KR100889591B1 - Suction Pad for Semiconductor Transfer Device - Google Patents

Suction Pad for Semiconductor Transfer Device Download PDF

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KR100889591B1
KR100889591B1 KR1020070038178A KR20070038178A KR100889591B1 KR 100889591 B1 KR100889591 B1 KR 100889591B1 KR 1020070038178 A KR1020070038178 A KR 1020070038178A KR 20070038178 A KR20070038178 A KR 20070038178A KR 100889591 B1 KR100889591 B1 KR 100889591B1
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semiconductor package
vacuum
package
suction pad
ball
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KR1020070038178A
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Korean (ko)
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KR20080094145A (en
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이광열
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한미반도체 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

본 발명은, BOC BGA(Board On Chip Ball Grid Array) 반도체 패키지와 같이 볼이 형성되지 않은 비접속부가 중간 부분을 가로지르도록 형성된 반도체 패키지를 진공 흡착하여 반송하는 반도체 패키지 이송장치용 흡착패드에 관한 것으로, 반도체 패키지 이송장치에 고정되며, 중앙에 진공 형성을 위한 진공홀이 형성된 몸체부와; 상기 몸체부의 하부면 중앙을 가로지르면서 돌출되게 형성되어 상기 반도체 패키지의 중간의 비접속부와 접촉하며, 중앙부에 상기 진공홀과 연통되는 진공형성홀이 관통되게 형성된 흡착부를 포함하여 구성된 것을 특징으로 하는 반도체 패키지 이송장치용 흡착패드를 제공한다.The present invention relates to a suction pad for a semiconductor package transfer device that vacuum-sucks and conveys a semiconductor package formed such that a non-connected portion, in which a ball is not formed, crosses an intermediate portion, such as a BOC BGA (Board On Chip Ball Grid Array) semiconductor package. A body portion fixed to the semiconductor package transfer apparatus and having a vacuum hole formed at the center thereof for forming a vacuum; It is formed to protrude while crossing the center of the lower surface of the body portion in contact with the non-connected portion of the middle of the semiconductor package, characterized in that it comprises an adsorption portion formed through the vacuum forming hole communicating with the vacuum hole in the center portion Provided is a suction pad for a semiconductor package transfer device.

이러한 본 발명에 따르면, 흡착패드가 반도체 패키지의 양측 볼 부분을 지지하면서 중간 부분의 볼이 형성되지 않은 부분을 진공 흡착하여 고정하므로, 볼이 반도체 패키지의 에지까지 형성되어 에지에 여유 공간이 없거나, 반도체 패키지에 휨 변형(warpage)이 발생하더라도 반도체 패키지를 안정적으로 고정할 수 있다.According to the present invention, since the suction pad supports the ball portions on both sides of the semiconductor package, the suction portion is fixed by vacuum adsorption on the portion where the ball of the middle portion is not formed, so that the ball is formed to the edge of the semiconductor package and there is no free space at the edge. Even if warpage occurs in the semiconductor package, the semiconductor package can be stably fixed.

반도체 패키지, BOC BGA, 흡착패드 Semiconductor Package, BOC BGA, Suction Pad

Description

반도체 패키지 이송장치용 흡착패드{Suction Pad for Semiconductor Transfer Device}Suction Pad for Semiconductor Package Transfer Device

도 1a와 도 1b는 일반적인 BOC BGA 타입의 반도체 패키지를 보여주는 사시도1A and 1B are perspective views illustrating a general BOC BGA type semiconductor package

도 2는 종래의 흡착패드의 구조를 나타낸 사시도Figure 2 is a perspective view showing the structure of a conventional adsorption pad

도 3은 도 2의 흡착패드의 요부 단면도3 is a cross-sectional view of main parts of the suction pad of FIG. 2;

도 4는 도 2의 흡착패드의 문제점을 설명하는 요부 단면도4 is a cross-sectional view of main parts illustrating a problem of the suction pad of FIG. 2;

도 5는 도 2의 흡착패드의 다른 문제점을 설명하는 요부 단면도5 is a cross-sectional view illustrating main parts illustrating another problem of the suction pad of FIG. 2.

도 6은 본 발명에 따른 반도체 패키지 이송장치용 흡착패드의 일 실시예의 구조를 나타낸 사시도6 is a perspective view showing the structure of an embodiment of a suction pad for a semiconductor package transfer device according to the present invention;

도 7과 도 8은 도 6의 흡착패드의 구조 및 작동을 나타내는 요부 단면도7 and 8 are main cross-sectional view showing the structure and operation of the adsorption pad of FIG.

도 9는 도 6의 흡착패드에 반도체 패키지가 흡착된 상태에서 비전 검사되는 상태를 나타낸 도면FIG. 9 is a view illustrating a state in which vision inspection is performed in a state in which a semiconductor package is adsorbed to the suction pad of FIG.

도 10은 도 6의 흡착패드에 워페이지 변형이 발생한 반도체 패키지가 고정된 상태를 나타낸 요부 단면도FIG. 10 is a cross-sectional view illustrating main parts of a semiconductor package in which warpage deformation is fixed to a suction pad of FIG. 6.

도 11은 도 6의 흡착패드에 다른 형태(도 1b에 도시된 형태)의 반도체 패키지가 고정된 상태를 나타낸 요부 단면도FIG. 11 is a cross-sectional view illustrating main parts of a semiconductor package of another type (shown in FIG. 1B) fixed to the suction pad of FIG. 6.

도 12는 본 발명에 따른 반도체 패키지 이송장치용 흡착패드의 다른 실시예 의 구조를 나타낸 사시도12 is a perspective view showing the structure of another embodiment of a suction pad for a semiconductor package transfer device according to the present invention;

* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

10 : 흡착패드 11 : 몸체부10: adsorption pad 11: body part

11a : 진공홀 12 : 볼지지부11a: vacuum hole 12: ball support

13 : 흡착부 13b : 진공형성홀13: adsorption part 13b: vacuum forming hole

P : 반도체 패키지 B : 볼P: Semiconductor Package B: Ball

C : 접속부 N : 비접속부C: connection N: non-connection

H : 홀더 V : 비전카메라H: Holder V: Vision Camera

본 발명은 반도체 패키지 이송장치용 흡착패드에 관한 것으로, 더욱 상세하게는 BOC BGA(Board On Chip Ball Grid Array) 타입의 반도체 패키지들을 일 공정 위치에서 진공 흡착하여 다른 공정 위치로 반송하는 기능을 수행하는 반도체 패키지 이송장치용 흡착패드에 관한 것이다. The present invention relates to a suction pad for a semiconductor package transfer device, and more particularly, to carry out a function of vacuum-absorbing a BOC BGA (Board On Chip Ball Grid Array) type semiconductor package at one process location and returning it to another process location. A suction pad for a semiconductor package transfer device.

일반적으로, BGA 타입의 반도체 패키지는, 실리콘으로 된 반도체 기판('스트립'이라고도 함) 상에 트랜지스터 및 커패시터 등과 같은 고집적회로가 형성된 반도체칩(chip)들을 부착한 후에 반도체 기판의 상면에 레진수지로 몰딩하는 공정을 거치고, 몰딩공정이 완료된 반도체 기판의 하면에 리드프레임의 역할을 하는 솔더볼(BGA; Ball Grid Array)을 접착시켜 칩과 통전하도록 만든 다음, 절단장치를 이 용하여 개별의 반도체 패키지 단위로 절단하는 공정, 즉 싱귤레이션(Singulation) 공정을 거쳐서 제조된다. 싱귤레이션 공정이 끝난 반도체 패키지는 세척공정 및 건조공정을 거쳐 표면에 묻은 이물질이 제거되고, 패키지 이송장치로 전달되어 비전검사장치에 의해 불량여부가 검사된 다음, 언로딩부에서 트레이에 수납된다.In general, a BGA type semiconductor package is formed of a resin paper on the upper surface of a semiconductor substrate after attaching semiconductor chips having high integrated circuits such as transistors and capacitors on a semiconductor substrate (also referred to as a 'strip') made of silicon. After a molding process, a solder ball (BGA), which acts as a lead frame, is adhered to a lower surface of the semiconductor substrate where the molding process is completed, so that it is energized with a chip, and then cut into individual semiconductor package units using a cutting device. It is manufactured through a cutting process, that is, a singulation process. After the singulation process, the semiconductor package is cleaned and dried to remove foreign substances on the surface. The semiconductor package is transferred to the package transfer device and inspected for defect by the vision inspection device, and then stored in the tray at the unloading unit.

상기와 같이 스트립 상의 반도체 패키지들을 개별 반도체 패키지로 절단하고, 개별화된 반도체 패키지들을 트레이에 수납하는 일련의 공정들은 반도체 패키지 절단(sawing) 및 핸들링(handling) 장치에 의해 수행된다. As described above, a series of processes for cutting the semiconductor packages on the strip into individual semiconductor packages and storing the individualized semiconductor packages in a tray are performed by a semiconductor package sawing and handling apparatus.

이러한 반도체 패키지 절단 및 핸들링장치에서 개별화된 반도체 패키지들을 트레이에 수납하여 주는 기능은 픽커에 의해 수행된다. In the semiconductor package cutting and handling apparatus, the function of storing the individual semiconductor packages in a tray is performed by a picker.

상기 픽커는 유연한 재질의 흡착패드를 이용하여 개별화된 반도체 패키지들을 진공 흡착하여 고정함으로써 반도체 패키지의 볼에 손상을 주지 않으면서 안정적으로 고정시킨다. The picker may be stably fixed without damaging the balls of the semiconductor package by vacuum adsorption and fixing the individual semiconductor packages using a suction pad made of a flexible material.

그런데, 최근들어 반도체 패키지가 점차적으로 고밀도·고집적화되면서 반도체 패키지의 볼이 차지하는 영역이 확대되고, 이에 따라 반도체 패키지의 에지(edge) 영역이 너무 협소해져서 픽커의 흡착패드가 반도체 패키지의 에지에 안정적으로 접촉할 수 없는 문제가 발생하였다. However, in recent years, as the semiconductor package is gradually densified and highly integrated, the area occupied by the balls of the semiconductor package is enlarged. As a result, the edge area of the semiconductor package is so narrowed that the adsorption pad of the picker is stably at the edge of the semiconductor package. There was a problem that could not be contacted.

특히, BOC BGA(Board On Chip Ball Grid Array) 반도체 패키지(이하 BOC 패키지)의 경우, 칩의 양측으로 2개의 기판(substrate)이 상호 이격되게 위치되고, 이 기판들과 칩 사이에 리드와이어가 연결된 구조를 갖는다.Particularly, in the case of BOC BGA (Board On Chip Ball Grid Array) package (hereinafter referred to as BOC package), two substrates are positioned to be spaced apart from each other on both sides of the chip, and lead wires are connected between the substrates and the chip. Has a structure.

따라서, 도 1a와 도 1b에 도시된 것과 같이, BOC 패키지(P)는 중간 부분의 칩에 대응하는 부분에 볼이 없는 비접속부(N)가 형성되고, 이 비접속부(N)를 중심으로 양측부에 실장시 접속을 위한 볼(B)들이 배열된 접속부(C)가 형성된다. Therefore, as shown in FIGS. 1A and 1B, the BOC package P has a non-ball connection portion N formed at a portion corresponding to the chip of the middle portion, and both sides of the BOC package P are formed around the non-connection portion N. The connection part C in which the balls B for connection at the time of mounting is arranged in the part.

상기 비접속부(N)는 도 1a에 도시된 것처럼, BOC 패키지(P)의 몰드면에 돌출되게 형성될 수도 있고, 도 1b에 도시된 것처럼, BOC 패키지(P)의 몰드면에 편평하게 형성될 수도 있다.The non-connecting portion N may be formed to protrude on the mold surface of the BOC package P, as shown in FIG. 1A, and may be formed flat on the mold surface of the BOC package P, as shown in FIG. 1B. It may be.

이와 같이, BOC 패키지(P)는 양측부에 볼(B)들이 형성되기 때문에 패키지가 고밀도·고집적화될수록 볼(B)이 BOC 패키지(P)의 에지에 근접하게 된다.As described above, since the balls B are formed at both sides of the BOC package P, the denser and higher the density of the package, the closer the ball B is to the edge of the BOC package P.

한편, 종래의 반도체 패키지 이송용 픽커의 흡착패드(1)는 도 2와 도 3에 도시된 것처럼, 픽커의 홀더(H)에 탈착 가능하게 장착되며 중앙에 진공 형성을 위한 진공홀(3)이 관통되게 형성된 유연한 재질의 몸체부(2)와, 상기 몸체부(2)의 하부면에 돌출되게 형성되어 BOC 패키지(P)의 에지 부분에 접촉하는 패키지 가이드부(4)와, 상기 패키지 가이드부(4)의 중앙부 양측에 오목하게 형성되어 BOC 패키지(P)의 돌출된 비접속부(N)(도 1a 참조)에 대응하는 비접속부 가이드홈(5)으로 구성된다. Meanwhile, as shown in FIGS. 2 and 3, the adsorption pad 1 of the picker for transporting a semiconductor package is detachably mounted to a holder H of the picker, and a vacuum hole 3 is formed in the center to form a vacuum. A body portion 2 of a flexible material formed to penetrate through, a package guide portion 4 protruding from the lower surface of the body portion 2 in contact with the edge portion of the BOC package (P), and the package guide portion It is formed by the non-contact guide groove 5 which is formed in the both sides of the center part of (4), and corresponds to the non-connected part N (refer FIG. 1A) of the BOC package P.

따라서, BOC 패키지(P)의 에지 부분에 여유 공간이 넉넉한 경우에는 상기 흡착패드(1)의 패키지 가이드부(4)가 에지 부분에 충분한 면적으로 접촉할 수 있고, 따라서 안정적으로 진공압을 형성하여 패키지를 흡착시킬 수 있다.Therefore, when there is enough free space at the edge portion of the BOC package P, the package guide portion 4 of the suction pad 1 may contact the edge portion with sufficient area, thus stably forming a vacuum pressure The package can be adsorbed.

하지만, 도 4에 도시된 것처럼, BOC 패키지(P)의 볼(B)이 에지까지 침범하여 여유 공간이 거의 없을 경우에는 흡착패드(1)의 패키지 가이드부(4)가 BOC 패키지(P)의 면에 접촉할 수 없거나 접촉하더라도 그 면적이 너무 협소해 진공압을 형 성할 수 없는 문제가 발생한다. However, as shown in FIG. 4, when the ball B of the BOC package P invades to the edge and there is almost no free space, the package guide part 4 of the suction pad 1 is connected to the BOC package P. The problem is that the surface cannot be contacted or the surface is too narrow to form a vacuum pressure.

그리고, BOC 패키지(P)의 에지 부분에 패키지 가이드부(4)가 접촉할 면적을 확보하더라도 장시간이 경과하면 패키지 가이드부(4)와 BOC 패키지(P) 간의 잦은 접촉에 의해 패키지 가이드부(4)의 접촉면이 까맣게 변색되는 현상이 발생하게 된다. 이에 따라, BOC 패키지(P)의 하면에 비전카메라로 비전검사를 수행할 때, 변색된 패키지 가이드부(4)와 BOC 패키지(P) 간의 색깔 구별이 어려워 BOC 패키지(P)의 경계를 정확하게 인식할 수 없고, 따라서 비전 검사의 정확도가 저하되는 문제가 발생한다. And even if the area where the package guide portion 4 is in contact with the edge portion of the BOC package (P), even if a long time passes, the package guide portion (4) by frequent contact between the package guide portion 4 and the BOC package (P) ), The discoloration of the contact surface of black will occur. Accordingly, when performing vision inspection on the lower surface of the BOC package (P), it is difficult to distinguish the color between the discolored package guide 4 and the BOC package (P) to accurately recognize the boundary of the BOC package (P) A problem arises that the accuracy of vision inspection is deteriorated.

또한, 도 5에 도시된 것과 같이, BOC 패키지(P)가 휘어지는 워페이지(warpage) 변형이 발생하게 되면, BOC 패키지(P)와 흡착패드(1)의 패키지 가이드부(4)가 접촉하지 못하게 되고, 이 경우 역시 흡착패드(1)와 BOC 패키지(P) 간에 진공압이 형성되지 않아 픽커가 BOC 패키지(P)를 고정할 수 없는 문제가 발생한다. In addition, as shown in FIG. 5, when warpage deformation occurs in which the BOC package P is bent, the BOC package P and the package guide part 4 of the suction pad 1 do not come into contact with each other. In this case, too, no vacuum pressure is formed between the adsorption pad 1 and the BOC package P, so that the picker cannot fix the BOC package P.

본 발명은 상기와 같은 문제를 해결하기 위한 것으로, 중간 부분에 볼이 형성되지 않은 비접속부가 형성된 반도체 패키지를 진공 흡착하여 반송하는 반도체 패키지 이송장치용 흡착패드에 있어서, 반도체 패키지가 고밀도·고집적화되어 볼이 반도체 패키지의 에지까지 형성되거나, 반도체 패키지에 워페이지와 같은 휨 변형이 발생하더라도 반도체 패키지를 안정적으로 진공 흡착할 수 있는 반도체 패키지 이송장치용 흡착패드를 제공함에 그 목적이 있다. SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and in the adsorption pad for a semiconductor package transfer device which vacuum-adsorbs and transports a semiconductor package having a non-connected portion in which no ball is formed in the middle portion, the semiconductor package is densely and highly integrated. It is an object of the present invention to provide a suction pad for a semiconductor package transfer device capable of stably vacuum sucking a semiconductor package even when a ball is formed to an edge of the semiconductor package or a warpage deformation such as a warpage occurs in the semiconductor package.

본 발명의 다른 목적은 장시간의 사용에도 비전 검사의 정확도를 저하시키지 않는 반도체 패키지 이송장치용 흡착패드를 제공하는 것이다. Another object of the present invention is to provide a suction pad for a semiconductor package transfer device that does not reduce the accuracy of vision inspection even for long time use.

상기와 같은 목적을 달성하기 위한 본 발명은, 볼이 형성되지 않은 비접속부가 중간 부분을 가로지르도록 형성된 반도체 패키지를 진공 흡착하여 반송하는 반도체 패키지 이송장치용 흡착패드에 있어서, 반도체 패키지 이송장치에 고정되며, 중앙에 진공 형성을 위한 진공홀이 형성된 몸체부와; 상기 몸체부의 하부면 중앙을 가로지르면서 돌출되게 형성되어 상기 반도체 패키지의 중간의 비접속부와 접촉하며, 중앙부에 상기 진공홀과 연통되는 진공형성홀이 관통되게 형성된 흡착부를 포함하여 구성된 것을 특징으로 하는 반도체 패키지 이송장치용 흡착패드를 제공한다.The present invention for achieving the above object, in the adsorption pad for a semiconductor package transfer device for vacuum adsorption and conveying the semiconductor package formed so that the non-connected portion is not formed cross the middle portion, the semiconductor package transfer device A body part which is fixed and has a vacuum hole for forming a vacuum in the center; It is formed to protrude while crossing the center of the lower surface of the body portion in contact with the non-connected portion of the middle of the semiconductor package, characterized in that it comprises an adsorption portion formed through the vacuum forming hole communicating with the vacuum hole in the center portion Provided is a suction pad for a semiconductor package transfer device.

이러한 본 발명에 따르면, 흡착패드가 반도체 패키지의 양측 볼 부분을 지지하면서 중간 부분의 볼이 형성되지 않은 부분을 진공 흡착하여 고정하므로, 볼이 반도체 패키지의 에지까지 형성되어 에지에 여유 공간이 없거나, 반도체 패키지에 휨 변형(warpage)가 발생하더라도 반도체 패키지를 안정적으로 고정할 수 있다.According to the present invention, since the suction pad supports the ball portions on both sides of the semiconductor package, the suction portion is fixed by vacuum adsorption on the portion where the ball of the middle portion is not formed, so that the ball is formed to the edge of the semiconductor package and there is no free space at the edge. Even if warpage occurs in the semiconductor package, the semiconductor package can be stably fixed.

이하, 첨부된 도면을 참조하여 본 발명에 따른 반도체 패키지 이송장치용 흡착패드의 바람직한 실시예들을 상세히 설명한다. Hereinafter, with reference to the accompanying drawings will be described in detail preferred embodiments of the adsorption pad for semiconductor package transfer device according to the present invention.

참고로, 이하의 실시예에 대한 설명에서 본 발명의 흡착패드가 BOC BGA 타입의 반도체 패키지를 흡착하는 것을 예시하고 있지만, 이러한 BOC BGA 타입의 반도체 패키지 외에도 볼이 형성되지 않은 비접속부가 패키지의 중간 부분을 가로지르 는 형태로 형성된 모든 종류의 반도체 패키지에 동일 또는 유사하게 적용될 수 있다. For reference, in the description of the following embodiments, the adsorption pad of the present invention exemplifies the adsorption of the BOC BGA type semiconductor package, but in addition to the BOC BGA type semiconductor package, the non-connected portion in which the ball is not formed is in the middle of the package. The same or similar may be applied to all kinds of semiconductor packages formed in the form of a cross section.

먼저, 도 6과 도 7에 도시된 것과 같이, 본 발명에 따른 흡착패드(10)는 반도체 패키지 이송장치, 즉 픽커의 홀더(H)에 탈착 가능하게 결합되며 중앙에 진공홀(11a)이 관통되게 형성된 유연한 재질의 몸체부(11)와, 상기 몸체부(11)의 하부면에 소정의 면적으로 돌출되게 형성되는 볼지지부(12)와, 상기 볼지지부(12)의 중간부분을 가로지르도록 돌출 형성되는 흡착부(13)로 구성된다. First, as shown in FIGS. 6 and 7, the suction pad 10 according to the present invention is detachably coupled to a holder H of a semiconductor package transfer device, that is, a picker, and a vacuum hole 11a penetrates through the center thereof. The body portion 11 of a flexible material formed so as to cross the middle portion of the ball support portion 12, and the ball support portion 12 is formed to protrude to a predetermined area on the lower surface of the body portion 11; It consists of an adsorption part 13 which protrudes.

상기 흡착부(13)는 BOC 패키지(P)의 중간 부분을 가로지르도록 형성된 비접속부(N)에 접촉하여 진공압을 형성하는 부분으로서, 상기 흡착부(13)는 중간 부분에 진공형성을 위한 기다란 홈(13a)이 형성되고, 이 홈(13a)의 중앙에 상기 진공홀(11a)과 연통되는 작은 진공형성홀(13b)이 관통되게 형성된 구조로 이루어진다. The adsorption part 13 is a part for forming a vacuum pressure in contact with the non-connection part N formed to cross the middle part of the BOC package P, and the adsorption part 13 is used for vacuum formation in the middle part. An elongated groove 13a is formed, and a small vacuum forming hole 13b communicating with the vacuum hole 11a is formed in the center of the groove 13a.

상기 진공홀(11a)과 진공형성홀(13b) 사이에는 경사부(11b)가 형성된다. 상기 경사부(11b)는 진공홀(11a) 내측에 삽입된 픽커의 홀더(H) 끝단부와 진공형성홀(13b) 사이에서 공기의 유동이 원활해지도록 하는 기능을 한다. An inclined portion 11b is formed between the vacuum hole 11a and the vacuum forming hole 13b. The inclined portion 11b functions to smooth the flow of air between the holder H end of the picker inserted into the vacuum hole 11a and the vacuum forming hole 13b.

상기 볼지지부(12)는 BOC 패키지(P) 양측의 접속부(C)와 대응하여, 접속부(C)에 형성된 볼(B)과 인접하면서 이 부분을 지지하는 기능을 한다. 즉, 상기 볼지지부(12)는 흡착패드(10)가 BOC 패키지(P)를 어떠한 구조물에 안착시킬 때, BOC 패키지의 볼(B)과 접촉하게 되면서 이 부분을 지지함으로써 BOC 패키지가 한쪽으로 기울어지지 않고 안착될 수 있도록 한다. The ball support part 12 functions to support this part while being adjacent to the ball B formed in the connection part C, corresponding to the connection part C of BOC package P both sides. That is, the ball support portion 12 is in contact with the ball (B) of the BOC package when the adsorption pad 10 seats the BOC package (P) to any structure, by supporting this portion of the BOC package is tilted to one side Allow them to settle without losing.

상기 볼지지부(12)는 BOC 패키지(P)의 면적과 대체로 동일한 면적을 가질 수 도 있지만, 이 실시예에서처럼 BOC 패키지(P)의 면적보다 작은 면적을 가질 수도 있다. 이와 같이, 볼지지부(12)의 면적을 BOC 패키지(P) 면적보다 작은 면적으로 형성하면, 취급하고자 하는 BOC 패키지(P)의 크기가 더 작을 경우에도 흡착패드(10)를 교체하지 않고 그대로 사용할 수 있는 이점이 있다. The ball support 12 may have an area substantially the same as that of the BOC package P, but may have an area smaller than that of the BOC package P as in this embodiment. As such, when the area of the ball support part 12 is formed to be smaller than the area of the BOC package P, even if the size of the BOC package P to be handled is smaller, the suction pad 10 can be used as it is without being replaced. There is an advantage to this.

상기와 같이 구성된 흡착패드(10)는 도 8에 도시된 것과 같이, 상기 흡착부(13)가 BOC 패키지(P)의 중앙의 비접속부(N)와 접촉하고, 상기 진공홀(11a)과 진공형성홀(13b)을 통해 흡입력이 제공되어 상기 비접속부(N)를 진공 흡착한다. 이 때, 흡착패드(10)에 BOC 패키지(P)가 고정된 상태에서 BOC 패키지(P)의 양측 접속부(C)의 볼(B)은 흡착패드(10)의 볼지지부(12)의 하측에 인접한 상태로 된다. In the adsorption pad 10 configured as described above, as shown in FIG. 8, the adsorption part 13 is in contact with the non-connection part N at the center of the BOC package P, and the vacuum hole 11a and the vacuum are performed. A suction force is provided through the forming hole 13b to vacuum suck the non-connecting portion N. At this time, in the state in which the BOC package P is fixed to the suction pad 10, the balls B of both side connection portions C of the BOC package P are disposed below the ball support part 12 of the suction pad 10. It becomes an adjacent state.

따라서, 픽커가 흡착패드(10)에 부착된 BOC 패키지(P)를 트레이의 포켓에 안착시킬 때, BOC 패키지(P)의 양측면부가 흡착패드(10)의 볼지지부(12)에 의해 지지되므로 BOC 패키지가 한 쪽으로 기울어지지 않고 안정적으로 안착된다. Therefore, when the picker seats the BOC package P attached to the adsorption pad 10 in the pocket of the tray, both sides of the BOC package P are supported by the ball support 12 of the adsorption pad 10. The package rests reliably without tilting to one side.

한편, 도 9에 도시된 것과 같이, 상기 흡착패드(10)의 하부에 BOC 패키지(P)가 진공 흡착된 상태에서 BOC 패키지(P)는 하부의 비전카메라(V)에 의해 마킹검사 등이 이루어진다. 이 때, 상기 흡착패드(10)의 몸체부(11)의 하부면은 촬영되는 BOC 패키지(P)의 배경이 된다. Meanwhile, as shown in FIG. 9, the BOC package P is markedly inspected by the vision camera V at the bottom in a state in which the BOC package P is vacuum-adsorbed to the lower portion of the adsorption pad 10. . At this time, the lower surface of the body portion 11 of the suction pad 10 becomes the background of the BOC package (P) to be photographed.

따라서, 비전카메라(V)에 의한 비전 검사시, 흡착패드(10)의 하부면과 BOC 패키지(P) 간의 경계가 뚜렷하게 나타나기 위해서는 흡착패드(10)의 몸체부(11)의 색깔은 BOC 패키지(P)의 색(대부분 검은색임)과는 대비되는 색깔(예컨대 하얀색)을 가지며, 몸체부(11)의 하부면의 면적은 BOC 패키지(P)의 면적보다 큰 것이 바람직 하다. Therefore, in the vision inspection by the vision camera V, the color of the body portion 11 of the suction pad 10 is BOC package (in order to clearly show the boundary between the bottom surface of the suction pad 10 and the BOC package P). It has a color (for example white) in contrast to the color of P) (mostly black), and the area of the lower surface of the body portion 11 is preferably larger than the area of the BOC package P.

그리고, 도 10에 도시된 것과 같이, 본 발명의 흡착패드(10)는 BOC 패키지(P)의 중간 부분의 비접속부(N)를 진공 흡착하므로, 워페이지(warpage) 변형이 발생한 BOC 패키지(P)도 안정적으로 흡착할 수 있다. And, as shown in Figure 10, the adsorption pad 10 of the present invention vacuum-adsorbs the non-connecting portion (N) of the middle portion of the BOC package (P), so that warpage (warpage) deformation BOC package (P) ) Can also be stably adsorbed.

또한, 상기와 구성된 본 발명의 흡착패드(10)는 도 7과 도 8에 도시된 것과 같이 볼이 형성되지 않은 비접속부(N)가 중간 부분에 돌출 형성된 형태의 BOC 패키지(P) 뿐만 아니라, 도 11에 도시된 것과 같이, 편평한 형태의 비접속부(N)를 갖는 BOC 패키지(P)도 동일한 방식으로 진공 흡착할 수 있다. 물론, 이 경우, 흡착패드(10)의 흡착부(13)는 도 7에 도시된 흡착패드(10)의 흡착부(13)보다 더 높게 돌출될 것이다. In addition, the adsorption pad 10 of the present invention configured as described above, as shown in Figures 7 and 8, as well as the BOC package (P) having a non-connected portion (N) is formed protruding in the middle portion, As shown in FIG. 11, the BOC package P having the non-connected portion N in a flat shape may be vacuum-adsorbed in the same manner. Of course, in this case, the adsorption part 13 of the adsorption pad 10 will protrude higher than the adsorption part 13 of the adsorption pad 10 shown in FIG. 7.

한편, 전술한 실시예의 흡착패드(10)는 볼지지부(12)가 몸체부(11)의 하부면에 대해 소정 높이로 돌출된 구조를 가지지만, 도 12에 도시된 흡착패드(10)의 실시예와 같이, 볼지지부(12a)가 몸체부(11)의 하부면에 돌출되지 않고 대체로 편평하게 형성될 수도 있다. Meanwhile, although the suction pad 10 of the above-described embodiment has a structure in which the ball support part 12 protrudes at a predetermined height with respect to the lower surface of the body part 11, the suction pad 10 shown in FIG. 12 is implemented. As an example, the ball supporting portion 12a may be formed to be generally flat without protruding from the lower surface of the body portion 11.

이상에서와 같이 본 발명에 따르면, 흡착패드가 반도체 패키지의 양측 볼 부분을 지지하면서 중간 부분의 볼이 형성되지 않은 부분을 진공 흡착하여 고정하므로, 볼이 반도체 패키지의 에지까지 형성되어 에지에 여유 공간이 없더라도 반도체 패키지를 안정적으로 고정할 수 있다.As described above, according to the present invention, since the suction pad supports the ball portions on both sides of the semiconductor package, the suction portion is fixed by vacuum adsorption on a portion in which the ball of the middle portion is not formed. Without this, the semiconductor package can be fixed stably.

또한, 반도체 패키지에 워페이지 변형이 발생하더라도 반도체 패키지를 안정 되게 고정할 수 있다. In addition, even if warpage deformation occurs in the semiconductor package, the semiconductor package may be stably fixed.

그리고, 흡착패드의 중간 부분에 반도체 패키지를 진공 흡착하는 흡착부가 형성되어 있으므로, 장시간 동안의 반복 사용에 의해 흡착부 표면이 변색되어도 비전카메라에 의한 비전검사에 영향을 주지 않고 항상 정확한 비전 검사가 이루어질 수 있다.And since the adsorption part for vacuum adsorption of the semiconductor package is formed in the middle part of the adsorption pad, even if the surface of the adsorption part is discolored by repeated use for a long time, accurate vision inspection is always performed without affecting the vision inspection by the vision camera. Can be.

Claims (5)

볼이 형성되지 않은 비접속부가 중간 부분을 가로지르도록 형성된 반도체 패키지를 진공 흡착하여 반송하는 반도체 패키지 이송장치용 흡착패드에 있어서, In the adsorption pad for a semiconductor package conveying apparatus which vacuum-suctions and conveys the semiconductor package formed so that the non-connection part which a ball is not formed across an intermediate part, 반도체 패키지 이송장치에 고정되며, 중앙에 진공 형성을 위한 진공홀이 형성된 몸체부와;A body portion fixed to the semiconductor package transfer apparatus and having a vacuum hole formed at the center thereof for forming a vacuum; 상기 몸체부의 하부면에 일체로 형성되어, 몸체부 하부에 흡착되는 반도체 패키지의 양측의 볼들과 인접하는 볼지지부와; A ball support part integrally formed on the lower surface of the body part and adjacent to the balls on both sides of the semiconductor package adsorbed to the lower part of the body part; 상기 볼지지부의 중앙을 가로지르면서 돌출되게 형성되어 상기 반도체 패키지의 중간의 비접속부와 접촉하며, 중앙부에 상기 진공홀과 연통되는 진공형성홀이 관통되게 형성된 흡착부를 포함하여 구성된 것을 특징으로 하는 반도체 패키지 이송장치용 흡착패드.And a suction part formed to protrude across the center of the ball support part to contact a non-connection part in the middle of the semiconductor package, and a suction part formed to penetrate a vacuum forming hole communicating with the vacuum hole in the center part. Suction pad for package feeder. 제 1항에 있어서, 상기 볼지지부는 몸체부의 하부면에 돌출되게 형성된 것을 특징으로 하는 반도체 패키지 이송장치용 흡착패드.The suction pad of claim 1, wherein the ball support is formed to protrude from the lower surface of the body. 제 1항 또는 2항에 있어서, 상기 볼지지부는 반도체 패키지의 면적보다 작은 면적을 갖는 것을 특징으로 하는 반도체 패키지 이송장치용 흡착패드.The suction pad of claim 1 or 2, wherein the ball support portion has an area smaller than that of the semiconductor package. 제 1항 또는 제 2항에 있어서, 상기 몸체부의 하부면의 면적은 반도체 패키 지의 면적보다 큰 것을 특징으로 하는 반도체 패키지 이송장치용 흡착패드.The suction pad of claim 1 or 2, wherein an area of a lower surface of the body portion is larger than an area of a semiconductor package. 제 1항에 있어서, 상기 몸체부의 진공홀과 상기 진공형성홀 사이에 경사부가 형성된 것을 특징으로 하는 반도체 패키지 이송장치용 흡착패드.The suction pad of claim 1, wherein an inclined portion is formed between the vacuum hole of the body portion and the vacuum forming hole.
KR1020070038178A 2007-04-19 2007-04-19 Suction Pad for Semiconductor Transfer Device KR100889591B1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200364704Y1 (en) 2004-06-04 2004-10-12 주식회사 대성엔지니어링 Pocket type insert apparatus
KR100639401B1 (en) * 2005-11-22 2006-10-27 한미반도체 주식회사 Pad having reference mark and pad alignment method using thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200364704Y1 (en) 2004-06-04 2004-10-12 주식회사 대성엔지니어링 Pocket type insert apparatus
KR100639401B1 (en) * 2005-11-22 2006-10-27 한미반도체 주식회사 Pad having reference mark and pad alignment method using thereof

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