CN100547752C - Adhering apparatus - Google PatentsAdhering apparatus Download PDF
- Publication number
- CN100547752C CN100547752C CNB2006800171352A CN200680017135A CN100547752C CN 100547752 C CN100547752 C CN 100547752C CN B2006800171352 A CNB2006800171352 A CN B2006800171352A CN 200680017135 A CN200680017135 A CN 200680017135A CN 100547752 C CN100547752 C CN 100547752C
- Prior art keywords
- adhesive sheet
- Prior art date
- 230000001070 adhesive Effects 0.000 claims abstract description 162
- 239000000853 adhesives Substances 0.000 claims abstract description 162
- 238000009795 derivation Methods 0.000 claims abstract description 39
- 230000001427 coherent Effects 0.000 claims abstract description 23
- 230000000875 corresponding Effects 0.000 claims abstract description 16
- 239000004065 semiconductors Substances 0.000 claims abstract description 10
- 238000000034 methods Methods 0.000 claims description 19
- 238000003466 welding Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 description 6
- 238000005516 engineering processes Methods 0.000 description 1
The present invention relates to a kind of adhering apparatus, in more detail, relate to a kind ofly when adhesive sheet being adhered to plate-shaped members such as semiconductor wafer, can be accurately adhesive sheet be adhered to adhering apparatus on the plate-shaped member assigned address.
Be formed with the semiconductor wafer (being designated hereinafter simply as " wafer ") of circuit face, on chip, form after the discrete parts, generally each chip will be picked up, it is bonded on the lead frame (carries out chips welding).This chips welding in wafer processing procedure, can be undertaken by adhering to the adhesive sheet with temperature-sensitive cementability that is used for chips welding in advance.
As the adhesion mode of above-mentioned adhesive sheet, there are following two kinds.A kind of roll web that on banded stripping film, temporarily is stained with banded adhesive sheet that is to use, the adhesive sheet of peeling off from above-mentioned stripping film, adhere on the wafer after, cut (with reference to patent documentation 1) along the wafer periphery; Another kind is the thin slice that is predisposed to the corresponding flat shape of wafer profile, after peeling off from stripping film, adheres to by (with reference to patent documentation 2) on the wafer again.
Patent documentation 1: the Japan Patent spy opens the 2003-257898 communique
Patent documentation 2: Japanese patent laid-open 7-195527 communique
But, under the situation of the formation of patent documentation 1, owing to will carry out the periphery cutting after adhesive sheet adheres to, the periphery cutter sweep just becomes requisite device, so except cause device construction complicated, because of the adhesion of periphery cutter sweep and supporting wafers with the site error between the workbench etc., may cause unfavorable conditions such as wafer peripheral damage.
On the other hand, adhering under the situation of wafer with the corresponding thin slice of wafer shape preformed, positional skew during because of the derivation roll web may produce adhesive sheet and adhere to less than on the wafer assigned address, and the problem that under the state of lateral attitude skew, is adhered to.At this shortcoming, the formation scheme that patent documentation 2 proposes is, when roll web is derived, even flap position takes place also can revise this skew, thereby adhesive sheet is adhered on the wafer assigned address under the situation of skew.
But, the device that patent documentation 2 is disclosed, be employing when the skew that detects adhesive sheet, suspend the derivation of roll web,, can't handle disposal ability problem such as decline to a great extent continuously with the mode that image mechanism is made a video recording so bring.And, be to use video camera etc. as prerequisite, so it is high to exist its control device cost, shortcomings such as cost increase.
Summary of the invention
The present invention makes motion just at above-mentioned shortcoming, its purpose is to provide a kind of adhering apparatus, when roll web is derived, even adhesive sheet is producing offset with the direction that derives the direction quadrature, also can adhesive sheet be adhered on the assigned address of plate-shaped member by revising this side-play amount.
In addition, another object of the present invention is to provide a kind of adhering apparatus, adopt adhesive sheet is cut into the mode that adheres to the corresponding flat shape of wafer profile in advance, can not need the periphery cutter sweep.
Of the present invention also have another purpose just to be to provide a kind of adhering apparatus, can not damage the surface of adhesive sheet when adhering to.
In order to achieve the above object, adhering apparatus of the present invention has adopted following structure, and it comprises: the adhesion workbench of accommodating plate-shaped parts; In the process of interim its flat shape that adheres on stripping film and the roll web derivation of the corresponding adhesive sheet of plate-shaped member, this adhesive sheet is peeled off, make it adhere to coherent unit on the above-mentioned plate-shaped member; Also comprise: be configured on the derivation passage of above-mentioned roll web, be used to detect the testing agency of deriving the side-play amount transversely of direction quadrature with above-mentioned adhesive sheet; When mechanism is detected after testing with offset in above-mentioned adhesive sheet, the offset correction device that this offset is revised; Above-mentioned testing agency detects side-play amount under the situation of the derivation operation that need not to stop above-mentioned roll web.
In addition, adhering apparatus of the present invention has also adopted following structure, and it comprises: the adhesion workbench of supporting semiconductor wafers; In the process of interim its flat shape that adheres on stripping film and the roll web derivation of the corresponding adhesive sheet of plate-shaped member, this adhesive sheet is peeled off, make it adhere to coherent unit on the above-mentioned semiconductor wafer; Also comprise: be configured on the derivation passage of above-mentioned roll web, be used to detect the testing agency of deriving the side-play amount transversely of direction quadrature with above-mentioned adhesive sheet; When mechanism is detected after testing with offset in above-mentioned adhesive sheet, can regulate the offset correction device of above-mentioned adhesion at this offset with operating position; Above-mentioned testing agency detects side-play amount under the situation of the derivation operation that need not to stop above-mentioned roll web.
In addition, adhering apparatus of the present invention has also adopted following structure, and it comprises: the adhesion workbench of accommodating plate-shaped parts; In the process that derives with the roll web that on stripping film, is stained with its flat shape and the corresponding adhesive sheet of plate-shaped member temporarily, this adhesive sheet is peeled off, made it adhere to coherent unit on the above-mentioned plate-shaped member; Above-mentioned coherent unit, Yi Bian carry out simultaneously above-mentioned adhesive sheet derivation, adhesive sheet pushing and peel off the process of adhesive sheet from stripping film, Yi Bian adhere on the plate-shaped member; Described adhering apparatus also comprises on the derivation passage that is configured in above-mentioned roll web, is used to detect the testing agency of deriving the side-play amount transversely of direction quadrature with above-mentioned adhesive sheet; When mechanism is detected after testing with offset in above-mentioned adhesive sheet, can regulate the offset correction device of above-mentioned adhesion at this offset with operating position; Above-mentioned testing agency detects side-play amount under the situation of the derivation operation that need not to stop above-mentioned roll web.
In addition, adhering apparatus of the present invention has also adopted following structure, and it comprises: the adhesion workbench of accommodating plate-shaped parts; In the process of interim its flat shape that adheres on stripping film and the roll web derivation of the corresponding adhesive sheet of plate-shaped member, this adhesive sheet is peeled off, make it adhere to coherent unit on the above-mentioned plate-shaped member.Above-mentioned coherent unit, from above-mentioned adhesive sheet being exported to the state till being positioned at above the plate-shaped member, Yi Bian carry out the pushing of the batching of above-mentioned adhesive sheet, adhesive sheet simultaneously and peel off the process of adhesive sheet from stripping film, Yi Bian adhere on the above-mentioned plate-shaped member; Described adhering apparatus also comprises on the derivation passage that is configured in above-mentioned roll web, is used to detect the testing agency of deriving the side-play amount transversely of direction quadrature with above-mentioned adhesive sheet; When mechanism is detected after testing with offset in above-mentioned adhesive sheet, can regulate the offset correction device of above-mentioned adhesion at this offset with operating position; Above-mentioned testing agency detects side-play amount under the situation of the derivation operation that need not to stop above-mentioned roll web.
In the present invention, adopt following structure: above-mentioned adhesive sheet is roughly done circular, above-mentioned testing agency measures above-mentioned side-play amount by detecting the chord length of adhesive sheet on the above-mentioned derivation direction.
In addition, testing agency of the present invention equally spaced is configured in the both lateral sides of reference center's line.
In addition, above-mentioned adhesive sheet also can select to be used for the temperature-sensitive cementability adhesive sheet of chips welding as object.
The present invention has following effect.
According to the present invention, because what use is interim its shape that adheres to and the roll web of the corresponding adhesive sheet of plate-shaped member on stripping film, so do not need the device that cuts along the plate-shaped member periphery.
In addition, when detecting the offset of being derived adhesive sheet,,, can improve the adhesion process efficient of adhesive sheet greatly so compare with the situation of carrying out step feed because needn't end the derivation action of roll web.
In addition, because the offset that is detected is revised, what adopt is the formation of adjusting accommodating plate-shaped parts operating position, in other words, as long as according to the error on the roll web derivation passage, with workbench just toward laterally mobile suitable amount with side-play amount, so, can do the mechanism of correction position skew very simple.
In addition, because above-mentioned coherent unit is arranged to, can carry out the derivation of adhesive sheet simultaneously or batch, the pushing of adhesive sheet and peel off the structure of operations such as adhesive sheet from stripping film, the pushing force that in the past applied on the adhesive sheet, be endowed through stripping film, can not damage the surface of adhesive sheet, can adhere to this adhesive sheet on the plate-shaped member.
Description of drawings
Fig. 1 is the integrally-built approximate vertical view of chip processing device that the expression present embodiment relates to.
Fig. 2 is the partial front elevation view that expression comprises Fig. 1 of adhering apparatus.
Fig. 3 is the approximate three-dimensional map of expression adhering apparatus.
Fig. 4 is the approximate three-dimensional map that expression adhesive roll mobile device adheres to the stage midway of adhesive sheet.
Fig. 5 is expression detects the principle of offset with testing agency a schematic diagram.
Fig. 6 is that the schematic diagram that adheres to the effect of action is simultaneously derived in expression.
Fig. 7 is that the schematic diagram that adheres to the effect of action is simultaneously batched in expression.
The explanation of Reference numeral
10 chip processing devices
15 adhering apparatus
21 adhesion workbench
24 coherent unit
51 offset correction devices
60 testing agencies
The L roll web
S1 adhesive sheet (temperature-sensitive cementability adhesive sheet)
The PS stripping film
The LS adhesive sheet
W semiconductor wafer (plate-shaped member)
Below, with reference to the description of drawings embodiments of the present invention.
In Fig. 1, the vertical view of the chip processing device that the expression present embodiment relates to.In this figure, chip processing device 10 is made the device of handling following series of processes: the adhesive sheet S1 (being designated hereinafter simply as " adhesive sheet S1 ") that is used for the temperature-sensitive cementability of chips welding is adhered to go up as the reverse side (being designated hereinafter simply as " back side of wafer W ") of the circuit face of the wafer W of plate-shaped member after, in this adhesive sheet S1 one side, (dicing tape) is contained in wafer W on the ring frame RF by dicing tape.
Above-mentioned chip processing device 10, its formation comprises: the film magazine 11 of depositing wafer W; With absorption and transport the manipulator 12 of the wafer W of taking out from this film magazine 11; With the ultraviolet irradiation unit 13 that illustrated boundary belt carries out ultraviolet irradiation of not giving to circuit face one side that sticks to above-mentioned wafer W; With the alignment device 14 that wafer W is positioned; Adhere to the adhering apparatus 15 of above-mentioned adhesive sheet S1 with the back side toward the wafer W after registration process; Be included on the wafer W that has adhered to behind the adhesive sheet S1, by dicing tape, the assembling device 18 that wafer W is installed to the adhesive tape coherent unit 16 on the ring frame RF and peels off the tape stripping unit 17 of boundary belt; With the accumulator 19 that the wafer W of having peeled off boundary belt is received and kept.
Formation or device except that above-mentioned adhering apparatus 15, be above-mentioned film magazine 11, manipulator 12, ultraviolet irradiation unit 13, alignment device 14, assembling device 18 and accumulator 19, with the 2004-133069 number application of the special hope of Japan Patent that the applicant has submitted to, be identical in fact.Therefore, below drawing up above-mentioned adhering apparatus 15 describes.
Above-mentioned adhering apparatus 15, as shown in Figures 2 and 3, its formation comprises: accept the wafer W after ultraviolet irradiation, and support the transfer workbench 20 of this wafer W; With transfer the adhesion workbench 21 of this transfer with the wafer W on the workbench 20 arranged; The absorption transfer is arrived its transfer the shifting apparatus 22 that adheres to workbench 21 with the wafer on the workbench 20; With the back side one side (upper face side), adhere to the coherent unit 24 of adhesive sheet S1 in the wafer W that is arrived adhesion usefulness workbench 21 by transfer; With the adhesive sheet S1 that adheres to by this coherent unit 24 is heated, and be used for it is bonded to bonding with workbench 26 on the wafer W fully.
Transfer is arranged to liftable with workbench 20, and between above being arranged to can and adhere to workbench 21 in the position of the wafer W of accepting preceding working procedure by mobile device 30, moves back and forth.This shift position 30 comprises: pair of guide rails 31,31; Be subjected to 31 guiding of this two guide rails, the slide plate 32 that on this guide rail 31, moves; With the lowering or hoisting gear 33 (with reference to Fig. 2) that is configured on this slide plate 32; With the ball screw axle 35 that is connected the state perforation on the nut 34 that is fixed in slide plate 32 with screw; Motor M1 (with reference to Fig. 1) with this ball screw axle 35 of rotation driving.On ball screw axle 35, the opposite side of motor M1 rotatably is supported on the bearing 36, takes this, and when motor M1 did both forward and reverse directions rotation driving, transfer can reciprocatingly move on directions X along guide rail 31,31 with workbench 20.
Above-mentioned adhesion is to be adsorption plane above a kind of the making with workbench 21; not adsorb the state of circuit face one side of wafer W by giving illustrated boundary belt; by above-mentioned coherent unit 24; be used for adhesive sheet S1 is adhered to the workbench of its back side (top), and be built-in with the calandria that is used for wafer W is heated to uniform temperature.This adheres to workbench 21, and 21B is constituted by pedestal 21A absorption workbench, and wherein pedestal 21A is supported on side-looking and roughly is on the shears 40 of L word shape, and absorption workbench 21B then can be supported on the pedestal 21A movably along the Y direction.
Above-mentioned adhesion is arranged to and can be being adorned 42 liftings by lifting with workbench 21.This lifting is adorning 42 by constituting with lower member: the nut 43 that is installed on shears 40 back sides one side; With a secondary lifting side plate 45 that is connected in shears 40 both sides; With a secondary rising guide rail 46 that guides above-mentioned lifting side plate 45 at above-below direction; With the ball screw axle 47 that connects above-mentioned nut 43 at above-below direction and extend; With lower end that is individually fixed in this ball screw axle 47 and the belt pulley 48,49 that is configured on the motor M2 output shaft nearby of rising guide rail 46 lower ends; With around the belt 50 that hangs on the above-mentioned belt pulley 48,49.Adhere to workbench 21, by following the rotation of the ball screw axle 47 that said motor M2 drives, can lifting between as shown in Figure 3 retreating position and adhesion locations as shown in Figure 4.
Shown in Fig. 2 summary,, dispose offset correction device 51 constituting adhesion with between the pedestal 21A and absorption workbench 21B of workbench 21.This offset correction device 51 is by adsorption plate 21B is constituted at the single shaft manipulator that the Y direction moves.
Above-mentioned coherent unit 24 is made of the adhesive roll mobile device 52 that is supported on the thin slice leading-out portion 54 in the plate-shaped frame F and be set up in parallel with it.That is to say that coherent unit 24 comprises with lower member: the backing roll 55 that can support for the web-like roll web L that on banded stripping film PS, is stained with banded adhesive sheet LS temporarily with deriving; With the die-cut roller 56 that comprises cutter edge 56A, wherein this die-cut roller 56 forms indentation by not giving illustrated motor rotation on adhesive sheet LS, makes its profile corresponding with the profile of wafer W, thereby forms the adhesive sheet S1 that adheres to usefulness; Be used as discarded adhesive sheet S2 with the outer circumferential side behind the formation adhesive sheet S1 and batch the recovery roller 57 of recovery; Be set up in parallel with this recovery roller 57, with the dance roller (dancer roll) 58 of guaranteeing the buffer area; Derive on the passage, with being configured in to detect the testing agency 60 of adhesive sheet S1 position by the roll web behind this dance roller 58 positions; With the adhesive roll 61 that when wafer W pushes adhesive sheet S1, adheres to; With by giving the rotation of illustrated motor, the takers-in 63 that the stripping film PS that has adhered to after the adhesive sheet S1 is batched with given tension force.
Between backing roll 55 and die-cut roller 56, dispose by not giving driven roller 65 and niproll (nip rolls) 65N and the guide roller 66 that illustrated torque motor drives.In the periphery of die-cut roller 56, face-off is disposed and is followed the platen roller (platen rolls) 68 that this die-cut roller moving 56 drives.At platen roller 68 with reclaim between the roller 57, dispose guide roller 69, by not giving driven roller 70 that illustrated torque motor drives and niproll 70N and by not giving the driven roller 71 that illustrated motor rotates.On driven roller 71, dispose pinch roll 72, give derivation power for roll web L, meanwhile, be arranged to reclaim roller 57 and always bump and be connected on this pinch roll 72, and when being arranged in frictionally and rotating this recovery roller 57, can batch and reclaim unwanted adhesive sheet S2.In addition, driven roller 65,70 is set for, on adhesive sheet LS, form in the impression, with adhesive sheet S1 do not extend, unbending mode, Yi Bian carry out twin shaft Tension Control based on two axles of Synchronization Control, Yi Bian with its derivation.
In addition, between dance roller 58 and adhesive roll 61, dispose by not giving driven roller 74 and niproll 74N, guide roller 75,76 and the idler roller 77 that illustrated torque motor drives.Further, also between adhesive roll 61 and takers-in 63, dispose guide roller 79 and by not giving driven roller 80 and the dance roller 80N that illustrated torque motor drives.In addition, driven roller 74,80 is set for, when adhesive sheet S1 is adhered to wafer W, with adhesive sheet S1 do not extend, unbending mode, Yi Bian carry out twin shaft Tension Control based on two axles of Synchronization Control, Yi Bian with its derivation.
Above-mentioned testing agency 60 is made of the face from framework the F bar-shaped support unit 82 that protrudes and the pair of sensors 83A, the 83B that are installed in the length direction two of this support unit 82.As shown in Figure 5, transducer 83A, 83B are configured in the edge derives on the equally spaced position, the reference center line CL left and right sides of direction, to detect along chord length a, the b of the adhesive sheet S1 of the line CL of reference center.At this, so-called " reference center's line ", the meaning be with adhere to workbench 21 on the corresponding pass, center of wafer W fasten, stick to the center line in the design that the center C of the adhesive sheet S1 on the stripping film PS must pass through temporarily.Therefore, when center C not under situation about passing through on the line CL of reference center, adhesive sheet S1 skew is a certain square tube mistake of (left and right directions among Fig. 5) laterally.Therefore, as shown in Figure 5, be positioned at the more inclined to one side line CL of reference center left side and when deriving in the supposition center C, adhesive sheet S1 then becomes and has been offset the so many states of S in the left side.As the detection method of this side-play amount, in the present embodiment, can adopt two kinds of methods.In more detail, for example, radius r according to 1/2 and the default adhesive sheet S1 of the detected chord length a of transducer 83A, obtain residue length on one side according to Pythagorean theorem, by relatively this length and preseting length A (distance between sensor position and the reference center's line), just can determine side-play amount S.In addition,, then detect 1/2 and the radius r of chord length b,, obtain the residue length on one side in left side, get it and above-mentioned right side of trying to achieve remains the poor of an edge lengths with above-mentioned same according to transducer 83B as other method, also can half be defined as side-play amount S with it.In addition, these side-play amounts S, calculate by the Automatic Program of not giving illustrated control device, this control device stores side-play amount S, before satisfactory adhesive sheet S1 adheres to wafer W, single shaft manipulator to above-mentioned offset correction device 51 sends instruction, adsorption plate 21B is moved the distance of a side-play amount S on the Y direction.
Above-mentioned adhesive roll mobile device 52, by constituting with lower member: with above-mentioned transfer with the parallel direction of the guide rail 31 of workbench 20, i.e. the single shaft manipulator 85 that extends of directions X; Be supported on this single shaft manipulator 85 transfer arm 86 that extends in the Y direction; With mode with anti-single shaft manipulator 85 1 ends that support this transfer arm 86, the guide rail 88 that extends at directions X; With a pair of dynamic air cylinder 89,89 up and down of being located at two places above the above-mentioned transfer arm 86; With the downside that is configured in transfer arm 86, rely on the advance and retreat of the piston rod 91 (with reference to Fig. 4) of dynamic air cylinder 89 up and down, be configured to liftable door type framework 90; With the adhesive roll 61 that is rotatably supported by this type framework 90.By 85 actions of above-mentioned single shaft manipulator, transfer arm 86 moves at directions X, makes the adhesive sheet S1 that periphery at adhesive roll 61 detours, and is adhered on being pushed to wafer W.
In the both sides of above-mentioned door type framework 90, fixing the tabular carriage 92,92 that is shaped as in the approximate vertical plane, in Fig. 2 of this carriage 92 right side about, supporting above-mentioned guide roller 76,79.In addition, around the rotary middle spindle of guide roller 76, can joltily adorn roughly be the L type shake ring 94, supporting above-mentioned idler roller 77 at the one end, and at the other end, then connecting the piston rod 97 that is fixed on the cylinder 96 above the above-mentioned transfer arm 86.Therefore, by the advance and retreat of piston rod 97, it can be that pivot rotates with the rotary middle spindle of guide roller 76 that idler roller 77 is arranged to, and takes this, and gives certain force of strain to the roll web L between guide roller 76 and the adhesive roll 61.
Above-mentioned shifting apparatus 22, its formation comprises: the tabular adsorption plate 100 that wafer W is adsorbed onto following side; With the temperature adjustment unit 101 of being located at these adsorption plate 100 upper face sides; With the supporting arm 102 that supports adsorption plate 100; With the Z axle cylinder 103 that makes adsorption plate 100 liftings; With the single shaft manipulator 105 that Z axle cylinder 103 is moved in the Y direction.Adsorption plate 100 has been parts of following effect: when having adsorbed transfer with the wafer W on the workbench 20, wafer is heated to adheres to used temperature temporarily, simultaneously the wafer W transfer is used on the workbench 21 to adhering to, after adhesive sheet S1 is adhered to this wafer W, the wafer W transfer to bonding with workbench 26, again in this bonding wafer transfer with adhesive sheet S1 bonding fully on workbench 26 to assembling device 18.At this moment, shifting apparatus 22, passing through temperature adjustment unit 101, wafer W from transfer with workbench 20, transfer is to adhering to during the workbench 21, from adhering to workbench 21 transfers to bonding with during the workbench 26, from bonding with workbench 26 transfers on any one procedure of assembling device 18, all carry out the temperature adjustment of wafer W, not needing can to realize or shorten from the later temperature of transfer wafer and adjust the time.
Above-mentioned bonding with workbench 26, by not giving illustrated framework, be configured in the sidepiece top that adheres to workbench 21.This bonding workbench 26 of using constitutes as adsorption plane with upper surface, and wafer W is by above-mentioned shifting apparatus 22, and from adhering to workbench 21 transfers, heating is stained with the wafer W of adhesive sheet S1 temporarily then, and this adhesive sheet S1 is bonded on the wafer W fully.
Above-mentioned bonding with the bonding fully wafer W of adhesive sheet S1 on the workbench 26, once more by shifting apparatus 22 by transfer to assembling device 18 1 sides.In this assembling device 18, wafer W installs on the annular frame RF by not giving illustrated dicing tape, on the circuit face of the wafer W after finishing this assembling, peels off screening glass and is stored in the accumulator 19.
Below, the adhesion action of the adhesive sheet S1 in the present embodiment is described.
Through the wafer W of ultraviolet irradiation processing and registration process, by the transfer workbench, in case be transported to the top position that adheres to workbench 21, wafer W just is attracted on the adsorption plate 100 of shifting apparatus 22.After this, transfer turns back to solid line position among Fig. 2 with workbench 20, and adheres to workbench 21, then rise among Fig. 4 with on the position shown in the solid line, thereby wafer W by transfer to adhering to on the workbench 21.
On the other hand, in coherent unit 24 1 sides, the derivation of roll web L is carried out, rely on driven roller 65,70 to carry out Tension Control on one side, successively by die-cut roller 56, on adhesive sheet LS, form impression on one side, overlook the profile of roughly rounded adhesive sheet S1 with formation.Unwanted adhesive sheet S2 by this impression produces by reclaiming roller 57, is batched recovery successively, and self-powered action roller 71 has adhered to the roll web of adhesive sheet S1 state to deriving the direction downstream side temporarily on stripping film PS, derived successively.At this, as previously mentioned, testing agency 60 detects the lateral attitude skew with respect to the line CL of adhesive sheet S1 reference center, determines this side-play amount S, stores into and does not give among the illustrated control device.
The wafer W one that side-play amount S is determined enters into adhesive systems, do not give illustrated control device, just according to the side-play amount S that stores this good adhesive sheet in advance, single shaft manipulator to offset correction device 51 sends instruction, allow adsorption plate 21B, by that amount suitable, move to the Y direction with respect to the line CL of reference center with its side-play amount.Then, on one side adhesive sheet S1 is subjected to the rotation and the pushing force effect of adhesive roll 61, Yi Bian according to adhering to Be Controlled with the relative position relation of the wafer W on the workbench 21, simultaneously, carry out Tension Control by driven roller 74,80, and, adhere to the back side of wafer W successively from deriving the direction end.In view of the above, under the state of having revised offset, adhesive sheet S1 is adhered to the back side of wafer W.In addition, the absorption workbench 21B that has moved is returned to primary position promptly at the line CL of reference center, after the center consistent location of wafer W, wafer W is consigned to adsorption plate 100.
Be attracted to the wafer W on the adsorption plate 100 of shifting apparatus 22, transfer to bonding with behind the workbench 26, by bonding fully; in addition; at assembling device 18, after the assembling of annular frame RF was carried out, the illustrated boundary belt that do not give that is adhered on the circuit face was stripped from.
Secondly, adhere to concrete effect on the wafer W with reference to Fig. 6 and 7 explanation adhesive sheet S1 by adhesive roll 61.
In the present invention, shown in Fig. 6 and 7, can adopt two kinds of adhesion modes, adhesion mode as shown in Figure 6, the so-called derivation of expression adheres to mode simultaneously, adhesion mode as shown in Figure 7, the expression what is called is batched the mode that adheres to simultaneously.
In the adhesion mode shown in Fig. 6 (A)～(D), the leading end SE of adhesive sheet S1 is exported to right-hand member consistent location (with reference to Fig. 6 (A)) among the figure with wafer W.Then, under this state, adhesive roll 61 descends by dynamic air cylinder 89 up and down, the right-hand member (with reference to Fig. 6 (B)) that leading end SE is bumped receive wafer W.Secondly, by the radially opposite side shifting of adhesive roll mobile device 52 towards wafer W, Yi Bian derive adhesive sheet S1, Yi Bian adhesive roll 61 is pressed to adhesive sheet S1 on the wafer W with its adhesion (with reference to Fig. 6 (D)).
In addition, in the adhesion mode shown in Fig. 7 (A)～(D), make 52 actions of adhesive roll mobile device, center with adhesive roll 61, place directly over the figure left end of wafer W, simultaneously, the consistent state of left end in the figure of the anti-leading end SE1 of adhesive sheet S1 and wafer W, promptly arrive till the position relative, carry out the derivation (with reference to Fig. 7 (A)) of roll web with wafer W.Under this state, adhesive roll 61 is descended, and the anti-leading end SE1 of adhesive sheet S1 is bumped the left end (with reference to Fig. 7 (B)) of receiving wafer W.Secondly, by the radially opposite side shifting of adhesive roll mobile device 52 towards wafer W, on one side can batch adhesive sheet S1, Yi Bian adhesive roll 61 can be pressed to adhesive sheet S1 on the wafer W with its adhesion (with reference to Fig. 7 ((C), D)).
Therefore, according to such execution mode, testing agency 60 can detect the offset of deriving adhesive sheet S1 in the action, so when producing this offset, can take to revise to adhere to comes corresponding with the method for workbench 21 positions, so just neither can reduce treatment effeciency, serially adhesive sheet S1 be adhered on the wafer W again.
In addition,, adhesive sheet S1 adhered to, so can prevent from directly to contact the generation that causes situations such as damage because of adhesive roll 61 because being subjected to pushing force by stripping film PS.
Though more than just implement the used the best formation of the present invention, method etc., disclosed by described record, but the present invention is not limited to this.
That is to say, the present invention has mainly done special diagram and explanation with regard to specific execution mode, but, only otherwise break away from technological thought of the present invention and purpose scope, for above-described execution mode, to its shape, position or configuration etc., as required, those skilled in the art's all changes in addition.
For example, adhering apparatus 16 in the above-mentioned execution mode though be that the device that adheres on the wafer W with the adhesive sheet S1 that the chips welding with temperature-sensitive cementability is used is that example illustrates and illustrates, also can be other thin slice, for example, the thin slice that has pressure-sensitive adhesive.In addition, also applicable to the situation that dried diaphragm (dryresist film) and thin slice of being used to form diaphragm etc. is adhered to wafer W.
In addition, in the above-described embodiment, though just the formation that adhesive sheet S1 is adhered on the wafer W is illustrated, also applicable to the structure that thin slice, adhesion of film is arrived other plate-shaped members beyond the wafer W.
Priority Applications (3)
|Application Number||Priority Date||Filing Date||Title|
|Publication Number||Publication Date|
|CN101176198A CN101176198A (en)||2008-05-07|
|CN100547752C true CN100547752C (en)||2009-10-07|
Family Applications (1)
|Application Number||Title||Priority Date||Filing Date|
|CNB2006800171352A CN100547752C (en)||2005-05-19||2006-04-24||Adhering apparatus|
Country Status (2)
|JP (1)||JP5261522B2 (en)|
|CN (1)||CN100547752C (en)|
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