KR20000014177A - Wafer transfer equipment - Google Patents

Wafer transfer equipment Download PDF

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Publication number
KR20000014177A
KR20000014177A KR1019980033432A KR19980033432A KR20000014177A KR 20000014177 A KR20000014177 A KR 20000014177A KR 1019980033432 A KR1019980033432 A KR 1019980033432A KR 19980033432 A KR19980033432 A KR 19980033432A KR 20000014177 A KR20000014177 A KR 20000014177A
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KR
South Korea
Prior art keywords
wafer
wafer transfer
chamber
load lock
arm
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Application number
KR1019980033432A
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Korean (ko)
Inventor
전재홍
Original Assignee
윤종용
삼성전자 주식회사
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Application filed by 윤종용, 삼성전자 주식회사 filed Critical 윤종용
Priority to KR1019980033432A priority Critical patent/KR20000014177A/en
Publication of KR20000014177A publication Critical patent/KR20000014177A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Abstract

PURPOSE: A wafer transfer equipment is provided to improve a structure of chamber for transfer equipment and load lock chamber and increase quantity of processing and reduce cost. CONSTITUTION: The wafer transfer equipment comprises a cassette, a load lock chamber and a stage. In the wafer transfer equipment, the cassette contains a wafer and moves in up/down direction. The load lock chamber has a loading unit and an unloading unit and exchanges and transfers the wafer between the cassette and a processing chamber, wherein the loading unit and the unloading unit are connected to a supporter and a driver which connect an arm to a supporting plate to adjust a location of arm. The stage moves the wafer on load lock chamber to the processing chamber.

Description

웨이퍼 이송장치Wafer Transfer Device

본 발명은 웨이퍼 이송장치에 관한 것으로서, 보다 상세하게는 로딩유닛과 언로딩유닛을 분리하여 구성한 웨이퍼 이송장치에 관한 것이다.The present invention relates to a wafer transfer apparatus, and more particularly, to a wafer transfer apparatus configured by separating a loading unit and an unloading unit.

통상적으로 웨이퍼는 사진, 확산, 식각, 화학기상증착 및 금속배선 등의 공정이 반복 수행됨에 따라 반도체장치로 제작되고, 이렇게 반도체장치로 제작되기까지 웨이퍼는 요구되는 제조설비로 이송되어 각 공정에 따른 작업을 수행하게 된다.Typically, wafers are manufactured as semiconductor devices by repeating processes such as photographing, diffusion, etching, chemical vapor deposition, and metallization, and the wafers are transferred to required manufacturing facilities until the semiconductor devices are manufactured. Will do the work.

이러한 웨이퍼는 통상 이송하기 용이하도록 형성된 캐리어에 담겨져 작업자 또는 다른 이송수단에 의해 소정 위치로 옮겨지게 되고, 이어 다른 이송장치에 의해 캐리어에서 제조설비 내부로 이송되어 공정을 수행하기 용이한 형태로 놓이게 된다.Such wafers are usually contained in a carrier formed to be easily transported and transferred to a predetermined position by an operator or other transfer means, and then transferred from the carrier to the inside of the manufacturing facility by another transfer device so that the wafer is placed in an easy form to perform the process. .

도1은 종래의 웨이퍼 이송장치를 나타낸 도면이다.1 is a view showing a conventional wafer transfer apparatus.

도1을 참조하면, 웨이퍼 이송장치(2)는 웨이퍼(10)가 적재된 카세트(12), 웨이퍼 이송로봇(14) 및 웨이퍼(10)를 공정챔버(16)로 이송하도록 하는 스테이지(18)를 포함하여 이루어진다.Referring to FIG. 1, the wafer transfer device 2 includes a stage 18 for transferring a cassette 12, a wafer transfer robot 14, and a wafer 10 loaded with a wafer 10 to a process chamber 16. It is made, including.

상기 로봇이 움직일시 X,Y,Z축 이동을 하며 웨이퍼 사이즈가 증가함에 따라 회전 반경이 커져 이송장치의 사이즈가 증가한다. 그리고 공정챔버에서 1매마다 펌핑과 제거를 실시함에 따라 처리량의 감소를 유발하고 있다. 또한, 복잡한 로봇에 의해서 설비의 가격 상승을 유발하는 문제점이 있었다.As the robot moves, the X, Y, and Z axes move, and as the wafer size increases, the radius of rotation increases, thereby increasing the size of the transfer apparatus. In addition, as the pumping and removing is performed every sheet in the process chamber, the throughput is reduced. In addition, there is a problem that causes a price increase of the facility by a complex robot.

본 발명의 목적은, 이송장치의 챔버와 로드 락 챔버의 구조를 개선하여 처리량의 증대와 설비가격을 낮출수 있도록 하는 웨이퍼 이송장치를 제공하는 데 있다.SUMMARY OF THE INVENTION An object of the present invention is to provide a wafer transfer apparatus which can improve the structure of the chamber of the transfer apparatus and the load lock chamber to increase the throughput and lower the equipment price.

도1은 종래의 웨이퍼 이송장치를 나타낸 도면이다.1 is a view showing a conventional wafer transfer apparatus.

도2는 본 발명의 일 실시예에 따른 웨이퍼 이송장치를 나타내는 도면이다.2 is a view showing a wafer transfer apparatus according to an embodiment of the present invention.

도3은 도2의 로딩유닛을 나타내는 도면이다.3 is a view showing a loading unit of FIG.

도4는 도3의 상부 암의 형태를 상세히 나타내는 도면이다.4 is a view showing in detail the shape of the upper arm of FIG.

도5는 도2의 언로딩유닛을 나타내는 도면이다.5 is a view illustrating the unloading unit of FIG. 2.

※ 도면의 주요 부분에 대한 부호의 설명※ Explanation of codes for main parts of drawing

2,4 : 웨이퍼 이송장치2,4: Wafer transfer device

10,20 : 웨이퍼 12,22 : 카세트10,20 wafer 12,22 cassette

14 : 로봇 16,28 : 공정챔버14: robot 16,28: process chamber

18,30 : 스테이지 23 : 로드 락 챔버18,30 stage 23: load lock chamber

24 : 로딩유닛 26 : 언로딩유닛24: loading unit 26: unloading unit

32 : 핀 34 : 암(Arm)32: pin 34: arm

36 : 지지판 38 : 지지대36: support plate 38: support

40 : 고정대 42 : 구동기40: holder 42: actuator

상기 목적을 달성하기 위한 본 발명에 따른 웨이퍼 이송장치는 웨이퍼가 적재되며 상하운동 하는 카세트, 상기 카세트와 공정챔버 간에 상기 웨이퍼를 교환 이송하는 로딩유닛과 언로딩유닛을 구비한 로드 락 챔버 및 상기 로드 락 챔버의 웨이퍼를 상기 공정챔버로 이송하는 스테이지를 포함하여 이루어진다.The wafer transfer apparatus according to the present invention for achieving the above object is a cassette loaded with the wafer and the vertical movement, the load lock chamber and the load having a loading unit and an unloading unit for transferring the wafer exchanged between the cassette and the process chamber And a stage for transferring the wafer of the lock chamber to the process chamber.

상기 로딩유닛과 언로딩유닛은 상기 웨이퍼가 안착되는 암, 상기 암을 지지판에 연결하여 주는 지지대 및 구동기에 연결되어 상기 암의 위치를 조절하게 되는 지지판으로 이루어진다.The loading unit and the unloading unit include an arm on which the wafer is seated, a support for connecting the arm to the support plate, and a support plate connected to a driver to adjust the position of the arm.

상기 지지판은 고정대에 의해 상기 구동기에 연결되어 상기 구동기의 힘을 상기 지지대에 전달한다.The support plate is connected to the driver by a fixture to transmit the force of the driver to the support.

상기 지지대는 좌우로 이동 또는 회전되도록 하는 것을 특징으로 한다.The support is characterized in that to move or rotate left and right.

상기 스테이지에는 웨이퍼가 스페이지에서 공정챔버로 또는 공정챔버에서 스테이지로 이송되도록 상하운동하는 핀이 설치되어 있다.The stage is provided with a pin that moves up and down so that the wafer is transferred from the step to the process chamber or from the process chamber to the stage.

이하, 본 발명의 구체적인 실시예를 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도2는 본 발명의 일 실시예를 따른 웨이퍼 이송장치를 나타내는 도면이다.2 is a view showing a wafer transfer apparatus according to an embodiment of the present invention.

도2에서 보는 바와 같이 웨이퍼 이송장치(4)는 웨이퍼(20)가 적재되며 상하운동하는 카세트(22), 상기 카세트(22)와 공정챔버(28) 간에 상기 웨이퍼(20)를 교환 이송하는 로딩유닛(24)과 언로딩유닛(26)을 구비한 로드 락 챔버(23) 및 상기 로드 락 챔버(23)의 웨이퍼(20)를 상기 공정챔버(28)로 이송하는 스테이지(30)를 포함하여 이루어진다.As shown in FIG. 2, the wafer transfer device 4 includes a cassette 22 in which a wafer 20 is loaded and moves up and down, and an exchange transfer of the wafer 20 between the cassette 22 and the process chamber 28. A load lock chamber 23 having a unit 24 and an unloading unit 26, and a stage 30 for transferring the wafer 20 of the load lock chamber 23 to the process chamber 28. Is done.

로딩유닛(24)과 언로딩유닛(26)을 나누어 활용하며, 이때 4개의 핀(32)이 상하운동에 의해서 로딩유닛(24)과 언로딩유닛(26)에서 공정챔버(28)로 이송이 가능하도록 한다. 즉 카세트(22)에서 웨이퍼(20)가 로딩유닛(24)을 통과하여 공정챔버(28)로 가면 언로딩유닛(26)을 지나 다시 카세트(22)로 나간다.The loading unit 24 and the unloading unit 26 are divided and utilized, wherein four pins 32 are transferred from the loading unit 24 and the unloading unit 26 to the process chamber 28 by vertical movement. Make it possible. That is, in the cassette 22, the wafer 20 passes through the loading unit 24 to the process chamber 28 and passes through the unloading unit 26 to the cassette 22 again.

도3를 참조하여 암의 구동형태를 설명하면, 상부 암(34)은 하부 지지판(36)에 움직이는 지지대(38)로 연결된다. 상기 하부 지지판(36)은 고정대(40)에 의해 구동기(42)에 연결되며 구동기(42)의 힘을 상기 움직이는 지지대(38)로 전달시키는 역할을 한다. 그리고 상부 암(34)은 좌우로 이동이 가능하고, 하부 지지판(36) 또한 하부 지지판 고정대(40) 위를 좌우로 이동이 가능하게 한다.Referring to Figure 3, the driving form of the arm, the upper arm 34 is connected to the support 38 moving to the lower support plate (36). The lower support plate 36 is connected to the driver 42 by the holder 40 and serves to transfer the force of the driver 42 to the moving support 38. And the upper arm 34 is movable to the left and right, and the lower support plate 36 also enables to move left and right on the lower support plate holder 40.

상부 암의 형태는 도4를 참조하면, 상부 암(34)은 움직이는 지지대(38)에 연결되어 있다. 상기 상부 암(34)은 진공형성에 의해 웨이퍼를 이송할 수 있도록 한다. 진공 홀(35)을 통하여 웨이퍼(20)를 상압에서는 잡고 있으며 이송장치 챔버가 진공으로 가면 진공 홀(35)을 닫아 웨이퍼(20)의 안정을 이룬다.4, the upper arm 34 is connected to a moving support 38. The upper arm 34 allows the wafer to be transferred by vacuum forming. The wafer 20 is held at normal pressure through the vacuum hole 35, and when the transfer chamber goes to vacuum, the vacuum hole 35 is closed to stabilize the wafer 20.

도5를 참조하면 상부 구동기(42)에 상부 지지판(36)이 연결되어 있고, 상부 지지판(36)에 하부 암(34)을 연결하는 움직이는 지지대(38)가 연결되어 있다. 움직이는 지지대(38)는 좌우로 이동 또는 회전도 가능하다.Referring to FIG. 5, an upper support plate 36 is connected to the upper driver 42, and a movable support 38 connecting the lower arm 34 to the upper support plate 36 is connected. The movable support 38 can also be moved left or right.

전술한 바와 같이 상기 웨이퍼 이송장치로 빠른 공정 진행이 가능하며, 단순한 구조에 의한 가격 절감이 가능하다.As described above, it is possible to proceed quickly with the wafer transfer device and to reduce the cost by a simple structure.

따라서, 본 발명에 의하면 이송장치의 챔버와 로드 락 챔버의 구조를 개선하여 처리량의 증대와 가격 절감에 효과가 있다.Therefore, according to the present invention, the structure of the chamber of the transfer apparatus and the load lock chamber may be improved, thereby increasing the throughput and reducing the cost.

이상에서 본 발명은 기재된 구체예에 대해서만 상세히 설명되었지만 본 발명의 기술사상 범위 내에서 다양한 변형 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속함은 당연한 것이다.Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.

Claims (5)

웨이퍼가 적재되며 상하운동하는 카세트;A cassette loaded with a wafer and moving up and down; 상기 카세트와 공정챔버 간에 상기 웨이퍼를 교환 이송하는 로딩유닛과 언로딩유닛을 구비한 로드 락 챔버; 및A load lock chamber having a loading unit and an unloading unit for transferring and transferring the wafer between the cassette and the process chamber; And 상기 로드 락 챔버의 웨이퍼를 상기 공정챔버로 이송하는 스테이지;A stage for transferring a wafer of the load lock chamber to the process chamber; 를 포함하여 이루어지는 것을 특징으로 하는 웨이퍼 이송장치.Wafer transfer apparatus comprising a. 제 1 항에 있어서,The method of claim 1, 상기 로딩유닛과 언로딩유닛은 상기 웨이퍼가 안착되는 암, 상기 암을 지지판에 연결하여 주는 지지대 및 구동기에 연결되어 상기 암의 위치를 조절하게 되는 지지판으로 이루어지는 것을 특징으로 하는 상기 웨이퍼 이송장치.The loading unit and the unloading unit are the wafer transport apparatus, characterized in that the arm is seated, the support for connecting the arm to the support plate and the support plate is connected to the driver to adjust the position of the arm. 제 2 항에 있어서,The method of claim 2, 상기 지지판은 고정대에 의해 상기 구동기에 연결되어 상기 구동기의 힘을 상기 지지대에 전달하는 것을 특징으로 하는 상기 웨이퍼 이송장치.The support plate is connected to the driver by a holder for the wafer transfer apparatus, characterized in that for transmitting the force of the driver to the support. 제 2 항에 있어서,The method of claim 2, 상기 지지대는 좌우로 이동 또는 회전되도록 하는 것을 특징으로 하는 상기 웨이퍼 이송장치.The support device is characterized in that the support for moving or rotating from side to side. 제 1 항에 있어서,The method of claim 1, 상기 스테이지에는 웨이퍼가 스페이지에서 공정챔버로 또는 공정챔버에서 스테이지로 이송되도록 상하운동하는 핀이 설치되는 것을 특징으로 하는 상기 웨이퍼 이송장치.The stage of the wafer transfer apparatus, characterized in that the pin is provided to move up and down so that the wafer is transferred from the step to the process chamber or the process chamber to the stage.
KR1019980033432A 1998-08-18 1998-08-18 Wafer transfer equipment KR20000014177A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100376866B1 (en) * 2000-10-13 2003-03-19 주식회사 하이닉스반도체 A suction picker

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100376866B1 (en) * 2000-10-13 2003-03-19 주식회사 하이닉스반도체 A suction picker

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