WO2022195931A1 - Processing apparatus and processed article manufacturing method - Google Patents

Processing apparatus and processed article manufacturing method Download PDF

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Publication number
WO2022195931A1
WO2022195931A1 PCT/JP2021/035885 JP2021035885W WO2022195931A1 WO 2022195931 A1 WO2022195931 A1 WO 2022195931A1 JP 2021035885 W JP2021035885 W JP 2021035885W WO 2022195931 A1 WO2022195931 A1 WO 2022195931A1
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WO
WIPO (PCT)
Prior art keywords
holding
plate
transport
holding plate
conveying
Prior art date
Application number
PCT/JP2021/035885
Other languages
French (fr)
Japanese (ja)
Inventor
元樹 深井
昌一 片岡
聡子 堀
雄哉 坂上
裕子 山本
翔 吉岡
一郎 今井
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to KR1020237029195A priority Critical patent/KR20230135661A/en
Priority to JP2023506721A priority patent/JPWO2022195931A1/ja
Priority to CN202180095325.0A priority patent/CN116963871A/en
Publication of WO2022195931A1 publication Critical patent/WO2022195931A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
    • B23Q7/04—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0616—Grinders for cutting-off using a tool turning around the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Definitions

  • the present invention relates to a processing device and a method for manufacturing a processed product.
  • Patent Document 1 in a cutting apparatus for cutting an object to be cut to manufacture a plurality of individualized products, it has been conceived that a suction jig is detachably attached to a cutting table. It is
  • the suction jig is simply detachable from the cutting table, and an operator needs to perform the work when actually replacing the suction jig.
  • the suction jig is simply detachable from the cutting table, and an operator needs to perform the work when actually replacing the suction jig.
  • there is a problem that not only is the labor cost of the worker high, but also the mounting state varies.
  • the replacement work takes time, and the productivity of the cutting device decreases.
  • the present invention has been made to solve the above problems, and its main object is to automatically replace a holding plate for holding an object to be processed.
  • a processing apparatus includes a processing mechanism for processing an object to be processed, a plate housing unit for housing a holding plate for holding the object to be processed, and the holding plate are detachably attached, A holding base portion that holds the workpiece using the holding plate; and a plate conveying mechanism that conveys the plate between the plate accommodating portion and the holding base portion, wherein the plate conveying mechanism includes the The holding plate removed from the holding base portion is conveyed to the plate accommodating portion, and the holding plate in the plate accommodating portion is conveyed to the holding base portion.
  • the holding plate for holding the workpiece can be automatically replaced.
  • FIG. 1 It is a figure showing typically composition of a cutting device concerning a 1st embodiment of the present invention. It is a perspective view which shows typically the table for cutting of the same embodiment, and its peripheral structure. It is the figure (plan view) seen from the Z direction which shows typically the structure of the cutting table of the same embodiment, and its peripheral structure. It is the figure (front view) seen from the Y direction which shows typically the structure of the cutting table of the same embodiment, and its peripheral structure. It is the figure (front view) seen from the Y direction which shows typically the structure of the 1st holding mechanism of the same embodiment, and the moving mechanism for conveyance. It is the figure (side view) which showed typically the structure of the 1st holding mechanism of the same embodiment, and the moving mechanism for conveyance seen from the X direction.
  • FIG. 1 It is a perspective view which shows the holding
  • FIG. 1 It is a perspective view which shows the 1st conveyance mechanism (plate conveyance mechanism) and plate accommodating part of the same embodiment.
  • (a) A view showing the positional relationship between the sticking member storage section and the plate storage section when the sticking member is put in and taken out of the sticking member storage section, and
  • FIG. 1 It is the figure (front view) seen from the Y direction which shows typically the peripheral structure of the table for drying of the same embodiment, and a storage box. It is a schematic diagram which shows operation
  • processing device Sealed substrate (object to be processed)
  • cutting mechanism (processing mechanism) 5 transfer table 6: second holding mechanism (holding mechanism for carrying, second carrying mechanism) 7... Transport moving mechanism (second transport mechanism) 141...
  • Holding table (inspection table) 24 Plate accommodating portion M2 Holding base portion M1 Holding plate 25 Plate conveying mechanism 21 Tray 22 Tray conveying mechanism (first conveying mechanism) 261 Fixing insertion hole 262 Fixing cylinder portion 262a Cylinder main body 262b Mover 262c Elastic body 27 Temporary placement portion 281 Transfer holding hole 282 Cylinder portion 29 for transporting Inspection mechanism 29a Inspection channel 101 Pasting member 102 Placement table 106 Pasting member housing portion 107 Pasting member conveying mechanism 1071... Third holding mechanism (first transport mechanism) 111... Storage box 112... Drying table 116... Cylindrical container 116x... One end opening 117... Container installation part 118... Transport/accommodation mechanism 119... Intermediate table 120... ⁇ First product transport mechanism 121 . . . Second product transport mechanism
  • the processing apparatus of the present invention includes a processing mechanism for processing an object to be processed, a plate housing section for housing a holding plate for holding the object to be processed, and the holding plate detachably attached. a holding base portion for holding the workpiece using the holding plate; and a plate transport mechanism for transporting the plate between the plate accommodating portion and the holding base portion, wherein the plate transport mechanism is and conveying the holding plate removed from the holding base portion to the plate accommodating portion, and conveying the holding plate in the plate accommodating portion to the holding base portion.
  • this processing apparatus since it has a plate transport mechanism that transports the holding plate removed from the holding base portion to the plate accommodating portion and transports the holding plate in the plate accommodating portion to the holding base portion, the holding base portion
  • the holding plate can be automatically exchanged for As a result, labor costs for exchanging holding plates can be reduced.
  • the holding plate since the holding plate is automatically replaced, it is possible to reduce variations in the state of attachment of the holding plate to the holding base portion.
  • the holding plate is automatically exchanged, the time for exchanging the holding plate can be shortened, and the productivity of the processing apparatus can be improved.
  • the plate transport mechanism lifts and transports the holding plate. With this configuration, when the holding plate is conveyed, interference between the holding plate and other members can be avoided, and the holding plate can be easily conveyed.
  • the plate conveying mechanism includes a processing table holding plate for processing the processing object, a drying table holding plate for drying the processing object processed by the processing mechanism, A holding plate for an inspection table for inspecting the processed workpieces, a holding plate for a transfer table on which the processed workpieces are placed before sorting, or the processed workpieces after processing It is desirable to transport at least one of the holding plates of the transport holding mechanism that holds the object for transport. With this configuration, it is possible to automatically replace the holding plates of the processing table, the inspection table, the transfer table, and the carrying mechanism.
  • the processing apparatus of the present invention further includes a processing object transport mechanism that transports the processing object.
  • the plate transport mechanism is configured using the workpiece transport mechanism in order to simplify the device configuration and reduce the device cost while enabling automatic replacement of the holding plate. is desirable.
  • the plate transport mechanism is configured to have a function of transporting the workpiece.
  • the processing apparatus of the present invention can be configured such that the processed object can be accommodated in a tray (also called “tray accommodation”).
  • This processing apparatus further includes a tray transport mechanism that transports a tray on which the processed objects are sorted.
  • the plate transport mechanism is configured using the tray transport mechanism in order to simplify the device configuration and reduce the device cost while enabling automatic replacement of the holding plate. is desirable.
  • the plate conveying mechanism has a function of conveying trays in which processed objects are sorted.
  • the plate transport mechanism includes a first transport mechanism that transports the holding plate between the plate accommodating portion and the temporary placement portion, and a holding plate that transports the holding plate between the temporary placement portion and the holding base portion. It is desirable to have a second transport mechanism for With this configuration, the holding plate is transported by the first transporting mechanism and the second transporting mechanism via the temporary placement section. It is possible to increase the degree of freedom of the transport destination.
  • the plate conveying mechanism is composed of a first conveying mechanism and a second conveying mechanism
  • the first conveying mechanism conveys the pasting member to the mounting table
  • the second conveying mechanism conveys the individual pieces. It is desirable to convey the processed object that has been processed. With this configuration, the device cost can be reduced while simplifying the configuration of the device while enabling automatic exchange of the holding plate.
  • the processing apparatus of the present invention can have a configuration in which individualized workpieces can be accommodated (also called “ring accommodation”) by being attached to an attaching member having an adhesive surface.
  • This processing apparatus further includes a mounting table on which a pasting member having an adhesive surface to which the individualized objects to be processed by the processing mechanism are adhered is placed.
  • This structure WHEREIN It is desirable that the said plate conveyance mechanism can convey the said sticking member to the said mounting table. With this processing apparatus, since the plate conveying mechanism can convey the pasting member to the mounting table, there is no need to provide a conveying mechanism for the pasting member separately from the plate conveying mechanism, and individualized processing can be performed. It is possible to simplify the device configuration of a processing device that stores an object by sticking it on an adhesive surface.
  • the attaching member to which the individualized workpiece is attached may be moved. The handling can be facilitated.
  • the plate transport mechanism includes a first transport mechanism that transports the holding plate between the plate accommodating portion and the temporary placement portion, and a holding plate that transports the holding plate between the temporary placement portion and the holding base portion. It is desirable to have a second transport mechanism for With this configuration, the holding plate is transported by the first transporting mechanism and the second transporting mechanism via the temporary placement section. It is possible to increase the degree of freedom of the transport destination.
  • the plate conveying mechanism is composed of a first conveying mechanism and a second conveying mechanism
  • the first conveying mechanism conveys the pasting member to the mounting table
  • the second conveying mechanism conveys the individual pieces. It is desirable to convey the processed object that has been processed. With this configuration, the device cost can be reduced while simplifying the configuration of the device while enabling automatic exchange of the holding plate.
  • the processing apparatus of the present invention includes a first holding mechanism that holds the object to be processed in order to convey the object to be processed to the processing table; a second holding mechanism for holding the singulated object to convey the singulated object from the processing table; and conveying the pasting member to the mounting table. and a conveying movement mechanism having a common transfer shaft for moving the first holding mechanism, the second holding mechanism and the third holding mechanism. It is desirable to be prepared.
  • the first transport mechanism includes the third holding mechanism and the transport moving mechanism. and the second transport mechanism is preferably configured using the second holding mechanism and the transport moving mechanism.
  • the processing apparatus of the present invention further includes an affixing member accommodating section that accommodates the affixing member.
  • an affixing member accommodating section that accommodates the affixing member.
  • the processing apparatus of the present invention can be configured so that individualized workpieces can be accommodated in a discrete state (also referred to as “bulk accommodation”).
  • This processing apparatus further includes a storage box in which the workpieces separated by the processing mechanism are dropped and stored.
  • the plate transport mechanism can transport the individualized workpieces to the storage box.
  • the plate conveying mechanism can convey the singulated workpieces to the storage box. It is possible to simplify the device configuration of the processing device that drops and stores the processed object. Furthermore, equipment costs can also be reduced.
  • the individualized workpieces are dropped and stored in the storage box, the storage space can be reduced in comparison with the conventional tray storage configuration. This also reduces the footprint of the processing device.
  • the processing apparatus of the present invention can be configured so that individualized workpieces can be accommodated in cylindrical containers (also called "tube accommodation”).
  • cylindrical containers also called “tube accommodation”
  • the cylindrical container is sometimes called a tube, magazine stick, stick magazine, stick, or the like.
  • This processing apparatus includes a container installation section in which a cylindrical container for accommodating the individualized workpieces from one end opening is installed, and the individualized workpieces are placed in the container installation section. It further comprises a transporting/storing mechanism for transporting and storing in the installed cylindrical container.
  • the processing apparatus of the present invention includes the above-described A first holding mechanism for holding an object to be processed, and a second holding mechanism for holding the individualized object to convey the individualized object from the processing table. and a transfer movement mechanism having a common transfer shaft for moving the first holding mechanism and the second holding mechanism, wherein the plate transfer mechanism moves the second holding mechanism and the transfer movement mechanism. It is desirable to be configured using
  • the processing apparatus of the present invention further comprises an inspection mechanism for inspecting the state of attachment of the holding plate to the holding base. is desirable.
  • the inspection mechanism includes an inspection flow path that opens onto a mounting surface on which the holding plate is mounted, and a fluid flow path that is provided in the inspection flow path and that flows from the opening. It would be desirable to have a detection sensor to detect a leak in the air.
  • the detection sensor detects fluid leakage from the opening by measuring the pressure or flow rate of the fluid.
  • the holding base has a fixing cylinder inserted into a fixing insertion hole formed in the holding plate
  • the fixing cylinder part includes a cylinder body inserted into the fixing insertion hole, a mover provided movably at a position protruding from and retracted from the outer peripheral surface of the cylinder body, and the mover. and a position where the mover protrudes in a state in which the fixing cylinder portion is inserted into the fixing insertion hole Accordingly, it is desirable that the holding plate is fixed to the holding base.
  • the plate conveying mechanism has a conveying cylinder portion that is inserted into a conveying holding hole formed in the holding plate.
  • the conveying cylinder portion includes a cylinder body inserted into the conveying holding hole, a mover provided movably at a position protruding from and retracted from the outer peripheral surface of the cylinder body, and the movable element. and an elastic body for exerting a force so that the movable element protrudes from the cylinder main body, and in a state in which the conveying cylinder part is inserted into the conveying insertion hole, the position where the movable element protrudes. Therefore, it is preferable that the holding plate is held by the plate conveying mechanism.
  • a method for manufacturing a processed product using the processing apparatus described above is also an aspect of the present invention.
  • the processing apparatus 100 of the present embodiment is a cutting apparatus that separates a sealed substrate W, which is an object to be processed, into a plurality of products P, which are processed products.
  • the sealed substrate W is a substrate to which electronic elements such as a semiconductor chip, a resistor element, a capacitor element, etc. are connected, and at least the electronic elements are resin-molded so as to be resin-sealed.
  • a lead frame and a printed wiring board can be used as the substrate constituting the sealed substrate W.
  • semiconductor substrates including semiconductor wafers such as silicon wafers
  • metal substrates metal substrates
  • ceramic substrates can be used.
  • a glass substrate, a resin substrate, or the like can be used.
  • the substrates constituting the sealed substrate W may or may not be wired.
  • one surface of the sealed substrate W and the product P of this embodiment becomes a mounting surface to be mounted later.
  • one surface to be mounted later is referred to as a "mounting surface”, and the opposite surface is referred to as a "mark surface”.
  • the cutting apparatus 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W, and cutting tables 2A and 2B that hold the sealed substrate W.
  • a first holding mechanism 3 for holding the sealed substrate W for transporting to the substrate
  • a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting tables 2A and 2B, and a plurality of products
  • a transfer table 5 to which P is transferred a second holding mechanism 6 for holding a plurality of products P to transfer the plurality of products P from the cutting tables 2A and 2B to the transfer table 5, and a first holding mechanism 3.
  • the first holding mechanism 3 and the transport moving mechanism 7 constitute a transport mechanism (loader) for transporting the sealed substrate W, and the second holding mechanism 6 and the transport moving mechanism 7 transport a plurality of products P.
  • a transport mechanism (unloader) is configured.
  • the directions orthogonal to each other in the plane (horizontal plane) along the upper surfaces of the cutting tables 2A and 2B are the X direction as the first direction and the Y direction as the second direction, and the X direction and the Y direction.
  • the perpendicular direction is defined as the Z direction.
  • the horizontal direction in FIG. 1 is the X direction
  • the vertical direction is the Y direction.
  • the X direction is the direction in which the support 812 moves
  • the two cutting tables 2A, 2B are fixed in the X, Y and Z directions.
  • the cutting table 2A can be rotated in the .theta. direction by a rotating mechanism 9A provided below the cutting table 2A.
  • the cutting table 2B can be rotated in the .theta. direction by a rotating mechanism 9B provided under the cutting table 2B.
  • These two cutting tables 2A and 2B are provided along the X direction on the horizontal plane. Specifically, the two cutting tables 2A and 2B are arranged such that their upper surfaces are positioned on the same horizontal plane (located at the same height in the Z direction) (see FIG. 4), and their The centers of the upper surfaces (specifically, the centers of rotation of the rotation mechanisms 9A and 9B) are arranged on the same straight line extending in the X direction (see FIGS. 2 and 3).
  • the two cutting tables 2A and 2B suck and hold the sealed substrate W, and as shown in FIG.
  • Two vacuum pumps 10A, 10B are arranged.
  • Each vacuum pump 10A, 10B is, for example, a water ring vacuum pump.
  • the pipes (not shown) connected from the vacuum pumps 10A and 10B to the cutting tables 2A and 2B can be shortened, and the pipe pressure It is possible to reduce the loss and prevent the deterioration of the adsorption force. As a result, even a very small package of, for example, 1 mm square or less can be reliably attracted to the cutting tables 2A and 2B.
  • the capacities of the vacuum pumps 10A and 10B can be reduced, leading to miniaturization and cost reduction.
  • the first holding mechanism 3 holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B.
  • the first holding mechanism 3 includes a suction head 31 provided with a plurality of suction portions 311 for sucking and holding the sealed substrate W, and a suction portion of the suction head 31. 311 connected to a vacuum pump or vacuum ejector (not shown). Then, the suction head 31 is moved to a desired position by a transfer mechanism 7 or the like, which will be described later, to transfer the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B.
  • the substrate supply mechanism 11 includes a substrate accommodating portion 11a in which a plurality of sealed substrates W are accommodated from the outside, and a first holding portion for the sealed substrates W accommodated in the substrate accommodating portion 11a. and a substrate supply part 11b for moving to a holding position RP where the mechanism 3 sucks and holds the substrate.
  • This holding position RP is set so as to be aligned with the two cutting tables 2A and 2B in the X direction.
  • the substrate supply mechanism 11 may have a heating unit 11c that presses the sealed substrate W while heating it so as to flatten the sealed substrate W that is sucked by the first holding mechanism 3 .
  • the cutting mechanism 4 as shown in FIGS. 1, 2, and 3, has two rotary tools 40, which are blades 41A, 41B and two spindles 42A, 42B.
  • the two spindle parts 42A and 42B are provided so that their rotation axes are along the Y direction, and the blades 41A and 41B attached to them are arranged so as to face each other (see FIG. 3).
  • the blade 41A of the spindle section 42A and the blade 41B of the spindle section 42B cut the sealed substrate W held on each cutting table 2A, 2B by rotating in a plane including the X direction and the Z direction. As shown in FIG.
  • the cutting apparatus 100 of the present embodiment includes a liquid supply mechanism 12 having an injection nozzle 12a for injecting cutting water (working fluid) to suppress frictional heat generated by the blades 41A and 41B. is provided.
  • This injection nozzle 12a is supported by, for example, a Z-direction moving unit 83, which will be described later.
  • the transfer table 5 of the present embodiment is a table to which a plurality of products P inspected by an inspection unit 13, which will be described later, are transferred.
  • This transfer table 5 is a so-called index table, and a plurality of products P are temporarily placed thereon before sorting the plurality of products P onto various trays 21 .
  • the transfer table 5 and the two cutting tables 2A and 2B are arranged in a line along the X direction on the horizontal plane.
  • the transfer table 5 is movable back and forth along the Y direction, and can move up to the sorting mechanism 20 .
  • a plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 according to the inspection results (good products, defective products, etc.) by the inspection unit 13 .
  • the tray storage unit 23 has three types of trays, for example, a tray 21 before storing the product P, a tray 21 storing a good product P, and a tray 21 storing a defective product P that requires rework. configured to receive a tray;
  • the inspection unit 13 is provided between the cutting tables 2A and 2B and the transfer table 5, and inspects the plurality of products P held by the second holding mechanism 6.
  • the inspection unit 13 of this embodiment has a first inspection unit 131 that inspects the mark surface of the product P and a second inspection unit 132 that inspects the mounting surface of the product P.
  • the first inspection unit 131 is an imaging camera having an optical system for inspecting the mark surface
  • the second inspection unit 132 is an imaging camera having an optical system for inspecting the mounting surface. Note that the first inspection unit 131 and the second inspection unit 132 may be shared.
  • a reversing mechanism 14 for reversing the plurality of products P is provided so that both sides of the plurality of products P can be inspected by the inspection unit 13 (see FIG. 1).
  • the reversing mechanism 14 has a holding table 141 that holds a plurality of products P, and a reversing unit 142 such as a motor that turns the holding table 141 upside down.
  • the second holding mechanism 6 When the second holding mechanism 6 holds a plurality of products P from the cutting tables 2A and 2B, the marked surfaces of the products P face downward. In this state, the mark surface of the products P is inspected by the first inspection unit 131 while the plurality of products P are being conveyed from the cutting tables 2A and 2B to the reversing mechanism 14 . After that, the multiple products P held by the second holding mechanism 6 are reversed by the reversing mechanism 14 , and then the reversing mechanism 14 moves to the position of the transfer table 5 . During this movement, the mounting surface of the product P facing downward is inspected by the second inspection unit 132 . After that, the product P is delivered to the transfer table 5 .
  • the second holding mechanism 6 holds a plurality of products P in order to convey the plurality of products P from the cutting tables 2A and 2B to the reversing mechanism 14, as shown in FIG.
  • the second holding mechanism 6 is connected to a suction head 61 provided with a plurality of suction portions 611 for sucking and holding a plurality of products P, and the suction portions 611 of the suction head 61 . and a vacuum pump or vacuum ejector (not shown). Then, the suction head 61 is moved to a desired position by a transfer mechanism 7 or the like, which will be described later, to transfer the plurality of products P from the cutting tables 2A and 2B to the holding table 141 .
  • the transportation moving mechanism 7 moves the first holding mechanism 3 between at least the substrate supply mechanism 11 and the cutting tables 2A and 2B, and moves the second holding mechanism 6 between at least the cutting tables. It is moved between 2A, 2B and the holding table 141 .
  • the transportation moving mechanism 7 extends in a straight line along the arrangement direction (X direction) of the two cutting tables 2A and 2B and the transfer table 5, and the first holding mechanism 3 and the second 2 has a common transfer shaft 71 for moving the holding mechanism 6 .
  • the transfer shaft 71 is provided within a range in which the first holding mechanism 3 can move above the substrate supply portion 11b of the substrate supply mechanism 11 and the second holding mechanism 6 can move above the transfer table 5 ( See Figure 1).
  • the first holding mechanism 3, the second holding mechanism 6, the cutting tables 2A and 2B, and the transfer table 5 are provided on the same side (front side) of the transfer shaft 71 in plan view.
  • the inspection section 13, the reversing mechanism 14, various trays 21, the tray conveying mechanism 22, the tray accommodating section 23, the first cleaning mechanism 18 and the second cleaning mechanism 19 described later, and the collection container 172 are the same with respect to the transfer shaft 71. provided on the side (front side).
  • the transporting moving mechanism 7 includes a main moving mechanism 72 that moves the first holding mechanism 3 and the second holding mechanism 6 in the X direction along the transfer shaft 71; A vertical movement mechanism 73 for vertically moving the first holding mechanism 3 and the second holding mechanism 6 with respect to the transfer shaft 71 in the Z direction, and a vertical movement mechanism 73 for vertically moving the first holding mechanism 3 and the second holding mechanism 6 with respect to the transfer shaft 71 in the Y direction. and a horizontal movement mechanism 74 for horizontal movement.
  • the main moving mechanism 72 is provided on the transfer shaft 71 and has a common guide rail 721 for guiding the first holding mechanism 3 and the second holding mechanism 6. and a rack-and-pinion mechanism 722 for moving the first holding mechanism 3 and the second holding mechanism 6 .
  • the guide rail 721 extends straight in the X direction along the transfer shaft 71, and, like the transfer shaft 71, allows the first holding mechanism 3 to move above the substrate supply portion 11b of the substrate supply mechanism 11, 2 A holding mechanism 6 is provided within a range in which it can move above the transfer table 5 .
  • the guide rail 721 is slidably provided with a slide member 723 on which the first holding mechanism 3 and the second holding mechanism 6 are provided via a vertical movement mechanism 73 and a horizontal movement mechanism 74 .
  • the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6, but the vertical movement mechanism 73, the horizontal movement mechanism 74 and the slide member 723 are common to the first holding mechanism 3 and the second holding mechanism 6. provided separately for each.
  • the rack and pinion mechanism 722 includes a cam rack 722a common to the first holding mechanism 3 and the second holding mechanism 6, and a pinion provided in each of the first holding mechanism 3 and the second holding mechanism 6 and rotated by an actuator (not shown). and a gear 722b.
  • the cam rack 722a is provided on the common transfer shaft 71 and can be varied in length by connecting a plurality of cam rack elements.
  • the pinion gear 722b is provided on the slide member 723 and is called a so-called roller pinion. As shown in FIG. It has a plurality of roller pins 722b2 which are provided at equal intervals in the circumferential direction between the roller bodies 722b1 and are provided so as to be able to roll with respect to the roller body 722b1.
  • the rack-and-pinion mechanism 722 of this embodiment uses the roller pinions described above, two or more roller pins 722b2 come into contact with the cam rack 722a. Positioning accuracy is improved when moving the first holding mechanism 3 and the second holding mechanism 6 in the X direction.
  • the lifting mechanism 73 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6.
  • the lifting mechanism 73 of the first holding mechanism 3 is interposed between the transfer shaft 71 (specifically, the main moving mechanism 72) and the first holding mechanism 3, as shown in FIGS. It has a Z-direction guide rail 73a provided along the Z-direction, and an actuator portion 73b for moving the first holding mechanism 3 along the Z-direction guide rail 73a.
  • the actuator section 73b may use, for example, a ball screw mechanism, an air cylinder, or a linear motor.
  • the configuration of the up-and-down movement mechanism 73 of the second holding mechanism 6 is the same as that of the up-and-down movement mechanism 73 of the first holding mechanism 3, as shown in FIG.
  • the horizontal movement mechanism 74 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6, as shown in FIGS.
  • the horizontal movement mechanism 74 of the first holding mechanism 3 is interposed between the transfer shaft 71 (specifically, the vertical movement mechanism 73) and the first holding mechanism 3, as shown in FIGS. Y-direction guide rails 74a provided along the Y-direction, elastic bodies 74b for applying force to the first holding mechanism 3 on one side of the Y-direction guide rails 74a, and the first holding mechanism 3. and a cam mechanism 74c for moving to the other side of the Y-direction guide rail 74a.
  • the cam mechanism 74c uses an eccentric cam, and the amount of movement of the first holding mechanism 3 in the Y direction can be adjusted by rotating the eccentric cam with an actuator such as a motor.
  • the configuration of the horizontal movement mechanism 74 of the second holding mechanism 6 is the same as that of the vertical movement mechanism 73 of the first holding mechanism 3, as shown in FIG. Further, the second holding mechanism 6 may be configured without the horizontal movement mechanism 74 , or both the first holding mechanism 3 and the second holding mechanism 6 may be configured without the horizontal movement mechanism 74 . Further, the horizontal movement mechanism 74 may use, for example, a ball screw mechanism or an air cylinder without using the cam mechanism 74c, like the elevation movement mechanism 73. Alternatively, a linear motor may be used.
  • the cutting movement mechanism 8 linearly moves each of the two spindles 42A and 42B in the X, Y and Z directions.
  • the cutting movement mechanism 8 includes an X-direction movement unit 81 that linearly moves the spindles 42A and 42B in the X direction, and a linear movement of the spindles 42A and 42B in the Y direction. and a Z-direction moving portion 83 for linearly moving the spindle portions 42A and 42B in the Z-direction.
  • the X-direction moving part 81 is common to the two cutting tables 2A and 2B, and is provided along the X direction with the two cutting tables 2A and 2B interposed therebetween, as particularly shown in FIGS. a pair of X-direction guide rails 811, and a support body that moves along the pair of X-direction guide rails 811 and supports the spindles 42A and 42B via the Y-direction moving portion 82 and the Z-direction moving portion 83. 812.
  • a pair of X-direction guide rails 811 are provided on the sides of the two cutting tables 2A and 2B provided along the X-direction.
  • the support 812 is, for example, a portal type and has a shape extending in the Y direction. Specifically, the support 812 has a pair of legs extending upward from the pair of X-direction guide rails 811 and beams (beams) bridging the pair of legs. extending in the direction
  • the support 812 is linearly reciprocated along the X direction on a pair of X direction guide rails 811 by, for example, a ball screw mechanism 813 extending in the X direction.
  • the ball screw mechanism 813 is driven by a drive source (not shown) such as a servomotor.
  • the support 812 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
  • the Y-direction moving part 82 includes a Y-direction guide rail 821 provided along the Y direction on the support 812, and a Y-direction slider 822 that moves along the Y-direction guide rail 821. have.
  • the Y-direction slider 822 is driven by, for example, a linear motor 823 and linearly reciprocates on the Y-direction guide rail 821 .
  • two Y-direction sliders 822 are provided corresponding to the two spindle portions 42A and 42B. Thereby, the two spindle parts 42A and 42B are movable in the Y direction independently of each other.
  • the Y-direction slider 822 may be configured to reciprocate by another direct acting mechanism using a ball screw mechanism.
  • the Z-direction moving part 83 moves along a Z-direction guide rail 831 provided along the Z-direction on each Y-direction slider 822 and moves along the Z-direction guide rail 831. and a Z-direction slider 832 that supports the spindle portions 42A and 42B. That is, the Z-direction moving portion 83 is provided corresponding to each spindle portion 42A, 42B.
  • the Z-direction slider 832 is driven by, for example, an eccentric cam mechanism (not shown), and linearly reciprocates on the Z-direction guide rail 831 .
  • the Z-direction slider 832 may be configured to reciprocate by another direct acting mechanism such as a ball screw mechanism.
  • the positional relationship between the moving mechanism 8 for cutting and the transfer shaft 71 is such that the transfer shaft 71 is arranged above the moving mechanism 8 for cutting so as to cross the moving mechanism 8 for cutting. ing. Specifically, the transfer shaft 71 is arranged above the support 812 so as to cross the support 812 , and the transfer shaft 71 and the support 812 have a positional relationship of crossing each other.
  • the cutting apparatus 100 of the present embodiment further includes a processing waste storage section 17 that stores processing waste S such as offcuts generated by cutting the sealed substrate W, as shown in FIG.
  • the processing waste container 17 is provided below the cutting tables 2A and 2B, and is a guide chute having an upper opening 171X surrounding the cutting tables 2A and 2B in plan view. 171 and a collection container 172 for collecting the processing waste S guided by the guide shooter 171 .
  • the recovery rate of the processing waste S can be improved.
  • the guide shooter 171 guides the processing waste S scattered or dropped from the cutting tables 2A, 2B to the collection container 172.
  • the upper opening 171X of the guide shooter 171 surrounds the cutting tables 2A and 2B (see FIG. 3)
  • it is difficult to remove the processing waste S, and the collection rate of the processing waste S is further improved. can be improved.
  • the guide shooter 171 is provided so as to surround the rotating mechanisms 9A and 9B provided under the cutting tables 2A and 2B (see FIG. 4). is configured to protect
  • the processing waste container 17 is shared by the two cutting tables 2A and 2B, but may be provided for each of the cutting tables 2A and 2B.
  • the collection container 172 is for collecting the processing waste S that has passed through the guide shooter 171 by its own weight.
  • the two collection containers 172 are arranged on the front side of the transfer shaft, and configured to be independently removable from the front side of the cutting device 100 . With this configuration, it is possible to improve maintainability such as disposal of the processing waste S. Considering the size of the sealed substrate W, the size and amount of the processing waste S, the workability, etc., one collection container 172 may be provided under the entire cutting table, or three collection containers may be provided. You may divide
  • the processing waste storage section 17 has a separating section 173 for separating cutting water and processing waste.
  • a filter such as a perforated plate that allows cutting water to pass through the bottom surface of the collection container 172 may be provided.
  • the separation unit 173 allows the processing waste S to be collected without accumulating cutting water in the collection container 172 .
  • the cutting apparatus 100 of the present embodiment includes a first cleaning mechanism 18 that cleans the upper surface side (mounting surface) of the plurality of products P held by the cutting tables 2A and 2B. is further provided.
  • the first cleaning mechanism 18 cleans the upper surfaces of the products P (see FIG. 5) by spray nozzles 18a (see FIG. 5) for spraying cleaning liquid and/or compressed air onto the upper surfaces of the plurality of products P held on the cutting tables 2A and 2B. mounting surface).
  • the first cleaning mechanism 18 is configured to be movable along the transfer shaft 71 together with the first holding mechanism 3, as shown in FIG.
  • the first cleaning mechanism 18 is provided on a slide member 723 that slides on a guide rail 721 provided on the transfer shaft 71 .
  • an elevation movement mechanism 181 for vertically moving the first cleaning mechanism 18 in the Z direction.
  • the lifting mechanism 181 may be, for example, one using a rack and pinion mechanism, one using a ball screw mechanism, or one using an air cylinder.
  • the cutting apparatus 100 of the present invention further includes a second cleaning mechanism 19 that cleans the lower surface side (mark surface) of the plurality of products P held by the second holding mechanism 6, as shown in FIG. .
  • the second cleaning mechanism 19 is provided between the cutting table 2B and the inspection section 13, and sprays cleaning liquid and/or compressed air onto the lower surfaces of the plurality of products P held by the second holding mechanism 6. By doing so, the lower surface side (mark surface) of the product P is cleaned. That is, while the second holding mechanism 6 is being moved along the transfer shaft 71, the second cleaning mechanism 19 cleans the lower surface side (mark surface) of the product P. As shown in FIG.
  • FIG. 9 shows the moving path of the first holding mechanism 3 and the moving path of the second holding mechanism 6 in the operation of the cutting device 10.
  • all the operations of the cutting apparatus 100 such as transportation of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, replacement of the holding plate M1 described later, and the like. Control is performed by the control unit CTL (see FIG. 1).
  • the substrate supply unit 11b of the substrate supply mechanism 11 moves the sealed substrate W accommodated in the substrate accommodation unit 11a toward the holding position RP held by the first holding mechanism 3.
  • the transport moving mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 holds the sealed substrate W by suction.
  • the transfer moving mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting tables 2A and 2B, and the first holding mechanism 3 releases the suction holding, and the sealed substrate W is released.
  • a substrate W is placed on the cutting tables 2A and 2B.
  • the main moving mechanism 72 adjusts the position of the sealed substrate W in the X direction
  • the horizontal moving mechanism 74 adjusts the position of the sealed substrate W in the Y direction.
  • the cutting tables 2A and 2B hold the sealed substrate W by suction.
  • the elevation movement mechanism 73 moves the first holding mechanism 3 to the cutting movement mechanism 8 (support body 812). Raise to a position where there is no physical interference.
  • the support body 812 is retracted from the cutting table 2B to the transfer table 5 side. It is not necessary to raise and lower the first holding mechanism 3 at this time.
  • the cutting movement mechanism 8 sequentially moves the two spindles 42A and 42B in the X direction and the Y direction, and the cutting tables 2A and 2B rotate to form the sealed substrate W in a grid pattern. Cut and individualize.
  • the transfer mechanism 7 moves the first cleaning mechanism 18 to clean the upper surface side (mounting surface) of the multiple products P held on the cutting tables 2A and 2B. After this cleaning, the transfer mechanism 7 retracts the first holding mechanism 3 and the first cleaning mechanism 18 to predetermined positions.
  • the transfer movement mechanism 7 moves the second holding mechanism 6 to the cutting tables 2A and 2B after cutting, and the second holding mechanism 6 holds the plurality of products P by suction.
  • the transport moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the second cleaning mechanism 19 .
  • the second cleaning mechanism 19 cleans the lower surfaces (marked surfaces) of the plurality of products P held by the second holding mechanism 6 .
  • the plurality of products P held by the second holding mechanism 6 are inspected on the lower surface side (marked surface) by the inspection unit 131, and then transferred to the reversing mechanism 14, where the marks are processed by the reversing mechanism 14. After the face is sucked and held, it is inverted. After the reversal, the reversing mechanism 14 is moved, and the mounting surface of the product P is inspected by the inspection section 132 . After being inspected on both sides in this manner, the product P is transferred from the reversing mechanism 14 to the transfer table 5 . A plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 according to the inspection results (good products, defective products, etc.) by the inspection unit 13 .
  • the cutting apparatus 100 of this embodiment has a function of automatically exchanging the holding plate M1 for holding the sealed substrate W or the product P.
  • FIG. 1 ⁇ Automatic Exchange Function of Holding Plate M1> Furthermore, the cutting apparatus 100 of this embodiment has a function of automatically exchanging the holding plate M1 for holding the sealed substrate W or the product P.
  • cutting tables 2A and 2B for cutting the sealed substrate W an inspection table (holding table 141) for inspecting the product P, and the product P before sorting.
  • the transfer table 5 to be placed on the substrate and the holding mechanism for carrying (the second holding mechanism 6) for carrying the product P are exchangeable, and the holding plate M1 is detachable. and a holding base portion M2 that holds the sealed substrate W or product P using a holding plate M1.
  • FIG. 10 shows the holding plates M1 and holding base portions M2 of the cutting tables 2A and 2B as representatives, the holding table 141, the transfer table 5 and the second holding mechanism 6 also have holding plates.
  • the configuration with M1 and holding base M2 is the same.
  • the cutting device 100 conveys the plate accommodating portion 24 that accommodates the holding plate M1 and the holding plate M1 between the plate accommodating portion 24 and the holding base portion M2.
  • a plate transport mechanism 25 is provided.
  • the holding plate M1 is formed with a suction portion (suction hole) (not shown) for sucking the sealed substrate W or the product P, and is mounted on the holding base portion M2 by being attached to the holding base portion M2.
  • the sealed substrate W or the product P is sucked through the suction channel M21 (see FIG. 10).
  • the holding plate M1 is used for the cutting tables 2A and 2B, the holding table 141, the transfer table 5, and the second holding mechanism 6.
  • the configuration of the adsorption section is different.
  • the holding plate M1 is used for the cutting tables 2A and 2B, the holding table 141, the transfer table 5, and the second holding mechanism 6.
  • the configuration of the adsorption unit may be shared and made the same.
  • the various holding plates M1 have different shapes, configurations of suction portions, etc. for each sealed substrate W or product P, and are selected according to the sealed substrate W or product P.
  • the cutting device 100 is provided with a fixing mechanism 26 for detachably attaching the holding plate M1 to the holding base portion M2.
  • the fixing mechanism 26 includes a fixing insertion hole 261 formed in the holding plate M1 and a fixing insertion hole 261 provided in the holding base portion M2 and inserted into the fixing insertion hole 261 formed in the holding plate M1. It has a cylinder portion 262 .
  • the fixing cylinder part 262 is a so-called chuck cylinder, and as shown in FIG. It has a spherical mover 262b that is movably provided at a position where it is positioned at the position where it is positioned, and an elastic body 262c that applies a force to the mover 262b so that the mover 262b protrudes from the cylinder body 262a.
  • the mover 262b is configured to be switched between the protruded position (FIG. 12(a)) and the retracted position (FIG. 12(b)).
  • the fixing cylinder portion 262 has a piston portion 262d.
  • the piston part 262d is interposed between the movable element 262b and the elastic body 262c inside the cylinder main body 262a, and moves inside the cylinder main body 262a by means of compressed air, thereby protruding and retracting the movable element 262b. Switch between positions.
  • the piston portion 262d moves inside the cylinder body 262a against the force received from the elastic body 262c, and moves the mover 262b to the retracted position (FIG. 12(b)).
  • the force received from the elastic body 262c moves inside the cylinder body 262a to move the mover 262b to the projecting position (FIG. 12(a)).
  • the fixing insertion hole 261 formed in the holding plate M1 is in a state in which the fixing cylinder portion 262 is inserted, and when the mover 262b is at a protruded position, It has a convex portion 261a that catches the mover 262b and prevents the fixing cylinder portion 262 from coming off.
  • the protruding portion 261a catches the mover 262b at the projected position, but does not catch the mover 262b at the retracted position. Therefore, when the fixing cylinder portion 262 is inserted into the fixing insertion hole 261, the holding plate M1 is fixed to the holding base portion M2 by setting the mover 262b to a protruding position (Fig. 12(a)).
  • the plate accommodating portion 24 accommodates the holding plates M1 before and after replacement (before and after use), and as shown in FIG. 11, has a slide shelf portion 241 on which each holding plate M1 is placed.
  • the slide racks 241 on the upper side accommodate new holding plates M1 before replacement
  • the slide shelves 241 on the lower side accommodate old holding plates M1 after replacement. and For example, by sliding the target slide shelf 241 forward by the plate transport mechanism 25, the used old holding plate M1 is placed on the slide shelf 241, or , a new holding plate M1 before use is taken out.
  • a hook portion 241a is provided on the front side portion of the slide shelf portion 241, and the slide shelf portion 241 is pulled out using the hook portion 241a.
  • the plate conveying mechanism 25 conveys the holding plate M1 removed from the holding base portion M2 to the plate accommodating portion 24, and conveys the holding plate M1 in the plate accommodating portion 24 to the holding base portion M2. Further, the plate transport mechanism 25 can lift and transport the holding plate M1. More specifically, the plate transport mechanism 25 can transport the holding plate M1 in the horizontal direction at the elevated position where the holding plate M1 is held and raised from above.
  • the "up position” means that the holding plate M1 is raised from the position of the holding plate M1 attached to the holding base portion M2 to be replaced or from the lowest position of the holding plate M1 that can be taken during transportation. It means the position of the height where the
  • the plate conveying mechanism 25 includes a first conveying mechanism 25a for conveying the holding plate M1 between the plate accommodating portion 24 and the temporary placing portion 27, the temporary placing portion 27 and the holding base. and a second transport mechanism 25b that transports the holding plate M1 to and from the portion M2.
  • the temporary placement section 27 of this embodiment is the holding table 141 of the reversing mechanism 14 .
  • the transfer table 5 may be used as the temporary placement section 27 , or the temporary placement section 27 may be provided separately from the holding table 141 and the transfer table 5 .
  • the first transport mechanism 25a is configured using the tray transport mechanism 22, and is capable of transporting the tray 21 for sorting the workpieces W (products P) after processing.
  • the second transport mechanism 25b is configured using the second holding mechanism 6 and the transport moving mechanism 7 (workpiece transport mechanism), and can transport the workpiece W.
  • the plate transport mechanism 25 (the first transport mechanism 25a and the second transport mechanism 25b) is configured to move in the X direction by the common transfer shaft 71 described above. Also, the plate transport mechanism 25 is provided on the same side (front side) of the transfer shaft 71 in plan view.
  • the tray transport mechanism 22 which is the first transport mechanism 25a, as shown in FIG.
  • it has a plate holding portion 221b such as a holding claw for holding the holding plate M1.
  • tray holding portions 221a are provided on a pair of opposing sides facing each other, and plate holding portions 221b are provided on a different pair of opposing sides.
  • the plate holding portion 221b may be configured using the above-described catch cylinder.
  • the tray transport mechanism 22 is configured such that the plate holding portion 221b can be moved up and down, and can transport the holding plate M1 in a state in which the plate holding portion 221b holding the holding plate M1 is raised to the raised position. can.
  • the tray transport mechanism 22 has the same configuration as the transport moving mechanism 7 of the first holding mechanism 3 and the second holding mechanism 6 . That is, as shown in FIG. 11, the tray transport mechanism 22 includes the above-described main moving mechanism 72 that moves the tray holding mechanism in the X direction along the transfer shaft 71, and the tray holding mechanism 221 that moves in the Z direction with respect to the transfer shaft 71. and a horizontal movement mechanism 76 for horizontally moving the tray holding mechanism 221 in the Y direction with respect to the transfer shaft 71 .
  • the vertical movement mechanism 75 and the horizontal movement mechanism 76 are linear motion mechanisms such as those using a rack and pinion mechanism, a ball screw mechanism, a linear motor, or an air cylinder. configured to move back and forth.
  • the second holding mechanism 6 serving as the second conveying mechanism 25b includes a conveying cylinder portion 282 inserted into a conveying holding hole 281 (see FIG. 10) formed in the holding plate M1.
  • the fixing cylinder portion 262 of the holding base portion M2 of the second holding mechanism 6 is used to configure the transfer cylinder portion 282 .
  • the transport holding hole 281 has the same configuration as the fixing insertion hole 261 of the fixing mechanism 26 described above. Note that the holding hole 281 for transportation and the insertion hole 261 for fixing are arranged upside down.
  • the second holding mechanism 6 may use holding claws that are hooked on the edge of the holding plate M1 to hold it, instead of the conveying cylinder portion 282 .
  • the second holding mechanism 6 is configured such that the portion holding the holding plate M1 can be moved up and down, and the holding plate M1 can be transported in a state in which the portion holding the holding plate M1 is raised to the raised position. can.
  • the cutting device 100 of this embodiment further includes an inspection mechanism 29 that inspects the attachment state of the holding plate M1 to the holding base portion M2.
  • the inspection mechanism 29 includes an inspection channel 29a that opens onto the mounting surface M22 on which the holding plate M1 is mounted, and a detection sensor (not shown) that is provided in the inspection channel 29a and detects fluid leakage from the opening. ).
  • the inspection channel 29a has an opening formed in the mounting surface M22 of the holding base portion M2, and is supplied with compressed air.
  • the detection sensor detects the leakage of compressed air from the opening by detecting the pressure or flow rate of the compressed air flowing through the inspection flow path 29a.
  • the holding plate M1 is identified when the holding plate M1 is taken out from the plate accommodating portion 24 by using an identifier such as an RFID provided on the holding plate M1 in the first transport mechanism 25a (tray It is read by an identifier reader (not shown) provided in the transport mechanism 22).
  • an identifier such as an RFID provided on the holding plate M1 in the first transport mechanism 25a (tray It is read by an identifier reader (not shown) provided in the transport mechanism 22).
  • the holding plate M1 of the holding table 141 is removed, and the holding plate M1 is lifted by the first transport mechanism 25a (tray transport mechanism 22) and transported to the plate accommodating section 24 in the raised position.
  • first transport mechanism 25a tunnel transport mechanism 22
  • compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the recessed position, thereby releasing the fixation of the fixing mechanism 26.
  • the first conveying mechanism 25a (tray conveying mechanism 22) takes out the new holding plate M1 of the holding table 141 from the plate accommodating portion 24 and conveys it to the holding base portion M2 of the holding table 141 in the state of the raised position,
  • the holding plate M1 is lowered and placed.
  • the holding plate M1 descends and the fixing cylinder portion 262 moves into the fixing insertion hole 261 of the holding plate M1.
  • the mover 262b is at a protruded position, and the holding plate M1 is fixed to the holding base portion M2 of the holding table 141. As shown in FIG.
  • the holding plate M1 of the transfer table 5 is removed, and the holding plate M1 is lifted by the first transport mechanism 25a (tray transport mechanism 22) and transported to the plate accommodating section 24 in the raised position.
  • first transport mechanism 25a tunnel transport mechanism 22
  • compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the retracted position, thereby releasing the fixation of the fixing mechanism 26.
  • the first transport mechanism 25a takes out the new holding plate M1 of the transfer table 5 from the plate accommodating part 24 and transports it to the holding base part M2 of the transfer table 5 in the state of being in the raised position. Then, the holding plate M1 is lowered and placed. In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the holding plate M1 descends and the fixing cylinder portion 262 moves into the fixing insertion hole 261 of the holding plate M1. After that, when the supply of compressed air is stopped, the mover 262b is at a protruded position, and the holding plate M1 is fixed to the holding base portion M2 of the transfer table 5. As shown in FIG.
  • the order of replacement of the holding plate M1 of the holding table 141 and replacement of the holding plate M1 of the transfer table 5 is not limited to the above.
  • a new holding plate M1 may be attached to each of the holding table 141 and the transfer table 5 after removing the holding plate M1.
  • the holding plates M1 of the cutting tables 2A and 2B are removed, and the holding plates M1 are lifted by the second conveying mechanism 25b (the conveying moving mechanism 7 and the second holding mechanism 6) to the elevated position. 27, and the holding plate M1 is lowered and placed thereon.
  • the holding plates M1 of the cutting tables 2A and 2B are removed, compressed air is supplied to the fixing cylinder portion 262 so that the mover 262b is retracted to release the fixation of the fixing mechanism 26.
  • the holding table 141 is used as the temporary placement unit 27, it is desirable to remove the holding table 141 in advance.
  • the first transport mechanism 25a (tray transport mechanism 22) lifts the holding plates M1 of the cutting tables 2A and 2B placed on the holding table 141 and transports them to the plate accommodating section 24 in the raised position. Then, the holding plate M1 is lowered and accommodated.
  • the first conveying mechanism 25a (tray conveying mechanism 22) takes out the new holding plates M1 of the cutting tables 2A and 2B from the plate accommodating portion 24, and the holding table serving as the temporary placing portion 27 is moved to the raised position. 141, and the holding plate M1 is lowered and placed thereon.
  • the second transport mechanism 25b moves the new holding plate M1 placed on the holding table 141 to the holding base portion M2 of the cutting tables 2A and 2B at the raised position.
  • the holding plate M1 is lowered and placed thereon.
  • the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied.
  • the mover 262b is at the projecting position, and the holding plate M1 is fixed to the holding base portion M2 of the cutting tables 2A and 2B.
  • the transport moving mechanism 7 moves the second holding mechanism 6 to the holding table 141, which is the temporary placement unit 27, and lowers the holding plate M1. , and the holding plate M1 is placed on the holding table 141, which is the temporary placement unit 27. As shown in FIG. When removing the holding plate M1 of the second holding mechanism 6, compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the recessed position, thereby releasing the fixing of the fixing mechanism 26.
  • the first conveying mechanism 25a (tray conveying mechanism 22) raises the holding plate M1 of the second holding mechanism 6 placed on the holding table 141 and conveys it to the plate accommodating section 24 in a raised position. , the holding plate M1 is lowered and accommodated.
  • the holding table 141 is used as the temporary placement unit 27, it is desirable to remove the holding plate M1 of the holding table 141 in advance.
  • the first conveying mechanism 25a (tray conveying mechanism 22) takes out the new holding plate M1 of the second holding mechanism 6 from the plate accommodating portion 24 and places it on the holding table 141, which is the temporary placing portion 27, in a raised position. Then, the holding plate M1 is lowered and placed.
  • the second holding mechanism 6 is moved to the holding table 141 by the transfer moving mechanism 7, the holding base portion M2 is lowered, and the new holding plate M1 placed on the holding table 141 is attached.
  • the fixing cylinder portion 262 provided in the holding base portion M2 of the second holding mechanism 6 is inserted into the fixing insertion hole 261 formed in the holding plate M1 by the transportation moving mechanism 7 .
  • the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied.
  • the mover 262b is at a projected position, and the holding plate M1 is fixed to the holding base portion M2 of the second holding mechanism 6. As shown in FIG.
  • replacement of the transfer table 5, the holding table 141, the cutting tables 2A and 2B, and the holding plate M1 of the second holding mechanism 6 may be performed as a series of operations.
  • the transfer table 5, the holding table 141, the second holding mechanism 6, and the holding plates M1 of the cutting tables 2A and 2B are removed in this order, and then the cutting tables 2A and 2B, the second holding mechanism 6, and the holding table are removed.
  • 141 and the holding plate M1 of the transfer table 5 may be attached in this order.
  • the holding plate M1 removed from the holding base portion M2 is conveyed to the plate accommodating portion 24, and the holding plate M1 in the plate accommodating portion 24 is conveyed to the holding base portion M2. Since the plate conveying mechanism 25 is provided, the holding plate M1 can be automatically exchanged with respect to the holding base portion M2. As a result, labor costs for exchanging the holding plate M1 can be reduced. In addition, since the holding plate M1 is automatically replaced, the replacement time of the holding plate M1 can be shortened, and the productivity of the cutting apparatus 100 can be improved. Furthermore, it is possible to reduce variations in the mounting state of the holding plate M1 with respect to the holding base portion M2.
  • the plate transport mechanism 25 includes a first transport mechanism 25a that transports the holding plate M1 between the plate accommodating portion 24 and the temporary placement portion 27, and a holding mechanism between the temporary placement portion 27 and the holding base portion M2. Since it has the second transport mechanism 25b for transporting the plate M1, the degree of freedom of the transport destination of the holding plate M1 can be increased compared to the case where the plate transport mechanism 25 is composed of one transport mechanism.
  • the first transport mechanism 25a is configured using the tray transport mechanism 22, the device configuration can be simplified and the device cost can be reduced.
  • the second transport mechanism 25b is configured using the second holding mechanism 6 and the transport moving mechanism 7, the device configuration can be simplified and the device cost can be reduced.
  • the first holding mechanism 3 and the second holding mechanism 6 are moved by a common transfer shaft 71 extending along the arrangement direction of the cutting tables 2A and 2B and the transfer table 5. Since the cutting mechanism 4 is moved in the horizontal plane by the moving mechanism 8 in the X direction along the transfer shaft 71 and in the Y direction orthogonal to the X direction, the cutting tables 2A and 2B are not moved in the X direction and the Y direction.
  • the sealed substrate W can be processed. Therefore, the bellows member for protecting the ball screw mechanism and the cover member for protecting the bellows member can be eliminated without moving the cutting tables 2A and 2B by the ball screw mechanism.
  • the configuration of the cutting device 100 can be simplified.
  • the cutting tables 2A and 2B can be configured so as not to move in the X and Y directions, and the footprint of the cutting device 100 can be reduced.
  • the holding plates M1 of the cutting tables 2A and 2B, the inspection table (holding table 141), the transfer table 5, and the carrying mechanism (second holding mechanism 6) are Although it was configured to be replaced automatically, at least one of the cutting tables 2A and 2B, the inspection table (holding table 141), the transfer table 5, and the holding mechanism for transportation (second holding mechanism 6) It is good also as a structure which exchanges automatically.
  • the plate conveying mechanism 25 of the first embodiment has the first conveying mechanism 25a and the second conveying mechanism 25b, it may have a single conveying mechanism. Further, the plate transport mechanism 25 may be configured without the tray transport mechanism 22, or may be configured without the second holding mechanism 6 and transport moving mechanism 7 (processing object transport mechanism).
  • This cutting apparatus 100 does not have a tray transport mechanism 22, and various trays 21 are moved below the plate accommodating section 24 by the tray moving mechanism TM, thereby sorting the products P by the sorting mechanism 20.
  • the tray moving mechanism TM includes a transport rail TM1 extending along the Y direction, a moving mechanism (not shown) for moving the tray 21 on the transport rail TM1, and a moving mechanism TM2 for moving the various trays 21 in the X direction. and a moving mechanism TM3 that is provided for each tray 21 and moves each tray 21 in the Z direction.
  • the plate transport mechanism 25 can be configured using the second holding mechanism 6 and transport moving mechanism 7 .
  • the plate accommodating portion 24 of the first embodiment includes the cutting tables 2A and 2B, the inspection table (holding table 141), the transfer table 5, and the conveying holding mechanism (second holding mechanism 6).
  • the holding plate M1 is accommodated, a plurality of dedicated plate accommodating portions 24 may be provided according to the type of the holding plate M1.
  • the transfer table 5 of the first embodiment is an index table that is temporarily placed before sorting into the various trays 21, but the transfer table 5 may be used as the holding table 141 of the reversing mechanism 14. .
  • the grooves may be formed without cutting the sealed substrate on the cutting tables 2A and 2B.
  • the sealed substrate W grooved by the cutting tables 2A and 2B may be returned to the substrate supply section 11b by the first holding mechanism 3 and the transfer movement mechanism 7.
  • the sealed substrate W returned to the substrate supply section 11b may be accommodated in the substrate accommodation section 11a.
  • the cutting apparatus 100 of the second embodiment can store a plurality of products P by attaching them to the sticking member 101 having an adhesive surface 101x (also called "ring storage"), unlike the tray storage of the first embodiment. is configured as
  • the cutting apparatus 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W, and cutting tables 2A and 2B that hold the sealed substrate W.
  • a first holding mechanism 3 for holding the sealed substrate W for transporting to the substrate
  • a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting tables 2A and 2B, and a plurality of products
  • a transfer table 5 to which P is transferred a second holding mechanism 6 for holding a plurality of products P to transfer the plurality of products P from the cutting tables 2A and 2B to the transfer table 5, and a first holding mechanism 3. and a transfer movement mechanism 7 having a common transfer shaft 71 for moving the second holding mechanism 6, and a cutting mechanism 4 for moving the sealed substrate W held on the cutting tables 2A and 2B.
  • a moving mechanism for processing (moving mechanism for processing) 8 .
  • a plurality of products P are temporarily placed on the transfer table 5 of the second embodiment before the plurality of products P are attached to an attaching member 101, which will be described later. 17 and 18, the transfer table 5 is provided movably along the Y direction, and is positioned at a transfer position X1 where a plurality of products P are placed by the second holding mechanism 6. , and a pick-up position X2 where a plurality of products P are conveyed by the pasting conveying mechanism 103 .
  • the transfer position X1 is set on the front side of the transfer shaft 71, and is a position where the two cutting tables 2A and 2B are arranged in a line along the X direction on the horizontal plane. is set on the back side of the transfer shaft 71 .
  • the transfer shaft 71 of the transfer mechanism 7 allows the first holding mechanism 3 to move above the substrate supply portion 11b of the substrate supply mechanism 11 and the second holding mechanism 6 to move above the transfer table 5.
  • the pasting member transport mechanism 107 which will be described later, extends in a range in which it can move between the pasting member transport position X ⁇ b>3 and the guide rail 108 .
  • a mounting table 102 , an application member storage section 106 and an application member conveying mechanism 107 which will be described later, are also provided on the same side (front side) of the transfer shaft 71 with respect to the transfer shaft 71 .
  • the cutting device 100 of the second embodiment includes a mounting table 102 on which a sticking member 101 having an adhesive surface 101x to which a plurality of products P are to be stuck is placed, and a plurality of a pasting conveying mechanism 103 for conveying the product P from the transfer table 5 to the pasting member 101 placed on the placing table 102 .
  • two mounting tables 102 are provided along the X direction (see FIG. 17), and the sticking member 101 is mounted on each mounting table 102 .
  • the two mounting tables 102 are arranged such that their upper surfaces are located on the same horizontal plane (located at the same height in the Z direction).
  • the two mounting tables 102 are provided movably along the Y direction, and are positioned at a pasting member transfer position where the pasting member conveying mechanism 107 transfers the pasting member 101. It moves between X3 and a sticking position X4 where a plurality of products P are transported by the transport mechanism 103 for sticking.
  • the two mounting tables 102 move independently of each other between the attaching member conveying position X3 and the attaching position X4.
  • the pasting member conveying position X3 is set on the front side of the transfer shaft 71, and the pasting position X4 is set on the far side of the transfer shaft 71.
  • the mounting table 102 at the sticking position X4 and the transfer table 5 at the take-out position X2 are arranged along the X direction (see FIG. 17).
  • the sticking member 101 includes, for example, an annular or rectangular frame-shaped member 101a and a resin sheet 101b having an adhesive surface 101x disposed inside the frame-shaped member 101a.
  • the frame member 101a is made of metal such as stainless steel.
  • the resin sheet 101b includes, for example, a sheet-like base material 101b1 made of resin and an adhesive layer (adhesive layer) 101b2 made of an adhesive applied to the upper surface of the sheet-like base material 101b1.
  • the upper surface of the adhesive layer (adhesive layer) 101b2 is the adhesive surface 101x.
  • the pasting conveying mechanism 103 conveys a plurality of products P from the transfer table 5 moved to the take-out position X2 to the pasting member 101 placed on the placing table 102 moved to the pasting position X4.
  • the pasting conveying mechanism 103 includes a product suction mechanism 1031 for sucking a plurality of products P held on the transfer table 5, for example, in each row, and the product suction mechanism 1031. and a moving mechanism 1032 for adsorption that moves 1031 along the X direction.
  • a product suction mechanism 1031 for sucking a plurality of products P held on the transfer table 5, for example, in each row
  • the product suction mechanism 1031 for example, in each row
  • a moving mechanism 1032 for adsorption that moves 1031 along the X direction.
  • two pasting conveying mechanisms 103 are provided, and the respective pasting conveying mechanisms 103 are configured to be driven independently of each other.
  • the product suction mechanism 1031 is connected to a suction head 1031A provided with a plurality of suction portions 1031a for individually sucking and holding a plurality of products P, and the suction portion 1031a of the suction head 1031A. and a vacuum pump or vacuum ejector (not shown).
  • the product adsorption mechanism 1031 is configured such that each adsorption portion 1031a adsorbs one product P.
  • the plurality of suction portions 1031a are configured to be able to move up and down independently of each other, and each suction portion 1031a descends to individually suck the product P. As shown in FIG.
  • the suction moving mechanism 1032 includes an X-direction moving portion 1032a for moving the product suction mechanism 1031 in the X direction and a Z-direction moving portion 1032b for moving the product suction mechanism 1031 in the Z direction.
  • the suction moving mechanism 1032 may have a Y-direction moving unit that moves the product suction mechanism 1031 in the Y direction.
  • the X-direction moving portion 1032a moves along an X-direction guide rail 1032a1 provided along the X direction on the far side of the transfer shaft 71, and along the X-direction guide rail 1032a1, moves through the Z-direction moving portion 1032b. and a support 1032 a 2 that supports the product suction mechanism 1031 .
  • the support 1032a2 is linearly reciprocated along the X direction on the X direction guide rail 1032a1 by, for example, a ball screw mechanism (not shown) extending in the X direction. This ball screw mechanism is driven by a drive source (not shown) such as a servomotor.
  • the support 1032a2 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
  • the Z-direction moving portion 1032b moves along a Z-direction guide rail 1032b1 provided along the Z-direction on the support 1032a2 and the product suction mechanism 1031.
  • Z-direction slider 1032b2 to support.
  • the Z-direction slider 1032b2 linearly reciprocates along the Z-direction on the Z-direction guide rail 1032b1 by, for example, a ball screw mechanism (not shown) extending in the Z-direction.
  • the Z-direction slider 1032b2 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
  • the first imaging unit 201 is an imaging camera that images the product P sucked and held by the product suction mechanism 1031 of the pasting conveying mechanism 103 from below, and images the lower surface (mark surface) of the product P. Also, the first imaging unit 201 is provided so as to be movable in the front-rear direction (Y direction). Thereby, it is configured such that the position of the product P sucked and held by each of the two pasting conveying mechanisms 103 can be confirmed.
  • each pasting conveying mechanism 103 is provided with a second imaging section 202 for confirming the position where the product P is pasted on the pasting member 101, as shown in FIG.
  • the second imaging unit 202 is an imaging camera that captures an image of the sticking member 101 on the mounting table 102 at the sticking position X4 from above, and images the top surface (adhesive surface 101x) of the sticking member 101 .
  • the product P is aligned with the application member 101 and conveyed for application.
  • the mechanism 103 affixes the product P to the adhesive surface 101 x of the affixing member 101 .
  • the position alignment of the product P is performed by the adsorption moving mechanism 1032 of the pasting transport mechanism 103, the rotating mechanism (not shown) provided in the pasting transport mechanism 103, or the moving mechanism (not shown) of the mounting table 102. Alternatively, it can be performed by a rotating mechanism (not shown) provided on the mounting table 102 .
  • the cutting device 100 of the present embodiment has an affixing member accommodation unit 106 that accommodates the affixing member 101, and conveys the affixing member 101 between the mounting table 102 and the affixing member accommodation unit 106.
  • a pasting member conveying mechanism 107 is provided.
  • the sticking member storage part 106 stores an empty sticking member 101 to which the product P is not stuck, and also stores the pasted sticking member 101 to which the product P is stuck.
  • the adhesive member storage unit 106 is arranged in a line along the X direction with the placement table 102 at the adhesive member transport position X3 (see FIG. 17).
  • a pair of guide rails 108 for taking the sticking member 101 into and out of the sticking member housing portion 106 is provided at the opening of the sticking member housing portion 106.
  • the pair of guide rails 108, on which the sticking member 101 is placed, are provided in front of the opening of the sticking member accommodating portion 106 along the X direction.
  • the pasting member conveying mechanism 107 conveys the pasting member 101 between the placing table 102 located at the pasting member conveying position X3 and the pasting member storage section 106 .
  • the application member conveying mechanism 107 includes a third holding mechanism 1071 that sucks and holds the frame-shaped member 101a of the application member 101, and the third holding mechanism 1071 that moves at least in the X direction and the Z direction. and a moving mechanism 1072 for moving in the direction.
  • the third holding mechanism 1071 includes a suction head 1071A provided with a plurality of suction portions 1071a for sucking and holding the application member 101, and a vacuum pump or vacuum ejector (not shown) connected to the suction portions 1071a of the suction head 1071A. ).
  • the moving mechanism 1072 is configured using the main moving mechanism 72 of the transporting moving mechanism 7 , and the third holding mechanism 1071 moves along the common transfer shaft 71 . Further, the moving mechanism 1072 has an up-and-down moving mechanism 1072a similar to the up-and-down moving mechanism 73 of the moving mechanism 7 for transportation. Note that the moving mechanism 1072 may have a Y-direction moving mechanism that moves the third holding mechanism 1071 in the Y direction.
  • FIG. 17 An example of the operation of the cutting device 100 of the second embodiment will be described with reference to FIGS. 9, 17 to 19 and 21.
  • FIG. 17 all operations of the cutting device 100, such as transportation of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, cleaning of the product P, and accommodation of the product P in the ring, are performed. Operation and control are performed by the control unit CTL (see FIG. 17).
  • the operations from transporting the sealed substrate W, cutting the sealed substrate W, cleaning the product P, and inspecting the product P are the same as in the first embodiment. (see FIG. 9).
  • the product P is transferred from the reversing mechanism 14 to the transfer table 5 .
  • the transfer table 5 on which a plurality of products P are placed moves to the take-out position X2 (see FIGS. 17, 18 and 19).
  • an empty pasting member 101 is transported from the pasting member container 106 by the pasting member transport mechanism 107 to the placement table 102 at the pasting member transport position X3. Then, the mounting table 102 carrying the empty sticking member 101 moves to the sticking position X4 (see FIGS. 18 and 19).
  • the pasting transport mechanism 103 sucks and holds the product P from the transfer table 5 located at the take-out position X2. Then, it moves above the first imaging unit 201 . Thereby, the position of the product P in the pasting conveying mechanism 103 is confirmed by the first imaging unit 201 . In addition, the pasting conveying mechanism 103 is moved to confirm the position where the product P is pasted on the pasting member 101 on the mounting table 102 at the pasting position X4 by the second imaging unit 202 . The pasting conveying mechanism 103 then sticks the held product P onto the pasting member 101 . This operation is repeated multiple times until the allowable number of products P that can be stuck on the sticking member 101 are stuck, or until all the multiple products P on the transfer table 5 are stuck.
  • the mounting table 102 moves to the attaching member conveying position X3, as shown in FIGS.
  • the applied member conveying mechanism 107 conveys the pasted applied member 101 placed on the mounting table 102 to the applied member housing portion 106 .
  • the pasted member conveying mechanism 107 places the pasted pasted pasted member 101 on a pair of guide rails 108 provided in the pasted member accommodating portion 106 .
  • the pasted member 101 is housed in the pasted member housing portion 106. As shown in FIG.
  • the pasting member conveying mechanism 107 draws out the pasting member 101 from the pasting member housing portion 106 and places it on the pair of guide rails 108 . , sucks and holds the empty sticking member 101 placed on the pair of guide rails 108 and transports it to the placing table 102 at the sticking member transport position X3.
  • the cutting apparatus 100 of the second embodiment has a function of automatically exchanging the holding plate M1 for holding the sealed substrate W or the product P, as in the first embodiment.
  • the cutting tables 2A and 2B, the holding table 141, the transfer table 5, and the second holding mechanism 6 each have a holding plate M1 and a holding base portion M2. ing.
  • the specific configurations of the holding plate M1 and the holding base portion M2 are the same as in the first embodiment.
  • the cutting device 100 conveys the plate accommodating portion 24 that accommodates the holding plate M1 and the holding plate M1 between the plate accommodating portion 24 and the holding base portion M2.
  • a plate transport mechanism 25 is provided.
  • the cutting device 100 of the second embodiment is provided with a fixing mechanism 26 and an inspection mechanism 29 as in the first embodiment.
  • the plate accommodating portion 24 of this embodiment has the same configuration as that of the first embodiment, but as shown in FIG.
  • the plate accommodating portion 24 of this embodiment is provided above the attaching member accommodating portion 106 .
  • the plate accommodating portion 24 and the sticking member accommodating portion 106 are configured to be movable up and down in the vertical direction (Z direction).
  • an elevation movement section 109 for vertically moving the plate housing section 24 and an elevation movement section 110 for vertically moving the pasting member housing section 106 are provided, and the plate housing section 24 and the pasting member housing section 106 are independent of each other. It is configured to be able to move up and down.
  • the up-and-down moving units 109 and 110 may use, for example, a ball screw mechanism, an air cylinder, or a linear motor.
  • the plate accommodating portion 24 and the attaching member accommodating portion 106 may be integrally moved up and down by a common up-and-down movement mechanism.
  • the application member 101 is arranged at the desired height position H1 by the moving unit 110 , and the application member 101 is taken in and out of the application member storage unit 106 by the application member conveying mechanism 107 .
  • the holding plate M1 is to be put in and taken out of the plate accommodating portion 24, as shown in FIG. is placed at a desired height position H2 by the up-and-down moving unit 109, and the holding plate M1 is taken in and out of the plate accommodating unit 24 by the plate conveying mechanism 25.
  • the height position H2 of the plate accommodating portion 24 is positioned higher than the height position H1 of the attaching member accommodating portion 106 so that the attaching member conveying mechanism 107 does not interfere with the guide rail 108 .
  • the plate transport mechanism 25 of this embodiment includes a first transport mechanism 25a that transports the holding plate M1 between the plate accommodating portion 24 and the temporary placement portion 27, the temporary placement portion 27 and the holding portion 25a. and a second transport mechanism 25b that transports the holding plate M1 to and from the base portion M2.
  • the temporary placement section 27 of this embodiment is the holding table 141 of the reversing mechanism 14 .
  • the transfer table 5 may be used as the temporary placement section 27 , or the temporary placement section 27 may be provided separately from the holding table 141 and the transfer table 5 .
  • the first transport mechanism 25a of the second embodiment is configured using the pasting member transport mechanism 107 (the third holding mechanism 1071 and the moving mechanism 1072).
  • the first transport mechanism 25a of the second embodiment can transport the sticking member 101 to which the processed workpiece W (product P) is to be stuck.
  • the second transport mechanism 25b is configured using the second holding mechanism 6 and the transport moving mechanism 7, and can transport the workpiece W, as in the first embodiment. That is, the plate transport mechanism 25 (the first transport mechanism 25a and the second transport mechanism 25b) is configured to move in the X direction by the common transfer shaft 71 described above. Also, the plate transport mechanism 25 is provided on the same side (front side) of the transfer shaft 71 in plan view.
  • the pasting member conveying mechanism 107 which serves as the first conveying mechanism 25a, as shown in FIG. It has a cylinder portion 1071b.
  • the attaching member conveying mechanism 107 is configured such that the portion that holds the holding plate M1 can be raised and lowered, and the holding plate M1 can be conveyed in a state in which the portion holding the holding plate M1 is raised to the raised position. can.
  • the holding plate M1 is identified when the holding plate M1 is taken out from the plate accommodating portion 24 by using an identifier such as an RFID provided on the holding plate M1 to the first transport mechanism 25a (plate It is read by an identifier reader (not shown) provided in the transport mechanism 25). Also, in this replacement operation, as shown in FIG. The holding plate M1 is taken in and out of the plate accommodating portion 24 by the plate conveying mechanism 25. As shown in FIG.
  • the holding plate M1 of the holding table 141 is removed, and the holding plate M1 is lifted by the first conveying mechanism 25a (applying member conveying mechanism 107) and conveyed to the plate accommodating section 24 in a raised position.
  • first conveying mechanism 25a applying member conveying mechanism 1057
  • second conveying mechanism 107 conveyed to the plate accommodating section 24 in a raised position.
  • the first conveying mechanism 25a (attachment member conveying mechanism 107) takes out the new holding plate M1 of the holding table 141 from the plate accommodating portion 24 and conveys it to the holding base portion M2 of the holding table 141 in the state of being in the raised position. , the holding plate M1 is lowered and placed. In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the holding plate M1 descends and the fixing cylinder portion 262 moves into the fixing insertion hole 261 of the holding plate M1. After that, when the supply of compressed air is stopped, the mover 262b is at a protruded position, and the holding plate M1 is fixed to the holding base portion M2 of the holding table 141. As shown in FIG.
  • the holding plate M1 of the transfer table 5 is removed, and the holding plate M1 is lifted by the first conveying mechanism 25a (applied member conveying mechanism 107) to the raised position and conveyed to the plate accommodating section 24.
  • the first conveying mechanism 25a applied member conveying mechanism 107
  • compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the retracted position, thereby releasing the fixation of the fixing mechanism 26.
  • the first conveying mechanism 25a (attached member conveying mechanism 107) takes out the new holding plate M1 of the transfer table 5 from the plate accommodating portion 24 and places it on the holding base portion M2 of the transfer table 5 in the state of being in the raised position. Then, the holding plate M1 is lowered and placed. In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the holding plate M1 descends and the fixing cylinder portion 262 moves into the fixing insertion hole 261 of the holding plate M1. After that, when the supply of compressed air is stopped, the mover 262b is at a protruded position, and the holding plate M1 is fixed to the holding base portion M2 of the transfer table 5. As shown in FIG.
  • the order of replacement of the holding plate M1 of the holding table 141 and replacement of the holding plate M1 of the transfer table 5 is not limited to the above.
  • a new holding plate M1 may be attached to each of the holding table 141 and the transfer table 5 after removing the holding plate M1.
  • the holding plates M1 of the cutting tables 2A and 2B are removed, and the holding plates M1 are lifted by the second conveying mechanism 25b (the conveying moving mechanism 7 and the second holding mechanism 6) to the elevated position. 27, and the holding plate M1 is lowered and placed thereon.
  • the holding plates M1 of the cutting tables 2A and 2B are removed, compressed air is supplied to the fixing cylinder portion 262 so that the mover 262b is retracted to release the fixation of the fixing mechanism 26.
  • the holding table 141 is used as the temporary placement unit 27, it is desirable to remove the holding plate M1 of the holding table 141 in advance.
  • the first transport mechanism 25a (applied member transport mechanism 107) lifts the holding plates M1 of the cutting tables 2A and 2B placed on the holding table 141 to the raised position, and moves them into the plate accommodating section 24. Then, the holding plate M1 is lowered and accommodated.
  • the first conveying mechanism 25a (applied member conveying mechanism 107) takes out the new holding plate M1 of the cutting tables 2A and 2B from the plate accommodating portion 24, and in a state where the holding plate M1 is in the elevated position, the temporary holding portion 27 holds the plate. It is conveyed to the table 141, and the holding plate M1 is lowered and placed thereon.
  • the second transport mechanism 25b moves the new holding plate M1 placed on the holding table 141 to the holding base portion M2 of the cutting tables 2A and 2B at the raised position.
  • the holding plate M1 is lowered and placed thereon.
  • the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied.
  • the mover 262b is at the projecting position, and the holding plate M1 is fixed to the holding base portion M2 of the cutting tables 2A and 2B.
  • the transport moving mechanism 7 moves the second holding mechanism 6 to the holding table 141, which is the temporary placement section 27, and lowers the holding plate M1. , and the holding plate M1 is placed on the holding table 141, which is the temporary placement unit 27. As shown in FIG. When removing the holding plate M1 of the second holding mechanism 6, compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the recessed position, thereby releasing the fixing of the fixing mechanism 26.
  • the first conveying mechanism 25a (attachment member conveying mechanism 107) raises the holding plate M1 of the second holding mechanism 6 placed on the holding table 141 and conveys it to the plate accommodating section 24 in a state of the raised position. Then, the holding plate M1 is lowered and accommodated.
  • the first conveying mechanism 25a (attachment member conveying mechanism 107) takes out the new holding plate M1 of the second holding mechanism 6 from the plate accommodating portion 24 and moves the holding table 141, which is the temporary placing portion 27, to the raised position. , and the holding plate M1 is lowered and placed thereon.
  • the second holding mechanism 6 is moved to the holding table 141 by the transfer moving mechanism 7, the holding base portion M2 is lowered, and the new holding plate M1 placed on the holding table 141 is attached.
  • the fixing cylinder portion 262 provided in the holding base portion M2 of the second holding mechanism 6 is inserted into the fixing insertion hole 261 formed in the holding plate M1 by the transportation moving mechanism 7 .
  • the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied.
  • the mover 262b is at a projected position, and the holding plate M1 is fixed to the holding base portion M2 of the second holding mechanism 6. As shown in FIG.
  • the holding plate M1 of the second holding mechanism 6 serving as the second transport mechanism 25b and the holding plate M1 of the holding table 141 are removed in advance.
  • the holding plate M1 of the holding table 141 is removed in advance.
  • replacement of the transfer table 5, the holding table 141, the cutting tables 2A and 2B, and the holding plate M1 of the second holding mechanism 6 may be performed as a series of operations.
  • the transfer table 5, the holding table 141, the second holding mechanism 6, and the holding plates M1 of the cutting tables 2A and 2B are removed in this order, and then the cutting tables 2A and 2B, the second holding mechanism 6, and the holding table are removed.
  • 141 and the holding plate M1 of the transfer table 5 may be attached in this order.
  • the holding plate M1 removed from the holding base portion M2 is conveyed to the plate accommodating portion 24, and the holding plate in the plate accommodating portion 24 is Since the plate transport mechanism 25 transports M1 to the holding base portion M2, the holding plate M1 can be automatically replaced with respect to the holding base portion M2. As a result, labor costs for exchanging the holding plate M1 can be reduced. In addition, since the holding plate M1 is automatically replaced, the replacement time of the holding plate M1 can be shortened, and the productivity of the cutting apparatus 100 can be improved. Furthermore, it is possible to reduce variations in the mounting state of the holding plate M1 with respect to the holding base portion M2. Other than that, in the second embodiment, the effects produced by the same configuration as in the first embodiment are the same.
  • the plate conveying mechanism 25 can convey the pasting member 101 to the mounting table 102, there is no need to provide a conveying mechanism for the pasting member separately from the plate conveying mechanism 25.
  • the device configuration of the cutting device 100 to be housed can be simplified. Furthermore, equipment costs can also be reduced.
  • a post-process such as a sputtering process or a mounting process is performed on a plurality of products P
  • the sticking member 101 to which the plurality of products P are stuck can be moved, thereby facilitating handling. can be done.
  • the plate transport mechanism 25 includes a first transport mechanism 25a that transports the holding plate M1 between the plate accommodating portion 24 and the temporary placement portion 27, and a holding mechanism 25a that transports the holding plate M1 between the temporary placement portion 27 and the holding base portion M2. Since it has the second transport mechanism 25b for transporting the plate M1, the degree of freedom of the transport destination of the holding plate M1 can be increased compared to the case where the plate transport mechanism 25 is composed of one transport mechanism.
  • the first conveying mechanism 25a is configured using the pasting member conveying mechanism 107 (the third holding mechanism 1071 and the moving mechanism 1072), the device configuration can be simplified and the device cost can be reduced.
  • the second transport mechanism 25b is configured using the second holding mechanism 6 and the transport moving mechanism 7, the device configuration can be simplified and the device cost can be reduced.
  • the holding plates M1 of the cutting tables 2A and 2B, the inspection table (holding table 141), the transfer table 5, and the conveying holding mechanism (second holding mechanism 6) are Although it was configured to be replaced automatically, at least one of the cutting tables 2A and 2B, the inspection table (holding table 141), the transfer table 5, and the holding mechanism for transportation (second holding mechanism 6) It is good also as a structure which exchanges automatically.
  • the plate conveying mechanism 25 of the second embodiment has the first conveying mechanism 25a and the second conveying mechanism 25b, it may have a single conveying mechanism. Further, the plate conveying mechanism 25 may be configured without using the pasting member conveying mechanism 107, or may be configured without using the second holding mechanism 6 and the conveying moving mechanism 7 (processing object conveying mechanism).
  • the plate accommodating portion 24 is placed at a position accessible to the second holding mechanism 6 (for example, the transfer table 5 (index table) and the place where the pasting member 101 is placed).
  • the plate conveying mechanism 25 can be composed of the second holding mechanism 6 and the conveying moving mechanism 7 without using the pasting member conveying mechanism 107 .
  • the plate accommodating portion 24 of the second embodiment accommodates the holding plates M1 of the cutting tables 2A and 2B, the inspection table (holding table 141), the transfer table 5, and the second holding mechanism 6.
  • a plurality of dedicated plate accommodating portions 24 may be provided.
  • FIG. 1 a configuration in which a plurality of (specifically, two) mounting tables 102 are provided has been described, but as shown in FIG. Also good.
  • two guide rails 108A and 108B may be provided on the upper and lower sides of the opening of the adhesive member accommodating section 106.
  • the upper guide rails 108A are configured so that the mutual spacing can be expanded and contracted by an expansion and contraction mechanism (not shown).
  • the interval between the upper guide rails 108A is expanded by the expansion/reduction mechanism (see FIG. 26(b)).
  • the pasting member conveying mechanism 107 descends between the upper guide rails 108A, pulls out the empty pasting member 101 from the pasting member accommodating portion 106, and temporarily places it on the lower guide rail 108B.
  • the pasting member conveying mechanism 107 moves to the mounting table 102 located at the pasting member conveying position X3 and receives the pasted pasted pasted member 101 .
  • the applied member conveying mechanism 107 places the applied applied member 101 on the upper guide rail 108 ⁇ /b>A and pushes the applied member 101 into the applied member accommodating portion 106 .
  • the interval between the upper guide rails 108A is expanded by the expansion/reduction mechanism.
  • the pasting member conveying mechanism 107 descends between the upper guide rails 108A, receives the empty pasting member 101 placed on the lower guide rail 108B, and conveys it to the placing table 102.
  • the configuration has two pasting conveying mechanisms 103 , but a configuration having one pasting conveying mechanism 103 may be employed.
  • the first imaging unit 201 is common to the two pasting conveying mechanisms 103, the first photographing unit 201 may be provided for each of the two pasting conveying mechanisms 103.
  • the transfer table 5 of the second embodiment is an index table that is temporarily placed before being attached to the sticking member 101, but the transfer table 5 can be used as the holding table 141 of the reversing mechanism 14. good.
  • the cutting device 100 of the third embodiment can accommodate a plurality of products P in a discrete state (also called "bulk accommodation"). is configured as
  • the cutting apparatus 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W, and cutting tables 2A and 2B that hold the sealed substrate W.
  • a first holding mechanism 3 for holding the sealed substrate W for transporting to the substrate
  • a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting tables 2A and 2B
  • a plurality of products A second holding mechanism 6 for holding a plurality of products P to transport P from the cutting tables 2A and 2B to the storage box 111, and a common transfer for moving the first holding mechanism 3 and the second holding mechanism 6.
  • a transfer movement mechanism 7 having a shaft 71 and a cutting movement mechanism (processing movement mechanism) 8 for moving the cutting mechanism 4 with respect to the sealed substrate W held by the cutting tables 2A and 2B.
  • the second holding mechanism 6 of the third embodiment holds a plurality of products P in order to convey the plurality of products P from the cutting tables 2A, 2B to the drying table 112 or storage box 111. It is something to do.
  • the second holding mechanism 6, as shown in FIG. 8, has the same configuration as in the first and second embodiments. Then, the suction head 61 is moved to a desired position by a transport movement mechanism 7 or the like, which will be described later, so that the plurality of products P are transported from the cutting tables 2A and 2B to the drying table 112. to the storage box 111.
  • the transport moving mechanism 7 of the third embodiment moves the first holding mechanism 3 between at least the substrate supply mechanism 11 and the cutting tables 2A and 2B, and moves the second holding mechanism 6. are moved at least between the cutting tables 2A and 2B and the storage box 111. As shown in FIG. 27, the transport moving mechanism 7 of the third embodiment moves the first holding mechanism 3 between at least the substrate supply mechanism 11 and the cutting tables 2A and 2B, and moves the second holding mechanism 6. are moved at least between the cutting tables 2A and 2B and the storage box 111. As shown in FIG.
  • the transfer shaft 71 is provided within a range in which the first holding mechanism 3 can move above the substrate supply portion 11b of the substrate supply mechanism 11 and the second holding mechanism 6 can move above the storage box 111 ( See Figure 27).
  • a storage box 111 and a drying table 112, which will be described later, are also provided on the same side (front side) of the transfer shaft 71 in plan view.
  • the guide rail 721 of the main moving mechanism 72 extends straight in the X direction along the transfer shaft 71, and similarly to the transfer shaft 71, the first holding mechanism 3 is positioned at the substrate supply portion 11b of the substrate supply mechanism 11. While being able to move upward, the second holding mechanism 6 is provided within a range capable of moving upward of the storage box 111 .
  • the cutting device 100 of the third embodiment has a function of further drying the multiple products P cleaned by the second cleaning mechanism 19 .
  • the cutting apparatus 100 includes a drying table 112 for drying a plurality of products P and a drying table 112 for drying the plurality of products P placed on the drying table 112.
  • a mechanism 113 and a drying moving mechanism 114 for moving the drying mechanism 113 along the drying table 112 are provided.
  • a plurality of products P are transported and placed on the drying table 112 by the second holding mechanism 6 and transport moving mechanism 7 .
  • This drying table 112 holds a plurality of products P by suction.
  • the drying table 112 and the two cutting tables 2A and 2B are arranged in a line along the X direction on the horizontal plane.
  • the drying table 112 of this embodiment has a rectangular shape in a plan view, but may have another shape.
  • the drying mechanism 113 jets compressed air, which is a gas, from above the drying table 112 to dry the plurality of products P adsorbed and held on the drying table 112 .
  • This drying mechanism 113 has an injection nozzle 113a for injecting compressed air onto the plurality of products P held on the drying table 112 .
  • the injection nozzle 113a of this embodiment has a linearly extending slit-shaped opening facing the drying table 112 (see FIG. 28). It may have a plurality of openings that are aligned with each other.
  • the drying mechanism 113 of this embodiment is configured to inject compressed air in the moving direction of the drying movement mechanism 114 (see FIG. 28).
  • the direction in which the compressed air is jetted by the jet nozzle 113a is directed to the movement direction of the drying movement mechanism 114 (here, from the front side to the back side in the Y direction).
  • the jet nozzle 113a of the drying mechanism 113 is inclined at, for example, less than 30 degrees with respect to the arrangement direction of the plurality of products P held on the drying table 112 along the X direction. are placed.
  • a plurality of products P are arranged in a matrix in the X direction and the Y direction.
  • the compressed air is injected at an angle. This makes it easy to blow off the water remaining between the adjacent products P from the products P. Thereby, the drying of the plurality of products P is promoted.
  • the slit-shaped opening of the injection nozzle 113a of the drying mechanism 113 may be provided so as to be slightly inclined toward the drying table 112 so that the compressed air is blown away in the moving direction of the drying mechanism 113.
  • the drying movement mechanism 114 moves the drying mechanism 113 above the drying table 112 in the Y direction.
  • the drying movement mechanism 114 of this embodiment reciprocates the drying mechanism 113 in the Y direction with respect to the drying table 112 .
  • the drying movement mechanism 114 includes a Y-direction guide rail 1141 extending in the Y-direction and a slide that moves along the Y-direction guide rail 1141 and holds the drying mechanism 113. It has a member 1142 and a drive section (not shown) that moves the slide member 1142 along the Y-direction guide rail 1141 .
  • the drive unit may be, for example, one using a ball screw mechanism, one using an air cylinder, or one using a linear motor.
  • the drying moving mechanism 114 moves the drying mechanism 113 to one side of the drying table 112 in the Y direction ( For example, it is retracted to the front side). Then, when a plurality of products P are placed and held on the drying table 112, the drying mechanism 113 starts jetting compressed air, and the drying moving mechanism 114 moves the drying mechanism 113 to the other side in the Y direction (for example, back). As a result, the plurality of products P held on the drying table 112 are dried. When the drying movement mechanism 114 moves the drying mechanism 113 from the other side in the Y direction (back side) to the one side in the Y direction (front side), the drying mechanism 113 stops jetting the gas. Note that the drying mechanism 113 may be configured to jet compressed air not only on the outward path but also on the return path.
  • the storage box 111 stores a plurality of products P in a discrete state (so-called bulk storage).
  • the storage box 111 and the two cutting tables 2A and 2B are arranged in a line along the X direction on the horizontal plane.
  • This storage box 111 further includes a scraping member 115 that scrapes off the plurality of products P from the second holding mechanism 6 .
  • the storage box 111 has a rectangular upper opening 111X in plan view (see FIG. 28).
  • the scraping member 115 is fixed to one side of the upper opening 111X of the storage box 111 .
  • the product P is scraped off and dropped to be stored in the storage box 111 .
  • the storage box 111 of the present embodiment is provided between the drying table 112 and a plate storage portion 24 that stores a holding plate M1, which will be described later, in the X direction. is provided on one side of the drying table 112 side of the upper opening 111X. As a result, the second holding mechanism 6 does not interfere with the plate accommodating portion 24 when the product P is scraped off.
  • the scraping member 115 extends upward from one side of the upper opening 111X on the drying table 112 side (see FIG. 29). Further, the scraping member 115 may be any member as long as it scrapes off the product P that does not separate from the second holding mechanism 6 that has been released from suction. It may be in the shape of a flat plate.
  • the storage box 111 is arranged on the front side of the transfer shaft 71, and a handle 1111 (see FIG. 28) is provided on the outer surface of the storage box 111 on the front side. It is designed so that it can be removed from the With this configuration, it is possible to improve maintainability such as taking out and recovering the product P.
  • the direction in which the storage box 111 is taken out is not limited to the front side.
  • FIG. 30 shows the moving path of the first holding mechanism 3 and the moving path of the second holding mechanism 6 in the operation of the cutting device 100.
  • the operation of the cutting device 100 for example, transporting the sealed substrate W, cutting the sealed substrate W, cleaning the product P, drying the product P, scraping off the product P, etc. , all operations and controls are performed by the controller CTL (see FIG. 27).
  • the operations from transporting the sealed substrate W, cutting the sealed substrate W, and cleaning the product P are the same as in the first embodiment.
  • the transfer mechanism 7 moves the second holding mechanism 6 to the drying table 112, the second holding mechanism 6 releases the suction holding, and the plurality of products P are moved to the drying table 112. It is placed on the table 112 .
  • the drying table 112 holds the sealed substrate W by suction.
  • the transport moving mechanism 7 retracts the second holding mechanism 6 to a position that does not interfere with the movement of the drying mechanism 113 .
  • the drying movement mechanism 114 reciprocates the drying mechanism 113 in the Y direction, and the drying mechanism 113 jets compressed air, thereby drying the plurality of products P.
  • the number of reciprocations of the drying mechanism 113 by the drying movement mechanism 114 can be set as appropriate, and may be one time or a plurality of times.
  • the transfer mechanism 7 moves the second holding mechanism 6 to the drying table 112, and the second holding mechanism 6 holds the plurality of products P from the drying table 112 by suction. After that, the transportation moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the storage box 111 .
  • the second holding mechanism 6 releases suction holding of the plurality of products P above the upper opening 111X of the storage box 111 .
  • the transfer mechanism 7 moves the second holding mechanism 6 to the scraping member 115 so that the product P remaining on the second holding mechanism 6 without falling from the second holding mechanism 6 hits the scraping member 115 . relative to the drying table 112 side.
  • the second holding mechanism 6 in order to reliably scrape off the product P, is moved with respect to the scraping member 115 so that the scraping member 115 contacts the lower surface, which is the suction surface of the second holding mechanism 6 . Let As a result, a plurality of products P are dropped and stored in the storage box 111 .
  • the cutting apparatus 100 of the third embodiment has a function of automatically exchanging the holding plate M1 for holding the sealed substrate W or the product P, as in the first and second embodiments.
  • the cutting tables 2A and 2B, the drying table 112 and the second holding mechanism 6 have the holding plate M1 and the holding base portion M2.
  • the specific configurations of the holding plate M1 and the holding base portion M2 are the same as in the first embodiment.
  • the cutting device 100 conveys the plate accommodating portion 24 that accommodates the holding plate M1 and the holding plate M1 between the plate accommodating portion 24 and the holding base portion M2.
  • a plate transport mechanism 25 is provided.
  • the cutting device 100 of the second embodiment is provided with a fixing mechanism 26 and an inspection mechanism 29 as in the first embodiment.
  • the plate conveying mechanism 25 of the third embodiment is configured using the second holding mechanism 6 and the conveying moving mechanism 7, and can convey a plurality of products P.
  • the second holding mechanism 6 and the transport moving mechanism 7 have the function of transporting the holding plate M1.
  • the plate transport mechanism 25 is configured to move in the X direction by the common transfer shaft 71 described above.
  • the plate transport mechanism 25 is provided on the same side (front side) of the transfer shaft 71 in plan view.
  • the second holding mechanism 6 that constitutes the plate conveying mechanism 25 is a conveying cylinder that is inserted into a conveying holding hole 281 (see FIG. 10) formed in the holding plate M1. It has a portion 282 (see FIG. 13).
  • the holding plate M1 is identified when the holding plate M1 is taken out from the plate accommodating portion 24 by using the identifier such as the RFID provided on the holding plate M1 to the plate conveying mechanism 25 (second It is read by an identifier reader (not shown) provided in the holding mechanism 6).
  • the identifier such as the RFID provided on the holding plate M1 to the plate conveying mechanism 25 (second It is read by an identifier reader (not shown) provided in the holding mechanism 6).
  • the holding plates of the cutting tables 2A and 2B or the drying table 112 are exchanged.
  • the plate transport mechanism 25 (transport moving mechanism 7 and second holding mechanism 6) takes out new holding plates M1 of the cutting tables 2A and 2B from the plate housing section 24, and holds the cutting tables 2A and 2B. It is conveyed to the base portion M2 in the raised position, and the holding plate M1 is lowered and placed thereon.
  • the fixing cylinder portion 262 when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied.
  • the mover 262b is at the projecting position, and the holding plate M1 is fixed to the holding base portion M2 of the cutting tables 2A and 2B.
  • the plate conveying mechanism 25 takes out the new holding plate M1 of the drying table 112 from the plate accommodating portion 24, and places it on the holding base portion M2 of the drying table 112.
  • the substrate is transported in the raised position, and the holding plate M1 is lowered and placed.
  • the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied.
  • the mover 262b is at a projected position, and the holding plate M1 is fixed to the holding base portion M2 of the drying table 112. As shown in FIG.
  • the exchange of the holding plate M1 of the second holding mechanism 6, the cutting tables 2A and 2B, and the drying table 112 is a series of operations.
  • the holding plate M1 on at least one of the drying tables 112 may be exchanged individually.
  • the holding plate M1 removed from the holding base portion M2 is conveyed to the plate accommodating portion 24, and Since the plate conveying mechanism 25 that conveys the holding plate M1 to the holding base portion M2 is provided, the holding plate M1 can be automatically exchanged with respect to the holding base portion M2. As a result, labor costs for exchanging the holding plate M1 can be reduced. In addition, since the holding plate M1 is automatically replaced, the replacement time of the holding plate M1 can be shortened, and the productivity of the cutting apparatus 100 can be improved. Furthermore, it is possible to reduce variations in the mounting state of the holding plate M1 with respect to the holding base portion M2. Other than that, in the third embodiment, the effects produced by the same configuration as in the first and second embodiments are the same.
  • the plate transport mechanism 25 can transport a plurality of products P to the storage box 111, there is no need to provide a product transport mechanism separate from the plate transport mechanism 25, and bulk storage can be performed.
  • the device configuration of the cutting device 100 can be simplified. Furthermore, equipment costs can also be reduced.
  • the size of the storage space can be reduced as compared with the conventional tray storage structure. This also allows the footprint of the cutting device 100 to be reduced.
  • the holding plates M1 of the cutting tables 2A and 2B, the drying table 112, and the holding mechanism (second holding mechanism 6) are automatically exchanged. At least one of 2A, 2B, drying table 112, and holding mechanism (second holding mechanism 6) may be automatically replaced.
  • the plate transport mechanism 25 of the third embodiment may be configured without using the second holding mechanism 6 and transport moving mechanism 7 .
  • the plate accommodating portion 24 of the third embodiment accommodates the holding plates M1 of the cutting tables 2A and 2B, the drying table 112, and the holding mechanism (second holding mechanism 6).
  • a plurality of dedicated plate accommodating portions 24 may be provided according to the type of holding plate M1.
  • the second holding mechanism 6 may jet gas to drop the plurality of products P. can.
  • the scraping member 115 may be fixed to another member, or the scraping member 115 may be configured to be movable so as to be attached to the second holding mechanism 6. A plurality of products P may be scraped off by moving the scraping member 115 .
  • the cutting device 100 of the fourth embodiment accommodates a plurality of products P in a cylindrical container 116 (also called “tube accommodation”).
  • a cylindrical container 116 may be called a tube, magazine stick, stick magazine, stick, or the like.
  • the cutting apparatus 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W, and the sealed substrate W on the cutting tables 2A and 2B.
  • a first holding mechanism 3 that holds the sealed substrate W for transportation
  • a cutting mechanism (processing mechanism) 4 that cuts the sealed substrate W held on the cutting tables 2A and 2B, and a plurality of products P a transfer table 5 to which the are transferred
  • a second holding mechanism 6 for holding a plurality of products P in order to transfer the plurality of products P from the cutting tables 2A and 2B to the transfer table 5
  • a transfer moving mechanism 7 having a common transfer shaft 71 for moving the second holding mechanism 6, and a cutting mechanism 4 for moving the sealed substrate W held by the cutting tables 2A and 2B.
  • a moving mechanism (processing moving mechanism) 8 is provided.
  • a plurality of products P are temporarily placed on the transfer table 5 of the present embodiment before the plurality of products P are accommodated in a cylindrical container 116, which will be described later.
  • the transfer table 5 is provided so as to be movable along the Y direction.
  • the storage mechanism 118 moves between the pick-up position X2 where a plurality of products P are transported.
  • the transfer position X1 is set on the front side of the transfer shaft 71, and is a position where the two cutting tables 2A and 2B are arranged in a line along the X direction on the horizontal plane. is set on the back side of the transfer shaft 71 .
  • the cutting apparatus 100 of the present embodiment includes a container setting portion 117 in which a cylindrical container 116 containing a plurality of products P from one end opening 116x is set, and a plurality of products P.
  • a transfer/accommodation mechanism 118 is provided for conveying P from the transfer table 5 to a cylindrical container 116 installed in the container installation portion 117 and accommodating the same.
  • the empty cylindrical container 116 in which the product P is not stored is installed in the container setting part 117, and the product P is inserted from one end opening 116x of the cylindrical container 116 by the transporting/receiving mechanism 118.
  • the container installation unit 117 of the present embodiment includes an empty container storage unit 117a that stores an empty cylindrical container 116, and an empty cylindrical container 116 that is sent out from the empty container storage unit 117a. , an insertion position setting portion 117b for setting an empty cylindrical container 116 at an insertion position where the products P are inserted from one end opening 116x, and a filled cylinder filled with the products P or containing a desired number of products P. and a stored container storage portion 117c that stores the shaped container 116 therein.
  • the cylindrical container 116 accommodates a plurality of products P in a row.
  • the cylindrical container 116 has a shape extending linearly and has a space for accommodating the product P therein.
  • the cross-sectional shape of the cylindrical container 116 orthogonal to the longitudinal direction is a shape corresponding to the cross-sectional shape of the product P.
  • the cylindrical container 116 shown in FIG. 34 has a configuration in which a part of the side peripheral wall extending along the longitudinal direction is open, but the configuration may be such that the side peripheral wall is closed.
  • the cylindrical container 116 may have a configuration in which a plurality of products P are arranged in a row, or a configuration in which a plurality of products P are arranged in a plurality of rows. Furthermore, the cylindrical container 116 may be made of resin or may be made of metal. Also, although FIG. 34 shows a form in which the product P has leads, it may be of a non-lead type such as QFN.
  • the transport/accommodation mechanism 118 includes an intermediate table 119 on which a plurality of products P are temporarily placed, and a transfer table 5 located at the pick-up position X2 for transferring the plurality of products P to the intermediate table. 119, and a second product transport mechanism that transports a plurality of products P from the intermediate table 119 to the cylindrical container 116 installed in the insertion position installation portion 117b of the container installation portion 117 and accommodates them therein. 121.
  • the intermediate table 119 temporarily places the product P transported by the first product transport mechanism 120 from the transfer table 5 at the take-out position X2.
  • the product P temporarily placed on the intermediate table 119 is transported by the second product transport mechanism 121 to the cylindrical container 116 placed on the container placement section 117 .
  • the intermediate table 119 of this embodiment is fixed in the X and Y directions, it may be configured to be movable.
  • the first product transport mechanism 120 transports a predetermined number (for example, one) of a plurality of products P to the intermediate table 119 from the transfer table 5 moved to the take-out position X2.
  • the first product transport mechanism 120 includes a product suction mechanism 1201 that suctions a predetermined number (for example, one) of a plurality of products P held on the transfer table 5, and a product suction mechanism 1201 that and a moving mechanism 1202 for adsorption that moves the mechanism 1201 along the X direction.
  • a product suction mechanism 1201 that suctions a predetermined number (for example, one) of a plurality of products P held on the transfer table 5
  • a product suction mechanism 1201 that and a moving mechanism 1202 for adsorption that moves the mechanism 1201 along the X direction.
  • the product suction mechanism 1201 includes a suction head 1201A provided with a suction portion 1201a for sucking and holding a plurality of products P, and a vacuum pump or vacuum pump connected to the suction portion 1201a of the suction head 1201A. and a vacuum ejector (not shown).
  • the product adsorption mechanism 1201 is configured such that each adsorption portion 1201a adsorbs one product P.
  • the plurality of suction units 1201a are configured to be able to move up and down independently of each other, and each suction unit 1201a can be lowered to suck the product P individually.
  • An imaging camera 203 for confirming the state of the product P to be sucked is provided below the first product transport mechanism 120 .
  • the suction moving mechanism 1202 includes an X-direction moving portion 1202a for moving the product suction mechanism 1201 in the X direction and a Z-direction moving portion 1202b for moving the product suction mechanism 1201 in the Z direction.
  • the suction moving mechanism 1202 may have a Y-direction moving unit that moves the product suction mechanism 1201 in the Y direction.
  • the X-direction moving portion 1202a moves along an X-direction guide rail 1202a1 provided along the X direction on the back side of the transfer shaft 71, and moves along the X-direction guide rail 1202a1, and moves through the Z-direction moving portion 1202b. and a support 1202 a 2 that supports the product suction mechanism 1201 .
  • the support 1202a2 is linearly reciprocated along the X direction on the X direction guide rail 1202a1 by, for example, a ball screw mechanism (not shown) extending in the X direction. This ball screw mechanism is driven by a drive source (not shown) such as a servomotor.
  • the support 1202a2 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
  • the Z-direction moving portion 1202b includes a Z-direction guide rail 1202b1 provided along the Z-direction on the support 1202a2, and a Z-direction slider 1202b2 that moves along the Z-direction guide rail 1202b1 and supports the product suction mechanism 1201. have.
  • the Z-direction slider 1202b2 linearly reciprocates along the Z-direction on the Z-direction guide rail 1202b1 by, for example, a ball screw mechanism (not shown) extending in the Z-direction.
  • the Z-direction slider 1202b2 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
  • the second product transport mechanism 121 transports the product P placed on the intermediate table 119 to the cylindrical container 116 placed on the insertion position setting portion 117b of the container setting portion 117. , the product P is inserted from one end opening 116x of the cylindrical container 116 and accommodated therein.
  • the second product transport mechanism 121 includes a pressing member 121a that presses the product P placed on the intermediate table 119, and a drive unit 121b that moves the pressing member 121a along the Y direction.
  • the drive unit 121b may use, for example, a ball screw mechanism, an air cylinder, or a linear motor.
  • the second product transport mechanism 121 may have a product guide portion that guides the product P to the one end opening portion 116x of the cylindrical container 116 .
  • a mechanism for lifting and lowering the pressing member 121a may be provided.
  • FIG. 9 ⁇ Example of operation of cutting device>
  • all the operations of the cutting apparatus 100 such as transport of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, cleaning of the product P, accommodation of the product P in the tube, etc. Control is performed by the controller CTL (see FIG. 33).
  • the operations from transporting the sealed substrate W, cutting the sealed substrate W, cleaning the product P, and inspecting the product P are the same as in the first embodiment. is.
  • the product P is transferred from the reversing mechanism 14 to the transfer table 5 .
  • the transfer table 5 on which a plurality of products P are placed moves to the pick-up position X2 (see FIGS. 33 and 35).
  • an empty cylindrical container 116 is installed in the insertion position installation portion 117b of the container installation portion 117 (see FIGS. 32 and 34).
  • the first product transport mechanism 120 sucks and holds the product P from the transfer table 5 located at the pick-up position X2. After that, the first product transport mechanism 120 moves the product P to the intermediate table 119 , releases the product P from the suction holding, and places the product P on the intermediate table 119 .
  • the product P placed on the intermediate table 119 is inserted into the cylindrical container 116 and accommodated by the second product transport mechanism 121 .
  • the stored cylindrical container 116 in the insertion position setting portion 117b is While being moved to the container accommodating portion 117c, the empty cylindrical container 116 is delivered from the empty container accommodating portion 117a and installed in the insertion position setting portion 117b.
  • the cutting apparatus 100 of the fourth embodiment has a function of automatically exchanging the holding plate M1 for holding the sealed substrate W or the product P, like the first embodiment.
  • the cutting tables 2A and 2B, the holding table 141, the transfer table 5, and the second holding mechanism 6 each have a holding plate M1 and a holding base portion M2. ing.
  • the specific configurations of the holding plate M1 and the holding base portion M2 are the same as in the first embodiment.
  • the cutting apparatus 100 includes a plate accommodating portion 24 that accommodates the holding plate M1, and a plate accommodating portion 24 that holds the holding plate M1, as shown in FIGS.
  • a plate conveying mechanism 25 for conveying between the base portions M2 is provided.
  • the cutting device 100 of the second embodiment is provided with a fixing mechanism 26 and an inspection mechanism 29 as in the first embodiment.
  • the plate conveying mechanism 25 of the fourth embodiment is configured using the second holding mechanism 6 and the conveying moving mechanism 7, and can convey a plurality of products P.
  • the second holding mechanism 6 and the transport moving mechanism 7 have the function of transporting the holding plate M1.
  • the plate transport mechanism 25 is configured to move in the X direction by the common transfer shaft 71 described above.
  • the plate transport mechanism 25 is provided on the same side (front side) of the transfer shaft 71 in plan view.
  • the second holding mechanism 6 that constitutes the plate conveying mechanism 25 is a conveying cylinder that is inserted into a conveying holding hole 281 (see FIG. 10) formed in the holding plate M1. It has a portion 282 (see FIG. 13).
  • the holding plate M1 is identified when the holding plate M1 is taken out from the plate accommodating portion 24 by using the identifier such as the RFID provided on the holding plate M1 to the plate conveying mechanism 25 (second It is read by an identifier reader (not shown) provided in the holding mechanism 6).
  • the identifier such as the RFID provided on the holding plate M1 to the plate conveying mechanism 25 (second It is read by an identifier reader (not shown) provided in the holding mechanism 6).
  • the holding plates of the cutting tables 2A and 2B or the holding table 141 are exchanged.
  • the plate transport mechanism 25 (transport moving mechanism 7 and second holding mechanism 6) takes out new holding plates M1 of the cutting tables 2A and 2B from the plate housing section 24, and holds the cutting tables 2A and 2B. It is conveyed to the base portion M2 in the raised position, and the holding plate M1 is lowered and placed thereon.
  • the fixing cylinder portion 262 when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied.
  • the mover 262b is at the projecting position, and the holding plate M1 is fixed to the holding base portion M2 of the cutting tables 2A and 2B.
  • the plate conveying mechanism 25 takes out the new holding plate M1 of the holding table 141 from the plate accommodating portion 24, and moves it to the holding base portion M2 of the holding table 141 at the raised position.
  • the holding plate M1 is lowered and placed thereon.
  • the fixing cylinder portion 262 when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied.
  • the mover 262b is at the projected position, and the holding plate M1 is fixed to the holding base portion M2 of the holding table 141. As shown in FIG.
  • the plate transport mechanism 25 (the transport moving mechanism 7 and the second holding mechanism 6) takes out the new holding plate M1 of the transfer table 5 from the plate accommodating part 24, and puts it on the holding base part M2 of the transfer table 5.
  • the substrate is transported in the raised position, and the holding plate M1 is lowered and placed.
  • the fixing cylinder portion 262 when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied.
  • the mover 262b is at a projected position, and the holding plate M1 is fixed to the holding base portion M2 of the transfer table 5. As shown in FIG.
  • the order of the replacement operation of the holding plates M1 of the cutting tables 2A and 2B, the replacement operation of the holding plates M1 of the holding table 141, and the replacement operation of the holding plates M1 of the transfer table 5 can be changed as appropriate. be. Also, the holding plate M1 is removed from the holding base portion M2 of the cutting tables 2A and 2B, the holding table 141 and the transfer table 5, and then the holding bases of the cutting tables 2A and 2B, the holding table 141 and the transfer table 5 are removed. A new retaining plate M1 can also be attached to the portion M2.
  • the exchange of the second holding mechanism 6, the cutting tables 2A and 2B, the holding table 141, and the holding plate M1 of the transfer table 5 is a series of operations.
  • the holding plate M1 in at least one of 2A, 2B, the holding table 141, or the transfer table 5 may be exchanged individually.
  • the holding plate M1 of the second holding mechanism 6 constituting the plate transport mechanism 25 is removed in advance. can be considered.
  • the holding plate M1 removed from the holding base portion M2 is conveyed to the plate accommodating portion 24, and the holding plate M1 in the plate accommodating portion 24 is transported. Since the plate transport mechanism 25 transports the holding plate M1 to the holding base portion M2, the holding plate M1 can be automatically replaced with respect to the holding base portion M2. As a result, labor costs for exchanging the holding plate M1 can be reduced. In addition, since the holding plate M1 is automatically replaced, the replacement time of the holding plate M1 can be shortened, and the productivity of the cutting apparatus 100 can be improved. Furthermore, it is possible to reduce variations in the mounting state of the holding plate M1 with respect to the holding base portion M2. Other than that, in the fourth embodiment, the effects produced by the same configuration as in the first to third embodiments are the same.
  • the plurality of products P are transported from the transfer table 5 to the cylindrical container 116 installed in the container installation section 117 by the transporting/storage mechanism 118, and the cylindrical container 116 is A plurality of products P can be accommodated from one end opening 116x of 116 .
  • the plate conveying mechanism 25 is configured using the second holding mechanism 6 and the conveying moving mechanism 7, so that the device configuration can be simplified and the device cost can be reduced. .
  • the container installation portion 117 is provided on the back side of the transfer shaft 71 , but may be provided on the front side of the transfer shaft 71 .
  • cylindrical container 116 installed in the container installation portion 117 may be provided along the Y direction instead of the X direction, or may be provided along another direction. Also good.
  • a twin-cut table system and a twin-spindle configuration cutting device have been described. It may be a cutting device having a twin-spindle configuration.
  • the cutting device (processing device) 100 can be connected between the second cleaning mechanism 19 and the inspection unit 13 or the drying table 112. It can be a modular configuration that can be separated and connected (detachable) between them. In this case, for example, between the module on the side of the second cleaning mechanism 19 and the module on the side of the inspection section 13 or the module on the side of the drying table 112, a module that performs a different type of inspection from that of the inspection section 13 may be provided. can be added.
  • the cutting device (processing device) 100 may have a module configuration that can be separated and connected (detachable) at any point, and the modules to be added may be modules with various functions other than inspection. .
  • processing apparatus of the present invention may perform processing other than cutting, and may perform other mechanical processing such as cutting and grinding.

Abstract

The present invention automatically replaces a holding plate for holding a workpiece and is provided with: a processing mechanism 4 that performs processing on a sealed board W; a plate reception part 24 that receives a holding plate M1 for holding the sealed board W; a holding base part M2 on which the holding plate M1 can be detachably mounted and which holds the sealed board W using the holding plate M1; and a plate conveying mechanism 25 that conveys the holding plate M1 between the plate reception part 24 and the holding base part M2, wherein the plate conveying mechanism 25 conveys the holding plate M1 detached from the holding base part M2 to the plate reception part 24 and conveys the holding plate M1 at the plate reception part 24 to the holding base part M2.

Description

加工装置、及び加工品の製造方法Processing device and manufacturing method of processed product
　本発明は、加工装置、及び加工品の製造方法に関するものである。 The present invention relates to a processing device and a method for manufacturing a processed product.
　従来、特許文献１に示すように、被切断物を切断して個片化された複数の製品を製造する切断装置において、切断用テーブルに対して吸着治具を着脱可能に構成したものが考えられている。 Conventionally, as shown in Patent Document 1, in a cutting apparatus for cutting an object to be cut to manufacture a plurality of individualized products, it has been conceived that a suction jig is detachably attached to a cutting table. It is
特開２０１６－０４００６０号公報JP 2016-040060 A
　しかしながら、上記の切断装置では、単に切断用テーブルに対して吸着治具を着脱可能にしただけであり、実際に吸着治具を交換する際には作業者が作業を行う必要がある。そのため、作業者の人件費がかかるだけでなく、取り付け状態にばらつきが出てしまうという問題がある。また、交換作業に時間がかかってしまい、切断装置の生産性が低下してしまう。 However, in the above-described cutting device, the suction jig is simply detachable from the cutting table, and an operator needs to perform the work when actually replacing the suction jig. As a result, there is a problem that not only is the labor cost of the worker high, but also the mounting state varies. Moreover, the replacement work takes time, and the productivity of the cutting device decreases.
　そこで本発明は、上記問題点を解決すべくなされたものであり、加工対象物を保持するための保持用プレートを自動的に交換することをその主たる課題とするものである。 Accordingly, the present invention has been made to solve the above problems, and its main object is to automatically replace a holding plate for holding an object to be processed.
　すなわち本発明に係る加工装置は、加工対象物を加工する加工機構と、前記加工対象物を保持するための保持用プレートを収容するプレート収容部と、前記保持用プレートが着脱可能に取り付けられ、前記保持用プレートを用いて前記加工対象物を保持する保持ベース部と、前記プレートを前記プレート収容部及び前記保持ベース部の間で搬送するプレート搬送機構とを備え、前記プレート搬送機構は、前記保持ベース部から取り外された前記保持用プレートを前記プレート収容部に搬送し、前記プレート収容部にある前記保持用プレートを前記保持ベース部に搬送することを特徴とする。 That is, a processing apparatus according to the present invention includes a processing mechanism for processing an object to be processed, a plate housing unit for housing a holding plate for holding the object to be processed, and the holding plate are detachably attached, A holding base portion that holds the workpiece using the holding plate; and a plate conveying mechanism that conveys the plate between the plate accommodating portion and the holding base portion, wherein the plate conveying mechanism includes the The holding plate removed from the holding base portion is conveyed to the plate accommodating portion, and the holding plate in the plate accommodating portion is conveyed to the holding base portion.
　このように構成した本発明によれば、加工対象物を保持するための保持用プレートを自動的に交換することができる。 According to the present invention configured in this manner, the holding plate for holding the workpiece can be automatically replaced.
本発明の第１実施形態に係る切断装置の構成を模式的に示す図である。It is a figure showing typically composition of a cutting device concerning a 1st embodiment of the present invention. 同実施形態の切断用テーブル及びその周辺構造を模式的に示す斜視図である。It is a perspective view which shows typically the table for cutting of the same embodiment, and its peripheral structure. 同実施形態の切断用テーブル及びその周辺構造の構成を模式的に示すＺ方向から見た図（平面図）である。It is the figure (plan view) seen from the Z direction which shows typically the structure of the cutting table of the same embodiment, and its peripheral structure. 同実施形態の切断用テーブル及びその周辺構造の構成を模式的に示すＹ方向から見た図（正面図）である。It is the figure (front view) seen from the Y direction which shows typically the structure of the cutting table of the same embodiment, and its peripheral structure. 同実施形態の第１保持機構及び搬送用移動機構の構成を模式的に示すＹ方向から見た図（正面図）である。It is the figure (front view) seen from the Y direction which shows typically the structure of the 1st holding mechanism of the same embodiment, and the moving mechanism for conveyance. 同実施形態の第１保持機構及び搬送用移動機構の構成を模式的に示すＸ方向から見た図（側面図）である。It is the figure (side view) which showed typically the structure of the 1st holding mechanism of the same embodiment, and the moving mechanism for conveyance seen from the X direction. 同実施形態のラックアンドピニオン機構の構成を模式的に示す断面図である。It is a sectional view showing typically composition of a rack and pinion mechanism of the embodiment. 同実施形態の第２保持機構及び搬送用移動機構の構成を模式的に示すＹ方向から見た図（正面図）である。It is the figure (front view) seen from the Y direction which shows typically the structure of the 2nd holding mechanism of the same embodiment, and the moving mechanism for conveyance. 同実施形態の切断装置の動作を示す模式図である。It is a schematic diagram which shows operation|movement of the cutting device of the same embodiment. 同実施形態の保持用プレート及び保持ベース部の構成を示す模式図である。It is a schematic diagram which shows the structure of the holding plate of the same embodiment, and a holding|maintenance base part. 同実施形態の第１搬送機構（トレイ搬送機構）及びプレート収容部を示す斜視図である。It is a perspective view which shows the 1st conveyance mechanism (tray conveyance mechanism) of the same embodiment, and a plate accommodating part. 同実施形態の固定機構の構成を模式的に示す断面図である。It is a sectional view showing typically composition of a fixing mechanism of the embodiment. 同実施形態の第２保持機構の保持ベース部を示す斜視図である。It is a perspective view which shows the holding|maintenance base part of the 2nd holding|maintenance mechanism of the same embodiment. 同実施形態の保持用プレートの交換動作を示す図である。It is a figure which shows the exchange operation|movement of the plate for a holding|maintenance of the same embodiment. 同実施形態の保持用プレートの交換動作を示す図である。It is a figure which shows the exchange operation|movement of the plate for a holding|maintenance of the same embodiment. 第１実施形態におけるプレート搬送機構の変形例の構成を模式的に示す（ａ）Ｚ方向から見た部分図（部分平面図）、（ｂ）Ｘ方向から見た部分図（部分側面図）、及び（ｃ）Ｙ方向から見た部分図（部分正面図）である。(a) A partial view (partial plan view) viewed from the Z direction, (b) A partial view (partial side view) viewed from the X direction, and (c) a partial view (partial front view) seen from the Y direction. 本発明の第２実施形態に係る切断装置の構成を模式的に示す図である。It is a figure which shows typically the structure of the cutting device which concerns on 2nd Embodiment of this invention. 同実施形態の移載テーブル及び載置テーブルの各位置を模式的に示すＺ方向から見た図（平面図）である。It is the figure (plan view) which shows each position of the transfer table of the same embodiment typically, and was seen from the Z direction. 同実施形態の移載テーブル、載置テーブル及び貼付用搬送機構の構成を模式的に示すＹ方向から見た図（正面図）である。It is the figure (front view) seen from the Y direction which shows typically the structure of the transfer table of the same embodiment, a mounting table, and the conveyance mechanism for affixing. 同実施形態の貼付部材の構成を模式的に示す（ａ）平面図、（ｂ）断面図、及び（ｃ）部分拡大断面図である。It is (a) a plan view, (b) a cross-sectional view, and (c) a partially enlarged cross-sectional view schematically showing the configuration of the sticking member of the same embodiment. 同実施形態の載置テーブル、貼付部材収容部及び貼付部材搬送機構の構成を模式的に示すＹ方向から見た図（正面図）である。It is the figure (front view) seen from the Y direction which shows typically the structure of the mounting table of the same embodiment, the affixing member accommodating part, and the affixing member conveyance mechanism. 同実施形態の第１搬送機構（プレート搬送機構）及びプレート収容部を示す斜視図である。It is a perspective view which shows the 1st conveyance mechanism (plate conveyance mechanism) and plate accommodating part of the same embodiment. 同実施形態の（ａ）貼付部材収容部に対して貼付部材を出し入れする場合における貼付部材収容部及びプレート収容部の位置関係を示す図、及び（ｂ）プレート収容部に対して保持用プレートを出し入れする場合における貼付部材収容部及びプレート収容部の位置関係を示す図である。(a) A view showing the positional relationship between the sticking member storage section and the plate storage section when the sticking member is put in and taken out of the sticking member storage section, and (b) a holding plate is attached to the plate storage section in the same embodiment. It is a figure which shows the positional relationship of the affixing member accommodating part and the plate accommodating part in the case of putting in and out. 同実施形態の保持用プレートの交換動作を示す図である。It is a figure which shows the exchange operation|movement of the plate for a holding|maintenance of the same embodiment. 同実施形態の保持用プレートの交換動作を示す図である。It is a figure which shows the exchange operation|movement of the plate for a holding|maintenance of the same embodiment. 変形実施形態の（ａ）載置テーブル、貼付部材収容部及び貼付部材搬送機構の構成を模式的に示すＹ方向から見た図（正面図）、（ｂ）上のガイドレールの間隔が拡がった状態を示す模式図、及び（ｃ）上のガイドレールの間隔が縮まった状態を示す模式図である。(a) A view (front view) schematically showing the configuration of a mounting table, an application member storage section, and an application member transport mechanism of a modified embodiment, viewed from the Y direction (front view), (b) with an increased interval between the guide rails. It is a schematic diagram which shows a state, and a schematic diagram which shows the state where the space|interval of the guide rail on (c) was shortened. 本発明の第３実施形態に係る切断装置の構成を模式的に示す図である。It is a figure which shows typically the structure of the cutting device which concerns on 3rd Embodiment of this invention. 同実施形態の乾燥用テーブル及び収容ボックスの周辺構造を模式的に示すＺ方向から見た図（平面図）である。It is the figure (plan view) seen from the Z direction which shows typically the peripheral structure of the table for drying of the same embodiment, and a storage box. 同実施形態の乾燥用テーブル及び収容ボックスの周辺構造を模式的に示すＹ方向から見た図（正面図）である。It is the figure (front view) seen from the Y direction which shows typically the peripheral structure of the table for drying of the same embodiment, and a storage box. 同実施形態の切断装置の動作を示す模式図である。It is a schematic diagram which shows operation|movement of the cutting device of the same embodiment. 同実施形態のプレート搬送機構及びプレート収容部を示す斜視図である。It is a perspective view which shows the plate conveyance mechanism and plate accommodating part of the same embodiment. 同実施形態の保持用プレートの交換動作を示す図である。It is a figure which shows the exchange operation|movement of the plate for a holding|maintenance of the same embodiment. 本発明の第４実施形態に係る切断装置の構成を模式的に示す図である。It is a figure which shows typically the structure of the cutting device which concerns on 4th Embodiment of this invention. 同実施形態の筒状容器の構成を模式的に示す（ａ）斜視図、及び（ｂ）断面図である。It is (a) a perspective view and (b) sectional drawing which show typically the structure of the cylindrical container of the same embodiment. 同実施形態の移載テーブル及び搬送収容機構の構成を模式的に示すＹ方向から見た図（正面図）である。It is the figure (front view) seen from the Y direction which shows typically the structure of the transfer table of the same embodiment, and a conveyance accommodation mechanism. 同実施形態の保持用プレートの交換動作を示す図である。It is a figure which shows the exchange operation|movement of the plate for a holding|maintenance of the same embodiment.
１００・・・切断装置（加工装置）
Ｗ・・・封止済基板（加工対象物）
Ｐ・・・製品（加工品）
２Ａ、２Ｂ・・・切断用テーブル（加工用テーブル）
４・・・切断機構（加工機構）
５・・・移載テーブル
６・・・第２保持機構（搬送用保持機構、第２搬送機構）
７・・・搬送用移動機構（第２搬送機構）
１４１・・・保持テーブル（検査用テーブル）
２４・・・プレート収容部
Ｍ２・・・保持ベース部
Ｍ１・・・保持用プレート
２５・・・プレート搬送機構
２１・・・トレイ
２２・・・トレイ搬送機構（第１搬送機構）
２６１・・・固定用挿入孔
２６２・・・固定用シリンダ部
２６２ａ・・・シリンダ本体
２６２ｂ・・・可動子
２６２ｃ・・・弾性体
２７・・・仮置き部
２８１・・・搬送用保持孔
２８２・・・搬送用シリンダ部
２９・・・検査機構
２９ａ・・・検査用流路
１０１・・・貼付部材
１０２・・・載置テーブル
１０６・・・貼付部材収容部
１０７・・・貼付部材搬送機構
１０７１・・・第３保持機構（第１搬送機構）
１１１・・・収容ボックス
１１２・・・乾燥用テーブル
１１６・・・筒状容器
１１６ｘ・・・一端開口部
１１７・・・容器設置部
１１８・・・搬送収容機構
１１９・・・中間テーブル
１２０・・・第１製品搬送機構
１２１・・・第２製品搬送機構 100...Cutting device (processing device)
W: Sealed substrate (object to be processed)
P・・・Product (processed product)
2A, 2B... Cutting table (processing table)
4 ... cutting mechanism (processing mechanism)
5: transfer table 6: second holding mechanism (holding mechanism for carrying, second carrying mechanism)
7... Transport moving mechanism (second transport mechanism)
141... Holding table (inspection table)
24 Plate accommodating portion M2 Holding base portion M1 Holding plate 25 Plate conveying mechanism 21 Tray 22 Tray conveying mechanism (first conveying mechanism)
261 Fixing insertion hole 262 Fixing cylinder portion 262a Cylinder main body 262b Mover 262c Elastic body 27 Temporary placement portion 281 Transfer holding hole 282 Cylinder portion 29 for transporting Inspection mechanism 29a Inspection channel 101 Pasting member 102 Placement table 106 Pasting member housing portion 107 Pasting member conveying mechanism 1071... Third holding mechanism (first transport mechanism)
111... Storage box 112... Drying table 116... Cylindrical container 116x... One end opening 117... Container installation part 118... Transport/accommodation mechanism 119... Intermediate table 120...・First product transport mechanism 121 . . . Second product transport mechanism
　次に、本発明について、例を挙げてさらに詳細に説明する。ただし、本発明は、以下の説明により限定されない。 Next, the present invention will be described in more detail with examples. However, the invention is not limited by the following description.
　本発明の加工装置は、前述のとおり、加工対象物を加工する加工機構と、前記加工対象物を保持するための保持用プレートを収容するプレート収容部と、前記保持用プレートが着脱可能に取り付けられ、前記保持用プレートを用いて前記加工対象物を保持する保持ベース部と、前記プレートを前記プレート収容部及び前記保持ベース部の間で搬送するプレート搬送機構とを備え、前記プレート搬送機構は、前記保持ベース部から取り外された前記保持用プレートを前記プレート収容部に搬送し、前記プレート収容部にある前記保持用プレートを前記保持ベース部に搬送することを特徴とする。
　この加工装置であれば、保持ベース部から取り外された保持用プレートをプレート収容部に搬送し、プレート収容部にある保持用プレートを保持ベース部に搬送するプレート搬送機構を有するので、保持ベース部に対して保持用プレートを自動的に交換することができる。その結果、保持用プレートを交換するための人件費を削減することができる。また、保持用プレートを自動的に交換するので、保持ベース部に対する保持用プレートの取り付け状態のばらつきを低減することができる。さらに、保持用プレートを自動的に交換するので、保持用プレートの交換時間を短縮することができ、加工装置の生産性を向上することができる。 As described above, the processing apparatus of the present invention includes a processing mechanism for processing an object to be processed, a plate housing section for housing a holding plate for holding the object to be processed, and the holding plate detachably attached. a holding base portion for holding the workpiece using the holding plate; and a plate transport mechanism for transporting the plate between the plate accommodating portion and the holding base portion, wherein the plate transport mechanism is and conveying the holding plate removed from the holding base portion to the plate accommodating portion, and conveying the holding plate in the plate accommodating portion to the holding base portion.
With this processing apparatus, since it has a plate transport mechanism that transports the holding plate removed from the holding base portion to the plate accommodating portion and transports the holding plate in the plate accommodating portion to the holding base portion, the holding base portion The holding plate can be automatically exchanged for As a result, labor costs for exchanging holding plates can be reduced. Moreover, since the holding plate is automatically replaced, it is possible to reduce variations in the state of attachment of the holding plate to the holding base portion. Furthermore, since the holding plate is automatically exchanged, the time for exchanging the holding plate can be shortened, and the productivity of the processing apparatus can be improved.
　前記プレート搬送機構は、前記保持用プレートを上昇させて搬送することが望ましい。
　この構成であれば、保持用プレートを搬送する際に、保持用プレートと他の部材との干渉を回避して、保持用プレートを容易に搬送することができる。 It is desirable that the plate transport mechanism lifts and transports the holding plate.
With this configuration, when the holding plate is conveyed, interference between the holding plate and other members can be avoided, and the holding plate can be easily conveyed.
　前記プレート搬送機構は、前記加工対象物を加工するための加工用テーブルの保持用プレート、前記加工機構により加工された加工後の前記加工対象物を乾燥するための乾燥用テーブルの保持用プレート、加工後の前記加工対象物を検査するための検査用テーブルの保持用プレート、加工後の前記加工対象物が仕分け前に載置される移載テーブルの保持用プレート、又は、加工後の前記加工対象物を搬送するために保持する搬送用保持機構の保持用プレートの少なくとも１つを搬送することが望ましい。
　この構成であれば、加工用テーブル、検査用テーブル、移載テーブル及び搬送用保持機構それぞれの保持用プレートを自動的に交換することができる。 The plate conveying mechanism includes a processing table holding plate for processing the processing object, a drying table holding plate for drying the processing object processed by the processing mechanism, A holding plate for an inspection table for inspecting the processed workpieces, a holding plate for a transfer table on which the processed workpieces are placed before sorting, or the processed workpieces after processing It is desirable to transport at least one of the holding plates of the transport holding mechanism that holds the object for transport.
With this configuration, it is possible to automatically replace the holding plates of the processing table, the inspection table, the transfer table, and the carrying mechanism.
　本発明の加工装置は、前記加工対象物を搬送する加工対象物搬送機構をさらに備えている。
　この構成において保持用プレートの自動的な交換を可能にしながらも装置構成を簡素化しつつ装置コストを削減するためには、前記プレート搬送機構は、前記加工対象物搬送機構を用いて構成されていることが望ましい。つまり、プレート搬送機構が、加工対象物を搬送する機能を有する構成となる。 The processing apparatus of the present invention further includes a processing object transport mechanism that transports the processing object.
In this configuration, the plate transport mechanism is configured using the workpiece transport mechanism in order to simplify the device configuration and reduce the device cost while enabling automatic replacement of the holding plate. is desirable. In other words, the plate transport mechanism is configured to have a function of transporting the workpiece.
　本発明の加工装置は、加工後の前記加工対象物を、トレイに収容（「トレイ収容」とも呼ばれる。）できる構成とすることができる。この加工装置は、加工後の前記加工対象物が仕分けされるトレイを搬送するトレイ搬送機構をさらに備えている。
　この構成において、保持用プレートの自動的な交換を可能にしながらも装置構成を簡素化しつつ装置コストを削減するためには、前記プレート搬送機構は、前記トレイ搬送機構を用いて構成されていることが望ましい。つまり、プレート搬送機構が、加工後の加工対象物が仕分けされるトレイを搬送する機能を有する構成となる。 The processing apparatus of the present invention can be configured such that the processed object can be accommodated in a tray (also called “tray accommodation”). This processing apparatus further includes a tray transport mechanism that transports a tray on which the processed objects are sorted.
In this configuration, the plate transport mechanism is configured using the tray transport mechanism in order to simplify the device configuration and reduce the device cost while enabling automatic replacement of the holding plate. is desirable. In other words, the plate conveying mechanism has a function of conveying trays in which processed objects are sorted.
　前記プレート搬送機構は、前記プレート収容部と仮置き部との間で前記保持用プレートを搬送する第１搬送機構と、前記仮置き部と前記保持ベース部との間で前記保持用プレートを搬送する第２搬送機構とを有することが望ましい。
　この構成であれば、仮置き部を介して第１搬送機構及び第２搬送機構により保持用プレートを搬送するので、プレート搬送機構を１つの搬送機構で構成する場合に比べて、保持用プレートの搬送先の自由度を増すことができる。 The plate transport mechanism includes a first transport mechanism that transports the holding plate between the plate accommodating portion and the temporary placement portion, and a holding plate that transports the holding plate between the temporary placement portion and the holding base portion. It is desirable to have a second transport mechanism for
With this configuration, the holding plate is transported by the first transporting mechanism and the second transporting mechanism via the temporary placement section. It is possible to increase the degree of freedom of the transport destination.
　前記プレート搬送機構を第１搬送機構及び第２搬送機構により構成する場合には、前記第１搬送機構が、前記貼付部材を前記載置テーブルに搬送し、前記第２搬送機構が、前記個片化された前記加工対象物を搬送することが望ましい。
　この構成であれば、保持用プレートの自動的な交換を可能にしながらも装置構成を簡素化しつつ装置コストを削減することができる。 When the plate conveying mechanism is composed of a first conveying mechanism and a second conveying mechanism, the first conveying mechanism conveys the pasting member to the mounting table, and the second conveying mechanism conveys the individual pieces. It is desirable to convey the processed object that has been processed.
With this configuration, the device cost can be reduced while simplifying the configuration of the device while enabling automatic exchange of the holding plate.
　本発明の加工装置は、個片化された加工対象物を、粘着面を有する貼付部材に貼り付けて収容（「リング収容」とも呼ばれる。）できる構成とすることができる。この加工装置は、前記加工機構により個片化された前記加工対象物が貼り付けられる粘着面を有する貼付部材が載置される載置テーブルをさらに備えている。
　この構成において、前記プレート搬送機構は、前記貼付部材を前記載置テーブルに搬送することができることが望ましい。
　この加工装置であれば、プレート搬送機構が、貼付部材を載置テーブルに搬送することができるので、プレート搬送機構とは別に貼付部材用の搬送機構を設ける必要がなく、個片化された加工対象物を粘着面に貼り付けて収容する加工装置の装置構成を簡素化することができる。さらに、装置コストも削減することができる。その他、個片化された加工対象物に対して、スパッタリング工程又は実装工程などの後工程を行う場合に、個片化された加工対象物が貼り付けられた貼付部材を移動させればよく、その取り扱いを容易にすることができる。 The processing apparatus of the present invention can have a configuration in which individualized workpieces can be accommodated (also called “ring accommodation”) by being attached to an attaching member having an adhesive surface. This processing apparatus further includes a mounting table on which a pasting member having an adhesive surface to which the individualized objects to be processed by the processing mechanism are adhered is placed.
This structure WHEREIN: It is desirable that the said plate conveyance mechanism can convey the said sticking member to the said mounting table.
With this processing apparatus, since the plate conveying mechanism can convey the pasting member to the mounting table, there is no need to provide a conveying mechanism for the pasting member separately from the plate conveying mechanism, and individualized processing can be performed. It is possible to simplify the device configuration of a processing device that stores an object by sticking it on an adhesive surface. Furthermore, equipment costs can also be reduced. In addition, when a post-process such as a sputtering process or a mounting process is performed on the individualized workpiece, the attaching member to which the individualized workpiece is attached may be moved. The handling can be facilitated.
　前記プレート搬送機構は、前記プレート収容部と仮置き部との間で前記保持用プレートを搬送する第１搬送機構と、前記仮置き部と前記保持ベース部との間で前記保持用プレートを搬送する第２搬送機構とを有することが望ましい。
　この構成であれば、仮置き部を介して第１搬送機構及び第２搬送機構により保持用プレートを搬送するので、プレート搬送機構を１つの搬送機構で構成する場合に比べて、保持用プレートの搬送先の自由度を増すことができる。 The plate transport mechanism includes a first transport mechanism that transports the holding plate between the plate accommodating portion and the temporary placement portion, and a holding plate that transports the holding plate between the temporary placement portion and the holding base portion. It is desirable to have a second transport mechanism for
With this configuration, the holding plate is transported by the first transporting mechanism and the second transporting mechanism via the temporary placement section. It is possible to increase the degree of freedom of the transport destination.
　前記プレート搬送機構を第１搬送機構及び第２搬送機構により構成する場合には、前記第１搬送機構が、前記貼付部材を前記載置テーブルに搬送し、前記第２搬送機構が、前記個片化された前記加工対象物を搬送することが望ましい。
　この構成であれば、保持用プレートの自動的な交換を可能にしながらも装置構成を簡素化しつつ装置コストを削減することができる。 When the plate conveying mechanism is composed of a first conveying mechanism and a second conveying mechanism, the first conveying mechanism conveys the pasting member to the mounting table, and the second conveying mechanism conveys the individual pieces. It is desirable to convey the processed object that has been processed.
With this configuration, the device cost can be reduced while simplifying the configuration of the device while enabling automatic exchange of the holding plate.
　装置構成の簡素化するための具体的な実施の態様としては、本発明の加工装置は、前記加工対象物を前記加工用テーブルに搬送するために前記加工対象物を保持する第１保持機構と、前記個片化された前記加工対象物を前記加工用テーブルから搬送するために前記個片化された前記加工対象物を保持する第２保持機構と、前記貼付部材を前記載置テーブルに搬送するための前記貼付部材を保持する第３保持機構と、前記第１保持機構、前記第２保持機構及び前記第３保持機構を移動させるための共通のトランスファ軸を有する搬送用移動機構とをさらに備えることが望ましい。
　この構成において、保持用プレートの自動的な交換を可能にしながらも装置構成を簡素化しつつ装置コストを削減するためには、前記第１搬送機構は、前記第３保持機構及び前記搬送用移動機構を用いて構成され、前記第２搬送機構は、前記第２保持機構及び前記搬送用移動機構を用いて構成されていることが望ましい。 As a specific embodiment for simplifying the configuration of the apparatus, the processing apparatus of the present invention includes a first holding mechanism that holds the object to be processed in order to convey the object to be processed to the processing table; a second holding mechanism for holding the singulated object to convey the singulated object from the processing table; and conveying the pasting member to the mounting table. and a conveying movement mechanism having a common transfer shaft for moving the first holding mechanism, the second holding mechanism and the third holding mechanism. It is desirable to be prepared.
In this configuration, in order to simplify the apparatus configuration and reduce the apparatus cost while enabling automatic replacement of the holding plate, the first transport mechanism includes the third holding mechanism and the transport moving mechanism. and the second transport mechanism is preferably configured using the second holding mechanism and the transport moving mechanism.
　本発明の加工装置は、前記貼付部材を収容する貼付部材収容部をさらに備えている。
　この構成において、加工装置のフットプリントを小型化するためには、前記プレート収容部及び前記貼付部材収容部は互いに上下に配置されていることが望ましい。 The processing apparatus of the present invention further includes an affixing member accommodating section that accommodates the affixing member.
In this configuration, in order to reduce the footprint of the processing apparatus, it is desirable that the plate accommodating section and the attaching member accommodating section are arranged vertically with respect to each other.
　本発明の加工装置は、個片化された加工対象物をばらばらの状態で収容（「バルク収容」とも呼ばれる。）できる構成とすることができる。この加工装置は、前記加工機構により個片化された前記加工対象物が落下して収容される収容ボックスをさらに備えている。
　この構成において、前記プレート搬送機構は、前記個片化された前記加工対象物を前記収容ボックスに搬送することができることが望ましい。
　この加工装置であれば、プレート搬送機構が、個片化された加工対象物を収容ボックスに搬送することができるので、プレート搬送機構とは別の搬送機構を設ける必要がなく、個片化された加工対象物を落下させて収容する加工装置の装置構成を簡素化することができる。さらに、装置コストも削減することができる。その他、個片化された加工対象物を収容ボックスに落下させて収容するので、従来のトレイ収容する構成に比べて、収容スペースを小型化することができる。これによっても、加工装置のフットプリントを低減することができる。 The processing apparatus of the present invention can be configured so that individualized workpieces can be accommodated in a discrete state (also referred to as “bulk accommodation”). This processing apparatus further includes a storage box in which the workpieces separated by the processing mechanism are dropped and stored.
In this configuration, it is desirable that the plate transport mechanism can transport the individualized workpieces to the storage box.
With this processing apparatus, the plate conveying mechanism can convey the singulated workpieces to the storage box. It is possible to simplify the device configuration of the processing device that drops and stores the processed object. Furthermore, equipment costs can also be reduced. In addition, since the individualized workpieces are dropped and stored in the storage box, the storage space can be reduced in comparison with the conventional tray storage configuration. This also reduces the footprint of the processing device.
　また、本発明の加工装置は、個片化された加工対象物を筒状容器に収容（「チューブ収容」とも呼ばれる。）できる構成とすることができる。なお、筒状容器は、チューブ、マガジンスティック、スティックマガジン、スティックなどと呼ばれることがある。この加工装置は、前記個片化された前記加工対象物を一端開口部から収容する筒状容器が設置される容器設置部と、前記個片化された前記加工対象物を前記容器設置部に設置された前記筒状容器に搬送して収容する搬送収容機構とをさらに備えている。 In addition, the processing apparatus of the present invention can be configured so that individualized workpieces can be accommodated in cylindrical containers (also called "tube accommodation"). Note that the cylindrical container is sometimes called a tube, magazine stick, stick magazine, stick, or the like. This processing apparatus includes a container installation section in which a cylindrical container for accommodating the individualized workpieces from one end opening is installed, and the individualized workpieces are placed in the container installation section. It further comprises a transporting/storing mechanism for transporting and storing in the installed cylindrical container.
　上記のバルク収容又はチューブ収容する加工装置の装置構成の簡素化するための具体的な実施の態様としては、本発明の加工装置は、前記加工対象物を前記加工用テーブルに搬送するために前記加工対象物を保持する第１保持機構と、前記個片化された前記加工対象物を前記加工用テーブルから搬送するために前記個片化された前記加工対象物を保持する第２保持機構と、前記第１保持機構及び前記第２保持機構を移動させるための共通のトランスファ軸を有する搬送用移動機構とをさらに備え、前記プレート搬送機構は、前記第２保持機構及び前記搬送用移動機構を用いて構成されていることが望ましい。 As a specific embodiment for simplifying the device configuration of the above-described processing apparatus for bulk storage or tube storage, the processing apparatus of the present invention includes the above-described A first holding mechanism for holding an object to be processed, and a second holding mechanism for holding the individualized object to convey the individualized object from the processing table. and a transfer movement mechanism having a common transfer shaft for moving the first holding mechanism and the second holding mechanism, wherein the plate transfer mechanism moves the second holding mechanism and the transfer movement mechanism. It is desirable to be configured using
　保持用プレートの固定が正確に行われているかを自動的に検査するためには、本発明の加工装置は、前記保持ベース部に対する前記保持用プレートの取り付け状態を検査する検査機構をさらに備えることが望ましい。 In order to automatically inspect whether the fixing of the holding plate is performed correctly, the processing apparatus of the present invention further comprises an inspection mechanism for inspecting the state of attachment of the holding plate to the holding base. is desirable.
　検査機構の具体的な実施の態様としては、前記検査機構は、前記保持用プレートが搭載される搭載面に開口する検査用流路と、前記検査用流路に設けられ、前記開口からの流体の漏れを検知する検知センサとを有することが望ましい。ここで検知センサは、流体の圧力又は流量を測定することによって前記開口からの流体の漏れを検知する。 As a specific embodiment of the inspection mechanism, the inspection mechanism includes an inspection flow path that opens onto a mounting surface on which the holding plate is mounted, and a fluid flow path that is provided in the inspection flow path and that flows from the opening. It would be desirable to have a detection sensor to detect a leak in the air. Here, the detection sensor detects fluid leakage from the opening by measuring the pressure or flow rate of the fluid.
　保持ベース部に対する保持用プレートの固定構造を簡単にするためには、前記保持ベース部は、前記保持用プレートに形成された固定用挿入孔に挿入される固定用シリンダ部を有しており、前記固定用シリンダ部は、前記固定用挿入孔に挿入されるシリンダ本体と、当該シリンダ本体の外側周面から突出した位置及び没入した位置で移動可能に設けられた可動子と、当該可動子を前記シリンダ本体に対して突出した位置となるように力を付与する弾性体とを有し、前記固定用シリンダ部が前記固定用挿入孔に挿入された状態で、前記可動子が突出した位置となることにより、前記保持ベース部に対して前記保持用プレートが固定されることが望ましい。 In order to simplify the fixing structure of the holding plate to the holding base, the holding base has a fixing cylinder inserted into a fixing insertion hole formed in the holding plate, The fixing cylinder part includes a cylinder body inserted into the fixing insertion hole, a mover provided movably at a position protruding from and retracted from the outer peripheral surface of the cylinder body, and the mover. and a position where the mover protrudes in a state in which the fixing cylinder portion is inserted into the fixing insertion hole Accordingly, it is desirable that the holding plate is fixed to the holding base.
　また、プレート搬送機構に対する保持用プレートの着脱構造を簡単にするためには、前記プレート搬送機構は、前記保持用プレートに形成された搬送用保持孔に挿入される搬送用シリンダ部を有しており、前記搬送用シリンダ部は、前記搬送用保持孔に挿入されるシリンダ本体と、当該シリンダ本体の外側周面から突出した位置及び没入した位置で移動可能に設けられた可動子と、当該可動子を前記シリンダ本体に対して突出した位置となるように力を付与する弾性体とを有し、前記搬送用シリンダ部が搬送用挿入孔に挿入された状態で、前記可動子が突出した位置となることにより、前記プレート搬送機構に前記保持用プレートが保持されることが望ましい。 Further, in order to simplify the attachment/detachment structure of the holding plate with respect to the plate conveying mechanism, the plate conveying mechanism has a conveying cylinder portion that is inserted into a conveying holding hole formed in the holding plate. The conveying cylinder portion includes a cylinder body inserted into the conveying holding hole, a mover provided movably at a position protruding from and retracted from the outer peripheral surface of the cylinder body, and the movable element. and an elastic body for exerting a force so that the movable element protrudes from the cylinder main body, and in a state in which the conveying cylinder part is inserted into the conveying insertion hole, the position where the movable element protrudes. Therefore, it is preferable that the holding plate is held by the plate conveying mechanism.
　また、上記の加工装置を用いて加工品を製造する加工品の製造方法も本発明の一態様である。 A method for manufacturing a processed product using the processing apparatus described above is also an aspect of the present invention.
＜本発明の各実施形態＞
　以下に、本発明に係る加工装置の各実施形態について、図面を参照して説明する。なお、以下に示すいずれの図についても、わかりやすくするために、適宜省略し又は誇張して模式的に描かれている。同一の構成要素については、同一の符号を付して説明を適宜省略する。 <Each embodiment of the present invention>
Hereinafter, each embodiment of a processing apparatus according to the present invention will be described with reference to the drawings. It should be noted that all of the drawings shown below are schematically drawn with appropriate omissions or exaggerations for the sake of clarity. The same components are given the same reference numerals, and the description thereof is omitted as appropriate.
＜第１実施形態＞
＜加工装置の全体構成＞
　本実施形態の加工装置１００は、加工対象物である封止済基板Ｗを切断することによって、複数の加工品である製品Ｐに個片化する切断装置である。 <First Embodiment>
<Overall configuration of processing equipment>
The processing apparatus 100 of the present embodiment is a cutting apparatus that separates a sealed substrate W, which is an object to be processed, into a plurality of products P, which are processed products.
　ここで、封止済基板Ｗとは、半導体チップ、抵抗素子、キャパシタ素子等の電子素子が接続された基板に対して、少なくとも電子素子を樹脂封止するように樹脂成形したものである。封止済基板Ｗを構成する基板としては、リードフレーム、プリント配線板を用いることができ、これら以外にも、半導体製基板（シリコンウェーハ等の半導体ウェーハを含む）、金属製基板、セラミック製基板、ガラス製基板、樹脂製基板等を用いることができる。また、封止済基板Ｗを構成する基板には、配線が施されていても施されていなくてもよい。 Here, the sealed substrate W is a substrate to which electronic elements such as a semiconductor chip, a resistor element, a capacitor element, etc. are connected, and at least the electronic elements are resin-molded so as to be resin-sealed. A lead frame and a printed wiring board can be used as the substrate constituting the sealed substrate W. In addition to these, semiconductor substrates (including semiconductor wafers such as silicon wafers), metal substrates, and ceramic substrates can be used. , a glass substrate, a resin substrate, or the like can be used. Further, the substrates constituting the sealed substrate W may or may not be wired.
　また、本実施形態の封止済基板Ｗ及び製品Ｐは、一方の面が後に実装される実装面となる。本実施形態の説明では、後に実装される一方の面を「実装面」と記載し、その反対側の面を「マーク面」と記載する。 Also, one surface of the sealed substrate W and the product P of this embodiment becomes a mounting surface to be mounted later. In the description of this embodiment, one surface to be mounted later is referred to as a "mounting surface", and the opposite surface is referred to as a "mark surface".
　具体的に切断装置１００は、図１に示すように、封止済基板Ｗを保持する２つの切断用テーブル（加工用テーブル）２Ａ、２Ｂと、封止済基板Ｗを切断用テーブル２Ａ、２Ｂに搬送するために封止済基板Ｗを保持する第１保持機構３と、切断用テーブル２Ａ、２Ｂに保持された封止済基板Ｗを切断する切断機構（加工機構）４と、複数の製品Ｐが移される移載テーブル５と、複数の製品Ｐを切断用テーブル２Ａ、２Ｂから移載テーブル５に搬送するために複数の製品Ｐを保持する第２保持機構６と、第１保持機構３及び第２保持機構６を移動させるための共通のトランスファ軸７１を有する搬送用移動機構７と、切断機構４を切断用テーブル２Ａ、２Ｂに保持された封止済基板Ｗに対して移動させる切断用移動機構（加工用移動機構）８とを備えている。なお、第１保持機構３及び搬送用移動機構７により封止済基板Ｗを搬送する搬送機構（ローダ）が構成され、第２保持機構６及び搬送用移動機構７により複数の製品Ｐを搬送する搬送機構（アンローダ）が構成される。 Specifically, as shown in FIG. 1, the cutting apparatus 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W, and cutting tables 2A and 2B that hold the sealed substrate W. a first holding mechanism 3 for holding the sealed substrate W for transporting to the substrate, a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting tables 2A and 2B, and a plurality of products A transfer table 5 to which P is transferred, a second holding mechanism 6 for holding a plurality of products P to transfer the plurality of products P from the cutting tables 2A and 2B to the transfer table 5, and a first holding mechanism 3. and a transfer movement mechanism 7 having a common transfer shaft 71 for moving the second holding mechanism 6, and a cutting mechanism 4 for moving the sealed substrate W held on the cutting tables 2A and 2B. and a moving mechanism for processing (moving mechanism for processing) 8 . The first holding mechanism 3 and the transport moving mechanism 7 constitute a transport mechanism (loader) for transporting the sealed substrate W, and the second holding mechanism 6 and the transport moving mechanism 7 transport a plurality of products P. A transport mechanism (unloader) is configured.
　以下の説明において、切断用テーブル２Ａ、２Ｂの上面に沿った平面（水平面）内で互いに直交する方向をそれぞれ第１方向であるＸ方向及び第２方向であるＹ方向、Ｘ方向及びＹ方向に直交する鉛直方向をＺ方向とする。具体的には、図１の左右方向をＸ方向とし、上下方向をＹ方向とする。後述するが、Ｘ方向は、支持体８１２の移動方向であり、また、門型の支持体８１２における一対の脚部を架け渡される梁部（ビーム部）の長手方向（梁部の延びる方向）に直交する方向である（図２及び図３参照）。 In the following description, the directions orthogonal to each other in the plane (horizontal plane) along the upper surfaces of the cutting tables 2A and 2B are the X direction as the first direction and the Y direction as the second direction, and the X direction and the Y direction. The perpendicular direction is defined as the Z direction. Specifically, the horizontal direction in FIG. 1 is the X direction, and the vertical direction is the Y direction. As will be described later, the X direction is the direction in which the support 812 moves, and the longitudinal direction (the direction in which the beam extends) of the beam that bridges the pair of legs of the gate-shaped support 812 . (see FIGS. 2 and 3).
＜切断用テーブル２Ａ、２Ｂ＞
　２つの切断用テーブル２Ａ、２Ｂは、Ｘ方向、Ｙ方向及びＺ方向に固定して設けられている。なお、切断用テーブル２Ａは、切断用テーブル２Ａの下に設けられた回転機構９Ａによってθ方向に回転可能である。また、切断用テーブル２Ｂは、切断用テーブル２Ｂの下に設けられた回転機構９Ｂによってθ方向に回転可能である。 <Cutting tables 2A and 2B>
The two cutting tables 2A, 2B are fixed in the X, Y and Z directions. The cutting table 2A can be rotated in the .theta. direction by a rotating mechanism 9A provided below the cutting table 2A. Further, the cutting table 2B can be rotated in the .theta. direction by a rotating mechanism 9B provided under the cutting table 2B.
　これら２つの切断用テーブル２Ａ、２Ｂは、水平面上においてＸ方向に沿って設けられている。具体的には、２つの切断用テーブル２Ａ、２Ｂは、それらの上面が同一の水平面上に位置する（Ｚ方向において同じ高さ位置する）ように配置されるとともに（図４参照）、それらの上面の中心（具体的には回転機構９Ａ、９Ｂによる回転中心）がＸ方向に延びる同一直線上に位置するように配置されている（図２及び図３参照）。 These two cutting tables 2A and 2B are provided along the X direction on the horizontal plane. Specifically, the two cutting tables 2A and 2B are arranged such that their upper surfaces are positioned on the same horizontal plane (located at the same height in the Z direction) (see FIG. 4), and their The centers of the upper surfaces (specifically, the centers of rotation of the rotation mechanisms 9A and 9B) are arranged on the same straight line extending in the X direction (see FIGS. 2 and 3).
　また、２つの切断用テーブル２Ａ、２Ｂは、封止済基板Ｗを吸着保持するものであり、図１に示すように、２つの切断用テーブル２Ａ、２Ｂに対応して、吸着保持するための２つの真空ポンプ１０Ａ、１０Ｂが配置されている。各真空ポンプ１０Ａ、１０Ｂは、例えば水封式真空ポンプである。 The two cutting tables 2A and 2B suck and hold the sealed substrate W, and as shown in FIG. Two vacuum pumps 10A, 10B are arranged. Each vacuum pump 10A, 10B is, for example, a water ring vacuum pump.
　ここで、切断用テーブル２Ａ、２ＢがＸＹＺ方向に固定されているため、真空ポンプ１０Ａ、１０Ｂから切断用テーブル２Ａ、２Ｂに接続される配管（不図示）を短くすることができ、配管の圧力損失を低減して、吸着力の低下を防止することができる。その結果、例えば１ｍｍ角以下の極小パッケージであっても確実に切断用テーブル２Ａ、２Ｂに吸着することができる。また、配管の圧力損失による吸着力の低下を防止できるので、真空ポンプ１０Ａ、１０Ｂの容量を小さくすることができ、小型化やコストダウンにもつながる。 Here, since the cutting tables 2A and 2B are fixed in the XYZ directions, the pipes (not shown) connected from the vacuum pumps 10A and 10B to the cutting tables 2A and 2B can be shortened, and the pipe pressure It is possible to reduce the loss and prevent the deterioration of the adsorption force. As a result, even a very small package of, for example, 1 mm square or less can be reliably attracted to the cutting tables 2A and 2B. In addition, since it is possible to prevent a decrease in adsorption force due to pressure loss in the piping, the capacities of the vacuum pumps 10A and 10B can be reduced, leading to miniaturization and cost reduction.
＜第１保持機構３＞
　第１保持機構３は、図１に示すように、封止済基板Ｗを基板供給機構１１から切断用テーブル２Ａ、２Ｂに搬送するために封止済基板Ｗを保持するものである。この第１保持機構３は、図５及び図６に示すように、封止済基板Ｗを吸着保持するための複数の吸着部３１１が設けられた吸着ヘッド３１と、当該吸着ヘッド３１の吸着部３１１に接続された真空ポンプ又は真空エジェクタ（不図示）とを有している。そして、吸着ヘッド３１が、後述する搬送用移動機構７などにより所望の位置に移動されることにより、封止済基板Ｗを基板供給機構１１から切断用テーブル２Ａ、２Ｂに搬送する。 <First holding mechanism 3>
The first holding mechanism 3, as shown in FIG. 1, holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B. As shown in FIGS. 5 and 6, the first holding mechanism 3 includes a suction head 31 provided with a plurality of suction portions 311 for sucking and holding the sealed substrate W, and a suction portion of the suction head 31. 311 connected to a vacuum pump or vacuum ejector (not shown). Then, the suction head 31 is moved to a desired position by a transfer mechanism 7 or the like, which will be described later, to transfer the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B.
　基板供給機構１１は、図１に示すように、複数の封止済基板Ｗが外部から収容される基板収容部１１ａと、当該基板収容部１１ａに収容された封止済基板Ｗを第１保持機構３により吸着保持される保持位置ＲＰに移動させる基板供給部１１ｂとを有している。この保持位置ＲＰは、２つの切断用テーブル２Ａ、２ＢとＸ方向において同列となるように設定されている。なお、基板供給機構１１は、第１保持機構３により吸着される封止済基板Ｗを平らにするため、加熱しながら封止済基板Ｗをプレスする加熱部１１ｃを有していても良い。 As shown in FIG. 1, the substrate supply mechanism 11 includes a substrate accommodating portion 11a in which a plurality of sealed substrates W are accommodated from the outside, and a first holding portion for the sealed substrates W accommodated in the substrate accommodating portion 11a. and a substrate supply part 11b for moving to a holding position RP where the mechanism 3 sucks and holds the substrate. This holding position RP is set so as to be aligned with the two cutting tables 2A and 2B in the X direction. The substrate supply mechanism 11 may have a heating unit 11c that presses the sealed substrate W while heating it so as to flatten the sealed substrate W that is sucked by the first holding mechanism 3 .
＜切断機構４＞
　切断機構４は、図１、図２及び図３に示すように、ブレード４１Ａ、４１Ｂ及び２つのスピンドル部４２Ａ、４２Ｂからなる２つの回転工具４０を有するものである。２つのスピンドル部４２Ａ、４２Ｂは、それらの回転軸がＹ方向に沿うように設けられており、それらに取り付けられるブレード４１Ａ、４１Ｂが互いに対向するように配置される（図３参照）。スピンドル部４２Ａのブレード４１Ａ及びスピンドル部４２Ｂのブレード４１Ｂは、Ｘ方向とＺ方向とを含む面内において回転することによって各切断用テーブル２Ａ、２Ｂに保持された封止済基板Ｗを切断する。なお、本実施形態の切断装置１００には、図４に示すように、ブレード４１Ａ、４１Ｂによって発生する摩擦熱を抑えるために切削水（加工液）を噴射する噴射ノズル１２ａを有する液体供給機構１２が設けられている。この噴射ノズル１２ａは、例えば、後述するＺ方向移動部８３に支持されている。 <Cutting mechanism 4>
The cutting mechanism 4, as shown in FIGS. 1, 2, and 3, has two rotary tools 40, which are blades 41A, 41B and two spindles 42A, 42B. The two spindle parts 42A and 42B are provided so that their rotation axes are along the Y direction, and the blades 41A and 41B attached to them are arranged so as to face each other (see FIG. 3). The blade 41A of the spindle section 42A and the blade 41B of the spindle section 42B cut the sealed substrate W held on each cutting table 2A, 2B by rotating in a plane including the X direction and the Z direction. As shown in FIG. 4, the cutting apparatus 100 of the present embodiment includes a liquid supply mechanism 12 having an injection nozzle 12a for injecting cutting water (working fluid) to suppress frictional heat generated by the blades 41A and 41B. is provided. This injection nozzle 12a is supported by, for example, a Z-direction moving unit 83, which will be described later.
＜移載テーブル５＞
　本実施形態の移載テーブル５は、図１に示すように、後述する検査部１３により検査された複数の製品Ｐが移されるテーブルである。この移載テーブル５は、いわゆるインデックステーブルといわれるものであり、複数の製品Ｐを各種トレイ２１に仕分けする前に、複数の製品Ｐが一時的に載置される。また、移載テーブル５は、２つの切断用テーブル２Ａ、２Ｂと水平面上においてＸ方向に沿って一列に配置される。さらに、移載テーブル５は、Ｙ方向に沿って前後に移動可能であり、仕分け機構２０まで移動することができる。移載テーブル５に載置された複数の製品Ｐは、検査部１３による検査結果（良品、不良品など）に応じて、仕分け機構２０によって各種トレイ２１に仕分けされる。 <Transfer table 5>
The transfer table 5 of the present embodiment, as shown in FIG. 1, is a table to which a plurality of products P inspected by an inspection unit 13, which will be described later, are transferred. This transfer table 5 is a so-called index table, and a plurality of products P are temporarily placed thereon before sorting the plurality of products P onto various trays 21 . Also, the transfer table 5 and the two cutting tables 2A and 2B are arranged in a line along the X direction on the horizontal plane. Furthermore, the transfer table 5 is movable back and forth along the Y direction, and can move up to the sorting mechanism 20 . A plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 according to the inspection results (good products, defective products, etc.) by the inspection unit 13 .
　なお、各種トレイ２１は、トランスファ軸７１に沿って移動するトレイ搬送機構２２により所望の位置に搬送され、仕分け機構２０によって仕分けられる製品Ｐが載置される。仕分けされた後に各種トレイ２１は、トレイ搬送機構２２によりトレイ収容部２３に収容される。本実施形態では、トレイ収容部２３に、例えば製品Ｐを収容する前のトレイ２１、良品の製品Ｐを収容したトレイ２１、リワークが必要な不良品の製品Ｐを収容したトレイ２１といった３種類のトレイを収容するように構成されている。 The various trays 21 are transported to desired positions by the tray transport mechanism 22 that moves along the transfer shaft 71, and the products P sorted by the sorting mechanism 20 are placed thereon. After being sorted, the various trays 21 are accommodated in the tray accommodating section 23 by the tray conveying mechanism 22 . In the present embodiment, the tray storage unit 23 has three types of trays, for example, a tray 21 before storing the product P, a tray 21 storing a good product P, and a tray 21 storing a defective product P that requires rework. configured to receive a tray;
＜検査部１３＞
　ここで、検査部１３は、図１に示すように、切断用テーブル２Ａ、２Ｂと移載テーブル５との間に設けられ、第２保持機構６に保持された複数の製品Ｐを検査するものである。本実施形態の検査部１３は、製品Ｐのマーク面を検査する第１検査部１３１と、製品Ｐの実装面を検査する第２検査部１３２とを有している。第１検査部１３１は、マーク面を検査するための光学系を有する撮像カメラであり、第２検査部１３２は、実装面を検査するための光学系を有する撮像カメラである。なお、第１検査部１３１及び第２検査部１３２を共通としても良い。 <Inspection unit 13>
Here, as shown in FIG. 1, the inspection unit 13 is provided between the cutting tables 2A and 2B and the transfer table 5, and inspects the plurality of products P held by the second holding mechanism 6. is. The inspection unit 13 of this embodiment has a first inspection unit 131 that inspects the mark surface of the product P and a second inspection unit 132 that inspects the mounting surface of the product P. As shown in FIG. The first inspection unit 131 is an imaging camera having an optical system for inspecting the mark surface, and the second inspection unit 132 is an imaging camera having an optical system for inspecting the mounting surface. Note that the first inspection unit 131 and the second inspection unit 132 may be shared.
　また、検査部１３により複数の製品Ｐの両面を検査可能にするために、複数の製品Ｐを反転させる反転機構１４が設けられている（図１参照）。この反転機構１４は、複数の製品Ｐを保持する保持テーブル１４１と、当該保持テーブル１４１を表裏逆となるように反転させるモータなどの反転部１４２とを有している。 In addition, a reversing mechanism 14 for reversing the plurality of products P is provided so that both sides of the plurality of products P can be inspected by the inspection unit 13 (see FIG. 1). The reversing mechanism 14 has a holding table 141 that holds a plurality of products P, and a reversing unit 142 such as a motor that turns the holding table 141 upside down.
　第２保持機構６が切断用テーブル２Ａ、２Ｂから複数の製品Ｐを保持した際には、製品Ｐのマーク面が下側を向いている。この状態で、切断用テーブル２Ａ、２Ｂから反転機構１４に複数の製品Ｐを搬送する途中で、第１検査部１３１により製品Ｐのマーク面が検査される。その後、第２保持機構６に保持された複数の製品Ｐが反転機構１４により反転されて、その後、反転機構１４が移載テーブル５の位置まで移動する。この移動の間に、第２検査部１３２により下側を向いている製品Ｐの実装面が検査される。その後、製品Ｐが移載テーブル５に受け渡される。 When the second holding mechanism 6 holds a plurality of products P from the cutting tables 2A and 2B, the marked surfaces of the products P face downward. In this state, the mark surface of the products P is inspected by the first inspection unit 131 while the plurality of products P are being conveyed from the cutting tables 2A and 2B to the reversing mechanism 14 . After that, the multiple products P held by the second holding mechanism 6 are reversed by the reversing mechanism 14 , and then the reversing mechanism 14 moves to the position of the transfer table 5 . During this movement, the mounting surface of the product P facing downward is inspected by the second inspection unit 132 . After that, the product P is delivered to the transfer table 5 .
＜第２保持機構６＞
　第２保持機構６は、図１に示すように、複数の製品Ｐを切断用テーブル２Ａ、２Ｂから反転機構１４に搬送するために複数の製品Ｐを保持するものである。この第２保持機構６は、図８に示すように、複数の製品Ｐを吸着保持するための複数の吸着部６１１が設けられた吸着ヘッド６１と、当該吸着ヘッド６１の吸着部６１１に接続された真空ポンプ又は真空エジェクタ（不図示）とを有している。そして、吸着ヘッド６１が、後述する搬送用移動機構７などにより所望の位置に移動されることにより、複数の製品Ｐを切断用テーブル２Ａ、２Ｂから保持テーブル１４１に搬送する。 <Second holding mechanism 6>
The second holding mechanism 6 holds a plurality of products P in order to convey the plurality of products P from the cutting tables 2A and 2B to the reversing mechanism 14, as shown in FIG. As shown in FIG. 8 , the second holding mechanism 6 is connected to a suction head 61 provided with a plurality of suction portions 611 for sucking and holding a plurality of products P, and the suction portions 611 of the suction head 61 . and a vacuum pump or vacuum ejector (not shown). Then, the suction head 61 is moved to a desired position by a transfer mechanism 7 or the like, which will be described later, to transfer the plurality of products P from the cutting tables 2A and 2B to the holding table 141 .
＜搬送用移動機構７＞
　搬送用移動機構７は、図１に示すように、第１保持機構３を少なくとも基板供給機構１１と切断用テーブル２Ａ、２Ｂとの間で移動させるとともに、第２保持機構６を少なくとも切断用テーブル２Ａ、２Ｂと保持テーブル１４１との間で移動させるものである。 <Conveyance moving mechanism 7>
As shown in FIG. 1, the transportation moving mechanism 7 moves the first holding mechanism 3 between at least the substrate supply mechanism 11 and the cutting tables 2A and 2B, and moves the second holding mechanism 6 between at least the cutting tables. It is moved between 2A, 2B and the holding table 141 .
　そして、搬送用移動機構７は、図１に示すように、２つの切断用テーブル２Ａ、２Ｂ及び移載テーブル５の配列方向（Ｘ方向）に沿って一直線に延び、第１保持機構３及び第２保持機構６を移動させるための共通のトランスファ軸７１を有する。 As shown in FIG. 1, the transportation moving mechanism 7 extends in a straight line along the arrangement direction (X direction) of the two cutting tables 2A and 2B and the transfer table 5, and the first holding mechanism 3 and the second 2 has a common transfer shaft 71 for moving the holding mechanism 6 .
　このトランスファ軸７１は、第１保持機構３が基板供給機構１１の基板供給部１１ｂの上方に移動できるとともに、第２保持機構６が移載テーブル５の上方に移動できる範囲で設けられている（図１参照）。また、このトランスファ軸７１に対して、第１保持機構３、第２保持機構６、切断用テーブル２Ａ、２Ｂ及び移載テーブル５は、平面視において同じ側（手前側）に設けられている。その他、検査部１３、反転機構１４、各種トレイ２１、トレイ搬送機構２２、トレイ収容部２３、後述する第１クリーニング機構１８及び第２クリーニング機構１９、回収容器１７２も、トランスファ軸７１に対して同じ側（手前側）に設けられている。 The transfer shaft 71 is provided within a range in which the first holding mechanism 3 can move above the substrate supply portion 11b of the substrate supply mechanism 11 and the second holding mechanism 6 can move above the transfer table 5 ( See Figure 1). The first holding mechanism 3, the second holding mechanism 6, the cutting tables 2A and 2B, and the transfer table 5 are provided on the same side (front side) of the transfer shaft 71 in plan view. In addition, the inspection section 13, the reversing mechanism 14, various trays 21, the tray conveying mechanism 22, the tray accommodating section 23, the first cleaning mechanism 18 and the second cleaning mechanism 19 described later, and the collection container 172 are the same with respect to the transfer shaft 71. provided on the side (front side).
　さらに搬送用移動機構７は、図５、図６及び図８に示すように、トランスファ軸７１に沿ってＸ方向に第１保持機構３及び第２保持機構６を移動させるメイン移動機構７２と、トランスファ軸７１に対して第１保持機構３及び第２保持機構６をＺ方向に昇降移動させる昇降移動機構７３と、トランスファ軸７１に対して第１保持機構３及び第２保持機構６をＹ方向に水平移動させる水平移動機構７４とを有している。 Furthermore, as shown in FIGS. 5, 6, and 8, the transporting moving mechanism 7 includes a main moving mechanism 72 that moves the first holding mechanism 3 and the second holding mechanism 6 in the X direction along the transfer shaft 71; A vertical movement mechanism 73 for vertically moving the first holding mechanism 3 and the second holding mechanism 6 with respect to the transfer shaft 71 in the Z direction, and a vertical movement mechanism 73 for vertically moving the first holding mechanism 3 and the second holding mechanism 6 with respect to the transfer shaft 71 in the Y direction. and a horizontal movement mechanism 74 for horizontal movement.
　メイン移動機構７２は、図５～図８に示すように、トランスファ軸７１に設けられ、第１保持機構３及び第２保持機構６をガイドする共通のガイドレール７２１と、当該ガイドレール７２１に沿って第１保持機構３及び第２保持機構６を移動させるラックアンドピニオン機構７２２とを有している。 As shown in FIGS. 5 to 8, the main moving mechanism 72 is provided on the transfer shaft 71 and has a common guide rail 721 for guiding the first holding mechanism 3 and the second holding mechanism 6. and a rack-and-pinion mechanism 722 for moving the first holding mechanism 3 and the second holding mechanism 6 .
　ガイドレール７２１は、トランスファ軸７１に沿ってＸ方向に一直線に延びており、トランスファ軸７１と同様に、第１保持機構３が基板供給機構１１の基板供給部１１ｂの上方に移動できるとともに、第２保持機構６が移載テーブル５の上方に移動できる範囲で設けられている。このガイドレール７２１には、昇降移動機構７３及び水平移動機構７４を介して第１保持機構３及び第２保持機構６が設けられるスライド部材７２３がスライド可能に設けられている。ここで、ガイドレール７２１は第１保持機構３及び第２保持機構６に共通するが、昇降移動機構７３、水平移動機構７４及びスライド部材７２３は、第１保持機構３及び第２保持機構６のそれぞれに対して個別に設けられている。 The guide rail 721 extends straight in the X direction along the transfer shaft 71, and, like the transfer shaft 71, allows the first holding mechanism 3 to move above the substrate supply portion 11b of the substrate supply mechanism 11, 2 A holding mechanism 6 is provided within a range in which it can move above the transfer table 5 . The guide rail 721 is slidably provided with a slide member 723 on which the first holding mechanism 3 and the second holding mechanism 6 are provided via a vertical movement mechanism 73 and a horizontal movement mechanism 74 . Here, the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6, but the vertical movement mechanism 73, the horizontal movement mechanism 74 and the slide member 723 are common to the first holding mechanism 3 and the second holding mechanism 6. provided separately for each.
　ラックアンドピニオン機構７２２は、第１保持機構３及び第２保持機構６に共通のカムラック７２２ａと、第１保持機構３及び第２保持機構６それぞれに設けられ、アクチュエータ（不図示）により回転するピニオンギア７２２ｂとを有している。カムラック７２２ａは、共通のトランスファ軸７１に設けられており、複数のカムラック要素を連結することにより、種々の長さに変更することができるものである。また、ピニオンギア７２２ｂは、スライド部材７２３に設けられ、いわゆるローラピニオンと呼ばれるものであり、図７に示すように、モータの回転軸とともに回転する一対のローラ本体７２２ｂ１と、当該一対のローラ本体７２２ｂ１の間において周方向に等間隔に設けられ、ローラ本体７２２ｂ１に対して転動可能に設けられた複数のローラピン７２２ｂ２とを有するものである。本実施形態のラックアンドピニオン機構７２２は、上記のローラピニオンを用いているので、カムラック７２２ａに対して２つ以上のローラピン７２２ｂ２が接触することになり、正逆方向にバックラッシが発生せず、第１保持機構３及び第２保持機構６をＸ方向に移動させる際に位置決め精度が良くなる。 The rack and pinion mechanism 722 includes a cam rack 722a common to the first holding mechanism 3 and the second holding mechanism 6, and a pinion provided in each of the first holding mechanism 3 and the second holding mechanism 6 and rotated by an actuator (not shown). and a gear 722b. The cam rack 722a is provided on the common transfer shaft 71 and can be varied in length by connecting a plurality of cam rack elements. The pinion gear 722b is provided on the slide member 723 and is called a so-called roller pinion. As shown in FIG. It has a plurality of roller pins 722b2 which are provided at equal intervals in the circumferential direction between the roller bodies 722b1 and are provided so as to be able to roll with respect to the roller body 722b1. Since the rack-and-pinion mechanism 722 of this embodiment uses the roller pinions described above, two or more roller pins 722b2 come into contact with the cam rack 722a. Positioning accuracy is improved when moving the first holding mechanism 3 and the second holding mechanism 6 in the X direction.
　昇降移動機構７３は、図５及び図８に示すように、第１保持機構３及び第２保持機構６それぞれに対応して設けられている。第１保持機構３の昇降移動機構７３は、図５及び図６に示すように、トランスファ軸７１（具体的にはメイン移動機構７２）と第１保持機構３との間に介在して設けられており、Ｚ方向に沿って設けられたＺ方向ガイドレール７３ａと、当該Ｚ方向ガイドレール７３ａに沿って第１保持機構３を移動させるアクチュエータ部７３ｂとを有している。なお、アクチュエータ部７３ｂは、例えばボールねじ機構を用いたものであっても良いし、エアシリンダを用いたものであっても良いし、リニアモータを用いたものであっても良い。なお、第２保持機構６の昇降移動機構７３の構成は、図８に示すように、第１保持機構３の昇降移動機構７３と同様である。 As shown in Figs. 5 and 8, the lifting mechanism 73 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6. The lifting mechanism 73 of the first holding mechanism 3 is interposed between the transfer shaft 71 (specifically, the main moving mechanism 72) and the first holding mechanism 3, as shown in FIGS. It has a Z-direction guide rail 73a provided along the Z-direction, and an actuator portion 73b for moving the first holding mechanism 3 along the Z-direction guide rail 73a. The actuator section 73b may use, for example, a ball screw mechanism, an air cylinder, or a linear motor. The configuration of the up-and-down movement mechanism 73 of the second holding mechanism 6 is the same as that of the up-and-down movement mechanism 73 of the first holding mechanism 3, as shown in FIG.
　水平移動機構７４は、図５、図６及び図８に示すように、第１保持機構３及び第２保持機構６それぞれに対応して設けられている。第１保持機構３の水平移動機構７４は、図５及び図６に示すように、トランスファ軸７１（具体的には昇降移動機構７３）と第１保持機構３との間に介在して設けられており、Ｙ方向に沿って設けられたＹ方向ガイドレール７４ａと、第１保持機構３に対してＹ方向ガイドレール７４ａの一方側に力を付与する弾性体７４ｂと、第１保持機構３をＹ方向ガイドレール７４ａの他方側に移動させるカム機構７４ｃとを有する。ここで、カム機構７４ｃは、偏心カムを用いたものであり、当該偏心カムをモータ等のアクチュエータで回転させることにより、第１保持機構３のＹ方向への移動量を調整することができる。 The horizontal movement mechanism 74 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6, as shown in FIGS. The horizontal movement mechanism 74 of the first holding mechanism 3 is interposed between the transfer shaft 71 (specifically, the vertical movement mechanism 73) and the first holding mechanism 3, as shown in FIGS. Y-direction guide rails 74a provided along the Y-direction, elastic bodies 74b for applying force to the first holding mechanism 3 on one side of the Y-direction guide rails 74a, and the first holding mechanism 3. and a cam mechanism 74c for moving to the other side of the Y-direction guide rail 74a. Here, the cam mechanism 74c uses an eccentric cam, and the amount of movement of the first holding mechanism 3 in the Y direction can be adjusted by rotating the eccentric cam with an actuator such as a motor.
　なお、第２保持機構６の水平移動機構７４の構成は、図８に示すように、第１保持機構３の昇降移動機構７３と同様である。また、第２保持機構６には水平移動機構７４を設けない構成としても良いし、第１保持機構３及び第２保持機構６の両方に水平移動機構７４を設けない構成としても良い。さらに、水平移動機構７４は、昇降移動機構７３と同様に、カム機構７４ｃを用いることなく、例えばボールねじ機構を用いたものであっても良いし、エアシリンダを用いたものであっても良いし、リニアモータを用いたものであっても良い。 The configuration of the horizontal movement mechanism 74 of the second holding mechanism 6 is the same as that of the vertical movement mechanism 73 of the first holding mechanism 3, as shown in FIG. Further, the second holding mechanism 6 may be configured without the horizontal movement mechanism 74 , or both the first holding mechanism 3 and the second holding mechanism 6 may be configured without the horizontal movement mechanism 74 . Further, the horizontal movement mechanism 74 may use, for example, a ball screw mechanism or an air cylinder without using the cam mechanism 74c, like the elevation movement mechanism 73. Alternatively, a linear motor may be used.
＜切断用移動機構（加工用移動機構）＞
　切断用移動機構８は、２つのスピンドル部４２Ａ、４２Ｂそれぞれを、Ｘ方向、Ｙ方向及びＺ方向の各方向に直線移動させるものである。 <Moving mechanism for cutting (moving mechanism for processing)>
The cutting movement mechanism 8 linearly moves each of the two spindles 42A and 42B in the X, Y and Z directions.
　具体的に切断用移動機構８は、図２～図４に示すように、スピンドル部４２Ａ、４２ＢをＸ方向に直線移動させるＸ方向移動部８１と、スピンドル部４２Ａ、４２ＢをＹ方向に直線移動させるＹ方向移動部８２と、スピンドル部４２Ａ、４２ＢをＺ方向に直線移動させるＺ方向移動部８３とを備えている。 Specifically, as shown in FIGS. 2 to 4, the cutting movement mechanism 8 includes an X-direction movement unit 81 that linearly moves the spindles 42A and 42B in the X direction, and a linear movement of the spindles 42A and 42B in the Y direction. and a Z-direction moving portion 83 for linearly moving the spindle portions 42A and 42B in the Z-direction.
　Ｘ方向移動部８１は、２つの切断用テーブル２Ａ、２Ｂで共通のものであり、特に図２及び図３に示すように、２つの切断用テーブル２Ａ、２Ｂを挟んでＸ方向に沿って設けられた一対のＸ方向ガイドレール８１１と、当該一対のＸ方向ガイドレール８１１に沿って移動するとともに、Ｙ方向移動部８２及びＺ方向移動部８３を介してスピンドル部４２Ａ、４２Ｂを支持する支持体８１２とを有している。一対のＸ方向ガイドレール８１１は、Ｘ方向に沿って設けられた２つの切断用テーブル２Ａ、２Ｂの側方に設けられている。また、支持体８１２は、例えば門型のものであり、Ｙ方向に延びる形状を有している。具体的に支持体８１２は、一対のＸ方向ガイドレール８１１から上方に延びる一対の脚部と、当該一対の脚部に架け渡される梁部（ビーム部）とを有し、当該梁部がＹ方向に延びている。 The X-direction moving part 81 is common to the two cutting tables 2A and 2B, and is provided along the X direction with the two cutting tables 2A and 2B interposed therebetween, as particularly shown in FIGS. a pair of X-direction guide rails 811, and a support body that moves along the pair of X-direction guide rails 811 and supports the spindles 42A and 42B via the Y-direction moving portion 82 and the Z-direction moving portion 83. 812. A pair of X-direction guide rails 811 are provided on the sides of the two cutting tables 2A and 2B provided along the X-direction. Further, the support 812 is, for example, a portal type and has a shape extending in the Y direction. Specifically, the support 812 has a pair of legs extending upward from the pair of X-direction guide rails 811 and beams (beams) bridging the pair of legs. extending in the direction
　そして、支持体８１２は、例えば、Ｘ方向に延びるボールねじ機構８１３により、一対のＸ方向ガイドレール８１１上をＸ方向に沿って直線的に往復移動する。このボールねじ機構８１３はサーボモータ等の駆動源（不図示）により駆動される。その他、支持体８１２は、リニアモータ等の他の直動機構により往復移動するように構成しても良い。 The support 812 is linearly reciprocated along the X direction on a pair of X direction guide rails 811 by, for example, a ball screw mechanism 813 extending in the X direction. The ball screw mechanism 813 is driven by a drive source (not shown) such as a servomotor. In addition, the support 812 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
　Ｙ方向移動部８２は、特に図３に示すように、支持体８１２においてＹ方向に沿って設けられたＹ方向ガイドレール８２１と、当該Ｙ方向ガイドレール８２１に沿って移動するＹ方向スライダ８２２とを有している。Ｙ方向スライダ８２２は、例えばリニアモータ８２３により駆動されるものであり、Ｙ方向ガイドレール８２１上を直線的に往復移動する。本実施形態では、２つのスピンドル部４２Ａ、４２Ｂに対応して２つのＹ方向スライダ８２２が設けられている。これにより、２つのスピンドル部４２Ａ、４２Ｂは互いに独立してＹ方向に移動可能とされている。その他、Ｙ方向スライダ８２２は、ボールねじ機構を用いた他の直動機構により往復移動するように構成しても良い。 3, the Y-direction moving part 82 includes a Y-direction guide rail 821 provided along the Y direction on the support 812, and a Y-direction slider 822 that moves along the Y-direction guide rail 821. have. The Y-direction slider 822 is driven by, for example, a linear motor 823 and linearly reciprocates on the Y-direction guide rail 821 . In this embodiment, two Y-direction sliders 822 are provided corresponding to the two spindle portions 42A and 42B. Thereby, the two spindle parts 42A and 42B are movable in the Y direction independently of each other. Alternatively, the Y-direction slider 822 may be configured to reciprocate by another direct acting mechanism using a ball screw mechanism.
　Ｚ方向移動部８３は、図２～図４に示すように、各Ｙ方向スライダ８２２においてＺ方向に沿って設けられたＺ方向ガイドレール８３１と、当該Ｚ方向ガイドレール８３１に沿って移動するとともにスピンドル部４２Ａ、４２Ｂを支持するＺ方向スライダ８３２とを有している。つまり、Ｚ方向移動部８３は、各スピンドル部４２Ａ、４２Ｂに対応して設けられている。Ｚ方向スライダ８３２は、例えば、偏心カム機構（不図示）により駆動されるものであり、Ｚ方向ガイドレール８３１上を直線的に往復移動する。その他、Ｚ方向スライダ８３２は、ボールねじ機構等の他の直動機構により往復移動するように構成しても良い。 As shown in FIGS. 2 to 4, the Z-direction moving part 83 moves along a Z-direction guide rail 831 provided along the Z-direction on each Y-direction slider 822 and moves along the Z-direction guide rail 831. and a Z-direction slider 832 that supports the spindle portions 42A and 42B. That is, the Z-direction moving portion 83 is provided corresponding to each spindle portion 42A, 42B. The Z-direction slider 832 is driven by, for example, an eccentric cam mechanism (not shown), and linearly reciprocates on the Z-direction guide rail 831 . Alternatively, the Z-direction slider 832 may be configured to reciprocate by another direct acting mechanism such as a ball screw mechanism.
　この切断用移動機構８とトランスファ軸７１との位置関係は、図１及び図４に示すように、トランスファ軸７１が、切断用移動機構８の上方において切断用移動機構８を横切るように配置されている。具体的にトランスファ軸７１は、支持体８１２の上方において当該支持体８１２を横切るように配置され、トランスファ軸７１及び支持体８１２は互いに交差する位置関係となる。 As shown in FIGS. 1 and 4, the positional relationship between the moving mechanism 8 for cutting and the transfer shaft 71 is such that the transfer shaft 71 is arranged above the moving mechanism 8 for cutting so as to cross the moving mechanism 8 for cutting. ing. Specifically, the transfer shaft 71 is arranged above the support 812 so as to cross the support 812 , and the transfer shaft 71 and the support 812 have a positional relationship of crossing each other.
＜加工屑収容部１７＞
　また、本実施形態の切断装置１００は、図１に示すように、封止済基板Ｗの切断により生じた端材などの加工屑Ｓを収容する加工屑収容部１７をさらに備えている。 <Processing waste container 17>
The cutting apparatus 100 of the present embodiment further includes a processing waste storage section 17 that stores processing waste S such as offcuts generated by cutting the sealed substrate W, as shown in FIG.
　この加工屑収容部１７は、図２～図４に示すように、切断用テーブル２Ａ、２Ｂの下方に設けられており、平面視において切断用テーブル２Ａ、２Ｂを取り囲む上部開口１７１Ｘを有する案内シュータ１７１と、当該案内シュータ１７１によりガイドされた加工屑Ｓを回収する回収容器１７２とを有している。加工屑収容部１７を切断用テーブル２Ａ、２Ｂの下方に設けることによって、加工屑Ｓの回収率を向上することができる。 As shown in FIGS. 2 to 4, the processing waste container 17 is provided below the cutting tables 2A and 2B, and is a guide chute having an upper opening 171X surrounding the cutting tables 2A and 2B in plan view. 171 and a collection container 172 for collecting the processing waste S guided by the guide shooter 171 . By providing the processing waste container 17 below the cutting tables 2A and 2B, the recovery rate of the processing waste S can be improved.
　案内シュータ１７１は、切断用テーブル２Ａ、２Ｂから飛散又は落下した加工屑Ｓを回収容器１７２に導くものである。本実施形態は、案内シュータ１７１の上部開口１７１Ｘが切断用テーブル２Ａ、２Ｂを取り囲むように構成されているので（図３参照）、加工屑Ｓを取りこぼしにくくなり、加工屑Ｓの回収率を一層向上することができる。また、案内シュータ１７１は、切断用テーブル２Ａ、２Ｂの下に設けられた回転機構９Ａ、９Ｂを取り囲むように設けられており（図４参照）、加工屑Ｓ及び切削水から回転機構９Ａ、９Ｂを保護するように構成されている。 The guide shooter 171 guides the processing waste S scattered or dropped from the cutting tables 2A, 2B to the collection container 172. In this embodiment, since the upper opening 171X of the guide shooter 171 surrounds the cutting tables 2A and 2B (see FIG. 3), it is difficult to remove the processing waste S, and the collection rate of the processing waste S is further improved. can be improved. Further, the guide shooter 171 is provided so as to surround the rotating mechanisms 9A and 9B provided under the cutting tables 2A and 2B (see FIG. 4). is configured to protect
　本実施形態では、加工屑収容部１７は２つの切断用テーブル２Ａ、２Ｂに共通のものとされているが、切断用テーブル２Ａ、２Ｂそれぞれに対応して設けられても良い。 In the present embodiment, the processing waste container 17 is shared by the two cutting tables 2A and 2B, but may be provided for each of the cutting tables 2A and 2B.
　回収容器１７２は、案内シュータ１７１を自重により通過した加工屑Ｓを回収するものであり、本実施形態では、図４等に示すように、２つの切断用テーブル２Ａ、２Ｂそれぞれに対応して設けられている。そして、２つの回収容器１７２は、トランスファ軸の手前側に配置されており、それぞれ独立して切断装置１００の手前側から取り外すことができるように構成されている。この構成により、加工屑Ｓの廃棄等のメンテナンス性を向上することができる。なお、回収容器１７２は、封止済基板Ｗのサイズや、加工屑Ｓのサイズ及び量、作業性などを考慮して、全ての切断用テーブルの下全体に１つ設けて良いし、３つ以上に分割して設けても良い。 The collection container 172 is for collecting the processing waste S that has passed through the guide shooter 171 by its own weight. In this embodiment, as shown in FIG. It is The two collection containers 172 are arranged on the front side of the transfer shaft, and configured to be independently removable from the front side of the cutting device 100 . With this configuration, it is possible to improve maintainability such as disposal of the processing waste S. Considering the size of the sealed substrate W, the size and amount of the processing waste S, the workability, etc., one collection container 172 may be provided under the entire cutting table, or three collection containers may be provided. You may divide|segment more and may provide.
　また、加工屑収容部１７は、図４等に示すように、切削水と加工屑とを分離する分離部１７３を有している。この分離部１７３の構成としては、例えば、回収容器１７２の底面に切削水を通過させる多孔板等のフィルタを設けることが考えられる。この分離部１７３により、回収容器１７２に切削水を溜めることなく、加工屑Ｓを回収することができる。 In addition, as shown in FIG. 4 and the like, the processing waste storage section 17 has a separating section 173 for separating cutting water and processing waste. As for the configuration of the separation unit 173, for example, a filter such as a perforated plate that allows cutting water to pass through the bottom surface of the collection container 172 may be provided. The separation unit 173 allows the processing waste S to be collected without accumulating cutting water in the collection container 172 .
＜第１クリーニング機構１８＞
　また、本実施形態の切断装置１００は、図１及び図５に示すように、切断用テーブル２Ａ、２Ｂに保持された複数の製品Ｐの上面側（実装面）をクリーニングする第１クリーニング機構１８をさらに備えている。この第１クリーニング機構１８は、切断用テーブル２Ａ、２Ｂに保持された複数の製品Ｐの上面に洗浄液及び／又は圧縮空気を噴射する噴射ノズル１８ａ（図５参照）によって、製品Ｐの上面側（実装面）をクリーニングするものである。 <First Cleaning Mechanism 18>
In addition, as shown in FIGS. 1 and 5, the cutting apparatus 100 of the present embodiment includes a first cleaning mechanism 18 that cleans the upper surface side (mounting surface) of the plurality of products P held by the cutting tables 2A and 2B. is further provided. The first cleaning mechanism 18 cleans the upper surfaces of the products P (see FIG. 5) by spray nozzles 18a (see FIG. 5) for spraying cleaning liquid and/or compressed air onto the upper surfaces of the plurality of products P held on the cutting tables 2A and 2B. mounting surface).
　この第１クリーニング機構１８は、図５に示すように、第１保持機構３とともにトランスファ軸７１に沿って移動可能に構成されている。ここでは、第１クリーニング機構１８は、トランスファ軸７１に設けられるガイドレール７２１をスライドするスライド部材７２３に設けられている。ここで、第１クリーニング機構１８及びスライド部材７２３の間には、第１クリーニング機構１８をＺ方向に昇降移動するための昇降移動機構１８１が設けられている。この昇降移動機構１８１は、例えばラックアンドピニオン機構を用いたもの、ボールねじ機構を用いたもの、又はエアシリンダを用いたもの等が考えられる。 The first cleaning mechanism 18 is configured to be movable along the transfer shaft 71 together with the first holding mechanism 3, as shown in FIG. Here, the first cleaning mechanism 18 is provided on a slide member 723 that slides on a guide rail 721 provided on the transfer shaft 71 . Here, between the first cleaning mechanism 18 and the slide member 723, there is provided an elevation movement mechanism 181 for vertically moving the first cleaning mechanism 18 in the Z direction. The lifting mechanism 181 may be, for example, one using a rack and pinion mechanism, one using a ball screw mechanism, or one using an air cylinder.
＜第２クリーニング機構１９＞
　さらに、本発明の切断装置１００は、図１に示すように、第２保持機構６に保持された複数の製品Ｐの下面側（マーク面）をクリーニングする第２クリーニング機構１９をさらに備えている。この第２クリーニング機構１９は、切断用テーブル２Ｂと検査部１３との間に設けられており、第２保持機構６に保持された複数の製品Ｐの下面に洗浄液及び／又は圧縮空気を噴射することによって、製品Ｐの下面側（マーク面）をクリーニングする。つまり、第２保持機構６がトランスファ軸７１に沿って移動される途中において、第２クリーニング機構１９は製品Ｐの下面側（マーク面）をクリーニングする。 <Second Cleaning Mechanism 19>
Furthermore, the cutting apparatus 100 of the present invention further includes a second cleaning mechanism 19 that cleans the lower surface side (mark surface) of the plurality of products P held by the second holding mechanism 6, as shown in FIG. . The second cleaning mechanism 19 is provided between the cutting table 2B and the inspection section 13, and sprays cleaning liquid and/or compressed air onto the lower surfaces of the plurality of products P held by the second holding mechanism 6. By doing so, the lower surface side (mark surface) of the product P is cleaned. That is, while the second holding mechanism 6 is being moved along the transfer shaft 71, the second cleaning mechanism 19 cleans the lower surface side (mark surface) of the product P. As shown in FIG.
＜切断装置１００の動作の一例＞
　次に、切断装置１００の動作の一例を説明する。図９には、切断装置１０の動作における第１保持機構３の移動経路、及び、第２保持機構６の移動経路を示している。なお、本実施形態においては、切断装置１００の動作、例えば封止済基板Ｗの搬送、封止済基板Ｗの切断、製品Ｐの検査、後述する保持用プレートＭ１の交換など、すべての動作や制御は制御部ＣＴＬ（図１参照）により行われる。 <Example of Operation of Cutting Device 100>
Next, an example of operation of the cutting device 100 will be described. FIG. 9 shows the moving path of the first holding mechanism 3 and the moving path of the second holding mechanism 6 in the operation of the cutting device 10. As shown in FIG. In this embodiment, all the operations of the cutting apparatus 100, such as transportation of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, replacement of the holding plate M1 described later, and the like. Control is performed by the control unit CTL (see FIG. 1).
　基板供給機構１１の基板供給部１１ｂは、第１保持機構３により保持される保持位置ＲＰに向けて、基板収容部１１ａに収容された封止済基板Ｗを移動させる。 The substrate supply unit 11b of the substrate supply mechanism 11 moves the sealed substrate W accommodated in the substrate accommodation unit 11a toward the holding position RP held by the first holding mechanism 3.
　次に、搬送用移動機構７は第１保持機構３を保持位置ＲＰに移動させ、第１保持機構３は封止済基板Ｗを吸着保持する。その後、搬送用移動機構７は、封止済基板Ｗを保持した第１保持機構３を切断用テーブル２Ａ、２Ｂに移動させて、第１保持機構３は吸着保持を解除して、封止済基板Ｗを切断用テーブル２Ａ、２Ｂに載置する。このとき、メイン移動機構７２により封止済基板ＷのＸ方向の位置を調整し、水平移動機構７４により封止済基板ＷのＹ方向の位置を調整する。そして、切断用テーブル２Ａ、２Ｂは、封止済基板Ｗを吸着保持する。 Next, the transport moving mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 holds the sealed substrate W by suction. After that, the transfer moving mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting tables 2A and 2B, and the first holding mechanism 3 releases the suction holding, and the sealed substrate W is released. A substrate W is placed on the cutting tables 2A and 2B. At this time, the main moving mechanism 72 adjusts the position of the sealed substrate W in the X direction, and the horizontal moving mechanism 74 adjusts the position of the sealed substrate W in the Y direction. The cutting tables 2A and 2B hold the sealed substrate W by suction.
　ここで、封止済基板Ｗを保持した第１保持機構３を切断用テーブル２Ｂに移動させる場合には、昇降移動機構７３が第１保持機構３を切断用移動機構８（支持体８１２）に物理的に干渉しない位置まで上昇させる。なお、封止済基板Ｗを保持した第１保持機構３を切断用テーブル２Ｂに移動させる際に、支持体８１２を切断用テーブル２Ｂから移載テーブル５側に退避させる場合には、上記のように第１保持機構３を昇降させる必要はない。 Here, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2B, the elevation movement mechanism 73 moves the first holding mechanism 3 to the cutting movement mechanism 8 (support body 812). Raise to a position where there is no physical interference. When the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2B, the support body 812 is retracted from the cutting table 2B to the transfer table 5 side. It is not necessary to raise and lower the first holding mechanism 3 at this time.
　この状態で、切断用移動機構８が２つのスピンドル部４２Ａ、４２ＢをＸ方向及びＹ方向に順次移動させるとともに、切断用テーブル２Ａ、２Ｂが回転することによって、封止済基板Ｗを格子状に切断して個片化する。 In this state, the cutting movement mechanism 8 sequentially moves the two spindles 42A and 42B in the X direction and the Y direction, and the cutting tables 2A and 2B rotate to form the sealed substrate W in a grid pattern. Cut and individualize.
　切断後に、搬送用移動機構７は第１クリーニング機構１８を移動させて、切断用テーブル２Ａ、２Ｂに保持されている複数の製品Ｐの上面側（実装面）をクリーニングする。このクリーニングの後、搬送用移動機構７は、第１保持機構３及び第１クリーニング機構１８を所定の位置に退避させる。 After cutting, the transfer mechanism 7 moves the first cleaning mechanism 18 to clean the upper surface side (mounting surface) of the multiple products P held on the cutting tables 2A and 2B. After this cleaning, the transfer mechanism 7 retracts the first holding mechanism 3 and the first cleaning mechanism 18 to predetermined positions.
　次に、搬送用移動機構７は第２保持機構６を切断後の切断用テーブル２Ａ、２Ｂに移動させ、第２保持機構６は複数の製品Ｐを吸着保持する。その後、搬送用移動機構７は、複数の製品Ｐを保持した第２保持機構６を第２クリーニング機構１９に移動させる。これにより、第２クリーニング機構１９が、第２保持機構６に保持されている複数の製品Ｐの下面側（マーク面）をクリーニングする。 Next, the transfer movement mechanism 7 moves the second holding mechanism 6 to the cutting tables 2A and 2B after cutting, and the second holding mechanism 6 holds the plurality of products P by suction. After that, the transport moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the second cleaning mechanism 19 . Thereby, the second cleaning mechanism 19 cleans the lower surfaces (marked surfaces) of the plurality of products P held by the second holding mechanism 6 .
　クリーニングの後、第２保持機構６に保持された複数の製品Ｐは、検査部１３１で下面側（マーク面）の検査が行われ、その後、反転機構１４に受け渡され、反転機構１４によりマーク面が吸着保持された後、反転される。反転後、反転機構１４が移動し、検査部１３２で製品Ｐの実装面が検査される。このように両面検査がされた後、製品Ｐは反転機構１４から移載テーブル５に受け渡される。移載テーブル５に載置された複数の製品Ｐは、検査部１３による検査結果（良品、不良品など）に応じて、仕分け機構２０によって各種トレイ２１に仕分けされる。 After the cleaning, the plurality of products P held by the second holding mechanism 6 are inspected on the lower surface side (marked surface) by the inspection unit 131, and then transferred to the reversing mechanism 14, where the marks are processed by the reversing mechanism 14. After the face is sucked and held, it is inverted. After the reversal, the reversing mechanism 14 is moved, and the mounting surface of the product P is inspected by the inspection section 132 . After being inspected on both sides in this manner, the product P is transferred from the reversing mechanism 14 to the transfer table 5 . A plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 according to the inspection results (good products, defective products, etc.) by the inspection unit 13 .
＜保持用プレートＭ１の自動交換機能＞
　さらに本実施形態の切断装置１００は、封止済基板Ｗ又は製品Ｐを保持するための保持用プレートＭ１を自動的に交換できる機能を有している。 <Automatic Exchange Function of Holding Plate M1>
Furthermore, the cutting apparatus 100 of this embodiment has a function of automatically exchanging the holding plate M1 for holding the sealed substrate W or the product P. FIG.
　本実施形態では、図１０に示すように、封止済基板Ｗを切断するための切断用テーブル２Ａ、２Ｂ、製品Ｐを検査するための検査用テーブル（保持テーブル１４１）、製品Ｐが仕分け前に載置される移載テーブル５、及び、製品Ｐを搬送するために保持する搬送用保持機構（第２保持機構６）が、交換可能な保持用プレートＭ１と、保持用プレートＭ１が着脱可能に取り付けられ、保持用プレートＭ１を用いて封止済基板Ｗ又は製品Ｐを保持する保持ベース部Ｍ２とを有している。なお、図１０では、切断用テーブル２Ａ、２Ｂの保持用プレートＭ１及び保持ベース部Ｍ２を代表して示しているが、保持テーブル１４１、移載テーブル５及び第２保持機構６も、保持用プレートＭ１及び保持ベース部Ｍ２を有する構成は同じである。 In this embodiment, as shown in FIG. 10, cutting tables 2A and 2B for cutting the sealed substrate W, an inspection table (holding table 141) for inspecting the product P, and the product P before sorting. The transfer table 5 to be placed on the substrate and the holding mechanism for carrying (the second holding mechanism 6) for carrying the product P are exchangeable, and the holding plate M1 is detachable. and a holding base portion M2 that holds the sealed substrate W or product P using a holding plate M1. Although FIG. 10 shows the holding plates M1 and holding base portions M2 of the cutting tables 2A and 2B as representatives, the holding table 141, the transfer table 5 and the second holding mechanism 6 also have holding plates. The configuration with M1 and holding base M2 is the same.
　具体的に切断装置１００は、図１及び図１１に示すように、保持用プレートＭ１を収容するプレート収容部２４と、保持用プレートＭ１をプレート収容部２４及び保持ベース部Ｍ２の間で搬送するプレート搬送機構２５とを備えている。 Specifically, as shown in FIGS. 1 and 11, the cutting device 100 conveys the plate accommodating portion 24 that accommodates the holding plate M1 and the holding plate M1 between the plate accommodating portion 24 and the holding base portion M2. A plate transport mechanism 25 is provided.
　保持用プレートＭ１は、封止済基板Ｗ又は製品Ｐを吸着するための図示しない吸着部（吸着孔）が形成されており、保持ベース部Ｍ２に取り付けられることによって、当該保持ベース部Ｍ２に設けられた吸着流路Ｍ２１を介して封止済基板Ｗ又は製品Ｐを吸着する（図１０参照）。また、保持用プレートＭ１は、切断用テーブル２Ａ、２Ｂに用いられるもの、保持テーブル１４１に用いられるもの、移載テーブル５に用いられるもの、及び、第２保持機構６に用いられるもので、形状又は吸着部の構成などが異なっている。なお、保持用プレートＭ１は、切断用テーブル２Ａ、２Ｂに用いられるもの、保持テーブル１４１に用いられるもの、移載テーブル５に用いられるもの、及び、第２保持機構６に用いられるもので、形状又は吸着部の構成などが共通化して同じにしてもよい。さらに、各種保持用プレートＭ１は、封止済基板Ｗ又は製品Ｐごとに形状又は吸着部の構成などが異なり、封止済基板Ｗ又は製品Ｐに合わせて選択される。 The holding plate M1 is formed with a suction portion (suction hole) (not shown) for sucking the sealed substrate W or the product P, and is mounted on the holding base portion M2 by being attached to the holding base portion M2. The sealed substrate W or the product P is sucked through the suction channel M21 (see FIG. 10). The holding plate M1 is used for the cutting tables 2A and 2B, the holding table 141, the transfer table 5, and the second holding mechanism 6. Alternatively, the configuration of the adsorption section is different. The holding plate M1 is used for the cutting tables 2A and 2B, the holding table 141, the transfer table 5, and the second holding mechanism 6. Alternatively, the configuration of the adsorption unit may be shared and made the same. Further, the various holding plates M1 have different shapes, configurations of suction portions, etc. for each sealed substrate W or product P, and are selected according to the sealed substrate W or product P. FIG.
　また、切断装置１００は、図１０に示すように、保持ベース部Ｍ２に対して保持用プレートＭ１を着脱可能に構成するための固定機構２６が設けられている。具体的に固定機構２６は、保持用プレートＭ１に形成された固定用挿入孔２６１と、保持ベース部Ｍ２に設けられ、保持用プレートＭ１に形成された固定用挿入孔２６１に挿入される固定用シリンダ部２６２を有している。 In addition, as shown in FIG. 10, the cutting device 100 is provided with a fixing mechanism 26 for detachably attaching the holding plate M1 to the holding base portion M2. Specifically, the fixing mechanism 26 includes a fixing insertion hole 261 formed in the holding plate M1 and a fixing insertion hole 261 provided in the holding base portion M2 and inserted into the fixing insertion hole 261 formed in the holding plate M1. It has a cylinder portion 262 .
　固定用シリンダ部２６２は、いわゆるチャックシリンダと呼ばれるものであり、図１２に示すように、固定用挿入孔２６１に挿入されるシリンダ本体２６２ａと、シリンダ本体２６２ａの外側周面から突出した位置及び没入した位置で移動可能に設けられた球状の可動子２６２ｂと、当該可動子２６２ｂをシリンダ本体２６２ａに対して突出した位置となるように力を付与する弾性体２６２ｃとを有し、圧縮空気を供給することによって、可動子２６２ｂが突出した位置（図１２（ａ））と没入した位置（図１２（ｂ））とで切り替えられるように構成されている。 The fixing cylinder part 262 is a so-called chuck cylinder, and as shown in FIG. It has a spherical mover 262b that is movably provided at a position where it is positioned at the position where it is positioned, and an elastic body 262c that applies a force to the mover 262b so that the mover 262b protrudes from the cylinder body 262a. By doing so, the mover 262b is configured to be switched between the protruded position (FIG. 12(a)) and the retracted position (FIG. 12(b)).
　さらに、固定用シリンダ部２６２は、ピストン部２６２ｄを有する。このピストン部２６２ｄは、シリンダ本体２６２ａの内部において、可動子２６２ｂ及び弾性体２６２ｃの間に介在され、圧縮空気によりシリンダ本体２６２ａの内部を移動することによって、可動子２６２ｂを突出した位置及び没入した位置の間で切り替える。このピストン部２６２ｄは、圧縮空気の供給が開始されると、弾性体２６２ｃから受ける力に対抗してシリンダ本体２６２ａの内部を移動し、可動子２６２ｂを没入した位置に移動させ（図１２（ｂ））、圧縮空気の供給が停止されると、弾性体２６２ｃから受ける力によってシリンダ本体２６２ａの内部を移動し、可動子２６２ｂを突出した位置に移動させる（図１２（ａ））。 Furthermore, the fixing cylinder portion 262 has a piston portion 262d. The piston part 262d is interposed between the movable element 262b and the elastic body 262c inside the cylinder main body 262a, and moves inside the cylinder main body 262a by means of compressed air, thereby protruding and retracting the movable element 262b. Switch between positions. When the supply of compressed air is started, the piston portion 262d moves inside the cylinder body 262a against the force received from the elastic body 262c, and moves the mover 262b to the retracted position (FIG. 12(b)). )), when the supply of compressed air is stopped, the force received from the elastic body 262c moves inside the cylinder body 262a to move the mover 262b to the projecting position (FIG. 12(a)).
　また、保持用プレートＭ１に形成された固定用挿入孔２６１は、図１２に示すように、固定用シリンダ部２６２が挿入された状態において、可動子２６２ｂが突出した位置となったときに、当該可動子２６２ｂが引っ掛かり、固定用シリンダ部２６２が抜けないようにする凸部２６１ａを有している。この凸部２６１ａは、突出した位置にある可動子２６２ｂが引っ掛かり、没入した位置にある可動子２６２ｂは引っ掛からない。このため、固定用シリンダ部２６２が固定用挿入孔２６１に挿入された状態で、可動子２６２ｂが突出した位置とすることにより、保持ベース部Ｍ２に対して保持用プレートＭ１が固定される（図１２（ａ）参照）。一方、固定用シリンダ部２６２が固定用挿入孔２６１に挿入された状態で、可動子２６２ｂが没入した位置とすることにより、保持ベース部Ｍ２に対する保持用プレートＭ１の固定が解除される（図１２（ｂ）参照）。 Further, as shown in FIG. 12, the fixing insertion hole 261 formed in the holding plate M1 is in a state in which the fixing cylinder portion 262 is inserted, and when the mover 262b is at a protruded position, It has a convex portion 261a that catches the mover 262b and prevents the fixing cylinder portion 262 from coming off. The protruding portion 261a catches the mover 262b at the projected position, but does not catch the mover 262b at the retracted position. Therefore, when the fixing cylinder portion 262 is inserted into the fixing insertion hole 261, the holding plate M1 is fixed to the holding base portion M2 by setting the mover 262b to a protruding position (Fig. 12(a)). On the other hand, when the fixing cylinder portion 262 is inserted into the fixing insertion hole 261 and the mover 262b is set to the recessed position, the fixing of the holding plate M1 to the holding base portion M2 is released (FIG. 12). (b)).
　プレート収容部２４は、交換前後（使用前後）の保持用プレートＭ１を収容するものであり、図１１に示すように、各保持用プレートＭ１が載置されるスライド棚部２４１を有している。本実施形態では、上側複数段のスライド棚部２４１を交換前の新しい保持用プレートＭ１を収容するものとし、下側複数段のスライド棚部２４１を交換後の古い保持用プレートＭ１を収容するものとしている。このプレート収容部２４は、例えばプレート搬送機構２５により対象となるスライド棚部２４１が前方にスライドされることにより、当該スライド棚部２４１に使用後の古い保持用プレートＭ１が載置される、又は、使用前の新しい保持用プレートＭ１が取り出される。なお、スライド棚部２４１の前辺部には引っ掛け部２４１ａが設けられており、当該引っ掛け部２４１ａを用いて引き出される。 The plate accommodating portion 24 accommodates the holding plates M1 before and after replacement (before and after use), and as shown in FIG. 11, has a slide shelf portion 241 on which each holding plate M1 is placed. . In this embodiment, the slide racks 241 on the upper side accommodate new holding plates M1 before replacement, and the slide shelves 241 on the lower side accommodate old holding plates M1 after replacement. and For example, by sliding the target slide shelf 241 forward by the plate transport mechanism 25, the used old holding plate M1 is placed on the slide shelf 241, or , a new holding plate M1 before use is taken out. A hook portion 241a is provided on the front side portion of the slide shelf portion 241, and the slide shelf portion 241 is pulled out using the hook portion 241a.
　プレート搬送機構２５は、保持ベース部Ｍ２から取り外された保持用プレートＭ１をプレート収容部２４に搬送し、プレート収容部２４にある保持用プレートＭ１を保持ベース部Ｍ２に搬送するものである。また、プレート搬送機構２５は、保持用プレートＭ１を上昇させて搬送することができる。より具体的には、プレート搬送機構２５は、保持用プレートＭ１を上方から保持して上昇させた上昇位置にて、保持用プレートＭ１を水平方向に搬送することができる。ここで、「上昇位置」とは、交換する対象の保持ベース部Ｍ２に取り付けられた保持用プレートＭ１の位置又は搬送中に取り得る最も低い保持用プレートＭ１の位置より、保持用プレートＭ１を上昇させた高さの位置を意味する。 The plate conveying mechanism 25 conveys the holding plate M1 removed from the holding base portion M2 to the plate accommodating portion 24, and conveys the holding plate M1 in the plate accommodating portion 24 to the holding base portion M2. Further, the plate transport mechanism 25 can lift and transport the holding plate M1. More specifically, the plate transport mechanism 25 can transport the holding plate M1 in the horizontal direction at the elevated position where the holding plate M1 is held and raised from above. Here, the "up position" means that the holding plate M1 is raised from the position of the holding plate M1 attached to the holding base portion M2 to be replaced or from the lowest position of the holding plate M1 that can be taken during transportation. It means the position of the height where the
　具体的にプレート搬送機構２５は、図１に示すように、プレート収容部２４と仮置き部２７との間で保持用プレートＭ１を搬送する第１搬送機構２５ａと、仮置き部２７と保持ベース部Ｍ２との間で保持用プレートＭ１を搬送する第２搬送機構２５ｂとを有している。本実施形態の仮置き部２７は、反転機構１４の保持テーブル１４１である。なお、移載テーブル５を仮置き部２７としても良いし、保持テーブル１４１及び移載テーブル５とは別に仮置き部２７を設けても良い。 Specifically, as shown in FIG. 1, the plate conveying mechanism 25 includes a first conveying mechanism 25a for conveying the holding plate M1 between the plate accommodating portion 24 and the temporary placing portion 27, the temporary placing portion 27 and the holding base. and a second transport mechanism 25b that transports the holding plate M1 to and from the portion M2. The temporary placement section 27 of this embodiment is the holding table 141 of the reversing mechanism 14 . The transfer table 5 may be used as the temporary placement section 27 , or the temporary placement section 27 may be provided separately from the holding table 141 and the transfer table 5 .
　第１搬送機構２５ａは、トレイ搬送機構２２を用いて構成されており、加工後の加工対象物Ｗ（製品Ｐ）が仕分けされるトレイ２１を搬送することができる。第２搬送機構２５ｂは、第２保持機構６及び搬送用移動機構７（加工対象物搬送機構）を用いて構成されており、加工対象物Ｗを搬送することができる。つまり、プレート搬送機構２５（第１搬送機構２５ａ及び第２搬送機構２５ｂ）は、上述した共通のトランスファ軸７１によってＸ方向に移動する構成とされている。また、プレート搬送機構２５は、トランスファ軸７１に対して、平面視において同じ側（手前側）に設けられていることになる。 The first transport mechanism 25a is configured using the tray transport mechanism 22, and is capable of transporting the tray 21 for sorting the workpieces W (products P) after processing. The second transport mechanism 25b is configured using the second holding mechanism 6 and the transport moving mechanism 7 (workpiece transport mechanism), and can transport the workpiece W. As shown in FIG. That is, the plate transport mechanism 25 (the first transport mechanism 25a and the second transport mechanism 25b) is configured to move in the X direction by the common transfer shaft 71 described above. Also, the plate transport mechanism 25 is provided on the same side (front side) of the transfer shaft 71 in plan view.
　ここで第１搬送機構２５ａとなるトレイ搬送機構２２では、図１１に示すように、トレイ２１を保持するためのトレイ保持機構２２１に、トレイ２１を保持するための例えば保持爪などのトレイ用保持部２２１ａの他に、保持用プレートＭ１を保持するための例えば保持爪などのプレート用保持部２２１ｂを有している。ここでは、互いに対向する一対の対向辺にトレイ用保持部２２１ａが設けられており、それとは異なる一対の対向辺にプレート用保持部２２１ｂが設けられている。なお、プレート用保持部２２１ｂは、上述したキャッチシリンダを用いた構成としても良い。トレイ搬送機構２２は、プレート用保持部２２１ｂを昇降可能に構成され、保持用プレートＭ１を保持したプレート用保持部２２１ｂを上昇させて上昇位置とした状態で、保持用プレートＭ１を搬送することができる。 Here, in the tray transport mechanism 22, which is the first transport mechanism 25a, as shown in FIG. In addition to the portion 221a, it has a plate holding portion 221b such as a holding claw for holding the holding plate M1. Here, tray holding portions 221a are provided on a pair of opposing sides facing each other, and plate holding portions 221b are provided on a different pair of opposing sides. Note that the plate holding portion 221b may be configured using the above-described catch cylinder. The tray transport mechanism 22 is configured such that the plate holding portion 221b can be moved up and down, and can transport the holding plate M1 in a state in which the plate holding portion 221b holding the holding plate M1 is raised to the raised position. can.
　その他、トレイ搬送機構２２は、第１保持機構３及び第２保持機構６の搬送用移動機構７と同様の構成である。つまり、トレイ搬送機構２２は、図１１に示すように、トランスファ軸７１に沿ってＸ方向にトレイ保持機構を移動させる上述したメイン移動機構７２と、トランスファ軸７１に対してトレイ保持機構２２１をＺ方向に昇降移動させる昇降移動機構７５と、トランスファ軸７１に対してトレイ保持機構２２１をＹ方向に水平移動させる水平移動機構７６とを有している。なお、昇降移動機構７５及び水平移動機構７６は、例えばラックアンドピニオン機構を用いたもの、ボールねじ機構を用いたもの、リニアモータを用いたもの又はエアシリンダを用いたもの等の直動機構により往復移動するように構成されている。 In addition, the tray transport mechanism 22 has the same configuration as the transport moving mechanism 7 of the first holding mechanism 3 and the second holding mechanism 6 . That is, as shown in FIG. 11, the tray transport mechanism 22 includes the above-described main moving mechanism 72 that moves the tray holding mechanism in the X direction along the transfer shaft 71, and the tray holding mechanism 221 that moves in the Z direction with respect to the transfer shaft 71. and a horizontal movement mechanism 76 for horizontally moving the tray holding mechanism 221 in the Y direction with respect to the transfer shaft 71 . The vertical movement mechanism 75 and the horizontal movement mechanism 76 are linear motion mechanisms such as those using a rack and pinion mechanism, a ball screw mechanism, a linear motor, or an air cylinder. configured to move back and forth.
　また、第２搬送機構２５ｂとなる第２保持機構６は、図１３に示すように、保持用プレートＭ１に形成された搬送用保持孔２８１（図１０参照）に挿入される搬送用シリンダ部２８２を有している。本実施形態では、第２保持機構６の保持ベース部Ｍ２の固定用シリンダ部２６２を用いて搬送用シリンダ部２８２を構成している。搬送用保持孔２８１は、上述した固定機構２６の固定用挿入孔２６１と同様の構成である。なお、搬送用保持孔２８１と固定用挿入孔２６１とは、上下逆の構成である。なお、第２保持機構６は、搬送用シリンダ部２８２の代わりに、保持用プレートＭ１の縁部に引っ掛けて保持する保持爪を用いても良い。第２保持機構６は、保持用プレートＭ１を保持する部分を昇降可能に構成され、保持用プレートＭ１を保持した部分を上昇させて上昇位置とした状態で、保持用プレートＭ１を搬送することができる。 As shown in FIG. 13, the second holding mechanism 6 serving as the second conveying mechanism 25b includes a conveying cylinder portion 282 inserted into a conveying holding hole 281 (see FIG. 10) formed in the holding plate M1. have. In this embodiment, the fixing cylinder portion 262 of the holding base portion M2 of the second holding mechanism 6 is used to configure the transfer cylinder portion 282 . The transport holding hole 281 has the same configuration as the fixing insertion hole 261 of the fixing mechanism 26 described above. Note that the holding hole 281 for transportation and the insertion hole 261 for fixing are arranged upside down. It should be noted that the second holding mechanism 6 may use holding claws that are hooked on the edge of the holding plate M1 to hold it, instead of the conveying cylinder portion 282 . The second holding mechanism 6 is configured such that the portion holding the holding plate M1 can be moved up and down, and the holding plate M1 can be transported in a state in which the portion holding the holding plate M1 is raised to the raised position. can.
＜保持用プレートＭ１の検査機構２９＞
　本実施形態の切断装置１００は、図１０及び図１３に示すように、保持ベース部Ｍ２に対する保持用プレートＭ１の取り付け状態を検査する検査機構２９をさらに備えている。 <Inspection Mechanism 29 for Holding Plate M1>
As shown in FIGS. 10 and 13, the cutting device 100 of this embodiment further includes an inspection mechanism 29 that inspects the attachment state of the holding plate M1 to the holding base portion M2.
　この検査機構２９は、保持用プレートＭ１が搭載される搭載面Ｍ２２に開口する検査用流路２９ａと、検査用流路２９ａに設けられ、開口からの流体の漏れを検知する検知センサ（不図示）とを有している。検査用流路２９ａは、保持ベース部Ｍ２の搭載面Ｍ２２に形成された開口を有しており、圧縮空気が供給されるものである。また、検知センサは、検査用流路２９ａを流れる圧縮空気の圧力又は流量を検出することによって、開口からの圧縮空気の漏れを検知するものである。この検査機構２９により、保持ベース部Ｍ２の搭載面Ｍ２２に保持用プレートＭ１が密着して固定されているか否かがわかる。検査機構２９により保持ベース部Ｍ２の搭載面Ｍ２２に保持用プレートＭ１が密着していない場合には、固定機構２６により固定を解除して、再度保持用プレートＭ１を取り付け直すことができる。 The inspection mechanism 29 includes an inspection channel 29a that opens onto the mounting surface M22 on which the holding plate M1 is mounted, and a detection sensor (not shown) that is provided in the inspection channel 29a and detects fluid leakage from the opening. ). The inspection channel 29a has an opening formed in the mounting surface M22 of the holding base portion M2, and is supplied with compressed air. Moreover, the detection sensor detects the leakage of compressed air from the opening by detecting the pressure or flow rate of the compressed air flowing through the inspection flow path 29a. With this inspection mechanism 29, it can be determined whether or not the holding plate M1 is fixed in close contact with the mounting surface M22 of the holding base portion M2. When the inspection mechanism 29 detects that the holding plate M1 is not in close contact with the mounting surface M22 of the holding base portion M2, the fixing mechanism 26 releases the fixing, and the holding plate M1 can be reattached.
＜保持用プレートＭ１の交換動作＞
　次に本実施形態のプレート搬送機構２５による保持用プレートＭ１の交換動作について、図１４及び図１５を参照して説明する。 <Replacement operation of holding plate M1>
Next, the exchange operation of the holding plate M1 by the plate conveying mechanism 25 of this embodiment will be described with reference to FIGS. 14 and 15. FIG.
　なお、以下の交換動作において、プレート収容部２４から保持用プレートＭ１を取り出す際の保持用プレートＭ１の判別は、保持用プレートＭ１に設けられたＲＦＩＤなどの識別子を、第１搬送機構２５ａ（トレイ搬送機構２２）に設けられた識別子リーダ（不図示）により読み取ることにより行う。 In the replacement operation described below, the holding plate M1 is identified when the holding plate M1 is taken out from the plate accommodating portion 24 by using an identifier such as an RFID provided on the holding plate M1 in the first transport mechanism 25a (tray It is read by an identifier reader (not shown) provided in the transport mechanism 22).
（１）移載テーブル５及び保持テーブル１４１の保持用プレートの交換動作（図１４参照） (1) Exchange operation of holding plates of transfer table 5 and holding table 141 (see FIG. 14)
　保持テーブル１４１の保持用プレートＭ１を取り外し、第１搬送機構２５ａ（トレイ搬送機構２２）により保持用プレートＭ１を上昇させて上昇位置とした状態でプレート収容部２４に搬送する。なお、保持テーブル１４１の保持用プレートＭ１を取り外す際には、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にして固定機構２６の固定を解除する。 The holding plate M1 of the holding table 141 is removed, and the holding plate M1 is lifted by the first transport mechanism 25a (tray transport mechanism 22) and transported to the plate accommodating section 24 in the raised position. When removing the holding plate M1 of the holding table 141, compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the recessed position, thereby releasing the fixation of the fixing mechanism 26. FIG.
　次に、第１搬送機構２５ａ（トレイ搬送機構２２）が、プレート収容部２４から保持テーブル１４１の新しい保持用プレートＭ１を取り出し上昇位置とした状態で保持テーブル１４１の保持ベース部Ｍ２に搬送し、保持用プレートＭ１を下降させて載置する。この状態で、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にすると、保持用プレートＭ１が下降して固定用シリンダ部２６２が保持用プレートＭ１の固定用挿入孔２６１に入り、その後、圧縮空気の供給を停止すると、可動子２６２ｂが突出した位置となり、保持テーブル１４１の保持ベース部Ｍ２に対して保持用プレートＭ１が固定される。 Next, the first conveying mechanism 25a (tray conveying mechanism 22) takes out the new holding plate M1 of the holding table 141 from the plate accommodating portion 24 and conveys it to the holding base portion M2 of the holding table 141 in the state of the raised position, The holding plate M1 is lowered and placed. In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the holding plate M1 descends and the fixing cylinder portion 262 moves into the fixing insertion hole 261 of the holding plate M1. After that, when the supply of compressed air is stopped, the mover 262b is at a protruded position, and the holding plate M1 is fixed to the holding base portion M2 of the holding table 141. As shown in FIG.
　また、移載テーブル５の保持用プレートＭ１を取り外し、第１搬送機構２５ａ（トレイ搬送機構２２）により保持用プレートＭ１を上昇させて上昇位置とした状態でプレート収容部２４に搬送する。なお、移載テーブル５の保持用プレートＭ１を取り外す際には、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にして固定機構２６の固定を解除する。 Also, the holding plate M1 of the transfer table 5 is removed, and the holding plate M1 is lifted by the first transport mechanism 25a (tray transport mechanism 22) and transported to the plate accommodating section 24 in the raised position. When removing the holding plate M1 of the transfer table 5, compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the retracted position, thereby releasing the fixation of the fixing mechanism 26. FIG.
　次に、第１搬送機構２５ａ（トレイ搬送機構２２）が、プレート収容部２４から移載テーブル５の新しい保持用プレートＭ１を取り出し上昇位置とした状態で移載テーブル５の保持ベース部Ｍ２に搬送し、保持用プレートＭ１を下降させて載置する。この状態で、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にすると、保持用プレートＭ１が下降して固定用シリンダ部２６２が保持用プレートＭ１の固定用挿入孔２６１に入り、その後、圧縮空気の供給を停止すると、可動子２６２ｂが突出した位置となり、移載テーブル５の保持ベース部Ｍ２に対して保持用プレートＭ１が固定される。 Next, the first transport mechanism 25a (tray transport mechanism 22) takes out the new holding plate M1 of the transfer table 5 from the plate accommodating part 24 and transports it to the holding base part M2 of the transfer table 5 in the state of being in the raised position. Then, the holding plate M1 is lowered and placed. In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the holding plate M1 descends and the fixing cylinder portion 262 moves into the fixing insertion hole 261 of the holding plate M1. After that, when the supply of compressed air is stopped, the mover 262b is at a protruded position, and the holding plate M1 is fixed to the holding base portion M2 of the transfer table 5. As shown in FIG.
　なお、保持テーブル１４１の保持用プレートＭ１の交換と移載テーブル５の保持用プレートＭ１の交換の順番は上記に限られず、逆であっても良いし、保持テーブル１４１及び移載テーブル５それぞれの保持用プレートＭ１を取り外した後に、保持テーブル１４１及び移載テーブル５それぞれに新しい保持用プレートＭ１を取り付けるようにしても良い。 The order of replacement of the holding plate M1 of the holding table 141 and replacement of the holding plate M1 of the transfer table 5 is not limited to the above. A new holding plate M1 may be attached to each of the holding table 141 and the transfer table 5 after removing the holding plate M1.
（２）切断用テーブル２Ａ、２Ｂ及び第２保持機構６の保持用プレートの交換動作（図１５参照） (2) Replacing operation of the cutting tables 2A and 2B and the holding plates of the second holding mechanism 6 (see FIG. 15)
　切断用テーブル２Ａ、２Ｂの保持用プレートＭ１を取り外し、第２搬送機構２５ｂ（搬送用移動機構７及び第２保持機構６）により保持用プレートＭ１を上昇させて上昇位置とした状態で仮置き部２７である保持テーブル１４１に搬送し、保持用プレートＭ１を下降させて載置する。なお、切断用テーブル２Ａ、２Ｂの保持用プレートＭ１を取り外す際には、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にして固定機構２６の固定を解除する。ここで、保持テーブル１４１を仮置き部２７とする場合には、保持テーブル１４１を予め取り外しておくことが望ましい。 The holding plates M1 of the cutting tables 2A and 2B are removed, and the holding plates M1 are lifted by the second conveying mechanism 25b (the conveying moving mechanism 7 and the second holding mechanism 6) to the elevated position. 27, and the holding plate M1 is lowered and placed thereon. When the holding plates M1 of the cutting tables 2A and 2B are removed, compressed air is supplied to the fixing cylinder portion 262 so that the mover 262b is retracted to release the fixation of the fixing mechanism 26. FIG. Here, when the holding table 141 is used as the temporary placement unit 27, it is desirable to remove the holding table 141 in advance.
　また、第１搬送機構２５ａ（トレイ搬送機構２２）が、保持テーブル１４１に載置された切断用テーブル２Ａ、２Ｂの保持用プレートＭ１を上昇させて上昇位置とした状態でプレート収容部２４に搬送し、保持用プレートＭ１を下降させて収容する。 In addition, the first transport mechanism 25a (tray transport mechanism 22) lifts the holding plates M1 of the cutting tables 2A and 2B placed on the holding table 141 and transports them to the plate accommodating section 24 in the raised position. Then, the holding plate M1 is lowered and accommodated.
　次に、第１搬送機構２５ａ（トレイ搬送機構２２）が、プレート収容部２４から切断用テーブル２Ａ、２Ｂの新しい保持用プレートＭ１を取り出し上昇位置とした状態で、仮置き部２７である保持テーブル１４１に搬送し、保持用プレートＭ１を下降させて載置する。 Next, the first conveying mechanism 25a (tray conveying mechanism 22) takes out the new holding plates M1 of the cutting tables 2A and 2B from the plate accommodating portion 24, and the holding table serving as the temporary placing portion 27 is moved to the raised position. 141, and the holding plate M1 is lowered and placed thereon.
　そして、第２搬送機構２５ｂ（搬送用移動機構７及び第２保持機構６）が、保持テーブル１４１に載置された新しい保持用プレートＭ１を切断用テーブル２Ａ、２Ｂの保持ベース部Ｍ２に上昇位置とした状態で搬送し、保持用プレートＭ１を下降させて載置する。この状態で、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にすると、固定用シリンダ部２６２が保持用プレートＭ１の固定用挿入孔２６１に入り、その後、圧縮空気の供給を停止すると、可動子２６２ｂが突出した位置となり、切断用テーブル２Ａ、２Ｂの保持ベース部Ｍ２に対して保持用プレートＭ１が固定される。 Then, the second transport mechanism 25b (the transport moving mechanism 7 and the second holding mechanism 6) moves the new holding plate M1 placed on the holding table 141 to the holding base portion M2 of the cutting tables 2A and 2B at the raised position. The holding plate M1 is lowered and placed thereon. In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied. When the supply is stopped, the mover 262b is at the projecting position, and the holding plate M1 is fixed to the holding base portion M2 of the cutting tables 2A and 2B.
　第２保持機構６の保持用プレートＭ１を交換する場合には、搬送用移動機構７により第２保持機構６を仮置き部２７である保持テーブル１４１に移動させるとともに、保持用プレートＭ１を下降させて取り外し、仮置き部２７である保持テーブル１４１に保持用プレートＭ１を載置する。なお、第２保持機構６の保持用プレートＭ１を取り外す際には、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にして固定機構２６の固定を解除する。 When replacing the holding plate M1 of the second holding mechanism 6, the transport moving mechanism 7 moves the second holding mechanism 6 to the holding table 141, which is the temporary placement unit 27, and lowers the holding plate M1. , and the holding plate M1 is placed on the holding table 141, which is the temporary placement unit 27. As shown in FIG. When removing the holding plate M1 of the second holding mechanism 6, compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the recessed position, thereby releasing the fixing of the fixing mechanism 26. FIG.
　そして、第１搬送機構２５ａ（トレイ搬送機構２２）が、保持テーブル１４１に載置された第２保持機構６の保持用プレートＭ１を上昇させて上昇位置とした状態でプレート収容部２４に搬送し、保持用プレートＭ１を下降させて収容する。ここで、保持テーブル１４１を仮置き部２７とする場合には、保持テーブル１４１の保持用プレートＭ１を予め取り外しておくことが望ましい Then, the first conveying mechanism 25a (tray conveying mechanism 22) raises the holding plate M1 of the second holding mechanism 6 placed on the holding table 141 and conveys it to the plate accommodating section 24 in a raised position. , the holding plate M1 is lowered and accommodated. Here, when the holding table 141 is used as the temporary placement unit 27, it is desirable to remove the holding plate M1 of the holding table 141 in advance.
　次に、第１搬送機構２５ａ（トレイ搬送機構２２）が、プレート収容部２４から第２保持機構６の新しい保持用プレートＭ１を取り出し上昇位置とした状態で仮置き部２７である保持テーブル１４１に搬送し、保持用プレートＭ１を下降させて載置する。 Next, the first conveying mechanism 25a (tray conveying mechanism 22) takes out the new holding plate M1 of the second holding mechanism 6 from the plate accommodating portion 24 and places it on the holding table 141, which is the temporary placing portion 27, in a raised position. Then, the holding plate M1 is lowered and placed.
　そして、搬送用移動機構７により第２保持機構６を保持テーブル１４１に移動させ、保持ベース部Ｍ２を下降させて、保持テーブル１４１に載置された新しい保持用プレートＭ１が取り付けられる。ここでは、搬送用移動機構７により第２保持機構６の保持ベース部Ｍ２に設けられた固定用シリンダ部２６２が保持用プレートＭ１に形成された固定用挿入孔２６１に差し込まれる。この状態で、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にすると、固定用シリンダ部２６２が保持用プレートＭ１の固定用挿入孔２６１に入り、その後、圧縮空気の供給を停止すると、可動子２６２ｂが突出した位置となり、第２保持機構６の保持ベース部Ｍ２に対して保持用プレートＭ１が固定される。 Then, the second holding mechanism 6 is moved to the holding table 141 by the transfer moving mechanism 7, the holding base portion M2 is lowered, and the new holding plate M1 placed on the holding table 141 is attached. Here, the fixing cylinder portion 262 provided in the holding base portion M2 of the second holding mechanism 6 is inserted into the fixing insertion hole 261 formed in the holding plate M1 by the transportation moving mechanism 7 . In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied. When the supply is stopped, the mover 262b is at a projected position, and the holding plate M1 is fixed to the holding base portion M2 of the second holding mechanism 6. As shown in FIG.
　なお、切断用テーブル２Ａ、２Ｂの保持用プレートＭ１を交換する際に、第２搬送機構２５ｂとなる第２保持機構６の保持用プレートＭ１を予め取り外しておくことが望ましい。 It should be noted that when replacing the holding plates M1 of the cutting tables 2A and 2B, it is desirable to previously remove the holding plate M1 of the second holding mechanism 6, which serves as the second transport mechanism 25b.
　また、移載テーブル５、保持テーブル１４１、切断用テーブル２Ａ、２Ｂ及び第２保持機構６の保持用プレートＭ１の交換を一連の動作としても行ってもよい。例えば、移載テーブル５、保持テーブル１４１、第２保持機構６及び切断用テーブル２Ａ、２Ｂの保持用プレートＭ１をこの順に取り外し、その後、切断用テーブル２Ａ、２Ｂ、第２保持機構６、保持テーブル１４１及び移載テーブル５の保持用プレートＭ１をこの順で取り付けることが考えられる。 Further, replacement of the transfer table 5, the holding table 141, the cutting tables 2A and 2B, and the holding plate M1 of the second holding mechanism 6 may be performed as a series of operations. For example, the transfer table 5, the holding table 141, the second holding mechanism 6, and the holding plates M1 of the cutting tables 2A and 2B are removed in this order, and then the cutting tables 2A and 2B, the second holding mechanism 6, and the holding table are removed. 141 and the holding plate M1 of the transfer table 5 may be attached in this order.
＜本実施形態の効果＞
　本実施形態の切断装置１００によれば、保持ベース部Ｍ２から取り外された保持用プレートＭ１をプレート収容部２４に搬送し、プレート収容部２４にある保持用プレートＭ１を保持ベース部Ｍ２に搬送するプレート搬送機構２５を有するので、保持ベース部Ｍ２に対して保持用プレートＭ１を自動的に交換することができる。その結果、保持用プレートＭ１を交換するための人件費を削減することができる。また、保持用プレートＭ１を自動的に交換するので、保持用プレートＭ１の交換時間を短縮することができ、切断装置１００の生産性を向上することができる。さらに、保持ベース部Ｍ２に対する保持用プレートＭ１の取り付け状態のばらつきを低減することができる。 <Effects of this embodiment>
According to the cutting device 100 of this embodiment, the holding plate M1 removed from the holding base portion M2 is conveyed to the plate accommodating portion 24, and the holding plate M1 in the plate accommodating portion 24 is conveyed to the holding base portion M2. Since the plate conveying mechanism 25 is provided, the holding plate M1 can be automatically exchanged with respect to the holding base portion M2. As a result, labor costs for exchanging the holding plate M1 can be reduced. In addition, since the holding plate M1 is automatically replaced, the replacement time of the holding plate M1 can be shortened, and the productivity of the cutting apparatus 100 can be improved. Furthermore, it is possible to reduce variations in the mounting state of the holding plate M1 with respect to the holding base portion M2.
　また、プレート搬送機構２５が、プレート収容部２４と仮置き部２７との間で保持用プレートＭ１を搬送する第１搬送機構２５ａと、仮置き部２７と保持ベース部Ｍ２との間で保持用プレートＭ１を搬送する第２搬送機構２５ｂとを有するので、プレート搬送機構２５を１つの搬送機構で構成する場合に比べて、保持用プレートＭ１の搬送先の自由度を増すことができる。ここで、第１搬送機構２５ａをトレイ搬送機構２２を用いて構成しているので、装置構成を簡素化するとともに装置コストを削減することができる。また、第２搬送機構２５ｂを第２保持機構６及び搬送用移動機構７を用いて構成しているので、装置構成を簡素化するとともに装置コストを削減することができる。 Further, the plate transport mechanism 25 includes a first transport mechanism 25a that transports the holding plate M1 between the plate accommodating portion 24 and the temporary placement portion 27, and a holding mechanism between the temporary placement portion 27 and the holding base portion M2. Since it has the second transport mechanism 25b for transporting the plate M1, the degree of freedom of the transport destination of the holding plate M1 can be increased compared to the case where the plate transport mechanism 25 is composed of one transport mechanism. Here, since the first transport mechanism 25a is configured using the tray transport mechanism 22, the device configuration can be simplified and the device cost can be reduced. Further, since the second transport mechanism 25b is configured using the second holding mechanism 6 and the transport moving mechanism 7, the device configuration can be simplified and the device cost can be reduced.
　その他、本実施形態では、切断用テーブル２Ａ、２Ｂ及び移載テーブル５の配列方向に沿って延びる共通のトランスファ軸７１により第１保持機構３及び第２保持機構６を移動させる構成とし、切断用移動機構８により切断機構４を水平面においてトランスファ軸７１に沿ったＸ方向及びＸ方向に直交するＹ方向それぞれに移動させるので、切断用テーブル２Ａ、２ＢをＸ方向及びＹ方向に移動させることなく、封止済基板Ｗを加工することができる。このため、切断用テーブル２Ａ、２Ｂをボールねじ機構により移動させることなく、ボールねじ機構を保護するための蛇腹部材及び当該蛇腹部材を保護するためのカバー部材を不要にすることができる。その結果、切断装置１００の装置構成を簡素化することができる。また、切断用テーブル２Ａ、２ＢをＸ方向及びＹ方向に移動しない構成にすることができ、切断装置１００のフットプリントを低減することができる。 In addition, in this embodiment, the first holding mechanism 3 and the second holding mechanism 6 are moved by a common transfer shaft 71 extending along the arrangement direction of the cutting tables 2A and 2B and the transfer table 5. Since the cutting mechanism 4 is moved in the horizontal plane by the moving mechanism 8 in the X direction along the transfer shaft 71 and in the Y direction orthogonal to the X direction, the cutting tables 2A and 2B are not moved in the X direction and the Y direction. The sealed substrate W can be processed. Therefore, the bellows member for protecting the ball screw mechanism and the cover member for protecting the bellows member can be eliminated without moving the cutting tables 2A and 2B by the ball screw mechanism. As a result, the configuration of the cutting device 100 can be simplified. Moreover, the cutting tables 2A and 2B can be configured so as not to move in the X and Y directions, and the footprint of the cutting device 100 can be reduced.
＜第１実施形態の変形例＞
　例えば、前記第１実施形態では、切断用テーブル２Ａ、２Ｂ、検査用テーブル（保持テーブル１４１）、移載テーブル５、及び、搬送用保持機構（第２保持機構６）それぞれの保持用プレートＭ１を自動的に交換する構成であったが、切断用テーブル２Ａ、２Ｂ、検査用テーブル（保持テーブル１４１）、移載テーブル５、及び、搬送用保持機構（第２保持機構６）の少なくとも１つを自動的に交換する構成としても良い。 <Modified Example of First Embodiment>
For example, in the first embodiment, the holding plates M1 of the cutting tables 2A and 2B, the inspection table (holding table 141), the transfer table 5, and the carrying mechanism (second holding mechanism 6) are Although it was configured to be replaced automatically, at least one of the cutting tables 2A and 2B, the inspection table (holding table 141), the transfer table 5, and the holding mechanism for transportation (second holding mechanism 6) It is good also as a structure which exchanges automatically.
　前記第１実施形態のプレート搬送機構２５は、第１搬送機構２５ａ及び第２搬送機構２５ｂを有する構成であったが、単一の搬送機構を有する構成としても良い。また、プレート搬送機構２５は、トレイ搬送機構２２を用いない構成としても良いし、第２保持機構６及び搬送用移動機構７（加工対象物搬送機構）を用いない構成としても良い。 Although the plate conveying mechanism 25 of the first embodiment has the first conveying mechanism 25a and the second conveying mechanism 25b, it may have a single conveying mechanism. Further, the plate transport mechanism 25 may be configured without the tray transport mechanism 22, or may be configured without the second holding mechanism 6 and transport moving mechanism 7 (processing object transport mechanism).
　プレート搬送機構２５にトレイ搬送機構を用いない構成の一例として、例えば図１６に示すものが考えられる。この切断装置１００は、トレイ搬送機構２２を有さないものであり、各種トレイ２１がトレイ移動機構ＴＭによってプレート収容部２４の下方を移動することにより、仕分け機構２０により製品Ｐが仕分けられる仕分け位置に移動するように構成されている。なお、トレイ移動機構ＴＭは、Ｙ方向に沿って延びる搬送レールＴＭ１と、当該搬送レールＴＭ１上でトレイ２１を移動させる移動機構（不図示）と、各種トレイ２１をＸ方向に移動する移動機構ＴＭ２と、各種トレイ２１毎に設けられ、各種トレイ２１をＺ方向に移動する移動機構ＴＭ３とを有している。この切断装置１００において、プレート搬送機構２５は、第２保持機構６及び搬送用移動機構７を用いて構成することができる。 As an example of a configuration that does not use a tray transport mechanism for the plate transport mechanism 25, for example, the one shown in FIG. 16 can be considered. This cutting apparatus 100 does not have a tray transport mechanism 22, and various trays 21 are moved below the plate accommodating section 24 by the tray moving mechanism TM, thereby sorting the products P by the sorting mechanism 20. configured to move to The tray moving mechanism TM includes a transport rail TM1 extending along the Y direction, a moving mechanism (not shown) for moving the tray 21 on the transport rail TM1, and a moving mechanism TM2 for moving the various trays 21 in the X direction. and a moving mechanism TM3 that is provided for each tray 21 and moves each tray 21 in the Z direction. In this cutting apparatus 100 , the plate transport mechanism 25 can be configured using the second holding mechanism 6 and transport moving mechanism 7 .
　また、前記第１実施形態のプレート収容部２４は、切断用テーブル２Ａ、２Ｂ、検査用テーブル（保持テーブル１４１）、移載テーブル５、及び、搬送用保持機構（第２保持機構６）それぞれの保持用プレートＭ１を収容するものであったが、保持用プレートＭ１の種類に応じて専用のプレート収容部２４を複数設ける構成としても良い。 Further, the plate accommodating portion 24 of the first embodiment includes the cutting tables 2A and 2B, the inspection table (holding table 141), the transfer table 5, and the conveying holding mechanism (second holding mechanism 6). Although the holding plate M1 is accommodated, a plurality of dedicated plate accommodating portions 24 may be provided according to the type of the holding plate M1.
　また、前記第１実施形態の移載テーブル５は、各種トレイ２１に仕分ける前に一時的に載置されるインデックステーブルであったが、移載テーブル５を反転機構１４の保持テーブル１４１としても良い。 Further, the transfer table 5 of the first embodiment is an index table that is temporarily placed before sorting into the various trays 21, but the transfer table 5 may be used as the holding table 141 of the reversing mechanism 14. .
　その上、前記第１実施形態の構成において、切断用テーブル２Ａ、２Ｂにおいて封止済基板を切断することなく、溝を形成する構成としても良い。この場合、例えば、切断用テーブル２Ａ、２Ｂで溝加工が施された封止済基板Ｗは、第１保持機構３及び搬送用移動機構７によって、基板供給部１１ｂに戻す構成としても良い。また、この基板供給部１１ｂに戻された封止済基板Ｗを基板収容部１１ａに収容する構成としても良い。 Moreover, in the configuration of the first embodiment, the grooves may be formed without cutting the sealed substrate on the cutting tables 2A and 2B. In this case, for example, the sealed substrate W grooved by the cutting tables 2A and 2B may be returned to the substrate supply section 11b by the first holding mechanism 3 and the transfer movement mechanism 7. FIG. Alternatively, the sealed substrate W returned to the substrate supply section 11b may be accommodated in the substrate accommodation section 11a.
＜本発明の第２実施形態＞
　次に、本発明の第２実施形態について説明する。
　第２実施形態の切断装置１００は、前記第１実施形態のトレイ収容とは異なり、複数の製品Ｐを粘着面１０１ｘを有する貼付部材１０１に貼り付けて収容（「リング収容」とも呼ばれる。）できるように構成されている。 <Second embodiment of the present invention>
Next, a second embodiment of the invention will be described.
The cutting apparatus 100 of the second embodiment can store a plurality of products P by attaching them to the sticking member 101 having an adhesive surface 101x (also called "ring storage"), unlike the tray storage of the first embodiment. is configured as
　具体的に切断装置１００は、図１７に示すように、封止済基板Ｗを保持する２つの切断用テーブル（加工用テーブル）２Ａ、２Ｂと、封止済基板Ｗを切断用テーブル２Ａ、２Ｂに搬送するために封止済基板Ｗを保持する第１保持機構３と、切断用テーブル２Ａ、２Ｂに保持された封止済基板Ｗを切断する切断機構（加工機構）４と、複数の製品Ｐが移される移載テーブル５と、複数の製品Ｐを切断用テーブル２Ａ、２Ｂから移載テーブル５に搬送するために複数の製品Ｐを保持する第２保持機構６と、第１保持機構３及び第２保持機構６を移動させるための共通のトランスファ軸７１を有する搬送用移動機構７と、切断機構４を切断用テーブル２Ａ、２Ｂに保持された封止済基板Ｗに対して移動させる切断用移動機構（加工用移動機構）８とを備えている。 Specifically, as shown in FIG. 17, the cutting apparatus 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W, and cutting tables 2A and 2B that hold the sealed substrate W. a first holding mechanism 3 for holding the sealed substrate W for transporting to the substrate, a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting tables 2A and 2B, and a plurality of products A transfer table 5 to which P is transferred, a second holding mechanism 6 for holding a plurality of products P to transfer the plurality of products P from the cutting tables 2A and 2B to the transfer table 5, and a first holding mechanism 3. and a transfer movement mechanism 7 having a common transfer shaft 71 for moving the second holding mechanism 6, and a cutting mechanism 4 for moving the sealed substrate W held on the cutting tables 2A and 2B. and a moving mechanism for processing (moving mechanism for processing) 8 .
　以下、第１実施形態とは異なる構成について主に説明する。 The following mainly describes the configuration different from the first embodiment.
　第２実施形態の移載テーブル５は、複数の製品Ｐを後述する貼付部材１０１に貼り付ける前に、複数の製品Ｐが一時的に載置されるものである。また、移載テーブル５は、図１７及び図１８に示すように、Ｙ方向に沿って移動可能に設けられており、第２保持機構６により複数の製品Ｐが載置される移載位置Ｘ１と、貼付用搬送機構１０３により複数の製品Ｐが搬送される取り出し位置Ｘ２との間で移動する。なお、移載位置Ｘ１は、トランスファ軸７１よりも手前側に設定されており、２つの切断用テーブル２Ａ、２Ｂと水平面上においてＸ方向に沿って一列に配置される位置であり、取り出し位置Ｘ２は、トランスファ軸７１よりも奥側に設定されている。 A plurality of products P are temporarily placed on the transfer table 5 of the second embodiment before the plurality of products P are attached to an attaching member 101, which will be described later. 17 and 18, the transfer table 5 is provided movably along the Y direction, and is positioned at a transfer position X1 where a plurality of products P are placed by the second holding mechanism 6. , and a pick-up position X2 where a plurality of products P are conveyed by the pasting conveying mechanism 103 . The transfer position X1 is set on the front side of the transfer shaft 71, and is a position where the two cutting tables 2A and 2B are arranged in a line along the X direction on the horizontal plane. is set on the back side of the transfer shaft 71 .
　また、搬送用移動機構７のトランスファ軸７１は、第１保持機構３が基板供給機構１１の基板供給部１１ｂの上方に移動できるとともに、第２保持機構６が移載テーブル５の上方に移動できる範囲に加えて、後述する貼付部材搬送機構１０７が貼付部材搬送位置Ｘ３とガイドレール１０８の間を移動できる範囲に延びている。また、このトランスファ軸７１に対して、後述する載置テーブル１０２、貼付部材収容部１０６及び貼付部材搬送機構１０７も、トランスファ軸７１に対して同じ側（手前側）に設けられている。 The transfer shaft 71 of the transfer mechanism 7 allows the first holding mechanism 3 to move above the substrate supply portion 11b of the substrate supply mechanism 11 and the second holding mechanism 6 to move above the transfer table 5. In addition to the range, the pasting member transport mechanism 107 , which will be described later, extends in a range in which it can move between the pasting member transport position X<b>3 and the guide rail 108 . In addition, a mounting table 102 , an application member storage section 106 and an application member conveying mechanism 107 , which will be described later, are also provided on the same side (front side) of the transfer shaft 71 with respect to the transfer shaft 71 .
＜リング収容の具体的な構成＞
　そして、第２実施形態の切断装置１００は、図１７～図１９に示すように、複数の製品Ｐが貼り付けられる粘着面１０１ｘを有する貼付部材１０１が載置される載置テーブル１０２と、複数の製品Ｐを移載テーブル５から載置テーブル１０２に載置された貼付部材１０１に搬送する貼付用搬送機構１０３とを備えている。 <Specific Configuration of Ring Storage>
17 to 19, the cutting device 100 of the second embodiment includes a mounting table 102 on which a sticking member 101 having an adhesive surface 101x to which a plurality of products P are to be stuck is placed, and a plurality of a pasting conveying mechanism 103 for conveying the product P from the transfer table 5 to the pasting member 101 placed on the placing table 102 .
　載置テーブル１０２は、本実施形態ではＸ方向に沿って２つ設けられており（図１７参照）、各載置テーブル１０２には、貼付部材１０１が載置される。具体的には、２つの載置テーブル１０２は、それらの上面が同一の水平面上に位置する（Ｚ方向において同じ高さ位置する）ように配置されている。 In this embodiment, two mounting tables 102 are provided along the X direction (see FIG. 17), and the sticking member 101 is mounted on each mounting table 102 . Specifically, the two mounting tables 102 are arranged such that their upper surfaces are located on the same horizontal plane (located at the same height in the Z direction).
　また、２つの載置テーブル１０２は、図１７及び図１８に示すように、Ｙ方向に沿って移動可能に設けられており、貼付部材搬送機構１０７により貼付部材１０１が搬送される貼付部材搬送位置Ｘ３と、貼付用搬送機構１０３により複数の製品Ｐが搬送される貼り付け位置Ｘ４との間で移動する。２つの載置テーブル１０２は、互いに独立して貼付部材搬送位置Ｘ３と貼り付け位置Ｘ４との間で移動する。なお、貼付部材搬送位置Ｘ３は、トランスファ軸７１よりも手前側に設定されており、貼り付け位置Ｘ４は、トランスファ軸７１よりも奥側に設定されている。また、貼り付け位置Ｘ４にある載置テーブル１０２と、取り出し位置Ｘ２にある移載テーブル５とは、Ｘ方向に沿って配置される（図１７参照）。 As shown in FIGS. 17 and 18, the two mounting tables 102 are provided movably along the Y direction, and are positioned at a pasting member transfer position where the pasting member conveying mechanism 107 transfers the pasting member 101. It moves between X3 and a sticking position X4 where a plurality of products P are transported by the transport mechanism 103 for sticking. The two mounting tables 102 move independently of each other between the attaching member conveying position X3 and the attaching position X4. The pasting member conveying position X3 is set on the front side of the transfer shaft 71, and the pasting position X4 is set on the far side of the transfer shaft 71. As shown in FIG. Also, the mounting table 102 at the sticking position X4 and the transfer table 5 at the take-out position X2 are arranged along the X direction (see FIG. 17).
　ここで、貼付部材１０１は、図２０に示すように、例えば円環状又は矩形状をなす枠状部材１０１ａと、当該枠状部材１０１ａの内側に配置された粘着面１０１ｘを有する樹脂シート１０１ｂとを備えている。枠状部材１０１ａは、例えばステンレス等の金属製のものである。また、樹脂シート１０１ｂは、例えば、樹脂製のシート状基材１０１ｂ１と、当該シート状基材１０１ｂ１の上面に塗布された接着剤からなる接着層（粘着層）１０１ｂ２とを備えている。なお、接着層（粘着層）１０１ｂ２の上面が粘着面１０１ｘとなる。 Here, as shown in FIG. 20, the sticking member 101 includes, for example, an annular or rectangular frame-shaped member 101a and a resin sheet 101b having an adhesive surface 101x disposed inside the frame-shaped member 101a. I have. The frame member 101a is made of metal such as stainless steel. The resin sheet 101b includes, for example, a sheet-like base material 101b1 made of resin and an adhesive layer (adhesive layer) 101b2 made of an adhesive applied to the upper surface of the sheet-like base material 101b1. The upper surface of the adhesive layer (adhesive layer) 101b2 is the adhesive surface 101x.
　貼付用搬送機構１０３は、取り出し位置Ｘ２に移動した移載テーブル５から、貼り付け位置Ｘ４に移動した載置テーブル１０２に載置された貼付部材１０１に複数の製品Ｐを搬送するものである。 The pasting conveying mechanism 103 conveys a plurality of products P from the transfer table 5 moved to the take-out position X2 to the pasting member 101 placed on the placing table 102 moved to the pasting position X4.
　具体的に貼付用搬送機構１０３は、図１７及び図１８に示すように、移載テーブル５に保持された複数の製品Ｐを例えば１列毎に吸着する製品吸着機構１０３１と、当該製品吸着機構１０３１をＸ方向に沿って移動させる吸着用移動機構１０３２とを備えている。本実施形態では、貼付用搬送機構１０３が２つ設けられており、それぞれの貼付用搬送機構１０３が互いに独立して駆動するように構成されている。 Specifically, as shown in FIGS. 17 and 18, the pasting conveying mechanism 103 includes a product suction mechanism 1031 for sucking a plurality of products P held on the transfer table 5, for example, in each row, and the product suction mechanism 1031. and a moving mechanism 1032 for adsorption that moves 1031 along the X direction. In this embodiment, two pasting conveying mechanisms 103 are provided, and the respective pasting conveying mechanisms 103 are configured to be driven independently of each other.
　製品吸着機構１０３１は、図１９に示すように、複数の製品Ｐを個別に吸着保持するための複数の吸着部１０３１ａが設けられた吸着ヘッド１０３１Ａと、当該吸着ヘッド１０３１Ａの吸着部１０３１ａに接続された真空ポンプ又は真空エジェクタ（不図示）とを有している。この製品吸着機構１０３１は、それぞれの吸着部１０３１ａが１つの製品Ｐを吸着する構成としてある。また、複数の吸着部１０３１ａは、互いに独立して昇降移動可能に構成されており、各吸着部１０３１ａが下降することにより、個別に製品Ｐを吸着することができる。 As shown in FIG. 19, the product suction mechanism 1031 is connected to a suction head 1031A provided with a plurality of suction portions 1031a for individually sucking and holding a plurality of products P, and the suction portion 1031a of the suction head 1031A. and a vacuum pump or vacuum ejector (not shown). The product adsorption mechanism 1031 is configured such that each adsorption portion 1031a adsorbs one product P. As shown in FIG. In addition, the plurality of suction portions 1031a are configured to be able to move up and down independently of each other, and each suction portion 1031a descends to individually suck the product P. As shown in FIG.
　吸着用移動機構１０３２は、図１９に示すように、製品吸着機構１０３１をＸ方向に移動させるＸ方向移動部１０３２ａと、製品吸着機構１０３１をＺ方向に移動させるＺ方向移動部１０３２ｂとを備えている。なお、吸着用移動機構１０３２は、製品吸着機構１０３１をＹ方向に移動させるＹ方向移動部を有していても良い。 As shown in FIG. 19, the suction moving mechanism 1032 includes an X-direction moving portion 1032a for moving the product suction mechanism 1031 in the X direction and a Z-direction moving portion 1032b for moving the product suction mechanism 1031 in the Z direction. there is Note that the suction moving mechanism 1032 may have a Y-direction moving unit that moves the product suction mechanism 1031 in the Y direction.
　Ｘ方向移動部１０３２ａは、トランスファ軸７１の奥側においてＸ方向に沿って設けられたＸ方向ガイドレール１０３２ａ１と、当該Ｘ方向ガイドレール１０３２ａ１に沿って移動するとともに、Ｚ方向移動部１０３２ｂを介して製品吸着機構１０３１を支持する支持体１０３２ａ２とを有している。そして、支持体１０３２ａ２は、例えば、Ｘ方向に延びるボールねじ機構（不図示）により、Ｘ方向ガイドレール１０３２ａ１上をＸ方向に沿って直線的に往復移動する。このボールねじ機構はサーボモータ等の駆動源（不図示）により駆動される。その他、支持体１０３２ａ２は、リニアモータ等の他の直動機構により往復移動するように構成しても良い。 The X-direction moving portion 1032a moves along an X-direction guide rail 1032a1 provided along the X direction on the far side of the transfer shaft 71, and along the X-direction guide rail 1032a1, moves through the Z-direction moving portion 1032b. and a support 1032 a 2 that supports the product suction mechanism 1031 . The support 1032a2 is linearly reciprocated along the X direction on the X direction guide rail 1032a1 by, for example, a ball screw mechanism (not shown) extending in the X direction. This ball screw mechanism is driven by a drive source (not shown) such as a servomotor. In addition, the support 1032a2 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
　Ｚ方向移動部１０３２ｂは、図１９に示すように、支持体１０３２ａ２においてＺ方向に沿って設けられたＺ方向ガイドレール１０３２ｂ１と、当該Ｚ方向ガイドレール１０３２ｂ１に沿って移動するとともに製品吸着機構１０３１を支持するＺ方向スライダ１０３２ｂ２とを有している。そして、Ｚ方向スライダ１０３２ｂ２は、例えば、Ｚ方向に延びるボールねじ機構（不図示）により、Ｚ方向ガイドレール１０３２ｂ１上をＺ方向に沿って直線的に往復移動する。その他、Ｚ方向スライダ１０３２ｂ２は、リニアモータ等の他の直動機構により往復移動するように構成しても良い。 As shown in FIG. 19, the Z-direction moving portion 1032b moves along a Z-direction guide rail 1032b1 provided along the Z-direction on the support 1032a2 and the product suction mechanism 1031. Z-direction slider 1032b2 to support. The Z-direction slider 1032b2 linearly reciprocates along the Z-direction on the Z-direction guide rail 1032b1 by, for example, a ball screw mechanism (not shown) extending in the Z-direction. Alternatively, the Z-direction slider 1032b2 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
　また、貼付用搬送機構１０３に吸着保持された製品Ｐは、第１撮像部２０１（図１７参照）により貼付用搬送機構１０３における製品Ｐの位置が確認される。この第１撮像部２０１は、貼付用搬送機構１０３の製品吸着機構１０３１に吸着保持された製品Ｐを下方から撮像する撮像カメラであり、製品Ｐの下面（マーク面）を撮像する。また、第１撮像部２０１は、前後方向（Ｙ方向）に移動可能に設けられている。これにより、２つの貼付用搬送機構１０３それぞれに吸着保持された製品Ｐの位置を確認できるように構成している。 Also, for the product P sucked and held by the pasting transport mechanism 103, the position of the product P in the pasting transport mechanism 103 is confirmed by the first imaging unit 201 (see FIG. 17). The first imaging unit 201 is an imaging camera that images the product P sucked and held by the product suction mechanism 1031 of the pasting conveying mechanism 103 from below, and images the lower surface (mark surface) of the product P. Also, the first imaging unit 201 is provided so as to be movable in the front-rear direction (Y direction). Thereby, it is configured such that the position of the product P sucked and held by each of the two pasting conveying mechanisms 103 can be confirmed.
　さらに、各貼付用搬送機構１０３には、図１７に示すように、貼付部材１０１において製品Ｐが貼付される位置を確認する第２撮像部２０２が設けられている。この第２撮像部２０２は、貼り付け位置Ｘ４にある載置テーブル１０２上の貼付部材１０１を上方から撮像する撮像カメラであり、貼付部材１０１の上面（粘着面１０１ｘ）を撮像する。そして、第１撮像部２０１により得られた撮像データと、第２撮像部２０２により得られた撮像データとに基づいて、貼付部材１０１に対して製品Ｐの位置合わせが行われて、貼付用搬送機構１０３が製品Ｐを貼付部材１０１の粘着面１０１ｘに貼り付ける。なお、製品Ｐの位置合わせは、貼付用搬送機構１０３の吸着用移動機構１０３２や貼付用搬送機構１０３に設けられた回転機構（不図示）、又は、載置テーブル１０２の移動機構（不図示）又は載置テーブル１０２に設けられた回転機構（不図示）により行うことができる。 Further, each pasting conveying mechanism 103 is provided with a second imaging section 202 for confirming the position where the product P is pasted on the pasting member 101, as shown in FIG. The second imaging unit 202 is an imaging camera that captures an image of the sticking member 101 on the mounting table 102 at the sticking position X4 from above, and images the top surface (adhesive surface 101x) of the sticking member 101 . Based on the imaging data obtained by the first imaging unit 201 and the imaging data obtained by the second imaging unit 202, the product P is aligned with the application member 101 and conveyed for application. The mechanism 103 affixes the product P to the adhesive surface 101 x of the affixing member 101 . The position alignment of the product P is performed by the adsorption moving mechanism 1032 of the pasting transport mechanism 103, the rotating mechanism (not shown) provided in the pasting transport mechanism 103, or the moving mechanism (not shown) of the mounting table 102. Alternatively, it can be performed by a rotating mechanism (not shown) provided on the mounting table 102 .
　また、本実施形態の切断装置１００は、図２１に示すように、貼付部材１０１を収容する貼付部材収容部１０６と、貼付部材１０１を載置テーブル１０２と貼付部材収容部１０６との間で搬送する貼付部材搬送機構１０７とを備えている。 Moreover, as shown in FIG. 21, the cutting device 100 of the present embodiment has an affixing member accommodation unit 106 that accommodates the affixing member 101, and conveys the affixing member 101 between the mounting table 102 and the affixing member accommodation unit 106. A pasting member conveying mechanism 107 is provided.
　貼付部材収容部１０６は、製品Ｐが貼り付けられていない空の貼付部材１０１を収容するとともに、製品Ｐが貼り付けられた貼付済の貼付部材１０１を収容するものである。この貼付部材収容部１０６は、貼付部材搬送位置Ｘ３にある載置テーブル１０２とＸ方向に沿って一列に配置されている（図１７参照）。 The sticking member storage part 106 stores an empty sticking member 101 to which the product P is not stuck, and also stores the pasted sticking member 101 to which the product P is stuck. The adhesive member storage unit 106 is arranged in a line along the X direction with the placement table 102 at the adhesive member transport position X3 (see FIG. 17).
　また、貼付部材収容部１０６の開口部には、図１７及び図２１に示すように、貼付部材１０１を貼付部材収容部１０６に出し入れするための一対のガイドレール１０８が設けられている。この一対のガイドレール１０８は、貼付部材１０１が載置されるものであり、貼付部材収容部１０６の開口部の前方においてＸ方向に沿って設けられている。 17 and 21, a pair of guide rails 108 for taking the sticking member 101 into and out of the sticking member housing portion 106 is provided at the opening of the sticking member housing portion 106. As shown in FIGS. The pair of guide rails 108, on which the sticking member 101 is placed, are provided in front of the opening of the sticking member accommodating portion 106 along the X direction.
　貼付部材搬送機構１０７は、貼付部材搬送位置Ｘ３にある載置テーブル１０２と貼付部材収容部１０６との間で貼付部材１０１を搬送するものである。具体的に貼付部材搬送機構１０７は、図２１に示すように、貼付部材１０１の枠状部材１０１ａを吸着して保持する第３保持機構１０７１と、当該第３保持機構１０７１を少なくともＸ方向及びＺ方向に移動させる移動機構１０７２とを備えている。 The pasting member conveying mechanism 107 conveys the pasting member 101 between the placing table 102 located at the pasting member conveying position X3 and the pasting member storage section 106 . Specifically, as shown in FIG. 21, the application member conveying mechanism 107 includes a third holding mechanism 1071 that sucks and holds the frame-shaped member 101a of the application member 101, and the third holding mechanism 1071 that moves at least in the X direction and the Z direction. and a moving mechanism 1072 for moving in the direction.
　第３保持機構１０７１は、貼付部材１０１を吸着保持するための複数の吸着部１０７１ａが設けられた吸着ヘッド１０７１Ａと、当該吸着ヘッド１０７１Ａの吸着部１０７１ａに接続された真空ポンプ又は真空エジェクタ（不図示）とを有している。また、移動機構１０７２は、上記の搬送用移動機構７のメイン移動機構７２を用いて構成されており、第３保持機構１０７１は、共通のトランスファ軸７１に沿って移動する。さらに、移動機構１０７２は、搬送用移動機構７の昇降移動機構７３と同様の昇降移動機構１０７２ａを有している。なお、移動機構１０７２は、第３保持機構１０７１をＹ方向に移動させるＹ方向移動機構を有していても良い。 The third holding mechanism 1071 includes a suction head 1071A provided with a plurality of suction portions 1071a for sucking and holding the application member 101, and a vacuum pump or vacuum ejector (not shown) connected to the suction portions 1071a of the suction head 1071A. ). The moving mechanism 1072 is configured using the main moving mechanism 72 of the transporting moving mechanism 7 , and the third holding mechanism 1071 moves along the common transfer shaft 71 . Further, the moving mechanism 1072 has an up-and-down moving mechanism 1072a similar to the up-and-down moving mechanism 73 of the moving mechanism 7 for transportation. Note that the moving mechanism 1072 may have a Y-direction moving mechanism that moves the third holding mechanism 1071 in the Y direction.
＜切断装置１００の動作の一例＞
　次に、第２実施形態の切断装置１００の動作の一例を、図９、図１７～図１９及び図２１を参照して説明する。本実施形態においては、切断装置１００の動作、例えば封止済基板Ｗの搬送、封止済基板Ｗの切断、製品Ｐの検査、製品Ｐのクリーニング、及び、製品Ｐのリング収容など、すべての動作や制御は制御部ＣＴＬ（図１７参照）により行われる。 <Example of Operation of Cutting Device 100>
Next, an example of the operation of the cutting device 100 of the second embodiment will be described with reference to FIGS. 9, 17 to 19 and 21. FIG. In the present embodiment, all operations of the cutting device 100, such as transportation of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, cleaning of the product P, and accommodation of the product P in the ring, are performed. Operation and control are performed by the control unit CTL (see FIG. 17).
　本実施形態の切断装置１００の動作において、封止済基板Ｗの搬送、封止済基板Ｗの切断、製品Ｐのクリーニング、及び、製品Ｐの検査までの動作は、前記第１実施形態と同様である（図９参照）。 In the operation of the cutting apparatus 100 of the present embodiment, the operations from transporting the sealed substrate W, cutting the sealed substrate W, cleaning the product P, and inspecting the product P are the same as in the first embodiment. (see FIG. 9).
　そして、両面検査がされた後、製品Ｐは反転機構１４から移載テーブル５に受け渡される。複数の製品Ｐが載置された移載テーブル５は、取り出し位置Ｘ２に移動する（図１７、図１８及び図１９参照）。 Then, after double-sided inspection, the product P is transferred from the reversing mechanism 14 to the transfer table 5 . The transfer table 5 on which a plurality of products P are placed moves to the take-out position X2 (see FIGS. 17, 18 and 19).
　一方で、貼付部材搬送位置Ｘ３にある載置テーブル１０２には、貼付部材搬送機構１０７によって貼付部材収容部１０６から空の貼付部材１０１が搬送される。そして、空の貼付部材１０１が搬送された載置テーブル１０２は、貼り付け位置Ｘ４に移動する（図１８及び図１９参照）。 On the other hand, an empty pasting member 101 is transported from the pasting member container 106 by the pasting member transport mechanism 107 to the placement table 102 at the pasting member transport position X3. Then, the mounting table 102 carrying the empty sticking member 101 moves to the sticking position X4 (see FIGS. 18 and 19).
　この状態で、図１９に示すように、貼付用搬送機構１０３は、取り出し位置Ｘ２にある移載テーブル５から製品Ｐを吸着保持する。そして、第１撮像部２０１の上方に移動する。これにより、第１撮像部２０１により貼付用搬送機構１０３における製品Ｐの位置が確認される。また、貼付用搬送機構１０３を移動させて第２撮像部２０２により、貼り付け位置Ｘ４にある載置テーブル１０２上の貼付部材１０１における製品Ｐが貼り付けられる位置を確認する。そして、貼付用搬送機構１０３は、保持している製品Ｐを貼付部材１０１に貼り付ける。この動作は、貼付部材１０１に貼り付けることができる許容数の製品Ｐが貼り付けられるまで、或いは、移載テーブル５にある複数の製品Ｐの全部が貼り付けられるまで、複数回繰り返される。 In this state, as shown in FIG. 19, the pasting transport mechanism 103 sucks and holds the product P from the transfer table 5 located at the take-out position X2. Then, it moves above the first imaging unit 201 . Thereby, the position of the product P in the pasting conveying mechanism 103 is confirmed by the first imaging unit 201 . In addition, the pasting conveying mechanism 103 is moved to confirm the position where the product P is pasted on the pasting member 101 on the mounting table 102 at the pasting position X4 by the second imaging unit 202 . The pasting conveying mechanism 103 then sticks the held product P onto the pasting member 101 . This operation is repeated multiple times until the allowable number of products P that can be stuck on the sticking member 101 are stuck, or until all the multiple products P on the transfer table 5 are stuck.
　その後、載置テーブル１０２は、図１８及び図２１に示すように、貼付部材搬送位置Ｘ３に移動する。そして、貼付部材搬送機構１０７が、載置テーブル１０２に載置された貼付済の貼付部材１０１を貼付部材収容部１０６に搬送する。具体的には、貼付部材搬送機構１０７が、貼付部材収容部１０６に設けられた一対のガイドレール１０８に貼付済の貼付部材１０１を載置し、一対のガイドレール１０８に載置された貼付済の貼付部材１０１を押すことにより、貼付済の貼付部材１０１を貼付部材収容部１０６に収容する。 After that, the mounting table 102 moves to the attaching member conveying position X3, as shown in FIGS. Then, the applied member conveying mechanism 107 conveys the pasted applied member 101 placed on the mounting table 102 to the applied member housing portion 106 . Specifically, the pasted member conveying mechanism 107 places the pasted pasted pasted member 101 on a pair of guide rails 108 provided in the pasted member accommodating portion 106 . By pressing the pasted member 101, the pasted member 101 is housed in the pasted member housing portion 106. As shown in FIG.
　次に、空の貼付部材１０１を貼付部材収容部１０６から取り出す場合には、貼付部材搬送機構１０７は、貼付部材収容部１０６内の貼付部材１０１を引き出して、一対のガイドレール１０８に載置し、一対のガイドレール１０８に載置された空の貼付部材１０１を吸着保持して貼付部材搬送位置Ｘ３にある載置テーブル１０２に搬送する。 Next, when taking out an empty pasting member 101 from the pasting member housing portion 106 , the pasting member conveying mechanism 107 draws out the pasting member 101 from the pasting member housing portion 106 and places it on the pair of guide rails 108 . , sucks and holds the empty sticking member 101 placed on the pair of guide rails 108 and transports it to the placing table 102 at the sticking member transport position X3.
＜保持用プレートＭ１の自動交換機能＞
　さらに第２実施形態の切断装置１００は、前記第１実施形態と同様に、封止済基板Ｗ又は製品Ｐを保持するための保持用プレートＭ１を自動的に交換できる機能を有している。なお、本実施形態では、第１実施形態と同様に、切断用テーブル２Ａ、２Ｂ、保持テーブル１４１、移載テーブル５及び第２保持機構６が、保持用プレートＭ１及び保持ベース部Ｍ２を有している。なお、保持用プレートＭ１及び保持ベース部Ｍ２の具体的構成は、第１実施形態と同様である。 <Automatic Exchange Function of Holding Plate M1>
Further, the cutting apparatus 100 of the second embodiment has a function of automatically exchanging the holding plate M1 for holding the sealed substrate W or the product P, as in the first embodiment. In this embodiment, as in the first embodiment, the cutting tables 2A and 2B, the holding table 141, the transfer table 5, and the second holding mechanism 6 each have a holding plate M1 and a holding base portion M2. ing. The specific configurations of the holding plate M1 and the holding base portion M2 are the same as in the first embodiment.
　具体的に切断装置１００は、図１７及び図２２に示すように、保持用プレートＭ１を収容するプレート収容部２４と、保持用プレートＭ１をプレート収容部２４及び保持ベース部Ｍ２の間で搬送するプレート搬送機構２５とを備えている。なお、第２実施形態の切断装置１００には、前記第１実施形態と同様に、固定機構２６及び検査機構２９が設けられている。 Specifically, as shown in FIGS. 17 and 22, the cutting device 100 conveys the plate accommodating portion 24 that accommodates the holding plate M1 and the holding plate M1 between the plate accommodating portion 24 and the holding base portion M2. A plate transport mechanism 25 is provided. The cutting device 100 of the second embodiment is provided with a fixing mechanism 26 and an inspection mechanism 29 as in the first embodiment.
　本実施形態のプレート収容部２４は、第１実施形態と同様の構成であるが、図２３に示すように、プレート収容部２４及び貼付部材収容部１０６は互いに上下に配置されている。本実施形態のプレート収容部２４は、貼付部材収容部１０６の上方に設けられている。そして、プレート収容部２４及び貼付部材収容部１０６は上下方向（Ｚ方向）に昇降移動可能に構成されている。ここでは、プレート収容部２４を昇降移動させる昇降移動部１０９と、貼付部材収容部１０６を昇降移動させる昇降移動部１１０とが設けられており、プレート収容部２４及び貼付部材収容部１０６は互いに独立して昇降移動可能に構成されている。なお、昇降移動部１０９、１１０は、例えばボールねじ機構を用いたものであっても良いし、エアシリンダを用いたものであっても良いし、リニアモータを用いたものであっても良い。また、プレート収容部２４と貼付部材収容部１０６とは共通の昇降移動機構によって一体的に昇降移動可能に構成してもよい。 The plate accommodating portion 24 of this embodiment has the same configuration as that of the first embodiment, but as shown in FIG. The plate accommodating portion 24 of this embodiment is provided above the attaching member accommodating portion 106 . The plate accommodating portion 24 and the sticking member accommodating portion 106 are configured to be movable up and down in the vertical direction (Z direction). Here, an elevation movement section 109 for vertically moving the plate housing section 24 and an elevation movement section 110 for vertically moving the pasting member housing section 106 are provided, and the plate housing section 24 and the pasting member housing section 106 are independent of each other. It is configured to be able to move up and down. The up-and-down moving units 109 and 110 may use, for example, a ball screw mechanism, an air cylinder, or a linear motor. Further, the plate accommodating portion 24 and the attaching member accommodating portion 106 may be integrally moved up and down by a common up-and-down movement mechanism.
　貼付部材収容部１０６に対して貼付部材１０１を出し入れする場合には、図２３（ａ）に示すように、プレート収容部２４が昇降移動部１０９により上方に退避し、貼付部材収容部１０６が昇降移動部１１０により所望の高さ位置Ｈ１に配置され、貼付部材搬送機構１０７により貼付部材収容部１０６に対して貼付部材１０１が出し入れされる。 When the sticking member 101 is to be put in and taken out of the sticking member accommodating portion 106, as shown in FIG. The application member 101 is arranged at the desired height position H1 by the moving unit 110 , and the application member 101 is taken in and out of the application member storage unit 106 by the application member conveying mechanism 107 .
　一方、プレート収容部２４に対して保持用プレートＭ１を出し入れする場合には、図２３（ｂ）に示すように、貼付部材収容部１０６が昇降移動部１１０により下方に退避し、プレート収容部２４が昇降移動部１０９により所望の高さ位置Ｈ２に配置され、プレート搬送機構２５によりプレート収容部２４に対して保持用プレートＭ１が出し入れされる。ここで、貼付部材搬送機構１０７がガイドレール１０８に干渉しないように、貼付部材収容部１０６の高さ位置Ｈ１よりもプレート収容部２４の高さ位置Ｈ２が高い位置としてある。 On the other hand, when the holding plate M1 is to be put in and taken out of the plate accommodating portion 24, as shown in FIG. is placed at a desired height position H2 by the up-and-down moving unit 109, and the holding plate M1 is taken in and out of the plate accommodating unit 24 by the plate conveying mechanism 25. As shown in FIG. Here, the height position H2 of the plate accommodating portion 24 is positioned higher than the height position H1 of the attaching member accommodating portion 106 so that the attaching member conveying mechanism 107 does not interfere with the guide rail 108 .
　本実施形態のプレート搬送機構２５は、図１７に示すように、プレート収容部２４と仮置き部２７との間で保持用プレートＭ１を搬送する第１搬送機構２５ａと、仮置き部２７と保持ベース部Ｍ２との間で保持用プレートＭ１を搬送する第２搬送機構２５ｂとを有している。本実施形態の仮置き部２７は、反転機構１４の保持テーブル１４１である。なお、移載テーブル５を仮置き部２７としても良いし、保持テーブル１４１及び移載テーブル５とは別に仮置き部２７を設けても良い。 As shown in FIG. 17, the plate transport mechanism 25 of this embodiment includes a first transport mechanism 25a that transports the holding plate M1 between the plate accommodating portion 24 and the temporary placement portion 27, the temporary placement portion 27 and the holding portion 25a. and a second transport mechanism 25b that transports the holding plate M1 to and from the base portion M2. The temporary placement section 27 of this embodiment is the holding table 141 of the reversing mechanism 14 . The transfer table 5 may be used as the temporary placement section 27 , or the temporary placement section 27 may be provided separately from the holding table 141 and the transfer table 5 .
　第２実施形態の第１搬送機構２５ａは、前記第１実施形態とは異なり、貼付部材搬送機構１０７（第３保持機構１０７１及び移動機構１０７２）を用いて構成されている。つまり、第２実施形態の第１搬送機構２５ａは、加工後の加工対象物Ｗ（製品Ｐ）が貼り付けられる貼付部材１０１を搬送することができる。第２搬送機構２５ｂは、第１実施形態と同様に、第２保持機構６及び搬送用移動機構７を用いて構成されており、加工対象物Ｗを搬送することができる。つまり、プレート搬送機構２５（第１搬送機構２５ａ及び第２搬送機構２５ｂ）は、上述した共通のトランスファ軸７１によってＸ方向に移動する構成とされている。また、プレート搬送機構２５は、トランスファ軸７１に対して、平面視において同じ側（手前側）に設けられていることになる。 Unlike the first embodiment, the first transport mechanism 25a of the second embodiment is configured using the pasting member transport mechanism 107 (the third holding mechanism 1071 and the moving mechanism 1072). In other words, the first transport mechanism 25a of the second embodiment can transport the sticking member 101 to which the processed workpiece W (product P) is to be stuck. The second transport mechanism 25b is configured using the second holding mechanism 6 and the transport moving mechanism 7, and can transport the workpiece W, as in the first embodiment. That is, the plate transport mechanism 25 (the first transport mechanism 25a and the second transport mechanism 25b) is configured to move in the X direction by the common transfer shaft 71 described above. Also, the plate transport mechanism 25 is provided on the same side (front side) of the transfer shaft 71 in plan view.
　ここで第１搬送機構２５ａとなる貼付部材搬送機構１０７では、図２１に示すように、貼付部材１０１を吸着保持するための複数の吸着部１０７１ａの他に、上述したキャッチシリンダを用いた搬送用シリンダ部１０７１ｂを有している。貼付部材搬送機構１０７は、保持用プレートＭ１を保持する部分を昇降可能に構成され、保持用プレートＭ１を保持した部分を上昇させて上昇位置とした状態で、保持用プレートＭ１を搬送することができる。 Here, in the pasting member conveying mechanism 107, which serves as the first conveying mechanism 25a, as shown in FIG. It has a cylinder portion 1071b. The attaching member conveying mechanism 107 is configured such that the portion that holds the holding plate M1 can be raised and lowered, and the holding plate M1 can be conveyed in a state in which the portion holding the holding plate M1 is raised to the raised position. can.
＜保持用プレートＭ１の交換動作＞
　次に本実施形態のプレート搬送機構２５による保持用プレートＭ１の交換動作について、図２４及び図２５を参照して説明する。 <Replacement operation of holding plate M1>
Next, the replacement operation of the holding plate M1 by the plate conveying mechanism 25 of this embodiment will be described with reference to FIGS. 24 and 25. FIG.
　なお、以下の交換動作において、プレート収容部２４から保持用プレートＭ１を取り出す際の保持用プレートＭ１の判別は、保持用プレートＭ１に設けられたＲＦＩＤなどの識別子を、第１搬送機構２５ａ（プレート搬送機構２５）に設けられた識別子リーダ（不図示）により読み取ることにより行う。また、この交換動作では、図２３（ｂ）に示すように、貼付部材収容部１０６が昇降移動部１１０により下方に退避し、プレート収容部２４が昇降移動部１０９により所望の高さ位置Ｈ２に配置され、プレート搬送機構２５によりプレート収容部２４に対して保持用プレートＭ１が出し入れされる。 In the replacement operation described below, the holding plate M1 is identified when the holding plate M1 is taken out from the plate accommodating portion 24 by using an identifier such as an RFID provided on the holding plate M1 to the first transport mechanism 25a (plate It is read by an identifier reader (not shown) provided in the transport mechanism 25). Also, in this replacement operation, as shown in FIG. The holding plate M1 is taken in and out of the plate accommodating portion 24 by the plate conveying mechanism 25. As shown in FIG.
（１）移載テーブル５及び保持テーブル１４１の保持用プレートＭ１の交換動作（図２４参照） (1) Exchange operation of the holding plate M1 of the transfer table 5 and the holding table 141 (see FIG. 24)
　保持テーブル１４１の保持用プレートＭ１を取り外し、第１搬送機構２５ａ（貼付部材搬送機構１０７）により保持用プレートＭ１を上昇させて上昇位置とした状態でプレート収容部２４に搬送する。なお、保持テーブル１４１の保持用プレートＭ１を取り外す際には、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にして固定機構２６の固定を解除する。 The holding plate M1 of the holding table 141 is removed, and the holding plate M1 is lifted by the first conveying mechanism 25a (applying member conveying mechanism 107) and conveyed to the plate accommodating section 24 in a raised position. When removing the holding plate M1 of the holding table 141, compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the recessed position, thereby releasing the fixation of the fixing mechanism 26. FIG.
　次に、第１搬送機構２５ａ（貼付部材搬送機構１０７）が、プレート収容部２４から保持テーブル１４１の新しい保持用プレートＭ１を取り出し上昇位置とした状態で保持テーブル１４１の保持ベース部Ｍ２に搬送し、保持用プレートＭ１を下降させて載置する。この状態で、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にすると、保持用プレートＭ１が下降して固定用シリンダ部２６２が保持用プレートＭ１の固定用挿入孔２６１に入り、その後、圧縮空気の供給を停止すると、可動子２６２ｂが突出した位置となり、保持テーブル１４１の保持ベース部Ｍ２に対して保持用プレートＭ１が固定される。 Next, the first conveying mechanism 25a (attachment member conveying mechanism 107) takes out the new holding plate M1 of the holding table 141 from the plate accommodating portion 24 and conveys it to the holding base portion M2 of the holding table 141 in the state of being in the raised position. , the holding plate M1 is lowered and placed. In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the holding plate M1 descends and the fixing cylinder portion 262 moves into the fixing insertion hole 261 of the holding plate M1. After that, when the supply of compressed air is stopped, the mover 262b is at a protruded position, and the holding plate M1 is fixed to the holding base portion M2 of the holding table 141. As shown in FIG.
　また、移載テーブル５の保持用プレートＭ１を取り外し、第１搬送機構２５ａ（貼付部材搬送機構１０７）により保持用プレートＭ１を上昇させて上昇位置とした状態でプレート収容部２４に搬送する。なお、移載テーブル５の保持用プレートＭ１を取り外す際には、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にして固定機構２６の固定を解除する。 Also, the holding plate M1 of the transfer table 5 is removed, and the holding plate M1 is lifted by the first conveying mechanism 25a (applied member conveying mechanism 107) to the raised position and conveyed to the plate accommodating section 24. When removing the holding plate M1 of the transfer table 5, compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the retracted position, thereby releasing the fixation of the fixing mechanism 26. FIG.
　次に、第１搬送機構２５ａ（貼付部材搬送機構１０７）が、プレート収容部２４から移載テーブル５の新しい保持用プレートＭ１を取り出し上昇位置とした状態で移載テーブル５の保持ベース部Ｍ２に搬送し、保持用プレートＭ１を下降させて載置する。この状態で、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にすると、保持用プレートＭ１が下降して固定用シリンダ部２６２が保持用プレートＭ１の固定用挿入孔２６１に入り、その後、圧縮空気の供給を停止すると、可動子２６２ｂが突出した位置となり、移載テーブル５の保持ベース部Ｍ２に対して保持用プレートＭ１が固定される。 Next, the first conveying mechanism 25a (attached member conveying mechanism 107) takes out the new holding plate M1 of the transfer table 5 from the plate accommodating portion 24 and places it on the holding base portion M2 of the transfer table 5 in the state of being in the raised position. Then, the holding plate M1 is lowered and placed. In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the holding plate M1 descends and the fixing cylinder portion 262 moves into the fixing insertion hole 261 of the holding plate M1. After that, when the supply of compressed air is stopped, the mover 262b is at a protruded position, and the holding plate M1 is fixed to the holding base portion M2 of the transfer table 5. As shown in FIG.
　なお、保持テーブル１４１の保持用プレートＭ１の交換と移載テーブル５の保持用プレートＭ１の交換の順番は上記に限られず、逆であっても良いし、保持テーブル１４１及び移載テーブル５それぞれの保持用プレートＭ１を取り外した後に、保持テーブル１４１及び移載テーブル５それぞれに新しい保持用プレートＭ１を取り付けるようにしても良い。 The order of replacement of the holding plate M1 of the holding table 141 and replacement of the holding plate M1 of the transfer table 5 is not limited to the above. A new holding plate M1 may be attached to each of the holding table 141 and the transfer table 5 after removing the holding plate M1.
（２）切断用テーブル２Ａ、２Ｂ及び第２保持機構６の保持用プレートＭ１の交換動作（図２５参照） (2) Exchange operation of the cutting tables 2A, 2B and the holding plate M1 of the second holding mechanism 6 (see FIG. 25)
　切断用テーブル２Ａ、２Ｂの保持用プレートＭ１を取り外し、第２搬送機構２５ｂ（搬送用移動機構７及び第２保持機構６）により保持用プレートＭ１を上昇させて上昇位置とした状態で仮置き部２７である保持テーブル１４１に搬送し、保持用プレートＭ１を下降させて載置する。なお、切断用テーブル２Ａ、２Ｂの保持用プレートＭ１を取り外す際には、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にして固定機構２６の固定を解除する。ここで、保持テーブル１４１を仮置き部２７とする場合には、保持テーブル１４１の保持用プレートＭ１を予め取り外しておくことが望ましい。 The holding plates M1 of the cutting tables 2A and 2B are removed, and the holding plates M1 are lifted by the second conveying mechanism 25b (the conveying moving mechanism 7 and the second holding mechanism 6) to the elevated position. 27, and the holding plate M1 is lowered and placed thereon. When the holding plates M1 of the cutting tables 2A and 2B are removed, compressed air is supplied to the fixing cylinder portion 262 so that the mover 262b is retracted to release the fixation of the fixing mechanism 26. FIG. Here, when the holding table 141 is used as the temporary placement unit 27, it is desirable to remove the holding plate M1 of the holding table 141 in advance.
　また、第１搬送機構２５ａ（貼付部材搬送機構１０７）が、保持テーブル１４１に載置された切断用テーブル２Ａ、２Ｂの保持用プレートＭ１を上昇させて上昇位置とした状態でプレート収容部２４に搬送し、保持用プレートＭ１を下降させて収容する。 In addition, the first transport mechanism 25a (applied member transport mechanism 107) lifts the holding plates M1 of the cutting tables 2A and 2B placed on the holding table 141 to the raised position, and moves them into the plate accommodating section 24. Then, the holding plate M1 is lowered and accommodated.
　次に、第１搬送機構２５ａ（貼付部材搬送機構１０７）が、プレート収容部２４から切断用テーブル２Ａ、２Ｂの新しい保持用プレートＭ１を取り出し上昇位置とした状態で、仮置き部２７である保持テーブル１４１に搬送し、保持用プレートＭ１を下降させて載置する。 Next, the first conveying mechanism 25a (applied member conveying mechanism 107) takes out the new holding plate M1 of the cutting tables 2A and 2B from the plate accommodating portion 24, and in a state where the holding plate M1 is in the elevated position, the temporary holding portion 27 holds the plate. It is conveyed to the table 141, and the holding plate M1 is lowered and placed thereon.
　そして、第２搬送機構２５ｂ（搬送用移動機構７及び第２保持機構６）が、保持テーブル１４１に載置された新しい保持用プレートＭ１を切断用テーブル２Ａ、２Ｂの保持ベース部Ｍ２に上昇位置とした状態で搬送し、保持用プレートＭ１を下降させて載置する。この状態で、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にすると、固定用シリンダ部２６２が保持用プレートＭ１の固定用挿入孔２６１に入り、その後、圧縮空気の供給を停止すると、可動子２６２ｂが突出した位置となり、切断用テーブル２Ａ、２Ｂの保持ベース部Ｍ２に対して保持用プレートＭ１が固定される。 Then, the second transport mechanism 25b (the transport moving mechanism 7 and the second holding mechanism 6) moves the new holding plate M1 placed on the holding table 141 to the holding base portion M2 of the cutting tables 2A and 2B at the raised position. The holding plate M1 is lowered and placed thereon. In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied. When the supply is stopped, the mover 262b is at the projecting position, and the holding plate M1 is fixed to the holding base portion M2 of the cutting tables 2A and 2B.
　第２保持機構６の保持用プレートＭ１を交換する場合には、搬送用移動機構７により第２保持機構６を仮置き部２７である保持テーブル１４１に移動させるとともに、保持用プレートＭ１を下降させて取り外し、仮置き部２７である保持テーブル１４１に保持用プレートＭ１を載置する。なお、第２保持機構６の保持用プレートＭ１を取り外す際には、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にして固定機構２６の固定を解除する。 When replacing the holding plate M1 of the second holding mechanism 6, the transport moving mechanism 7 moves the second holding mechanism 6 to the holding table 141, which is the temporary placement section 27, and lowers the holding plate M1. , and the holding plate M1 is placed on the holding table 141, which is the temporary placement unit 27. As shown in FIG. When removing the holding plate M1 of the second holding mechanism 6, compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the recessed position, thereby releasing the fixing of the fixing mechanism 26. FIG.
　そして、第１搬送機構２５ａ（貼付部材搬送機構１０７）が、保持テーブル１４１に載置された第２保持機構６の保持用プレートＭ１を上昇させて上昇位置とした状態でプレート収容部２４に搬送し、保持用プレートＭ１を下降させて収容する。 Then, the first conveying mechanism 25a (attachment member conveying mechanism 107) raises the holding plate M1 of the second holding mechanism 6 placed on the holding table 141 and conveys it to the plate accommodating section 24 in a state of the raised position. Then, the holding plate M1 is lowered and accommodated.
　次に、第１搬送機構２５ａ（貼付部材搬送機構１０７）が、プレート収容部２４から第２保持機構６の新しい保持用プレートＭ１を取り出し上昇位置とした状態で仮置き部２７である保持テーブル１４１に搬送し、保持用プレートＭ１を下降させて載置する。 Next, the first conveying mechanism 25a (attachment member conveying mechanism 107) takes out the new holding plate M1 of the second holding mechanism 6 from the plate accommodating portion 24 and moves the holding table 141, which is the temporary placing portion 27, to the raised position. , and the holding plate M1 is lowered and placed thereon.
　そして、搬送用移動機構７により第２保持機構６を保持テーブル１４１に移動させ、保持ベース部Ｍ２を下降させて、保持テーブル１４１に載置された新しい保持用プレートＭ１が取り付けられる。ここでは、搬送用移動機構７により第２保持機構６の保持ベース部Ｍ２に設けられた固定用シリンダ部２６２が保持用プレートＭ１に形成された固定用挿入孔２６１に差し込まれる。この状態で、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にすると、固定用シリンダ部２６２が保持用プレートＭ１の固定用挿入孔２６１に入り、その後、圧縮空気の供給を停止すると、可動子２６２ｂが突出した位置となり、第２保持機構６の保持ベース部Ｍ２に対して保持用プレートＭ１が固定される。 Then, the second holding mechanism 6 is moved to the holding table 141 by the transfer moving mechanism 7, the holding base portion M2 is lowered, and the new holding plate M1 placed on the holding table 141 is attached. Here, the fixing cylinder portion 262 provided in the holding base portion M2 of the second holding mechanism 6 is inserted into the fixing insertion hole 261 formed in the holding plate M1 by the transportation moving mechanism 7 . In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied. When the supply is stopped, the mover 262b is at a projected position, and the holding plate M1 is fixed to the holding base portion M2 of the second holding mechanism 6. As shown in FIG.
　なお、切断用テーブル２Ａ、２Ｂの保持用プレートＭ１を交換する際は、第２搬送機構２５ｂとなる第２保持機構６の保持用プレートＭ１と、保持テーブル１４１の保持用プレートＭ１を予め取り外しおく。また、第２保持機構６の保持用プレートＭ１を交換する際は、保持テーブル１４１の保持用プレートＭ１をあらかじめ取り外しておく。 When replacing the holding plates M1 of the cutting tables 2A and 2B, the holding plate M1 of the second holding mechanism 6 serving as the second transport mechanism 25b and the holding plate M1 of the holding table 141 are removed in advance. . When replacing the holding plate M1 of the second holding mechanism 6, the holding plate M1 of the holding table 141 is removed in advance.
　また、移載テーブル５、保持テーブル１４１、切断用テーブル２Ａ、２Ｂ及び第２保持機構６の保持用プレートＭ１の交換を一連の動作としても行ってもよい。例えば、移載テーブル５、保持テーブル１４１、第２保持機構６及び切断用テーブル２Ａ、２Ｂの保持用プレートＭ１をこの順に取り外し、その後、切断用テーブル２Ａ、２Ｂ、第２保持機構６、保持テーブル１４１及び移載テーブル５の保持用プレートＭ１をこの順で取り付けることが考えられる。 Further, replacement of the transfer table 5, the holding table 141, the cutting tables 2A and 2B, and the holding plate M1 of the second holding mechanism 6 may be performed as a series of operations. For example, the transfer table 5, the holding table 141, the second holding mechanism 6, and the holding plates M1 of the cutting tables 2A and 2B are removed in this order, and then the cutting tables 2A and 2B, the second holding mechanism 6, and the holding table are removed. 141 and the holding plate M1 of the transfer table 5 may be attached in this order.
＜第２実施形態の効果＞
　第２実施形態の切断装置１００によれば、第１実施形態と同様に、保持ベース部Ｍ２から取り外された保持用プレートＭ１をプレート収容部２４に搬送し、プレート収容部２４にある保持用プレートＭ１を保持ベース部Ｍ２に搬送するプレート搬送機構２５を有するので、保持ベース部Ｍ２に対して保持用プレートＭ１を自動的に交換することができる。その結果、保持用プレートＭ１を交換するための人件費を削減することができる。また、保持用プレートＭ１を自動的に交換するので、保持用プレートＭ１の交換時間を短縮することができ、切断装置１００の生産性を向上することができる。さらに、保持ベース部Ｍ２に対する保持用プレートＭ１の取り付け状態のばらつきを低減することができる。その他、第２実施形態において、前記第１実施形態と同様の構成により生じる効果は同じである。 <Effects of Second Embodiment>
According to the cutting device 100 of the second embodiment, as in the first embodiment, the holding plate M1 removed from the holding base portion M2 is conveyed to the plate accommodating portion 24, and the holding plate in the plate accommodating portion 24 is Since the plate transport mechanism 25 transports M1 to the holding base portion M2, the holding plate M1 can be automatically replaced with respect to the holding base portion M2. As a result, labor costs for exchanging the holding plate M1 can be reduced. In addition, since the holding plate M1 is automatically replaced, the replacement time of the holding plate M1 can be shortened, and the productivity of the cutting apparatus 100 can be improved. Furthermore, it is possible to reduce variations in the mounting state of the holding plate M1 with respect to the holding base portion M2. Other than that, in the second embodiment, the effects produced by the same configuration as in the first embodiment are the same.
　特に、第２実施形態では、プレート搬送機構２５が、貼付部材１０１を載置テーブル１０２に搬送することができるので、プレート搬送機構２５とは別に貼付部材用の搬送機構を設ける必要がなく、リング収容する切断装置１００の装置構成を簡素化することができる。さらに、装置コストも削減することができる。その他、複数の製品Ｐに対して、スパッタリング工程又は実装工程などの後工程を行う場合に、複数の製品Ｐが貼り付けられた貼付部材１０１を移動させればよく、その取り扱いを容易にすることができる。 In particular, in the second embodiment, since the plate conveying mechanism 25 can convey the pasting member 101 to the mounting table 102, there is no need to provide a conveying mechanism for the pasting member separately from the plate conveying mechanism 25. The device configuration of the cutting device 100 to be housed can be simplified. Furthermore, equipment costs can also be reduced. In addition, when a post-process such as a sputtering process or a mounting process is performed on a plurality of products P, the sticking member 101 to which the plurality of products P are stuck can be moved, thereby facilitating handling. can be done.
　さらに、プレート搬送機構２５が、プレート収容部２４と仮置き部２７との間で保持用プレートＭ１を搬送する第１搬送機構２５ａと、仮置き部２７と保持ベース部Ｍ２との間で保持用プレートＭ１を搬送する第２搬送機構２５ｂとを有するので、プレート搬送機構２５を１つの搬送機構で構成する場合に比べて、保持用プレートＭ１の搬送先の自由度を増すことができる。ここで、第１搬送機構２５ａを貼付部材搬送機構１０７（第３保持機構１０７１及び移動機構１０７２）を用いて構成しているので、装置構成を簡素化するとともに装置コストを削減することができる。また、第２搬送機構２５ｂを第２保持機構６及び搬送用移動機構７を用いて構成しているので、装置構成を簡素化するとともに装置コストを削減することができる。 Further, the plate transport mechanism 25 includes a first transport mechanism 25a that transports the holding plate M1 between the plate accommodating portion 24 and the temporary placement portion 27, and a holding mechanism 25a that transports the holding plate M1 between the temporary placement portion 27 and the holding base portion M2. Since it has the second transport mechanism 25b for transporting the plate M1, the degree of freedom of the transport destination of the holding plate M1 can be increased compared to the case where the plate transport mechanism 25 is composed of one transport mechanism. Here, since the first conveying mechanism 25a is configured using the pasting member conveying mechanism 107 (the third holding mechanism 1071 and the moving mechanism 1072), the device configuration can be simplified and the device cost can be reduced. Further, since the second transport mechanism 25b is configured using the second holding mechanism 6 and the transport moving mechanism 7, the device configuration can be simplified and the device cost can be reduced.
＜第２実施形態の変形例＞
　例えば、前記第２実施形態では、切断用テーブル２Ａ、２Ｂ、検査用テーブル（保持テーブル１４１）、移載テーブル５、及び、搬送用保持機構（第２保持機構６）それぞれの保持用プレートＭ１を自動的に交換する構成であったが、切断用テーブル２Ａ、２Ｂ、検査用テーブル（保持テーブル１４１）、移載テーブル５、及び、搬送用保持機構（第２保持機構６）の少なくとも１つを自動的に交換する構成としても良い。 <Modification of Second Embodiment>
For example, in the second embodiment, the holding plates M1 of the cutting tables 2A and 2B, the inspection table (holding table 141), the transfer table 5, and the conveying holding mechanism (second holding mechanism 6) are Although it was configured to be replaced automatically, at least one of the cutting tables 2A and 2B, the inspection table (holding table 141), the transfer table 5, and the holding mechanism for transportation (second holding mechanism 6) It is good also as a structure which exchanges automatically.
　前記第２実施形態のプレート搬送機構２５は、第１搬送機構２５ａ及び第２搬送機構２５ｂを有する構成であったが、単一の搬送機構を有する構成としても良い。また、プレート搬送機構２５は、貼付部材搬送機構１０７を用いない構成としても良いし、第２保持機構６及び搬送用移動機構７（加工対象物搬送機構）を用いない構成としても良い。 Although the plate conveying mechanism 25 of the second embodiment has the first conveying mechanism 25a and the second conveying mechanism 25b, it may have a single conveying mechanism. Further, the plate conveying mechanism 25 may be configured without using the pasting member conveying mechanism 107, or may be configured without using the second holding mechanism 6 and the conveying moving mechanism 7 (processing object conveying mechanism).
　プレート搬送機構２５に貼付部材搬送機構１０７を用いない構成とする場合、プレート収容部２４を第２保持機構６がアクセス可能な位置（例えば移載テーブル５（インデックステーブル）と貼付部材１０１の載置テーブル１０２との間）に配置することによって、プレート搬送機構２５を貼付部材搬送機構１０７を用いること無く、第２保持機構６及び搬送用移動機構７により構成することができる。 When the plate conveying mechanism 25 does not use the pasting member conveying mechanism 107, the plate accommodating portion 24 is placed at a position accessible to the second holding mechanism 6 (for example, the transfer table 5 (index table) and the place where the pasting member 101 is placed). By arranging the plate conveying mechanism 25 between the table 102 , the plate conveying mechanism 25 can be composed of the second holding mechanism 6 and the conveying moving mechanism 7 without using the pasting member conveying mechanism 107 .
　また、前記第２実施形態のプレート収容部２４は、切断用テーブル２Ａ、２Ｂ、検査用テーブル（保持テーブル１４１）、移載テーブル５、及び、第２保持機構６それぞれの保持用プレートＭ１を収容するものであったが、保持用プレートＭ１の種類に応じて専用のプレート収容部２４を複数設ける構成としても良い。 Further, the plate accommodating portion 24 of the second embodiment accommodates the holding plates M1 of the cutting tables 2A and 2B, the inspection table (holding table 141), the transfer table 5, and the second holding mechanism 6. However, according to the type of the holding plate M1, a plurality of dedicated plate accommodating portions 24 may be provided.
　例えば、前記第２実施形態では載置テーブル１０２を複数（具体的には２つ）設けた構成について説明したが、図２６（ａ）に示すように、載置テーブル１０２が１つであっても良い。この場合、貼付部材収容部１０６の開口部において上下に２つのガイドレール１０８Ａ、１０８Ｂを設けても良い。この構成において、上のガイドレール１０８Ａは、互いの間隔が図示しない拡縮機構によって拡縮できるように構成されている。 For example, in the second embodiment, a configuration in which a plurality of (specifically, two) mounting tables 102 are provided has been described, but as shown in FIG. Also good. In this case, two guide rails 108A and 108B may be provided on the upper and lower sides of the opening of the adhesive member accommodating section 106. As shown in FIG. In this configuration, the upper guide rails 108A are configured so that the mutual spacing can be expanded and contracted by an expansion and contraction mechanism (not shown).
　この上下２段構成のガイドレール１０８Ａ、１０８Ｂを有する場合の動作は以下のようになる。 The operation in the case of having the guide rails 108A and 108B configured in two upper and lower stages is as follows.
　まず上のガイドレール１０８Ａの間隔が拡縮機構によって拡がる（図２６（ｂ）参照）。そして、貼付部材搬送機構１０７は、上のガイドレール１０８Ａの間を下降して、貼付部材収容部１０６から下のガイドレール１０８Ｂに空の貼付部材１０１を引き出して仮置きする。その後、貼付部材搬送機構１０７は、貼付部材搬送位置Ｘ３にある載置テーブル１０２に移動して、貼付済の貼付部材１０１を受け取る。 First, the interval between the upper guide rails 108A is expanded by the expansion/reduction mechanism (see FIG. 26(b)). Then, the pasting member conveying mechanism 107 descends between the upper guide rails 108A, pulls out the empty pasting member 101 from the pasting member accommodating portion 106, and temporarily places it on the lower guide rail 108B. After that, the pasting member conveying mechanism 107 moves to the mounting table 102 located at the pasting member conveying position X3 and receives the pasted pasted pasted member 101 .
　次に、上のガイドレール１０８Ａの間隔が拡縮機構によって縮まる（図２６（ｃ）参照）。そして、貼付部材搬送機構１０７は、上のガイドレール１０８Ａに貼付済の貼付部材１０１を載置するとともに、その貼付部材１０１を貼付部材収容部１０６に押し入れる。 Next, the interval between the upper guide rails 108A is reduced by the expansion/reduction mechanism (see FIG. 26(c)). Then, the applied member conveying mechanism 107 places the applied applied member 101 on the upper guide rail 108</b>A and pushes the applied member 101 into the applied member accommodating portion 106 .
　その後、上のガイドレール１０８Ａの間隔が拡縮機構によって拡がる。そして、貼付部材搬送機構１０７は、上のガイドレール１０８Ａの間を下降して、下のガイドレール１０８Ｂに載置されている空の貼付部材１０１を受け取り、載置テーブル１０２に搬送する。 After that, the interval between the upper guide rails 108A is expanded by the expansion/reduction mechanism. Then, the pasting member conveying mechanism 107 descends between the upper guide rails 108A, receives the empty pasting member 101 placed on the lower guide rail 108B, and conveys it to the placing table 102. FIG.
　また、前記第２実施形態では２つの貼付用搬送機構１０３を有する構成であったが、１つの貼付用搬送機構１０３を有する構成としても良い。 Also, in the second embodiment, the configuration has two pasting conveying mechanisms 103 , but a configuration having one pasting conveying mechanism 103 may be employed.
　さらに、第１撮像部２０１は、２つの貼付用搬送機構１０３に共通のものとしていたが、２つの貼付用搬送機構１０３それぞれに対応して第１撮像部２０１を設けても良い。 Furthermore, although the first imaging unit 201 is common to the two pasting conveying mechanisms 103, the first photographing unit 201 may be provided for each of the two pasting conveying mechanisms 103.
　また、前記第２実施形態の移載テーブル５は、貼付部材１０１に貼り付ける前に一時的に載置されるインデックステーブルであったが、移載テーブル５を反転機構１４の保持テーブル１４１としても良い。 Further, the transfer table 5 of the second embodiment is an index table that is temporarily placed before being attached to the sticking member 101, but the transfer table 5 can be used as the holding table 141 of the reversing mechanism 14. good.
＜本発明の第３実施形態＞
　次に、本発明の第３実施形態について説明する。
　第３実施形態の切断装置１００は、前記第１実施形態のトレイ収容及び第２実施形態のリング収容とは異なり、複数の製品Ｐをばらばらの状態で収容（「バルク収容」とも呼ばれる。）できるように構成されている。 <Third embodiment of the present invention>
Next, a third embodiment of the invention will be described.
Unlike the tray accommodation of the first embodiment and the ring accommodation of the second embodiment, the cutting device 100 of the third embodiment can accommodate a plurality of products P in a discrete state (also called "bulk accommodation"). is configured as
　具体的に切断装置１００は、図２７に示すように、封止済基板Ｗを保持する２つの切断用テーブル（加工用テーブル）２Ａ、２Ｂと、封止済基板Ｗを切断用テーブル２Ａ、２Ｂに搬送するために封止済基板Ｗを保持する第１保持機構３と、切断用テーブル２Ａ、２Ｂに保持された封止済基板Ｗを切断する切断機構（加工機構）４と、複数の製品Ｐを切断用テーブル２Ａ、２Ｂから収容ボックス１１１に搬送するために複数の製品Ｐを保持する第２保持機構６と、第１保持機構３及び第２保持機構６を移動させるための共通のトランスファ軸７１を有する搬送用移動機構７と、切断機構４を切断用テーブル２Ａ、２Ｂに保持された封止済基板Ｗに対して移動させる切断用移動機構（加工用移動機構）８とを備えている。 Specifically, as shown in FIG. 27, the cutting apparatus 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W, and cutting tables 2A and 2B that hold the sealed substrate W. a first holding mechanism 3 for holding the sealed substrate W for transporting to the substrate, a cutting mechanism (processing mechanism) 4 for cutting the sealed substrate W held on the cutting tables 2A and 2B, and a plurality of products A second holding mechanism 6 for holding a plurality of products P to transport P from the cutting tables 2A and 2B to the storage box 111, and a common transfer for moving the first holding mechanism 3 and the second holding mechanism 6. Equipped with a transfer movement mechanism 7 having a shaft 71 and a cutting movement mechanism (processing movement mechanism) 8 for moving the cutting mechanism 4 with respect to the sealed substrate W held by the cutting tables 2A and 2B. there is
　以下、第１、第２実施形態とは異なる構成について主に説明する。 The configuration different from the first and second embodiments will be mainly described below.
　第３実施形態の第２保持機構６は、図２７に示すように、複数の製品Ｐを切断用テーブル２Ａ、２Ｂから乾燥用テーブル１１２又は収容ボックス１１１に搬送するために複数の製品Ｐを保持するものである。この第２保持機構６は、図８に示すように、第１、第２実施形態と同様の構成である。そして、吸着ヘッド６１が、後述する搬送用移動機構７などにより所望の位置に移動されることにより、複数の製品Ｐを切断用テーブル２Ａ、２Ｂから乾燥用テーブル１１２に搬送し、乾燥用テーブル１１２から収容ボックス１１１に搬送する。 The second holding mechanism 6 of the third embodiment, as shown in FIG. 27, holds a plurality of products P in order to convey the plurality of products P from the cutting tables 2A, 2B to the drying table 112 or storage box 111. It is something to do. The second holding mechanism 6, as shown in FIG. 8, has the same configuration as in the first and second embodiments. Then, the suction head 61 is moved to a desired position by a transport movement mechanism 7 or the like, which will be described later, so that the plurality of products P are transported from the cutting tables 2A and 2B to the drying table 112. to the storage box 111.
　第３実施形態の搬送用移動機構７は、図２７に示すように、第１保持機構３を少なくとも基板供給機構１１と切断用テーブル２Ａ、２Ｂとの間で移動させるとともに、第２保持機構６を少なくとも切断用テーブル２Ａ、２Ｂと収容ボックス１１１との間で移動させるものである。 As shown in FIG. 27, the transport moving mechanism 7 of the third embodiment moves the first holding mechanism 3 between at least the substrate supply mechanism 11 and the cutting tables 2A and 2B, and moves the second holding mechanism 6. are moved at least between the cutting tables 2A and 2B and the storage box 111. As shown in FIG.
　また、トランスファ軸７１は、第１保持機構３が基板供給機構１１の基板供給部１１ｂの上方に移動できるとともに、第２保持機構６が収容ボックス１１１の上方に移動できる範囲で設けられている（図２７参照）。また、このトランスファ軸７１に対して、後述する収容ボックス１１１及び乾燥用テーブル１１２も、平面視において同じ側（手前側）に設けられている。 Further, the transfer shaft 71 is provided within a range in which the first holding mechanism 3 can move above the substrate supply portion 11b of the substrate supply mechanism 11 and the second holding mechanism 6 can move above the storage box 111 ( See Figure 27). A storage box 111 and a drying table 112, which will be described later, are also provided on the same side (front side) of the transfer shaft 71 in plan view.
　さらに、メイン移動機構７２のガイドレール７２１は、トランスファ軸７１に沿ってＸ方向に一直線に延びており、トランスファ軸７１と同様に、第１保持機構３が基板供給機構１１の基板供給部１１ｂの上方に移動できるとともに、第２保持機構６が収容ボックス１１１の上方に移動できる範囲で設けられている。 Further, the guide rail 721 of the main moving mechanism 72 extends straight in the X direction along the transfer shaft 71, and similarly to the transfer shaft 71, the first holding mechanism 3 is positioned at the substrate supply portion 11b of the substrate supply mechanism 11. While being able to move upward, the second holding mechanism 6 is provided within a range capable of moving upward of the storage box 111 .
＜切断装置１００の乾燥機能＞
　第３実施形態の切断装置１００は、第２クリーニング機構１９によりクリーニングされた複数の製品Ｐをさらに乾燥する機能を有している。具体的に切断装置１００は、図２７～図２９に示すように、複数の製品Ｐを乾燥するための乾燥用テーブル１１２と、乾燥用テーブル１１２に載置された複数の製品Ｐを乾燥する乾燥機構１１３と、当該乾燥機構１１３を乾燥用テーブル１１２に沿って移動させる乾燥用移動機構１１４とを備えている。 <Drying Function of Cutting Device 100>
The cutting device 100 of the third embodiment has a function of further drying the multiple products P cleaned by the second cleaning mechanism 19 . Specifically, as shown in FIGS. 27 to 29, the cutting apparatus 100 includes a drying table 112 for drying a plurality of products P and a drying table 112 for drying the plurality of products P placed on the drying table 112. A mechanism 113 and a drying moving mechanism 114 for moving the drying mechanism 113 along the drying table 112 are provided.
　乾燥用テーブル１１２は、第２保持機構６及び搬送用移動機構７により複数の製品Ｐが搬送されて載置されるものである。この乾燥用テーブル１１２は、複数の製品Ｐを吸着して保持する。また、乾燥用テーブル１１２は、２つの切断用テーブル２Ａ、２Ｂと水平面上においてＸ方向に沿って一列に配置される。本実施形態の乾燥用テーブル１１２は、平面視において矩形状をなすものであるが、その他の形状であってもよい。 A plurality of products P are transported and placed on the drying table 112 by the second holding mechanism 6 and transport moving mechanism 7 . This drying table 112 holds a plurality of products P by suction. In addition, the drying table 112 and the two cutting tables 2A and 2B are arranged in a line along the X direction on the horizontal plane. The drying table 112 of this embodiment has a rectangular shape in a plan view, but may have another shape.
　乾燥機構１１３は、乾燥用テーブル１１２の上方から気体である圧縮空気を噴射して、乾燥用テーブル１１２に吸着保持された複数の製品Ｐを乾燥するものである。この乾燥機構１１３は、乾燥用テーブル１１２に保持された複数の製品Ｐに圧縮空気を噴射する噴射ノズル１１３ａを有している。本実施形態の噴射ノズル１１３ａは、乾燥用テーブル１１２に向けて設けられた、直線状に延びるスリット状をなす開口を有するものであるが（図２８参照）、Ｘ方向に沿って間欠的に設けられた複数の開口を有するものであっても良い。 The drying mechanism 113 jets compressed air, which is a gas, from above the drying table 112 to dry the plurality of products P adsorbed and held on the drying table 112 . This drying mechanism 113 has an injection nozzle 113a for injecting compressed air onto the plurality of products P held on the drying table 112 . The injection nozzle 113a of this embodiment has a linearly extending slit-shaped opening facing the drying table 112 (see FIG. 28). It may have a plurality of openings that are aligned with each other.
　本実施形態の乾燥機構１１３は、乾燥用移動機構１１４による移動方向に向けて圧縮空気を噴射するように構成されている（図２８参照）。つまり、噴射ノズル１１３ａによる圧縮空気の噴射方向が乾燥用移動機構１１４による移動方向（ここでは、Ｙ方向において手前側から奥側）を向くように構成されている。 The drying mechanism 113 of this embodiment is configured to inject compressed air in the moving direction of the drying movement mechanism 114 (see FIG. 28). In other words, the direction in which the compressed air is jetted by the jet nozzle 113a is directed to the movement direction of the drying movement mechanism 114 (here, from the front side to the back side in the Y direction).
　また、乾燥機構１１３の噴射ノズル１１３ａは、図２８に示すように、乾燥用テーブル１１２上に保持された複数の製品ＰのＸ方向に沿った配列方向に対して例えば３０度未満で傾斜して配置されている。ここで、乾燥用テーブル１１２には、複数の製品ＰがＸ方向及びＹ方向においてマトリックス状に配置されており、乾燥機構１１３の噴射ノズル１１３ａは、各製品ＰのＸ方向に沿った一辺に対して傾斜して圧縮空気を噴射することになる。これにより、隣接する製品Ｐの間に溜まっている水分を製品Ｐから吹き飛ばしやすくしている。これにより、複数の製品Ｐの乾燥が促進される。また、乾燥機構１１３の噴射ノズル１１３ａのスリット状の開口を、乾燥用テーブル１１２に向けて若干傾斜するように設け、圧縮空気が乾燥機構１１３の移動方向に向けて吹き飛ばされるようにしてもよい。 Further, as shown in FIG. 28, the jet nozzle 113a of the drying mechanism 113 is inclined at, for example, less than 30 degrees with respect to the arrangement direction of the plurality of products P held on the drying table 112 along the X direction. are placed. Here, on the drying table 112, a plurality of products P are arranged in a matrix in the X direction and the Y direction. , the compressed air is injected at an angle. This makes it easy to blow off the water remaining between the adjacent products P from the products P. Thereby, the drying of the plurality of products P is promoted. Also, the slit-shaped opening of the injection nozzle 113a of the drying mechanism 113 may be provided so as to be slightly inclined toward the drying table 112 so that the compressed air is blown away in the moving direction of the drying mechanism 113.
　乾燥用移動機構１１４は、乾燥機構１１３を乾燥用テーブル１１２の上方においてＹ方向に移動させるものである。本実施形態の乾燥用移動機構１１４は、乾燥用テーブル１１２に対して乾燥機構１１３をＹ方向に往復移動させるものである。具体的に乾燥用移動機構１１４は、図２８及び図２９に示すように、Ｙ方向に延びるＹ方向ガイドレール１１４１と、当該Ｙ方向ガイドレール１１４１に沿って移動するとともに乾燥機構１１３を保持するスライド部材１１４２と、当該スライド部材１１４２をＹ方向ガイドレール１１４１に沿って移動させる駆動部（不図示）とを備えている。なお、駆動部としては、例えばボールねじ機構を用いたものであっても良いし、エアシリンダを用いたものであっても良いし、リニアモータを用いたものであっても良い。 The drying movement mechanism 114 moves the drying mechanism 113 above the drying table 112 in the Y direction. The drying movement mechanism 114 of this embodiment reciprocates the drying mechanism 113 in the Y direction with respect to the drying table 112 . Specifically, as shown in FIGS. 28 and 29, the drying movement mechanism 114 includes a Y-direction guide rail 1141 extending in the Y-direction and a slide that moves along the Y-direction guide rail 1141 and holds the drying mechanism 113. It has a member 1142 and a drive section (not shown) that moves the slide member 1142 along the Y-direction guide rail 1141 . The drive unit may be, for example, one using a ball screw mechanism, one using an air cylinder, or one using a linear motor.
＜乾燥動作の一例＞
　次に乾燥機構１１３及び乾燥用移動機構１１４による乾燥動作について説明する。 <Example of drying operation>
Next, the drying operation by the drying mechanism 113 and the drying moving mechanism 114 will be described.
　乾燥用テーブル１１２に複数の製品Ｐを載置する前において、乾燥用移動機構１１４は、複数の製品Ｐの載置を邪魔しないように、乾燥機構１１３を乾燥用テーブル１１２のＹ方向一方側（例えば手前側）に退避させている。そして、乾燥用テーブル１１２に複数の製品Ｐが載置されて保持されると、乾燥機構１１３は圧縮空気の噴射を開始するとともに、乾燥用移動機構１１４は乾燥機構１１３をＹ方向他方側（例えば奥側）に移動させる。これにより、乾燥用テーブル１１２に保持された複数の製品Ｐの乾燥が行われる。なお、乾燥用移動機構１１４が、乾燥機構１１３をＹ方向他方側（奥側）からＹ方向一方側（手前側）に移動させる際には、乾燥機構１１３は気体の噴射を停止する。なお、乾燥機構１１３は往路だけでなく復路においても圧縮空気を噴射する構成としても良い。 Before placing the plurality of products P on the drying table 112, the drying moving mechanism 114 moves the drying mechanism 113 to one side of the drying table 112 in the Y direction ( For example, it is retracted to the front side). Then, when a plurality of products P are placed and held on the drying table 112, the drying mechanism 113 starts jetting compressed air, and the drying moving mechanism 114 moves the drying mechanism 113 to the other side in the Y direction (for example, back). As a result, the plurality of products P held on the drying table 112 are dried. When the drying movement mechanism 114 moves the drying mechanism 113 from the other side in the Y direction (back side) to the one side in the Y direction (front side), the drying mechanism 113 stops jetting the gas. Note that the drying mechanism 113 may be configured to jet compressed air not only on the outward path but also on the return path.
＜バルク収容の具体的な構成（収容ボックス１１１及び掻き落とし部材１１５）＞
　収容ボックス１１１は、図２７～図２９に示すように、複数の製品Ｐをばらばらの状態で収容する（いわゆるバルク収容する）ものである。また、収容ボックス１１１は、２つの切断用テーブル２Ａ、２Ｂと水平面上においてＸ方向に沿って一列に配置される。この収容ボックス１１１は、第２保持機構６から複数の製品Ｐを掻き落とす掻き落とし部材１１５をさらに備えている。 <Specific Configuration of Bulk Storage (Storage Box 111 and Scraping Member 115)>
As shown in FIGS. 27 to 29, the storage box 111 stores a plurality of products P in a discrete state (so-called bulk storage). In addition, the storage box 111 and the two cutting tables 2A and 2B are arranged in a line along the X direction on the horizontal plane. This storage box 111 further includes a scraping member 115 that scrapes off the plurality of products P from the second holding mechanism 6 .
　収容ボックス１１１は、平面視において矩形状の上部開口１１１Ｘを有するものである（図２８参照）。そして、掻き落とし部材１１５は、収容ボックス１１１の上部開口１１１Ｘの一辺に固定されている。この掻き落とし部材１１５に対して第２保持機構６をＸ方向に移動させることにより、製品Ｐが掻き落とされて落下して収容ボックス１１１に収容される。 The storage box 111 has a rectangular upper opening 111X in plan view (see FIG. 28). The scraping member 115 is fixed to one side of the upper opening 111X of the storage box 111 . By moving the second holding mechanism 6 in the X direction with respect to the scraping member 115 , the product P is scraped off and dropped to be stored in the storage box 111 .
　また、本実施形態の収容ボックス１１１は、Ｘ方向において乾燥用テーブル１１２と後述する保持用プレートＭ１を収容するプレート収容部２４との間に設けられており、掻き落とし部材１１５は、収容ボックス１１１の上部開口１１１Ｘにおいて乾燥用テーブル１１２側の一辺に設けられている。これにより、製品Ｐを掻き落とす際に、第２保持機構６がプレート収容部２４に干渉しない構成としている。 Further, the storage box 111 of the present embodiment is provided between the drying table 112 and a plate storage portion 24 that stores a holding plate M1, which will be described later, in the X direction. is provided on one side of the drying table 112 side of the upper opening 111X. As a result, the second holding mechanism 6 does not interfere with the plate accommodating portion 24 when the product P is scraped off.
　掻き落とし部材１１５は、上部開口１１１Ｘにおける乾燥用テーブル１１２側の一辺から上方に延び設けられている（図２９参照）。また、掻き落とし部材１１５としては、吸着解除された第２保持機構６から離れない製品Ｐを掻き落とすものであれば良く、例えば、ＰＥＥＫ材などの樹脂製のものであり、その形態は、ブラシ形状であっても良いし、平板形状であってもよい。 The scraping member 115 extends upward from one side of the upper opening 111X on the drying table 112 side (see FIG. 29). Further, the scraping member 115 may be any member as long as it scrapes off the product P that does not separate from the second holding mechanism 6 that has been released from suction. It may be in the shape of a flat plate.
　本実施形態では、収容ボックス１１１は、トランスファ軸７１の手前側に配置されており、収容ボックス１１１の手前側の外面に取っ手１１１１（図２８参照）が設けられており、切断装置１００の手前側から取り外すことができるように構成されている。この構成により、製品Ｐの取出し、回収等のメンテナンス性を向上することができる。なお、収容ボックス１１１の取り出す方向は手前側に限られず、例えば、切断装置１００の横側から取り出す構成としても良いし、奥側から取り出す構成としても良い。 In this embodiment, the storage box 111 is arranged on the front side of the transfer shaft 71, and a handle 1111 (see FIG. 28) is provided on the outer surface of the storage box 111 on the front side. It is designed so that it can be removed from the With this configuration, it is possible to improve maintainability such as taking out and recovering the product P. The direction in which the storage box 111 is taken out is not limited to the front side.
＜切断装置１００の動作の一例＞
　次に、第３実施形態の切断装置１００の動作の一例を、図３０を参照して説明する。図３０には、切断装置１００の動作における第１保持機構３の移動経路、及び、第２保持機構６の移動経路を示している。なお、本実施形態においては、切断装置１００の動作、例えば封止済基板Ｗの搬送、封止済基板Ｗの切断、製品Ｐのクリーニング、製品Ｐの乾燥、及び、製品Ｐの掻き落とし動作など、すべての動作や制御は制御部ＣＴＬ（図２７参照）により行われる。 <Example of Operation of Cutting Device 100>
Next, an example of operation of the cutting device 100 of the third embodiment will be described with reference to FIG. FIG. 30 shows the moving path of the first holding mechanism 3 and the moving path of the second holding mechanism 6 in the operation of the cutting device 100. As shown in FIG. In the present embodiment, the operation of the cutting device 100, for example, transporting the sealed substrate W, cutting the sealed substrate W, cleaning the product P, drying the product P, scraping off the product P, etc. , all operations and controls are performed by the controller CTL (see FIG. 27).
　本実施形態の切断装置１００の動作において、封止済基板Ｗの搬送、封止済基板Ｗの切断、及び、製品Ｐのクリーニングまでの動作は、前記第１実施形態と同様である。 In the operation of the cutting device 100 of the present embodiment, the operations from transporting the sealed substrate W, cutting the sealed substrate W, and cleaning the product P are the same as in the first embodiment.
　そして、製品Ｐのクリーニングの後、搬送用移動機構７は第２保持機構６を乾燥用テーブル１１２に移動させて、第２保持機構６は吸着保持を解除して、複数の製品Ｐを乾燥用テーブル１１２に載置する。そして、乾燥用テーブル１１２は、封止済基板Ｗを吸着保持する。このとき、搬送用移動機構７は、第２保持機構６を乾燥機構１１３の移動を邪魔しない位置に退避させる。 After cleaning the products P, the transfer mechanism 7 moves the second holding mechanism 6 to the drying table 112, the second holding mechanism 6 releases the suction holding, and the plurality of products P are moved to the drying table 112. It is placed on the table 112 . The drying table 112 holds the sealed substrate W by suction. At this time, the transport moving mechanism 7 retracts the second holding mechanism 6 to a position that does not interfere with the movement of the drying mechanism 113 .
　この状態で、乾燥用移動機構１１４が乾燥機構１１３をＹ方向に往復移動させるとともに、乾燥機構１１３が圧縮空気を噴射することによって、複数の製品Ｐの乾燥が行われる。なお、乾燥用移動機構１１４による乾燥機構１１３の往復回数は、適宜設定可能であり、１回であっても良いし、複数回であっても良い。 In this state, the drying movement mechanism 114 reciprocates the drying mechanism 113 in the Y direction, and the drying mechanism 113 jets compressed air, thereby drying the plurality of products P. The number of reciprocations of the drying mechanism 113 by the drying movement mechanism 114 can be set as appropriate, and may be one time or a plurality of times.
　乾燥の後、搬送用移動機構７は第２保持機構６を乾燥用テーブル１１２に移動させて、第２保持機構６は、乾燥用テーブル１１２から複数の製品Ｐを吸着保持する。その後、搬送用移動機構７は、複数の製品Ｐを保持した第２保持機構６を収容ボックス１１１に移動させる。 After drying, the transfer mechanism 7 moves the second holding mechanism 6 to the drying table 112, and the second holding mechanism 6 holds the plurality of products P from the drying table 112 by suction. After that, the transportation moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the storage box 111 .
　そして、第２保持機構６は、収容ボックス１１１の上部開口１１１Ｘの上方において、複数の製品Ｐの吸着保持を解除する。その後、搬送用移動機構７は、第２保持機構６から落下せずに第２保持機構６に残存している製品Ｐが掻き落とし部材１１５に当たるように、第２保持機構６を掻き落とし部材１１５に対して乾燥用テーブル１１２側に移動させる。本実施形態では、製品Ｐを確実に掻き落とすために、掻き落し部材１１５が第２保持機構６の吸着面である下面に接触するように第２保持機構６を掻き落とし部材１１５に対して移動させる。これにより、複数の製品Ｐが収容ボックス１１１に落下して収容される。 Then, the second holding mechanism 6 releases suction holding of the plurality of products P above the upper opening 111X of the storage box 111 . After that, the transfer mechanism 7 moves the second holding mechanism 6 to the scraping member 115 so that the product P remaining on the second holding mechanism 6 without falling from the second holding mechanism 6 hits the scraping member 115 . relative to the drying table 112 side. In this embodiment, in order to reliably scrape off the product P, the second holding mechanism 6 is moved with respect to the scraping member 115 so that the scraping member 115 contacts the lower surface, which is the suction surface of the second holding mechanism 6 . Let As a result, a plurality of products P are dropped and stored in the storage box 111 .
＜保持用プレートＭ１の自動交換機能＞
　さらに第３実施形態の切断装置１００は、前記第１、第２実施形態と同様に、封止済基板Ｗ又は製品Ｐを保持するための保持用プレートＭ１を自動的に交換できる機能を有している。なお、本実施形態では、切断用テーブル２Ａ、２Ｂ、乾燥用テーブル１１２及び第２保持機構６が、保持用プレートＭ１及び保持ベース部Ｍ２を有している。なお、保持用プレートＭ１及び保持ベース部Ｍ２の具体的構成は、第１実施形態と同様である。 <Automatic Exchange Function of Holding Plate M1>
Furthermore, the cutting apparatus 100 of the third embodiment has a function of automatically exchanging the holding plate M1 for holding the sealed substrate W or the product P, as in the first and second embodiments. ing. In this embodiment, the cutting tables 2A and 2B, the drying table 112 and the second holding mechanism 6 have the holding plate M1 and the holding base portion M2. The specific configurations of the holding plate M1 and the holding base portion M2 are the same as in the first embodiment.
　具体的に切断装置１００は、図２７及び図３１に示すように、保持用プレートＭ１を収容するプレート収容部２４と、保持用プレートＭ１をプレート収容部２４及び保持ベース部Ｍ２の間で搬送するプレート搬送機構２５とを備えている。なお、第２実施形態の切断装置１００には、前記第１実施形態と同様に、固定機構２６及び検査機構２９が設けられている。 Specifically, as shown in FIGS. 27 and 31, the cutting device 100 conveys the plate accommodating portion 24 that accommodates the holding plate M1 and the holding plate M1 between the plate accommodating portion 24 and the holding base portion M2. A plate transport mechanism 25 is provided. The cutting device 100 of the second embodiment is provided with a fixing mechanism 26 and an inspection mechanism 29 as in the first embodiment.
　第３実施形態のプレート搬送機構２５は、第２保持機構６及び搬送用移動機構７を用いて構成されており、複数の製品Ｐを搬送することができる。言い換えれば、第２保持機構６及び搬送用移動機構７が、保持用プレートＭ１を搬送する機能を有している。このプレート搬送機構２５は、上述した共通のトランスファ軸７１によってＸ方向に移動する構成とされている。また、プレート搬送機構２５は、トランスファ軸７１に対して、平面視において同じ側（手前側）に設けられていることになる。ここで、プレート搬送機構２５を構成する第２保持機構６は、第１実施形態と同様に、保持用プレートＭ１に形成された搬送用保持孔２８１（図１０参照）に挿入される搬送用シリンダ部２８２を有している（図１３参照）。 The plate conveying mechanism 25 of the third embodiment is configured using the second holding mechanism 6 and the conveying moving mechanism 7, and can convey a plurality of products P. In other words, the second holding mechanism 6 and the transport moving mechanism 7 have the function of transporting the holding plate M1. The plate transport mechanism 25 is configured to move in the X direction by the common transfer shaft 71 described above. Also, the plate transport mechanism 25 is provided on the same side (front side) of the transfer shaft 71 in plan view. Here, as in the first embodiment, the second holding mechanism 6 that constitutes the plate conveying mechanism 25 is a conveying cylinder that is inserted into a conveying holding hole 281 (see FIG. 10) formed in the holding plate M1. It has a portion 282 (see FIG. 13).
＜保持用プレートＭ１の交換動作＞
　次に本実施形態のプレート搬送機構２５による保持用プレートＭ１の交換動作について、図３２を参照して説明する。 <Replacement operation of holding plate M1>
Next, the exchange operation of the holding plate M1 by the plate conveying mechanism 25 of this embodiment will be described with reference to FIG.
　なお、以下の交換動作において、プレート収容部２４から保持用プレートＭ１を取り出す際の保持用プレートＭ１の判別は、保持用プレートＭ１に設けられたＲＦＩＤなどの識別子を、プレート搬送機構２５（第２保持機構６）に設けられた識別子リーダ（不図示）により読み取ることにより行う。 In the following replacement operation, the holding plate M1 is identified when the holding plate M1 is taken out from the plate accommodating portion 24 by using the identifier such as the RFID provided on the holding plate M1 to the plate conveying mechanism 25 (second It is read by an identifier reader (not shown) provided in the holding mechanism 6).
（１）第２保持機構６の保持用プレートＭ１の取り外し動作（図３２（ａ）参照）
　まず、第２保持機構６の保持用プレートＭ１を取り外す。具体的には、搬送用移動機構７により第２保持機構６をプレート収容部２４に移動させるとともに、第２保持機構６を下降させて保持用プレートＭ１を取り外し、スライド棚部２４１に保持用プレートＭ１を載置して収容する。なお、第２保持機構６の保持用プレートＭ１を取り外す際には、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にして固定機構２６の固定を解除する。 (1) Removal operation of the holding plate M1 of the second holding mechanism 6 (see FIG. 32(a))
First, the holding plate M1 of the second holding mechanism 6 is removed. Specifically, the transport moving mechanism 7 moves the second holding mechanism 6 to the plate housing portion 24 , lowers the second holding mechanism 6 , removes the holding plate M<b>1 , and slides the holding plate to the slide shelf portion 241 . M1 is placed and accommodated. When removing the holding plate M1 of the second holding mechanism 6, compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the recessed position, thereby releasing the fixing of the fixing mechanism 26. FIG.
　この保持用プレートＭ１が取り外された状態の第２保持機構６を用いて、切断用テーブル２Ａ、２Ｂ又は乾燥用テーブル１１２の保持用プレートの交換動作が行われる。 Using the second holding mechanism 6 with the holding plate M1 removed, the holding plates of the cutting tables 2A and 2B or the drying table 112 are exchanged.
（２）切断用テーブル２Ａ、２Ｂの保持用プレートＭ１の交換動作（図３２（ｂ）参照）
　切断用テーブル２Ａ、２Ｂの保持用プレートＭ１を取り外し、プレート搬送機構２５（搬送用移動機構７及び第２保持機構６）により保持用プレートＭ１を上昇させて上昇位置とした状態でプレート収容部２４に搬送し、保持用プレートＭ１を下降させてスライド棚部２４１に載置して収容する。なお、切断用テーブル２Ａ、２Ｂの保持用プレートＭ１を取り外す際には、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にして固定機構２６の固定を解除する。 (2) Replacement operation of the holding plates M1 of the cutting tables 2A and 2B (see FIG. 32(b))
The holding plates M1 of the cutting tables 2A and 2B are removed, and the holding plates M1 are lifted by the plate conveying mechanism 25 (the conveying movement mechanism 7 and the second holding mechanism 6) to the raised position. , and the holding plate M1 is lowered and placed on the slide shelf portion 241 for storage. When the holding plates M1 of the cutting tables 2A and 2B are removed, compressed air is supplied to the fixing cylinder portion 262 so that the mover 262b is retracted to release the fixation of the fixing mechanism 26. FIG.
　次に、プレート搬送機構２５（搬送用移動機構７及び第２保持機構６）が、プレート収容部２４から切断用テーブル２Ａ、２Ｂの新しい保持用プレートＭ１を取り出し、切断用テーブル２Ａ、２Ｂの保持ベース部Ｍ２に上昇位置とした状態で搬送し、保持用プレートＭ１を下降させて載置する。この状態で、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にすると、固定用シリンダ部２６２が保持用プレートＭ１の固定用挿入孔２６１に入り、その後、圧縮空気の供給を停止すると、可動子２６２ｂが突出した位置となり、切断用テーブル２Ａ、２Ｂの保持ベース部Ｍ２に対して保持用プレートＭ１が固定される。 Next, the plate transport mechanism 25 (transport moving mechanism 7 and second holding mechanism 6) takes out new holding plates M1 of the cutting tables 2A and 2B from the plate housing section 24, and holds the cutting tables 2A and 2B. It is conveyed to the base portion M2 in the raised position, and the holding plate M1 is lowered and placed thereon. In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied. When the supply is stopped, the mover 262b is at the projecting position, and the holding plate M1 is fixed to the holding base portion M2 of the cutting tables 2A and 2B.
（３）乾燥用テーブル１１２の保持用プレートＭ１の交換動作（図３２（ｂ）参照）
　乾燥用テーブル１１２の保持用プレートＭ１を取り外し、プレート搬送機構２５（搬送用移動機構７及び第２保持機構６）により保持用プレートＭ１を上昇させて上昇位置とした状態でプレート収容部２４に搬送し、保持用プレートＭ１を下降させて前方にスライドされたスライド棚部２４１に載置して収容する。なお、乾燥用テーブル１１２の保持用プレートＭ１を取り外す際には、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にして固定機構２６の固定を解除する。 (3) Replacement operation of the holding plate M1 of the drying table 112 (see FIG. 32(b))
The holding plate M1 of the drying table 112 is removed, and the holding plate M1 is lifted by the plate conveying mechanism 25 (the conveying moving mechanism 7 and the second holding mechanism 6) to the elevated position, and conveyed to the plate accommodating section 24. Then, the holding plate M1 is lowered and placed on the slide shelf 241 that is slid forward for storage. When removing the holding plate M1 of the drying table 112, compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the recessed position, thereby releasing the fixation of the fixing mechanism 26. FIG.
　次に、プレート搬送機構２５（搬送用移動機構７及び第２保持機構６）が、プレート収容部２４から乾燥用テーブル１１２の新しい保持用プレートＭ１を取り出し、乾燥用テーブル１１２の保持ベース部Ｍ２に上昇位置とした状態で搬送し、保持用プレートＭ１を下降させて載置する。この状態で、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にすると、固定用シリンダ部２６２が保持用プレートＭ１の固定用挿入孔２６１に入り、その後、圧縮空気の供給を停止すると、可動子２６２ｂが突出した位置となり、乾燥用テーブル１１２の保持ベース部Ｍ２に対して保持用プレートＭ１が固定される。 Next, the plate conveying mechanism 25 (conveyance moving mechanism 7 and second holding mechanism 6) takes out the new holding plate M1 of the drying table 112 from the plate accommodating portion 24, and places it on the holding base portion M2 of the drying table 112. The substrate is transported in the raised position, and the holding plate M1 is lowered and placed. In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied. When the supply is stopped, the mover 262b is at a projected position, and the holding plate M1 is fixed to the holding base portion M2 of the drying table 112. As shown in FIG.
（４）第２保持機構６の保持用プレートＭ１の取り付け動作（図３２（ｃ）参照）
　上記の通り、切断用テーブル２Ａ、２Ｂ及び乾燥用テーブル１１２の保持用プレートＭ１の交換動作を行った後に、搬送用移動機構７により第２保持機構６をプレート収容部２４に移動させるとともに、第２保持機構６を下降させて、スライド棚部２４１に載置された新しい保持用プレートＭ１が取り付けられる。ここでは、搬送用移動機構７により第２保持機構６の保持ベース部Ｍ２に設けられた固定用シリンダ部２６２が保持用プレートＭ１に形成された固定用挿入孔２６１に差し込まれる。この状態で、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にすると、固定用シリンダ部２６２が保持用プレートＭ１の固定用挿入孔２６１に入り、その後、圧縮空気の供給を停止すると、可動子２６２ｂが突出した位置となり、第２保持機構６の保持ベース部Ｍ２に対して保持用プレートＭ１が固定される。 (4) Mounting operation of the holding plate M1 of the second holding mechanism 6 (see FIG. 32(c))
As described above, after the holding plates M1 of the cutting tables 2A and 2B and the drying table 112 have been exchanged, the transport moving mechanism 7 moves the second holding mechanism 6 to the plate housing portion 24, 2 The holding mechanism 6 is lowered, and a new holding plate M1 placed on the slide shelf 241 is attached. Here, the fixing cylinder portion 262 provided in the holding base portion M2 of the second holding mechanism 6 is inserted into the fixing insertion hole 261 formed in the holding plate M1 by the transportation moving mechanism 7 . In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied. When the supply is stopped, the mover 262b is at a projected position, and the holding plate M1 is fixed to the holding base portion M2 of the second holding mechanism 6. As shown in FIG.
　なお、切断用テーブル２Ａ、２Ｂの保持用プレートＭ１の交換動作と、乾燥用テーブル１１２の保持用プレートＭ１の交換動作とはどちらを先に行っても構わない。また、切断用テーブル２Ａ、２Ｂ及び乾燥用テーブル１１２の保持ベース部Ｍ２から保持用プレートＭ１を取り外し、その後、切断用テーブル２Ａ、２Ｂ及び乾燥用テーブル１１２の保持ベース部Ｍ２に新しい保持用プレートＭ１を取り付けることもできる。 It does not matter which of the replacement operation of the holding plates M1 of the cutting tables 2A and 2B and the replacement operation of the holding plates M1 of the drying table 112 is performed first. Also, the holding plate M1 is removed from the holding base portions M2 of the cutting tables 2A, 2B and the drying table 112, and then new holding plates M1 are attached to the holding base portions M2 of the cutting tables 2A, 2B and the drying table 112. can also be installed.
　また、上記では、第２保持機構６、切断用テーブル２Ａ、２Ｂ及び乾燥用テーブル１１２の保持用プレートＭ１の交換を一連の動作としているが、第２保持機構６、切断用テーブル２Ａ、２Ｂ又は乾燥用テーブル１１２の少なくとも１つにおける保持用プレートＭ１の交換を個別に行うようにしても良い。このとき、切断用テーブル２Ａ、２Ｂ又は乾燥用テーブル１１２の保持用プレートＭ１を交換する際には、プレート搬送機構２５を構成する第２保持機構６の保持用プレートＭ１を予め取り外すことが考えられる。 In the above description, the exchange of the holding plate M1 of the second holding mechanism 6, the cutting tables 2A and 2B, and the drying table 112 is a series of operations. The holding plate M1 on at least one of the drying tables 112 may be exchanged individually. At this time, when replacing the holding plate M1 of the cutting tables 2A, 2B or the drying table 112, it is conceivable to previously remove the holding plate M1 of the second holding mechanism 6 that constitutes the plate conveying mechanism 25. .
＜第３実施形態の効果＞
　第３実施形態の切断装置１００によれば、第１、第２実施形態と同様に、保持ベース部Ｍ２から取り外された保持用プレートＭ１をプレート収容部２４に搬送し、プレート収容部２４にある保持用プレートＭ１を保持ベース部Ｍ２に搬送するプレート搬送機構２５を有するので、保持ベース部Ｍ２に対して保持用プレートＭ１を自動的に交換することができる。その結果、保持用プレートＭ１を交換するための人件費を削減することができる。また、保持用プレートＭ１を自動的に交換するので、保持用プレートＭ１の交換時間を短縮することができ、切断装置１００の生産性を向上することができる。さらに、保持ベース部Ｍ２に対する保持用プレートＭ１の取り付け状態のばらつきを低減することができる。その他、第３実施形態において、前記第１、第２実施形態と同様の構成により生じる効果は同じである。 <Effects of the third embodiment>
According to the cutting device 100 of the third embodiment, similarly to the first and second embodiments, the holding plate M1 removed from the holding base portion M2 is conveyed to the plate accommodating portion 24, and Since the plate conveying mechanism 25 that conveys the holding plate M1 to the holding base portion M2 is provided, the holding plate M1 can be automatically exchanged with respect to the holding base portion M2. As a result, labor costs for exchanging the holding plate M1 can be reduced. In addition, since the holding plate M1 is automatically replaced, the replacement time of the holding plate M1 can be shortened, and the productivity of the cutting apparatus 100 can be improved. Furthermore, it is possible to reduce variations in the mounting state of the holding plate M1 with respect to the holding base portion M2. Other than that, in the third embodiment, the effects produced by the same configuration as in the first and second embodiments are the same.
　特に、第３実施形態では、プレート搬送機構２５が、複数の製品Ｐを収容ボックス１１１に搬送することができるので、プレート搬送機構２５とは別の製品搬送機構を設ける必要がなく、バルク収容する切断装置１００の装置構成を簡素化することができる。さらに、装置コストも削減することができる。その他、複数の製品Ｐを収容ボックス１１１に落下させて収容するので、従来のトレイ収容する構成に比べて、収容スペースを小型化することができる。これによっても、切断装置１００のフットプリントを低減することができる。 In particular, in the third embodiment, since the plate transport mechanism 25 can transport a plurality of products P to the storage box 111, there is no need to provide a product transport mechanism separate from the plate transport mechanism 25, and bulk storage can be performed. The device configuration of the cutting device 100 can be simplified. Furthermore, equipment costs can also be reduced. In addition, since a plurality of products P are dropped and stored in the storage box 111, the size of the storage space can be reduced as compared with the conventional tray storage structure. This also allows the footprint of the cutting device 100 to be reduced.
＜第３実施形態の変形例＞
　例えば、第３実施形態では、切断用テーブル２Ａ、２Ｂ、乾燥用テーブル１１２及び保持機構（第２保持機構６）それぞれの保持用プレートＭ１を自動的に交換する構成であったが、切断用テーブル２Ａ、２Ｂ、乾燥用テーブル１１２及び保持機構（第２保持機構６）の少なくとも１つを自動的に交換する構成としても良い。 <Modified example of the third embodiment>
For example, in the third embodiment, the holding plates M1 of the cutting tables 2A and 2B, the drying table 112, and the holding mechanism (second holding mechanism 6) are automatically exchanged. At least one of 2A, 2B, drying table 112, and holding mechanism (second holding mechanism 6) may be automatically replaced.
　第３実施形態のプレート搬送機構２５は、第２保持機構６及び搬送用移動機構７を用いない構成としても良い。 The plate transport mechanism 25 of the third embodiment may be configured without using the second holding mechanism 6 and transport moving mechanism 7 .
　また、前記第３実施形態のプレート収容部２４は、切断用テーブル２Ａ、２Ｂ、乾燥用テーブル１１２及び保持機構（第２保持機構６）それぞれの保持用プレートＭ１を収容するものであったが、保持用プレートＭ１の種類に応じて専用のプレート収容部２４を複数設ける構成としても良い。 In addition, the plate accommodating portion 24 of the third embodiment accommodates the holding plates M1 of the cutting tables 2A and 2B, the drying table 112, and the holding mechanism (second holding mechanism 6). A plurality of dedicated plate accommodating portions 24 may be provided according to the type of holding plate M1.
　また、掻き落とし部材１１５を有さずに、第２保持機構６により吸着保持を解除した後に、第２保持機構６からガスを噴射することによって、複数の製品Ｐを落下させる構成にすることもできる。 Alternatively, without the scraping member 115, after the second holding mechanism 6 cancels the suction holding, the second holding mechanism 6 may jet gas to drop the plurality of products P. can.
　さらに、掻き落とし部材１１５を収容ボックス１１１に固定する構成の他、他の部材に固定しても良いし、又は、掻き落とし部材１１５を移動可能に構成して、第２保持機構６に対して掻き落とし部材１１５が移動することにより、複数の製品Ｐを掻き落とす構成としても良い。 Furthermore, in addition to the configuration in which the scraping member 115 is fixed to the storage box 111, it may be fixed to another member, or the scraping member 115 may be configured to be movable so as to be attached to the second holding mechanism 6. A plurality of products P may be scraped off by moving the scraping member 115 .
＜本発明の第４実施形態＞
　次に、本発明の第４実施形態について説明する。
　第４実施形態の切断装置１００は、前記第１実施形態のトレイ収容、第２実施形態のリング収容及び第３実施形態のバルク収容とは異なり、複数の製品Ｐを筒状容器１１６に収容（「チューブ収容」とも呼ばれる。）できるように構成されている。なお、筒状容器１１６は、チューブ、マガジンスティック、スティックマガジン、スティックなどと呼ばれることがある。 <Fourth Embodiment of the Present Invention>
Next, a fourth embodiment of the invention will be described.
Unlike the tray accommodation of the first embodiment, the ring accommodation of the second embodiment, and the bulk accommodation of the third embodiment, the cutting device 100 of the fourth embodiment accommodates a plurality of products P in a cylindrical container 116 ( (also called “tube accommodation”). Note that the cylindrical container 116 may be called a tube, magazine stick, stick magazine, stick, or the like.
　具体的に切断装置１００は、図３３に示すように、封止済基板Ｗを保持する２つの切断用テーブル（加工テーブル）２Ａ、２Ｂと、封止済基板Ｗを切断用テーブル２Ａ、２Ｂに搬送するために封止済基板Ｗを保持する第１保持機構３と、切断用テーブル２Ａ、２Ｂに保持された封止済基板Ｗを切断する切断機構（加工機構）４と、複数の製品Ｐが移される移載テーブル５と、複数の製品Ｐを切断用テーブル２Ａ、２Ｂから移載テーブル５に搬送するために複数の製品Ｐを保持する第２保持機構６と、第１保持機構３及び第２保持機構６を移動させるための共通のトランスファ軸７１を有する搬送用移動機構７と、切断機構４を切断用テーブル２Ａ、２Ｂに保持された封止済基板Ｗに対して移動させる切断用移動機構（加工用移動機構）８とを備えている。 Specifically, as shown in FIG. 33, the cutting apparatus 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W, and the sealed substrate W on the cutting tables 2A and 2B. A first holding mechanism 3 that holds the sealed substrate W for transportation, a cutting mechanism (processing mechanism) 4 that cuts the sealed substrate W held on the cutting tables 2A and 2B, and a plurality of products P a transfer table 5 to which the are transferred, a second holding mechanism 6 for holding a plurality of products P in order to transfer the plurality of products P from the cutting tables 2A and 2B to the transfer table 5, a first holding mechanism 3 and A transfer moving mechanism 7 having a common transfer shaft 71 for moving the second holding mechanism 6, and a cutting mechanism 4 for moving the sealed substrate W held by the cutting tables 2A and 2B. A moving mechanism (processing moving mechanism) 8 is provided.
　以下、第１～第３実施形態とは異なる構成について主に説明する。 Configurations different from those of the first to third embodiments will be mainly described below.
　本実施形態の移載テーブル５は、複数の製品Ｐを後述する筒状容器１１６に収容する前に、複数の製品Ｐが一時的に載置される。また、移載テーブル５は、図３３に示すように、Ｙ方向に沿って移動可能に設けられており、第２保持機構６により複数の製品Ｐが載置される移載位置Ｘ１と、搬送収容機構１１８により複数の製品Ｐが搬送される取り出し位置Ｘ２との間で移動する。なお、移載位置Ｘ１は、トランスファ軸７１よりも手前側に設定されており、２つの切断用テーブル２Ａ、２Ｂと水平面上においてＸ方向に沿って一列に配置される位置であり、取り出し位置Ｘ２は、トランスファ軸７１よりも奥側に設定されている。 A plurality of products P are temporarily placed on the transfer table 5 of the present embodiment before the plurality of products P are accommodated in a cylindrical container 116, which will be described later. Further, as shown in FIG. 33, the transfer table 5 is provided so as to be movable along the Y direction. The storage mechanism 118 moves between the pick-up position X2 where a plurality of products P are transported. The transfer position X1 is set on the front side of the transfer shaft 71, and is a position where the two cutting tables 2A and 2B are arranged in a line along the X direction on the horizontal plane. is set on the back side of the transfer shaft 71 .
＜チューブ収容の具体的な構成＞
　そして、本実施形態の切断装置１００は、図３３～図３５に示すように、複数の製品Ｐを一端開口部１１６ｘから収容する筒状容器１１６が設置される容器設置部１１７と、複数の製品Ｐを移載テーブル５から容器設置部１１７に設置された筒状容器１１６に搬送して収容する搬送収容機構１１８とを備えている。 <Specific Configuration of Tube Storage>
33 to 35, the cutting apparatus 100 of the present embodiment includes a container setting portion 117 in which a cylindrical container 116 containing a plurality of products P from one end opening 116x is set, and a plurality of products P. A transfer/accommodation mechanism 118 is provided for conveying P from the transfer table 5 to a cylindrical container 116 installed in the container installation portion 117 and accommodating the same.
　容器設置部１１７は、製品Ｐが収容されていない空の筒状容器１１６が設置されて、搬送収容機構１１８により筒状容器１１６の一端開口部１１６ｘから製品Ｐが挿入されるものである。 The empty cylindrical container 116 in which the product P is not stored is installed in the container setting part 117, and the product P is inserted from one end opening 116x of the cylindrical container 116 by the transporting/receiving mechanism 118.
　本実施形態の容器設置部１１７は、図３３に示すように、空の筒状容器１１６を収容する空容器収容部１１７ａと、当該空容器収容部１１７ａから空の筒状容器１１６が送り出されるとともに、空の筒状容器１１６を製品Ｐが一端開口部１１６ｘから挿入される挿入位置に設置する挿入位置設置部１１７ｂと、製品Ｐが満載となった又は所望の個数が収容された収容済の筒状容器１１６を収容する収容済容器収容部１１７ｃとを備えている。 As shown in FIG. 33, the container installation unit 117 of the present embodiment includes an empty container storage unit 117a that stores an empty cylindrical container 116, and an empty cylindrical container 116 that is sent out from the empty container storage unit 117a. , an insertion position setting portion 117b for setting an empty cylindrical container 116 at an insertion position where the products P are inserted from one end opening 116x, and a filled cylinder filled with the products P or containing a desired number of products P. and a stored container storage portion 117c that stores the shaped container 116 therein.
　ここで、筒状容器１１６は、図３４に示すように、複数の製品Ｐを列状に整列した状態で収容するものである。具体的に筒状容器１１６は、直線状に延びる形状を有しており、内部に製品Ｐを収容する空間を有している。また、筒状容器１１６の長手方向に直交する断面形状は、製品Ｐの断面形状に対応した形状である。なお、図３４に示す筒状容器１１６は、長手方向に沿って延びる側周壁の一部が空いている構成であるが、前記側周壁が閉じた構成であっても良い。また、筒状容器１１６は、複数の製品Ｐを一列に整列した状態で収容する構成の他に、複数の製品Ｐを複数列に整列した状態で収容する構成のものであっても良い。さらに、筒状容器１１６は、樹脂製のものであっても良いし、金属製のものであっても良い。また、図３４には製品Ｐとしてリードがある形態を示しているが、ＱＦＮ等のノンリードタイプであっても良い。 Here, as shown in FIG. 34, the cylindrical container 116 accommodates a plurality of products P in a row. Specifically, the cylindrical container 116 has a shape extending linearly and has a space for accommodating the product P therein. Further, the cross-sectional shape of the cylindrical container 116 orthogonal to the longitudinal direction is a shape corresponding to the cross-sectional shape of the product P. As shown in FIG. The cylindrical container 116 shown in FIG. 34 has a configuration in which a part of the side peripheral wall extending along the longitudinal direction is open, but the configuration may be such that the side peripheral wall is closed. Further, the cylindrical container 116 may have a configuration in which a plurality of products P are arranged in a row, or a configuration in which a plurality of products P are arranged in a plurality of rows. Furthermore, the cylindrical container 116 may be made of resin or may be made of metal. Also, although FIG. 34 shows a form in which the product P has leads, it may be of a non-lead type such as QFN.
　搬送収容機構１１８は、図３３及び図３５に示すように、複数の製品Ｐが一時的に載置される中間テーブル１１９と、複数の製品Ｐを取り出し位置Ｘ２にある移載テーブル５から中間テーブル１１９に搬送する第１製品搬送機構１２０と、複数の製品Ｐを中間テーブル１１９から容器設置部１１７の挿入位置設置部１１７ｂに設置された筒状容器１１６に搬送して収容する第２製品搬送機構１２１とを備えている。 As shown in FIGS. 33 and 35, the transport/accommodation mechanism 118 includes an intermediate table 119 on which a plurality of products P are temporarily placed, and a transfer table 5 located at the pick-up position X2 for transferring the plurality of products P to the intermediate table. 119, and a second product transport mechanism that transports a plurality of products P from the intermediate table 119 to the cylindrical container 116 installed in the insertion position installation portion 117b of the container installation portion 117 and accommodates them therein. 121.
　中間テーブル１１９は、取り出し位置Ｘ２にある移載テーブル５から第１製品搬送機構１２０により製品Ｐが搬送されて一時的に載置されるものである。また、中間テーブル１１９に一時的に載置された製品Ｐは、第２製品搬送機構１２１により容器設置部１１７に設置された筒状容器１１６に搬送される。本実施形態の中間テーブル１１９は、Ｘ方向及びＹ方向において固定されているが、移動可能に構成しても良い。 The intermediate table 119 temporarily places the product P transported by the first product transport mechanism 120 from the transfer table 5 at the take-out position X2. The product P temporarily placed on the intermediate table 119 is transported by the second product transport mechanism 121 to the cylindrical container 116 placed on the container placement section 117 . Although the intermediate table 119 of this embodiment is fixed in the X and Y directions, it may be configured to be movable.
　第１製品搬送機構１２０は、取り出し位置Ｘ２に移動した移載テーブル５から、中間テーブル１１９に複数の製品Ｐを所定個数（例えば１個）ずつ搬送するものである。 The first product transport mechanism 120 transports a predetermined number (for example, one) of a plurality of products P to the intermediate table 119 from the transfer table 5 moved to the take-out position X2.
　具体的に第１製品搬送機構１２０は、図３５に示すように、移載テーブル５に保持された複数の製品Ｐを所定個数（例えば１個）ずつ吸着する製品吸着機構１２０１と、当該製品吸着機構１２０１をＸ方向に沿って移動させる吸着用移動機構１２０２とを備えている。 Specifically, as shown in FIG. 35, the first product transport mechanism 120 includes a product suction mechanism 1201 that suctions a predetermined number (for example, one) of a plurality of products P held on the transfer table 5, and a product suction mechanism 1201 that and a moving mechanism 1202 for adsorption that moves the mechanism 1201 along the X direction.
　製品吸着機構１２０１は、図３５に示すように、複数の製品Ｐを吸着保持するための吸着部１２０１ａが設けられた吸着ヘッド１２０１Ａと、当該吸着ヘッド１２０１Ａの吸着部１２０１ａに接続された真空ポンプ又は真空エジェクタ（不図示）とを有している。この製品吸着機構１２０１は、それぞれの吸着部１２０１ａが１つの製品Ｐを吸着する構成としてある。また、複数の吸着部１２０１ａは、互いに独立して昇降移動可能に構成されており、各吸着部１２０１ａが下降することにより、個別に製品Ｐを吸着することができる。なお、第１製品搬送機構１２０の下部に、吸着する製品Ｐの状態を確認するための撮像カメラ２０３が設けられている。 As shown in FIG. 35, the product suction mechanism 1201 includes a suction head 1201A provided with a suction portion 1201a for sucking and holding a plurality of products P, and a vacuum pump or vacuum pump connected to the suction portion 1201a of the suction head 1201A. and a vacuum ejector (not shown). The product adsorption mechanism 1201 is configured such that each adsorption portion 1201a adsorbs one product P. As shown in FIG. In addition, the plurality of suction units 1201a are configured to be able to move up and down independently of each other, and each suction unit 1201a can be lowered to suck the product P individually. An imaging camera 203 for confirming the state of the product P to be sucked is provided below the first product transport mechanism 120 .
　吸着用移動機構１２０２は、図３５に示すように、製品吸着機構１２０１をＸ方向に移動させるＸ方向移動部１２０２ａと、製品吸着機構１２０１をＺ方向に移動させるＺ方向移動部１２０２ｂとを備えている。なお、吸着用移動機構１２０２は、製品吸着機構１２０１をＹ方向に移動させるＹ方向移動部を有していても良い。 As shown in FIG. 35, the suction moving mechanism 1202 includes an X-direction moving portion 1202a for moving the product suction mechanism 1201 in the X direction and a Z-direction moving portion 1202b for moving the product suction mechanism 1201 in the Z direction. there is Note that the suction moving mechanism 1202 may have a Y-direction moving unit that moves the product suction mechanism 1201 in the Y direction.
　Ｘ方向移動部１２０２ａは、トランスファ軸７１の奥側においてＸ方向に沿って設けられたＸ方向ガイドレール１２０２ａ１と、当該Ｘ方向ガイドレール１２０２ａ１に沿って移動するとともに、Ｚ方向移動部１２０２ｂを介して製品吸着機構１２０１を支持する支持体１２０２ａ２とを有している。そして、支持体１２０２ａ２は、例えば、Ｘ方向に延びるボールねじ機構（不図示）により、Ｘ方向ガイドレール１２０２ａ１上をＸ方向に沿って直線的に往復移動する。このボールねじ機構はサーボモータ等の駆動源（不図示）により駆動される。その他、支持体１２０２ａ２は、リニアモータ等の他の直動機構により往復移動するように構成しても良い。 The X-direction moving portion 1202a moves along an X-direction guide rail 1202a1 provided along the X direction on the back side of the transfer shaft 71, and moves along the X-direction guide rail 1202a1, and moves through the Z-direction moving portion 1202b. and a support 1202 a 2 that supports the product suction mechanism 1201 . The support 1202a2 is linearly reciprocated along the X direction on the X direction guide rail 1202a1 by, for example, a ball screw mechanism (not shown) extending in the X direction. This ball screw mechanism is driven by a drive source (not shown) such as a servomotor. Alternatively, the support 1202a2 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
　Ｚ方向移動部１２０２ｂは、支持体１２０２ａ２においてＺ方向に沿って設けられたＺ方向ガイドレール１２０２ｂ１と、当該Ｚ方向ガイドレール１２０２ｂ１に沿って移動するとともに製品吸着機構１２０１を支持するＺ方向スライダ１２０２ｂ２とを有している。そして、Ｚ方向スライダ１２０２ｂ２は、例えば、Ｚ方向に延びるボールねじ機構（不図示）により、Ｚ方向ガイドレール１２０２ｂ１上をＺ方向に沿って直線的に往復移動する。その他、Ｚ方向スライダ１２０２ｂ２は、リニアモータ等の他の直動機構により往復移動するように構成しても良い。 The Z-direction moving portion 1202b includes a Z-direction guide rail 1202b1 provided along the Z-direction on the support 1202a2, and a Z-direction slider 1202b2 that moves along the Z-direction guide rail 1202b1 and supports the product suction mechanism 1201. have. The Z-direction slider 1202b2 linearly reciprocates along the Z-direction on the Z-direction guide rail 1202b1 by, for example, a ball screw mechanism (not shown) extending in the Z-direction. Alternatively, the Z-direction slider 1202b2 may be configured to reciprocate by another linear motion mechanism such as a linear motor.
　第２製品搬送機構１２１は、図３３及び図３５に示すように、中間テーブル１１９に載置された製品Ｐを容器設置部１１７の挿入位置設置部１１７ｂに設置された筒状容器１１６に搬送して、当該筒状容器１１６の一端開口部１１６ｘから製品Ｐを挿入して収容するものである。 The second product transport mechanism 121, as shown in FIGS. 33 and 35, transports the product P placed on the intermediate table 119 to the cylindrical container 116 placed on the insertion position setting portion 117b of the container setting portion 117. , the product P is inserted from one end opening 116x of the cylindrical container 116 and accommodated therein.
　具体的に第２製品搬送機構１２１は、図３５に示すように、中間テーブル１１９に載置された製品Ｐを押す押圧部材１２１ａと、当該押圧部材１２１ａをＹ方向に沿って移動させる駆動部１２１ｂとを有している。なお、駆動部１２１ｂとしては、例えばボールねじ機構を用いたものであっても良いし、エアシリンダを用いたものであっても良いし、リニアモータを用いたものであっても良い。また、第２製品搬送機構１２１は、製品Ｐを筒状容器１１６の一端開口部１１６ｘにガイドする製品ガイド部を有していても良い。さらに、押圧部材１２１ａを昇降させる機構を有していてもよい。 Specifically, as shown in FIG. 35, the second product transport mechanism 121 includes a pressing member 121a that presses the product P placed on the intermediate table 119, and a drive unit 121b that moves the pressing member 121a along the Y direction. and The drive unit 121b may use, for example, a ball screw mechanism, an air cylinder, or a linear motor. Further, the second product transport mechanism 121 may have a product guide portion that guides the product P to the one end opening portion 116x of the cylindrical container 116 . Furthermore, a mechanism for lifting and lowering the pressing member 121a may be provided.
＜切断装置の動作の一例＞
　次に、切断装置１００の動作の一例を図９、図３３及び図３５を参照して説明する。本実施形態においては、切断装置１００の動作、例えば封止済基板Ｗの搬送、封止済基板Ｗの切断、製品Ｐの検査、製品Ｐのクリーニング、製品Ｐのチューブ収容など、すべての動作や制御は制御部ＣＴＬ（図３３参照）により行われる。 <Example of operation of cutting device>
Next, an example of operation of the cutting device 100 will be described with reference to FIGS. 9, 33 and 35. FIG. In the present embodiment, all the operations of the cutting apparatus 100, such as transport of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, cleaning of the product P, accommodation of the product P in the tube, etc. Control is performed by the controller CTL (see FIG. 33).
　本実施形態の切断装置１００の動作において、封止済基板Ｗの搬送、封止済基板Ｗの切断、製品Ｐのクリーニング、及び、製品Ｐの検査までの動作は、前記第１実施形態と同様である。 In the operation of the cutting apparatus 100 of the present embodiment, the operations from transporting the sealed substrate W, cutting the sealed substrate W, cleaning the product P, and inspecting the product P are the same as in the first embodiment. is.
　そして、両面検査された後、製品Ｐは反転機構１４から移載テーブル５に受け渡される。複数の製品Ｐが載置された移載テーブル５は、取り出し位置Ｘ２に移動する（図３３及び図３５参照）。一方で、容器設置部１１７の挿入位置設置部１１７ｂには、空の筒状容器１１６が設置されている（図３２及び図３４参照）。 Then, after double-sided inspection, the product P is transferred from the reversing mechanism 14 to the transfer table 5 . The transfer table 5 on which a plurality of products P are placed moves to the pick-up position X2 (see FIGS. 33 and 35). On the other hand, an empty cylindrical container 116 is installed in the insertion position installation portion 117b of the container installation portion 117 (see FIGS. 32 and 34).
　この状態で、図３５に示すように、第１製品搬送機構１２０は、取り出し位置Ｘ２にある移載テーブル５から製品Ｐを吸着保持する。その後、第１製品搬送機構１２０は、製品Ｐを中間テーブル１１９に移動して、製品Ｐの吸着保持を解除して、製品Ｐを中間テーブル１１９に載置する。中間テーブル１１９に載置された製品Ｐは、第２製品搬送機構１２１により、筒状容器１１６の内部に挿入されて収容される。 In this state, as shown in FIG. 35, the first product transport mechanism 120 sucks and holds the product P from the transfer table 5 located at the pick-up position X2. After that, the first product transport mechanism 120 moves the product P to the intermediate table 119 , releases the product P from the suction holding, and places the product P on the intermediate table 119 . The product P placed on the intermediate table 119 is inserted into the cylindrical container 116 and accommodated by the second product transport mechanism 121 .
　筒状容器１１６が満載となった場合、又は、筒状容器１１６に所望の個数の製品Ｐが収容された場合には、挿入位置設置部１１７ｂにある収容済の筒状容器１１６は、収容済容器収容部１１７ｃに移動されるとともに、挿入位置設置部１１７ｂには、空容器収容部１１７ａから空の筒状容器１１６が送り出されて設置される。 When the cylindrical container 116 is fully loaded, or when the desired number of products P are stored in the cylindrical container 116, the stored cylindrical container 116 in the insertion position setting portion 117b is While being moved to the container accommodating portion 117c, the empty cylindrical container 116 is delivered from the empty container accommodating portion 117a and installed in the insertion position setting portion 117b.
＜保持用プレートＭ１の自動交換機能＞
　さらに第４実施形態の切断装置１００は、前記第１実施形態などと同様に、封止済基板Ｗ又は製品Ｐを保持するための保持用プレートＭ１を自動的に交換できる機能を有している。なお、本実施形態では、第１実施形態と同様に、切断用テーブル２Ａ、２Ｂ、保持テーブル１４１、移載テーブル５及び第２保持機構６が、保持用プレートＭ１及び保持ベース部Ｍ２を有している。なお、保持用プレートＭ１及び保持ベース部Ｍ２の具体的構成は、第１実施形態と同様である。 <Automatic Exchange Function of Holding Plate M1>
Furthermore, the cutting apparatus 100 of the fourth embodiment has a function of automatically exchanging the holding plate M1 for holding the sealed substrate W or the product P, like the first embodiment. . In this embodiment, as in the first embodiment, the cutting tables 2A and 2B, the holding table 141, the transfer table 5, and the second holding mechanism 6 each have a holding plate M1 and a holding base portion M2. ing. The specific configurations of the holding plate M1 and the holding base portion M2 are the same as in the first embodiment.
　具体的に切断装置１００は、第３実施形態と同様に、図３３及び図３６に示すように、保持用プレートＭ１を収容するプレート収容部２４と、保持用プレートＭ１をプレート収容部２４及び保持ベース部Ｍ２の間で搬送するプレート搬送機構２５とを備えている。なお、第２実施形態の切断装置１００には、前記第１実施形態と同様に、固定機構２６及び検査機構２９が設けられている。 Specifically, as in the third embodiment, the cutting apparatus 100 includes a plate accommodating portion 24 that accommodates the holding plate M1, and a plate accommodating portion 24 that holds the holding plate M1, as shown in FIGS. A plate conveying mechanism 25 for conveying between the base portions M2 is provided. The cutting device 100 of the second embodiment is provided with a fixing mechanism 26 and an inspection mechanism 29 as in the first embodiment.
　第４実施形態のプレート搬送機構２５は、第２保持機構６及び搬送用移動機構７を用いて構成されており、複数の製品Ｐを搬送することができる。言い換えれば、第２保持機構６及び搬送用移動機構７が、保持用プレートＭ１を搬送する機能を有している。このプレート搬送機構２５は、上述した共通のトランスファ軸７１によってＸ方向に移動する構成とされている。また、プレート搬送機構２５は、トランスファ軸７１に対して、平面視において同じ側（手前側）に設けられていることになる。ここで、プレート搬送機構２５を構成する第２保持機構６は、第１実施形態と同様に、保持用プレートＭ１に形成された搬送用保持孔２８１（図１０参照）に挿入される搬送用シリンダ部２８２を有している（図１３参照）。 The plate conveying mechanism 25 of the fourth embodiment is configured using the second holding mechanism 6 and the conveying moving mechanism 7, and can convey a plurality of products P. In other words, the second holding mechanism 6 and the transport moving mechanism 7 have the function of transporting the holding plate M1. The plate transport mechanism 25 is configured to move in the X direction by the common transfer shaft 71 described above. Also, the plate transport mechanism 25 is provided on the same side (front side) of the transfer shaft 71 in plan view. Here, as in the first embodiment, the second holding mechanism 6 that constitutes the plate conveying mechanism 25 is a conveying cylinder that is inserted into a conveying holding hole 281 (see FIG. 10) formed in the holding plate M1. It has a portion 282 (see FIG. 13).
＜保持用プレートＭ１の交換動作＞
　次に、本実施形態のプレート搬送機構２５による保持用プレートＭ１の交換動作について、図３６を参照して説明する。 <Replacement operation of holding plate M1>
Next, the exchange operation of the holding plate M1 by the plate conveying mechanism 25 of this embodiment will be described with reference to FIG.
　なお、以下の交換動作において、プレート収容部２４から保持用プレートＭ１を取り出す際の保持用プレートＭ１の判別は、保持用プレートＭ１に設けられたＲＦＩＤなどの識別子を、プレート搬送機構２５（第２保持機構６）に設けられた識別子リーダ（不図示）により読み取ることにより行う。 In the following replacement operation, the holding plate M1 is identified when the holding plate M1 is taken out from the plate accommodating portion 24 by using the identifier such as the RFID provided on the holding plate M1 to the plate conveying mechanism 25 (second It is read by an identifier reader (not shown) provided in the holding mechanism 6).
（１）第２保持機構６の保持用プレートＭ１の取り外し動作（図３６（ａ）参照）
　まず、第２保持機構６の保持用プレートＭ１を取り外す。具体的には、搬送用移動機構７により第２保持機構６をプレート収容部２４に移動させるとともに、第２保持機構６を下降させて保持用プレートＭ１を取り外し、スライド棚部２４１に保持用プレートＭ１を載置して収容する。なお、第２保持機構６の保持用プレートＭ１を取り外す際には、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にして固定機構２６の固定を解除する。 (1) Removal operation of the holding plate M1 of the second holding mechanism 6 (see FIG. 36(a))
First, the holding plate M1 of the second holding mechanism 6 is removed. Specifically, the transport moving mechanism 7 moves the second holding mechanism 6 to the plate housing portion 24 , lowers the second holding mechanism 6 , removes the holding plate M<b>1 , and slides the holding plate to the slide shelf portion 241 . M1 is placed and accommodated. When removing the holding plate M1 of the second holding mechanism 6, compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the recessed position, thereby releasing the fixing of the fixing mechanism 26. FIG.
　この保持用プレートＭ１が取り外された状態の第２保持機構６を用いて、切断用テーブル２Ａ、２Ｂ又は保持テーブル１４１の保持用プレートの交換動作が行われる。 Using the second holding mechanism 6 with the holding plate M1 removed, the holding plates of the cutting tables 2A and 2B or the holding table 141 are exchanged.
（２）切断用テーブル２Ａ、２Ｂの保持用プレートＭ１の交換動作（図３６（ｂ）参照）
　切断用テーブル２Ａ、２Ｂの保持用プレートＭ１を取り外し、プレート搬送機構２５（搬送用移動機構７及び第２保持機構６）により保持用プレートＭ１を上昇させて上昇位置とした状態でプレート収容部２４に搬送し、保持用プレートＭ１を下降させてスライド棚部２４１に載置して収容する。なお、切断用テーブル２Ａ、２Ｂの保持用プレートＭ１を取り外す際には、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にして固定機構２６の固定を解除する。 (2) Replacement operation of the holding plates M1 of the cutting tables 2A and 2B (see FIG. 36(b))
The holding plates M1 of the cutting tables 2A and 2B are removed, and the holding plates M1 are lifted by the plate conveying mechanism 25 (the conveying movement mechanism 7 and the second holding mechanism 6) to the raised position. , and the holding plate M1 is lowered and placed on the slide shelf portion 241 for storage. When the holding plates M1 of the cutting tables 2A and 2B are removed, compressed air is supplied to the fixing cylinder portion 262 so that the mover 262b is retracted to release the fixation of the fixing mechanism 26. FIG.
　次に、プレート搬送機構２５（搬送用移動機構７及び第２保持機構６）が、プレート収容部２４から切断用テーブル２Ａ、２Ｂの新しい保持用プレートＭ１を取り出し、切断用テーブル２Ａ、２Ｂの保持ベース部Ｍ２に上昇位置とした状態で搬送し、保持用プレートＭ１を下降させて載置する。この状態で、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にすると、固定用シリンダ部２６２が保持用プレートＭ１の固定用挿入孔２６１に入り、その後、圧縮空気の供給を停止すると、可動子２６２ｂが突出した位置となり、切断用テーブル２Ａ、２Ｂの保持ベース部Ｍ２に対して保持用プレートＭ１が固定される。 Next, the plate transport mechanism 25 (transport moving mechanism 7 and second holding mechanism 6) takes out new holding plates M1 of the cutting tables 2A and 2B from the plate housing section 24, and holds the cutting tables 2A and 2B. It is conveyed to the base portion M2 in the raised position, and the holding plate M1 is lowered and placed thereon. In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied. When the supply is stopped, the mover 262b is at the projecting position, and the holding plate M1 is fixed to the holding base portion M2 of the cutting tables 2A and 2B.
（３）保持テーブル１４１の保持用プレートＭ１の交換動作（図３６（ｂ）参照）
　保持テーブル１４１の保持用プレートＭ１を取り外し、プレート搬送機構２５（搬送用移動機構７及び第２保持機構６）により保持用プレートＭ１を上昇させて上昇位置とした状態でプレート収容部２４に搬送し、保持用プレートＭ１を下降させて前方にスライドされたスライド棚部２４１に載置して収容する。なお、保持テーブル１４１の保持用プレートＭ１を取り外す際には、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にして固定機構２６の固定を解除する。 (3) Replacing operation of holding plate M1 of holding table 141 (see FIG. 36(b))
The holding plate M1 of the holding table 141 is removed, and the holding plate M1 is lifted by the plate conveying mechanism 25 (the conveying movement mechanism 7 and the second holding mechanism 6) and conveyed to the plate accommodating section 24 in the elevated position. , the holding plate M1 is lowered and placed on the slide shelf 241 that is slid forward for storage. When removing the holding plate M1 of the holding table 141, compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the recessed position, thereby releasing the fixation of the fixing mechanism 26. FIG.
　次に、プレート搬送機構２５（搬送用移動機構７及び第２保持機構６）が、プレート収容部２４から保持テーブル１４１の新しい保持用プレートＭ１を取り出し、保持テーブル１４１の保持ベース部Ｍ２に上昇位置とした状態で搬送し、保持用プレートＭ１を下降させて載置する。この状態で、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にすると、固定用シリンダ部２６２が保持用プレートＭ１の固定用挿入孔２６１に入り、その後、圧縮空気の供給を停止すると、可動子２６２ｂが突出した位置となり、保持テーブル１４１の保持ベース部Ｍ２に対して保持用プレートＭ１が固定される。 Next, the plate conveying mechanism 25 (conveyance moving mechanism 7 and second holding mechanism 6) takes out the new holding plate M1 of the holding table 141 from the plate accommodating portion 24, and moves it to the holding base portion M2 of the holding table 141 at the raised position. The holding plate M1 is lowered and placed thereon. In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied. When the supply is stopped, the mover 262b is at the projected position, and the holding plate M1 is fixed to the holding base portion M2 of the holding table 141. As shown in FIG.
（４）移載テーブル５の保持用プレートの交換動作（図３６（ｂ）参照）
　移載テーブル５の保持用プレートＭ１を取り外し、プレート搬送機構２５（搬送用移動機構７及び第２保持機構６）により保持用プレートＭ１を上昇させて上昇位置とした状態でプレート収容部２４に搬送し、保持用プレートＭ１を下降させて前方にスライドされたスライド棚部２４１に載置して収容する。なお、移載テーブル５の保持用プレートＭ１を取り外す際には、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にして固定機構２６の固定を解除する。 (4) Replacing the holding plate of the transfer table 5 (see FIG. 36(b))
The holding plate M1 of the transfer table 5 is removed, and the holding plate M1 is lifted by the plate conveying mechanism 25 (the conveying moving mechanism 7 and the second holding mechanism 6) to the raised position and conveyed to the plate accommodating section 24. Then, the holding plate M1 is lowered and placed on the slide shelf 241 that is slid forward for storage. When removing the holding plate M1 of the transfer table 5, compressed air is supplied to the fixing cylinder portion 262 to move the mover 262b to the retracted position, thereby releasing the fixation of the fixing mechanism 26. FIG.
　次に、プレート搬送機構２５（搬送用移動機構７及び第２保持機構６）が、プレート収容部２４から移載テーブル５の新しい保持用プレートＭ１を取り出し、移載テーブル５の保持ベース部Ｍ２に上昇位置とした状態で搬送し、保持用プレートＭ１を下降させて載置する。この状態で、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にすると、固定用シリンダ部２６２が保持用プレートＭ１の固定用挿入孔２６１に入り、その後、圧縮空気の供給を停止すると、可動子２６２ｂが突出した位置となり、移載テーブル５の保持ベース部Ｍ２に対して保持用プレートＭ１が固定される。 Next, the plate transport mechanism 25 (the transport moving mechanism 7 and the second holding mechanism 6) takes out the new holding plate M1 of the transfer table 5 from the plate accommodating part 24, and puts it on the holding base part M2 of the transfer table 5. The substrate is transported in the raised position, and the holding plate M1 is lowered and placed. In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied. When the supply is stopped, the mover 262b is at a projected position, and the holding plate M1 is fixed to the holding base portion M2 of the transfer table 5. As shown in FIG.
（５）第２保持機構６の保持用プレートＭ１の取り付け動作（図３６（ｃ）参照）
　上記の通り、切断用テーブル２Ａ、２Ｂ、保持テーブル１４１及び移載テーブル５の保持用プレートＭ１の交換動作を行った後に、搬送用移動機構７により第２保持機構６をプレート収容部２４に移動させるとともに、第２保持機構６を下降させて、スライド棚部２４１に載置された新しい保持用プレートＭ１が取り付けられる。ここでは、搬送用移動機構７により第２保持機構６の保持ベース部Ｍ２に設けられた固定用シリンダ部２６２が保持用プレートＭ１に形成された固定用挿入孔２６１に差し込まれる。この状態で、固定用シリンダ部２６２に圧縮空気を供給して可動子２６２ｂを没入した位置にすると、固定用シリンダ部２６２が保持用プレートＭ１の固定用挿入孔２６１に入り、その後、圧縮空気の供給を停止すると、可動子２６２ｂが突出した位置となり、第２保持機構６の保持ベース部Ｍ２に対して保持用プレートＭ１が固定される。 (5) Mounting operation of the holding plate M1 of the second holding mechanism 6 (see FIG. 36(c))
As described above, after the cutting tables 2A and 2B, the holding table 141, and the holding plate M1 of the transfer table 5 have been exchanged, the second holding mechanism 6 is moved to the plate housing portion 24 by the transfer movement mechanism 7. At the same time, the second holding mechanism 6 is lowered, and a new holding plate M1 placed on the slide shelf 241 is attached. Here, the fixing cylinder portion 262 provided in the holding base portion M2 of the second holding mechanism 6 is inserted into the fixing insertion hole 261 formed in the holding plate M1 by the transportation moving mechanism 7 . In this state, when compressed air is supplied to the fixing cylinder portion 262 to set the mover 262b to the retracted position, the fixing cylinder portion 262 enters the fixing insertion hole 261 of the holding plate M1, and then the compressed air is supplied. When the supply is stopped, the mover 262b is at the projecting position, and the holding plate M1 is fixed to the holding base portion M2 of the second holding mechanism 6. As shown in FIG.
　なお、切断用テーブル２Ａ、２Ｂの保持用プレートＭ１の交換動作と、保持テーブル１４１の保持用プレートＭ１の交換動作と、移載テーブル５の保持用プレートＭ１の交換動作の順番は適宜変更可能である。また、切断用テーブル２Ａ、２Ｂ、保持テーブル１４１及び移載テーブル５の保持ベース部Ｍ２から保持用プレートＭ１を取り外し、その後、切断用テーブル２Ａ、２Ｂ、保持テーブル１４１及び移載テーブル５の保持ベース部Ｍ２に新しい保持用プレートＭ１を取り付けることもできる。 The order of the replacement operation of the holding plates M1 of the cutting tables 2A and 2B, the replacement operation of the holding plates M1 of the holding table 141, and the replacement operation of the holding plates M1 of the transfer table 5 can be changed as appropriate. be. Also, the holding plate M1 is removed from the holding base portion M2 of the cutting tables 2A and 2B, the holding table 141 and the transfer table 5, and then the holding bases of the cutting tables 2A and 2B, the holding table 141 and the transfer table 5 are removed. A new retaining plate M1 can also be attached to the portion M2.
　また、上記では、第２保持機構６、切断用テーブル２Ａ、２Ｂ、保持テーブル１４１及び移載テーブル５の保持用プレートＭ１の交換を一連の動作としているが、第２保持機構６、切断用テーブル２Ａ、２Ｂ、保持テーブル１４１又は移載テーブル５の少なくとも１つにおける保持用プレートＭ１の交換を個別に行うようにしても良い。このとき、切断用テーブル２Ａ、２Ｂ、保持テーブル１４１又は移載テーブル５の保持用プレートＭ１を交換する際には、プレート搬送機構２５を構成する第２保持機構６の保持用プレートＭ１を予め取り外すことが考えられる。 In the above description, the exchange of the second holding mechanism 6, the cutting tables 2A and 2B, the holding table 141, and the holding plate M1 of the transfer table 5 is a series of operations. The holding plate M1 in at least one of 2A, 2B, the holding table 141, or the transfer table 5 may be exchanged individually. At this time, when replacing the holding plate M1 of the cutting tables 2A and 2B, the holding table 141, or the transfer table 5, the holding plate M1 of the second holding mechanism 6 constituting the plate transport mechanism 25 is removed in advance. can be considered.
＜第４実施形態の効果＞
　本実施形態の切断装置１００によれば、第１～第３実施形態と同様に、保持ベース部Ｍ２から取り外された保持用プレートＭ１をプレート収容部２４に搬送し、プレート収容部２４にある保持用プレートＭ１を保持ベース部Ｍ２に搬送するプレート搬送機構２５を有するので、保持ベース部Ｍ２に対して保持用プレートＭ１を自動的に交換することができる。その結果、保持用プレートＭ１を交換するための人件費を削減することができる。また、保持用プレートＭ１を自動的に交換するので、保持用プレートＭ１の交換時間を短縮することができ、切断装置１００の生産性を向上することができる。さらに、保持ベース部Ｍ２に対する保持用プレートＭ１の取り付け状態のばらつきを低減することができる。その他、第４実施形態において、前記第１～第３実施形態と同様の構成により生じる効果は同じである。 <Effects of the Fourth Embodiment>
According to the cutting apparatus 100 of this embodiment, as in the first to third embodiments, the holding plate M1 removed from the holding base portion M2 is conveyed to the plate accommodating portion 24, and the holding plate M1 in the plate accommodating portion 24 is transported. Since the plate transport mechanism 25 transports the holding plate M1 to the holding base portion M2, the holding plate M1 can be automatically replaced with respect to the holding base portion M2. As a result, labor costs for exchanging the holding plate M1 can be reduced. In addition, since the holding plate M1 is automatically replaced, the replacement time of the holding plate M1 can be shortened, and the productivity of the cutting apparatus 100 can be improved. Furthermore, it is possible to reduce variations in the mounting state of the holding plate M1 with respect to the holding base portion M2. Other than that, in the fourth embodiment, the effects produced by the same configuration as in the first to third embodiments are the same.
　特に、第４実施形態の切断装置１００であれば、搬送収容機構１１８により複数の製品Ｐを移載テーブル５から容器設置部１１７に設置された筒状容器１１６に搬送して、当該筒状容器１１６の一端開口部１１６ｘから複数の製品Ｐを収容することができる。 In particular, in the cutting apparatus 100 of the fourth embodiment, the plurality of products P are transported from the transfer table 5 to the cylindrical container 116 installed in the container installation section 117 by the transporting/storage mechanism 118, and the cylindrical container 116 is A plurality of products P can be accommodated from one end opening 116x of 116 .
　また、チューブ収容する切断装置１００において、プレート搬送機構２５を第２保持機構６及び搬送用移動機構７を用いて構成しているので、装置構成を簡素化するとともに装置コストを削減することができる。 In addition, in the cutting device 100 that accommodates tubes, the plate conveying mechanism 25 is configured using the second holding mechanism 6 and the conveying moving mechanism 7, so that the device configuration can be simplified and the device cost can be reduced. .
＜第４実施形態の変形例＞
　例えば、前記第４実施形態では、容器設置部１１７がトランスファ軸７１の奥側に設けられていたが、トランスファ軸７１の手前側に設けられていても良い。 <Modification of Fourth Embodiment>
For example, in the fourth embodiment, the container installation portion 117 is provided on the back side of the transfer shaft 71 , but may be provided on the front side of the transfer shaft 71 .
　また、容器設置部１１７に設置された筒状容器１１６は、Ｘ方向に沿って設けられる構成のほか、Ｙ方向に沿って設けられていても良いし、その他の方向に沿って設けられていても良い。 In addition, the cylindrical container 116 installed in the container installation portion 117 may be provided along the Y direction instead of the X direction, or may be provided along another direction. Also good.
＜その他の変形実施形態＞
　前記各実施形態では、ツインカットテーブル方式であって、ツインスピンドル構成の切断装置を説明したが、これに限らず、シングルカットテーブル方式であって、シングルスピンドル構成の切断装置や、シングルカットテーブル方式であって、ツインスピンドル構成の切断装置などであってもよい。 <Other Modified Embodiments>
In each of the above-described embodiments, a twin-cut table system and a twin-spindle configuration cutting device have been described. It may be a cutting device having a twin-spindle configuration.
　また、トランスファ軸７１を構成するカムラック要素は複数を連結して構成することができるので、例えば、切断装置（加工装置）１００を、第２クリーニング機構１９と検査部１３又は乾燥用テーブル１１２との間で分離及び連結可能（着脱可能）なモジュール構成とすることができる。この場合、例えば、第２クリーニング機構１９側のモジュールと、検査部１３側のモジュール又は乾燥用テーブル１１２側のモジュールとの間に、検査部１３での検査とは異なる種類の検査を行うモジュールを追加することができる。なお、ここに例示した構成以外にも、切断装置（加工装置）１００をどこで分離及び連結可能（着脱可能）なモジュール構成としてもよく、追加するモジュールを検査以外の様々な機能のモジュールとしてもよい。 In addition, since a plurality of cam rack elements constituting the transfer shaft 71 can be connected to each other, for example, the cutting device (processing device) 100 can be connected between the second cleaning mechanism 19 and the inspection unit 13 or the drying table 112. It can be a modular configuration that can be separated and connected (detachable) between them. In this case, for example, between the module on the side of the second cleaning mechanism 19 and the module on the side of the inspection section 13 or the module on the side of the drying table 112, a module that performs a different type of inspection from that of the inspection section 13 may be provided. can be added. In addition to the configuration illustrated here, the cutting device (processing device) 100 may have a module configuration that can be separated and connected (detachable) at any point, and the modules to be added may be modules with various functions other than inspection. .
　また、本発明の加工装置は、切断以外の加工を行うものであってもよく、例えば切削や研削などのその他の機械加工を行うものであってもよい。 In addition, the processing apparatus of the present invention may perform processing other than cutting, and may perform other mechanical processing such as cutting and grinding.
　その他、本発明は前記実施形態に限られず、その趣旨を逸脱しない範囲で種々の変形が可能であるのは言うまでもない。 In addition, it goes without saying that the present invention is not limited to the above-described embodiments, and that various modifications are possible without departing from the spirit of the present invention.
　本発明によれば、加工対象物を保持するための保持用プレートを自動的に交換する加工装置を提供することができる。
  According to the present invention, it is possible to provide a processing apparatus that automatically replaces a holding plate for holding an object to be processed.

Claims (22)

  1. 　加工対象物を加工する加工機構と、
    　前記加工対象物を保持するための保持用プレートを収容するプレート収容部と、
    　前記保持用プレートが着脱可能に取り付けられ、前記保持用プレートを用いて前記加工対象物を保持する保持ベース部と、
    　前記保持用プレートを前記プレート収容部及び前記保持ベース部の間で搬送するプレート搬送機構とを備え、
    　前記プレート搬送機構は、前記保持ベース部から取り外された前記保持用プレートを前記プレート収容部に搬送し、前記プレート収容部にある前記保持用プレートを前記保持ベース部に搬送する、加工装置。     a processing mechanism for processing an object to be processed;
    a plate accommodating portion that accommodates a holding plate for holding the object to be processed;
    a holding base portion to which the holding plate is detachably attached and which holds the workpiece using the holding plate;
    a plate conveying mechanism for conveying the holding plate between the plate accommodating portion and the holding base;
    The processing apparatus according to claim 1, wherein the plate transport mechanism transports the holding plate removed from the holding base portion to the plate accommodating portion, and transports the holding plate in the plate accommodating portion to the holding base portion.
  2. 　前記プレート搬送機構は、前記保持用プレートを上昇させて搬送する、請求項１に記載の加工装置。 The processing apparatus according to claim 1, wherein the plate transport mechanism lifts and transports the holding plate.
  3. 　前記プレート搬送機構は、
    　前記加工対象物を加工するための加工用テーブルの保持用プレート、
    　前記加工機構により加工された加工後の前記加工対象物を乾燥するための乾燥用テーブルの保持用プレート、
    　前記加工後の前記加工対象物を検査するための検査用テーブルの保持用プレート、
    　前記加工後の前記加工対象物が仕分け前に載置される移載テーブルの保持用プレート、又は、
    　前記加工後の前記加工対象物を搬送するために保持する搬送用保持機構の保持用プレートの少なくとも１つを搬送する、請求項１又は２に記載の加工装置。     The plate transport mechanism is
    a plate for holding a processing table for processing the workpiece;
    a holding plate for a drying table for drying the processed object processed by the processing mechanism;
    a holding plate for an inspection table for inspecting the processed object;
    A holding plate for a transfer table on which the processed objects are placed before sorting, or
    3. The processing apparatus according to claim 1, wherein at least one holding plate of a holding mechanism for carrying is held for carrying the processed object after machining.
  4. 　前記プレート搬送機構は、前記加工後の前記加工対象物を搬送することができる、請求項１乃至３の何れか一項に記載の加工装置。 The processing apparatus according to any one of claims 1 to 3, wherein the plate transport mechanism can transport the processed object.
  5. 　前記プレート搬送機構は、前記加工後の前記加工対象物が仕分けされるトレイを搬送することができる、請求項１乃至４の何れか一項に記載の加工装置。 The processing apparatus according to any one of claims 1 to 4, wherein the plate transport mechanism is capable of transporting a tray on which the processed objects are sorted.
  6. 　前記プレート搬送機構は、
    　前記プレート収容部と仮置き部との間で前記保持用プレートを搬送する第１搬送機構と、
    　前記仮置き部と前記保持ベース部との間で前記保持用プレートを搬送する第２搬送機構とを有する、請求項１乃至５の何れか一項に記載の加工装置。     The plate transport mechanism is
    a first transport mechanism for transporting the holding plate between the plate accommodating portion and the temporary placement portion;
    The processing apparatus according to any one of claims 1 to 5, further comprising a second transport mechanism that transports the holding plate between the temporary placement section and the holding base section.
  7. 　前記第１搬送機構は、前記トレイを搬送することができる、請求項６に記載の加工装置。 The processing apparatus according to claim 6, wherein the first transport mechanism can transport the tray.
  8. 　前記第２搬送機構は、前記加工後の前記加工対象物を搬送することができる、請求項６又は７に記載の加工装置。 The processing apparatus according to claim 6 or 7, wherein the second transport mechanism can transport the processed object.
  9. 　前記加工機構により個片化された前記加工対象物が貼り付けられる粘着面を有する貼付部材が載置される載置テーブルをさらに備え、
    　前記プレート搬送機構は、前記貼付部材を前記載置テーブルに搬送することができる、請求項１乃至４の何れか一項に記載の加工装置。     further comprising a mounting table on which a pasting member having an adhesive surface to which the object to be processed that has been singulated by the processing mechanism is mounted is placed;
    5. The processing apparatus according to any one of claims 1 to 4, wherein said plate transport mechanism is capable of transporting said pasting member to said mounting table.
  10. 　前記プレート搬送機構は、
    　前記プレート収容部と仮置き部との間で前記保持用プレートを搬送する第１搬送機構と、
    　前記仮置き部と前記保持ベース部との間で前記保持用プレートを搬送する第２搬送機構とを有する、請求項９に記載の加工装置。     The plate transport mechanism is
    a first transport mechanism for transporting the holding plate between the plate accommodating portion and the temporary placement portion;
    10. The processing apparatus according to claim 9, further comprising a second transport mechanism for transporting said holding plate between said temporary placement portion and said holding base portion.
  11. 　前記第１搬送機構は、前記貼付部材を前記載置テーブルに搬送することができる、請求項１０に記載の加工装置。 The processing apparatus according to claim 10, wherein said first transport mechanism can transport said pasting member to said mounting table.
  12. 　前記第２搬送機構は、前記個片化された前記加工対象物を搬送することができる、請求項１０又は１１に記載の加工装置。 The processing apparatus according to claim 10 or 11, wherein said second transport mechanism is capable of transporting said singulated workpiece.
  13. 　前記加工対象物を前記加工用テーブルに搬送するために前記加工対象物を保持する第１保持機構と、
    　前記個片化された前記加工対象物を前記加工用テーブルから搬送するために前記個片化された前記加工対象物を保持する第２保持機構と、
    　前記貼付部材を前記載置テーブルに搬送するための前記貼付部材を保持する第３保持機構と、
    　前記第１保持機構、前記第２保持機構及び前記第３保持機構を移動させるための共通のトランスファ軸を有する搬送用移動機構とをさらに備え、
    　前記第１搬送機構は、前記第３保持機構及び前記搬送用移動機構を用いて構成され、
    　前記第２搬送機構は、前記第２保持機構及び前記搬送用移動機構を用いて構成されている、請求項１０乃至１２の何れか一項に記載の加工装置。     a first holding mechanism that holds the workpiece to transport the workpiece to the processing table;
    a second holding mechanism that holds the singulated workpiece for transporting the singulated workpiece from the processing table;
    a third holding mechanism that holds the pasting member for conveying the pasting member to the mounting table;
    a transfer movement mechanism having a common transfer shaft for moving the first holding mechanism, the second holding mechanism, and the third holding mechanism;
    The first transport mechanism is configured using the third holding mechanism and the transport moving mechanism,
    The processing apparatus according to any one of claims 10 to 12, wherein the second transport mechanism is configured using the second holding mechanism and the transport moving mechanism.
  14. 　前記貼付部材を収容する貼付部材収容部をさらに備え、
    　前記プレート収容部及び前記貼付部材収容部は互いに上下に配置されている、請求項１０乃至１３の何れか一項に記載の加工装置。     further comprising an affixing member accommodation unit that accommodates the affixing member,
    14. The processing apparatus according to any one of claims 10 to 13, wherein said plate accommodating portion and said attaching member accommodating portion are arranged one above the other.
  15. 　前記加工機構により個片化された前記加工対象物が落下して収容される収容ボックスをさらに備え、
    　前記プレート搬送機構は、前記個片化された前記加工対象物を前記収容ボックスに搬送することができる、請求項１乃至４の何れか一項に記載の加工装置。     further comprising a storage box in which the objects to be processed that have been singulated by the processing mechanism are dropped and stored;
    5. The processing apparatus according to any one of claims 1 to 4, wherein said plate transport mechanism is capable of transporting said singulated workpiece to said storage box.
  16. 　前記個片化された前記加工対象物を一端開口部から収容する筒状容器が設置される容器設置部と、
    　前記個片化された前記加工対象物を前記容器設置部に設置された前記筒状容器に搬送して収容する搬送収容機構とをさらに備える、請求項１乃至４の何れか一項に記載の加工装置。     a container installation unit in which a cylindrical container that accommodates the individualized workpieces from one end opening is installed;
    5. The method according to any one of claims 1 to 4, further comprising a transporting/storing mechanism that transports and stores the singulated workpieces in the cylindrical container installed in the container installation unit. processing equipment.
  17. 　前記加工対象物を前記加工用テーブルに搬送するために前記加工対象物を保持する第１保持機構と、
    　前記個片化された前記加工対象物を前記加工用テーブルから搬送するために前記個片化された前記加工対象物を保持する第２保持機構と、
    　前記第１保持機構及び前記第２保持機構を移動させるための共通のトランスファ軸を有する搬送用移動機構とをさらに備え、
    　前記プレート搬送機構は、前記第２保持機構及び前記搬送用移動機構を用いて構成されている、請求項１５又は１６に記載の加工装置。     a first holding mechanism that holds the workpiece to transport the workpiece to the processing table;
    a second holding mechanism that holds the singulated workpiece for transporting the singulated workpiece from the processing table;
    a transfer movement mechanism having a common transfer shaft for moving the first holding mechanism and the second holding mechanism;
    The processing apparatus according to claim 15 or 16, wherein the plate transport mechanism is configured using the second holding mechanism and the transport moving mechanism.
  18. 　前記保持ベース部に対する前記保持用プレートの取り付け状態を検査する検査機構をさらに備える、請求項１乃至１７の何れか一項に記載の加工装置。 The processing apparatus according to any one of claims 1 to 17, further comprising an inspection mechanism for inspecting the state of attachment of said holding plate to said holding base portion.
  19. 　前記検査機構は、
    　前記保持用プレートが搭載される搭載面に開口する検査用流路と、
    　前記検査用流路に設けられ、前記開口からの流体の漏れを検知する検知センサとを有する、請求項１８に記載の加工装置。     The inspection mechanism is
    an inspection channel that opens to a mounting surface on which the holding plate is mounted;
    19. The processing apparatus according to claim 18, further comprising a detection sensor provided in said inspection channel and detecting fluid leakage from said opening.
  20. 　前記保持ベース部は、前記保持用プレートに形成された固定用挿入孔に挿入される固定用シリンダ部を有しており、
    　前記固定用シリンダ部は、前記固定用挿入孔に挿入されるシリンダ本体と、当該シリンダ本体の外側周面から突出した位置及び没入した位置で移動可能に設けられた可動子と、当該可動子を前記シリンダ本体に対して突出した位置となるように力を付与する弾性体とを有し、
    　前記固定用シリンダ部が前記固定用挿入孔に挿入された状態で、前記可動子が突出した状態となることにより、前記保持ベース部に対して前記保持用プレートが固定される、請求項１乃至１９の何れか一項に記載の加工装置。     The holding base portion has a fixing cylinder portion inserted into a fixing insertion hole formed in the holding plate,
    The fixing cylinder part includes a cylinder body inserted into the fixing insertion hole, a mover provided movably at a position protruding from and retracted from the outer peripheral surface of the cylinder body, and the mover. an elastic body that applies a force to the cylinder body so as to protrude from the cylinder body;
    2. The holding plate is fixed to the holding base portion by protruding the mover while the fixing cylinder portion is inserted into the fixing insertion hole. 20. The processing apparatus according to any one of 19.
  21. 　前記プレート搬送機構は、前記保持用プレートに形成された搬送用保持孔に挿入される搬送用シリンダ部を有しており、
    　前記搬送用シリンダ部は、前記搬送用保持孔に挿入されるシリンダ本体と、当該シリンダ本体の外側周面から突出した位置及び没入した位置で移動可能に設けられた可動子と、当該可動子を前記シリンダ本体に対して突出した位置となるように力を付与する弾性体とを有し、
    　前記搬送用シリンダ部が搬送用挿入孔に挿入された状態で、前記可動子が突出した状態となることにより、前記プレート搬送機構に前記保持用プレートが保持される、請求項１乃至２０の何れか一項に記載の加工装置。     The plate transport mechanism has a transport cylinder portion inserted into a transport holding hole formed in the holding plate,
    The conveying cylinder portion includes a cylinder body inserted into the conveying holding hole, a mover provided movably at a position protruding and retracted from the outer peripheral surface of the cylinder body, and the mover. an elastic body that applies a force to the cylinder body so as to protrude from the cylinder body;
    21. The holding plate is held by the plate conveying mechanism by protruding the mover while the conveying cylinder portion is inserted into the conveying insertion hole. or the processing device according to item 1.
  22. 　請求項１乃至２１の何れか一項に記載の加工装置を用いて加工品を製造する加工品の製造方法。

          A method for manufacturing a processed product using the processing apparatus according to any one of claims 1 to 21.
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