WO2009113236A1 - Procédé et appareil pour la découpe de substrat - Google Patents

Procédé et appareil pour la découpe de substrat Download PDF

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Publication number
WO2009113236A1
WO2009113236A1 PCT/JP2009/000472 JP2009000472W WO2009113236A1 WO 2009113236 A1 WO2009113236 A1 WO 2009113236A1 JP 2009000472 W JP2009000472 W JP 2009000472W WO 2009113236 A1 WO2009113236 A1 WO 2009113236A1
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WO
WIPO (PCT)
Prior art keywords
cutting
substrate
molded
molded substrate
package
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Application number
PCT/JP2009/000472
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English (en)
Japanese (ja)
Inventor
東秀和
岩田康弘
白井克昌
片岡昌一
木原源
望月啓人
Original Assignee
Ｔｏｗａ株式会社
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Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Publication of WO2009113236A1 publication Critical patent/WO2009113236A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Definitions

  • the present invention relates to a substrate cutting method for cutting a molded substrate in which a plurality of required electronic parts such as ICs are collectively sealed with a resin material into individual packages (pieces) and an improvement of the apparatus. It is.
  • a required portion of a molded substrate is cut by a cutting mechanism (cutting mechanism) such as a blade (circular rotary cutting blade), so that each individual A package is formed, and this cutting is performed as follows.
  • a cutting mechanism such as a blade (circular rotary cutting blade)
  • the molded substrate 1 is supplied and set on the mounting surface of a cutting table (mounting rotary table for cutting) with its ball surface 1a facing up and fixed by suction.
  • a cutting line is set on the ball surface (substrate surface) 1a of the molded substrate 1 (refer to FIG. 6A for the molded substrate 1 and FIG. 6B for the package 5).
  • the alignment mark (alignment mark) provided on the ball surface 1a of the molded substrate 1 is detected by the detection mechanism, and the required cutting line 4 is set.
  • this detection and setting is referred to as alignment setting.
  • the cutting table on which the molded substrate 1 is placed is moved to the substrate cutting position, and at the substrate cutting position, the cutting line set on the molded substrate 1 by the cutting mechanism while injecting cooling water to the cutting location. Then, the molded substrate 1 can be cut along to form individual packages 5 (1c) to be cut substrates (package assemblies). At this time, a cutting kerf having a required groove width (a cutting groove 58 having a required width) is formed at the position of the cutting line 4 on the substrate by the cutting mechanism. Next, the cutting table on which the cut substrate 5 (1c) is placed is moved back to the substrate mounting position, and the groove width (cutting groove 58) of the cut kerf formed on the cut substrate 5 (1c) is returned. ) Is kerf-checked by the detection mechanism. Conventionally, at the substrate mounting position in the substrate cutting apparatus, the alignment setting by the alignment mark and the kerf check of the width of the cutting groove 58 are performed by one detection mechanism.
  • an object of the present invention is to provide a substrate cutting method and apparatus capable of improving product (package) productivity.
  • the substrate cutting method according to the present invention for solving the technical problem is as follows. Using the substrate cutting apparatus, first, the molded substrate is placed on the cutting table at the substrate mounting position of the above-described apparatus and moved to the substrate cutting position of the above-mentioned apparatus, and then at the above-described substrate cutting position.
  • a substrate cutting method in which a package is formed by cutting with a cutting mechanism in a state where the above-described formed substrate is placed on the above-described cutting table, First, at the substrate mounting position described above, by setting the alignment of the molded substrate described above with an alignment mechanism, a cutting line is set on the molded substrate described above, Next, the cutting groove formed by cutting the molded substrate along the cutting line by the cutting mechanism at the substrate cutting position is inspected by a kerf check mechanism.
  • a method for cutting a substrate according to the present invention for solving the above technical problem is as follows. Using the substrate cutting apparatus, first, the molded substrate is placed on the cutting table at the substrate mounting position of the above-described apparatus and moved to the substrate cutting position of the above-mentioned apparatus, and then at the above-described substrate cutting position.
  • a substrate cutting method in which a package is formed by cutting with a cutting mechanism in a state where the molded substrate is placed on the cutting table described above, In the above-described substrate placement position, by setting the alignment of the molded substrate described above with an alignment mechanism, a step of setting a cutting line on the molded substrate described above; By cutting the molded substrate with the cutting mechanism described above along the cutting line of the molded substrate, the cutting groove corresponding to the cutting line described above is formed on the molded substrate.
  • the above-described substrate cutting position performing a step of inspecting the cutting groove formed in the above-described molded substrate with a kerf check mechanism, Cutting the molded substrate along the cutting line by moving the cutting mechanism relative to the cutting table in the cutting direction during the cutting process of the cutting line described above;
  • the above-described cutting groove inspection step the above-described cutting groove is inspected by the above-described kerf check mechanism by moving the above-described kerf check mechanism relative to the cutting table in a direction opposite to the cutting direction described above. It is characterized by doing.
  • a method for cutting a substrate according to the present invention for solving the technical problem is as follows. Using the substrate cutting apparatus provided with two cutting tables, the two cutting tables described above are moved from the substrate mounting position provided in the apparatus described above to the substrate cutting position, respectively, In each case, first, the molded substrate is placed on the cutting table at the substrate mounting position, and then the molded substrate is placed on the cutting table at the substrate cutting position.
  • a method of cutting a substrate that forms a package by cutting with a cutting mechanism In each of the above-described cutting tables, first, in the above-described substrate mounting position, by setting the alignment of the molded substrate described above with an alignment mechanism, a cutting line is set on the molded substrate described above, Next, in the above-described substrate cutting position, a step of inspecting a cutting groove formed by the above-described cutting mechanism with a kerf check mechanism is performed.
  • a method for cutting a substrate according to the present invention for solving the above technical problem is as follows.
  • each of the cutting tables is set to the eccentric position of the cutting table as a center of rotation. It is characterized by being rotated separately at an angle.
  • a substrate cutting apparatus for solving the above technical problem is as follows.
  • Reciprocating means for reciprocating the cutting table between the substrate mounting position and the substrate cutting position, and a substrate cutting apparatus comprising: In the above-described substrate mounting position, while providing an alignment mechanism for setting the alignment of the molded substrate mounted on the cutting table described above, In the above-described substrate cutting position, a kerf check mechanism for inspecting a cutting groove formed by cutting the above-described molded substrate with the above-described cutting mechanism is provided.
  • a substrate cutting apparatus for solving the above technical problem is as follows. It is characterized by comprising an integrated cutting inspection means in which the cutting mechanism and the kerf check mechanism described above are integrated.
  • a substrate cutting apparatus for solving the above technical problem is as follows. While providing an integrated cutting inspection means that integrates the cutting mechanism and the kerf check mechanism described above, The cutting mechanism and the kerf check mechanism in the integrated cutting inspection means described above are arranged along the cutting line of the molded substrate cut by the cutting mechanism.
  • a substrate cutting apparatus for solving the above technical problem is as follows. Two cutting tables described above are provided.
  • a substrate cutting apparatus for solving the above technical problem is as follows.
  • a rotation mechanism is provided for rotating the above-described cutting table at a required angle with the eccentric position as the center position of rotation.
  • a debris removal mechanism is provided for removing the debris adhering to the package surface by spraying a two-fluid mixture mixed with air and water onto the surface of the package formed by cutting with the aforementioned cutting mechanism. It is characterized by being configured.
  • the present invention adopts a twin table (two cutting tables) system in order to improve the productivity of a product (package).
  • the present invention is a substrate cutting apparatus adopting a twin table system, in the substrate mounting position, set the alignment with the alignment mark of the molded substrate placed on one of the two cutting tables, And (almost) at the same time, the width of the cutting groove formed on the molded substrate placed on the other cutting table at the substrate cutting position is kerf-checked, so that alignment setting and kerf-check are performed (almost) simultaneously.
  • the number of products (packages) produced per hour can be improved.
  • the present invention is configured such that a cut substrate (individual package) subjected to kerf check can be cleaned by a cleaning section provided between the substrate cutting position and the substrate mounting position.
  • the present invention can efficiently cut a molded substrate and improve the productivity of a product (package).
  • this invention is a structure using the integrated cutting
  • the present invention since the present invention is configured to kerf-check the width of this one cutting groove immediately after forming one cutting groove, the time for the relative movement of the cutting mechanism.
  • the time for cutting the molded substrate can be shortened. Therefore, as shown in the conventional example, the present invention shortens the time for cutting the formed substrate as described above, compared to the configuration in which all the cutting grooves are formed and then the widths of all the cutting grooves are inspected as shown in the conventional example. Therefore, the productivity of the product (package) is improved.
  • FIG. 1 is a schematic plan view schematically showing a substrate cutting apparatus according to the present invention.
  • FIG. 2 is an enlarged schematic plan view schematically showing an enlarged main part (package cutting unit) in the substrate cutting apparatus shown in FIG.
  • FIG. 3 (1) is an enlarged schematic front view schematically showing an enlarged main part of the substrate cutting apparatus (package cutting unit) shown in FIG. 2, and FIG. 3 (2) is shown in FIG. 3 (1).
  • It is an expansion schematic front view which expands and shows roughly the cutting mechanism (blade) and kerf check mechanism in the device principal part shown.
  • FIG. 4 is an enlarged schematic longitudinal sectional view schematically showing an enlarged main part of the substrate cutting apparatus (package cutting unit) shown in FIG. 5 (1), FIG. 5 (2), and FIG.
  • FIG. 5 (3) are enlarged schematic front views for explaining a method using the cutting mechanism (blade) and the kerf check mechanism shown in FIG. 3 (2).
  • FIG. 5 (1) shows a state before the substrate is cut with the blade
  • FIG. 5 (2) shows a state when the substrate is cut with the blade
  • FIG. 5 (3) shows a state when the kerf check mechanism is used.
  • Yes. 6 (1) is a schematic perspective view schematically showing a molded substrate used in the present invention
  • FIG. 6 (2) shows a package formed by cutting the molded substrate shown in FIG. 6 (1). It is a schematic perspective view.
  • FIG. 1 and 2 show a substrate cutting apparatus according to the present invention.
  • 3 (1) and 3 (2) show an integrated cutting inspection means integrated with the cutting mechanism and the kerf check mechanism (kerf inspection mechanism) according to the present invention.
  • FIG. 4 shows an integrated cutting inspection means (calf check mechanism) according to the present invention.
  • FIGS. 5 (1), 5 (2), and 5 (3) show a cutting state and a kerf check state performed by the integrated cutting inspection means according to the present invention.
  • FIG. 6 (1) is a molded substrate (cut substrate) used in the present invention
  • FIG. 6 (2) is a package cut by the substrate cutting apparatus according to the present invention.
  • the molded substrate 1 is configured such that a ball surface (substrate surface) 1a and a mold surface 1b which is the opposite surface are provided as surfaces. Further, the molded substrate 1 is configured by being provided with a substrate 2 and a resin molded body 3 provided on the mold surface (resin surface) 1a side of the molded substrate 1 (substrate 2). A cutting line 4 is set on the ball surface (substrate surface) 1a side of the substrate 1 (substrate 2).
  • a cutting groove having a required width corresponding to the cutting line 4 (a cutting kerf having a required groove width) is formed on the ball surface 1 a of the molded substrate 1. ) Is formed.
  • the package 5 formed by cutting the cutting line 4 of the molded substrate 1 is separated from the ball surface 5a and the surface opposite to the ball surface 5a. And a mold surface 5b.
  • the package 5 includes a substrate portion 6 and a resin portion 7 provided on the mold surface 5b side of the package 5 (substrate portion 6).
  • a ball electrode 8 may be formed on the ball surface 5a (1a) side of the substrate portion 6 (substrate 2). Also, in FIG.
  • an assembly of individual packages 5 (appearance is the same size as the molded substrate 1), which becomes the cut substrate 1c cut and separated from the molded substrate 1, is denoted by reference numeral 5 ( 1c). Therefore, as will be described later, individual packages 5 (1c) can be formed by cutting the molded substrate 1 using the substrate cutting device (9) according to the present invention.
  • 4a is a long-side cutting line (cut in the first direction) corresponding to the long side of the rectangular shaped substrate 1 in a parallel state
  • 4b is a short side. It is a cutting line in the short side direction corresponding to the parallel state (cutting part in the second direction).
  • substrate 1 is set to arbitrary directions, for example, various directions (for example, 1st Or the second direction).
  • a substrate cutting apparatus 9 includes a substrate loading unit A for loading a molded substrate 1 and a molded substrate 1 transferred from the substrate loading unit A. Inspection of package cutting unit B to be cut (separated) into package 5 (cut substrate 1c), and individual package 5 cut by substrate cutting unit B to be visually inspected and classified into good products and defective products The unit C and a package accommodation unit D for accommodating the packages inspected and sorted by the package inspection unit C into good and defective products in trays.
  • the molded substrate 1 loaded in the substrate loading unit A is first transferred to the substrate cutting unit B and cut into individual packages 5, and then the cut individual packages 5 are converted into package inspection units. While being inspected and selected by C, the package 5 can be separately accommodated as a good product and a defective product by the package accommodation unit D.
  • the substrate cutting apparatus 9 according to the present invention is configured such that the units A, B, C, and D described above can be detachably connected in series in this order and installed. ing.
  • substrate cutting device 9 which concerns on this invention it is comprised so that each unit A * B * C * D can be connected detachably with the connector 10, for example.
  • 9a is a front surface of the device
  • 9b is a rear surface of the device.
  • the substrate cutting unit B includes a substrate alignment mechanism 11 that aligns the molded substrate 1 in a required direction and a substrate cutting mechanism 12 that cuts the molded substrate 1. It is provided and configured. Therefore, first, the molded substrate 1 supplied from the substrate loading unit A side is aligned in a required direction by the substrate alignment mechanism unit 11 and supplied to the substrate cutting mechanism unit 12, and then the substrate cutting mechanism. The molded substrate 1 can be cut by the portion 12.
  • the substrate cutting device 9 (substrate cutting unit B) according to the present invention employs a twin table (two cutting tables 17) system.
  • the substrate alignment mechanism 11 includes a substrate supply table 13 to which the molded substrate 1 is supplied from the substrate loading unit A, and the molded substrate 1 supplied to the substrate supply table 13. And a substrate rotation aligning means 14 for supplying and setting the formed substrate 1 rotated and aligned at a required angle (for example, 90 degrees) and aligned in a required direction to the substrate cutting mechanism 12 side.
  • a required angle for example, 90 degrees
  • the molded substrate 1 is first supplied and set from the substrate loading unit A to the substrate supply table 13, and then the molded substrate 1 is engaged from the substrate supply table 13 by the substrate rotation alignment means 14.
  • the molded substrate 1 is arranged so as to be aligned in a required direction and supplied to the substrate cutting mechanism 12 side by being lifted up and rotated at a required angle.
  • the substrate cutting mechanism unit 12 has an individualization line that is a production line in the cutting apparatus 9 (substrate cutting unit B) for substrate cutting (substrate individualization).
  • the substrate cutting mechanism unit 12 has an individualization line that is a production line in the cutting apparatus 9 (substrate cutting unit B) for substrate cutting (substrate individualization).
  • these two sets of individualized lines are arranged in parallel with the Y direction, and the arrangement positions thereof substantially coincide with a moving area 26 of the cutting table 17 described later.
  • the first individualized line (movement of the first cutting table 17 a) is on the left side.
  • a set of areas 26a) is arranged, and a set of second singulated lines (moving area 26b of the second cutting table 17b) is arranged on the right side.
  • the substrate cutting mechanism 12 includes the substrate mounting means 15 and the substrate mounting means 15 in each of the first and second singulation lines (the moving area 26 of the cutting table 17).
  • Reciprocating means 16 for reciprocating and guiding in the Y direction is provided.
  • the substrate cutting mechanism 12 is provided with a substrate mounting position 24 and a substrate cutting position 25, and the reciprocating means 16 moves the substrate mounting means 15 (cutting table 17) to Y. It is configured to be able to reciprocate in the direction.
  • the first substrate mounting means 15a (first cutting table 17a) is moved between the substrate mounting position 24 and the substrate cutting position 25 by the first reciprocating movement means 16a. It is comprised so that can be reciprocated.
  • the second substrate placing means 15b (second cutting table 17b) is moved between the substrate placing position 24 and the substrate cutting position 25 by the second reciprocating means 16b. It is comprised so that can be reciprocated.
  • the constituent members related to the singulation line (moving region 26) in the substrate cutting mechanism 12 the subscript “a” is attached to the first and the subscript “b” is attached to the second. Is.
  • the substrate placing means 15 (the first substrate placing means 15a and the second substrate placing means 15b) has the molded substrate 1 with the mold surface 1b on the lower surface.
  • a cutting table (mounting rotary table for cutting) 17 (17a, 17b) to be placed is provided with the substrate surface 1a being the upper surface.
  • the molded substrate 1 placed on the cutting table 17 (17a, 17b) is sucked and fixed to the cutting table 17 (first cutting table 17a, second cutting table 17b).
  • a suction hole 51 (first suction hole 51a, second suction hole 51b) and a vacuuming mechanism 52 (first vacuuming mechanism 52a, second vacuuming mechanism 52b) such as a vacuum pump are provided. It is configured. Further, as shown in FIG. 4, the mounting surface 20 (first table mounting surface 20a, second table mounting surface 20b) of the cutting table 17 is cut with a blade (rotary cutting blade) described later. Table grooves 53 (first table grooves 53a and second table grooves 53b) corresponding to the mechanisms (first cutting mechanism 28 and second cutting mechanism 29) are provided. Moreover, as shown in FIG.
  • the mounting surface of the cutting table is located at the position of the cutting line 4 (4a, 4b) set on the molded substrate 1 supplied and set to the table mounting surface 20 (20a, 20b).
  • 20 first table placement surface 20a, second table placement surface 20b
  • the molded substrate 1 aligned by the rotary alignment means 14 on the table mounting surface 20 (20a, 20b) of the cutting table 17 (17a, 17b) is cut into the cutting line 4 (4a) of this molded substrate 1.
  • the molded substrate 1 can be adsorbed and fixed on the table mounting surface 20 (20a, 20b) of the cutting table 17 (17a, 17b) on the mold surface 1b side by vacuuming and vacuuming. It is configured.
  • the cutting table 17 (17a, 17b) is an eccentric position set on the mounting surface 20 (20a, 20b) of the cutting table 17 (17a, 17b).
  • Rotation mechanism that rotates (eccentric rotation) the cutting table 17 (17a, 17b) at a required angle (for example, at an angle of 90 degrees) with 21 (21a, 21b) as the center of rotation (Not shown) is provided.
  • the rotation position causes the eccentric position 21 (21a, 21b) to be the center of rotation. It is configured so that it can be rotated in a required direction (eccentric rotation) at a required angle (as an axial center position of the rotary shaft).
  • the eccentric position 21 (21a, 21b) on the mounting surface 20 (20a, 20b) of the cutting table 17 is set as the rotation center position.
  • the eccentric position 21 (21a, 21b) of the cutting table 17 (17a, 17b) is a position excluding the central position on the mounting surface 20 (20a, 20b) of the cutting table 17 (17a, 17b).
  • 20 (20a, 20b) can be set on a straight line formed by connecting the midpoints of the short sides and parallel to the long sides (except for the center position of the table mounting surface).
  • the first cutting table 17a and the second cutting table 17b are configured such that their long side directions are parallel to the Y direction.
  • the molded substrate 1 placed on the first cutting table 17a and the molded substrate 1 placed on the second cutting table 17b are in a state in which the long side direction is parallel to the Y direction. It is comprised so that it may become.
  • the first cutting table 17a and the second cutting table 17b are adjacent to each other, and are configured to have a minimum distance 33 between adjacent positions. In this state, the first cutting table 17a and the second cutting table 17b can reciprocate between the substrate placement position 24 and the substrate cutting position 25 without colliding (interfering) with each other.
  • the 1st cutting table 17a and the 2nd cutting table 17b are provided in the position which cannot be arrange
  • the first cutting table 17a and the second cutting table 17b are configured to be adjacent to each other and at the same time so as not to rotate with the eccentric position as the rotation center position, and the cutting tables 17 (17a and 17b) Is configured to be able to rotate so as not to collide (interfere).
  • the first cutting table 17a (second cutting table 17b) is in a single state at the substrate cutting position 25, and further in a state where the second cutting table 17b is not adjacent (for example, the second cutting table 17b).
  • the eccentric position 21a can be rotated at a required angle around the center of rotation. Therefore, as described above, since the first cutting table 17a and the second cutting table 17b are arranged close to each other and at the minimum interval 33 of the proximity position, (for example, at the center position of the cutting table). Compared with a device having a center position of rotation, the overall size of the substrate cutting device can be reduced.
  • a vertical wall-shaped bellows member 31 (31a, 31b) that protects the means 16 (16a, 16b) is provided to be extendable and contractible.
  • a cleaning unit 30 is provided for cleaning and drying.
  • the molded substrate 1 (or individual package 5) is placed in a state where the vertical wall-shaped bellows member 31 (31a, 31b) is expanded or contracted.
  • the cut table 17 (17a, 17b) can be reciprocated, and the individual package 5 (1c) cut at the substrate cutting position 25 can be cleaned and dried in the cleaning unit 30. Therefore, the reciprocating means 16 (16a, 16b) can be protected by the longitudinal wall-shaped bellows member 31 (31a, 31b) that expands or contracts.
  • an alignment mark (alignment mark) provided on the molded substrate 1 (ball surface 1a) placed on the cutting table 17 (17a, 17b) is detected at the substrate placement position 24 in the substrate cutting mechanism section 12.
  • (one) alignment mechanism 27 for setting (imaginarily) the cutting line 4 (4a, 4b) is provided.
  • the substrate cutting mechanism 12 is provided with an alignment reciprocating mechanism 54 that reciprocates the alignment mechanism 27 in the X direction, Y direction, and Z direction (vertical direction) in the apparatus 9 (substrate cutting unit B). It is configured. That is, by moving the alignment mechanism 27 with the alignment reciprocating mechanism 54 and scanning, the molded substrates 1 placed on the two cutting tables 17 (17a, 17b) can be set for alignment.
  • the cutting line 4 (cutting part) can be set to the molded substrate 1 separately. Accordingly, the molded substrate 1 placed on the first cutting table 17a and the molded substrate 1 placed on the second cutting table 17b are respectively set to be aligned and the cutting lines 4 (4a, 4b) are set. Can be set.
  • the molded substrate 1 placed on the cutting table 17 (17 a, 17 b) is placed on the cutting line 4 at the substrate cutting position 25 in the substrate cutting mechanism 12.
  • Two cutting mechanisms (cutting mechanisms) having blades (circular rotary cutting blades) or the like that are cut along, that is, the first cutting mechanism 28 and the second cutting mechanism 29 are cutting means for the molded substrate 1. Is provided and configured. That is, the first cutting mechanism 28 is configured with the first blade 63, and the second cutting mechanism 29 is configured with the second blade 64. Further, the first cutting mechanism 28 and the second cutting mechanism 29 are provided with the first blade 63 and the second blade 64 facing each other at a predetermined interval (the blade surfaces are in parallel). Is configured.
  • the axial direction of the spindle shaft that rotates these blades 63 and 64 separately is configured to be parallel to each other in the X direction.
  • the first cutting mechanism 28 and the second cutting mechanism 29 are separated by reciprocating them both in the X direction, (relatively) in the Y direction, and in the Z direction (up and down direction).
  • a mechanism reciprocating mechanism 55 is provided.
  • the first cutting mechanism 28 is configured with a first sliding connection member 60
  • the second cutting mechanism 29 is configured with a second sliding connection member 61. Yes.
  • the sliding connection member 60 attached to the first cutting mechanism 28 having the first blade 63 by the reciprocating mechanism 55 of the cutting mechanism that is, the first cutting mechanism 28 in the X direction (relative It is configured so that it can be reciprocated in the Z direction (up and down direction) in the Y direction.
  • the reciprocating mechanism 55 of the cutting mechanism moves the second sliding connecting member 61 attached to the second cutting mechanism 29 having the second blade 64, that is, the second cutting mechanism 29 in the X direction. , (Relatively) can be moved back and forth in the Z direction (up and down direction) in the Y direction.
  • first blade 63 and the second blade 64 are moved by moving the first cutting mechanism 28 and the second cutting mechanism 29 separately in the X direction by the reciprocating mechanism 55 of the cutting mechanism. It is comprised so that it can set suitably at a required space
  • the first cutting mechanism 28 (or the second cutting mechanism 29) is provided with a cooling water injection mechanism 67 that injects cooling water onto the blade 63 (64).
  • the cooling water injection mechanism 67 is configured by providing a circular cooling pipe 68 at a side position of the blade 63, and on the peripheral side surface of the circular cooling pipe 68. A required number of injection holes (not shown) are formed. Therefore, when the molded substrate 1 is cut along the cutting line 4, the cooling water is injected from the injection holes of the cooling pipe 68 in the cooling water injection mechanism 67 onto the blade 63 (circular side surface thereof). It is comprised so that it can cool.
  • the first cutting mechanism 28 (or the second cutting mechanism 29) is provided with a cutting water injection mechanism 69 that injects cutting water onto the blade 63 (64).
  • a cutting water injection mechanism 69 is provided on the device front surface 9a side of the blade 63 (along the cutting direction of the blade 63). Therefore, when the molded substrate 1 is cut along the cutting line 4, the cutting water spray mechanism 69 can spray the cutting water onto the blade 63 (the cutting edge).
  • the molded substrate 1 is cut by the cutting mechanism 28 and the cutting mechanism 29 (blades 63 and 64), foreign matters such as broken materials (cutting chips) are generated on the molded substrate 1 (package 5).
  • This broken material (foreign matter) tends to adhere and remain on the surface of the package 5 (for example, the ball surface 5a), and the broken material may remain attached to the surface of the package 5 even after washing with cleaning water. Therefore, it is required to efficiently remove the broken material from the surface (5a) of the package 5 after cleaning the package 5. That is, the first cutting mechanism 28 (or the second cutting mechanism 29) is generated when the molded substrate 1 is cut by the blade 63 (64) along the cutting line 4, and is generated on the surface (5a) of the package 5.
  • a debris removal mechanism (broken material blow-off mechanism) 70 removes the debris remaining on the gas) by blowing it off with a gas-liquid two-fluid mixture (water containing a large number of air bubbles) that is a mixture of air and water. It is provided and configured.
  • the broken material removal mechanism 70 is provided on the apparatus front surface 9 a side of the blade 63, and the broken material removal mechanism 70 is disposed between the blade 63 and the cutting water injection mechanism 69. It is provided and sandwiched between the two. That is, the cutting water injection mechanism 69 and the broken material removal mechanism 70 are provided in this order from the blade 63 side along the cutting direction of the blade 63 (in the Y direction). Therefore, the broken material (foreign matter) generated when the molded substrate 1 is cut by the blade 63 along the cutting line 4 can be removed by being blown off by the broken material removing mechanism 70.
  • a cutting groove 58 having a required width 57 corresponding to the cutting line 4. (Cutting groove) can be formed.
  • the cutting groove 58 having a required width 57 formed on the ball surface 1a in the molded substrate 1 (cut substrate 1c) is viewed in a plane, it is a single line in the Y direction.
  • the substrate cutting mechanism 12 has a groove width of a cutting groove 58 formed by cutting the molded substrate 1 along the cutting line 4.
  • a kerf check mechanism (calf inspection mechanism) 59 for inspecting 57 is provided. That is, by using the kerf check mechanism 59, the groove width 57 of the cutting groove 58 that forms one groove line in the Y direction formed on the ball surface 1a of the molded substrate 1 can be scanned and inspected. It is configured. Therefore, the size of each package 5 (length and width) formed by cutting the molded substrate 1 can be accurately set to a required length, and each package can be formed.
  • the kerf check mechanism 59 can inspect the groove width 57 of the cutting groove 58 and can inspect the shape of the cutting groove (kerf) 58, for example, the chipping state of the cutting groove 58. is there. Therefore, the kerf check mechanism 59 can check a package in which chipping or the like is generated in the shape of the cutting groove 58 (that is, in the shape of the package 5), and can efficiently remove the package, so that a high-quality and highly reliable product ( Individual packages).
  • the kerf check mechanism 59 has a foreign substance such as dust attached to the surface of each package 5 by pumping compressed air to the surface of the cut substrate 1C (individual package 5) to be inspected by the kerf check mechanism 59.
  • An air blow mechanism 71 that blows off the air is provided. That is, in the example shown in FIG. 3B, the air blow mechanism 71 is provided on the apparatus front surface 9a side of the kerf check mechanism 59. Accordingly, the compressed air is pumped to the surface of the cut substrate 1c (5) by the air blow mechanism 71, so that foreign matters such as dust adhering to the surface of the package 5 (for example, the ball surface 5a) are ejected and removed. Can do.
  • a kerf check mechanism 59 is provided via a sliding connecting member 60 at a position on the front surface 9a side. Further, as the installation position of the kerf check mechanism 59, along the cutting groove 58 (cutting line 4) formed by cutting the molded substrate 1 along the cutting line 4 with the first blade 63 (Y direction). (Along a straight line extending in the direction).
  • the first cutting mechanism 28 and the kerf check mechanism 59 are integrated by the sliding connection member 60 in a state where the first cutting mechanism 28 and the kerf check mechanism 59 are arranged along the cutting line 4 (cutting groove 58) of the molded substrate 1.
  • the cutting inspection means 62 is formed. As shown in FIG. 3B, the rotation direction of the first blade 63 of the first cutting mechanism 28 is clockwise in the figure.
  • the integrated cutting inspection means 62 is operated by the reciprocating mechanism 55 of the cutting mechanism in the X direction, the Y direction (the cutting table 17 side reciprocates), and the Z direction (vertical direction). ) Can be reciprocated. Therefore, the first cutting mechanism 28 in the integrated cutting inspection means 62 cuts the cutting line 4 formed on the molded substrate 1 to form a cutting groove 58 having a required width 57 corresponding to the cutting line 4. It is comprised so that it can form.
  • the positions of the first cutting mechanism 28 and the kerf check mechanism 59 in the integrated cutting inspection means 62 are, for example, as shown in FIG. It can be arranged on the cutting line 4 (cutting groove 58) of the molded substrate 1 cut by 28 (blade 63) (on the Y direction). Therefore, when the cutting table 17 on which the molded substrate 1 is placed is reciprocated in the Y direction (in the direction in which the cutting line 4 extends), the first cutting mechanism 28 and the kerf check mechanism 59 are the same. It will reciprocate relative to the cutting table 17 along a straight line (the cutting line 4 or the cutting groove 58).
  • the integrated cutting inspection means 62 is moved relative to the cutting table 17 from the apparatus back surface 9b side to the apparatus front surface 9a side (by moving relatively in the forward direction), so that the integrated cutting is performed.
  • the cutting line 4 can be cut in the Y direction, which is the cutting direction 65, by the first cutting mechanism 28 (blade 63) in the inspection means 62.
  • the integrated cutting inspection means 62 is moved relative to the cutting table 17 from the apparatus front surface 9a side to the apparatus back surface 9b side (relative to the return direction, which is opposite to the forward direction).
  • the cutting groove 58 corresponding to the cutting line 4 can be inspected by the kerf check mechanism 59 in the integrated cutting inspection means 62. Therefore, the kerf check mechanism 59 in the integrated cutting inspection means 62 can inspect (kerf check) the width 57 of the cutting groove 58 formed corresponding to the cutting line 4. Further, as described above, since the present invention can efficiently perform the cutting of the single cutting line 4 and the kerf check, the integrated cutting inspection means 62 (the first cutting mechanism 28 and the kerf check). The time for the mechanism 59) to move relative to the cutting table 17 can be reduced, and the time for cutting the molded substrate 1 can be shortened. For this reason, since the molded substrate 1 can be efficiently cut into the individual packages 5, the number of products produced per hour can be improved.
  • the cutting table 17 (17a, 17a) for the integrated cutting inspection means 62, the cutting mechanisms 28, 29, and the kerf check mechanism 59 is described. (Refer to FIG. 5 (1), FIG. 5 (2), and FIG. 5 (3)). That is, as described above, the cutting table 17 (17a, 17a) is configured to reciprocate in the Y direction by the reciprocating means 16 (16a, 16b).
  • the first cutting mechanism 28 and the second cutting mechanism 29 are moved separately from each other in the cutting direction 65, that is, in the direction from the apparatus back surface 9b side to the apparatus front surface 9a side. It can be set to the state moved automatically. Further, for example, the first cutting mechanism 28 (including the kerf check mechanism 59) and the second cutting mechanism 29 are not moved in the Y direction, and the cutting table 17 (17a, 17b) is moved in the Y direction.
  • the first cutting mechanism 28 (calf check mechanism 59) and the second cutting mechanism 29 are moved in a direction 66 opposite to the cutting direction 65, respectively, by moving from the apparatus rear surface 9b side to the apparatus front surface 9a side. That is, it can be set to a state in which it is relatively moved in the direction from the device front surface 9a side to the device back surface 9b side.
  • the cutting table 17 (17a, 17b) substantially reciprocates in the Y direction so that the integrated cutting inspection means 62 performs cutting and inspection.
  • the integrated cutting inspection means 62 is moved relative to the cutting table 17 in the cutting direction 65 along the Y direction, so that the molded substrate 1 is formed by the first cutting mechanism 28 (first blade 63). Can be cut along the cutting line 4. Further, the integrated cutting inspection means 62 is moved relative to the cutting table 17 in a direction 66 (check direction) opposite to the cutting direction along the Y direction, thereby cutting by the kerf check mechanism 59. The width 57 of the cutting groove 58 formed corresponding to the line 4 can be inspected.
  • the integrated cutting inspection means 62 is moved in the cutting direction 65 relative to the cutting table 17 as the forward path (advanced state) of the integrated cutting inspection means 62, so that the integrated cutting inspection means 62
  • the molded substrate 1 is cut along one cutting line 4, and then the integrated cutting inspection means 62 is cut relative to the cutting table 17 as the return path (reverse state) of the integrated cutting inspection means 62.
  • the integrated cutting inspection means 62 can inspect the width 57 of one cutting groove 58.
  • FIG. 5A shows a state before the substrate is cut by the integrated cutting inspection unit 62
  • FIG. 5B shows a state when the substrate is cut by the integrated cutting inspection unit 62 (first cutting mechanism 28).
  • FIG. 5 (3) shows a state when the substrate is inspected by the integrated cutting inspection means 62.
  • the cutting table 17 (17a, 17b) reciprocates in the Y direction, but the integrated cutting inspection means 62 does not move in the Y direction.
  • the molded substrate 1 placed on the cutting table 17 (17a, 17b) is moved from the apparatus front surface 9a side (cleaning unit 30 side) to the apparatus. It is moved along the Y direction toward the back surface 9b.
  • the integrated cutting inspection means 62 is moved downward, and the integrated cutting inspection means 62 is moved in the X direction.
  • the cutting direction 65 that is the Y direction of the first blade 63 is matched with the (single) cutting line 4 in the Y direction set on the ball surface 1a of the molded substrate 1,
  • the molded substrate 1 (cutting table 17) is moved from the apparatus front surface 9a side to the apparatus rear surface 9b side along the Y direction (in an immovable state in the Y direction). Accordingly, the molded substrate 1 is cut in the cutting direction 65 by the first blade 63 (first cutting mechanism 28) along the cutting line 4 by moving the cutting substrate 65 in the cutting direction 65.
  • the integrated cutting inspection means 62 is moved up after the cutting line 4 is cut by the first blade 63.
  • the molded substrate 1 (cutting table 17) is moved from the apparatus back surface 9b side to the apparatus front surface 9a side along the Y direction (
  • the integrated cutting inspection means 62 moving in the Y direction) relative to the cutting table 17 in a direction 66 (check direction) opposite to the cutting direction, the integrated cutting inspection means 62 (kerf check mechanism) 59), the width 57 of the (one) cutting groove 58 corresponding to the cutting line 4 can be inspected.
  • the second cutting mechanism 29 (first The width of the cutting groove 58 by the second blade 64) can be inspected by scanning in the Y direction with the integrated cutting inspection means 62 (kerf check mechanism 59).
  • the molded substrate 1 is supplied and set from the substrate loading unit A to the substrate alignment mechanism unit 11 (substrate supply table 13) in the substrate cutting unit B, and the molded substrate 1 is set by the rotary alignment means 14 as required. Aligned in the direction and supplied to the mounting surface 20a (20b) of the first cutting table 17a (or the second cutting table 17b) present at the substrate mounting position 24. At this time, the molded substrate 1 can be mounted on the table mounting surface 20a (20b) by suction and fixation. Next, the first cutting table 17 a is moved to the substrate cutting position 25 with the molded substrate 1 placed thereon.
  • the vertical wall-shaped bellows members 31a separately provided on both sides in the moving direction of the first cutting table 17a extend one side with the movement of the first cutting table 17a, and the other side It will be reduced.
  • the first cutting table 17a is rotated at a required angle (for example, an angle of 90 degrees) with the eccentric position 21a on the mounting surface 20a of the first cutting table 17a as the rotation center position.
  • the molded substrate 1 is cut by using the first cutting mechanism 28 (integrated cutting inspection means 62) and the second cutting mechanism 29 along the cutting line 4 (4b) in the short side direction. Can do.
  • the width 57 of the cutting groove 58 corresponding to the cutting line 4 (4b) can be inspected by the kerf check mechanism 59 of the integrated cutting inspection means 62.
  • the first cutting table 17a on which the molded substrate 1 cut along all of the cutting lines 4b in the short side direction is placed at a required angle in the opposite direction with the eccentric position 21a as the rotation center position. Rotate to return to the original position.
  • the molded substrate 1 is cut using the first cutting mechanism 28 (integrated cutting inspection means 62) and the second cutting mechanism 29 along the cutting line 4 (4a) in the long side direction. Can do.
  • the width 57 of the cutting groove 58 corresponding to the cutting line 4 (4a) can be inspected by the kerf check mechanism 59 of the integrated cutting inspection means 62. Accordingly, individual packages 5 (cut substrates 1c) can be formed on the mounting surface 20a of the first cutting table 17a.
  • the molded substrate 1 placed on the placement surface 20b of the second cutting table 17b is the same as the case of the first cutting table 17a.
  • the first blade 63 By moving the integrated cutting inspection means 62 (or the second cutting mechanism 29) provided with the cutting mechanism 28 in the cutting direction 65 relative to the cutting table 17, the first blade 63 (or the first cutting mechanism 28) is moved.
  • the shaped substrate 1 is cut along the cutting line 4 (4a, 4b) with the blade 64 of 2 to form a cutting groove 58 having a required width 57 corresponding to the cutting line 4 (4a, 4b). it can. Therefore, next, as shown in FIG. 5 (3), there is a cutting groove 58 that is placed on the cutting table 17 (17a, 17b) and cut along the cutting line 4 (4a, 4b).
  • the integrated cutting inspection means 62 provided with the kerf check mechanism 59 is cut in the cutting direction relative to the cutting table 17. Is moved in the opposite direction 66 (check direction). At this time, the width 57 of the cutting groove 58 can be inspected (kerf check) by the kerf check mechanism 59 provided in the integrated cutting inspection means 62.
  • the integrated cutting inspection means 62 is provided with a cutting groove 58 formed by cutting the cutting line 4 (4a, 4b) provided on the molded substrate 1 by the second cutting mechanism 29.
  • the kerf check mechanism 59 can inspect.
  • the molded substrate 1 placed on the first cutting table 17a is aligned by the alignment mechanism 27 and the cutting lines 4 (4a, 4b) are set.
  • the molded substrate 1 placed on the second cutting table 17b is moved along the cutting line 4 (4a, 4b) with the first cutting mechanism 28 (integrated cutting inspection means).
  • the alignment setting using the twin table method of the present invention and the kerf check after cutting are compared with the configuration in which the alignment setting by the single table method of the conventional example and the kerf check after cutting are performed by one detection mechanism.
  • the number of products (packages) produced per hour can be improved by the configuration in which the processes are performed individually.
  • the present invention is a substrate cutting device 9 adopting a twin table system (two cutting tables 17), and aligns the molded substrate 1 on the first cutting table 17a at the substrate mounting position 24. Setting and (substantially) simultaneously cutting the molded substrate 1 on the second cutting table 17b along the cutting line 4 (4a, 4b) at the substrate cutting position 25 to form the cutting groove 58. The width 57 of the cutting groove 58 formed in the molded substrate 1 can be inspected. Accordingly, by adopting the twin table method (two cutting tables 17), the substrate mounting position 24 is aligned with the molded substrate 1 on one of the two cutting tables 17 at the substrate mounting position 24.
  • the cutting line 4 is set and the cutting line 4 is set, and at the same time, the molded substrate 1 on the other cutting table 17 can be cut and inspected at the substrate cutting position 25. That is, by adopting the configuration of the twin table system (two cutting tables 17) and the configuration in which "alignment setting” and "inspection including cutting” are performed at the same time, the single table system shown in the conventional example is used. However, compared with the configuration in which “alignment setting” and “inspection” are combined with one detection mechanism, “alignment setting” and “inspection” are separately performed in the present invention. The number of (package) production can be improved and the molded substrate 1 can be efficiently cut. Therefore, the productivity of the product (package) can be improved.
  • the present invention is a substrate cutting device 9 adopting a twin table system (two cutting tables 17), and is formed on the first cutting table 17a at the substrate mounting position 24.
  • the alignment is performed on the finished substrate 1 and (substantially) at the same time, at the substrate cutting position 25, the shaped substrate 1 on the second cutting table 17b is cut along the cutting line 4 (4a, 4b) to obtain a cutting groove. 58 and the width 57 of the cutting groove 58 formed in the molded substrate 1 can be inspected.
  • the molded substrate 1 placed on one of the cutting tables 17a is cut (including the kerf check) at the substrate cutting position 25
  • the molded substrate 1 is supplied to the other cutting table 17b by the rotational alignment means 14.
  • It can be set and placed and set for alignment. For example, when the molded substrate 1 placed on one of the cutting tables 17a is cut (including the kerf check) at the substrate cutting position 25, first, the cut substrate 1c placed on the other cutting table 17b ( The package 5) is cleaned by the cleaning unit 30, and then the individual packages placed on the cutting table 17b can be transferred to the inspection unit C side at the substrate placement position 24. Further, for example, when setting the alignment of the molded substrate 1 placed on one of the cutting tables 17a at the substrate placement position 24, the cleaned substrate 1c (package 5) placed on the other cutting table 17b is cleaned. 30 can be washed.
  • the substrate cutting device 9 provided with the two cutting tables 17 (17a and 17b), the alignment mechanism 27, and the kerf check mechanism 59. Since the molded substrate 1 can be cut efficiently, the productivity of the product (package) can be improved.
  • the integrated cutting inspection means 62 can be formed by integrating the first cutting mechanism 28 and the kerf check mechanism 59. Further, at the substrate cutting position 25, the integrated cutting inspection means 62 (first cutting mechanism 28) is cut in the cutting direction 65 by moving the cutting table 17 forward from the apparatus front surface 9a side to the apparatus rear surface 9b side. After moving relative to the table 17 and cutting the molded substrate 1 along the cutting line 4 by the first cutting mechanism 28 to form the cutting groove 58, the cutting table 17 is immediately moved to the apparatus rear surface 9b side. Is moved backward from the apparatus front surface 9a side to move the integrated cutting inspection means 62 (calf check mechanism 59) relative to the cutting table 17 in a direction 66 opposite to the cutting direction.
  • the width 57 of the cutting groove 58 can be inspected. That is, as shown in the conventional example, in the present invention, the substrate cutting position is compared with the configuration in which the alignment setting and the width of the cutting groove are inspected after cutting all the cutting lines at the substrate mounting position. 25, since the width 57 of the cutting groove 58 corresponding to this single cutting line 4 can be inspected immediately after cutting along the single cutting line 4, time for cutting the molded substrate 1 And the productivity of the product (package) can be improved.
  • the rotation center position of the cutting table 17 on which the molded substrate 1 is placed is set to the eccentric position 21 on the placement surface 20 of the cutting table 17, and two pieces are cut. Since the table 17 (17a, 17b) is provided at the close position (interval 33) so as to be able to run in parallel in a parallel state, the overall size of the substrate cutting apparatus can be reduced. .
  • the kerf check mechanism 59 is attached to the first cutting mechanism 28 and the (first) integrated cutting inspection means 62 is formed and used.
  • the second cutting mechanism A configuration may be adopted in which a kerf check mechanism 59 is attached to 29 to form a second integrated cutting inspection means.
  • two integrated cutting inspection means (62) are used to perform cutting along the cutting line of the substrate and inspection of the width of the cutting groove. Therefore, in the present invention, a configuration using a plurality of required integral cutting inspection means (62) can be adopted.
  • the configuration using the integrated cutting inspection means 62 in which the cutting mechanism (28, 29) and the kerf check mechanism (59) are integrated is exemplified.
  • the required number of cutting mechanisms (28, 29) are exemplified.
  • the required number of kerf check mechanisms (59) can be provided independently of each other.
  • One cutting mechanism and one kerf check mechanism can be provided independently and exclusively.
  • the configuration in which the cutting groove 58 is formed by full-cutting the cutting line 4 of the molded substrate 1 is illustrated.
  • the groove depth (distance) of the cutting groove 58 is set to a required groove depth.
  • the cutting line 4 of the molded substrate 1 can be half cut to form a cutting groove having a required groove depth (for example, a half groove depth at the time of full cutting).
  • the substrate loading unit A includes a substrate loading unit 41 that loads the molded substrate 1 and an extrusion member 42 that pushes the molded substrate 1 from the substrate loading unit 41. Therefore, the molded substrate 1 can be supplied to the substrate alignment mechanism unit 11 (substrate supply table 13) in the substrate cutting unit B by extruding the molded substrate 1 from the substrate loading unit 41 by the pushing member 42. It is configured as follows.
  • the package inspection unit C includes a package supply unit 43 that supplies each package 5 (cut substrate 1c) cut by the substrate cutting unit B to the package inspection unit 44, and an individual unit from the package supply unit 43.
  • each package 5 (1c) supplied from the substrate cutting unit B to the package supply unit 43 is inspected by the camera 45 by the package inspection unit 44, whereby the package selection unit 46 is inspected.
  • the package housing unit D includes a non-defective product tray 47 that stores non-defective products and a defective product tray 48 that stores defective products.
  • the package 5 inspected as a non-defective product by the package inspection unit C is stored in the non-defective product tray 47 by the package sorting means 46, and the package 5 inspected as a defective product is stored in the package sorting means 46. Can be accommodated in the defective product tray 48.
  • the package inspection unit C is a unit that inspects the package 5 cut from the molded substrate 1 with an inspection camera (inspection mechanism). That is, in the inspection unit C, the ball surface 5a (including the package size) of the package 5 can be inspected first, and then the resin surface 5b of the package 5 can be inspected. Furthermore, in the inspection unit C, the ball surface 5a of each package 5 (1c) is placed on the first plate with the ball surface 5a as the upper surface, and is reversed in this state, and is individually viewed by the inspection camera from the lower position.
  • the ball surface 5a of the package 5 (1c) is inspected, and then the package 5 (1c) is placed on the second plate with the resin surface 5b of the package 5 (1c) as the upper surface, and this package 5 (
  • the resin surface 5b of 1c) can be inspected with an inspection camera.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

La présente invention concerne un appareil pour la découpe d'un substrat capable d'améliorer la productivité d'un produit (un emballage (5)) formé par la découpe d'un substrat profilé (1) le long d'une ligne de coupe (4). L'appareil pour la découpe d'un substrat (9) comporte deux tables de coupe (17 (17a et 17b)). Le substrat profilé placé sur une table de coupe (17a) à une position de placement de substrats (24) est aligné par un mécanisme d'alignement (27) établissant ainsi la ligne de coupe. En outre, sensiblement simultanément le substrat profilé (1) placé sur l'autre table de coupe (17b) est découpé le long de la ligne de coupe (4) par un premier mécanisme de coupe (28) (un moyen d'inspection de coupe intégral (62)) et un second mécanisme de coupe (29) formant ainsi une fente de coupe (trait de coupe) (58). Au même moment, la fente de coupe (58) est inspectée (vérification de trait de coupe) par un mécanisme de vérification de trait de coupe (59) (le moyen d'inspection de coupe intégral (62)).
PCT/JP2009/000472 2008-03-11 2009-02-06 Procédé et appareil pour la découpe de substrat WO2009113236A1 (fr)

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JP2008060881A JP2009218397A (ja) 2008-03-11 2008-03-11 基板の切断方法及び装置
JP2008-060881 2008-03-11

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WO2023286339A1 (fr) * 2021-07-15 2023-01-19 Ｔｏｗａ株式会社 Dispositif de traitement et procédé de fabrication d'article traité
WO2023013146A1 (fr) * 2021-08-03 2023-02-09 Ｔｏｗａ株式会社 Dispositif de traitement et procédé de fabrication d'objet traité
WO2023013147A1 (fr) * 2021-08-04 2023-02-09 Ｔｏｗａ株式会社 Dispositif de traitement et procédé de fabrication d'article traité

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JP6218511B2 (ja) * 2013-09-02 2017-10-25 Ｔｏｗａ株式会社 切断装置及び切断方法
JP6218526B2 (ja) * 2013-09-20 2017-10-25 Ｔｏｗａ株式会社 切断装置及び切断方法
JP6257291B2 (ja) * 2013-12-04 2018-01-10 株式会社ディスコ パッケージ基板の加工方法
JP6143668B2 (ja) * 2013-12-28 2017-06-07 Ｔｏｗａ株式会社 電子部品製造用の切断装置及び切断方法
JP2016082195A (ja) * 2014-10-22 2016-05-16 Ｔｏｗａ株式会社 切断装置及び切断方法
JP6598811B2 (ja) * 2017-03-23 2019-10-30 Ｔｏｗａ株式会社 半導体パッケージ配置装置、製造装置、半導体パッケージの配置方法および電子部品の製造方法
KR102685963B1 (ko) * 2021-07-13 2024-07-17 한미반도체 주식회사 반도체 자재 절단방법

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WO2023286339A1 (fr) * 2021-07-15 2023-01-19 Ｔｏｗａ株式会社 Dispositif de traitement et procédé de fabrication d'article traité
WO2023013146A1 (fr) * 2021-08-03 2023-02-09 Ｔｏｗａ株式会社 Dispositif de traitement et procédé de fabrication d'objet traité
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