head 43 .
- a plurality (12 in the example of FIG. 1) of suction nozzles 45 are exchangeably held below the automatic tool 44 .
- the suction nozzle 45 is driven by an elevation drive mechanism (not shown) to ascend and descend, and is selectively supplied with negative or positive pressure air from an air supply mechanism (not shown).
- the suction nozzle 45 sucks and holds the component from the supply position 32 of the component supply device 3 and mounts it on the substrate K.
- the mounting head 43, the automatic tool 44, and the suction nozzle 45 may be replaced by an operator or automatically. In the case of automatic replacement, a replacement station is provided on the upper surface of the base 10, and replacement equipment is prepared.
- the board recognition camera 46 is provided on the X-axis moving body 42 along with the mounting head 43 .
- the board recognition camera 46 is arranged with its optical axis directed downward, and images the position reference mark attached to the board K from above.
- the acquired image data is image-processed, and the stop position of the substrate K is obtained accurately.
- a side-view camera 47 is provided on the front side of the autotool 44 below the mounting head 43 .
- the side-view camera 47 captures and recognizes the component held by the suction nozzle 45 together with the lower part of the suction nozzle 45 from the side.
- a digital imaging device having an imaging device such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) can be exemplified.
- the component recognition camera 49 is provided on the base 10 between the substrate transport device 2 and the component supply device 3.
- the component recognition camera 49 is arranged so that the optical axis faces upward.
- the component recognition camera 49 captures and recognizes the component held by the suction nozzle 45 from below while the mounting head 43 is moving from the component supply device 3 to the board K.
- a digital imaging device having an imaging element such as a CCD or CMOS can be exemplified.
- the control device 5 is assembled to the base 10, and the position at which it is arranged is not particularly limited.
- the control device 5 is configured using a computer device having a CPU and operated by software. Note that the control device 5 may be configured by distributing a plurality of CPUs inside the machine and connecting them for communication.
- the control device 5 controls the board conveying device 2, the component supply device 3, the component transfer device 4, and the component recognition camera 49 to proceed with the component mounting work. .
- the job data is data describing detailed procedures and implementation methods of the mounting work.
- the board transfer device 2 includes a transfer section 6, a board passage sensor 7, and a transfer control section 8 in addition to the pair of guide rails 21 described above.
- a predetermined stop position PS for stopping the substrate K is set at the center of the pair of guide rails 21 (transport path) in the transport direction (X-axis direction).
- the transport section 6 has a conveyor belt 61, two support pulleys (62, 63), a tension pulley 64 and a drive pulley 65 which are individually provided for each of the guide rails 21. .
- the transport section 6 has a drive motor 66 that is commonly provided for the two drive pulleys 65 .
- the conveyor belt 61 is formed in an endless loop using a flexible strip-shaped member.
- the conveyor belt 61 is fitted into grooves formed in the guide rails 21 and held rotatably (see FIG. 15).
- the substrate K is placed horizontally across the top surfaces of the two conveyor belts 61 .
- the support pulley 62 is rotatably provided at the carry-in end 22 of the guide rail 21 .
- the support pulley 63 is rotatably provided at the unloading end 23 of the guide rail 21 .
- Two support pulleys (62, 63) support the conveyor belt 61 for rotation.
- the tension pulley 64 is rotatably provided below the support pulley 62 on the carry-in end 22 side.
- the tension pulley 64 is urged by an unillustrated urging mechanism to apply tension to the conveyor belt 61 to prevent slackening.
- a drive pulley 65 is provided below the support pulley 63 on the delivery end 23 side and engages the conveyor belt 61 .
- the conveyor belt 61 is supported by the four pulleys described above and rotates clockwise in FIG.
- the drive motor 66 rotates the two drive pulleys 65 at a constant speed via a transmission mechanism (not shown).
- each of the two drive pulleys 65 rotates the conveyor belt 61 respectively.
- the two conveyor belts 61 transport the placed substrate K.
- the drive motor 66 a pulse motor, a stepping motor, or the like with good controllability is used. Therefore, the transport speed and transport distance of the substrate K can be freely adjusted, and the accurate transport distance of the substrate K can be obtained.
- the substrate passing sensor 7 detects the presence or absence of the substrate K at the specified position.
- the specified position is set to coincide with the carry-in end 22 of the guide rail 21 (conveyance path).
- the specified position is not limited to this, and may be a position further toward the stop position PS than the carry-in end 22, and should be a position closer to the carry-in end 22 than the stop position PS.
- the substrate passage sensor 7 employs a vertical passage type that projects the detection light DL in the vertical direction and detects the presence or absence of the substrate K based on the amount of passage of the detection light DL.
- the board passage sensor 7 is composed of a light projecting section 71, a light receiving section 72, and a determination section 73 (see FIG. 4). As shown in FIG. 3 , the light projecting section 71 is arranged above the carry-in end 22 . The light projecting unit 71 projects vertically downward detection light DL toward the horizontal substrate K passing through the carry-in end 22 . The light projecting part 71 is maintained in a lighting state throughout the operating time period of the component mounting machine 1 .
- the light receiving section 72 is arranged on the opposite side of the light projecting section 71 with the substrate K therebetween, in other words, below the carry-in end 22 .
- the light receiving section 72 detects the passing amount of the detection light DL.
- the passing amount of the detection light DL is large when there is no substrate K at the carry-in end 22, and decreases or disappears when the substrate K is present.
- the light projecting unit 71 and the light receiving unit 72 may be arranged upside down, and the light projecting unit 71 may project the vertically upward detection light DL.
- the determination unit 73 receives information on the amount of passage of the detection light DL from the light receiving unit 72 .
- the determination unit 73 determines that there is no substrate when the passing amount is equal to or greater than a predetermined threshold, and determines that there is a substrate when the passing amount is less than the threshold.
- the predetermined threshold is determined in advance in consideration of various conditions. These conditions include the performance of the light projecting section 71 and the light receiving section 72, changes in performance over time, tolerance of arrangement, light transmittance depending on the material and thickness of the substrate K, and the like.
- the determination section 73 outputs the determination result to the transport control section 8 .
- the determination result of the determination unit 73 corresponds to the detection result of the substrate passing sensor 7 .
- the determination section 73 may be provided integrally with the light receiving section 72 or may be provided within the transport control section 8 .
- the transport control unit 8 is configured using a computer device.
- the transport control unit 8 controls the transport of the substrate K based on a command from the higher-level control device 5 connected for communication, and reports the control status to the control device 5 .
- the transport control unit 8 executes the substrate transport method of the embodiment as described in detail below.
- the transport control unit 8 receives the determination result from the determination unit 73 of the substrate passage sensor 7, and controls the drive motor 66 of the transport unit 6 based on the determination result.
- the transport control unit 8 may have a function of controlling the light projecting unit 71, for example, a function of adjusting the brightness of the detection light DL.
- the transport control unit 8 can obtain the transport distance of the substrate K based on the operation history of the drive motor 66 . Further, the transport control unit 8 recognizes the arrival of the substrate K at the stop position PS based on the determination result of the determination unit 73 and the transport distance obtained from the operation history of the drive motor 66 .
- Various known methods can be applied as a control method for the drive motor 66, for example, a smooth deceleration control method for preventing the substrate K from suddenly stopping at the stop position PS.
- the transport control unit 8 has four control function units configured using software, that is, a setting unit 81, a monitoring unit 82, a resetting unit 83, and an abnormality determination unit 84.
- the four control function units operate in parallel with the transport operation of the transport unit 6 .
- the setting unit 81 changes the determination result of the determination unit 73 of the substrate passage sensor 7 from “no substrate” to “no substrate” via "substrate present".
- a future transport distance D1 for transporting the substrate K to the stop position PS is set.
- the fact that the determination result has changed from “no substrate” to “with substrate” means that the front end of the substrate K has reached the carry-in end 22 .
- the ordinary substrate K means a general rectangular substrate K having no voids. Therefore, the transport distance D1 represents the distance to be transported after the moment when the trailing edge of the substrate K passes the loading end 22 (see FIGS. 6 and 7).
- the monitoring unit 82 operates immediately after the setting unit 81 sets the conveying distance D1 at the latest.
- the monitoring unit 82 monitors whether or not the determination result of the determination unit 73 changes again to "substrate present" until the substrate K reaches the stop position PS.
- the monitoring unit 82 stores that the determination result has changed again to "substrate present” by the reset flag setting operation.
- the change of the judgment result of the judging unit 73 to "substrate present" cannot occur with a normal substrate K, but with a cracked substrate KB (see FIG. 8), which will be described later.
- the monitoring unit 82 operates without being constrained by the setting unit 81 and continuously monitors changes in the determination result of the determination unit 73 .
- the resetting unit 83 operates when the monitoring unit 82 finds that the determination result of the determination unit 73 has changed to "substrate present" again. In other words, the resetting unit 83 operates with the resetting flag set when the broken substrate KB is transported. The resetting unit 83 resets the set transport distance when the determination result of the determining unit 73 changes again to "substrate present" and then to "substrate absent". Further, the resetting unit 83 resets the future transport distance D1. "Reset” means that the initially set transport distance D1 is gradually corrected to be smaller as the transport of the substrate K progresses after the setting operation of the setting unit 81, but the reduced transport distance is reset. This means that the same conveying distance D1 as at the beginning is set again at this time.
- the abnormality determination unit 84 determines whether or not there is an abnormality related to the transport of the board K.
- the abnormality determination unit 84 obtains the estimated length of the substrate K in the transport direction based on the operation history of the drive motor 66 of the transport unit 6 and the determination result of the determination unit 73 of the substrate passage sensor 7 . More specifically, the abnormality determining unit 84 determines the first time when the determination result of the determining unit 73 changes from "no board" to "with board” and the moment when "with board” changes to "no board”. Find the second time. In other words, the abnormality determination unit 84 obtains the first time when the front end of the substrate K passes the loading end 22 and the second time when the rear end of the substrate K passes the loading end 22 .
- the abnormality determination unit 84 obtains the transport distance that the drive motor 66 transported the board K from the first time to the second time, and uses it as the estimated length of the board K.
- the abnormality determination unit 84 compares this estimated length with a previously stored known length LK of the substrate K in the transport direction, and determines that there is an abnormality when the length error exceeds a predetermined allowable value. According to this, an abnormality in which two substrates K are transported while being in contact with each other in the transportation direction, and an abnormality in which a component protruding backward from the substrate K is erroneously detected as the rear end of the substrate K is detected.
- the abnormality determination unit 84 is not an essential component and may be omitted.
- the abnormality determination unit 84 can determine whether or not there is an abnormality when the substrate passage sensor 7 detects the rear end of the substrate K during the operation of the substrate transfer device 2 .
- the substrate K is controlled to stop so that its intermediate position PK overlaps the stop position PS (see FIG. 7).
- the conveying distance D1 is obtained by the following equation (1).
- Conveyance distance D1 D0-(LK/2) (1) That is, the transport distance D1 is a distance obtained by subtracting half the length LK of the substrate K in the transport direction from the separation distance D0 between the stop position PS and the specified position (carry-in end 22).
- the conveying distance D2 is obtained by the following equation (2).
- Conveyance distance D2 D0 (2) That is, the conveying distance D2 matches the separation distance D0 between the stop position PS and the specified position (carrying-in end 22).
- the conveying distance D3 is obtained by the following equation (3).
- Conveyance distance D3 D0-LK (3) That is, the conveying distance D3 is a distance obtained by subtracting the length LK of the substrate K in the conveying direction from the separation distance D0 between the stop position PS and the specified position (carrying-in end 22).
- the cracked substrate KB consists of a picture-frame-shaped frame portion KF and two small piece substrates (K1, K2). Each of the small substrates (K1, K2) is coupled to the inside of the frame KF at three points. After the production of the broken substrate KB is completed, each of the small substrates (K1, K2) is separated from the frame KF and used separately.
- the length of the broken substrate KB in the transport direction is LB.
- the future transport distances (D1, D2, D3) can be obtained by applying the length LB to the equations (1), (2), and (3).
- a gap portion KG is formed between the small piece substrate K1 on the front side in the transport direction of the broken substrate KB and the small piece substrate K2 on the rear side.
- the cracked substrate KB may have three or more small piece substrates and a plurality of gaps KG.
- the trailing edge of the front small board K1 may be erroneously detected as the trailing edge of the cracked board KB.
- the first embodiment eliminates the possibility of this false detection.
- FIG. 5 shows an operation flow of the substrate transfer apparatus 2
- FIGS. 6 and 7 show an operation example of transferring a normal substrate K
- FIGS. 8 to 12 show an operation example of transferring a cracked substrate KB.
- the reset flag used by the monitoring unit 82 is in the reset state.
- the transport control unit 8 causes the transport unit 6 to start the transport operation. After that, the transport unit 6 automatically continues the transport operation of the substrate K.
- the transport control unit 8 repeats a series of operations after step S2 for each control cycle.
- step S ⁇ b>2 the transport control unit 8 acquires the determination result of the determination unit 73 (hereinafter simply referred to as “determination result”), in other words, the detection result of the substrate passing sensor 7 .
- step S3 the monitoring unit 82 checks whether or not the previous determination result was "no substrate” and the current determination result changed to "with substrate”.
- the monitoring unit 82 advances the execution of the operation flow to step S4 when the change is made as described above, and otherwise advances the execution of the operation flow to step S11.
- step S11 the monitoring unit 82 checks whether or not the previous determination result was "substrate present” and the current determination result changed to "substrate absent".
- the monitoring unit 82 advances the execution of the operation flow to step S12 when the change is made as described above, and otherwise advances the execution of the operation flow to step S15.
- step S15 the monitoring unit 82 checks whether the substrate K has reached the stop position PS. If not, the monitoring unit 82 returns execution of the operation flow to step S2. The front end of the substrate K has not reached the carry-in end 22 at the initial stage when the transportation of the substrate K is started. Therefore, the transport control unit 8 acquires the determination result of "no substrate" each time step S2 is executed. As a result, an operation loop composed of steps S2, S3, S11, and S15 is repeatedly executed.
- step S2 the transport control unit 8 acquires the determination result of "substrate present". As a result, execution of the operation flow exits the operation loop from step S3 and proceeds to step S4.
- step S4 the monitoring unit 82 determines whether or not it is the first operation (whether or not step S4 has been performed for the first time). If it is the first operation, the monitoring unit 82 returns execution of the operation flow to step S2.
- the front end of the substrate K reaches the carry-in end 22, the operation is performed for the first time, so execution of the operation flow is returned to step S2.
- step S2 the transport control unit 8 acquires the determination result of "substrate present" each time step S2 is executed. As a result, the operation loop described above is repeatedly executed. As shown in FIG. 6, when the rear end of the substrate K reaches the carry-in end 22, in step S2, the transport control unit 8 acquires the determination result of "no substrate". As a result, execution of the operation flow exits the operation loop from step S11 and proceeds to step S12.
- step S12 the monitoring unit 82 determines the branch destination of the operation flow depending on whether the reset flag is set. When the rear end of the substrate K reaches the carry-in end 22, the reset flag is in the initial reset state, so execution of the operation flow proceeds to step S13.
- step S13 the setting unit 81 determines the trailing edge of the substrate K, and performs the operation of setting the transport distance D1 from now on. Thereafter, execution of the operation flow returns to step S2 via step S15.
- the transport control unit 8 After the trailing edge of the substrate K has passed the carry-in edge 22, the transport control unit 8 acquires the determination result of "no substrate" each time step S2 is executed. As a result, the operation loop described above is repeatedly executed. During the repetition, the transport control unit 8 gradually corrects the future transport distance D1 to be smaller as the transport of the substrate K progresses. Then, when the substrate K approaches the stop position PS, the transport control unit 8 appropriately decelerates the transport unit 6 .
- step S15 When the substrate K reaches and stops at the stop position PS as shown in FIG. 7, execution of the operation flow exits the operation loop from step S15 and ends.
- steps S5 and S14 of the operation flow are not executed, and the reset flag is not used.
- resetting unit 83 does not operate.
- the transport control unit 8 causes the transport unit 6 to start the transport operation.
- the transport control section 8 acquires the determination result of the determination section 73 .
- the transportation control unit 8 acquires the determination result of “no substrate” each time step S2 is executed.
- an operation loop composed of steps S2, S3, S11, and S15 is repeatedly executed.
- step S2 the transport control unit 8 acquires the determination result of "substrate present".
- execution of the operation flow exits the operation loop from step S3 and proceeds to step S4.
- step S4 the monitoring unit 82 returns the execution of the operation flow to step S2 because it is the first operation.
- the transport control unit 8 acquires the determination result of "substrate present” each time step S2 is executed. As a result, the operation loop described above is repeatedly executed.
- step S2 when the trailing edge of the small board K1 reaches the carry-in end 22, in step S2, the transport control unit 8 acquires the determination result of "no board". As a result, execution of the operation flow exits the operation loop from step S11 and proceeds to step S12. In step S12, since the reset flag is set in the monitoring unit 82, the execution of the operation flow proceeds to step S13. In step S13, the setting unit 81 determines the trailing edge of the cracked substrate KB, and performs the operation of setting the transport distance D1 from now on. However, this determination and setting operation is not for the trailing edge of the cracked substrate KB and is erroneous. Thereafter, execution of the operation flow returns to step S2 via step S15.
- the transport control unit 8 acquires the determination result of "no substrate” each time step S2 is executed. As a result, the operation loop described above is repeatedly executed. During the repetition, the transport control unit 8 gradually corrects the future transport distance D1 to be smaller as the transport of the substrate K progresses.
- step S2 when the front edge of the rear small piece substrate K2 reaches the carry-in end 22, in step S2, the transport control unit 8 acquires the determination result of "substrate present". Therefore, the monitoring unit 82 recognizes that the determination result has changed to "substrate present" again. As a result, execution of the operation flow exits the operation loop from step S3 and proceeds to step S4. In step S4, the monitoring unit 82 advances the execution of the operation flow to step S5 because it is the second operation.
- the monitoring unit 82 After setting the reset flag in step S5, the monitoring unit 82 returns the operation flow to step S2. After that, while the small substrate K2 and the rear portion of the frame KF are passing through the carry-in end 22, the transport control unit 8 acquires the determination result of "substrate present" each time step S2 is executed. As a result, the operation loop described above is repeatedly executed. During the repetition, the transport control unit 8 gradually corrects the future transport distance to be smaller.
- step S2 when the rear end of the broken substrate KB reaches the carry-in end 22, in step S2, the transport control unit 8 acquires the determination result of "no substrate". As a result, execution of the operation flow exits the operation loop from step S11 and proceeds to step S12. In step S12, since the reset flag is set (already set in step S5), the monitoring unit 82 advances the operation flow to step S14.
- step S14 the resetting unit 83 determines the correction of the rear end of the cracked substrate KB, and resets the transport distance D1 from now on.
- the conveying distance set in step S13 and gradually corrected to be smaller is reset, and the same conveying distance D1 as the initial one is set again at this time.
- the erroneous setting in step S13 is reset and the correct setting is made in step S14.
- the resetting unit 83 resets the resetting flag after normally completing the resetting operation. Thereafter, execution of the operation flow returns to step S2 via step S15.
- the transport control unit 8 After the rear end of the cracked substrate KB has passed the carry-in end 22, the transport control unit 8 acquires the determination result of "no substrate" each time step S2 is executed. As a result, the operation loop described above is repeatedly executed. During the repetition, the transport control unit 8 appropriately controls the transport unit 6 based on the transport distance D1 reset in step S14.
- step S15 execution of the operation flow exits the operation loop from step S15 and ends.
- steps S5 and S14 are executed the number of times corresponding to the number of gaps KG. Therefore, the resetting unit 83 operates the number of times corresponding to the number of the gaps KG.
- step S13 is executed only once regardless of the presence or absence of the gaps KG and the number thereof. Therefore, the setting unit 81 operates only once regardless of the type of substrate (K, KB).
- the transport distance D1 from now on is set. Then, when the detection result changes to "substrate present” again, when the detection result subsequently changes to "substrate absent", it is determined to be the rear end of the cracked substrate KB, and the set transport distance is reset. The future transport distance D1 is set again.
- the transport distance D1 from now on is restarted when the true trailing edge of the cracked substrate KB is determined to be corrected. set. Therefore, the detection accuracy of the rear end of the board (K, KB) can be improved more than before, and as a result, the board-to-board work machine (component mounting machine 1) can be stopped due to an error in transportation, or the board (K, KB) can be detected. ) of the stop position can be reduced more than before.
- control method of the transport control unit 8 based on the detection result of the substrate passing sensor 7 is common to all types of substrates (K, KB). Therefore, in the first embodiment, the operator's labor is greatly reduced compared to the conventional technique in which the timer is set and the transport distance is adjusted for each of a plurality of board-to-board work machines for each type of board.
- the substrate transfer apparatus 2A of the second embodiment will be described mainly with respect to the differences from the first embodiment.
- the configurations of the transport section 6 and the transport control section 8 are the same as in the first embodiment.
- the substrate passage sensor 7A of the second embodiment employs a horizontal passage type that projects the detection light DL in the horizontal direction and detects the presence or absence of the substrate K based on the amount of passage of the detection light DL.
- the board passage sensor 7A is composed of a light projecting section 74, a light receiving section 75, and a determining section 73 which is the same as in the first embodiment.
- the light projecting part 74 is arranged outside the carry-in end 22 (prescribed position) of one of the guide rails 21 in the Y-axis direction.
- the light projecting part 74 projects the detection light DL in the horizontal direction orthogonal to the transport direction toward the substrate K in the horizontal posture passing through the carry-in end 22 .
- the light receiving portion 75 is arranged at a position on the opposite side of the light projecting portion 74 with the substrate K therebetween, in other words, outside the carry-in end 22 (prescribed position) of the other guide rail 21 in the Y-axis direction.
- the light receiving section 75 detects the passing amount of the detection light DL.
- the detection accuracy of the trailing edge can be improved more than in the past. More specifically, in FIG. 14, the warped substrate KS is warped such that the intermediate portion in the transport direction protrudes upward, and the degree of warping is exaggerated. In the transport operation of the warped substrate KS, when the front portion and the rear portion of the warped substrate KS pass through the carry-in end 22, the passing amount of the detection light DL decreases. Meanwhile, when the intermediate portion of the warped substrate KS passes through the carry-in end 22, the detection light DL passes under the warp as shown in the drawing, and the passing amount increases temporarily.
- the warped intermediate portion of the warped substrate KS has the same effect as the gap KG of the cracked substrate KB.
- the determination result of the determination unit 73 of the substrate passage sensor 7A follows the same transition as in the case of transporting the cracked substrate KB in the first embodiment. Therefore, even if the trailing edge is erroneously determined due to the presence of the warped portion of the warped substrate KS, the future transport distance D1 is reset when the true trailing edge of the warped substrate KS is determined to be corrected. According to this, it is possible to improve the detection accuracy of the rear end of the warped board KS as compared with the conventional one. A decrease in positional accuracy can be reduced more than before.
- the board passing sensor 7B employs a vertical reflection type that projects the detection light DL in the vertical direction and detects the presence or absence of the board K based on the amount of reflection of the detection light DL.
- the board passage sensor 7B is composed of a light projecting section 76, a light receiving section 77, and a determination section (not shown).
- the light projecting part 76 is arranged at a position above the carry-in end 22 in a posture slightly inclined from the vertical direction.
- the light projecting unit 76 projects obliquely downward detection light DL toward the horizontal substrate K passing through the carry-in end 22 .
- the light-receiving part 77 is arranged in a position aligned with the light-projecting part 76 and corresponding to the path of the detection light DL reflected by the substrate K in a posture slightly inclined from the vertical direction.
- the light receiving section 77 detects the amount of reflection of the detection light DL.
- the determination unit receives information on the amount of reflection of the detection light DL from the light receiving unit 77.
- the determining unit determines that there is no substrate when the amount of reflection is less than a predetermined threshold, and determines that there is a substrate when the amount of reflection is equal to or greater than the threshold.
- the board transfer device 2B of the third embodiment differs from the first embodiment in the detection method of the board passing sensor 7B, but its operation, function and effect are substantially the same as those of the first embodiment.
- the board transfer devices (2, 2A, 2B) can also be applied to work machines other than the component mounting machine 1, such as a solder printing machine and a board inspection machine.
- the substrate passage sensor may be of a horizontal reflection type that projects detection light in the horizontal direction and detects the presence or absence of the substrate K based on the amount of reflection of the detection light.
- the substrate transport devices (2, 2A, 2B) use the estimated length obtained by the abnormality determination unit 84 to calculate the future transport distance D1. and the substrate K can be stopped at a predetermined stop position PS.
- the abnormality determination by the abnormality determination unit 84 cannot be performed.
- Various other applications and modifications are possible for the first to third embodiments.
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Abstract
Description
まず、第1実施形態の基板搬送装置2を適用した部品装着機1の全体構成について、図1を参考にして説明する。部品装着機1は、基板Kに部品を装着する装着作業を実施する。部品装着機1の上流側にはんだ印刷機等が配置され、下流側に基板検査機等が配置されて対基板作業ラインが構成される。図1の紙面左側から右側に向かう方向が基板Kを搬送するX軸方向、紙面下側(前側)から紙面上側(後側)に向かう方向がY軸方向となる。部品装着機1は、基板搬送装置2、部品供給装置3、部品移載装置4、部品認識用カメラ49、および制御装置5(図4参照)などが基台10に組み付けられて構成される。 1. Overall Configuration of
第1実施形態の基板搬送装置2の説明に移る。基板搬送装置2は、前述した一対のガイドレール21に加え、搬送部6、基板通過センサ7、および搬送制御部8を備える。図2に示されるように、一対のガイドレール21(搬送路)の搬送方向(X軸方向)の中央に、基板Kを停止させる所定の停止位置PSが設定される。図3に示されるように、搬送部6は、ガイドレール21の各々に対して個別に設けられたコンベアベルト61、二つの支持プーリ(62、63)、テンションプーリ64、および駆動プーリ65を有する。さらに、搬送部6は、二つの駆動プーリ65に対して共通に設けられた駆動モータ66を有する。 2. Configuration of
次に、基板搬送装置2の制御の構成について、図4を参考にして説明する。搬送制御部8は、コンピュータ装置を用いて構成される。搬送制御部8は、通信接続された上位の制御装置5からの指令に基づいて基板Kを搬送する制御を行うとともに、制御状況を制御装置5に報告する。搬送制御部8は、以降に詳述するように、実施形態の基板搬送方法を実行する。 3. Configuration of Control of
次に、前述した搬送距離D1について、図2、図7を参考にして説明する。前述したように、ガイドレール21(搬送路)のX軸方向の中央に、破線で示された停止位置PSが設定される。停止位置PSと搬入端22(規定位置)との離間距離は、D0である。一方、基板Kの搬送方向の長さは、LKである。また、基板Kの搬送方向の中間位置PKが、破線で示されている。離間距離D0および基板Kの長さLKは既知であり、搬送距離D1は、搬送動作を開始する以前に予め求められる。 4. Conveyance distance D1 (D2, D3)
Next, the conveying distance D1 described above will be described with reference to FIGS. 2 and 7. FIG. As described above, the stop position PS indicated by the dashed line is set at the center of the guide rail 21 (conveyance path) in the X-axis direction. A distance between the stop position PS and the carry-in end 22 (prescribed position) is D0. On the other hand, the length of the substrate K in the transport direction is LK. Further, an intermediate position PK in the transport direction of the substrate K is indicated by a dashed line. The separation distance D0 and the length LK of the substrate K are known, and the transport distance D1 is obtained in advance before starting the transport operation.
搬送距離D1=D0-(LK/2)…………(1)
つまり、搬送距離D1は、停止位置PSと規定位置(搬入端22)との離間距離D0から基板Kの搬送方向の長さLKの半分を減算した距離となる。 In the first embodiment, the substrate K is controlled to stop so that its intermediate position PK overlaps the stop position PS (see FIG. 7). In this case, the conveying distance D1 is obtained by the following equation (1).
Conveyance distance D1=D0-(LK/2) (1)
That is, the transport distance D1 is a distance obtained by subtracting half the length LK of the substrate K in the transport direction from the separation distance D0 between the stop position PS and the specified position (carry-in end 22).
搬送距離D2=D0……………………………(2)
つまり、搬送距離D2は、停止位置PSと規定位置(搬入端22)との離間距離D0に一致する。 In addition, when stop control is performed so that the rear end of the substrate K overlaps the stop position PS, the conveying distance D2 is obtained by the following equation (2).
Conveyance distance D2=D0 (2)
That is, the conveying distance D2 matches the separation distance D0 between the stop position PS and the specified position (carrying-in end 22).
搬送距離D3=D0-LK……………………(3)
つまり、搬送距離D3は、停止位置PSと規定位置(搬入端22)との離間距離D0から基板Kの搬送方向の長さLKを減算した距離となる。 Further, when stop control is performed so that the front end of the substrate K overlaps the stop position PS, the conveying distance D3 is obtained by the following equation (3).
Conveyance distance D3=D0-LK (3)
That is, the conveying distance D3 is a distance obtained by subtracting the length LK of the substrate K in the conveying direction from the separation distance D0 between the stop position PS and the specified position (carrying-in end 22).
次に、割れ基板KBの構成例について、図8を参考にして説明する。割れ基板KBは、額縁形状の枠部KF、および二つの小片基板(K1、K2)からなる。小片基板(K1、K2)の各々は、枠部KFの内側に3箇所で結合されている。割れ基板KBの生産終了後に、小片基板(K1、K2)の各々は、枠部KFから割り取られて別々に使用される。 5. Cracked substrate KB
Next, a configuration example of the cracked substrate KB will be described with reference to FIG. The cracked substrate KB consists of a picture-frame-shaped frame portion KF and two small piece substrates (K1, K2). Each of the small substrates (K1, K2) is coupled to the inside of the frame KF at three points. After the production of the broken substrate KB is completed, each of the small substrates (K1, K2) is separated from the frame KF and used separately.
次に、基板搬送装置2の動作について、図5~図12を参考にして説明する。図5は、基板搬送装置2の動作フローを示し、図6および図7は、通常の基板Kを搬送する動作事例を示し、図8~図12は、割れ基板KBを搬送する動作事例を示す。搬送動作を開始する以前の初期状態において、監視部82が用いる再設定フラグはリセット状態になっている。 6. Operation of
次に、第2実施形態の基板搬送装置2Aについて、図13および図14を参考にして、第1実施形態と異なる点を主に説明する。第2実施形態において、搬送部6および搬送制御部8の構成は、第1実施形態と同じである。一方、第2実施形態の基板通過センサ7Aは、水平方向の検出光DLを投射し、検出光DLの通過量に基づいて基板Kの有無を検出する水平方向通過式が採用されている。基板通過センサ7Aは、投光部74、受光部75、および第1実施形態と同じ判定部73で構成される。 7. 2A of board|substrate conveying apparatuses of 2nd Embodiment
Next, with reference to FIGS. 13 and 14, the
次に、第3実施形態の基板搬送装置2Bについて、図15を参考にして、第1および第2実施形態と異なる点を主に説明する。第3実施形態において、基板通過センサ7Bは、上下方向の検出光DLを投射し、検出光DLの反射量に基づいて基板Kの有無を検出する上下方向反射式が採用されている。基板通過センサ7Bは、投光部76、受光部77、および判定部(図略)で構成される。 8.
Next, the
なお、基板搬送装置(2、2A、2B)は、部品装着機1以外の対基板作業機、例えばはんだ印刷機や基板検査機にも適用することができる。また、基板通過センサは、水平方向の検出光を投射し、検出光の反射量に基づいて基板Kの有無を検出する水平方向反射式を採用してもよい。さらに、基板Kの搬送方向の長さLKが未知であっても、基板搬送装置(2、2A、2B)は、異常判定部84が求めた推定長さを用いて今後の搬送距離D1を演算し、基板Kを所定の停止位置PSに停止させることができる。ただし、異常判定部84による異常判定は行えない。第1~第3実施形態は、その他にも様々な応用や変形が可能である。 9. Applications and Modifications of the Embodiments The board transfer devices (2, 2A, 2B) can also be applied to work machines other than the
Claims (8)
- 基板を搬送路の搬入端から所定の停止位置まで搬送する搬送部と、
前記搬送路の前記停止位置よりも前記搬入端側の規定位置を通過する前記基板に向けて検出光を投射し、前記検出光の通過量または反射量に基づいて、前記規定位置における前記基板の有無を検出する基板通過センサと、
前記搬送部が前記基板を搬送する際に、前記基板通過センサの検出結果が「基板無し」から「基板有り」を経て「基板無し」に変化した時点で、前記基板を前記停止位置まで搬送する今後の搬送距離を設定する設定部と、
前記基板が前記停止位置に到着するまで、前記検出結果が再び「基板有り」に変化するか否かを監視する監視部と、
前記検出結果が再び「基板有り」に変化した場合、その後に前記検出結果が「基板無し」に変化した時点で、設定済みの前記搬送距離をリセットして今後の前記搬送距離を設定し直す再設定部と、
を備える基板搬送装置。 a transport unit that transports the substrate from the carry-in end of the transport path to a predetermined stop position;
A detection light is projected toward the substrate passing through a specified position on the carry-in end side of the transport path relative to the stop position, and the substrate at the specified position is detected based on the amount of passage or reflection of the detection light. a substrate passage sensor that detects the presence or absence of
When the transport unit transports the substrate, the substrate is transported to the stop position when the detection result of the substrate passage sensor changes from "substrate present" to "substrate absent". a setting unit for setting a future conveying distance;
a monitoring unit for monitoring whether or not the detection result changes to "substrate present" again until the substrate reaches the stop position;
When the detection result changes to "substrate present" again, when the detection result subsequently changes to "substrate absent", the already set transport distance is reset and the future transport distance is set again. a setting unit;
A substrate transport device comprising: - 前記基板通過センサは、水平姿勢で搬送される前記基板に向けて、上下方向の前記検出光を投射する、請求項1に記載の基板搬送装置。 2. The substrate transport apparatus according to claim 1, wherein said substrate passage sensor projects said detection light in a vertical direction toward said substrate transported in a horizontal posture.
- 前記基板通過センサは、水平姿勢で搬送される前記基板に向けて、搬送方向に交差する水平方向の前記検出光を投射する、請求項1に記載の基板搬送装置。 2. The substrate transport apparatus according to claim 1, wherein said substrate passage sensor projects said detection light in a horizontal direction intersecting the transport direction toward said substrate transported in a horizontal posture.
- 前記基板通過センサは、
前記基板に向けて前記検出光を投射する投光部と、
前記基板を挟んで前記投光部の反対側に配置され、前記基板が無いときと比較して前記基板が有るときに減少する前記検出光の前記通過量を検出する受光部と、
前記通過量が所定の閾値以上である場合に「基板無し」と判定し、前記通過量が前記閾値未満である場合に「基板有り」と判定する判定部と、を有する、
請求項1~3のいずれか一項に記載の基板搬送装置。 The substrate passing sensor is
a light projecting unit that projects the detection light toward the substrate;
a light-receiving unit disposed on the opposite side of the light-projecting unit with the substrate interposed therebetween, and detecting the amount of the detection light passing through that decreases when the substrate is present compared to when the substrate is not present;
a determination unit that determines that there is no substrate when the passing amount is equal to or greater than a predetermined threshold, and determines that there is a substrate when the passing amount is less than the threshold;
A substrate transfer apparatus according to any one of claims 1 to 3. - 前記基板通過センサは、
前記基板に向けて前記検出光を投射する投光部と、
前記投光部に並んで配置され、前記基板が無いときと比較して前記基板が有るときに増加する前記検出光の前記反射量を検出する受光部と、
前記反射量が所定の閾値未満である場合に「基板無し」と判定し、前記反射量が前記閾値以上である場合に「基板有り」と判定する判定部と、を有する、
請求項1~3のいずれか一項に記載の基板搬送装置。 The substrate passing sensor is
a light projecting unit that projects the detection light toward the substrate;
a light receiving unit arranged side by side with the light projecting unit for detecting the amount of reflection of the detection light that increases when the substrate is present compared to when the substrate is not present;
a determination unit that determines that there is no substrate when the amount of reflection is less than a predetermined threshold, and determines that there is a substrate when the amount of reflection is equal to or greater than the threshold;
A substrate transfer apparatus according to any one of claims 1 to 3. - 前記搬送距離は、前記停止位置と前記規定位置との離間距離、前記離間距離から前記基板の搬送方向の長さの半分を減算した距離、および、前記離間距離から前記基板の搬送方向の長さを減算した距離のいずれかである、請求項1~5のいずれか一項に記載の基板搬送装置。 The transport distance is the separation distance between the stop position and the specified position, the distance obtained by subtracting half the length of the substrate in the transport direction from the separation distance, and the length of the substrate in the transport direction from the separation distance. 6. The substrate transfer apparatus according to any one of claims 1 to 5, wherein the distance is any one of the distances obtained by subtracting .
- 前記搬送部の動作履歴および前記基板通過センサの前記検出結果に基づいて前記基板の搬送方向の推定長さを求め、前記推定長さと前記基板の搬送方向の既知の長さとを比較することにより異常の有無を判定する異常判定部を備える、請求項1~6のいずれか一項に記載の基板搬送装置。 An estimated length of the substrate in the transport direction is obtained based on the operation history of the transport unit and the detection result of the substrate passage sensor, and the estimated length and the known length of the substrate in the transport direction are compared to detect an abnormality. The substrate transfer apparatus according to any one of claims 1 to 6, comprising an abnormality determination unit that determines the presence or absence of a
- 基板を搬送路の搬入端から所定の停止位置まで搬送する搬送部と、
前記搬送路の前記停止位置よりも前記搬入端側の規定位置を通過する前記基板に向けて検出光を投射し、前記検出光の通過量または反射量に基づいて、前記規定位置における前記基板の有無を検出する基板通過センサと、
前記基板通過センサの検出結果に基づいて前記搬送部を制御する制御部と、を備える基板搬送装置において、
前記制御部は、
前記搬送部が前記基板を搬送する際に、前記検出結果が「基板無し」から「基板有り」を経て「基板無し」に変化した時点で、前記基板を前記停止位置まで搬送する今後の搬送距離を設定し、
前記基板が前記停止位置に到着するまで、前記検出結果が再び「基板有り」に変化するか否かを監視し、
前記検出結果が再び「基板有り」に変化した場合、その後に前記検出結果が「基板無し」に変化した時点で、設定済みの前記搬送距離をリセットして今後の前記搬送距離を設定し直す、
基板搬送方法。 a transport unit that transports the substrate from the carry-in end of the transport path to a predetermined stop position;
A detection light is projected toward the substrate passing through a specified position on the carry-in end side of the transport path relative to the stop position, and the substrate at the specified position is detected based on the amount of passage or reflection of the detection light. a substrate passage sensor that detects the presence or absence of
A substrate transport apparatus comprising a control unit that controls the transport unit based on a detection result of the substrate passage sensor,
The control unit
When the transport unit transports the substrate, when the detection result changes from "no substrate" to "no substrate" via "substrate present", a future transport distance for transporting the substrate to the stop position and set
until the substrate reaches the stop position, monitoring whether the detection result changes again to "substrate present";
When the detection result changes again to "substrate present", when the detection result subsequently changes to "substrate absent", resetting the set transport distance and resetting the future transport distance;
Substrate transfer method.
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CN202180091723.5A CN116762485A (en) | 2021-03-03 | 2021-03-03 | Substrate conveying device and substrate conveying method |
PCT/JP2021/008069 WO2022185428A1 (en) | 2021-03-03 | 2021-03-03 | Substrate transfer apparatus and substrate transfer method |
JP2023503584A JP7432058B2 (en) | 2021-03-03 | 2021-03-03 | Substrate transfer device and substrate transfer method |
DE112021007189.0T DE112021007189T5 (en) | 2021-03-03 | 2021-03-03 | Blank conveying device and blank conveying method |
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Citations (6)
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JPH0537187A (en) * | 1991-07-31 | 1993-02-12 | Juki Corp | Conveyer for electronic circuit board |
WO2004093514A1 (en) * | 2003-04-11 | 2004-10-28 | Fuji Machine Mfg. Co., Ltd. | Method and system for carrying substrate |
JP2007225323A (en) * | 2006-02-21 | 2007-09-06 | Dainippon Screen Mfg Co Ltd | Crack sensor of substrate and substrate treatment apparatus |
JP2011071345A (en) * | 2009-09-25 | 2011-04-07 | Fuji Mach Mfg Co Ltd | Electronic circuit component mounting machine |
JP2013225627A (en) * | 2012-04-23 | 2013-10-31 | Hitachi High-Tech Instruments Co Ltd | Substrate transfer device |
JP2017183630A (en) * | 2016-03-31 | 2017-10-05 | パナソニック デバイスSunx株式会社 | Substrate detection sensor |
-
2021
- 2021-03-03 DE DE112021007189.0T patent/DE112021007189T5/en active Pending
- 2021-03-03 JP JP2023503584A patent/JP7432058B2/en active Active
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Patent Citations (6)
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JPH0537187A (en) * | 1991-07-31 | 1993-02-12 | Juki Corp | Conveyer for electronic circuit board |
WO2004093514A1 (en) * | 2003-04-11 | 2004-10-28 | Fuji Machine Mfg. Co., Ltd. | Method and system for carrying substrate |
JP2007225323A (en) * | 2006-02-21 | 2007-09-06 | Dainippon Screen Mfg Co Ltd | Crack sensor of substrate and substrate treatment apparatus |
JP2011071345A (en) * | 2009-09-25 | 2011-04-07 | Fuji Mach Mfg Co Ltd | Electronic circuit component mounting machine |
JP2013225627A (en) * | 2012-04-23 | 2013-10-31 | Hitachi High-Tech Instruments Co Ltd | Substrate transfer device |
JP2017183630A (en) * | 2016-03-31 | 2017-10-05 | パナソニック デバイスSunx株式会社 | Substrate detection sensor |
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JPWO2022185428A1 (en) | 2022-09-09 |
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