JPH104295A - Electronic part packaging method and its device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To avoid the production of a defective substrate due to the abnormal sticking of a conductive film by a method wherein if a conductive film is located in a correct position of a substrate is distinguished so as to package an elec tronic part only if the conductive film is located in the correct position. SOLUTION: Panel marks 8, 9 are previously printed on respective packaging positions 15 on the surface of a substrate (panel) 1 whereon a conductive film 6 is sticked Next, if the conductive film 6 is located in the correct positions of the panel marks 8, 9 is distinguished. When it is distinguished that the conductive film 6 is located in the correct positions, the XY positional slippage amount is corrected so as to package an electronic part 4 on the panel 1. Besides, when it is distinguished that the conductive film 6 is not located at least in one surface of the panel marks 8, 9, the device is stopped to inform the abnormal state of the conductive film 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an electronic component such as a driving electronic component on a substrate such as a liquid crystal panel via a conductive film such as an anisotropic conductive film (ACF). And its device.

[0002]

2. Description of the Related Art When mounting a driving electronic component on a liquid crystal panel (hereinafter referred to as a panel) in which a conductive film is pasted on electrodes in advance by a film pasting device, a panel mark provided on both ends of a panel electrode is conventionally used. The marks of the corresponding electronic components are individually recognized, and the positional relationship between them is detected to correct the positional relationship at the time of mounting.

An example of a conventional electronic component mounting method and apparatus will be described below with reference to FIGS.

As shown in FIGS. 3 and 4, this type of electronic component mounting machine includes a film sticking device 12 for sticking a conductive film 6 to a panel 1, a panel carrier 14 for transporting a panel in a direction a, and a panel carrier. Panel 1 transported from table 14
An electronic component mounting device 13 for mounting the electronic component 2 is provided.

In FIGS. 1 and 2, before the electronic component 4 is mounted on the panel 1, electrical connection between the electrode 7 of the panel 1 and the electronic component 4 is performed, and the electronic component 4 is placed on the panel 1. The conductive film 6 for fixing is attached to a plurality of mounting locations 15 on the panel 1 in advance. At the time of mounting, the positions of the component marks 10 and 11 of the electronic component 4 held by the nozzle 3 are recognized from below by the camera 5, and then the panel marks 8 and 9 of the predetermined mounting location 15 of the panel 1 held by the stage 2.
Is recognized by the same camera 5 from below, and the amount of displacement between the electronic component 4 and the panel 1 is obtained. After correcting the position with the obtained positional deviation amount, the nozzle 3 moves down and the electronic component 4
Is mounted on the panel 1. At this time, the nozzle 3 applies a temperature and a load according to the characteristics of the conductive film 6 to the electronic component 4, thereby breaking the insulating layer in the conductive film only at a portion of the conductive film 6 facing the electrode 7, thereby causing an electrical failure. Simultaneously with the joining, the conductive film 6 is cured to fix the electronic component 4.

When the conductive film 6 is not stuck on the panel 1 or when the position where the conductive film 6 is stuck is not appropriate, electrical connection is performed at the electrode of the plurality of electrodes 7 where the conductive film 6 is not interposed. No conduction failure occurs. In order to prevent this, as shown in FIG. 4, a film detecting means 16 is provided in the film sticking device 12, and a film detecting operation is performed after the film sticking is performed, and the conductive film 6 in all the mounting locations 15 is normally detected. Only the panel 1 is transported and supplied to the electronic component mounting apparatus 13.

[0007]

However, in the conventional film detecting apparatus and method, it is necessary to detect a conductive film sticking abnormality in which the conductive film is peeled off or turned up while being conveyed to the electronic component mounting apparatus after the film detecting operation. As a result, there were many occurrences of substrates with poor conduction.

According to the present invention, in a method and an apparatus for mounting an electronic component on a substrate via a conductive film, the occurrence of a defective mounting substrate caused by the conductive film not being located at a proper position on the substrate. The purpose is to suppress.

[0009]

According to the present invention, there is provided an electronic component mounting method for mounting an electronic component via a conductive film previously adhered to a substrate. Immediately before mounting, a film determining step of determining whether the conductive film is present at a regular position on the substrate, and the electronic component only when the conductive film is present at a regular position on the substrate. And a mounting step for mounting.

According to the electronic component mounting method of the present invention, not only when the conductive film stuck to the substrate is not present at the proper position, but also when the conductive film is peeled or rolled during the transportation of the substrate. In such a case, the electronic component is not mounted on the substrate, so that the occurrence of a defective substrate due to the abnormal adhesion of the conductive film can be reliably prevented.

According to the electronic component mounting apparatus of the present invention, in an electronic component mounting apparatus for mounting an electronic component via a conductive film previously attached to a substrate, the electronic component mounting apparatus recognizes a mark which is printed on the substrate in advance and indicates a legitimate mounting position. Mark recognition means, and the mark recognition means also serves as film discrimination means for discriminating whether or not the conductive film exists at a regular position on the substrate.

According to the electronic component mounting apparatus of the present invention, the same operation and effect as the invention of the electronic component mounting method can be obtained, and the mark recognizing means also functions as the film discriminating means. Compared with the case, the discriminating means only for discriminating the film can be omitted.

In the electronic component mounting method according to the present invention,
The substrate is a transparent substrate, a data creation step of creating in advance recognition data of the mark and the conductive film on the substrate before the start of mounting, and the mark and the conductive film based on the recognition data from the mounting back surface of the substrate. A mark recognition step for recognition is provided, and the film determination step is configured to determine whether or not the conductive film is present at a regular position on the substrate based on the recognition data and the output of the mark recognition step. Since the mark and the conductive film can be recognized from the mounting back surface of the substrate, and the film is also distinguished by one operation of the mark recognition, compared to the case where the two are separate, the time from the film attachment to the mounting of the electronic component is reduced. Can be shortened.

In the electronic component mounting method, the data creation step may include a step of recognizing the mark when the conductive film is present on the mark on the substrate and a step of recognizing the mark when the conductive film is not present on the mark. It is configured to adjust the illuminance of illumination so as to perform recognition data creation under the illuminance condition so that the mark recognition process cannot identify the mark by making the surrounding luminance of the mark substantially equal to the luminance of the mark. In the data creation step, generally, the recognition data can be easily created by adjusting the illuminance of the illumination required at the time of creating the recognition data.

In the electronic component mounting method according to the present invention,
The mark recognition step recognizes the marks of a plurality of mounting locations on the board, and the film discrimination step includes the step of recognizing the conductive film at a regular position on the board when even one of the plurality of marks is not recognized normally. If it is configured to determine that it is not performed, the number of mounted electronic components at the time of detecting the conductive film sticking abnormality can be eliminated or minimized, so the peeling of the conductive film on the substrate where the abnormality has been detected, the re-pasting process becomes easy and suitable. It is.

[0016]

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 to 3 show an electronic component mounting apparatus according to the present invention. The electronic component mounting apparatus 13 is disposed on a panel carrier 14 for transporting the panel in the direction a as shown in FIG.
It is located downstream of the film sticking device 12. As shown in FIGS. 1 and 2, the electronic component mounting apparatus 13
XY stage 2 for holding the electronic component 4, a nozzle 3 for mounting the electronic component 4 on the panel 1, and a camera 5 as a mark recognizing means for recognizing the panel marks 8, 9 of the panel 1 and the component marks 10, 11 of the electronic component 4. It is composed of

The XY stage 2 holds the panel 1 and marks panel marks 8 and 9 of each mounting portion 15 of the panel 1 with the camera 5.
Above, and to correct the positional deviation of the mounting location 15 detected by the camera 5, two-dimensional, that is, XY
It can be moved in the direction by numerical control.

The nozzle 3 sucks and holds the electronic component 4 to position the component marks 10 and 11 of the electronic component 4 above the camera 5 and to correct the positional deviation of the electronic component 4 detected by the camera 5. Further, since the electronic component 4 is mounted on the panel 1, the electronic component 4 can be moved by numerical control not only in the XY directions but also in the vertical direction.

The camera 5 is fixed and has panel marks 8 and 9 on the panel 1 and component marks 10 and 11 on the electronic component 4.
And a film discriminating means for discriminating whether or not the conductive film 6 is present at a proper position on the panel 1 based on the output of the mark recognizing means and separately prepared recognition data. Also serves as. Also, camera 5
Has a built-in illumination that can adjust the illuminance for irradiating the panel 1 from the lower surface side (the mounting rear surface side) in the optical system.
Further, above the camera 5, an unillustrated illuminable light that illuminates the panel 1 from above is disposed at a position that does not interfere with the nozzle 3.

The electronic component mounting method of the present invention is shown in FIGS.
A description will be given based on FIG.

First, FIG. 2 shows the details of the configuration of each mounting portion 15 of the panel 1. The material of the panel 1 is a transparent glass plate, which transmits light well. Each mounting point 15 on the top surface of panel 1
Is pre-printed with an electrode 7 and two circular panel marks 8 and 9 arranged at both ends thereof. The panel marks 8 and 9 are silver and reflect light well. Conductive film 6
Is a rectangular film having a size that is previously adhered one by one to the upper surface of each mounting portion 15 in the film attaching device 12 and that can completely cover the electrodes 7 and the panel marks 8 and 9. The conductive film 6 is translucent and has little light transmission and reflection. At each mounting location 15, the conductive film 6
When the film covers the entirety of the electrode 7 and the two panel marks 8 and 9 with margins about the diameter of the panel marks 8 and 9 at both ends, it is assumed that the film sticking is normal.

Now, three types of portions on the upper surface of the panel 1 are respectively described as follows: portion A: portion of the panel marks 8 and 9; portion B: portion where the conductive film 6 exists around the panel marks 8 and 9; C: a portion where the conductive film 6 does not exist around the panel marks 8 and 9, where the intensity of the reflected light and the transmitted light to the lower surface of the panel 1 corresponding to the three types of the upper surface of the panel 1 The relationship is as follows: intensity of transmitted light: portion A <portion B <portion C, intensity of reflected light: portion A> portion B> portion C.

Therefore, since the transmission and reflection of light are small in the portion B, if the intensity of the transmitted light and the intensity of the reflected light are adjusted, the total light intensity of the transmitted light and the reflected light becomes the total light intensity. : Part A> part B, and part C> part B.

Based on the above premise, the data creation step S
1 will be described in detail below.

In the flowchart of FIG. 6, when the illuminance of the two lights is adjusted to make the luminances of the portions A and C the same in step S11, the light receiving processing means provided in the camera 5 causes Is no longer distinguished from the part A, and the part B is distinguished from the part A because the transmitted light and the reflected light are small and the luminance is low. That is, the panel marks 8 and 9 can be identified in the portion where the conductive film 6 exists, and the panel marks 8 and 9 cannot be identified in the portion where the conductive film 6 does not exist. In this manner, the presence or absence of the conductive film 6 on the panel marks 8 and 9 can be determined. In step S12, recognition data indicating the panel marks 8, 9 and the surrounding two-dimensional luminance distribution is created, and recognition is confirmed in step S13 based on the created recognition data. That is, the data creation step S1 is performed only when it is confirmed that the panel marks 8 and 9 can be identified in the portion where the conductive film 6 exists, and the panel mark 8 cannot be identified in the portion where the conductive film 6 does not exist. To end. Otherwise, repeat step S
The adjustment is performed from the 11th illuminance adjustment.

Table 1 shows specific measured values (in units of 100% of the luminance of the reflected light of the portion A) of the three types of portions on the upper surface of the panel 1 in the data creation step S1. FIG. 7A shows an example of the generated recognition data.
(B).

[0028]

[Table 1]

In FIGS. 7A and 7B, reference numeral 17 denotes a panel mark 8 (9) and a two-dimensional planar image around the panel mark 8 (9).
Reference numeral 18 denotes a planar image of the panel mark 8 (9), reference numeral 19 denotes an x-direction profile centered on the panel mark 8 (9) of the two-dimensional luminance distribution, and reference numeral 20 denotes a panel mark 8 (2) of the two-dimensional luminance distribution. 9 shows a y-direction profile centered on 9).

FIG. 7A shows a case where the conductive film 6 exists at a regular position on the panel mark 8 (9).
Since the panel marks 8 (9) luminances b and c are distinguished from the surrounding luminances d and e by the threshold value S, the panel marks 8 (9)
Has been identified. On the other hand, FIG.
Is not present on the panel mark 8 (9), and the threshold value S indicates that the panel marks 8 (9) have the luminances f and g.
Is not distinguished from the surrounding luminances h and i.
(9) is not identified.

After the recognition data of the panel marks 8 and 9 is created in the data creation step S1 as described above, in the flowchart of FIG. 5, an instruction to start mounting is input to the device in step S2 to start mounting. In step S3, the nozzle 3 takes out the electronic component 4 from a predetermined position according to the mounting start command. In step S4, the electronic component 4 held by the nozzle 3 is moved, and the component mark 1 of the electronic component 4 is moved.
0 and 11 are put in the field of view of the camera 5 and made to be recognized.
Is corrected. In step S5, the nozzle 3 is raised, and the electronic component 4 is retracted above the camera 5. Step S6 is performed according to the mounting instruction of step S2.
Then, the panel 1 is loaded on the stage 2. Step S
After the completion of the component retreat operation 5, the stage 2 is moved so that the panel marks 8 and 9 enter the field of view of the camera 5 in step S 7, and the panel marks 8 and 9 at both ends of the mounting location 15 are recognized. In step S8, it is determined whether or not the conductive film 6 exists at the regular positions of the panel marks 8 and 9. If it is determined in step S8 that the conductive film 6 is present at the regular positions of the panel marks 8 and 9, the XY position shift amount of the panel 1 is corrected in step S9 to move the electronic component 4 to the panel 1
Mount on top. Then, at the next mounting location 15, the above operation is repeated. At step S8, panel marks 8, 9
If it is determined that the conductive film 6 does not exist on at least one of the upper surfaces, the device is stopped in step S10,
The operator is notified that the state of the conductive film 6 is abnormal.

The second embodiment of the present invention is a case where mark recognition and film discrimination are performed only by reflected light in the first embodiment.

That is, when the reflected light luminance shown in Table 1 is measured by the light receiving processing means provided in the camera 5, for example, the luminance threshold is set to 15 to distinguish the part B from the part C. Separately, the film is discriminated. Then, only when it is determined that the film application is normal, the threshold value of the luminance is set to 70 to perform the mark recognition by distinguishing the part A and the part B, and the mark position is detected. The electronic component 4 is corrected by correcting the XY position shift amount of the panel 1 and
Mount on top. In the film determination, when it is determined that the film sticking is abnormal, the operator is notified and the mark recognition is not performed. These processes can be performed by the light receiving processing means on the image data of the reflected light once captured by the camera 5 in a software manner. When the luminance threshold value is switched, the reflected light is processed again. There is no need to perform operations such as capturing images.

[0034]

According to the electronic component mounting method and the method of the present invention, not only when the conductive film attached to the substrate is not at a regular position, but also when the conductive film is transferred during transportation of the substrate. It is also possible to determine whether the board has been peeled or turned up. In such a case, since the electronic component is not mounted on the board, it is possible to reliably prevent the occurrence of a faulty board due to an abnormal adhesion of the conductive film.

According to the electronic component mounting apparatus of the present invention, since the mark recognizing means also functions as the film discriminating means, the discriminating means for discriminating only the film can be omitted as compared with the case where the two are separate.

In the electronic component mounting method of the present invention,
A substrate is a transparent substrate, and a mark recognition step for recognizing a mark and a conductive film is provided from the mounting back surface of the substrate, and a film discriminating step is performed in such a manner that the conductive film is positioned at a regular position on the substrate based on an output of the mark recognition step. If it is configured to determine whether or not there is, the mark and the conductive film can be recognized from the mounting back surface of the board, and the film is also determined by one operation of the mark recognition, so that compared to the case where the two are separate. In addition, it is possible to reduce the time from attaching the film to mounting the electronic component.

Further, in the electronic component mounting method of the present invention,
In the data creation step, the mark recognition step can identify the mark when a conductive film is present on the mark on the substrate, and when the conductive film is not present on the mark, the surrounding luminance of the mark is equal to that of the mark. By adjusting the illuminance of the illumination and performing recognition data creation under the illuminance conditions, the mark creation step is generally performed at the time of recognition data creation so that the mark recognition step cannot identify the mark by being substantially equal to the luminance. This is preferable because recognition data can be easily created by adjusting the illuminance of necessary illumination.

Further, in the electronic component mounting method according to the present invention, the mark recognition step recognizes marks at a plurality of mounting locations on the substrate, and the film discrimination step does not normally recognize even one of the plurality of marks. If it is configured to determine that the conductive film does not exist at the proper position on the substrate in the case, since the number of mounted electronic components at the time of detecting the conductive film pasting abnormality can be eliminated or minimized, the abnormality is detected. It is preferable because the conductive film can be easily peeled off and reattached to the substrate.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a part of an embodiment of an electronic component mounting apparatus of the present invention.

FIG. 2 is an enlarged perspective view showing a part of a mounting portion of the electronic component according to the embodiment of the present invention.

FIG. 3 is a perspective view showing an arrangement state of an electronic component mounting apparatus and a film sticking apparatus.

FIG. 4 is a perspective view showing an example of a conventional film sticking apparatus.

FIG. 5 is a flowchart showing an embodiment of an electronic component mounting method according to the present invention.

FIG. 6 is a flowchart showing one embodiment of a data creation step in the electronic component mounting method of the present invention.

7A and 7B show examples of recognition data created in the present invention, wherein FIG. 7A shows a case where a conductive film is present at a regular position on a panel mark, and FIG. This is the case when it does not exist at the above regular position.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Liquid crystal panel (panel) 2 XY stage 3 Nozzle 4 Electronic component 5 Camera 6 Conductive film 7 Electrode 8, 9 Panel mark 10, 11 Component mark

Claims (5)

[Claims] 1. An electronic component mounting method for mounting an electronic component via a conductive film previously attached to a substrate, wherein the conductive film is present at a proper position on the substrate immediately before mounting the electronic component. An electronic component mounting method, comprising: a film determining step of determining whether or not the electronic component is present; and a mounting step of mounting the electronic component only when the conductive film exists at a regular position on the substrate. 2. An electronic component mounting apparatus for mounting an electronic component via a conductive film previously adhered to a substrate, comprising: mark recognition means for recognizing a mark which is pre-printed on the substrate and indicates a legitimate mounting position. An electronic component mounting apparatus, wherein the mark recognizing means also serves as a film discriminating means for discriminating whether or not the conductive film exists at a regular position on the substrate. 3. The substrate is a transparent substrate, and includes a data creating step of creating recognition data of a mark and a conductive film on the substrate before the start of mounting, and a data generation step based on the recognition data from a mounting back surface of the substrate. A mark recognizing step of recognizing the mark and the conductive film, wherein the film discriminating step includes determining whether the conductive film is present at a regular position on the substrate based on the recognition data and an output of the mark recognizing step. The electronic component mounting method according to claim 1, wherein: 4. The data creating step includes: when a conductive film is present on a mark on the substrate, the mark recognizing step can identify the mark; when the conductive film is not present on the mark, a mark around the mark is provided. 4. The electronic component mounting according to claim 3, wherein the illuminance of the illumination is adjusted and recognition data is created under the illuminance condition so that the mark is not identified in the mark recognition step when the luminance becomes substantially equal to the luminance of the mark. Method. 5. A mark recognizing step of recognizing marks at a plurality of mounting locations on a substrate, and a film discriminating step includes: when at least one of the plurality of marks is not correctly recognized, the conductive film is placed on the substrate. 5. The electronic component mounting method according to claim 3, wherein it is determined that the electronic component does not exist at a regular position.