JPWO2022195931A1 - - Google Patents

Info

Publication number
JPWO2022195931A1
JPWO2022195931A1 JP2023506721A JP2023506721A JPWO2022195931A1 JP WO2022195931 A1 JPWO2022195931 A1 JP WO2022195931A1 JP 2023506721 A JP2023506721 A JP 2023506721A JP 2023506721 A JP2023506721 A JP 2023506721A JP WO2022195931 A1 JPWO2022195931 A1 JP WO2022195931A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023506721A
Other languages
Japanese (ja)
Other versions
JPWO2022195931A5 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022195931A1 publication Critical patent/JPWO2022195931A1/ja
Publication of JPWO2022195931A5 publication Critical patent/JPWO2022195931A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
    • B23Q7/04—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0616—Grinders for cutting-off using a tool turning around the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
JP2023506721A 2021-03-18 2021-09-29 Pending JPWO2022195931A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2021044356 2021-03-18
JP2021130829 2021-08-10
JP2021133294 2021-08-18
PCT/JP2021/035885 WO2022195931A1 (en) 2021-03-18 2021-09-29 Processing apparatus and processed article manufacturing method

Publications (2)

Publication Number Publication Date
JPWO2022195931A1 true JPWO2022195931A1 (en) 2022-09-22
JPWO2022195931A5 JPWO2022195931A5 (en) 2024-01-04

Family

ID=83320267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023506721A Pending JPWO2022195931A1 (en) 2021-03-18 2021-09-29

Country Status (4)

Country Link
JP (1) JPWO2022195931A1 (en)
KR (1) KR20230135661A (en)
TW (1) TWI785840B (en)
WO (1) WO2022195931A1 (en)

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06135546A (en) * 1992-10-29 1994-05-17 Oki Electric Ind Co Ltd Jumping preventive mechanism for integrated circuit package
JP4201564B2 (en) * 2001-12-03 2008-12-24 日東電工株式会社 Semiconductor wafer transfer method and semiconductor wafer transfer apparatus using the same
JP3527738B2 (en) * 2003-04-14 2004-05-17 株式会社コスメック Clamp device with datum function and clamp system equipped with the device
WO2006022597A2 (en) * 2004-08-23 2006-03-02 Rokko Systems Pte Ltd Supply mechanism for the chuck of an integrated circuit dicing device
JP5248987B2 (en) * 2008-11-11 2013-07-31 株式会社ディスコ Transport mechanism
MY159061A (en) * 2009-05-27 2016-12-15 Ueno Seiki Co Ltd Classification apparatus
JP5718379B2 (en) * 2013-01-15 2015-05-13 東京エレクトロン株式会社 Substrate storage processing apparatus, substrate storage processing method, and substrate storage processing storage medium
JP6211851B2 (en) * 2013-08-08 2017-10-11 パスカルエンジニアリング株式会社 Clamping device
JP6235391B2 (en) * 2014-03-27 2017-11-22 Ｔｏｗａ株式会社 Inspection jig, cutting device, and cutting method
JP6430170B2 (en) 2014-08-12 2018-11-28 Ｔｏｗａ株式会社 Cutting apparatus, cutting method, adsorption mechanism and apparatus using the same
JP6382039B2 (en) * 2014-09-04 2018-08-29 Ｔｏｗａ株式会社 Cutting apparatus, adsorption mechanism and apparatus using the same
JP2019016700A (en) * 2017-07-07 2019-01-31 Ｔｏｗａ株式会社 Holding member, method for manufacturing holding member, holding device, conveyance device, and device for manufacturing electronic component
JP6861602B2 (en) * 2017-09-15 2021-04-21 Ｔｏｗａ株式会社 Holding member, manufacturing method of holding member, holding mechanism and product manufacturing equipment
JP7009306B2 (en) * 2018-05-21 2022-01-25 株式会社ディスコ Cutting equipment
KR102167500B1 (en) * 2019-09-09 2020-10-19 제너셈(주) Vacuum adsorption module
KR102138003B1 (en) * 2019-09-09 2020-07-27 제너셈(주) Conversion kit auto change system
KR102146784B1 (en) * 2019-06-18 2020-08-21 제너셈(주) Object dispensing method
JP7229644B2 (en) * 2019-07-26 2023-02-28 株式会社ディスコ Conveyor system

Also Published As

Publication number Publication date
WO2022195931A1 (en) 2022-09-22
TW202238698A (en) 2022-10-01
KR20230135661A (en) 2023-09-25
TWI785840B (en) 2022-12-01

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