JP6861602B2 - Holding member, manufacturing method of holding member, holding mechanism and product manufacturing equipment - Google Patents

Description

The present invention relates to a holding member for holding a product, a method for manufacturing the holding member, a holding mechanism, and a product manufacturing apparatus.

Examples of the holding member used when holding the product to be held include a tray and the like. By sucking the product to be held through the suction hole formed of the through hole, the product to be held may be temporarily brought into close contact with the surface of the holding member and fixed (sucked). A suction jig or the like having a suction hole used in this case is also included in the holding member. By sucking the product to be held using the suction holes provided in the holding member, the product to be held is attracted to the surface of the holding member. Adsorption means that the product to be held is pressed against the surface of the holding member by atmospheric pressure, so that the product to be held is brought into close contact with the surface of the holding member.

A suitable example of a product to be retained is an IC package which is a semiconductor integrated circuit (abbreviated as IC). IC packages are manufactured by cutting and singulating a sealed substrate using a rotary blade. The IC package is the final product and the sealed substrate is the intermediate product. Since the sealed substrate itself immediately before being separated into pieces may be traded, the sealed substrate is also included in the product.

The sealed substrate is a composite member including the substrate, a chip containing a semiconductor chip and the like, and a sealing resin made of a cured resin. The substrate includes a lead frame, a printed wiring board, a ceramics substrate, a semiconductor wafer, and the like. The semiconductor substrate includes a silicon substrate (silicon wafer), a SiC substrate (SiC wafer), and the like. The substrate includes a circuit board on which an electric circuit including a logic circuit, a storage circuit, an amplifier circuit, and the like is formed, and a support substrate for supporting the chip. The supporting substrate is a carrier and includes a silicon substrate, a glass substrate, and the like.

As a kind of holding member, an IC tray manufactured by resin molding using an injection molding method has been proposed (see FIG. 1 in the upper left column of page 4 of Patent Document 1). This IC tray is partitioned by a grid that is orthogonal to each other. A tray for a QFP (quad flat package) type IC in which one semiconductor integrated circuit device is loaded per lattice is created by an injection molding method using a molding die. The QFP type IC corresponds to the IC package. The molding die is manufactured by machining, electric discharge machining, or the like.

Japanese Unexamined Patent Publication No. 03-0372558

In recent years, the shapes and configurations of products including IC packages and sealed substrates have been diversified, such as the number of IC packages manufactured from one sealed substrate. As for the number of products to be taken, there have been cases where 1,000 pieces (for example, 3,000 to 5,000 pieces) of products are manufactured from one sealed substrate. As a type of IC package, there is a type called a ball grid array (BGA) package (hereinafter referred to as "BGA package") in which solder balls are formed in a grid pattern on an individualized circuit board. ..

The solder ball of the BGA is, for example, a convex portion having a diameter of about 0.1 to 1.0 mm. A sealed substrate for manufacturing a BGA (hereinafter referred to as "sealed substrate for BGA") has a large number of solder balls formed on a circuit board. Each BGA manufactured by disassembling the sealed substrate for BGA also has a large number of solder balls formed on the circuit board. When the sealed substrate for BGA and BGA are adsorbed, between the tops of many solder balls, which are many protrusions, and the surface of the circuit board (the bottom surface of the recesses for many solder balls, which are convex parts). In, a gap is likely to occur. Since air flows through the gap, the adsorption force for adsorbing the sealed substrate for BGA and the BGA itself is weakened. Therefore, in the individualization process, the transfer process, etc., there is a possibility that the sealed substrate for BGA and the BGA itself may move unintentionally in the holding member having a suction function.

As a configuration for sufficiently adsorbing the sealed substrate for BGA and the BGA to the holding member having a suction function, there are as many recesses as the number of recesses in which a plurality of solder balls of one product are accommodated. An example is a configuration in which a holding member is formed. In this case, it is necessary to form convex portions corresponding to the number of concave portions equal to the number of taken parts on the surface corresponding to the arrangement surface of the product to be held in the molding mold for injection molding. Forming 1,000 convex parts in a molding die by machining, electric discharge machining, etc. causes a problem of increasing the manufacturing cost of the molding die. Similarly, when a holding member (for example, a tray) having no suction function is manufactured by using a molding die, there arises a problem of increasing the manufacturing cost of the molding die.

The present invention has been made to solve the above-mentioned problems. An object of the present invention is to inexpensively manufacture a holding member used for holding a holding object having irregularities.

In order to solve the above problems, the method for manufacturing a holding member according to the present invention is a method for manufacturing a holding member for manufacturing a holding member for holding an object to be held, and is a method for manufacturing a holding member having a first width. A step of preparing a molding die having a main surface, a step of arranging the molding die facing the resin material, a step of pressing the main surface of the molding die against the resin material, and a step of curing the resin material to form a cured resin. The molded product includes a step of molding a molded product containing a cured resin and a step of removing the molded product from the molding mold, and the molded product has a plurality of wall portions formed by transferring a plurality of grooves to the cured resin. It is a holding member provided with a recess surrounded by a plurality of wall portions, and when the inner bottom surface of the cured resin is viewed from the outer bottom surface of the cured resin, the retained object product includes the recessed portion. Is retained.

In order to solve the above problems, the holding member according to the present invention is a holding member for holding the holding target product, and is a cured resin formed by curing the resin material and having a contact surface in contact with the holding target product. And a plurality of first wall portions contained in the cured resin and extending along the first direction, and a plurality of second walls contained in the cured resin and extending along the second direction intersecting the first direction. It is provided with a wall portion and a recess surrounded by a plurality of first wall portions and a plurality of second wall portions, and when the inner bottom surface of the cured resin is viewed from the outer bottom surface of the cured resin, the product to be held is recessed. The object to be held is held so as to include the above, and the shape of the plurality of first wall portions is such that the shape of the plurality of first grooves having the first width formed on the main surface of the molding mold is a cured resin. The shape of the plurality of second wall portions is the shape transferred to the cured resin, and the shape of the plurality of second groove portions having the first width formed on the main surface of the molding die is transferred to the cured resin. Is.

In order to solve the above problems, the holding mechanism according to the present invention has the above-mentioned holding member.

In order to solve the above problems, the product manufacturing apparatus according to the present invention has the above-mentioned holding member.

According to the present invention, the holding member can be manufactured without increasing the manufacturing cost.

(A) is a plan view of the sealed substrate for BGA as viewed from the substrate side, and (b) is a front view of the sealed substrate for BGA. (A) is a schematic cross-sectional view showing a process of manufacturing a BGA package from the sealed substrate for BGA shown in FIG. 1, and (b) to (c) are manufacturing a holding member for a BGA package. It is a schematic cross-sectional view which shows a part of the process to perform. (A) to (c) are schematic cross-sectional views which show the part which continued from FIG. 2C in the process of manufacturing the holding member for a BGA package, and (d) is the holding member for a manufactured BGA package. It is a schematic cross-sectional view which shows the process of adsorbing a BGA package using. (A)-(d) are schematic cross-sectional views showing a part of another step for manufacturing a holding member for a BGA package. (A) to (b) are schematic cross-sectional views showing a step of adsorbing a BGA package using another manufactured holding member for the BGA package. (A) to (b) are schematic cross-sectional views showing a step of adsorbing an LED package using the manufactured holding member for the LED package. It is a schematic plan view which shows the cutting apparatus to which the holding member for the BGA package shown in FIG. 3D is applied.

Hereinafter, embodiments according to the present invention will be described with reference to the drawings. All figures in the application documents are schematically drawn with omission or exaggeration for the sake of clarity. The same components are designated by the same reference numerals and the description thereof will be omitted as appropriate.

[Embodiment 1]
(Structure of sealed substrate for BGA)
The configuration of the sealed substrate for BGA will be described with reference to FIG. The final product, the BGA package, is manufactured by cutting the sealed substrate for BGA. Therefore, the sealed substrate for BGA corresponds to an intermediate product in manufacturing a BGA package. The BGA package, which corresponds to the final product, is the product to be held that is held by the holding member.

As shown in FIG. 1 (b), the substrate 2 included in the sealed substrate 1 for BGA has a plurality of regions 3. On one surface 2a of the substrate 2, the chip 4 is mounted on each region 3. The sealing resin 5 is formed on one surface 2a of the substrate 2 so that the chips 4 in the plurality of regions 3 are covered. Each chip 4 is collectively resin-sealed with the sealing resin 5. The sealed substrate 1 for BGA includes a substrate 2, a chip 4, and a sealing resin 5.

As shown in FIG. 1, a large number of protruding electrodes 6 are provided on the other surface 2b of the sealed substrate 1 for BGA. The protruding electrode 6 is a convex portion protruding from the other surface 2b of the sealed substrate 1 for BGA. The amount of protrusion, which is the length of the protruding electrode 6 protruding from the other surface 2b, is the distance La. The protruding electrode 6 functions as an external terminal that electrically connects the BGA package and the outside of the BGA package. In FIG. 1, a solder ball is shown as the protruding electrode 6. FIG. 1 shows a case where the protruding electrode 6 is provided in the entire region 3 of the sealed substrate 1 for BGA. On the other surface 2b of the sealed substrate 1 for BGA, the protruding electrode 6 is a convex portion, and the portion other than the protruding electrode 6 (in other words, the portion other than the protruding electrode 6 on the other surface 2b) is a concave portion. Is.

As shown in FIG. 1A, the sealed substrate 1 for BGA has a plurality of first cutting lines 7 extending along the X direction and a plurality of second cutting lines 8 extending along the Y direction. , Each is set virtually. The plurality of regions 3 surrounded by the plurality of first cutting lines 7 and the plurality of second cutting lines 8 correspond to the BGA packages to be retained. The planar shape of the region 3 shown in FIG. 1A (shape viewed along the Z direction; the same applies hereinafter) is a square having four sides having a side length a.

In FIG. 1A, three regions 3 are formed along the X direction, and four regions 3 are formed along the Y direction. Therefore, 12 regions 3 are formed in a grid pattern on the sealed substrate 1 for BGA. By cutting the sealed substrate 1 for BGA along the plurality of first cutting lines 7 and the plurality of second cutting lines 8, 12 BGA packages corresponding to the respective regions 3 are manufactured. The size of the sealed substrate 1 for BGA is arbitrarily set according to the size and the number of BGA packages to be separated.

(Manufacturing method of BGA package)
A method of manufacturing a BGA package from the sealed substrate 1 for BGA will be described with reference to FIG. 2 (a). First, the cutting table 9 is prepared. A cutting jig 10 is attached to the cutting table 9. The cutting jig 10 has a metal plate 11 and a resin sheet 12 mounted on the metal plate 11. A metal plate 11 is attached to the upper surface of the cutting table 9. A cutting groove 13 is formed on the upper surface of the resin sheet 12 so as to overlap the plurality of first cutting lines 7 (see FIG. 1) and the plurality of second cutting lines 8 of the sealed substrate 1 for BGA. To.

The cutting jig 10 has a through hole 14 penetrating the metal plate 11 and the resin sheet 12. The through holes 14 are formed corresponding to the regions 3 of the sealed substrate 1 for BGA. Each through hole 14 is connected to a decompression source (not shown) via a space 15 formed in the cutting table 9, a pipe 16 and a valve 17 in sequence. As the decompression source, for example, a decompression pump, a decompression tank, or the like is used.

Next, as shown in FIG. 2A, the sealed substrate 1 for BGA is placed on the cutting jig 10. By operating the valve 17, the sealed substrate 1 for BGA is sucked through the pipe 16, the space 15, and each through hole 14. The wide arrow indicated by the line segment indicates the intake VT for sucking the sealed substrate 1 for BGA. The sealed substrate 1 for BGA is in close contact with the upper surface of the cutting jig 10 by being pressed by atmospheric pressure. In other words, the sealed substrate 1 for BGA is adsorbed on the upper surface of the cutting jig 10. As a result, the sealed substrate 1 for BGA is temporarily fixed to the cutting jig 10 of the cutting table 9.

Next, as shown in FIG. 2A, a disc-shaped rotary blade 18 is prepared. The rotary blade 18 is a rotary blade for cutting having a width (thickness) w1. When the rotary blade 18 is cut along the diameter direction, the cross-sectional shape of the outer edge of the rotary blade 18 is V-shaped. The rotary blade 18 rotating at high speed is used to cut the sealed substrate 1 for BGA along the plurality of first cutting lines 7 (see FIG. 1) and the plurality of second cutting lines 8. As a result, the BGA package 19 in which the sealed substrate 1 for BGA is individualized in units of each region 3 is manufactured. FIG. 2A shows a case where the sealed substrate 1 for BGA is cut along the second cutting line 8. A gap 20 having a width w1 is formed between the adjacent BGA packages 19.

(Manufacturing method of holding member for BGA package)
A method for manufacturing the holding member according to the first embodiment of the present invention will be described with reference to FIGS. First, as shown in FIG. 2B, a plate-shaped member 21 made of a hard plate is prepared. The plate-shaped member 21 is a molding raw material used for manufacturing the holding member. The planar shape of the plate-shaped member 21 preferably includes the planar shape of the sealed substrate 1 for BGA. As the plate-shaped member 21, a composite material plate such as a glass epoxy substrate, a hard resin plate such as an acrylic plate or a fluororesin plate, a metal plate such as an aluminum plate, a glass plate or the like is used.

Next, as shown in FIG. 2B, the plate-shaped member 21 is temporarily fixed to the cutting jig 10 of the cutting table 9. FIG. 2B shows an example in which the plate-shaped member 21 is temporarily fixed to the upper surface of the cutting jig 10 by suction. In the subsequent steps, the cutting table 9 used for cutting the sealed substrate 1 for BGA can be used.

Next, the disk-shaped rotary blade 22 is prepared. The rotary blade 22 is a rotary blade for forming a groove having a width (thickness) w2. The width (thickness) w2 of the rotary blade 22 for forming a groove is larger than the width (thickness) w1 of the rotary blade 18 for cutting. As shown in FIG. 2C, the cross-sectional shape of the outer edge of the rotary blade 22 when the rotary blade 22 is cut along the diameter direction is rectangular.

Next, as shown in FIG. 2C, the groove portion 23 is formed in the plate-shaped member 21 by using the rotary blade 22 that rotates at high speed. The formed groove 23 has a width w2. Specifically, the cutting lines 24 correspond to the plurality of first cutting lines 7 and the plurality of second cutting lines 8 virtually set on the sealed substrate 1 for BGA (see FIG. 1A). Along the line, a groove 23 is formed in the plate-shaped member 21. The depth of the groove 23 is the distance Lb. The distance Lb is larger than the distance La, which is the amount of protrusion of the protruding electrode 6 from the other surface 2b of the sealed substrate 1 for BGA. By the steps up to this point, the grooved plate 25 forming a part of the molding die used for manufacturing the holding member is completed. In the step of forming the groove portion 23 in the plate-shaped member 21, the cutting device used for cutting the sealed substrate 1 for BGA may be diverted. In this case, it is only necessary to replace the rotary blade of the cutting device. Therefore, it is convenient because it is not necessary to prepare a new processing apparatus.

Next, as shown in FIG. 3A, the reinforcing plate 26 is fixed to the opposite surface (upper surface in FIG. 3A) of the grooved plate 25 on which the groove portion 23 is formed. The grooved plate 25 and the reinforcing plate 26 form a molding die 27 used for manufacturing the holding member. The material of the reinforcing plate 26 may be selected from the materials used for the plate-shaped member 21. When fixing the reinforcing plate 26 to the grooved plate 25, an adhesive or the like can be used.

Next, as shown in FIG. 3A, the box-shaped member 28 is prepared. The resin material 29 is supplied to the box-shaped member 28. The resin material 29 is a resin having fluidity at room temperature (hereinafter referred to as “liquid resin”), regardless of the degree of viscosity. The resin material 29 is preferably a room temperature curable resin. As the resin material 29, a silicone resin, a fluororesin, or the like is used. The optimum resin material can be selected according to the required hardness and shape of the holding member. Since bubbles may be contained inside the resin material 29, it is preferable to remove bubbles by defoaming in advance.

Next, as shown in FIG. 3B, the resin material 29 supplied to the box-shaped member 28 is immersed in the side of the surface of the grooved veneer 25 of the molding die 27 on which the groove portion 23 is formed. The length at which the grooved plate 25 is immersed in the resin material 29 is set to be equal to or longer than the length at which the groove portion 23 of the grooved plate 25 is filled with the resin material 29.

Next, the resin material 29 is cured to form the cured resin 30. As shown in FIG. 3C, the cured resin 30 is separated from the mold 27. Since the resin material 29 is a room temperature curable resin, shrinkage of the cured resin 30 does not occur in the process of molding the cured resin 30. Therefore, the cured resin 30 having good dimensional accuracy can be obtained.

By the steps up to this point, the molded product 31 including the box-shaped member 28 and the cured resin 30 is completed. The molded product 31 has a plurality of recesses 32 corresponding to the plurality of regions 3 shown in FIG. 1, a plurality of first cutting lines 7 and a plurality of second cutting lines 8 which are boundaries of the plurality of regions 3. It has a corresponding wall portion 33. The recess 32 is a space surrounded by the wall portion 33. The wall portion 33 of the molded product 31 is formed by transferring the shape of the groove portion 23 of the molding die 27. The concave portion 32 of the molded product 31 is formed by transferring the shape of the portion (in other words, the convex portion surrounded by the groove portion 23) surrounded by the groove portion 23 in the molding die 27.

Next, a through hole 34 (see FIG. 3D) is formed in the molded product 31. A through hole 34 penetrating the box-shaped member 28 and the cured resin 30 is formed in the central portion of each recess 32 by using a drill, a laser, or the like. The through hole 34 functions as a suction hole for sucking the product to be held. By the step of forming the through hole 34 in the molded product 31, as shown in FIG. 3D, the holding member 35 including the box-shaped member 28, the cured resin 30, and the through hole 34 is completed.

The width of the wall portion 33 included in the holding member 35 is a width w2 equal to the width (thickness) of the rotary blade 22 for forming a groove. The end surface 36 (lower surface in FIG. 3D) of the wall portion 33 shown in FIGS. 3C and 3D is a horizontal plane. The distance Lb, which is the depth of the groove portion 23 of the grooved plate 25 of the molding die 27, is equal to the height of the wall portion 33.

(Aspect for holding the BGA package using a holding member)
A mode of holding the BGA package 19 by using the holding member 35 will be described with reference to FIG. 3 (d). The holding member 35 is used by being attached to a transport mechanism 37 such as an unloader, for example. First, as shown in FIG. 3D, a transport mechanism 37 to which the holding member 35 is attached is prepared.

Next, after moving the holding member 35 above the BGA package 19 adsorbed on the cutting table 9, the holding member 35 is lowered. In this step, the cutting table 9 and the transport mechanism 37 may be relatively moved up and down. In this process, the center of the gap 20 between the adjacent BGA packages 19 and the center of the wall portion 33 are aligned. When viewed along the Z direction in the state after alignment (hereinafter referred to as "planar view"), the length at which the wall portion 33 and the BGA package 19 overlap (in FIG. 3D, along the X direction). (Shown as overlapping length) is the distance L1.

Next, as shown in FIG. 3D, each BGA package 19 is sucked by the intake VJ via the pipe 38 and the valve (not shown) in sequence. As a result, the outer peripheral portion of each BGA package 19 is attracted to the end surface 36 of the wall portion 33.

Next, after stopping the suction on the cutting table 9 (see the intake VT shown in FIG. 2), the transport mechanism 37 is raised to transport each BGA package 19 to the mechanism for performing the next step. Examples of the mechanism for performing the next step include an inspection mechanism and a cleaning mechanism.

Hereinafter, the features of the holding member 35 will be described. First, the end surface 36 of the wall portion 33 shown in FIG. 3 (d) (the lower surface in FIG. 3 (d); the same applies hereinafter) is a horizontal plane.

Second, the wall portion 33 has a width w2. The relationship between the width w2 of the wall portion 33 and the width w1 of the gap 20 between the BGA packages 19 (= the width w1 of the rotary blade for cutting) is width w2> width w1.

Thirdly, the end portion 39 of the wall portion 33 (which is the lower portion in FIG. 3D and is surrounded by a broken line) is surrounded by the facing outer peripheral portions (hereinafter, appropriately referred to as “opposing outer peripheral portions”) between adjacent BGA packages 19. The end face 36 in the separated portion. The same shall apply hereinafter) is pressed against the surface. As a result, the outer peripheral portions facing each other and the end surface 36 of the wall portion 33 come into close contact with each other. As a result, the end portion 39 of the wall portion 33 is compressed and deformed so as to spread in the X direction and the Y direction. Therefore, in a state where the outer peripheral portion of each BGA package 19 is adsorbed, the length at which the wall portion 47 and the BGA package 19 overlap is larger than the distance L1 shown in FIG. 3 (d). The hardness of the cured resin 30 is set to such a hardness that the end 39 of the wall 33 is deformed so as to be crushed by pressing the end 39 of the wall 33 against the opposite outer peripheral portion of the BGA package 19. To.

Due to the above three features, the end face 36 of the wall portion 33 closes the gap 20 between the BGA packages 19. In this state, when the outer bottom surface of the cured resin 30 (upper surface in FIG. 3D) is viewed from the inner bottom surface of the cured resin 30 (upper surface in the recess 32 in FIG. 3D), in other words, it is a flat surface. When viewed, each BGA package 19 completely covers each recess 32. By sucking each BGA package 19 using the intake VJ, the outer peripheral portion of each BGA package 19 is attracted to the end surface 36 of each wall portion 33 of the holding member 35. The holding member 35 functions as a suction jig.

In addition, the distance Lb, which is the depth of the recess 32 of the holding member 35, is larger than the distance La, which is the amount of protrusion of the protruding electrode 6 from the other surface 2b of the sealed substrate 1 for BGA. The distance Lb is preferably large so that the inner bottom surface of the recess 32 of the holding member 35 does not come into contact with the top of the protruding electrode 6 even when the end 39 of the wall 33 is deformed so as to be crushed. As a result, firstly, the inner bottom surface of the recess 32 of the holding member 35 comes into contact with the top of the protruding electrode 6, so that the opposite outer peripheral portion of the BGA package 19 and the end portion 39 of the wall portion 33 are separated from each other. , Avoided. Therefore, the situation where the BGA package 19 is not adsorbed due to the leakage of the intake VJ is avoided.

Secondly, by setting the distance Lb to an appropriate size, the protruding electrodes 6 of each BGA package 19 are in close contact with the opposite outer peripheral portion of the BGA package 19 and the end surface 36 of the wall portion 33. It is completely housed in each recess 32 of the holding member 35. Therefore, the outer peripheral portion of each BGA package 19 is attracted to the end surface 36 of the wall portion 33 surrounding each recess 32 of the holding member 35.

When the inner bottom surface of each recess 32 of the holding member 35 comes into contact with the top of the protruding electrode 6, if the opposite outer peripheral portion of the BGA package 19 and the end surface 36 of the wall portion 33 are kept in close contact with each other. Good. In this case, the space of the portion other than the protruding electrode 6 communicates with each other on the other surface 2b of each BGA package 19. Therefore, each BGA package 19 is attracted to the end surface 36 of the wall portion 33 surrounding each recess 32 of the holding member 35 in a state where the opposite outer peripheral portion of the BGA package 19 and the end surface 36 of the wall portion 33 are in close contact with each other. ..

(Action effect)
According to the present embodiment, the wall portion 33 in which the plurality of BGA packages 19 are attracted and held by the holding member 35 and the plurality of recesses 32 surrounded by the wall portion 33 can be collectively formed. Therefore, the holding member 35 having a plurality of recesses 32 can be manufactured at low cost.

According to this embodiment, a room temperature curable resin is used as the resin material 29 to mold the cured resin 30 contained in the holding member 35. As a result, shrinkage of the cured resin 30 does not occur in the process of molding the cured resin 30. Therefore, the holding member 35 having good dimensional accuracy can be manufactured.

According to this embodiment, the holding member 35 including the box-shaped member 28 and the cured resin 30 can be collectively manufactured. The box-shaped member 28 functions as a reinforcing material for the holding member 35. The box-shaped member 28 also functions as a fixing plate for fixing the holding member 35 to another member (for example, a member constituting the transport mechanism 37 (see FIG. 3D) of the manufacturing apparatus), if necessary. To do. Therefore, the holding member 35 having a member that functions as a reinforcing material and a fixing plate can be manufactured at low cost.

(Modification example)
The following modification may be adopted. These modifications can be appropriately adopted in other embodiments as well.

First, the cured resin 30 may be removed from the box-shaped member 28 after the molded product made of the cured resin 30 has been molded. In this case, there is an advantage that the box-shaped member 28 can be used as a jig for repetitive molding. By setting the hardness of the cured resin 30 appropriately large, the cured resin 30 alone can be used as the holding member 35. If necessary, the cured resin 30 is fixed to another member (for example, a member constituting the transport mechanism 37 (see FIG. 3D) of the manufacturing apparatus), and the cured resin 30 fixed to the member is held. It may function as a member.

Secondly, the resin material 29 having a large viscosity may be supplied on the plate-shaped member without using the box-shaped member 28. In this case, it is preferable that the viscosity of the resin material 29 is large enough to keep the resin material 29 stationary even if the plate-shaped member is tilted while the resin material 29 is supplied on the plate-shaped member. .. The side of the grooved plate 25 of the molding die 27 on which the grooved portion 23 is formed is immersed in the resin material 29 having a large viscosity. The steps after the step of curing the resin material 29 having a large viscosity to form the cured resin 30 are the same as the steps described so far.

In this modification, first, the cured resin 30 is molded using a plate-shaped member having a large planar shape. Next, a range required as a holding member is set for the molded product containing the plate-shaped member and the cured resin 30, and the boundary between the required range and the unnecessary outer peripheral portion is cut. As a result, the holding member 35 including the plate-shaped member and the cured resin 30 corresponding to the range required as the holding member is completed.

Thirdly, as the resin material 29, the following resin material may be used instead of the resin having fluidity at room temperature. The resin material has a property that the shape of the groove 23 in the grooved plate 25 of the molding die 27 can be deformed to the extent that the shape of the groove 23 is transferred, and a property that the shape of the groove 23 is cured at room temperature in the transferred state. Is. For example, a jelly-like resin material can be used as the resin material 29.

Fourth, the end face 36 of the wall portion 33 may be a curved surface having a large radius of curvature (in other words, a small curvature). Also in this case, the end 39 of the wall 33 is deformed so as to be crushed by the end 39 of the wall 33 being pressed against the opposite outer peripheral portions of the BGA package 19. Therefore, the end surface 36 of the wall portion 33 can close the gap 20 between the BGA packages 19.

Fifth, the cured resin 30 may have a two-layer structure. After supplying the first resin material to the box-shaped member 28 shown in FIG. 3A to mold the first cured resin, the second resin material is supplied on the first cured resin. Mold the second cured resin. The hardness of the second cured resin is smaller than the hardness of the first cured resin. According to this modification, the soft and easily deformable second cured resin is supported by the hard first cured resin, and the second cured resin constitutes the end portion 39 of the wall portion 33.

According to this modification, the end 39 of the wall 33 is soft and easily deformed, so that the end surface 36 of the wall 33 can more reliably close the gap 20 between the BGA packages 19. The first cured resin having a large hardness functions as a reinforcing plate in the holding member 35, and also functions as a fixing plate for fixing the holding member 35 to another member, if necessary. Instead of curing the first resin material to form the first cured resin, a resin plate made of a hard resin having a hardness higher than that of the second cured resin is previously applied to the inner bottom surface of the box-shaped member 28. May be supplied.

[Embodiment 2]
(Manufacturing method of holding member for BGA package)
A method for manufacturing the holding member according to the second embodiment of the present invention will be described with reference to FIG. The description of the same contents as those in the embodiments described above will be omitted as appropriate.

First, the plate-shaped member 21 (see FIG. 2B) is prepared. The disk-shaped rotary blade 40 shown in FIG. 4A is prepared. The rotary blade 40 is a rotary blade for forming a groove having a width (thickness) w3. As shown in FIG. 4A, the cross-sectional shape of the outer edge of the rotary blade 40 when the rotary blade 40 is cut along the diameter direction is V-shaped. The width (thickness) w3 of the rotary blade 40 for forming the groove is larger than the width (thickness) w1 of the rotary blade 18 for cutting shown in FIG. 2 (a). The width w3 of the rotary blade 40 is preferably smaller than the width (thickness) w2 of the rotary blade 22 for groove formation shown in FIG. 2 (c).

Next, the rotary blade 40 is used to form the groove 41 in the plate-shaped member. The formed groove 41 has a width w3. The cross-sectional shape near the bottom of the groove 41 is V-shaped. The depth of the groove 41 is a distance Lb. The distance Lb is larger than the distance La, which is the amount of protrusion of the protruding electrode 6 shown in FIG. 2A from the other surface 2b of the sealed substrate 1 for BGA. By the steps up to this point, the grooved plate 42 forming a part of the molding die used for manufacturing the holding member is completed.

Next, as shown in FIG. 4B, the reinforcing plate 26 is fixed to the opposite surface (upper surface in FIG. 4B) of the grooved plate 42 on which the groove portion 41 is formed. The grooved plate 42 and the reinforcing plate 26 form a molding die 43 used for manufacturing the holding member.

Next, as shown in FIG. 4B, the box-shaped member 28 is prepared. A resin plate 44 is supplied in advance to the inner bottom surface of the box-shaped member 28. The resin plate 44 is a resin material made of a hard resin. A resin material 29 made of a liquid resin is supplied on the resin plate 44. The molding die 43 is arranged on the resin material 29 supplied to the box-shaped member 28 with the grooved plate 42 on the lower side.

Next, as shown in FIG. 4C, the resin material 29 supplied to the box-shaped member 28 is immersed in the side of the surface of the grooved veneer 42 of the molding die 43 on which the groove 41 is formed. The length at which the grooved plate 42 is immersed in the resin material 29 is set to be equal to or longer than the length at which the groove portion 41 of the grooved plate 42 is filled with the resin material 29.

Next, the resin material 29 is cured to form the cured resin 30. In this process, the resin plate 44 made of a hard resin and the cured resin 30 are adhered to each other. The hardness of the cured resin 30 is smaller than the hardness of the resin plate 44.

Next, as shown in FIG. 4D, the cured resin 30 is separated from the molding die 43. Since the resin material 29 is a room temperature curable resin, shrinkage of the cured resin 30 does not occur in the process of molding the cured resin 30. Therefore, the cured resin 30 having good dimensional accuracy can be obtained.

By the steps up to this point, the molded product 45 including the box-shaped member 28, the resin plate 44 made of hard resin, and the cured resin 30 is completed. The resin plate 44 is a base and corresponds to the first layer. The cured resin 30 is molded so as to cover the resin plate 44 and corresponds to the second layer. The molded product 45 has a plurality of recesses 46 corresponding to the plurality of regions 3 shown in FIG. 1, a plurality of first cutting lines 7 and a plurality of second cutting lines 8 which are boundaries of the plurality of regions 3 (FIG. It has a wall portion 47 corresponding to 1 (a)). The recess 46 is a space surrounded by the wall portion 47.

Next, as shown in FIG. 5A, a through hole 48 is formed in the molded product 45. A through hole 48 penetrating the box-shaped member 28, the resin plate 44, and the cured resin 30 is formed in the central portion of each recess 46 by using a drill, a laser, or the like. The through hole 48 functions as a suction hole for sucking the product to be held. By the step of forming the through hole 48 in the molded product 45, the holding member 49 including the box-shaped member 28, the cured resin 30, the resin plate 44, and the through hole 48 is completed.

With reference to FIG. 5, the dimensions and shape of the wall portion 47 included in the holding member 49 will be described below. The width of the wall portion 47 is a width w3 equal to the width (thickness) of the rotary blade 40 for forming a groove. The width of the end 50 of the wall 47 (lower part in FIG. 5; the same applies hereinafter) becomes narrower as it approaches the tip 51 (lower end in FIG. 5; the same applies hereinafter). In other words, the cross-sectional shape of the end 50 of the wall 47 (the cross-sectional shape when cut along the X-axis of FIG. 5) is as shown in FIG. 5 (with the end 50 facing down). It is V-shaped. The tip 51 of the wall portion 47 is a ridge line extending along the Y axis of FIG. The distance Lb, which is the depth of the groove portion 41 in the grooved plate 42, is equal to the height of the wall portion 47 in the holding member 49. The side surface of the wall portion 47 may be curved. A curved surface having a small radius of curvature (in other words, a large radius of curvature) may be provided at the tip 51.

(Aspect for holding the BGA package using a holding member)
The process of holding the BGA package 19 by using the holding member 49 will be described with reference to FIG. First, as shown in FIG. 5A, a transport mechanism 37 to which the holding member 49 is attached is prepared.

Next, as shown in FIG. 5A, the holding member 49 is moved above the BGA package 19 adsorbed on the cutting table 9. In this process, the center of the gap 20 between the adjacent BGA packages 19 and the center of the wall portion 47 are aligned.

Next, the transport mechanism 37 is lowered from the state shown in FIG. 5 (a). In this step, the cutting table 9 and the transport mechanism 37 may be relatively moved up and down. As a result, the end portion 50 of the wall portion 47 is inserted into the gap 20 between the adjacent BGA packages 19. The end portion 50 of the wall portion 47 has a V-shaped cross-sectional shape as shown in FIG. A part of the end portion 50 including the tip end 51 of the wall portion 47 enters the inside of the gap 20 (the portion below the uppermost end of the gap 20 in FIG. 5), and the deformed both side surfaces of the wall portion 47 are the most of the gap 20. Adhere to the top edge. Therefore, the gap 20 can be closed by the wall portion 47. When viewed in a plan view in this state, each BGA package 19 completely includes each recess 46. In a state where a part including the tip 51 of the wall portion 47 has entered the inside of the gap 20, the inner bottom surface of the recess 46 (the upper surface of the recess 46 in FIG. 5B) and the top of the protruding electrode 6 do not come into contact with each other. It is preferable that the distance Lb is determined.

Next, as shown in FIG. 5 (b), each BGA package 19 is sucked by the intake VJ. As a result, each BGA package 19 is adsorbed on both side surfaces of the end portion 50 of the wall portion 47. The holding member 49 functions as a suction jig.

Next, after stopping the suction on the cutting table 9, the transport mechanism 37 is raised to transport each BGA package 19 to the mechanism for performing the next step.

(Action effect)
According to the present embodiment, the same effect as that of the first embodiment can be obtained. In addition, according to this embodiment, the following effects can be obtained. The end 50 of the wall 47, which is soft and easily deformed, has a cross-sectional shape that becomes narrower as it approaches the tip 51. As the tip 51 of the wall portion 47 enters the inside of the gap 20, the deformed both side surfaces of the wall portion 47 close the gap 20. On the other hand, as shown in FIG. 3D, according to the first embodiment, the end portion 39 of the wall portion 33 is deformed so as to be crushed to close the gap 20. Therefore, according to the present embodiment, the length in which the wall portion 47 and the BGA package 19 overlap in a plan view (in FIG. 5B, it is shown as the length L2 that overlaps along the X direction) is the first embodiment. Is smaller than the overlapping length L1 (see FIG. 3D). According to the present embodiment as compared with the first embodiment, the protruding electrodes 6 can be arranged closer to the outer edge between the adjacent BGA packages 19. Therefore, this embodiment enables further densification of the arrangement of the protruding electrodes 6 in the BGA package 19.

It is clear by comparing FIGS. 3 (d) and 5 (b) that this embodiment enables further densification of the arrangement of the protruding electrodes 6 in the BGA package 19. In FIG. 3D showing the first embodiment, four protruding electrodes 6 are arranged along the X direction in one BGA package 19. On the other hand, in FIG. 5B showing the present embodiment, five protruding electrodes 6 are arranged along the X direction in one BGA package 19.

In addition, according to the present embodiment, each BGA package 19 is attracted to the holding member 49 even when the distance between the outer edge of the BGA package 19 and the outermost edge of the outermost solder ball is small. This, in the first place, allows for the miniaturization of the BGA package 19. Secondly, it enables an increase in the number of BGA packages 19 manufactured from the BGA sealed substrate 1 (see FIG. 1) having the same flat area, in other words, the number of BGA packages 19 that can be taken.

(Modification example)
As a modification, after supplying the first resin material to the box-shaped member 28 shown in FIG. 4B to mold the first cured resin, the second resin material is placed on the first cured resin. May be supplied to form a second cured resin. The hardness of the second cured resin is smaller than the hardness of the first cured resin. The portion of the wall portion 47 near the end portion 50 may be formed of the second cured resin, and the portion closer to the box-shaped member 28 than the vicinity of the end portion 50 may be formed of the first cured resin. With these configurations, the soft and easily deformable second cured resin is supported by the hard first cured resin, and the end 50 of the wall portion 47 is formed by the second cured resin. Therefore, since the end portion 50 of the wall portion 47 is soft and easily deformed, the end portion 50 can more reliably close the gap 20 between the BGA packages 19.

The angle of the tip 51 is preferably an acute angle, and the angle of the tip 51 is more preferably 15 ° or more and 45 ° or less. The reason why the angle of the tip 51 is more preferably 15 ° or more and 45 ° or less is as follows. When the angle of the tip 51 is less than 15 °, the inner bottom surface of the recess 46 of the holding member 49 may come into contact with the top of the protruding electrode 6 due to the wall portion 47 deeply penetrating into the gap 20. There is. In this case, the opposite outer peripheral portion of the BGA package 19 and the end portion 50 of the wall portion 47 may be separated from each other, making it impossible to adsorb the BGA package 19, which is not preferable. If the angle of the tip 51 is made larger than 45 °, it hinders the high density of the arrangement of the protruding electrodes 6 and the miniaturization of the BGA package 19, which is not preferable.

The following modification may be adopted for the wall portion 47. The cross-sectional shape of the end portion 50 may be an asymmetrical shape in which the width becomes narrower as it approaches the tip end 51. For example, the cross-sectional shape of the end portion 50 may be a shape in which the angle symbol ∠ is rotated counterclockwise by 90 °.

[Embodiment 3]
(Aspect for holding the LED package using a holding member)
A mode in which the holding member according to the third embodiment of the present invention holds the optical element will be described with reference to FIG. FIG. 6 shows an LED (Light emitting diode) package 52 corresponding to an optical product as a product to be retained. The LED package 52 includes a substrate 53 made of a printed circuit board, a lead frame, and the like, an LED chip 54, and a sealing resin 55 corresponding to a convex portion. The sealing resin 55 composed of the translucent resin functions as a convex lens. An external terminal (not shown) is formed on one surface (lower surface in FIG. 6A) of the substrate 53. The other surface 56 (upper surface in FIG. 6A) of the substrate 53 is the chip mounting surface. The height from the other surface 56 of the substrate 53 to the top of the sealing resin 55 (in other words, the amount of protrusion of the sealing resin 55) is the distance La. The LED package 52 is manufactured by disassembling the LED sealed substrate (not shown, which corresponds to the BGA sealed substrate 1 shown in FIG. 1). The sealing resin 55 contained in one LED package 52 is housed in one of the plurality of recesses 46 formed in the holding member 49.

The LED package 52 shown in FIG. 6 has a total of four LED chips 54, two along the X direction and two along the Y direction. One LED chip 54 may be provided in one LED package 52. As the optical element, a laser diode chip may be provided instead of the LED chip 54. One light emitting element and one light receiving element may be provided in one package. In this case, the one package functions as an optical sensor.

The holding member 49 shown in FIG. 6 holds the LED package 52 in the same manner as the holding member 49 shown in FIG. Each LED package completely includes each recess 46 when viewed in a plan view in the state shown in FIG. 6 (b). In this case, the distance Lb, which is the depth of the recess 46, is taken into consideration from the distance La, which is the amount of protrusion of the sealing resin 55, and the amount by which a part including the tip 51 of the wall portion 47 enters the inside of the gap 20. Is determined. Specifically, the inner bottom surface of the recess 46 (the upper surface of the recess 46 in FIG. 6B) and the top of the sealing resin 55 in a state where a part including the tip 51 of the wall portion 47 has entered the inside of the gap 20. The distance Lb is determined so that they do not come into contact with each other.

(Action effect)
According to this embodiment, each LED package 52 is attracted to the holding member 49 even when the distance between the outer edge of the substrate 53 and the outer edge of the sealing resin 55 on the other surface 56 of the substrate 53 is small. This, in the first place, enables the miniaturization of the LED package 52. Secondly, it enables an increase in the number of LED packages 52 manufactured from sealed substrates for LEDs having the same flat area, in other words, the number of LED packages 52 that can be taken.

[Embodiment 4]
(Configuration of cutting device)
A configuration of a cutting device for cutting the sealed substrate 1 for BGA shown in FIG. 1 will be described with reference to FIG. 7. The cutting device 57 shown in FIG. 7 is one form of a product manufacturing device that manufactures the product BGA package 19 using the holding member 35 shown in FIG. 3 (d).

As shown in FIG. 7, the cutting device 57 includes a supply module A for supplying the sealed substrate 1 for BGA, a cutting module B for cutting the sealed substrate 1 for BGA, and a cut BGA package 19. An inspection / storage module C for inspection and storage is provided as a component. Each component (each module A to C) is removable and replaceable with respect to each other component.

The supply module A is provided with a sealed substrate supply unit 58 that supplies the sealed substrate 1 for BGA. The BGA-sealed substrate 1 has the other surface 2b (the surface on which the protruding electrode 6 is formed; see FIG. 1) of the BGA-sealed substrate 1 facing upward (in the + Z direction) by a transport mechanism (not shown). (Orientation), and is conveyed from the supply module A to the cutting module B.

The cutting module B is provided with a cutting table 9 (see FIG. 2) for placing and cutting the sealed substrate 1 for BGA. A cutting jig 10 (see FIG. 2) is mounted on the cutting table 9. The cutting table 9 can be moved in the Y direction in the figure by the moving mechanism 59. Moreover, the cutting table 9 can be rotated in the θ direction by the rotation mechanism 60. The sealed substrate 1 for BGA is placed on the cutting jig 10 mounted on the cutting table 9.

The cutting module B is provided with a spindle 61 as a cutting mechanism. The spindle 61 can move independently in the X and Z directions. A rotary blade 18 for cutting the sealed substrate 1 for BGA is mounted on the spindle 61. As shown in FIG. 2A, the rotary blade 18 has a width (thickness) w1.

The spindle 61 is provided with a cutting water nozzle for injecting cutting water toward a rotary blade 18 rotating at high speed, a cooling water nozzle for injecting cooling water (neither of them is shown), and the like. The sealed substrate 1 for BGA is cut by relatively moving the cutting table 9 and the spindle 61. The rotary blade 18 cuts the sealed substrate 1 for BGA by rotating in the plane of the YY plane.

The cutting device 57 is a cutting device having a single spindle configuration in which one spindle 61 is provided. Not limited to this, a cutting device having a twin spindle configuration in which two spindles are provided in the cutting module B may be used. Further, two cutting tables may be provided, and a twin-cut table configuration may be configured in which the sealed substrate 1 for BGA is cut at each cutting table. By adopting the twin spindle configuration and the twin cut table configuration, the productivity of the cutting apparatus can be improved.

The inspection / storage module C is provided with a transport mechanism 37 (see FIG. 3 (d)) for sucking and transporting a plurality of BGA packages 19 which are separated from the sealed substrate 1 for BGA. The transport mechanism 37 is movable in the X direction and the Z direction. The holding member 35 shown in FIG. 3D is attached to the transport mechanism 37. The transport mechanism 37 uses the holding member 35 to collectively attract and transport the plurality of individualized BGA packages 19 to the holding member 35.

The inspection / storage module C is provided with an inspection table 62 for mounting and inspecting a plurality of individualized BGA packages 19. An inspection jig 63 is mounted on the inspection table 62. The inspection table 62 can rotate about the Y axis and can move in the X and Z directions. A plurality of BGA packages 19 are collectively placed on the inspection jig 63 by the transport mechanism 37. The plurality of BGA packages 19 are the other surface of the sealing resin 5 shown in FIG. 5 (a) (lower surface in FIG. 5 (a)) and the surface on the side of the protruding electrode 6 by the inspection camera 64. Surfaces 2b are inspected respectively.

The inspection / storage module C is provided with a storage table 65 for temporarily storing a plurality of inspected BGA packages 19. The storage table 65 is movable in the Y direction. The holding member 35 for the BGA package shown in the second embodiment is attached to the storage table 65. The storage table 65 corresponds to a holding mechanism. The inspected BGA package 19 is collectively transferred from the inspection table 62 to the holding member 35 attached to the storage table 65. The BGA package 19 stored in the storage table 65 is classified into a non-defective product and a defective product, and the non-defective product is transferred to the non-defective product tray 66 and the defective product is transferred to the defective product tray 67 by a transfer mechanism (not shown) and stored. To.

The supply module A is provided with a control unit CTL. The control unit CTL operates the cutting device 57, transports the sealed substrate 1 for BGA, cuts the sealed substrate 1 for BGA, transports the individualized BGA package 19, inspects the BGA package 19, and performs the BGA package. Controls the storage of 19 and the like. In the present embodiment, the control unit CTL is provided in the supply module A. Not limited to this, the control unit CTL may be provided in another module. Further, the control unit CTL may be divided into a plurality of parts, and the divided parts may be provided in at least two modules of the supply module A, the cutting module B, and the inspection / storage module C.

When manufacturing the LED package 52 shown in FIG. 6, a transport mechanism 37 to which the holding member 49 is attached is used. When manufacturing an optical product, for example, when manufacturing a microlens array, the holding target product held by the holding member is the microlens array. In this case, a holding member corresponding to the dimensions and shape of the microlens array is prepared. The prepared holding member is attached to the transport mechanism, and the microlens array is attracted to the holding member. The microlens array is then transported using a transport mechanism.

In the present embodiment, the holding member 35 (see FIGS. 3D and 7) and the holding member 49 (see FIGS. 5 and 6) are typically used in the following steps. It is a process in which the BGA package 19 and the LED package 52, which are separated by being cut, are transferred from the cutting table to the inspection table. As a step other than this, the BGA package 19 and the LED package 52 are adsorbed with the convex portions (protruding electrode 6 and the sealing resin 55) of the irregularities of the BGA package 19 and the LED package 52 facing upward. In the process, the holding members 35 and 49 are used.

(Action effect)
According to the present embodiment, in the cutting device 57, the holding member 35 for the BGA package shown in the second embodiment is applied to the transport mechanism 37 and the storage table 65. The plurality of protruding electrodes 6 of one BGA package 19 are housed in one recess 32 among the plurality of recesses 32 formed in the holding member 35. Therefore, in the plurality of BGA packages 19, the other surface 2b, which is the surface on the side of the protruding electrode 6 shown in FIG. 5A, can be stably adsorbed on the transport mechanism 37 and the storage table 65. By applying the holding member 35 to the transport mechanism 37 and the storage table 65, the manufacturing cost of the cutting device 57 can be suppressed.

In the embodiments described so far, the BGA package 19 and the LED package 52 have been illustrated and described as the holding target products held by the holding member according to the present invention. Not limited to these, the present invention is applied to a product to be retained having irregularities on the surface to be adsorbed. First, there is a sealed substrate for LGA (Land grid array) in which terminals made of copper foil and solder resist made of insulating resin are formed on the surface to be adsorbed. Since the thickness of the terminal and the thickness of the solder resist are usually different, unevenness (in other words, a step) is formed on the surface to be adsorbed on the sealed substrate for LGA (Land grid array). Secondly, there is an optical product in which a lens is formed on the surface to be attracted. A convex lens is an example of a convex portion, a concave lens is an example of a concave portion, and a Fresnel lens is an example of an uneven portion. Optical products include microlens arrays.

In the embodiments described so far, when the holding member is manufactured, the molding dies 27 shown in FIGS. 3 (a) to 3 (c) and the molding dies 43 shown in FIGS. 4 (b) to 4 (d) are formed. It was used. The mold 27 has a grooved plate 25 (see FIGS. 3A to 3C). The mold 43 has a grooved plate 42 (see FIG. 4). When the grooved plates 25 and 42 were manufactured, a disc-shaped rotary blade 22 having a width (thickness) w2 was used to form a groove in the plate-shaped member 21 made of a hard resin plate or the like. Instead of the plate-shaped member 21, the rotary blades 22 and 40 may be used to form a groove portion with respect to the intermediate product immediately before being individualized. As an intermediate product immediately before being separated into pieces, first, the sealed substrate 1 for BGA itself (see FIG. 1) can be mentioned. Secondly, the sealed substrate itself for the LED package (not shown) immediately before being separated into the LED package 52 (see FIG. 6) can be mentioned. Thirdly, there is a molded product which is an intermediate product immediately before being separated into a microlens array or the like in the process of manufacturing an optical product such as a microlens array.

Grooves may be formed by using rotary blades 22 and 40 in an alternative having the same dimensions and shape as the sealed substrate described above. As a substitute, for example, a molded product that is a substitute for the sealed substrate 1 for BGA shown in FIG. 1 can be mentioned. In order to manufacture this molded product, the same substrate as the substrate 2 used for the sealed substrate 1 for BGA is used, and for example, it has the same dimensions and shape as the sealing resin 5 without mounting the chip 4. Mold a dummy resin. By forming a groove in the molded product containing the dummy resin using the rotary blades 22 and 40, a grooved molded product that replaces the grooved plates 25 and 42 is manufactured. Grooved molded products can be used in place of the molds 27 shown in FIGS. 3 (a) to 3 (c) and the molds 43 shown in FIGS. 4 (b) to 4 (d).

In the embodiments described so far, the groove portions 23 and 41 are formed by using the rotary blades 22 and 40. In the step of forming the grooves 23 and 41, a wire saw, a band saw or the like may be used instead of the rotary blades 22 and 40 for processing. Further, in the step of forming the grooves 23 and 41, laser processing, blast processing, water jet processing and the like may be used. When machining with a wire saw, laser machining, blast machining, or water jet machining is used, a product having a curved line or a polygonal line in a planar shape can be manufactured. A memory card is an example of a product in which a curved line or a polygonal line is included in a planar shape.

In the embodiments described so far, the holding member 49 is used as a suction jig. As a modification, a molded product 45 (see FIG. 4D), which is a member in which the suction hole 48 is not formed, can be used as a tray. In other words, the molded product 45 can be used as a holding member that does not require a suction hole. An embodiment in which the molded product 45 shown in FIG. 4D is used as a tray will be described. The molded product 45 is used in the state shown in FIG. 4D (the state in which the opening of the recess 46 faces upward). This will be described with reference to the state in which FIG. 5B is turned upside down. In this state, the BGA package 19 is housed in the recess 46 so that the outer edge of the BGA package 19 comes into contact with the inner surface of the end 50 of the wall 47 surrounding the recess 46. The protruding electrode 6 of the BGA package 19 does not come into contact with the inner bottom surface of the recess 46. This prevents dirt from adhering to the protruding electrode 6. Therefore, the electrical connection involving the protruding electrode 6 is stably performed. In addition, rattling during transportation of the BGA package 19 is suppressed.

As another modification, FIG. 6B will be described with reference to the upside-down state. In this case, the sealing resin 55 of the LED package 52 does not come into contact with the inner bottom surface of the recess 46. This prevents dirt from adhering to the sealing resin 55 that functions as a convex lens. Therefore, the optical characteristics of the LED package 52 are not deteriorated. In addition, rattling when transporting the LED package 52 is suppressed.

As yet another modification, the modification of the molded product 31 shown in FIG. 3C can be used as the tray. A shallow groove is formed at the center of the groove 23 shown in FIG. 3A by using a rotary blade for forming a groove having a width (thickness) w4. The width w4 of the rotary blade is smaller than the width w1 of the rotary blade 18 for cutting (see FIG. 2A). By the steps shown in FIGS. 3 (a) to 3 (c), a molded product that replaces the molded product 31 shown in FIG. 3 (c) is manufactured. This molded product has steps formed at both corners in the upper part of the wall 33 shown in FIG. 3 (c). The outer edges of the objects to be held such as the BGA package 19 and the LED package 52 are placed on the horizontal surface at this step. Also in this modified example, the same effect as the two modified examples described so far can be obtained.

In the three modified examples described so far, suction holes may be formed in the molded product and the molded product 45, which are modified examples of the molded product 31. In these cases, the holding member and the holding member 49, which are modified examples of the holding member 35, correspond to a tray having a function of sucking the holding target product.

In each embodiment, the cutting device has been described as one embodiment of the product manufacturing device. Not limited to this, the holding member of the present invention can also be applied to a transport device for transporting a product, a storage device for storing the product, an inspection device for inspecting the product, and the like, which are used in the manufacturing apparatus for each product. ..

The present invention is not limited to the above-described embodiments, and can be arbitrarily and appropriately combined, modified, or selected and adopted as necessary without departing from the spirit of the present invention. Is.

1 BGA sealed substrate (intermediate product)
2,53 Substrate 2a One surface 2b The other surface (first surface)
3 Area 4 Chip 5, 55 Encapsulating resin 6 Protruding electrode 7 1st cutting line 8 2nd cutting line 9 Cutting table 10 Cutting jig 11 Metal plate 12 Resin sheet 13 Cutting groove 14, 34, 48 Through hole 15 Space 16 , 38 Piping 17 Valves 18, 22, 40 Rotary blades 19 BGA package (Products, products to be held, electronic devices)
20 Gap 21 Plate-shaped member (hard plate)
23, 41 Grooves 24 Cutting lines 25, 42 Grooved plates 26 Reinforcing plates 27, 43 Molded 28 Box-shaped members 29 Resin material 30 Cured resin 31, 45 Molded products 32, 46 Recesses 33, 47 Walls 35, 49 Holding members 36 End face 37 Conveyance mechanism 39, 50 End part 44 Resin plate (first layer)
51 Tip 52 LED package (product, holding target, electronic device)
54 LED chip 56 The other side (first side)
57 Cutting device 58 Encapsulated substrate supply part 59 Movement mechanism 60 Rotation mechanism 61 Spindle 62 Inspection table 63 Inspection jig 64 Inspection camera 65 Storage table 66 Good product tray 67 Defective product tray a One side length A Supply module B Cutting module C Inspection / storage module CTL control unit L1, L2 Overlapping length La, Lb Distance VJ, VT Intake w1 width (second width)
w2, w3 width (first width)

Claims (9)

A method for manufacturing a holding member for manufacturing a holding member in which a plurality of holding target products having a plurality of protruding electrodes are held after being cut by a cutting blade and separated into pieces.
A plurality of the large first width than the thickness of the cutting blade have a, are formed corresponding to the wall portion arranged to block the clearance of the holding goods for the adjacent after the being diced The process of preparing a molding mold having a groove on the main surface of
The step of arranging the molding die facing the resin material and
The step of pressing the main surface of the molding die against the resin material and
A step of molding a molded product containing the cured resin by curing the resin material to form a cured resin.
A step of removing the molded product from the molding mold is provided.
The molded article is a holding member having a plurality of recesses surrounded by a plurality of the wall portion formed by said plurality of grooves is transferred to the cured resin,
A holding member in which the recessed product accommodates the plurality of protruding electrodes of the product to be held, and the product to be held is held in a state of being sealed by the wall portion surrounding the recess and the product to be held. Manufacturing method. The process of preparing the box-shaped member and
Further provided with a step of supplying the resin material to the box-shaped member,
The method for manufacturing a holding member according to claim 1, wherein in the step of pressing against the resin material, the main surface of the molding die is pressed against the resin material supplied to the box-shaped member. The method for manufacturing a holding member according to claim 2, further comprising a step of removing the box-shaped member from the cured resin. The molding die includes a hard plate and the plurality of grooves formed on the main surface of the hard plate.
1. The plurality of grooves include a plurality of first grooves extending along a first direction and a plurality of second grooves extending along a second direction intersecting the first direction. The method for manufacturing a holding member according to any one of Items to 3. The steps of molding the molded product include a step of providing a first layer as a base and a step of molding a second layer formed so as to cover the first layer and capable of contacting the product to be held. Including and
The method for manufacturing a holding member according to any one of claims 1 to 4, wherein the second layer is softer than the first layer. A step of forming a through hole provided in the recess and penetrating at least the cured resin is further provided.
The method for manufacturing a holding member according to any one of claims 1 to 5, wherein the through hole is a suction hole for sucking the holding target product. A holding member that holds a plurality of holding objects having a plurality of protruding electrodes after being cut by a cutting blade and separated into pieces.
A cured resin formed by curing the resin material and having a contact surface in contact with the object to be retained,
A plurality of first wall portions contained in the cured resin and extending along the first direction,
A plurality of second wall portions contained in the cured resin and extending along a second direction intersecting with the first direction.
It is provided with a recess surrounded by the plurality of first wall portions and the plurality of second wall portions.
The recess closes a gap between adjacent products to be held after being individualized , accommodates the plurality of protruding electrodes of the product to be held, and surrounds the recess with the wall and the target to be held. The product to be held is held in a state of being sealed by the product, and the product to be held is held.
The shape of the plurality of first wall portions is formed on the main surface of the molding die, and the shape of the plurality of first groove portions having a first width larger than the thickness of the cutting blade is transferred to the cured resin. Shape
The shape of the plurality of second wall portions is formed on the main surface of the molding die, and the shape of the plurality of second groove portions having the first width larger than the thickness of the cutting blade is formed on the cured resin. A holding member that has a transferred shape. A holding mechanism having the holding member according to claim 7. A product manufacturing apparatus having the holding member according to claim 7.

Images