JP3371325B2 - Manufacturing method of liquid crystal display device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device for displaying visible information such as characters and numbers by modulating the light by controlling the orientation of the liquid crystal sandwiched between a pair of transparent substrates. It relates to a manufacturing method. In particular, the present invention relates to a method of manufacturing a so-called COG type liquid crystal display device in which an electronic element such as a liquid crystal driving IC is directly bonded onto a transparent substrate.

[0002]

2. Description of the Related Art Generally, a liquid crystal display device is manufactured by electrically connecting an electronic element such as a liquid crystal driving IC to a liquid crystal panel. The liquid crystal panel is formed by forming a transparent electrode having a predetermined pattern on the surface of each of a pair of transparent substrates, and bonding the transparent substrates to each other with the liquid crystal sandwiched therebetween. In a liquid crystal display device, a pixel is formed by a pair of transparent electrodes facing each other, and in general, bright display or dark display of the pixel is determined by applying or not applying a voltage to the transparent electrodes.

Application of voltage to the transparent electrode is usually performed by a liquid crystal driving IC. Regarding the method of connecting the liquid crystal driving IC to the liquid crystal panel, various methods have been conventionally known. Among them, COG (Chip On Glas) is used.
s) There is a method called method. The COG method is, for example, as shown in FIG. 6, in which one or both of the pair of transparent substrates 52a and 52b forming the liquid crystal panel 51 is provided with the liquid crystal driving IC 53, and the FPC.
This is a joining method of directly joining without intervening intervening elements such as (Flexible Printed Circuit).

In such a COG system, first,
An ACF (Anisotropic C) is placed at a predetermined position on the transparent substrate 52a.
onductive film (anisotropic conductive film) 54 or the like, and a liquid crystal driving I is attached on the ACF 54.
Paste C53. In this case, it should be noted that the positions of the IC input electrode terminals 55a and the IC output electrode terminals 55b formed on the transparent substrate 52a and the positions of the bumps (that is, the terminals) of the liquid crystal driving IC 53 are accurate. It means that they must be joined together in the state of being matched with.

As described above, in order to accurately align the electrode terminals 55a and 55b on the transparent substrate 52a and the bumps of the liquid crystal driving IC 53, conventionally, for example, the following method has been adopted. That is, the substrate-side alignment mark 56 is formed on the transparent substrate 52a, while the IC-side alignment mark 57 is formed on the bonding surface (lower surface of the figure) of the liquid crystal driving IC, and the liquid crystal driving IC 53 is transparent. As shown in FIG. 7, when it is attached to the substrate 52a, the IC
The liquid crystal driving I so that the side alignment mark 57 and the substrate side alignment mark 56 have a predetermined relative positional relationship.
The relative positional relationship between C53 and the transparent substrate 52a is adjusted. In some cases, I instead of the alignment mark
The C bump and the terminal on the substrate may be directly aligned. Such position adjustment work is performed by an operator while visually confirming the transparent substrate 52a and the bonding surface of the liquid crystal driving IC 53 through the transparent substrate 52a from the direction of arrow A in FIG.

[0006]

However, in the above-mentioned conventional method, the substrate-side alignment mark 56 is located inside the ACF 54. Generally, ACF5
Since No. 4 is formed by dispersing conductive particles in a thermoplastic or thermosetting resin film, when the substrate-side alignment mark 56 is inside the ACF 54, the contrast of the alignment mark 56 is increased. descend. Even in this case, the alignment mark 56 can be observed by the human eye, but when observing the alignment mark 56 with a camera to automatically perform image processing, the contrast of the alignment mark 56 is too low to recognize it. Can not. Therefore, it is difficult to automatically recognize the position of the alignment mark 56 using the camera processing.

The present invention has been made in view of the above problems, and automatically aligns an electronic element such as a liquid crystal driving IC or the like with a liquid crystal panel by using a camera process. The purpose is to be able to.

[0008]

Method of manufacturing a liquid crystal display device of the present invention According to an aspect of the method of manufacturing a liquid crystal display device, IC test
A step of photographing the IC side alignment mark provided on the liquid crystal driving IC at the inspection position and outputting a first video signal; and the position of the IC side alignment mark based on the first video signal from the reference position. If there is a deviation, the deviation amount is calculated and sent to the control device as the first position information, and at the panel inspection position, it is provided outside the region where the bonding material is adhered on the translucent substrate. A step of photographing the board-side alignment mark and outputting a second video signal, and calculating the deviation amount of the board-side alignment mark when the position of the board-side alignment mark deviates from the reference position based on the second video signal. , A step of sending the second position information to the control device, a step of controlling the transportation of the liquid crystal driving IC to the sticking work position based on the first position information, and a step of controlling the second position information. A step of controlling the transportation of the translucent substrate to the adhering work position, and a step of adhering the liquid crystal driving IC and the translucent substrate with the bonding material at the adhering work position. And, the IC inspection
Move one camera between the position and the panel inspection position.
By moving the IC side alignment mark and the substrate
Take each of the side alignment marks with the camera.
Characterized in that that. In addition, the board-side alignment
A plurality of marks, and the substrate side alignment mark is
It is preferable that they are placed near both ends of the bonding material.
Yes. In addition, the substrate-side alignment mark is the bonding
Outside the lateral outer edge of the material or outside the extended trajectory line of the lateral outer edge
It is preferably located on the side. Also, the substrate side
The liment mark is the outer or outer edge of the joint in the longitudinal direction.
Is located outside the extension line of the longitudinal outer edge.
preferable.

In the above description, the term "translucency" means the property of transmitting light regardless of whether it is colorless and transparent or colored. The electronic element is generally considered to be a liquid crystal driving IC, but if any other electronic element is required, it is meant to include such any electronic element. Further, the bonding material includes not only ACF (Anisotropic Conductive Film) containing conductive particles but also a resin film for bonding which does not contain conductive particles. The shape of the alignment mark is
It can be circular, square, cross-shaped, or any other shape.

According to the above method of manufacturing a liquid crystal display device,
Since the alignment mark is formed on the outside of the bonding material, the contrast of the alignment mark does not decrease, and therefore the alignment mark can be clearly recognized using the camera. Therefore, by accurately recognizing the position of the electronic element such as the liquid crystal driving IC and the position of the liquid crystal panel by using the camera, the both can be automatically and accurately aligned.

Regarding the method of manufacturing the above-mentioned liquid crystal display device, the following several embodiments can be considered. First of all, although only one alignment mark is required, if there is only one alignment mark, the position recognition in the rotation direction of the liquid crystal panel may be insufficient. In order to sufficiently perform the position recognition in the rotation direction, it is desirable to provide at least two alignment marks and perform the position recognition for each of them. In this case, as the distance between the two alignment marks increases, the accuracy of the position recognition of the liquid crystal panel inevitably increases, but if the distance between the alignment marks increases, the moving distance of the camera increases. It impairs the work speed.
In order to avoid this problem, the two alignment marks should not be too far apart and should not be too close together. Specifically, each alignment mark should have both alignment marks at both ends of the bonding material such as ACF. It is desirable to arrange it in the vicinity of the part.

Regarding the position of the alignment mark, as shown in FIG. 1, the alignment mark 6 can be provided outside the lateral outer edges 4a and 4b of the bonding material such as ACF4. The lateral direction is a direction XX parallel to the sides 2d and 2e of the translucent substrate that defines the portion 2c for attaching the bonding material. Also, the direction Y-Y perpendicular to this
Is the vertical direction.

Further, as shown in FIG. 4, an extended locus line L _A of the lateral outer edges 4a and 4b of the bonding material such as ACF 4 is formed.
And outer L _B may be provided an alignment mark 6 to the position (area indicated by the arrow H).

Further, as shown in FIG. 5, outside the vertical outer edges 4c and 4d of the bonding material such as ACF4 or outside the extended locus lines L _C and L _D of the vertical outer edges 4c and 4d (the area indicated by the arrow J). ) The alignment mark 6 can be provided at the position.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an embodiment of a liquid crystal display device according to the present invention. This liquid crystal display device is manufactured by attaching a liquid crystal driving IC 3 as an electronic element to the liquid crystal panel 1. Two IC-side alignment marks 7 are formed on the bonding surface (lower surface of the drawing) of the liquid crystal driving IC 3. The liquid crystal panel 1 has a pair of transparent substrates (that is, translucent substrates) 2a and 2b facing each other. These transparent substrates 2a and 2b are shown in FIG.
As shown in FIG. 5, the bead-shaped spacers 9 are bonded to each other by the sealing material 11 while maintaining a predetermined cell gap. Then, the liquid crystal 12 is enclosed in the cell gap thus formed.

IT is formed on the inner surfaces of the transparent substrates 2a and 2b.
Transparent electrodes 13a and 13b made of O (Indium Tin Oxide) are formed, and these transparent electrodes form pixels for liquid crystal display. One transparent substrate 2a has an overhanging portion 2c overhanging to the outside of the other transparent substrate 2b, and the transparent electrode 13a is connected to an IC output electrode terminal 5b formed on the overhanging portion 2c. Further, an IC input electrode terminal 5a is formed at the end of the overhanging portion 2c. In FIG. 2, reference numeral 14 indicates a polarizing plate attached to the outer surface of each of the transparent substrates 2a and 2b. As for the transparent electrodes 13a and 13b, a metal film pattern may be provided on the upper side or the lower side thereof, if necessary.

Returning to FIG. 1, at a predetermined position B of the protruding portion 2c of one transparent substrate 2a, an ACF (Ani
sotropic Conductive Film) 4 is attached. Usually, the ACF 4 is attached automatically while the plurality of liquid crystal panels 1 are sequentially conveyed in the direction of arrow C by an automatic machine. ACF4 is a bonding material formed by dispersing conductive particles in a thermoplastic or thermosetting resin film. First, the ACF 4 is attached to the substrate overhanging portion 2c, and further, the liquid crystal driving IC 3 is placed on the ACF 4.
Is adhered, that is, temporarily adhered, and then the liquid crystal driving IC 3 is pressed against the substrate overhanging portion 2c by AC.
By heating F4 or the like to cure the resin portion thereof, as shown in FIG. 2, the liquid crystal driving IC 3 is bonded onto the substrate overhanging portion 2c, and at the same time, the bumps 8 of the liquid crystal driving IC 3 are connected to the electrode terminals 5a and 5b. Can be conductively connected to.

The transparent electrode 13a on the transparent substrate 2a
Is formed by forming a thin film of ITO by a thin film forming process such as sputtering and then forming the ITO into a predetermined pattern by photolithography and patterning. During this series of electrode forming processes, at the same time, In FIG. 1, two board-side alignment marks 6 and 6 are formed outside the ACF attachment position B. Therefore, the substrate side alignment marks 6 and 6 are also ITO.
Formed by.

As is apparent from FIG. 1, the substrate overhanging portion 2c for sticking the ACF 4 is a side 2d of the transparent substrate 2a.
And both sides of the side 2e of the transparent substrate 2b are defined. Now, the direction X parallel to these sides 2d and 2e is defined.
-X is considered to be the horizontal direction, and the direction Y-Y orthogonal thereto is considered to be the vertical direction. In the present embodiment, it is outside the lateral outer edge 4a of the ACF 4, further inside the extended locus lines L _C and L _D of the vertical outer edges 4c and 4d of the ACF 4, and further at both end portions of the ACF 4 as much as possible. Substrate-side alignment marks 6 and 6 were formed in the vicinity.

Hereinafter, a process for attaching the liquid crystal driving IC 3 onto the overhanging portion 2c of the transparent substrate 2a, that is, for temporarily adhering the liquid crystal driving IC 3 will be described. This attachment is performed by, for example, an automatic machine shown in FIG. This automatic machine is equipped with a liquid crystal drive IC3.
An IC support portion 16 for adsorbing and holding the liquid crystal from above, a panel support portion 17 for supporting the liquid crystal panel 1 from below, and a CC
And a D camera 18. The IC supporting unit 16 is conveyed by the IC conveying device 19 and moves in parallel between the inspection position P1 and the sticking work position P2. In addition, the panel support portion 17
Is transported by the panel transport device 21 to the inspection position P.
3 is moved in parallel between the sticking work position P4. The CCD camera 18 is carried by the camera carrying device 22,
The IC is moved in parallel between the IC inspection position P5 and the panel inspection position P6. Each of the above-described transfer devices 19, 21 and 22 can be configured by a conventionally known linear parallel transfer mechanism or in-plane parallel transfer mechanism.

In this automatic machine, the liquid crystal driving IC 3
Is set exactly at a predetermined reference position at the inspection position P1, and the liquid crystal panel 1 is set exactly at the predetermined reference position at the inspection position P3.
After the support part 16 is carried from the inspection position P1 to the sticking work position P2, and the panel support part 17 is carried from the test position P3 to the sticking work position P4, the IC support part 16 descends as shown by arrow D. Then, when the bumps 8 of the liquid crystal driving IC 3 come into contact with the surface of the overhanging portion 2c of the transparent substrate 2a of the liquid crystal panel 1, the positions of the bumps 8 and the positions of the electrode terminals 5a and 5b (FIG. 1) are exactly aligned. It is supposed to do.

The output signal of the CCD camera 18 is sent to the position discriminating circuit 23. CCD camera 18 is IC support 16
When the IC side alignment mark 7 (FIG. 1) of the liquid crystal driving IC 3 supported by is photographed and the video signal is output, the position determination circuit 23 determines the position of the IC side alignment mark 7 based on the video signal. Therefore, the position of the liquid crystal driving IC 3 is calculated, and the calculation result is calculated by the controller 24.
Send to. In this embodiment, since the two IC-side alignment marks 7 are provided, the CCD camera 18
First takes a picture of the first alignment mark 7, then moves to the position of the second alignment mark 7, takes a picture of the second alignment mark 7, and Output the corresponding video signal.

Further, the CCD camera 18 moves to the panel inspection position P6, and the substrate side alignment mark 6 (FIG. 1) formed on the projecting portion 2c of the transparent substrate 2a of the liquid crystal panel 1 supported by the panel supporting portion 17 is shown. ) Is photographed and the video signal is output, the position determination circuit 23 calculates the position of the substrate-side alignment mark 6 and thus the position of the liquid crystal panel 1 based on the video signal, and the calculation result is sent to the controller 24. send. In this case, since two board-side alignment marks 6 are also provided, the CCD camera 18
As shown in FIG. 1, first, the first alignment mark 6 is moved to a position P _6-1 below the first substrate-side alignment mark 6, and the alignment mark 6 is photographed. The second alignment mark 6 is photographed by moving to the lower position P _6-2 , and the video signal corresponding to each mark is output.

Returning to FIG. 3, the control device 24 is constituted by including, for example, a computer, and the position discriminating circuit 23.
The operation of the IC transfer device 19 and the panel transfer device 21 is controlled based on the position information regarding the liquid crystal driving IC 3 and the position information regarding the liquid crystal panel 1 sent from the device.

Since the automatic sticking machine used for manufacturing the liquid crystal display device of the present embodiment is configured as described above, the sticking work for the liquid crystal driving IC 3, that is, the temporary sticking work, is performed. First, in FIG. 3, the liquid crystal driving IC 3 is suction-supported by the IC support portion 16, and further, the liquid crystal panel 1 having the ACF 4 attached at a predetermined position is set at a predetermined position of the panel support portion 17. And C
First, place the CD camera 18 at the IC inspection position P5 and
The C-side alignment mark 7 (FIG. 1) is photographed. Then, after that, the CCD camera 18 is moved to the panel inspection position P6 and the substrate side alignment mark 6 (FIG. 1) is photographed.

The position discriminating circuit 23 calculates the positions of the IC-side alignment mark 7 and the substrate-side alignment mark 6 based on the image signals, and when the marks are deviated from the reference position, the deviation amount thereof is calculated. Is calculated and the calculation result is sent to the control device 24. The control device 24 conveys the IC support part 16 from the inspection position P1 to the sticking work position P2 by the IC transport device 19 and the panel support device 17 conveys the panel support part 17 from the inspection position P3 to the sticking work position P4 by the panel carrying device 21. In doing so, the carry distance and the carry direction of the IC support portion 16 and the panel support portion 17 are controlled based on the position information transmitted from the position determination circuit 23, respectively. As a result, even if the mounting position of the liquid crystal driving IC 3 on the IC supporting portion 16 varies or the mounting position of the liquid crystal panel 1 on the panel supporting portion 17 varies, the liquid crystal driving IC 3 and the liquid crystal panel 1 are always fixed. It can be carried to the sticking work position, and therefore, the positions of the bumps 8 of the liquid crystal driving IC 3 and the positions of the electrode terminals 5a and 5b on the liquid crystal panel 1 can be automatically and accurately matched at the sticking work position. You can

After that, the IC supporting portion 16 is lowered as shown by an arrow D, and the liquid crystal driving IC 3 is pressed against the projecting portion 2c of the transparent substrate 2a with the ACF 4 interposed therebetween. Is the board overhang 2
It is pasted on c, that is, temporarily adhered. At this time, the control device 24 controls the IC transfer device 19 and the panel transfer device 2
As a result of the position control for 1, the bumps of the liquid crystal driving IC 3 and the electrode terminals 5a and 5b of the liquid crystal panel 1 can always be accurately and electrically conductively connected. When the temporary adhesion of the liquid crystal driving IC 3 to the liquid crystal panel 1 is completed in this way, the liquid crystal panel 1 is carried to another processing stage and the liquid crystal driving IC 3 is permanently bonded. Specifically, the liquid crystal driving IC 3 is mounted on the substrate overhanging portion 2c.
While being pressed against, the ACF 4 is cured by heating or the like to perform the main adhesion.

As is apparent from the above description, in this embodiment, as shown in FIG. 1, the substrate side alignment marks 6 and 6 are formed outside the ACF 4, so that the contrast of these alignment marks 6 and 6 is lowered. Therefore, the alignment marks 6 and 6 are
It can be clearly recognized using the CD camera 18. Therefore, the position of the liquid crystal driving IC 3 and the position of the liquid crystal panel 1 can be accurately recognized, and thus both can be automatically and accurately aligned by an automatic machine using the CCD camera 18. Also,
Since the substrate-side alignment marks 6 and 6 are provided near both ends of the ACF 4, the distance between both marks is relatively short. Therefore, the movement amount when moving the CCD camera 18 between both marks can be made relatively small,
Therefore, the photographing work by the CCD camera 18 can be performed quickly.

FIG. 4 shows a modification of the position where the substrate-side alignment mark is provided. In the embodiment shown in FIG. 1, the substrate-side alignment marks 6 and 6 are located outside the lateral outer edge 4a of the ACF 4 and inside the extended trajectory lines L _C and L _D of the vertical outer edges 4c and 4d of the ACF 4. Further, they were arranged at positions as close as possible to both end portions of the ACF 4. On the other hand, in the embodiment of FIG. 4, the substrate-side alignment marks 6 and 6 are provided on the lateral outer edge 4 of the ACF 4.
It is arranged outside the extended locus line L _A of a and outside the extended locus lines L _C and L _D of the vertical outer edges 4c and 4d of the ACF 4, and as close as possible to both end portions of the ACF 4. .

FIG. 5 shows another modification of the position where the substrate-side alignment mark is provided. In this embodiment, the substrate-side alignment marks 6 and 6 are
It was placed inside the extended locus line L _A of the lateral outer edge 4a of F4, further outside the vertical outer edges 4c and 4d of ACF4, and as close as possible to both end portions of ACF4.

As described with reference to FIG. 1, A
When the CF4 is attached to the substrate overhanging portion 2c, the ACF4 is used while sequentially transporting the plurality of liquid crystal panels 1 in the arrow C direction.
The substrate overhang 2 of each liquid crystal panel 1
In many cases, automatic processing of continuously pasting on c is performed. In such a case, the sticking position of the ACF 4 is unlikely to be displaced in the vertical direction YY, but is easily displaced in the horizontal direction XX. Further, in order to maintain the reliability of the connection of the ACF 4 on the safe side, the ACF 4 may be elongated in the lateral direction. Therefore, the substrate side alignment marks 6 and 6 are A
It is desirable to arrange it on the outer side of the lateral outer edge 4a or 4b of CF4 or on the outer side of the extended locus line L _A or L _B thereof. By doing this, the attachment position of the ACF 4 is the horizontal direction X.
It is possible to prevent the ACF 4 from overlapping the substrate-side alignment marks 6 and 6 even if there is some variation in −X. However, since there are many transparent electrodes 13a outside L _B , L
_It is desirable to place the alignment mark on the outside of _A.

Although the present invention has been described with reference to the preferred embodiments, the present invention is not limited to the embodiments and can be variously modified within the technical scope described in the claims.

For example, in the embodiment of FIG. 1, the substrate-side alignment mark 6 is formed in a circular shape, but it can be formed in a quadrangular shape or any other shape. Also, IC
The side alignment mark 7 can also have any shape other than the shape shown. Also, in the embodiment of FIG.
A case was considered in which an overhanging portion 2c was formed on one transparent substrate 2a and the liquid crystal driving IC 3 was attached thereto. In addition to this, an overhanging portion is formed on the other transparent substrate 2b and the overhanging portion is formed. An embodiment in which a liquid crystal driving IC is attached to the portion is also conceivable. Further, the number of the liquid crystal driving ICs 3 to be attached is not limited to one, but may be plural. Further, the automatic sticking system shown in FIG. 3 is merely an example, and it goes without saying that the sticking work can be automatically performed by using an automatic machine having any other structure.

[0034]

According to the method of manufacturing a liquid crystal display device of the present invention, since the alignment mark is formed outside the bonding material, the contrast of the alignment mark does not decrease, and therefore the alignment mark can be formed by using the camera. Clearly recognizable. As a result, by accurately recognizing the position of the electronic element such as the liquid crystal driving IC and the position of the liquid crystal panel by using the camera, the both can be automatically and accurately aligned.

According to the method of manufacturing a liquid crystal display device of the present invention, when a plurality of alignment marks are provided at a distance from each other, the distance between them does not become too large, and therefore these alignment marks are provided. When using a camera for automatic recognition, the amount of movement of the camera can be reduced, and therefore work can be performed quickly.

According to the method of manufacturing a liquid crystal display device of the present invention, it is possible to surely avoid overlapping of the bonding material and the alignment mark. The bonding material is often attached to the transparent substrate of the liquid crystal panel using an automatic machine. In this case, the position of the bonded bonding material is unlikely to be displaced in the vertical direction, but is likely to be displaced in the horizontal direction. Further, in order to maintain the reliability of connection of the bonding material on the safe side, the bonding material may be elongated in the lateral direction. Therefore, if the alignment mark is provided outside the lateral outer edge of the bonding material or outside the extended trajectory line of the lateral outer edge, even if the bonding material sticking position deviates in the lateral direction to some extent, it will be above the alignment mark. It is possible to prevent the joining materials from overlapping.

According to the method of manufacturing a liquid crystal display device of the present invention, when a plurality of alignment marks are provided, the distance between them can be reduced, and therefore the positions of these alignment marks can be recognized using a camera. In this case, the moving distance of the camera can be reduced, and the work can be performed quickly.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a liquid crystal display device according to the present invention.

FIG. 2 is a sectional view showing a sectional structure of the liquid crystal display device of FIG.

FIG. 3 is a diagram schematically showing an example of an automatic machine for attaching a bonding material such as ACF to a liquid crystal panel.

FIG. 4 is a plan view showing a modified example of a position where an alignment mark is attached on a transparent substrate.

FIG. 5 is a plan view showing another modification of a position where an alignment mark is attached on a transparent substrate.

FIG. 6 is a perspective view showing an example of a conventional liquid crystal display device.

FIG. 7 is a perspective view showing an example of a substrate-side alignment mark and an IC-side alignment mark used in a conventional liquid crystal display device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Liquid crystal panel 2a, 2b Transparent substrate (translucent substrate) 2c Overhang 2d of transparent substrate 2e Side of transparent substrate 3 Liquid crystal drive IC (electronic element) 4 ACF (bonding material) 4a, 4b ACF lateral direction Outer edges 4c and 4d Vertical outer edges 5a and 5b of ACF Electrode terminals 6 Substrate side alignment mark 7 IC side alignment mark 8 Bumps of liquid crystal driving IC 12 Liquid crystals 13a and 13b Transparent electrode 16 IC support 17 Panel support 18 CCD camera L _a, inspection of L _B ACF lateral edge extension trajectory line L _C of, L _D ACF longitudinal edge attached working position P3 LCD panel inspection position P2 liquid crystal driving IC of the extension trajectory P1 liquid crystal driving IC of the Position P4 Liquid crystal panel sticking work position P5 CCD camera IC inspection position P6 CCD camera panel inspection position X horizontal direction Y vertical direction

Continuation of front page (56) References JP-A-5-323348 (JP, A) JP-A-7-232851 (JP, A) JP-A-8-70200 (JP, A) JP-A-10-177183 (JP , A) JP 8-162503 (JP, A) JP 8-107130 (JP, A) JP 8-29798 (JP, A) JP 9-61118 (JP, A) (58) Fields surveyed (Int.Cl. ⁷ , DB name) G02F 1/1345 G02F 1/13 101

Claims (4)

(57) [Claims] 1. A method for manufacturing a liquid crystal display device, comprising: an IC provided on a liquid crystal driving IC at an IC inspection position.
Photographing a side alignment mark and outputting a first video signal, and calculating a deviation amount of the IC side alignment mark when the position of the IC side alignment mark is deviated from a reference position based on the first video signal, The step of sending to the control device as the first position information, and the board-side alignment mark provided outside the region where the bonding material is adhered on the translucent board at the panel inspection position is photographed, and the second image A step of outputting a signal, and a step of calculating a deviation amount when the position of the substrate-side alignment mark deviates from a reference position based on the second video signal, and sending it as second position information to a control device. And a step of controlling the transportation of the liquid crystal driving IC to the sticking work position based on the first position information, and the sticking work position of the translucent substrate based on the second position information. And controlling the transport of, in the sticking work position, and a step of wearing bonded to said liquid crystal driving IC and the light transmissive substrate by the bonding material, the IC inspection position and the panel inspection position One between
Move the camera to move the IC side alignment mark
And each of the substrate side alignment marks
A method for manufacturing a liquid crystal display device, which is characterized by photographing with a camera . 2. A method of manufacturing a liquid crystal display device according to claim 1.
In, a plurality of substrate side alignment marks are provided,
The board-side alignment mark is formed on both ends of the bonding material.
A liquid crystal display device characterized by being arranged in the vicinity
Production method. 3. A method of manufacturing a liquid crystal display device according to claim 2.
At the substrate side alignment mark,
Outside the lateral outer edge of the material or outside the extended trajectory line of the lateral outer edge
Manufacture of liquid crystal display device characterized by being located on the side
Method. 4. A method of manufacturing a liquid crystal display device according to claim 2.
At the substrate side alignment mark,
Outside the longitudinal outer edge of the material or outside the extension line of the longitudinal outer edge
Manufacture of liquid crystal display device characterized by being located on the side
Method.