KR100854437B1 - Suction pad for semicondcutor transfer device - Google Patents

Abstract

An adsorption pad of a semiconductor package transferring apparatus is provided to shorten a time interval of vision inspection by immediately enabling a vision inspection without decreasing an unloading picker from the present position. A semiconductor package transferring apparatus includes a picker head movably installed on a main body, a holder installed in the picker head, and an adsorption pad(62) fixed to the lower end of the holder wherein the adsorption pad vacuum-adsorbs a semiconductor package(P). The adsorption pad is composed of a body part(621) fixed to the holder and an adsorption part(622) formed in the lower end of the body part wherein the semiconductor package is adsorbed to the adsorption part. The body part and the adsorption part are made of different colors. The body part and the adsorption part can be incorporated.

Description

Suction Pad for Semiconductor Package Transfer Device {Suction Pad for Semicondcutor Transfer Device}

1 illustrates an example of vision inspection performed in a conventional semiconductor package cutting and handling apparatus.

Figure 2 is a plan view schematically showing the overall configuration of the semiconductor package cutting and handling device is applied to the suction pad of the semiconductor package transfer apparatus according to the present invention

3 is a front view illustrating a first vision inspection unit of the semiconductor package cutting and handling apparatus of FIG. 2.

4 is a front view illustrating a second vision inspection unit of the semiconductor package cutting and handling apparatus of FIG. 2.

Figure 5 is a perspective view showing an embodiment of a suction pad of the semiconductor package transfer apparatus according to the present invention

Explanation of symbols on the main parts of the drawings

10: loading unit 12: inlet rail

14 strip picker 15 first X-axis guide rail

20: cutting part 21: cutting chuck table

22: cutting spindle 30: cleaning part

35 unit picker 40 drying unit

45: package return picker 50: turntable

53: 1st Y-axis guide rail 55: 2nd X-axis guide rail

60: unloading picker 61: holder

62: adsorption pad 621: body portion

622: adsorption unit 623: vacuum hole

65: third X-axis guide rail 70: unloading unit

71: good quality unloading unit 72: reject unloading unit

73: empty tray loading portion 75: second Y-axis guide frame

76: tray transfer 81: the first vision inspection unit

811: First Vision Camera 812: First Lighting Unit

85: second vision inspection unit 851: second vision camera

852: 2nd lighting unit 853: 3rd lighting unit

855 Prism P: semiconductor package

L: Lead

The present invention relates to a suction pad of a semiconductor package transfer device, and more particularly, to cut a semiconductor package for each package unit on a strip during a manufacturing process of the semiconductor package, and to store the cut individual semiconductor packages in a tray of an unloading unit. In the semiconductor package cutting and handling apparatus, the suction package of the semiconductor package transfer device for vacuum suction the individual cut semiconductor package to convey to the vision inspection position and the unloading unit.

In general, a BGA type semiconductor package is formed of a resin paper on the upper surface of a semiconductor substrate after attaching semiconductor chips having high integrated circuits such as transistors and capacitors on a semiconductor substrate (also referred to as a 'strip') made of silicon. After the molding process, a solder ball (BGA), which acts as a lead frame, is adhered to the lower surface of the semiconductor substrate where the molding process is completed, so that it is energized with a chip, and then cut into individual semiconductor package units using a cutting device. It is manufactured through a cutting process, that is, a singulation process. After the singulation process, the semiconductor package is cleaned and dried to remove foreign substances on the surface. The semiconductor package is transferred to the package transfer device and inspected for defect by the vision inspection device, and then stored in the tray at the unloading unit.

As described above, a series of processes of cutting the semiconductor packages on the strip into individual semiconductor packages and storing the individualized semiconductor packages in a tray are performed by a semiconductor package sawing and handling apparatus.

In the semiconductor package cutting and handling device, the strip is cut into cutting blades to separate the semiconductor packages on the strip. In this cutting process, friction occurs between the cutting surface of the semiconductor package and the cutting blades. Mechanical or thermal deformation (eg burrs) will occur in the leads.

If a burr is generated in the lead of the semiconductor package, the semiconductor package may not be properly seated on the circuit board while the semiconductor package is mounted on the circuit board, and a connection failure may occur. Contact with the burrs of the side leads causes electrical conduction, thereby causing a problem in the semiconductor package itself.

Therefore, the conventional semiconductor package cutting and handling apparatus, as shown in Figure 1, before receiving the individually cut semiconductor package in the tray of the unloading portion, the suction pad of the semiconductor package transfer device, that is, the picker (6) In the state where 6a vacuum-adsorbs the semiconductor package P, the vision inspection apparatus 8 vision-photographs the lower surface of the semiconductor package P under the semiconductor package P, and performs marking inspection (hereinafter, The inspection is referred to as a 'marking inspection', and then the side surface of the semiconductor package is photographed to inspect a deformation state of the lead L of the semiconductor package P (hereinafter, referred to as a 'side inspection'). In FIG. 1, reference numeral 8a denotes an illumination device that provides illumination for vision photography toward a semiconductor package.

However, in the conventional semiconductor package cutting and handling apparatus, since the adsorption pad of the picker is white, the color of the molding part of the semiconductor package (usually black) and the color of the adsorption pad serving as a background are clear at the time of marking inspection. In contrast, the edges of each semiconductor package are clearly photographed so that no error occurs during the inspection. However, in the side inspection, the image of the lead is generally photographed with a white system so that it is almost indistinguishable from the color of the adsorption pad forming the background. There is a problem that cannot perform the side inspection.

Therefore, conventionally, the color of the adsorption pad was changed to black for the side inspection, and a method of providing illumination from the side of the adsorption pad during the marking inspection was adopted. When the adsorption pad is black as described above, when the non-dedicated illumination is provided from the side, the color of the adsorption pad is photographed in gray instead of black. Therefore, during the side inspection, the color of the lead and the color of the adsorption pad are completely contrasted, so that the side inspection is performed smoothly without errors. During the marking inspection, the molding part of the black semiconductor package and the background color of the absorption pad photographed in gray are taken. This allows the semiconductor package to be clearly photographed so that accurate vision inspection can be performed.

However, in order to perform such a conventional vision inspection method, the picker should be lowered to provide side lighting not only at the side inspection but also at the marking inspection, so that the semiconductor package and the adsorption pad should be set at the same height as the side lighting position. . Therefore, the vision inspection takes a lot of time, there is a problem that the unit per hour (UPH) is lowered.

The present invention is to solve the above problems, an object of the present invention is to smoothly perform the marking inspection at the current position without lowering the semiconductor package to the illumination position during the marking inspection by the vision inspection device, and during side inspection The present invention provides a suction pad of a semiconductor package transfer device capable of accurately vision checking the deformation of the lead, thereby increasing the output per unit time (UPH) and improving the accuracy of the inspection.

The present invention for achieving the above object, the picker head movably installed on the upper portion of the body, the holder is installed on the picker head, the suction pad is fixed to the lower end of the holder vacuum suction the semiconductor package A semiconductor package transfer device comprising: the suction pad, a body portion fixed to the holder; It is formed on the lower end of the body portion, and consists of an adsorption portion which is a portion of the semiconductor package is adsorbed; The body portion and the adsorption portion provides a suction pad of the semiconductor package transfer device, characterized in that made of different colors.

According to the present invention, the body portion of the adsorption pad, which is the background of the image during the marking inspection, is made of a color that is clearly distinguished from the molding portion of the semiconductor package, and the adsorption portion of the adsorption pad forming the boundary with the lid during the side inspection is provided with the lid. Is a distinctive color, so you can not only get accurate test results in both marking and side inspections, but also in the marking test, you can carry out vision inspection directly from the current position without lowering the semiconductor package feeder, ie unloading picker. This can reduce vision inspection time.

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment of the suction pad of the semiconductor package transfer device according to the present invention in detail.

First, in order to help the understanding of the present invention, the entire configuration of the semiconductor package cutting and handling apparatus to which the suction pad of the semiconductor package transfer device according to the present invention is applied will be described with reference to FIG. 2.

As shown in FIG. 2, a loading unit 10 on which a semiconductor package strip (not shown) is loaded is disposed on one side of the main body, and a strip is loaded from the loading unit 10 on one side of the loading unit 10. Guided inlet rail 12 is installed.

The other side of the inlet rail 12 is disposed cutting portion 20 for cutting the strip into individual semiconductor packages. The cutting processing unit 20 is provided with a cutting chuck table 21 on which the strip is seated and fixed so as to be movable in the Y-axis direction, and separates the strip on the cutting chuck table 21 behind the cutting processing unit 20. A cutting blade 22 for cutting into a semiconductor package is installed.

A strip picker for conveying a strip from the inlet rail 12 to the cutting chuck table 21 while horizontally moving along the first X-axis guide frame 15 on the upper side of the inlet rail 12 and the cutting processing unit 20. 14 is installed.

A cleaning unit 30 for cleaning the cut semiconductor package and a drying unit 40 for drying the cleaned semiconductor package are disposed on one side of the cutting processing unit 20, and the cutting processing unit 20 and the cleaning unit ( 30 and the unit picker 35 for conveying the semiconductor packages cut individually to the upper side of the drying unit 40 are installed to move horizontally along the first X-axis guide frame 15.

The turntable 50, on which one side of the main body, the semiconductor package conveyed from the drying unit 40 is seated and aligned, is installed, and the drying unit 40 is disposed above the drying unit 40 and the turntable 50. The package transport picker 45 for conveying the semiconductor package from the turntable 50 to the horizontal direction is provided along the second X-axis guide frame 55.

The turntable 50 is configured to move in the Y-axis direction along the first Y-axis guide frame 53.

An unloading unit 70 is disposed at one side of the turntable 50 to classify and store the individual semiconductor packages P conveyed from the turntable 50 by inspection results, and at the rear of the main body, the turntable 50 Unloading pickers 60, which are two semiconductor package transfer apparatuses, which vacuum-absorb semiconductor packages and convey them to the unloading section 70, are provided. The unloading pickers 60 are configured to convey semiconductor packages while independently moving horizontally along a pair of third X-axis guide frames 65 formed parallel to each other on the upper side of the main body.

The unloading unit 70 is a good quality unloading unit 71 in which a semiconductor package, which is determined to be good, as a result of vision inspection by the first and second vision inspection units 81 and 85, is received, and is determined to be defective or reinspected. A reject unloading unit 72 in which the semiconductor package is stored, an empty tray stacking unit 73 on which empty trays to be supplied to the good quality unloading unit 71 and the reject unloading unit 72 are stacked; The empty tray T is conveyed from the empty tray loading section 73 to the good unloading section 71 and the reject unloading section 72 while reciprocating horizontally along the second X-axis guide frame 55. The main consists of a tray transfer 76.

Each tray of the non-loading unit 71 and the reject unloading unit 72 is configured to move in the Y-axis direction along the second Y-axis guide rail 75.

Therefore, in the unloading unit 70, the semiconductor packages of the unloading picker 60 and the tray T are moved by the X-axis movement of the unloading pickers 60 and the Y-axis movement of the trays T. As the relative position between the pockets is adjusted, the semiconductor packages are sequentially received in the empty pockets of the tray T.

On the other hand, the first and second vision inspection units 81 and 85 perform vision inspection on the lower side of the moving path of the unloading picker 60 on the bottom surface of each semiconductor package adsorbed by the unloading picker 60. Is placed. The first and second vision inspection units 81 and 85 are configured to be horizontally movable in the Y-axis direction along the third Y-axis guide rail 89.

3 to 5, the unloading picker 60 is installed on the picker head (not shown) to move along the third X-axis guide frame 65 (see FIG. 2) and the picker head. And a holder 61 having a vacuum hole (not shown) for forming a vacuum therein, and a suction pad 62 detachably installed at a lower end of the holder 61.

As shown in FIG. 5, the adsorption pad 62 is fixed to the lower portion of the body portion 621 having a substantially quadrangular pyramidal shape fixed to the holder 61, and the semiconductor package P. It consists of an adsorption part 622 which is a part which adsorb | sucks. In the center of the body portion 621 and the adsorption portion 622 is formed through the vacuum hole 623 for forming a vacuum pressure.

Here, the body portion 621 and the adsorption portion 622 is made of a flexible material such as silicon rubber, and have a different color. That is, in the embodiment of the adsorption pad 62, the body portion 621 is made of white, and the adsorption portion 622 is made of black.

When the adsorption pad 62 is viewed from the bottom, the adsorption part 622 is preferably smaller than the size of the semiconductor package (P). This is because when the marking inspection is performed on the bottom surface of the suction pad 62 with the vision camera, the suction part 622 is completely covered by the semiconductor package P, so that the black color of the suction part 622 causes the semiconductor package P to disappear. This is to prevent the marking test from being interrupted.

The body part 621 and the adsorption part 622 of the adsorption pad 62 may be integrally molded by double injection or the like, but the body part 621 and the adsorption part 622 are separately manufactured in individual molds, It may be manufactured by putting them together in one mold and heat-bonding them. In this case, the body portion 621 and the adsorption portion 622 is preferably made of the same material.

In addition, the body portion 621 and the adsorption portion 622 may be manufactured separately from each other and then integrally bonded by an adhesive or the like.

Alternatively, the body part 621 and the adsorption part 622 of the adsorption pad 62 are uniformly injected into white, and then the adsorption part 622 is painted or printed in black, and the adsorption part 622 is provided. The body portion 621 may have different colors.

As described above, the adsorption pad 62 of the present invention is formed of two colors in which the body portion 621 and the adsorption portion 622 are different from each other, which is a vision inspection of the lower surface of the semiconductor package (a marking surface on which no lead is formed). The purpose is to satisfy both the marking inspection and the accuracy of the side inspection for inspecting the side surface of the semiconductor package.

Meanwhile, as shown in FIG. 3, the first vision inspection unit 81 is a vision inspection apparatus for marking inspection for inspecting a lower surface (a surface of which a mark is engraved without a lead formed), and the upper semiconductor package. The first lighting unit 812 provides illumination toward the camera, and the first vision camera 811 which photographs the semiconductor package P from the lower side of the first lighting unit 812.

In addition, as illustrated in FIG. 4, the second vision inspection unit 85 is a vision inspection apparatus for side inspection for inspecting deformation of a lead by photographing a side surface of the semiconductor package P. The second lighting unit 852 and the third lighting unit 853 having a plurality of LED light sources 854 for providing illumination from the side, and the light emitted from the second lighting unit 852 is a semiconductor package (P). And a plurality of prisms 855 for adjusting the direction of light to go straight to the side of the () and at the same time to form a side image of the semiconductor package (P), and the lower side of the second and third lighting units (852, 853) The second vision camera 851 is configured to photograph a side image of the semiconductor package P formed on the prism 855.

In this embodiment, the second vision inspection unit 85 is composed of two, so that side inspection of two semiconductor packages can be performed at the same time.

The semiconductor package cutting and handling apparatus having the adsorption pad of the present invention configured as described above operates as follows.

As shown in FIG. 2, when a strip (not shown) is withdrawn from the loading portion 10 onto the inlet rail 12, the strip picker 14 picks up the strip of the inlet rail 12 and cuts the cut portion ( It is seated and fixed on the cutting chuck table 21 of 20).

Subsequently, the cutting chuck table 21 moves to the cutting blade 22 position, and the strip is cut into individual semiconductor packages by the relative movement between the cutting chuck table 21 and the cutting blade 22.

Then, the cutting chuck table 21 moves forward to return to the initial position, and the unit picker 35 vacuum-adsorbs individual semiconductor packages on the cutting chuck table 21 to dry the cleaning unit 30 and dry. It returns to the part 40 one by one.

The cleaning unit 30 removes foreign substances by brushing the cut semiconductor package or spraying water and / or air. In addition, the drying unit 40 dries the semiconductor packages by heating the semiconductor packages or blowing air into the semiconductor packages.

When the drying of the semiconductor packages is completed in the drying unit 40, the package transport picker 45 picks up the semiconductor packages on the drying unit 40 and transports them to the turntable 50, and then seats and arranges the semiconductor packages on the drying unit 40.

When the semiconductor packages are seated on the turntable 50, the turntable 50 moves backward along the first Y-axis guide frame 53 to be positioned below the unloading picker 60.

Subsequently, the unloading picker 60 adsorbs the semiconductor packages P placed on the upper surface of the turntable 50 and moves to the upper side of the first vision inspection unit 81.

As shown in FIG. 3, when the first vision inspection unit 81 of the unloading picker 60 moves upward, the first vision inspection unit 81 moves upward through the first lighting unit 812. Illumination is provided to the semiconductor package P, and the first vision camera 811 photographs the lower surface of the semiconductor package P to perform marking inspection.

When the first vision camera 811 photographs the semiconductor package P directly under the semiconductor package P, the photographed image of the semiconductor package P is black, and the background of the semiconductor package P is Since the portion becomes the white body 621 of the suction pad 62, the edge boundary of the semiconductor package P is clearly distinguished. Therefore, the marking inspection of the semiconductor package P can be accurately performed.

When the marking inspection is performed in the first vision inspection unit 81, the unloading picker 60 is photographed at the current position without falling down. Therefore, if the size of the first vision camera 811 is sufficiently large, marking inspection of a plurality of semiconductor packages (for example, two) at a time is possible, and thus the inspection speed may be further improved.

When the unloading picker 60 moves horizontally by a predetermined pitch in one direction, marking inspection of all the semiconductor packages P adsorbed to the unloading picker 60 by the first vision inspection unit 81 is completed. The vision inspection units 81 and 85 move along the third Y-axis guide rail 89 (see FIG. 2) so that the second vision inspection units 85 and the semiconductor packages P of the unloading picker 60 are aligned. The unloading picker 60 performs side inspection by the second vision inspection unit 85 while moving by a predetermined pitch in the opposite direction as before.

As shown in FIG. 4, on the upper side of the second vision inspection unit 85, the unloading picker 60 is lowered downward by a predetermined distance so that the semiconductor packages P may have the second lighting unit 852 and the prism 855. ) Are aligned at the same height as

Subsequently, light is provided through the second lighting unit 852 and the third lighting unit 853, and a side image of the semiconductor package P is formed on the inclined surface of the prism 855.

The second vision camera 851 examines a side image of the semiconductor package P formed on the prism 855 to inspect deformation of the lead L, for example, generation of burrs.

At this time, as shown in an enlarged view in FIG. 4, the adsorption part 622 of the adsorption pad 62 is photographed in black, and the leads L of the semiconductor package P are photographed in white. ) 'S image becomes clear.

When the side inspection of the semiconductor package by the second vision inspection unit 85 is completed, as shown in FIG. 1, the unloading picker 60 moves to an upper side of the unloading unit 70 and freezes the goods according to the inspection result. The semiconductor packages are accommodated in the tray T of the loading unit 71 or the tray T of the reject unloading unit 72.

On the other hand, the adsorption pad 62 of the semiconductor package transfer device of the above-described embodiment has been illustrated that the body portion 621 and the adsorption portion 622 is made of white and black, respectively, but if desired, any other color is selected. The body portion 621 and the adsorption portion 622 of the adsorption pad may be configured. Of course, even in this case, the body portion and the adsorption portion of the adsorption pad should have different colors.

In addition, the adsorption pad 62 has been described as having a substantially square pyramid shape, but may be formed in various shapes such as a cone or a square.

As described above, the adsorption pad according to the present invention has a different color from the body of the adsorption pad, which is the background of the image during the marking inspection of the semiconductor package, and the adsorption portion of the adsorption pad, which forms the boundary between the lid and the side inspection of the semiconductor package. Have

That is, the body part of the adsorption pad, which is the background of the image in the marking test, is formed in a color distinct from the molding part of the semiconductor package, and the adsorption part of the adsorption pad, which forms the boundary of the lead in the side inspection, is clearly distinguished from the lead. It is made of color.

Therefore, not only accurate inspection results can be obtained in both the marking inspection and the side inspection, but also the vision inspection time can be performed directly from the current position without lowering the semiconductor package transfer device, that is, the unloading picker. It can be reduced, and thus there is an advantage that can increase the output per unit time (UPH).

Claims (6)

A semiconductor package transfer device comprising a picker head movably installed on an upper portion of a main body, a holder installed on the picker head, and a suction pad fixed to a lower end of the holder to suck a semiconductor package by vacuum. The suction pad includes a body portion fixed to the holder; It is formed on the lower end of the body portion, and consists of an adsorption portion which is a portion of the semiconductor package is adsorbed; Adsorption pad of the semiconductor package transfer device, characterized in that the body portion and the adsorption portion made of different colors. The suction pad of claim 1, wherein the suction pad is smaller than the size of the semiconductor package when the suction pad is viewed from the bottom. The suction pad of claim 1, wherein the body part and the suction part are integrally formed. The suction pad of claim 1, wherein the body part and the suction part are formed separately, and a part of the suction part is fixed to the body part while being inserted into the lower end of the body part. delete The suction pad of claim 1, wherein the body part is made of white and the adsorption part is made of black.

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