JP2009010124A - Apparatus for mounting electronic component and method of manufacturing electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent dislocation during pressure-bonding and establish appropriate processing. <P>SOLUTION: The apparatus 100 for mounting electronic components is provided with: a pressure-bonding unit 5 that works on a substrate P wherein an electronic component H is mounted, at the specified heating temperature and pressure by means of a bonding material S and pressure-bonds the electronic component H to the substrate P; and correction means 35, 36, 37 that detect a change in position of the electronic component H to the substrate P in a direction crossing the working direction of pressing during heating and pressing and correct the relative position between the substrate P and the electronic component H. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component manufacturing method for mounting an electronic component such as a semiconductor chip or a flexible printed circuit board on a glass or resin substrate, for example.

  For example, a substrate constituting a liquid crystal display panel is composed of two glass plates in which electrodes are provided on each joint surface and a liquid crystal material is interposed, and two polarizing plates bonded to the front and back surfaces of these glass plates. Become. One glass plate and the two polarizing plates have substantially the same area and shape, and the edges of each side are aligned at the same position. Only the other glass plate protrudes at one end, and the electrode is exposed at the protruding portion. This projecting portion becomes a mounting portion on which the electronic component is mounted.

  A substrate is supplied to the electronic component mounting apparatus in the above-described state, and an electronic component such as a semiconductor chip or a flexible printed circuit board is mounted on an electrode portion exposed on one glass plate. A schematic configuration of the mounting apparatus includes a bonding material pasting unit for bonding a bonding material to a predetermined portion of a substrate, a temporary pressure bonding unit for temporarily pressing an electronic component (for example, a semiconductor chip) to the substrate via the bonding material, and a temporary pressure bonding. The semiconductor chip is further heated and pressurized at high temperature and high pressure to provide a main pressure bonding unit for electrically connecting bumps (electrodes) of the semiconductor chip and electrodes of the substrate.

The bonding material is made of a tape-like base material to which an adhesive is applied, and for example, an anisotropic conductive film (ACF) is used. This anisotropic conductive film is a polymer film having electrical anisotropy having conductivity in the thickness direction of the film and insulation in the surface direction by thermocompression bonding, and in an adhesive binder Conductive particles are mixed. As shown in FIGS. 24 and 25, when the main pressure bonding is performed, the tool is moved and the substrate is heated and pressurized to reduce the viscosity of the bonding material and melt the electronic component. The electrode of the semiconductor chip and the electrode of the substrate are connected by the conductive particles in the bonding material. In this type of mounting apparatus, since high accuracy is required, for example, there is an apparatus that detects the position of the substrate and adjusts the position and height of the processing stage before each processing (see, for example, Patent Document 1). .
JP 2006-165392 A

  However, the above technique has the following problems. That is, in the bonding material in which the conductive particles having the above configuration are mixed, when the bonding material is heated and pressurized during the pressure bonding and the adhesive binder is melted, spherical particles are formed between the substrate and the electronic component. Since it is interposed, the electronic component is easily moved with respect to the substrate. Therefore, when the heating tool has a low rigidity or the heating tool position and the pressing direction are slightly inclined, the pressing tool is bent and deformed during the crimping process as shown in FIG. In some cases, misalignment may occur between the semiconductor chip and the pressing tool and the substrate in a direction different from the pressing direction. For this reason, even if the positions of the stage and the tool are adjusted before various processes, it is difficult to ensure accuracy because a positional shift occurs during the subsequent crimping process.

  The present invention has been made paying attention to the above circumstances, and its object is to prevent misalignment during the crimping process and enable appropriate processing.

  An electronic component mounting apparatus according to an aspect of the present invention is an electronic component mounting apparatus for mounting an electronic component on a substrate, and the electronic component mounting device is mounted on the substrate on which the electronic component is placed via a bonding material. A main pressure-bonding unit that operates with a heating temperature and a pressurizing force to press-bond the electronic component to the substrate, and the substrate in a direction that intersects the direction of the pressure during the heating and pressurizing process. Correction means for detecting a displacement of the electronic component relative to the substrate and correcting a relative position between the substrate and the electronic component.

  In the electronic component mounting apparatus according to one aspect of the present invention, the main crimping unit includes a main crimping stage that supports the substrate, and an electronic component among the substrates of the substrate that is disposed in proximity to the main crimping stage. A main pressure bonding backup stage that supports a mounting part to be mounted, and a main pressure bonding tool configured to be movable and to operate with a predetermined heating temperature and pressure against the main pressure bonding backup stage, and the correction unit includes: The relative position is adjusted by adjusting the position of the main crimping tool.

  According to one aspect of the present invention, there is provided a method for manufacturing an electronic component, wherein the electronic component is applied to a substrate on which the electronic component is placed via a bonding material with a predetermined heating temperature and pressure. During the step of crimping and the step of final crimping, the displacement of the electronic component relative to the substrate in a direction crossing the direction of pressure application is detected, and the relative position between the substrate and the electronic component is corrected. And a step of performing.

  According to the present invention, it is possible to prevent misalignment during the crimping process and to perform appropriate processing.

[First Embodiment]
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In each figure, the configuration is schematically shown by appropriately enlarging, reducing, or omitting it. In the figure, arrows X, Y, and Z indicate three orthogonal directions. FIG. 1 is an overall perspective view showing a schematic configuration of an electronic component mounting apparatus according to the present invention, and FIG. 2 is an external view showing the back side of the mounting apparatus 100. The electronic component mounting apparatus 100 includes a base 1, a position correction unit (hereinafter referred to as a pre-alignment unit) 2, a joint extending from one end (left end in the drawing) to the right end on the base 1. The material pasting unit 3, the provisional pressure bonding unit 4, the main pressure bonding unit 5 and the discharge unit 6 are sequentially arranged at a predetermined interval. A chip supply unit (electronic component supply unit) 7 is disposed on the back side of the temporary pressure bonding unit 4, and the temporary pressure bonding unit 4 and the chip supply unit 7 are aligned in the Y direction.

  A first transport mechanism 8A is interposed between the pre-alignment unit 2 and the bonding material pasting unit 3, and a second transport mechanism 8B is disposed between the bonding material pasting unit 3 and the temporary pressure bonding unit 4. It is installed. A third transport mechanism 8C is interposed between the temporary pressure bonding unit 4 and the main pressure bonding unit 5, and a fourth transport mechanism 8D is interposed between the main pressure bonding unit 5 and the discharge unit 6. Established.

  The first to fourth transport mechanisms 8A to 8D transport the substrate between two points at predetermined reference positions of stages to be described later in the units 2 to 6, respectively. That is, each of the transport mechanisms 8A to 8D receives the substrate P at a predetermined reference position on the stage of the unit on the left side of the figure and transports it in the X direction, and is predetermined on the stage of the unit on the right side of the figure. It acts to deliver the substrate to the reference position.

  3 to 6 are diagrams for sequentially explaining the process of mounting the electronic component H on the substrate P. Here, the configuration of the substrate P will be described with reference to FIG.

  The substrate P supplied from the upstream apparatus to the pre-alignment unit 2 of the mounting apparatus 100 includes two glass plates a1 and a2 that are formed in a rectangular shape in plan view, and polarized light that is bonded to the front and back surfaces of these glass plates. It is comprised from board b1, b2. An electrode (not shown) is formed between the glass plates a1 and a2, and a liquid crystal material is interposed.

  The edges of the three sides of the glass plates a1 and a2 and the polarizing plates b1 and b2 are the same, but only one side of the one glass plate a2 has the other glass plate a1 and the polarizing plates b1 and b2. It protrudes from the edge. An electrode is formed on one surface (here, the upper surface) of the protruding portion of the glass plate a2, and the bonding material S is attached to the electrode portion as described later, and the electronic component H is mounted via the bonding material S. That is, this protrusion becomes a processing target part.

  The bonding material S shown in FIG. 4 is made of a tape-like base material to which an adhesive is applied, and for example, an anisotropic conductive film (ACF) is used as the adhesive. This anisotropic conductive film is a connecting material having three functional characteristics of adhesion, conductivity, and insulation. An anisotropic conductive film is a polymer film with electrical anisotropy that is conductive in the thickness direction of the film and insulative in the surface direction by thermocompression bonding, and conductive particles are mixed in an adhesive binder. is doing.

  A semiconductor chip is applied as the electronic component H shown in FIG. In addition, as an electronic component, the following forms are applicable similarly, for example with respect to a flexible substrate etc.

  The semiconductor chip H is accommodated in a chip tray (not shown) in a state where bumps which are connection surfaces to the substrate P are provided on the upper surface. Depending on the type of product to be produced, the bumps may be accommodated in the chip tray with the bottom surface provided.

  The pre-alignment unit 2 shown in FIGS. 7 and 8 includes a first stage 10 that supports a substrate P supplied from an upstream device (not shown) as described later, and a recognition camera 11 that images the substrate P on the first stage 10. And a laser displacement meter (height measuring means) 12 for measuring the height (distance) from the reference position to the substrate P on the stage 10 and the first stage 10 are movable in the XY and Z directions, And a drive mechanism 13 that is movable in a rotation direction (θ direction) in a horizontal plane.

  The recognition camera 11 and an image capturing device provided in a control device (not shown) that captures and recognizes a captured image signal of the recognition camera 11 and a recognition signal from the image capturing device are driven and controlled in a predetermined direction. The drive mechanism 13 constitutes a position correction mechanism (position correction means) G.

  Note that, as a substitute for the laser displacement meter 12, various types such as a non-contact optical sensor having an autofocus function, an optical sensor using infrared rays, or a mechanical contact sensor can be used. .

  As shown in FIGS. 1 and 9, the bonding material pasting unit 3 includes two sets of pasting stages 15, two sets of pasting backup stages 16, and two sets of pasting tools 17 arranged in parallel along the X direction. And two sets of bonding material supply mechanisms 18.

  The pasting stage 15 sucks and fixes the substrate P and is movable in the X direction, the Y direction, and the Z direction.

  The pasting backup stage 16 is provided on the pasting stage 15 and moves together with the pasting stage 15 in the Y direction. When the substrate P is placed on the pasting stage 15, the protruding portion of the substrate P is disposed on the pasting backup stage 16.

  The affixing tool 17 shown in FIG. 5 is provided immediately above the affixing backup stage 16 and is supported so as to be movable up and down in the Z direction so as to act on the affixing backup stage 16 with a predetermined heating temperature and pressure. The bonding material supply mechanism 18 supplies the tape-shaped bonding material S wound around the reel between the pasting backup stage 16 and the pasting tool 17.

  The temporary crimping unit 4 shown in FIGS. 1 and 2 includes a single temporary crimping stage 20, a backup stage 21 disposed at a position very close to the temporary crimping stage 20, and a temporary crimping tool 22. .

  A temporary press-bonding stage 20 shown in FIG. 1 includes a drive mechanism that holds the substrate P by suction and is movable in the X direction, the Y direction, and the Z direction, and is movable in the rotational direction (θ direction) in a horizontal plane. Yes. The backup stage 21 is provided at a position very close to the provisional pressure-bonding stage 20, and is fixedly provided without moving in any direction.

  The temporary crimping tool 22 is provided immediately above the backup stage 21, is movable in the X direction, the Y direction, and the θ direction, and acts on the backup stage 21 with a predetermined heating temperature and pressure. Thus, it is supported so as to be movable up and down in the Z direction.

  As shown in FIG. 10, the chip supply unit 7 includes a chip reversing mechanism 24, a chip stage 25, and a chip transport mechanism 26. The chip reversing mechanism 24 receives a semiconductor chip H having a bump provided on the upper surface from a chip supply means (not shown) and sucks the semiconductor chip H, and rotates the suction part 27 180 degrees to move the semiconductor chip H up and down ( A half-rotation mechanism 28 that changes to a reverse orientation and a lifting mechanism 29 that drives the half-rotation mechanism 28 up and down together with the suction portion 27. The chip stage 25 receives and supports the semiconductor chip H from the chip reversing mechanism 24. The chip transport mechanism 26 transports the chip stage 25 to the temporary crimping unit 4 in the Y direction, and transports the semiconductor chip H supported by the chip stage 25 to a position facing the temporary crimping tool 22. Yes.

  Note that the chip stage 25 and the chip transport mechanism 26 not only receive the semiconductor chip H via the chip reversing mechanism 24 but also directly receive the semiconductor chip H or other electronic components by omitting the chip reversing mechanism 24. It can be conveyed to the temporary crimping unit 4.

  As shown in FIGS. 1, 11, and 12, the main crimping unit 5 is arranged in parallel along the X direction. Here, three sets of main crimping stages 30 and the main crimping stage 30 are in close proximity. The backup stage 31 arranged at the position, the three sets of main crimping tools 32 provided opposite to the backup stage 31, the protective tape supply mechanism 33 for supplying the protective tape T, and the displacement of the substrate P are detected. A non-contact displacement meter 35 as detection means, a movable mechanism 36 for attaching the main crimping tool 32 movably in the X direction, and a controller 37 for controlling the operation of the movable mechanism 36 according to the detection result are provided. The non-contact displacement meter 35, the movable mechanism 36, and the control unit 37 constitute correction means.

  The main pressure bonding stage 30 adsorbs and fixes the substrate P and is movable in the X direction, the Y direction, and the Z direction. The backup stage 31 is provided at a position very close to the main crimping stage 30, and is fixedly provided without moving in any direction.

  The main crimping tool 32 is provided immediately above the backup stage 31 and is moved in the Z direction and the X direction via the movable mechanism 36 so as to act on the backup stage 31 with a predetermined heating temperature and pressure. It is supported movably.

  In the protective tape supply mechanism 33, the protective tape T fed from the supply reel 34 is interposed between the main crimping tool 32 and the semiconductor chip H when the main crimping tool 32 acts on the semiconductor chip H.

  The non-contact displacement meter 35 is, for example, a displacement of the end face of the semiconductor chip H as a change in the relative positional relationship between the substrate P and the main crimping tool 32 when the bonding material S is melted by heating and pressing in the final crimping step. For example, it has a function of detecting the quantity and displacement direction in units of 1 micron.

  The movable mechanism 36 is configured to be movable under the control of the control unit 37 and has a function of moving the main crimping tool attached along with the movement.

  The control unit 37 performs predetermined calculation processing based on information such as the displacement amount of the end face of the semiconductor chip H detected by the non-contact displacement meter 35 and the predetermined displacement direction, and determines the moving distance and moving direction of the main crimping tool 32. It has a function of driving the movable mechanism 36 by calculating and outputting a control signal according to the calculation result.

  The discharge unit 6 shown in FIG. 1 includes a discharge stage 50 that receives the substrate P on which the semiconductor chip H delivered from the main pressure bonding unit 5 is mounted. The discharge stage 50 moves along the X direction to a delivery position with a downstream device (not shown), and can deliver the substrate P to the downstream device.

  In the electronic component mounting apparatus 100 configured as described above, the substrate P is supplied from the upstream apparatus to the pre-alignment unit 2. In the pre-alignment unit 2, a position correction process for the substrate P is performed. Next, in the bonding material pasting unit 3, a bonding material pasting step is performed in which the bonding material S is pasted on the protruding portion of the glass plate a2. In the temporary pressure bonding unit 4, a temporary pressure bonding process is performed in which the semiconductor chip H that is an electronic component is positioned and temporarily pressure bonded to the bonding material S bonded to the substrate P. Next, in the main pressure bonding unit 5, a main pressure bonding process is performed in which the semiconductor chip H is pressure bonded to the substrate P and mounted. Then, the board | substrate P is carried out from the discharge unit 6 to a downstream apparatus.

  The electronic component mounting apparatus 100 includes one set of pre-alignment unit 2, two sets of bonding material pasting unit 3, one set of temporary crimping unit 4, three sets of final crimping unit 5, and one set of discharge unit 6. It becomes the composition of. This is because the time required for the temporary pressure bonding process in the temporary pressure bonding unit 4 is set as a reference.

  That is, when the temporary pressure bonding process takes 5 seconds, two sets of bonding material application units 3 are provided to perform the bonding material application process that takes 10 seconds in two places, and the main pressure bonding process that requires 15 seconds is required. By providing three sets of the main pressure bonding units 5 to perform in one place, the optimum tact time can be reduced to 5 seconds, and the productivity is increased.

  Hereinafter, the operation of the electronic component mounting apparatus 100 will be described in detail with reference to FIG.

  The substrate P is supplied from the upstream device to the first stage 10 of the pre-alignment unit 2, and here, the position correction mechanism G corrects the positional deviation of the substrate P when it is delivered from the upstream device.

  That is, the substrate P is placed on the first stage 10 of the pre-alignment unit 2 from the upstream apparatus, and a suction mechanism provided on the stage is activated at a timing, and the substrate P is vacuum-sucked and fixed on the upper surface of the stage 10. In this state, the edge of the glass plate a1 and the two polarizing plates b1 and b2 constituting the substrate P without the protruding portion are substantially aligned with the leading edge of the stage 10, and the protruding portion of one glass plate a2 is the stage 10 Projects from the edge.

  At this time, the pre-alignment unit 2 detects a positional deviation of the substrate P when the substrate P is delivered from the upstream apparatus, and the substrate P is set to a preset reference position in the first stage 10 according to the positional deviation. Correct the position.

  By correcting the position of the substrate P to a preset reference position in the first stage 10, the first transport mechanism 8A receives the substrate P from the reference position, and the stage 15 in the adjoining bonding material pasting unit 4 provided in advance is received in advance. The substrate P can be delivered to the set reference position. As described above, each of the first transport mechanism 8A to the fourth transport mechanism 8D includes the substrate P between two points at predetermined reference positions of the stages 15, 20, 30, and 50 in the units 2 to 6, respectively. Is supposed to be transported.

  When the position correction and height position control with respect to the substrate P is completed in the pre-alignment unit 2, the first transport mechanism 8A is driven to the delivery position of the substrate P that has been positioned and corrected to the transport reference position of the first stage 10. And move.

  FIGS. 13 to 15 are diagrams for sequentially explaining the operation of the first transport mechanism 8 </ b> A delivering the substrate P from the stage 10 of the pre-alignment unit 2.

  As shown in FIG. 13, the stage 10 of the pre-alignment unit 2 is located immediately below the first transport unit 8 </ b> A while the substrate P is vacuum-sucked. The first transport unit 8A has an inverted L-shaped cross section, and is provided with a magnet portion 42 constituting a linear motor at the base end portion and supported by a linear guide 43. In addition, a suction path 44 communicating with an external vacuum source (not shown) is provided in the horizontal piece portion of the transport unit 8A, and the suction path 44 is opened on the lower surface of the horizontal piece portion.

  As shown in FIG. 14, the stage 10 is driven up and stopped at a predetermined position. An external vacuum source is driven in a state where the substrate P and the first transport mechanism 8A are in contact with each other, and the substrate P is vacuum-sucked by the first transport mechanism 8A.

  Next, as shown in FIG. 15, the step of transferring the substrate P to the first transport mechanism 8A by releasing the vacuum suction action on the stage 10 of the pre-alignment unit 2 and driving the stage 10 downward. Complete. In the first transport mechanism 8A, the linear motor mechanism operates to move the first transport mechanism 8A in the X direction while the substrate P is vacuum-sucked, and a reference set in advance on the pasting stage 15 of the bonding material pasting unit 3 Stops against the position of.

  In this way, the first transport mechanism 8A transports the substrate P from the first stage 10 of the pre-alignment unit 2 to the pasting stage 15 of the bonding material pasting unit 3. Further, the structures of the second to fourth transport mechanisms 8B to 8D are all the same as those of the first transport mechanism 8A, and the stages 15, 20, 30, Since the transfer operation of the substrate P of the second to fourth transfer mechanisms 8B to 8D to 50 is performed in exactly the same procedure as described above, the detailed operation of the transfer mechanisms 8B to 8D after that is performed. Description is omitted.

  As shown in FIG. 1, the first transport mechanism 8 </ b> A sucks and fixes the substrate P from the pre-alignment unit 2 and moves in the Y direction, reaches the position facing the bonding material pasting unit 3, and stops. Of the two sets of bonding stages 15 provided in the bonding material bonding unit 3, one of the bonding stages 15 is temporarily driven from the back side of the apparatus to the front side, that is, moved in the Y direction, and is then driven upward. The substrate P is delivered from the mechanism 8A. The transfer operation of the substrate P at this time is performed in the opposite manner to that described above with reference to FIGS.

  The first transport mechanism 8A returns to the first stage 10 of the pre-alignment unit 2, sucks and holds the next-positioned substrate P that has been newly corrected for positioning, and places the substrate P on the other pasting stage 15 of the bonding material pasting unit 2. Hand over.

  The adhering stage 15 of the bonding material adhering unit 3 to which the substrate P is adsorbed and fixed moves in the Y direction which is the back side of the apparatus in order to go to a predetermined bonding material adhering position. And the sticking stage 15 descend | falls after moving to the sticking backup stage 16 with which this joining material sticking unit 3 is equipped, and a proximity | contact position.

  The mounting position of the substrate P with respect to the bonding stage 15 in the bonding material bonding unit 3 shown in FIG. 1 is the same as the mounting position of the substrate P with respect to the stage 10 of the pre-alignment unit 2. Only the substrate P protrudes from the edge of the stage 15, and the substrate P is adsorbed and fixed to the affixing stage 15 with the other glass plate a 1 and the edges of the two polarizing plates b 1, b 2 and the stage edge aligned.

  Then, the pasting stage 15 is lowered to a height position at which the rear surface of the protruding portion of the substrate P contacts the upper surface of the pasting backup stage 16. The amount of descent of the bonding material pasting stage 15 at this time is controlled based on the result of the laser displacement meter 12 measuring the substrate P supported on the stage 10 of the pre-alignment unit 2 described above.

The bonding material S is wound on a reel in the form of a tape, and is supplied from the bonding material supply mechanism 18 to the pasting position.

  The pasting tool 17 is driven downward with respect to the bonding material S, a predetermined load and temperature are applied, and the bonding material S is punched and pasted on the substrate P.

  Since the mounting part of the substrate P is held horizontally, the bonding material S can be attached to an accurate position.

  The punched bonding material S is sucked by the suction mechanism 40 shown in FIG. 2, guided into the disposal box 41 disposed on the back side of the bonding material pasting unit 3, and discarded. About the suction mechanism 40 etc., the thing of the same structure is also provided in this crimping | compression-bonding unit 5, The detailed structure and effect | action are demonstrated in the final crimping | compression-bonding process mentioned later.

The substrate P to which the bonding material S has been bonded in the bonding material bonding stage 15 is a diagram for sequentially explaining the process of inspecting the bonding state of the actual bonding material S that is taken out and transported to the second transport mechanism 8B. As shown in FIG. 1, after bonding the bonding material S to the substrate P, the substrate P is transported to the temporary press-bonding unit 4 by the second transport unit 8B according to the same procedure as the previous step, and is provided here. Passed to 20. The temporary press-bonding stage 20 moves in the Y direction from the back side of the apparatus, temporarily exits to the front side of the apparatus, and the substrate P is delivered from the second transport mechanism 8B.

  Here, the positions of the glass plate a1 excluding the glass plate a2 constituting the substrate P and the edges of the two polarizing plates b1 and b2 are aligned with respect to the edge of the stage 20. The substrate P is sucked and fixed to the temporary pressure-bonding stage 20 in a state where the protruding portion of the glass plate a1 protrudes from the edge of the temporary pressure-bonded stage 20. The temporary pressure bonding stage 20 sucks and holds the substrate P and moves to the back side (Y direction) of the apparatus, moves close to the backup stage 21 and moves to the upper part.

  The temporary press-bonding stage 20 is lowered to a height position at which the rear surface of the protruding portion of the substrate P comes into contact with the backup stage 21. Also at this time, since the control is performed based on the height measurement result at the first stage 10 in the pre-alignment unit 2 described above, the upper surface of the backup stage 21 and the rear surface of the protruding portion of the substrate P are in contact with each other in a uniform state. The substrate P is always held horizontally.

  On the other hand, the semiconductor chip H is delivered from the chip supply means to the chip supply unit 7. When the electrodes (bumps) formed on the semiconductor chip H are supplied in a state of facing the upper surface side, the semiconductor chip H has the suction portion 27 of the chip reversing mechanism 24 constituting the chip supply unit 7 as shown in FIG. Receive and vacuum-suck.

  Then, as shown in FIG. 16, the half-rotation mechanism 28 is driven, and the suction unit 27 is rotated by 180 degrees and stopped. Since the suction action of the suction portion 27 on the semiconductor chip H continues, the semiconductor chip H is held in place of an upside down (upside down) posture.

  Next, as shown in FIG. 17, the elevating mechanism 29 is driven to drive the half-rotating mechanism 28 downward along with the suction portion 27, and the semiconductor chip H stops at the position where it is placed on the chip stage 25 of the chip transport mechanism 26. .

  The stage 25 of the chip transport mechanism 26 fixes the semiconductor chip H by vacuum suction, and then releases the vacuum suction at the suction portion 27 of the chip reversing mechanism 24. Therefore, the semiconductor chip H is delivered from the chip reversing mechanism 24 to the chip stage 25. At this timing, the chip transport mechanism 26 is driven to transport the chip stage 25 together with the semiconductor chip H to the provisional pressure bonding unit 4.

  The lift mechanism 29 of the chip reversing mechanism 24 is driven and raised, and the half-rotation mechanism 28 is half-rotated in the reverse direction. The chip reversing mechanism 24 returns to the initial posture and waits for the supply of the next semiconductor chip H to be supplied. On the other hand, the chip transport mechanism 26 stops in a state where the semiconductor chip H supported by the chip stage 25 is transported to a position facing the temporary crimping tool 22.

  Depending on the type to be produced, the mounting surface of the electronic component delivered from the chip supply means may be downward. In that case, supply of the electronic component to the chip reversing mechanism 24 can be omitted, and the electronic component can be directly transferred to the chip stage 25 of the chip transport mechanism 26, so that productivity can be increased.

  As shown in FIG. 1, when the chip stage 25 of the chip transport mechanism 26 to which the semiconductor chip H is attracted and fixed stops at a position facing the temporary pressure bonding tool 22, the temporary pressure bonding tool 22 is lowered and this time on the chip stage 25. In contact with the semiconductor chip H. The suction action of the chip stage 25 is stopped, and the vacuum suction action of the temporary pressure bonding tool 22 to the semiconductor chip H is started, and the semiconductor chip H is delivered to the temporary pressure bonding tool 22.

  Then, the temporary crimping tool 22 is timed down toward the substrate P on the backup stage 21 and temporarily crimps the semiconductor chip H to the mounting surface of the substrate P via the bonding material S with a predetermined load and temperature. The temporary crimping process is completed.

  When the temporary press-bonding step is completed, the third transport mechanism 8C is operated to take out the substrate P on which the semiconductor chip H is temporarily press-bonded from the temporary press-bonding unit 4 and transport it to the main press-bonding unit 5. The substrate P is delivered to the main press bonding stage 30 that has moved in the Y direction from the back side of the apparatus to the front side in the main press bonding unit 5. The third transport mechanism 8C delivers the substrate P to one of the three main crimping stages 30 and then immediately returns to the temporary crimping unit 4 to receive the next substrate P to the other final crimping stage 30. hand over. Then, the process returns to the temporary press-bonding unit 4 again, and the substrate P is transferred to the remaining free press-bonding stage 30.

  The main crimping stage 30 to which the substrate P has been delivered again moves to the back side of the apparatus (Y direction) and then descends, at a position where the mounting surface of the substrate P on which the semiconductor chip H is temporarily crimped is placed on the backup stage 31. Stop. The amount of descent of the main press bonding stage 30 at this time is also based on the result previously measured by the laser displacement meter 12 of the pre-alignment unit 2, and the protruding portion of the substrate P is always held horizontally.

  Then, as shown in FIG. 18, the main crimping tool 32 descends toward the substrate P mounting surface of the backup stage 31, and the protective tape T is applied based on the heating temperature and the large load conditions higher than those in the temporary crimping process. Then, the semiconductor chip H is heated and pressurized against the substrate P, and a main pressure bonding process is performed in which the semiconductor chip H is pressure bonded to the substrate P.

. At this time, the adhesive binder of the bonding material S is melted and the conductive particles are interposed by the heating and pressurizing treatment, and the bonding between the substrate P and the semiconductor chip H is weakened and the semiconductor chip H and the substrate are bonded. It becomes easy to move relative to P. At this time, the main crimping tool 32 is deformed and the semiconductor chip H moves in the X direction with respect to the substrate P as shown in FIG.

  The semiconductor chip H moves relative to the substrate P. At this time, the displacement amount and the displacement direction of the end face of the semiconductor chip H are detected by the non-contact displacement meter 35 in units of 1 micron, for example. Based on the detection result of the non-contact displacement meter 35, a predetermined calculation process is performed in the control unit 37, the movement distance and movement direction of the main crimping tool 32 are calculated, and a control signal corresponding to the calculation result is output. The In response to this output, as shown in FIG. 20, the movable mechanism 36 moves in a predetermined direction by a predetermined distance, and the main crimping tool 32 also moves. For example, the main crimping tool 32 is moved in the direction opposite to the displacement direction of the end face of the semiconductor chip H by the same distance as the displacement amount of the end face of the semiconductor chip H. For example, when the semiconductor chip H is displaced by 1 micron to the left, the relative positional relationship between the semiconductor chip H and the substrate P is corrected by immediately moving the main crimping tool 32 to the right by 1 micron. This position correction is repeated every predetermined time until the main pressure bonding process is completed.

  As described above, the bonding material S is melted and the electrode of the semiconductor chip H and the electrode of the substrate P are electrically connected via the conductive particles included in the anisotropic conductive film as the bonding material S. When S is cured, the semiconductor chip H is mounted on the substrate P. At this time, even if a deviation occurs due to the interposition of the bonding material S, the positional relationship is corrected before curing, so that mounting at an accurate position is possible.

  The fourth transport mechanism 8D sucks the substrate P that has undergone the main press-bonding step, transports the substrate P to the substrate discharge unit 6, and delivers the substrate P to the discharge stage 50. The discharge stage 50 moves to the delivery position with the downstream apparatus (X direction) and delivers the substrate P to the downstream apparatus. Thereby, all the mounting processes of the semiconductor chip H on the series of substrates P are completed.

  According to the electronic component mounting apparatus 100 and the electronic component manufacturing method according to the present embodiment, the following effects can be obtained. That is, the relative positional relationship between the substrate P and the semiconductor chip H is detected, and the main crimping tool 32 is moved in accordance with the detection result, thereby preventing the positional deviation between the substrate P and the semiconductor chip H and the desired part. Accurate processing can be performed.

  In addition, this invention is not limited to the said embodiment as it is.

  In the above-described embodiment, only the main crimping unit 5 is provided with a correction unit including the non-contact displacement meter 35, the movable mechanism 36, and the control unit 37, and the position is corrected in the final crimping process. As shown in FIG. 4, the temporary press-bonding unit 4 is also provided with a correcting means including a non-contact displacement gauge 35, a movable mechanism 36, and a control unit 37, and performs position correction during the temporary press-bonding as in the case of the main press-bonding. It is good also as a structure.

  In the above embodiment, the case where the position correction is performed with the main crimping tool 32 being movable has been described, but instead of or in combination with this, as shown in FIG. 22, the main crimping stage 30 on which the substrate P is placed and the backup are provided. The stage 31 may be movable and the relative position may be adjusted by adjusting these positions. In this case, in an apparatus in which the main press-bonding stage 30 and the backup stage 31 are already configured to be movable in advance, no new equipment is required, so that the manufacturing cost can be kept low.

  Although the relative position is detected by detecting the displacement of the end face of the semiconductor chip H by the non-contact displacement meter 35, instead of or in combination with this, as shown in FIG. The relative position may be detected from the position of the main crimping tool 32 by using a displacement meter 29 that detects the displacement of the portion in contact with the chip H.

  Furthermore, in the above-described embodiment, the case where the displacement in the X direction is detected and the position is corrected in the X direction has been described. However, the present invention is not limited to this. For example, instead of or in addition to this, the displacement in the Y direction Detection and position correction may be performed. In addition, in the implementation stage, the constituent elements can be modified and embodied without departing from the spirit of the invention. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

1 is a schematic perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. The schematic perspective view which shows the back side of the mounting apparatus of the electronic component which concerns on one Embodiment of this invention. Sectional drawing explaining the state of the board | substrate in the position correction process in the embodiment. Sectional drawing explaining the state of the board | substrate in the bonding goods sticking process in the embodiment. Sectional drawing explaining the state of the board | substrate in the temporary crimping | compression-bonding process in the embodiment. Sectional drawing explaining the state of the board | substrate in the main crimping | compression-bonding process in the embodiment. The perspective view which shows the structure of the pre-alignment unit which concerns on the same embodiment. The side view which shows the structure of the pre-alignment unit which concerns on the same embodiment. The side view which shows the structure of the bonding material sticking unit which concerns on the same embodiment. The side view which shows the structure of the chip | tip supply unit which concerns on the same embodiment. The front view which shows the structure of this crimping | compression-bonding unit which concerns on the same embodiment. Explanatory drawing which shows the structure of the bonding material sticking unit which concerns on the embodiment. Sectional drawing explaining the process of conveying the board | substrate of the embodiment. The side view explaining the process of conveying the board | substrate of the embodiment. The side view explaining the process of conveying the board | substrate of the embodiment. The side view explaining the process of supplying a chip | tip in the chip | tip supply unit which concerns on the embodiment. The side view explaining the process of supplying a chip | tip in the chip | tip supply unit which concerns on the embodiment. Explanatory drawing which shows the main crimping | compression-bonding process in the main crimping | compression-bonding unit which concerns on the embodiment. Explanatory drawing which shows the main crimping | compression-bonding process in the main crimping | compression-bonding unit which concerns on the embodiment. Explanatory drawing which shows the main crimping | compression-bonding process in the main crimping | compression-bonding unit which concerns on the embodiment. Explanatory drawing which shows the temporary crimping | compression-bonding unit concerning other embodiment of this invention. Explanatory drawing which shows this crimping | compression-bonding unit concerning other embodiment of this invention. Explanatory drawing which shows this crimping | compression-bonding unit concerning other embodiment of this invention. The side view which shows an example of the mounting device of an electronic component. The side view which shows an example of the main crimping | compression-bonding process of the mounting device of an electronic component. The side view which shows an example of this crimping | compression-bonding process of the mounting device of an electronic component.

Explanation of symbols

P ... Substrate, H ... Semiconductor chip (electronic component), 3 ... Bonding material pasting unit, 4 ... Temporary crimping unit, 5 ... Final crimping unit, 8A ... First transport mechanism, 8B ... Second transport mechanism, 8C ... 3rd transport mechanism, 8D ... 4th transport mechanism, G ... Position correction mechanism, 10 ... First stage, 12 ... Laser displacement meter, S ... Bonding material (anisotropic conductive film: ACF), 15 ... Pasting stage, DESCRIPTION OF SYMBOLS 16 ... Pasting backup stage, 17 ... Pasting tool, 20 ... Temporary pressure bonding stage, 21 ... Temporary pressure bonding backup stage, 22 ... Temporary pressure bonding tool, 30 ... Final pressure bonding stage, 31 ... Final pressure bonding backup stage, 32 ... Final pressure bonding tool, 35 ... non-contact displacement meter, 36 ... movable mechanism, 37 ... control unit, 50 ... discharge stage.

Claims (4)

An electronic component mounting apparatus for mounting an electronic component on a substrate,
A main pressure-bonding unit that acts on the substrate on which the electronic component is placed via a bonding material with a predetermined heating temperature and pressure, and which finally press-bonds the electronic component to the substrate;
Correction means for detecting a displacement of the electronic component relative to the substrate in a direction crossing the direction of the pressurization during the processing by heating and pressurizing and correcting the relative position between the substrate and the electronic component. When,
An electronic component mounting apparatus comprising: An electronic component mounting apparatus for mounting an electronic component on a substrate,
An affixing unit for adhering the bonding material to the substrate;
A bonding material supply mechanism for supplying the bonding material to the pasting unit;
A temporary pressure-bonding unit that temporarily pressure-bonds an electronic component to the substrate via the bonding material by heating and pressure treatment;
A chip supply unit for transporting the electronic component to the temporary crimping unit;
A main pressure-bonding unit that acts on the substrate on which the electronic component is placed via a bonding material with a predetermined heating temperature and pressure, and which finally press-bonds the electronic component to the substrate;
A transport mechanism for transporting a substrate between the plurality of units;
Correction means for detecting a displacement of the electronic component relative to the substrate in a direction crossing the direction of the pressurization during the processing by heating and pressurizing and correcting the relative position between the substrate and the electronic component. When,
An electronic component mounting apparatus comprising:   The electronic component mounting apparatus according to claim 1, wherein the bonding material includes an anisotropic conductive film, and the correction is performed when the bonding material is heated. A step of applying a predetermined heating temperature and pressure to the substrate on which the electronic component is placed via the bonding material, and finally pressing the electronic component to the substrate;
Detecting the displacement of the electronic component with respect to the substrate in a direction intersecting the direction of the pressurization during the step of performing the main pressure bonding, and correcting a relative position between the substrate and the electronic component; An electronic component manufacturing method comprising the electronic component.

Images