KR102214899B1 - Apparatus for adhering adhesive tape - Google Patents

Abstract

An object of the present invention is to provide an adhesive tape adhesive device capable of automatically deriving the adhesive tape head.
A supply unit 12 for supplying a tape-like member 2 to which an adhesive tape 21 is adhered to a release tape 22, and an adhesive surface on the opposite side of the release tape of the adhesive tape to the object to be bonded. The adhesive portion 11 to be bonded, the conveying portion 14 for transferring the tape-like member from the supply portion to the adhesive portion, and the adhesive reference position 10 arranged on the side of the adhesive tape in the tape-shaped member, and the optical axis is set relative to the adhesive portion. ), and the light axis installed at a predetermined angle with respect to the vertical direction of the adhesive surface of the adhesive tape located at the reference position for adhesion, and the optical axis at the reference position for adhesion. On the basis of the image of the tape-like member obtained by the imaging unit and the image capturing unit 18 that is aligned and disposed on the side of the adhesive tape in the tape-like member and is positioned at the adhesion reference position, the adhesive tape A determination unit 196 for determining whether or not the state of the cut portion 20 is in is provided.

Description

Adhesive tape adhesive device {APPARATUS FOR ADHERING ADHESIVE TAPE}

The present invention relates to a device for bonding an adhesive tape.

In the manufacturing process of a flat panel display such as a liquid crystal display or an organic EL display, it is necessary to mount an electronic component on a substrate that is an object to be bonded. This mounting is carried out, for example, by pressing an electronic component to a terminal portion provided on a peripheral upper surface of the substrate through an adhesive tape, followed by applying heat and pressure to the terminal portion, and then applying heat and pressure to the terminal portion.

Electronic components to be bonded are, for example, IC chips, TCP (Tape Carrier Package), COF (Chip On Film), and the like. TCP is a package in which a chip such as an IC is mounted on a thin film. The adhesive tape is made of, for example, ACF (Anisotropic Conductive Film), and has a width of several millimeters and a thickness of several ten microns. ACF is a film having anisotropic conductivity made of a resin containing metal particles.

Thus, the thin adhesive tape is constituted as a tape-like member affixed to a release tape. The tape-like member is sent out from the reel, and after the adhesive tape is pressed against the substrate, only the release tape is peeled off and discharged.

The tape-like member was replaced by a new tape-like member manually when the adhesive tape was removed by the bonding operation. Specifically, the operator performed the following operation. First, replace the reel with no adhesive tape into an unused reel. A new tape-like member is taken out from the replaced, unused reel. The adhesive tape for a predetermined length is peeled off from the tip of the pulled out tape-like member, and is set in an adhesive device. In this way, peeling off the adhesive tape at the tip portion is performed by attaching the adhesive tape to a conveying roller or the like that sandwiches the tape-shaped member (release tape) from both sides at the downstream side in the conveying direction from the bonding operation position. This is to prevent poor conveyance.

[Patent Document 1] Japanese Patent Application Laid-Open No. 2004-186387

As described above, when the tape-like member is replaced, in order to ensure the accuracy of adhesion to the substrate, a head derivation operation is performed by aligning the cutting part of the adhesive tape, the leading part (hereinafter, simply referred to as ``tip''), to a predetermined position. Was doing. This conventional head derivation operation is an operation in which the operator visually transports the tape-shaped member while aligning the position to a predetermined position, for example, an adhesive working position, and it is difficult to visually recognize the tape-shaped member from the adhesive tape side due to the configuration of the device. In some cases, it was difficult to position the tape-like member at a predetermined position, such as excessive transfer.

The present invention has been made in order to solve the above problems, and an object thereof is to provide an adhesive tape adhesive device capable of automatically deriving a head of the adhesive tape.

The adhesive device of the present invention includes a supply unit for supplying a tape-like member to which an adhesive tape is adhered to a release tape, an adhesive unit for bonding an adhesive surface of the adhesive tape on the opposite side of the release tape to an object to be bonded. , A conveying part for transferring the tape-like member from the supply part to the adhesive part, and disposed on the adhesive tape side of the tape-like member, and the optical axis is directed to an adhesion reference position set for the adhesion part, and the adhesion standard With respect to the vertical direction of the adhesive surface of the adhesive tape positioned at the position, the lighting unit and the optical axis are arranged to be intersected at a predetermined angle, and the optical axis is aligned with the adhesive reference position, and the tape-like member In the adhesive tape, based on an image of the tape-like member, which is disposed on the side of the adhesive tape and captures the tape-like member positioned at the adhesion reference position, and the image of the tape-like member obtained by the image pickup It characterized in that it comprises a determination unit for determining whether or not the state of the cut portion.

A cutter provided between the supply part and the adhesive part, and a cutting part for cutting the adhesive tape of the tape-like member to form a half cut line serving as the cut part, and the conveying part, wherein the half cut line is attached to the adhesive tape. The tape-like member is transferred to come to a reference position, the imaging unit captures the tape-like member including the half cut line, and the determination unit detects the half cut line from the image obtained by the imaging unit. In addition, you may determine whether or not the shape of the cut surface of the half cut line is good or bad.

The determination unit may determine whether or not the detected half cut line is in an allowable range including the adhesion reference position.

And a conveyance control unit for calculating a distance between the half-cut line and the adhesion reference position, and when it is determined that the half-cut line is out of the allowable range by the determination unit, the conveyance unit comprises: Based on the distance calculated by the above, the tape-like member may be conveyed so that the half cut line is positioned at the bonding reference position.

The adhesive portion adheres the adhesive tape downstream of the half-cut line to the object to be adhered, and the image pickup portion photographs the tape-like member after adhesion by the adhesive portion, and the determination portion comprises: Before and after, the presence or absence of the adhesive tape may be determined in a plurality of regions set along the width direction of the adhesive tape, and the quality of the head lead-out of the adhesive tape may be determined based on the determination result.

The determination unit may gray-scale the image to detect the cut portion.

The lighting unit may be provided so that the optical axis is inclined by 60° to 85° with respect to the vertical direction of the adhesive surface of the adhesive tape positioned at the bonding reference position.

The illumination unit may irradiate white light or green light.

The adhesive tape may be an anisotropic conductive film.

ADVANTAGE OF THE INVENTION According to this invention, it is possible to obtain an adhesive tape adhesive device capable of automatically leading out the adhesive tape head.

1 is a schematic configuration diagram of a bonding device according to an embodiment.
2 is a functional block diagram of a control unit.
3 is a flowchart showing an example of an operation of leading out a head of an adhesive tape of the adhesive device according to the embodiment.
Figure 4 (a) is a diagram showing the transfer of the tape-like member. (b) is a diagram for explaining the leading portion of the adhesive tape. (c) is a diagram showing the formation of a half cut line. (d) is a diagram for explaining the determination of whether the position of the half cut line is good or bad. (e) is a diagram for explaining the throw away of the adhesive tape. (f1) is a diagram showing a mode in which it is determined that there is an adhesive tape on the downstream side of the adhesion reference position and is determined to be defective. (f2) is a diagram showing a mode in which it is determined that there is no adhesive tape on the upstream side of the adhesion reference position and is determined to be defective. (g) is a diagram showing an aspect in which there is no adhesive tape on the downstream side of the adhesion reference position, and it is determined that there is an adhesive tape on the upstream side of the adhesion reference position, and is determined as good.
Fig. 5 (a) is a cross-sectional view showing a photographing state of a tape-like member in the bonding apparatus of a comparative example. (b) is an image of a tape-like member obtained by the bonding apparatus of the comparative example.
Fig. 6(a) is a cross-sectional view showing a photographing state of a tape-like member in the bonding device of the embodiment. (b) is an image of a tape-like member obtained by the bonding apparatus of the embodiment.
7 shows an inclination angle θ of the optical axis of the lighting unit with respect to the line of the tape-like member, and the detection result of the cut portion of the adhesive tape at the angle.
Fig. 8 (a) is a schematic diagram showing the correction of the feed of the tape-like member when the half cut line is shifted just in front of the bonding reference position. (b) is a schematic diagram showing the correction of conveyance of the tape-like member when the half cut line is shifted beyond the reference position for adhesion.
9 is a flowchart showing an example of an operation of bonding an adhesive tape to a substrate in the bonding apparatus.
10 is a diagram showing the bonding operation of the bonding device according to the embodiment. (a) shows a state in which the head of the adhesive tape is drawn out and the substrate is set. (b) shows a half-cut state. (c) shows a state in which the tape-like member is conveyed. (d) shows a state in which the adhesive tape is adhered to the substrate and the release tape is peeled off.
11 is a schematic diagram for explaining an arrangement mode of an illumination unit of the bonding device according to another embodiment.

[Embodiment]

An example of an embodiment of the present invention (hereinafter referred to as an embodiment) will be specifically described with reference to the drawings. On the other hand, as shown in FIG. 1, the tape-like member 2 used in the present embodiment is, for example, an adhesive tape 21 adhered to a release tape 22. The adhesive tape 21 is, for example, an anisotropic conductive film (ACF). The release tape 22 is a tape that can be peeled off from the adhesive tape 21 and is formed of, for example, a resin film such as polyimide. The width of the tape-like member 2 generally used is about 0.5 mm to 3.5 mm.

[Configuration]

1 is a schematic configuration diagram of an adhesive device 1 according to an embodiment. The adhesive device 1 is a device that adheres the adhesive tape 21 of the tape-like member 2 to an object to be adhered. The object to be bonded is, for example, a throw away plate 112 to be described later, or a substrate as a member constituting a flat panel display.

As shown in Figure 1, the bonding device 1, the bonding unit 11, the supply unit 12, the collection unit 13, the conveying unit 14, the peeling unit 15, the cutting unit 16, the lighting unit ( 17), an imaging unit 18, and a control unit 19 are provided.

[Adhesion part]

The adhesive portion 11 adheres the adhesive tape 21 in the tape-like member 2 to the object to be adhered. The bonding portion 11 has a pressing head 110 and a stage member 111.

The pressure head 110 heats and presses the tape-like member 2 with respect to the object to be bonded by moving up and down by an elevating device (not shown). Therefore, a heater (not shown) is provided in the pressure head 110, and the contact surface with the tape-like member 2 is heated to a predetermined temperature. Further, a buffer member 110a is provided on the contact surface of the pressure head 110 with the tape-like member 2. This buffer member 110a is, for example, a sheet formed of an elastic body, and prevents the adhesive tape 21 softened by heating from adhering to the pressure head 110. That is, in the tape-like member 2, the surface of the adhesive tape 21 on the opposite side of the release tape 22 becomes an adhesive surface with the object to be adhered.

The stage member 111 is a member that supports the object to be adhered from below when the tape-like member 2 is heated and pressed against the object to be adhered by the pressure head 110. The stage member 111 has, on its upper surface, a support surface 111a which is a flat surface that supports the object to be bonded.

As described above, the object to be adhered to the stage member 111 is the throwaway plate 112 or a substrate used as a product. For example, to the throw away plate 112, an unnecessary portion at the top of the adhesive tape 21 is adhered. The throw away plate 112 is, for example, a metal plate, has the same size as the substrate, and is disposed on the support surface 111a of the stage member 111. On the other hand, as the throw away plate 112, a cloth tape, a plastic plate, or the like may be used instead of the metal plate. Alternatively, a cloth tape, a plastic plate, or the like may be provided on the throw away plate 112 so as to be exchangeable by adhesion or the like.

On the conveyance path through which the tape-like member 2 is conveyed with respect to the bonding operation position at which the adhesive tape 21 is adhered in the bonding portion 11, the bonding reference position 10 is set. The adhesion reference position 10 is a reference position at which the cut portion 20 of the adhesive tape 21 in the tape member 2 is aligned, and here, in the conveyance direction of the tape member 2 , Is the position of the upstream end of the pressure head 110. The cut portion 20 of the adhesive tape 21 is, for example, a half cut line 20b to be described later formed by the leading portion of the adhesive tape 21 and the cut portion 16 in the tape-like member 2.

[Supply]

The supply part 12 supplies the tape-like member 2 to the adhesive part 11. The supply unit 12 includes a supply reel 120, a tension mechanism 121, and a path roller 122. The supply reel 120 is a reel that winds and attaches the tape-like member 2 and delivers the tape-like member 2 by rotation.

The tension mechanism 121 applies tension to the tape-like member 2. The tension mechanism 121 is a pair of rollers arranged at a vertical distance so as to guide the movement of the tape-like member 2 drawn out from the supply reel 120. One roller is a fixed roller 121a that does not move up and down, and the other roller is a movable roller 121b that can move up and down. The movable roller 121b moves up and down by an elevating mechanism (not shown). That is, it moves in the direction of the black arrow in the drawing.

The path roller 122 is a roller that changes the conveyance direction of the tape-like member 2 from the tension mechanism 121 and sends it out toward the cutting portion 16.

[Recovery Department]

The recovery unit 13 recovers the release tape 22 peeled off from the adhesive tape 21 adhered to the object to be bonded in the bonding unit 11. The recovery part 13 has a recovery reel 130 and a path roller 131.

The recovery reel 130 is a reel that winds up and recovers the release tape 22. The path roller 131 is a roller that changes the conveyance direction of the release tape 22 from the side of the bonding portion 11 and sends it out toward the recovery reel 130.

[Return]

The conveying unit 14 is disposed between the bonding unit 11 and the collecting unit 13 and conveys the tape-like member 2 from the supply unit 12 to the collecting unit 13 through the bonding unit 11. The conveying unit 14 has a pair of conveying rollers 140 and a conveying motor (not shown). The pair of conveying rollers 140 sandwiches the release tape 22, and moves the tape-like member 2 from the supply reel 120 side to the recovery reel 130 side by rotation of the rollers. The conveying motor is a drive source that rotates the conveying roller 140. In the conveying motor, the rotating shaft is connected to the conveying roller 140, and the rotating shaft rotates around the axis by driving of the motor, thereby rotating the conveying roller 140 around the rotating shaft.

On the other hand, the tape-like member 2 sent out from the supply reel 120 passes through the two rollers 121a and 121b of the tension mechanism 121, the path roller 122, and the path roller 131, and the recovery reel 130 The path leading to) is the conveying path of the tape-like member 2. In addition, in order to explain the positional relationship of the respective portions, the supply portion 12 side is referred to as a relatively upstream side of the tape member 2, and the recovery portion 13 side is also referred to as a downstream side of the tape member 2. Further, the downstream side of the tape-like member 2 is referred to as front and the upstream side of the tape-like member 2 is referred to as the rear side with respect to the adhesion reference position 10.

[Peeling Department]

The peeling part 15 peels the release tape 22 from the adhesive tape 21 adhered to the object to be bonded. The peeling part 15 has peeling rods 150 and 151. The peeling rods 150 and 151 are, for example, round rods, and are members in contact with the release tape 22. The release rod 150 is in contact with the surface of the release tape 22, that is, the surface on the side of the adhesive tape 21, and the release rod 151 is in contact with the back surface of the release tape 22. The peeling rods 150 and 151 are moved from the downstream side of the bonding portion 11 to the upstream side (Fig. 1, dotted line) in a state in which the release tape 22 is in contact, as shown in Fig. 1 by a moving mechanism not shown. By moving horizontally in the direction of the arrow), the release tape 22 is peeled from the pressure-sensitive adhesive tape 21 pressed onto the object to be bonded.

[Cutting part]

The cutting part 16 cuts the adhesive tape 21 in the tape-like member 2. The cutting portion 16 may further cut into the release tape 22 so as not to cut the release tape 22. The cutting of the adhesive tape 21 in this way is hereinafter referred to as a half cut, and the line formed on the adhesive tape 21 by the cutting portion 16 is referred to as a half cut line 20b.

The cutting portion 16 is provided between the supply portion 12 and the bonding portion 11 and has a cutter 160 and a backup member 161. The cutter 160 is a member to be cut in contact with the adhesive tape 21, and is provided between the supply portion 12 and the adhesive portion 11. In the cutter 160, the blade at its tip is brought into contact with and separated from the backup member 161 by an elevating mechanism (not shown). The blade at the tip end of the cutter 160 extends in the width direction of the tape-like member 2. The backup member 161 is a rectangular parallelepiped block. This backup member 161 has a flat surface 161a that sandwiches the tape-like member 2 between the cutter 160 and the release tape 22 in the horizontal direction on the lower surface of the block. On the other hand, in this embodiment, the position of the cutting part 16 is set so that the distance between the cutter 160 and the adhesion reference position 10 becomes shorter than the length of the adhesive tape 21 adhered to the substrate.

[Lighting part]

The lighting part 17 is disposed on the side of the adhesive tape 21 in the tape-like member 2 in the vicinity of the adhesion reference position 10. Specifically, the lighting unit 17 is disposed below the tape member 2 and illuminates the tape member 2 from the adhesive tape 21 side.

The lighting unit 17 is provided so that its optical axis is directed to the bonding reference position 10 so as to be intersected with respect to the repair of the tape-like member 2. This repair is orthogonal to the surface of the tape-like member 2, more specifically, with respect to the above-described adhesive surface of the adhesive tape 21 in the tape-like member 2 positioned at the adhesion reference position 10. It is a straight line. When the tape-like member 2 is conveyed horizontally with respect to the adhesion reference position 10, the repair may be a vertical line with respect to the horizontal direction. It is preferable that the optical axis of the lighting unit 17 is inclined by 60° to 85° with respect to the vertical direction of the adhesive surface of the adhesive tape 21 positioned at the bonding reference position 10. The lighting unit 17 may be provided on the upstream side of the tape member 2 or may be provided on the downstream side of the tape member 2. As the lighting unit 17, for example, an LED that irradiates visible light can be used, and among them, a white light or green light LED may be used. On the other hand, that the optical axis of the lighting unit 17 is directed to the adhesion reference position 10 means that the lighting unit 17 is disposed toward the adhesion reference position 10, and the optical axis at the position shown in FIG. It is not necessary to completely intersect with the bonding reference position 10.

[Imaging unit]

The imaging unit 18 captures an image of the tape-like member 2 at the adhesion reference position 10. The imaging unit 18 is, for example, a camera. The imaging unit 18 aligns the optical axis with the adhesion reference position 10 and is disposed on the adhesive tape 21 side in the tape-like member 2, and is on the adhesive tape 21 side by the lighting unit 17. In the state where the tape-like member 2 is projected from, the tape-like member 2 is imaged. Specifically, the imaging unit 18 is below the tape-like member 2 and is disposed immediately below the adhesion reference position 10, and the optical axis is orthogonal to the tape-like member 2. That is, when the adhesive reference position 10 is included in the imaging range of the imaging unit 18, and the cut portion 20 of the adhesive tape 21 enters the imaging range by the transfer of the tape-like member 2, The imaging unit 18 captures the tape-like member 2 including the cut portion 20. On the other hand, the optical axis of the imaging unit 18 does not need to be orthogonal to the tape member 2. For example, the optical axis of the imaging unit 18 may be intersected by about 15° with respect to the line of the tape member 2 as viewed from the conveyance direction of the tape member 2. On the other hand, also in the imaging unit 18, it is not necessary that the optical axis completely coincide with the bonding reference position 10, and the desired portion of the tape-like member 2 positioned at the bonding reference position 10 may enter the imaging range. .

[Control unit]

The control unit 19 is a control device that unifies control of each part of the bonding device 1. The control unit 19 can be configured by, for example, a dedicated electronic circuit or a computer operating with a predetermined program. That is, for the control of the bonding unit 11, the tension mechanism 121, the conveying unit 14, the peeling unit 15, the cutting unit 16, the lighting unit 17, and the imaging unit 18, the control contents are programmed. And is executed by a processing device such as a PLC or CPU.

2 is a functional block diagram of the control unit 19. As shown in FIG. 2, the control unit 19 includes an adhesion control unit 190, a tension mechanism control unit 191, a peeling control unit 192, a cutting control unit 193, a lighting control unit 194, and an imaging control unit 195. , A determination unit 196 and a transfer control unit 197 are provided.

The adhesion control unit 190 controls the heater and the lifting device provided in the adhesion part 11 to heat the pressurizing head 110 to the heater, and to lift the pressurizing head 110 heated by the lifting device. The tension mechanism control part 191 controls the lifting mechanism provided in the tension mechanism 121, and applies tension to the tape-like member 2 by moving the movable roller 121b up and down.

The peeling control unit 192 controls the moving mechanism installed in the peeling unit 15 to horizontally move the peeling rods 150 and 151 to transfer the adhesive tape 21 compressed to the throw away plate 112 to the release tape 22 ) To peel off. The cutting control unit 193 controls the lifting mechanism provided in the cutting part 16 to lift the cutter 160.

The lighting control unit 194 controls the lighting unit 17 to be turned on and off. The imaging control unit 195 controls the imaging of the imaging unit 18.

The determination unit 196 is based on the image of the tape-like member 2 obtained by the imaging unit 18, in a state such as the good or bad position of the cut portion 20 of the adhesive tape 21 or the good or bad cut surface. Determine good or bad. The determination unit 196 converts the image of the tape-like member 2 into gray scale, and detects the position of the cut portion 20 of the adhesive tape 21. Then, the determination unit 196 determines whether or not the detected cut portion 20 is located within the allowable range of the adhesion reference position 10. When the cut part 20 falls within the allowable range, it is determined as good, and if the cut part 20 is outside the allowable range, it is determined as defective. On the other hand, gray scaling refers to, for example, converting the brightness of an image into multi-level pixel values according to the brightness, and is typically a conversion using 256 gray scales of the pixel value 0 (black) to 255 (white). .

Based on the image of the tape-like member 2 obtained by the imaging unit 18, the determination unit 196 detects the half cut line 20b as the cut portion 20, and Judge. The shape of the cut surface of the half cut line 20b is the shape of the cutout formed by the cutter 160 when the tape-like member 2 is viewed from the adhesive tape 21 side. The half-cut line 20b is judged to be good when, for example, a pixel value in the width direction of the tape-like member 2 is detected as a large (bright) linear type, and the portion with a large pixel value is determined to be linear. Rather, it is judged as defective if it is obliquely or if it is uneven, such as meandering or crumbling.

In addition, the determination unit 196 determines whether or not the adhesive tape 21 is deducted into the head based on the presence or absence of the adhesive tape 21 in the area before and after the adhesion reference position 10. With the derivation of the head of the adhesive tape 21, a new supply reel 120 is set, and a half-cut line 20b formed at the tip of the leading adhesive tape 21 that can be adhered to a substrate as a product is indicated at an adhesion reference position ( It refers to positioning within a predetermined range including 10), and the predetermined range is an allowable range assuming that the half cut line 20b is positioned at the bonding reference position 10. The determination unit 196 may determine the presence or absence of the adhesive tape 21 by dividing each region before and after the adhesion reference position 10 into a plurality of small regions.

When it is determined that the position of the cut part 20 is defective by the determination part 196, the conveyance control unit 197 is the distance between the cut part 20 of the adhesive tape 21 and the adhesion reference position 10 ( Misalignment). That is, when the position of the cut part 20 is defective, the position of the cut part 20 is shifted beyond the allowable range with respect to the adhesion reference position 10, so that the position of the cut part 20 is within the allowable range. It is necessary to correct the position of the tape-like member 2. Therefore, the conveyance control unit 197 calculates the distance between the bonding reference position 10 and the position of the cut portion 20 based on the captured image of the imaging unit 18, and based on the calculated distance, the transfer motor It generates a control signal to drive. That is, this control signal is a signal for conveying the tape-like member 2 so that the half-cut line 20b comes to the bonding reference position 10 for the calculated distance, and is output to the conveying motor.

[action]

The operation of the bonding device 1 of the adhesive tape 21 having the above-described configuration will be described.

[Adhesive tape head derivation operation]

3 is a flowchart showing an example of a head lead-out operation of the adhesive tape 21 of the adhesive device 1 according to the embodiment.

On the other hand, as a premise, a new supply reel 120 is set in the supply unit 12, the tape-like member 2 is withdrawn from the supply reel 120, and the tension mechanism 121, the path roller 122, the peeling unit It is wound on the recovery reel 130 through (15), the path roller 131, and the conveyance roller 140. In addition, the pressure-sensitive adhesive tape 21 in the tape-like member 2 is peeled off by an operator on the downstream side before being wound, and the leading portion 20a, which is the cut portion 20 of the adhesive tape 21, is It is assumed that it is located upstream from the imaging unit 18, that is, the adhesion reference position 10. That is, the adhesive tape 21 is peeled off from the downstream side of the leading portion 20a, and the surface of the release tape 22 is exposed. Since the shape of the leading part 20a of the adhesive tape 21 is peeled by an operator, it is arbitrary. For example, there may be a line parallel to the width direction of the tape-like member 2, a line inclined with respect to the width direction of the tape-like member 2, or a valley with respect to the width direction of the tape-like member 2 ) It may be a meandering line or an uneven line.

In addition, it is assumed that the throw away plate 112 is previously disposed on the support surface 111a of the stage member 111.

As shown in Fig. 3, the lighting unit 17 is turned on by the lighting control unit 194, and the tape-like member 2 including the adhesion reference position 10 is illuminated (step S01). As shown in (a) of Fig. 4, the tape-like member 2 is transferred by a predetermined pitch by the conveying unit 14 (step S02), and adhered by the imaging unit 18 and the determining unit 196. It is determined whether the position of the leading portion 20a (cutting portion 20) of the tape 21 is good or bad (step S03). That is, when the tape-like member 2 is transferred by the conveying part 14, the imaging unit 18 photographs the tape-like member 2 in the imaging range including the adhesion reference position 10, and the determination unit Reference numeral 196 is gray-scaled the image obtained by the imaging unit 18, and, as shown in Fig. 4B, within a predetermined range R1 including the adhesion reference position 10 from the difference in shade. It is determined whether or not the leading portion 20a of the adhesive tape 21 is included. The portion with the adhesive tape 21 is dark, the portion without the adhesive tape 21 becomes bright, and the border of light and dark becomes the leading portion 20a. The predetermined range R1 is, for example, an inspection area set within the imaging range.

The conveyance pitch of the conveyance part 14 is equal to or shorter than the length of the conveyance direction of the tape-like member 2 of the predetermined range R1. If the head portion 20a is not detected by the determination unit 196 (NO in step S03), the process returns to step S02, and steps S02 and S03 are repeated until the head portion 20a is detected.

When the leading portion 20a is detected by the determination unit 196 (YES in step S03), the tape-like member 2 is stopped at the position where the leading portion 20a is detected, and the cutting control unit 193 is By raising the cutter 160, half-cutting the tape-like member 2 (step S04), and cutting the adhesive tape 21 as a cut portion 20 as shown in Fig. 4(c). A half cut line 20b is formed. Then, the tape-like member 2 is conveyed by the conveying section 14 for the distance between the cutting section 16 (cutter 160) and the adhesion reference position 10 (step S05). Subsequently, the tape-like member 2 is photographed by the imaging unit 18, and the presence or absence of the half cut line 20b is detected by the determination unit 196 (step S06). When the half cut line 20b is not detected (NO in step S06), the process returns to step S04.

When the half cut line 20b is detected (YES in step S06), as shown in Fig. 4D, by the determination unit 196, the detected half cut line 20b is the adhesion reference position. It is determined whether or not it is within the allowable range including (10) (step S07). When the half cut line 20b is not within the allowable range (NO in step S07), the feed correction of the tape-like member 2 is performed. That is, based on the position of the half cut line 20b and the position of the adhesion reference position 10 recognized within the predetermined range R1, the conveyance control unit 197 is the half cut line 20b and the adhesion reference position ( 10) Calculate the distance between (step S08), and transfer the tape-like member 2 by the conveying unit 14 for the calculated distance so that the half cut line 20b comes to the bonding reference position 10 (Step S09), and the process returns to step S07.

When the half cut line 20b is within the allowable range (YES in step S07), the portion from the head 20a to the half cut line 20b of the adhesive tape 21 is the pressure head 110 and the throw away plate. It is located between 112. In this state, the tape-like member 2 is pushed down with the pressure head 110 heated in advance, and the unnecessary adhesive tape 21 on the downstream side of the half cut line 20b is thrown away to the throwaway plate 112. [Step S10, see Fig. 4 (e)]. That is, by lowering the pressure head 110 heated in advance by the adhesive control unit 190, unnecessary adhesive tape 21 from the head portion 20a to the half cut line 20b is transferred to the throwaway plate 112. Bonding and raising the pressure head 110. Thereafter, by the peeling control unit 192, the peeling rods 150 and 151 are horizontally moved toward the adhesive portion 11, and the release tape 22 is peeled from the adhesive tape 21 compressed to the throw away plate 112. (Step S11).

When the release tape 22 is peeled off, the tape-like member 2 is photographed by the imaging unit 18 (step S12). On the other hand, at this time, since the tape-like member 2 is not being transported, the position of the cut portion 20 of the adhesive tape 21 remaining on the upstream side of the adhesion reference position 10 is located at the adhesion reference position 10 Does not change. The determination unit 196 gray-scales the image obtained by the imaging unit 18, and, as shown in Fig. 4(f1) and (f2), 3 places each before and after the adhesion reference position 10 In each of the small areas R11 to R16 as inspection areas of six points set each, the presence or absence of the adhesive tape 21 is determined (step S13). The front and rear small regions R11, R12, R13 and R14, R15, R16 are set in advance so that they are arranged side by side in the width direction of the tape member 2. The determination of the presence or absence of the adhesive tape 21 is, for example, in the case where the ratio of pixels exceeding a predetermined pixel value in each of the small regions R11 to R16 becomes a predetermined ratio or higher, in other words, less than a predetermined pixel value. When the ratio of the pixels becomes less than the predetermined ratio, it is determined that there is no adhesive tape 21 in the small regions R11 to R16, and the ratio of pixels exceeding the predetermined pixel value is less than the predetermined ratio. In other words, when the ratio of pixels falling below the predetermined pixel value is equal to or higher than the predetermined ratio, it is determined that the adhesive tape 21 is present in the small regions R11 to R16. Thereby, the determination unit 196 judges the quality of the state (shape) of the tip (half cut line 20b) of the adhesive tape 21 remaining on the upstream side after the unnecessary adhesive tape 21 has been peeled off. Determine whether or not to deduce.

The determination unit 196, as shown in (f1) of Fig. 4, the adhesive tape 21 in at least one of the small regions R14 to R16 in front (downstream) of the adhesion reference position 10 When it is determined that there is (NO in step S14), the process returns to step S04 as a head derivation failure. On the other hand, in this case, it is considered that a part of the adhesive tape 21 is not peeled off at the time of peeling of the unnecessary adhesive tape 21 but remains on the release tape 22, resulting in poor peeling.

On the other hand, as shown in Fig. 4(f2), it is a case where it is determined that there is no adhesive tape 21 in any of the small regions R14 to R16 in front (downstream) of the adhesion reference position 10. (YES in step S14), when it is determined that there is no adhesive tape 21 in at least one of the small regions R11 to 13 behind (upstream side) of the adhesion reference position 10 (NO in step S15), It returns to step S04 as a head derivation failure. In this case, at the time of peeling of unnecessary adhesive tape 21, it is considered that a part of the tip of the adhesive tape 21 on the upstream side, which is the leading adhesive tape 21, has peeled off together. As this cause, it is considered that the half-cut by the cutter 160 is defective, and the unnecessary adhesive tape 21 and a part of the leading adhesive tape 21 are connected in the half-cut line 20b.

In addition, as shown in Fig. 4(g), it is a case where it is determined that there is no adhesive tape 21 in any of the small regions R14 to R16 in front (downstream) of the adhesion reference position 10. (YES in step S14), when it is determined that the adhesive tape 21 exists anywhere in each of the small regions R11 to 13 behind (upstream) the adhesion reference position 10 (YES in step S15), It is determined that the head has been derived, and it ends.

On the other hand, it is also contemplated that the NO determination in step S06, S14, or S15 returns to step S04, and the NO determination is made again in the following step S06, S14, or S15. In this case, the step of determining the number of repetitions may be set before step S06 or step S14, and when the set number of times is repeated, the head derivation operation is stopped as an error, and the operator may be notified of an abnormality by an alarm or the like. In this case, a half-cut failure caused by the above-described cutter 160 is considered as one of the causes. Therefore, the control unit 19 may prompt the execution of a maintenance operation such as cleaning or replacing the cutter 160 by an alarm.

[Action]

The operation of the bonding device 1 according to the embodiment will be described with reference to Figs. 5 to 8, taking a comparative example.

(Slope of lighting)

Fig. 5A is a cross-sectional view showing a photographing state of the tape-like member 2 in the bonding apparatus of the comparative example. 5B is an image of the tape-like member 2 obtained by the bonding apparatus of the comparative example. However, the graph of the pixel values for each position of the image is superimposed on the image. The pixel values are represented by 256 gray scales in which black is 0 and 255 is white.

As shown in Fig. 5A, a half mirror M is provided inside the image pickup unit 18, and the light L has its optical axis directed toward the half mirror M, and the illumination ( The light of L) is reflected by the half mirror M, and the light of the illumination L is coaxial light parallel to the optical axis of the imaging unit 18, and is incident from a direction perpendicular to the tape-like member 2 .

As shown in Fig. 5B, almost no difference was obtained in the pixel values of the adhesive tape 21 and the release tape 22. Therefore, detection of the cut portion 20 of the adhesive tape 21 has become difficult.

In this way, it is understood that detection of the cut portion 20 of the adhesive tape 21 is difficult simply by providing the lighting L.

Fig. 6(a) is a cross-sectional view showing a photographing state of the tape-like member 2 in the bonding device 1 according to the embodiment. 6B is an image of the tape-like member 2 obtained by the bonding device 1 of the embodiment. However, the graph of the pixel values for each position of the image is superimposed on the image. The pixel values are represented by 256 gray scales in which black is 0 and 255 is white.

As shown in (a) of FIG. 6, the optical axis of the lighting unit 17 is intersected with respect to the repair of the tape-like member 2, and the optical axis of the imaging unit 18 is orthogonal to the tape-like member 2, have. By constituting in this way, as shown in Fig. 6B, a large difference occurs in the pixel values of the adhesive tape 21 and the release tape 22, and the contrast between the locations with and without the adhesive tape 21 Became clearer. It is assumed that this is due to the shape of the fine irregularities on the surface of the release tape 22 and the shape of the fine metal fine particles contained in the adhesive tape 21. That is, the metal particles of the adhesive tape 21 are substantially spherical, and the amount of diffused light entering the image pickup unit 18 does not change significantly whether incident light from the illumination unit 17 is coaxial or intersecting. In contrast, the irregularities on the surface of the release tape 22 are random, and therefore, it is estimated that the amount of diffused light entering the imaging unit 18 is increased by intersecting the incident light from the illumination unit 17. For example, in FIG. 6, the angle at which the optical axis of the lighting unit 17 intersects the repair line of the tape-like member 2 is set to 75°, but the pixel value at the point where the adhesive tape 21 is located is about 97, and The pixel value at the point where the tape 21 is not present is about 157. As described above, the difference in light and shade becomes 50 or more, and the cut portion 20 of the adhesive tape 21 can be stably detected.

Thus, the inventors conducted an experiment to investigate the relationship between the angle of the optical axis of the lighting unit 17 and the amount of light entering the image pickup unit 18. Fig. 7 shows an inclination angle θ of the optical axis of the lighting unit 17 with respect to the line of the tape-like member 2, and the detection result of the cut portion 20 of the adhesive tape 21 at this angle. On the other hand, the detection result is a white LED manufactured by Seiwa Kogaku Seisakusho (model: SBR-15-50W) as the lighting unit 17, and as the imaging unit 18, a camera manufactured by Omron ( Format: FZ-S) was used, and the distance between the tape-like member 2 and the imaging unit 18 was set to 100 mm. In addition, as the tape-like member 2 as an object of photographing, a tape-like member 2 in which the cut portion 20 of the adhesive tape 21 is formed parallel to the width direction of the tape-like member 2 was used.

As shown in FIG. 7, the inclination angle θ was changed to 30°, 45°, 60°, 75°, 85°, and 90° to attempt detection of the cut part 20. As a result, in the case of 30°, 45°, and 90°, good detection of the cut portion 20 was not possible. On the other hand, when the inclination angle θ was 60°, 75°, and 85°, good detection of the cut portion 20 was possible. That is, the difference between the pixel values of the location where the adhesive tape 21 is and the location without the adhesive tape 21 is 50 or more, and the determination accuracy of the detection of the presence or absence of the adhesive tape 21 is improved.

Thus, by setting the inclination angle θ to 60° to 85°, the detection of the leading portion of the adhesive tape 21, the detection of the half cut line 20b formed on the adhesive tape 21, and the adhesion reference position ( Also in the detection of the presence or absence of the adhesive tape 21 before and after 10), the determination accuracy of the presence or absence of the adhesive tape 21 can be improved in common.

(Tape-shaped member feed correction)

The correction of the feed of the tape-like member 2 will be described. As described above, the distance between the cutting portion 16 and the bonding reference position 10 is determined in advance, and after forming the half-cut line 20b, the distance is determined by the transfer unit 14 and the transfer control unit 197. The half-cut line 20b comes to the adhesion reference position 10 by conveying the tape-like member 2 of 2.

However, in practice, an error may occur in the conveying amount of the tape-shaped member 2 due to a rotation error of the conveying motor or the conveying roller 140 or the expansion and contraction of the tape-shaped member 2. As the width of the tape-like member 2 becomes thinner, the tape-like member 2 is more easily stretched even with a constant tension, and it is more likely to be jammed in each roller or the like. Therefore, the tape-like member 2 may generate unique elongation for each type. In this way, when an error occurs in the conveying amount of the tape-like member 2, the affixing error in the conveying direction of the adhesive tape 21 increases.

Therefore, in this embodiment, it is determined by the imaging unit 18 and the determination unit 196 whether or not the half cut line 20b is located within the allowable range of the bonding reference position 10, and the half cut line 20b ) Is out of the predetermined range, the conveyance control unit 197 calculates the distance between the half cut line 20b of the adhesive tape 21 and the adhesion reference position 10, and the half cut line ( A correction amount for conveying the tape-like member 2 by the conveying section 14 is set so that 20b) comes to the bonding reference position 10. In the bonding operation described later, the tape-like member 2 is transferred to the bonding reference position 10 by a transfer amount plus the correction amount.

That is, as shown in (a) of FIG. 8, when the half cut line 20b is shifted immediately in front of the adhesion reference position 10 by the transfer of the tape-like member 2, the shift distance D1, The tape-like member 2 is transferred to the adhesive part 11 side. On the other hand, as shown in (b) of Fig. 8, when the half-cut line 20b is shifted beyond the adhesion reference position 10 due to the transfer of the tape-like member 2, the distance D2 is shifted, and the tape The mold member 2 is conveyed to return to the cut portion 16 side.

In this way, since the deviation between the half cut line 20b and the adhesion reference position 10 is detected, and the transfer of the tape-like member 2 is corrected to eliminate the deviation, the head of the adhesive tape 21 can be accurately derived. As a result, the adhesive tape 21 can be accurately adhered to the substrate provided on the adhesive portion 11.

[Adhesion operation]

9 is a flowchart showing an example of the bonding operation of the adhesive tape 21 to the substrate of the bonding apparatus 1. 10 is a diagram showing the bonding operation of the bonding device 1.

As a premise, as shown in Fig. 10 (a), the cut portion 20 (half cut line 20b) of the adhesive tape 21 is located at the reference position 10 for adhesion, and the adhesive tape 21 It is assumed that the derivation of the head of is completed. That is, the cutter 160 has been inspected in the process of the head derivation operation, and the half cut line 20b, which is the cutting part 20, is parallel to the width direction of the tape-like member 2 by the cutting part 16. It is normally formed to do. Further, the adhesive tape 21 does not remain on the downstream side of the cut portion 20, and the adhesive tape 21 does not adhere to a member in contact with the tape member 2 such as the transfer roller 140, It is possible to prevent the member 2 from becoming defective in transport.

In addition, on the support surface 111a of the stage member 111, instead of the throw away plate 112, it is assumed that, for example, a product substrate 300 as a member constituting a flat panel display is disposed. On the other hand, the adhesive tape 21 is adhered to the substrate 300 with a desired length. Here, for convenience, it is assumed that the adhesive tape 21 is adhered to the entire conveyance direction of the substrate 300, and the distance between the cutting portion 16 and the adhesion reference position 10 is the length of the substrate 300 and the pressure head ( It shall be the same as the length of 111).

As shown in Fig. 10B, first, the tape-like member 2 is cut in half by the cutting portion 16 (step S21). Then, as shown in (c) of Fig. 10, the distance between the cutter 160 and the adhesion reference position 10, the tape-like member 2 is transferred by the conveying unit 14 (step S22). . By this transfer, the half cut line 20b formed in step S21 coincides with the bonding reference position 10. After that, the stage member 111 is moved to position the edge portion of the substrate 300 to which the adhesive tape 21 is adhered under the tape-like member 2. Then, the preheated pressing head 110 is lowered, and the substrate 300 and the tape-like member 2 are inserted into the pressing head 110 and the stage member 111, and then compressed. The adhesive tape 21 is adhered onto the substrate 300 (step S23). Thereafter, by raising the pressure head 110 and horizontally moving the peeling portion 15 toward the adhesive portion 11, the adhesive tape 21 adhered to the substrate 300, as shown in FIG. 10(d). ), the release tape 22 is peeled off (step S24), and the peeling portion 15 is returned to its original position.

Thereafter, in the case where the adhesive tape 21 adheres the adhesive tape 21 to the non-adhesive substrate 300 (YES in step S25), the substrate on which the adhesion on the stage member 111 is completed is transferred to the adhesive tape 21 ) Is replaced with a new non-adhesive substrate 300, and the process returns to step S21.

On the other hand, when the adhesive tape 21 does not adhere the adhesive tape 21 to the non-adhesive substrate 300 (NO in step S25), it ends. On the other hand, in step S22 of transferring the tape-like member 2, the same transfer correction of the tape-like member 2 as in steps S06 to S09 described above may be performed.

[effect]

The adhesive device 1 of the adhesive tape 21 of the embodiment includes a supply unit 12 for supplying a tape-like member 2 to which the adhesive tape 21 is adhered to a release tape 22, and an object to be adhered, An adhesive portion 11 for bonding the adhesive surface on the side opposite to the release tape 22 of the adhesive tape 21, and a conveying portion 14 for transferring the tape-like member 2 from the supply portion 12 to the adhesive portion 11, , An adhesive tape disposed on the side of the adhesive tape 21 in the tape-like member 2, the optical axis directed to the adhesion reference position 10 set with respect to the adhesive portion 11, and positioned at the adhesion reference position 10 With respect to the vertical direction of the adhesive surface of (21), the lighting unit 17 and the optical axis are aligned at a predetermined angle to the adhesive reference position 10, and the adhesive tape in the tape-like member 2 On the image of the tape-like member 2 obtained by the imaging unit 18 and the tape-like member 2, which is disposed on the (21) side and captures the tape-like member 2 positioned at the adhesion reference position 10 On the basis of this, a determination unit 196 for determining the quality of the state of the cut portion 20 in the adhesive tape was provided.

Thereby, since the cut portion 20 of the adhesive tape 21 can be automatically recognized, the head of the adhesive tape 21 can be automatically drawn out without manually deriving the head of the adhesive tape 21. have. That is, in the case in which the lighting part L is provided so that the optical axis is orthogonal to the tape-like member 2 as in the comparative example described above, the image of the tape-like member 2 becomes unclear, and the cut part 20 is It was difficult to detect. On the other hand, according to the intensive research of the present inventors, the knowledge that the contrast of the image of the tape-like member 2 becomes clear was obtained by installing the lighting part 17 so as to be inclined to the repair of the tape-like member 2. According to this embodiment based on this knowledge, the head of the adhesive tape 21 can be drawn out automatically.

It has a cutter 160 installed between the supply part 12 and the adhesive part 11, and cuts the adhesive tape 21 of the tape-like member 2 to form a half-cut line 20b that becomes the cut part 20. A cutting part 16 is provided, and the conveying part 14 conveys the tape-like member 2 so that the half cut line 20b comes to the adhesion reference position 10, and the imaging part 18 is a half cut line. The tape-like member 2 is imaged including (20b), and the determination unit 196 detects the half cut line 20b from the image obtained by the image pickup unit 18, and the half cut line 20b is The shape of the cut surface was determined to be good or bad.

Thereby, the consumption of the cutter 160 can be managed. That is, when it is determined that the half-cut line 20b is defective, it is considered that the blade of the cutter 160 is consumed. In this case, for example, a display device such as a display or a notification means such as a speaker is connected to the control unit 19, and the operator can be urged to exchange the cutter 160 on the screen or by voice.

The determination unit 196 made it to determine whether or not the detected half cut line 20b was within the allowable range of the bonding reference position 10.

Accordingly, it is possible to improve the accuracy of the alignment of the half cut line to the bonding reference position 10.

When it is determined by the determination unit 196 that the half cut line 20b is out of the allowable range with a conveyance control unit 197 that calculates the distance between the half cut line 20b and the adhesion reference position 10 , The conveyance part 14 was made to convey the tape-like member 2 so that the half cut line 20b may be located at the adhesion reference position 10 based on the distance calculated by the conveyance control part 197.

Thereby, the precision of the head derivation of the adhesive tape 21 can be improved, and the precision of the adhesion position of the adhesive tape 21 to the substrate to be adhered in the traveling direction of the tape-like member 2 is improved. I can make it.

The adhesive part 11 adheres the adhesive tape 21 on the downstream side of the half-cut line 20b to the object to be adhered, specifically the throw away plate 112, and the imaging part 18 is attached to the adhesive part 11 The tape-like member 2 after adhesion is photographed, and the determination unit 196 is in an area set in plural along the width direction of the adhesive tape 21 before and after the adhesion reference position 10. 21) was determined, and based on the determination result, it was made to determine whether or not the adhesive tape 21 can be deducted from the head.

Thereby, the adhesive tape 21 does not remain in front of the adhesive reference position 10, and the adhesive tape 21 can be in a state behind the adhesive reference position 10, and the head of the adhesive tape 21 is drawn out Can be done exactly. In addition, it is possible to prevent poor conveyance of the tape-like member 2 due to the adhesive tape 21 remaining in the release tape 22 being rolled into a roller such as the conveying section 14 located downstream from the adhesive section 11. I can.

The determination unit 196 converted the image into gray scale to detect the cut portion 20. Thereby, not only the presence or absence of the cut part 20 but also the good part of the cut part 20 can be accurately detected. For example, when the cut portion 20 is a half-cut line 20b, the half-cut line 20b is actually completely cut by the adhesive tape 21 due to contamination of the blade tip of the cutter 160 or the blade coming off. It is considered that the adhesive tape 21 partially remains thinner than the original thickness and appears as a dotted line. When this image is subjected to a binarization process, it may be erroneously detected that the half cut line 20b is normally formed. That is, since the thickness of the remaining adhesive tape 21 is thin, when the pixel value of the adhesive tape 21 portion is on the side without the adhesive tape 21 relative to the binarization threshold, the half cut line 20b is considered to be good. Is detected. Even in such a situation, by making the image gray-scale, the adhesive tape 21 on the half cut line 20b remains without being removed from the image, and it can be detected that the half cut line 20b is defective.

The lighting unit 17 was installed so that the optical axis was inclined by 60° to 85° with respect to the line of the tape-like member 2. Thereby, the contrast of the image of the tape-like member 2 obtained by the imaging part 18 and the determination part 196 can be made clearer, and the cut part 20 can be detected accurately.

The lighting unit 17 was irradiated with white light or green light. Thereby, the contrast of the image of the tape-like member 2 obtained by the imaging part 18 and the determination part 196 can be made clearer, and the cut part 20 can be detected accurately. In particular, in the case where the white light or green light illumination unit 17 and the adhesive tape 21 are anisotropic conductive films, the contrast becomes clearer, and the detection accuracy of the cut portion 20 is improved, and as a result, the precision of head derivation is improved. I can make it.

[Other embodiments]

The present invention is not limited to the above embodiments, and includes other embodiments shown below. In addition, the present invention includes a combination of all or any one of the above embodiments and the following other embodiments. In addition, various omissions, substitutions, and changes can be made to these embodiments without departing from the scope of the invention, and modifications thereof are also included in the present invention.

In the above embodiment, the lighting unit 17 is provided on the upstream side of the tape-like member 2 with respect to the adhesion reference position 10, but as shown in FIG. 11, on the downstream side of the tape-like member 2 You may install it. In this case, after the throw away of the adhesive tape 21, the cross section of the cut portion 20b of the adhesive tape 21 is exposed to the lighting unit 17 side, so that the cross section is directly illuminated, and the image of the tape-like member 2 The contrast of becomes clear. Although it is not limited to the following mechanisms, the light reflected from the end surface of the cut part 20b or the metal particles in the adhesive tape 21 is also reflected by the release tape 22 downstream from the cut part 20b to capture an image. It is considered that this is because the amount of light received by the portion 18 and reflected near the cut portion 20b increases.

Further, in the above embodiment, correction of the conveyance amount of the tape-like member 2 was performed by the conveying unit 14, but a moving mechanism for moving the bonding unit 11 is separately provided, and the bonding unit 11 ) May be moved to align the bonding reference position 10 with the half cut line 20b.

In the above embodiment, the adhesion reference position 10 is set to a position coincident with the end of the pressure head 110 on the upstream side, but in other positions, for example, the upstream end of the pressure head 110. You can also set it on a location

In the above embodiment, when the new tape-like member 2 is set in the adhesive device 1, the cut portion 20 serving as the leading portion of the adhesive tape 21 has an arbitrary shape formed by the operator. , The cutting portion 20 may be formed parallel to the width direction of the tape-like member 2 at the time of setting. In this case, the operation of leading out the head of the adhesive tape 21 is sufficient in steps S01 to S03 described above.

1: adhesive tape adhesive device 10: adhesive reference position
11: bonding unit 110: pressure head
111: stage member 111a: support surface
112: throw away plate 12: supply
120: supply reel 121: tension mechanism
121a: fixed roller 121b: movable roller
122: path roller 13: recovery unit
130: recovery reel 131: path roller
14: conveying unit 140: conveying roller
15: peeling part 150, 151: peeling rod
16: cutting unit 160: cutter
161: backup member 161a: flat surface
17: lighting unit 18: imaging unit
19: control unit 190: adhesion control unit
191: tension mechanism control unit 192: peeling control unit
193: cutting control unit 194: lighting control unit
195: imaging control unit 196: determination unit
197: conveyance control unit 2: tape-shaped member
20: cut part of adhesive tape 20a: leading part of adhesive tape
20b: half cut line 21: adhesive tape
22: release tape 300: substrate

Claims (9)

A supply unit for supplying a tape-like member to which an adhesive tape is adhered to a release tape;
An adhesive portion for bonding an adhesive surface of the adhesive tape on the opposite side of the release tape to the adhesive object;
A conveying unit for transferring the tape-like member from the supply unit to the adhesive unit,
Arranged on the side of the adhesive tape in the tape-like member, the optical axis is directed to an adhesive reference position set with respect to the adhesive portion, with respect to the perpendicular direction of the adhesive surface of the adhesive tape positioned at the adhesive reference position , A lighting unit installed by socializing at a preset angle,
An imaging unit that aligns the optical axis with the adhesion reference position, is disposed on the adhesive tape side of the tape member, and captures the tape member positioned at the adhesion reference position;
A determination unit for determining whether or not the state of the cut portion in the adhesive tape is based on the image of the tape-like member obtained by the imaging unit
To have,
The determination unit determines the presence or absence of the adhesive tape in a plurality of regions set along the width direction of the adhesive tape before and after the adhesive reference position, and based on the determination result, the head of the adhesive tape is derived. A bonding device for an adhesive tape, characterized in that determining good or bad. The method according to claim 1, further comprising a cutting part having a cutter provided between the supply part and the adhesive part, and cutting the adhesive tape of the tape-like member to form a half cut line serving as the cut part,
The conveying unit conveys the tape-like member so that the half cut line comes to the adhesion reference position,
The imaging unit captures the tape-like member including the half cut line,
The determination unit detects the half cut line from the image obtained by the image pickup unit, and determines whether or not the shape of a cut surface of the half cut line is good or bad. The adhesive tape bonding apparatus according to claim 2, wherein the determination unit determines whether or not the detected half cut line is in an allowable range including the bonding reference position. The method according to claim 3, further comprising a conveyance control unit for calculating a distance between the half cut line and the adhesion reference position,
When it is determined by the determination unit that the half-cut line is out of the allowable range, the conveying unit, based on the distance calculated by the conveying control unit, places the half-cut line at the bonding reference position. , Adhesive tape adhesive device, characterized in that transporting the tape-like member. The adhesive tape according to any one of claims 2 to 4, wherein the adhesive portion adheres the adhesive tape downstream of the half-cut line to the adhesive object,
The apparatus for attaching an adhesive tape, wherein the image capturing unit photographs the tape-like member after adhesion by the adhesive unit. The adhesive tape bonding apparatus according to any one of claims 1 to 4, wherein the determination unit converts the image into gray scale and detects the cut portion. The method according to any one of claims 1 to 4, wherein the lighting unit is installed so that the optical axis is inclined by 60° to 85° with respect to the vertical direction of the adhesive surface of the adhesive tape positioned at the adhesive reference position. Adhesive tape bonding device, characterized in that. The adhesive tape bonding device according to any one of claims 1 to 4, wherein the illumination unit irradiates white light or green light. The adhesive tape adhesive device according to any one of claims 1 to 4, wherein the adhesive tape is an anisotropic conductive film.

Images