WO2022209080A1 - Dispositif d'usinage et procédé de fabrication d'article usiné - Google Patents

Dispositif d'usinage et procédé de fabrication d'article usiné Download PDF

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Publication number
WO2022209080A1
WO2022209080A1 PCT/JP2021/048104 JP2021048104W WO2022209080A1 WO 2022209080 A1 WO2022209080 A1 WO 2022209080A1 JP 2021048104 W JP2021048104 W JP 2021048104W WO 2022209080 A1 WO2022209080 A1 WO 2022209080A1
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WIPO (PCT)
Prior art keywords
tray
moving
sorting
cutting
holding
Prior art date
Application number
PCT/JP2021/048104
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English (en)
Japanese (ja)
Inventor
元樹 深井
聡子 堀
雄哉 坂上
裕子 山本
翔 吉岡
昌一 片岡
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to KR1020237026134A priority Critical patent/KR20230124085A/ko
Priority to CN202180093048.XA priority patent/CN117178352A/zh
Publication of WO2022209080A1 publication Critical patent/WO2022209080A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Definitions

  • the present invention relates to a processing device and a method for manufacturing a processed product.
  • a cutting system is provided with a tray picker for unloading trays on which packages are mounted and for loading new trays.
  • the tray picker is configured to independently horizontally and vertically move each of a plurality of trays by separate rows of picker drive members.
  • each of the plurality of trays is configured to move horizontally and vertically independently by separate rows of picker drive members, resulting in a large footprint of the cutting system.
  • the present invention has been made to solve the above problems, and its main object is to reduce the footprint of the processing apparatus.
  • a processing apparatus includes a processing mechanism for processing an object to be processed, a sorting mechanism for sorting the processed objects into a plurality of trays, and a tray moving mechanism for moving the tray.
  • the mechanism has three or more tray mounts on which the trays are mounted, and the three or more tray mounts are arranged in a line and independently of each other along the direction of the line. It is characterized by being movable to a sorting position by the sorting mechanism.
  • the footprint of the processing device can be reduced.
  • FIG. 1 It is a figure showing typically composition of a cutting device concerning one embodiment of the present invention. It is a perspective view which shows typically the table for cutting of the same embodiment, and its peripheral structure. It is the figure (plan view) seen from the Z direction which shows typically the structure of the cutting table of the same embodiment, and its peripheral structure. It is the figure (front view) seen from the Y direction which shows typically the structure of the cutting table of the same embodiment, and its peripheral structure. It is the figure (front view) seen from the Y direction which shows typically the structure of the 1st holding mechanism of the same embodiment, and the moving mechanism for conveyance. It is the figure (side view) which showed typically the structure of the 1st holding mechanism of the same embodiment, and the moving mechanism for conveyance seen from the X direction.
  • FIG. 4 is a diagram (plan view) viewed from the Z direction schematically showing the configurations of the tray transport mechanism and the tray moving mechanism of the same embodiment. It is the figure (plan view) seen from the Z direction which shows typically the composition of the tray movement mechanism of the embodiment.
  • FIG. 4 is a diagram (plan view) viewed from the Z direction schematically showing the configurations of the tray transport mechanism and the tray moving mechanism of the same embodiment. It is the figure (plan view) seen from the Z direction which shows typically the composition of the tray movement mechanism of the embodiment.
  • FIG. 4 is a perspective view schematically showing a state in which each tray of the same embodiment is in a sorting position, an accommodation position, and a retracted position; It is a sectional view showing typically height positions H1 and H2 of the 2nd tray placement part of the embodiment.
  • FIG. 11 is a cross-sectional view schematically showing height positions H1 and H2 of a third tray placing portion of the same embodiment;
  • FIG. 4 is a perspective view schematically showing a state in which the first tray placement section and the second tray placement section of the same embodiment pass each other;
  • FIG. 4 is a cross-sectional view schematically showing a state in which the first tray placement section and the second tray placement section of the same embodiment pass each other;
  • FIG. 10 is a perspective view schematically showing a state when the second tray placement section and the third tray placement section of the same embodiment pass each other;
  • FIG. 10 is a cross-sectional view schematically showing a state when the second tray placement section and the third tray placement section of the same embodiment pass each other;
  • FIG. 4 is a perspective view schematically showing a state in which the first tray placement section and the third tray placement section of the same embodiment pass each other;
  • FIG. 10 is a cross-sectional view schematically showing a state when the first tray placement section and the third tray placement section of the same embodiment pass each other;
  • the processing apparatus of the present invention includes a processing mechanism for processing an object to be processed, a sorting mechanism for sorting the processed objects into a plurality of trays, and a tray moving mechanism for moving the tray.
  • the tray moving mechanism has three or more tray placement units on which the trays are placed, and the three or more tray placement units are arranged in a line and are independent of each other along the direction of the line. and can be moved to a sorting position by the sorting mechanism.
  • three or more tray mounting units are arranged in a line and are configured to be movable to the sorting positions by the sorting mechanism independently of each other along the direction of the line.
  • the footprint of the processing equipment can be reduced.
  • since three or more tray placement units are arranged in a line the distance to each tray becomes the same when sorting the processed objects, and the transport time when sorting into each tray becomes the same. and improve productivity.
  • the tray moving mechanism adjusts the height position of at least one of the three or more tray stacking units. It is desirable to have a variable height position changer.
  • the height position changing unit vertically moves the tray stacking unit between a raised position at the height of the sorting position and a lowered position at a height that does not interfere with other tray stacking units. is desirable.
  • the processing apparatus of the present invention further includes a tray housing section that houses the tray.
  • the tray moving mechanism moves the three or more tray placement units between the sorting position and an accommodation position for accommodating the trays in the tray accommodation unit.
  • the processing apparatus of the present invention includes the tray accommodating section and the tray accommodating section. It is desirable to further include a tray transport mechanism for transporting the tray between the tray rests in position.
  • the tray moving mechanism has a first moving rail and a second moving rail provided parallel to each other, and two moving rails are provided on the first moving rail.
  • the tray mounting portions are provided movably so as not to interfere with each other, and the two tray mounting portions are provided on the second moving rail, one tray mounting portion being provided on the first moving rail. It is desirable that it be provided movably so as not to interfere with the
  • a method for manufacturing a processed product using the processing apparatus described above is also an aspect of the present invention.
  • the processing apparatus 100 of the present embodiment is a cutting apparatus that separates a sealed substrate W, which is an object to be processed, into a plurality of products P, which are processed products.
  • the cutting apparatus 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W, and the sealed substrate W on the cutting tables 2A and 2B.
  • a first holding mechanism 3 that holds the sealed substrate W for transportation
  • a cutting mechanism (processing mechanism) 4 that cuts the sealed substrate W held on the cutting tables 2A and 2B, and a plurality of products P a transfer table 5 to which the are transferred
  • a second holding mechanism 6 for holding a plurality of products P in order to transfer the plurality of products P from the cutting tables 2A and 2B to the transfer table 5
  • a transfer moving mechanism 7 having a common transfer shaft 71 for moving the second holding mechanism 6, and a cutting mechanism 4 for moving the sealed substrate W held by the cutting tables 2A and 2B.
  • a moving mechanism (processing moving mechanism) 8 is provided.
  • the sealed substrate W is a substrate to which electronic elements such as a semiconductor chip, a resistor element, a capacitor element, etc. are connected, and at least the electronic elements are resin-molded so as to be resin-sealed.
  • a lead frame and a printed wiring board can be used as the substrate constituting the sealed substrate W.
  • semiconductor substrates including semiconductor wafers such as silicon wafers
  • metal substrates metal substrates
  • ceramic substrates can be used.
  • a glass substrate, a resin substrate, or the like can be used.
  • the substrates constituting the sealed substrate W may or may not be wired.
  • the directions orthogonal to each other in the plane (horizontal plane) along the upper surfaces of the cutting tables 2A and 2B are the X direction and the Y direction, respectively, and the vertical direction orthogonal to the X direction and the Y direction is the Z direction.
  • the horizontal direction in FIG. 1 is the X direction
  • the vertical direction is the Y direction.
  • the X direction is the direction in which the support 812 moves
  • the two cutting tables 2A, 2B are fixed in the X, Y and Z directions.
  • the cutting table 2A can be rotated in the .theta. direction by a rotating mechanism 9A provided below the cutting table 2A.
  • the cutting table 2B can be rotated in the .theta. direction by a rotating mechanism 9B provided under the cutting table 2B.
  • These two cutting tables 2A and 2B are provided along the X direction on the horizontal plane. Specifically, the two cutting tables 2A and 2B are arranged such that their upper surfaces are positioned on the same horizontal plane (located at the same height in the Z direction) (see FIG. 4), and their The centers of the upper surfaces (specifically, the centers of rotation of the rotation mechanisms 9A and 9B) are arranged on the same straight line extending in the X direction (see FIGS. 2 and 3).
  • the two cutting tables 2A and 2B suck and hold the sealed substrate W, and as shown in FIG.
  • Two vacuum pumps 10A, 10B are arranged.
  • Each vacuum pump 10A, 10B is, for example, a water ring vacuum pump.
  • the pipes (not shown) connected from the vacuum pumps 10A and 10B to the cutting tables 2A and 2B can be shortened, and the pipe pressure It is possible to reduce the loss and prevent the deterioration of the adsorption force. As a result, even a very small package of, for example, 1 mm square or less can be reliably attracted to the cutting tables 2A and 2B.
  • the capacities of the vacuum pumps 10A and 10B can be reduced, leading to miniaturization and cost reduction.
  • the first holding mechanism 3 holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B.
  • the first holding mechanism 3 includes a suction head 31 provided with a plurality of suction portions 311 for sucking and holding the sealed substrate W, and a suction portion of the suction head 31. 311 and a vacuum pump (not shown). Then, the suction head 31 is moved to a desired position by a transfer mechanism 7 or the like, which will be described later, to transfer the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B.
  • the substrate supply mechanism 11 includes a substrate accommodation portion 111 that accommodates a plurality of sealed substrates W from the outside, and a first holding portion for the sealed substrates W accommodated in the substrate accommodation portion 111 . and a substrate supply unit 112 for moving to a holding position RP where the mechanism 3 sucks and holds the substrate.
  • This holding position RP is set so as to be aligned with the two cutting tables 2A and 2B in the X direction.
  • the substrate supply mechanism 11 may have a heating unit 113 that heats the sealed substrate W to be attracted by the first holding mechanism 3 so as to make it flexible and facilitate the attraction.
  • the cutting mechanism 4 as shown in FIGS. 1, 2, and 3, has two rotary tools 40, which are blades 41A, 41B and two spindles 42A, 42B.
  • the two spindle parts 42A and 42B are provided so that their rotation axes are along the Y direction, and the blades 41A and 41B attached to them are arranged so as to face each other (see FIG. 3).
  • the blade 41A of the spindle section 42A and the blade 41B of the spindle section 42B cut the sealed substrate W held on each cutting table 2A, 2B by rotating in a plane including the X direction and the Z direction. As shown in FIG.
  • the cutting apparatus 100 of the present embodiment includes a liquid supply mechanism 12 having an injection nozzle 121 for injecting cutting water (working fluid) to suppress frictional heat generated by the blades 41A and 41B. is provided.
  • This injection nozzle 121 is supported by, for example, a Z-direction moving unit 83, which will be described later.
  • the transfer table 5 of the present embodiment is a table to which a plurality of products P inspected by an inspection unit 13, which will be described later, are transferred.
  • This transfer table 5 is a so-called index table, and a plurality of products P are temporarily placed thereon before sorting the plurality of products P onto various trays 21 .
  • the transfer table 5 and the two cutting tables 2A and 2B are arranged in a line along the X direction on the horizontal plane.
  • the transfer table 5 can be moved back and forth along the Y direction by a table moving mechanism 25 and can move up to the sorting mechanism 20 .
  • the table moving mechanism 25 may use, for example, a ball screw mechanism, an air cylinder, or a linear motor.
  • a plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 according to inspection results (good products, defective products, etc.) by the inspection unit 13 .
  • the tray 21 before storing the products P is conveyed to the tray moving mechanism 24 by the tray conveying mechanism 22 that moves along the transfer shaft 71, and then conveyed to the predetermined sorting position X1 by the tray moving mechanism 24. , the products P sorted by the sorting mechanism 20 are placed. After being sorted, the various trays 21 are accommodated in the tray accommodating section 23 by the tray moving mechanism 24 and the tray conveying mechanism 22 .
  • the tray housing unit 23 includes, for example, a tray 21 before housing the product P, a tray 21 housing a good product P, and a tray 21 housing a defective product P that requires rework (reinspection). It is configured to accommodate three types of trays 21 such as. Note that the tray moving mechanism 24 will be described later.
  • the inspection unit 13 is provided between the cutting tables 2A and 2B and the transfer table 5, and inspects the plurality of products P held by the second holding mechanism 6. is.
  • the inspection unit 13 of this embodiment has a first inspection unit 131 that inspects the sealing surface (package surface) of the product P and a second inspection unit 132 that inspects the lead surface of the product P.
  • the first inspection unit 131 is an imaging camera having an optical system for inspecting the package surface
  • the second inspection unit 132 is an imaging camera having an optical system for inspecting the lead surface. Note that the first inspection unit 131 and the second inspection unit 132 may be shared.
  • the sealed substrate W and the product P of this embodiment are configured such that one surface of the substrate is molded with resin.
  • the resin-molded surface is the surface on which the electronic element connected to the substrate is resin-sealed, and is called a “sealing surface” or a “package surface”.
  • the non-resin-molded surface opposite to the resin-molded surface is called the lead surface because the leads functioning as external connection electrodes of the product are usually exposed.
  • this lead is a protruding electrode used in an electronic component such as a BGA (Ball Grid Array), it is sometimes called a "ball surface".
  • the non-resin-molded surface opposite to the resin-molded surface may be called a "substrate surface" because there are some forms in which leads are not formed.
  • the resin-molded surface is referred to as the “sealing surface” or "package surface”
  • the resin-molded surface opposite to the resin-molded surface is referred to as the "lead surface”.
  • a reversing mechanism 14 for reversing the plurality of products P is provided so that both sides of the plurality of products P can be inspected by the inspection unit 13 (see FIG. 1).
  • the reversing mechanism 14 has a holding table 141 that holds a plurality of products P, and a reversing unit 142 such as a motor that turns the holding table 141 upside down.
  • the package surface of the products P faces downward.
  • the first inspection unit 131 inspects the package surfaces of the products P.
  • the multiple products P held by the second holding mechanism 6 are reversed by the reversing mechanism 14 .
  • the lead surface of the product P faces downward, and the lead surface of the product P is inspected by moving the reversing mechanism 14 to the second inspection unit 132 .
  • the second holding mechanism 6 holds a plurality of products P in order to convey the plurality of products P from the cutting tables 2A and 2B to the transfer table 5, as shown in FIG.
  • the second holding mechanism 6 is connected to a suction head 61 provided with a plurality of suction portions 611 for sucking and holding a plurality of products P, and the suction portions 611 of the suction head 61 . and a vacuum pump (not shown). Then, the suction head 61 is moved to a desired position by a transfer mechanism 7 or the like, which will be described later, to transfer the plurality of products P from the cutting tables 2A and 2B to the holding table 141 or the transfer table 5 .
  • the transportation moving mechanism 7 moves the first holding mechanism 3 between at least the substrate supply mechanism 11 and the cutting tables 2A and 2B, and moves the second holding mechanism 6 between at least the cutting tables. It is moved between 2A, 2B and the holding table 141 .
  • the transportation moving mechanism 7 extends in a straight line along the arrangement direction (X direction) of the two cutting tables 2A and 2B and the transfer table 5, and the first holding mechanism 3 and the second 2 has a common transfer shaft 71 for moving the holding mechanism 6 .
  • the transfer shaft 71 is provided within a range in which the first holding mechanism 3 can move above the substrate supply section 112 of the substrate supply mechanism 11 and the second holding mechanism 6 can move above the transfer table 5 ( See Figure 1).
  • the first holding mechanism 3, the second holding mechanism 6, the cutting tables 2A and 2B, and the transfer table 5 are provided on the same side (front side in the Y direction) of the transfer shaft 71 in plan view. ing.
  • the inspection section 13, the reversing mechanism 14, various trays 21, the tray conveying mechanism 22, the tray accommodating section 23, the first cleaning mechanism 18 and the second cleaning mechanism 19 described later, and the collection container 172 are the same with respect to the transfer shaft 71. side (front side in the Y direction).
  • the sorting mechanism 20 is provided on the back side of the transfer shaft 71 in the Y direction.
  • the transporting moving mechanism 7 includes a main moving mechanism 72 that moves the first holding mechanism 3 and the second holding mechanism 6 in the X direction along the transfer shaft 71; A vertical movement mechanism 73 for vertically moving the first holding mechanism 3 and the second holding mechanism 6 with respect to the transfer shaft 71 in the Z direction, and a vertical movement mechanism 73 for vertically moving the first holding mechanism 3 and the second holding mechanism 6 with respect to the transfer shaft 71 in the Y direction. and a horizontal movement mechanism 74 for horizontal movement.
  • the main moving mechanism 72 is provided on the transfer shaft 71 and has a common guide rail 721 for guiding the first holding mechanism 3 and the second holding mechanism 6. and a rack-and-pinion mechanism 722 for moving the first holding mechanism 3 and the second holding mechanism 6 .
  • the guide rail 721 extends straight in the X direction along the transfer shaft 71, and, like the transfer shaft 71, allows the first holding mechanism 3 to move above the substrate supply portion 112 of the substrate supply mechanism 11, 2 A holding mechanism 6 is provided within a range in which it can move above the transfer table 5 .
  • the guide rail 721 is slidably provided with a slide member 723 on which the first holding mechanism 3 and the second holding mechanism 6 are provided via a vertical movement mechanism 73 and a horizontal movement mechanism 74 .
  • the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6, but the vertical movement mechanism 73, the horizontal movement mechanism 74 and the slide member 723 are common to the first holding mechanism 3 and the second holding mechanism 6. provided separately for each.
  • the rack and pinion mechanism 722 includes a cam rack 722a common to the first holding mechanism 3 and the second holding mechanism 6, and a pinion provided in each of the first holding mechanism 3 and the second holding mechanism 6 and rotated by an actuator (not shown). and a gear 722b.
  • the cam rack 722a is provided on the common transfer shaft 71 and can be varied in length by connecting a plurality of cam rack elements.
  • the pinion gear 722b is provided on the slide member 723 and is called a so-called roller pinion. As shown in FIG. It has a plurality of roller pins 722b2 which are provided at equal intervals in the circumferential direction between the roller bodies 722b1 and are provided so as to be able to roll with respect to the roller body 722b1.
  • the rack-and-pinion mechanism 722 of this embodiment uses the roller pinions described above, two or more roller pins 722b2 come into contact with the cam rack 722a. Positioning accuracy is improved when moving the first holding mechanism 3 and the second holding mechanism 6 in the X direction.
  • the lifting mechanism 73 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6.
  • the lifting mechanism 73 of the first holding mechanism 3 is interposed between the transfer shaft 71 (specifically, the main moving mechanism 72) and the first holding mechanism 3, as shown in FIGS. It has a Z-direction guide rail 73a provided along the Z-direction, and an actuator portion 73b for moving the first holding mechanism 3 along the Z-direction guide rail 73a.
  • the actuator section 73b may use, for example, a ball screw mechanism, an air cylinder, or a linear motor.
  • the configuration of the up-and-down movement mechanism 73 of the second holding mechanism 6 is the same as that of the up-and-down movement mechanism 73 of the first holding mechanism 3, as shown in FIG.
  • the horizontal movement mechanism 74 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6, as shown in FIGS.
  • the horizontal movement mechanism 74 of the first holding mechanism 3 is interposed between the transfer shaft 71 (specifically, the vertical movement mechanism 73) and the first holding mechanism 3, as shown in FIGS. Y-direction guide rails 74a provided along the Y-direction, elastic bodies 74b for applying force to the first holding mechanism 3 on one side of the Y-direction guide rails 74a, and the first holding mechanism 3. and a cam mechanism 74c for moving to the other side of the Y-direction guide rail 74a.
  • the cam mechanism 74c uses an eccentric cam, and the amount of movement of the first holding mechanism 3 in the Y direction can be adjusted by rotating the eccentric cam with an actuator such as a motor.
  • the configuration of the horizontal movement mechanism 74 of the second holding mechanism 6 is the same as that of the vertical movement mechanism 73 of the first holding mechanism 3, as shown in FIG. Further, the second holding mechanism 6 may be configured without the horizontal movement mechanism 74 , or both the first holding mechanism 3 and the second holding mechanism 6 may be configured without the horizontal movement mechanism 74 . Further, the horizontal movement mechanism 74 may use, for example, a ball screw mechanism or an air cylinder without using the cam mechanism 74c, like the elevation movement mechanism 73. Alternatively, a linear motor may be used.
  • the cutting movement mechanism 8 linearly moves the two spindles 42A and 42B independently in the X, Y and Z directions.
  • the cutting movement mechanism 8 includes an X-direction movement section 81 that linearly moves the spindle sections 42A and 42B in the X direction, and the spindle sections 42A and 42B. and a Z-direction moving portion 83 for linearly moving the spindle portions 42A and 42B in the Z-direction.
  • the X-direction moving part 81 is common to the two cutting tables 2A and 2B, and is provided along the X direction with the two cutting tables 2A and 2B interposed therebetween, as particularly shown in FIGS. a pair of X-direction guide rails 811, and a support body that moves along the pair of X-direction guide rails 811 and supports the spindles 42A and 42B via the Y-direction moving portion 82 and the Z-direction moving portion 83. 812.
  • a pair of X-direction guide rails 811 are provided on the sides of the two cutting tables 2A and 2B provided along the X-direction.
  • the support 812 is, for example, a portal type and has a shape extending in the Y direction. Specifically, the support 812 has a pair of legs extending upward from the pair of X-direction guide rails 811 and beams (beams) bridging the pair of legs. extending in the direction
  • the support 812 is linearly reciprocated along the X direction on a pair of X direction guide rails 811 by, for example, a ball screw mechanism 813 extending in the X direction.
  • the ball screw mechanism 813 is driven by a drive source (not shown) such as a servomotor.
  • the support 812 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
  • the Y-direction moving part 82 includes a Y-direction guide rail 821 provided along the Y direction on the support 812, and a Y-direction slider 822 that moves along the Y-direction guide rail 821. have.
  • the Y-direction slider 822 is driven by, for example, a linear motor 823 and linearly reciprocates on the Y-direction guide rail 821 .
  • two Y-direction sliders 822 are provided corresponding to the two spindle portions 42A and 42B. Thereby, the two spindle parts 42A and 42B are movable in the Y direction independently of each other.
  • the Y-direction slider 822 may be configured to reciprocate by another direct acting mechanism using a ball screw mechanism.
  • the Z-direction moving part 83 moves along a Z-direction guide rail 831 provided along the Z-direction on each Y-direction slider 822 and moves along the Z-direction guide rail 831. and a Z-direction slider 832 that supports the spindle portions 42A and 32B. That is, the Z-direction moving portion 83 is provided corresponding to each spindle portion 42A, 32B.
  • the Z-direction slider 832 is driven by, for example, an eccentric cam mechanism (not shown), and linearly reciprocates on the Z-direction guide rail 831 .
  • the Z-direction slider 832 may be configured to reciprocate by another direct acting mechanism such as a ball screw mechanism.
  • the positional relationship between the moving mechanism 8 for cutting and the transfer shaft 71 is such that the transfer shaft 71 is arranged above the moving mechanism 8 for cutting so as to cross the moving mechanism 8 for cutting. ing. Specifically, the transfer shaft 71 is arranged above the support 812 so as to cross the support 812 , and the transfer shaft 71 and the support 812 have a positional relationship of crossing each other.
  • the cutting apparatus 100 of the present embodiment further includes a processing waste storage section 17 that stores processing waste S such as offcuts generated by cutting the sealed substrate W, as shown in FIG.
  • the processing waste container 17 is provided below the cutting tables 2A and 2B, and is a guide chute having an upper opening 171X surrounding the cutting tables 2A and 2B in plan view. 171 and a collection container 172 for collecting the processing waste S guided by the guide shooter 171 .
  • the recovery rate of the processing waste S can be improved.
  • the guide shooter 171 guides the processing waste S scattered or dropped from the cutting tables 2A, 2B to the collection container 172.
  • the upper opening 171X of the guide shooter 171 surrounds the cutting tables 2A and 2B (see FIG. 3)
  • it is difficult to remove the processing waste S, and the collection rate of the processing waste S is further improved. can be improved.
  • the guide shooter 171 is provided so as to surround the rotating mechanisms 9A and 9B provided under the cutting tables 2A and 2B (see FIG. 4). is configured to protect
  • the processing waste container 17 is shared by the two cutting tables 2A and 2B, but may be provided for each of the cutting tables 2A and 2B.
  • the collection container 172 is for collecting the processing waste S that has passed through the guide shooter 171 by its own weight.
  • the two collection containers 172 are arranged on the front side of the transfer shaft, and configured to be independently removable from the front side of the cutting device 100 . With this configuration, it is possible to improve maintainability such as disposal of the processing waste S. Considering the size of the sealed substrate W, the size and amount of the processing waste S, the workability, etc., one collection container 172 may be provided under the entire cutting table, or three collection containers may be provided. You may divide
  • the processing waste storage section 17 has a separating section 173 for separating cutting water and processing waste.
  • a filter such as a perforated plate that allows cutting water to pass through the bottom surface of the collection container 172 may be provided.
  • the separation unit 173 allows the processing waste S to be collected without accumulating cutting water in the collection container 172 .
  • the cutting apparatus 100 of the present invention includes a first cleaning mechanism 18 that cleans the upper surfaces (lead surfaces) of the plurality of products P held on the cutting tables 2A and 2B. I have more.
  • the first cleaning mechanism 18 cleans the upper surfaces of the products P by means of injection nozzles 18a (see FIG. 5) that inject cleaning liquid and/or compressed air onto the upper surfaces of the plurality of products P held on the cutting tables 2A and 2B. It is for cleaning.
  • the first cleaning mechanism 18 is configured to be movable along the transfer shaft 71 together with the first holding mechanism 3, as shown in FIG.
  • the first cleaning mechanism 18 is provided on a slide member 723 that slides on a guide rail 721 provided on the transfer shaft 71 .
  • an elevation movement mechanism 181 for vertically moving the first cleaning mechanism 18 in the Z direction.
  • the lifting mechanism 181 may be, for example, one using a rack and pinion mechanism, one using a ball screw mechanism, or one using an air cylinder.
  • the cutting device 100 of the present invention further includes a second cleaning mechanism 19 that cleans the lower surface side (package surface) of the plurality of products P held by the second holding mechanism 6, as shown in FIG. .
  • the second cleaning mechanism 19 is provided between the cutting table 2B and the inspection section 13, and sprays cleaning liquid and/or compressed air onto the lower surfaces of the plurality of products P held by the second holding mechanism 6. By doing so, the lower surface side of the product P is cleaned. That is, the second cleaning mechanism 19 cleans the lower surface side of the product P while the second holding mechanism 6 is being moved along the transfer shaft 71 .
  • FIG. 9 shows the moving path of the first holding mechanism 3 and the moving path of the second holding mechanism 6 in the operation of the cutting device 10.
  • the operation of the cutting device 100 for example, transportation of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, movement of various trays described later, sorting of the product P, etc., are all performed. is performed by the controller CTL (see FIG. 1).
  • the substrate supply unit 112 of the substrate supply mechanism 11 moves the sealed substrate W accommodated in the substrate accommodation unit 111 toward the holding position RP held by the first holding mechanism 3 .
  • the transport moving mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 holds the sealed substrate W by suction.
  • the transfer moving mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting tables 2A and 2B, and the first holding mechanism 3 releases the suction holding, and the sealed substrate W is released.
  • a substrate W is placed on the cutting tables 2A and 2B.
  • the main moving mechanism 72 adjusts the position of the sealed substrate W in the X direction
  • the horizontal moving mechanism 74 adjusts the position of the sealed substrate W in the Y direction.
  • the cutting tables 2A and 2B hold the sealed substrate W by suction.
  • the elevation movement mechanism 73 moves the first holding mechanism 3 to the cutting movement mechanism 8 (support body 812). Raise to a position where there is no physical interference.
  • the support body 812 is retracted from the cutting table 2B to the transfer table 5 side. It is not necessary to raise and lower the first holding mechanism 3 at this time.
  • the cutting movement mechanism 8 sequentially moves the two spindles 42A and 42B in the X direction and the Y direction, and the cutting tables 2A and 2B rotate to form the sealed substrate W in a grid pattern. Cut and individualize.
  • the transfer mechanism 7 moves the first cleaning mechanism 18 to clean the upper surface side (lead surface) of the multiple products P held on the cutting tables 2A and 2B. After this cleaning, the transfer mechanism 7 retracts the first holding mechanism 3 and the first cleaning mechanism 18 to predetermined positions.
  • the transfer movement mechanism 7 moves the second holding mechanism 6 to the cutting tables 2A and 2B after cutting, and the second holding mechanism 6 holds the plurality of products P by suction.
  • the transport moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the second cleaning mechanism 19 .
  • the second cleaning mechanism 19 cleans the lower surface side (package surface) of the plurality of products P held by the second holding mechanism 6 .
  • the multiple products P held by the second holding mechanism 6 are double-sided inspected by the inspection unit 13 and the reversing mechanism 14 .
  • the transfer movement mechanism 7 moves the second holding mechanism 6 to the transfer table 5
  • the second holding mechanism 6 releases the suction holding, and places the plurality of products P on the transfer table 5 .
  • a plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 according to the inspection results (good products, defective products, etc.) by the inspection unit 13 .
  • the double-sided inspection for example, first, one side of the product P is inspected while being sucked and held by the second holding mechanism 6 . Next, the product P is transferred from the second holding mechanism 6 to the holding table 141 of the reversing mechanism 14, and the other side of the product P is inspected while being sucked and held by the holding table 141 after reversing. inspection can be performed. Subsequently, the product P can be transferred from the reversing table 14 to the transfer table 5 by transferring it from the holding table 141 to the second holding mechanism 6 .
  • the holding table 141 is configured to be movable in the X direction, and at least one of the holding table 141 and the transfer table 5 is configured to be movable in the Z direction, and the holding table 141 is moved above the transfer table 5.
  • the product P can also be transported to the transfer table 5 and transferred.
  • the tray moving mechanism 24 of this embodiment moves each of the three types of trays 21, as shown in FIGS.
  • the three types of trays 21 are, for example, the first and second trays 21a and 21b that contain non-defective products P, and the third tray that contains defective products P that require rework (reinspection). It is the tray 21c.
  • the tray moving mechanism 24 includes tray placing sections 241a to 241c on which three types of trays 21a to 21c are placed, and tray placing sections 241a to 241c. It is provided with moving rails 242A and 242B that move linearly.
  • the three tray placing parts 241a to 241c are arranged in a row along the Y direction, and the trays are sorted by the sorting mechanism 20 independently of each other along the direction of the row (Y direction). It is configured to be movable to position X1.
  • the tray placement portion 241a on which the first tray 21a is placed is referred to as the first tray placement portion 241a
  • the tray placement portion 241b on which the second tray 21b is placed is referred to as the second tray placement portion 241a
  • the tray mounting portion 241c on which the third tray 21c is mounted is referred to as the third tray mounting portion 241c.
  • the moving rails 242A and 242B of this embodiment have a first moving rail 242A and a second moving rail 242B provided parallel to each other. Both the first moving rail 242A and the second moving rail 242B extend along the Y direction.
  • First and second tray mounting portions 241a and 241b are movably provided on the first moving rail 242A so as not to interfere with each other, and a third tray is provided on the second moving rail 242B.
  • the mounting portion 241c is provided movably so as not to interfere with the first and second tray mounting portions 241a and 241b provided on the first moving rail 242A.
  • the first and second tray mounting portions 241a and 241b are movably provided on the left and right side surfaces (side surfaces in the X direction) facing each other on the first moving rail 242A.
  • the first tray mounting part 241a is movably provided on the left side of the first moving rail 242A, and the second tray mounting part 241b is moved to the right side of the first moving rail 242A.
  • the first and second tray mounting portions 241a and 241b are arranged in a line on the first moving rail 242A.
  • the first and second tray mounting portions 241a and 241b are linearly moved along the Y direction on the first moving rail 242A by a ball screw mechanism 243A extending in the Y direction. move back and forth to The ball screw mechanism 243A is driven by a drive source (not shown) such as a servomotor.
  • a drive source such as a servomotor.
  • the first and second tray mounting portions 241a and 241b may be configured to reciprocate by another linear motion mechanism such as a linear motor.
  • a third tray mounting portion 241c is movably provided on the left side of the second moving rail 242B.
  • a third tray mounting portion 241c provided on the second moving rail 242B extends toward the first moving rail 242A so as to be aligned with the first and second tray mounting portions 241a and 241b. ing.
  • the third tray mounting portion 241c of the second moving rail 242B linearly reciprocates along the Y direction on the second moving rail 242B by a ball screw mechanism 243B extending in the Y direction.
  • the ball screw mechanism 243B is driven by a drive source (not shown) such as a servomotor.
  • the third tray mounting portion 241c may be configured to reciprocate by another linear motion mechanism such as a linear motor.
  • the tray moving mechanism 24 moves the first to third tray placement units 241a to 241c to the sorting position X1 sorted by the sorting mechanism 20 and the trays 21a to 21c. is moved between a storage position X2 for storing the tray storage section 23 and a retraction position X3 for retracting when the other tray placement sections 241a to 241c are at the sorting position X1 or the storage position X2.
  • the sorting position X1 is set on the rear side of the transfer shaft 71 in the Y direction
  • the storage position X2 is set on the front side of the transfer shaft 71 in the Y direction.
  • the retracted position X3 is set on the front side of the storage position X2 in the Y direction with respect to the transfer shaft 71 .
  • the first to third tray placement sections 241a to 241c arranged in a row in this manner are configured so as not to interfere with each other when they move.
  • the tray moving mechanism 24 as shown in FIGS. It has a height position changing section 244 for changing the height position.
  • the first tray placement section 241a which is not provided with the height position changing section 244, is fixed at the raised position H1, which is the height of the sorting position X1 by the sorting mechanism 20.
  • the height position changing section 244 is provided corresponding to each of the second and third tray mounting sections 241b and 241c, and for example, one using a rack and pinion mechanism or a ball screw mechanism. , or using an air cylinder. Specifically, as shown in FIGS. 13 and 14, the height position changing unit 244 moves the second and third tray stacking units 241b and 241c to a raised position H1, which is the height at the sorting position X1 by the sorting mechanism 20. , and a lowered position H2 at a height that does not interfere with the other tray placing portions 241a to 241c at the raised position H1.
  • the second tray mounting portion 241b is the height position changing portion. 244 to the lowered position H2.
  • the second tray mounting portion 241b passes under the first tray mounting portion 241a, and the first tray mounting portion 241a and the second tray mounting portion 241b interfere with each other. move without
  • the second tray mounting portion 241b is the height position changing portion. 244 to the lowered position H2, and the height position changing part 244 brings the third tray mounting portion 241c to the raised position H1.
  • the second tray mounting portion 241b passes under the third tray mounting portion 241c, and the second tray mounting portion 241b and the third tray mounting portion 241c interfere with each other. move without
  • the third tray mounting portion 241c is the height position changing portion. 244 to the lowered position H2.
  • the third tray mounting portion 241c passes under the first tray mounting portion 241a, and the first tray mounting portion 241a and the third tray mounting portion 241c interfere with each other. move without
  • the first to third tray placement sections 241a to 241c move to the respective positions X1 to X3, they pass each other in the above three ways, so that they do not interfere with each other.
  • the second and third tray mounting portions 241b and 241c are located at the housing position X2, the second and third tray mounting portions 241b and 241c must be moved to match the transportation of the trays with the first tray mounting portion 241a.
  • the placing portions 241b and 241c are set to the raised position H1.
  • the first tray mounting portion 241a is fixed at the raised position H1
  • the second and third tray mounting portions 241b and 241c are movable between the raised position H1 and the lowered position H2. Therefore, the three tray mounting portions 241a to 241c do not overlap in the Z direction, and the passing space of the three tray mounting portions 241a to 241c in the Z direction can be reduced.
  • a plurality of products P are placed on the transfer table 5 after inspection by the inspection unit 13 as shown in ⁇ Example of operation of the cutting device> described above.
  • the transfer table 5 on which a plurality of products P are placed is moved in the Y direction by the table moving mechanism 25 and moved to a predetermined sorting position by the sorting mechanism 20 .
  • the tray moving mechanism 24 moves the desired tray placement units 241a to 241c to the accommodation position X2, and the tray transport mechanism 22 moves the desired trays 21a to 21c to the tray placement units 241a to 241c at the accommodation position X2. transported to and placed on the
  • the tray moving mechanism 24 moves any one of the tray placing units 241a to 241c on which various trays 21a to 21c are placed to the sorting position X1. Note that the other tray placement units 241a to 241c that are not moved to the sorting position X1 are moved to the accommodation position X2 or the retreat position X3.
  • the sorting mechanism 20 moves the plurality of trays placed on the transfer table 5.
  • the products P are sorted into the trays 21a to 21c on the tray placing units 241a to 241c located at the sorting position X1 according to the inspection result (good product, defective product, etc.) by the inspection unit 13.
  • the sorting mechanism 20 determines that the product is non-defective according to the inspection result. The determined products P are sorted into the first and second trays 21a and 21b. Further, when the third tray placing section 241c on which the third tray 21c is placed is located at the sorting position X1, the sorting mechanism 20 sorts the product P determined as defective by the inspection result to the third tray. Sort into tray 21c.
  • the tray moving mechanism 24 When the various trays 21a to 21c reach the maximum number of products P that can be stored (full or full), or when the sorting of the products P is completed, the tray moving mechanism 24 is at the sorting position X1.
  • the tray mounting portions 241a to 241c are moved to the housing position X2.
  • the tray transport mechanism 22 transports the trays 21a to 21c from the tray placement units 241a to 241c at the storage position X2 to the tray storage unit 23. As shown in FIG. Also, the tray transport mechanism 22 transports the new trays 21a to 21c in the tray storage section 23 to the tray placement sections 241a to 241c in the storage position X2.
  • the tray moving mechanism 24 moves the tray placement units 241a to 241c on which new trays 21a to 21c are placed to the sorting position X1.
  • the three tray placing sections 241a to 241c are arranged in a row, and can be independently moved to the sorting position X1 by the sorting mechanism 20 along the direction of the row. configured, the footprint of the cutting device 100 can be reduced.
  • the three tray placing portions 241a to 241c are arranged in a line, the distances between the transfer table 5 on which the products P before being sorted are placed and the respective trays 21a to 21c are the same. It is possible to make the transportation time the same when sorting to each of the trays 21a to 21c, and to improve productivity.
  • the tray moving mechanism 24 has the height position changing unit 244 that changes the height position of at least one of the three tray mounting units 241a to 241c
  • the three tray mounting units 241a to 241c are independent of each other. so that they do not interfere with each other when they move.
  • the height position changing unit 244 moves the tray stacking units 241a to 241c between a raised position H1 that is the height of the sorting position X1 and a height position H2 that does not interfere with the other tray stacking units 241a to 241c. , so that the products P can be accurately placed on the trays 21a to 21c by the sorting mechanism 20 while the three tray placement parts 241a to 241c do not interfere with each other when they move independently of each other. become.
  • the first holding mechanism 3 and the second holding mechanism 6 are moved by a common transfer shaft 71 extending along the arrangement direction of the cutting tables 2A and 2B and the transfer table 5. Since the cutting mechanism 4 is moved in the horizontal plane by the moving mechanism 8 in the X direction along the transfer shaft 71 and in the Y direction orthogonal to the X direction, the cutting tables 2A and 2B are not moved in the X direction and the Y direction.
  • the sealed substrate W can be processed. Therefore, the bellows member for protecting the ball screw mechanism and the cover member for protecting the bellows member can be eliminated without moving the cutting tables 2A and 2B by the ball screw mechanism.
  • the configuration of the cutting device 100 can be simplified.
  • the cutting tables 2A and 2B can be configured so as not to move in the X and Y directions, and the footprint of the cutting device 100 can be reduced.
  • the configuration has three tray mounting portions 241a to 241c, but it may be configured to have four or more tray mounting portions.
  • the configuration has three tray mounting portions 241a to 241c, but it may be configured to have four or more tray mounting portions.
  • the number of tray placement units can be increased by adding more moving rails.
  • the height position changing unit 244 in the above embodiment moves up and down at two height positions, it may be configured to move up and down at three or more height positions.
  • the height position of the first tray mounting portion 241a is fixed, and the height positions of the second and third tray mounting portions 241b and 241c are changeable.
  • the height position of the second tray mounting portion 241b or the third tray mounting portion 241c may be fixed, and the height positions of the remaining two tray mounting portions may be changed. .
  • the height of two tray stacking portions 241b and 241c out of the three tray stacking portions 241a to 241c can be changed by the height changing mechanism 243.
  • a configuration in which the height can be changed by the height changing mechanism 243 may be employed.
  • the height of each of the three tray placing portions 241a to 241c may be changed by a height changing mechanism.
  • the height at the sorting position X1 by the sorting mechanism 20 is defined as the raised position H1, and the lowered position H2 is set below the raised position H1 so that the tray stacking sections do not interfere with each other.
  • the height at the sorting position X1 by the sorting mechanism 20 is set as the lowered position, and the raised position is set above the lowered position so that the tray placing sections do not interfere with each other.
  • the height positions of the tray mounting portions 241a to 241c are changeable. It is good also as a structure which fixes to a height position.
  • the three tray mounting portions 241a to 241c are moved using the two moving rails 242A and 242B, but the three tray mounting portions 241a to 241c are movably provided on one moving rail.
  • twin-cut table system and a twin-spindle configuration cutting device have been described. It may also be a cutting device with a twin spindle configuration.
  • the transfer table 5 of the above embodiment is an index table that is temporarily placed before sorting into the various trays 21 , but the transfer table 5 may be used as the holding table 141 of the reversing mechanism 14 .
  • the transfer table 5 is sorted into the tray 21, but the product P may be conveyed and attached to the adhesive tape arranged inside the frame-shaped member.
  • the grooves may be formed without cutting the sealed substrate on the cutting tables 2A and 2B.
  • the sealed substrate W grooved by the cutting tables 2A and 2B may be returned to the substrate supply section 112 by the first holding mechanism 3 and the transfer movement mechanism 7 .
  • the sealed substrate W returned to the substrate supply section 112 may be accommodated in the substrate accommodation section 111 .
  • the cutting device (processing device) 100 can be separated and connected between the second cleaning mechanism 19 and the inspection unit 13. It can be configured as a removable (detachable) module. In this case, for example, between the module on the second cleaning mechanism 19 side and the module on the inspection section 13 side, a module that performs an inspection different from the inspection performed by the inspection section 13 can be added.
  • the cutting device (processing device) 100 may have a module configuration that can be separated and connected (detachable) at any point, and the modules to be added may be modules with various functions other than inspection. .
  • processing apparatus of the present invention may perform processing other than cutting, and may perform other mechanical processing such as cutting and grinding.
  • the footprint of the processing device can be reduced.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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  • General Preparation And Processing Of Foods (AREA)

Abstract

L'objectif de la présente invention est de réduire l'encombrement d'un dispositif d'usinage, le dispositif d'usinage comportant un mécanisme d'usinage 4 pour usiner un substrat scellé W, un mécanisme de tri 20 pour trier les substrats scellés usinés W dans des plateaux 21a à 21c, et un mécanisme de déplacement de plateau 24 pour déplacer les plateaux 21a à 21c, le mécanisme de déplacement de plateau 24 comprenant au moins trois parties de placement de plateau 241a à 241c sur lesquelles les plateaux 21a à 21c sont placés, et les au moins trois parties de placement de plateau 241a à 241c étant agencées en une rangée et conçues pour pouvoir se déplacer les unes par rapport aux autres indépendamment dans la direction de la rangée vers une position de tri X1 pour permettre le tri par le mécanisme de tri 20.
PCT/JP2021/048104 2021-03-29 2021-12-24 Dispositif d'usinage et procédé de fabrication d'article usiné WO2022209080A1 (fr)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007026433A1 (fr) * 2005-08-31 2007-03-08 Hirata Corporation Appareil de manipulation de travail
JP2007536727A (ja) * 2004-05-07 2007-12-13 ハンミ セミコンダクター カンパニー リミテッド 半導体パッケージ製造工程用切断及びハンドラシステム
KR20100000538A (ko) * 2008-06-25 2010-01-06 세크론 주식회사 기판 이송 장치 및 이를 포함하는 다이 본딩 장치
KR20100107945A (ko) * 2009-03-27 2010-10-06 (주)제이티 소자소팅장치 및 그 방법
KR20140119232A (ko) * 2013-03-27 2014-10-10 세메스 주식회사 트레이 이송 장치
KR101689023B1 (ko) * 2015-11-10 2016-12-22 주식회사 이노비즈 이중 트레이 이송장치 및 이를 갖는 반도체 검사 및 분류시스템

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM362224U (en) * 2009-02-25 2009-08-01 Hi Lo System Res Co Ltd Chip tester
JP5589525B2 (ja) * 2010-04-20 2014-09-17 澁谷工業株式会社 物品分類装置
JP6218526B2 (ja) * 2013-09-20 2017-10-25 Ｔｏｗａ株式会社 切断装置及び切断方法
KR102401058B1 (ko) * 2015-05-12 2022-05-23 (주)제이티 소자핸들러

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007536727A (ja) * 2004-05-07 2007-12-13 ハンミ セミコンダクター カンパニー リミテッド 半導体パッケージ製造工程用切断及びハンドラシステム
WO2007026433A1 (fr) * 2005-08-31 2007-03-08 Hirata Corporation Appareil de manipulation de travail
KR20100000538A (ko) * 2008-06-25 2010-01-06 세크론 주식회사 기판 이송 장치 및 이를 포함하는 다이 본딩 장치
KR20100107945A (ko) * 2009-03-27 2010-10-06 (주)제이티 소자소팅장치 및 그 방법
KR20140119232A (ko) * 2013-03-27 2014-10-10 세메스 주식회사 트레이 이송 장치
KR101689023B1 (ko) * 2015-11-10 2016-12-22 주식회사 이노비즈 이중 트레이 이송장치 및 이를 갖는 반도체 검사 및 분류시스템

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TW202237520A (zh) 2022-10-01
TWI823298B (zh) 2023-11-21

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