WO2023286339A1 - Dispositif de traitement et procédé de fabrication d'article traité - Google Patents

Dispositif de traitement et procédé de fabrication d'article traité Download PDF

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Publication number
WO2023286339A1
WO2023286339A1 PCT/JP2022/009931 JP2022009931W WO2023286339A1 WO 2023286339 A1 WO2023286339 A1 WO 2023286339A1 JP 2022009931 W JP2022009931 W JP 2022009931W WO 2023286339 A1 WO2023286339 A1 WO 2023286339A1
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WIPO (PCT)
Prior art keywords
processing
holding
moving
cutting
pasting
Prior art date
Application number
PCT/JP2022/009931
Other languages
English (en)
Japanese (ja)
Inventor
元樹 深井
昌一 片岡
一郎 今井
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to CN202280044311.0A priority Critical patent/CN117546273A/zh
Priority to KR1020237042876A priority patent/KR20240008343A/ko
Publication of WO2023286339A1 publication Critical patent/WO2023286339A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q41/00—Combinations or associations of metal-working machines not directed to a particular result according to classes B21, B23, or B24
    • B23Q41/06—Features relating to organisation of working of machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
    • B23Q7/04—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Definitions

  • the present invention relates to a processing device and a method for manufacturing a processed product.
  • Patent Document 1 a semiconductor package substrate cutting apparatus for cutting a semiconductor package substrate in order to manufacture a semiconductor package having a sealing resin, and a semiconductor package cut by this semiconductor package cutting apparatus are arranged.
  • a manufacturing apparatus equipped with a semiconductor package arranging apparatus that
  • the semiconductor package substrate cutting apparatus conveys the semiconductor package substrate in the X-axis direction, places the semiconductor package substrate on the cutting table, and cuts the semiconductor package substrate with the rotary blade of the cutting mechanism while moving the cutting table in the Y-axis direction. Then, it is divided into a plurality of semiconductor packages. Also, the semiconductor package arranging apparatus accommodates the semiconductor packages by affixing them to an arranging member, which is an adhering member having an adhesive layer (adhesive layer).
  • the semiconductor package substrate is not only transported in the X-axis direction, but also the cutting table is moved in the Y-axis direction to cut the semiconductor package substrate, so the footprint of the apparatus becomes large. .
  • the moving mechanism for moving the cutting table requires a protective member to protect the moving mechanism from processing waste or processing water generated by cutting.
  • a protective member a bellows member for protecting the moving mechanism, a cover member for protecting the bellows member, and the like are used. As a result, the device configuration becomes complicated.
  • the main task is to attach and store objects.
  • a processing apparatus includes a processing table that holds an object to be processed, a first holding mechanism that holds the object to be processed in order to convey the object to be processed to the processing table, and a mechanism that holds the object to be processed on the processing table.
  • a processing mechanism that cuts and singulates the processed object, a transfer table onto which the processed object that has been singulated by the processing mechanism is transferred, and the singulated processing object that is placed on a transfer table; a second holding mechanism for holding the singulated workpieces for transporting them from the processing table to the transfer table; 1 holding mechanism and a transfer moving mechanism having a common transfer shaft for moving the second holding mechanism; A moving mechanism for processing that moves in two directions, a mounting table on which a pasting member having an adhesive surface to which the singulated object to be processed is adhered is mounted, and the singulated processing object. and a pasting conveying mechanism for conveying an object from the transfer table to the pasting member placed on the placing table.
  • the individualized processing object is adhered to the sticking member having an adhesive surface and stored. be able to.
  • FIG. 1 It is a figure showing typically composition of a cutting device concerning one embodiment of the present invention. It is a perspective view which shows typically the table for cutting of the same embodiment, and its peripheral structure. It is the figure (plan view) seen from the Z direction which shows typically the structure of the cutting table of the same embodiment, and its peripheral structure. It is the figure (front view) seen from the Y direction which shows typically the structure of the cutting table of the same embodiment, and its peripheral structure. It is the figure (front view) seen from the Y direction which shows typically the structure of the 1st holding mechanism of the same embodiment, and the moving mechanism for conveyance. It is the figure (side view) which showed typically the structure of the 1st holding mechanism of the same embodiment, and the moving mechanism for conveyance seen from the X direction.
  • FIG. 1 A view (front view) schematically showing the configuration of a mounting table, an application member storage section, and an application member transport mechanism of a modified embodiment, viewed from the Y direction (front view), (b) with an increased interval between the guide rails. It is a schematic diagram which shows a state, and a schematic diagram which shows the state where the space
  • the processing apparatus of the present invention includes a processing table that holds an object to be processed, a first holding mechanism that holds the object to be processed in order to convey the object to be processed to the processing table, and the processing table.
  • a processing mechanism that cuts and singulates the workpiece held by the machine; a transfer table on which the workpiece singulated by the machining mechanism is transferred; and the singulated workpiece a second holding mechanism for holding the singulated workpieces to transport the workpieces from the machining table to the transfer table; a transfer movement mechanism having a common transfer shaft for moving the first holding mechanism and the second holding mechanism; a processing moving mechanism for moving in each of the second directions, a mounting table on which a pasting member having an adhesive surface to which the singulated workpiece is pasted is placed, and the singulated object and a pasting conveying mechanism for conveying the object to be processed from the transfer table to the pasting member placed on the placing table.
  • the first holding mechanism and the second holding mechanism are moved by a common transfer shaft extending along the arrangement direction of the processing table and the transfer table, and the processing movement mechanism moves the processing mechanism in the horizontal plane. Since the table is moved in the first direction along the transfer axis and in the second direction orthogonal to the first direction, the workpiece can be singulated without moving the machining table in the first direction and the second direction. can be done. Therefore, the bellows member for protecting the ball screw mechanism and the like and the cover member for protecting the bellows member can be eliminated without moving the machining table by the ball screw mechanism or the like. As a result, the device configuration of the processing device can be simplified.
  • the processing table does not move in the first direction and the second direction on the horizontal plane, it is possible to reduce the movement space of the processing table and the wasted space around it, thereby reducing the footprint of the processing apparatus. be able to.
  • the object to be processed that has been singulated by the conveying mechanism for pasting is transported from the transfer table to the sticking member placed on the mounting table, and the object to be processed is singulated on the adhesive surface of the sticking member. can be pasted.
  • a post-process such as a sputtering process or a mounting process
  • the transfer shaft is arranged above the moving mechanism for processing so as to cross the moving mechanism for processing.
  • the first holding mechanism that moves along the transfer axis can be moved above the moving mechanism for processing, and the first holding mechanism can be prevented from physically interfering with the moving mechanism for processing. can be done.
  • the second holding mechanism that moves along the transfer axis can be moved above the moving mechanism for processing, and the second holding mechanism can be prevented from physically interfering with the moving mechanism for processing.
  • the processing apparatus of the present invention comprises a storage section for storing the sticking member, and a storage section for placing the sticking member on the placement table and the storage section. It is desirable to have a pasting member conveying mechanism that conveys between.
  • the processing apparatus of the present invention includes the individualized workpieces held by the second holding mechanism. It is desirable to further include a first imaging section for confirming a position, and a second imaging section for confirming a position where the individualized workpiece is adhered on the adhesive surface of the adhesion member.
  • a plurality of the sticking transport mechanisms are provided, and each of the sticking transport mechanisms is provided. are driven independently of each other.
  • the moving mechanism for machining moves the machining mechanism in the first direction.
  • the pitch between the pair of X-direction guide rails can be increased.
  • the X-direction guide rail can be of lower specifications than the conventional one.
  • a method for manufacturing a processed product using the processing apparatus described above is also an aspect of the present invention.
  • the processing apparatus 100 of the present embodiment is a cutting apparatus that separates a sealed substrate W, which is an object to be processed, into a plurality of products P, which are processed products.
  • the sealed substrate W is a substrate to which electronic elements such as a semiconductor chip, a resistor element, a capacitor element, etc. are connected, and at least the electronic elements are resin-molded so as to be resin-sealed.
  • a lead frame and a printed wiring board can be used as the substrate constituting the sealed substrate W.
  • semiconductor substrates including semiconductor wafers such as silicon wafers
  • metal substrates metal substrates
  • ceramic substrates can be used.
  • a glass substrate, a resin substrate, or the like can be used.
  • the substrates constituting the sealed substrate W may or may not be wired.
  • the sealed substrate W and the product P of the present embodiment are configured such that one surface of the substrate is resin-molded.
  • the resin-molded surface is the surface on which the electronic element connected to the substrate is resin-sealed, and is called a “sealing surface” or a “package surface”.
  • the non-resin-molded surface opposite to the resin-molded surface is called the lead surface because the leads functioning as external connection electrodes of the product are usually exposed.
  • this lead is a protruding electrode used in an electronic component such as a BGA (Ball Grid Array), it is sometimes called a "ball surface".
  • the non-resin-molded surface opposite to the resin-molded surface may be called a "substrate surface" because there are some forms in which leads are not formed.
  • the resin-molded surface is referred to as the “sealing surface” or "package surface”
  • the resin-molded surface opposite to the resin-molded surface is referred to as the "lead surface”.
  • the cutting apparatus 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W, and the sealed substrate W on the cutting tables 2A and 2B.
  • a first holding mechanism 3 that holds the sealed substrate W for transportation
  • a cutting mechanism (processing mechanism) 4 that cuts the sealed substrate W held on the cutting tables 2A and 2B, and a plurality of products P a transfer table 5 to which the are transferred
  • a second holding mechanism 6 for holding a plurality of products P in order to transfer the plurality of products P from the cutting tables 2A and 2B to the transfer table 5
  • a first holding mechanism 3 and A transfer moving mechanism 7 having a common transfer shaft 71 for moving the second holding mechanism 6, and a cutting mechanism 4 for moving the sealed substrate W held by the cutting tables 2A and 2B.
  • a moving mechanism (processing moving mechanism) 8 is provided.
  • the first holding mechanism 3 and the transport moving mechanism 7 constitute a transport mechanism (loader) for transporting the sealed substrate W, and the second holding mechanism 6 and the transport moving mechanism 7 transport a plurality of products P.
  • a transport mechanism (unloader) is configured.
  • the directions orthogonal to each other in the plane (horizontal plane) along the upper surfaces of the cutting tables 2A and 2B are the X direction as the first direction and the Y direction as the second direction, and the X direction and the Y direction.
  • the perpendicular direction is defined as the Z direction.
  • the horizontal direction in FIG. 1 is the X direction
  • the vertical direction is the Y direction.
  • the X direction is the direction in which the support 812 moves
  • the two cutting tables 2A, 2B are fixed in the X, Y and Z directions.
  • the cutting table 2A can be rotated in the .theta. direction by a rotating mechanism 9A provided below the cutting table 2A.
  • the cutting table 2B can be rotated in the .theta. direction by a rotating mechanism 9B provided under the cutting table 2B.
  • These two cutting tables 2A and 2B are provided along the X direction on the horizontal plane. Specifically, the two cutting tables 2A and 2B are arranged such that their upper surfaces are positioned on the same horizontal plane (located at the same height in the Z direction) (see FIG. 4), and their The centers of the upper surfaces (specifically, the centers of rotation of the rotation mechanisms 9A and 9B) are arranged on the same straight line extending in the X direction (see FIGS. 2 and 3).
  • the two cutting tables 2A and 2B suck and hold the sealed substrate W, and as shown in FIG.
  • Two vacuum pumps 10A, 10B are arranged.
  • Each vacuum pump 10A, 10B is, for example, a water ring vacuum pump.
  • the pipes (not shown) connected from the vacuum pumps 10A and 10B to the cutting tables 2A and 2B can be shortened, and the pipe pressure It is possible to reduce the loss and prevent the deterioration of the adsorption force. As a result, even a very small package of, for example, 1 mm square or less can be reliably attracted to the cutting tables 2A and 2B.
  • the capacities of the vacuum pumps 10A and 10B can be reduced, leading to miniaturization and cost reduction.
  • the first holding mechanism 3 holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B.
  • the first holding mechanism 3 includes a suction head 31 provided with a plurality of suction portions 311 for sucking and holding the sealed substrate W, and a suction portion of the suction head 31. 311 and a vacuum pump (not shown). Then, the suction head 31 is moved to a desired position by a transfer mechanism 7 or the like, which will be described later, to transfer the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B.
  • the substrate supply mechanism 11 includes a substrate accommodation portion 111 that accommodates a plurality of sealed substrates W from the outside, and a first holding portion for the sealed substrates W accommodated in the substrate accommodation portion 111 . and a substrate supply unit 112 for moving to a holding position RP where the mechanism 3 sucks and holds the substrate.
  • This holding position RP is set so as to be aligned with the two cutting tables 2A and 2B in the X direction.
  • the substrate supply mechanism 11 may have a heating unit 113 that heats the sealed substrate W to be attracted by the first holding mechanism 3 so as to make it flexible and facilitate the attraction.
  • the cutting mechanism 4 which is a processing mechanism, has two rotary tools 40 comprising blades 41A, 41B and two spindles 42A, 42B.
  • the two spindle parts 42A and 42B are provided so that their rotation axes are along the Y direction, and the blades 41A and 41B attached to them are arranged so as to face each other (see FIG. 3).
  • the blade 41A of the spindle section 42A and the blade 41B of the spindle section 42B cut the sealed substrate W held on each cutting table 2A, 2B by rotating in a plane including the X direction and the Z direction. As shown in FIG.
  • the cutting apparatus 100 of the present embodiment includes a liquid supply mechanism 12 having an injection nozzle 121 for injecting cutting water (working fluid) to suppress frictional heat generated by the blades 41A and 41B. is provided.
  • This injection nozzle 121 is supported by, for example, a Z-direction moving unit 83, which will be described later.
  • the transfer table 5 of the present embodiment is a table to which a plurality of products P inspected by an inspection unit 13, which will be described later, are transferred.
  • the transfer table 5 is a so-called index table, and a plurality of products P are temporarily placed thereon before the plurality of products P are affixed to an affixing member 20, which will be described later. 1 and 7, the transfer table 5 is provided movably along the Y direction, and is positioned at a transfer position X1 where a plurality of products P are placed by the second holding mechanism 6. , and a pick-up position X2 where a plurality of products P are transported by the pasting transport mechanism 22 .
  • the transfer position X1 is set on the front side of the transfer shaft 71, and is a position where the two cutting tables 2A and 2B are arranged in a line along the X direction on the horizontal plane. is set on the back side of the transfer shaft 71 .
  • the inspection unit 13 is provided between the cutting tables 2A and 2B and the transfer table 5, and inspects the plurality of products P held by the second holding mechanism 6. is.
  • the inspection unit 13 of this embodiment has a first inspection unit 131 that inspects the sealing surface (package surface) of the product P and a second inspection unit 132 that inspects the lead surface of the product P.
  • the first inspection unit 131 is an imaging camera having an optical system for inspecting the package surface
  • the second inspection unit 132 is an imaging camera having an optical system for inspecting the lead surface. Note that the first inspection unit 131 and the second inspection unit 132 may be shared.
  • a reversing mechanism 14 for reversing the plurality of products P is provided so that both sides of the plurality of products P can be inspected by the inspection unit 13 (see FIG. 1).
  • the reversing mechanism 14 has a holding table 141 that holds a plurality of products P, and a reversing unit 142 such as a motor that turns the holding table 141 upside down.
  • the package surface of the products P faces downward.
  • the package surfaces of the products P are inspected by the first inspection unit 131.
  • FIG. After that, the multiple products P held by the second holding mechanism 6 are reversed by the reversing mechanism 14 , and then the reversing mechanism 14 moves to the position of the transfer table 5 .
  • the lead surface of the product P facing downward is inspected by the second inspection unit 132 .
  • the product P is delivered to the transfer table 5 .
  • the second holding mechanism 6 holds a plurality of products P in order to convey the plurality of products P from the cutting tables 2A and 2B to the reversing mechanism 14, as shown in FIG.
  • the second holding mechanism 6 is connected to a suction head 61 provided with a plurality of suction portions 611 for sucking and holding a plurality of products P, and the suction portions 611 of the suction head 61 . and a vacuum pump (not shown). Then, the suction head 61 is moved to a desired position by a transfer mechanism 7 or the like, which will be described later, to transfer the plurality of products P from the cutting tables 2A and 2B to the holding table 141 .
  • the transportation moving mechanism 7 moves the first holding mechanism 3 between at least the substrate supply mechanism 11 and the cutting tables 2A and 2B, and moves the second holding mechanism 6 between at least the cutting tables. It is moved between 2A, 2B and the holding table 141 .
  • the transportation moving mechanism 7 extends in a straight line along the arrangement direction (X direction) of the two cutting tables 2A and 2B and the transfer table 5, and the first holding mechanism 3 and the second 2 has a common transfer shaft 71 for moving the holding mechanism 6 .
  • the transfer shaft 71 is provided within a range in which the first holding mechanism 3 can move above the substrate supply section 112 of the substrate supply mechanism 11 and the second holding mechanism 6 can move above the transfer table 5 ( See Figure 1). Further, a pasting member conveying mechanism 26, which will be described later, extends within a range in which it can move between the pasting member conveying position X3 and the guide rail 27. As shown in FIG. The first holding mechanism 3, the second holding mechanism 6, the cutting tables 2A and 2B, and the transfer table 5 are provided on the same side (front side) of the transfer shaft 71 in plan view.
  • the inspection section 13 , the reversing mechanism 14 , the mounting table 21 , the application member storage section 25 , the application member conveying mechanism 26 , the first cleaning mechanism 18 and the second cleaning mechanism 19 which will be described later are also arranged on the same side of the transfer shaft 71 . (front side).
  • the transporting moving mechanism 7 includes a main moving mechanism 72 that moves the first holding mechanism 3 and the second holding mechanism 6 in the X direction along the transfer shaft 71; A vertical movement mechanism 73 for vertically moving the first holding mechanism 3 and the second holding mechanism 6 with respect to the transfer shaft 71 in the Z direction, and a vertical movement mechanism 73 for vertically moving the first holding mechanism 3 and the second holding mechanism 6 with respect to the transfer shaft 71 in the Y direction. and a horizontal movement mechanism 74 for horizontal movement.
  • the main moving mechanism 72 is provided on the transfer shaft 71, and has a common guide rail 721 that guides the first holding mechanism 3 and the second holding mechanism 6; It has a rack and pinion mechanism 722 that moves the first holding mechanism 3 and the second holding mechanism 6 along the guide rail 721 .
  • the guide rail 721 extends straight in the X direction along the transfer shaft 71, and, like the transfer shaft 71, allows the first holding mechanism 3 to move above the substrate supply portion 112 of the substrate supply mechanism 11, 2 A holding mechanism 6 is provided within a range in which it can move above the transfer table 5 .
  • the guide rail 721 is slidably provided with a slide member 723 on which the first holding mechanism 3 and the second holding mechanism 6 are provided via a vertical movement mechanism 73 and a horizontal movement mechanism 74 .
  • the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6, but the vertical movement mechanism 73, the horizontal movement mechanism 74 and the slide member 723 are common to the first holding mechanism 3 and the second holding mechanism 6. provided separately for each.
  • the rack and pinion mechanism 722 includes a cam rack 722a common to the first holding mechanism 3 and the second holding mechanism 6, and a pinion provided in each of the first holding mechanism 3 and the second holding mechanism 6 and rotated by an actuator (not shown). and a gear 722b.
  • the cam rack 722a is provided on the common transfer shaft 71 and can be varied in length by connecting a plurality of cam rack elements.
  • the pinion gear 722b is provided on the slide member 723 and is called a so-called roller pinion. As shown in FIG. It has a plurality of roller pins 722b2 which are provided at equal intervals in the circumferential direction between the roller bodies 722b1 and are provided so as to be able to roll with respect to the roller body 722b1.
  • the rack-and-pinion mechanism 722 of this embodiment uses the roller pinions described above, two or more roller pins 722b2 come into contact with the cam rack 722a. Positioning accuracy is improved when moving the first holding mechanism 3 and the second holding mechanism 6 in the X direction.
  • the lifting mechanism 73 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6.
  • the lifting mechanism 73 of the first holding mechanism 3 is interposed between the transfer shaft 71 (specifically, the main moving mechanism 72) and the first holding mechanism 3, as shown in FIGS. It has a Z-direction guide rail 73a provided along the Z-direction, and an actuator portion 73b for moving the first holding mechanism 3 along the Z-direction guide rail 73a.
  • the actuator section 73b may use, for example, a ball screw mechanism, an air cylinder, or a linear motor.
  • the configuration of the elevation movement mechanism 73 of the second holding mechanism 6 is the same as that of the elevation movement mechanism 73 of the first holding mechanism 3, as shown in FIG.
  • the horizontal movement mechanism 74 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6, as shown in FIGS.
  • the horizontal movement mechanism 74 of the first holding mechanism 3 is interposed between the transfer shaft 71 (specifically, the vertical movement mechanism 73) and the first holding mechanism 3, as shown in FIGS. Y-direction guide rails 74a provided along the Y-direction, elastic bodies 74b for applying force to the first holding mechanism 3 on one side of the Y-direction guide rails 74a, and the first holding mechanism 3. and a cam mechanism 74c for moving to the other side of the Y-direction guide rail 74a.
  • the cam mechanism 74c uses an eccentric cam, and the amount of movement of the first holding mechanism 3 in the Y direction can be adjusted by rotating the eccentric cam with an actuator such as a motor.
  • the configuration of the horizontal movement mechanism 74 of the second holding mechanism 6 is the same as that of the vertical movement mechanism 73 of the first holding mechanism 3, as shown in FIG. Further, the second holding mechanism 6 may be configured without the horizontal movement mechanism 74 , or both the first holding mechanism 3 and the second holding mechanism 6 may be configured without the horizontal movement mechanism 74 . Further, the horizontal movement mechanism 74 may use, for example, a ball screw mechanism or an air cylinder without using the cam mechanism 74c, like the elevation movement mechanism 73. Alternatively, a linear motor may be used.
  • the cutting movement mechanism 8 linearly moves each of the two spindles 42A and 42B in the X, Y and Z directions.
  • the cutting movement mechanism 8 includes an X-direction movement unit 81 that linearly moves the spindles 42A and 42B in the X direction, and a Y-direction movement of the spindles 42A and 42B. and a Z-direction moving portion 83 for linearly moving the spindle portions 42A and 42B in the Z-direction.
  • the X-direction moving part 81 is common to the two cutting tables 2A and 2B, and is provided along the X direction with the two cutting tables 2A and 2B interposed therebetween, as particularly shown in FIGS. a pair of X-direction guide rails 811, and a support body that moves along the pair of X-direction guide rails 811 and supports the spindles 42A and 42B via the Y-direction moving portion 82 and the Z-direction moving portion 83. 812.
  • a pair of X-direction guide rails 811 are provided on the sides of the two cutting tables 2A and 2B provided along the X-direction.
  • the support 812 is, for example, a portal type and has a shape extending in the Y direction. Specifically, the support 812 has a pair of legs extending upward from the pair of X-direction guide rails 811 and beams (beams) bridging the pair of legs. extending in the direction
  • the support 812 is linearly reciprocated along the X direction on a pair of X direction guide rails 811 by, for example, a ball screw mechanism 813 extending in the X direction.
  • the ball screw mechanism 813 is driven by a drive source (not shown) such as a servomotor.
  • the support 812 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
  • the Y-direction moving part 82 includes a Y-direction guide rail 821 provided along the Y direction on the support 812, and a Y-direction slider 822 that moves along the Y-direction guide rail 821. have.
  • the Y-direction slider 822 is driven by, for example, a linear motor 823 and linearly reciprocates on the Y-direction guide rail 821 .
  • two Y-direction sliders 822 are provided corresponding to the two spindle portions 42A and 42B. Thereby, the two spindle parts 42A and 42B are movable in the Y direction independently of each other.
  • the Y-direction slider 822 may be configured to reciprocate by another direct acting mechanism using a ball screw mechanism.
  • the Z-direction moving part 83 moves along a Z-direction guide rail 831 provided along the Z-direction on each Y-direction slider 822 and moves along the Z-direction guide rail 831. and a Z-direction slider 832 that supports the spindle portions 42A and 42B. That is, the Z-direction moving portion 83 is provided corresponding to each spindle portion 42A, 42B.
  • the Z-direction slider 832 is driven by, for example, an eccentric cam mechanism (not shown), and linearly reciprocates on the Z-direction guide rail 831 .
  • the Z-direction slider 832 may be configured to reciprocate by another direct acting mechanism such as a ball screw mechanism.
  • the positional relationship between the moving mechanism 8 for cutting and the transfer shaft 71 is such that the transfer shaft 71 is arranged above the moving mechanism 8 for cutting so as to cross the moving mechanism 8 for cutting. ing. Specifically, the transfer shaft 71 is arranged above the support 812 so as to cross the support 812 , and the transfer shaft 71 and the support 812 have a positional relationship of crossing each other.
  • the cutting apparatus 100 of the present embodiment further includes a processing waste storage section 17 that stores processing waste S such as offcuts generated by cutting the sealed substrate W, as shown in FIG.
  • the processing waste container 17 is provided below the cutting tables 2A and 2B, and is a guide chute having an upper opening 171X surrounding the cutting tables 2A and 2B in plan view. 171 and a collection container 172 for collecting the processing waste S guided by the guide shooter 171 .
  • the recovery rate of the processing waste S can be improved.
  • the guide shooter 171 guides the processing waste S scattered or dropped from the cutting tables 2A, 2B to the collection container 172.
  • the upper opening 171X of the guide shooter 171 surrounds the cutting tables 2A and 2B (see FIG. 3)
  • it is difficult to remove the processing waste S, and the collection rate of the processing waste S is further improved. can be improved.
  • the guide shooter 171 is provided so as to surround the rotating mechanisms 9A and 9B provided under the cutting tables 2A and 2B (see FIG. 4). is configured to protect
  • the processing waste container 17 is shared by the two cutting tables 2A and 2B, but may be provided for each of the cutting tables 2A and 2B.
  • the collection container 172 is for collecting the processing waste S that has passed through the guide shooter 171 by its own weight.
  • the two collection containers 172 are arranged on the front side of the transfer shaft, and configured to be independently removable from the front side of the cutting device 100 . With this configuration, it is possible to improve maintainability such as disposal of the processing waste S. Considering the size of the sealed substrate W, the size and amount of the processing waste S, the workability, etc., one collection container 172 may be provided under the entire cutting table, or three collection containers may be provided. You may divide
  • the processing waste container 17 has a separation section 173 that separates cutting water and processing waste S from each other.
  • a filter such as a perforated plate that allows cutting water to pass through the bottom surface of the collection container 172 may be provided.
  • the separation unit 173 allows the processing waste S to be collected without accumulating cutting water in the collection container 172 .
  • the cutting apparatus 100 of the present invention includes a first cleaning mechanism 18 that cleans the upper surfaces (lead surfaces) of the plurality of products P held on the cutting tables 2A and 2B. I have more.
  • the first cleaning mechanism 18 cleans the upper surfaces of the products P by means of injection nozzles 18a (see FIG. 5) that inject cleaning liquid and/or compressed air onto the upper surfaces of the plurality of products P held on the cutting tables 2A and 2B. It is for cleaning.
  • the first cleaning mechanism 18 is configured to be movable along the transfer shaft 71 together with the first holding mechanism 3, as shown in FIG.
  • the first cleaning mechanism 18 is provided on a slide member 723 that slides on a guide rail 721 provided on the transfer shaft 71 .
  • an elevation movement mechanism 181 for vertically moving the first cleaning mechanism 18 in the Z direction.
  • the lifting mechanism 181 may be, for example, one using a rack and pinion mechanism, one using a ball screw mechanism, or one using an air cylinder.
  • the cutting device 100 of the present invention further includes a second cleaning mechanism 19 that cleans the lower surface side (package surface) of the plurality of products P held by the second holding mechanism 6, as shown in FIG. .
  • the second cleaning mechanism 19 is provided between the cutting table 2B and the inspection section 13, and sprays cleaning liquid and/or compressed air onto the lower surfaces of the plurality of products P held by the second holding mechanism 6. By doing so, the lower surface side of the product P is cleaned. That is, the second cleaning mechanism 19 cleans the lower surface side of the product P while the second holding mechanism 6 is being moved along the transfer shaft 71 .
  • the cutting device 100 of the present embodiment is configured so that a plurality of products P can be accommodated (also called “ring accommodation”) by being adhered to the sticking member 20 having the adhesive surface 20x.
  • the cutting device 100 includes a mounting table 21 on which an affixing member 20 having an adhesive surface 20x to which a plurality of products P are affixed is placed, and a plurality of products P.
  • a pasting conveying mechanism 22 for conveying from the transfer table 5 to the pasting member 20 placed on the placing table 21 is provided.
  • two mounting tables 21 are provided along the X direction (see FIG. 1), and the sticking member 20 is mounted on each mounting table 21 .
  • the two mounting tables 21 are arranged so that their upper surfaces are located on the same horizontal plane (located at the same height in the Z direction).
  • the two mounting tables 21 are provided movably along the Y direction, and are positioned at a pasting member transfer position where the pasting member 20 is transferred by the pasting member conveying mechanism 26. It moves between X3 and a sticking position X4 where a plurality of products P are transported by the transport mechanism 22 for sticking.
  • the two mounting tables 21 move independently of each other between the attaching member conveying position X3 and the attaching position X4.
  • the pasting member conveying position X3 is set on the front side of the transfer shaft 71, and the pasting position X4 is set on the far side of the transfer shaft 71.
  • the mounting table 21 at the sticking position X4 and the transfer table 5 at the take-out position X2 are arranged along the X direction (see FIG. 1).
  • the sticking member 20 includes, for example, an annular or rectangular frame-shaped member 20a and a resin sheet 20b having an adhesive surface 20x disposed inside the frame-shaped member 20a.
  • the frame member 20a is made of metal such as stainless steel.
  • the resin sheet 20b includes, for example, a sheet-like base material 20b1 made of resin and an adhesive layer (adhesive layer) 20b2 made of an adhesive applied to the upper surface of the sheet-like base material 20b1.
  • the upper surface of the adhesive layer (adhesive layer) 20b2 is the adhesive surface 20x.
  • the pasting conveying mechanism 22 conveys a plurality of products P from the transfer table 5 moved to the take-out position X2 to the pasting member 20 placed on the placing table 21 moved to the pasting position X4.
  • the pasting conveying mechanism 22 includes a product suction mechanism 221 that suctions a plurality of products P held on the transfer table 5, for example, in each row, and the product suction mechanism 221 that is X and a moving mechanism for adsorption 222 that moves along the direction.
  • the product suction mechanism 221 that is X
  • a moving mechanism for adsorption 222 that moves along the direction.
  • two pasting conveying mechanisms 22 are provided (see FIG. 1), and each pasting conveying mechanism 22 is configured to be driven independently of each other.
  • the product suction mechanism 221 is connected to a suction head 221A provided with a plurality of suction portions 221a for individually sucking and holding a plurality of products P, and to the suction portions 221a of the suction head 221A. and a vacuum pump or vacuum ejector (not shown).
  • the product adsorption mechanism 221 is configured such that each adsorption portion 221a adsorbs one product P.
  • the plurality of suction portions 221a are configured to be able to move up and down independently of each other, and each suction portion 221a can be lowered to suck the product P individually.
  • the suction moving mechanism 222 includes an X-direction moving portion 222a for moving the product suction mechanism 221 in the X direction and a Z-direction moving portion 222b for moving the product suction mechanism 221 in the Z direction.
  • the suction moving mechanism 222 may have a Y-direction moving portion that moves the product suction mechanism 221 in the Y direction.
  • the X-direction moving portion 222a moves along an X-direction guide rail 222a1 provided along the X direction on the back side of the transfer shaft 71, and along the X-direction guide rail 222a1, moves through the Z-direction moving portion 222b. and a support 222 a 2 that supports the product suction mechanism 221 .
  • the support 222a2 is linearly reciprocated along the X direction on the X direction guide rail 222a1 by, for example, a ball screw mechanism (not shown) extending in the X direction. This ball screw mechanism is driven by a drive source (not shown) such as a servomotor. Alternatively, the support 222a2 may be configured to reciprocate by another direct acting mechanism such as a linear motor.
  • the Z-direction moving part 222b moves along a Z-direction guide rail 222b1 provided along the Z-direction on the support 222a2 and the product suction mechanism 221.
  • Z direction slider 222b2 to support.
  • the Z-direction slider 222b2 linearly reciprocates along the Z-direction on the Z-direction guide rail 222b1 by, for example, a ball screw mechanism (not shown) extending in the Z-direction.
  • the Z-direction slider 222b2 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
  • the first imaging unit 23 is an imaging camera that images the product P adsorbed and held by the product adsorption mechanism 221 of the pasting transport mechanism 22 from below, and images the lower surface of the product P (package surface).
  • the first imaging unit 23 is provided so as to be movable in the front-rear direction (Y direction). Thereby, it is configured such that the position of the product P sucked and held by each of the two pasting conveying mechanisms 22 can be confirmed.
  • each pasting conveying mechanism 22 is provided with a second imaging section 24 for confirming the position where the product P is pasted on the pasting member 20, as shown in FIG.
  • the second imaging unit 24 is an imaging camera that captures an image of the sticking member 20 on the mounting table 21 at the sticking position X4 from above, and images the top surface (adhesive surface 20x) of the sticking member 20 . Then, based on the imaging data obtained by the first imaging unit 23 and the imaging data obtained by the second imaging unit 24, the product P is aligned with the application member 20 and conveyed for application.
  • the mechanism 22 affixes the product P to the adhesive surface 20x of the affixing member 20.
  • the position alignment of the product P is performed by the suction moving mechanism 222 of the pasting transport mechanism 22, the rotating mechanism (not shown) provided in the pasting transport mechanism 22, or the moving mechanism (not shown) of the placing table 21. Alternatively, it can be performed by a rotating mechanism (not shown) provided on the mounting table 21 .
  • the cutting device 100 of the present embodiment has a pasting member housing portion 25 that houses the pasting member 20, and conveys the pasting member 20 between the mounting table 21 and the pasting member housing portion 25.
  • a pasting member conveying mechanism 26 is provided.
  • the sticking member storage part 25 stores an empty sticking member 20 to which the product P is not stuck, and also stores the pasted sticking member 20 to which the product P is stuck.
  • the pasting member storage unit 25 is arranged in a line along the X direction with the placing table 21 at the pasting member conveying position X3 (see FIG. 1).
  • a pair of guide rails 27 for taking the sticking member 20 into and out of the sticking member housing portion 25 is provided at the opening of the sticking member housing portion 25 .
  • the pair of guide rails 27, on which the sticking member 20 is placed, are provided in front of the opening of the sticking member housing portion 25 along the X direction.
  • the pasting member conveying mechanism 26 conveys the pasting member 20 between the mounting table 21 located at the pasting member conveying position X3 and the pasting member storage section 25.
  • the application member conveying mechanism 26 includes a third holding mechanism 261 that sucks and holds the frame-shaped member 20a of the application member 20, and moves the third holding mechanism 261 in at least the X direction and the Z direction. and a moving mechanism 262 for moving in the direction.
  • the third holding mechanism 261 includes a suction head 261A provided with a plurality of suction portions 261a for sucking and holding the sticking member 20, and a vacuum pump or vacuum ejector (not shown) connected to the suction portions 261a of the suction head 261A. ). Further, the moving mechanism 262 is configured using the main moving mechanism 72 of the transporting moving mechanism 7, and further has a lifting/lowering moving mechanism 262a similar to the lifting/lowering moving mechanism 73 of the transporting moving mechanism 7. there is Note that the moving mechanism 262 may have a Y-direction moving mechanism that moves the third holding mechanism 261 in the Y direction.
  • FIG. 13 shows the moving path of the first holding mechanism 3 and the moving path of the second holding mechanism 6 in the operation of the cutting device 100.
  • all operations and controls of the cutting apparatus 100 such as transportation of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, and accommodation of the product P in the ring, are performed by the control unit CTL. (See FIG. 1).
  • the substrate supply unit 112 of the substrate supply mechanism 11 moves the sealed substrate W accommodated in the substrate accommodation unit 111 toward the holding position RP held by the first holding mechanism 3 (see FIG. 1).
  • the transfer mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 holds the sealed substrate W by suction.
  • the transfer moving mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting tables 2A and 2B, and the first holding mechanism 3 releases the suction holding, and the sealed substrate W is released.
  • a substrate W is placed on the cutting tables 2A and 2B.
  • the main moving mechanism 72 adjusts the position of the sealed substrate W in the X direction
  • the horizontal moving mechanism 74 adjusts the position of the sealed substrate W in the Y direction.
  • the cutting tables 2A and 2B hold the sealed substrate W by suction.
  • the elevation movement mechanism 73 moves the first holding mechanism 3 to the cutting movement mechanism 8 (support body 812). Raise to a position where there is no physical interference.
  • the support body 812 is retracted from the cutting table 2B to the transfer table 5 side. It is not necessary to raise and lower the first holding mechanism 3 at this time.
  • the cutting movement mechanism 8 sequentially moves the two spindles 42A and 42B in the X direction and the Y direction, and the cutting tables 2A and 2B rotate to form the sealed substrate W in a grid pattern. Cut and individualize.
  • the transfer mechanism 7 moves the first cleaning mechanism 18 to clean the upper surface side (lead surface) of the multiple products P held on the cutting tables 2A and 2B. After this cleaning, the transfer mechanism 7 retracts the first holding mechanism 3 and the first cleaning mechanism 18 to predetermined positions.
  • the transfer movement mechanism 7 moves the second holding mechanism 6 to the cutting tables 2A and 2B after cutting, and the second holding mechanism 6 holds the plurality of products P by suction.
  • the transport moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the second cleaning mechanism 19 .
  • the second cleaning mechanism 19 cleans the lower surface side (package surface) of the plurality of products P held by the second holding mechanism 6 .
  • the plurality of products P held by the second holding mechanism 6 are inspected on the lower surface side (package surface) by the inspection unit 131, and then transferred to the reversing mechanism 14, where the reversing mechanism 14 packages them. After the face is sucked and held, it is inverted. After the reversal, the reversing mechanism 14 is moved, and the lead surface of the product P is inspected by the inspection unit 132 . After being inspected on both sides in this manner, the product P is transferred from the reversing mechanism 14 to the transfer table 5 . The transfer table 5 on which a plurality of products P are placed moves to the pick-up position X2 (see FIGS. 1, 7 and 10).
  • an empty pasting member 20 is conveyed from the pasting member storage section 25 by the pasting member conveying mechanism 26 to the placement table 21 at the pasting member conveying position X3. Then, the mounting table 21 carrying the empty sticking member 20 moves to the sticking position X4 (see FIGS. 7 and 10).
  • the pasting transport mechanism 22 sucks and holds the product P from the transfer table 5 located at the take-out position X2. Then, it moves above the first imaging unit 23 . Thereby, the position of the product P in the pasting conveying mechanism 22 is confirmed by the first imaging section 23 . Further, the pasting conveying mechanism 22 is moved to confirm the position where the product P is pasted on the pasting member 20 on the mounting table 21 at the pasting position X4 by the second imaging section 24 . Then, the sticking conveying mechanism 22 sticks the held product P onto the sticking member 20 . This operation is repeated multiple times until the allowable number of products P that can be stuck on the sticking member 20 are stuck, or until all the multiple products P on the transfer table 5 are stuck.
  • the mounting table 21 moves to the pasting member conveying position X3, as shown in FIGS.
  • the pasted member conveying mechanism 26 conveys the pasted pasted pasted member 20 placed on the mounting table 21 to the pasted member housing portion 25 .
  • the pasted member conveying mechanism 26 places the pasted pasted member 20 on a pair of guide rails 27 provided in the pasted member housing portion 25 , and the pasted member 20 placed on the pair of guide rails 27 is placed on the pasted member 20 .
  • the pasted sticking member 20 is housed in the sticking member housing portion 25. As shown in FIG.
  • the pasting member conveying mechanism 26 pulls out the pasting member 20 from the pasting member housing portion 25 and places it on the pair of guide rails 27 .
  • the empty sticking member 20 placed on the pair of guide rails 27 is held by suction and transported to the placing table 21 at the sticking member transport position X3.
  • the first holding mechanism 3 and the second holding mechanism 6 are moved by the common transfer shaft 71 extending along the arrangement direction of the cutting tables 2A and 2B and the transfer table 5.
  • the cutting mechanism 4 is moved in the horizontal plane by the cutting movement mechanism 8 in the X direction along the transfer shaft 71 and in the Y direction orthogonal to the X direction.
  • the sealed substrate W can be singulated without being moved. Therefore, the bellows member for protecting the ball screw mechanism or the like and the cover member for protecting the bellows member can be eliminated without moving the cutting tables 2A and 2B by the ball screw mechanism or the like. As a result, the configuration of the cutting device 100 can be simplified.
  • the cutting tables 2A and 2B are configured so as not to move in the X direction and the Y direction on the horizontal plane, it is possible to reduce the space for moving the cutting tables 2A and 2B and the wasted space therearound. A footprint of 100 can be reduced.
  • the plurality of products P are transported from the transfer table 5 to the sticking member 20 placed on the placing table 21 by the sticking conveying mechanism 22, and the plurality of products P are stuck to the adhesive surface 20x of the sticking member 20. can be attached.
  • a post-process such as a sputtering process or a mounting process is performed on a plurality of products P, it is only necessary to move the sticking member 20 to which the plurality of products P are stuck, thereby facilitating handling. be able to.
  • two guide rails 27A and 27B may be provided on the upper and lower sides of the opening of the adhesive member accommodating portion 25.
  • the upper guide rails 27A are configured such that the distance between them can be expanded and contracted by an expansion and contraction mechanism (not shown).
  • the interval between the upper guide rails 27A is expanded by the expansion/reduction mechanism (see FIG. 14(b)).
  • the pasting member conveying mechanism 26 descends between the upper guide rails 27A, pulls out the empty pasting member 20 from the pasting member storage section 25 onto the lower guide rail 27B, and temporarily places it.
  • the application member transport mechanism 26 moves to the mounting table 21 located at the application member transport position X3 and receives the applied application member 20 .
  • the applied member conveying mechanism 26 places the applied applied member 20 on the upper guide rail 27 ⁇ /b>A and pushes the applied member 20 into the applied member accommodating portion 25 .
  • the interval between the upper guide rails 27A is expanded by the expansion/reduction mechanism.
  • the pasting member conveying mechanism 26 descends between the upper guide rails 27A, receives the empty pasting member 20 placed on the lower guide rails 27B, and conveys it to the placing table 21.
  • the two pasting conveying mechanisms 22 are provided, but a single pasting conveying mechanism 22 may be provided.
  • first imaging unit 23 is common to the two pasting conveying mechanisms 22, the first photographing unit 23 may be provided for each of the two pasting conveying mechanisms 22.
  • twin-cut table system and a twin-spindle configuration cutting device have been described. It may also be a cutting device with a twin spindle configuration.
  • the cutting device (processing device) 100 can be separated and connected between the second cleaning mechanism 19 and the inspection unit 13. It can be configured as a removable (detachable) module. In this case, for example, between the module on the second cleaning mechanism 19 side and the module on the inspection section 13 side, a module that performs an inspection different from the inspection performed by the inspection section 13 can be added.
  • the cutting device (processing device) 100 may have a module configuration that can be separated and connected (detachable) at any point, and the modules to be added may be modules with various functions other than inspection. .
  • Processing device Sealed substrate (object to be processed) P ⁇ Product (processed product) 2A, 2B... Cutting table (processing table) 3 First holding mechanism 4 Cutting mechanism (processing mechanism) 5 Transfer table 6 Second holding mechanism 7 Conveyance movement mechanism 71 Transfer shaft 8 Machining movement mechanism 81 X-direction movement unit 82 Y Direction moving part 811... A pair of X-direction guide rails 812... Support body 20... Pasting member 20x... Adhesive surface 21... Placement table 22... Pasting conveying mechanism 23... First imaging unit 24 Second imaging unit 25 Pasting member storage unit 26 Pasting member conveying mechanism 27 Guide rails 27A, 27B Guide rails

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Abstract

La présente invention élimine le besoin d'un mécanisme de déplacement pour déplacer une table de traitement et stocke un objet à traiter, divisé en morceaux, par adhérence de celui-ci à une surface adhésive. La présente invention comprend : des tables de coupe 2A, 2B pour maintenir un substrat scellé W ; un premier mécanisme de maintien 3 pour maintenir le substrat scellé W afin de transporter le substrat scellé W vers les tables de coupe 2A, 2B ; un mécanisme de coupe 4 pour couper, et diviser en morceaux, le substrat scellé W maintenu par les tables de coupe 2A, 2B ; une table de transfert 5 à laquelle sont transférés des morceaux de produit P obtenus par le mécanisme de coupe 4 ; un second mécanisme de maintien 6 pour maintenir la pluralité de morceaux de produits P afin de transporter la pluralité de morceaux de produit P à partir des tables de coupe 2A, 2B vers la table de transfert 5 ; un mécanisme de déplacement de transport 7 qui s'étend dans la direction le long de laquelle les tables de coupe 2A, 2B et la table de transfert 5 sont agencées et présente un arbre de transfert commun 71 pour déplacer le premier mécanisme de maintien 3 et le second mécanisme de maintien 6 ; un mécanisme de déplacement de traitement 8 qui déplace, dans un plan horizontal, le mécanisme de coupe 4 dans chacune d'une direction X le long de l'arbre de transfert 71 et d'une direction Y orthogonale à la direction X ; une table de montage 21 sur laquelle est monté un élément d'adhérence 20 qui présente une surface adhésive 20x sur laquelle la pluralité de morceaux de produit P adhèrent ; et un mécanisme de transport d'adhérence 22 qui transporte la pluralité de morceaux de produit P, de la table de transfert 5 à l'élément d'adhérence 20 monté sur la table de montage 21.
PCT/JP2022/009931 2021-07-15 2022-03-08 Dispositif de traitement et procédé de fabrication d'article traité WO2023286339A1 (fr)

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JP2020017559A (ja) * 2018-07-23 2020-01-30 Ｔｏｗａ株式会社 搬送機構、電子部品製造装置、搬送方法および電子部品の製造方法
JP2021097093A (ja) * 2019-12-16 2021-06-24 Ｔｏｗａ株式会社 統計データ生成方法、切断装置及びシステム

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