JP3848402B2 - Electronic component mounting method - Google Patents

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JP3848402B2
JP3848402B2 JP15372296A JP15372296A JP3848402B2 JP 3848402 B2 JP3848402 B2 JP 3848402B2 JP 15372296 A JP15372296 A JP 15372296A JP 15372296 A JP15372296 A JP 15372296A JP 3848402 B2 JP3848402 B2 JP 3848402B2
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electronic component
conductive film
substrate
panel
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JPH104295A (en
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修一 平田
智隆 西本
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Description

【０００１】
【発明の属する技術分野】
本発明は、異方性導電フィルム（ＡＣＦ）などの導電フィルムを介して、駆動用電子部品などの電子部品を、液晶パネルなどの基板上に実装する電子部品実装方法に関するものである。
【０００２】
【従来の技術】
導電フィルムがフィルム貼付装置によって予め電極上に貼付された液晶パネル（以下パネルと称する）に駆動用電子部品を実装するに際して、従来はパネル電極の両端に設けられたパネルマークとそれに対応する電子部品のマークを個々に認識して両者の位置関係を検出して実装時の位置関係を補正している。
【０００３】
従来の電子部品実装方法及び装置の一例について、以下に図１〜図４を参照しながら説明する。
【０００４】
この種電子部品実装機は、図３、図４に示すように、パネル１に導電フィルム６を貼付するフィルム貼付装置１２、パネルを方向ａへ搬送するパネル搬送台１４、及びパネル搬送台１４から搬送されたパネル１に電子部品２を実装する電子部品実装装置１３を備えている。
【０００５】
図１、図２において、パネル１上に電子部品４を実装する前に、パネル１の電極７と電子部品４との間の電気的接合を行いかつ電子部品４をパネル１上に固定するための導電フィルム６を予めパネル１上の複数の実装箇所１５に貼付しておく。実装時にはノズル３に保持された電子部品４の部品マーク１０、１１の位置をカメラ５で下方から認識し、次にステージ２に保持されたパネル１の所定の実装箇所１５のパネルマーク８、９の位置を同一のカメラ５で下方から認識して、電子部品４とパネル１の位置ズレ量を得る。得られた位置ズレ量により位置補正した後、ノズル３が下降して電子部品４をパネル１上に実装する。その際、ノズル３は導電フィルム６の特性に応じた温度、荷重を電子部品４に与えることにより、導電フィルム６の前記電極７に相対する部分のみの導電フィルム内絶縁層を破壊して電気的接合を行うと同時に導電フィルム６を硬化させて電子部品４の固定を行う。
【０００６】
パネル１上に導電フィルム６が貼付されていなかったり、導電フィルム６の貼付位置が適切でない場合、複数の電極７の内導電フィルム６が介在していない電極において電気的接合が行われないため導通不良が発生する。これを防ぐため、図４に示すように、フィルム貼付装置１２内にフィルム検出手段１６を設けておき、フィルム貼付実行後にフィルム検出動作を行い、全実装箇所１５の導電フィルム６が正常に検出されたパネル１のみ電子部品実装装置１３へ搬送、供給している。
【０００７】
【発明が解決しようとする課題】
しかしながら、従来のフィルム検出装置及び方法では、フィルム検出動作後に電子部品実装装置へ搬送される間に導電フィルムが剥がれたり捲れたりした導電フィルム貼付異常を検出することができず、その結果導通不良基板の発生が多かった。
【０００８】
本発明は、導電フィルムを介して電子部品を基板上に実装する電子部品実装方法及びその装置において、導電フィルムが基板上の正規の位置に存在しないことに起因する実装不良基板の発生を抑えることを目的とする。
【０００９】
【課題を解決するための手段】
本発明による電子部品実装方法は、上記目的を達成するため、基板に予め貼付された導電フィルムを介して電子部品を実装する電子部品実装方法において、前記電子部品を実装する直前に前記導電フィルムが前記基板上の正規の位置に存在するか否かを判別するフィルム判別工程と、前記導電フィルムが前記基板上の正規の位置に存在する場合のみ前記電子部品を実装する実装工程とを有する電子部品実装方法であって、前記基板は透明基板であり、前記基板上のマーク及び導電フィルムの認識データを実装開始前に予め作成しておくデータ作成工程と、前記基板の実装裏面から前記認識データに基づいて前記マーク及び導電フィルムを認識するマーク認識工程とを有し、フィルム判別工程は、前記認識データと前記マーク認識工程の出力とに基づき導電フィルムが前記基板上の正規の位置に存在するか否かを判別することを特徴とする。
【００１０】
本発明の電子部品実装方法によれば、基板に貼付された導電フィルムが正規の位置に存在していない場合のみならず、その基板の搬送の間に導電フィルムが剥がれたり捲れたりした場合をも判別でき、このような場合に前記基板への電子部品の実装をしないので、導電フィルム貼付異常による不良基板発生を確実に防止することができる。
【００１３】
また本発明の電子部品実装方法によれば、基板の実装裏面からマーク及び導電フィルムを認識することができ、マーク認識の一動作によりフィルム判別もなされるので、前記両者が別々である場合に比べ、フィルム貼付後から電子部品実装までの時間を短縮することができる。
【００１４】
前記電子部品実装方法において、データ作成工程を、基板のマーク上に導電フィルムが存在する場合にはマーク認識工程が前記マークを識別でき、前記マーク上に前記導電フィルムが存在しない場合には前記マークの周囲輝度が前記マークの輝度と同程度になることによって前記マーク認識工程が前記マークを識別できないように、照明の照度調節を行い、その照度条件において認識データ作成を行うよう構成すると、データ作成工程では、一般的に認識データ作成時に必要な照明の照度調節によって、容易に認識データを作成でき好適である。
【００１５】
本発明による電子部品実装方法において、マーク認識工程を、基板上の複数の実装箇所のマークを認識し、フィルム判別工程を、前記複数のマークの内一つでも正常に認識されない場合に導電フィルムが前記基板上の正規の位置に存在しないと判別するよう構成すると、導電フィルム貼付異常検出時における実装済電子部品の数を皆無もしくは最小限にできるので、前記異常の検出された基板に対する導電フィルムの剥離、再貼付処理が容易となり好適である。
【００１６】
【発明の実施の形態】
本発明の実施形態を図面に基づき以下に説明する。
【００１７】
電子部品実装装置１３は図３に示すようにパネルを方向ａへ搬送するパネル搬送台１４の上に配設され、フィルム貼付装置１２の下流側に位置している。電子部品実装装置１３は、図１、図２に示すように、パネル１を保持するＸＹステージ２と、電子部品４をパネル１に実装するノズル３と、パネル１のパネルマーク８、９と電子部品４の部品マーク１０、１１とを認識するマーク認識手段であるカメラ５とで構成される。
【００１８】
ＸＹステージ２はパネル１を保持し、パネル１の各実装箇所１５のパネルマーク８、９をカメラ５の上方に位置させるため、又カメラ５が検出した実装箇所１５の位置ズレを補正するため、２次元すなわちＸＹ方向に数値制御で移動可能である。
【００１９】
ノズル３は電子部品４を吸着、保持し、電子部品４の部品マーク１０、１１をカメラ５の上方に位置させるため、又カメラ５が検出した電子部品４の位置ズレを補正するため、更に電子部品４をパネル１に実装するため、ＸＹ方向の他、上下方向にも数値制御で移動可能である。
【００２０】
カメラ５は固定されており、パネル１のパネルマーク８、９と電子部品４の部品マーク１０、１１とを認識するマーク認識手段と、そのマーク認識手段の出力と別途予め作成した認識データとに基づき導電フィルム６がパネル１上の正規の位置に存在するか否かを判別するフィルム判別手段とを兼ねている。又、カメラ５は、その光学系の中に、パネル１を下面側（実装裏面側）から照射する照度調整可能な照明を内蔵している。更に、カメラ５の上方には、ノズル３と干渉しない位置にパネル１を上面側から照射する照度調整可能な図示しない照明が配設されている。
【００２１】
本発明の電子部品実装方法を図２、図５〜図７に基づき説明する。
【００２２】
まず、パネル１の各実装箇所１５の構成の詳細を図２に示す。パネル１の材質は透明なガラス板で、光をよく透過する。パネル１上面の各実装箇所１５には、電極７と、その両端に配置された２個の円形のパネルマーク８、９とが予め印刷されている。パネルマーク８、９は銀色で光をよく反射する。導電フィルム６は、フィルム貼付装置１２において各実装箇所１５上面に１枚ずつ予め貼付されており、電極７とパネルマーク８、９とを完全に覆うことができる大きさの矩形状フィルムである。導電フィルム６は半透明で、光の透過と反射は少ない。各実装箇所１５において、導電フィルム６が電極７と２個のパネルマーク８、９との全体を、その両端部においてパネルマーク８、９の直径程度の余裕代をもって覆っている場合をフィルム貼付が正常であるとする。
【００２３】
さて、パネル１の上面の３種類の部分を夫々、
部分Ａ：パネルマーク８、９の部分、
部分Ｂ：パネルマーク８、９の周囲で導電フィルム６が存在している部分、
部分Ｃ：パネルマーク８、９の周囲で導電フィルム６が存在していない部分、
とすると、
パネル１の上面の３種類の部分に応じたパネル１の下面への反射光及び透過光の強度の大小関係は、
透過光の強度 ：部分Ａ＜部分Ｂ＜部分Ｃ、
反射光の強度 ：部分Ａ＞部分Ｂ＞部分Ｃ、
となる。
【００２４】
従って、部分Ｂでは光の透過と反射が少ないので、透過光の強度と反射光の強度を調整すれば、透過光と反射光との合計の光の強度は、
合計の光の強度：部分Ａ＞部分Ｂ、かつ部分Ｃ＞部分Ｂ、
となる。
【００２５】
前記の前提に基づいて、データ作成工程Ｓ１を以下に詳細に説明する。
【００２６】
図６のフローチャートにおいて、ステップＳ１１で、２個の照明の照度を調節して、部分Ａ及び部分Ｃの輝度を同程度にすると、カメラ５が備えている受光処理手段において、部分Ｃは部分Ａとは区別されなくなり、部分Ｂは透過光も反射光も少なく輝度が低いため部分Ａとは区別される。すなわち、導電フィルム６が存在している部分ではパネルマーク８、９を識別でき、導電フィルム６が存在していない部分ではパネルマーク８、９を識別できなくなる。このようにして、導電フィルム６のパネルマーク８、９上の存在の有無を判別することができる。ステップＳ１２でパネルマーク８、９及びその周囲の２次元の輝度分布を示す認識データを作成し、作成された認識データに基づいてステップＳ１３で認識確認を行う。すなわち、導電フィルム６が存在している部分ではパネルマーク８、９を識別でき、導電フィルム６が存在していない部分ではパネルマーク８を識別できない、ということが確認された場合のみデータ作成工程Ｓ１を終了する。それ以外の場合は再度ステップＳ１１の照度調節から実施する。
【００２７】
上記、データ作成工程Ｓ１による、パネル１の上面の３種類の部分の具体的な輝度の測定値（単位は部分Ａの反射光の輝度を１００％とした百分率）を表１に、そして作成された認識データの例を図７（ａ）、（ｂ）、に示す。
【００２８】
【表１】

Figure 0003848402
【００２９】
図７（ａ）、（ｂ）において、１７はパネルマーク８（９）及びその周囲の２次元の平面画像を、１８はパネルマーク８（９）の平面画像を、１９は前記２次元の輝度分布のパネルマーク８（９）を中心としたｘ方向プロファイルを、２０は前記２次元の輝度分布のパネルマーク８（９）を中心としたｙ方向プロファイルを示している。
【００３０】
図７（ａ）は導電フィルム６がパネルマーク８（９）上の正規の位置に存在している場合であり、しきい値Ｓによりパネルマーク８（９）輝度ｂ、ｃは周囲輝度ｄ、ｅと区別されるので、パネルマーク８（９）は識別されている。一方、図７（ｂ）は導電フィルム６がパネルマーク８（９）上に存在していない場合であり、しきい値Ｓによりパネルマーク８（９）輝度ｆ、ｇは周囲輝度ｈ、ｉと区別されないので、パネルマーク８（９）は識別されない。
【００３１】
データ作成工程Ｓ１で前記のとおりパネルマーク８、９の認識データを作成した後、図５のフローチャートにおいて、ステップＳ２で装置に対して実装開始の指令を入力し実装を開始する。実装開始指令によってステップＳ３でノズル３が電子部品４を所定位置から取り出す。ステップＳ４においてノズル３により保持された電子部品４を移動させ、電子部品４の部品マーク１０、１１をカメラ５の視野に入れ認識させ、電子部品４の２次元のＸＹ位置ズレを補正する。ステップＳ５でノズル３を上昇させ、カメラ５の上方へ電子部品４を退避させる。ステップＳ２の実装指令によってステップＳ６でステージ２上にパネル１を搬入しておく。ステップＳ５の部品退避動作完了を待って、ステップＳ７でカメラ５の視野にパネルマーク８、９が入るようステージ２を移動し、実装箇所１５両端部のパネルマーク８、９を認識する。ステップＳ８でパネルマーク８、９の正規の位置に導電フィルム６が存在するか否かを判別する。ステップＳ８でパネルマーク８、９の正規の位置に導電フィルム６が存在すると判別した場合、ステップＳ９でパネル１のＸＹ位置ズレ量を補正して電子部品４をパネル１上へ実装する。そして、次の実装箇所１５において、前記操作を繰り返す。ステップＳ８でパネルマーク８、９の少なくとも一方の上面に導電フィルム６が存在しないと判別した場合、ステップＳ１０で装置を停止させて、導電フィルム６の状態異常であることを作業者に通知する。
【００３２】
本発明の第２の実施形態は、上記第１の実施形態において、反射光のみでマーク認識及びフィルム判別を行う場合である。
【００３３】
すなわち、カメラ５が備えている受光処理手段において、例えば表１の反射光輝度が測定される場合、まず輝度のしきい値を１５に設定することにより部分Ｂと部分Ｃとを区別してフィルム判別を行い、次いでフィルム貼付が正常と判別されたときのみ、輝度のしきい値を７０に設定することにより部分Ａと部分Ｂとを区別してマーク認識を行い、マーク位置を検出して、パネル１のＸＹ位置ズレ量を補正して電子部品４をパネル１上へ実装する。フィルム判別において、フィルム貼付が異常と判別されたときは作業者に通知し、マーク認識を行なわない。尚、これらの処理は、カメラ５が一度取り込んだ反射光の画像データに対して、その受光処理手段がソフト的に行うことができるものであり、輝度のしきい値の切換えに際して再度反射光の画像を取り込むといった動作を必要としない。
【００３４】
【発明の効果】
本発明の電子部品実装方法によれば、基板に貼付された導電フィルムが正規の位置に存在していない場合のみならず、その基板の搬送の間に導電フィルムが剥がれたり捲れたりした場合をも判別でき、これらの場合に前記基板への電子部品の実装をしないので、導電フィルム貼付異常による不良基板発生を確実に防止することができる。
【００３６】
又、本発明の電子部品実装方法によれば、基板の実装裏面からマーク及び導電フィルムを認識することができ、マーク認識の一動作によりフィルム判別もなされるので、前記両者が別々である場合に比べ、フィルム貼付後から電子部品実装までの時間を短縮することができる。
【００３７】
又、本発明の電子部品実装方法において、データ作成工程を、基板のマーク上に導電フィルムが存在する場合にはマーク認識工程が前記マークを識別でき、前記マーク上に前記導電フィルムが存在しない場合には前記マークの周囲輝度が前記マークの輝度と同程度になることによって前記マーク認識工程が前記マークを識別できないように、照明の照度調節を行い、その照度条件において認識データ作成を行うと、データ作成工程において一般的に認識データ作成時に必要な照明の照度調節によって、容易に認識データを作成できるので好適である。
【００３８】
更に、本発明の電子部品実装方法において、マーク認識工程は、基板上の複数の実装箇所のマークを認識し、フィルム判別工程は、前記複数のマークの内一つでも正常に認識されない場合に導電フィルムが前記基板上の正規の位置に存在しないと判別するよう構成すると、導電フィルム貼付異常検出時における実装済電子部品の数を皆無もしくは最小限にできるので、前記異常の検出された基板に対する導電フィルムの剥離、再貼付処理が容易となり好適である。
【図面の簡単な説明】
【図１】 本発明の電子部品実装方法に用いる電子部品実装装置の一実施形態の一部を示す斜視図。
【図２】 本発明の一実施形態における電子部品の実装箇所の一部を示す拡大斜視図。
【図３】 電子部品実装装置とフィルム貼付装置との配設状態を示す斜視図。
【図４】 従来のフィルム貼付装置の一例を示す斜視図。
【図５】 本発明の電子部品実装方法の一実施形態を示すフローチャート。
【図６】 本発明の電子部品実装方法におけるデータ作成工程の一実施形態を示すフローチャート。
【図７】 本発明において作成された認識データの例を示す図で、（ａ）は導電フィルムがパネルマーク上の正規の位置に存在している場合で、（ｂ）は導電フィルムがパネルマーク上の正規の位置に存在していない場合である。
【符号の説明】
１ 液晶パネル（パネル）
２ ＸＹステージ
３ ノズル
４ 電子部品
５ カメラ
６ 導電フィルム
７ 電極
８、９ パネルマーク
１０、１１ 部品マーク[0001]
BACKGROUND OF THE INVENTION
The present invention, through a conductive film such as an anisotropic conductive film (ACF), the electronic components such as the drive electronics component, relates to an electronic component mounting how to be mounted on a substrate such as a liquid crystal panel.
[0002]
[Prior art]
When mounting a driving electronic component on a liquid crystal panel (hereinafter referred to as a panel) in which a conductive film is previously adhered to an electrode by a film pasting device, conventionally, panel marks provided at both ends of the panel electrode and the corresponding electronic component The mark is individually recognized and the positional relationship between the two is detected to correct the positional relationship during mounting.
[0003]
An example of a conventional electronic component mounting method and apparatus will be described below with reference to FIGS.
[0004]
As shown in FIGS. 3 and 4, this type of electronic component mounting machine includes a film sticking device 12 for sticking the conductive film 6 to the panel 1, a panel carrier 14 for conveying the panel in the direction a, and the panel carrier 14. An electronic component mounting apparatus 13 for mounting the electronic component 2 on the transported panel 1 is provided.
[0005]
In FIG. 1 and FIG. 2, before mounting the electronic component 4 on the panel 1, an electrical connection between the electrode 7 of the panel 1 and the electronic component 4 is performed and the electronic component 4 is fixed on the panel 1. The conductive film 6 is affixed to a plurality of mounting locations 15 on the panel 1 in advance. At the time of mounting, the positions of the component marks 10 and 11 of the electronic component 4 held by the nozzle 3 are recognized from below by the camera 5, and then the panel marks 8 and 9 of the predetermined mounting location 15 of the panel 1 held by the stage 2 are mounted. Is recognized from below by the same camera 5 to obtain a positional deviation amount between the electronic component 4 and the panel 1. After the position correction is performed based on the obtained positional deviation amount, the nozzle 3 is lowered and the electronic component 4 is mounted on the panel 1. At that time, the nozzle 3 applies a temperature and a load according to the characteristics of the conductive film 6 to the electronic component 4, thereby destroying the insulating layer in the conductive film only at a portion facing the electrode 7 of the conductive film 6 to electrically At the same time as joining, the conductive film 6 is cured to fix the electronic component 4.
[0006]
If the conductive film 6 is not affixed on the panel 1 or if the affixing position of the conductive film 6 is not appropriate, the electrical connection is not performed at the electrodes of the plurality of electrodes 7 where the inner conductive film 6 is not interposed. Defects occur. In order to prevent this, as shown in FIG. 4, film detection means 16 is provided in the film sticking device 12, and the film detection operation is performed after the film sticking is performed, and the conductive film 6 in all the mounting locations 15 is normally detected. Only the panel 1 is conveyed and supplied to the electronic component mounting apparatus 13.
[0007]
[Problems to be solved by the invention]
However, in the conventional film detection apparatus and method, it is not possible to detect a conductive film sticking abnormality in which the conductive film is peeled off or rolled while being transported to the electronic component mounting apparatus after the film detection operation. There were many occurrences of.
[0008]
The present invention suppresses the occurrence of a defective mounting board due to the fact that the conductive film does not exist at a regular position on the substrate in the electronic component mounting method and apparatus for mounting the electronic component on the substrate via the conductive film. With the goal.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, an electronic component mounting method according to the present invention is an electronic component mounting method for mounting an electronic component via a conductive film that has been affixed to a substrate in advance. An electronic component having a film discrimination step for discriminating whether or not it exists at a regular position on the substrate, and a mounting step for mounting the electronic component only when the conductive film is present at a regular position on the substrate In the mounting method, the substrate is a transparent substrate, and the data creation step of creating the recognition data of the mark and the conductive film on the substrate before starting the mounting, and the recognition data from the mounting back surface of the substrate A mark recognition step for recognizing the mark and the conductive film based on the film recognition step, and the film discrimination step includes the recognition data and the output of the mark recognition step. Conductive film based is characterized by determining whether or not present in a normal position on the substrate.
[0010]
According to the electronic component mounting method of the present invention, not only the case where the conductive film affixed to the substrate does not exist at the proper position, but also the case where the conductive film is peeled off or rolled during the transportation of the substrate. In such a case, the electronic component is not mounted on the substrate, so that it is possible to reliably prevent the generation of a defective substrate due to the abnormal adhesion of the conductive film.
[0013]
Further , according to the electronic component mounting method of the present invention, the mark and the conductive film can be recognized from the back side of the mounting of the substrate, and the film is also discriminated by one operation of the mark recognition. In addition, it is possible to shorten the time from the application of the film to the mounting of the electronic component.
[0014]
In the electronic component mounting method, in the data creation process, the mark recognition process can identify the mark when the conductive film exists on the mark on the substrate, and the mark when the conductive film does not exist on the mark. If the brightness of the light is adjusted so that the mark recognition process cannot identify the mark when the ambient brightness of the mark is approximately the same as the brightness of the mark, and the recognition data is created under the illuminance condition, the data is created. In the process, it is preferable that the recognition data can be easily created by adjusting the illuminance of the illumination generally required at the time of creating the recognition data.
[0015]
In the electronic component mounting method according to the present invention, the mark recognizing step recognizes marks at a plurality of mounting locations on the substrate, and the film discriminating step is performed when the conductive film is not recognized normally even at one of the plurality of marks. If it is configured to determine that it does not exist at a regular position on the substrate, the number of mounted electronic components at the time of detecting an abnormal conductive film sticking can be eliminated or minimized. Peeling and re-sticking processing are easy and suitable.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0017]
Electronic component mounting apparatus 13 is disposed on the panel carrier table 14 for conveying the panels 3 in the direction a, it is located downstream of the film sticking apparatus 12. As shown in FIGS. 1 and 2, the electronic component mounting apparatus 13 includes an XY stage 2 that holds the panel 1, a nozzle 3 that mounts the electronic component 4 on the panel 1, panel marks 8 and 9 on the panel 1, and electronic The camera 5 is a mark recognition unit that recognizes the component marks 10 and 11 of the component 4.
[0018]
The XY stage 2 holds the panel 1 and positions the panel marks 8 and 9 of each mounting location 15 of the panel 1 above the camera 5 and corrects the positional deviation of the mounting location 15 detected by the camera 5. It is movable in two dimensions, that is, in the XY direction by numerical control.
[0019]
The nozzle 3 sucks and holds the electronic component 4, positions the component marks 10 and 11 of the electronic component 4 above the camera 5, and corrects the positional deviation of the electronic component 4 detected by the camera 5. Since the component 4 is mounted on the panel 1, it can be moved by numerical control in the vertical direction in addition to the XY direction.
[0020]
The camera 5 is fixed and includes a mark recognizing unit for recognizing the panel marks 8 and 9 of the panel 1 and the component marks 10 and 11 of the electronic component 4, an output of the mark recognizing unit, and separately generated recognition data. This also serves as film discrimination means for discriminating whether or not the conductive film 6 is present at a regular position on the panel 1. In addition, the camera 5 incorporates illumination-adjustable illumination for irradiating the panel 1 from the lower surface side (mounting rear surface side) in the optical system. Further, above the camera 5, an illumination (not shown) capable of adjusting the illuminance for irradiating the panel 1 from the upper surface side is provided at a position where it does not interfere with the nozzle 3.
[0021]
The electronic component mounting method of the present invention will be described with reference to FIGS. 2 and 5 to 7.
[0022]
First, the details of the configuration of each mounting portion 15 of the panel 1 are shown in FIG. The material of the panel 1 is a transparent glass plate and transmits light well. In each mounting portion 15 on the upper surface of the panel 1, an electrode 7 and two circular panel marks 8 and 9 arranged at both ends thereof are printed in advance. The panel marks 8 and 9 are silver and reflect light well. The conductive film 6 is a rectangular film having a size capable of completely covering the electrode 7 and the panel marks 8, 9, which is preliminarily pasted on the upper surface of each mounting location 15 in the film pasting device 12. The conductive film 6 is translucent and has little light transmission and reflection. When the conductive film 6 covers the entirety of the electrode 7 and the two panel marks 8 and 9 at each mounting location 15 with a margin of about the diameter of the panel marks 8 and 9 at both ends, the film sticking is performed. Suppose that it is normal.
[0023]
Now, each of the three types of parts on the upper surface of the panel 1,
Part A: Panel marks 8 and 9
Part B: part where the conductive film 6 exists around the panel marks 8 and 9,
Part C: a part where the conductive film 6 does not exist around the panel marks 8 and 9,
Then,
The magnitude relationship between the intensity of reflected light and transmitted light to the lower surface of the panel 1 according to the three types of parts on the upper surface of the panel 1 is as follows:
Intensity of transmitted light: part A <part B <part C
Intensity of reflected light: part A> part B> part C
It becomes.
[0024]
Accordingly, since the transmission and reflection of light is small in the portion B, if the intensity of the transmitted light and the intensity of the reflected light are adjusted, the total light intensity of the transmitted light and the reflected light is
Total light intensity: part A> part B and part C> part B,
It becomes.
[0025]
Based on the above premise, the data creation step S1 will be described in detail below.
[0026]
In the flowchart of FIG. 6, when the illuminances of the two illuminations are adjusted in step S11 so that the luminances of the part A and the part C are approximately the same, the part C is the part A in the light receiving processing means provided in the camera 5. The portion B is distinguished from the portion A because the portion B has little transmitted light and reflected light and has low luminance. That is, the panel marks 8 and 9 can be identified at a portion where the conductive film 6 exists, and the panel marks 8 and 9 cannot be identified at a portion where the conductive film 6 does not exist. In this way, the presence or absence of the conductive film 6 on the panel marks 8 and 9 can be determined. In step S12, recognition data indicating the panel marks 8 and 9 and the surrounding two-dimensional luminance distribution is created, and recognition is confirmed in step S13 based on the created recognition data. That is, the data creation step S1 is performed only when it is confirmed that the panel marks 8 and 9 can be identified in the portion where the conductive film 6 exists and the panel mark 8 cannot be identified in the portion where the conductive film 6 does not exist. Exit. In other cases, the illuminance adjustment in step S11 is performed again.
[0027]
Table 1 shows the measured values of specific brightness of the three types of portions on the upper surface of the panel 1 (unit: percentage with the brightness of the reflected light of the portion A as 100%) by the data creation step S1. Examples of the recognized data are shown in FIGS. 7 (a) and 7 (b).
[0028]
[Table 1]
Figure 0003848402
[0029]
7A and 7B, 17 is a two-dimensional planar image of the panel mark 8 (9) and its surroundings, 18 is a planar image of the panel mark 8 (9), and 19 is the two-dimensional luminance. An x-direction profile centered on the panel mark 8 (9) of the distribution and 20 represents a y-direction profile centered on the panel mark 8 (9) of the two-dimensional luminance distribution.
[0030]
FIG. 7A shows a case where the conductive film 6 is present at a regular position on the panel mark 8 (9), and the panel mark 8 (9) brightness b and c are the ambient brightness d and the threshold value S, respectively. Since it is distinguished from e, the panel mark 8 (9) is identified. On the other hand, FIG. 7B shows a case where the conductive film 6 is not present on the panel mark 8 (9), and the panel mark 8 (9) brightness f, g is represented by the ambient brightness h, i by the threshold value S. Since they are not distinguished, the panel mark 8 (9) is not identified.
[0031]
After the recognition data of the panel marks 8 and 9 is created as described above in the data creation step S1, in the flowchart of FIG. 5, a mounting start command is input to the apparatus in step S2 to start mounting. In step S3, the nozzle 3 takes out the electronic component 4 from a predetermined position in response to the mounting start command. In step S4, the electronic component 4 held by the nozzle 3 is moved, the component marks 10 and 11 of the electronic component 4 are placed in the field of view of the camera 5, and the two-dimensional XY position shift of the electronic component 4 is corrected. In step S <b> 5, the nozzle 3 is raised and the electronic component 4 is retracted above the camera 5. The panel 1 is loaded onto the stage 2 in step S6 according to the mounting instruction in step S2. After the completion of the component retracting operation in step S5, the stage 2 is moved so that the panel marks 8 and 9 are in the field of view of the camera 5 in step S7, and the panel marks 8 and 9 at both ends of the mounting location 15 are recognized. In step S8, it is determined whether or not the conductive film 6 is present at the normal positions of the panel marks 8 and 9. If it is determined in step S8 that the conductive film 6 is present at the normal position of the panel marks 8 and 9, the electronic component 4 is mounted on the panel 1 by correcting the XY position shift amount of the panel 1 in step S9. The above operation is repeated at the next mounting location 15. If it is determined in step S8 that the conductive film 6 is not present on the upper surface of at least one of the panel marks 8 and 9, the apparatus is stopped in step S10 to notify the operator that the state of the conductive film 6 is abnormal.
[0032]
The second embodiment of the present invention is a case where mark recognition and film discrimination are performed using only reflected light in the first embodiment.
[0033]
That is, in the light receiving processing means provided in the camera 5, for example, when the reflected light luminance of Table 1 is measured, first, the threshold value of the luminance is set to 15 to distinguish between the portion B and the portion C to determine the film. Then, only when it is determined that the film sticking is normal, the brightness threshold value is set to 70 to distinguish the part A and the part B, to perform the mark recognition, and to detect the mark position. The electronic component 4 is mounted on the panel 1 by correcting the amount of XY positional deviation. In film discrimination, when it is determined that film sticking is abnormal, the operator is notified and mark recognition is not performed. Note that these processes can be performed in software by the light receiving processing means for the reflected light image data once captured by the camera 5, and the reflected light is reflected again when the luminance threshold value is switched. There is no need for operations such as capturing images.
[0034]
【The invention's effect】
According to the electronic component mounting how the present invention, not only when the conductive film attached on the substrate is not present in the normal position, the case where the conductive film is or turned up or peel off during the transport of the substrate In these cases, since no electronic component is mounted on the substrate, it is possible to reliably prevent the generation of a defective substrate due to abnormal adhesion of the conductive film.
[0036]
In addition, according to the electronic component mounting method of the present invention, the mark and the conductive film can be recognized from the back surface of the substrate, and the film can be identified by one operation of the mark recognition. In comparison, the time from film application to electronic component mounting can be shortened.
[0037]
In the electronic component mounting method of the present invention, when the data creation process includes a conductive film on the mark on the substrate, the mark recognition process can identify the mark, and the conductive film does not exist on the mark. The ambient brightness of the mark is approximately the same as the brightness of the mark so that the mark recognition process cannot identify the mark, and the illumination is adjusted for illumination, and recognition data is created under the illumination conditions. In the data creation process, it is preferable that the recognition data can be easily created by adjusting the illuminance of the illumination generally required when creating the recognition data.
[0038]
Furthermore, in the electronic component mounting method of the present invention, the mark recognition step recognizes marks at a plurality of mounting locations on the substrate, and the film discrimination step conducts when one of the plurality of marks is not normally recognized. If it is configured to discriminate that the film does not exist at a regular position on the substrate, the number of mounted electronic components at the time of detecting the abnormality in sticking the conductive film can be eliminated or minimized. The film can be easily peeled off and reattached, which is preferable.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a part of an embodiment of an electronic component mounting apparatus used in an electronic component mounting method of the present invention.
FIG. 2 is an enlarged perspective view showing a part of a mounting location of an electronic component in one embodiment of the present invention.
FIG. 3 is a perspective view showing an arrangement state of an electronic component mounting apparatus and a film sticking apparatus.
FIG. 4 is a perspective view showing an example of a conventional film sticking apparatus.
FIG. 5 is a flowchart showing an embodiment of the electronic component mounting method of the present invention.
FIG. 6 is a flowchart showing an embodiment of a data creation process in the electronic component mounting method of the present invention.
7A and 7B are diagrams showing examples of recognition data created in the present invention. FIG. 7A shows a case where the conductive film is present at a normal position on the panel mark, and FIG. 7B shows a case where the conductive film is the panel mark. This is a case where the upper position does not exist.
[Explanation of symbols]
1 LCD panel
2 XY stage 3 Nozzle 4 Electronic component 5 Camera 6 Conductive film 7 Electrode 8, 9 Panel mark 10, 11 Component mark

Claims (3)

基板に予め貼付された導電フィルムを介して電子部品を実装する電子部品実装方法において、前記電子部品を実装する直前に前記導電フィルムが前記基板上の正規の位置に存在するか否かを判別するフィルム判別工程と、前記導電フィルムが前記基板上の正規の位置に存在する場合のみ前記電子部品を実装する実装工程とを有する電子部品実装方法であって、前記基板は透明基板であり、前記基板上のマーク及び導電フィルムの認識データを実装開始前に予め作成しておくデータ作成工程と、前記基板の実装裏面から前記認識データに基づいて前記マーク及び導電フィルムを認識するマーク認識工程とを有し、フィルム判別工程は、前記認識データと前記マーク認識工程の出力とに基づき導電フィルムが前記基板上の正規の位置に存在するか否かを判別することを特徴とする電子部品実装方法。In an electronic component mounting method for mounting an electronic component via a conductive film affixed in advance to a substrate, it is determined whether or not the conductive film is present at a regular position on the substrate immediately before mounting the electronic component. An electronic component mounting method comprising: a film discrimination step; and a mounting step of mounting the electronic component only when the conductive film is present at a regular position on the substrate, wherein the substrate is a transparent substrate, There are a data creation step for creating recognition data for the upper mark and conductive film in advance before starting mounting, and a mark recognition step for recognizing the mark and conductive film from the mounting back surface of the substrate based on the recognition data. In the film discrimination step, whether the conductive film exists at a normal position on the substrate based on the recognition data and the output of the mark recognition step. Electronic component mounting method characterized by determining whether. データ作成工程は、基板のマーク上に導電フィルムが存在する場合にはマーク認識工程が前記マークを識別でき、前記マーク上に前記導電フィルムが存在しない場合には前記マークの周囲輝度が前記マークの輝度と同程度になることによって前記マーク認識工程が前記マークを識別できないように、照明の照度調節を行い、その照度条件において認識データ作成を行う請求項１記載の電子部品実装方法。In the data creation process, the mark recognition process can identify the mark when a conductive film is present on the mark on the substrate, and the ambient brightness of the mark is determined when the conductive film is not present on the mark. The electronic component mounting method according to claim 1 , wherein the mark recognition step adjusts the illuminance of the illumination so that the mark cannot be identified when the mark recognition level becomes substantially the same as the luminance, and the recognition data is created under the illuminance condition. マーク認識工程は、基板上の複数の実装箇所のマークを認識し、フィルム判別工程は、前記複数のマークの内一つでも正常に認識されない場合に導電フィルムが前記基板上の正規の位置に存在しないと判別する請求項１又は２記載の電子部品実装方法。The mark recognition process recognizes marks at a plurality of mounting locations on the substrate, and the film determination process has a conductive film at a regular position on the substrate when one of the plurality of marks is not normally recognized. The electronic component mounting method according to claim 1, wherein the electronic component mounting method is determined not to be performed.
JP15372296A 1996-06-14 1996-06-14 Electronic component mounting method Expired - Fee Related JP3848402B2 (en)

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JP4249570B2 (en) * 2003-08-26 2009-04-02 パナソニック株式会社 Tape application method
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