KR102409833B1 - Aoi automation system and method - Google Patents

Abstract

The present invention relates to an AOI automation system and method, and a supply unit 110 provided to receive a PCB from a tray in which the PCB is accommodated before inspection and supply it to the cleaning unit 120 and the robot operation unit 130; A cleaning unit 120 provided to fix the PCB supplied from the unit 110 one unit at a time and remove foreign substances attached to the surface before inspection, and the cleaning unit 120 to remove the PCB before inspection from the supply unit 110 . The robot operation unit 130 provided to pick up and put into the inspection unit 140 and transfer the PCB from the inspection unit 140 to the discharge unit 150 after inspection, and the robot operation unit 130 before inspection Inspection unit 140 that inspects the PCB for abnormalities by automatic optical inspection and takes out the PCB after inspection It is characterized by automating the overall AOI process by including the discharge unit 150 to prevent damage to the PCB and significantly increase inspection efficiency.

Description

AOI AUTOMATION SYSTEM AND METHOD

The present invention relates to an AOI automation system and method, and more particularly, to an AOI automation system and method configured to prevent damage to the PCB and increase inspection efficiency by automating the overall AOI process performed in the manufacturing process of the PCB will be.

In general, printed circuit boards (PCBs) used in electronic devices are designed with integrated circuits, so the pattern is complex and there is a risk of damage during the manufacturing process due to the thin thickness of several millimeters. is accompanied by

Automated Optical Inspection (AOI) is a process that automatically scans and inspects defects or foreign substances in the inner and outer layer circuits during the printed circuit board (PCB) manufacturing process. This is done by the AOI system as

In the conventional AOI system, a main body equipped with optical inspection equipment such as a photographing camera and an image analysis module is provided, and a PCB, which is an inspection target, is put in one by one, undergoes an inspection process, and then is discharged.

Looking at the schematic configuration of the AOI system with reference to conventionally known techniques, as an example, Korean Patent Registration No. 10-0772608 discloses that in an automatic optical inspection system of an inspection object in which flexible printed circuit board units are continuously formed, the inspection object is provided An automatic optical inspection system comprising an unwinding unit, a photographing member that irradiates light into the photographing area of the inspection object provided from the unwinding unit and photographs the surface with a camera, and a winding portion in which the inspected object is unloaded do.

As another example, Korean Patent Registration No. 10-1523512 discloses a supply unit for supplying a circuit board, a database unit for storing optical information as a criterion for judging a defect included in the circuit board, and an optical image for the circuit board and a first optical inspection unit that inspects the circuit board using optical information, a second optical inspection unit that processes the optical image whose judgment is withheld from the first optical inspection unit, and re-inspects the circuit board using the optical information; An automatic optical inspection device including a accommodating part and a control part is configured.

As another example, Korea Patent Registration No. 10-0684454 is equipped with a loader for supplying a printed circuit board unit, a moving member having loading parts on which the printed circuit board unit is placed by the loader, a line scan camera and a lighting unit. An automatic optical inspection system including a photographing member having a printed circuit board unit placed on the loading unit for vision inspection, and an unloader for unloading the inspected printed circuit board unit from the moving member is configured.

Korean Patent Registration No. 10 - 0772608 (2007.11.02) Korean Patent Registration No. 10 - 1523512 (2015.05.28) Korean Patent Registration No. 10 - 0684454 (2007.02.22) Korean Patent Registration No. 10-0673394 (Jan. 24, 2007)

The AOI system to which the prior art is applied as described above is configured in the form of inputting a PCB unit by unit and discharging it after passing through the inspection process in order to inspect the presence or absence of abnormality in the PCB that has undergone the manufacturing process.

However, when a PCB, which is made of a flexible thin film mounting an integrated circuit and is sensitive to handling, is manually put into and discharged from the AOI system as in the prior art, the risk of damage is significantly increased and process efficiency is greatly improved in mass work. There is a problem with lowering.

In addition, when inserting and discharging PCBs to the AOI system, it takes a lot of time to replace the PCB before and after inspection, and additional devices and operations are required to load and discharge the inspected PCB, resulting in process continuity and productivity. There is a problem of deterioration.

Accordingly, the present invention was invented to solve the problems of the prior art as described above,

A supply unit 110 provided to receive the PCB from the tray in which the PCB is accommodated before the inspection and supply it to the cleaning unit 120 and the robot operation unit 130;

A cleaning unit 120 provided to fix the PCB unit by unit before the inspection supplied from the supply unit 110 and remove foreign substances adhering to the surface;

Robot operation provided to pick up the PCB from the supply unit 110 before the inspection that has passed through the cleaning unit 120 , put it into the inspection unit 140 , and transfer the PCB from the inspection unit 140 to the discharge unit 150 after inspection unit 130 and

An inspection unit 140 provided to inspect the PCB before inspection input by the robot operation unit 130 for abnormalities by automatic optical inspection and to take out the PCB after inspection;

After the inspection transferred from the robot operation unit 130, the PCB is seated on the tray and configured to include the discharge unit 150 provided to discharge to the outside of the system, thereby automating the overall AOI process to prevent damage to the PCB and significantly improve the inspection efficiency. Achievable goals can be achieved.

The present invention provides an AOI automation system and method configured to prevent damage to the PCB and increase inspection efficiency by automating the overall AOI process performed in the manufacturing process of the PCB.

Therefore, the present invention has the advantage of significantly reducing the possibility of damage or breakage in the handling process of the PCB, such as a configuration in which the PCB is simply put into and discharged from the inspection device one by one as in the conventional AOI system.

In particular, the present invention not only fully automates a series of processes of replacing, discharging, and loading PCBs before and after inspection, but also cleans the PCB before putting it into the inspection process, sequentially supplying the PCBs that have undergone the manufacturing process. It has an effect of remarkably improving the continuity and efficiency of the inspection process by having a configuration that is significantly different from the AOI system of the prior art, such as improving inspection accuracy.

1 and 2 are front and rear perspective views of an AOI automation system according to the present invention.
3 and 4 are interior front and rear perspective views of the AOI automation system according to the present invention.
5 is an internal front view of the AOI automation system according to the present invention.
6 is an internal side view of an AOI automation system according to the present invention;
7 is an internal rear view of an AOI automation system according to the present invention;
8 is an enlarged perspective view of the main part of the AOI automation system according to the present invention.
9 is a schematic perspective view of a cleaning unit of an AOI automation system according to the present invention;
10 is a schematic perspective view of the robot arm gripper of the AOI automation system according to the present invention.
11 is a process flow diagram of an automation method using an AOI automation system according to the present invention.

Hereinafter, the configuration and operation according to a preferred embodiment of the AOI automation system and method of the present invention will be described in detail with reference to the accompanying drawings. In the following description, detailed descriptions of parts that can be easily implemented by those skilled in the art may be omitted. In addition, since the following description is given with reference to preferred embodiments of the present invention, the present invention is not limited by the following examples, and it is natural that various modifications may be provided without departing from the scope of the present invention. something to do.

The AOI automation system and method to which the technology of the present invention is applied automates the overall AOI process performed in the manufacturing process of the PCB to prevent damage to the PCB during the transfer process before and after the inspection and to increase the inspection efficiency. Note that it is about the method.

For this purpose, the AOI automation system 100 of the present invention includes a supply unit 110, a cleaning unit 120, and a robot operation unit in the direction from the input side to the discharge side of the system body as shown in FIGS. 130), the inspection unit 140, and the discharge unit 150 is configured to include and specifically as follows.

The AOI automation system of the present invention builds a three-tiered frame body inside an external panel and has a series of sequential input of PCB before inspection, inspection, and sequential discharge of PCB after inspection, centering on the inspection unit 140 that mounts an optical module. Configured to automate the entire process.

The supply unit 110 is provided to receive the PCB from the tray in which the PCB is accommodated before the inspection and supply it to the cleaning unit 120 and the robot operation unit 130 .

The PCB that has undergone the manufacturing process is placed inside the tray together with the interleaf sheet for surface protection, and the supply unit 110 is configured to automatically supply the interposer sheet and the PCB into the system before inspection from such a plurality of trays. The supply unit 110 includes a tray supply module 111 , a tray transfer module 112 , a first transfer arm 113 , and an interleaving table 114 .

As shown in FIG. 8, the tray supply module 111 is provided to load a plurality of trays on which the interleaving paper and the PCB are placed before the inspection, and intermittently move upward to supply the inside of the system.

The tray supply module 111 is configured to load the trays in upper and lower stages, but the tray transfer module 112 and the first transfer arm 113 installed on the upper side move the tray upward one by one so that the transfer operation is performed. do.

The tray supply module 111 is equipped with a predetermined detection sensor to check whether an empty tray state after the interleaving paper placed on the tray and the PCB before the inspection is transferred by the first transfer arm 113 to be described later. It is configured to interwork with the operation of the tray transfer module 112 .

The interposer mounting table 114 is installed in a flat plate shape between the tray supply module 111 and the discharge unit 150 to temporarily hold the interleaving sheet accommodated in the tray to which the PCB is transferred before inspection.

The interleaving holder 114 is configured to temporarily hold the interposer until it is placed together with the PCB after inspection on an empty tray that moves to the discharge unit 150, which will be described later.

The interleaf mounting table 114 is installed between the upper side of the tray discharging module 152 to be described later on the upper side of the tray supply module 111 to facilitate movement of the interleaf by the first transfer arm 113 . do.

The tray transfer module 112 is installed so as to move between the tray supply module 111 and the discharge unit 150 to transfer the empty tray to which the PCB and the separator are transferred before the inspection to the discharge unit 150 .

The tray transfer module 112 discharges the empty tray from which the PCB and the separator are removed from the tray moved to the top by the tray supply module 111 provided on one side of the system body, the tray being provided on the other side of the system body. It is a configuration for transferring to the module 152 side.

The tray transfer module 112 checks whether an empty tray is in an empty tray state in conjunction with a predetermined detection sensor mounted on the tray supply module 111, then slides and moves to transfer the empty tray to the tray discharge module 152, waiting configure to do

The first transfer arm 113 is installed so as to follow and move from the upper side of the tray supply module 111, so that the PCB before the inspection is the alignment table 121 of the cleaning unit 120, and the interleaf is used as the interleaf mounting table 114. provided for each transfer.

The first transfer arm 113 follows and transversely moves between the tray supply module 111 and the interleaving holder 114 in the X-axis and Y-axis directions to mount the interleaving paper placed on the tray on the interleaving holder 114 . be prepared to do so

In addition, the first transfer arm 113 follows and moves between the tray supply module 111 and a cleaning unit 120 to be described later in the X-axis and Y-axis directions to align the PCB before inspection placed on the tray on an alignment table. (121) is provided to be seated.

The first transfer arm 113 is provided with a suction pad horizontally to vacuum-adsorb and transfer the PCB unit by unit before the interleaving or inspection.

The cleaning unit 120 is provided to fix the PCB supplied from the supply unit 110 one by one before the inspection and to remove foreign substances attached to the surface.

The cleaning unit 120 is configured to remove various foreign substances from the surface of the PCB before the inspection supplied by the supply unit 110 and to align the posture. The clean unit includes an alignment table 121 , a cleaning roller module 122 , and a cleaner replacement module 123 .

As shown in FIG. 9 , the alignment table 121 is provided to seat the PCB before the test, fix one end with a clamp, and arrange a plurality of alignment pins along the outer end to align the posture.

The alignment table 121 is provided to horizontally seat the PCB before the inspection transferred by the first transfer arm 113 .

A clamp is mounted on one side of the alignment table 121 , that is, a side of the cleaning roller module 122 , which will be described later, to prevent the PCB from being pushed by the cleaning roller module 122 .

The alignment table 121 is designed to have a size corresponding to the type of PCB before inspection, and a plurality of alignment pins are arranged on the upper surface of the alignment table 121 along the outer end corresponding to the standard of the PCB to be inspected. It is configured to align the posture of the cleaned PCB.

The cleaning roller module 122 is provided on one side of the alignment table 121 to adsorb foreign substances by rolling in one direction along the surface of the PCB before inspection.

The cleaning roller module 122 is formed by winding a cleaner having an adsorption surface in the form of a roll, and is configured to roll in contact with the surface of the PCB before inspection from the upper side of the alignment table 121 . The cleaner is provided to form a perforated line by one rotation amount.

The cleaner replacement module 123 is provided to peel and remove the cleaner wound on the outer peripheral surface of the cleaning roller module 122 by one rotation amount.

The cleaner replacement module 123 adsorbs foreign substances from the surface of the PCB and peels and removes the amount of one rotation from the cleaning roller module 122 returning to the original position, thereby cleaning the next PCB.

The robot operation unit 130 picks up the PCB from the supply unit 110 before the inspection that has passed through the cleaning unit 120 , and puts it into the inspection unit 140 , and after the inspection, the PCB is discharged from the inspection unit 140 . ) to be transported.

The robot operation unit 130 is equipped with an articulated robot arm that drives multi-axis rotation between the cleaning unit 120 and the inspection unit 140 , the inspection unit 140 and the discharge unit 150 to be described later. It is configured so that the PCB before the inspection and the PCB after the inspection are continuously transferred by copper wire.

In the robot operation unit 130 of the present invention, the cleaning unit 120 and the inspection unit 140, and between the inspection unit 140 and the discharge unit 150 are driven in three axes to adsorb the PCB before and after inspection. , the robot arm gripper 131 is mounted to transport.

As shown in FIG. 10, the robot arm gripper 131 includes an upper frame 132 and a lower frame 133, and each of the first and second variable jigs 134 and the third and fourth variable jigs ( 135), configured to include a variable cylinder (136).

The upper frame 132 and the lower frame 133 are mounted so as to be parallel up and down, and are provided so as to be reversed 180 degrees up and down.

The upper frame 132 and the lower frame 133 are formed in a rectangular shape corresponding to the PCB and are provided to be symmetrical above and below each other.

The upper frame 132 and the lower frame 133 are provided so that they can be reversed 180 degrees up and down around the rotation axis at one end connected to the robot arm. For example, the upper frame 132 is supplied by gripping the PCB before inspection. At the same time, the lower frame 133 is configured so that a series of operations of gripping and discharging the PCB after inspection can be continuously performed.

The first and second variable jigs 134 and third and fourth variable jigs 135 are mounted in a bar shape opposite to each other in front, rear and left and right sides of the upper frame 132 and the lower frame 133, respectively. A plurality of vacuum suction nozzles are arranged and provided.

The first and second variable jigs 134 and the third and fourth variable jigs 135 are provided in individual bar shapes corresponding to the four sides of the PCB to be inspected, and one side of the PCB is removed by a vacuum suction nozzle. provided for adsorption.

The variable cylinders 136 are respectively mounted between the first and second variable jigs 134 and between the third and fourth variable jigs 135 to enlarge or reduce the mutual spacing.

The variable cylinder 136 is configured to enlarge or reduce the distance between the first and second variable jigs 134 and between the third and fourth variable jigs 135 by mounting a cylinder rod between the variable jigs 135 to increase or decrease the distance between them. According to the type, the position of the suction by the vacuum suction nozzle is automatically adjusted to achieve gripping.

The inspection unit 140 is provided to inspect the PCB before inspection input by the robot operation unit 130 for abnormalities by automatic optical inspection, and to take out the PCB after inspection.

The inspection unit 140 is a conventional AOI device that mounts optical inspection equipment such as a camera, lighting, database, and image analysis module inside the main body, and provides a loader for inserting and withdrawing the PCB before and after inspection on one side of the main body. can be applied

The discharge unit 150 is provided to seat the PCB after the inspection transferred from the robot operation unit 130 to discharge to the outside of the system.

The discharge unit 150 is configured to automatically discharge the PCB to the outside of the system after interleaving and inspection on the empty tray transferred from the supply unit 110, and includes a second transfer arm 151 and a tray discharge module 152. includes

The second transfer arm 151 is installed so as to follow and move from the upper side of the tray discharge module 152, so that the interleaving arm is installed in the interleaving position 114 of the supply unit 110, and after inspection, the PCB is the robot operation unit 130. It is provided to transfer to the empty tray of the tray discharge module 152 in the.

The second transfer arm 151 follows and transversely moves between the interleaving holder 114 and the tray discharge module 152 in the X-axis and Y-axis directions to empty the tray for the interleaving paper temporarily placed on the interleaving holder 114 . ready to be transported to

In addition, the second transfer arm 151 is configured to be able to follow, traverse, and rotate in the X-axis and Y-axis directions between the robot arm gripper 131 and the tray discharge module 152, so that the robot arm gripper 131 is attached to the second transfer arm 151. It is configured to transfer the PCB to an empty tray after inspection, which is transferred in an adsorbed state.

The second transfer arm 151 is provided with a suction pad horizontally so as to vacuum-adsorb and transfer the PCB unit by unit after interleaving or inspection.

The tray discharge module 152 is provided to load a plurality of trays on which the PCB is placed after interleaving and inspection, and to move intermittently to the lower side to discharge to the outside of the system.

The tray discharge module 152 is configured such that the tray is loaded in upper and lower stages, but the tray is moved downward by one stage so that the transfer operation is performed by the second transfer arm 151 installed on the upper side.

Hereinafter, an automation method using the AOI automation system to which the technology of the present invention is applied having the configuration as described above will be described.

The automation method using the AOI automation system according to the present invention configures the overall PCB inspection process by automation by a series of automatic optical inspections leading to the sequential input of the PCB before the inspection, the inspection, and the sequential discharge of the PCB after the inspection.

For this, the AOI automation method of the present invention is, as shown in FIG. 11, a tray supply process (S10), a transfer and distribution process (S20), a tray replacement process (S30), a cleaning process before inspection (S40), a cleaner replacement process ( S50), a robot input process (S60), an AOI inspection process (S70), a robot discharge process (S80), a transfer assembly process (S90), and a tray discharge process (S100) are included.

The tray supply process (S10) is a process of loading a tray accommodating the PCB and interleaving paper before the inspection through the manufacturing process on the tray supply module 111, and moving it upward to supply it into the system.

In the transfer and distribution process (S20), the first transfer arm 113 follows and moves from the upper side of the tray supply module 111, so that the PCB before the inspection is transferred to the cleaning unit 120, and the interleaf is placed on the interleaving table 114. Each is transported to

In the transfer/distribution process (S20), the first transfer arm 113 moves the suction pad in the X-axis and Y-axis directions to adsorb the PCB before the inspection placed on the tray to the alignment table 121 of the cleaning unit 120. It is made to be transported, adsorbed on the interleaf, and temporarily mounted on the interleaving table 114 .

The tray replacement process (S30) is a process in which the tray transfer module 112 moves to the discharge unit 150 to move the empty tray after the transfer and distribution process (S20).

In the tray replacement process (S30), the empty tray to which the PCB has been transferred before the interleaving and inspection is transferred from the tray supply module 111 to the tray discharge module 152 to wait.

In the pre-inspection cleaning process (S40), one end of the PCB transferred to the alignment table 121 of the cleaning unit 120 is fixed with a clamp and the cleaning roller module 122 is rolled to remove foreign substances and then align the posture. is a process that

In the pre-inspection cleaning process (S40), before the PCB is put into the AOI inspection process (S70) before the inspection, foreign substances on the surface of the inspection site are removed and the posture is aligned to improve inspection accuracy.

The cleaner replacement process (S50) is a process in which the cleaner replacement module 123 peels off and removes the amount of the cleaner from one side of the cleaning roller module 122 that has undergone the cleaning process.

In the cleaner replacement process (S50), the cleaner wound on the cleaning roller module 122 is automatically peeled off and removed for one rotation along the perforation line to prepare the next PCB to be cleaned.

The robot input process ( S60 ) is a process in which the robot arm gripper 131 vacuum-sucks the PCB before the inspection on the alignment table 121 and transfers it to the inspection unit 140 after the cleaning process before inspection ( S40 ).

In the robot input process (S60), the robot arm gripper 131 provided in the multi-axis rotation-driven multi-joint robot arm adsorbs the PCB to the vacuum suction nozzle of the upper frame 132 or the lower frame 133 before the inspection, and the inspection unit (140) is made to input.

In the robot input process (S60), the distance between the first and second variable jigs 134 by driving the variable cylinder 136 provided in the upper frame 132 and the lower frame 133 of the robot arm gripper 131, and By preceding the step of adjusting the interval of the third and fourth variable jigs 135, the robot arm gripper 131 is automatically optimized according to the type of the PCB to be inspected.

The AOI inspection process (S70) is a process of inspecting the PCB input to the inspection unit 140 for abnormalities by automatic optical inspection and taking out the PCB after inspection.

In the AOU inspection process, by using optical inspection equipment such as a camera, lighting, database, and image analysis module mounted inside the body, the PCB is automatically optically inspected before inspection to detect abnormalities, and the PCB is taken out after inspection.

The robot discharging process (S80) is a process in which the robot arm gripper 131 vacuum adsorbs the PCB after the inspection in the inspection unit 140 after going through the AOI inspection process (S70) and transfers it to the discharge unit 150 .

In the robot discharging process (S80), the robot arm gripper 131 provided in the multi-axis rotational driving multi-joint robot arm adsorbs the PCB to the vacuum suction nozzle of the upper frame 132 or the lower frame 133 after inspection, and discharges the unit. It is made to transfer to 150.

The robot input process or robot ejection process (S60 ~ S80) is performed by reversing the upper frame 132 and lower frame 133 of the robot arm gripper 131 before the PCB and after inspection in the AOI inspection process (S70). It is made to input and withdraw the PCB at the same time. For example, the upper frame 132 of the robot arm gripper 131 grips and supplies the PCB before inspection, and at the same time, the lower frame 133 continuously performs a series of operations of gripping and discharging the PCB after inspection before inspection. It is configured to significantly shorten the replacement time of the PCB and the PCB after inspection.

In the transfer assembly process (S90), the second transfer arm 151 is driven and transversely moved from the upper side of the tray discharge module 152 in the interleaving mounting table 114, and after the inspection, the PCB is removed from the robot arm gripper 131. This is the process of transferring to an empty tray.

In the transfer and assembling process (S90), the second transfer arm 151 moves the suction pad in the X-axis and Y-axis directions to adsorb the interleaved paper temporarily placed on the interleaving holder 114, and the empty tray of the discharge unit 150 After inspection, the second transfer arm 151 moves the suction pad on the X-axis and rotates toward the robot arm gripper 131 to be adsorbed and transferred to the robot arm gripper 131, adsorbing the PCB and transferring it to an empty tray , is made to fit

In the tray discharging process (S100), after the inspection through the inspection process, a tray accommodating the PCB and interleaving paper is loaded onto the tray discharging module 152, and then moved downward to discharge to the outside of the system.

The AOI automation system and method according to the present invention as described above provides an AOI automation system and method configured to prevent damage to the PCB and increase inspection efficiency by automating the overall AOI process performed in the manufacturing process of the PCB.

In particular, the present invention automatically supplies and discharges a PCB and an interlayer sheet and a tray for placing the PCB and interposer paper to each module before the inspection that has gone through the manufacturing process, and optimizes the replacement and transfer flow of the PCB before and after the inspection, and before the inspection It has the effect of improving the inspection accuracy by cleaning the PCB.

Therefore, the present invention has advantages such as greatly reducing the possibility of damage or breakage in the handling process of the PCB and significantly improving the continuity and efficiency of the inspection process, compared to the AOI system of the prior art, so it is expected that the industrial application will be very large do.

100: AOI automation system 110: supply unit
111: tray supply module 112: tray transfer module
113: first transfer arm 114: interstitial position
120: cleaning unit 121: alignment table
122: cleaning roller module 123: cleaner replacement module
130: robot operation unit 131: robot arm gripper
132: upper frame 133: lower frame
134: first and second variable jig 135: third and fourth variable jig
136: variable cylinder 140: inspection unit
150: discharge unit 151: second transfer arm
152: tray discharge module
S10: tray supply process S20: transfer distribution process
S30: tray replacement process S40: cleaning process before inspection
S50: Cleaner replacement process S60: Robot input process
S70: AOI inspection process S80: Robot discharge process
S90: transfer assembly process S100: tray discharge process

Claims (7)

The supply unit 110 that receives the PCB from the tray in which the PCB is accommodated before the inspection and supplies it to the cleaning unit 120 and the robot operation unit 130, and the PCB before inspection supplied from the supply unit 110 are fixed unit by unit, The cleaning unit 120 for removing foreign substances attached to the surface, the cleaning unit 120 before the inspection, picks up the PCB from the supply unit 110 and puts it into the inspection unit 140, and after inspection, the PCB is transferred to the inspection unit 140 ), the robot operation unit 130 transferred to the discharge unit 150, the inspection unit 140 that inspects the PCB before the inspection input by the robot operation unit 130 by automatic optical inspection and takes the PCB out after the inspection 140, the robot In the AOI automation system including the discharge unit 150 for discharging the PCB to the outside of the system by seating the PCB on the tray after the inspection transferred from the operation unit 130,
The supply unit 110,
A tray supply module 111 provided to load a plurality of trays on which the interleaving paper and the PCB are placed before the inspection, and intermittently move to the upper side to supply the inside of the system;
An interposer mounting table 114 installed in a flat plate shape between the tray supply module 111 and the discharge unit 150 to temporarily hold the interleaving sheet accommodated in the tray to which the PCB has been transferred before inspection;
A tray transfer module 112, which is installed to move between the tray supply module 111 and the discharge unit 150 to transfer the empty tray to which the PCB and interleaving paper are transferred before the inspection to the discharge unit 150, and;
Installed so as to follow and move from the upper side of the tray supply module 111, the PCB before inspection is transferred to the alignment table 121 of the cleaning unit 120, and the interleaf is provided to be transferred to the interleaving table 114, respectively. Containing a transfer arm (113),
The cleaning unit 120,
Before the inspection, the PCB is seated, but a clamp is mounted on the front side of the cleaning roller module 122 in the moving direction to fix one end of the PCB with a clamp, and a plurality of alignment pins are arranged along the outer end to align the posture. (121) and;
A cleaning roller having a cleaner having an adsorption surface wound in a roll shape to form a perforation line for each rotation, and rolling in one direction along the surface of the PCB before inspection from one side of the alignment table 121 to adsorb foreign substances module 122;
and a cleaner replacement module 123 provided to peel and remove the cleaner wound on the outer peripheral surface of the cleaning roller module 122 by one rotation,
The discharge unit 150,
Installed so as to follow and move from the upper side of the tray discharge module 152, the interleaf is transferred from the interleaf mounting table 114 of the supply unit 110 to the empty tray of the tray discharge module 152, and after inspection, the PCB is a robot operation unit a second transfer arm 151 provided to transfer from 130 to an empty tray of the tray discharge module 152;
AOI automation system comprising a tray discharge module 152 having a plurality of trays on which the PCB is placed after interleaving and inspection, and intermittently moving to the lower side to discharge to the outside of the system. delete delete The method of claim 1,
The robot operation unit 130 drives a 3-axis drive between the cleaning unit 120 and the inspection unit 140 and the inspection unit 140 and the discharge unit 150 to adsorb and transport the PCB before and after inspection. Including a robot arm gripper 131 provided so as to
The robot arm gripper 131,
An upper frame 132 and a lower frame 133 that are mounted so as to be parallel to the top and bottom and can be reversed 180 degrees up and down;
The first and second variable jigs 134 and the second variable jigs 134 and the first are mounted in a bar shape opposite to each other at the front, rear, left and right sides of the upper frame 132 and the lower frame 133, respectively, and arranged by arranging a plurality of vacuum suction nozzles. 3 and 4 variable jigs 135, and
The first and second variable jigs 134 and the third are respectively mounted between the first and second variable jigs 134 and between the third and fourth variable jigs 135, respectively, at four corners according to the size of the PCB to be inspected. , AOI automation system, characterized in that it comprises a variable cylinder (136) provided to enlarge or reduce the front, rear and left and right intervals to correspond to the four variable jigs (135). delete In the automation method using the AOI automation system according to any one of claims 1 and 4,
A tray supply process (S10) of loading the tray accommodating the PCB and interleaving paper on the tray supply module 111 before the inspection that has undergone the manufacturing process and moving it upward to supply it into the system;
The first transfer arm 113 follows and moves from the upper side of the tray supply module 111, so that the PCB before inspection is transferred to the cleaning unit 120, and the interleaf is transferred to the interleaving table 114. A transfer and distribution process ( S20) and
A tray replacement process (S30) in which the empty tray is transferred to the discharge unit 150 by the tray transfer module 112 horizontally moved after the transfer and distribution process (S20);
A cleaning process before inspection (S40) in which one end of the PCB transferred to the alignment table 121 of the cleaning unit 120 is fixed with a clamp and the cleaning roller module 122 is rolled to remove foreign substances and then align the posture; ,
A cleaner replacement process (S50) in which the cleaner replacement module 123 peels and removes the amount of the cleaner for one rotation from one side of the cleaning roller module 122 that has undergone the cleaning process;
After the pre-inspection cleaning process (S40), the robot arm gripper 131 vacuum-adsorbs the PCB before the inspection on the alignment table 121 and transfers it to the inspection unit 140 in a robot input process (S60);
AOI inspection process (S70) of inspecting the PCB for inspection before the inspection input into the inspection unit 140 for abnormalities by automatic optical inspection and withdrawing the PCB after inspection;
After the AOI inspection process (S70), the robot arm gripper 131 vacuum-adsorbs the PCB after inspection in the inspection unit 140 and transfers it to the discharge unit 150 (S80);
A transfer assembly process in which the second transfer arm 151 moves and moves from the upper side of the tray discharge module 152 to the interleaving mounting table 114, and after inspection, the PCB is transferred from the robot arm gripper 131 to the empty tray (S90) and
After the inspection through the inspection process, the tray accommodating the PCB and the separator is loaded on the tray discharge module 152, and the tray discharging process (S100) for discharging it to the outside of the system is included,
In the robot input process (S60),
By driving the variable cylinder 136 provided in the upper frame 132 and the lower frame 133 of the robot arm gripper 131 according to the type of the PCB to be inspected, the spacing between the first and second variable jigs 134, and the second 3, 4 AOI automation method characterized in that it is made to precede the step of adjusting the interval of the variable jig (135). delete

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