WO2022185684A1 - Dispositif de traitement - Google Patents

Dispositif de traitement Download PDF

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Publication number
WO2022185684A1
WO2022185684A1 PCT/JP2021/047824 JP2021047824W WO2022185684A1 WO 2022185684 A1 WO2022185684 A1 WO 2022185684A1 JP 2021047824 W JP2021047824 W JP 2021047824W WO 2022185684 A1 WO2022185684 A1 WO 2022185684A1
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WO
WIPO (PCT)
Prior art keywords
processing
holding mechanism
holding
transfer
cutting
Prior art date
Application number
PCT/JP2021/047824
Other languages
English (en)
Japanese (ja)
Inventor
元樹 深井
聡子 堀
雄哉 坂上
裕子 山本
翔 吉岡
昌一 片岡
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to CN202180090166.5A priority Critical patent/CN116745042A/zh
Priority to KR1020237022451A priority patent/KR20230114284A/ko
Publication of WO2022185684A1 publication Critical patent/WO2022185684A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
    • B23Q7/04—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • B26D1/157—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis
    • B26D1/18—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis mounted on a movable carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Definitions

  • the present invention relates to processing equipment.
  • a strip picker moves in the X-axis direction to transfer a semiconductor strip from an on-loading device to a chuck table of a cutting device, and the chuck table sucks the semiconductor strip to produce a Y-axis.
  • Arrangements have been conceived in which the semiconductor strip is cut into semiconductor packages by a spindle after an axial movement to the rear of the system.
  • the chuck table is configured to be moved in the Y-axis direction using a ball screw (ball screw mechanism).
  • the ball screw is used to move the chuck table to perform cutting. It is necessary to provide a bellows member that protects against dust and to provide a plurality of plate members on the bellows member to protect the bellows member. As a result, the device configuration becomes complicated.
  • the semiconductor strip is not only transported in the X-axis direction, but also transported to the rear of the system in the Y-axis direction to cut the semiconductor strip, which increases the footprint of the device.
  • the present invention has been made to solve the above-mentioned problems, and its main object is to simplify the device configuration and reduce the footprint.
  • a processing apparatus includes a processing table that holds an object to be processed, a first holding mechanism that holds the object to be processed in order to convey the object to be processed to the processing table, and a mechanism that holds the object to be processed on the processing table.
  • a processing mechanism for processing the processed workpiece a transfer table to which the processed workpiece is transferred; and a processing mechanism for transferring the processed workpiece from the processing table to the transfer table.
  • a processing movement mechanism for moving the processing mechanism in a horizontal plane in a first direction along the transfer shaft and in a second direction orthogonal to the first direction. do.
  • FIG. 1 It is a figure showing typically composition of a cutting device concerning one embodiment of the present invention. It is a perspective view which shows typically the table for cutting of the same embodiment, and its peripheral structure. It is the figure (plan view) seen from the Z direction which shows typically the structure of the cutting table of the same embodiment, and its peripheral structure. It is the figure (front view) seen from the Y direction which shows typically the structure of the cutting table of the same embodiment, and its peripheral structure. It is the figure (front view) seen from the Y direction which shows typically the structure of the 1st holding mechanism of the same embodiment, and the moving mechanism for conveyance. It is the figure (side view) which showed typically the structure of the 1st holding mechanism of the same embodiment, and the moving mechanism for conveyance seen from the X direction.
  • FIG. 4 is a cross-sectional view viewed from the X direction schematically showing the configuration of the processing moving mechanism and the cover member of the same embodiment.
  • FIG. 4 is a cross-sectional view viewed from the Y direction schematically showing the configuration of the processing moving mechanism and the cover member of the same embodiment. It is a schematic diagram which shows operation
  • the processing apparatus of the present invention includes a processing table that holds an object to be processed, a first holding mechanism that holds the object to be processed in order to convey the object to be processed to the processing table, and the processing table.
  • a processing movement mechanism that moves the processing mechanism in a horizontal plane in a first direction along the transfer shaft and in a second direction orthogonal to the first direction.
  • the first holding mechanism and the second holding mechanism are moved by a common transfer shaft extending along the arrangement direction of the processing table and the transfer table, and the processing movement mechanism moves the processing mechanism in the horizontal plane. Since it is moved in the first direction along the transfer axis and in the second direction orthogonal to the first direction, the workpiece can be processed without moving the processing table in the first direction and the second direction. . Therefore, the bellows member for protecting the ball screw mechanism and the cover member for protecting the bellows member can be eliminated without moving the machining table by the ball screw mechanism. As a result, the device configuration of the processing device can be simplified. In addition, since the processing table does not move in the first direction and the second direction on the horizontal plane, it is possible to reduce the movement space of the processing table and the wasted space around it, thereby reducing the footprint of the processing apparatus. be able to.
  • the transfer shaft is arranged above the moving mechanism for processing so as to cross the moving mechanism for processing.
  • the first holding mechanism that moves along the transfer axis can be moved above the moving mechanism for processing, and the first holding mechanism can be prevented from physically interfering with the moving mechanism for processing. can be done.
  • the second holding mechanism that moves along the transfer axis can be moved above the moving mechanism for processing, and the second holding mechanism can be prevented from physically interfering with the moving mechanism for processing.
  • the processing apparatus of the present invention preferably has a plurality of processing tables.
  • the plurality of processing tables and the transfer table are arranged in a row on a horizontal plane.
  • the workpiece can be transferred to each of the plurality of processing tables by the first holding mechanism that moves along the common transfer axis.
  • the workpiece after machining can be transferred from each of the plurality of machining tables to the transfer table by the second holding mechanism that moves along the common transfer axis.
  • another processing such as transportation can be performed on the other processing table.
  • the machining table is configured not to move in the first direction and the second direction on the horizontal plane, and the machining movement mechanism only moves the machining mechanism in the first direction and the second direction, the machining of the object to be machined is restricted. There is a risk that In order to eliminate this restriction on machining, it is desirable that the machining table be configured to be rotatable on the horizontal plane.
  • the first holding mechanism, the second holding mechanism, the processing table, and the transfer table should be arranged with respect to the transfer axis in plan view. preferably on the same side. Moreover, since the first holding mechanism, the second holding mechanism, the processing table, and the transfer table are provided on the same side, maintainability can also be improved.
  • the working movement mechanism is a so-called gantry mechanism.
  • the processing movement mechanism includes a first direction movement unit that linearly moves the processing mechanism in the first direction, and a second direction movement unit that linearly moves the processing mechanism in the second direction,
  • the first direction moving part moves along a pair of first direction guide rails provided along the first direction with the machining table interposed therebetween, and moves along the pair of first direction guide rails.
  • the common transfer axis is positioned above and across the supports such that the common transfer axis and the supports are in a crosswise relationship with each other.
  • the pitch (interval) between the pair of first direction guide rails can be increased.
  • the pitch (interval) between the pair of first direction guide rails can be increased.
  • the machining mechanism for example, a rotary tool such as a blade
  • the first direction guide rail can be of lower specifications than the conventional one.
  • the processing apparatus of the present invention includes a first cleaning mechanism that cleans the upper surface of the processed object held on the processing table. It is desirable to further include In this configuration, in order to simplify the device configuration by moving the first cleaning mechanism using a common transfer shaft, the first cleaning mechanism is moved along the transfer shaft together with the first holding mechanism. It is desirable to be configured to be movable.
  • the processing apparatus of the present invention cleans the lower surface of the processed workpiece held by the second holding mechanism. It is desirable to further include a second cleaning mechanism for cleaning the side.
  • the processing apparatus of the present invention includes an inspection unit for inspecting the processed object held by the second holding mechanism, and the processed object after processing. It is desirable to further include a reversing mechanism for reversing the processed object so that both sides of the object can be inspected by the inspection unit.
  • the transportation movement mechanism is provided on the transfer shaft and has a common mechanism for guiding the first holding mechanism and the second holding mechanism. and a rack and pinion mechanism for moving the first holding mechanism and the second holding mechanism along the guide rail.
  • the rack and pinion mechanism includes a cam rack common to the first holding mechanism and the second holding mechanism, and a pinion gear provided in each of the first holding mechanism and the second holding mechanism and rotated by an actuator. It is desirable to have With this configuration, it is possible to arbitrarily set the movement ranges of the first holding mechanism and the second holding mechanism by changing the length of the common cam rack.
  • the conveying movement mechanism is interposed between the transfer shaft and the first holding mechanism, and includes an elevation movement mechanism that moves the first holding mechanism up and down relative to the transfer shaft, and the transfer shaft. It is desirable to further include a horizontal movement mechanism interposed between the first holding mechanism and moving the first holding mechanism along the second direction with respect to the transfer shaft.
  • the elevating movement mechanism not only moves up and down when the first holding mechanism delivers the workpiece, but also moves up and down so that the first holding mechanism does not physically interfere with the moving mechanism for processing.
  • the horizontal movement mechanism can adjust the position of the workpiece along the second direction with respect to the machining table when the workpiece is placed on the machining table by the first holding mechanism.
  • the horizontal movement mechanism is provided along the second direction and includes a horizontal guide rail for guiding the first holding mechanism, and a horizontal guide rail for guiding the first holding mechanism. It is desirable to have an elastic body that applies force to one side of the first guide portion, and a cam mechanism that moves the first holding mechanism to the other side of the first guide portion.
  • the processing apparatus of the present invention since the processing mechanism moved by the processing movement mechanism with respect to the processing table fixed in the first direction and the second direction processes the object to be processed, the processing table is moved in the first direction or the second direction. A moving mechanism for moving in two directions is not required. For this reason, it is preferable that the processing apparatus of the present invention further include a processing waste storage section provided below the processing table for storing processing waste generated by processing by the processing mechanism. By providing the processing waste container below the processing table in this manner, the collection rate of processing waste can be improved.
  • the processing waste storage section includes a guide chute having an upper opening surrounding the processing table in a plan view, and a recovery device for collecting the processing waste guided by the guide shooter. It is desirable to have a container. With this configuration, since the guide shooter has an upper opening surrounding the processing table, it is difficult to remove processing waste scattered or dropped from the processing table, and the processing waste recovery rate can be further improved.
  • the cutting direction by the blade and the first direction by the moving mechanism for machining match (that is, the rotational axis direction of the blade and the It is particularly important that the first direction by the moving mechanism for processing is perpendicular to the first direction.
  • the object to be processed is a resin-sealed substrate, and the processing mechanism cuts the sealed substrate with a blade. It is desirable that the product is singulated into a plurality of products.
  • a method for manufacturing a processed product using the processing apparatus described above is also an aspect of the present invention.
  • the processing apparatus 100 of the present embodiment is a cutting apparatus that separates a plurality of products P by cutting a sealed substrate W, which is an object to be processed.
  • the cutting apparatus 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W, and the sealed substrate W on the cutting tables 2A and 2B.
  • a first holding mechanism 3 that holds the sealed substrate W for transportation
  • a cutting mechanism (processing mechanism) 4 that cuts the sealed substrate W held on the cutting tables 2A and 2B, and a plurality of products P a transfer table 5 to which the are transferred
  • a second holding mechanism 6 for holding a plurality of products P in order to transfer the plurality of products P from the cutting tables 2A and 2B to the transfer table 5
  • a transfer moving mechanism 7 having a common transfer shaft 71 for moving the second holding mechanism 6, and a cutting mechanism 4 for moving the sealed substrate W held by the cutting tables 2A and 2B.
  • a moving mechanism (processing moving mechanism) 8 is provided.
  • the sealed substrate W is a substrate to which electronic elements such as a semiconductor chip, a resistor element, a capacitor element, etc. are connected, and at least the electronic elements are resin-molded so as to be resin-sealed.
  • a lead frame and a printed wiring board can be used as the substrate constituting the sealed substrate W.
  • semiconductor substrates including semiconductor wafers such as silicon wafers
  • metal substrates including semiconductor wafers such as silicon wafers
  • ceramic substrates a substrate made of glass, a substrate made of resin, or the like can be used.
  • the substrates constituting the sealed substrate W may or may not be wired.
  • the directions orthogonal to each other in the plane (horizontal plane) along the upper surfaces of the cutting tables 2A and 2B are the X direction and the Y direction, respectively, and the vertical direction orthogonal to the X direction and the Y direction is the Z direction.
  • the horizontal direction in FIG. 1 is the X direction
  • the vertical direction is the Y direction.
  • the X direction is the direction in which the support 812 moves
  • the two cutting tables 2A, 2B are fixed in the X, Y and Z directions.
  • the cutting table 2A can be rotated in the .theta. direction by a rotating mechanism 9A provided below the cutting table 2A.
  • the cutting table 2B can be rotated in the .theta. direction by a rotating mechanism 9B provided under the cutting table 2B.
  • These two cutting tables 2A and 2B are provided along the X direction on the horizontal plane. Specifically, the two cutting tables 2A and 2B are arranged such that their upper surfaces are positioned on the same horizontal plane (located at the same height in the Z direction) (see FIG. 4), and their The centers of the upper surfaces (specifically, the centers of rotation of the rotation mechanisms 9A and 9B) are arranged on the same straight line extending in the X direction (see FIGS. 2 and 3).
  • the two cutting tables 2A and 2B suck and hold the sealed substrate W, and as shown in FIG.
  • Two vacuum pumps 10A, 10B are arranged.
  • Each vacuum pump 10A, 10B is, for example, a water ring vacuum pump.
  • the pipes (not shown) connected from the vacuum pumps 10A and 10B to the cutting tables 2A and 2B can be shortened, and the pipe pressure It is possible to reduce the loss and prevent the deterioration of the adsorption force. As a result, even a very small package of, for example, 1 mm square or less can be reliably attracted to the cutting tables 2A and 2B.
  • the capacities of the vacuum pumps 10A and 10B can be reduced, leading to miniaturization and cost reduction.
  • the first holding mechanism 3 holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B.
  • the first holding mechanism 3 includes a suction head 31 provided with a plurality of suction portions 311 for sucking and holding the sealed substrate W, and a suction portion of the suction head 31. 311 and a vacuum pump (not shown). Then, the suction head 31 is moved to a desired position by a transfer mechanism 7 or the like, which will be described later, to transfer the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B.
  • the substrate supply mechanism 11 includes a substrate accommodation portion 111 that accommodates a plurality of sealed substrates W from the outside, and a first holding portion for the sealed substrates W accommodated in the substrate accommodation portion 111 . and a substrate supply unit 112 for moving to a holding position RP where the mechanism 3 sucks and holds the substrate.
  • This holding position RP is set so as to be aligned with the two cutting tables 2A and 2B in the X direction.
  • the substrate supply mechanism 11 may have a heating unit 113 that heats the sealed substrate W to be attracted by the first holding mechanism 3 so as to make it flexible and facilitate the attraction.
  • the cutting mechanism 4 as shown in FIGS. 1, 2 and 3, has two rotary tools 40 comprising blades 41A, 41B and two spindles 42A, 42B.
  • the two spindles 42A, 42B are provided with their rotation axes along the Y direction, and the blades 41A, 41B attached thereto are arranged so as to face each other (see FIG. 3).
  • the blade 41A of the spindle 42A and the blade 41B of the spindle 42B cut the sealed substrate W held on the cutting tables 2A and 2B by rotating in a plane including the X direction and the Z direction. As shown in FIG.
  • the cutting apparatus 100 of the present embodiment includes a liquid supply mechanism 12 having an injection nozzle 121 for injecting cutting water (working fluid) to suppress frictional heat generated by the blades 41A and 41B. is provided.
  • This injection nozzle 121 is supported by, for example, a Z-direction moving unit 83, which will be described later.
  • the transfer table 5 of the present embodiment is a table to which a plurality of products P inspected by an inspection unit 13, which will be described later, are transferred.
  • This transfer table 5 is a so-called index table, and a plurality of products P are temporarily placed thereon before sorting the plurality of products P onto various trays 21 .
  • the transfer table 5 and the two cutting tables 2A and 2B are arranged in a line along the X direction on the horizontal plane. A plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 according to the inspection results (good products, defective products, etc.) by the inspection unit 13 .
  • the various trays 21 are transported to desired positions by the tray transport mechanism 22 that moves along the transfer shaft 71, and the products P sorted by the sorting mechanism 20 are placed thereon. After being sorted, the various trays 21 are accommodated in the tray accommodating section 23 by the tray conveying mechanism 22 .
  • the inspection unit 13 is provided between the cutting tables 2A and 2B and the transfer table 5, and inspects the plurality of products P held by the second holding mechanism 6.
  • the inspection unit 13 of this embodiment has a first inspection unit 131 that inspects the sealing surface (package surface) of the product P and a second inspection unit 132 that inspects the lead surface of the product P.
  • the first inspection unit 131 is an imaging camera having an optical system for inspecting the package surface
  • the second inspection unit 132 is an imaging camera having an optical system for inspecting the lead surface. Note that the first inspection unit 131 and the second inspection unit 132 may be shared.
  • the sealed substrate W and the product P of this embodiment are configured such that one surface of the substrate is molded with resin.
  • the resin-molded surface is the surface on which the electronic element connected to the substrate is resin-sealed, and is called a “sealing surface” or a “package surface”.
  • the non-resin-molded surface opposite to the resin-molded surface is called the lead surface because the leads functioning as external connection electrodes of the product are usually exposed.
  • this lead is a protruding electrode used in an electronic component such as a BGA (Ball Grid Array), it is sometimes called a "ball surface".
  • the non-resin-molded surface opposite to the resin-molded surface may be called a "substrate surface" because there are some forms in which leads are not formed.
  • the resin-molded surface is referred to as the “sealing surface” or "package surface”
  • the resin-molded surface opposite to the resin-molded surface is referred to as the "lead surface”.
  • a reversing mechanism 14 for reversing the plurality of products P is provided so that both sides of the plurality of products P can be inspected by the inspection unit 13 (see FIG. 1).
  • the reversing mechanism 14 has a holding table 141 that holds a plurality of products P, and a reversing unit 142 such as a motor that turns the holding table 141 upside down.
  • the package surface of the products P faces downward.
  • the package surfaces of the products P are inspected by the first inspection unit 131.
  • FIG. Thereafter, the plurality of products P held by the second holding mechanism 6 are reversed by the reversing mechanism 14 and held by the second holding mechanism 6 again.
  • the lead surface of the product P faces downward, and the lead surface of the product P is inspected by moving the second holding mechanism 6 to the second inspection section 132 .
  • the second holding mechanism 6 holds a plurality of products P in order to convey the plurality of products P from the cutting tables 2A and 2B to the transfer table 5, as shown in FIG.
  • the second holding mechanism 6 is connected to a suction head 61 provided with a plurality of suction portions 611 for sucking and holding a plurality of products P, and the suction portions 611 of the suction head 61 . and a vacuum pump (not shown). Then, the suction head 61 is moved to a desired position by a transfer mechanism 7 or the like, which will be described later, to transfer the plurality of products P from the cutting tables 2A and 2B to the holding table 141 or the transfer table 5 .
  • the transportation moving mechanism 7 moves the first holding mechanism 3 between at least the substrate supply mechanism 11 and the cutting tables 2A and 2B, and moves the second holding mechanism 6 between at least the cutting tables. It is moved between 2A, 2B and the holding table 141 .
  • the transportation moving mechanism 7 extends in a straight line along the arrangement direction (X direction) of the two cutting tables 2A and 2B and the transfer table 5, and the first holding mechanism 3 and the second 2 has a common transfer shaft 71 for moving the holding mechanism 6 .
  • the transfer shaft 71 is provided within a range in which the first holding mechanism 3 can move above the substrate supply section 112 of the substrate supply mechanism 11 and the second holding mechanism 6 can move above the transfer table 5 ( See Figure 1).
  • the first holding mechanism 3, the second holding mechanism 6, the cutting tables 2A and 2B, and the transfer table 5 are provided on the same side (front side) of the transfer shaft 71 in plan view.
  • the inspection section 13, the reversing mechanism 14, various trays 21, the tray conveying mechanism 22, the tray accommodating section 23, the first cleaning mechanism 18 and the second cleaning mechanism 19 described later, and the collection container 172 are the same with respect to the transfer shaft 71. provided on the side (front side).
  • the transporting moving mechanism 7 includes a main moving mechanism 72 that moves the first holding mechanism 3 and the second holding mechanism 6 in the X direction along the transfer shaft 71; A vertical movement mechanism 73 for vertically moving the first holding mechanism 3 and the second holding mechanism 6 with respect to the transfer shaft 71 in the Z direction, and a vertical movement mechanism 73 for vertically moving the first holding mechanism 3 and the second holding mechanism 6 with respect to the transfer shaft 71 in the Y direction. and a horizontal movement mechanism 74 for horizontal movement.
  • the main moving mechanism 72 is provided on the transfer shaft 71 and has a common guide rail 721 for guiding the first holding mechanism 3 and the second holding mechanism 6. and a rack-and-pinion mechanism 722 for moving the first holding mechanism 3 and the second holding mechanism 6 .
  • the guide rail 721 extends straight in the X direction along the transfer shaft 71, and, like the transfer shaft 71, allows the first holding mechanism 3 to move above the substrate supply portion 112 of the substrate supply mechanism 11, 2 A holding mechanism 6 is provided within a range in which it can move above the transfer table 5 .
  • the guide rail 721 is slidably provided with a slide member 723 on which the first holding mechanism 3 and the second holding mechanism 6 are provided via a vertical movement mechanism 73 and a horizontal movement mechanism 74 .
  • the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6, but the vertical movement mechanism 73, the horizontal movement mechanism 74 and the slide member 723 are common to the first holding mechanism 3 and the second holding mechanism 6. provided separately for each.
  • the rack and pinion mechanism 722 includes a cam rack 722a common to the first holding mechanism 3 and the second holding mechanism 6, and a pinion provided in each of the first holding mechanism 3 and the second holding mechanism 6 and rotated by an actuator (not shown). and a gear 722b.
  • the cam rack 722a is provided on the common transfer shaft 71 and can be varied in length by connecting a plurality of cam rack elements.
  • the pinion gear 722b is provided on the slide member 723 and is called a so-called roller pinion. As shown in FIG. It has a plurality of roller pins 722b2 which are provided at equal intervals in the circumferential direction between the roller bodies 722b1 and are provided so as to be able to roll with respect to the roller body 722b1.
  • the rack-and-pinion mechanism 722 of this embodiment uses the roller pinions described above, two or more roller pins 722b2 come into contact with the cam rack 722a. Positioning accuracy is improved when moving the first holding mechanism 3 and the second holding mechanism 6 in the X direction.
  • the lifting mechanism 73 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6.
  • the lifting mechanism 73 of the first holding mechanism 3 is interposed between the transfer shaft 71 (specifically, the main moving mechanism 72) and the first holding mechanism 3, as shown in FIGS. It has a Z-direction guide rail 73a provided along the Z-direction, and an actuator portion 73b for moving the first holding mechanism 3 along the Z-direction guide rail 73a.
  • the actuator section 73b may use, for example, a ball screw mechanism, an air cylinder, or a linear motor.
  • the configuration of the up-and-down movement mechanism 73 of the second holding mechanism 6 is the same as that of the up-and-down movement mechanism 73 of the first holding mechanism 3, as shown in FIG.
  • the horizontal movement mechanism 74 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6, as shown in FIGS.
  • the horizontal movement mechanism 74 of the first holding mechanism 3 is interposed between the transfer shaft 71 (specifically, the vertical movement mechanism 73) and the first holding mechanism 3, as shown in FIGS. Y-direction guide rails 74a provided along the Y-direction, elastic bodies 74b for applying force to the first holding mechanism 3 on one side of the Y-direction guide rails 74a, and the first holding mechanism 3. and a cam mechanism 74c for moving to the other side of the Y-direction guide rail 74a.
  • the cam mechanism 74c uses an eccentric cam, and the amount of movement of the first holding mechanism 3 in the Y direction can be adjusted by rotating the eccentric cam with an actuator such as a motor.
  • the configuration of the horizontal movement mechanism 74 of the second holding mechanism 6 is the same as that of the vertical movement mechanism 73 of the first holding mechanism 3, as shown in FIG. Further, the second holding mechanism 6 may be configured without the horizontal movement mechanism 74 , or both the first holding mechanism 3 and the second holding mechanism 6 may be configured without the horizontal movement mechanism 74 . Further, the horizontal movement mechanism 74 may use, for example, a ball screw mechanism or an air cylinder without using the cam mechanism 74c, like the elevation movement mechanism 73. Alternatively, a linear motor may be used.
  • the cutting movement mechanism 8 linearly moves the two spindles 42A and 42B independently in the X, Y and Z directions.
  • the cutting movement mechanism 8 includes an X-direction movement unit 81 that linearly moves the spindles 32A and 32B in the X direction, and an X-direction movement unit 81 that moves the spindles 32A and 32B in the Y direction.
  • a Y-direction moving unit 82 that linearly moves the spindles 32A and 32B in the Z-direction.
  • the X-direction moving part 81 is common to the two cutting tables 2A and 2B, and is provided along the X direction with the two cutting tables 2A and 2B interposed therebetween, as particularly shown in FIGS. and a support body 812 that moves along the pair of X-direction guide rails 811 and supports the spindles 32A and 32B via the Y-direction movement portion 82 and the Z-direction movement portion 83. and A pair of X-direction guide rails 811 are provided on the sides of the two cutting tables 2A and 2B provided along the X-direction.
  • the support 812 is, for example, a portal type and has a shape extending in the Y direction. Specifically, the support 812 has a pair of legs extending upward from the pair of X-direction guide rails 811 and beams (beams) bridging the pair of legs. extending in the direction
  • the support 812 is linearly reciprocated along the X direction on a pair of X direction guide rails 811 by, for example, a ball screw mechanism 813 extending in the X direction.
  • the ball screw mechanism 813 is driven by a drive source (not shown) such as a servomotor.
  • the support 812 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
  • the Y-direction moving part 82 includes a Y-direction guide rail 821 provided along the Y direction on the support 812, and a Y-direction slider 822 that moves along the Y-direction guide rail 821. have.
  • the Y-direction slider 822 is driven by, for example, a linear motor 823 and linearly reciprocates on the Y-direction guide rail 821 .
  • two Y-direction sliders 822 are provided corresponding to the two spindles 32A, 32B. This allows the two spindles 32A and 32B to move independently of each other in the Y direction.
  • the Y-direction slider 822 may be configured to reciprocate by another direct acting mechanism using a ball screw mechanism.
  • the Z-direction moving part 83 moves along a Z-direction guide rail 831 provided along the Z-direction on each Y-direction slider 822 and moves along the Z-direction guide rail 831. and a Z-direction slider 832 that supports the spindles 32A, 32B. That is, the Z-direction moving part 83 is provided corresponding to each spindle 32A, 32B.
  • the Z-direction slider 832 is driven by, for example, an eccentric cam mechanism (not shown), and linearly reciprocates on the Z-direction guide rail 831 .
  • the Z-direction slider 832 may be configured to reciprocate by another direct acting mechanism such as a ball screw mechanism.
  • the positional relationship between the moving mechanism 8 for cutting and the transfer shaft 71 is such that the transfer shaft 71 is arranged above the moving mechanism 8 for cutting so as to cross the moving mechanism 8 for cutting. ing. Specifically, the transfer shaft 71 is arranged above the support 812 so as to cross the support 812 , and the transfer shaft 71 and the support 812 have a positional relationship of crossing each other.
  • the support 812 in the cutting movement mechanism 8 is provided with a cover member 15 for accommodating the two spindles 32A and 32B. Note that the cover member 15 is omitted in FIG. The cover member 15 accommodates not only the two spindles 32A and 32B but also the injection nozzle 121 so that cutting water injected from the injection nozzle 121 does not scatter around.
  • the cover member 15 is formed with openings 15a for exposing the blades 41A and 41B on its lower surface.
  • An opening 15b is formed in the upper surface of the cover member 15 so as not to interfere with the movement of the spindles 42A and 42B and the moving mechanism 8 for cutting.
  • the opening 15b on the upper surface is closed by a bellows member 16, which is configured to expand and contract as the spindles 42A and 42B move.
  • the cover member 15 and the bellows member 16 cover both sides in the X direction, both sides in the Y direction, and the upper side of the spindles 42A and 42B, thereby limiting the range in which the cutting water jetted from the jet nozzle 121 scatters.
  • a window 151 through which the inside of the cover member 15 can be viewed is formed in the side wall on the front side of the cover member 15 (the side opposite to the support 812) (see FIG. 10). Furthermore, by evacuating the surroundings of the cover member 15 with an exhaust mechanism (not shown), droplets (mist) can be effectively discharged to the outside.
  • the cutting apparatus 100 of the present embodiment further includes a processing waste storage section 17 that stores processing waste S such as offcuts generated by cutting the sealed substrate W, as shown in FIG.
  • the processing waste container 17 is provided below the cutting tables 2A and 2B, and is a guide chute having an upper opening 171X surrounding the cutting tables 2A and 2B in plan view. 171 and a collection container 172 for collecting the processing waste S guided by the guide shooter 171 .
  • the recovery rate of the processing waste S can be improved.
  • the guide shooter 171 guides the processing waste S scattered or dropped from the cutting tables 2A, 2B to the collection container 172.
  • the upper opening 171X of the guide shooter 171 surrounds the cutting tables 2A and 2B (see FIG. 3)
  • it is difficult to remove the processing waste S, and the collection rate of the processing waste S is further improved. can be improved.
  • the guide shooter 171 is provided so as to surround the rotating mechanisms 9A and 9B provided under the cutting tables 2A and 2B (see FIG. 4). is configured to protect
  • the processing waste container 17 is shared by the two cutting tables 2A and 2B, but may be provided for each of the cutting tables 2A and 2B.
  • the collection container 172 is for collecting the processing waste S that has passed through the guide shooter 171 by its own weight.
  • the two collection containers 172 are arranged on the front side of the transfer shaft, and configured to be independently removable from the front side of the cutting device 100 . With this configuration, it is possible to improve maintainability such as disposal of the processing waste S. Considering the size of the sealed substrate W, the size and amount of the processing waste S, the workability, etc., one collection container 172 may be provided under the entire cutting table, or three collection containers may be provided. The above may be set.
  • the processing waste storage section 17 has a separating section 173 for separating cutting water and processing waste.
  • a filter such as a perforated plate that allows cutting water to pass through the bottom surface of the collection container 172 may be provided.
  • the separation unit 173 allows the processing waste S to be collected without accumulating cutting water in the collection container 172 .
  • the cutting apparatus 100 of the present invention includes a first cleaning mechanism 18 that cleans the upper surfaces (lead surfaces) of the plurality of products P held on the cutting tables 2A and 2B. I have more.
  • the first cleaning mechanism 18 cleans the upper surfaces of the products P by means of injection nozzles 18a (see FIG. 5) that inject cleaning liquid and/or compressed air onto the upper surfaces of the plurality of products P held on the cutting tables 2A and 2B. It is for cleaning.
  • the first cleaning mechanism 18 is configured to be movable along the transfer shaft 71 together with the first holding mechanism 3, as shown in FIG.
  • the first cleaning mechanism 18 is provided on a slide member 723 that slides on a guide rail 721 provided on the transfer shaft 71 .
  • an elevation movement mechanism 181 for vertically moving the first cleaning mechanism 18 in the Z direction.
  • the lifting mechanism 181 may be, for example, one using a rack and pinion mechanism, one using a ball screw mechanism, or one using an air cylinder.
  • the cutting device 100 of the present invention further includes a second cleaning mechanism 19 that cleans the lower surface side (package surface) of the plurality of products P held by the second holding mechanism 6, as shown in FIG. .
  • the second cleaning mechanism 19 is provided between the cutting table 2B and the inspection section 13, and sprays cleaning liquid and/or compressed air onto the lower surfaces of the plurality of products P held by the second holding mechanism 6. By doing so, the lower surface side of the product P is cleaned. That is, the second cleaning mechanism 19 cleans the lower surface side of the product P while the second holding mechanism 6 is being moved along the transfer shaft 71 .
  • FIG. 11 shows the moving path of the first holding mechanism 3 and the moving path of the second holding mechanism 6 in the operation of the cutting device 10.
  • all operations and controls of the cutting apparatus 100 such as transportation of the sealed substrate W, cutting of the sealed substrate W, and inspection of the product P, are performed by the control unit CTL (see FIG. 1). ).
  • the substrate supply unit 112 of the substrate supply mechanism 11 moves the sealed substrate W accommodated in the substrate accommodation unit 111 toward the holding position RP held by the first holding mechanism 3 .
  • the transport moving mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 holds the sealed substrate W by suction.
  • the transfer moving mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting tables 2A and 2B, and the first holding mechanism 3 releases the suction holding, and the sealed substrate W is released.
  • a substrate W is placed on the cutting tables 2A and 2B.
  • the main moving mechanism 72 adjusts the position of the sealed substrate W in the X direction
  • the horizontal moving mechanism 74 adjusts the position of the sealed substrate W in the Y direction.
  • the cutting tables 2A and 2B hold the sealed substrate W by suction.
  • the elevation movement mechanism 73 moves the first holding mechanism 3 to the cutting movement mechanism 8 (support body 812). Raise to a position where there is no physical interference.
  • the support body 812 is retracted from the cutting table 2B to the transfer table 5 side. It is not necessary to raise and lower the first holding mechanism 3 at this time.
  • the cutting movement mechanism 8 sequentially moves the two spindles 42A and 42B in the X direction and the Y direction, and the cutting tables 2A and 2B rotate to cut the sealed substrate W in a grid pattern. and singulate.
  • the transfer mechanism 7 moves the first cleaning mechanism 18 to clean the upper surface side (lead surface) of the multiple products P held on the cutting tables 2A and 2B. After this cleaning, the transfer mechanism 7 retracts the first holding mechanism 3 and the first cleaning mechanism 18 to predetermined positions.
  • the transfer movement mechanism 7 moves the second holding mechanism 6 to the cutting tables 2A and 2B after cutting, and the second holding mechanism 6 holds the plurality of products P by suction.
  • the transport moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the second cleaning mechanism 19 .
  • the second cleaning mechanism 19 cleans the lower surface side (package surface) of the plurality of products P held by the second holding mechanism 6 .
  • the multiple products P held by the second holding mechanism 6 are double-sided inspected by the inspection unit 13 and the reversing mechanism 14 .
  • the transfer movement mechanism 7 moves the second holding mechanism 6 to the transfer table 5
  • the second holding mechanism 6 releases the suction holding, and places the plurality of products P on the transfer table 5 .
  • a plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 according to the inspection results (good products, defective products, etc.) by the inspection unit 13 .
  • the double-sided inspection for example, first, one side of the product P is inspected while being sucked and held by the second holding mechanism 6 . Next, the product P is transferred from the second holding mechanism 6 to the holding table 141 of the reversing mechanism 14, and the other side of the product P is inspected while being sucked and held by the holding table 141 after reversing. inspection can be performed. Subsequently, the product P can be transferred from the reversing table 14 to the transfer table 5 by transferring it from the holding table 141 to the second holding mechanism 6 .
  • the holding table 141 is configured to be movable in the X direction, and at least one of the holding table 141 and the transfer table 5 is configured to be movable in the Z direction, and the holding table 141 is moved above the transfer table 5.
  • the product P can also be transported to the transfer table 5 and transferred.
  • the first holding mechanism 3 and the second holding mechanism 6 are moved by the common transfer shaft 71 extending along the arrangement direction of the cutting tables 2A and 2B and the transfer table 5.
  • the cutting mechanism 4 is moved in the horizontal plane by the cutting movement mechanism 8 in the X direction along the transfer shaft 71 and in the Y direction orthogonal to the X direction, so that the cutting tables 2A and 2B are moved in the X direction and the Y direction.
  • the sealed substrate W can be processed without the need to Therefore, the bellows member for protecting the ball screw mechanism and the cover member for protecting the bellows member can be eliminated without moving the cutting tables 2A and 2B by the ball screw mechanism.
  • the configuration of the cutting device 100 can be simplified.
  • the cutting tables 2A and 2B can be configured so as not to move in the X and Y directions, and the footprint of the cutting device 100 can be reduced.
  • the pitch between the pair of X-direction guide rails 811 can be increased.
  • the straightness of the X-direction moving portion 81 is improved by increasing the pitch of the pair of guide rails 811, and as a result, the deflection of the cutting edges of the blades 41A and 41B is reduced, and the cutting resistance during cutting is reduced.
  • machining accuracy can be improved.
  • the Y-direction guide rail 811 can be used with lower specifications than the conventional one.
  • the moving mechanism 8 (X direction moving unit 81) moves in the X direction with respect to the two or more cutting tables 2A and 2B.
  • Parallelism can be adjusted at once. That is, when two cutting tables are provided in a conventional apparatus in which the cutting tables move during cutting, the parallelism in the X direction of the two cutting tables is adjusted, and the parallelism in the X direction and the blade are adjusted. Although it was necessary to adjust the parallelism in the X direction (specifically, two adjustments were required), in this embodiment, the two cutting tables 2A and 2B move in the X direction during cutting. Therefore, it is sufficient to adjust the parallelism of the blades 41A and 41B in the X direction (specifically, one adjustment is sufficient).
  • twin-cut table system and a twin-spindle configuration cutting device have been described. It may be a system, such as a cutting device with a twin spindle configuration.
  • the transfer table 5 of the above embodiment is an index table that is temporarily placed before sorting into the various trays 21 , but the transfer table 5 may be used as the holding table 141 of the reversing mechanism 14 .
  • the transfer table 5 is sorted into the tray 21, but the product P may be conveyed and attached to the adhesive tape arranged inside the frame-shaped member.
  • the grooves may be formed without cutting the sealed substrate on the cutting tables 2A and 2B.
  • the sealed substrate W grooved by the cutting tables 2A and 2B may be returned to the substrate supply section 112 by the first holding mechanism 3 and the transfer movement mechanism 7 .
  • the sealed substrate W returned to the substrate supply section 112 may be accommodated in the substrate accommodation section 111 .
  • the cutting device (processing device) 100 can be separated and connected between the second cleaning mechanism 19 and the inspection unit 13. It can be configured as a removable (detachable) module. In this case, for example, between the module on the second cleaning mechanism 19 side and the module on the inspection section 13 side, a module that performs an inspection different from the inspection performed by the inspection section 13 can be added.
  • the cutting device (processing device) 100 may have a module configuration that can be separated and connected (detachable) at any point, and the modules to be added may be modules with various functions other than inspection. .
  • processing apparatus of the present invention may perform processing other than cutting, and may perform other mechanical processing such as cutting and grinding.
  • the present invention can simplify the device configuration and reduce the footprint.

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Forests & Forestry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Details Of Cutting Devices (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Feeding Of Workpieces (AREA)
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  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Threshing Machine Elements (AREA)

Abstract

La présente invention permet de simplifier la structure de dispositif et de réduire l'encombrement, et comprend : une table de travail (2A, 2B) pour maintenir un substrat scellé (W) ; un premier mécanisme de maintien (3) pour maintenir le substrat scellé (W) afin de transporter le substrat scellé (W) vers la table de travail (2A, 2B) ; un mécanisme de traitement (4) pour traiter le substrat scellé (W) maintenu par la table de travail (2A, 2B) ; une table de transfert (5) à laquelle une pluralité de produits (P) sont transférés ; un second mécanisme de maintien (6) pour maintenir la pluralité de produits (P) afin de transporter la pluralité de produits (P) de la table de travail (2A, 2B) à la table de transfert (5) ; un mécanisme de déplacement de transport (7) qui s'étend dans la direction le long de laquelle la table de travail (2A, 2B) et la table de transfert (5) sont disposées, et a un arbre de transfert (71) commun pour déplacer le premier mécanisme de maintien (3) et le second mécanisme de maintien (6) ; et un mécanisme de déplacement de traitement (8) qui déplace, dans un plan horizontal, le mécanisme de traitement (4) dans chacune d'une direction (X) le long de l'arbre de transfert (71) et une direction (Y) croisant la direction (X).
PCT/JP2021/047824 2021-03-04 2021-12-23 Dispositif de traitement WO2022185684A1 (fr)

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