JP2023155541A - Cutting device and manufacturing method of cut product - Google Patents

Abstract

To provide a cutting device which is configured to cut a cut object and enables automatic exchange of a dress board, and to provide a manufacturing method of a cut product.SOLUTION: A cutting device includes a cutting table, a cutting mechanism, a dressing table, a housing mechanism, and a transport mechanism. The cutting tabel holds a cut object. The cutting mechanism cuts the cut object held by the cutting table with a blade. The dressing table holds a dress board for dressing of the blade. The housing mechanism houses multiple dress boards in a stacked manner. The transport mechanism includes: a substrate transport part; and a dress board transport part which may move with the substrate transport part. The substrate transport part suctions the cut object and transports the suctioned cut object to the cutting table. The dress board transport part transports the dress board between the housing mechanism and the dressing table.SELECTED DRAWING: Figure 1

Description

The present invention relates to a cutting device and a method for manufacturing cut products.

Japanese Unexamined Patent Publication No. 2013-120794 (Patent Document 1) discloses a dicing apparatus that performs grooving and cutting on a work such as a wafer. In this dicing apparatus, various processes are performed on a workpiece by using a dicing blade that rotates at high speed. Further, dressing of the dicing blade is performed by cutting a groove in the dressing member with the dicing blade. In this dicing device, the dressing member is automatically replaced (see Patent Document 1).

Japanese Patent Application Publication No. 2013-120794

The technique disclosed in Patent Document 1 is related to a dicing device that performs groove processing and cutting on a workpiece such as a wafer. It is not appropriate to directly apply the present technology to a cutting device configured to cut an object to be cut that is not targeted by a dicing device, for example, a sealed substrate sealed with resin.

The present invention has been made to solve such problems, and its purpose is to cut objects to be cut including sealed substrates, and to automatically replace dress boards. It is an object of the present invention to provide a cutting device and a method for manufacturing cut products.

A cutting device according to an aspect of the present invention includes a cutting table, a cutting mechanism, a dressing table, a storage mechanism, and a conveyance mechanism. The cutting table is configured to hold an object to be cut. The cutting mechanism is configured to cut the object held on the cutting table with a blade. The dressing table is configured to hold a dressing board for dressing the blade. The storage mechanism is configured to store a plurality of dress boards in a stacked manner. The transport mechanism includes a substrate transport section and a dress board transport section that is movable together with the substrate transport section. The substrate transport section is configured to suck the object to be cut and to transport the attracted object to the cutting table. The dress board transport section is configured to transport the dress board between the storage mechanism and the dressing table.

Further, a method for manufacturing a cut product according to another aspect of the present invention is a method for manufacturing a cut product using the above cutting device. The method for manufacturing a cut product includes the steps of suctioning an object to be cut and transporting the suctioned object to a cutting table, a step of transporting a dressing board between a storage mechanism and a dressing table, and a step of transporting a dressing board between a storage mechanism and a dressing table. dressing the blade using a dressing board held on the table; and manufacturing a cut product by cutting the object held on the cutting table using the dressed blade. .

According to the present invention, it is possible to provide a cutting device configured to cut an object to be cut including a sealed substrate and capable of automatically replacing a dress board, and a method for manufacturing a cut product. can.

FIG. 2 is a plan view schematically showing a cutting device. 1 is a diagram schematically showing the hardware configuration of a computer. FIG. 3 is a perspective view schematically showing the periphery of the accommodation mechanism. It is a figure which shows typically the conveyance mechanism seen diagonally from below. It is a figure which shows typically the conveyance mechanism seen diagonally from above. FIG. 3 is a diagram for explaining the mutual relationship between a substrate transport section, a mounting loader, and a suction source. It is a figure which shows typically the side surface of a part of conveyance mechanism. It is a figure which shows typically the state which looked at the cutting table and the dressing table from diagonally above. It is a figure which shows typically the plane of a member for dress board arrangement|positioning. 9 is a diagram schematically showing a cross section taken along line XX in FIG. 9. FIG. 3 is a flowchart illustrating a procedure for automatic dress board replacement processing. 12 is a flowchart showing the processing executed in step S110 of FIG. 11. It is a figure which shows the positional relationship of the conveyance mechanism and a table at the timing of collecting|recovering the dressing board held by the table for dressing. 12 is a flowchart showing the processing executed in step S120 of FIG. 11. It is a figure which shows the positional relationship of the conveyance mechanism and a table at the timing which arrange|positions a new dress board on the table for dressing. 12 is a flowchart showing an example in which dress board collection processing and attachment processing are performed in parallel. It is a perspective view which shows typically the periphery of a new dress holder in other embodiments.

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment (hereinafter also referred to as "this embodiment") according to one aspect of the present invention will be described in detail below with reference to the drawings. In addition, the same reference numerals are attached to the same or corresponding parts in the drawings, and the description thereof will not be repeated. Further, each drawing is schematically drawn with objects omitted or exaggerated as appropriate for ease of understanding.

[1. composition]
<1-1. Overall configuration of cutting device>
FIG. 1 is a plan view schematically showing a cutting device 1 according to the present embodiment. The cutting device 1 is configured to cut a package substrate (an example of an object to be cut) into pieces into a plurality of electronic components (package components). Examples of package substrates include those on which a semiconductor chip is mounted or a lead frame sealed with resin, and those on which capacitors, resistors, etc. are sealed with resin. Further, in this embodiment, the package substrate is the object to be cut, but the object to be cut may be a substrate or a wafer that is not sealed with resin.

Examples of package substrates include BGA (Ball Grid Array) package substrate, LGA (Land Grid Array) package substrate, CSP (Chip Size Package) package substrate, LED (Light Emitting Diode) package substrate, and QFN (Quad Flat No-leaded) package substrate. ) package substrates.

Further, the cutting device 1 is configured to inspect each of the plurality of individualized electronic components. In the cutting device 1, an image of each electronic component is captured, and each electronic component is inspected based on the image. Inspection data is generated through the inspection, and each electronic component is classified as a "good product" or a "defective product."

In this example, a package substrate P1 is used as the object to be cut, and the cutting device 1 separates the package substrate P1 into a plurality of electronic components S1. Hereinafter, of both surfaces of the package substrate P1, the resin-sealed surface will be referred to as a mold surface, and the surface opposite to the mold surface will be referred to as a ball/lead surface.

As shown in FIG. 1, the cutting device 1 includes a cutting module A1 and an inspection/storage module B1 as components. The cutting module A1 is configured to manufacture a plurality of electronic components S1 by cutting the package substrate P1.

Further, in the cutting module A1, dressing of a blade 6a (described later) for cutting the package substrate P1 is performed. Dressing the blade 6a means sharpening the blade 6a. Dressing of the blade 6a is performed by forming grooves in the dressing board D1 (described later) with the blade 6a. In the cutting module A1, the dressing board D1 is automatically replaced. The automatic replacement of the dress board D1 will be explained in detail later.

The inspection/storage module B1 is configured to inspect each of the plurality of manufactured electronic components S1, and then store the electronic components S1 in a tray. In the cutting device 1, each component is removable and replaceable with respect to other components.

The cutting module A1 mainly includes a substrate supply section 3, a positioning section 4, a table 5, a spindle section 6, and a transport section 7.

The substrate supply section 3 supplies the package substrates P1 one by one to the positioning section 4 by pushing out the package substrates P1 one by one from the magazine M1 that accommodates a plurality of package substrates P1. At this time, the package substrate P1 is placed with the ball/lead surface facing upward.

The positioning section 4 includes a rail section 4a, a transport mechanism 4b, and a storage mechanism 43. In the rail section 4a, the package substrate P1 pushed out from the substrate supply section 3 is placed on the rail section 4a, and the package substrate P1 is positioned. Thereafter, the transport mechanism 4b transports the positioned package substrate P1 to the table 5. The storage mechanism 43 stores a plurality of dress boards D1 (FIG. 3) in a stacked manner. The transport mechanism 4b transports the dress board D1 accommodated in the storage mechanism 43 to the table 5 as necessary. Note that the transport mechanism 4b and the storage mechanism 43 will be explained in detail later.

The table 5 holds the package substrate P1 to be cut. Here, a cutting device 1 having a twin cut table configuration having two tables 5 is illustrated. The table 5 includes a cutting table 5a, a dressing table 5f, a rotating mechanism 5b, and a moving mechanism 5c.

The cutting table 5a holds the package substrate P1 transported by the transport mechanism 4b by adsorbing it from below. The dressing table 5f holds the dress board D1 (FIG. 3) transported by the transport mechanism 4b by adsorbing it from below. Although details will be described later, the dressing board D1 held on the dressing table 5f is automatically replaced by the transport mechanism 4b.

The rotation mechanism 5b is capable of rotating the cutting table 5a and the dressing table 5f in the θ1 direction in the figure (that is, rotating in the horizontal plane). The moving mechanism 5c can move the cutting table 5a and the dressing table 5f along the Y axis in the figure. More specifically, the moving mechanism 5c has a set position (hereinafter also simply referred to as "set position") where the package substrate P1 is held on the cutting table 5a, and a processing position (hereinafter also referred to simply as "set position") where the package substrate P1 is cut. (also simply referred to as the "processing position").

The spindle unit 6 separates the package substrate P1 into a plurality of electronic components S1 by cutting the package substrate P1. Here, a cutting device 1 having a twin spindle configuration having two spindle sections 6 is illustrated. The spindle portion 6 is movable along the X-axis and Z-axis in the figure. Note that the cutting device 1 may have a single spindle configuration having one spindle portion 6.

The spindle portion 6 includes a blade 6a and a rotating shaft 6c. The blade 6a cuts the package substrate P1 by rotating at high speed, and separates the package substrate P1 into a plurality of electronic components S1. The blade 6a is mounted on the rotating shaft 6c while being sandwiched between first and second flanges (not shown). The first and second flanges are fixed to the rotating shaft 6c by a fastening member (not shown) such as a nut. The first flange is also referred to as the inner flange, and the second flange is also referred to as the outer flange. Further, dressing of the blade 6a is performed by rotating the blade 6a at high speed to form a groove in the dressing board D1 held on the dressing table 5f. As a result, the blade 6a is sharpened.

The spindle portion 6 is provided with a cutting water nozzle, a cooling water nozzle, an offcut splashing water nozzle, and the like. The cutting water nozzle injects cutting water toward the blade 6a rotating at high speed. The cooling water nozzle injects cooling water toward the vicinity of the cut portion of the package substrate P1. The waste material removal water nozzle sprays waste material removal water that removes cutting waste and the like.

After the cutting table 5a adsorbs the package substrate P1, the package substrate P1 is imaged by the first position confirmation camera 5d, and the position of the package substrate P1 is confirmed. The confirmation using the first position confirmation camera 5d is, for example, confirmation of the position of a mark provided on the package substrate P1. The mark indicates, for example, the cutting position of the package substrate P1.

Thereafter, the table 5 moves toward the spindle section 6 along the Y axis in the figure. After the table 5 moves below the spindle part 6, the package substrate P1 is cut by relatively moving the table 5 and the spindle part 6. Thereafter, the package board P1 is imaged by the second position confirmation camera 6b provided in the spindle section 6 as needed, and the position of the package board P1 and the like are confirmed. The confirmation using the second position confirmation camera 6b is, for example, confirmation of the cutting position and cutting width of the package substrate P1.

After the cutting of the package substrate P1 is completed, the table 5 moves in a direction away from the spindle part 6 along the Y axis in the figure while adsorbing the plurality of individualized electronic components S1. During this moving process, the first cleaner 5e cleans and dries the upper surface (ball/lead surface) of the electronic component S1. The first cleaner 5e is provided in an area between the set position and the processing position. The cleaning in the first cleaner 5e may be performed, for example, by directly spraying cleaning water (an example of a liquid) onto the top surface of the electronic component S1, or by cleaning the top surface of the electronic component S1 with a brush or the like. This may be done by supplying water.

Although the cutting device 1 is provided with two first cleaners 5e arranged in the X-axis direction in the figure, the number of first cleaners 5e is not limited to this. Further, in the cutting device 1, the first cleaner 5e may be able to clean the dressing board D1 held on the dressing table 5f. In this case, the dress board D1 may be cleaned, for example, by directly spraying cleaning water onto the top surface of the dress board D1. Alternatively, two fluids including liquid and gas may be directly injected onto the upper surface of the dress board D1. As a result, even if, for example, processing waste generated through the cutting process of the package substrate P1 adheres to the dress board D1, the dress board D1 can be cleaned, and the blade 6a can be cleaned using the cleaned dress board D1. Dressing can be done.

The transport unit 7 sucks the electronic component S1 held on the cutting table 5a from above and transports the electronic component S1 to the inspection table 11 of the inspection/storage module B1. During this transportation process, the second cleaner 7a cleans and dries the lower surface (mold surface) of the electronic component S1. This cleaning may be performed, for example, by directly spraying cleaning water onto the bottom surface of the electronic component S1, or by supplying cleaning water to the bottom surface of the electronic component S1 through a brush or the like. Good too.

The inspection/storage module B1 mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, an arrangement section 14, and an extraction section 15. Note that the first optical inspection camera 12 may be provided in the cutting module A1.

The inspection table 11 holds the electronic component S1 for optical inspection of the electronic component S1. The inspection table 11 is movable along the X-axis in the figure. Further, the inspection table 11 can be turned upside down. The inspection table 11 is provided with a holding member that holds the electronic component S1 by sucking the electronic component S1.

The first optical inspection camera 12 and the second optical inspection camera 13 image both sides (ball/lead surface and mold surface) of the electronic component S1. Based on the captured images (image data) generated by the first optical inspection camera 12 and the second optical inspection camera 13, various inspections of the electronic component S1 are performed. Each of the first optical inspection camera 12 and the second optical inspection camera 13 is arranged in the vicinity of the inspection table 11 so as to image the upper part.

The first optical inspection camera 12 images the mold surface of the electronic component S1 that is transported to the inspection table 11 by the transport unit 7. Thereafter, the transport section 7 places the electronic component S1 on the holding member of the inspection table 11. After the holding member adsorbs the electronic component S1, the inspection table 11 is turned upside down. The inspection table 11 moves above the second optical inspection camera 13, and the ball/lead surface of the electronic component S1 is imaged by the second optical inspection camera 13.

In the placement section 14, the inspected electronic component S1 is placed. The arrangement section 14 is movable along the Y axis in the figure. The inspection table 11 places the inspected electronic component S1 in the placement section 14.

The extraction unit 15 transfers the electronic component S1 placed in the placement unit 14 to a tray. The electronic components S1 are classified into "defective products" or "defective products" based on the results of inspection using the first optical inspection camera 12 and the second optical inspection camera 13. The extraction unit 15 transfers each electronic component S1 to the non-defective tray 15a or the defective tray 15b based on the classification results. That is, non-defective products are stored in the tray 15a for non-defective products, and defective products are stored in the tray 15b for defective products. Once each of the non-defective tray 15a and the defective tray 15b is filled with electronic components S1, they are replaced with new trays.

The cutting device 1 further includes a computer 50 and a monitor 20. Monitor 20 is configured to display images. The monitor 20 is configured with a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor.

The computer 50 controls, for example, the operation of each part of the cutting module A1 and the inspection/storage module B1. The computer 50 controls, for example, the substrate supply section 3, the positioning section 4, the table 5, the spindle section 6, the transport section 7, the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, the arrangement section 14, and the extraction section. 15 and monitor 20 are controlled.

<1-2. Computer hardware configuration>
FIG. 2 is a diagram schematically showing the hardware configuration of the computer 50. As shown in FIG. 2, the computer 50 includes a control section 70, an input/output I/F (interface) 90, a reception section 95, and a storage section 80, and each component is electrically connected via a bus. It is connected to the.

The control unit 70 includes a CPU (Central Processing Unit) 72, a RAM (Random Access Memory) 74, a ROM (Read Only Memory) 76, and the like. The control unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 according to information processing.

The input/output I/F 90 is configured to communicate with each component included in the cutting device 1 via a signal line. The input/output I/F 90 is used to transmit data from the computer 50 to each component in the cutting device 1 and to receive data transmitted from each component in the cutting device 1 to the computer 50. The reception unit 95 is configured to receive instructions from a user (worker). The reception unit 95 includes, for example, a touch panel, a keyboard, a mouse, and a portion or all of a microphone.

The storage unit 80 is, for example, an auxiliary storage device such as a hard disk drive or a solid state drive. The storage unit 80 is configured to store a control program 81, for example. By executing the control program 81 by the control unit 70, various operations in the cutting device 1 are realized. When the control unit 70 executes the control program 81, the control program 81 is loaded into the RAM 74. The control unit 70 controls each component by having the CPU 72 interpret and execute the control program 81 loaded in the RAM 74.

<1-3. Detailed configuration of each mechanism related to automatic dress board replacement>
As described above, the cutting device 1 is provided with the dressing table 5f configured to hold the dressing board D1, and the dressing board D1 held by the dressing table 5f is automatically replaced. The reason for this will be explained next.

For example, if the dressing table 5f is not provided, it is conceivable to dress the blade 6a by arranging the dressing board D1 on the cutting table 5a. Furthermore, it is conceivable to arrange the dress board D1 manually. In such a case, the operator will temporarily stop the cutting device 1 and manually place the dress board D1 on the cutting table 5a. Since such work requires a certain amount of time, it takes a long time to dress the dressing board D1.

In the cutting device 1 according to the present embodiment, the dressing table 5f that holds the dressing board D1 is provided separately from the cutting table 5a, and the dressing board D1 held on the dressing table 5f is replaced by the transport mechanism 4b. done automatically. Therefore, according to the cutting device 1, the dressing board D1 is basically held on the dressing table 5f, and even when the dressing board D1 needs to be replaced, the dressing board D1 can be replaced automatically. Therefore, the time required for dressing the dressing board D1 can be shortened. Each mechanism related to automatic replacement of the dress board D1 will be described in detail below.

(1-3-1. Configuration of accommodation mechanism)
FIG. 3 is a perspective view schematically showing the periphery of the accommodation mechanism 43. As shown in FIG. 3, the accommodation mechanism 43 is provided at a position adjacent to the rail portion 4a. The storage mechanism 43 includes a new dress holder 43a and a used dress box 43b.

The new dress holder 43a is configured to accommodate a plurality of new dress boards D1 in a stacked manner. The new dress holder 43a is assembled to a base portion 436, and includes a movable block 432 and a fixed block 433. The base portion 436 is a plate-shaped member whose bottom is raised by a plurality of legs.

Fixed block 433 is fixed on base portion 436. A protrusion 437 that protrudes toward the movable block 432 in the X-axis direction is provided at each of both ends of the fixed block 433 in the Y-axis direction. The length between the two protrusions 437 is approximately the same as the length of the corresponding side of the dress board D1. The two protrusions 437 determine the position of the dress board D1 in the Y-axis direction with high precision.

The movable block 432 has a movable range on the base portion 436 in the X-axis direction. The movable block 432 can be fixed at a desired position within the movable range. By determining the position of the movable block 432, the position of the dress board D1 in the X-axis direction can be determined with high precision.

A sensor 434 is attached to the lower surface of the base portion 436. The sensor 434 is composed of, for example, a reflective sensor. Among the plurality of dress boards D1 housed in the new dress holder 43a, the dress board D1 housed lowest is exposed to the sensor 434 side. The sensor 434 detects whether or not the dress board D1 remains in the new dress holder 43a by emitting light toward the new dress holder 43a and detecting the presence or absence of reflected light, for example. For example, when the new dress holder 43a is empty, the cutting device 1 may generate a warning sound.

The used dress box 43b is configured to accommodate a plurality of used dress boards D1 in a stacked manner. For example, when the number of dress boards D1 housed in the used dress box 43b reaches a predetermined number, the used dress box 43b is replaced with a new empty one. The used dress box 43b is a box-shaped member with an open top. The used dress box 43b is placed on the base portion 436.

The used dress box 43b includes a bottom portion 430 and side wall portions 431a, 431b, 431c, and 431d. A plurality of used dress boards D1 are accommodated in the space surrounded by the side walls 431a, 431b, 431c, and 431d. The side walls 431a and 431c face each other, and the side walls 431b and 431d face each other. A notch C1 is formed at the upper end of each of the side walls 431b and 431d. The reason why the notch portion C1 is formed at the upper end of each of the side wall portions 431b and 431d will be explained later.

A sensor 435 is attached to the lower surface of the base portion 436. The sensor 435 is composed of, for example, a reflective sensor. At least a portion of the lower surface of the used dress box 43b is exposed to the sensor 435 side. The sensor 435 detects whether or not the used dress box 43b is present at a predetermined position, for example, by emitting light toward the used dress box 43b and detecting the presence or absence of reflected light. For example, when the used dressing box 43b is not present at a predetermined position, the cutting device 1 may generate a warning sound.

(1-3-2. Configuration of transport mechanism)
FIG. 4 is a diagram schematically showing the transport mechanism 4b as seen diagonally from below. FIG. 5 is a diagram schematically showing the transport mechanism 4b as viewed diagonally from above. Referring to FIGS. 4 and 5, the transport mechanism 4b includes a substrate transport section 42 and a dress board transport section 41. In addition, in each of FIG. 4 and FIG. 5, in order to facilitate understanding, the attachment loader 41a and the recovery loader 41b are each shown holding the dress board D1, and in particular, the recovery loader 41a and the recovery loader 41b are shown holding the dress board D1. The dress board D1 held by the loader 41b is shown transparent.

The substrate conveyance section 42 is configured to suck the package substrate P1 positioned on the rail section 4a (FIG. 1) and convey the sucked package substrate P1 to the cutting table 5a. The substrate transport section 42 is connected to a suction source 65 (FIG. 6) such as a vacuum ejector via a connecting member 66. The suction source 65 will be explained later.

The dress board transport section 41 includes an attachment loader 41a and a recovery loader 41b. The attachment loader 41a and the recovery loader 41b are provided at positions adjacent to each other in the X-axis direction (see FIG. 1). The dress board transport unit 41 is integrated with the board transport unit 42 and is configured to move in the X direction together with the board transport unit 42.

The mounting loader 41a suctions the dress board D1 located uppermost among the plurality of dress boards D1 housed in the new dress holder 43a (FIG. 3), and dresses the suctioned dress board D1 from the new dress holder 43a. It is configured to transport the paper to the table 5f for use. The mounting loader 41a is connected to a suction source 65 such as a vacuum ejector via a connecting member 66.

FIG. 6 is a diagram for explaining the mutual relationship among the substrate transport section 42, the mounting loader 41a, and the suction source 65. As shown in FIG. 6, the substrate transport section 42 and the mounting loader 41a are each connected to a common suction source 65 via a switching valve V1. For example, by controlling the switching valve V1 by the control unit 70 (FIG. 2), a state in which the substrate transport unit 42 and the suction source 65 are connected, and a state in which the mounting loader 41a and the suction source 65 are connected can be changed. can be switched. According to the cutting device 1, since the suction source for suctioning the package substrate P1 and the suction source for suctioning the dress board D1 are common, an increase in the number of suction sources can be suppressed. As a result, according to the cutting device 1, it is possible to suppress the device from increasing in size.

The mounting loader 41a includes an air cylinder 411a and a vacuum pad 44. The air cylinder 411a can be expanded and contracted in the vertical direction, and is configured to move the vacuum pad 44 in the vertical direction. The vacuum pad 44 is lowered and the dress board D1 is attracted to the dress board D1 while the vacuum pad 44 is in contact with the dress board D1. Thereby, the dress board D1 is held by the mounting loader 41a. Further, by connecting a pressure reducing valve to the air cylinder 411a, it is possible to appropriately pick up the dress boards D1 regardless of the number of dress boards D1 remaining in the new dress holder 43a.

The recovery loader 41b is configured to mechanically hold the used dress board D1 held on the dressing table 5f and transport the held dress board D1 from the dressing table 5f to the used dress box 43b. has been done. The reason why the new dress board D1 is held by suction while the used dress board D1 is not held by suction but is held mechanically will be explained next.

A large number of grooves are formed on the used dress board D1. Depending on the weight of the dress board D1 and/or the size of the grooves, the dress board D1 may not be stably held due to suction of the surface on which many grooves are formed. That is, holding of the used dress board D1 may become unstable.

In the cutting device 1, a new (unused) dress board D1 is suction-held by an attachment loader 41a, and a used dress board D1 is mechanically held by a recovery loader 41b. Therefore, according to the cutting device 1, since the new dress board D1 is held by suction, it is possible to suppress a decrease in the positional accuracy of the new dress board D1. Further, according to the cutting device 1, since the used dress board D1 is mechanically held, the used dress board D1 can be held stably.

FIG. 7 is a diagram schematically showing a side surface of a portion of the transport mechanism 4b. Referring to FIG. 7, recovery loader 41b includes an air cylinder 411b and claw portions 49a, 49b. The air cylinder 411b can be expanded and contracted in the vertical direction, and is configured to move the claws 49a and 49b in the vertical direction.

The claw portions 49a and 49b face each other in the horizontal direction (X-axis direction). The claw portions 49a and 49b are configured to move in a direction toward each other and in a direction in which they move away from each other. That is, a pair of claws (hereinafter also simply referred to as a "pair of claws") constituted by the claws 49a and 49b are configured to open and close in the horizontal direction. The recovery loader 41b mechanically holds the dress board D1 by sandwiching the dress board D1 between a pair of claws.

The claw portion 49a includes a claw 45a, a linear bush 47a, an air chuck 46a, and a spring 48a. The claw 45a is a plate-shaped member that has a width in the Y-axis direction and extends in the Z-axis direction. The lower end of the claw 45a is bent toward the claw 45b. The pawl 45a is attached to a linear bush 47a. A shaft extending in the X-axis direction passes through the linear bush 47a, and the linear bush 47a is configured to move on the shaft. On the shaft passing through the linear bush 47a, a spring 48a is provided in a direction opposite to the direction in which the claw 45a exists with respect to the linear bush 47a. The air chuck 46a is configured to move in the X-axis direction. Linear bush 47a is attached to air chuck 46a.

Further, the claw portion 49b includes a claw 45b, a linear bush 47b, an air chuck 46b, and a spring 48b. The claw 45b is a plate-shaped member that has a width in the Y-axis direction and extends in the Z-axis direction. The lower end of the claw 45b is bent toward the claw 45a. The pawl 45b is attached to the linear bush 47b. A shaft extending in the X-axis direction passes through the linear bush 47b, and the linear bush 47b is configured to move on the shaft. On the shaft passing through the linear bush 47b, a spring 48b is provided in a direction opposite to the direction in which the claw 45b exists with respect to the linear bush 47b. The air chuck 46b is configured to move in the X-axis direction. Linear bush 47b is attached to air chuck 46b.

As the air chucks 46a and 46b move toward each other, the linear bushing 47a to which the pawl 45a is attached and the linear bushing 47b to which the pawl 45b is attached come close to each other. Finally, the used dress board D1 is held by the claws 45a, 45b with each of the springs 48a, 48b contracted. When the springs 48a, 48b are in the contracted state, a force acts in the direction in which each of the springs 48a, 48b extends, so that the dress board D1 is held with a moderate force (soft clamp).

(1-3-3. Composition of dressing table)
FIG. 8 is a diagram schematically showing the state in which the cutting table 5a and the dressing table 5f are viewed diagonally from above. As shown in FIG. 8, the dressing table 5f is provided at a position adjacent to the cutting table 5a, and is fixed to the cutting table 5a. The dressing table 5f includes a base portion 63 and a dressing board arrangement member 60 fixed on the base portion 63. The dress board arrangement member 60 is made of an elastic member such as rubber, and is replaceable. The dress board D1 is arranged on the dress board arrangement member 60. The dress board D1 is held by suction on the dress board arrangement member 60.

FIG. 9 is a diagram schematically showing a plane of the dress board arrangement member 60. FIG. 10 is a diagram schematically showing a cross section taken along line XX in FIG. Referring to FIGS. 9 and 10, the dress board arrangement member 60 has a bottom portion 61. As shown in FIG. A plurality of holes H2 are formed on the bottom surface part 61. Suction of the dress board D1 is performed through the hole H2. A notch C2 is formed in each of a pair of opposing sides of the plurality of sides of the bottom surface portion 61. The reason why the notch C2 is formed will be explained later.

A protrusion 62 extending upward is formed on a portion of the outer periphery of the bottom surface portion 61 other than the portion where the notch portion C2 is formed. Dress board D1 is arranged within the area surrounded by protrusion 62. Note that the shape and size of the dress board D1 in a plan view are substantially the same as the shape and size of the area surrounded by the protrusion 62 in a plan view.

[2. motion]
FIG. 11 is a flowchart showing the procedure for automatic replacement processing of the dress board D1. The processing shown in this flowchart is executed by the control unit 70 (FIG. 2) of the computer 50 when it is necessary to attach or replace the dress board D1.

Referring to FIG. 11, the control unit 70 places the used dress board D1 on the dressing table 5f by referring to the output of a sensor (not shown) that detects the suction state on the dressing table 5f, for example. It is determined whether or not there exists (step S100). If it is determined that there is no used dressing board D1 on the dressing table 5f (NO in step S100), the control unit 70 executes the process of step S120.

On the other hand, if it is determined that there is a used dress board D1 on the dressing table 5f (YES in step S100), the control unit 70 executes a collection process for the used dress board D1 (step S110). The recovery process for the dress board D1 will be explained in detail later. When the collection process of the used dress board D1 is completed, the control unit 70 executes the process of attaching a new dress board D1 (step S120). The process of attaching the dress board D1 will be explained in detail later.

FIG. 12 is a flowchart showing the process executed in step S110 (recovery process of dress board D1) in FIG. Referring to FIG. 12, the control unit 70 controls the drive unit (eg, motor) of the transport mechanism 4b so that the recovery loader 41b is positioned above the dressing table 5f (step S200). After that, the control unit 70 controls the pair of claws so that the pair of claws of the collection loader 41b descend and pick up the used dressing board D1 held on the dressing table 5f. (step S210).

Referring again to FIG. 9, the pair of claws of the recovery loader 41b is lowered in an open state, and then the dress included in the dressing table 5f is closed. A pair of claws enters the notch C2 of the board placement member 60. The dress board D1 is picked up by raising the pair of claws while entering the notch C2.

FIG. 13 is a diagram showing the positional relationship between the transport mechanism 4b and the table 5 at the timing of collecting the dressing board D1 held on the dressing table 5f. As shown in FIG. 13, at the timing to collect the dressing board D1 held on the dressing table 5f, the collecting loader 41b is located above the dressing table 5f. On the other hand, in plan view, the substrate transport section 42 and the cutting table 5a do not overlap. The reason why the dress board D1 is collected in such a positional relationship will be explained next.

In the cutting device 1, the substrate transport section 42 is provided with a pin PI1 extending downward, and the cutting table 5a is provided with a hole H1 into which the pin PI1 enters. In the cutting device 1, in order to ensure the positional accuracy of the package substrate P1, the package substrate P1 is moved by the substrate transfer section 42 for cutting with the pin PI1 of the substrate transfer section 42 entering the hole H1 of the cutting table 5a. It is placed on the table 5a. If the recovery loader 41b attempts to recover the dress board D1 in a state where the substrate transfer section 42 and the cutting table 5a overlap in plan view, the pins PI1 of the substrate transfer section 42 will get in the way. According to the cutting device 1, the dress board D1 is collected by the collection loader 41b in a state where the substrate transport section 42 and the cutting table 5a do not overlap in a plan view, so that the dress board D1 can be collected appropriately. I can do it.

Referring again to FIG. 12, when the pickup of the dress board D1 is completed in step S210, the control unit 70 controls the drive unit of the transport mechanism 4b so that the collection loader 41b is positioned above the used dress box 43b. (Step S220). Thereafter, the control unit 70 controls the collection loader 41b so that the pair of claws descends and enters each notch C1 (FIG. 3) formed in the used dress box 43b. The drive units for the pair of claws are controlled so that the claws open (step S230). Thereby, the used dress board D1 is stored in the used dress box 43b. Since the pair of claws are opened with each claw entering each notch C1 (FIG. 3) formed in the used dress box 43b, the used dress board D1 is placed inside the used dress box 43b. The possibility of not falling is reduced.

FIG. 14 is a flowchart showing the process executed in step S120 (attachment process of dress board D1) in FIG. Referring to FIG. 14, the control unit 70 controls the drive unit of the transport mechanism 4b so that the mounting loader 41a is positioned above the new dress holder 43a (step S300). The control unit 70 controls the drive unit of the mounting loader 41a so that the vacuum pad 44 of the mounting loader 41a descends and the vacuum pad 44 suction-holds the new dress board D1 housed in the new dress holder 43a. control (step S310).

The control unit 70 controls the drive unit of the transport mechanism 4b so that the mounting loader 41a is positioned above the dressing table 5f (step S320). After that, the control unit 70 controls the drive unit of the mounting loader 41a so that the vacuum pad 44 is lowered and the vacuum pad 44 places the dressing board D1 on the dressing table 5f (step S330).

FIG. 15 is a diagram showing the positional relationship between the transport mechanism 4b and the table 5 at the timing when a new dressing board D1 is placed on the dressing table 5f. As shown in FIG. 15, the mounting loader 41a is positioned above the dressing table 5f at the timing when a new dressing board D1 is placed on the dressing table 5f. On the other hand, in plan view, the substrate transport section 42 and the cutting table 5a do not overlap. According to the cutting device 1, since the mounting loader 41a positions the dressing board D1 in a state where the substrate transport section 42 and the cutting table 5a do not overlap in plan view, the dressing board D1 is not affected by the pin PI1. The dress board D1 can be appropriately placed on the table 5f.

[3. Features]
As described above, in the cutting device 1 according to the present embodiment, the transport mechanism 4b includes the dress board transport section 41. The dress board transport unit 41 automatically transports the dress board D1 between the storage mechanism 43 and the dressing table 5f. Therefore, according to the cutting device 1, since the dressing board D1 is automatically transported between the storage mechanism 43 and the dressing table 5f, the dressing board D1 attached to the dressing table 5f can be automatically replaced. As a result, the cutting device 1 can shorten the time required to replace the dress board D1.

Note that the cutting device 1 is an example of a "cutting device" in the present invention. The cutting table 5a is an example of a "cutting table" in the present invention. The spindle portion 6 is an example of a "cutting mechanism" in the present invention. The dressing table 5f is an example of a "dressing table" in the present invention. The accommodation mechanism 43 is an example of the "accommodation mechanism" in the present invention. The transport mechanism 4b is an example of a "transport mechanism" in the present invention. The substrate transport section 42 is an example of a "substrate transport section" in the present invention. The dress board transport section 41 is an example of a "dress board transport section" in the present invention.

Moreover, the attachment loader 41a is an example of the "attachment loader" in the present invention. The collection loader 41b is an example of a "recovery loader" in the present invention. The suction source 65 is an example of a "suction source" in the present invention. Each of the claw parts 49a and 49b is an example of a "claw part" in the present invention. The new dress holder 43a is an example of the "first accommodating part" in the present invention. The used dress box 43b is an example of a "second storage section" in the present invention. The moving mechanism 5c is an example of a "moving mechanism" in the present invention. The first cleaner 5e is an example of a "cleaning section" in the present invention.

[4. Other embodiments]
The idea of the above embodiments is not limited to the embodiments described above. Hereinafter, an example of another embodiment to which the idea of the above embodiment can be applied will be described.

<4-1>
In the embodiment described above, in the automatic replacement of the dress board D1, after the collection process of the used dress board D1 is completed, the process of attaching the new dress board D1 is executed. However, these processing procedures are not limited to this. For example, these processes may be executed in parallel.

FIG. 16 is a flowchart showing an example in which the collection process and the attachment process of the dress board D1 are performed in parallel. The processing shown in this flowchart may be executed by the control unit 70, for example.

Referring to FIG. 16, the control unit 70 controls the drive unit of the transport mechanism 4b so that the mounting loader 41a is positioned above the new dress holder 43a (step S400). The control unit 70 controls the drive unit of the mounting loader 41a so that the vacuum pad 44 of the mounting loader 41a descends and the vacuum pad 44 suction-holds the new dress board D1 housed in the new dress holder 43a. control (step S405).

The control unit 70 determines whether or not there is a used dress board D1 on the dressing table 5f, for example, by referring to the output of a sensor (not shown) that detects the suction state on the dressing table 5f. Determination is made (step S410). If it is determined that there is no used dressing board D1 on the dressing table 5f (NO in step S410), the control unit 70 executes the process of step S425.

On the other hand, if it is determined that there is a used dress board D1 on the dressing table 5f (YES in step S410), the control unit 70 transports the collection loader 41b so that it is located above the dressing table 5f. The drive section of the mechanism 4b is controlled (step S415). After that, the control unit 70 controls the pair of claws so that the pair of claws of the collection loader 41b descend and pick up the used dressing board D1 held on the dressing table 5f. (step S420).

The control unit 70 controls the drive unit of the transport mechanism 4b so that the mounting loader 41a is positioned above the dressing table 5f (step S425). After that, the control unit 70 controls the drive unit of the mounting loader 41a so that the vacuum pad 44 is lowered and the vacuum pad 44 places the dressing board D1 on the dressing table 5f (step S430). Thereafter, the control unit 70 controls the drive unit of the transport mechanism 4b so that the collection loader 41b is positioned above the used dress box 43b (step S435).

For example, the control unit 70 determines whether the collection loader 41b holds the used dress board D1 by referring to the output of a sensor (not shown) provided on the collection loader 41b (step S440). If it is determined that the collection loader 41b does not hold the used dress board D1 (NO in step S440), the process shown in this flowchart ends. On the other hand, if it is determined that the recovery loader 41b is holding the used dress board D1 (YES in step S440), the control unit 70 causes the pair of claws of the recovery loader 41b to descend so that the used dress board D1 is not used. With each claw entering each notch C1 (FIG. 3) formed in the finished dressing box 43b, the driving parts of the pair of claws are controlled so that the pair of claws open (step S445). Thereby, the used dress board D1 is stored in the used dress box 43b.

In this way, by performing the collection process of the used dress board D1 and the process of attaching the new dress board D1 in parallel, the time required to replace the dress board D1 can be further shortened.

<4-2>
Moreover, in the embodiment described above, the collection loader 41b is configured to mechanically hold the used dress board D1. However, the recovery loader 41b does not necessarily have to mechanically hold the dress board D1. For example, if the groove formed in the dress board D1 is shallow or if the dress board D1 is lightweight, the recovery loader 41b may hold the dress board D1 by suction.

<4-3>
Further, in the embodiment described above, the substrate transport section 42 and the mounting loader 41a are connected to a common suction source 65. However, the substrate transport section 42 and the mounting loader 41a do not necessarily need to be connected to the common suction source 65. The suction source connected to the substrate transport section 42 and the suction source connected to the attachment loader 41a may be different.

<4-4>
Further, the structure of the new dress holder is not limited to the structure of the new dress holder 43a in the above embodiment. For example, the structure of the new dress holder may be as described below.

FIG. 17 is a perspective view schematically showing the vicinity of a new dress holder 43aA in another embodiment. As shown in FIG. 17, the new dress holder 43aA is configured to accommodate a plurality of dress boards D1 in a stacked manner. In the example shown in FIG. 17, the new dress holder 43aA accommodates two dress boards D1 less than the maximum number of sheets accommodated (one example).

The new dress holder 43aA is assembled to a base portion 436, and includes a movable block 432A and a fixed block 433. The movable block 432A has a movable range in the X-axis direction on the base portion 436. The movable block 432A can be fixed at a desired position within the movable range.

The movable block 432A is formed with a through hole H4 that penetrates in the thickness direction (X-axis direction) of the movable block 432A. When the maximum number of dress boards D1 are stored in the new dress holder 43aA, a through hole H4 is formed at the boundary between the uppermost dress board D1 and the second dress board D1 from the top. The center is located. A pipe 438 is connected to the through hole H4, and compressed air is sent to the through hole H4 through the pipe 438.

For example, when the mounting loader 41a suction-holds the dress board D1 housed in the new dress holder 43a, discharge of compressed air from the through hole H4 is started. When the dress board D1 rises to the position of the through hole H4 while being held by the attachment loader 41a, the discharge of compressed air from the through hole H4 is stopped. Thereafter, the conveyance of the dress board D1 is continued.

The reason why the above operation is performed will be explained next. For example, a wet dress board D1 may be unintentionally accommodated in the new dress holder 43aA. In such a case, the plurality of dress boards D1 may stick to each other, and the plurality of dress boards D1 may be lifted up by suction and holding of the dress boards D1 by the mounting loader 41a. As described above, by discharging compressed air from the through hole H4 to the boundary between the dress boards D1, among the plurality of lifted dress boards D1, dresses other than the dress board D1 held by the vacuum pad 44 are removed. The board D1 can be dropped into the new dress holder 43aA. That is, according to such a configuration, it is possible to suppress the occurrence of a situation in which a plurality of new dress boards D1 are unintentionally transported.

The embodiments of the present invention have been exemplarily described above. That is, the detailed description and accompanying drawings have been disclosed for purposes of illustration. Therefore, some of the components described in the detailed description and the attached drawings may not be essential for solving the problem. Therefore, just because non-essential components are described in the detailed description and accompanying drawings, such non-essential components should not be immediately identified as essential.

Furthermore, the above embodiments are merely illustrative of the present invention in all respects. Various improvements and changes can be made to the above embodiments within the scope of the present invention. That is, in implementing the present invention, specific configurations can be adopted as appropriate depending on the embodiment.
[5. Additional notes]

This specification discloses various technical ideas including at least the following techniques.

<Technology 1>
(composition)
a cutting table configured to hold an object to be cut;
a cutting mechanism configured to cut the object to be cut held on the cutting table with a blade;
a dressing table configured to hold a dressing board for dressing the blade;
a storage mechanism configured to stack and store a plurality of the dress boards;
A transport mechanism including a substrate transport section and a dress board transport section that moves together with the substrate transport section,
The substrate conveyance unit is configured to suck the object to be cut and to convey the attracted object to be cut to the cutting table,
The dress board transport section is a cutting device configured to transport the dress board between the accommodation mechanism and the dressing table.

(Effects, etc.)
In this cutting device, the transport mechanism includes a dress board transport section. The dress board transport section automatically transports the dress board between the storage mechanism and the dressing table. Therefore, according to this cutting device, since the dressing board is automatically transported between the storage mechanism and the dressing table, the dressing board attached to the dressing table can be automatically replaced.

<Technology 2>
(composition)
The dress board conveyance section is
an attachment loader configured to adsorb the unused dress board accommodated in the accommodation mechanism and to transport the adsorbed dress board from the accommodation mechanism to the dressing table;
Technique 1 includes a recovery loader configured to mechanically hold the used dressing board and to transport the mechanically held dressing board from the dressing table to the storage mechanism. Cutting device as described.

(Effects, etc.)
In this cutting device, unused dress boards are suction-held by an attachment loader, and used dress boards are mechanically held by a recovery loader. Therefore, according to this cutting device, since the unused dress board is held by suction, it is possible to suppress a decrease in the positional accuracy of the unused dress board. Further, since many grooves are formed on the surface of the used dress board, suction and holding of the used dress board may become unstable. According to this cutting device, since the used dress board is mechanically held, the used dress board can be held stably.

<Technology 3>
(composition)
The cutting device according to technique 2, wherein a suction source for suction of the object to be cut by the substrate transport section and a suction source for suction of the dress board by the mounting loader are common.

(Effects, etc.)
According to this cutting device, since the suction source for suctioning the object to be cut and the suction source for suctioning the dress board are common, an increase in the number of suction sources can be suppressed. As a result, with this cutting device, it is possible to suppress the device from increasing in size.

<Technology 4>
(composition)
The recovery loader includes a pair of claws facing each other in the horizontal direction,
The pair of claws are configured to open and close in a horizontal direction,
The cutting device according to technique 2 or technique 3, wherein the recovery loader is configured to mechanically hold the dress board by sandwiching the dress board between the pair of claws.

(Effects, etc.)
According to this cutting device, since the used dress board is mechanically held between the pair of claws, the used dress board can be held stably.

<Technology 5>
(composition)
The accommodation mechanism is
a first accommodating portion configured to accommodate the unused dress board;
a second storage portion configured to receive the used dress board;
The shape of the first accommodating part is different from the shape of the second accommodating part,
The second accommodating portion includes a plurality of side wall portions,
The used dress board is housed in a space surrounded by the plurality of side walls,
The cutting device according to technique 4, wherein a notch is formed at an upper end of each of two opposing side wall portions among the plurality of side wall portions.

(Effects, etc.)
In this accommodation mechanism, the shape of the first accommodation part and the shape of the second accommodation part are different, and a notch is formed at the upper end of each of two opposing side walls of the plurality of side walls of the second accommodation part. ing. According to this cutting device, the pair of claws of the collection loader enters into the notch, opens the pair of claws, and drops the used dressboard, thereby ensuring that the used dressboard is placed in the first place. It can be accommodated in two accommodating parts.

<Technology 6>
(composition)
a movement mechanism configured to move both the cutting table and the dressing table;
further comprising a cleaning section configured to clean each of the object to be cut and the dress board,
The moving mechanism is configured to move between a set position where the object to be cut is held on the cutting table and a processing position where the object to be cut is subjected to a cutting process,
The cutting device according to any one of techniques 1 to 5, wherein the cleaning section is provided in an area between the set position and the processing position.

(Effects, etc.)
In this cutting device, a cleaning section is provided in an area between a set position and a processing position. Therefore, according to this cutting device, the cleaning section can clean the dressing board held by the dressing table. As a result, with this cutting device, even if, for example, machining waste generated during the cutting process of the object to be cut adheres to the dress board, the dress board can be cleaned, and the dress board after cleaning can be cleaned. can be used to dress the blade.

<Technology 7>
(composition)
The cutting device according to technique 6, wherein the cleaning section is configured to clean each of the object to be cut and the dress board by using at least a liquid.

(Effects, etc.)
According to this cutting device, the dressing board held by the dressing table can be cleaned using at least the liquid.

<Technology 8>
(composition)
The substrate transfer unit includes pins extending downward,
A hole is formed in the cutting table,
The substrate transport unit is configured to hold the object to be cut on the cutting table in a state in which the pin enters the hole,
Technique 1, wherein the dress board transfer unit is configured to transfer the dress board to and from the dressing table in a state where the substrate transfer unit and the cutting table do not overlap in plan view. The cutting device according to any one of Technique 7.

(Effects, etc.)
In this cutting device, in order to ensure positional accuracy of the object to be cut, the object to be cut is placed on the cutting table with the pins of the substrate transport section entering the holes of the cutting table. If the dressing board is transferred between the dressing board transporting part and the dressing table with the board transporting part and the cutting table overlapping in plan view, the pins of the board transporting part may get in the way. There is. According to this cutting device, the dress board is transferred between the dress board transfer section and the dressing table in a state where the substrate transfer section and the cutting table do not overlap in a plan view, so that the dress board is transferred and received appropriately. can be done.

<Technology 9>
(composition)
A method for manufacturing a cut product using the cutting device according to any one of techniques 1 to 8, comprising:
adsorbing the object to be cut and transporting the adsorbed object to be cut to the cutting table;
transporting the dressing board between the storage mechanism and the dressing table;
dressing the blade using the dressing board held on the dressing table;
A method for manufacturing a cut product, the method comprising: cutting the object to be cut held on the cutting table using the dressed blade to produce the cut product.

(Effects, etc.)
In this method for manufacturing cut products, the dressing board is automatically transported between the storage mechanism and the dressing table. Therefore, according to this method for manufacturing cut products, since the dressing board is automatically transported between the storage mechanism and the dressing table, the dressing board attached to the dressing table can be automatically replaced.

1 cutting device, 3 substrate supply unit, 4 positioning unit, 4a rail unit, 4b transport mechanism, 5 table, 5a cutting table, 5b rotation mechanism, 5c movement mechanism, 5d first position confirmation camera, 5e first cleaner, 5f Dressing table, 6 Spindle section, 6a Blade, 6b Second position confirmation camera, 6c Rotation shaft, 7 Conveyance section, 7a Second cleaner, 11 Inspection table, 12 First optical inspection camera, 13 Second optical inspection camera, 14 Placement section, 15 Extraction section, 15a Tray for good products, 15b Tray for defective products, 20 Monitor, 41 Dress board transport section, 41a Mounting loader, 41b Collection loader, 42 Board transport section, 43 Accommodation mechanism, 43a, 43aA New Dress holder, 43b Used dress box, 44 Vacuum pad, 45a, 45b Claw, 46a, 46b Air chuck, 47a, 47b Linear bush, 48a, 48b Spring, 49a, 49b Claw portion, 50 Computer, 60 Dress board placement member , 61 bottom part, 62 projection part, 63,436 base part, 65 suction source, 66 connection member, 70 control part, 72 CPU, 74 RAM, 76 ROM, 80 storage part, 81 control program, 90 input/output I/F , 95 reception part, 411a, 411b air cylinder, 430 bottom part, 431a, 431b, 431c, 431d side wall part, 432, 432A movable block, 433 fixed block, 434, 435 sensor, 437 protrusion part, 438 piping, A1 cutting module , B1 inspection/storage module, C1, C2 notch, D1 dress board, H1, H2, H3 hole, H4 through hole, P1 package board, PI1 pin, S1 electronic component, V1 switching valve.

Claims (9)

a cutting table configured to hold an object to be cut;
a cutting mechanism configured to cut the object to be cut held on the cutting table with a blade;
a dressing table configured to hold a dressing board for dressing the blade;
a storage mechanism configured to stack and store a plurality of the dress boards;
A transport mechanism including a substrate transport section and a dress board transport section movable together with the substrate transport section,
The substrate conveyance unit is configured to suck the object to be cut and to convey the attracted object to be cut to the cutting table,
The dress board transport section is a cutting device configured to transport the dress board between the accommodation mechanism and the dressing table. The dress board conveyance section is
an attachment loader configured to adsorb the unused dress board accommodated in the accommodation mechanism and to transport the adsorbed dress board from the accommodation mechanism to the dressing table;
2. A collection loader configured to mechanically hold the used dressing board and to transport the mechanically held dressing board from the dressing table to the storage mechanism. The cutting device described in . The cutting device according to claim 2, wherein a suction source for suction of the object to be cut by the substrate transport unit and a suction source for suction of the dress board by the mounting loader are common. The recovery loader includes a pair of claws facing each other in the horizontal direction,
The pair of claws are configured to open and close in a horizontal direction,
The cutting device according to claim 2 or 3, wherein the recovery loader is configured to mechanically hold the dress board by sandwiching the dress board between the pair of claws. The accommodation mechanism is
a first accommodating portion configured to accommodate the unused dress board;
a second storage portion configured to receive the used dress board;
The shape of the first accommodating part is different from the shape of the second accommodating part,
The second accommodating portion includes a plurality of side wall portions,
The used dress board is housed in a space surrounded by the plurality of side walls,
The cutting device according to claim 4, wherein a notch is formed in the upper end of each of two opposing side wall portions among the plurality of side wall portions. a movement mechanism configured to move both the cutting table and the dressing table;
further comprising a cleaning section configured to clean each of the object to be cut and the dress board,
The moving mechanism is configured to move between a set position where the object to be cut is held on the cutting table and a processing position where the object to be cut is subjected to a cutting process,
The cutting device according to any one of claims 1 to 5, wherein the cleaning section is provided in an area between the set position and the processing position. The cutting device according to claim 6, wherein the cleaning section is configured to clean each of the object to be cut and the dress board by using at least a liquid. The substrate transfer unit includes pins extending downward,
A hole is formed in the cutting table,
The substrate transport unit is configured to hold the object to be cut on the cutting table in a state in which the pin enters the hole,
The dress board transport section is configured to transfer the dress board to and from the dressing table in a state where the substrate transport section and the cutting table do not overlap in plan view. The cutting device according to any one of claims 1 to 7. A method for manufacturing a cut product using the cutting device according to any one of claims 1 to 8,
adsorbing the object to be cut and transporting the adsorbed object to be cut to the cutting table;
transporting the dressing board between the storage mechanism and the dressing table;
dressing the blade using the dressing board held on the dressing table;
A method for manufacturing a cut product, the method comprising: cutting the object to be cut held on the cutting table using the dressed blade to produce the cut product.