JP2007019241A - Sheet peeling apparatus and peeling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet peeling apparatus preventing useless consumption of a sheet by minimizing a pitch between sheet pasting regions on a plate-like member. <P>SOLUTION: The sheet peeling apparatus pastes a bonding sheet S on the surface of a wafer W supported on the top surface of a table 13, and cuts the bonding sheet S along the external edge of the wafer W to peel off an unwanted bonding sheet S1 positioned on the outside. The peeling apparatus is provided with: a small diameter roller 70 sandwiching the bonding sheet S between itself and the wafer W; and a large diameter roller 71 sandwiching the bonding sheet S between itself and the small diameter roller 70. These rollers 70, 71 move along the table 13, thereby peeling off the unwanted bonding sheet S1. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a sheet peeling apparatus and a peeling method, and more particularly, a sheet peeling apparatus and a peeling method for peeling a sheet region located outside a plate-like member after a sheet is attached to the plate-like member such as a semiconductor wafer. About.

  Conventionally, a protective sheet for protecting the circuit surface of a semiconductor wafer (hereinafter simply referred to as “wafer”) has been attached, or an adhesive sheet for die bonding has been attached to the back surface. It has been broken.

  As a method for sticking such a sheet, using a raw material in which a belt-like adhesive sheet is temporarily attached to a belt-like release sheet, the adhesive sheet is peeled off from the release sheet and attached to the wafer, and then along the outer periphery of the wafer. A method of cutting and then peeling off the adhesive sheet region outside the wafer as an unnecessary adhesive sheet is known (see, for example, Patent Document 1).

  As shown in FIGS. 6A to 6D, the sheet peeling apparatus described in Patent Document 1 is theoretically applied to the upper surface of the wafer W while the wafer W is supported on the upper surface of the table 100. The adhesive sheet S is affixed, and a closed loop-shaped cut line is formed in the adhesive sheet S along the outer edge of the wafer W by the cutter 101. Thereafter, the rollers 103 and 104 are moved from the position shown in FIG. By moving to the position shown in C), the unnecessary adhesive sheet S1 outside the wafer W can be peeled off.

JP 2004-47976 A

  However, in such sheet peeling, at least the rollers 103 and 104 are used when peeling the unnecessary adhesive sheet S1 and feeding the adhesive sheet S corresponding to the region to be attached to the next wafer W. It must be premised that the nip portion of the head is advanced until it reaches a position beyond the left end position E. This is because when the adhesive sheet S having a length corresponding to the region to be attached to the next wafer W is fed out unless the adhesive sheet S passes through the closed loop-shaped region of the cutter 101, the adhesive sheet S is fed out. This is because the tension is generated by pulling.

  Therefore, at least the length L from the left end E to the left end of the roller 103 must be a margin located on the lead end side with respect to the adhesive sheet region to be attached to the next wafer W. Accordingly, the diameter of the roller 103 is an important factor in minimizing the margin and avoiding wasteful consumption of the adhesive sheet.

  Further, when the diameter of the roller 103 is large, as shown in FIG. 6D, the peeling angle θ1 tends to be small and the peeling resistance is increased, which makes it easier to generate a tensile line. Inconvenience.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and an object of the present invention is to reduce the wasteful consumption of sheets by minimizing the pitch between sheet application areas on the plate-like member. It is to provide a peeling apparatus.

  Another object of the present invention is to provide a sheet peeling apparatus capable of smoothly performing peeling when peeling a sheet region outside a plate-like member, thereby eliminating the generation of tensile lines.

In order to achieve the above object, the present invention attaches a sheet to a plate-like member supported on the upper surface of a table, and cuts the sheet along the outer edge of the plate-like member and positions the sheet outside the plate-like member In the sheet peeling apparatus for peeling the sheet area to be
A first roller disposed so as to sandwich the sheet between the plate member and a second roller that nips the sheet between the first roller and winds up the sheet region;
The first roller is configured to have a smaller diameter than the second roller.

In the present invention, the sheet to be affixed to the plate-like member is an adhesive sheet peeled off from the release sheet via a peel plate,
The first roller is provided so as to be positioned at a substantially leading end of the peel plate when the peeling of the sheet region positioned outside the plate-like member is completed.

  The second roller is configured to complement the rigidity of the first roller.

Furthermore, the present invention provides a sheet peeling method in which a sheet attached to a plate-like member on a table is cut along an outer edge of the plate-like member to peel a sheet region located outside the plate-like member.
Using a first roller that sandwiches the sheet between the plate-like member and a second roller having a larger diameter than the first roller that nips the sheet between the first roller,
The first roller is rotated along the table surface to peel off the sheet, while the peeled sheet is wound up by the second roller.

  According to the present invention, since the first roller is provided with a smaller diameter than the second roller, the margin between the sheet regions to be attached to each plate member can be set as short as possible. It is possible to suppress wasteful consumption of sheets.

  Further, when the peeling by the first roller is completed, the recess mark formed in the adhesive layer of the sheet by the tip of the peel plate is positioned in the margin region by being positioned at the substantially tip of the peel plate. In other words, there is no possibility that a recess mark is included in the pasting region of the plate-like member.

  Further, since the second roller complements the rigidity of the first roller, even if the diameter of the first roller is set extremely small, peeling can be realized without causing any inconvenience.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a schematic front view of a sheet sticking apparatus according to the present embodiment, and FIG. 2 shows a schematic perspective view thereof. In these drawings, a sheet sticking apparatus 10 includes a sheet feeding unit 12 disposed on an upper portion of a base 11, a table 13 for supporting a wafer W as a plate member, and an adhesive sheet fed to the upper surface side of the wafer W. A pressing roller 14 that applies a pressing force to S and attaches it to the wafer W; a cutter 15 that attaches the adhesive sheet S to the wafer W and then cuts the adhesive sheet S along the outer edge of the wafer W; The peeling device 16 for peeling the unnecessary adhesive sheet S1 from the upper surface of the table 13 and a winding device 17 for winding the unnecessary adhesive sheet S1 are provided.

  The sheet feeding unit 12 includes a support roller 20 that supports a roll-shaped original fabric L in which a strip-shaped adhesive sheet S is temporarily attached to one surface of a strip-shaped release sheet PS, and an original fed from the support roller 20. The peel plate 22 that peels the adhesive sheet S from the release sheet PS by rapidly reversing the anti-L, the recovery roller 23 that winds and recovers the release sheet PS, and the support roller 20 and the recovery roller 23 are disposed. A plurality of guide rollers 25-31, a buffer roller 33 disposed between the guide rollers 25, 26, a tension measuring means 35 disposed between the guide rollers 27, 28, a peel plate 22, and guide rollers 27, 28. 29 and a sticking angle maintaining means 37 for integrally supporting the tension measuring means 35. The guide rollers 27 and 29 are provided with brake shoes 32 and 42. The brake shoes 32 and 42 are guided by the cylinders 38 and 48 when the adhesive sheet S is attached to the wafer W, respectively. By advancing and retreating with respect to the rollers 27 and 29, the adhesive sheet S is sandwiched and its feeding is suppressed.

  The tension measuring means 35 includes a load cell 39 and a tension measuring roller 40 supported on the load cell and positioned on the base side of the peel plate 22. The tension measuring roller 40 is configured to transmit the tension to the load cell 39 by being pulled by the tension of the adhesive sheet S that is sandwiched between the guide roller 27 and the brake shoe 32 and fed between the pressing roller 14. Has been. Then, the load cell 39 measures the tension of the adhesive sheet S when the feeding head 49 described later is displaced obliquely downward in FIG. Is to be kept constant.

  The sticking angle maintaining means 37 is configured to interact with the pressing roller 14 to keep the sticking angle θ of the adhesive sheet S to the wafer W constant. The sticking angle maintaining means 37 includes guide rollers 27, 28, 29, a load cell 39, a tension measuring roller 40, brake shoes 32, 42, cylinders 38, 48, a peel plate 22, and a pair of slide plates 43, 43 that support them. The feeding head 49 is configured to include a pair of guide rails 45 and 45 that guide the feeding head 49 up and down, and a pair of single-axis robots 46 and 46 that apply lifting force to the feeding head 49. Yes. The guide rail 45 and the single-axis robot 46 are arranged in an inclined posture, and the feeding head 49 can be moved up and down along this inclined angle. The peel plate 22 is supported by a cylinder 50 disposed inside the slide plate 43 and is provided so as to be able to advance and retreat in the X direction in FIG. The tip position can be adjusted.

  As shown in FIG. 3, the table 13 includes an outer table 51 having a substantially square shape in a plan view and an inner table 52 having a substantially circular shape in a plan view. The outer table 51 is provided in a concave shape that can receive the inner table 52, and can be moved up and down with respect to the base 11 via a single-axis robot 54. On the other hand, the inner table 52 is provided so as to be movable up and down with respect to the outer table 51 via a single-axis robot 56. Therefore, the outer table 51 and the inner table 52 can be moved up and down integrally, and can be moved up and down independently of each other, and thereby a predetermined height is set according to the thickness of the adhesive sheet S and the thickness of the wafer W. It can be adjusted to the position.

  The pressing roller 14 is supported via a portal frame 57. Cylinders 59, 59 are provided on the upper surface side of the portal frame 57, and the pressing roller 14 is provided so as to be moved up and down by the operation of the cylinder 59. As shown in FIG. 2, the portal frame 57 is provided so as to be movable in the X direction in FIG. 1 via a single-axis robot 60 and a guide rail 61.

  The cutter 15 is provided at a position above the table 13 so as to be lifted and lowered via a lifting device (not shown). The cutter 15 includes a rotation arm 66 fixed to the rotation center shaft 65 and a cutter blade 67 supported by the rotation arm 66. By rotating the cutter blade 67 around the rotation center shaft 65, The adhesive sheet S can be cut along the outer edge of the wafer W.

  As shown in FIGS. 1, 4, and 5, the peeling device 16 includes a small-diameter roller 70 as a first roller and a large-diameter roller 71 as a second roller. The small diameter roller 70 and the large diameter roller 71 are supported by the moving frame F. The moving frame F includes a front frame F1 that is relatively arranged along the Y direction in FIG. 2 and a rear frame F2 that is connected to the front frame F1 through a connecting member 73. While being supported by the single-axis robot 75, the front frame F1 is supported by the guide rail 61, whereby the moving frame F is movable in the X direction in FIG. As shown in FIG. 1, the large diameter roller 71 is supported by an arm member 74, and the arm member 74 is displaced by a cylinder 78 in a direction in which the large diameter roller 71 is separated from and approaches the small diameter roller 70. It is possible.

  The winding device 17 is supported on the driving roller 80 supported by the moving frame F and the free end side of the rotating arm 84, and contacts the outer peripheral surface of the driving roller 80 via a spring 85 to nip the unnecessary adhesive sheet S1. And a take-up roller 81. A drive motor M is disposed at the shaft end of the drive roller 80. When the motor M is driven, the drive roller 80 rotates, and the take-up roller 81 rotates following this, whereby the unnecessary adhesive sheet S1 is wound. It has come to be taken. The winding roller 81 rotates to the right in FIG. 1 against the force of the spring 85 as the winding amount increases.

  Next, a method for applying the adhesive sheet S in the present embodiment will be described with reference to FIGS. 4 and 5 as well.

  In the initial setting, the original fabric L fed from the support roller 20 is peeled off from the release sheet PS at the tip position of the peel plate 22, and the lead end of the release sheet PS passes through the guide rollers 28 and 29. Fixed to the collection roller 23. On the other hand, the lead end of the adhesive sheet S is fixed to the winding roller 81 of the winding device 17 via the pressing roller 14 and the peeling device 16. At this time, the peel plate 22 constituting the tip of the feeding head 49 is at the highest position (see FIGS. 1 and 4A), and the adhesive sheet S between the peel plate 22 and the pressing roller 14 is As shown in FIG. 1, it is set to have a predetermined sticking angle θ with respect to the surface of the wafer W arranged on the table 13. In the peel plate 22, the length of the adhesive sheet S between the peel plate 22 and the pressing roller 14 is slightly longer than the length from one end of the wafer W to the other end, that is, from the right end to the left end in FIG. Thus, the position of the tip is adjusted via the cylinder 50.

The pasting operation is started with the wafer W set on the table 13 via a transfer arm (not shown). Prior to the sticking operation, the brake shoes 32 and 42 are brought into contact with the guide rollers 27 and 29 so that the feeding of the adhesive sheet S is suppressed. Then, while the table 13 is stationary, the pressing roller 14 moves on the wafer W to the left in FIG. 4 while rotating. As the pressing roller moves, tension is applied to the adhesive sheet S, and the tension measuring roller 40 is pulled in the X direction. Therefore, the load cell 39 measures the tension, and the feeding head 49 is lowered obliquely downward using the sticking angle maintaining means 37 in order to maintain the predetermined tension. That is, the load cell 39 is controlled to measure the tension and issue a command to the pair of single-axis robots 46 so as to obtain a predetermined tension based on the data.
Accordingly, as a result, the feeding head 49 gradually descends along the inclination angle of the guide 45 and the single-axis robot 46 (see FIG. 1), whereby the adhesion between the tip of the peel plate 22 and the pressing roller 14 is achieved. Even if the length of the sheet S is shortened, the sticking angle θ is always kept constant.

  In the present embodiment, the feeding head 49 is lowered while measuring the tension of the adhesive sheet S by the load cell 39 while the pressing roller 14 performs the sticking operation as described above, so that the sticking angle θ is maintained as a result. However, the lowering control of the feeding head 49 can omit the load cell 39. That is, as shown in FIG. 4A, the position of the lowest point of the pressing roller 14 and the initial tip position when the peel plate 22 is pasted are P1 and P2, respectively, and the adhesive sheet S is pasted. When the tip position of the peel plate is P3 and the sticking angle of the angles P2, P1, P3 is θ, the peel roller 22 moves as the distance between the points P1, P3 decreases as the pressing roller 14 moves by the single-axis robot 60. The feeding head 49 constituting the sticking angle maintaining means 37 is lowered along the guide bar 45 so that the distance between the points P2 and P3 is also shortened, so that the sticking angle θ is always maintained. The robots 46 and 60 can also be controlled synchronously. Note that the amount of movement of the feeding head 49 can be easily derived by a trigonometric function. Thus, by maintaining the sticking angle θ constant based on the detection of the movement distance of the pressing roller 14, the same action and effect as the tension control using the load cell 39 can be produced. These controls can be selectively employed.

  As shown in FIGS. 4D and 4E, when the application of the adhesive sheet S is completed, the cutter 15 descends to cut the adhesive sheet S along the outer peripheral edge of the wafer W, and then the cutter 15 Rises and returns to the initial position (see FIG. 1). At this time, the tip of the peel plate 22 is located in the vicinity of the left end of the wafer W, whereby the adhesive sheet region existing on the left side from the tip position of the peel plate 22 can be used as a region to be bonded to the next wafer W. The adhesive sheet S is not wasted.

  Next, when the wafer W is removed from the table 13 via the transfer device, as shown in FIG. 5, the pressing roller 14 is raised, and the small-diameter roller 70 and the large-diameter roller 71 constituting the peeling device 16 are moved to the left side. While moving, the driving roller 80 of the winding device 17 is driven to wind up the unnecessary adhesive sheet S1, so that the unnecessary adhesive sheet S1 around the wafer W can be peeled off from the upper surface of the table 13. In a state where the unnecessary adhesive sheet S <b> 1 is completely peeled from the table 13, the small-diameter roller 70 is positioned substantially at the tip of the peel plate 22.

  Then, the brake shoes 32 and 42 are separated from the guide rollers 27 and 29 so that the original fabric L can be fed out, and the peeling device 16 and the winding device 17 are returned to the initial positions while the driving roller 80 is locked. As a result, a new adhesive sheet S is pulled out and a new wafer W is transferred onto the table 13 again.

Therefore, according to such an embodiment, since the peeling device is configured using the small-diameter roller 70, it is possible to set a small interval, that is, a margin in each region of the adhesive sheet S to be attached to the wafer W. Thus, an effect that wasteful consumption of the adhesive sheet S can be suppressed is obtained.
Further, as the small diameter roller 70 is made smaller, the above-described effect is manifested, and the peeling angle is increased, so that the sheet peeling can be made smoother, and the generation of tension lines can be suppressed.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, although the case where the plate-like member is a wafer has been described in the above embodiment, the present invention can also be applied to a configuration in which a sheet or film is attached to a plate-like member other than the wafer.

The schematic front view of the sheet sticking apparatus which concerns on this embodiment. The schematic perspective view of the said sheet sticking apparatus. The schematic sectional drawing of a table. Explanatory drawing of adhesion operation of an adhesive sheet. Explanatory drawing of peeling operation | movement of the unnecessary adhesive sheet by a peeling apparatus. (A) is the schematic front view which shows the state before peeling in the conventional peeling apparatus, (B) is the top view, (C) is the schematic plan view which shows the state at the time of peeling completion, (D) is the front of (C) Figure.

Explanation of symbols

10 Sheet Pasting Device 13 Table 22 Peel Plate 70 Small Diameter Roller (First Roller)
71 Large diameter roller (second roller)
L Original fabric PS Release sheet S Adhesive sheet S1 Unnecessary adhesive sheet W Wafer (plate-like member)

Claims (4)

In the sheet peeling apparatus for sticking the sheet to the plate-like member supported on the upper surface of the table, cutting the sheet along the outer edge of the plate-like member, and peeling the sheet region located outside the plate-like member,
A first roller disposed so as to sandwich the sheet between the plate member and a second roller that nips the sheet between the first roller and winds up the sheet region;
The sheet peeling apparatus according to claim 1, wherein the first roller is provided with a smaller diameter than the second roller. The sheet attached to the plate-like member is an adhesive sheet peeled from the release sheet via a peel plate,
2. The sheet peeling apparatus according to claim 1, wherein the first roller is positioned at a substantially leading end of the peel plate when peeling of a sheet region located outside the plate-like member is completed. The sheet peeling apparatus according to claim 1, wherein the second roller complements the rigidity of the first roller. In the sheet peeling method of cutting the sheet affixed to the plate-like member on the table along the outer edge of the plate-like member and peeling the sheet region located outside the plate-like member,
Using a first roller that sandwiches the sheet between the plate-like member and a second roller having a larger diameter than the first roller that nips the sheet between the first roller,
A sheet peeling method, comprising: rotating a first roller along the table surface to peel a sheet; and rolling up the peeled sheet with the second roller.

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