TW201822942A - Cutting apparatus that suppresses water drops falling onto a cut object by providing an intermediate chamber between a cleansing section and a drying section - Google Patents

Abstract

The present invention provides a cutting apparatus. The cutting apparatus suppresses water drops falling onto a cut object by providing an intermediate chamber between a cleansing section and a drying section. The cutting apparatus (1) comprises: a cutting mechanism (11a, 11b) for cutting an object to be cut (2); a work table (9) for carrying a cut object (13) that is formed by using the cutting mechanism (11a, 11b) to cut the object to be cut (2); a cleansing section (15) for cleansing the cut object (13) carried on the work table (9); a drying section (16) for drying the cut object (13) on the work table (9) that is moved from the cleansing section(15); and an intermediate chamber (17) arranged between the cleansing section (15) and the drying section (16).

Description

Cutting device

The present invention relates to a cutting device for washing and drying a cut object cut by a cutting mechanism.

Conventionally, cutting objects such as wafers or packaged substrates are cut by a cutting device using a cutting mechanism. In order to remove chips, contaminants, and the like generated when cutting the cutting object, the cut object after the cutting is washed and dried. For example, a cutting device for cleaning a processed object using a cleaning mechanism is disclosed (see Patent Document 1).

Patent Document 1: Japanese Patent Publication No. 2013-80811

However, the cutting device 1 disclosed in Patent Document 1 causes the following problems. As shown in FIG. 3 of Patent Document 1, the washing and drying nozzle 89 is provided in a cube-shaped case 82 having an open lower surface, and sprays washing water and drying air toward the workpiece W. The washing and drying nozzle 89 is connected to a washing water supply source 94 and a drying air supply source 95 via a switching valve 96. When the switching valve 96 is switched, the washing water and the drying air are selectively supplied to the washing and drying nozzle 89. The washing and drying nozzle 89 is reciprocated within the casing 82 to wash and dry the workpiece W.

As described above, since the washing water and the drying air are sprayed from the washing and drying nozzle 89 by selective switching, it is possible to spray the washing water remaining in the nozzle and the pipe to the workpiece W again during the drying process of the workpiece W. In addition, the washing water splashed from the workpiece W and the washing water in a mist form may adhere to the top wall or the inner wall of the case 82 during the washing process, and the washing water may become water droplets during the drying process Drop on the workpiece W. Therefore, there is a possibility that a water mark (water mark) is formed on the surface of the workpiece W and remains as a stain. In addition, there is a possibility that defective drying due to water drops may occur.

The present invention has been made in order to solve the above-mentioned problems, and an object thereof is to provide a cutting device that suppresses water droplets from falling on a cutting object by providing an intermediate chamber between a cleaning section and a drying section.

In order to solve the above-mentioned problem, the cutting device according to the present invention includes a cutting mechanism for cutting a cutting object, and a table for placing a cutting object, and the cutting object is provided by the cutting mechanism. The cutting object is cut; a cleaning part is used to clean the cut object on the workbench; a drying part is used to cut the cut on the workbench moved from the cleaning part The object is dried; and an intermediate chamber is provided between the washing section and the drying section.

According to the present invention, the cutting device suppresses water droplets from falling on the cutting object by providing an intermediate chamber between the cleaning section and the drying section.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. Any figure in this application document is appropriately omitted or exaggerated for schematic understanding. The same reference numerals are used for the same constituent elements, and descriptions thereof are appropriately omitted. In addition, in this document, the "support member" is a member for supporting a support object such as a wafer, an insulating film, a conductive film, or a semiconductor film, and examples thereof include glass epoxy substrates, ceramic substrates, resin substrates, and metal substrates. General substrates, lead frames, and semiconductor wafers.

[Example 1]

(Structure of the cutting device)

A configuration of a cutting device according to the present invention will be described with reference to FIG. 1. As shown in FIG. 1, the cutting device 1 is a device that cuts a cutting object having a large area and singulates it into a plurality of regions, for example. The cutting device 1 includes, as constituent elements, a supply module A for supplying a cutting object, a cutting module B for cutting the cutting object, and an inspection mold for inspecting a cut object after the cutting. Group C. Each component (each module A to C) can be attached to and detached from other components, and can be replaced. Here, the “cutting object having a large area” is, for example, a quadrangular shape having four sides of 200 mm or more, 250 mm or more, or 300 mm or more, or a circular cutting object having a diameter of 200 mm or more, 250 mm or more, or 300 mm or more.

The cutting device 1 is used to cut a support member having a resin portion as a cutting target, or a semiconductor wafer after completion of a pre-semiconductor process (diffusion process and wiring process), and the like is singulated. Examples of the support member having a resin portion include a packaged substrate after resin-sealing a wafer mounted on a substrate, and a packaged wafer after resin-sealing a wafer mounted on a semiconductor wafer. It is also possible to cut the support member itself before molding the resin portion. In the first embodiment, a case where the packaged substrate to be cut is cut and singulated is described. The cutting target may be a semiconductor wafer on which an element is formed.

The packaged substrate includes: a substrate; a plurality of wafers, which are mounted on a plurality of regions of the substrate; and an encapsulating resin, which is molded so as to cover a plurality of regions together. Each area singulated by cutting the packaged substrate is equivalent to a product.

The supply module A is provided with a cutting target supply mechanism 3 for supplying the packaged substrate 2 corresponding to the cutting target, a cutting target placement section 4 for transferring the packaged substrate 2, and a transport mechanism 5 For transporting the packaged substrate 2. The transport mechanism 5 can move in the X direction, the Y direction, and the Z direction. After positioning the packaged substrate 2 on the cutting target placement section 4, the packaged substrate 2 is transferred to the cutting module B by the transfer mechanism 5.

The cutting module B is provided with: an alignment area 6 for setting an imaginary cutting line on the packaged substrate 2; a cutting area 7 for cutting and packaging the packaged substrate 2 into a single piece; and The washing and drying area 8 is used for washing and drying the singulated cut object.

In the cutting module B, a cutting table 9 for placing the packaged substrate 2 in the alignment area 6 is provided. The cutting table 9 can be moved in the Y direction in the figure by a moving mechanism (not shown). The cutting table 9 is movable between the alignment area 6, the washing and drying area 8, and the cutting area 7. The cutting table 9 can be rotated in the θ direction by a rotation mechanism (not shown). For example, a cutting jig (not shown) may be attached to the cutting table 9, and the packaged substrate 2 may be placed on the cutting jig.

An alignment camera 6 is provided in the alignment area 6. The alignment camera 10 can move independently in the X direction. By moving the alignment camera 10 in the X direction and the cutting stage 9 in the Y direction, the coordinate position of the alignment mark formed on the packaged substrate 2 is measured. Thereby, the cutting line of the board | substrate 2 after encapsulation is set imaginarily in the X direction and the Y direction.

The cutting region 7 is provided with two mandrels 11 a and 11 b as a cutting mechanism. The cutting device 1 is a cutting device of a double mandrel structure provided with two mandrels 11a and 11b. The mandrels 11a and 11b can move independently in the X direction and the Z direction. Rotating blades 12a and 12b are attached to the mandrels 11a and 11b, respectively. The mandrels 11a and 11b are respectively provided with a cutting water nozzle for spraying cutting water and a cooling water nozzle (not shown) for spraying cooling water, so as to suppress friction caused by the high-speed rotating blades 12a and 12b heat. The post-package substrate 2 is cut by moving the cutting table 9 and the spindles 11 a and 11 b relatively. The rotating blades 12 a and 12 b cut the post-package substrate 2 by rotating in a plane of a plane orthogonal to the X axis.

The cutting device 1 may be a cutting device having a single spindle structure in which one spindle is provided in the cutting region 7. When cutting a large-area cutting object, since the total distance of the cutting object cut by the rotary blade is very long, it is preferable to efficiently cut the cutting object by providing two mandrels.

In the washing and drying area 8, a washing and drying mechanism 14 is provided. The washing and drying mechanism 14 cleans and dries the substrate 13 after cutting, which is a cutting object cut by the mandrels 11 a and 11 b. The cleaning and drying mechanism 14 includes a cleaning section 15 for cleaning the cut and cut substrate 13 and a drying section 16 for drying the cleaned and cut substrate 13. An intermediate chamber 17 is provided between the cleaning unit 15 and the drying unit 16, and the intermediate chamber 17 has a space divided by partition walls of the cleaning unit 15 and the drying unit 16. The cutting table 9 is moved back and forth in the Y direction below the cleaning and drying mechanism 14 to clean and dry the cut substrate 13. The washing and drying mechanism 14 will be described in detail below with reference to FIGS. 2 to 4.

The inspection module C is provided with an inspection table 18. The substrate 13 is transferred after being cut and placed on the inspection table 18. The post-cut substrate 13 is an aggregate of products P that are singulated by cutting the post-package substrate 2. The post-cut substrate 13 is transferred from the cutting table 9 by the transport mechanism 19 and placed on the inspection table 18. The transport mechanism 19 can move in the X direction, the Y direction, and the Z direction.

In the inspection module C, for example, a plurality of products P are inspected by the inspection camera 20. The inspection camera 20 can move in the X direction and the Y direction. The inspected product P is screened as a qualified product and a defective product. Good products are stored on the good product tray 21. Defective products are contained on the defective product tray 22.

A control unit CTL is provided in the supply module A. The control unit CTL is used to control the operation of the cutting device 1, the transportation of the packaged substrate 2, the alignment of the packaged substrate 2, the cutting of the packaged substrate 2, the cleaning and drying of the packaged substrate 13, and the Inspection and the like of the substrate 13 after transportation and cutting. In this embodiment, the control section CTL is provided in the supply module A. Not limited to this, the control section CTL may be provided in another module. In addition, the control unit CTL may be divided into a plurality of control units and provided in at least two modules among the supply module A, the cutting module B, and the inspection module C.

In addition, in FIG. 1, an example of cutting the packaged substrate 2 as a cutting target is shown. Therefore, the cutting target mounting portion 4, the cutting table 9, and the inspection table 18 are set as Rectangle (square) shape. Without being limited to this, if the cutting target to be processed is, for example, a semiconductor wafer, the cutting target mounting section 4, the cutting table 9, and the inspection table 18 may be circular.

(Structure of washing and drying mechanism)

The configuration of the washing and drying mechanism 14 of the first embodiment used in the cutting device 1 shown in FIG. 1 will be described with reference to FIG. 2.

As shown in (a) of FIG. 2, the cleaning and drying mechanism 14 includes a cleaning section 15 for cleaning the cut and cut substrate 13, and a drying section 16 for drying the cleaned and cut substrate 13; and The intermediate chamber 17 is provided between the washing section 15 and the drying section 16. The washing and drying mechanism 14 has a length L1 and a width W in a plan view. The width W of the washing and drying mechanism 14 is set larger than the width of the cutting table 9. The cutting table 9 moves back and forth in the Y direction below the washing and drying mechanism 14.

As shown in (b) and (c) of FIG. 2, a moving space for moving the cutting table 9 and the cut-off substrate 13 placed on the cutting table 9 is formed below the cleaning and drying mechanism 14. twenty three. The cutting table 9 uses a moving mechanism (not shown) such as a ball screw mechanism to reciprocate in the Y direction in the moving space 23.

The moving space 23 is a space that surrounds at least a part of the moving space 23 by constructing side wall plates on the outer periphery of the washing unit 15, the drying unit 16 and the intermediate chamber 17, and has a height h1 with the lower end of the washing and drying mechanism 14 as a reference plane. If the moving space 23 further includes the wall thickness of each of the washing unit 15, the drying unit 16, and the intermediate chamber 17, the moving space 23 is a rectangular parallelepiped space having a length L1 × width W × h1. When the lower end of the washing and drying mechanism 14 is used as a reference plane, the height of the intermediate chamber 17 is h2, the height of the drying unit 16 is h3, and the height of the washing unit 15 is h4. The relationship between these heights is h4> h3> h2> h1.

The cleaning unit 15 includes a cleaning chamber 24 having an opening portion below, and a cleaning mechanism 25 housed in the cleaning chamber 24. The cleaning chamber 24 and the intermediate chamber 17 are separated by an intermediate-chamber-side partition wall 26 constituting the cleaning unit 15. By reciprocating the cut substrate 13 in the moving space 23 below the cleaning chamber 24 and the intermediate chamber 17, the entire surface of the cut substrate 13 is cleaned by the cleaning mechanism 25.

As the cleaning mechanism 25, for example, a spray cleaning mechanism (spray cleaning) for spraying the cleaning liquid 27 is used. Spray cleaning is cleaning using a nozzle composed of a single fluid or a dual fluid. In the case of a single-fluid nozzle, the cleaning liquid 27 is sprayed from the tip of the nozzle toward the cut-off substrate 13. As the cleaning liquid 27, pure water, carbonated water, ozone water, or the like is preferably used. In the case of a two-fluid nozzle, a gas such as compressed air or nitrogen is supplied to the cleaning liquid 27. The cleaning liquid 27 mixed with the gas becomes fine mist particles and is sprayed toward the cut substrate 13. Alternatively, the cleaning liquid 27 sprayed from the cleaning mechanism 25 may be sprayed by applying ultrasonic waves. The direction and angle of spraying the cleaning liquid 27 can be arbitrarily set.

In the case of cleaning the cut substrate 13 having a large area, in order to clean the entire surface of the cut substrate 13 together, it is preferable to use a wider width than the plurality of cleaning mechanisms 25 or the cut substrate 13 and to provide Slit nozzle or porous nozzle cleaning mechanism 25. In addition, the cleaning mechanism 25 may be provided in a structure capable of automatically changing the nozzle orientation in the left-right or up-down direction toward the cut substrate 13. As shown in FIG. 2 (b), the cleaning liquid 27 is preferably sprayed from the cleaning chamber 24 in a direction opposite to the intermediate chamber 17. The cleaning liquid 27 sprayed from the cleaning mechanism 25, the water droplets adhering to the inner wall of the cleaning chamber 24, and the mist generated in the cleaning chamber 24 are preferably prevented from entering the intermediate chamber 17.

The drying unit 16 includes a drying chamber 28 having an opening portion below, and a drying mechanism 29, and is housed in the drying chamber 28. The drying chamber 28 and the intermediate chamber 17 are separated by an intermediate-chamber-side partition wall 30 constituting the drying section 16. By reciprocating the cut substrate 13 in the moving space 23 below the drying chamber 28 and the intermediate chamber 17, the entire surface of the cut substrate 13 is dried by the drying mechanism 29.

As the drying mechanism 29, for example, an air-knife dewatering dryer is used, which blows a cleaning liquid 27 from the surface of the cut-off substrate 13 by blowing a gas 31 such as compressed air or nitrogen gas toward the cut-off substrate 13. The air knife dewatering and drying can form a wide and narrow air flow, and blow off the cleaning liquid 27 with a strong spraying force. The direction, angle, and the like of the blowing gas 31 can be arbitrarily set.

When an air knife is used, the width of the air knife is preferably larger than the width of the substrate 13 after cutting so that the entire surface of the substrate 13 after cutting is dried together. In addition, the air knife may have a structure capable of automatically changing the direction of the jet port of the air knife in the left-right or up-down direction. The gas 31 ejected from the drying mechanism 29 may be ejected from the drying chamber 28 in a direction opposite to the intermediate chamber 17, or may be ejected from the drying chamber 28 toward the intermediate chamber 17. Alternatively, the gas 31 may be injected directly below. It suffices that the cleaning liquid 27 on the cut substrate 13 is blown downward from the drying chamber 28.

In the cleaning and drying mechanism 14, each of the cleaning mechanism 25 and the drying mechanism 29 may be in the form of an assembly composed of a plurality of products P aligned in the width direction of the substrate 13 after cutting and drying together. In addition, it is preferable that the cleaning and drying mechanism 14 has a structure that suppresses adhesion to the inner walls of the cleaning and drying mechanism 14 (specifically, the cleaning chamber 24 and the intermediate chamber 17) during or after drying the cut substrate 13. The water drops on the substrate fall onto the substrate 13 after the cutting.

(Operation of cleaning and drying mechanism)

The operation of cleaning and drying the cut substrate 13 by the cleaning and drying mechanism 14 will be described with reference to FIGS. 3 to 4.

As shown in FIGS. 3A and 3B, in order to clean the cut substrate 13, a moving mechanism (not shown) is used to reciprocate the cutting table 9 below the cleaning chamber 24 in the Y direction. When the post-cut substrate 13 placed on the cutting table 9 passes under the cleaning chamber 24, the post-cut substrate 13 is cleaned by spraying a cleaning liquid 27 from the plurality of cleaning mechanisms 25 to the post-cut substrate 13. For example, the entire surface of the substrate 13 after cutting can be cleaned by a plurality of cleaning mechanisms 25 by reciprocating the cutting table 9 from the S1 position to the S2 position in the Y direction by a predetermined distance D. Chips, contaminants, and the like remaining on the substrate 13 after cutting are removed by a plurality of cleaning mechanisms 25.

The cleaning mechanism 25 uses spray cleaning using a nozzle composed of a single fluid or a dual fluid. In the case of a single-fluid nozzle, a part of the cleaning liquid 27 ejected from the tip of the nozzle may splash from the cut substrate 13 and adhere to the inner wall of the cleaning chamber 24 or the cleaning mechanism 25 to become water droplets. Water droplets adhering to the inner wall of the cleaning chamber 24 or the cleaning mechanism 25 may fall downward with the passage of time.

In the case of a two-fluid nozzle, a gas such as compressed air or nitrogen is supplied to the cleaning liquid 27. The gas-containing cleaning liquid 27 becomes fine mist particles (fog) and is sprayed toward the substrate 13 after cutting. The mist may adhere to the inner wall or ceiling of the cleaning chamber 24 and condense into water droplets. Water droplets adhering to the inner wall or ceiling of the cleaning chamber 24 may fall downward with the passage of time. In addition, although two-fluid nozzles are more prone to misting, even single-fluid nozzles sometimes produce misting.

As described above, when spray cleaning is used, water droplets adhering to the inner wall or ceiling of the cleaning chamber 24 and the cleaning mechanism 25 may fall downward with the passage of time. Therefore, it is preferable that the cleaning and drying mechanism 14 has a structure in which, when or after the cut substrate 13 is dried, water droplets are prevented from falling on the cut substrate 13.

As shown in FIGS. 4 (a) and 4 (b), in order to dry the cleaned and cut substrate 13, a moving mechanism (not shown) is used to make the cutting table 9 below the drying chamber 28 along the Y Move back and forth in the direction. When the post-cut substrate 13 placed on the cutting table 9 passes under the drying chamber 28, a gas 31 such as compressed air or nitrogen is blown from the drying mechanism 29 to the post-cut substrate 13 to remove the surface of the post-cut substrate 13 Blow off cleaning solution 27. For example, by cutting the cutting table 9 back and forth in a Y direction from the S1 position to the S2 position by a predetermined distance D, the entire surface of the cut substrate 13 is dried by the drying mechanism 29.

In order to clean the entire surface of the cut-off substrate 13, the cut-off substrate 13 is cleaned by reciprocating a predetermined distance D in the Y direction from the S1 position to the S2 position. Similarly, in order to dry the entire surface of the substrate 13 after cutting, the substrate 13 for cutting is dried by reciprocating the cutting table 9 from the S3 position to the S4 position by a predetermined distance D in the Y direction. In both the case where the cut substrate 13 is cleaned and the case where the cut substrate 13 is dried, the entire cutting substrate 13 can be moved by moving the cutting table by a predetermined distance D in the Y direction. Noodles are washed and dried.

In the washing and drying mechanism 14, an intermediate chamber 17 is provided between the washing section 15 and the drying section 16. As shown in FIG. 4A, the intermediate chamber 17 has a length d1 in the Y direction. Accordingly, the cleaning and drying mechanism 14 can be configured to prevent the substrate 13 from passing under the cleaning chamber 24 after the cutting is performed while the substrate 13 is being dried. Therefore, it is possible to prevent water droplets adhering to the inner wall of the cleaning chamber 24 or the ceiling and the cleaning mechanism 25 from falling on the cut substrate 13 during or after the cutting of the cut substrate 13.

(Effect)

In this embodiment, the cutting device 1 has a structure including mandrels 11a and 11b as cutting mechanisms for cutting the packaged substrate 2 as a cutting target, and cutting work as a table. The stage 9 is used for mounting the post-cut substrate 13, and the post-cut substrate 13 is a cut after the packaged substrate 2 is cut by the mandrels 11 a and 11 b; the cleaning unit 15 is used for cleaning the cutting table 9 After cutting substrate 13; drying section 16 for drying the cutting substrate 13 on the cutting table 9 moved from the cleaning section 15; and an intermediate chamber 17 provided between the cleaning section 15 and the drying section 16 between.

According to this configuration, the cutting device 1 includes a cleaning section 15 for cleaning the cut substrate 13, a drying section 16 for drying the cut substrate 13, and an intermediate chamber 17 provided in the cleaning section 15 and the drying section. Between 16. By providing the intermediate chamber 17, the cutting device 1 is configured so that the cutting table 9 does not pass under the cleaning chamber 24 during the drying process of the substrate 13 after cutting. Therefore, it is possible to prevent water droplets adhering to the inner wall or ceiling of the cleaning chamber 24 and the cleaning mechanism 25 from falling on the cut substrate 13.

According to this embodiment, the cutting device 1 includes spindles 11a and 11b for cutting the substrate 2 after the package, and a cutting table 9 for placing the substrate 13 after the cutting. A cut object obtained by cutting the substrate 2; and a cleaning and drying mechanism 14 that moves the cutting table 9 to clean and dry the cut substrate 13. The cleaning and drying mechanism 14 includes a cleaning section 15 for cleaning the cut substrate 13, a drying section 16 for drying the cut substrate 13, and an intermediate chamber 17 provided between the cleaning section 15 and the drying section 16. By providing an intermediate chamber 17 between the cleaning unit 15 and the drying unit 16, the cleaning and drying mechanism 14 is configured so that the substrate does not pass under the cleaning chamber 24 after cutting when the cutting substrate 13 is dried by the drying mechanism 29. As a result, it is possible to prevent water droplets adhering to the inner wall or ceiling of the cleaning chamber 24 and the cleaning mechanism 25 from falling onto the cut substrate 13. Therefore, it is possible to suppress the generation of stains and poor drying due to the drop of water droplets.

According to this embodiment, since the intermediate chamber 17 is provided between the cleaning unit 15 and the drying unit 16, compared with a structure without an intermediate chamber, it is possible to suppress the cleaning liquid 27 ejected from the cleaning mechanism 25 and the adhesion to the cleaning chamber 24 The water droplets on the inner wall and the mist generated in the cleaning chamber 24 enter the drying section 16 and can prevent the water droplets from falling on the cut object.

[Example 2]

(Structure of washing and drying mechanism)

The structure of the washing and drying mechanism according to the second embodiment used in the cutting device 1 will be described with reference to FIG. 5. The difference between the second embodiment and the first embodiment is that the structures of the cleaning section and the intermediate chamber are changed. The other configurations are the same as those of the first embodiment, and therefore descriptions thereof are omitted.

As shown in FIG. 5 (a), the cleaning and drying mechanism 32 includes a cleaning section 33 for cleaning the cut and cut substrate 13, and a drying section 16 for drying the cleaned and cut substrate 13; and The intermediate chamber 34 is provided between the washing section 33 and the drying section 16. The drying section 16 is the same as the drying section shown in Example 1. In plan view, the washing and drying mechanism 32 has a length L2 and a width W. The width W of the washing and drying mechanism 32 is the same as the width of the washing and drying mechanism 14 shown in the first embodiment. The length L2 of the washing and drying mechanism 32 is smaller than the length L1 of the washing and drying mechanism 14 shown in Example 1 (see (a) of FIG. 2). The cutting table 9 moves back and forth in the Y direction below the washing and drying mechanism 32.

As shown in FIG. 5 (b), the cleaning section 33 includes an intermediate chamber-side partition wall 35 provided on the intermediate chamber 34 side of the cleaning section 33, and a partition plate 36 extending from the intermediate chamber-side partition wall 35 toward the cleaning section. 33 sides tilt. The partition plate 36 is, for example, from the position on the intermediate-chamber-side partition wall 35 corresponding to the top of the top plate of the intermediate chamber 34 (the position of the height h2 when the lower end of the cleaning and drying mechanism 32 is used as a reference plane) toward the lower side of the cleaning unit 33 (the The lower end of the washing and drying mechanism 32 is a position at a height h1 when the reference surface is provided). In the intermediate-chamber-side partition wall 35 of the cleaning unit 33, the installation position, inclination angle, and length of the partition plate 36 can be arbitrarily set. The cleaning chamber 24 and the intermediate chamber 34 are separated by an intermediate chamber-side partition wall 35 and a partition plate 36 constituting the cleaning unit 33. By providing the partition plate 36, it is possible to prevent the cleaning liquid 27 ejected from the cleaning mechanism 25, water droplets adhering to the inner wall of the cleaning chamber 24, and mist generated in the cleaning chamber 24 from entering the intermediate chamber 34.

As shown in FIG. 5 (c), the ceiling plate 37 constituting the intermediate chamber 34 has a herringbone roof shape inclined from the center to both sides. In other words, the inner surface of the top plate, which is the lower surface of the top plate 37 of the intermediate chamber 34, has a shape inclined downward from both sides of the central portion. The central portion of the intermediate chamber 34 has a height of h2 with the lower end of the washing and drying mechanism 32 as a reference plane, and the side wall plate of the intermediate chamber 34 has a height of h1 with the lower end of the washing and drying mechanism 32 as a reference plane. Therefore, the intermediate chamber 34 is configured by a space surrounded by a ceiling plate 37 having a herringbone roof shape, a partition plate 36 provided in the cleaning section 33, and a side wall plate that configures the intermediate chamber 34 and the cleaning section 33, respectively.

As shown in FIGS. 5 (b) and 7 (a), the intermediate chamber 34 is configured by a space below the top plate 37 of the intermediate chamber 34 and a space below the partition plate 36 provided in the cleaning unit 33. Not only the space below the top plate 37 of the intermediate chamber 34 is a space where the intermediate chamber 34 is structured, but also the space provided below the partition plate 36 of the cleaning unit 33 is a space where the intermediate chamber 34 is structured. Therefore, in the Y direction of the washing and drying mechanism 32, the length d2 of the space below the top plate 37 (see FIG. 7 (a)) and the length d3 of the space below the partition plate 36 (see FIG. 7 (a)). The added length (d2 + d3) is the effective length of the intermediate chamber 34. Accordingly, when the cut substrate 13 is dried, the cutting table 9 can be reciprocated to a space formed below the partition plate 36. The distance that the cutting table 9 moves in the + Y direction can be increased in accordance with the length d3 (see FIG. 7 (a)) of the space formed below the partition plate 36 in the Y direction. Therefore, even if the length L2 (see FIG. 5 (a)) of the washing and drying mechanism 32 is set to be shorter than the length L1 (see FIG. 2 (a)) of the washing and drying mechanism 14, the cutting can be ensured below the intermediate chamber 34. The distance D (refer to FIG. 7 (a)) in which the cutting table 9 is reciprocated to dry the entire surface of the substrate 13 after cutting.

The washing and drying mechanism 32 has a structure in which a partition plate 36 is provided in the washing unit 33 to prevent the washing liquid 27 ejected from the washing mechanism 25 from entering the intermediate chamber 34 and water droplets attached to the inner wall of the washing chamber 24 from entering the intermediate chamber 34 and the mist generated in the cleaning chamber 24 enter the intermediate chamber 34. However, even when the partition plate 36 is provided in the cleaning unit 33, there is still a possibility that mist generated in the cleaning chamber 24 may enter the intermediate chamber 34.

Therefore, in order to prevent the mist entering the intermediate chamber 34 from adhering and condensing on the inner wall of the intermediate chamber 34 to become water droplets, the inner wall of the intermediate chamber 34 may be made a hydrophilic inner wall. The lower surface 38 of the top plate 37 constituting the intermediate chamber 34, that is, the inner surface of the ceiling, and the lower surface 39 of the partition plate 36 provided in the cleaning unit 33 can be formed with fine irregularities on the surface by, for example, sandblasting. The lower surface 38 of the top plate 37 and the lower surface 39 of the partition plate 36 may be roughened by sandblasting to impart hydrophilicity. Accordingly, even if the mist adhered to the lower surface 38 of the top plate 37 and the lower surface 39 of the partition plate 36 is condensed, it is possible to suppress the mist from falling into a large water droplet to the extent that it falls downward. In addition, since the water droplets on the lower surface 38 of the top plate 37 are more likely to fall on the cut object than the lower surface 39 of the partition plate 36, only the lower surface 38 of the top plate 37 may be roughened.

In addition, the ceiling plate 37 that configures the intermediate chamber 34 is shaped like a herringbone roof that slopes from the center to both sides. The partition plate 36 provided in the washing unit 33 is also inclined downward. Therefore, even if the mist adhering to the inner wall of the intermediate chamber 34 condenses into water droplets, the water droplets do not become large water droplets falling downward, but the water droplets easily flow downward along the slope of the top plate 37 and the partition plate 36. Therefore, it is possible to suppress water drops from falling on the substrate 13 after cutting.

In addition, a gas injection mechanism 40 for injecting air or nitrogen may be provided on the upper surface of the partition plate 36 provided in the cleaning section 33. The direction and angle of the ejected gas can be arbitrarily set. In addition, the gas injection mechanism 40 may have a structure capable of automatically changing the gas injection direction in the left-right or up-down direction. By providing the gas injection mechanism 40, it is possible to further suppress the cleaning liquid 27 ejected from the cleaning mechanism 25, water droplets adhering to the inner wall of the cleaning chamber 24, and mist generated in the cleaning chamber 24 from entering the intermediate chamber 34. Therefore, it is possible to further suppress the water droplets from adhering to the inner wall of the intermediate chamber 34.

In the washing and drying mechanism 32 shown in the second embodiment, the following four measures are taken. (1) An inclined partition plate 36 is provided in the cleaning section 33; (2) The ceiling plate 37 of the intermediate chamber 34 is shaped as a herringbone roof; (3) The lower surface 38 of the ceiling plate 37 of the intermediate chamber 34 and the cleaning plate 33 The lower surface 39 of the partition plate 36 of the portion 33 is roughened. (4) A gas injection mechanism 40 is provided on the upper surface of the partition plate 36. By these measures, it is possible to further suppress the drop of water droplets on the substrate 13 after cutting.

(Operation of cleaning and drying mechanism)

The operation of cleaning and drying the cut substrate 13 by the cleaning and drying mechanism 32 will be described with reference to FIGS. 6 to 7.

As shown in FIGS. 6A and 6B, in order to clean the cut substrate 13, a cutting mechanism 9 is used to move the cutting table 9 back and forth in the Y direction below the cleaning chamber 24 using a moving mechanism (not shown). When the cutting table 9 is partitioned by a partition plate 36 provided in the cleaning section 33 and is opened below the cleaning chamber 24, the cleaning liquid 27 is sprayed from the plurality of cleaning mechanisms 25 to the cut back substrate 13 to be cleaned. Cut the back substrate 13. As in Example 1, in order to clean the entire surface of the substrate 13 after cutting, the cutting table 9 is reciprocated in the Y direction from the S1 position to the S2 position by a predetermined distance D. The entire surface of the cut substrate 13 is cleaned by a plurality of cleaning mechanisms 25.

The cleaning chamber 24 and the intermediate chamber 34 are partitioned by an intermediate chamber-side partition wall 35 and a partition plate 36 constituting the cleaning unit 33. By providing the partition plate 36, it is possible to prevent the cleaning liquid 27 ejected from the cleaning mechanism 25 from entering the intermediate chamber 34, water droplets adhering to the inner wall of the cleaning chamber 24, and the mist generated in the cleaning chamber 24 Enter the middle chamber 34.

As shown in (a) and (b) of FIG. 7, in order to dry the cut substrate 13, a cutting mechanism 9 is used to reciprocate the cutting table 9 in the Y direction below the drying chamber 28 using a moving mechanism (not shown). As in Example 1, in order to dry the entire surface of the substrate 13 after cutting, the cutting table 9 is reciprocated by a predetermined distance D in the Y direction from the S3 position to the S4 position.

The intermediate chamber 34 is configured by a space below the top plate 37 of the intermediate chamber 34 and a space below the partition plate 36 provided in the washing unit 33. When the cut substrate 13 is dried, the cutting table 9 can be reciprocated to a space below the partition plate 36. That is, the cutting table 9 can be moved back and forth in the + Y direction in the range of the length d2 + d3 in the Y direction of the washing and drying mechanism 32, where the length d2 + d3 is the length d2 of the space below the top plate 37 and The length d3 of the space below the partition plate 36 is added up. By providing the partition plate 36 in the cleaning unit 33, it is possible to lengthen the effective length of the intermediate chamber 34 in the Y direction. Therefore, the reciprocating distance of the cutting table 9 can be increased below the intermediate chamber 34. Accordingly, even if the length of the cleaning and drying mechanism 32 is shortened, the distance D for reciprocating movement of the cutting table 9 can be ensured to dry the entire surface of the substrate 13 after cutting. Therefore, it is possible to suppress water drops from falling on the substrate 13 after cutting.

(Effect)

According to the present embodiment, the washing and drying mechanism 32 is provided with the partition plate 36 that is inclined from the intermediate-chamber-side partition wall 35 of the cleaning unit 33 to the cleaning unit 33 side. The cleaning chamber 24 and the intermediate chamber 34 are partitioned by the intermediate-chamber-side partition wall 35 and the partition plate 36 that structure the cleaning section 33. Thereby, the opening part below the washing | cleaning part 24 can be narrowed, and the effective space of the intermediate chamber 34 can be enlarged. Therefore, when the cut substrate 13 is dried, the reciprocating distance of the cutting table 9 in the intermediate chamber 34 can be increased. Therefore, it is possible to suppress water drops from falling on the substrate 13 after cutting. In addition, the length of the washing and drying mechanism 32 can be shortened.

According to the present embodiment, the washing and drying mechanism 32 is provided with the partition plate 36 that is inclined from the intermediate-chamber-side partition wall 35 of the cleaning unit 33 to the cleaning unit 33 side. This can prevent the cleaning liquid 27 ejected from the cleaning mechanism 25, the water droplets adhering to the inner wall of the cleaning chamber 24, and the mist generated in the cleaning chamber 24 from entering the intermediate chamber 34. Therefore, it is possible to suppress water droplets from adhering to the inner wall of the intermediate chamber 34. Therefore, it is possible to suppress water droplets from falling on the cut substrate 13 in the intermediate chamber 34.

According to the present embodiment, the ceiling plate 37 constituting the intermediate chamber 34 is formed into a herringbone roof shape inclined from the center to both sides. In other words, the ceiling inner surface of the intermediate chamber 34 has a shape inclined downward from both sides of the central portion. Even if the mist entering the intermediate chamber 34 condenses into water droplets, the water droplets can easily flow to both sides along the inner surface of the ceiling, that is, the top plate 37. Therefore, it is possible to suppress water droplets from falling on the cut substrate 13 in the intermediate chamber 34.

According to this embodiment, at least the inner surface of the ceiling is roughened to the inner wall of the intermediate chamber 34 to impart hydrophilicity. The lower surface 38 of the top plate 37 constituting the intermediate chamber 34 and the lower surface 39 of the partition plate 36 provided in the cleaning unit 33 are subjected to sandblasting to form fine irregularities on the surfaces. As a result, it is possible to suppress the mist adhered to the inner wall of the intermediate chamber 34 from becoming large water droplets. Therefore, it is possible to suppress water droplets from falling on the cut substrate 13 in the intermediate chamber 34.

According to the present embodiment, the gas injection mechanism 40 is provided on the upper surface of the partition plate 36 provided in the cleaning section 33. This can prevent the cleaning liquid 27 ejected from the cleaning mechanism 25, the water droplets adhering to the inner wall of the cleaning chamber 24, and the mist generated in the cleaning chamber 24 from entering the intermediate chamber 34. Therefore, it is possible to further suppress the water droplets from adhering to the inner wall of the intermediate chamber 34. Therefore, it is possible to further suppress the water droplets from falling on the cut substrate 13.

In each embodiment, a case where a cutting object having a rectangular (square) shape as a cutting object is cut is shown. It is not limited to this, and when cutting a cutting object having a substantially circular shape like a semiconductor wafer, the contents described so far can be applied.

In each embodiment, a case where a packaged substrate on which a wafer is mounted as a cutting target is cut is shown. The present invention is not limited to this, and when the following cutting objects, which are cutting objects other than the packaged substrate, are cut and singulated, the present invention can be applied. The first is a case of singulating a semiconductor wafer having a circuit element made of silicon or a compound semiconductor or a functional element such as MEMS (Micro Electro Mechanical Systems). The second method is to manufacture a chip resistor, a chip capacitor, a chip-type sensor, and a surface by singulating a ceramic substrate or a glass substrate with functional elements such as resistors, capacitors, sensors, and surface acoustic wave devices. The situation of products such as elastic wave devices. In both cases, a semiconductor wafer, a ceramic substrate, a glass substrate, or the like corresponds to a support member having built-in functional elements corresponding to a plurality of regions, respectively.

As described above, the cutting device of the above embodiment has a structure including a cutting mechanism for cutting a cutting object, and a table for placing a cutting object. The cutting object is provided by the cutting mechanism. The cutting object is cut; a cleaning section is used to clean the cuts on the worktable; a drying section is used to dry the cuts on the worktable moved from the cleaning section; and the intermediate chamber, It is provided between a washing part and a drying part.

According to this configuration, an intermediate chamber is provided between the washing section and the drying section. Accordingly, when the cut object is dried, the cut object can be prevented from passing under the washing section. Therefore, it is possible to suppress the water droplets from falling from the washing section onto the cut object.

Moreover, the cutting device of the said Example has the structure which has the partition plate inclined to the washing part side below the intermediate-chamber-side partition wall of a washing part.

According to this structure, by providing a partition plate in a washing | cleaning part, the effective space of an intermediate room is enlarged. This makes it possible to lengthen the moving distance of the table when the cut object is dried. Therefore, it is possible to suppress water drops from falling on the cut object.

In addition, the cutting device of the above embodiment has a structure in which a gas ejection mechanism for ejecting gas is provided on the upper surface of the partition plate.

According to this structure, the gas injection mechanism suppresses the cleaning liquid, water droplets, and mist from entering the intermediate chamber. Therefore, it is possible to suppress the drop of water droplets from the top plate of the intermediate chamber onto the cut object.

In addition, the cutting device of the above-mentioned embodiment has a structure in which the ceiling inner surface of the intermediate chamber is inclined downward from the center to both sides.

According to this structure, the inner surface of the ceiling of the intermediate chamber is inclined downward from the center to both sides. Even if the water droplets adhere to the inner surface of the ceiling, it is easy for the water droplets to flow to both sides along the inclination of the inner surface of the ceiling. Therefore, it is possible to suppress water drops from falling from the ceiling inner surface of the intermediate chamber onto the cut object.

In addition, the cutting device of the above embodiment has a structure in which at least the inner surface of the ceiling of the intermediate chamber is roughened.

According to this structure, fine unevenness is formed on the inner surface of the ceiling of the intermediate chamber. Thereby, the mist adhered to the ceiling inner surface of the intermediate chamber is prevented from becoming large water droplets. Therefore, it is possible to suppress water drops from falling from the ceiling inner surface of the intermediate chamber onto the cut object.

In addition, the cutting device of the above-mentioned embodiment has a structure in which the cleaning section includes a cleaning mechanism for cleaning the cut object, and the drying section includes a drying mechanism for drying the cut object.

According to this configuration, the cut object can be cleaned by the cleaning mechanism, and the cut object can be dried by the drying mechanism.

Further, in the cutting device of the above embodiment, the cutting target is a support member having a resin portion.

According to this configuration, the cutting target can be cut using the cutting mechanism, and the cutting target is formed by resin-molding the support member.

Further, in the cutting device of the above embodiment, the drying mechanism is configured to dry the cut object when the table moves at least below the drying section and the intermediate chamber. [00100] According to this configuration, when the table moves below the drying section and the intermediate chamber, the cut object is dried by the drying mechanism. Therefore, it is possible to suppress the water droplets from falling from the washing section onto the cut object. [00101] The present invention is not limited to the above-mentioned embodiments, and can be arbitrarily and appropriately combined to be changed or selectively adopted as needed without departing from the spirit of the present invention.

1‧‧‧ cutting device

2‧‧‧ Post-package substrate (cutting target)

3‧‧‧ Cut off supply mechanism

4‧‧‧ Cutting target placement section

5‧‧‧ delivery agency

6‧‧‧ alignment area

7‧‧‧ cut-off area

8‧‧‧ Clean and dry area

9‧‧‧ Cutting workbench (workbench)

10‧‧‧ Alignment Camera

11a, 11b‧‧‧ mandrel (cutting mechanism)

12a, 12b‧‧‧rotating blade

13‧‧‧ After cutting the substrate (cut object)

14, 32‧‧‧Cleaning and drying mechanism

15, 33‧‧‧ Cleaning Department

16‧‧‧ Drying section

17, 34‧‧‧ Intermediate Room

18‧‧‧ Inspection Workbench

19‧‧‧ delivery agency

20‧‧‧ Inspection Camera

21‧‧‧Qualified product tray

22‧‧‧Defective tray

23‧‧‧ Mobile Space

24‧‧‧Cleaning room

25‧‧‧cleaning agency

26‧‧‧ side partition wall

27‧‧‧Cleaning liquid

28‧‧‧ drying room

29‧‧‧ drying mechanism

30‧‧‧ side partition wall

31‧‧‧gas

35‧‧‧ side wall of middle chamber

36‧‧‧ divider

37‧‧‧Top plate

38‧‧‧ the lower surface of the roof (the inner surface of the ceiling)

39‧‧‧ lower surface of divider

40‧‧‧gas injection mechanism

A‧‧‧Supply Module

B‧‧‧ Cut-off module

C‧‧‧Check Module

P‧‧‧ Products

CTL‧‧‧Control Department

L1, L2‧‧‧ length

W‧‧‧Width

h1, h2, h3, h4‧‧‧ height

S1, S2, S3, S4‧‧‧ position

D‧‧‧distance

d1, d2, d3‧‧‧ length

FIG. 1 is a plan view showing a schematic configuration of a device in a cutting device according to the present invention.

Fig. 2 is a schematic view showing a washing and drying mechanism used in Example 1, (a) is a plan view, (b) is a cross-sectional view taken along the line A-A, and (c) is a cross-sectional view taken along the line B-B.

FIGS. 3 (a) to 3 (b) are schematic cross-sectional views illustrating an operation of cleaning a cut object using the washing and drying mechanism of the first embodiment.

FIGS. 4 (a) to 4 (b) are schematic cross-sectional views illustrating an operation of drying a cut object using the washing and drying mechanism of Example 1. FIG.

Fig. 5 is a schematic view showing a washing and drying mechanism used in Example 2, (a) is a plan view, (b) is a cross-sectional view taken along the line C-C, and (c) is a cross-sectional view taken along the line D-D.

FIGS. 6 (a) to 6 (b) are schematic cross-sectional views illustrating an operation of cleaning a cut object using the washing and drying mechanism of the second embodiment.

FIGS. 7 (a) to 7 (b) are schematic cross-sectional views showing an operation of drying the cut object using the washing and drying mechanism of Example 2. FIG.

Claims (8)

A cutting device includes: a cutting mechanism configured to cut a cutting object; a table configured to place a cutting object, the cutting object cutting the cutting object by the cutting mechanism; A cutting part configured to clean the cut object on the table; a drying part configured to dry the cut object on the table moved from the cleaning part; and an intermediate part The chamber is provided between the washing section and the drying section. The cutting device according to item 1 of the scope of patent application, wherein a partition plate inclined to the cleaning section side is provided below the partition wall on the intermediate chamber side of the cleaning section. The cutting device according to item 2 of the scope of patent application, wherein a gas injection mechanism for injecting gas is provided on the upper surface of the partition plate. The cutting device according to any one of claims 1 to 3, wherein a ceiling inner surface of the intermediate chamber has a shape inclined downward from both sides of the central portion. The cutting device according to any one of claims 1 to 3, wherein at least an inner surface of a ceiling of the intermediate chamber is roughened. The cutting device according to any one of claims 1 to 3, wherein the cleaning section has a cleaning mechanism configured to clean the cut object, and the drying section is configured to clean the cut object. A drying mechanism that performs drying. The cutting device according to any one of claims 1 to 3, wherein the cutting target is a support member having a resin portion. The cutting device according to item 6 of the patent application scope, wherein the drying mechanism dries the cut object when the table moves at least below the drying section and the intermediate chamber.