CN116963871A - Processing device and method for manufacturing processed product - Google Patents
Processing device and method for manufacturing processed product Download PDFInfo
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- CN116963871A CN116963871A CN202180095325.0A CN202180095325A CN116963871A CN 116963871 A CN116963871 A CN 116963871A CN 202180095325 A CN202180095325 A CN 202180095325A CN 116963871 A CN116963871 A CN 116963871A
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- holding plate
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- 238000012545 processing Methods 0.000 title claims abstract description 110
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000000034 method Methods 0.000 title description 6
- 230000007246 mechanism Effects 0.000 claims abstract description 986
- 238000012546 transfer Methods 0.000 claims description 163
- 238000001035 drying Methods 0.000 claims description 101
- 230000033001 locomotion Effects 0.000 claims description 78
- 238000007689 inspection Methods 0.000 claims description 69
- 238000003860 storage Methods 0.000 claims description 56
- 230000005540 biological transmission Effects 0.000 claims description 44
- 238000003780 insertion Methods 0.000 claims description 43
- 230000037431 insertion Effects 0.000 claims description 43
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 238000009434 installation Methods 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 5
- 239000012530 fluid Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 abstract description 114
- 238000005520 cutting process Methods 0.000 description 340
- 238000004140 cleaning Methods 0.000 description 32
- 238000010586 diagram Methods 0.000 description 14
- 230000003028 elevating effect Effects 0.000 description 14
- 238000003754 machining Methods 0.000 description 12
- 238000003384 imaging method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000007921 spray Substances 0.000 description 7
- 230000004308 accommodation Effects 0.000 description 6
- 230000009471 action Effects 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- 239000004696 Poly ether ether ketone Substances 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000010410 dusting Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 229920002530 polyetherether ketone Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000010981 drying operation Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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Abstract
The present invention provides a holding plate for automatically replacing a processing object, comprising: a processing mechanism 4 for processing the sealed substrate W; a board housing portion 24 for housing a holding board M1 for holding the sealed substrate W; a holding base M2 to which a holding plate M1 is detachably attached, and which holds the sealed substrate W using the holding plate M1; and a board conveyance mechanism 25 for conveying the holding board M1 between the board housing portion 24 and the holding base M2, wherein the board conveyance mechanism 25 conveys the holding board M1 removed from the holding base M2 to the board housing portion 24, and conveys the holding board M1 located in the board housing portion 24 to the holding base M2.
Description
Technical Field
The present invention relates to a processing apparatus and a method for manufacturing a processed product.
Background
As described in patent document 1, in a cutting apparatus for cutting an object to be cut to produce a plurality of products to be singulated, it is conceivable to configure the cutting apparatus so that an adsorption jig can be attached to and detached from a cutting table.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open publication 2016-040060
However, in the cutting device, only the suction jig is detachable from the cutting table, and an operator is required to perform work when actually replacing the suction jig. Therefore, not only the labor cost of the operator is consumed, but also the mounting state is not uniform. In addition, the replacement work takes time, and productivity of the cutting device is lowered.
Disclosure of Invention
Problems to be solved by the invention
Accordingly, the present invention has been made to solve the above-mentioned problems, and an object of the present invention is to automatically replace a holding plate for holding an object to be processed.
Technical means for solving the problems
That is, the processing apparatus of the present invention includes: a processing mechanism for processing the object to be processed; a board housing unit configured to house a holding board for holding the object; a holding base to which the holding plate is detachably attached, the holding plate being used to hold the object; and a board transfer mechanism that transfers the board between the board housing portion and the holding base portion, and transfers the holding board removed from the holding base portion to the board housing portion and transfers the holding board located in the board housing portion to the holding base portion.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention thus constituted, the holding plate for holding the object can be automatically replaced.
Drawings
Fig. 1 is a diagram schematically showing the structure of a cutting device according to a first embodiment of the present invention.
Fig. 2 is a perspective view schematically showing the cutting table and the peripheral structure thereof according to the embodiment.
Fig. 3 is a view (plan view) schematically showing the structure of the cutting table and its peripheral structure according to the embodiment, as viewed from the Z direction.
Fig. 4 is a view (front view) schematically showing the structure of the cutting table and its peripheral structure according to the embodiment, as viewed from the Y direction.
Fig. 5 is a view (front view) schematically showing the structure of the first holding mechanism and the conveying movement mechanism according to the above embodiment, as viewed from the Y direction.
Fig. 6 is a view (side view) schematically showing the structure of the first holding mechanism and the conveying movement mechanism according to the embodiment, as viewed from the X direction.
Fig. 7 is a cross-sectional view schematically showing the structure of a rack and pinion (rack and pinion) mechanism according to the embodiment.
Fig. 8 is a view (front view) schematically showing the structure of the second holding mechanism and the conveying movement mechanism according to the embodiment, as viewed from the Y direction.
Fig. 9 is a schematic diagram showing the operation of the cutting device according to the embodiment.
Fig. 10 is a schematic view showing the structure of the holding plate and the holding base according to the embodiment.
Fig. 11 is a perspective view showing the first conveying mechanism (tray conveying mechanism) and the board housing section according to the embodiment.
Fig. 12 is a cross-sectional view schematically showing the structure of the fixing mechanism according to the embodiment.
Fig. 13 is a perspective view showing a holding base of the second holding mechanism according to the embodiment.
Fig. 14 is a diagram showing the replacement operation of the holding plate according to the embodiment.
Fig. 15 is a diagram showing the replacement operation of the holding plate according to the embodiment.
Fig. 16 is a schematic diagram showing a configuration of a modification of the board conveying mechanism according to the first embodiment, (a) a partial view (partial plan view) viewed from the Z direction, (b) a partial view (partial side view) viewed from the X direction, and (c) a partial view (partial front view) viewed from the Y direction.
Fig. 17 is a diagram schematically showing the structure of a cutting device according to a second embodiment of the present invention.
Fig. 18 is a view (plan view) schematically showing each position of the transfer table and the placement table according to the embodiment, as viewed from the Z direction.
Fig. 19 is a view (front view) schematically showing the structure of the transfer table, the placement table, and the attachment conveyance mechanism according to the embodiment, as viewed from the Y direction.
Fig. 20 is a plan view (a), a cross-sectional view (b), and a partially enlarged cross-sectional view (c) schematically showing the structure of the attaching member according to the embodiment.
Fig. 21 is a view (front view) schematically showing the structure of the mounting table, the attaching member housing section, and the attaching member conveying mechanism according to the embodiment, as viewed from the Y direction.
Fig. 22 is a perspective view showing the first conveying mechanism (board conveying mechanism) and the board housing section according to the embodiment.
Fig. 23 (a) shows a positional relationship between the attaching member housing portion and the board housing portion when the attaching member housing portion is to be taken out or put in, and (b) shows a positional relationship between the attaching member housing portion and the board housing portion when the board housing portion is to be taken out or put in, respectively, the holding board according to the above-described embodiment.
Fig. 24 is a diagram showing the replacement operation of the holding plate according to the embodiment.
Fig. 25 is a diagram showing the replacement operation of the holding plate according to the embodiment.
Fig. 26 is a diagram (a) schematically showing the structure of the mounting table, the attaching member housing section, and the attaching member conveying mechanism as viewed from the Y direction, (b) showing a state in which the interval between the upper guide rails is widened, and (c) showing a state in which the interval between the upper guide rails is narrowed according to the modified embodiment.
Fig. 27 is a diagram schematically showing the structure of a cutting device according to a third embodiment of the present invention.
Fig. 28 is a view (plan view) schematically showing the peripheral structure of the drying table and the storage box according to the embodiment, as viewed from the Z direction.
Fig. 29 is a view (front view) schematically showing the peripheral structure of the drying table and the storage box according to the embodiment, as viewed from the Y direction.
Fig. 30 is a schematic diagram showing the operation of the cutting device according to the embodiment.
Fig. 31 is a perspective view showing the board transport mechanism and the board storage section according to the embodiment.
Fig. 32 is a diagram showing the replacement operation of the holding plate according to the embodiment.
Fig. 33 is a diagram schematically showing the structure of a cutting device according to a fourth embodiment of the present invention.
Fig. 34 is a perspective view (a) and a cross-sectional view (b) schematically showing the structure of the tubular container according to the embodiment.
Fig. 35 is a view (front view) schematically showing the structure of the transfer table and the conveyance housing mechanism according to the embodiment, as viewed from the Y direction.
Fig. 36 is a diagram showing the replacement operation of the holding plate according to the embodiment.
Description of symbols
100: cutting device (processing device)
W: sealed substrate (object)
P: product (processed product)
2A, 2B: cutting table (processing table)
4: cutting mechanism (processing mechanism)
5: transfer platform
6: second holding mechanism (holding mechanism for conveying, second conveying mechanism)
7: moving mechanism for conveyance (second conveyance mechanism)
141: holding table (inspection table)
24: board accommodating part
M2: retaining base
M1: holding plate
25: board conveying mechanism
21: tray for holding food
22: pallet conveying mechanism (first conveying mechanism)
261: insertion hole for fixing
262: fixing cylinder
262a: cylinder body
262b: movable member
262c: elastic body
27: temporary placement section
281: holding hole for transportation
282: conveying cylinder part
29: inspection mechanism
29a: flow path for inspection
101: attachment member
102: mounting table
106: attaching member housing part
107: attached member conveying mechanism
1071: third holding mechanism (first conveying mechanism)
111: containing box
112: drying table
116: cylindrical container
116x: one end opening part
117: container setting part
118: conveying and accommodating mechanism
119: intermediate table
120: first product conveying mechanism
121: second product conveying mechanism
Detailed Description
The examples of the invention will be described in more detail. However, the present invention is not limited by the following description.
As described above, the processing apparatus of the present invention is characterized by comprising: a processing mechanism for processing the object to be processed; a board housing unit configured to house a holding board for holding the object; a holding base to which the holding plate is detachably attached, the holding plate being used to hold the object; and a board transfer mechanism that transfers the board between the board housing portion and the holding base portion, and transfers the holding board removed from the holding base portion to the board housing portion and transfers the holding board located in the board housing portion to the holding base portion.
In the processing apparatus, since the board conveying mechanism is provided for conveying the holding board removed from the holding base to the board housing portion and conveying the holding board located in the board housing portion to the holding base, the holding board can be automatically replaced with the holding base. As a result, the labor cost for replacing the holding plate can be reduced. Further, since the holding plate is automatically replaced, the variation in the mounting state of the holding plate to the holding base can be reduced. Further, since the holding plate is automatically replaced, the replacement time of the holding plate can be shortened, and productivity of the processing apparatus can be improved.
The board conveying mechanism preferably lifts and conveys the holding board.
With this configuration, the holding plate can be easily transported without interference between the holding plate and other members when transporting the holding plate.
The board conveying mechanism preferably conveys at least one of the following holding boards: a holding plate for a processing table for processing the object; a holding plate of a drying table for drying the processed object processed by the processing means; a holding plate of an inspection table for inspecting the processed object; a holding plate for a transfer table for placing the processed object before sorting; or a holding plate of a holding mechanism for carrying for holding the object after the processing.
With this configuration, the holding plates of the processing table, the inspection table, the transfer table, and the conveyance holding mechanism can be automatically replaced.
The processing device of the invention further comprises: and a processing object conveying mechanism for conveying the processing object.
In the above-described configuration, the board conveying mechanism is preferably configured by using the object conveying mechanism in order to automatically replace the holding board, simplify the device configuration, and reduce the device cost. That is, the board conveyance mechanism has the following function: conveying the object.
The processing apparatus of the present invention may have the following structure: the object to be processed may be stored in a tray (also referred to as "tray storage"). The processing device further includes: and a tray conveying mechanism for conveying the trays for classifying the processed objects.
In the above-described configuration, the tray conveyance mechanism is preferably configured to be used in order to automatically replace the holding plate, simplify the device configuration, and reduce the device cost. That is, the board conveyance mechanism has the following function: and conveying a tray for classifying the processed objects.
The board conveying mechanism preferably includes: a first conveying mechanism for conveying the holding plate between the plate accommodating section and the temporary placement section; and a second conveying mechanism for conveying the holding plate between the temporary placement section and the holding base section.
In the above configuration, the holding plate is conveyed by the first conveying mechanism and the second conveying mechanism via the temporary placement section, and thus the degree of freedom of the conveying destination of the holding plate can be increased as compared with the case where the plate conveying mechanism is constituted by one conveying mechanism.
In the case where the board conveyance mechanism is constituted by a first conveyance mechanism and a second conveyance mechanism, it is preferable that the first conveyance mechanism conveys the attaching member to the mounting table, and the second conveyance mechanism conveys the singulated object.
With this configuration, the holding plate can be automatically replaced, the device structure can be simplified, and the device cost can be reduced.
The processing apparatus of the present invention may have the following structure: the singulated objects may be attached to an attaching member having an adhesive surface and stored (also referred to as "interlinked storage"). The processing device further includes: a mounting table for mounting an attaching member having an adhesive surface to which the object to be processed singulated by the processing means is attached.
In the above-described configuration, the board transfer mechanism preferably transfers the attaching member to the mounting table.
In the processing apparatus, the board conveying mechanism can convey the attaching member to the mounting table, and therefore, the conveying mechanism for the attaching member is not required to be separately provided irrespective of the board conveying mechanism, and the apparatus structure of the processing apparatus for attaching and housing the singulated processing object to the adhesive surface can be simplified. Furthermore, the device cost can be reduced. In addition, in the case of performing a subsequent process such as a sputtering process or a packaging process on the singulated objects, the attaching member to which the singulated objects are attached may be moved, and the handling thereof may be facilitated.
The board conveying mechanism preferably includes: a first conveying mechanism for conveying the holding plate between the plate accommodating section and the temporary placement section; and a second conveying mechanism for conveying the holding plate between the temporary placement section and the holding base section.
In the above configuration, the holding plate is conveyed by the first conveying mechanism and the second conveying mechanism via the temporary placement section, and thus the degree of freedom of the conveying destination of the holding plate can be increased as compared with the case where the plate conveying mechanism is constituted by one conveying mechanism.
In the case where the board conveyance mechanism is constituted by a first conveyance mechanism and a second conveyance mechanism, it is preferable that the first conveyance mechanism conveys the attaching member to the mounting table, and the second conveyance mechanism conveys the singulated object.
With this configuration, the holding plate can be automatically replaced, the device structure can be simplified, and the device cost can be reduced.
As a specific embodiment for simplifying the structure of the apparatus, the processing apparatus of the present invention preferably further includes: a first holding mechanism for holding the object to be processed in order to convey the object to be processed to the processing table; a second holding mechanism that holds the singulated object in order to convey the singulated object from the processing table; a third holding mechanism that holds the attaching member for conveying the attaching member to the mounting table; and a transport moving mechanism having a common transmission shaft for moving the first holding mechanism, the second holding mechanism, and the third holding mechanism.
In the above-described configuration, it is preferable that the first conveying means is configured by using the third holding means and the conveying moving means, and the second conveying means is configured by using the second holding means and the conveying moving means, in order to automatically replace the holding plate, simplify the device configuration, and reduce the device cost.
The processing device of the invention further comprises: and an attaching member housing part for housing the attaching member.
In the above-described configuration, it is preferable that the board housing portion and the attaching member housing portion are disposed vertically to each other in order to reduce a footprint (footprint) of the processing apparatus.
The processing apparatus of the present invention may have the following structure: the singulated objects may be stored in a scattered state (also referred to as "block storage"). The processing device further includes: and a storage box for storing the objects, which have been singulated by the processing means, by dropping.
In the above-described configuration, the board transfer mechanism preferably transfers the singulated objects to the storage box.
In the above processing apparatus, the board conveying means can convey the singulated objects to the storage box, and therefore, it is not necessary to provide a separate conveying means independently of the board conveying means, and the apparatus structure of the processing apparatus for dropping and storing the singulated objects can be simplified. Furthermore, the device cost can be reduced. In addition, since the singulated objects are dropped into the storage box and stored, the storage space can be made smaller than the structure in which the tray is stored before. The footprint of the processing device can also be reduced.
The processing apparatus of the present invention may have the following structure: the singulated objects may be accommodated in a cylindrical container (also referred to as "tube accommodation"). Further, the cylindrical container is sometimes called a tube (tube), a box rod (magazine), a rod box (stick magazine), a rod (stick), or the like. The processing device further includes: a container installation unit provided with a cylindrical container that accommodates the singulated objects from an opening at one end; and a conveyance and storage mechanism that conveys the singulated objects to the cylindrical container provided in the container installation section and stores the objects.
As a specific embodiment for simplifying the structure of the processing device for performing block storage or pipe storage, the processing device of the present invention preferably further includes: a first holding mechanism for holding the object to be processed in order to convey the object to be processed to the processing table; a second holding mechanism that holds the singulated object in order to convey the singulated object from the processing table; and a transport moving mechanism having a common transmission shaft for moving the first holding mechanism and the second holding mechanism, wherein the board transport mechanism is configured by using the second holding mechanism and the transport moving mechanism.
In order to automatically check whether or not the holding plate is accurately fixed, the processing apparatus of the present invention preferably further includes: and an inspection mechanism for inspecting the mounting state of the holding plate to the holding base.
In a specific embodiment of the inspection mechanism, the inspection mechanism preferably includes: an inspection flow path that opens to a mounting surface on which the holding plate is mounted; and a detection sensor provided in the inspection flow path and detecting leakage of the fluid from the opening. Here, the detection sensor detects leakage of the fluid from the opening by measuring the pressure or flow rate of the fluid.
In order to simplify the structure of fixing the holding plate to the holding base, it is preferable that the holding base has: a fixing cylindrical portion inserted into a fixing insertion hole formed in the holding plate, the fixing cylindrical portion including: a cylindrical body inserted into the fixing insertion hole; a movable member provided so as to be movable to a protruding position and a sinking position from an outer peripheral surface of the cylinder body; and an elastic body that applies a force so that the movable element is at a protruding position with respect to the cylinder body, wherein the movable element is at a protruding position in a state where the fixing cylinder portion is inserted into the fixing insertion hole, thereby fixing the holding plate to the holding base portion.
In order to simplify the structure of attaching and detaching the holding board-to-board conveying mechanism, it is preferable that the board conveying mechanism includes: a transport cylinder portion inserted into a transport holding hole formed in the holding plate, the transport cylinder portion including: a cylindrical body inserted into the conveyance holding hole; a movable member provided so as to be movable to a protruding position and a sinking position from an outer peripheral surface of the cylinder body; and an elastic body that applies a force so that the movable member is at a position protruding from the cylinder body, wherein the movable member is at a position protruding from the cylinder body in a state in which the conveying cylinder portion is inserted into the conveying insertion hole, thereby holding the holding plate in the plate conveying mechanism.
The method for manufacturing a processed product using the processing apparatus is also an embodiment of the present invention.
< embodiments of the invention >
Hereinafter, embodiments of the processing apparatus according to the present invention will be described with reference to the accompanying drawings. In addition, any of the drawings shown below is schematically and omitted or exaggerated for ease of understanding. The same reference numerals are given to the same components, and description thereof is omitted as appropriate.
< first embodiment >, first embodiment
General structure of the machining device
The processing apparatus 100 according to the present embodiment is a cutting apparatus that cuts a sealed substrate W as a processing target, thereby dividing the substrate into a plurality of products P as processed products.
Here, the sealed substrate W is a substrate to which electronic components such as a semiconductor chip, a resistor element, and a capacitor element are connected, and is formed by resin molding at least the electronic components in a resin-sealed manner. As the substrate constituting the sealed substrate W, a lead frame (lead frame) and a printed wiring board may be used, and in addition to these, a semiconductor substrate (including a semiconductor wafer such as a silicon wafer), a metal substrate, a ceramic substrate, a glass substrate, a resin substrate, and the like may be used. Further, the substrate constituting the sealed substrate W may or may not be wired.
In the sealed substrate W and the product P of the present embodiment, one of the surfaces is a package surface for post-package. In the description of the present embodiment, one of the surfaces of the rear package is referred to as a "package surface", and the surface on the opposite side is referred to as a "label surface".
Specifically, as shown in fig. 1, the cutting device 100 includes: two cutting stages (processing stages) 2A and 2B for holding the sealed substrate W; a first holding mechanism 3 for holding the sealed substrate W so as to convey the sealed substrate W to the cutting stages 2A and 2B; a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting stages 2A and 2B; a transfer stage 5 for moving a plurality of products P; a second holding mechanism 6 for holding the plurality of products P so as to convey the plurality of products P from the cutting stations 2A and 2B to the transfer station 5; the conveying movement mechanism 7 has a common transmission shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6; and a cutting movement mechanism (processing movement mechanism) 8 for moving the cutting mechanism 4 relative to the sealed substrate W held on the cutting stages 2A and 2B. The first holding mechanism 3 and the transfer moving mechanism 7 constitute a transfer mechanism (loader) for transferring the sealed substrate W, and the second holding mechanism 6 and the transfer moving mechanism 7 constitute a transfer mechanism (unloader) for transferring the plurality of products P.
In the following description, directions orthogonal to each other along a plane (horizontal plane) of the upper surfaces of the cutting tables 2A and 2B are respectively referred to as an X direction which is a first direction and a Y direction which is a second direction, and a vertical direction orthogonal to the X direction and the Y direction is referred to as a Z direction. Specifically, the left-right direction in fig. 1 is referred to as the X direction, and the up-down direction is referred to as the Y direction. The X direction is a moving direction of the support 812, and is a direction orthogonal to a longitudinal direction (a direction in which the beam portion extends) of a beam portion (a cross beam portion) of the door-shaped support 812 that spans the pair of leg portions, which will be described later (see fig. 2 and 3).
< cutting stage 2A, cutting stage 2B >)
The two cutting tables 2A and 2B are fixed in the X direction, the Y direction, and the Z direction. The cutting table 2A is rotatable in the θ direction by a rotation mechanism 9A provided below the cutting table 2A. The cutting table 2B is rotatable in the θ direction by a rotation mechanism 9B provided below the cutting table 2B.
These two cutting tables 2A and 2B are provided along the X direction on the horizontal plane. Specifically, the two cutting tables 2A and 2B are arranged such that the upper surfaces thereof are on the same horizontal plane (at the same height position in the Z direction) (see fig. 4), and such that the centers of the upper surfaces thereof (specifically, the centers of rotation by the rotation mechanisms 9A and 9B) are on the same straight line extending in the X direction (see fig. 2 and 3).
As shown in fig. 1, two vacuum pumps 10A and 10B for suction holding are disposed corresponding to the two cutting tables 2A and 2B, and the two cutting tables 2A and 2B suction hold the sealed substrate W. Each of the vacuum pumps 10A and 10B is, for example, a water seal type vacuum pump.
Here, since the cutting stages 2A and 2B are fixed in XYZ directions, piping (not shown) connected from the vacuum pump 10A and 10B to the cutting stages 2A and 2B can be shortened, pressure loss of the piping can be reduced, and reduction of the suction force can be prevented. As a result, even a very small package of, for example, 1mm square or less can be reliably adsorbed to the cutting table 2A and the cutting table 2B. Further, since the decrease in the suction force due to the pressure loss of the piping can be prevented, the capacities of the vacuum pump 10A and the vacuum pump 10B can be reduced, resulting in downsizing and cost reduction.
< first holding mechanism 3 >)
As shown in fig. 1, the first holding mechanism 3 holds the sealed substrate W so as to convey the sealed substrate W from the substrate supply mechanism 11 to the cutting stage 2A and the cutting stage 2B. As shown in fig. 5 and 6, the first holding mechanism 3 includes: the suction head 31 having a plurality of suction portions 311 for sucking and holding the sealed substrate W; and a vacuum pump or a vacuum ejector (not shown) connected to the suction portion 311 of the suction head 31. The suction head 31 is moved to a desired position by a transfer moving mechanism 7 or the like described later, and the sealed substrate W is transferred from the substrate supply mechanism 11 to the cutting stage 2A and the cutting stage 2B.
As shown in fig. 1, the substrate supply mechanism 11 includes: a substrate accommodating portion 11a for accommodating a plurality of sealed substrates W from the outside; and a substrate supply unit 11b for moving the sealed substrate W stored in the substrate storage unit 11a to a holding position RP to be sucked and held by the first holding mechanism 3. The holding position RP is set so as to be aligned with the two cutting tables 2A and 2B in the X direction. The substrate supply mechanism 11 may have a heating portion 11c for heating and pressing the sealed substrate W in order to planarize the sealed substrate W sucked by the first holding mechanism 3.
< cutting mechanism 4 >)
As shown in fig. 1, 2 and 3, the cutting mechanism 4 includes two rotary tools 40 including a blade 41A, a blade 41B, and two spindle portions 42A and 42B. The two spindle portions 42A and 42B are provided such that the rotation axes thereof extend in the Y direction, and the blades 41A and 41B attached to the spindle portions are disposed so as to face each other (see fig. 3). The blades 41A and 41B of the spindle portions 42A and 42B rotate in the plane including the X and Z directions, thereby cutting the sealed substrate W held by the cutting stages 2A and 2B. As shown in fig. 4, the cutting device 100 of the present embodiment is provided with a liquid supply mechanism 12 for suppressing frictional heat generated by the blades 41A and 41B, the liquid supply mechanism 12 having an injection nozzle 12a for injecting cutting water (machining liquid). The injection nozzle 12a is supported by a Z-direction moving portion 83, for example, which will be described later.
< transfer station 5 >)
As shown in fig. 1, the transfer station 5 of the present embodiment is a station that moves a plurality of products P inspected by an inspection unit 13 described later. The transfer stage 5 is called a so-called index stage, and temporarily places a plurality of products P before sorting the plurality of products P into various trays 21. The transfer table 5 is arranged in a row along the X direction with the two cutting tables 2A and 2B on the horizontal plane. Further, the transfer stage 5 is movable back and forth along the Y direction, and is movable to the sorting mechanism 20. The plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 based on the inspection results (good products, defective products, etc.) obtained by the inspection unit 13.
The various trays 21 are conveyed to a desired position by the tray conveying mechanism 22 moving along the conveying shaft 71, and the products P sorted by the sorting mechanism 20 are placed thereon. After sorting, the various trays 21 are accommodated in the tray accommodating portion 23 by the tray conveying mechanism 22. In the present embodiment, the tray storage unit 23 is configured to store three types of trays, for example, a tray 21 before storing the product P, a tray 21 storing the good product P, and a tray 21 storing the defective product P requiring reworking (reworking).
< inspection portion 13 >)
As shown in fig. 1, the inspection unit 13 is provided between the cutting stage 2A, the cutting stage 2B, and the transfer stage 5, and inspects the plurality of products P held by the second holding mechanism 6. The inspection unit 13 of the present embodiment includes a first inspection unit 131 for inspecting the marking surface of the product P, and a second inspection unit 132 for inspecting the packaging surface of the product P. The first inspection unit 131 is an imaging camera having an optical system for inspecting the marking surface, and the second inspection unit 132 is an imaging camera having an optical system for inspecting the packaging surface. The first inspection unit 131 and the second inspection unit 132 may be shared.
In order to enable inspection of both surfaces of the plurality of products P by the inspection unit 13, an inversion mechanism 14 (see fig. 1) for inverting the plurality of products P is provided. The reversing mechanism 14 includes a holding table 141 for holding a plurality of products P, and a reversing portion 142 such as a motor for reversing the holding table 141 to reverse the front and back directions.
When the second holding mechanism 6 holds the plurality of products P from the cutting tables 2A and 2B, the marking surface of the product P faces downward. In this state, the first inspection unit 131 inspects the marking surface of the product P while the plurality of products P are being conveyed from the cutting tables 2A and 2B to the reversing mechanism 14. Then, the plurality of products P held by the second holding mechanism 6 are reversed by the reversing mechanism 14, and thereafter the reversing mechanism 14 is moved to the position of the transfer stage 5. During the movement, the second inspection unit 132 inspects the package surface of the product P facing downward. Thereafter, the product P is transferred to the transfer station 5.
< second holding mechanism 6 >)
As shown in fig. 1, the second holding mechanism 6 holds the plurality of products P so as to convey the plurality of products P from the cutting tables 2A and 2B to the reversing mechanism 14. As shown in fig. 8, the second holding mechanism 6 includes: the suction head 61 is provided with a plurality of suction parts 611 for sucking and holding a plurality of products P; and a vacuum pump or a vacuum ejector (not shown) connected to the suction part 611 of the suction head 61. Then, the suction head 61 is moved to a desired position by a conveyance moving mechanism 7 or the like described later, and the plurality of products P are conveyed from the cutting tables 2A and 2B to the holding table 141.
< moving mechanism for conveying 7 >)
As shown in fig. 1, the conveyance moving mechanism 7 moves the first holding mechanism 3 at least between the substrate supply mechanism 11 and the cutting tables 2A and 2B, and moves the second holding mechanism 6 at least between the cutting tables 2A and 2B and the holding table 141.
As shown in fig. 1, the conveying movement mechanism 7 includes: the common transfer shaft 71 extends linearly along the arrangement direction (X direction) of the two cutting stages 2A and 2B and the transfer stage 5, and moves the first holding mechanism 3 and the second holding mechanism 6.
The transmission shaft 71 is provided in the following range: the first holding mechanism 3 is movable to above the substrate supply portion 11b of the substrate supply mechanism 11, and the second holding mechanism 6 is movable to above the transfer stage 5 (see fig. 1). The first holding mechanism 3, the second holding mechanism 6, the cutting table 2A, the cutting table 2B, and the transfer table 5 are provided on the same side (near front side) in plan view with respect to the transfer shaft 71. The inspection unit 13, the reversing mechanism 14, the various trays 21, the tray conveyance mechanism 22, the tray housing unit 23, the first cleaning mechanism 18, the second cleaning mechanism 19, and the collection container 172, which will be described later, are also provided on the same side (near front side) with respect to the transfer shaft 71.
As shown in fig. 5, 6, and 8, the conveyance moving mechanism 7 includes: a main moving mechanism 72 that moves the first holding mechanism 3 and the second holding mechanism 6 along the transmission shaft 71 in the X direction; a lifting and moving mechanism 73 for lifting and moving the first holding mechanism 3 and the second holding mechanism 6 in the Z direction relative to the transmission shaft 71; and a horizontal movement mechanism 74 for horizontally moving the first holding mechanism 3 and the second holding mechanism 6 in the Y direction with respect to the transmission shaft 71.
As shown in fig. 5 to 8, the main moving mechanism 72 includes: a common guide 721 provided on the transmission shaft 71 and guiding the first holding mechanism 3 and the second holding mechanism 6; and a rack and pinion mechanism 722 for moving the first holding mechanism 3 and the second holding mechanism 6 along the guide rail 721.
The guide rail 721 extends straight along the transmission shaft 71 in the X direction, and is provided in the following range, that is, in the same manner as the transmission shaft 71: the first holding mechanism 3 is movable to above the substrate supply portion 11b of the substrate supply mechanism 11, and the second holding mechanism 6 is movable to above the transfer stage 5. The guide rail 721 is slidably provided with a slide member 723, and the slide member 723 is provided with the first holding mechanism 3 and the second holding mechanism 6 via the elevating and moving mechanism 73 and the horizontal moving mechanism 74. Here, the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6, but the elevating movement mechanism 73, the horizontal movement mechanism 74, and the slide member 723 are provided for each of the first holding mechanism 3 and the second holding mechanism 6.
The rack and pinion mechanism 722 has: the cam rack 722a is shared by the first holding mechanism 3 and the second holding mechanism 6; and a pinion 722b provided on the first holding mechanism 3 and the second holding mechanism 6, respectively, and rotated by an actuator (not shown). The cam rack 722a is provided on the common transmission shaft 71, and can be changed to various lengths by connecting a plurality of cam rack members. The pinion 722b is provided on the sliding member 723, and is called a so-called roller pinion (roller pin), and includes: a pair of roller bodies 722b1 that rotate together with the rotation shaft of the motor; and a plurality of roller pins 722b2 provided between the pair of roller bodies 722b1 at equal intervals in the circumferential direction, and provided so as to be capable of rolling with respect to the roller bodies 722b 1. Since the rack and pinion mechanism 722 of the present embodiment uses the roller pinion, two or more roller pins 722b2 are in contact with the cam rack 722a, no backlash (backlash) is generated in the forward and reverse directions, and positioning accuracy is improved when the first holding mechanism 3 and the second holding mechanism 6 are moved in the X direction.
As shown in fig. 5 and 8, the elevating and moving mechanism 73 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6, respectively. As shown in fig. 5 and 6, the elevating and moving mechanism 73 of the first holding mechanism 3 is provided between the transmission shaft 71 (specifically, the main moving mechanism 72) and the first holding mechanism 3, and includes: a Z-direction guide rail 73a provided along the Z-direction; and an actuator portion 73b for moving the first holding mechanism 3 along the Z-direction guide rail 73 a. The actuator portion 73b may be, for example, a ball screw mechanism, an air cylinder, or a linear motor. As shown in fig. 8, the elevating and moving mechanism 73 of the second holding mechanism 6 has the same structure as the elevating and moving mechanism 73 of the first holding mechanism 3.
As shown in fig. 5, 6 and 8, the horizontal movement mechanism 74 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6. As shown in fig. 5 and 6, the horizontal movement mechanism 74 of the first holding mechanism 3 is provided between the transmission shaft 71 (specifically, the elevating movement mechanism 73) and the first holding mechanism 3, and includes: a Y-direction guide 74a provided along the Y-direction; an elastic body 74b that imparts a force to one side of the Y-direction guide 74a on the first holding mechanism 3; and a cam mechanism 74c that moves the first holding mechanism 3 to the other side of the Y-direction guide 74 a. Here, the cam mechanism 74c uses an eccentric cam, and the movement amount of the first holding mechanism 3 in the Y direction can be adjusted by rotating the eccentric cam by an actuator such as a motor.
As shown in fig. 8, the horizontal movement mechanism 74 of the second holding mechanism 6 has the same structure as the lifting movement mechanism 73 of the first holding mechanism 3. The second holding mechanism 6 may not be provided with the horizontal movement mechanism 74, or the first holding mechanism 3 and the second holding mechanism 6 may not be provided with the horizontal movement mechanism 74. Further, the horizontal movement mechanism 74 may use, for example, a ball screw mechanism instead of the cam mechanism 74c, a cylinder, or a linear motor, as in the lifting movement mechanism 73.
< cutting movement mechanism (processing movement mechanism) >)
The cutting movement mechanism 8 linearly moves the two spindle portions 42A and 42B in each of the X direction, the Y direction, and the Z direction.
Specifically, as shown in fig. 2 to 4, the cutting movement mechanism 8 includes: an X-direction moving unit 81 that moves the spindle units 42A and 42B linearly in the X-direction; a Y-direction moving section 82 for linearly moving the spindle sections 42A, 42B in the Y-direction; and a Z-direction moving unit 83 that moves the spindle units 42A and 42B linearly in the Z-direction.
The X-direction moving unit 81 is common to the two cutting tables 2A and 2B, and includes, as shown in fig. 2 and 3 in particular: a pair of X-direction guide rails 811 provided so as to sandwich the two cutting tables 2A and 2B along the X-direction; and a support body 812 that moves along the pair of X-direction guide rails 811 and supports the spindle portion 42A and the spindle portion 42B via the Y-direction moving portion 82 and the Z-direction moving portion 83. The pair of X-direction rails 811 are provided on the sides of the two cutting tables 2A and 2B provided along the X-direction. The support 812 is, for example, a door-shaped member having a shape extending in the Y direction. Specifically, the support body 812 includes a pair of legs extending upward from the pair of X-direction rails 811, and a beam portion (cross beam portion) provided to the pair of legs, the beam portion extending in the Y-direction.
The support 812 is linearly reciprocated in the X direction on the pair of X-direction guide rails 811 by, for example, a ball screw mechanism 813 extending in the X direction. The ball screw mechanism 813 is driven by a driving source (not shown) such as a servo motor. In addition, the support 812 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
As shown in fig. 3 in particular, the Y-direction moving portion 82 includes: a Y-direction guide rail 821 provided in the support 812 along the Y-direction; and a Y-direction slider 822 moving along the Y-direction guide 821. The Y-direction slider 822 is driven by, for example, a linear motor 823, and linearly reciprocates on a Y-direction rail 821. In the present embodiment, two Y-direction sliders 822 are provided corresponding to the two spindle portions 42A and 42B. Thereby, the two spindle portions 42A, 42B can be moved in the Y direction independently of each other. In addition, the Y-direction slider 822 may be configured to reciprocate by another linear motion mechanism using a ball screw mechanism.
As shown in fig. 2 to 4, the Z-direction moving unit 83 includes: a Z-direction guide rail 831 provided along the Z-direction in each Y-direction slider 822; and a Z-direction slider 832 moving along the Z-direction guide rail 831 and supporting the spindle portion 42A and the spindle portion 42B. That is, the Z-direction moving portion 83 is provided corresponding to each of the spindle portions 42A and 42B. The Z-direction slider 832 is driven by an eccentric cam mechanism (not shown), for example, and moves linearly back and forth on the Z-direction guide rail 831. In addition, the Z-direction slider 832 may be configured to reciprocate by another linear motion mechanism such as a ball screw mechanism.
As shown in fig. 1 and 4, the positional relationship between the cutting movement mechanism 8 and the transmission shaft 71 is such that the transmission shaft 71 passes across the cutting movement mechanism 8 above the cutting movement mechanism 8. Specifically, the transmission shaft 71 is disposed so as to cross the support body 812 above the support body 812, and the transmission shaft 71 and the support body 812 are in a positional relationship intersecting each other.
< machining chip accommodating portion 17 >)
As shown in fig. 1, the cutting device 100 according to the present embodiment further includes: the processing chip storage 17 stores processing chips S such as end materials generated by cutting the sealed substrate W.
As shown in fig. 2 to 4, the chip accommodating portion 17 is provided below the cutting tables 2A and 2B, and includes: a guide groove 171 having an upper opening 171X surrounding the cutting table 2A and the cutting table 2B in a plan view; and a collection container 172 for collecting the processing scraps S guided by the guide chute 171. By providing the chip accommodating portion 17 below the cutting tables 2A and 2B, the recovery rate of the chips S can be improved.
The guide chute 171 guides the machining chips S scattered or dropped from the cutting tables 2A and 2B to the collection container 172. In the present embodiment, the upper opening 171X of the guide chute 171 is formed so as to surround the cutting table 2A and the cutting table 2B (see fig. 3), so that the machining chips S are less likely to leak, and the recovery rate of the machining chips S can be further improved. The guide chute 171 is provided so as to surround the rotation mechanisms 9A and 9B provided below the cutting tables 2A and 2B (see fig. 4), and is configured so as to protect the rotation mechanisms 9A and 9B from machining chips S and cutting water.
In the present embodiment, the machining chip storage 17 is shared by the two cutting tables 2A and 2B, but may be provided in correspondence with each of the cutting tables 2A and 2B.
The collection container 172 collects the chips S passing through the guide chute 171 by its own weight, and is provided in the present embodiment so as to correspond to the two cutting tables 2A and 2B, respectively, as shown in fig. 4 and the like. The two collection containers 172 are disposed on the front side of the transfer shaft, and are configured to be detachable from the front side of the cutting device 100 independently. With this configuration, maintainability such as disposal of the machining chips S can be improved. The collection container 172 may be provided under all the cutting stages in one piece in consideration of the size of the sealed substrate W, the size and amount of the processing chips S, workability, and the like, or may be provided separately from three or more pieces.
As shown in fig. 4 and the like, the chip accommodating portion 17 includes a separating portion 173 for separating the cutting water from the chips. As a configuration of the separation portion 173, for example, a filter such as a perforated plate that allows cutting water to pass through is provided on the bottom surface of the recovery vessel 172. The separation unit 173 can collect the machining chips S without accumulating the cutting water in the collection container 172.
< first cleaning mechanism 18 >)
As shown in fig. 1 and 5, the cutting device 100 according to the present embodiment further includes: the first cleaning mechanism 18 cleans the upper surfaces (package surfaces) of the plurality of products P held on the cutting tables 2A and 2B. The first cleaning mechanism 18 cleans the upper surfaces (package surfaces) of the products P held on the cutting tables 2A and 2B by means of spray nozzles 18a (see fig. 5) for spraying cleaning liquid and/or compressed air onto the upper surfaces of the products P.
As shown in fig. 5, the first cleaning mechanism 18 is configured to be movable along the transmission shaft 71 together with the first holding mechanism 3. Here, the first cleaning mechanism 18 is provided on a slide member 723, and the slide member 723 slides on a guide rail 721 provided on the transmission shaft 71. Here, between the first cleaning mechanism 18 and the slide member 723, a lifting movement mechanism 181 for lifting and moving the first cleaning mechanism 18 in the Z direction is provided. As the lifting/lowering mechanism 181, for example, a rack and pinion mechanism, a ball screw mechanism, a cylinder, or the like can be used.
< second cleaning mechanism 19 >)
Further, as shown in fig. 1, the cutting device 100 of the present invention further includes: the second cleaning means 19 cleans the lower surface side (marking surface) of the plurality of products P held by the second holding means 6. The second cleaning mechanism 19 is provided between the cutting table 2B and the inspection unit 13, and sprays cleaning liquid and/or compressed air onto the lower surfaces of the plurality of products P held by the second holding mechanism 6, thereby cleaning the lower surface side (the marking surface) of the products P. That is, the second cleaning mechanism 19 cleans the lower surface side (the marking surface) of the product P in the middle of the movement of the second holding mechanism 6 along the transfer shaft 71.
< example of the operation of the cutting device 100 >
Next, an example of the operation of the cutting device 100 will be described. Fig. 9 shows a movement path of the first holding mechanism 3 and a movement path of the second holding mechanism 6 during the operation of the cutting device 10. In the present embodiment, all operations and controls of the cutting device 100, such as conveyance of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, replacement of the holding plate M1 described later, and the like, are performed by the control section CTL (see fig. 1).
The substrate supply portion 11b of the substrate supply mechanism 11 moves the sealed substrate W accommodated in the substrate accommodation portion 11a to the holding position RP held by the first holding mechanism 3.
Then, the transfer moving mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 suctions and holds the sealed substrate W. Thereafter, the transfer moving mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting tables 2A and 2B, and the first holding mechanism 3 releases the suction and holding, and places the sealed substrate W on the cutting tables 2A and 2B. At this time, the position of the sealed substrate W in the X direction is adjusted by the main moving mechanism 72, and the position of the sealed substrate W in the Y direction is adjusted by the horizontal moving mechanism 74. The sealed substrate W is sucked and held by the cutting stages 2A and 2B.
Here, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting stage 2B, the lifting/lowering movement mechanism 73 lifts the first holding mechanism 3 to a position where physical interference with the cutting movement mechanism 8 (support 812) does not occur. In addition, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting stage 2B, the first holding mechanism 3 does not need to be lifted up or down as described above when the support 812 is retracted from the cutting stage 2B to the transfer stage 5.
In this state, the cutting moving mechanism 8 sequentially moves the two spindle portions 42A and 42B in the X direction and the Y direction, rotates the cutting stages 2A and 2B, and cuts the sealed substrate W into a lattice shape to singulate.
After the cutting, the first cleaning means 18 is moved by the conveying moving means 7 to clean the upper surfaces (package surfaces) of the plurality of products P held on the cutting tables 2A and 2B. After the cleaning, the conveyance moving mechanism 7 withdraws the first holding mechanism 3 and the first cleaning mechanism 18 to predetermined positions.
Then, the conveying moving mechanism 7 moves the second holding mechanism 6 to the cut-off tables 2A and 2B after cutting, and the second holding mechanism 6 suctions and holds the plurality of products P. Thereafter, the conveying moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the second cleaning mechanism 19. Thereby, the second cleaning mechanism 19 cleans the lower surface side (the marking surface) of the plurality of products P held by the second holding mechanism 6.
After cleaning, the plurality of products P held by the second holding mechanism 6 are inspected on the lower surface side (the marking surface) by the inspection portion 131, and then transferred to the reversing mechanism 14, and the marking surface is sucked and held by the reversing mechanism 14 and then reversed. After the inversion, the inversion mechanism 14 moves, and the inspection unit 132 inspects the package surface of the product P. After the double-sided inspection, the product P is transferred from the reversing mechanism 14 to the transfer stage 5. The plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 based on the inspection results (good products, defective products, etc.) obtained by the inspection unit 13.
< automatic exchange function of retaining plate M1 >)
Further, the cutting device 100 of the present embodiment has the following functions: the holding plate M1 for holding the sealed substrate W or the product P is automatically replaced.
In this embodiment, as shown in fig. 10, the cutting stage 2A, the cutting stage 2B, the inspection stage (holding stage 141) for inspecting the products P, the transfer stage 5 for placing the products P before sorting, and the conveyance holding mechanism (second holding mechanism 6) for holding the products P for conveyance are provided with: a replaceable holding plate M1; and a holding base M2 to which a holding plate M1 is detachably attached, and the sealed substrate W or the product P is held by the holding plate M1. In fig. 10, the holding plates M1 and the holding bases M2 of the cutting tables 2A and 2B are representatively shown, but the holding tables 141, the transfer tables 5, and the second holding mechanisms 6 are also configured to have the holding plates M1 and the holding bases M2.
Specifically, as shown in fig. 1 and 11, the cutting device 100 includes: a board housing portion 24 for housing the holding board M1; and a board conveyance mechanism 25 for conveying the holding board M1 between the board housing portion 24 and the holding base M2.
The holding plate M1 is formed with a suction portion (suction hole) not shown for sucking the sealed substrate W or the product P, and is attached to the holding base M2, so that the sealed substrate W or the product P is sucked through a suction passage M21 provided in the holding base M2 (see fig. 10). The holding plates M1, the holding plates M1 for the cutting tables 2A and 2B, the holding plates M1 for the holding tables 141, the holding plates M1 for the transfer tables 5, and the holding plates M1 for the second holding mechanism 6 are different in shape, structure of the suction part, or the like. The holding plate M1 may be the same as the holding plates M1 used for the cutting tables 2A and 2B, the holding plates M1 used for the holding tables 141, the holding plates M1 used for the transfer tables 5, and the holding plates M1 used for the second holding mechanism 6 by sharing the shape, the structure of the suction part, and the like. Further, the various holding plates M1 are different in shape, structure of the suction portion, and the like with respect to the sealed substrate W or the product P, and are selected with respect to the sealed substrate W or the product P.
As shown in fig. 10, the cutting device 100 is provided with a fixing mechanism 26 for detachably attaching the holding plate M1 to the holding base M2. Specifically, the fixing mechanism 26 includes: a fixing insertion hole 261 formed in the holding plate M1; and a fixing cylindrical portion 262 provided on the holding base portion M2 and inserted into a fixing insertion hole 261 formed in the holding plate M1.
The fixing cylindrical portion 262 is called a so-called clip cylinder (chuck cylinder), and includes, as shown in fig. 12: a cylindrical body 262a inserted into the fixing insertion hole 261; the spherical movable element 262b is provided so as to be movable to a protruding position from the outer peripheral surface of the cylindrical body 262a and a sinking position; and an elastic body 262c configured to apply force so that the movable element 262b is at a protruding position with respect to the cylindrical body 262a, and to switch the movable element 262b between a protruding position (fig. 12 (a)) and a submerged position (fig. 12 (b)) by supplying compressed air.
Further, the fixing cylinder portion 262 has a piston portion 262d. The piston portion 262d is interposed between the movable element 262b and the elastic body 262c in the cylinder body 262a, and is moved in the cylinder body 262a by compressed air, thereby switching the movable element 262b between the protruding position and the retracted position. When the supply of compressed air is started, the piston portion 262d moves inside the cylinder body 262a against the force received from the elastic body 262c, so that the movable element 262b moves to the retracted position (fig. 12 (b)), and when the supply of compressed air is stopped, the piston portion moves inside the cylinder body 262a against the force received from the elastic body 262c, so that the movable element 262b moves to the protruding position (fig. 12 (a)).
As shown in fig. 12, the fixing insertion hole 261 formed in the holding plate M1 includes: when the movable member 262b is in the protruding position in the state where the fixing cylindrical portion 262 is inserted, the protruding portion 261a holds the movable member 262b so that the fixing cylindrical portion 262 does not fall off. The protrusion 261a catches the movable piece 262b at the protruding position, and does not catch the movable piece 262b at the sinking position. Therefore, the movable member 262b is set to the protruding position in a state where the fixing cylindrical portion 262 is inserted into the fixing insertion hole 261, and the holding plate M1 is fixed to the holding base M2 (see fig. 12 (a)). On the other hand, in a state where the fixing cylindrical portion 262 is inserted into the fixing insertion hole 261, the movable element 262b is set to the retracted position, and the fixing of the holding plate M1 to the holding base M2 is released (see fig. 12 (b)).
The board housing portion 24 houses the holding boards M1 before and after replacement (before and after use), and includes a carriage portion 241 on which each holding board M1 is mounted, as shown in fig. 11. In the present embodiment, the upper multi-stage carriage part 241 is configured to house a new holding plate M1 before replacement, and the lower multi-stage carriage part 241 is configured to house an old holding plate M1 after replacement. The board housing portion 24 is configured to place the old holding board M1 after use or to take out the new holding board M1 before use on the slide frame portion 241 by, for example, sliding the slide frame portion 241 to be subjected to the board conveyance mechanism 25 forward. A protruding portion 241a is provided on the front side of the carriage portion 241, and extraction is performed using the protruding portion 241 a.
The board conveying mechanism 25 conveys the holding board M1 removed from the holding base M2 to the board housing section 24, and conveys the holding board M1 located in the board housing section 24 to the holding base M2. The board conveyance mechanism 25 can convey the holding board M1 by lifting it. More specifically, the board conveyance mechanism 25 can convey the holding board M1 in the horizontal direction at a raised position where the holding board M1 is held from above and raised. Here, the "raised position" means a position at which the holding plate M1 is raised further than the position of the holding plate M1 attached to the holding base M2 to be replaced or the position of the lowest holding plate M1 that is desirable during conveyance.
Specifically, as shown in fig. 1, the board conveyance mechanism 25 includes: a first conveying mechanism 25a for conveying the holding board M1 between the board housing portion 24 and the temporary placement portion 27; and a second conveying mechanism 25b for conveying the holding plate M1 between the temporary placement section 27 and the holding base M2. The temporary placement section 27 of the present embodiment is a holding table 141 of the reversing mechanism 14. The transfer stage 5 may be a temporary placement unit 27, and the temporary placement unit 27 may be provided independently of the holding stage 141 and the transfer stage 5.
The first conveying mechanism 25a is configured using a tray conveying mechanism 22, and can convey the tray 21 for sorting the processed objects W (products P). The second conveying mechanism 25b is configured by using the second holding mechanism 6 and the conveying moving mechanism 7 (object conveying mechanism), and can convey the object W. That is, the board conveyance mechanism 25 (the first conveyance mechanism 25a and the second conveyance mechanism 25 b) is configured to move in the X direction via the common transmission shaft 71. The board conveyance mechanism 25 is provided on the same side (near front side) as the transmission shaft 71 in plan view.
As shown in fig. 11, the tray conveying mechanism 22 serving as the first conveying mechanism 25a includes a tray holding mechanism 221 for holding the tray 21, and a plate holding portion 221b such as a holding claw for holding the holding plate M1, in addition to a tray holding portion 221a such as a holding claw for holding the tray 21. Here, the tray holding portions 221a are provided on a pair of opposing sides facing each other, and the board holding portions 221b are provided on a pair of opposing sides different from the pair of opposing sides. The plate holding portion 221b may be configured to use the clip described above. The tray conveyance mechanism 22 is configured to be capable of raising and lowering the board holding portion 221b, and is configured to convey the board for holding M1 in a state in which the board holding portion 221b holding the board for holding M1 is raised to a raised position.
The tray conveyance mechanism 22 has the same configuration as the conveyance movement mechanism 7 of the first holding mechanism 3 and the second holding mechanism 6. That is, as shown in fig. 11, the tray conveyance mechanism 22 includes: a main moving mechanism 72 that moves the tray holding mechanism along the transfer shaft 71 in the X direction; a lifting movement mechanism 75 for lifting and moving the tray holding mechanism 221 in the Z direction with respect to the transmission shaft 71; and a horizontal movement mechanism 76 that horizontally moves the tray holding mechanism 221 in the Y direction with respect to the transmission shaft 71. The elevating and moving mechanism 75 and the horizontal moving mechanism 76 are configured as follows: the reciprocating movement is performed by a linear motion mechanism such as a mechanism using a rack and pinion mechanism, a mechanism using a ball screw mechanism, a mechanism using a linear motor, or a mechanism using a cylinder.
As shown in fig. 13, the second holding mechanism 6 serving as the second conveying mechanism 25b includes: the conveyance cylinder 282 is inserted into a conveyance holding hole 281 (see fig. 10) formed in the holding plate M1. In the present embodiment, the conveyance cylinder 282 is configured using the fixing cylinder 262 of the holding base M2 of the second holding mechanism 6. The conveyance holding hole 281 has the same structure as the fixing insertion hole 261 of the fixing mechanism 26 described above. The conveyance holding hole 281 and the fixing insertion hole 261 are configured to be vertically opposite to each other. The second holding mechanism 6 may use a holding claw that engages with the edge of the holding plate M1 instead of the conveyance cylinder 282 to hold the same. The second holding mechanism 6 is configured to be capable of lifting and lowering a portion where the holding plate M1 is held, and is configured to be capable of conveying the holding plate M1 in a state where the portion where the holding plate M1 is held is lifted and set to a lifted position.
Inspection mechanism 29 of holding plate M1
As shown in fig. 10 and 13, the cutting device 100 according to the present embodiment further includes: the inspection mechanism 29 inspects the mounting state of the holding plate M1 to the holding base M2.
The inspection mechanism 29 includes: the inspection flow path 29a opens on the mounting surface M22 on which the holding plate M1 is mounted; and a detection sensor (not shown) provided in the inspection flow path 29a for detecting leakage of the fluid from the opening. The inspection flow path 29a has an opening formed in the mounting surface M22 of the holding base M2, and is supplied with compressed air. The detection sensor detects the pressure or flow rate of the compressed air flowing through the inspection flow path 29a, thereby detecting leakage of the compressed air from the opening. By the inspection means 29, it is known whether or not the holding plate M1 is closely fixed to the mounting surface M22 of the holding base M2. When the holding plate M1 is not closely attached to the mounting surface M22 of the holding base M2 by the inspection mechanism 29, the holding plate M1 may be reattached by releasing the fixing by the fixing mechanism 26.
< replacement action of retaining plate M1 >)
Next, the replacement operation of the holding plate M1 by the plate conveying mechanism 25 according to the present embodiment will be described with reference to fig. 14 and 15.
In the following replacement operation, the holding plate M1 is discriminated when the holding plate M1 is taken out from the plate accommodating portion 24 by: the identifier such as the radio frequency identification (Radio Frequency Identification, RFID) provided on the holding plate M1 is read by an identifier reader (not shown) provided on the first conveying mechanism 25a (tray conveying mechanism 22).
(1) Transfer table 5 and replacement operation of holding plate of holding table 141 (see fig. 14)
The holding plate M1 of the holding table 141 is removed, and the holding plate M1 is lifted by the first conveying mechanism 25a (tray conveying mechanism 22) and conveyed to the plate accommodating portion 24 in a state where the lifting position is set. When the holding plate M1 of the holding table 141 is removed, compressed air is supplied to the fixing cylindrical portion 262 to set the movable element 262b to the retracted position, and the fixing of the fixing mechanism 26 is released.
Then, the first conveying mechanism 25a (tray conveying mechanism 22) takes out a new holding plate M1 of the holding table 141 from the plate housing portion 24, conveys the new holding plate M1 to the holding base M2 of the holding table 141 in a state set to the raised position, and lowers and places the holding plate M1. In this state, when compressed air is supplied to the fixing cylindrical portion 262 to set the movable element 262b to the retracted position, the holding plate M1 is lowered, the fixing cylindrical portion 262 enters the fixing insertion hole 261 of the holding plate M1, and when the supply of compressed air is stopped, the movable element 262b is set to the protruding position, and the holding plate M1 is fixed to the holding base M2 of the holding table 141.
The holding plate M1 of the transfer stage 5 is removed, and the holding plate M1 is lifted by the first conveying mechanism 25a (pallet conveying mechanism 22) and conveyed to the plate accommodating section 24 in a state where the lifting position is set. When the holding plate M1 of the transfer table 5 is removed, compressed air is supplied to the fixing cylinder 262 to set the movable element 262b to the retracted position, and the fixing of the fixing mechanism 26 is released.
Then, the first conveying mechanism 25a (pallet conveying mechanism 22) takes out the new holding plate M1 of the transfer table 5 from the plate housing portion 24, conveys the new holding plate M1 to the holding base M2 of the transfer table 5 in a state set to the raised position, and lowers and places the holding plate M1. In this state, when compressed air is supplied to the fixing cylindrical portion 262 and the movable element 262b is set to the retracted position, the holding plate M1 is lowered, the fixing cylindrical portion 262 enters the fixing insertion hole 261 of the holding plate M1, and when the supply of compressed air is stopped, the movable element 262b is set to the protruding position, and the holding plate M1 is fixed to the holding base M2 of the transfer table 5.
The order of replacement of the holding plate M1 of the holding stage 141 and the replacement of the holding plate M1 of the transfer stage 5 is not limited to the above, but may be reversed, and after the holding plates M1 of the holding stage 141 and the transfer stage 5 are removed, new holding plates M1 may be attached to the holding stage 141 and the transfer stage 5, respectively.
(2) Replacement operation of the holding plates of the cutting tables 2A, 2B and the second holding mechanism 6 (see fig. 15)
The holding plates M1 of the cutting tables 2A and 2B are removed, the holding plates M1 are lifted by the second conveying mechanism 25B (the conveying moving mechanism 7 and the second holding mechanism 6), and conveyed to the holding table 141 as the temporary placement section 27 in a state where the lifting position is set, and the holding plates M1 are lowered and placed. When the holding plates M1 of the cutting tables 2A and 2B are removed, compressed air is supplied to the fixing cylinder portion 262 to set the movable element 262B to the retracted position, and the fixing of the fixing mechanism 26 is released. Here, when the holding base 141 is the temporary placement portion 27, the holding base 141 is preferably removed in advance.
The first conveying mechanism 25a (tray conveying mechanism 22) conveys the holding boards M1 placed on the cutting tables 2A and 2B of the holding table 141 to the board accommodating portion 24 in a state where the boards are lifted up to a lifted position, and lowers and accommodates the holding boards M1.
Then, the first conveying mechanism 25a (tray conveying mechanism 22) takes out the new holding plate M1 of the cutting table 2A and the cutting table 2B from the plate housing portion 24, conveys the new holding plate M1 to the holding table 141 as the temporary placement portion 27 in a state of being set to the raised position, and lowers and places the holding plate M1.
Then, the second conveying mechanism 25B (the conveying moving mechanism 7 and the second holding mechanism 6) conveys the new holding plate M1 placed on the holding table 141 to the cutting table 2A and the holding base M2 of the cutting table 2B in a state where the holding plate M1 is set to the raised position, and lowers and places the holding plate M1. In this state, when compressed air is supplied to the fixing cylindrical portion 262 and the movable member 262B is set to the retracted position, the fixing cylindrical portion 262 enters the fixing insertion hole 261 of the holding plate M1, and when the supply of compressed air is stopped, the movable member 262B is set to the protruding position, and the holding base M2 of the cutting table 2A and the cutting table 2B fixes the holding plate M1.
When the holding plate M1 of the second holding mechanism 6 is replaced, the second holding mechanism 6 is moved to the holding table 141 as the temporary placement section 27 by the conveyance moving mechanism 7, and the holding plate M1 is lowered and removed, and the holding plate M1 is placed on the holding table 141 as the temporary placement section 27. When the holding plate M1 of the second holding mechanism 6 is removed, compressed air is supplied to the fixing cylinder portion 262 to set the movable element 262b to the retracted position, and the fixing of the fixing mechanism 26 is released.
Then, the first conveying mechanism 25a (tray conveying mechanism 22) lifts the holding plate M1 of the second holding mechanism 6 placed on the holding table 141, conveys the holding plate M1 to the plate accommodating portion 24 in a state of being set at the lifted position, and lowers and accommodates the holding plate M1. Here, when the holding table 141 is the temporary placement section 27, it is preferable to remove the holding plate M1 of the holding table 141 in advance.
Then, the first conveying mechanism 25a (tray conveying mechanism 22) takes out the new holding plate M1 of the second holding mechanism 6 from the plate housing portion 24, conveys the new holding plate M1 to the holding table 141 as the temporary placement portion 27 in a state of being set to the raised position, and lowers and places the holding plate M1.
Then, the second holding mechanism 6 is moved to the holding table 141 by the conveying moving mechanism 7, the holding base M2 is lowered, and a new holding plate M1 placed on the holding table 141 is attached. Here, the fixing cylindrical portion 262 provided at the holding base M2 of the second holding mechanism 6 is inserted into the fixing insertion hole 261 formed in the holding plate M1 by the conveying moving mechanism 7. In this state, when compressed air is supplied to the fixing cylindrical portion 262 and the movable member 262b is set to the retracted position, the fixing cylindrical portion 262 enters the fixing insertion hole 261 of the holding plate M1, and when the supply of compressed air is stopped, the movable member 262b is set to the protruding position and the holding plate M1 is fixed to the holding base M2 of the second holding mechanism 6.
In addition, when the holding plates M1 of the cutting tables 2A and 2B are replaced, the holding plate M1 of the second holding mechanism 6 serving as the second conveying mechanism 25B is preferably removed in advance.
The transfer stage 5, the holding stage 141, the cutting stage 2A, the cutting stage 2B, and the holding plate M1 of the second holding mechanism 6 may be replaced by a series of operations. For example, it is conceivable that the transfer stage 5, the holding stage 141, the second holding mechanism 6, the cutting stage 2A, and the holding plate M1 of the cutting stage 2B are removed in order, and then the cutting stage 2A, the cutting stage 2B, the second holding mechanism 6, the holding stage 141, and the holding plate M1 of the transfer stage 5 are attached in order.
Effect of the present embodiment >
According to the cutting device 100 of the present embodiment, since the board conveyance mechanism 25 is provided to convey the holding board M1 removed from the holding base M2 to the board housing portion 24 and convey the holding board M1 located in the board housing portion 24 to the holding base M2, the holding board M1 can be automatically replaced with respect to the holding base M2. As a result, the labor cost for replacing the holding plate M1 can be reduced. Further, since the holding plate M1 is automatically replaced, the replacement time of the holding plate M1 can be shortened, and the productivity of the cutting device 100 can be improved. Further, the non-uniformity of the mounting state of the holding plate M1 to the holding base M2 can be reduced.
The board conveyance mechanism 25 further includes: a first conveying mechanism 25a for conveying the holding board M1 between the board housing portion 24 and the temporary placement portion 27; and a second conveying mechanism 25b that conveys the holding plate M1 between the temporary placement section 27 and the holding base M2, so that the degree of freedom of the conveying destination of the holding plate M1 can be increased as compared with the case where the plate conveying mechanism 25 is constituted by one conveying mechanism. Here, the first conveying mechanism 25a is configured by using the tray conveying mechanism 22, so that the device structure can be simplified and the device cost can be reduced. Further, the second conveying mechanism 25b is configured by using the second holding mechanism 6 and the conveying moving mechanism 7, so that the device structure can be simplified and the device cost can be reduced.
In addition, in the present embodiment, the first holding mechanism 3 and the second holding mechanism 6 are moved by the common transfer shaft 71 extending along the arrangement direction of the cutting stage 2A, the cutting stage 2B, and the transfer stage 5, and the cutting mechanism 4 is moved by the cutting moving mechanism 8 in the horizontal plane in the X direction along the transfer shaft 71 and the Y direction orthogonal to the X direction, respectively, so that the sealed substrate W can be processed without moving the cutting stage 2A and the cutting stage 2B in the X direction and the Y direction. Therefore, the cutting tables 2A and 2B can be moved without using a ball screw mechanism, and a bellows member for protecting the ball screw mechanism and a cover member for protecting the bellows member are not required. As a result, the device structure of the cutting device 100 can be simplified. Further, the cutting tables 2A and 2B may not be moved in the X direction and the Y direction, and the occupied area of the cutting device 100 may be reduced.
< modification of the first embodiment >
For example, in the first embodiment, the holding plate M1 of each of the cutting table 2A, the cutting table 2B, the inspection table (holding table 141), the transfer table 5, and the conveyance holding mechanism (second holding mechanism 6) is automatically replaced, but at least one of the cutting table 2A, the cutting table 2B, the inspection table (holding table 141), the transfer table 5, and the conveyance holding mechanism (second holding mechanism 6) may be automatically replaced.
The board conveyance mechanism 25 of the first embodiment has the first conveyance mechanism 25a and the second conveyance mechanism 25b, but may have a single conveyance mechanism. The board conveyance mechanism 25 may be configured not to use the tray conveyance mechanism 22, or may be configured not to use the second holding mechanism 6 and the conveyance moving mechanism 7 (object conveyance mechanism).
As an example of a structure in which the tray conveyance mechanism is not used for the board conveyance mechanism 25, for example, a structure shown in fig. 16 is conceivable. The cutting device 100 does not have the tray conveying mechanism 22, and is configured in such a manner that: the various trays 21 are moved below the board housing portion 24 by the tray moving mechanism TM, thereby being moved to the sorting position where the products P are sorted by the sorting mechanism 20. Further, the tray moving mechanism TM includes: a conveyance rail TM1 extending in the Y direction; a moving mechanism (not shown) for moving the tray 21 on the conveying rail TM 1; a moving mechanism TM2 that moves the various trays 21 in the X direction; and a movement mechanism TM3 provided for each of the various trays 21, and configured to move the various trays 21 in the Z direction. In the cutting device 100, the board conveyance mechanism 25 may be configured using the second holding mechanism 6 and the conveyance moving mechanism 7.
The board housing portion 24 of the first embodiment houses the holding boards M1 of the cutting stage 2A, the cutting stage 2B, the inspection stage (holding stage 141), the transfer stage 5, and the conveyance holding mechanism (second holding mechanism 6), but a plurality of dedicated board housing portions 24 may be provided according to the type of the holding boards M1.
The transfer table 5 of the first embodiment is an index table temporarily placed before sorting into the various trays 21, but the transfer table 5 may be a holding table 141 of the reversing mechanism 14.
In the first embodiment, the following configuration may be adopted, namely: grooves are formed in the cutting tables 2A and 2B without cutting the sealed substrate. In this case, for example, the following structure is also possible: the sealed substrates W grooved on the cutting tables 2A and 2B are returned to the substrate supply section 11B by the first holding mechanism 3 and the transfer movement mechanism 7. The following structure may be adopted, namely: the sealed substrate W returned to the substrate supply unit 11b is stored in the substrate storage unit 11a.
< second embodiment of the invention >
Next, a second embodiment of the present invention will be described.
Unlike the tray housing of the first embodiment, the cutting device 100 of the second embodiment is configured to be capable of housing a plurality of products P by attaching them to an attaching member 101 having an adhesive surface 101x (also referred to as "serial housing").
Specifically, as shown in fig. 17, the cutting device 100 includes: two cutting stages (processing stages) 2A and 2B for holding the sealed substrate W; a first holding mechanism 3 for holding the sealed substrate W so as to convey the sealed substrate W to the cutting stages 2A and 2B; a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting stages 2A and 2B; a transfer stage 5 for moving a plurality of products P; a second holding mechanism 6 for holding the plurality of products P so as to convey the plurality of products P from the cutting stations 2A and 2B to the transfer station 5; the conveying movement mechanism 7 has a common transmission shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6; and a cutting movement mechanism (processing movement mechanism) 8 for moving the cutting mechanism 4 relative to the sealed substrate W held on the cutting stages 2A and 2B.
Hereinafter, a structure different from that of the first embodiment will be mainly described.
The transfer stage 5 of the second embodiment temporarily mounts a plurality of products P before attaching the plurality of products P to an attaching member 101 described later. As shown in fig. 17 and 18, the transfer stage 5 is provided so as to be movable in the Y direction, and moves between a transfer position X1 where the plurality of products P are placed by the second holding mechanism 6 and a take-out position X2 where the plurality of products P are conveyed by the attachment conveyance mechanism 103. The transfer position X1 is set on the front side of the transfer shaft 71, and the removal position X2 is set on the inner side of the transfer shaft 71, in a position aligned with the two cutting tables 2A and 2B in the X direction on the horizontal plane.
The transfer shaft 71 of the transfer movement mechanism 7 extends to a range in which the first holding mechanism 3 is movable above the substrate supply portion 11b of the substrate supply mechanism 11, and the second holding mechanism 6 is movable above the transfer stage 5, and also to a range in which the attaching member transfer mechanism 107, which will be described later, is movable between the attaching member transfer position X3 and the guide rail 108. The mounting table 102, the attaching member housing portion 106, and the attaching member conveying mechanism 107, which will be described later, are also provided on the same side (near front side) as the transfer shaft 71.
Specific structure of < interlink accommodation >)
As shown in fig. 17 to 19, the cutting device 100 according to the second embodiment includes: a mounting table 102 for mounting an attaching member 101, the attaching member 101 having an adhesive surface 101x for attaching a plurality of products P; and an attaching conveyance mechanism 103 that conveys the plurality of products P from the transfer stage 5 to the attaching member 101 mounted on the mounting stage 102.
In the present embodiment, two mounting tables 102 are provided along the X direction (see fig. 17), and the attaching member 101 is mounted on each mounting table 102. Specifically, the two mounting tables 102 are arranged such that the upper surfaces thereof are on the same horizontal plane (at the same height position in the Z direction).
As shown in fig. 17 and 18, the two mounting tables 102 are provided so as to be movable in the Y direction, and move between an attaching member conveying position X3 at which the attaching member 101 is conveyed by the attaching member conveying mechanism 107 and an attaching position X4 at which the plurality of products P are conveyed by the attaching conveying mechanism 103. The two tables 102 are moved independently of each other between the attachment member conveying position X3 and the attachment position X4. The attachment member conveying position X3 is set on the front side of the transfer shaft 71, and the attachment position X4 is set on the inner side of the transfer shaft 71. The mounting table 102 located at the attaching position X4 and the transfer table 5 located at the removing position X2 are arranged along the X direction (see fig. 17).
Here, as shown in fig. 20, the attaching member 101 includes: the frame-shaped member 101a is, for example, annular or rectangular; and a resin sheet 101b having an adhesive surface 101x disposed on the inner side of the frame-like member 101 a. The frame-like member 101a is made of metal such as stainless steel. The resin sheet 101b includes, for example, a sheet-like base material 101b1 made of resin, and an adhesive layer (adhesive layer) 101b2 containing an adhesive applied to the upper surface of the sheet-like base material 101b 1. The upper surface of the adhesive layer (adhesive layer) 101b2 is an adhesive surface 101x.
The transfer mechanism 103 transfers the plurality of products P from the transfer station 5 moved to the take-out position X2 to the attaching member 101 placed on the placement station 102 moved to the attaching position X4.
Specifically, as shown in fig. 17 and 18, the attaching conveyance mechanism 103 includes: the product adsorbing mechanism 1031 adsorbs a plurality of products P held by the transfer table 5, for example, in a row; and a suction moving mechanism 1032 for moving the product suction mechanism 1031 in the X direction. In the present embodiment, two attaching conveyance mechanisms 103 are provided, and each attaching conveyance mechanism 103 is configured to be driven independently of the other.
As shown in fig. 19, the product adsorbing mechanism 1031 includes: the suction head 1031A is provided with a plurality of suction units 1031A for sucking and holding the plurality of products P, respectively; and a vacuum pump or a vacuum ejector (not shown) connected to the suction unit 1031A of the suction head 1031A. The product adsorbing mechanism 1031 is configured such that each adsorbing portion 1031a adsorbs one product P. The plurality of suction units 1031a are configured to be movable up and down independently of each other, and each suction unit 1031a is configured to be lowered to thereby suck the product P.
As shown in fig. 19, the adsorbing moving mechanism 1032 includes: an X-direction moving unit 1032a for moving the product suction mechanism 1031 in the X-direction; and a Z-direction moving unit 1032b for moving the product suction mechanism 1031 in the Z-direction. The suction moving mechanism 1032 may have a Y-direction moving portion that moves the product suction mechanism 1031 in the Y-direction.
The X-direction moving unit 1032a includes: an X-direction guide rail 1032a1 provided along the X-direction on the inner side of the transmission shaft 71; and a support 1032a2 that moves along the X-direction guide rail 1032a1 and supports the product adsorbing mechanism 1031 via the Z-direction moving portion 1032 b. The support 1032a2 is linearly reciprocated along the X direction on the X direction rail 1032a1 by, for example, a ball screw mechanism (not shown) extending along the X direction. The ball screw mechanism is driven by a driving source (not shown) such as a servo motor. In addition, the support 1032a2 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
As shown in fig. 19, the Z-direction moving unit 1032b includes: a Z-direction guide rail 1032b1 provided in the support 1032a2 along the Z-direction; and a Z-direction slider 1032b2 that moves along the Z-direction guide rail 1032b1 and supports the article adsorbing mechanism 1031. The Z-direction slider 1032b2 is linearly reciprocated along the Z-direction on the Z-direction guide rail 1032b1 by, for example, a ball screw mechanism (not shown) extending along the Z-direction. In addition, the Z-direction slider 1032b2 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
The position of the product P in the attaching conveyance mechanism 103 is checked by the first image pickup unit 201 (see fig. 17) for the product P sucked and held by the attaching conveyance mechanism 103. The first image pickup unit 201 is an image pickup camera for picking up images of the product P sucked and held by the product suction mechanism 1031 of the attaching conveying mechanism 103 from below, and picks up images of the lower surface (marking surface) of the product P. The first imaging unit 201 is provided so as to be movable in the front-rear direction (Y direction). This allows the positions of the products P held by the two attaching conveyance mechanisms 103 to be checked.
Further, as shown in fig. 17, a second image pickup unit 202 is provided in each attaching conveyance mechanism 103, and the second image pickup unit 202 confirms the position of the attaching member 101 to which the product P is attached. The second imaging unit 202 is an imaging camera that images the upper surface (the adhesion surface 101X) of the adhesion member 101 from above, which is located on the mounting table 102 at the adhesion position X4. The attachment member 101 is aligned with the product P based on the image data obtained by the first image pickup unit 201 and the image data obtained by the second image pickup unit 202, and the attachment conveyance mechanism 103 attaches the product P to the adhesion surface 101x of the attachment member 101. The product P can be aligned by the suction moving mechanism 1032 of the attaching conveying mechanism 103, a rotating mechanism (not shown) provided in the attaching conveying mechanism 103, a moving mechanism (not shown) of the mounting table 102, or a rotating mechanism (not shown) provided in the mounting table 102.
As shown in fig. 21, the cutting device 100 according to the present embodiment includes: an attaching member housing portion 106 for housing the attaching member 101; and an attaching member conveying mechanism 107 that conveys the attaching member 101 between the mounting table 102 and the attaching member housing portion 106.
The attaching member housing portion 106 houses the empty attaching member 101 to which the product P is not attached, and houses the attached attaching member 101 to which the product P is attached. The attaching member housing portions 106 are arranged in a row along the X direction with the mounting table 102 at the attaching member conveying position X3 (see fig. 17).
As shown in fig. 17 and 21, a pair of guide rails 108 for taking out and putting in the attaching member 101 with respect to the attaching member housing portion 106 are provided in the opening portion of the attaching member housing portion 106. The pair of guide rails 108 are provided in front of the opening of the attaching member housing 106 along the X direction, on which the attaching member 101 is mounted.
The attaching member conveying mechanism 107 conveys the attaching member 101 between the mounting table 102 located at the attaching member conveying position X3 and the attaching member housing portion 106. Specifically, as shown in fig. 21, the attaching member conveying mechanism 107 includes: a third holding mechanism 1071 that adsorbs and holds the frame-like member 101a of the attaching member 101; and a moving mechanism 1072 for moving the third holding mechanism 1071 at least in the X direction and the Z direction.
The third holding mechanism 1071 includes: the suction head 1071A is provided with a plurality of suction parts 1071A for sucking and holding the attaching member 101; and a vacuum pump or vacuum ejector (not shown) connected to the suction part 1071A of the suction head 1071A. The moving mechanism 1072 is configured by using the main moving mechanism 72 of the conveying moving mechanism 7, and the third holding mechanism 1071 moves along the common transmission shaft 71. The moving mechanism 1072 further includes a lifting and moving mechanism 1072a similar to the lifting and moving mechanism 73 of the conveying moving mechanism 7. The moving mechanism 1072 may have a Y-direction moving mechanism that moves the third holding mechanism 1071 in the Y-direction.
< example of the operation of the cutting device 100 >
Next, an example of the operation of the cutting device 100 according to the second embodiment will be described with reference to fig. 9, 17 to 19, and 21. In the present embodiment, all operations and controls of the cutting device 100, such as the conveyance of the sealed substrate W, the cutting of the sealed substrate W, the inspection of the product P, the cleaning of the product P, and the serial storage of the product P, are performed by the control section CTL (see fig. 17).
In the operation of the cutting apparatus 100 of the present embodiment, the operations of the conveyance of the sealed substrate W, the cutting of the sealed substrate W, the cleaning of the product P, and the inspection of the product P are the same as those of the first embodiment (see fig. 9).
After the double-sided inspection, the product P is transferred from the reversing mechanism 14 to the transfer table 5. The transfer stage 5 on which the plurality of products P are placed moves to the take-out position X2 (see fig. 17, 18, and 19).
On the other hand, at the mounting table 102 located at the attaching member conveying position X3, the empty attaching member 101 is conveyed from the attaching member housing portion 106 by the attaching member conveying mechanism 107. Then, the mounting table 102 on which the empty attaching member 101 is conveyed is moved to the attaching position X4 (see fig. 18 and 19).
In this state, as shown in fig. 19, the attaching conveyance mechanism 103 suctions and holds the product P from the transfer stage 5 located at the take-out position X2. Then, the image sensor moves to above the first image pickup unit 201. Thereby, the first image pickup unit 201 confirms the position of the product P in the attaching conveyance mechanism 103. The attachment conveyance mechanism 103 is moved, and the second imaging unit 202 confirms the position of the attachment member 101 on the mounting table 102 at the attachment position X4, at which the product P is attached. Then, the attaching conveyance mechanism 103 attaches the held product P to the attaching member 101. This operation is repeated a plurality of times until the allowable number of products P that can be attached to the attaching member 101 are attached, or until all of the plurality of products P located on the transfer table 5 are attached.
Then, as shown in fig. 18 and 21, the mounting table 102 is moved to the attachment member conveying position X3. Then, the attaching member conveying mechanism 107 conveys the attached attaching member 101 placed on the placement table 102 to the attaching member accommodating portion 106. Specifically, the attaching member conveying mechanism 107 places the attached attaching member 101 on the pair of guide rails 108 provided in the attaching member accommodating portion 106, and pushes the attached attaching member 101 placed on the pair of guide rails 108, thereby accommodating the attached attaching member 101 in the attaching member accommodating portion 106.
Then, when the empty attaching member 101 is taken out from the attaching member housing portion 106, the attaching member conveying mechanism 107 extracts the attaching member 101 in the attaching member housing portion 106, places the attaching member 101 on the pair of guide rails 108, suctions and holds the empty attaching member 101 placed on the pair of guide rails 108, and conveys the attaching member to the placing table 102 located at the attaching member conveying position X3.
< automatic exchange function of retaining plate M1 >)
Further, the cutting device 100 of the second embodiment has a function of automatically replacing the holding plate M1 for holding the sealed substrate W or the product P, as in the first embodiment. In the present embodiment, the cutting stage 2A, the cutting stage 2B, the holding stage 141, the transfer stage 5, and the second holding mechanism 6 have the holding plate M1 and the holding base M2, as in the first embodiment. The specific configuration of the holding plate M1 and the holding base M2 is the same as that of the first embodiment.
Specifically, as shown in fig. 17 and 22, the cutting device 100 includes: a board housing portion 24 for housing the holding board M1; and a board conveyance mechanism 25 for conveying the holding board M1 between the board housing portion 24 and the holding base M2. The cutting device 100 of the second embodiment is provided with the fixing mechanism 26 and the inspection mechanism 29 in the same manner as in the first embodiment.
The board housing portion 24 of the present embodiment has the same structure as the first embodiment, but as shown in fig. 23, the board housing portion 24 and the attaching member housing portion 106 are disposed vertically above each other. The board housing portion 24 of the present embodiment is provided above the attaching member housing portion 106. The board housing portion 24 and the attaching member housing portion 106 are configured to be vertically movable (in the Z direction). Here, a lifting/lowering movement portion 109 for lifting/lowering the board housing portion 24 and a lifting/lowering movement portion 110 for lifting/lowering the attaching member housing portion 106 are provided, and the board housing portion 24 and the attaching member housing portion 106 are configured to be capable of lifting/lowering independently of each other. The lifting and lowering movement units 109 and 110 may be, for example, ball screw mechanisms, air cylinders, or linear motors. The board housing portion 24 and the attaching member housing portion 106 may be configured to be integrally movable up and down by a common lifting and moving mechanism.
When the attaching member 101 is to be taken out or put in with respect to the attaching member housing portion 106, as shown in fig. 23 (a), the board housing portion 24 is retracted upward by the elevating and moving portion 109, the attaching member housing portion 106 is disposed at a desired height position H1 by the elevating and moving portion 110, and the attaching member 101 is taken out or put in with respect to the attaching member housing portion 106 by the attaching member conveying mechanism 107.
On the other hand, when the holding board M1 is to be taken out of or put into the board storage section 24, as shown in fig. 23 (b), the attaching member storage section 106 is retracted downward by the elevating and moving section 110, the board storage section 24 is disposed at a desired height position H2 by the elevating and moving section 109, and the holding board M1 is to be taken out of or put into the board storage section 24 by the board conveying mechanism 25. Here, the height position H2 of the board housing portion 24 is set to a position higher than the height position H1 of the attaching member housing portion 106 so that the attaching member conveying mechanism 107 does not interfere with the guide rail 108.
As shown in fig. 17, the board conveying mechanism 25 of the present embodiment includes: a first conveying mechanism 25a for conveying the holding board M1 between the board housing portion 24 and the temporary placement portion 27; and a second conveying mechanism 25b for conveying the holding plate M1 between the temporary placement section 27 and the holding base M2. The temporary placement section 27 of the present embodiment is a holding table 141 of the reversing mechanism 14. The transfer stage 5 may be a temporary placement unit 27, and the temporary placement unit 27 may be provided independently of the holding stage 141 and the transfer stage 5.
Unlike the first embodiment, the first conveying mechanism 25a of the second embodiment is configured using the attaching member conveying mechanism 107 (the third holding mechanism 1071 and the moving mechanism 1072). That is, the first conveying mechanism 25a of the second embodiment can convey the attaching member 101 to which the processed object W (product P) is attached. The second conveying mechanism 25b is configured using the second holding mechanism 6 and the conveying moving mechanism 7, as in the first embodiment, and can convey the object W. That is, the board conveyance mechanism 25 (the first conveyance mechanism 25a and the second conveyance mechanism 25 b) is configured to move in the X direction via the common transmission shaft 71. The board conveyance mechanism 25 is provided on the same side (near front side) as the transmission shaft 71 in a plan view.
Here, the attaching member conveying mechanism 107 serving as the first conveying mechanism 25a includes, as shown in fig. 21, a plurality of adsorbing portions 1071a for adsorbing and holding the attaching member 101, and a conveying cylindrical portion 1071b using the above-described clip cylinder. The attachment member conveying mechanism 107 is configured to be capable of lifting and lowering the portion where the holding plate M1 is held, and is configured to convey the holding plate M1 in a state where the portion where the holding plate M1 is held is lifted and set to the lifted position.
< replacement action of retaining plate M1 >)
Next, the operation of replacing the holding plate M1 by the plate conveying mechanism 25 according to the present embodiment will be described with reference to fig. 24 and 25.
In the following replacement operation, the holding plate M1 is discriminated when the holding plate M1 is taken out from the plate accommodating portion 24 by: the identifier such as an RFID provided on the holding board M1 is read by an identifier reader (not shown) provided on the first conveying mechanism 25a (board conveying mechanism 25). In the replacement operation, as shown in fig. 23 (b), the attaching member housing portion 106 is retracted downward by the elevating and moving portion 110, the board housing portion 24 is disposed at a desired height position H2 by the elevating and moving portion 109, and the board for holding M1 is taken out of or put into the board housing portion 24 by the board conveying mechanism 25.
(1) Transfer table 5 and replacement operation of holding plate M1 of holding table 141 (see fig. 24)
The holding plate M1 of the holding table 141 is removed, and the holding plate M1 is lifted by the first conveying mechanism 25a (the attaching member conveying mechanism 107) and conveyed to the plate accommodating portion 24 while being set to the lifted position. When the holding plate M1 of the holding table 141 is removed, compressed air is supplied to the fixing cylindrical portion 262 to set the movable element 262b to the retracted position, and the fixing of the fixing mechanism 26 is released.
Then, the first conveying mechanism 25a (the attaching member conveying mechanism 107) takes out the new holding plate M1 of the holding table 141 from the plate housing portion 24, conveys the new holding plate M1 to the holding base M2 of the holding table 141 in a state of being set to the raised position, and lowers and places the holding plate M1. In this state, when compressed air is supplied to the fixing cylindrical portion 262 to set the movable element 262b to the retracted position, the holding plate M1 is lowered, the fixing cylindrical portion 262 enters the fixing insertion hole 261 of the holding plate M1, and when the supply of compressed air is stopped, the movable element 262b is set to the protruding position, and the holding plate M1 is fixed to the holding base M2 of the holding table 141.
The holding plate M1 of the transfer stage 5 is removed, and the holding plate M1 is lifted by the first conveying mechanism 25a (the attaching member conveying mechanism 107) and conveyed to the plate accommodating portion 24 in a state where the lifting position is set. When the holding plate M1 of the transfer table 5 is removed, compressed air is supplied to the fixing cylinder 262 to set the movable element 262b to the retracted position, and the fixing of the fixing mechanism 26 is released.
Then, the first conveying mechanism 25a (the attaching member conveying mechanism 107) takes out the new holding plate M1 of the transfer table 5 from the plate housing portion 24, conveys the new holding plate M1 to the holding base M2 of the transfer table 5 in a state of being set to the raised position, and lowers and places the holding plate M1. In this state, when compressed air is supplied to the fixing cylindrical portion 262 and the movable element 262b is set to the retracted position, the holding plate M1 is lowered, the fixing cylindrical portion 262 enters the fixing insertion hole 261 of the holding plate M1, and when the supply of compressed air is stopped, the movable element 262b is set to the protruding position, and the holding plate M1 is fixed to the holding base M2 of the transfer table 5.
The order of replacement of the holding plate M1 of the holding table 141 and the replacement of the holding plate M1 of the transfer table 5 is not limited to the above, but may be reversed, and after the holding plates M1 of the holding table 141 and the transfer table 5 are removed, new holding plates M1 may be attached to the holding table 141 and the transfer table 5, respectively.
(2) Replacement operation of the holding plate M1 of the cutting table 2A, the cutting table 2B, and the second holding mechanism 6 (see fig. 25)
The holding plates M1 of the cutting tables 2A and 2B are removed, the holding plates M1 are lifted by the second conveying mechanism 25B (the conveying moving mechanism 7 and the second holding mechanism 6), and conveyed to the holding table 141 as the temporary placement section 27 in a state where the lifting position is set, and the holding plates M1 are lowered and placed. When the holding plates M1 of the cutting tables 2A and 2B are removed, compressed air is supplied to the fixing cylinder portion 262 to set the movable element 262B to the retracted position, and the fixing of the fixing mechanism 26 is released. Here, when the holding table 141 is the temporary placement section 27, it is preferable to remove the holding plate M1 of the holding table 141 in advance.
The first conveying mechanism 25a (the adhering member conveying mechanism 107) lifts the holding boards M1 placed on the cutting tables 2A and 2B of the holding table 141, conveys the boards to the board storage section 24 in a state of being set at the lifted position, and lowers and stores the holding boards M1.
Then, the first conveying mechanism 25a (adhering member conveying mechanism 107) takes out the new holding boards M1 of the cutting tables 2A and 2B from the board housing section 24, conveys them to the holding table 141 as the temporary placement section 27 in a state of being set to the raised position, and lowers and places the holding boards M1.
Then, the second conveying mechanism 25B (the conveying moving mechanism 7 and the second holding mechanism 6) conveys the new holding plate M1 placed on the holding table 141 to the cutting table 2A and the holding base M2 of the cutting table 2B in a state where the holding plate M1 is set to the raised position, and lowers and places the holding plate M1. In this state, when compressed air is supplied to the fixing cylindrical portion 262 and the movable member 262B is set to the retracted position, the fixing cylindrical portion 262 enters the fixing insertion hole 261 of the holding plate M1, and when the supply of compressed air is stopped, the movable member 262B is set to the protruding position, and the holding base M2 of the cutting table 2A and the cutting table 2B fixes the holding plate M1.
When the holding plate M1 of the second holding mechanism 6 is replaced, the second holding mechanism 6 is moved to the holding table 141 as the temporary placement section 27 by the conveyance moving mechanism 7, and the holding plate M1 is lowered and removed, and the holding plate M1 is placed on the holding table 141 as the temporary placement section 27. When the holding plate M1 of the second holding mechanism 6 is removed, compressed air is supplied to the fixing cylinder portion 262 to set the movable element 262b to the retracted position, and the fixing of the fixing mechanism 26 is released.
Then, the first conveying mechanism 25a (the attaching member conveying mechanism 107) lifts the holding plate M1 of the second holding mechanism 6 placed on the holding table 141, conveys the holding plate M1 to the plate accommodating portion 24 in a state where the lifting position is set, and lowers and accommodates the holding plate M1.
Then, the first conveying mechanism 25a (the attaching member conveying mechanism 107) takes out the new holding plate M1 of the second holding mechanism 6 from the plate housing portion 24, conveys the new holding plate M1 to the holding table 141 as the temporary placement portion 27 in a state of being set to the raised position, and lowers and places the holding plate M1.
Then, the second holding mechanism 6 is moved to the holding table 141 by the conveying moving mechanism 7, the holding base M2 is lowered, and a new holding plate M1 placed on the holding table 141 is attached. Here, the fixing cylindrical portion 262 provided at the holding base M2 of the second holding mechanism 6 is inserted into the fixing insertion hole 261 formed in the holding plate M1 by the conveying moving mechanism 7. In this state, when compressed air is supplied to the fixing cylindrical portion 262 and the movable member 262b is set to the retracted position, the fixing cylindrical portion 262 enters the fixing insertion hole 261 of the holding plate M1, and when the supply of compressed air is stopped, the movable member 262b is set to the protruding position and the holding plate M1 is fixed to the holding base M2 of the second holding mechanism 6.
When the holding plates M1 of the cutting tables 2A and 2B are replaced, the holding plates M1 of the second holding mechanism 6 serving as the second conveying mechanism 25B and the holding plates M1 of the holding tables 141 are removed in advance. In addition, when the holding plate M1 of the second holding mechanism 6 is replaced, the holding plate M1 of the holding table 141 is removed in advance.
The transfer stage 5, the holding stage 141, the cutting stage 2A, the cutting stage 2B, and the holding plate M1 of the second holding mechanism 6 may be replaced by a series of operations. For example, it is conceivable to remove the transfer stage 5, the holding stage 141, the second holding mechanism 6, the cutting stage 2A, and the holding plate M1 of the cutting stage 2B in order, and then mount the cutting stage 2A, the cutting stage 2B, the second holding mechanism 6, the holding stage 141, and the holding plate M1 of the transfer stage 5 in order.
Effect of the second embodiment >
According to the cutting device 100 of the second embodiment, as in the first embodiment, the holding plate M1 removed from the holding base M2 is conveyed to the plate accommodating portion 24, and the holding plate M1 positioned in the plate accommodating portion 24 is conveyed to the plate conveying mechanism 25 of the holding base M2, so that the holding plate M1 can be automatically replaced with the holding base M2. As a result, the labor cost for replacing the holding plate M1 can be reduced. Further, since the holding plate M1 is automatically replaced, the replacement time of the holding plate M1 can be shortened, and the productivity of the cutting device 100 can be improved. Further, the non-uniformity of the mounting state of the holding plate M1 to the holding base M2 can be reduced. In addition, the second embodiment has the same effects as those of the first embodiment.
In particular, in the second embodiment, since the board conveyance mechanism 25 conveys the attaching member 101 to the mounting table 102, it is not necessary to provide a separate conveying mechanism for the attaching member independently of the board conveyance mechanism 25, and the apparatus structure of the cutting apparatus 100 for performing the serial storage can be simplified. Furthermore, the device cost can be reduced. In addition, in the case of performing the subsequent steps such as the sputtering step and the packaging step on the plurality of products P, the attaching member 101 to which the plurality of products P are attached is moved, and the handling thereof can be facilitated.
Further, the board conveyance mechanism 25 includes: a first conveying mechanism 25a for conveying the holding board M1 between the board housing portion 24 and the temporary placement portion 27; and a second conveying mechanism 25b for conveying the holding plate M1 between the temporary placement section 27 and the holding base M2, so that the degree of freedom of the conveying destination of the holding plate M1 can be increased as compared with the case where the plate conveying mechanism 25 is constituted by one conveying mechanism. Here, the first conveying mechanism 25a is configured by using the attaching member conveying mechanism 107 (the third holding mechanism 1071 and the moving mechanism 1072), so that the device structure can be simplified and the device cost can be reduced. Further, the second conveying mechanism 25b is configured by using the second holding mechanism 6 and the conveying moving mechanism 7, so that the device structure can be simplified and the device cost can be reduced.
< modification of the second embodiment >
For example, in the second embodiment, the holding plate M1 of each of the cutting table 2A, the cutting table 2B, the inspection table (holding table 141), the transfer table 5, and the conveyance holding mechanism (second holding mechanism 6) is automatically replaced, but at least one of the cutting table 2A, the cutting table 2B, the inspection table (holding table 141), the transfer table 5, and the conveyance holding mechanism (second holding mechanism 6) may be automatically replaced.
The board conveyance mechanism 25 of the second embodiment has the first conveyance mechanism 25a and the second conveyance mechanism 25b, but may have a single conveyance mechanism. The board conveyance mechanism 25 may be configured not to use the attaching member conveyance mechanism 107, or may be configured not to use the second holding mechanism 6 and the conveyance moving mechanism 7 (object conveyance mechanism).
When the board conveyance mechanism 25 is configured such that the attaching member conveyance mechanism 107 is not used, the board storage unit 24 is disposed at a position accessible by the second holding mechanism 6 (for example, between the transfer table 5 (index table) and the placement table 102 of the attaching member 101), so that the board conveyance mechanism 25 can be configured by the second holding mechanism 6 and the conveyance moving mechanism 7 without using the attaching member conveyance mechanism 107.
The board housing portion 24 of the second embodiment houses the holding boards M1 of the cutting stage 2A, the cutting stage 2B, the inspection stage (holding stage 141), the transfer stage 5, and the second holding mechanism 6, but a plurality of dedicated board housing portions 24 may be provided according to the type of the holding boards M1.
For example, in the second embodiment, the configuration in which a plurality of (specifically, two) tables 102 are provided has been described, but as shown in fig. 26 (a), one table 102 may be provided. In this case, two guide rails 108A and 108B may be provided in the upper and lower sides of the opening of the attaching member housing 106. In this configuration, the upper rail 108A is configured to be expandable and contractible at a distance from each other by an expansion and contraction mechanism, not shown.
The guide rail 108A and the guide rail 108B having the above-described two-stage structure operate as follows.
First, the interval between the upper guide rails 108A is widened by the expanding and contracting mechanism (see fig. 26 b). Then, the attaching member conveying mechanism 107 descends between the upper guide rails 108A, and the empty attaching member 101 is pulled out from the attaching member housing portion 106 and temporarily placed on the lower guide rails 108B. Then, the attaching member conveying mechanism 107 moves to the mounting table 102 located at the attaching member conveying position X3, and receives the attached attaching member 101.
Then, the interval between the upper guide rails 108A is narrowed by the expanding and contracting mechanism (see fig. 26 c). Then, the attaching member conveying mechanism 107 places the attached attaching member 101 on the upper guide rail 108A, and pushes the attaching member 101 into the attaching member housing portion 106.
Then, the interval of the upper rail 108A is widened by the expanding and contracting mechanism. Then, the attaching member conveying mechanism 107 descends between the upper rails 108A, receives the empty attaching member 101 placed on the lower rail 108B, and conveys the same to the placing table 102.
In the second embodiment, the two attaching conveyance mechanisms 103 are provided, but the second embodiment may be provided with one attaching conveyance mechanism 103.
Further, the first imaging unit 201 is shared by the two attaching conveyance mechanisms 103, but the first imaging unit 201 may be provided corresponding to each of the two attaching conveyance mechanisms 103.
The transfer table 5 according to the second embodiment is an index table temporarily placed before the transfer table 5 is attached to the attaching member 101, and the transfer table 5 may be a holding table 141 of the reversing mechanism 14.
Third embodiment of the invention
Next, a third embodiment of the present invention will be described.
Unlike the tray housing of the first embodiment and the interlinked housing of the second embodiment, the cutting device 100 of the third embodiment is configured to be capable of housing a plurality of products P in a scattered state (also referred to as "block housing").
Specifically, as shown in fig. 27, the cutting device 100 includes: two cutting stages (processing stages) 2A and 2B for holding the sealed substrate W; a first holding mechanism 3 for holding the sealed substrate W so as to convey the sealed substrate W to the cutting stages 2A and 2B; a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting stages 2A and 2B; a second holding mechanism 6 for holding the plurality of products P so as to convey the plurality of products P from the cutting tables 2A and 2B to the storage box 111; and a conveying movement mechanism 7 having a common transmission shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6; and a cutting movement mechanism (processing movement mechanism) 8 for moving the cutting mechanism 4 relative to the sealed substrate W held on the cutting stages 2A and 2B.
The following description mainly describes the structure different from the first and second embodiments.
As shown in fig. 27, the second holding mechanism 6 of the third embodiment holds the plurality of products P in order to convey the plurality of products P from the cutting tables 2A and 2B to the drying table 112 or the storage box 111. As shown in fig. 8, the second holding mechanism 6 has the same structure as the first and second embodiments. Then, the suction head 61 is moved to a desired position by a conveyance moving mechanism 7 or the like described later, so that the plurality of products P are conveyed from the cutting tables 2A and 2B to the drying table 112, and are conveyed from the drying table 112 to the storage box 111.
As shown in fig. 27, the transfer moving mechanism 7 according to the third embodiment moves the first holding mechanism 3 at least between the substrate supply mechanism 11 and the cutting tables 2A and 2B, and moves the second holding mechanism 6 at least between the cutting tables 2A and 2B and the storage box 111.
The transmission shaft 71 is provided in the following range: the first holding mechanism 3 is movable to above the substrate supply portion 11b of the substrate supply mechanism 11, and the second holding mechanism 6 is movable to above the housing box 111 (see fig. 27). The storage box 111 and the drying table 112, which will be described later, are also provided on the same side (near front side) in plan view with respect to the transfer shaft 71.
Further, the guide rail 721 of the main moving mechanism 72 extends linearly in the X direction along the transmission shaft 71, and is provided in the following range, that is, in the same manner as the transmission shaft 71: the first holding mechanism 3 is movable to above the substrate supply portion 11b of the substrate supply mechanism 11, and the second holding mechanism 6 is movable to above the housing box 111.
< drying function of cutting device 100 >)
The cutting device 100 of the third embodiment has a function of further drying the plurality of products P cleaned by the second cleaning mechanism 19. Specifically, as shown in fig. 27 to 29, the cutting device 100 includes: a drying stage 112 for drying the plurality of products P; a drying mechanism 113 that dries the plurality of products P placed on the drying table 112; and a drying moving mechanism 114 for moving the drying mechanism 113 along the drying table 112.
The drying table 112 carries and places a plurality of products P by the second holding mechanism 6 and the carrying moving mechanism 7. The drying stage 112 adsorbs and holds a plurality of products P. The drying stage 112 is arranged in a row along the X direction with the two cutting stages 2A and 2B on the horizontal plane. The drying stage 112 of the present embodiment is rectangular in plan view, but may be other shapes.
The drying means 113 sprays compressed air as a gas from above the drying table 112, and dries the plurality of products P adsorbed and held on the drying table 112. The drying mechanism 113 has an injection nozzle 113a for injecting compressed air into the plurality of products P held on the drying table 112. The spray nozzle 113a of the present embodiment has a slit-shaped opening (see fig. 28) extending linearly and provided toward the drying stage 112, but may have a plurality of openings intermittently provided along the X direction.
The drying mechanism 113 of the present embodiment is configured to eject compressed air in the moving direction of the drying moving mechanism 114 (see fig. 28). That is, the direction in which the compressed air is injected from the injection nozzle 113a is directed in the movement direction (here, from the front side to the inner side in the Y direction) of the drying movement mechanism 114.
As shown in fig. 28, the spray nozzles 113a of the drying mechanism 113 are disposed obliquely, for example, at an angle of less than 30 degrees, in the direction along the X-direction with respect to the plurality of products P held on the drying stage 112. Here, in the drying stage 112, the plurality of products P are arranged in a matrix in the X direction and the Y direction, and the injection nozzles 113a of the drying mechanism 113 inject the compressed air obliquely to one side of each product P along the X direction. This facilitates the blowing of moisture accumulated between adjacent products P from the products P. Thereby, drying of the plurality of products P is promoted. Further, a slit-shaped opening of the spray nozzle 113a of the drying mechanism 113 may be provided so as to be slightly inclined toward the drying table 112, and the compressed air may be blown off in the moving direction of the drying mechanism 113.
The drying movement mechanism 114 moves the drying mechanism 113 in the Y direction above the drying table 112. The drying movement mechanism 114 of the present embodiment moves the drying mechanism 113 back and forth in the Y direction with respect to the drying stage 112. Specifically, as shown in fig. 28 and 29, the drying moving mechanism 114 includes: a Y-direction guide 1141 extending in the Y-direction; a slide member 1142 that moves along the Y-direction guide rail 1141 and holds the drying mechanism 113; and a driving unit (not shown) for moving the slide member 1142 along the Y-direction rail 1141. Further, as the driving portion, for example, a ball screw mechanism, a cylinder, or a linear motor may be used.
< one example of drying action >
Next, a drying operation by the drying mechanism 113 and the drying moving mechanism 114 will be described.
Before the drying stage 112 mounts the plurality of products P, the drying moving mechanism 114 retracts the drying mechanism 113 to one side (for example, the near front side) of the drying stage 112 in the Y direction so as not to interfere with the mounting of the plurality of products P. When a plurality of products P are placed and held on the drying table 112, the drying mechanism 113 starts to inject compressed air, and the drying moving mechanism 114 moves the drying mechanism 113 to the other side (for example, the inner side) in the Y direction. Thereby, the plurality of products P held on the drying table 112 are dried. When the drying moving mechanism 114 moves the drying mechanism 113 from the other side (inner side) in the Y direction to one side (near front side) in the Y direction, the drying mechanism 113 stops the gas injection. The drying mechanism 113 may be configured to inject compressed air not only in the forward path but also in the backward path.
Specific structure of block accommodation (accommodation box 111 and duster 115)
As shown in fig. 27 to 29, the storage box 111 stores a plurality of products P in a scattered state (so-called block storage). The storage box 111 is arranged in a row along the X direction with the two cutting tables 2A and 2B on the horizontal plane. The housing box 111 further includes: the duster member 115 duster a plurality of articles P from the second holding mechanism 6.
The storage case 111 has a rectangular upper opening 111X (see fig. 28) in plan view. The duster 115 is fixed to one side of the upper opening 111X of the storage box 111. The second holding mechanism 6 is moved in the X direction with respect to the duster member 115, whereby the product P is dusted and dropped and stored in the storage box 111.
The storage box 111 of the present embodiment is provided between the drying table 112 and a board storage portion 24 of a storage and holding board M1 described later in the X direction, and the duster member 115 is provided on one side of the drying table 112 side in an upper opening 111X of the storage box 111. Thus, the second holding mechanism 6 is configured not to interfere with the board housing portion 24 when the product P is dusted.
The duster 115 extends upward from one side of the upper opening 111X on the drying table 112 side (see fig. 29). The duster 115 may be a brush or a plate, for example, made of a resin such as a polyetheretherketone (PolyetheretherKetone, PEEK) material, as long as the product P that is not separated from the second holding mechanism 6 after the suction is released can be duster.
In the present embodiment, the housing case 111 is disposed on the front side of the transmission shaft 71, and a handle 1111 (see fig. 28) is provided on the outer surface of the front side of the housing case 111 so as to be detachable from the front side of the cutting device 100. With this structure, maintainability of the product P such as removal and recovery can be improved. The direction of taking out the storage box 111 is not limited to the near side, and may be, for example, a structure taking out from the lateral side of the cutting device 100 or a structure taking out from the inner side.
< example of the operation of the cutting device 100 >
Next, an example of the operation of the cutting device 100 according to the third embodiment will be described with reference to fig. 30. Fig. 30 shows a movement path of the first holding mechanism 3 and a movement path of the second holding mechanism 6 during the operation of the cutting device 100. In the present embodiment, all operations or controls of the cutting device 100, such as the conveyance of the sealed substrate W, the cutting of the sealed substrate W, the cleaning of the product P, the drying of the product P, and the dusting operation of the product P, are performed by the control section CTL (see fig. 27).
In the operation of the cutting apparatus 100 of the present embodiment, the operations of the conveyance of the sealed substrate W, the cutting of the sealed substrate W, and the cleaning of the product P are the same as those of the first embodiment.
Then, after cleaning the products P, the conveying moving mechanism 7 moves the second holding mechanism 6 to the drying stage 112, and the second holding mechanism 6 releases the suction holding, so that the plurality of products P are placed on the drying stage 112. Then, the drying stage 112 suctions and holds the sealed substrate W. At this time, the conveyance moving mechanism 7 withdraws the second holding mechanism 6 to a position where the movement of the drying mechanism 113 is not hindered.
In this state, the drying moving mechanism 114 moves the drying mechanism 113 back and forth in the Y direction, and the drying mechanism 113 ejects compressed air, thereby drying the plurality of products P. The number of times the drying moving mechanism 114 reciprocates the drying mechanism 113 may be set as appropriate, and may be one time or a plurality of times.
After drying, the conveying moving mechanism 7 moves the second holding mechanism 6 to the drying stage 112, and the second holding mechanism 6 suctions and holds the plurality of products P from the drying stage 112. Then, the conveying moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the storage box 111.
Then, the second holding mechanism 6 releases the suction holding of the plurality of products P above the upper opening 111X of the housing box 111. Then, the conveying moving mechanism 7 moves the second holding mechanism 6 toward the drying table 112 with respect to the duster member 115 so that the duster member 115 touches the product P remaining on the second holding mechanism 6 without falling off from the second holding mechanism 6. In the present embodiment, in order to reliably brush the product P, the second holding mechanism 6 is moved relative to the brush member 115 so that the brush member 115 contacts the lower surface of the second holding mechanism 6 as the suction surface. Thereby, the plurality of products P are dropped and stored in the storage box 111.
< automatic exchange function of retaining plate M1 >)
Further, the cutting device 100 of the third embodiment has a function of automatically replacing the holding plate M1 for holding the sealed substrate W or the product P, as in the first and second embodiments. In the present embodiment, the cutting stage 2A, the cutting stage 2B, the drying stage 112, and the second holding mechanism 6 include the holding plate M1 and the holding base M2. The specific configuration of the holding plate M1 and the holding base M2 is the same as that of the first embodiment.
Specifically, as shown in fig. 27 and 31, the cutting device 100 includes: a board housing portion 24 for housing the holding board M1; and a board conveyance mechanism 25 for conveying the holding board M1 between the board housing portion 24 and the holding base M2. The cutting device 100 of the second embodiment is provided with the fixing mechanism 26 and the inspection mechanism 29 in the same manner as in the first embodiment.
The plate conveying mechanism 25 of the third embodiment is configured using the second holding mechanism 6 and the conveying moving mechanism 7, and can convey a plurality of products P. In other words, the second holding mechanism 6 and the transfer movement mechanism 7 have the function of transferring the holding plate M1. The board conveyance mechanism 25 is configured to move in the X direction by the common transmission shaft 71. The board conveyance mechanism 25 is provided on the same side (near front side) as the transmission shaft 71 in a plan view. Here, the second holding mechanism 6 constituting the board conveyance mechanism 25 has a conveyance cylindrical portion 282 (see fig. 13) as in the first embodiment, and the conveyance cylindrical portion 282 is inserted into a conveyance holding hole 281 (see fig. 10) formed in the holding board M1.
< replacement action of retaining plate M1 >)
Next, the operation of replacing the holding plate M1 by the plate conveying mechanism 25 according to the present embodiment will be described with reference to fig. 32.
In the following replacement operation, the holding plate M1 is discriminated when the holding plate M1 is taken out from the plate accommodating portion 24 by: the identifier such as an RFID provided on the holding board M1 is read by an identifier reader (not shown) provided on the board conveyance mechanism 25 (second holding mechanism 6).
(1) Removal operation of the holding plate M1 of the second holding mechanism 6 (see FIG. 32 (a))
First, the holding plate M1 of the second holding mechanism 6 is removed. Specifically, the second holding mechanism 6 is moved to the board storage section 24 by the conveying movement mechanism 7, and the second holding mechanism 6 is lowered to remove the holding board M1, and the holding board M1 is placed on the carriage section 241. When the holding plate M1 of the second holding mechanism 6 is removed, compressed air is supplied to the fixing cylinder portion 262 to set the movable element 262b to the retracted position, and the fixing of the fixing mechanism 26 is released.
The second holding mechanism 6 from which the holding plate M1 is removed is used to perform the operation of replacing the holding plate of the cutting table 2A, the cutting table 2B, or the drying table 112.
(2) Replacement operation of the holding plate M1 of the cutting table 2A and the cutting table 2B (see fig. 32B)
The holding plates M1 of the cutting tables 2A and 2B are removed, and the holding plates M1 are lifted by the plate conveying mechanism 25 (the conveying moving mechanism 7 and the second holding mechanism 6), conveyed to the plate accommodating portion 24 in a state where the lifting position is set, and the holding plates M1 are lowered and placed on the carriage portion 241. When the holding plates M1 of the cutting tables 2A and 2B are removed, compressed air is supplied to the fixing cylinder portion 262 to set the movable element 262B to the retracted position, and the fixing of the fixing mechanism 26 is released.
Then, the board conveyance mechanism 25 (the conveyance movement mechanism 7 and the second holding mechanism 6) takes out the new holding boards M1 of the cutting tables 2A and 2B from the board housing portion 24, conveys them to the holding bases M2 of the cutting tables 2A and 2B in a state where the raising positions are set, and lowers and places the holding boards M1. In this state, when compressed air is supplied to the fixing cylindrical portion 262 and the movable member 262B is set to the retracted position, the fixing cylindrical portion 262 enters the fixing insertion hole 261 of the holding plate M1, and when the supply of compressed air is stopped, the movable member 262B is set to the protruding position, and the holding base M2 of the cutting table 2A and the cutting table 2B fixes the holding plate M1.
(3) Replacement operation of the holding plate M1 of the drying stage 112 (see FIG. 32 (b))
The holding plate M1 of the drying stage 112 is removed, and the holding plate M1 is lifted by the plate conveying mechanism 25 (the conveying moving mechanism 7 and the second holding mechanism 6), conveyed to the plate accommodating portion 24 in a state where the lifting position is set, and the holding plate M1 is lowered and placed and accommodated in the carriage portion 241 slid forward. When the holding plate M1 of the drying table 112 is removed, compressed air is supplied to the fixing cylinder 262 to set the movable element 262b to the retracted position, and the fixing of the fixing mechanism 26 is released.
Then, the board conveyance mechanism 25 (the conveyance movement mechanism 7 and the second holding mechanism 6) takes out the new holding board M1 of the drying stage 112 from the board housing section 24, conveys the new holding board M1 to the holding base M2 of the drying stage 112 in a state where the board is set to the raised position, and lowers and places the holding board M1. In this state, when compressed air is supplied to the fixing cylindrical portion 262 and the movable member 262b is set to the retracted position, the fixing cylindrical portion 262 enters the fixing insertion hole 261 of the holding plate M1, and when the supply of compressed air is stopped, the movable member 262b is set to the protruding position and the holding plate M1 is fixed to the holding base M2 of the drying table 112.
(4) Mounting operation of the holding plate M1 of the second holding mechanism 6 (see FIG. 32 (c))
As described above, after the replacement operation of the holding plates M1 of the cutting stage 2A, the cutting stage 2B, and the drying stage 112 is performed, the second holding mechanism 6 is moved to the plate accommodating portion 24 by the conveying moving mechanism 7, the second holding mechanism 6 is lowered, and a new holding plate M1 placed on the carriage portion 241 is mounted. Here, the fixing cylindrical portion 262 provided at the holding base M2 of the second holding mechanism 6 is inserted into the fixing insertion hole 261 formed in the holding plate M1 by the conveying moving mechanism 7. In this state, when compressed air is supplied to the fixing cylindrical portion 262 and the movable member 262b is set to the retracted position, the fixing cylindrical portion 262 enters the fixing insertion hole 261 of the holding plate M1, and when the supply of compressed air is stopped, the movable member 262b is set to the protruding position and the holding plate M1 is fixed to the holding base M2 of the second holding mechanism 6.
The replacement operation of the holding plates M1 of the cutting tables 2A and 2B and the replacement operation of the holding plates M1 of the drying table 112 may be performed first. The holding plate M1 may be removed from the holding bases M2 of the cutting tables 2A, 2B, and 112, and then a new holding plate M1 may be attached to the holding bases M2 of the cutting tables 2A, 2B, and 112.
In the above, the replacement of the holding plates M1 of the second holding mechanism 6, the cutting table 2A, the cutting table 2B, and the drying table 112 is performed in a series of operations, but the replacement of the holding plates M1 of at least one of the second holding mechanism 6, the cutting table 2A, the cutting table 2B, and the drying table 112 may be performed. At this time, when the holding plate M1 of the cutting table 2A, the cutting table 2B, or the drying table 112 is replaced, it is conceivable to remove the holding plate M1 of the second holding mechanism 6 constituting the plate conveying mechanism 25 in advance.
Effect of the third embodiment >
According to the cutting device 100 of the third embodiment, as in the first and second embodiments, the holding plate M1 removed from the holding base M2 is conveyed to the plate accommodating portion 24 and the holding plate M1 positioned in the plate accommodating portion 24 is conveyed to the plate conveying mechanism 25 of the holding base M2, so that the holding plate M1 can be automatically replaced with respect to the holding base M2. As a result, the labor cost for replacing the holding plate M1 can be reduced. Further, since the holding plate M1 is automatically replaced, the replacement time of the holding plate M1 can be shortened, and the productivity of the cutting device 100 can be improved. Further, the non-uniformity of the mounting state of the holding plate M1 to the holding base M2 can be reduced. In addition, the third embodiment has the same effects as those of the first and second embodiments.
In particular, in the third embodiment, since the board conveying mechanism 25 can convey a plurality of products P to the storage box 111, it is not necessary to provide a separate product conveying mechanism independently of the board conveying mechanism 25, and the apparatus configuration of the cutting apparatus 100 for storing blocks can be simplified. Furthermore, the device cost can be reduced. In addition, since the plurality of products P are dropped and stored in the storage box 111, the storage space can be made smaller than in the prior tray storage structure. The footprint of the cutting device 100 can also be reduced.
< modification of the third embodiment >
For example, in the third embodiment, the holding plate M1 of each of the cutting table 2A, the cutting table 2B, the drying table 112, and the holding mechanism (the second holding mechanism 6) is automatically replaced, but at least one of the cutting table 2A, the cutting table 2B, the drying table 112, and the holding mechanism (the second holding mechanism 6) may be automatically replaced.
The board conveyance mechanism 25 of the third embodiment may be configured so as not to use the second holding mechanism 6 and the conveyance moving mechanism 7.
The plate housing portion 24 of the third embodiment houses the holding plates M1 of the cutting stage 2A, the cutting stage 2B, the drying stage 112, and the holding mechanism (the second holding mechanism 6), but a plurality of dedicated plate housing portions 24 may be provided according to the type of the holding plates M1.
The following structure may be adopted, namely: without the duster 115, the second holding mechanism 6 releases the suction holding, and then the second holding mechanism 6 sprays gas to drop the plurality of products P.
Further, in addition to the structure for fixing the duster 115 to the storage box 111, the duster may be fixed to another member, or may be configured as follows: the dusting member 115 is movably constituted, and the plurality of products P are dusted by moving the dusting member 115 relative to the second holding mechanism 6.
< fourth embodiment of the invention >
Next, a fourth embodiment of the present invention will be described.
The cutting device 100 according to the fourth embodiment is configured to be able to house a plurality of products P in a tubular container 116 (also referred to as "tube housing") unlike the tray housing according to the first embodiment, the interlink housing according to the second embodiment, and the block housing according to the third embodiment. The cylindrical container 116 is also called a tube, a box rod, a rod box, a rod, or the like.
Specifically, as shown in fig. 33, the cutting device 100 includes: two cutting stages (processing stages) 2A and 2B for holding the sealed substrate W; a first holding mechanism 3 for holding the sealed substrate W so as to convey the sealed substrate W to the cutting stages 2A and 2B; a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting stages 2A and 2B; a transfer stage 5 for moving a plurality of products P; a second holding mechanism 6 for holding the plurality of products P so as to convey the plurality of products P from the cutting stations 2A and 2B to the transfer station 5; the conveying movement mechanism 7 has a common transmission shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6; and a cutting movement mechanism (processing movement mechanism) 8 for moving the cutting mechanism 4 relative to the sealed substrate W held on the cutting stages 2A and 2B.
The following description will mainly explain the structure different from the first to third embodiments.
The transfer stage 5 of the present embodiment temporarily places a plurality of products P before accommodating the plurality of products P in a cylindrical container 116 described later. As shown in fig. 33, the transfer stage 5 is provided so as to be movable in the Y direction, and moves between a transfer position X1 where the plurality of products P are placed by the second holding mechanism 6 and a take-out position X2 where the plurality of products P are conveyed by the conveyance housing mechanism 118. The transfer position X1 is set on the front side of the transfer shaft 71, and is a position aligned with the two cutting tables 2A and 2B in the X direction on the horizontal plane, and the take-out position X2 is set on the inner side of the transfer shaft 71.
Specific structure of tube housing
As shown in fig. 33 to 35, the cutting device 100 according to the present embodiment includes: a container installation unit 117 in which a tubular container 116 is installed, the tubular container 116 accommodating a plurality of products P from one end opening 116 x; and a conveyance and storage mechanism 118 for conveying and storing a plurality of products P from the transfer station 5 to the tubular container 116 provided in the container installation section 117.
The container installation section 117 is provided with an empty tubular container 116 in which the product P is not accommodated, and the product P is inserted from an opening 116x at one end of the tubular container 116 by the conveyance accommodation mechanism 118.
As shown in fig. 33, the container setting unit 117 of the present embodiment includes: an empty container housing portion 117a for housing the empty tubular container 116; an insertion position setting unit 117b provided at an insertion position where the empty tubular container 116 is sent out from the empty container housing unit 117a and the product P is inserted into the empty tubular container 116 from the one end opening 116 x; and a housed container housing portion 117c for housing the housed cylindrical containers 116 in which the products P are fully loaded or in which the required number of products P are housed.
Here, as shown in fig. 34, the cylindrical container 116 accommodates a plurality of products P in a state of being arranged in a row. Specifically, the tubular container 116 has a shape extending linearly, and has a space for accommodating the product P therein. The cross-sectional shape of the tubular container 116 orthogonal to the longitudinal direction is a shape corresponding to the cross-sectional shape of the product P. The tubular container 116 shown in fig. 34 has a structure in which a part of the side peripheral wall extending in the longitudinal direction is opened, but may have a structure in which the side peripheral wall is closed. The tubular container 116 may be configured to accommodate a plurality of products P in a plurality of rows, in addition to the configuration in which the plurality of products P are accommodated in a single row. Further, the tubular container 116 may be made of resin or metal. In fig. 34, the product P is shown as having leads, but may be a leadless type such as a Quad Flat No-lead (QFN).
As shown in fig. 33 and 35, the conveyance housing mechanism 118 includes: an intermediate stage 119 for temporarily placing a plurality of products P; a first product conveying mechanism 120 that conveys a plurality of products P from the transfer station 5 located at the take-out position X2 to the intermediate station 119; and a second product conveying mechanism 121 for conveying and storing the plurality of products P from the intermediate table 119 to the tubular container 116 provided in the insertion position setting portion 117b of the container setting portion 117.
The intermediate stage 119 conveys the product P from the transfer stage 5 located at the take-out position X2 by the first product conveying mechanism 120 and temporarily places the product P. The product P temporarily placed on the intermediate stage 119 is conveyed by the second product conveying mechanism 121 to the tubular container 116 provided in the container setting section 117. The intermediate stage 119 of the present embodiment is fixed in the X direction and the Y direction, but may be configured to be movable.
The first product conveying mechanism 120 conveys a plurality of products P to the intermediate stage 119 in a predetermined number (for example, one) from the transfer stage 5 moved to the take-out position X2.
Specifically, as shown in fig. 35, the first product conveying mechanism 120 includes: the product adsorbing means 1201 adsorbs a plurality of products P held by the transfer table 5 in units of a predetermined number (for example, one product P); and a suction moving mechanism 1202 for moving the product suction mechanism 1201 in the X direction.
As shown in fig. 35, the product adsorbing mechanism 1201 has: an adsorption head 1201A provided with an adsorption portion 1201A for adsorbing and holding a plurality of products P; and a vacuum pump or a vacuum ejector (not shown) connected to the suction unit 1201A of the suction head 1201A. The product adsorbing mechanism 1201 is configured such that each adsorbing portion 1201a adsorbs one product P. The plurality of suction units 1201a are configured to be movable up and down independently of each other, and the product P can be sucked by lowering each suction unit 1201a. Further, an imaging camera 203 for confirming the state of the sucked product P is provided at the lower part of the first product conveying mechanism 120.
As shown in fig. 35, the adsorbing moving mechanism 1202 includes: an X-direction moving unit 1202a that moves the product suction mechanism 1201 in the X-direction; and a Z-direction moving unit 1202b for moving the product suction mechanism 1201 in the Z-direction. The suction moving mechanism 1202 may have a Y-direction moving portion that moves the product suction mechanism 1201 in the Y-direction.
The X-direction moving unit 1202a includes: an X-direction guide rail 1202a1 provided along the X-direction on the inner side of the transmission shaft 71; and a support body 1202a2 that moves along the X-direction guide rail 1202a1 and supports the product suction mechanism 1201 via the Z-direction moving portion 1202 b. The support body 1202a2 is linearly reciprocated along the X direction on the X direction guide rail 1202a1 by, for example, a ball screw mechanism (not shown) extending along the X direction. The ball screw mechanism is driven by a driving source (not shown) such as a servo motor. In addition, the support body 1202a2 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
The Z-direction moving unit 1202b includes: a Z-direction guide rail 1202b1 provided in the support body 1202a2 along the Z-direction; and a Z-direction slider 1202b2 that moves along the Z-direction guide 1202b1 and supports the article suction mechanism 1201. The Z-direction slider 1202b2 is linearly reciprocated along the Z-direction on the Z-direction guide rail 1202b1 by, for example, a ball screw mechanism (not shown) extending along the Z-direction. In addition, the Z-direction slider 1202b2 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
As shown in fig. 33 and 35, the second product conveying mechanism 121 conveys the product P placed on the intermediate stage 119 to the tubular container 116 provided in the insertion position setting portion 117b of the container setting portion 117, and inserts and accommodates the product P from the one end opening 116x of the tubular container 116.
Specifically, as shown in fig. 35, the second product conveying mechanism 121 includes: the pressing member 121a presses the product P placed on the intermediate stage 119; and a driving unit 121b that moves the pressing member 121a in the Y direction. The driving unit 121b may be a ball screw mechanism, a cylinder, or a linear motor, for example. The second product conveying mechanism 121 may have a product guide portion for guiding the product P to the one end opening 116x of the tubular container 116. Further, a mechanism for raising and lowering the pressing member 121a may be provided.
< example of the action of the cutting device >
Next, an example of the operation of the cutting device 100 will be described with reference to fig. 9, 33, and 35. In the present embodiment, all operations and controls of the cutting device 100, such as conveyance of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, cleaning of the product P, and tube housing of the product P, are performed by the control section CTL (see fig. 33).
In the operation of the cutting apparatus 100 of the present embodiment, the operations of conveying the sealed substrate W, cutting the sealed substrate W, cleaning the product P, and inspecting the product P are the same as those of the first embodiment.
After the double-sided inspection, the product P is transferred from the reversing mechanism 14 to the transfer table 5. The transfer stage 5 on which the plurality of products P are placed moves to the take-out position X2 (see fig. 33 and 35). On the other hand, an empty tubular container 116 (see fig. 32 and 34) is provided in the insertion position setting portion 117b of the container setting portion 117.
In this state, as shown in fig. 35, the first product conveying mechanism 120 suctions and holds the product P from the transfer station 5 located at the take-out position X2. Then, the first product conveying mechanism 120 moves the product P to the intermediate stage 119, and releases the suction and holding of the product P, thereby placing the product P on the intermediate stage 119. The product P placed on the intermediate stage 119 is inserted and accommodated in the cylindrical container 116 by the second product conveying mechanism 121.
When the cylindrical container 116 is full or when the cylindrical container 116 contains a desired number of products P, the housed cylindrical container 116 positioned in the insertion position setting unit 117b is moved to the housed container housing unit 117c, and the empty cylindrical container 116 is fed from the empty container housing unit 117a and set in the insertion position setting unit 117b.
< automatic exchange function of retaining plate M1 >)
Further, the cutting device 100 of the fourth embodiment has a function of automatically replacing the holding plate M1 for holding the sealed substrate W or the product P, as in the first embodiment and the like. In the present embodiment, the cutting stage 2A, the cutting stage 2B, the holding stage 141, the transfer stage 5, and the second holding mechanism 6 have the holding plate M1 and the holding base M2, as in the first embodiment. The specific configuration of the holding plate M1 and the holding base M2 is the same as that of the first embodiment.
Specifically, the cutting device 100 includes, as in the third embodiment, as shown in fig. 33 and 36: a board housing portion 24 for housing the holding board M1; and a board conveyance mechanism 25 for conveying the holding board M1 between the board housing portion 24 and the holding base M2. The cutting device 100 of the second embodiment is provided with the fixing mechanism 26 and the inspection mechanism 29 in the same manner as in the first embodiment.
The plate conveying mechanism 25 according to the fourth embodiment is configured using the second holding mechanism 6 and the conveying moving mechanism 7, and can convey a plurality of products P. In other words, the second holding mechanism 6 and the transfer movement mechanism 7 have the function of transferring the holding plate M1. The board conveyance mechanism 25 is configured to move in the X direction by the common transmission shaft 71. The board conveyance mechanism 25 is provided on the same side (near front side) as the transmission shaft 71 in a plan view. Here, the second holding mechanism 6 constituting the board conveyance mechanism 25 has a conveyance cylindrical portion 282 (see fig. 13) as in the first embodiment, and the conveyance cylindrical portion 282 is inserted into a conveyance holding hole 281 (see fig. 10) formed in the holding board M1.
< replacement action of retaining plate M1 >)
Next, the operation of replacing the holding plate M1 by the plate conveying mechanism 25 according to the present embodiment will be described with reference to fig. 36.
In the following replacement operation, the holding plate M1 is discriminated when the holding plate M1 is taken out from the plate accommodating portion 24 by: the identifier such as an RFID provided on the holding board M1 is read by an identifier reader (not shown) provided on the board conveyance mechanism 25 (second holding mechanism 6).
(1) Removal operation of the holding plate M1 of the second holding mechanism 6 (see FIG. 36 (a))
First, the holding plate M1 of the second holding mechanism 6 is removed. Specifically, the second holding mechanism 6 is moved to the board housing portion 24 by the conveying movement mechanism 7, and the holding board M1 is lowered and removed by the second holding mechanism 6, and the holding board M1 is placed and housed in the carriage portion 241. When the holding plate M1 of the second holding mechanism 6 is removed, compressed air is supplied to the fixing cylinder portion 262 to set the movable element 262b to the retracted position, and the fixing of the fixing mechanism 26 is released.
The second holding mechanism 6 from which the holding plate M1 is removed is used to perform the replacement operation of the holding plate of the cutting table 2A, the cutting table 2B, or the holding table 141.
(2) Replacement operation of the holding plate M1 of the cutting table 2A and the cutting table 2B (see fig. 36B)
The holding plates M1 of the cutting tables 2A and 2B are removed, and the holding plates M1 are lifted by the plate conveying mechanism 25 (the conveying moving mechanism 7 and the second holding mechanism 6), conveyed to the plate accommodating portion 24 in a state where the lifting position is set, and the holding plates M1 are lowered and placed on the carriage portion 241. When the holding plates M1 of the cutting tables 2A and 2B are removed, compressed air is supplied to the fixing cylinder portion 262 to set the movable element 262B to the retracted position, and the fixing of the fixing mechanism 26 is released.
Then, the board conveyance mechanism 25 (the conveyance movement mechanism 7 and the second holding mechanism 6) takes out the new holding boards M1 of the cutting tables 2A and 2B from the board housing portion 24, conveys them to the holding bases M2 of the cutting tables 2A and 2B in a state where the raising positions are set, and lowers and places the holding boards M1. In this state, when compressed air is supplied to the fixing cylindrical portion 262 and the movable member 262B is set to the retracted position, the fixing cylindrical portion 262 enters the fixing insertion hole 261 of the holding plate M1, and when the supply of compressed air is stopped, the movable member 262B is set to the protruding position, and the holding base M2 of the cutting table 2A and the cutting table 2B fixes the holding plate M1.
(3) Replacement operation of the holding plate M1 of the holding table 141 (see FIG. 36 (b))
The holding plate M1 of the holding table 141 is removed, and the holding plate M1 is lifted by the plate conveying mechanism 25 (the conveying moving mechanism 7 and the second holding mechanism 6) and conveyed to the plate accommodating portion 24 in a state where the lifting position is set, and the holding plate M1 is lowered and placed and accommodated in the carriage portion 241 slid forward. When the holding plate M1 of the holding table 141 is removed, compressed air is supplied to the fixing cylindrical portion 262 to set the movable element 262b to the retracted position, and the fixing of the fixing mechanism 26 is released.
Then, the board conveyance mechanism 25 (the conveyance movement mechanism 7 and the second holding mechanism 6) takes out the new holding board M1 of the holding table 141 from the board housing section 24, conveys the new holding board M1 to the holding base M2 of the holding table 141 in a state of being set to the raised position, and lowers and places the holding board M1. In this state, when compressed air is supplied to the fixing cylindrical portion 262 and the movable member 262b is set to the retracted position, the fixing cylindrical portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then, when the supply of compressed air is stopped, the movable member 262b is set to the protruding position and the holding plate M1 is fixed to the holding base M2 of the holding table 141.
(4) Replacement operation of holding plate of transfer table 5 (see FIG. 36 (b))
The holding plate M1 of the transfer stage 5 is removed, and the holding plate M1 is lifted by the plate conveying mechanism 25 (the conveying moving mechanism 7 and the second holding mechanism 6) and conveyed to the plate accommodating portion 24 in a state where the lifting position is set, and the holding plate M1 is lowered and placed and accommodated in the carriage portion 241 slid forward. When the holding plate M1 of the transfer table 5 is removed, compressed air is supplied to the fixing cylinder 262 to set the movable element 262b to the retracted position, and the fixing of the fixing mechanism 26 is released.
Then, the board transfer mechanism 25 (the transfer moving mechanism 7 and the second holding mechanism 6) takes out the new holding board M1 of the transfer station 5 from the board housing section 24, and transfers the new holding board M1 to the holding base M2 of the transfer station 5 in a state where the board is set to the raised position, and lowers and places the holding board M1. In this state, when compressed air is supplied to the fixing cylindrical portion 262 and the movable element 262b is set to the retracted position, the fixing cylindrical portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then, when the supply of compressed air is stopped, the movable element 262b is set to the protruding position and the holding plate M1 is fixed to the holding base M2 of the transfer table 5.
(5) Mounting operation of the holding plate M1 of the second holding mechanism 6 (see FIG. 36 (c))
As described above, after the replacement operation of the holding plates M1 of the cutting stage 2A, the cutting stage 2B, the holding stage 141, and the transfer stage 5 is performed, the second holding mechanism 6 is moved to the plate accommodating portion 24 by the conveying moving mechanism 7, and the second holding mechanism 6 is lowered, so that a new holding plate M1 placed on the carriage portion 241 is attached. Here, the fixing cylindrical portion 262 provided at the holding base M2 of the second holding mechanism 6 is inserted into the fixing insertion hole 261 formed in the holding plate M1 by the conveying moving mechanism 7. In this state, when compressed air is supplied to the fixing cylindrical portion 262 and the movable element 262b is set to the retracted position, the fixing cylindrical portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then, when the supply of compressed air is stopped, the movable element 262b is set to the protruding position and the holding plate M1 is fixed to the holding base M2 of the second holding mechanism 6.
The order of the replacement operation of the holding plates M1 of the cutting tables 2A and 2B, the replacement operation of the holding plates M1 of the holding table 141, and the replacement operation of the holding plates M1 of the transfer table 5 may be changed as appropriate. The holding plate M1 may be removed from the holding bases M2 of the cutting tables 2A, 2B, 141, and 5, and then a new holding plate M1 may be attached to the holding bases M2 of the cutting tables 2A, 2B, 141, and 5.
In the above description, the replacement of the holding plate M1 of the second holding mechanism 6, the cutting stage 2A, the cutting stage 2B, the holding stage 141, and the transfer stage 5 is performed in a series of operations, but the replacement of the holding plate M1 of at least one of the second holding mechanism 6, the cutting stage 2A, the cutting stage 2B, the holding stage 141, and the transfer stage 5 may be performed. At this time, when the holding plate M1 of the cutting stage 2A, the cutting stage 2B, the holding stage 141, or the transfer stage 5 is replaced, it is conceivable to remove the holding plate M1 of the second holding mechanism 6 constituting the plate conveying mechanism 25 in advance.
Effect of the fourth embodiment >
According to the cutting device 100 of the present embodiment, as in the first to third embodiments, the holding plate M1 removed from the holding base M2 is conveyed to the plate accommodating portion 24 and the holding plate M1 positioned in the plate accommodating portion 24 is conveyed to the plate conveying mechanism 25 of the holding base M2, so that the holding plate M1 can be automatically replaced with the holding base M2. As a result, the labor cost for replacing the holding plate M1 can be reduced. Further, since the holding plate M1 is automatically replaced, the replacement time of the holding plate M1 can be shortened, and the productivity of the cutting device 100 can be improved. Further, the non-uniformity of the mounting state of the holding plate M1 to the holding base M2 can be reduced. In addition, in the fourth embodiment, the same effects are obtained by the same configuration as in the first to third embodiments.
In particular, in the cutting apparatus 100 according to the fourth embodiment, the plurality of products P can be transported from the transfer stage 5 to the cylindrical container 116 provided in the container installation section 117 by the transport and storage mechanism 118, and the plurality of products P can be stored in the one end opening 116x of the cylindrical container 116.
In addition, in the pipe-accommodating cutting apparatus 100, the second holding mechanism 6 and the conveying moving mechanism 7 are used to construct the board conveying mechanism 25, so that the apparatus structure can be simplified and the apparatus cost can be reduced.
Modification of the fourth embodiment
For example, in the fourth embodiment, the container installation portion 117 is provided on the inner side of the transmission shaft 71, but may be provided on the front side of the transmission shaft 71.
The cylindrical container 116 provided in the container installation section 117 may be installed in the Y direction or in another direction, in addition to the configuration in which it is installed in the X direction.
< other variant embodiments >)
In the above embodiments, the cutting device of the double-table type and double-spindle structure has been described, but the present invention is not limited thereto, and may be a cutting device of the single-table type and single-spindle structure, a cutting device of the single-table type and double-spindle structure, or the like.
Further, since the cam rack member constituting the transmission shaft 71 may be constituted by connecting a plurality of members, the cutting device (processing device) 100 may be configured as a module structure that is detachable and attachable (detachable) between the second cleaning mechanism 19 and the inspection unit 13 or the drying table 112, for example. In this case, for example, a module for performing a different type of inspection from the inspection in the inspection unit 13 may be added between the module on the second cleaning mechanism 19 side and the module on the inspection unit 13 side or the module on the drying table 112 side. In addition to the configuration illustrated here, the cutting device (processing device) 100 may be configured as a module that can be separated and connected (detachable) at a certain place, or an additional module may be configured as a module for various functions other than inspection.
The machining device of the present invention may perform machining other than cutting, for example, cutting or grinding.
In addition, the present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the scope of the present invention.
Industrial applicability
According to the present invention, a processing apparatus is provided that automatically replaces a holding plate for holding a processing object.
Claims (22)
1. A processing apparatus comprising: a processing mechanism for processing the object to be processed;
a board housing unit configured to house a holding board for holding the object;
a holding base to which the holding plate is detachably attached, the holding plate being used to hold the object; and
a board conveying mechanism for conveying the holding board between the board housing portion and the holding base portion,
the board conveying mechanism conveys the holding board removed from the holding base to the board housing section, and conveys the holding board located in the board housing section to the holding base.
2. The processing apparatus according to claim 1, wherein the board conveyance mechanism lifts and conveys the holding board.
3. The processing apparatus according to claim 1 or 2, wherein the board conveyance mechanism conveys at least one of the following holding boards:
a holding plate for a processing table for processing the object;
a holding plate of a drying table for drying the processed object processed by the processing means;
a holding plate of an inspection table for inspecting the processed object;
A holding plate for a transfer stage for placing the processed object before sorting; or (b)
A holding plate of a holding mechanism for conveying the processed object after processing.
4. The processing apparatus according to any one of claims 1 to 3, wherein the board conveying mechanism is capable of conveying the processed object.
5. The processing apparatus according to any one of claims 1 to 4, wherein the board conveying mechanism is capable of conveying a tray that sorts the processed object.
6. The processing apparatus according to any one of claims 1 to 5, wherein the board conveyance mechanism has:
a first conveying mechanism for conveying the holding plate between the plate accommodating section and the temporary placement section; and
and a second conveying mechanism for conveying the holding plate between the temporary placement section and the holding base section.
7. The processing apparatus according to claim 6, wherein the first conveying mechanism is capable of conveying the tray.
8. The processing apparatus according to claim 6 or 7, wherein the second conveying mechanism is capable of conveying the processed object.
9. The processing apparatus according to any one of claims 1 to 4, further comprising: a mounting table for mounting an attaching member having an adhesive surface to which the object to be processed singulated by the processing means is attached,
the board conveyance mechanism is capable of conveying the attaching member to the mounting table.
10. The processing apparatus according to claim 9, wherein the board conveyance mechanism has:
a first conveying mechanism for conveying the holding plate between the plate accommodating section and the temporary placement section; and
and a second conveying mechanism for conveying the holding plate between the temporary placement section and the holding base section.
11. The processing apparatus according to claim 10, wherein the first conveying mechanism is capable of conveying the attaching member to the mounting table.
12. The processing apparatus according to claim 10 or 11, wherein the second conveying mechanism is capable of conveying the singulated object.
13. The processing apparatus according to any one of claims 10 to 12, further comprising: a first holding mechanism for holding the object to be processed in order to convey the object to be processed to the processing table;
A second holding mechanism that holds the singulated object in order to convey the singulated object from the processing table;
a third holding mechanism that holds the attaching member for conveying the attaching member to the mounting table; and
a transfer movement mechanism having a common transmission shaft for moving the first holding mechanism, the second holding mechanism, and the third holding mechanism,
the first conveying mechanism is configured by using the third holding mechanism and the conveying moving mechanism,
the second conveying mechanism is configured using the second holding mechanism and the conveying moving mechanism.
14. The processing apparatus according to any one of claims 10 to 13, further comprising: an attaching member housing portion for housing the attaching member,
the board housing portion and the attaching member housing portion are disposed vertically to each other.
15. The processing apparatus according to any one of claims 1 to 4, further comprising: a storage box for storing the objects subjected to singulation by the processing mechanism by falling down,
the board conveying mechanism can convey the singulated objects to the storage box.
16. The processing apparatus according to any one of claims 1 to 4, further comprising: a container installation unit provided with a cylindrical container that accommodates the singulated objects from an opening at one end; and
and a conveyance and storage mechanism that conveys and stores the singulated objects to the cylindrical container provided in the container installation section.
17. The processing apparatus according to claim 15 or 16, further comprising: a first holding mechanism for holding the object to be processed in order to convey the object to be processed to the processing table;
a second holding mechanism that holds the singulated object in order to convey the singulated object from the processing table; and
a transfer movement mechanism having a common transmission shaft for moving the first holding mechanism and the second holding mechanism,
the board conveying mechanism is configured by using the second holding mechanism and the conveying moving mechanism.
18. The processing apparatus according to any one of claims 1 to 17, further comprising: and an inspection mechanism for inspecting the mounting state of the holding plate to the holding base.
19. The processing apparatus of claim 18, wherein the inspection mechanism has:
an inspection flow path that opens to a mounting surface on which the holding plate is mounted; and
and a detection sensor provided in the inspection flow path and detecting leakage of the fluid from the opening.
20. The processing apparatus according to any one of claims 1 to 19, wherein the holding base has: a fixing cylindrical portion inserted into a fixing insertion hole formed in the holding plate,
the fixing cylinder portion includes: a cylindrical body inserted into the fixing insertion hole; a movable member provided so as to be movable to a protruding position and a sinking position from an outer peripheral surface of the cylinder body; and an elastic body for applying force so that the movable member is positioned to protrude from the cylinder body,
the movable member is protruded in a state where the fixing cylindrical portion is inserted into the fixing insertion hole, and thereby the holding plate is fixed to the holding base portion.
21. The processing apparatus according to any one of claims 1 to 20, wherein the board conveying mechanism has: a conveying cylinder part inserted into a conveying holding hole formed in the holding plate,
The conveying cylinder part comprises: a cylindrical body inserted into the conveyance holding hole; a movable member provided so as to be movable to a protruding position and a sinking position from an outer peripheral surface of the cylinder body; and an elastic body for applying force so that the movable member is positioned to protrude from the cylinder body,
the movable member is in a protruding state in a state in which the conveying cylindrical portion is inserted into the conveying insertion hole, thereby holding the holding plate in the plate conveying mechanism.
22. A method of manufacturing a processed product, the processed product being manufactured using the processing apparatus according to any one of claims 1 to 21.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-044356 | 2021-03-18 | ||
| JP2021-130829 | 2021-08-10 | ||
| JP2021133294 | 2021-08-18 | ||
| JP2021-133294 | 2021-08-18 | ||
| PCT/JP2021/035885 WO2022195931A1 (en) | 2021-03-18 | 2021-09-29 | Processing apparatus and processed article manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116963871A true CN116963871A (en) | 2023-10-27 |
Family
ID=88444701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180095325.0A Pending CN116963871A (en) | 2021-03-18 | 2021-09-29 | Processing device and method for manufacturing processed product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116963871A (en) |
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2021
- 2021-09-29 CN CN202180095325.0A patent/CN116963871A/en active Pending
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