JP3746127B2 - Component mounting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention holds a component supplied from a supply means by a head mechanism, moves the head mechanism to a predetermined position, and then releases the held component, thereby mounting the component on a substrate. It relates to the mounted device.
[0002]
[Prior art]
FIG. 3 is a perspective view showing a general example of a conventional component mounting apparatus P20. In general, the component mounting apparatus P20 is used by being connected to other circuit board processing apparatuses at the front and rear, and the circuit board sent from the front side in the X direction in the figure is carried in, and the electronic component is mounted on the circuit board. After that, the circuit board is carried out in the X direction in the drawing.
[0003]
3, P1... Is a reel that stores electronic components, P2... Is a supply device (hereinafter referred to as a feeder) that supplies electronic components one by one from the reels P1, and P3 is a circuit board on which the electronic components are mounted. , P4 is a head mechanism that holds electronic components, and P5 is an XY robot apparatus that moves the head mechanism P4 in the XY directions. The reels P1,... Are usually wound in a reel shape with electronic components housed in paper or plastic holes.
A plurality of sets of reels P1 and feeders P2 are provided, and a plurality of electronic components are supplied in a row in the X direction (flow direction of the circuit board) in the drawing.
[0004]
FIG. 4 shows a detailed view of the head mechanism P4. In the figure, P6 and P6 are vacuum-sucked electronic parts, P7 and P7 are suction nozzles as heads for sucking the electronic parts, P8 and P8 are motors for rotating the suction nozzles P7 and P7, and P9 is suction. A bracket for holding the nozzle P7 and the motor P8, P10a and P10b are ball screws and nuts for moving the bracket P9 up and down, P11 is a motor for moving the bracket P9 up and down by operating the ball screw P10a, and P12 moves the bracket P10 in the vertical direction P14a and P14b are position detectors for detecting the position of the electronic component P6, P13 is a structural member for holding the position detectors P14a and P14b, and P15 is an imaging camera as imaging means.
[0005]
As shown in the figure, the head mechanism P4 is provided with two or three sets of suction nozzles P7, P7, and operation mechanisms (rotation motor P8, vertical movement motor P11, etc.) associated therewith. This is because when a plurality of nozzles P7 and P7 descend simultaneously or individually when the electronic components P6 are picked up from the feeders P2... This is because the purpose is to shorten the cycle time and improve the production efficiency.
[0006]
Similarly, as shown in FIG. 4, the head mechanism P4 is provided with a set of imaging cameras P15. For example, the imaging camera P15 recognizes the target object by imaging the target object from directly above. The purpose of the imaging camera P15 is as follows (1) to (3).
(1) The mark provided on the circuit board P3 is imaged to recognize the position of the circuit board P3.
{Circle around (2)} In order to confirm the position of the component to be supplied, the position of the feeder P <b> 2... Is recognized, and correction is performed when there is a deviation from the reference position.
(3) The position and orientation of the electronic component P6 mounted on the circuit board P3 are confirmed and corrected.
[0007]
As described above, the head mechanism P4 of the conventional component mounting apparatus P20 is generally provided with a plurality of head portions (suction nozzles P7, P7) and a pair of imaging means (imaging camera P15) as described above. It was the target. And the imaging means (imaging camera P15) was installed between the plurality of head parts (suction nozzles P7, P7) at the substantially center of the head mechanism P4.
[0008]
[Problems to be solved by the invention]
By the way, when the imaging means is installed between the plurality of head portions as described above, the distances (centers) of the plurality of head portions are inevitably separated. In recent years, the size of a circuit board has a strong tendency to be miniaturized, and when the distance between the heads of the plurality of head portions is long as described above, for example, when two electronic components are mounted at two short intervals, There has been a problem that the efficiency of the mounting process is not improved. That is, after the first electronic component is mounted on the first head portion, the moving distance of the head mechanism P4 becomes longer until the second electronic component is mounted on the second head portion. Processing efficiency does not improve.
[0009]
On the other hand, a method is easily devised in which the imaging means is not attached to the central portion of the head mechanism P4, but is arranged on the left or right side of the plurality of head portions to shorten the distance between the head portions. However, the image pickup means needs to move the upper part over all the feeders P2 in order to recognize the position of the feeders P2 ... which is the purpose of the above (2), and the image pickup means is moved to one side of the head mechanism P4. Therefore, the movement stroke of the XY robot P5, especially the movement stroke in the direction in which the feeders P2,... Are arranged (the flow direction of the circuit board in the X direction in FIG. 3) has to be increased.
[0010]
The increase in the movement stroke of the XY robot P5 increases the installation area of the component mounting device P20, particularly the length in the substrate flow direction (X direction in FIG. 3). The component mounting device P20 is rarely used alone, and usually starts with a substrate supply device, and includes a solder printer, an adhesive applicator, a plurality of component mounting devices, a solder curing tank, a substrate recovery device, and a plurality of components mounting devices. Different devices can be connected in a row and can range from a few meters to a few dozen meters long. Therefore, it is an important factor that the length of the component mounting device P20 connected to a plurality of units is short. For this reason, there has been a problem with the method of arranging the imaging means on the left or right side of the plurality of head portions.
[0011]
The present invention has been made to solve the above-described problems, and is processed when components are mounted on a small circuit board by arranging a plurality of head portions close to each other without increasing the movement stroke of the XY mechanism. The object is to provide a component mounting device capable of improving efficiency.
[0012]
[Means for Solving the Problems]
To solve the above problem,
The invention according to claim 1 includes a supply means for supplying a component, a head mechanism for holding and releasing the component, and an XY mechanism for moving the head mechanism in the XY direction. In the component mounting apparatus that mounts the component on the board by releasing it after being held and moved to a predetermined position,
The supply means supplies a plurality of parts,
The head mechanism is
A plurality of head portions for individually holding and releasing a plurality of supplied parts;
An imaging means for imaging each of the plurality of parts or a supply location of the plurality of parts in order to confirm the positions of the plurality of parts to be supplied;
Two sets of the imaging means are provided,
These two sets of image pickup means are arranged on both sides of the plurality of head portions.
[0013]
According to the first aspect of the present invention, since the imaging means is arranged on both sides of the plurality of head portions, the distance between the plurality of head portions can be shortened. Therefore, even when components are mounted on a small board, the efficiency of mounting processing can be improved. For example, when two components are mounted at two short intervals on the substrate, two of the plurality of head portions are mounted on the first head portion and then two on the second head portion. Until the eye component is mounted, the moving distance of the head mechanism is short, and as a result, the efficiency of the mounting process is improved.
[0014]
Further, two sets of image pickup means are provided in the head mechanism, and these two sets of image pickup means are arranged on both sides of the plurality of head portions, so that the movement stroke of the XY mechanism necessary for processing performed by the image pickup means is reduced. I can do it. That is, when imaging each of the plurality of components or the supply locations of the plurality of components to confirm the positions of the plurality of components to be supplied, if there is one set of imaging means as in the prior art, the plurality of components or the plurality of components However, according to the configuration of the present invention, one of the imaging units is made to take an image on one side, and the other imaging unit is made to take an image on the other side. Thus, the movement stroke of the XY mechanism can be reduced by the distance between the two image pickup means.
[0015]
Since the movement stroke of the XY mechanism necessary for the processing of the imaging means is reduced, the movement stroke of the XY mechanism is not increased even if viewed comprehensively. Therefore, it is useful without increasing the installation area of the component mounting machine. is there. In particular, when the supply of a plurality of components by the supply means is performed side by side in the flow direction of the substrate, the length in the flow direction of the substrate is not increased. When processing is performed by connecting the substrates in a row and flowing the substrate along the rows of these apparatuses, it is particularly useful without increasing the length of the rows.
[0016]
Here, the arrangement of the plurality of head units and the two sets of imaging means is generally shown as a specific example in which the plurality of head parts are arranged in a line and the imaging units are arranged at both ends thereof (FIG. 2). However, the arrangement is not limited to this. For example, a plurality of head portions may be arranged in a zigzag pattern or in a plurality of rows, and two sets of imaging means may be arranged in a row of head portions. It may be arranged at a position shifted from the position. In addition, two sets of imaging units are arranged on both sides of the plurality of head units, and further, two sets are arranged on both sides of the plurality of head units, such as an arrangement in which the head units are arranged on the sides of the two sets of imaging units. It goes without saying that any arrangement in which the imaging means is arranged is included in the scope of the claims of the present invention.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 and 2.
FIG. 1 is a perspective view showing an overview of a component mounting apparatus 1 according to an embodiment of the present invention.
[0018]
The component mounting apparatus 1 according to this embodiment automatically mounts predetermined electronic components on a circuit board 20, and includes reels 2, 2,... As storage means for storing electronic components, and a feeder 3 as supply means. , 3..., A suction head mechanism 4 as a head mechanism, an XY robot 5 as an XY mechanism for moving the suction head mechanism 4 in the XY directions, and the like.
[0019]
This component mounting apparatus 1 usually starts with a substrate supply device, and is aligned with a solder printer, an adhesive applicator, a plurality of component mounting devices, a solder curing tank, a substrate recovery device, and a plurality of various substrate processing devices. The circuit boards 20 are used in a connected state, and various processes are performed by each substrate processing apparatus while being transported from an upstream apparatus to a downstream apparatus of the substrate processing apparatuses connected in a row. ing. The X direction in the figure is a direction to be connected to other substrate processing apparatuses. In the component mounting apparatus 1, the circuit board 20 is carried in from the carry-in port 7a, and the circuit board 20 is carried out from the carry-out port 7b. Yes.
[0020]
The reels 2, 2... Are each stored in a paper or plastic hole and wound in a reel shape, and different types of electronic components are accommodated in the plurality of reels 2, 2,.
[0021]
The feeders 3, 3... Are respectively provided corresponding to the plurality of reels 2, 2,..., Take out electronic components one by one from the corresponding reels 2, and transport and supply them to predetermined positions on the feeders 3, 3. It is supposed to be.
[0022]
The reels 2, 2,... And the feeders 3, 3,... Are sequentially arranged in the transport direction (X direction in the illustrated example) of the circuit board 20, and all the feeders 3 are positioned along the transport path of the circuit board 20. Is arranged. With this arrangement, the distances between all the feeders 3... And the circuit board 20 are reduced, and the processing efficiency for mounting the supplied electronic components on the circuit board can be improved.
[0023]
FIG. 2 shows an enlarged perspective view of the suction head mechanism 4 which is a feature of the present invention. The X direction in the figure and the X direction shown in FIG. 1 indicate the same direction.
[0024]
The suction head mechanism 4 is configured by attaching suction nozzles 13A and 13B as head portions and imaging cameras 11A and 11B as imaging means to a mounting base 4a. The suction nozzles 13A and 13B are attached via motion mechanisms 15A and 15B that enable the suction nozzles 13A and 13B to move in the vertical direction and the rotation direction.
[0025]
The suction nozzles 13A and 13B are capable of sucking the electronic components 30 and 30 by vacuum suction and are provided in two sets.
The imaging cameras 11A and 11B are capable of recognizing an object by imaging the object from directly above, and two sets are provided. These imaging cameras 11A and 11B, for example, image all the feeders 3, 3... To confirm the positions of the electronic components supplied to the feeders 3, 3. In order to confirm, the mark provided on the circuit board 20 is imaged and recognized, and in order to confirm the mounting position of the electronic component, the position and orientation of the electronic component mounted on the circuit board 20 are imaged and recognized. To do.
[0026]
The suction nozzles 13A and 13B and the imaging cameras 11A and 11B are arranged in a line in the conveyance direction of the circuit board 20, and the two sets of imaging cameras 11A and 11B are respectively provided on both sides of the two suction nozzles 13A and 13B. Is arranged. Since the suction nozzles 13A and 13B are arranged side by side, the length between the centers of the suction nozzles 13A and 13B is shortened.
As described above, the suction nozzles 13A and 13B and the imaging cameras 11A and 11B are arranged in a line in the X direction, so that the XY robot 5 can be used to pick up the electronic components after confirming the supply position of the electronic components. As the operation, only movement in the X direction is required, and movement in the Y direction is unnecessary, and accordingly, the processing efficiency and the movement accuracy can be improved.
[0027]
Of the two imaging cameras 11A and 11B, the first imaging camera 11A arranged on one side is assigned imaging processing on one side of the circuit board 20 and the feeders 3, 3,... And arranged on the other side. The imaging process of the remaining side of the circuit board 20 and the feeders 3, 3,... Is assigned to the second imaging camera 11B. The allocation of these imaging processes is controlled based on the movement position of the XY robot 5 in the X direction, for example.
[0028]
The motion mechanisms 15A and 15B are provided in association with the respective suction nozzles 13A and 13B, and individually move the respective suction nozzles 13A and 13B in the vertical direction and the rotation direction. Specifically, the motion mechanism 15A (15B) moves the suction nozzle 13A (13B) to the motor 15a, the bracket 15b for holding the suction nozzle 13A (13B) and the motor 15a, and the bracket 15b up and down. A ball screw 15c to be moved, a nut 15d, a motor 15e for moving the bracket 15b up and down by acting on the ball screw 15c, a linear guide 15f for moving the bracket 15b up and down, a position detection for detecting the position of the motor 15e and the electronic component 30 15g, 15g, and structural members 15h for holding the position detectors 15g, 15g.
[0029]
The component mounting apparatus 1 of this embodiment is configured as described above, and the following processing is performed by the suction head mechanism 4 equipped with two sets of imaging cameras 11A and 11B, and supplied electronic components. Is adsorbed and mounted on the circuit board 20.
[0030]
That is, first, the circuit board 20 is carried in from the upstream apparatus connected to the component mounting apparatus 1 via the carry-in entrance 7a, and the circuit board 20 is stopped at a predetermined position.
Further, the electronic components are taken out one by one from the reels 2, 2... By the feeders 3, 3,.
[0031]
The positions of the circuit board 20 and the electronic components are stored in advance by a control device (not shown). When the electronic components are supplied onto the feeders 3, 3,..., The XY robot 5 is operated by the control of the control device, The suction head mechanism 4 is moved over the electronic component on the feeder. Thereafter, the motion mechanisms 15A and 15B of the suction head mechanism 4 are operated to lower the two suction nozzles 13A and 13B simultaneously or individually, and the lowered suction nozzles 13A and 13B are electrons on the two feeders 3 and 3, respectively. The parts are brought into contact with each other, and are further sucked to suck the electronic parts. Then, the motion mechanisms 15A and 15B are operated again, and the suction nozzles 13A and 13B that have sucked the electronic components are returned to their original heights.
[0032]
When the electronic component is sucked and held on the suction head mechanism 4, the XY robot 5 is operated under the control of the above-described control device, and the suction head mechanism 4 is moved onto the component mounting portion of the circuit board 20. Then, the motion mechanism 15A (15B) of the suction head mechanism 4 is individually operated to lower the suction nozzle 13A (13B) and rotate it by a deviation amount, and mount the electronic component on the mounting position of the circuit board 20. After mounting, the vacuum suction is released and the suction of the electronic components is released, and the motion mechanism 15A (15B) is activated to return the suction nozzle 13A (13B) to its original height.
[0033]
The electronic component mounting process as described above is performed by the number of the suction nozzles, and all of the plurality of electronic components sucked and held by the suction head mechanism 4 are mounted on the circuit board 20. At this time, even when the circuit board 20 is small and the mounting positions of a plurality of electronic components are close to each other, the interval between the plurality of suction nozzles 13A and 13B is small, so there is no need to move the XY robot 5 greatly. The efficiency of the mounting process has been improved.
[0034]
Further, when all the electronic components sucked and held by the suction head mechanism 4 are mounted, the process of sucking the electronic components from the feeders 3, 3... Is repeated again, and the electronic components are mounted on the circuit board 20.
[0035]
When all the predetermined electronic components have been mounted on the circuit board 20, the circuit board 20 is unloaded through the outlet 7 b to a downstream device connected to the component mounting apparatus 1. The component mounting process (one-cycle component mounting process) ends.
[0036]
During the process of mounting the electronic component, the position of the electronic component to be supplied, the position of the circuit board 20, and the position of the mounted electronic component are checked by the imaging cameras 11A and 11B of the suction head mechanism 4. The status is checked.
[0037]
The position of the supplied electronic component is confirmed, for example, by imaging and recognizing all the feeders 3, 3... By the imaging cameras 11A, 11B before starting the component mounting process of one cycle.
[0038]
That is, when the process of confirming the position of the supplied electronic component is started, first, the XY robot 5 is operated by the control of the control device, and the suction head mechanism 4 is moved from one side end of the feeders 3, 3. The upper part of this feeder 3, 3 ... is moved over the end. At this time, all the feeders 3, 3... Are imaged by the first and second imaging cameras 11A, 11B, but the feeders 3, 3... Arranged throughout are shared by the imaging cameras 11A, 11B. Thus, since the imaging is performed, the movement stroke of the XY robot 5 necessary for the imaging is reduced.
[0039]
Then, after imaging and recognizing all the feeders 3, 3... As described above, the positions of the feeders 3, 3... Stored in the control device and the actual positions (movement positions of the XY robot 5). If there is a gap between them, the position data of the electronic components supplied onto the feeders 3, 3... Is corrected by correcting the position data of the feeders 3, 3. Reconfirmed.
[0040]
The position of the circuit board 20 is confirmed by, for example, imaging and recognizing the marks provided on the circuit board 20 with the imaging cameras 11A and 11B when the circuit board 20 is transported and stopped. Regarding the imaging of the mark on the circuit board 20, if the mark is on one side in the feeding direction of the circuit board 20, the imaging is performed by the imaging camera 11 </ b> A (11 </ b> B) arranged on the same one side. If it is on the other side, the image is taken by the imaging camera 11B (11A) arranged on the other side. As a result, the movement stroke of the XY robot 5 is reduced even during mark recognition.
[0041]
Confirmation of the position and state of the mounted electronic components is performed by, for example, imaging and recognizing the mounted electronic components with the imaging cameras 11A and 11B after mounting each electronic component or after mounting all the electronic components. Done in As for the imaging of the electronic component, when the electronic component is mounted on one side in the feeding direction of the circuit board 20, the imaging is performed by the imaging camera 11A (11B) disposed on the same one side. When the component is mounted on the other side, imaging is performed by the imaging camera 11B (11A) disposed on the other side. As a result, the movement stroke of the XY robot 5 can be reduced even when the mounted electronic component is imaged. If there is a deviation between the angle or position of the electronic component stored in the control device and the actual angle or position after imaging of the electronic component, the electronic device stored in the control device is the amount of the deviation. By correcting the data of the angle and position of the component, the mounting position and state of the next electronic component are corrected.
[0042]
As described above, according to the component mounting apparatus 1 of this embodiment, a plurality of electronic components to be sucked and released individually to the suction head mechanism 4 that sucks (holds) and releases the components. The suction nozzles 13A and 13B and imaging cameras 11A and 11B for imaging the supply locations are provided in order to confirm the positions of a plurality of components to be supplied, and two sets of the imaging cameras 11A and 11B are provided. Since the imaging cameras 11A and 11B are respectively arranged on both sides of the plurality of suction nozzles 13A and 13B, it is possible to shorten the interval between the plurality of suction nozzles 13A and 13B. Even when parts are mounted, the efficiency of the mounting process can be improved.
[0043]
Furthermore, since two sets of imaging cameras 11A and 11B are provided in the suction head mechanism 4, and these two sets of imaging cameras 11A and 11B are arranged on both sides of the plurality of suction nozzles 13A and 13B, one imaging camera 11A ( 11B) performs imaging on one side and causes the other imaging camera 11B (11A) to perform imaging on the other side, so that the movement stroke of the XY robot 5 necessary for the imaging process, in particular, the imaging cameras 11A and 11B are arranged. The movement stroke in the X direction, which is the direction, can be reduced. This is useful without increasing the installation area of the component mounting apparatus 1, particularly the length in the board flow direction.
[0044]
Note that the present invention is not limited to the component mounting apparatus 1 according to this embodiment. For example, the suction nozzles 13A and 13B are shown as the head unit for holding the component. Needless to say, the number of head portions is not limited to two. In addition, the arrangement of the head unit and the imaging unit is not limited to the one arranged in a line. For example, the same effect can be obtained even when the head unit is arranged in a zigzag manner or the imaging unit is arranged out of the row of the head unit. Is done. Other detailed structures and methods, such as reels 2, 2... For storing parts, feeders 3, 3. Changes can be made without departing from the spirit of the invention.
[0045]
【The invention's effect】
According to the first aspect of the present invention, the head mechanism for holding and releasing the components confirms the positions of the plurality of head portions that individually hold and release the plurality of components to be supplied and the plurality of components to be supplied. And a plurality of imaging means for imaging each of the plurality of parts or the supply locations of the plurality of parts, and two sets of the imaging means are provided, and these two sets of imaging means are respectively provided on both sides of the plurality of head portions. Since it is arranged, the distance between the plurality of head portions can be shortened, and therefore, the efficiency of the mounting process can be improved even when components are mounted on a small board.
[0046]
Further, two sets of image pickup means are provided in the head mechanism, and these two sets of image pickup means are arranged on both sides of the plurality of head portions, so that one image pickup means performs image pickup on one side and the other image pickup means. When the other side is imaged, the movement stroke of the XY mechanism necessary for processing of the imaging means can be reduced. Since the movement stroke of the XY mechanism does not increase, it is useful without increasing the installation area of the component mounting machine, particularly the length in the board flow direction.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is an enlarged perspective view showing details of the head mechanism of FIG. 1;
FIG. 3 is a perspective view showing an example of a conventional component mounting apparatus.
4 is an enlarged perspective view showing details of the head mechanism of FIG. 3. FIG.
[Explanation of symbols]
1 Component mounting device 2, 2 ... Reel (component storage means)
3, 3 ... Feeder (supply means)
4 Suction Head Mechanism 5 XY Robots 11A and 11B Imaging Cameras 13A and 13B Suction Nozzle (Head)

Claims (1)

It has a supply means for supplying parts, a head mechanism for holding and releasing the parts, and an XY mechanism for moving the head mechanism in the XY direction. The supplied parts are held by the head mechanism and moved to a predetermined position. In the component mounting device for mounting the component on the board by releasing it later,
The supply means supplies a plurality of parts,
The head mechanism is
A plurality of head portions for individually holding and releasing a plurality of supplied parts;
An imaging means for imaging each of the plurality of parts or a supply location of the plurality of parts in order to confirm the positions of the plurality of parts to be supplied;
Two sets of the imaging means are provided,
The component mounting apparatus, wherein the two sets of imaging means are arranged on both sides of the plurality of head portions.

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