KR20150076752A - Apparatus for drying semiconductor packages - Google Patents

Apparatus for drying semiconductor packages Download PDF

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Publication number
KR20150076752A
KR20150076752A KR1020130165307A KR20130165307A KR20150076752A KR 20150076752 A KR20150076752 A KR 20150076752A KR 1020130165307 A KR1020130165307 A KR 1020130165307A KR 20130165307 A KR20130165307 A KR 20130165307A KR 20150076752 A KR20150076752 A KR 20150076752A
Authority
KR
South Korea
Prior art keywords
semiconductor packages
nozzle assembly
driving unit
semiconductor
drying
Prior art date
Application number
KR1020130165307A
Other languages
Korean (ko)
Inventor
한광훈
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020130165307A priority Critical patent/KR20150076752A/en
Publication of KR20150076752A publication Critical patent/KR20150076752A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

An apparatus for drying semiconductor packages comprises a table for supporting multiple semiconductor packages; a nozzle assembly arranged on an upper part of the table, and including multiple air nozzles spraying air for drying the semiconductor packages; a rotating part connected to the nozzle assembly, and rotating the nozzle assembly; and a horizontal driving part connected to the rotating part, and moving the rotating part and the nozzle assembly in the horizontal direction.

Description

[0001] Apparatus for drying semiconductor packages [0002]

Embodiments of the present invention relate to a semiconductor package drying apparatus. More particularly, the present invention relates to an apparatus for drying semiconductor packages after a cleaning step for semiconductor packages that have been cut in a cutting and sorting process of semiconductor packages.

Generally, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as described above can be mounted on a substrate through a dicing process and a die bonding process have. Subsequently, the semiconductor elements on the substrate may be packaged together using a molding resin such as an epoxy resin.

As described above, the semiconductor strips fabricated by the molding process can be individualized into a plurality of semiconductor packages through a sawing & sorting process and can be classified according to good or defective judgment. The cutting and sorting process loads the semiconductor strip onto a chuck table and then individualizes it into a plurality of semiconductor elements using a cutting blade, the individual semiconductor elements being collectively picked up by a package picker and then cleaned have.

After the cleaning process of the semiconductor packages is completed, the semiconductor elements may be placed on a drying table and then dried by air jet. The semiconductor packages thus dried can be reversed by the reversing mechanism and then stacked on the pallet table, and then housed in the trays by the sorting mechanism.

The semiconductor packages dried on the drying table can be inspected for the first side by the first vision inspection apparatus and the inspection for the second side can be performed on the palette table by the second vision inspection apparatus . Also, according to the inspection result, the semiconductor packages can be judged as good and defective, and they can be classified as good and defective according to the inspection result.

As an example, Korean Patent Laid-Open Nos. 10-2002-0049954 and 10-2011-0144535 disclose a cutting and sorting apparatus for semiconductor packages, Korean Patent Laid-Open Publication No. 10-2007-0106266 Discloses an air knife for drying semiconductor packages.

The air knife or a plurality of air nozzles can jet air onto the semiconductor packages and can be reciprocated horizontally on the drying table. However, when the air knife or the air nozzles are moved in the horizontal direction as described above, the flow of the air provided on the drying table and the semiconductor packages is always constant, so that the possibility of moisture remaining between the semiconductor packages have.

If moisture remains on the drying table and the semiconductor packages as described above, it may become difficult to obtain a clear inspection image in a subsequent inspection process. Specifically, illumination light may be reflected or scattered by moisture on the drying table, thereby making it difficult to obtain a clear inspection image for the semiconductor packages. As a result, there may arise a problem that normal packages are determined to be defective due to the residual moisture.

It is an object of the present invention to provide a new type of semiconductor package drying apparatus capable of sufficiently drying semiconductor packages on a table.

According to embodiments of the present invention, a semiconductor package inspection apparatus includes a table for supporting a plurality of semiconductor packages, and a plurality of air nozzles disposed on the table and for spraying air to dry the semiconductor packages And a horizontal driving unit connected to the rotation driving unit and adapted to move the rotation driving unit and the nozzle assembly in a horizontal direction. The driving unit may include a nozzle assembly, a rotation driving unit connected to the nozzle assembly for rotating the nozzle assembly, and a horizontal driving unit for moving the rotation driving unit and the nozzle assembly in a horizontal direction.

According to embodiments of the present invention, the nozzle assembly may include a body in the form of a bar, and the air nozzles may be arranged along the extension direction of the body.

According to embodiments of the present invention, the semiconductor packages may be arranged to have a plurality of rows and columns on a table, and the nozzle assembly may be arranged in a row or column direction of the semiconductor packages Or in a diagonal direction with respect to the row direction or the column direction of the semiconductor packages.

According to the embodiments of the present invention, the nozzle assembly may be moved in a direction perpendicular to the extending direction of the body by the horizontal driving unit.

According to the embodiments of the present invention, the rotational movement of the nozzle assembly by the rotational driving unit and the linear movement of the nozzle assembly by the horizontal driving unit can be simultaneously performed.

According to embodiments of the present invention, the upper surface of the table may be provided with vacuum holes for adsorbing the semiconductor packages.

According to the embodiments of the present invention as described above, a plurality of air nozzles are disposed on the semiconductor packages disposed on the drying table, and the air nozzles are linearly moved in the horizontal direction and rotated, And the drying efficiency of the semiconductor packages can be greatly improved by forming a vortex around the upper surfaces of the semiconductor packages and the semiconductor packages.

Particularly, the drying efficiency of the semiconductor packages can be further improved by controlling the operation of the horizontal driving unit and the rotation driving unit so that the horizontal linear movement and the rotational movement of the air nozzles are simultaneously performed.

As a result, the sharpness of the inspection images for the semiconductor packages can be greatly improved in the subsequent semiconductor package inspection process, thereby greatly improving the reliability of the semiconductor package inspection process.

FIG. 1 is a schematic structural view illustrating a semiconductor package drying apparatus according to an embodiment of the present invention.
FIGS. 2 to 5 are schematic views for explaining the operation of the semiconductor packages and the nozzle assembly shown in FIG. 1. FIG.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail below with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be directly disposed or connected to the other element, and other elements or layers may be placed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the areas illustrated in the drawings, but include deviations in the shapes, the areas described in the drawings being entirely schematic and their shapes Is not intended to illustrate the exact shape of the area and is not intended to limit the scope of the invention.

FIG. 1 is a schematic structural view for explaining a semiconductor package drying apparatus according to an embodiment of the present invention, and FIGS. 2 to 5 are schematic views for explaining the operation of the semiconductor packages and the nozzle assembly shown in FIG. 1 .

1 to 5, the semiconductor package drying apparatus 100 according to an embodiment of the present invention can be suitably used in a cutting and sorting process of the semiconductor packages 10.

For example, the cutting and sorting process of the semiconductor packages 10 may include cutting the semiconductor strips into individual semiconductor packages 10, picking up and cleaning the semiconductor packages 10, , Drying the semiconductor packages (10), and classifying the semiconductor packages (10).

Although not shown in detail, the individualized semiconductor packages 10 may be cleaned by a cleaning module (not shown), dried by the drying apparatus 100, and then classified by a classification module (not shown) .

Although not shown, the cleaning module may include a nozzle for spraying water used as a cleaning liquid, a brush for removing foreign substances from the semiconductor packages 10, and the like, As shown in Fig.

The semiconductor packages 10 thus cleaned can be transferred to the drying apparatus 100, dried by the drying apparatus 100, and then transferred to the sorting module. In addition, an inspection process may be performed on the dried semiconductor packages 10, and the semiconductor packages 10 may be classified as good and defective according to the inspection result.

According to an embodiment of the present invention, the drying apparatus 100 includes a drying table 110 for supporting the cleaned semiconductor packages 10, and a drying table 110 for spraying air to dry the semiconductor packages 10 And a nozzle assembly 120.

Although not shown, a plurality of vacuum holes may be provided on the upper surface of the drying table 110 to vacuum-adsorb the semiconductor packages 10, thereby blowing air from the nozzle assembly 120 The semiconductor packages 10 can be stably fixed on the drying table 110. [0054] FIG.

The nozzle assembly 120 may include a plurality of air nozzles 122 for jetting air onto the semiconductor packages 10. [ For example, the nozzle assembly 120 may include a body 124 having a bar shape, and the air nozzles 122 may be arranged along the extension direction of the body 124 . 4, four air nozzles 122 are used, but the number of the air nozzles 122 may be variously changed, so that the scope of the present invention is not limited thereto.

According to an embodiment of the present invention, the drying apparatus 100 includes a rotation driving unit 130 connected to the nozzle assembly 120 for rotating the nozzle assembly 120, and a rotation driving unit 130 connected to the rotation driving unit 130 And a horizontal driving unit 140 for moving the rotation driving unit 130 and the nozzle assembly 120 in a horizontal direction.

For example, the rotation driving unit 130 may be constructed using a motor, and the horizontal driving unit 140 may be a rectangular coordinate robot. However, the detailed configuration of the rotation driving unit 130 and the horizontal driving unit 140 may be variously changed, so that the scope of the present invention is not limited thereto.

Further, although not shown, the air nozzles 122 may be connected to an air source (not shown) for supplying the air, and the air source may be configured using an air pump, a filter, an air tank, have. Further, although not shown, the operation of the rotation driving unit 130 and the horizontal driving unit 140 can be controlled by a control unit.

2 and 3, the semiconductor packages 10 may be arranged on the drying table 110 to have a plurality of rows and columns. That is, the semiconductor strip may be transferred onto the drying table 110 in a cut state, and may be adsorbed and fixed on the drying table 110 by the vacuum holes.

For example, the nozzle assembly 120 may be rotated by the rotation driving unit 130 so that the air nozzles 122 are parallel to the row or column direction of the semiconductor packages 10 And may be moved in a direction orthogonal to the direction in which the air nozzles 122 are arranged by the horizontal driving unit 140, that is, the direction in which the body 124 extends.

4, the nozzle assembly 120 may be disposed in an oblique direction with respect to a row direction or a column direction of the semiconductor packages 10 by the rotation driving unit 130, Can be moved in a direction orthogonal to the body (124) by the driving unit (140).

5, rotation of the nozzle assembly 120 by the rotation driving unit 130 and horizontal movement of the nozzle assembly 120 by the horizontal driving unit 140 are simultaneously performed It is possible.

The movement and rotation of the nozzle assembly 120 may be variously combined, whereby the moisture on the drying table 110 and the semiconductor packages 10 can be sufficiently removed. Particularly, when rotational movement and linear movement of the nozzle assembly 120 are simultaneously performed, irregular eddy currents may be generated in the periphery of the drying table 110 and the semiconductor packages 10, The drying efficiency of the drying apparatus 10 can be greatly improved.

The plurality of air nozzles 122 are disposed on the semiconductor packages 10 positioned on the drying table 110 and the air nozzles 122 are disposed on the semiconductor packages 10. [ By linearly moving the semiconductor package 10 in the horizontal direction and rotating it, a vortex is formed around the upper surface of the drying table 110 and around the semiconductor packages 10, thereby greatly improving the drying efficiency of the semiconductor packages 10 .

Particularly, by controlling the operation of the horizontal driving unit 140 and the rotation driving unit 130 so that the horizontal linear movement and the rotational movement of the air nozzles 122 are simultaneously performed, the drying efficiency of the semiconductor packages 10 is further improved .

As a result, the sharpness of inspection images for the semiconductor packages 10 can be greatly improved in a subsequent semiconductor package inspection process, thereby greatly improving the reliability of the semiconductor package inspection process.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

10: semiconductor package 100: drying device
110: drying table 120: nozzle assembly
122: air nozzle 124: body
130: rotation driving part 140: horizontal driving part

Claims (6)

A table for supporting a plurality of semiconductor packages;
A nozzle assembly disposed on the table and including a plurality of air nozzles for spraying air to dry the semiconductor packages;
A rotation driving unit connected to the nozzle assembly and rotating the nozzle assembly; And
And a horizontal driving unit connected to the rotation driving unit and moving the rotation driving unit and the nozzle assembly in a horizontal direction. 2. The apparatus of claim 1, wherein the nozzle assembly includes a bar shaped body and the air nozzles are arranged along an extending direction of the body. The semiconductor package according to claim 2, wherein the semiconductor packages are arranged to have a plurality of rows and columns on a table,
Wherein the nozzle assembly is arranged in a direction parallel to a row direction or a column direction of the semiconductor packages by the rotation driving unit or in an oblique direction with respect to a row direction or a column direction of the semiconductor packages. 4. The semiconductor package drying apparatus according to claim 3, wherein the nozzle assembly is moved in a direction orthogonal to an extending direction of the body by the horizontal driving unit. The apparatus of claim 1, wherein the rotational movement of the nozzle assembly by the rotational driving unit and the linear movement of the nozzle assembly by the horizontal driving unit are simultaneously performed. The apparatus of claim 1, wherein vacuum cleaners are provided on the upper surface of the table for vacuuming the semiconductor packages.
KR1020130165307A 2013-12-27 2013-12-27 Apparatus for drying semiconductor packages KR20150076752A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020130165307A KR20150076752A (en) 2013-12-27 2013-12-27 Apparatus for drying semiconductor packages

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Application Number Priority Date Filing Date Title
KR1020130165307A KR20150076752A (en) 2013-12-27 2013-12-27 Apparatus for drying semiconductor packages

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KR20150076752A true KR20150076752A (en) 2015-07-07

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102159467B1 (en) * 2020-03-26 2020-09-23 (주)네온테크 Semiconductor Package Drying Apparatus And Mehtod For The Same
JP2022081420A (en) * 2020-11-19 2022-05-31 サムス カンパニー リミテッド Package drying device in semiconductor strip cutting and sorting facility

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102159467B1 (en) * 2020-03-26 2020-09-23 (주)네온테크 Semiconductor Package Drying Apparatus And Mehtod For The Same
JP2022081420A (en) * 2020-11-19 2022-05-31 サムス カンパニー リミテッド Package drying device in semiconductor strip cutting and sorting facility
TWI804029B (en) * 2020-11-19 2023-06-01 韓商细美事有限公司 Semiconductor strip sawing and sorting equipment, apparatus for drying package, and handling apparatus

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