JP2006153971A - Manufacturing apparatus of display panel and detecting method of conduction toner - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing apparatus of a display panel and a detecting method of conduction toner, in which an application status of applied conduction toner is correctly recognized and reliability and production efficiency are improved. <P>SOLUTION: A top end section 13a of a supply nozzle 13 has a first face e1 parallel to an array substrate and a second face e2 formed aslant to the array substrate. A supply hole 16 for supplying the conduction toner is opened and when supplying the conduction toner, the top end section contacts the array substrate and moves freely up and down so as to be separated from the array substrate after supplying. A lamp mechanism 14 is united with the nozzle and supported at the first face side of the nozzle top end so that a light axis d1 may face an array substrate contact position of the nozzle top end section, in a state that the nozzle is separated from the array substrate. A camera mechanism 15 is united with the nozzle and supported at the second face side of the nozzle top end section and imaging is performed by receiving reflected light on the array substrate from the lamp mechanism. A detecting unit 11 performs image processing by receiving an imaging signal of the camera mechanism and detects the application status of the conduction toner. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a display panel manufacturing apparatus having an improved coating structure for applying a conductive agent to an array substrate, and a conductive agent detection method for detecting a conductive agent application state using the display panel manufacturing apparatus.

  For example, a liquid crystal substrate, which is a display panel, forms an alignment film on an array substrate provided with TFTs (Thin Film Transistors) in a portion to be a display region on a glass substrate, and the alignment film is subjected to alignment treatment. Is done. A sealing agent is applied so as to surround the display area, and the counter substrate is bonded through the sealing agent. The array substrate and the counter substrate are connected via a short-circuit bump electrode, and the electrode of the array substrate and the counter substrate are set to the same potential by the short-circuit bump electrode.

  In a manufacturing apparatus for manufacturing such a liquid crystal substrate, there is a step of forming the short-circuit bump electrode by applying a conductive agent made of, for example, silver paste to the electrodes constituting the array electrode. Specifically, a plurality of nozzles communicating with the conductive agent supply source are arranged in a line, and a predetermined amount of conductive agent is supplied and applied from each nozzle onto the electrode of the array substrate. After the conductive agent application step is completed, a step of detecting the conductive agent application state is performed.

  Conventionally, in order to perform the detection process, a lamp (illuminating unit) and a camera (imaging unit) are coaxially arranged with respect to the conducting agent. The conducting agent is illuminated by the lamp and the image is taken by the camera, and the image pickup signal is sent to the detection device (detection means). In the detection apparatus, the captured image is not binarized by a light / dark (black / white) threshold value, and it is determined from the result whether or not a predetermined amount of the conductive agent has been applied.

  However, erroneous detection is likely to occur depending on conditions such as the substrate stage supporting the array substrate and the color, density, and material of the electrodes. For example, the substrate stage is made of an aluminum material with black treatment and is easy to recognize because it is the opposite color to the conductive agent that is silver paste, but it is static due to friction when pushing up the array substrate with pins for unloading. It has been found that the TFTs mounted on the array substrate are adversely affected.

  Therefore, recently, measures have been taken to prevent the occurrence of electrostatic friction by changing the substrate stage to a ceramic material. However, the ceramic material is white and has a color very close to the silver conductive agent. The white substrate stage can be seen from the transparent glass plate that constitutes the array substrate, and the difference in density is small. It is difficult to do.

Therefore, a soldering area extracting device as in [Patent Document 1] and a coated surface inspection device and a coating system as in [Patent Document 2] have been provided. None of these are directly related to the production of the liquid crystal substrate, but they are consistent in that the objective is to obtain a reliable recognition of the object to be coated.
JP-A-4-65200 JP-A-11-2610

In [Patent Document 1], first color illumination means for illuminating a soldering region on a printed board with a color different from that of the board, second color illumination means for illuminating with a color different from the illumination color, and soldering A color imaging means for imaging the area and a color conversion means for color-converting the image signal of the color imaging means are provided, and a color area in the vicinity of the color projected by the first color illumination means is extracted.
However, in [Patent Document 1], since a plurality of illumination units having different colors are provided, the configuration is complicated, a space for arranging each illumination unit is required, and the extraction apparatus itself is enlarged. The color conversion means performs color conversion on the image pickup signal of each color image pickup means, but in practice, since the color region near the color projected by the first color illumination means is extracted, the extraction control becomes complicated.

[Patent Document 2] discloses an illumination device that irradiates illumination light that takes into account spectral characteristics of lead plate glass and a thin film on a surface of the lead plate glass, a light receiving device that receives reflected light of the illumination light, and enters the light receiving device. The light intensity of the reflected light is calculated, thin film application state data is generated, and calculation processing / discrimination processing for determining whether or not the application state is preset is configured.
However, this [Patent Document 2] is an apparatus that can capture the state of the lines and surfaces of the coating pattern applied over the entire surface of the lead plate glass, and as described in the background section above, the array substrate. In addition, there is a great difference in configuration from a device that applies a conductive agent in a so-called spot shape and detects the application state of each conductive agent.

  The present invention has been made paying attention to the above circumstances, and the purpose of the present invention is to apply the applied conductive agent without regard to conditions such as the color of the electrode of the array substrate and the substrate stage, and the material. It is an object of the present invention to provide a display panel manufacturing apparatus and a conductive agent detection method capable of accurately recognizing and improving reliability and production efficiency.

  In order to achieve the above object, a display panel manufacturing apparatus for manufacturing a display panel in which an array substrate and a counter substrate are connected via a short-circuit bump electrode formed from the conductive agent of the present invention is such that the tip of the nozzle is the array substrate. A supply hole for supplying a conducting agent to the array substrate is opened, and a tip is provided when supplying the conducting agent. After contact with the array substrate, it is driven so as to move up and down so that the tip is separated from the array substrate, and the illumination means is integrally supported with the nozzle on the first surface side of the nozzle tip, and the nozzle tip is the array substrate. The optical axis is directed obliquely with respect to the array substrate contact position of the nozzle tip in a state of being separated from the nozzle, and the imaging means is projected from the illumination means while being supported integrally with the nozzle on the second surface side of the nozzle tip. Light reflected from the board Receiving imaged, detection means for detecting the applied state of the image processing conducted agent receives the imaging signal of the imaging means.

  In order to achieve the above object, the method for detecting a conductive agent according to the present invention performs imaging of a portion where a conductive agent is to be applied before applying the conductive agent to the array substrate using the display panel manufacturing apparatus in the first step. No image signal is captured and image processing is performed. After the conductive agent is applied to the array substrate in the second step, the application state is imaged, the imaging signal is captured and image processing is performed. In the third step, the second step is performed. The difference between the image areas before applying the conductive agent obtained in the first step is obtained from the image area before applying the conductive agent, and the image area of only the applied conductive agent is extracted from the difference, In the step, the conductive agent image extracted in the third step is compared with a standard pattern stored in advance, and the application state of the conductive agent is determined from the comparison value.

  ADVANTAGE OF THE INVENTION According to this invention, there exists an effect that the application | coating state of the apply | coated conductive agent can be recognized correctly and the improvement of reliability and production efficiency can be acquired.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 schematically shows a conductive agent coating apparatus S that constitutes, for example, a liquid crystal substrate manufacturing apparatus as a display panel.
In this conductive agent coating apparatus S, an array substrate on which TFTs (Thin Film Transistors) are formed in a portion serving as a display area on the glass substrate is carried. An alignment film is formed on the array substrate, and an alignment process is performed on the alignment film. A sealing agent is applied so as to surround the display area, and a counter substrate is bonded to the conductive agent applying device S on the carry-out side via the sealing agent to form a liquid crystal substrate.

The conductive agent coating apparatus S includes an X-axis table 2 provided on the upper surface of the housing 1, a Y-axis table 3 placed on the X-axis table 2, and a substrate placed and fixed on the Y-axis table. Stage 4 is provided.
Furthermore, support columns (not shown) are erected on both the left and right sides of the upper surface of the housing 1, and a horizontal frame 5 is provided between these support columns. The horizontal frame 5 is provided with a coating mechanism 7 via an elevating mechanism 6 that is a Z-axis drive mechanism.

  The substrate stage 4 is for placing an array substrate, which will be described later, and is made of a ceramic material (white). Therefore, after applying the conductive agent to the array substrate, there is no generation of electrostatic friction when a pin (not shown) pushes up the array substrate and peels from the substrate stage 4.

  Here, the application mechanism 7 includes a temporary fixing agent application head 8 for applying a temporary fixing agent to two sets on both sides, and a plurality (four sets) of conductive agents sandwiched between these temporary fixing agent application heads. And a conductive agent coating head 9 for coating the liquid. Since both the temporary fixing agent application head 8 and the conductive agent application head 9 are individually provided in the elevating mechanism 6, the elevating control is individually performed in the Z-axis direction.

  On the back side of the horizontal frame 5, there are provided control devices 10 for individually controlling the operation of the temporary fixing agent application head 8 and the conductive agent application head 9. A detection device (detection means) 11 for detecting the application state of the agent is incorporated.

FIG. 2 is an enlarged schematic view of the conductive agent application head 9.
A head main body 12 constituting the conductive agent application head 9 is directly supported on the lifting mechanism 6. A supply nozzle 13 is attached to the lower portion of the head body 12 and communicates with a reservoir (not shown) that stores a conductive agent (for example, silver paste) via a pipe.

  A lamp mechanism (illuminating means) 14 is attached to a side portion (right side) of the supply nozzle 13 provided in the head body 12, and a camera mechanism is attached to the opposite side portion (left side) of the lamp mechanism 14 via the supply nozzle 13. An (imaging means) 15 is attached. The lamp mechanism 14, the camera mechanism 15, and the supply nozzle 13 are all driven up and down as they are attached to the head body 12.

  The supply nozzle 13 has a tip portion 13a directed vertically downward, and can supply a conducting agent from the tip portion 13a. The lamp 14a of the lamp mechanism 14 has its optical axis d1 directed toward the central axis d2 of the supply nozzle 13, and the intersection position of the supply nozzle central axis d2 and the lamp optical axis d1 is from the end surface of the supply nozzle tip 13a. It is set to be a lower part by a predetermined distance α (for example, 3 mm).

  On the other hand, the camera mechanism 15 is set so that the optical axis d3 of the light receiving lens 15a provided at the tip thereof is directed to the intersection of the supply nozzle central axis d2 and the lamp optical axis d1. In other words, the camera mechanism optical axis d3 and the supply nozzle central axis d2 are attached with the angle adjusted so that the position where the camera mechanism optical axis d3 and the supply nozzle central axis d2 intersect is a predetermined distance α (for example, 3 mm) from the end surface of the supply nozzle tip 13a.

  FIG. 3 is an enlarged view of the supply nozzle 13 and schematically shows the positional relationship between the lamp 14a of the lamp mechanism 14 and the light receiving lens 15a of the camera mechanism 15 with respect to the supply nozzle 13, and FIG. FIG. 4B is an enlarged cross-sectional view of the portion 13a, and FIG. 4B is a top view of the nozzle tip portion 13a.

  The supply nozzle 13 includes a flange portion 13b attached to the head main body 12, and is formed to be gradually sharpened from the flange portion 13b to the tip end portion (lower end portion) 13a. A supply hole 16 for supplying a conductive agent is provided along the central axis d2, and is opened at the end surface of the tip portion 13a.

  In particular, the tip portion 13a of the supply nozzle 13 is formed to have a predetermined uniform small diameter, and a part of the end surface is obliquely cut out. In other words, when the end surface of the nozzle tip portion 13a is divided into two through the central axis d2, one side thereof is formed in parallel to the surface of the array substrate a, which is a direction orthogonal to the central axis d2. This is called a first surface e1, and the other side is a surface inclined at an angle of 45 ° with respect to the first surface e1, and this is called a second surface e2.

  A half area of the supply hole 16 is opened in the first surface e1, and the remaining half area is opened in the second surface e2. Therefore, the first surface e1 comes into close contact with the array substrate a in a state in which the end surface of the nozzle tip 13a is in contact with the array substrate a and the conductive agent is supplied from the supply hole 16. Further, the second surface e2 has a gap formed obliquely with respect to the array substrate a, so that a larger amount of the conductive agent c can be supplied from the second surface e2 side.

  The ramp mechanism 14 is disposed on the first surface e1 side of the nozzle tip 13a, and the camera mechanism 15 is disposed on the second surface e2 side. As described above, the orientations of the optical axis d1 of the lamp 14a of the lamp mechanism 14 and the optical axis d3 of the light receiving lens 15a of the camera mechanism 15 with respect to the central axis d2 of the supply nozzle 13 are set. Actually, the inclination of the lamp mechanism 14 and the camera mechanism 15 with respect to the array substrate a in the respective optical axes d1 and d3 is inclined, for example, 45 °.

  As shown in FIG. 1 again, the control device 10 drives and controls the X-axis table 2, the Y-axis table 3, and the elevating mechanism 6, and turns on / off switching control of the lamp mechanism 14 and the camera mechanism 15. Control imaging timing. The detection device 11 receives the imaging signal sent from the camera mechanism 15 and performs binarization processing with a threshold value that makes the image light and dark (black / white), and compares the imaging pattern with a pre-stored standard pattern. To recognize the imaging target.

  FIG. 5 is a plan view of a liquid crystal substrate A on which a plurality of liquid crystal screens a1 are formed, for example, for a cellular phone. FIG. 6A is an enlarged view of one liquid crystal screen a1, and FIG. FIG. 3 is a cross-sectional view schematically showing a state where the array substrate a and the counter substrate b are connected via a short-circuit bump electrode C which is a conductive agent c.

  As shown in FIG. 5, the lines constituting the liquid crystal screen a1 represent the separation of the wiring pattern. As shown in FIG. 6A, the conductive agent c is applied to only one corner of one liquid crystal screen a1, and becomes a short-circuit bump electrode C in a state where the array substrate a and the counter substrate b are connected. Actually, as shown in FIG. 6B, a conductive agent c is applied on the electrode f provided on the array substrate a, and the counter substrate b and the array substrate electrode f are connected to each other. The counter substrate b is set to the same potential.

  FIG. 7A is a diagram for explaining the application state of the conductive agent c. Here, the lamp mechanism 14 and the camera mechanism 15 are not shown. FIG. 7B is a diagram for explaining a detection state of the applied conductive agent c, and FIG. 7C is a plan view of the applied conductive agent c.

  The supply nozzle 13 descends and comes into contact with a predetermined position of the array substrate electrode f and stops descending. At a timing, the silver paste as the conductive agent c is supplied from the supply hole 16. At this time, the first surface e1 formed on the end surface of the nozzle tip portion 13a contacts the array substrate electrode f, and the second surface e2 forms an oblique gap with the array substrate electrode f.

  Therefore, while the application amount of the conductive agent c is small on the first surface e1 side, the application amount of the conductive agent c is extremely large on the second surface e2 side. In other words, only half of the opening area of the supply hole 16 is supplied on the first surface e1 side, but the second surface e2 side protrudes from the gap between the array substrate electrode f and the second surface e2. Applied.

  When the application state of the conductive agent c is viewed from the front, the nozzle tip 13a swells obliquely along the inclination of the second surface e2 from the first surface e1 side to the second surface e2, and this outer shape position is It bulges outward from the outer shape of the nozzle tip 13a. The planar application state of the conductive agent c is a semicircular shape along the inner diameter of the supply hole 16 on the first surface e1 side, whereas it is formed in a fan shape on the second surface e2 side.

  After a predetermined amount of the conductive agent c is applied from the supply hole 16 of the supply nozzle 13, the supply nozzle 13 rises by a predetermined amount α and stops. The lamp mechanism 14 disposed on the first surface e1 side and raised integrally with the supply nozzle 13 is lit at a timing. Since the optical axis d1 of the lamp mechanism 14 is directed to the position where the end surface 13a end surface of the supply nozzle 13 is in contact with the array substrate electrode, the conductive agent c applied to the contact position is illuminated.

  The camera mechanism 15 disposed on the second surface e2 side and rising together with the supply nozzle 13 and the lamp mechanism 14 projects light from the lamp mechanism 14 to the conducting agent c and receives and reflects light reflected by the conducting agent. The imaging signal of the camera mechanism 15 is sent to the detection device 11 and binarized image processing is performed.

  8A is an enlarged cross-sectional view of the applied conductive agent c, and FIG. 8B is an enlarged plan view of the applied conductive agent c, both of which explain the bright and dark state by illumination of the lamp mechanism 14. FIG. Here, an arrow indicates illumination light, and a small x mark indicates a shadow. A portion with a small number of X marks represents a lighter shadow, and a portion with a larger number of X marks represents a darker shadow.

  The applied conductive agent c is roughly divided into a part that directly receives the illumination light of the lamp mechanism 14 and a part that hardly receives the illumination light of the lamp mechanism 14. The portion that directly receives the illumination light of the lamp mechanism 14 is mainly the first because the lamp mechanism 14 is disposed on the first surface e1 side formed on the end surface of the supply nozzle tip 13a and illuminates from an oblique position. The surface is applied to the surface e1 side, receives the illumination light, totally reflects and shines white.

  A portion that hardly receives illumination light from the lamp mechanism 14 is a portion that is applied mainly from the second surface e2 side, and is a portion that is a shadow of the conductive agent c itself, and appears to be black due to diffuse reflection. The camera mechanism 15 is disposed on the second surface e2 side, and the optical axis d3 is set toward the conductive agent c. Therefore, the contrast between the conductive agent c and the surrounding electrode f portion becomes clear. You can take an image in the state.

The camera mechanism 15 and the detection device 11 are controlled by the control device 10, and the detection method of the conductive agent c described below is executed.
That is, the supply nozzle 13 is above the array substrate electrode f by a predetermined distance α, and before applying the conductive agent c, the camera mechanism 15 images the planned conductive agent application site. The image pickup signal is sent to the detection device 11, and the detection device takes in the image signal, performs binarized image processing with a threshold value of light and dark (black / white), and performs a first step of storing the image area. .

  Then, after the supply nozzle 13 has applied the conductive agent c to the array substrate electrode f, the supply mechanism 13 is raised by a predetermined distance α, and after the lamp mechanism 14 is turned on, the camera mechanism 15 images the application portion. The image pickup signal is sent to the detection device 11, and here, a second step is performed in which the image signal from the camera mechanism 15 is taken in, binarized image processing is performed, and the image area is stored.

Next, in the detection device 11, a third step of performing a calculation for obtaining a difference between the image area after applying the conductive agent and the image area before applying is performed. In this way, the image area of only the conductive agent c is extracted from the difference between the image area after application and the image area before application.
Finally, a fourth step of comparing the extracted conductive agent image with a previously stored standard pattern is performed. When the comparison value is within a predetermined range, the control device 10 determines the application state of whether or not a predetermined amount of the conductive agent c is applied and notifies the operator.

The first to fourth steps for detecting the application state of the conductive agent c described above are performed and completed while the conductive agent application head 8 moves to the next application position. When the conductive agent application head 8 moves to the next application position, the process is repeated again from the first step.
Thus, the substrate stage 3 is white with a ceramic material, and the substrate stage 3 can be seen as it is from between the electrodes f of the array substrate a placed on the substrate stage. Even if the electrode f itself is black-processed, the conductive agent c made of a silver paste applied on the electrode f has a silver color, and normally, the image becomes cloudy due to the influence of the substrate stage 3.

  However, in the present invention, the end surface 13a end surface of the supply nozzle 13 is formed from a first surface e1 parallel to the array substrate a and a second surface e2 formed obliquely to the array substrate a, A lamp mechanism 14 is mounted obliquely on the first surface e1 side, and a camera mechanism 15 is provided on the second surface e2 side for receiving and imaging light projected from the lamp mechanism and reflected by the array substrate electrode f. .

From this, the contrast of the contrast between the part where the shape of the applied conductive agent c is illuminated by the lamp mechanism 14 and glows white and the part which becomes shadow and becomes black becomes clear. Therefore, the application state of the conductive agent c can be accurately recognized in the state where the binarized image processing is performed, and the improvement in reliability can be obtained.
In addition, as a method for detecting the conductive agent c, a first step of imaging and image-processing a conductive agent application scheduled site, a second step of imaging and image-processing the applied conductive agent c, A third step of extracting an image of only the conductive agent c from the difference between the image and the image before application, and a comparison of the extracted conductive agent image with a pre-stored standard pattern to determine the application state of the conductive agent Since the process 4 is provided, it is possible to accurately recognize the application state as to whether or not a predetermined amount of the conductive agent c is applied, thereby improving the production efficiency.

  In the above-described embodiment, the liquid crystal substrate is used as the display panel. However, the present invention is not limited to this. In other words, since the display panel is a plate-like structure that displays the display device, it can be used for TFT array substrates used in liquid crystal display devices and EL display devices, and array substrates for plasma displays or field effect display devices. Of course.

  The present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. Various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above-described embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an external perspective view of a conductive agent coating device constituting a liquid crystal substrate manufacturing apparatus that is a display panel according to an embodiment of the present invention. The schematic front view of the application | coating head with which the electrically conductive agent application | coating apparatus based on the embodiment is equipped. The figure explaining arrangement | positioning of the supply nozzle which apply | coats a conductive agent, a lamp mechanism, and a camera mechanism based on the embodiment. Sectional drawing which expanded the front-end | tip part of the supply nozzle based on the embodiment. The top view of the array substrate based on the embodiment. The figure which expanded the screen of the array substrate based on the embodiment, and the figure which represents typically the state which connects an array substrate electrode and a counter substrate via a short circuit bump electrode. The figure showing the state which apply | coats a conductive agent to an array substrate electrode from a supply nozzle based on the embodiment, the figure explaining the illumination with respect to the applied conductive agent, and the state of imaging, and the top view of the apply | coated conductive agent. Sectional drawing and the top view which expanded the electrically conductive agent based on the embodiment.

Explanation of symbols

  c ... conductive agent, C ... short-circuit bump electrode, a ... array substrate, b ... counter substrate, e1 ... first surface, e2 ... second surface, 16 ... supply hole, 13 ... supply nozzle, 14 ... lamp mechanism ( Illuminating means), 15... Camera mechanism (imaging means), 10... Detecting device (detecting means).

Claims (3)

In a display panel manufacturing apparatus for manufacturing a display panel in which an array substrate and a counter substrate are connected via a short-circuit bump electrode formed from a conductive agent,
The front end portion has a first surface parallel to the array substrate and a second surface formed obliquely with respect to the array substrate, and a supply hole for supplying a conductive agent to the array substrate is opened. When supplying the agent, the tip is brought into contact with the array substrate, and after supply, the nozzle is driven to be movable up and down so as to separate the tip from the array substrate;
Illumination that is supported integrally with the nozzle on the first surface side of the nozzle tip and directs the optical axis from an oblique direction with respect to the array substrate contact position of the nozzle tip with the nozzle tip separated from the array substrate Means,
An imaging unit that is supported integrally with the nozzle on the second surface side of the nozzle tip, receives and projects light projected from the illumination unit and reflected by the array substrate; and
An apparatus for manufacturing a display panel, comprising: a detecting unit that receives an imaging signal of the imaging unit and performs image processing to detect an application state of the conductive agent.   The tip of the nozzle is divided into two via the central axis of the nozzle, and one side thereof is defined as a first surface and the other side is defined as a second surface. Display panel manufacturing equipment. Using the display panel manufacturing apparatus according to claim 1, imaging a conductive agent application planned site before applying the conductive agent to the array substrate, capturing an image signal, and performing image processing;
After applying the conductive agent to the array substrate, the second step of imaging the application state, capturing the imaging signal, and image processing;
From the image area after applying the conductive agent obtained in the second step, the difference in the image area before applying the conductive agent obtained in the first step is obtained, and the image area of only the applied conductive agent is obtained from this difference. A third step of extracting;
A conducting agent comprising: a conducting agent image extracted in the third step, and a fourth step of comparing the preliminarily stored standard pattern and judging the application state of the conducting agent from the comparison value. Detection method.

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