KR20100036785A - Apparatus and method of scribing object - Google Patents

Apparatus and method of scribing object Download PDF

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Publication number
KR20100036785A
KR20100036785A KR1020080096168A KR20080096168A KR20100036785A KR 20100036785 A KR20100036785 A KR 20100036785A KR 1020080096168 A KR1020080096168 A KR 1020080096168A KR 20080096168 A KR20080096168 A KR 20080096168A KR 20100036785 A KR20100036785 A KR 20100036785A
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KR
South Korea
Prior art keywords
unit
cutting
mother substrate
support member
scribing
Prior art date
Application number
KR1020080096168A
Other languages
Korean (ko)
Inventor
김민웅
이성희
Original Assignee
세메스 주식회사
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Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020080096168A priority Critical patent/KR20100036785A/en
Publication of KR20100036785A publication Critical patent/KR20100036785A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

The cutting device includes a support member on which the object is seated and a cutting device for cutting the object. The cutting device includes a scribing unit for forming a scribe line on the object, a suction unit for sucking the foreign matter remaining in the object, and a blowing unit for guiding the foreign matter to the suction unit side by injecting air into the object. Accordingly, the cutting device prevents foreign matter from remaining in the object in the process of forming the scribe line, thereby improving cutting efficiency and yield of the product.

Description

Cutting device and its method {APPARATUS AND METHOD OF SCRIBING OBJECT}

The present invention relates to a cutting device used for manufacturing a flat panel display panel, and more particularly, to a cutting device and a method for cutting a mother substrate for a flat panel display panel.

In general, a plurality of flat panel display panels for displaying an image are manufactured at a time using a large panel, that is, a mother substrate. In detail, the flat panel display panel includes an upper substrate and a lower substrate facing each other. The upper substrate and the lower substrate are formed through different mother substrates. That is, each of the upper substrate mother substrate and the lower substrate mother substrate is divided into a plurality of unit regions. In each unit region of the upper substrate mother substrate, an upper cell formed of thin layers for forming the upper substrate is formed. In each unit region of the lower substrate mother substrate, a lower cell formed of thin layers for forming the lower substrate is formed.

The upper substrate mother substrate and the lower substrate mother substrate, each of which the thin film layers are formed, are coupled to face each other, and the unit regions of the upper substrate mother substrate and the lower regions of the mother substrate coincide with each other. The lower cell and the upper cell facing each other constitute one unit cell, and one unit cell constitutes one flat panel display panel. Two mother substrates coupled to each other are cut for each unit cell, thereby manufacturing a plurality of flat panel display panels.

As such, in order to manufacture a plurality of flat panel display panels using a large mother substrate, it is necessary to cut two combined mother substrates by unit cell. In general, a process of cutting a mother substrate includes a method of cutting using a laser beam and a method of using a scribe wheel. In a method of cutting a mother substrate using a scribe wheel, the scribe wheel is brought into contact with the mother substrate and then moved along a cutting schedule line to form a scribe line having a groove having a predetermined depth on the surface of the mother substrate. Subsequently, when a physical shock is applied to the mother substrate, cracks propagate along the scribe line and are separated by unit cells.

In the cutting method using the scribe wheel, chipping occurs in the process of forming the scribe line. These chippings remain on the mother substrate and lower the rotation of the scribe wheel, resulting in a cutting defect.

An object of the present invention is to provide a cutting device that can improve the cutting efficiency.

It is also an object of the present invention to provide a cutting method using the cutting device described above.

The cutting device according to one feature for realizing the above object of the present invention comprises a supporting member and a cutting member.

Specifically, the cutting object is seated on the support member. The cutting member is disposed above the support member, and cuts the cutting object seated on the support member. The cutting member has a scribing unit, a suction unit and a blowing unit. The scribing unit moves in the horizontal direction to etch the cutting object seated on the support member to a predetermined depth to form a scribe line on the cutting object. The suction unit is disposed adjacent to the scribing unit and sucks the foreign substances remaining in the cutting object. The air blowing unit is disposed adjacent to the scribing unit, faces the suction unit with the scribing unit therebetween, and blows air to the cutting object on the support member to remove foreign substances remaining on the cutting object. Guide to the suction unit.

When viewed from the advancing direction in which the scribing unit moves horizontally, the suction unit is located behind the scribing unit and the blowing unit is located in front of the scribing unit.

The scribing unit may include a body and a scribe wheel. The scribe wheel is coupled to the lower portion of the body, and rotates to etch the cutting object seated on the support member to a predetermined depth to form the scribe line on the cutting object.

Further, the cutting device according to one feature for realizing the above object of the present invention comprises a supporting member and a cutting member.

Specifically, a mother substrate for forming a flat panel display panel is mounted on the support member. The cutting member is disposed above the support member, and cuts the mother substrate seated on the support member for each unit cell forming the flat panel display panel. The cutting member may include a scribing unit, a suction unit, and a blowing unit. The scribing unit moves in the horizontal direction to etch the mother substrate seated on the support member to a predetermined depth to form a scribe line on the mother substrate. The suction unit is disposed adjacent to the scribing unit and sucks the foreign matter remaining on the mother substrate. The blowing unit is disposed adjacent to the scribing unit, and faces the suction unit with the scribing unit therebetween, and the air is directed toward a portion where the mother substrate seated on the support member and the scribing unit come into contact with each other. Sprays to guide foreign matter remaining in the mother substrate toward the suction unit.

In addition, the cutting method according to one feature for realizing the above object of the present invention is as follows. First, a mother substrate for forming a flat panel display panel is mounted on a support member. Next, the cutting unit is disposed on the support member. As the cutting unit moves horizontally, a scribe line is formed on the mother substrate on the support member, and at the same time, the chippings generated in the process of forming the scribe line are sucked out and discharged to the outside, and at the same time, the mosquito on the support member is Air is blown onto the plate to remove foreign substances remaining on the mother substrate on the support member on the path where the scribe line is formed.

Specifically, the process of forming the scribe line is as follows. First, the scribe wheel of the cutting unit is brought into contact with the upper surface of the mother substrate seated on the support member. While rotating the scribe wheel, the mother substrate is etched to a predetermined depth to form the scribe line, and at the same time, the suction unit disposed at the rear of the scribe wheel sucks the chippings generated in the process of forming the scribe line. At the same time, a blowing unit disposed in front of the scribe wheel injects air to the mother substrate to guide foreign substances remaining on the mother substrate toward the suction unit.

According to the present invention described above, the cutting device can exhaust the chippings generated in the process of forming the scribe line to the outside, thereby preventing the foreign matter remaining on the object on which the scribe line is formed. Accordingly, the cutting device can improve the cutting efficiency and the yield of the product.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the present embodiment, a mother substrate for a flat panel display panel is described as an example of cutting, but the technical idea of the present invention is not limited thereto, and other types of objects may be used.

1 is a plan view illustrating a mother substrate assembly for forming a plurality of flat panel display panels.

Referring to FIG. 1, the mother substrate assembly 100 includes two mother substrates that are coupled to face each other, and the mother substrate assembly 100 includes a plurality of unit cells 110, each forming one flat display panel. Is formed. The plurality of unit cells 110 are arranged in a matrix form, and the mother substrate assembly 100 is cut for each unit cell 110.

2 illustrates a substrate cutting system according to an embodiment of the present invention.

Referring to FIG. 2, the substrate cutting system 400 cuts the mother substrate assembly 100 shown in FIG. 1 for each unit cell 110. The cutting system 400 includes a cutting shelf 200 on which the mother substrate assembly 100 is seated and a cutting device 300 for cutting the mother substrate assembly 100.

The cutting device 300 is disposed above the cutting shelf 200. The cutting device 300 may include a scribing unit 310, a suction unit 320, and a blowing unit 330, and the scribing unit 310, the suction unit 320, and the blowing unit. Units 330 are arranged side by side at the top of the cutting shelf 200.

In detail, the scribing unit 310 may include a scribe body 311, a scribe wheel 312, and a wheel shaft 313 connecting the scribe body 311 and the scribe wheel 312. . The scribe wheel 312 is provided below the scribe body 311, the scribe body 311 is moved in the horizontal direction in one direction while pressing the scribe wheel 312 in the vertical direction. The scribe wheel 312 rotates by horizontal movement of the scribe body 311. The scribe wheel 312 has a generally disc shape, the outer peripheral surface is sawtooth shape. The scribe wheel 312 rotates the outer peripheral surface of the sawtooth shape in contact with the mother substrate assembly 100 to etch the mother substrate assembly 100 to a predetermined depth, thereby, the mother substrate assembly 100 The scribe line 120 is formed on the surface.

In one example of the present invention, the scribe wheel 312 may be a sawtooth shape as the diamond chips 31 of the triangular pyramid shape is coupled to the outer peripheral surface.

The scribe wheel 312 is connected to the scribe body 311 through the wheel shaft 313, the wheel shaft 313 is connected to the connector 32 formed at the center of the scribe wheel 312 one end Is inserted. When the scribe wheel 312 rotates, the wheel shaft 313 becomes a rotation axis of the scribe wheel 312.

The suction unit 320 is disposed behind the scribing unit 310 when viewed in the advancing direction of the scribing unit 310. The suction unit 320 is disposed adjacent to the scribing unit 310, and a suction port is formed on a lower surface of the suction unit 320 to suck chippings generated during the scribing process of the mother substrate assembly 100. The suction unit 320 is connected to the discharge pipe 340, the chippings sucked by the suction unit 320 is discharged to the outside through the discharge pipe 340.

As such, the suction unit 320 discharges the chippings generated during the scribing process to the outside, thereby preventing the chippings from remaining on the mother substrate assembly 100. Accordingly, the suction unit 320 may prevent the scribing failure of the mother substrate assembly 100, and improve the yield and scribing efficiency of the product.

On the other hand, the blowing unit 330 is disposed in front of the scribing unit 310 when viewed in the advancing direction of the scribing unit 310. The blower unit 330 is disposed adjacent to the scribing unit 310, and a blower 331 for injecting air is formed on a lower surface of the blower unit 330. The blowing unit 330 is connected to an air supply pipe 350 for supplying air, and receives the air through the air supply pipe 350. The blower unit 330 injects air toward the scribing unit 330 to inject air from the front end of the scribing unit 330 to the scribing unit 330. The chippings generated during the scribing process of the scribing unit 310 are guided to the suction unit 320 by the air injected from the blowing unit 330.

As such, the blowing unit 330 injects air to the rear of the scribing wheel 332, so that chippings located in front of the scribing wheel 332 are located toward the rear side of the suction unit 320. Induced. Accordingly, since the chipping suction efficiency of the suction unit 320 is improved, the yield and the scribing efficiency of the product can be improved.

The cutting device 300 may further include a coupling body 360. The scribing unit 310, the suction unit 320, and the blower unit 330 are coupled to a lower surface of the coupling body 360, and the discharge pipe 340 and the air supply pipe 350 are disposed on an upper surface thereof. Connected.

In FIG. 2, reference numeral SF denotes a path through which chipping flows into the inlet 320, and reference numeral AF denotes a flow of air discharged from the blowing unit 330.

Hereinafter, a process of scribing the mother substrate assembly 100 by the substrate cutting system 400 will be described in detail with reference to the accompanying drawings.

3 is a view illustrating a process of cutting a mother substrate assembly by the substrate cutting system illustrated in FIG. 2, FIG. 4 is a plan view illustrating the mother substrate assembly illustrated in FIG. 3, and FIG. 5 is a cutting line I- of FIG. 4. It is a sectional view along I '.

3 and 4, first, the mother substrate assembly 100 is disposed on the cutting shelf 200, and the cutting device 300 is disposed on the mother substrate assembly 100.

Subsequently, the cutting device 300 is disposed adjacent to the mother substrate assembly 100 so that the scribing wheel 322 of the scribing unit 310 contacts the upper surface of the mother substrate assembly 100. . Subsequently, the upper surface of the mother substrate assembly 100 is etched to a predetermined depth by moving the scribing wheel 322 toward the mother substrate assembly 100 in a horizontal direction along a cutting schedule line (not shown). . Accordingly, the scribe line 120 is formed on the upper surface of the mother substrate assembly 100.

4 and 5, when viewed in plan view, the scribe line 120 is formed in a lattice shape according to an arrangement structure of unit cells formed in the mother substrate assembly 100. That is, the scribe line 120 is formed along the outline of each unit cell in order to cut the mother substrate assembly 100 into each unit cell 110. The scribe line 120 is made of a cutting groove 20, the cross section has a substantially 'V' shape.

Referring again to FIG. 3, while the scribing wheel 322 forms the scribe line 120, the blower unit 330 moves with the scribing unit 310 while the scribe wheel 310 moves. The chippings CP generated in the process of forming the scribe line 120 by spraying air to the 322 side are guided to the suction unit 320. The suction unit 320 moves along the scribing unit 310 while sucking the chippings CP while discharging the scribing unit 310 to form the scribe line 120 and then discharging them to the outside. Let's do it.

Although described with reference to the embodiments above, those skilled in the art will understand that the present invention can be variously modified and changed without departing from the spirit and scope of the invention as set forth in the claims below. Could be. In addition, the representations of elements in the figures have been exaggerated to emphasize a more clear description.

1 is a plan view illustrating a mother substrate assembly for forming a plurality of flat panel display panels.

2 is a view showing a substrate cutting system according to an embodiment of the present invention.

3 is a diagram illustrating a process of cutting a substrate by the substrate cutting system illustrated in FIG. 2.

4 is a plan view illustrating a state in which a scribe line is formed in the mother substrate assembly shown in FIG. 3.

5 is a cross-sectional view taken along the line II ′ of FIG. 4.

Explanation of symbols on the main parts of the drawings

100: mother substrate assembly 110: unit cell

120: scribe line 200: cutting lathe

300: cutting device 310: scribing unit

320: suction unit 330: blowing unit

400: Substrate Cutting System

Claims (12)

A support member on which a cutting object is seated; And It is disposed on the support member, and includes a cutting member for cutting the cutting object seated on the support member, The cutting member, A scribing unit which moves in a horizontal direction to etch a cutting object seated on the support member to a predetermined depth to form a scribe line on the cutting object; A suction unit disposed adjacent to the scribing unit and suctioning foreign substances remaining in the cutting object; And Disposed adjacent to the scribing unit, facing the suction unit with the scribing unit interposed therebetween, and spraying air to the cutting object on the support member so that foreign matter remaining on the cutting object is directed toward the suction unit. Cutting device comprising a blowing unit for guiding. The method of claim 1, The suction device is located in the rear of the scribing unit and the blowing unit is located in front of the scribing unit when viewed in the advancing direction in which the scribing unit moves horizontally. The method of claim 2, The blowing unit is a cutting device, characterized in that for blowing the air toward the portion that the cutting object seated on the support member and the scribing unit contact. The method of claim 2, wherein the scribing unit, Body; And And a scribe wheel coupled to a lower portion of the body and rotating to form a scribe line on the cutting object by etching the cutting object seated on the support member while rotating. The method of claim 4, wherein The body is movable in the horizontal direction, the scribe wheel is a cutting device, characterized in that by rotating through the horizontal movement of the body. The method of claim 4, wherein The blower unit is provided with a spray hole for injecting the air on the lower surface, And said suction unit is provided at said lower surface with a suction port for sucking said chippings. A support member on which a mother substrate for forming a flat panel display panel is mounted; And A cutting member disposed on the support member and cutting the mother substrate seated on the support member for each unit cell forming the flat panel display panel; The cutting member, A scribing unit for etching the mother substrate seated on the support member to a predetermined depth while moving in a horizontal direction to form a scribe line on the mother substrate; A suction unit disposed adjacent to the scribing unit and suctioning foreign substances remaining on the mother substrate; And Disposed adjacent to the scribing unit, facing the suction unit with the scribing unit interposed therebetween, and injecting air toward a portion where the mother substrate seated on the support member and the scribing unit come into contact with each other; And a blowing unit for guiding the foreign matter remaining on the mother substrate to the suction unit side. The method of claim 7, wherein The suction device is located in the rear of the scribing unit and the blowing unit is located in front of the scribing unit when viewed in the advancing direction in which the scribing unit moves horizontally. The method of claim 8, wherein the scribing unit, Body; And And a scribe wheel coupled to the lower portion of the body and rotating to form a scribe line on the mother substrate by etching the mother substrate seated on the support member while rotating. 10. The method of claim 9, The blower unit is provided with a spray hole for injecting the air on the lower surface, And said suction unit is provided at said lower surface with a suction port for sucking said chippings. Mounting a mother substrate for forming a flat panel display panel on a support member; Disposing a cutting unit on top of the support member; And As the cutting unit moves horizontally, a scribe line is formed on the mother substrate on the support member, and at the same time, the chippings generated in the process of forming the scribe line are sucked out and discharged to the outside, and at the same time, the mosquito on the support member is And spraying air to the plate to remove foreign substances remaining in the mother substrate on the support member on a path where the scribe line is formed. The method of claim 11, wherein the forming of the scribe line comprises: Contacting the scribe wheel of the cutting unit with an upper surface of the mother substrate seated on the support member; While rotating the scribe wheel, the mother substrate is etched to a predetermined depth to form the scribe line, and at the same time, the suction unit disposed at the rear of the scribe wheel sucks the chippings generated in the process of forming the scribe line. And a blower unit disposed at the front of the scribe wheel to inject air to the mother substrate to guide foreign substances remaining on the mother substrate toward the suction unit.
KR1020080096168A 2008-09-30 2008-09-30 Apparatus and method of scribing object KR20100036785A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110123548A (en) * 2010-05-07 2011-11-15 엘지디스플레이 주식회사 Apparatus for manufacturing liquid crystal display device
KR20170111684A (en) 2016-03-29 2017-10-12 동우 화인켐 주식회사 Cutting apparatus equipped with residues removing function
KR20170111332A (en) 2016-03-28 2017-10-12 동우 화인켐 주식회사 Touch sensor and touch sensor cutting method using laser

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110123548A (en) * 2010-05-07 2011-11-15 엘지디스플레이 주식회사 Apparatus for manufacturing liquid crystal display device
KR20170111332A (en) 2016-03-28 2017-10-12 동우 화인켐 주식회사 Touch sensor and touch sensor cutting method using laser
KR20170111684A (en) 2016-03-29 2017-10-12 동우 화인켐 주식회사 Cutting apparatus equipped with residues removing function

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