KR20220040010A - Semiconductor materials sawing and cleaning method - Google Patents

Abstract

The present invention relates to a method for cutting and cleaning a semiconductor material for cutting and cleaning a semiconductor strip into a plurality of semiconductor packages. Specifically, the present invention relates to a method for cutting and cleaning a semiconductor material that can clean an upper surface, a lower surface and a side surface of a semiconductor package cut into a plurality, ensure high cleaning quality, and at the same time improve productivity (unit per hour; UPH).

Description

Semiconductor materials sawing and cleaning method

The present invention relates to a method for cutting and cleaning a semiconductor material for cutting and cleaning a semiconductor strip into a plurality of semiconductor packages. Specifically, the present invention is capable of cleaning the upper surface, lower surface and side surfaces of the semiconductor package cut into a plurality, while ensuring high cleaning quality and productivity (Unit per hour; UPH) can be improved, semiconductor material cutting and to a washing method.

The semiconductor material cutting device is a device that cuts a packaged semiconductor strip into a plurality of semiconductor packages. In addition to simply cutting the semiconductor strip, it performs cleaning and drying processes after cutting and inspects the top and bottom surfaces of the cut semiconductor package. It provides a function of processing a series of processes for classifying a semiconductor package having a manufacturing defect, and Korean Patent Laid-Open No. 10-2017-0026751 discloses a conventional semiconductor material cutting device.

A conventional semiconductor material cutting apparatus cuts a semiconductor strip into a plurality of semiconductor packages by a blade on a chuck table, and then performs a washing process by spraying washing water or compressed air on the lower surface of the semiconductor package in a washing unit. There is a problem in that high cleaning quality of the semiconductor package that can be cut in this way cannot be guaranteed.

Specifically, in the case of a semiconductor package, a burr is generated when a semiconductor strip made of a metal material is cut into a plurality of semiconductor packages, and in the case of a BGA-type semiconductor package, microscopicity generated due to high-speed cutting by a blade White contamination is generated on the upper and lower surfaces of the semiconductor package, but it is very difficult to remove if it is caught in the ball part of the upper surface. As this remains, there is a problem in that high cleaning quality cannot be guaranteed by the conventional cleaning process of spraying only the lower surface of the semiconductor package with cleaning water or compressed air.

That is, various problems may occur in the contamination of the semiconductor package depending on the type, size, and cutting method of the semiconductor package, and there is a problem that high cleaning quality of various semiconductor packages cannot be guaranteed with the conventional semiconductor material cutting device. Incomplete cleaning causes defects and affects performance during vision inspection of the upper and lower surfaces of the semiconductor package later. there is a problem.

Therefore, there is an urgent need for a semiconductor material cutting device capable of cleaning the top, bottom, and side surfaces of the semiconductor package cut into a plurality, guaranteeing high cleaning quality, and improving productivity (Unit per hour; UPH). It is becoming.

An object of the present invention is to provide a method for cutting and cleaning a semiconductor material capable of cleaning the upper surface, lower surface and side surfaces of a semiconductor package cut into a plurality and guaranteeing high cleaning quality.

Another object of the present invention is to provide a method for cutting and cleaning a semiconductor material that can improve productivity (Unit per hour; UPH) despite guaranteeing high cleaning quality of a semiconductor package.

In order to solve the above problems, the present invention,

A method for cutting and cleaning a semiconductor strip into a plurality of semiconductor packages, comprising the steps of: A) transferring the semiconductor strip to an upper portion of a first chuck table by a strip picker; B) when the first chuck table moves to the cutting position, the cutting unit cuts the semiconductor strip adsorbed on the first chuck table into individual semiconductor packages along a cutting path; C) When the cutting is complete, the first chuck table moves to the delivery position, and the first washing part made of a sponge or brush material provided on one side of the unit picker moves to the delivery position, and the first chuck table is located at the lower part of the first washing part. positioning the chuck table; D) In a state in which the first washing unit is lowered to come into contact with the upper surface of the semiconductor package adsorbed on the first chuck table, the unit picker moves in one direction to first wash the upper surface of the semiconductor package with the first washing unit performing; E) After performing the first upper surface cleaning, as the first chuck table moves in the direction of the cutting position and/or returns to the direction of the transfer position, the second cleaning unit is provided above the transfer path of the first chuck table. performing a second top surface cleaning of the semiconductor package; F) after performing the second upper surface washing, the first chuck table is moved to the delivery position and the unit picker is moved to the delivery position, so that the first chuck table is positioned under the unit picker; G) the unit picker picks up the semiconductor package on which the secondary upper surface cleaning has been completed, moves to the upper part of the third washing unit, performs washing of the lower surface of the semiconductor package in the third washing unit, and cleans the lower surface of the semiconductor package performing washing of the first chuck table with the second washing unit while the first chuck table from which the semiconductor package has been removed moves in a direction of a cutting position and/or returns to a direction of a transfer position; And H) the unit picker provides a method for cutting and cleaning semiconductor materials comprising the step of transferring the semiconductor package to a drying unit on which the cleaning of the lower surface has been completed.

Meanwhile, a method for cutting and cleaning a semiconductor strip into a plurality of semiconductor packages, comprising: A) transferring the semiconductor strip to an upper portion of a first chuck table by a strip picker; B) when the first chuck table moves to the cutting position, the cutting unit cuts the semiconductor strip adsorbed on the first chuck table into individual semiconductor packages along a cutting path; C) When the cutting is complete, the first chuck table moves to the delivery position, and the first cleaning unit made of a sponge or brush material provided on one side of the strip picker moves to the delivery position, and the first chuck table is placed under the first cleaning unit. positioning the chuck table; D) In a state in which the first washing unit is lowered to come into contact with the upper surface of the semiconductor package adsorbed on the first chuck table, the first chuck table is moved to the cutting position or the transfer position to the first washing unit and the semiconductor package performing a first upper surface washing of E) After performing the first upper surface cleaning, as the first chuck table moves in the direction of the cutting position and/or returns to the direction of the transfer position, the second cleaning unit is provided above the transfer path of the first chuck table. performing a second top surface cleaning of the semiconductor package; F) after performing the second upper surface washing, the first chuck table is moved to the delivery position and the unit picker is moved to the delivery position, so that the first chuck table is positioned under the unit picker; G) the unit picker picks up the semiconductor package on which the secondary upper surface cleaning has been completed, moves to the upper part of the third washing unit, performs washing of the lower surface of the semiconductor package in the third washing unit, and cleans the lower surface of the semiconductor package performing washing of the first chuck table with the second washing unit while the first chuck table from which the semiconductor package has been removed moves in a direction of a cutting position and/or returns to a direction of a transfer position; And H) the unit picker provides a method for cutting and cleaning semiconductor materials comprising the step of transferring the semiconductor package to a drying unit on which the cleaning of the lower surface has been completed.

Here, after step A) of the first chuck table, a new semiconductor strip is transferred to an upper portion of a second chuck table that is provided side by side on one side of the first chuck table and moves independently of the first chuck table, While steps C) D), E), F) and G) of the first chuck table are performed, the step of cutting the semiconductor strip adsorbed on the second chuck table is performed, and after step G), the first chuck It provides a method for cutting and cleaning a semiconductor material, characterized in that the transfer of a new semiconductor strip to the top of the table.

In addition, while steps C) D), E), F) and G) for the semiconductor package cut at the top of the second chuck table are sequentially performed, the new semiconductor strip transferred to the upper part of the first chuck table is It provides a method for cutting and cleaning semiconductor materials, characterized in that the cutting step is performed.

On the other hand, in a state in which the washing preparation signal of the first washing unit is turned on, when the cutting in step C) is completed, the first chuck table moves to the transfer position, and when the first chuck table moves to the transfer position, the second chuck table moves to the transfer position. Provided is a method for cutting and cleaning a semiconductor material, characterized in that the second washing unit is controlled not to spray washing water while the washing holding signal is turned on in the washing unit.

Here, when the first upper surface cleaning of the semiconductor package is completed in step E), the washing holding signal of the second washing unit is turned off, and the second washing unit sprays washing water to perform a second upper surface washing of the semiconductor package It provides a method for cutting and cleaning semiconductor materials, characterized in that.

In addition, during the first washing of the upper surface in steps D) and E), the first washing unit descends to come into contact with the upper surface of the semiconductor package, and when the first washing of the semiconductor package is completed, the first washing unit rises It provides a method for cutting and cleaning a semiconductor material, characterized in that the washing preparation signal of the first washing unit is turned off, and the second washing unit sprays washing water to perform a second upper surface washing of the semiconductor package.

And, performing the first upper surface cleaning of the semiconductor package is characterized in that the cleaning is performed while the first cleaning unit and the upper surface of the semiconductor material are brought into contact with each other in a state in which the first chuck table is rotated at a predetermined angle. A method for cutting and cleaning semiconductor materials is provided.

Furthermore, performing the first upper surface cleaning of the semiconductor package may include washing the upper surface of the semiconductor package while adjusting the elevation height of the first cleaning unit when the upper surface of the semiconductor package and the first washing unit are brought into contact with each other, or Provided is a method for cutting and cleaning a semiconductor material, characterized in that the upper surface of the semiconductor package is washed while rotating the first washing unit.

Meanwhile, performing the first upper surface cleaning of the semiconductor package may include performing one-way cleaning of the semiconductor package while contacting the first cleaning unit with the semiconductor package adsorbed on the upper surface of the first chuck table, and the first chuck Provided is a method for cutting and cleaning a semiconductor material, characterized in that cleaning in the other direction is performed while the semiconductor package and the first cleaning unit are in contact with the table rotated by 90 degrees.

In addition, after step H), if necessary, the first washing unit moves to an upper portion of the third washing unit, and the third washing unit further comprises the step of performing washing of the first washing unit. A method for cutting and cleaning semiconductor materials is provided.

And, while the first chuck table is moved to the delivery position in step C), the second washing unit sprays washing water to wash the upper surface of the semiconductor package with the washing water sprayed from the second washing unit, and the second washing unit sprays washing water. Provided is a method for cutting and cleaning semiconductor materials, characterized in that when the 1 chuck table is moved to the delivery position, the injection of the second washing water is stopped.

The semiconductor material cutting and cleaning method according to the present invention exhibits an excellent effect of ensuring high cleaning quality by providing an additional cleaning unit capable of cleaning the top and side surfaces of a plurality of cut semiconductor packages in a contact manner.

In addition, the semiconductor material cutting and cleaning method according to the present invention is a sequence in which the cutting and cleaning processes are precisely controlled in each of the two chuck tables despite cleaning the lower surface, upper surface and side surfaces of the plurality of cut semiconductor packages with high cleaning quality It shows an excellent effect of improving productivity (UPH) by performing as

In addition, the semiconductor material cutting and washing method according to the present invention can prevent secondary contamination by the washing unit through the cleaning of the contact washing unit.

1 schematically shows a top plan view of a semiconductor material cutting device according to the present invention.
Figure 2 schematically shows another embodiment of the semiconductor material cutting device according to the present invention shown in Figure 1.
Figure 3 schematically shows another embodiment of the semiconductor material cutting device according to the present invention shown in Figure 1.
Figure 4 shows another embodiment of the state in which the first washing unit performs a washing process in the semiconductor material cutting device according to the present invention shown in Fig. 1 .
5 is an enlarged perspective view of the first washing unit and the third washing unit in the semiconductor material cutting device shown in FIG. 1 .
6 schematically shows another embodiment of the third washing unit in FIG. 5 .
7 schematically illustrates another embodiment of the first washing unit in FIG. 5 .
8 schematically shows a state in which a cleaning process is performed in the semiconductor material cutting device according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosed subject matter may be thorough and complete, and the spirit of the present invention may be sufficiently conveyed to those skilled in the art. Like reference numerals refer to like elements throughout.

1 schematically shows a top plan view of a semiconductor material cutting device according to the present invention.

As shown in Fig. 1, the semiconductor material cutting device 10 according to the present invention draws out one semiconductor strip from the magazine in which the semiconductor strip is stored, and transfers and delivers the upper surface in an adsorbed state to the strip picker 100, A first chuck table provided so that the semiconductor strip S delivered by the strip picker or a plurality of semiconductor packages cut therefrom are respectively adsorbed, rotatable in the θ direction on the XY plane, and independently movable in the Y axis direction (310) and the second chuck table 320; The semiconductor strips adsorbed on the first chuck table 310 and the second chuck table 320 are cut into individual semiconductor packages along a cutting path, and the first chuck table 310 is provided to be movable in the X-axis direction. and a cutting part 600 for cutting the semiconductor strip into a semiconductor package by relative movement with the second chuck table 320 . It is mounted on the Y-axis transfer path of the first chuck table 310 and the second chuck table 320 to supply washing water toward the semiconductor package adsorbed on the first chuck table 310 and the second chuck table 320 . a second washing unit that sprays (710, 720); a unit picker 200 for adsorbing and transporting the semiconductor package adsorbed to the first chuck table 310 and the second chuck table 320, which has been cut in the cutting part; A third cleaning unit 400 for cleaning the lower surface of the semiconductor package adsorbed to the unit picker 200, and one or more pickers of the strip picker 100 and the unit picker 200 are mounted so as to be lifted and lowered from one side and first washing units 110 and 210 for cleaning the upper surface of the semiconductor package by contacting the upper surface of the semiconductor package adsorbed to the first chuck table or the second chuck table, which has been cut in the cutting portion.

Here, the third washing unit includes a contact washing unit 410 and 420 for washing in contact with the lower surface of the semiconductor package adsorbed to the unit picker, a lower washing zone comprising washing water supply means for supplying washing water to the contact washing unit, and a lower washing zone. It may include washing water storage zones 440 and 450 provided on one side for storing washing water, and a weaning fluid nozzle 430 provided on the other side of the lower washing zone to supply washing water and air to the lower surface of the semiconductor package.

As a semiconductor material cutting and cleaning method for cutting and cleaning a semiconductor strip into a plurality of semiconductor packages in the semiconductor material cutting apparatus of the present invention as described above, A) a strip picker delivering the semiconductor strip to the upper portion of the first chuck table: B) when the first chuck table moves to the cutting position, the cutting unit cuts the semiconductor strip adsorbed on the first chuck table into individual semiconductor packages along a cutting path; C) When the cutting is complete, the first chuck table moves to the delivery position, and the first washing part made of a sponge or brush material provided on one side of the unit picker moves to the delivery position, and the first chuck table is located at the lower part of the first washing part. positioning the chuck table; D) In a state in which the first washing unit is lowered to come into contact with the upper surface of the semiconductor package adsorbed on the first chuck table, the unit picker moves in one direction to first wash the upper surface of the semiconductor package with the first washing unit performing; E) After performing the first upper surface cleaning, the semiconductor package is transferred to a second cleaning unit provided above the transfer path of the first chuck table while the first chuck table moves in the direction of the cutting position or returns to the transfer position. performing a second upper surface washing of F) after performing the second upper surface washing, the first chuck table is moved to the delivery position and the unit picker is moved to the delivery position, so that the first chuck table is positioned under the unit picker; G) the unit picker picks up the semiconductor package on which the secondary upper surface cleaning has been completed, moves to the upper part of the third washing unit, performs washing of the lower surface of the semiconductor package in the third washing unit, and cleans the lower surface of the semiconductor package performing washing of the first chuck table with the second washing unit while the first chuck table from which the semiconductor package has been removed moves in the cutting position direction or returns to the delivery position direction; and H) transferring, by the unit picker, the semiconductor package on which the cleaning of the lower surface is completed, to a drying unit.

Hereinafter, the present invention will be described in detail with reference to FIGS. 1 and 4 to 8 of the present invention.

First, when a semiconductor strip is taken out from a magazine in which the semiconductor strip is stacked, the position of the semiconductor strip drawn out by the positioning unit 500 is corrected, and then the strip picker picks up the semiconductor strip and delivers it to the chuck table. Here, the strip picker 100 may include an adsorption unit capable of adsorbing a semiconductor strip and capable of ascending or descending in the Z-axis direction. The strip picker 100 may further include a gripper for drawing out a semiconductor strip, and a vision unit for checking the alignment state of the semiconductor strip to which the position is aligned in the position alignment unit 500 .

Although one first chuck table 310 may be provided in the present invention, it is preferable to use a dual chuck table to improve the UPH of cutting and washing operations. That is, the first chuck table 310 and the second chuck table 320 may be provided side by side at one side of the first chuck table and move independently of the first chuck table 310 .

The first and second chuck tables 310 and 320 each have an adsorption unit for adsorbing and fixing the mold surface, which is the lower surface of the semiconductor strip S or a plurality of semiconductor packages cut therefrom, and are provided to be movable independently of each other. The first and second chuck tables 310 and 320 have interference with the blade 610 to prevent damage caused by the blade 610 when the semiconductor strip S is cut by the blade 610 of the cutting part 600 . A blade escape groove may be additionally formed in this expected line. The semiconductor strip may be cut into individual semiconductor packages along a cutting path, preferably a blade escape.

In addition, the third cleaning unit 400 includes a brush 410 and a sponge 420 for contact-cleaning the mold surface, which is the lower surface of the plurality of semiconductor packages, and washing water toward the lower surface of the semiconductor package. and a weaning fluid nozzle 430 for spraying air and the like, and the brush 410 and the sponge 420 may be selectively or both used as needed, and the brush 410 and the sponge 420 ) Inside, water or washing water is supplied to the brush 410 and the sponge 420 to improve the cleaning quality of the semiconductor package, and scratches due to contact between the brush 410 and the sponge 420 and the lower surface of the semiconductor package are generated. In order to prevent this, a washing water supply means for supplying washing water to the brush or sponge may be provided.

In addition, between the brush 410 and the sponge 420, a washing water storage zone 440 for storing water or washing water supplied from the washing water supply means inside the sponge 420 and leaked out of the sponge 420 is added. is provided to prevent water or washing water leaking out of the sponge 420 from leaking to the floor of the facility.

In addition, the cutting unit 600 may be provided with a pair of blades 610 that rotate at high speed to cut the semiconductor strip S adsorbed on each of the first and second chuck tables 310 and 320 into a plurality of semiconductor packages. Each of the first and second chuck tables 310 and 320 reciprocates in the Y-axis direction and the cutting part 600 reciprocates in the X-axis direction, so that the chuck table and the cutting part move relative to the semiconductor strip S. cleavage can be performed.

In addition, the cutting unit 600 supplies cooling water such as water to the pair of blades 610 to damage the semiconductor package due to frictional heat when the semiconductor strip S is cut by the blade 610 and scatter during cutting. The generated dust can be minimized or prevented, and the scrap generated during cutting can be discharged.

Further, the first chuck table 310 and the second chuck table 320 are respectively disposed on the moving path of the picker moving shaft 700 to provide the first chuck table 310 and the second chuck table 320 . , and second washing units 710 and 720 for spraying washing water and/or washing water and air to the upper surface side of the semiconductor package that are adsorbed and cut to each of them may be additionally provided.

The second cleaning unit may be provided with each of the weaning fluid nozzles on the first chuck table and the second chuck table, so that one weaning fluid nozzle extends over the first chuck table and the second chuck table. They may be provided together. In addition, each of the weaning fluid nozzles of the second washing unit may be individually and independently controlled by receiving cutting information from the chuck table, or may be collectively controlled together.

The second cleaning units 710 and 720 spray washing water and air on the top surfaces of the plurality of cut semiconductor packages to clean the top surfaces of the cut semiconductor packages.

Specifically, the strip picker 100 adsorbs the semiconductor strip aligned in the position by the position alignment unit 500 , the semiconductor strip S on the first chuck table 310 , and then moves the X-axis The second semiconductor strip is again withdrawn from the magazine by the gripper of the strip picker.

While the strip picker 100 draws the second semiconductor strip from the magazine, the first chuck table 310 on which the first semiconductor strip S is adsorbed is moved to the cutting position along the Y-axis by the chuck table transfer unit 300 . After that, the first semiconductor strip S seated on the first chuck table 310 is first cut in the longitudinal direction by the cutting part 600 , that is, in the short axis direction of the semiconductor strip S, and then the first A plurality of semiconductor packages may be cut by being cut in the transverse direction, that is, in the long axis direction of the semiconductor strip S while being rotated by 90° in the θ direction by the chuck table 310 . However, the cutting sequence is not limited thereto, and if necessary, after cutting in the long axis direction of the semiconductor strip, it may be rotated 90° to cut in the short axis direction.

After the strip picker delivers the first semiconductor strip (S) to the first chuck table, the second semiconductor strip (S) is aligned with the first semiconductor strip (S) and transferred to the upper part of the second chuck table (320) After the cutting of the first semiconductor strip (S) is completed, the first chuck table moves to the delivery position to wash the cut semiconductor package, and the second chuck table 320 is transferred to the chuck table transfer unit 300 . is transferred to the cutting position along the Y-axis by the It is cut into semiconductor packages.

Here, each of the first chuck table 310 and the second chuck table 320 does not interfere with each other by the chuck table transfer unit 300 and independently of each other along the Y-axis at a cutting position (rear) or a transfer position ( forward), that is, in order to cut the adsorbed semiconductor strip (S) by the cutting unit 600, it moves from the transfer position (front) to the cutting position (rear) along the Y-axis, and conversely, the cutting process of the semiconductor strip After this is finished, it moves from the cutting position (rear) to the delivery position (front) along the Y-axis.

Meanwhile, the cutting unit 600 is movable in the horizontal direction along the X axis to cut the semiconductor strips adsorbed to the first and second chuck tables 310 and 320 , that is, the semiconductor seated on the first chuck table 310 . It moves to the left along the X-axis to cut the strip S, and moves to the right along the X-axis to cut the semiconductor strip S seated on the second chuck table 320 .

While the cutting process of the second semiconductor strip (S) is in progress, the first chuck table 310 on which the first semiconductor strip (S) is adsorbed is moved to the delivery position along the Y-axis, and a sponge provided on one side of the unit picker Alternatively, the first washing unit 210 made of a brush material moves to the delivery position so that the first chuck table is positioned under the first washing unit. The first washing unit is provided so as to be able to move up and down, so that it maintains the raised state during the movement of the unit picker and the operation by the unit picker (semiconductor package adsorption, washing by the third washing unit, delivery to the drying unit), and the cut semiconductor package When washing with the first washing unit, the lower surface and the side surface of the cut semiconductor package are cleaned in a contact manner.

At this time, in order to shorten the cleaning time by the first washing unit 210, the first washing unit is provided in the longitudinal direction of the unit picker, that is, in the long axis direction, so that the unit picker 200 is cleaned while moving in the short axis direction of the semiconductor strip. can be done

In addition, after contact-washing the top and side surfaces of the semiconductor package with the first washing unit 210 provided in the unit picker 200 , the first chuck table 310 on which the semiconductor package is adsorbed is again Y The upper surface and the side surface of the semiconductor package by passing through the lower portion of the second washing unit 710 that sprays washing water and air toward the upper surface of the semiconductor package while moving in the direction of the cutting position along the axis or returning from the direction of the cutting position to the direction of delivery. This can be further washed.

That is, the first washing unit is adsorbed to the chuck table to wash the top surface of the cut semiconductor package while in contact with the top surface of the cut semiconductor package, and the chuck table moves to the second washing unit and sprays washing water toward the top surface of the semiconductor package to remove It is possible to clean the foreign substances remaining even after the washing of the first washing unit.

When the second washing unit cuts the semiconductor strip into semiconductor package units, the washing preparation signal of the first washing unit is turned on. When the cutting of the semiconductor package is completed while the washing preparation signal of the first washing unit is turned on, the first chuck table moves to the delivery position.

When the washing preparation signal of the first washing unit is turned on, it notifies the unit picker that the semiconductor package is not picked up, and indicates that the washing operation preparation is possible by the first washing unit provided at one side of the unit picker. Therefore, when the washing preparation signal is turned on, washing water is supplied to the brushes or sponges of the first washing unit so that the brushes or sponges do not dry out, the brushes or sponges of the first washing unit are washed in the third washing unit, or the first washing unit does the third washing Waiting at the upper part of the unit, or by moving the first washing unit to the delivery position of the chuck table, washing standby may be performed.

A first washing unit provided on one side of the unit picker performs the first upper surface cleaning of the cut semiconductor package. At this time, the unit picker moves in the X-axis direction and the first washing unit is applied to the entire upper surface of the semiconductor package adsorbed on the chuck table. It can be contacted to perform washing. When the first cleaning unit performs cleaning of the top surface, since the cleaning is performed while in contact with the top surface of the semiconductor package, both the top surface and the side surface of the semiconductor package can be cleaned during the first cleaning of the top surface.

Meanwhile, since the first and second chuck tables 310 and 320 are rotatably provided, washing can be performed by adjusting the rotation angle (0°, ±45°±90°, etc.) of the chuck table to a preset angle.

For example, as shown in FIG. 4 , when the semiconductor package is cleaned by the first cleaning unit 210 in a state in which it is obliquely disposed, there is an advantage in that the cleaning quality between the semiconductor packages can be improved.

In addition, during the first upper surface cleaning, one direction (long axis) washing of the semiconductor package adsorbed on the chuck table is performed while the semiconductor package adsorbed on the chuck table and the first washing unit are in contact, and the semiconductor package adsorbed on the chuck table is rotated by 90°. The other direction (short-axis) washing may be performed while the package and the first washing unit are in contact. That is, there is an advantage in that both the long axis and the short axis direction of the semiconductor package adsorbed to the chuck table can be cleaned twice during the first upper surface cleaning.

In addition, in the process of performing upper surface washing by the first washing unit, a change may be made to the elevation height of the first washing unit. That is, the elevation height of the first washing unit may be adjusted in consideration of the degree of washing or the misalignment of the arrangement of the semiconductor packages adsorbed on the chuck table due to the contact of the first washing unit.

After performing the first upper surface cleaning of the cut semiconductor package, the chuck table moves in the cutting position direction or the transfer position direction, and the second upper surface cleaning of the semiconductor package is performed with the second washing unit provided above the transfer path of the chuck table. can be done

When the second washing unit starts cutting the semiconductor package at the cutting unit, the washing preparation signal of the second washing unit is turned on. When the cutting of the chuck table is completed while the second washing preparation signal is turned on, the cut chuck table moves from the cutting position to the delivery position.

In the process of transferring the cut chuck table to the delivery position, washing water is sprayed from the second washing unit provided above the transfer path of the chuck table to remove foreign substances generated during the semiconductor package cutting process before performing the first upper surface washing. Afterward, it may move to the first washing unit, and its function may be selectively set as needed.

That is, in the process in which the cut chuck table is moved to the first washing unit, foreign substances are removed with the washing water sprayed by the second washing unit, then the first washing is performed, and then the second washing is performed by moving to the second washing unit. Alternatively, after the chuck table that has been cut is moved to the first washing unit to perform the first top washing, the second washing is performed with the washing water sprayed by the second washing unit in the process of moving to the second washing unit. may be

Preferably, when the cutting step of the second washing unit is performed and the washing of the first washing unit is performed, the washing holding signal is turned on to the second washing unit so that the second washing unit does not spray the washing water.

In addition, the washing preparation signal of the second washing unit may be controlled by a signal of the first washing unit in addition to the signal with the cutting step.

That is, the first washing unit descends to come into contact with the upper surface of the semiconductor package, and when the first upper surface cleaning is completed, the first washing unit rises. and the second washing unit may spray washing water to perform secondary upper surface washing of the semiconductor package.

On the other hand, after performing the first upper surface cleaning of the cut semiconductor package, the second upper surface cleaning may be performed by moving to the lower part of the second cleaning unit. The second upper surface washing can be performed with the washing water sprayed by the At this time, the chuck table is cleaned while moving in the direction of the cutting position, but it is not necessarily moved to the cutting position. The chuck table is transported to the extent that washing can be performed by the second washing unit over the entire area of the semiconductor package adsorbed to the chuck table, and after the secondary top surface washing of the semiconductor package is performed, the cleaned semiconductor package is transferred to the unit The chuck table must return to the delivery position to deliver to the picker.

Therefore, while the chuck table moves in the direction of the cutting position, the secondary upper surface washing is performed, but the second upper surface washing can be performed even while the chuck table returns to the delivery position direction.

That is, the second upper surface washing is performed once while the chuck table moves in the cutting position direction, and the second upper surface washing is performed once while returning from the cutting position direction to the delivery position direction. can be doubled.

Of course, if necessary, the second upper surface washing may be performed once when moving in the direction of the cutting position or moving in the direction of the delivery position, and its function can be set as needed.

For reference, the second washing unit may use a nozzle disposed above the movement path of the chuck table to spray washing water downward, or a liquid nozzle that discharges washing water and air together.

After performing the second upper surface cleaning of the semiconductor package by the second washing unit, the chuck table moves to the delivery position, and the unit picker moves to the delivery position, so that the chuck table is located under the unit picker.

The semiconductor package whose top and side surfaces have been cleaned moves to the upper portion of the third washing unit 400 with the top side adsorbed by the adsorption unit of the unit picker 200, so that the lower surface of the semiconductor package is removed by the third washing unit. is washed

The cleaning of the lower surface of the semiconductor package using the first washing unit and the third washing unit of the present invention will be described in more detail with reference to FIGS. 5 to 7 .

5 is an enlarged perspective view of the first washing unit and the third washing unit in the semiconductor material cutting device shown in FIGS. 1 to 4 , and FIG. 6 schematically shows another embodiment of the third washing unit in FIG. 5 . , and FIG. 7 schematically shows another embodiment of the first washing unit in FIG. 5 .

As shown in FIGS. 5 and 7 , the first washing unit 210 provided on one side of the unit picker 200 is provided to be movable in one direction together with the unit picker, and the semiconductor adsorbed on the chuck table 320 . A sponge 211 or a brush 212 in contact with them is provided to wash the top and side surfaces of the package, and the sponge 211 and the brush 212 are the unit pickers 200 . Although provided on one side, it is possible to raise or lower independently of the unit picker.

For example, when the unit picker adsorbs the semiconductor package, when washing the lower surface of the semiconductor package adsorbed to the unit picker, or when transferring the semiconductor package adsorbed to the unit picker to the drying unit, the state in which the first washing unit is raised is It does not affect or interfere with the work operation of the unit picker by maintaining can also be done

In addition, the first washing unit may use a sponge as shown in FIGS. 5, 6 and 8 , or a brush material as shown in FIG. 7 .

The first cleaning unit of the present invention may be rotated to clean the upper surface of the semiconductor package in contact with it. For example, the sponge 211 may be washed while in contact with the upper surface and side of the semiconductor package while being automatically rotated by a rotating means such as a motor, or contacted with the upper surface and side of the semiconductor package in a fixed state without rotating. It can be washed while being used, and when it is worn or damaged by long-term use, it can be replaced with a new sponge 211 .

Here, when the sponge 211 is used in a fixed state without rotating, the surface in contact with the upper surface and the side surface of the semiconductor package is also fixed, so that the surface may be worn or damaged by long-term use, so that an operator can use the sponge ( 211) can be manually rotated so that a surface that is not worn or damaged comes into contact with the top and side surfaces of the semiconductor package, thereby extending the life of the sponge.

Meanwhile, the brush 212 as shown in FIG. 7 may be advantageous compared to the sponge 211 in terms of cleaning a minute gap between semiconductor packages, that is, the side surface of the semiconductor package.

In addition, a nozzle for supplying washing water to the sponge 211 and the brush 212 may be additionally provided in the first washing unit 210 , and the washing water supplied from the nozzle improves washing quality and improves the washing quality of the sponge The occurrence of scratches on the semiconductor package due to 211 or friction between the brush 212 and the semiconductor package may be minimized.

As shown in FIG. 5 , the third cleaning unit 400 includes a brush 410 and a sponge 420 , a brush or a sponge for contact-cleaning the mold surface, which is the lower surface of the plurality of semiconductor packages. Washing water supply means for supplying washing water to the side, between the brush 410 and the sponge 420, a washing water storage zone 440 for storing water or washing water supplied from the washing water supply means and leaked out of the brush 410 or sponge 420 ), and a weaning fluid nozzle 430 for spraying washing water and air toward the lower surface of the semiconductor package, and the like. The washing water storage zone 440 may prevent water or washing water leaking out of the brush and sponge 420 from leaking to the floor of the facility.

The washing water storage zone is a configuration in which washing water is supplied to wash the first washing unit or to prevent the first washing unit from drying out. In the embodiment of the present invention, a method of washing the first washing unit by storing the water leaked out of the brush and sponge has been described, but a fluid for washing the first washing unit may be used by installing a separate washing water supply means.

In the present invention, as shown in FIG. 6 as the washing water storage zone 440 , an ultrasonic bath 450 may be used.

For this purpose, the washing water storage zone shown in FIG. 6 includes a water tank 450 in which a liquid for immersing the semiconductor package or the first washing unit adsorbed on the unit picker is stored, an ultrasonic wave generator generating ultrasonic waves into the water tank, and one side of the water tank Provided in the upper drain for discharging floating foreign matter generated during washing, a lower drain provided at the lower part of the upper drain for discharging sedimentary foreign substances generated during washing, and a liquid supply part provided on the other side of the water tank to supply liquid in one direction can do.

The ultrasonic tank 450 not only functions to store the washing water flowing out from the sponge 420 like the water tank 440, but also removes the lower surfaces of the plurality of semiconductor packages that are adsorbed and transported by the unit picker 200. It can perform the function of ultrasonic cleaning.

Here, the ultrasonic cleaning may be performed in a manner of separating contaminants from the semiconductor package by applying minute ultrasonic vibrations to the washing water in the ultrasonic tank 450 while the semiconductor package is immersed in the ultrasonic tank 450 , Contaminants generated in the washing process are continuously removed through the upper and lower drains of the ultrasonic water tank 450 , so that the washing water stored in the ultrasonic water tank 450 can always be kept clean.

Meanwhile, while the lower surface of the semiconductor package is cleaned by the third cleaning unit 400 , the first chuck table 310 from which the semiconductor package is removed by the unit picker 200 is located below the second cleaning unit 710 . It can be washed by the washing water and air sprayed from the second washing unit 710 by passing through. That is, the first chuck table may be washed with the second washing unit while moving in the cutting position direction, or the first chuck table may be washed while returning from the cutting position direction to the delivery position direction. The first chuck table may be washed twice by washing the first chuck table with the second washing unit while the one chuck table moves in both directions.

Although the first chuck table has been described above as an example, in the present invention, since the first chuck table and the second chuck table are provided, the washing step of the pre-cut second chuck table is performed while the cutting step of the first chuck table is performed and the cutting step of the second chuck table may be continuously performed while the washing step of the first chuck table is performed.

If described as a more specific cutting and cleaning method sequence, after the step of transferring the semiconductor strip to the upper part of the first chuck table, the strip picker aligns the new semiconductor strip and then transfers the semiconductor strip to the upper part of the second chuck table.

The first chuck table transferred first is moved to the cutting position to perform a cutting step, and while the cut first chuck table is moved to the transfer position, the cutting operation of the semiconductor strip adsorbed to the second chuck table is performed. That is, the cutting step of the semiconductor strip adsorbed on the second chuck table is performed while the upper surface of the semiconductor package of the first chuck table is cleaned.

Thereafter, the unit picker picks up the semiconductor package adsorbed to the first chuck table on which the top surface cleaning has been completed by the first and second washing units, and while the third washing unit cleans the semiconductor package, the first chuck table on which the semiconductor package has been removed is removed from the first chuck table. The first chuck table is cleaned by moving to the second washing unit, and the strip picker 100 takes out the third semiconductor strip from the magazine again on the first chuck table where the cleaning is completed, and through the same process as the first and second semiconductor strips. The semiconductor strip is cut, and this process is repeated over and over again. While the new semiconductor strip is transferred to the first chuck table and cut, a cleaning step may also be performed on the semiconductor package that has been cut on the second chuck table.

Therefore, although the first chuck table has been described above as an example, the second chuck table can also be cut and washed through the same process. In addition, since the cutting operation and the cleaning operation are divided and performed alternately on each of the two chuck tables, it is possible to prevent a decrease in productivity.

For reference, the time required for the cutting operation and the cleaning operation is set similar to each other, but if the time required for the cleaning operation is longer than the time required for the cutting operation, an alarm is given to the operator to reset the cleaning time in each cleaning unit. It is also possible to adjust the time required for the cleaning operation.

Previously, an example of mounting on the unit picker was described with respect to the first washing unit of the present invention, but the first washing unit may be mounted on the strip picker as shown in FIG. 2 in the semiconductor material cutting device of the present invention.

Figure 2 schematically shows a second embodiment of the semiconductor material cutting device according to the present invention shown in Figure 1.

A method of cutting and cleaning a semiconductor strip into a plurality of semiconductor packages according to a second embodiment of the present invention comprises the steps of: A) a strip picker transferring the semiconductor strip to the upper part of the first chuck table: B) the first chuck table cutting the semiconductor strip adsorbed to the first chuck table into individual semiconductor packages according to the cutting path when the cutting unit moves to the cutting position; C) When the cutting is complete, the first chuck table moves to the delivery position, and the first cleaning unit made of a sponge or brush material provided on one side of the strip picker moves to the delivery position, and the first chuck table is placed under the first cleaning unit. positioning the chuck table; D) In a state in which the first washing unit is lowered to come into contact with the upper surface of the semiconductor package adsorbed on the first chuck table, the first chuck table is moved to the cutting position or the transfer position to the first washing unit and the semiconductor package performing a first upper surface washing of E) After performing the first upper surface cleaning, as the first chuck table moves in the direction of the cutting position and/or returns to the direction of the transfer position, the second cleaning unit is provided above the transfer path of the first chuck table. performing a second top surface cleaning of the semiconductor package; F) after performing the second upper surface washing, the first chuck table moves to a delivery position, and the unit picker moves to the delivery position, so that the first chuck table is positioned under the unit picker; G) The unit picker picks up the semiconductor package on which the second upper surface cleaning has been completed, moves to the upper part of the third washing unit, performs washing of the lower surface of the semiconductor package in the third washing unit, and cleans the lower surface of the semiconductor package performing washing of the first chuck table with the second washing unit while the first chuck table from which the semiconductor package has been removed moves in a direction of a cutting position and/or returns to a direction of a transfer position; and H) transferring, by the unit picker, the semiconductor package on which the cleaning of the lower surface is completed, to a drying unit.

At this time, since the washing order and method are almost the same except that the first washing unit is mounted on the strip picker, a duplicate description will be omitted.

When the first washing unit is mounted on the strip picker, the cut chuck table moves to the transfer position, and the strip picker is also transferred to the transfer position, so that the first washing unit of the strip picker is positioned on the chuck table. In the unit picker, since the first washing unit is mounted in the moving direction of the unit picker, the first upper surface washing of the semiconductor package was performed while the unit picker moved. In FIG. 2, the position of the unit picker is fixed while the chuck table moves while The upper surface of the semiconductor package adsorbed on the chuck table may be cleaned.

At this time, the chuck table may perform the first upper surface cleaning of the semiconductor package while moving in the direction of the cutting position or the transfer position. That is, the upper surface of the semiconductor package may be washed in the process of moving from the cutting position to the delivery position, or the upper surface of the semiconductor package may be cleaned in the process of returning from the delivery position to the cutting position, and from the cutting position to the delivery position. In the process of moving and returning from the delivery position to the cut position, the upper surface of the semiconductor package may be washed twice. At this time, the first washing unit mounted on one side of the strip picker may be washed in a separately provided washing unit or may be washed in the third washing unit.

Previously, in the embodiment of FIG. 2 , the first washing unit was mounted in the long axis direction to the strip picker according to the longitudinal direction of the chuck table in order to shorten the washing time, but the first washing unit may be mounted in the short axis direction of the strip picker. When the first washing unit is mounted in the short axis direction of the strip picker, the upper surface of the cut semiconductor package may be washed while moving relative to each other by the Y-axis movement of the chuck table and the X-axis movement of the strip picker.

On the other hand, the semiconductor material cutting device according to the present invention may be provided in each of the unit picker 200 and the strip picker 100, as shown in FIG.

As shown in FIG. 3 , when the strip picker and the unit picker are provided with the first washing unit, the first washing unit of the strip picker performs longitudinal washing of the semiconductor package adsorbed on the chuck table, and the first washing unit of the unit picker It is also possible to perform lateral cleaning of the semiconductor package adsorbed on the chuck table.

However, since the chuck table of the present invention is rotatably provided, after the unit picker performs lateral/or longitudinal washing of the semiconductor package adsorbed on the chuck table, the chuck table is rotated ±90° to Directional/or longitudinal cleaning may also be performed.

Therefore, it is preferable to mount the first washing unit to the unit picker in consideration of the movement path of the first washing unit and cleaning management of the first washing unit.

On the other hand, in the semiconductor package cutting device of the present invention, after the cleaning of the top and side surfaces of the semiconductor package by the first washing unit and the second washing unit is completed, the unit picker 200 adsorbs all of the plurality of semiconductor packages to remove the first washing unit and the second washing unit. It is transferred to the third washing unit 400 to wash the lower surface of the semiconductor package by the third washing unit 400 , and the semiconductor package cleaned by the third washing unit 400 is transferred to the drying unit and dried It is removed after being inspected for defects.

For reference, Figure 8 schematically shows a state in which the cleaning process is performed in the semiconductor material cutting device according to the present invention.

As shown in FIG. 8A , after the cutting is completed, the chuck table moves to the delivery position, the first washing part of the unit picker 200 moves to the delivery position, and when the first washing part is located on the top of the chuck table, the The sponge 211 descends from the first washing unit 210 provided in the unit picker 200 to come into contact with the semiconductor package, and in this state, as the unit picker 200 moves, the sponge 211 is The top and side surfaces of the semiconductor package are cleaned in a contact manner. However, as shown in FIG. 7 , when the sponge 211 is replaced with the brush 212 , the brush 212 contacts the gap between the semiconductor packages to contact the top and side surfaces of the semiconductor package. will be cleaned in this way. After completing the first top surface cleaning in a contact type, the sponge or brush of the unit picker rises, and the chuck table moves to the second cleaning unit. Return to the delivery position.

As shown in FIG. 8B , the chuck table returned to the transfer position moves down the unit picker 200 to collectively absorb the cut semiconductor package by the suction unit 220 of the unit picker.

Next, as shown in FIG. 8C , the unit picker 200 moves the semiconductor package adsorbed on the adsorption unit 220 to the brush 410 or sponge 420 of the third washing unit 400 to move the brush. The lower surface of the semiconductor package is washed while moving while the lower surface of the semiconductor package is in contact with 410 or the sponge 420 . After contact-washing the lower surface of the semiconductor package with a brush or sponge, it may be washed once more with the weaning nozzle 430 provided in the third washing unit.

Finally, as shown in FIG. 8D , the unit picker 200 delivers the semiconductor package on which the upper, lower, and side surfaces have been cleaned to a separate drying unit, and then moves the first washing unit to the upper part of the third washing unit as needed. It can move to perform washing of the first washing unit.

Since the third washing unit is provided with various washing means, the first washing unit may be washed by contacting the brush or sponge of the third washing unit, and the sponge of the second washing unit 200 is used with the weaning fluid nozzle 430 . Contaminants adhering to the sponge 211 may be removed by spraying washing water and air to the 211 . In addition, it is possible to remove contaminants from the ultrasonic bath or the like to prevent secondary contamination by the second washing unit while allowing the sponge to absorb the washing water.

In this case, the washing of the first washing unit may be set to be performed after a predetermined number of times or after a predetermined period of use, or may be set to be performed each time after delivery of the semiconductor package is completed or before performing the first washing operation, the operator It may be possible to perform the cleaning operation after inspecting the state of the first cleaning unit with a visual inspection or a separate vision.

In addition, before the washing operation by the first washing unit is performed, the sponge 211 or the brush of the first washing unit 200 is lowered from the washing water storage zone 440 or the ultrasonic water tank 450 and immersed in the washing water to perform the first By supplying washing water to the washing unit, the first washing unit is always kept in a wet state without drying to improve washing efficiency.

With the configuration as described above, the semiconductor material cutting device according to the present invention ensures high cleaning quality of a plurality of cut semiconductor packages and improves productivity (UPH) by performing the cutting and cleaning processes in a precisely controlled sequence. It shows an excellent effect.

Although the present specification has been described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify and change the present invention without departing from the spirit and scope of the present invention as set forth in the claims described below. will be able to carry out Therefore, if the modified implementation basically includes the elements of the claims of the present invention, all should be considered to be included in the technical scope of the present invention.

100: strip picker 200: unit picker
300: chuck table transfer unit 110, 210: first washing unit
710, 720: second washing unit 400: third washing unit
500: position alignment part 600: cut part
700: picker moving axis

Claims (12)

A method for cutting and cleaning a semiconductor strip into a plurality of semiconductor packages, comprising:
A) the strip picker transfers the semiconductor strip to the top of the first chuck table;
B) when the first chuck table moves to the cutting position, the cutting unit cuts the semiconductor strip adsorbed on the first chuck table into individual semiconductor packages along a cutting path;
C) When the cutting is complete, the first chuck table moves to the delivery position, and the first washing part made of a sponge or brush material provided on one side of the unit picker moves to the delivery position, and the first chuck table is located at the lower part of the first washing part. positioning the chuck table;
D) In a state in which the first washing unit is lowered to come into contact with the upper surface of the semiconductor package adsorbed on the first chuck table, the unit picker moves in one direction to first wash the upper surface of the semiconductor package with the first washing unit performing;
E) After performing the first upper surface cleaning, as the first chuck table moves in the direction of the cutting position and/or returns to the direction of the transfer position, the second cleaning unit is provided above the transfer path of the first chuck table. performing a second top surface cleaning of the semiconductor package;
F) after performing the second upper surface washing, the first chuck table is moved to the delivery position and the unit picker is moved to the delivery position, so that the first chuck table is positioned under the unit picker;
G) the unit picker picks up the semiconductor package on which the secondary upper surface cleaning has been completed, moves to the upper part of the third washing unit, performs washing of the lower surface of the semiconductor package in the third washing unit, and cleans the lower surface of the semiconductor package performing washing of the first chuck table with the second washing unit while the first chuck table from which the semiconductor package has been removed moves in a direction of a cutting position and/or returns to a direction of a transfer position; and
H) The unit picker is the semiconductor material cutting and cleaning method comprising the step of transferring the finished semiconductor package to the drying unit. A method for cutting and cleaning a semiconductor strip into a plurality of semiconductor packages, comprising:
A) the strip picker transfers the semiconductor strip to the top of the first chuck table;
B) when the first chuck table moves to the cutting position, the cutting unit cuts the semiconductor strip adsorbed on the first chuck table into individual semiconductor packages along a cutting path;
C) When the cutting is complete, the first chuck table moves to the delivery position, and the first cleaning unit made of a sponge or brush material provided on one side of the strip picker moves to the delivery position, and the first chuck table is placed under the first cleaning unit. positioning the chuck table;
D) In a state in which the first washing unit is lowered to come into contact with the upper surface of the semiconductor package adsorbed on the first chuck table, the first chuck table is moved to the cutting position or the transfer position to the first washing unit and the semiconductor package performing a first upper surface washing of
E) After performing the first upper surface cleaning, as the first chuck table moves in the direction of the cutting position and/or returns to the direction of the transfer position, the second cleaning unit is provided above the transfer path of the first chuck table. performing a second top surface cleaning of the semiconductor package;
F) after performing the second upper surface washing, the first chuck table is moved to the delivery position and the unit picker is moved to the delivery position, so that the first chuck table is positioned under the unit picker;
G) the unit picker picks up the semiconductor package on which the secondary upper surface cleaning has been completed, moves to the upper part of the third washing unit, performs washing of the lower surface of the semiconductor package in the third washing unit, and cleans the lower surface of the semiconductor package performing washing of the first chuck table with the second washing unit while the first chuck table from which the semiconductor package has been removed moves in a direction of a cutting position and/or returns to a direction of a transfer position; and
H) The unit picker is the semiconductor material cutting and cleaning method comprising the step of transferring the finished semiconductor package to the drying unit. 3. The method of claim 1 or 2,
After step A) of the first chuck table, a new semiconductor strip is transferred to the upper part of the second chuck table which is provided side by side on one side of the first chuck table and moves independently of the first chuck table,
A step of cutting the semiconductor strip adsorbed to the second chuck table is performed while steps C) D), E), F) and G) of the first chuck table are performed;
A method for cutting and cleaning semiconductor materials, characterized in that after step G), a new semiconductor strip is transferred to the upper portion of the first chuck table. 4. The method of claim 3,
Cutting the new semiconductor strip transferred to the top of the first chuck table while steps C) D), E), F) and G) for the semiconductor package cut on the top of the second chuck table are sequentially performed A semiconductor material cutting and cleaning method, characterized in that performed. 3. The method of claim 1 or 2,
When the washing preparation signal of the first washing unit is turned on and the cutting in step C) is completed, the first chuck table moves to the delivery position,
When the first chuck table moves to the transfer position, a washing holding signal is turned on to the second washing unit, and the second washing unit is controlled not to spray washing water. 6. The method of claim 5,
When the first upper surface cleaning of the semiconductor package is completed in step E), the washing holding signal of the second washing unit is turned off, and the second washing unit sprays washing water to perform the second upper surface cleaning of the semiconductor package A method of cutting and cleaning semiconductor materials using 6. The method of claim 5,
During the first washing of the top surface in steps D) and E), the first washing unit descends to come into contact with the top surface of the semiconductor package, and when the first washing unit rises after the first washing of the semiconductor package is completed, the first washing unit rises. A method for cutting and cleaning a semiconductor material, characterized in that the washing preparation signal of the first washing unit is turned off, and the second washing unit sprays washing water to perform a secondary upper surface washing of the semiconductor package. 3. The method of claim 1 or 2,
The step of performing the first upper surface cleaning of the semiconductor package is characterized in that the cleaning is performed while the first cleaning unit and the upper surface of the semiconductor material are brought into contact with each other while the first chuck table is rotated at a predetermined angle. How to cut and clean the material. 3. The method of claim 1 or 2,
The performing of the first upper surface washing of the semiconductor package may include washing the upper surface of the semiconductor package or the first washing while adjusting the elevation height of the first washing unit when the upper surface of the semiconductor package and the first washing unit are brought into contact with each other. A method for cutting and cleaning semiconductor materials, characterized in that the upper surface of the semiconductor package is washed while rotating the unit. 3. The method of claim 1 or 2,
The step of performing the first upper surface cleaning of the semiconductor package,
One-way cleaning of the semiconductor package is performed while the semiconductor package adsorbed on the upper surface of the first chuck table and the first cleaning unit are brought into contact, and the semiconductor package and the first cleaning unit are rotated 90 degrees while the first chuck table is rotated. A method for cutting and cleaning semiconductor materials, characterized in that cleaning is performed in the other direction while contacting the parts. 3. The method of claim 1 or 2,
After step H), if necessary, the first washing unit moves to the upper part of the third washing unit, and the third washing unit performs washing of the first washing unit. How to cut and clean. 3. The method of claim 1 or 2,
In step C), while the first chuck table is moved to the delivery position, the second washing unit sprays washing water to wash the upper surface of the semiconductor package with the washing water sprayed from the second washing unit, and the first chuck A method for cutting and cleaning semiconductor materials, characterized in that the injection of the second washing water is stopped when the table is moved to the delivery position.

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