JP5250868B2 - Chip storage tray - Google Patents

Description

  The present invention relates to a structure of a chip storage tray used in a semiconductor device manufacturing process.

In a conventional semiconductor device manufacturing process, a plurality of semiconductor chips scribed from a semiconductor wafer are temporarily stored in a chip storage tray during the transition from the previous process to the die bonding process. Prior to the die bonding process, the semiconductor chips pushed up by the needle pins of the sorting device are vacuum-sucked by the die collet and temporarily stored in the chip storage tray. When the semiconductor chip is picked up in the next process, the semiconductor chip may stick to the chip storage tray.

Patent Document 1 discloses a chip storage tray having means for preventing a semiconductor chip from sticking to the chip storage tray. In this known example, the shape of the bottom surface of the storage pocket is set as the contact area with the semiconductor chip as means for preventing the semiconductor chip from adhering to the bottom surface of the storage pocket (recess) of the chip storage tray and facilitating the removal of the semiconductor chip. It has a reduced structure. FIG. 7 is a partial cross-sectional view of a conventional chip storage tray. The chip storage tray is composed of a tray main body and a plurality of recesses (which are referred to as storage pockets) formed in the tray main body, and a plurality of storage pockets are arranged in a lattice shape. The bottom surface of the recess 101 formed in the tray main body 100 has a concavo-convex portion 104 provided in a lattice shape or an interdigital shape. The semiconductor chip 102 is placed thereon (FIG. 7 (a)). Moreover, it can comprise so that the bottom face of the recessed part 101 may be made into the one concave surface 105 (FIG.7 (b)). A protrusion 106 can also be provided on the bottom surface of the recess 101 (FIG. 7C). Further, the bottom surface of the concave portion 101 can be configured as one convex surface 107 (FIG. 7D). In any case, the contact area between the back surface of the semiconductor chip 102 and the bottom surface of the recess 101 can be greatly reduced as compared with the case where the bottom surface of the recess 101 is flat.

Patent Document 2 discloses a mold whose surface is covered with a release film. Disclosed is a novel release coating that improves the mold release of molding dies for plastic molding, rubber molding, and the like. The release coating is composed of a base coating on the surface of the molding die and an amorphous fluororesin coating with a uniform thickness attached on the base coating. This mold release film is obtained by forming a base film on the mold surface, applying an amorphous fluororesin dissolved in a fluorine-based inert liquid thereon, volatilizing and drying the fluorine-based inert liquid. Followed by heat treatment.
JP-A-60-109217 (FIG. 3) JP-A-5-245848

In recent years, semiconductor chips tend to be miniaturized. When the semiconductor chip is miniaturized, it is natural that the size of the concave portion of the chip storage tray needs to be reduced. Further, since the chip storage tray is formed by molding, there is a limit in forming a small groove or protrusion provided on the bottom surface of the concave portion of the tray.
In addition, as semiconductor chips become smaller, the grooves and protrusions in the recesses become larger relative to the semiconductor chip, which is used for adhesive tape that holds the semiconductor chip during the effects of static electricity and semiconductor wafer scribing. It becomes easy to be influenced by the applied adhesive and the like, and the semiconductor chip is easily attached to the bottom surface of the chip storage tray. In addition, the downsizing of the semiconductor chip makes it easier for the semiconductor chip to fall into a recess groove that is relatively large with respect to the chip, leading to chipping of the semiconductor chip and difficulty in picking up the semiconductor chip. Further, due to the miniaturization of the semiconductor chip, the foreign matter is relatively large with respect to the chip, and the foreign matter is likely to adhere to the semiconductor chip, making it difficult to pick up the semiconductor chip and easily scratching the semiconductor chip.

  The present invention has been made under such circumstances, and it is possible to prevent a semiconductor chip whose size has been reduced from adhering to the bottom surface of the chip storage recess of the chip storage tray, thereby making it easy to remove the chip. Provide a chip storage tray that can prevent damage and scratches.

One aspect of the chip storage tray of the present invention is to prevent a tray body having a plurality of recesses for detachably storing semiconductor chips on which semiconductor elements are formed, and to prevent the semiconductor chips from adhering to the bottom surfaces of the recesses. And a thin film made of a release material formed on the surface of the tray main body including the concave portion. The surface of the thin film may be subjected to uneven processing.

According to one aspect of the method for manufacturing a chip storage tray of the present invention, a tray body having a plurality of recesses for removably storing a semiconductor chip on which a semiconductor element is formed is prevented from adhering to the bottom surface of the recess. A step of immersing in the release material solution, a step of removing the tray body from the solution, and drying and curing the release material adhering to the surface of the removed tray body to release the release material thin film on the surface of the tray body. And a step of forming the structure. During the step of immersing the tray body in the release material solution, ultrasonic vibration may be applied to the release material solution. You may make it further have the process of giving an unevenness | corrugation process to the surface of the said mold release material thin film by an etching or a blast process. The release material may be selected from silicon-based or fluorine-based resin or rubber.

  The present invention prevents the semiconductor chip whose size has been reduced from adhering to the bottom surface of the concave portion of the chip storage tray and facilitates its removal by the above configuration. Further, by forming the release material thin film, foreign substances existing in the recesses of the chip storage tray can be eliminated, and the protrusions and grooves existing in the recesses can be covered, so that the semiconductor chip can be prevented from being scratched or chipped.

  Hereinafter, embodiments of the invention will be described with reference to examples.

Embodiment 1 will be described with reference to FIGS.
1 is a plan view of a chip storage tray described in this embodiment, FIG. 2 is a cross-sectional view of the chip storage tray shown in FIG. 1, taken along the line AA ', and FIG. 3 is mounted with a semiconductor chip. 1 is a plan view of the chip storage tray shown in FIG. 1, and FIG. 4 is a cross-sectional view of a portion along the line BB ′ of the chip storage tray shown in FIG.
As shown in FIGS. 1 and 2, the chip storage tray 10 includes a tray main body 1 having a recess 3 in which semiconductor chips are stored, and a release material thin film 2 formed on the surface of the tray main body 1. The tray body 1 is made of metal, glass, resin, or the like. The tray body 1 has a plurality of recesses 3 formed on the main surface in a lattice shape or an interdigital shape. The recess 3 is provided for storing a semiconductor chip and is referred to as a storage pocket 3.

The release material thin film 2 has a thickness of several tens of μm and is formed almost uniformly on the entire surface of the tray body 1. The release material is selected from silicon-based or fluorine-based resin, rubber, or the like.
A mold release material such as silicone has a high mold release property. A material having a high releasability is characterized by a lower surface tension than other molecules. The surface tension is a force generated as a result of molecules attracting each other. The low surface tension means that the force to attract the same molecules is weak and the attractive force to other types of molecules is also small.

  A semiconductor chip in which a semiconductor device is fabricated is formed by being scribed from a semiconductor wafer such as silicon. The semiconductor chip 9 is temporarily stored in the chip storage tray 10 during the transition from the previous process to the die bonding process (FIGS. 3 and 4). The semiconductor chip 9 is placed in the storage pocket 3 of the chip storage tray 10. That is, prior to the die bonding step, the semiconductor chip 9 pushed up by the needle pin of the sorting device is vacuum-sucked by the die collet and temporarily stored in the chip storage tray 10. When the semiconductor chip 9 enters the next process and is picked up, the semiconductor chip 9 may stick to the chip storage tray 10 and cannot be taken out.

  According to the embodiment, since the tray main body is covered with the release material thin film, the surface has releasability, and as a result, the semiconductor chip which has been downsized can adhere to the bottom surface of the storage pocket of the chip storage tray. Prevent and facilitate its removal. In addition, since the release material thin film covers the tray body, foreign substances existing in the storage pocket 3 of the tray are eliminated in the thin film forming process, and fine protrusions and grooves existing in the storage pocket 3 are also covered. Therefore, it is possible to prevent scratches on the semiconductor chip and missing of the end portion of the semiconductor chip.

Next, Example 2 will be described with reference to FIGS.
FIG. 5 is a flowchart for explaining a manufacturing process of the chip storage tray, and FIG. 6 is a schematic cross-sectional view of a manufacturing apparatus for forming a release material thin film on the surface of the chip storage tray. The material of the release material is selected from, for example, silicon-based or fluorine-based resin or rubber. First, a release resin, for example, a silicon resin is dissolved in a solvent made of ethanol containing a small amount of methanol to prepare a silicon resin solution 5. The silicon resin solution 5 is stored in the processing container 4.

  A method for forming a release material thin film will be described with reference to FIGS. First, the tray body 1 of the chip storage tray 10 is degreased and cleaned. For example, degreasing and cleaning are performed while applying ultrasonic vibration for 5 minutes in a pure water flow (1). The tray body 1 that has been degreased and washed is dehydrated and dried at 100 ° C. for 60 minutes, for example (2). Thereafter, a plurality of tray bodies 1 that have been dehydrated are placed in a net-like basket 6. A basket 6 containing a plurality of tray main bodies 1 is immersed in a silicon resin solution 5 filled in a processing container 4 so that the tray main body 1 is sufficiently immersed, and in this state, ultrasonic vibration 7 is applied. For example, ultrasonic vibration is applied for 5 minutes to uniformly adhere the silicon resin on the surface of the tray main body 1, and the silicon resin enters the inside of the tray main body 1 from the inside. Further, fine foreign matters existing on the surface of the tray body 1 can be removed (3).

  Next, the basket 6 is taken out of the silicon resin solution 5. Thereafter, each tray body 1 is washed with water and dried naturally. By this step, a release material thin film having a thickness of about 10 to 20 μm is formed. This process is repeated 2-3 times in order to eliminate unevenness of the release material thin film. Thereafter, it is cooled (slowly cooled), and a release material thin film 2 having a film thickness of about several tens of μm is formed on the tray body 1.

  According to the embodiment, since the tray main body is covered with the release material thin film, the surface has releasability, and as a result, the semiconductor chip whose size has been reduced is prevented from adhering to the bottom surface of the recess of the chip storage tray. Makes it easy to remove. In addition, since the release material thin film covers the tray body, foreign substances existing in the storage pocket 3 of the tray are eliminated in the thin film forming process, and fine protrusions and grooves existing in the storage pocket 3 are also covered. Therefore, it is possible to prevent scratches on the semiconductor chip and missing of the end portion of the semiconductor chip. Furthermore, since the release material enters the inside of the tray main body by applying ultrasonic vibration, the release material thin film is firmly formed on the tray main body.

Next, Example 3 will be described.
This embodiment is characterized by the structure of the release material thin film formed on the surface of the tray main body constituting the chip storage tray.
The chip storage tray 10 includes a tray main body 1 having a storage pocket 3 for storing semiconductor chips and a release material thin film 2 formed on the surface of the tray main body 1 (see FIG. 2). The release material thin film 2 is formed substantially uniformly on the entire surface of the tray body 1. A mold release material such as silicone has a high mold release property. In this embodiment, the surface of the release material thin film having high releasability is blasted to make the surface uneven, and the contact area between the bottom surface of the storage pocket of the chip storage tray and the semiconductor chip is reduced to release the surface. Reinforce sex.

In this surface treatment to reinforce the releasability, a blasting treatment with a nonmetal or metal such as particulate resin is performed on the surface of the tray body 1 that contacts the semiconductor chip 9 at the bottom of the storage pocket 3. Apply. As the particulate resin material, PTFE, silicon resin, polypropylene resin, or the like, which is a low surface energy resin material, is used alone or in combination. In the blast treatment, only a low surface energy resin material may be used, or it may be mixed with SiO ₂ , polyester resin, urea resin, or melamine resin. The particle size of the particles is 10 μm to 1000 μm, preferably 20 μm to 200 μm. Although the pressure to spray is suitably set according to a blast apparatus, it implements in the range of 2-3 bar.

  According to this embodiment, since the tray body is covered with the release material thin film, the surface has releasability, and as a result, the semiconductor chip whose size has been reduced adheres to the bottom surface of the storage pocket of the chip storage tray. To make it easier to remove. In addition, since the release material thin film covers the tray body, foreign substances existing in the storage pocket 3 of the tray are eliminated in the thin film forming process, and fine protrusions and grooves existing in the storage pocket 3 are also covered. Therefore, it is possible to prevent scratches on the semiconductor chip and missing of the end portion of the semiconductor chip. Further, by performing the blasting process, fine pieces of the resin material adhere to the surface, the irregularities on the surface of the storage pocket become remarkable, and the mold releasability of the chip storage tray can be compensated.

FIG. 3 is a plan view of a chip storage tray described in the first embodiment. Sectional drawing of the part which follows the AA 'line of the chip | tip storage tray shown in FIG. The top view of the chip | tip storage tray which mounts a semiconductor chip. Sectional drawing of the part which follows the BB 'line of the chip | tip storage tray shown in FIG. FIG. 9 is a flowchart showing a method for manufacturing a chip storage tray according to the second embodiment. FIG. 6 is a diagram illustrating a method for manufacturing a chip storage tray according to the second embodiment. The fragmentary sectional view of the conventional chip storage tray.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Tray body 2 ... Release material thin film 3 ... Storage pocket (recessed part)
DESCRIPTION OF SYMBOLS 4 ... Processing container 5 ... Release material solution 6 ... Basket 7 ... Ultrasonic vibration 9 ... Semiconductor chip 10 ... Chip storage tray

Claims (6)

A tray body having a plurality of recesses for detachably storing semiconductor chips on which semiconductor elements are formed, and a surface of the tray body including the recesses to prevent the semiconductor chips from adhering to the bottom surface of the recesses. A chip storage tray, comprising: a thin film made of a released release material. The chip storage tray according to claim 1, wherein the surface of the thin film is subjected to an unevenness treatment. A step of immersing a tray body having a plurality of recesses for removably storing semiconductor chips on which semiconductor elements are formed in a release material solution for preventing the semiconductor chips from adhering to the bottom surfaces of the recesses; and A chip comprising: a step of removing from the solution; and a step of drying and curing the release material adhering to the surface of the removed tray body to form a release material thin film on the surface of the tray body. Storage tray manufacturing method. 4. The method for manufacturing a chip storage tray according to claim 3, wherein ultrasonic vibration is applied to the release material solution during the step of immersing the tray body in the release material solution. 5. The method for manufacturing a chip storage tray according to claim 3, further comprising a step of subjecting the surface of the release material thin film to an unevenness process by etching or blasting. 6. The method for manufacturing a chip storage tray according to claim 3, wherein the release material is selected from silicon-based or fluorine-based resin or rubber.

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