KR20130063402A - Semiconductor manufacturing apparatus - Google Patents
Semiconductor manufacturing apparatus Download PDFInfo
- Publication number
- KR20130063402A KR20130063402A KR1020110129899A KR20110129899A KR20130063402A KR 20130063402 A KR20130063402 A KR 20130063402A KR 1020110129899 A KR1020110129899 A KR 1020110129899A KR 20110129899 A KR20110129899 A KR 20110129899A KR 20130063402 A KR20130063402 A KR 20130063402A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor
- chuck body
- scrap
- suction pad
- chuck
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
Description
The present invention relates to a semiconductor manufacturing apparatus, and more particularly to a semiconductor manufacturing apparatus including a chuck table used in the semiconductor cutting process.
The semiconductor package is manufactured through various processes, and is generally manufactured through the following processes.
In general, a semiconductor package manufactures a semiconductor chip having a highly integrated circuit such as a transistor and a capacitor formed on a semiconductor substrate made of silicon, and attaches the same to a strip material such as a lead frame or a printed circuit board, and the semiconductor chip and the strip material Electrically connected to each other by a wire or the like so as to be energized with each other, it is manufactured by the process of molding the semiconductor chip with an epoxy resin to protect from the external environment.
Usually, the semiconductor package is packaged in a matrix form arranged in the strip material, and each package in the strip material is cut and individually separated, and the separated packages are sorted according to a predetermined quality standard and then loaded into a tray or the like. And sent to the subsequent process.
Generally, the completed form of the molding process is referred to as a semiconductor strip or semiconductor material, and the semiconductor strip includes a plurality of semiconductor packages. A cutting process is performed to separate one semiconductor package from the semiconductor strip.
Specifically, the semiconductor strip is cut into the unit package through the semiconductor cutting device in a state where it is seated on the chuck table, and scrap, debris and fine dust may be generated during this cutting process. Hereinafter, portions of the semiconductor semiconductor strip except for the semiconductor package are referred to as scrap. Therefore, high pressure air or washing water (or cooling water) is injected in the cutting process in order to remove scrap generated during the cutting process. However, the semiconductor scrap is not easily discharged from the chuck table through high pressure air, washing water or cooling water.
Poorly discharged semiconductor scrap can cause many problems.
First, the semiconductor scrap which is not discharged is attached to the upper surface of the normal material to damage the cutting blade of the cutting device, such as to affect the semiconductor cutting device, thereby increasing the defective rate in the cutting process. In addition, the package picker for transferring the semiconductor package from the chuck table to another device may affect the package picker and may not be able to continuously and stably perform the cutting process.
In addition, when the semiconductor strip is supplied to the chuck table, the semiconductor strip may be affected by the remaining scrap, and thus the process defect rate may be increased.
Due to these problems, there is a need to provide a chuck table through which semiconductor strips can be discharged smoothly.
Through the Republic of Korea Patent No. 10-0585200 filed by the applicant has been presented a chuck table that can smoothly discharge the semiconductor strip. The patent publication proposes a chuck table in which semi-circular protrusions are arranged at predetermined intervals around a suction pad. However, these chuck tables have the following problems.
First, the chuck table, especially the chuck body, is made of a metal material in a configuration that requires very precise machining. And the surface precision is also very high. Therefore, it is very difficult to form the semicircular protrusions on the chuck body and the manufacturing cost is increased.
In addition, the discharge of the semiconductor scrap is sandwiched between the adsorption pad and the protrusion may cause a problem that the semiconductor scrap is not smoothly discharged. In addition, the washing water flows between the protrusions of the semicircle, and thus, the semiconductor scrap may not be discharged because the semiconductor scrap is supported on the protrusion of the semicircle. Of course, fine dust or debris may accumulate in the complex structure, so that subsequent cleaning operations may be complicated for reuse, and there may be a problem in which replacement of the adsorption pad is not easy.
Further, even though the semiconductor scrap is discharged to the outside by the line contact through the projecting portion of the semi-circle, there is a problem that the line contact portion generated in the discharged semiconductor scrap may increase. In addition, when the line contact the direction is parallel to the discharge direction there may be a limit in the smooth discharge of the semiconductor scrap.
Accordingly, there is a need to provide a chuck table and a semiconductor manufacturing apparatus including the same, in which manufacturing can be easily performed and the semiconductor scrap can be discharged more smoothly.
An object of the present invention is to provide a semiconductor manufacturing apparatus for solving the above-mentioned problems.
An embodiment of the present invention is to provide a semiconductor manufacturing apparatus in which the semiconductor scrap can be easily discharged by omitting a structure that prevents the discharge of the semiconductor scrap along the direction in which the semiconductor scrap is discharged.
An embodiment of the present invention is to provide a semiconductor manufacturing apparatus in which the semiconductor scrap can be easily discharged by minimizing the area in contact with the chuck body when the semiconductor scrap is discharged.
An embodiment of the present invention is to provide a semiconductor manufacturing apparatus in which the semiconductor scrap discharged perpendicularly to the direction in which the semiconductor scrap is discharged to enable continuous line contact so that the semiconductor scrap can be discharged more easily. .
An embodiment of the present invention is to provide a semiconductor manufacturing apparatus that can enable a simple structure to easily increase the reuse rate.
In order to achieve the above object, an embodiment of the present invention includes a semiconductor cutting device, a chuck table and a jetting means for injecting a fluid to the chuck table, the chuck table, the chuck table, the semiconductor strip to be cut A suction pad provided to be placed thereon; And a chuck body having a suction pad accommodating part in which the suction pad is located and a curved part extending downward from the outside of the suction pad accommodating part.
The curved portion may extend to the outermost portion of the chuck body. Thus, the semiconductor scrap can be continuously discharged completely out of the chuck body.
The chuck body and the suction pad accommodating portion may be formed in a rectangular shape, and the semiconductor cutting device may cut the semiconductor strip in a length direction and a width direction of the chuck body.
The curved surface portion is preferably formed along the longitudinal direction and the width direction of the chuck body. The curved portion is preferably formed to have a continuous surface, and more preferably, the curved portion is formed in the entire length direction and the width direction of the chuck body.
Preferably, the suction pad forms the uppermost part of the chuck table, and the height of the chuck body does not increase from the suction pad to the outermost part of the chuck body. That is, since the height does not increase in the discharge direction, the semiconductor scrap can be discharged smoothly.
The chuck body may include a flat portion formed between the suction pad receiving portion and the curved portion. The outermost portion of the suction pad may include a suction pad connection part having the same height as the flat part. The adsorption pad connection portion may act as a buffer between the adsorption pad and the chuck body to significantly reduce the wear of the chuck body. Therefore, the durability of the chuck body can be improved.
The chuck body includes at least one of a fastening hole for fixing to a base or a pin hole for determining a relative position of the chuck body, and the fastening hole and the pin hole are preferably formed in the curved portion. Therefore, the semiconductor scrap can be smoothly discharged on the fastening hole or the pinhole. This is because the height difference and the height difference at the entrance of the fastening hole or the pinhole are formed in a curved shape. This effectively prevents the suction of the semiconductor scrap from the fastening hole or the pinhole.
In addition, it may include a cover for inserting the fastening hole to fill the opening of the fastening hole.
Side of the chuck body it is preferable that the ring coupling portion provided with a ring for fastening with the toggle clamp is formed to be inclined downward. Of course, the clamp may be replaced by various clamps, not toggle clamps.
The top of the ring is preferably formed lower than the curved portion. Therefore, the semiconductor scrap discharged along the curved portion can be prevented from being caught in the ring.
The curved portion may be formed such that the semiconductor scrap is discharged to the outside of the chuck body in the cutting direction of the semiconductor strip or in the vertical direction of the cutting direction. The curved surface portion may be formed to be in continuous line contact with the semiconductor scrap along a vertical direction of the discharge direction of the semiconductor scrap.
According to an embodiment of the present invention, it is possible to provide a semiconductor manufacturing apparatus in which the semiconductor scrap can be discharged more easily by omitting a structure that obstructs the discharge of the semiconductor strip along the direction in which the semiconductor scrap is discharged.
According to an embodiment of the present invention, it is possible to provide a semiconductor manufacturing apparatus in which the semiconductor scrap can be easily discharged by minimizing the area in contact with the chuck body when the semiconductor scrap is discharged.
According to an embodiment of the present invention, it is possible to provide a semiconductor manufacturing apparatus in which semiconductor scraps can be discharged more easily by enabling continuous line contact of semiconductor scraps discharged perpendicularly to the direction in which the semiconductor scraps are discharged.
According to the embodiment of the present invention, it is possible to provide a semiconductor manufacturing apparatus that enables a simple structure and can easily increase the reuse rate.
1 is a perspective view showing a chuck table according to an embodiment of the present invention;
2 is a cross-sectional view showing a state in which the chuck table is mounted on the base;
3 is a perspective view illustrating a state in which a semiconductor strip disposed on a chuck table is cut and discharged of semiconductor scrap.
Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
According to an exemplary embodiment of the present invention, a semiconductor manufacturing apparatus may be provided, and more specifically, a semiconductor manufacturing apparatus including a semiconductor cutting apparatus for cutting a semiconductor strip may be provided.
In addition, according to an embodiment of the present invention can provide a semiconductor manufacturing apparatus including a chuck table on which the semiconductor strip to be cut is seated and the injection means for injecting fluid. Here, the fluid may include various forms of liquids, air and gases and may be used for cooling, lubrication, and cleaning.
Since the semiconductor cutting device and the injection means may be the same or similar to the conventional configuration, a detailed description thereof will be omitted below.
First, a chuck table that can be used in the embodiment of the present invention will be described in detail with reference to FIGS. 1 and 2.
As shown in FIG. 1, the chuck table 100 may include a
The chuck body 110 is generally formed of a metal material, and all surfaces are generally precisely machined. In addition, the chuck body 110 may be provided with a suction
The suction
Here, the
The upper surface of the
In detail, the
The
Hereinafter, a structure for adsorbing the
Adsorption holes 121 are formed in the central portion of the
Therefore, the vacuum force through the
In general, the
Here, the edge of the
Due to the structural features of the
The semiconductor scrap discharged to the outside of the
Therefore, according to this embodiment, the chuck body 110 preferably includes a
In addition, it is preferable that the height of the chuck body 110 does not increase from the outside of the
Here, the
In order to replace the
Therefore, since the portion of which at least the height increases from the
Here, the width of the
Of course, the length of the planar portion up to the outermost portion of the chuck body 110 can be increased through the
On the other hand, the adsorption
Hereinafter, the relationship between the discharge direction, the cutting direction, and the
3 shows a
As shown in FIG. 3, the chuck table 100 may be formed in a substantially rectangular shape. Therefore, the length of the chuck table 100 in the longitudinal direction may be longer than the length of the chuck table 100 in the width direction. Since the outer shape of the chuck table 100 is substantially determined by the chuck body 110, the chuck body 110 may also be formed in a rectangular shape. In addition, the
As illustrated in FIG. 1, the
In this case, the
As shown in FIG. 3, when cutting is performed in the longitudinal direction of the chuck body 110, a
Similarly, when the cutting is performed in the width direction of the chuck body 110, the short-length semiconductor scrap 420, that is, the scrap may be generated. The scrap scraps 420 may also be discharged in the cutting direction or perpendicular to the cutting direction.
Here, the scrap may be referred to as a low plate shape. Therefore, the center of gravity is low and the surface area is wide. In order to discharge the scrap of this type to the outside of the chuck body 110, the area in which the chuck body 110 and the
For example, semiconductor scrap may be discharged in the longitudinal direction of the chuck body 110. In this case, the semiconductor scrap may be discharged through the widthwise
In addition, since the scrap is formed in a plane, the scrap is in linear contact with the curved portion in a continuous straight shape perpendicular to the discharge direction. In other words, it is perpendicular to the contact portion and the discharge direction. When the wash water flows in the discharge direction, the contact area with the wash water and the discharged scrap can be maximized while the contact area can be minimized. In addition, since it can cause the rotation of the scrap to be discharged it is possible to effectively discharge the scrap to prevent the scrap is fixed.
Similarly, when the semiconductor scrap is discharged in the width direction of the chuck body 110, the scrap may be smoothly discharged due to the longitudinal
Meanwhile, as shown in FIG. 2, the chuck table 100 may be fixed to the base 500 through a
The
First, the
For example, when the fastening hole inlet is horizontal and the scrap is positioned above the fastening hole inlet in a state in which liquid is introduced into the fastening hole, suction force may be generated in the fastening hole. Therefore, the semiconductor scrap may not be smoothly discharged. Therefore, the discharge of the semiconductor scrap is not prevented even through the fastening hole or the pin hole formed in the
In particular, a cover (not shown) for filling the
As shown in FIG. 1, the chuck body 110 may include a
Here, the ring coupling portion 180 is preferably formed to be inclined downward. That is, as shown in Figure 1, it is preferable to be inclined to the inside of the chuck body 110 with respect to the
Unlike in FIG. 1, when the ring coupling part 180 is directly formed on the
Therefore, it is possible to effectively prevent the
As described above, in the semiconductor manufacturing apparatus according to the embodiment of the present invention, the height is not increased until the semiconductor scrap is completely discharged from the outside of the portion where the semiconductor strip is seated and supported. The semiconductor scrap is in line contact with the curved part in a direction perpendicular to the direction in which the semiconductor scrap is discharged through the curved part. This line contact can maximize the contact length with the discharged fluid while minimizing the contact area. Therefore, the scrap discharge can be made very easily.
Further, the semiconductor scrap can be smoothly discharged in any direction so that the discharge of the semiconductor scrap is not disturbed even through the configuration for mounting or positioning the chuck table.
100: chuck table 110: chuck body
111: plane portion 112: curved portion
120: adsorption pad 400: semiconductor strip
410: semiconductor package 420, 430: semiconductor scrap
Claims (9)
The chuck table
A suction pad provided to place the semiconductor strip to be cut; And
And a chuck body having a suction pad accommodating part in which the suction pad is located and a curved part extending downward from the outside of the suction pad accommodating part.
And the curved portion extends to the outermost portion of the chuck body.
The chuck body and the suction pad receiving portion is formed in a rectangular shape, the semiconductor cutting device is a semiconductor manufacturing apparatus, characterized in that for cutting the semiconductor strip in the longitudinal direction and the width direction of the chuck body.
The curved surface portion is a semiconductor manufacturing apparatus characterized in that it has a continuous surface in the longitudinal direction and the width direction of the chuck body.
The chuck body includes a flat portion formed between the suction pad receiving portion and the curved portion.
The chuck body includes at least one of a fastening hole for fixing to a base or a pin hole for determining a relative position of the chuck body, wherein the fastening hole and the pin hole are formed in the curved portion. Manufacturing device.
And a cover inserted into the fastening hole to fill the opening of the fastening hole.
The side of the chuck body semiconductor manufacturing apparatus, characterized in that the ring engaging portion provided with a ring for fastening with the toggle clamp is formed inclined downward.
And the uppermost portion of the ring is formed lower than the curved portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110129899A KR20130063402A (en) | 2011-12-06 | 2011-12-06 | Semiconductor manufacturing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110129899A KR20130063402A (en) | 2011-12-06 | 2011-12-06 | Semiconductor manufacturing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20130063402A true KR20130063402A (en) | 2013-06-14 |
Family
ID=48860771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020110129899A KR20130063402A (en) | 2011-12-06 | 2011-12-06 | Semiconductor manufacturing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20130063402A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101585784B1 (en) | 2014-08-19 | 2016-01-22 | 주식회사 두오텍 | Breaking machine for semiconductor packages |
| KR102183323B1 (en) | 2019-07-22 | 2020-11-26 | (주)대창엔지니어링 | Picker pad for semi-conductor chip sawing |
-
2011
- 2011-12-06 KR KR1020110129899A patent/KR20130063402A/en not_active Application Discontinuation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101585784B1 (en) | 2014-08-19 | 2016-01-22 | 주식회사 두오텍 | Breaking machine for semiconductor packages |
| KR102183323B1 (en) | 2019-07-22 | 2020-11-26 | (주)대창엔지니어링 | Picker pad for semi-conductor chip sawing |
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|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E601 | Decision to refuse application |