KR100376866B1 - A suction picker - Google Patents
A suction picker Download PDFInfo
- Publication number
- KR100376866B1 KR100376866B1 KR10-2000-0060453A KR20000060453A KR100376866B1 KR 100376866 B1 KR100376866 B1 KR 100376866B1 KR 20000060453 A KR20000060453 A KR 20000060453A KR 100376866 B1 KR100376866 B1 KR 100376866B1
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor chip
- picker
- transfer
- rack gear
- support
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
Abstract
본 발명은 반도체 칩 이송용 픽커에 관한 것으로서, 종래의 반도체 칩 이송용 픽커는 수평 및 수직 구동만이 가능하므로 반도체 칩을 이송용 트레이에 로딩시키기 위해 별도의 회전 이송이 가능한 회전구동부를 별도 구비해야 하므로 이송과정이 복잡하며 별도의 회전장치가 필요하며, 회전장치에 의해 반도체 칩이 회전하여 로딩방향이 정렬되는 동안 픽커의 작동이 중단되므로 반도체 칩의 로딩 공정 진행시간이 지연되어 전체적인 반도체 칩 이송수율이 저하되는 문제점이 있었던 바, 본 발명에 따른 반도체 칩 이송용 픽커는 반도체 칩을 수평 및 수직 이송시킬 수 있을 뿐만 아니라 반도체 칩의 이송과정에서 회전이 가능하도록 한 것이다.The present invention relates to a picker for transporting a semiconductor chip, and the conventional picker for transporting a semiconductor chip can only be driven horizontally and vertically, so that a separate rotation driving part capable of a separate rotational transport to load the semiconductor chip into the transport tray must be separately provided. Therefore, the transfer process is complicated and a separate rotation device is required, and since the picker is stopped while the semiconductor chip is rotated by the rotation device to align the loading direction, the progress of the loading process of the semiconductor chip is delayed, resulting in overall semiconductor chip transfer yield. As a result of this deterioration, the picker for semiconductor chip transfer according to the present invention can not only horizontally and vertically transfer the semiconductor chip but also rotate in the transfer process of the semiconductor chip.
Description
본 발명은 반도체 칩 이송용 픽커(picker)에 관한 것으로서, 특히, 쏘잉된 반도체 칩을 이송용 트레이에 로딩시키는 과정에서 반도체 칩의 수평 및 수직 이송뿐만 아니라 회전 이송이 가능한 반도체 칩 이송용 픽커에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a picker for semiconductor chip transfer, and more particularly, to a picker for semiconductor chip transfer capable of horizontal and vertical transfer as well as rotation transfer of a semiconductor chip in a process of loading a sawed semiconductor chip into a transfer tray. will be.
일반적으로 반도체 칩은 웨이퍼 단위에서 쏘잉(sawing)공정을 통해 낱개 단위로 절단되어 외관 검사를 수행한 다음, 패키지 공정을 수행하기 위해 이송용 트레이(tray)에 낱개 단위로 적재된다.In general, the semiconductor chip is cut into individual units through a sawing process in a wafer unit, and then inspected for appearance. Then, the semiconductor chips are individually stacked in a transfer tray to perform a package process.
따라서, 반도체 칩의 외관 검사와 이송용 트레이에 적재시키기 위해 이송장치가 사용된다.Therefore, a conveying apparatus is used to inspect the appearance of the semiconductor chip and to load it on the conveying tray.
도 1 은 쏘잉된 반도체 칩을 이송용 트레이에 로딩시키는 종래의 반도체 칩 로딩공정을 설명하기 위한 도면이다.1 is a view for explaining a conventional semiconductor chip loading process of loading the sawed semiconductor chip in the transfer tray.
도시된 바와 같이, 종래에는 쏘잉된 반도체 칩(6)을 이송용 트레이(7)에 로딩시키기 위해 반도체 칩 이송용 픽커(1)를 사용한다.As shown, conventionally, the semiconductor chip transfer picker 1 is used to load the sawed semiconductor chip 6 into the transfer tray 7.
반도체 칩 이송용 픽커(1)는 수평 구동암(2)에 의해 수평 구동하며, 수직 구동실린더(3)에 의해 수직 구동하는 지지대(4)에 반도체 칩(6)을 진공으로 흡착하는 다수개의 진공흡착축(5)이 고정 설치되어 반도체 칩(6)을 이송시킨다.The semiconductor chip transfer picker 1 is horizontally driven by the horizontal drive arm 2, and a plurality of vacuums are used to vacuum-adsorb the semiconductor chip 6 to a support 4 vertically driven by the vertical drive cylinder 3. An adsorption shaft 5 is fixedly installed to transfer the semiconductor chip 6.
이러한 구성으로 된 반도체 칩 이송용 픽커(1)에 의해 반도체 칩(6)의 로딩공정을설명하면 다음과 같다.The loading process of the semiconductor chip 6 by the semiconductor chip transfer picker 1 having such a configuration will be described below.
먼저, 초기 위치에서 반도체 칩 이송용 픽커(1)는 수평 구동암(2)에 의해 지지대(4)가 쏘잉된 반도체 칩(6)의 상단까지 수평구동한다.First, the semiconductor chip transfer picker 1 is driven horizontally to the upper end of the semiconductor chip 6 where the support 4 is sawed by the horizontal drive arm 2 at the initial position.
이 상태에서 지지대(4)는 수직 구동실린더(3)에 의해 진공 흡착축(5)의 하면과 반도체 칩(6)의 상면이 서로 접촉될 때까지 다운(down)하여 진공으로 반도체 칩을 흡착한 다음, 다시 수직 구동실린더(3)에 의해 업(up)된다.In this state, the support 4 is moved down by the vertical drive cylinder 3 until the bottom surface of the vacuum adsorption shaft 5 and the top surface of the semiconductor chip 6 come into contact with each other to adsorb the semiconductor chips by vacuum. Next, it is up by the vertical drive cylinder 3 again.
이 상태에서 지지대(4)는 수평 구동암(2)에 의해 수평이동하여 외관검사부(8)를 통과하면서 반도체 칩(6)의 외관검사를 수행한 다음, 회전구동부(9)상단까지 이동한다.In this state, the support 4 is horizontally moved by the horizontal drive arm 2 to perform the visual inspection of the semiconductor chip 6 while passing through the visual inspection section 8, and then moves to the upper portion of the rotation driving section 9.
그리고, 회전구동부(9)상단에서 지지대(4)는 수직 구동실린더(3)에 의해 다운(down)구동하여 진공흡착된 반도체 칩(6)을 회전구동부(9)상단에 안착시킨 다음, 다시 업(up)구동된다.At the top of the rotary driver 9, the support 4 is driven down by the vertical drive cylinder 3 to seat the vacuum chip 6 on the top of the rotary driver 9, and then up again. (up) is driven.
이 상태에서 회전구동부(9)에 안착된 반도체 칩(6)은 회전모터(10)에 의해 이송용 트레이(7)에 로딩될 방향으로 회전하고, 업(up)구동된 지지대(4)가 다시 다운(down)하여 회전된 반도체 칩을 진공흡착하고, 다시 업(up)구동한 다음 수평 이동하여 이송용 트레이(7)에 반도체 칩(6)을 로딩시킨다.In this state, the semiconductor chip 6 seated on the rotary drive unit 9 rotates in the direction to be loaded into the transfer tray 7 by the rotary motor 10, and the up driven support 4 is again The semiconductor chip rotated by vacuuming down is vacuum-suppressed, driven up again, and then horizontally moved to load the semiconductor chip 6 into the transfer tray 7.
그러나, 이러한 종래의 반도체 칩을 이송용 트레이에 로딩시키는 과정은 로딩에 시간이 많이 소요되어 전체적인 반도체 칩 이송 수율이 저하되고, 로딩 장치가 콤팩트화되지 못한 문제점이 있다.However, such a conventional process of loading a semiconductor chip into a transfer tray takes a long time for loading, thereby lowering the overall semiconductor chip transfer yield and causing the loading device not to be compact.
즉, 종래의 반도체 칩 이송용 픽커는 수평 및 수직 구동만이 가능하므로 반도체 칩을 수평 및 수직 이송만 시킬 수 있어 쏘잉된 반도체 칩을 이송용 트레이에 로딩시키기 위해 별도의 회전 이송이 가능한 회전구동부를 별도 구비해고, 회전구동부에서 반도체 칩의 로딩방향을 정렬하여야 하므로 이송과정이 복잡하며 장치가 대형화되어야 한다.That is, the conventional semiconductor chip transfer picker can only horizontally and vertically drive, so the semiconductor chip can only be horizontally and vertically transported, so that the rotary drive unit can be separately rotated and transported to load the sawed semiconductor chip into the transporting tray. Separately provided, since the loading direction of the semiconductor chip in the rotary drive unit must be aligned, the transfer process is complicated and the device must be enlarged.
또한, 회전구동부에 의해 반도체 칩이 회전하여 로딩방향이 정렬되는 동안, 픽커의 작동이 중단된 상태를 유지하여야 한다.In addition, while the semiconductor chip is rotated by the rotation driving unit so that the loading direction is aligned, the picker should be kept in a suspended state.
따라서, 반도체 칩의 로딩 공정 진행시간이 지연되어 전체적인 반도체 칩 이송수율이 저하된다.Therefore, the progress of the loading process of the semiconductor chip is delayed and the overall semiconductor chip transfer yield is lowered.
따라서, 본 발명은 상기 종래기술의 문제점을 해결하고자 안출된 것으로써, 반도체 칩 로딩공정의 시간 지연 발생요소를 제거하여 반도체 칩 이송 수율을 향상시킴과 동시에 콤팩트화된 반도체 칩 이송용 픽커를 제공하는데 그 목적이 있다.Accordingly, the present invention has been made to solve the problems of the prior art, to improve the semiconductor chip transfer yield by eliminating the time delay generation factor of the semiconductor chip loading process and at the same time to provide a compact semiconductor chip transfer picker The purpose is.
이에 본 발명에 따른 반도체 칩 이송용 픽커는 상기의 목적을 달성하기 위해, 수평 구동암에 의해 수평이동되고 수직 구동실린더에 의해 수직이동되는 지지대에 설치된 다수개의 진공 흡착축으로 쏘잉된 반도체 칩을 이송용 트레이에 로딩시키는 반도체 칩 이송용 픽커에 있어서, 지지대에 진공 흡착축을 회전 구동시키는 회전구동수단이 구비된 것을 특징으로 한다.In order to achieve the above object, the picker for transporting a semiconductor chip according to the present invention transfers a semiconductor chip shot by a plurality of vacuum suction shafts installed on a support horizontally moved by a horizontal drive arm and vertically moved by a vertical drive cylinder. A semiconductor chip transfer picker to be loaded into a tray for use, characterized in that the support is provided with rotation driving means for rotationally driving the vacuum suction shaft.
도 1 은 쏘잉된 반도체 칩을 이송용 트레이에 로딩시키는 종래의 반도체 칩 로딩공정을 설명하기 위한 도면.1 is a view for explaining a conventional semiconductor chip loading process of loading the sawed semiconductor chip in the transfer tray.
도 2 는 본 발명에 따른 반도체 칩 이송용 픽커의 정면도.2 is a front view of a picker for semiconductor chip transfer according to the present invention;
도 3 는 본 발명에 따른 반도체 칩 이송용 픽커의 평면도.3 is a plan view of a picker for semiconductor chip transfer according to the present invention;
도 4 는 본 발명에 따른 반도체 칩 이송용 픽커의 측면도.4 is a side view of a picker for semiconductor chip transfer according to the present invention;
도 5 는 본 발명에 따른 반도체 칩 이송용 픽커를 이용한 반도체 칩 로딩공정을 설명하기 위한 도면.5 is a view for explaining a semiconductor chip loading process using a semiconductor chip transfer picker according to the present invention.
※ 도면의 주요부분에 대한 부호의 설명 ※※ Explanation of code about main part of drawing ※
1,100 : 반도체 칩 이송용 픽커 2,101 : 수평 구동암1,100: semiconductor chip transfer picker 2,101: horizontal drive arm
3,102 : 수직 구동실린더 4,104 : 지지대3,102: vertical driving cylinder 4,104: support
5, 105 : 진공흡착축 6 : 반도체 칩5, 105: vacuum adsorption shaft 6: semiconductor chip
7 : 이송용 트레이 8 : 외관 검사부7: transfer tray 8: appearance inspection unit
9 : 회전구동부 10 : 회전모터9: rotation driving unit 10: rotation motor
103 : 메인 브라켓 106 : 관통공103: main bracket 106: through hole
107 : 피니언 기어 108 : 가이드 레일107: pinion gear 108: guide rail
109 : 랙기어 110 : 랙기어 구동실린더109: rack gear 110: rack gear driving cylinder
112 : 가이드공 113 : 가이드핀112: guide ball 113: guide pin
이하, 첨부된 도면을 참조하여 본 발명에 따른 반도체 칩 이송용 픽커의 바람직한 일실시예를 상세하게 설명한다.Hereinafter, a preferred embodiment of a semiconductor chip transfer picker according to the present invention will be described in detail with reference to the accompanying drawings.
도 2,3,4 는 각각 본 발명에 따른 반도체 칩 이송용 픽커의 정면도, 평면도, 측면도이다.2, 3, and 4 are a front view, a plan view, and a side view of a picker for semiconductor chip transfer according to the present invention, respectively.
도면을 참조하면, 본 발명에 따른 반도체 칩 이송용 픽커(100)는 수평 구동하는 수평 구동암(101)과, 수평구동암의 끝단에 연결 설치된 수직 구동실린더(102)와, 수직 구동실린더에 연결 설치된 메인 브라켓(103)과, 메인 브라켓에 연결 설치되고 반도체 칩(6)을 진공흡착하는 진공흡착축(105)이 다수개 설치되며 수평 구동암(101)과 수직 구동실린더(102)에 의해 수평 및 수직 이동하는 지지대(104)와, 지지대에 설치되어 진공흡착축(105)을 회전 구동시키는 회전 구동수단을 포함하여 이루어진다.Referring to the drawings, the semiconductor chip transfer picker 100 according to the present invention includes a horizontal drive arm 101 for horizontal driving, a vertical drive cylinder 102 connected to an end of the horizontal drive arm, and a vertical drive cylinder. The main bracket 103 is installed, and a plurality of vacuum suction shafts 105 connected to the main bracket and vacuum-absorbing the semiconductor chip 6 are installed, and are horizontally mounted by the horizontal drive arm 101 and the vertical drive cylinder 102. And a support 104 which moves vertically, and rotation driving means installed on the support to rotationally drive the vacuum suction shaft 105.
좀더 구체적으로 설명하면, 본 발명에 따른 반도체 칩 이송용 픽커의 회전 구동수단은 지지대(104)에 천공되어 진공 흡착축(105)이 삽설되는 관통공(106)과, 관통공에 삽설된 진공흡착축(105)의 상단에 연결 설치된 피니언 기어(107)와, 피니언 기어와 치합되고 지지대(104)상면에 설치된 가이드 레일(108)에서 슬라이딩 구동하는 랙기어(109)와, 랙기어의 일단에 구동축(111)이 연결 설치되어 랙기어를 슬라이딩 구동시키는 랙기어 구동실린더(110)를 포함하여 이루어진다.More specifically, the rotation driving means of the semiconductor chip transport picker according to the present invention is a through hole 106 is drilled in the support 104, the vacuum suction shaft 105 is inserted, and the vacuum adsorption inserted in the through hole A pinion gear 107 connected to the upper end of the shaft 105, a rack gear 109 sliding with the pinion gear and slidingly driven by a guide rail 108 provided on the support 104, and a drive shaft at one end of the rack gear. 111 is connected to the rack gear driving cylinder 110 for sliding the rack gear is installed is made.
또한, 본 발명에 따른 반도체 칩 이송용 픽커(100)는 랙기어(109)의 슬라이딩 거리를 제한하여 피니언 기어(107)의 회전각도를 제한하기 위해 회전제한 수단이 구비된다.In addition, the picker 100 for transferring semiconductor chips according to the present invention is provided with a rotation limiting means for limiting the rotation angle of the pinion gear 107 by limiting the sliding distance of the rack gear 109.
회전제한 수단은 가이드 레일(108)의 상면에 가이드공(112)을 천공하여 랙기어(109)에 가이드공(112)으로 돌설되는 가이드핀(113)을 설치하여 이루어진다.The rotation limit means is made by installing a guide pin 113 protruding from the guide hole 112 in the rack gear 109 by drilling the guide hole 112 on the upper surface of the guide rail 108.
이와 같이 구성된 본 발명에 따른 반도체 칩 이송용 픽커(100)를 이용하여 쏘잉된 반도체 칩(6)을 이송용 트레이(7)에 로딩시키는 과정을 도 5를 참조하여 설명한다.A process of loading the sawed semiconductor chip 6 into the transfer tray 7 using the semiconductor chip transfer picker 100 according to the present invention configured as described above will be described with reference to FIG. 5.
먼저, 쏘잉된 반도체 칩(6)을 진공흡착하기 위해 본 발명에 따른 반도체 칩 이송용 픽커의 수평 구동암(101)이 수평이동하여 지지대(104)가 반도체칩 상단에 위치된다.First, the horizontal drive arm 101 of the semiconductor chip transport picker according to the present invention is horizontally moved to vacuum the sawed semiconductor chip 6 so that the support 104 is positioned on the top of the semiconductor chip.
이 상태에서 수직 구동실린더(102)에 의해 지지대(104)가 다운(down)하여 반도체 칩(6)을 진공흡착축(105)에 의해 진공흡착한 다음, 업(up)하여 반도체 칩을 들어올린다.In this state, the support 104 is moved down by the vertical drive cylinder 102 to vacuum the semiconductor chip 6 by the vacuum suction shaft 105, and then up to lift the semiconductor chip. .
이 상태에서 지지대(104)는 수평 구동암(101)에 의해 외관 검사부(8)로 이송되어 반도체 칩(6)의 외관 검사를 수행한 다음, 반도체 칩을 이송용 트레이(7)에 로딩시키기 위해 회전 구동수단에 의해 로딩방향으로 회전한다.In this state, the support 104 is transferred to the appearance inspection unit 8 by the horizontal drive arm 101 to perform the appearance inspection of the semiconductor chip 6, and then load the semiconductor chip into the transfer tray 7. It rotates in a loading direction by a rotation drive means.
여기서, 회전구동 수단에 의한 반도체 칩(6)의 회전은 랙기어 구동실린더(110)가 작동하여 가이드 레일(108)에 놓여진 랙기어(109)를 밀어 이동시키면, 랙기어(109)와 맞물린 피니언 기어(107)가 회전한다.Here, the rotation of the semiconductor chip 6 by the rotation driving means is driven by the rack gear drive cylinder 110 to push the rack gear 109 placed on the guide rail 108, the pinion engaged with the rack gear 109 The gear 107 rotates.
피니언 기어(107)가 회전함에 따라 관통공(106)에 삽설된 진공흡착축(105)이 연동하여 회전하면서 반도체 칩(6)이 회전된다.As the pinion gear 107 rotates, the semiconductor chip 6 is rotated while the vacuum suction shaft 105 inserted in the through hole 106 rotates in association.
이때, 피니언 기어(107)의 회전은 일정 각도 이내에서 회전이 제한되어 진공흡착된 반도체 칩(6)이 소정 각도 이내에서 회전된다.At this time, the rotation of the pinion gear 107 is limited to rotation within a predetermined angle, so that the vacuum-adsorbed semiconductor chip 6 is rotated within a predetermined angle.
이는 랙기어(109)에 돌설된 가이드 핀(113)이 가이드 레일(108)에 천공된 가이드공(112)을 따라 이동하면서 가이드공(112)의 일측 끝단에 도달하기 전까지회전되기 때문이다.This is because the guide pin 113 protruding from the rack gear 109 is rotated until it reaches one end of the guide hole 112 while moving along the guide hole 112 drilled in the guide rail 108.
따라서, 본 발명에 따른 반도체 칩 이송용 픽커(100)는 반도체 칩의 수평, 수직, 회전 이동이 가능하게 되어 반도체 칩(6)을 이송용 트레이(7)에 로딩 방향으로 회전시키기 위한 별도의 회전장치를 구비하지 않아도 된다.Therefore, the semiconductor chip transfer picker 100 according to the present invention is capable of horizontal, vertical, and rotational movement of the semiconductor chip, so that a separate rotation for rotating the semiconductor chip 6 in the loading direction to the transfer tray 7 is possible. It is not necessary to have a device.
상기에서 상술한 바와 같이, 본 발명에 따른 반도체 칩 이송용 픽커는 수평, 수직 이동하면서 쏘잉된 반도체 칩을 이송용 트레이에 이송시키는 과정에서 회전 이동하면서 반도체 칩의 로딩방향을 정렬시킴으로써 반도체 칩의 로딩과정이 연속적으로 이루어지게 된다.As described above, in the semiconductor chip transfer picker according to the present invention, the semiconductor chip is loaded by aligning the loading direction of the semiconductor chip while rotating in the process of transferring the sawed semiconductor chip to the transfer tray while moving horizontally and vertically. The process is continuous.
따라서, 반도체 칩 로딩공정의 지연시간 발생을 방지하여 반도체 칩 이송수율을 향상시키게 된다.Therefore, it is possible to prevent the delay time of the semiconductor chip loading process to improve the semiconductor chip transfer yield.
또한, 본 발명에 따른 반도체 칩 이송용 픽커는 반도체 칩의 로딩방향을 정렬시키기 위한 별도의 회전장치가 불필요하므로 장치의 콤팩트화가 가능하게 된다.In addition, the picker for transferring semiconductor chips according to the present invention does not require a separate rotating device for aligning the loading direction of the semiconductor chip, thereby making the device compact.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2000-0060453A KR100376866B1 (en) | 2000-10-13 | 2000-10-13 | A suction picker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2000-0060453A KR100376866B1 (en) | 2000-10-13 | 2000-10-13 | A suction picker |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20020029556A KR20020029556A (en) | 2002-04-19 |
| KR100376866B1 true KR100376866B1 (en) | 2003-03-19 |
Family
ID=19693461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2000-0060453A KR100376866B1 (en) | 2000-10-13 | 2000-10-13 | A suction picker |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100376866B1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101133248B1 (en) * | 2009-11-30 | 2012-04-05 | (주)진성 테크템 | apparatus transfer pack-direction and load-distance of sealed package |
| KR101305346B1 (en) | 2007-02-09 | 2013-09-06 | 한미반도체 주식회사 | Sawing and Handling Apparatus for Semiconductor Package |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100691851B1 (en) * | 2005-12-02 | 2007-03-12 | (주)와이에스썸텍 | Vacuum absorption device for transferring hot plate |
| KR100793270B1 (en) * | 2006-08-24 | 2008-01-10 | 세크론 주식회사 | Apparatus for strip picker of semiconductor package |
| KR100807106B1 (en) * | 2006-12-12 | 2008-02-26 | 주식회사 프로텍 | Pick-up cylinder in one piece simultaneously having up-down and rotation drive |
| KR102348976B1 (en) * | 2019-12-19 | 2022-01-07 | 현대제철 주식회사 | Test piece transportion apparatus |
| CN116884908B (en) * | 2023-09-06 | 2023-11-10 | 深圳华太芯创有限公司 | Adsorption transfer mechanism for chip processing and application method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980049253A (en) * | 1996-12-19 | 1998-09-15 | 유홍준 | Dual Sorter Of IC Product Automatic Sorter |
| JPH11163076A (en) * | 1997-12-02 | 1999-06-18 | Hitachi Ltd | Transfer device |
| KR19990071252A (en) * | 1998-02-28 | 1999-09-15 | 윤종용 | Semiconductor Chip Package Transfer Device |
| KR19990036653U (en) * | 1998-02-26 | 1999-09-27 | 유홍준 | Suction port left and right flow device of IC sorter tool |
| KR20000000248U (en) * | 1998-06-05 | 2000-01-15 | 김영환 | Semiconductor Wafer Transfer Robot |
| KR20000014177A (en) * | 1998-08-18 | 2000-03-06 | 윤종용 | Wafer transfer equipment |
-
2000
- 2000-10-13 KR KR10-2000-0060453A patent/KR100376866B1/en not_active IP Right Cessation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980049253A (en) * | 1996-12-19 | 1998-09-15 | 유홍준 | Dual Sorter Of IC Product Automatic Sorter |
| JPH11163076A (en) * | 1997-12-02 | 1999-06-18 | Hitachi Ltd | Transfer device |
| KR19990036653U (en) * | 1998-02-26 | 1999-09-27 | 유홍준 | Suction port left and right flow device of IC sorter tool |
| KR19990071252A (en) * | 1998-02-28 | 1999-09-15 | 윤종용 | Semiconductor Chip Package Transfer Device |
| KR20000000248U (en) * | 1998-06-05 | 2000-01-15 | 김영환 | Semiconductor Wafer Transfer Robot |
| KR20000014177A (en) * | 1998-08-18 | 2000-03-06 | 윤종용 | Wafer transfer equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101305346B1 (en) | 2007-02-09 | 2013-09-06 | 한미반도체 주식회사 | Sawing and Handling Apparatus for Semiconductor Package |
| KR101133248B1 (en) * | 2009-11-30 | 2012-04-05 | (주)진성 테크템 | apparatus transfer pack-direction and load-distance of sealed package |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20020029556A (en) | 2002-04-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1123519C (en) | Integrated intra-bag transfer, storage and delivery system | |
| TWI439405B (en) | Plate - like component transfer equipment | |
| KR0165350B1 (en) | Semiconductor wafer supply system | |
| KR100244688B1 (en) | Wafer transfer apparatus | |
| KR100350693B1 (en) | Cassette carrier | |
| JP4509411B2 (en) | Loading / unloading device | |
| KR100376866B1 (en) | A suction picker | |
| KR100273837B1 (en) | A providing device for wafer ring | |
| JP2000286312A5 (en) | Rotational drive mechanism, mounting mechanism of the object to be inspected, and inspection device | |
| KR20090030375A (en) | Apparatus for reversing a semiconductor package | |
| KR100633848B1 (en) | Substrate installation/removal device, substrate installation/removal method, substrate carrier device, and substrate carrier method | |
| KR20050058555A (en) | Dry system of semiconductor package | |
| JP2008235845A (en) | Processing apparatus | |
| JP2002064128A (en) | Substrate transfer device and substrate processing apparatus provided with this substrate transfer device | |
| KR100491928B1 (en) | Apparatus with the tables for reversing | |
| JP3578593B2 (en) | Substrate alignment device | |
| CN1243090A (en) | Method and system for continuously producing workpiece on production line | |
| KR100730594B1 (en) | Apparatus for chip picker of sawing sorter system | |
| JP3671051B2 (en) | Electronic component bonding apparatus and bonding method | |
| KR100630955B1 (en) | Substrate delivering apparatus | |
| KR200161478Y1 (en) | Wafer transfer apparatus | |
| KR100874287B1 (en) | Carrier support device and method of carrying out object | |
| KR100503042B1 (en) | Apparatus for supporting a substrate and lifting device used therein | |
| KR100626555B1 (en) | Device for Cutting of nonmetal | |
| JP4225632B2 (en) | Article transport device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| FPAY | Annual fee payment |
Payment date: 20130225 Year of fee payment: 11 |
|
| FPAY | Annual fee payment |
Payment date: 20140221 Year of fee payment: 12 |
|
| FPAY | Annual fee payment |
Payment date: 20150223 Year of fee payment: 13 |
|
| FPAY | Annual fee payment |
Payment date: 20160223 Year of fee payment: 14 |
|
| FPAY | Annual fee payment |
Payment date: 20170223 Year of fee payment: 15 |
|
| FPAY | Annual fee payment |
Payment date: 20180223 Year of fee payment: 16 |
|
| LAPS | Lapse due to unpaid annual fee |