JP3631276B2 - Bonding apparatus and bonding method - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to a bonding apparatus and a bonding method for connecting an outer lead of an electronic component such as a TAB component using a TAB (Tape Automated Bonding) technique to a lead of a substrate such as a liquid crystal substrate via a connecting member such as an anisotropic conductive film. About.
[0002]
The present invention also relates to a bonding state inspection apparatus and a bonding state inspection method for inspecting a state in which an electronic component such as a TAB component is pressure-bonded to a light-transmitting substrate such as a liquid crystal substrate.
[0003]
[Prior art]
Conventionally, when a TAB component is mounted on a liquid crystal substrate, a bonding apparatus as shown in FIG. 8 has been used. FIG. 9 is a side view schematically showing the crimping mechanism 23 in the crimping apparatus 20 described later.
[0004]
The bonding apparatus includes a provisional pressure bonding apparatus 10 and a pressure bonding apparatus 20. Further, the temporary pressure bonding apparatus 10 includes a table 11, a liquid crystal substrate transport mechanism 12 disposed on the table 11, a temporary pressure bonding mechanism 13, and a temporary pressure bonding control unit 1 that controls these mechanisms. The liquid crystal substrate transport mechanism 12 transports the liquid crystal substrate Q in the direction of arrow α in FIG. Moreover, the temporary press-bonding mechanism 13 has a function of temporarily attaching the TAB component T to the liquid crystal substrate Q on which the anisotropic conductive film P has been previously attached. The liquid crystal substrate Q is designed so that a plurality of TAB components T are mounted at predetermined positions.
[0005]
The crimping device 20 includes a table 21, a liquid crystal substrate transport mechanism 22, a crimping mechanism 23, and a crimping controller 2 that controls these mechanisms. The liquid crystal substrate transport mechanism 22 transports the liquid crystal substrate Q in the α direction in FIG. The pressure-bonding mechanism 23 pressure-bonds the TAB component T temporarily attached to the liquid crystal substrate Q by pressing and heating with the bonding tool 23a and the backup tool 23b, and the outer lead of the TAB component T via the anisotropic conductive film P It has a function of electrically connecting the leads of the liquid crystal substrate Q.
[0006]
In the bonding apparatus configured as described above, first, the TAB component T is temporarily bonded to the liquid crystal substrate Q via the anisotropic conductive film P by the temporary pressing apparatus 10. Next, in the crimping mechanism 23 of the crimping apparatus 20, the TAB component T and the liquid crystal substrate Q are heated and pressurized through the anisotropic conductive film P by the bonding tool 23a and the backup tool 23b, and the outer lead and the liquid crystal substrate of the TAB component T are heated. The Q lead is electrically connected.
[0007]
On the other hand, when inspecting the bonding state of the outer lead of the TAB component T connected to the lead of the liquid crystal substrate Q through the anisotropic conductive film P in this way, the operator connects the connection portion of the liquid crystal substrate Q, that is, the connection The bonding state of the anisotropic conductive film P which is a member was visually observed.
[0008]
[Problems to be solved by the invention]
The bonding apparatus using the conventional mounting method as described above has the following problems. That is, the TAB component T temporarily attached to the liquid crystal substrate Q by the temporary pressure bonding apparatus 10 may fall off due to some reason before the pressure bonding apparatus 20 performs pressure bonding. However, in the above-described crimping device 20, the crimping operation is performed even if the TAB component T remains dropped. For this reason, the bonding tool 23a directly contacts the anisotropic conductive film P, and the anisotropic conductive film P may melt and adhere to the bonding tool 23a.
[0009]
If the bonding tool 23a to which the anisotropic conductive film P is adhered is continuously bonded, the anisotropic conductive film P may not be adhered to other TAB parts T or normal bonding may not be performed, resulting in a product yield. There was a problem of lowering.
[0010]
Furthermore, in order to prevent such a situation, it is necessary to clean the bonding tool 23a to which the anisotropic conductive film P is adhered each time. Therefore, it is necessary to provide a cleaning time for the bonding tool 23a itself, and there is a problem that productivity is lowered.
[0011]
On the other hand, the conventional bonding state inspection method has the following problems. That is, the bonding state of the TAB component T connected to the liquid crystal substrate Q through the anisotropic conductive film P is inspected by the operator visually inspecting the anisotropic conductive film P. Even when an automatic bonding apparatus is used, there is a problem that the bonding apparatus must be stopped and the bonding state must be inspected.
[0012]
Therefore, the present invention temporarily attaches an electronic component to a predetermined position of a substrate via an adhesive, and connects the terminal of the temporarily attached electronic component and the terminal of the substrate by pressure bonding. It is an object of the present invention to provide a bonding apparatus and a bonding method capable of protecting the crimping apparatus and improving the product yield and productivity by not performing the crimping operation when the material falls off.
[0013]
The present invention also provides a bonding state inspection apparatus and a bonding state that improve inspection efficiency by automatically inspecting the bonding state of an electronic component that is pressure-bonded to a predetermined position of a light-transmitting substrate via an anisotropic conductive film. The purpose is to provide an inspection method.
[0014]
[Means for Solving the Problems]
In order to solve the above-described problems and achieve the object, according to the invention described in claim 1, an electronic component is placed on a predetermined position of the substrate via an adhesive.ButTemporary attachmentFrom the state that has beenIn a bonding apparatus that connects the terminals of the electronic component and the terminals of the substrate by crimping, a crimping portion that crimps the temporarily attached terminals of the substrate and the terminals of the electronic component;In the state where it is arranged in this crimping partBefore crimping the electronic component, place it in the predetermined position on the board.CanDetection means for detecting the presence or absence of the electronic component, and a control unit for operating the crimping part only when the electronic component is at the predetermined position on the substrate based on the output of the detection means.
[0015]
According to the invention described in claim 2, in the invention described in claim 1, it is preferable that the detection means is movably provided based on the size of the substrate or the electronic component.
[0016]
According to the invention described in claim 3,In a bonding apparatus for connecting a terminal of the electronic component and a terminal of the substrate by crimping from a state where the electronic component is temporarily attached to a predetermined position of the substrate via an adhesive, the temporary attachment of the substrate A crimping portion for crimping the terminal and the terminal of the electronic component, and a detecting means for detecting the presence or absence of the electronic component at the predetermined position on the substrate before the electronic component is crimped in a state of being arranged in the crimping portion. And a controller that activates the crimping part only when the electronic component is at the predetermined position of the substrate based on the output of the detection means,The detecting means is preferably provided integrally with the crimping portion.
According to the invention described in claim 4,ElectricChild partsIs basedA storage unit for storing a position to be attached to the board as basic data, and a temporary attachment operation for attaching the electronic component to the predetermined position of the substrate through an adhesive based on the basic data stored in the storage unit. A crimping part that crimps the terminal of the substrate on which the tacking operation has been performed and the terminal of the electronic component; and the crimping partWas transported toAt the predetermined position on the substrateCanDetection means for detecting the presence or absence of the electronic component based on the basic data stored in the storage unit, and the crimping only when the electronic component is at the predetermined position on the substrate based on the output of the detection means PartCrimping operation of the above to the substrate1st control part which operatesAndI prepared.
[0017]
According to the invention described in claim 5,In the invention described in claim 4, when the electronic component is not in the predetermined position of the substrate based on the output of the detection means, the electronic component is attached to the predetermined position of the substrate in the temporary attachment portion. The second control unit for performing the tacking work viaI prepared.
[0018]
According to the invention described in claim 6,In a bonding method in which an electronic component is temporarily attached to a predetermined position of a substrate via an adhesive, and the terminal of the electronic component temporarily attached and the terminal of the substrate are connected by pressure bonding, the temporarily attached substrate is Receiving from the conveying means;
A recognition step for recognizing the presence or absence of the electronic component at least at the predetermined position of the temporarily attached substrate, and a terminal of the substrate and the electronic device when the recognition step recognizes that the electronic component is temporarily attached. Crimping process for crimping parts with terminalsAnd was prepared.
[0020]
[Action]
As a result of taking the above-mentioned means, the following operation occurs. That is, according to the invention described in claim 1.ElectricBy performing the pressure bonding when the child component is dropped, it is possible to prevent the pressure bonding portion from being stained or broken by the adhesive. In addition, adverse effects on other electronic components due to contamination of the crimping portion can be prevented. Further, since a cleaning process is not required when the adhesive adheres to the crimping portion, productivity is improved.
[0021]
According to the invention described in claim 2, in the invention described in claim 1, since the detecting means is provided so as to be movable based on the size of the substrate or the electronic component, various sizes of substrates and Even a bonding apparatus using electronic components can be applied.
[0022]
According to the invention described in claim 3,By performing the pressure bonding when the electronic component is dropped, it is possible to prevent the pressure bonding portion from being stained or broken by the adhesive. In addition, adverse effects on other electronic components due to contamination of the crimping portion can be prevented. In addition, since the cleaning process when the adhesive adheres to the crimping part is not required, productivity is improved,Since the detection means is provided integrally with the crimping portion, there is no need to provide a place for arranging the detection means, which can contribute to downsizing of the entire bonding apparatus. Also. After the electronic component is detected by the detection means, the step of transporting the substrate to the crimping portion is unnecessary, and it is possible to prevent the electronic component whose presence or absence has been confirmed during the transport from falling off.
[0023]
According to the invention described in claim 4ElectricBy performing the pressure bonding when the child component is dropped, it is possible to prevent the pressure bonding portion from being stained or broken by the adhesive. In addition, adverse effects on other electronic components due to contamination of the crimping portion can be prevented. In addition, the productivity is improved because no cleaning process is required when the adhesive adheres to the crimping part.The
[0024]
According to the invention described in claim 5,In the invention described in claim 4, when the electronic component is not in a predetermined position of the substrate based on the output of the detecting means, the electronic component is temporarily attached to the predetermined position of the substrate in the temporary attachment portion via an adhesive. This improves the product yield.
[0025]
According to the invention described in claim 6,By performing the pressure bonding when the electronic component is dropped, it is possible to prevent the pressure bonding portion from being stained or broken by the adhesive. In addition, adverse effects on other electronic components due to contamination of the crimping portion can be prevented. Further, since a cleaning process is not required when the adhesive adheres to the crimping portion, productivity is improved.
[0027]
【Example】
FIG. 1 is a front view showing an outline of a bonding apparatus according to a first embodiment of the present invention, and FIG. 2 is a side view showing a main part of the apparatus. In these drawings, the same reference numerals are given to the same functional parts as those in FIGS.
[0028]
In FIG. 1, 10 indicates a provisional pressure bonding device, and 20 indicates a pressure bonding device. The temporary pressure bonding apparatus 10 includes a table 11, a liquid crystal substrate transport mechanism 12 disposed on the table 11, a temporary pressure bonding mechanism 13, and a temporary pressure bonding control unit 14.
[0029]
The liquid crystal substrate transport mechanism 12 includes a guide 12a, a liquid crystal substrate support mechanism 12b that is slidably movable along the guide 12a in the direction of arrow α in FIG. 1, and a drive mechanism (not configured) that drives the liquid crystal substrate support mechanism 12b. (Illustrated).
[0030]
The temporary pressure bonding mechanism 13 has a function of temporarily attaching the TAB component T to the liquid crystal substrate Q on which the anisotropic conductive film P has been pasted. The liquid crystal substrate Q is designed so that a plurality of TAB components T are mounted at predetermined positions. Further, L in FIG. 1 indicates a temporary pressure bonding position where the TAB component T is temporarily attached to the liquid crystal substrate Q by the temporary pressure bonding mechanism 13.
[0031]
The temporary pressure bonding control unit 14 is based on the basic data or correction data stored in the basic data storage unit 26a and the correction data storage unit 26b of the storage unit 26 of the pressure bonding apparatus 20 to be described later, and the liquid crystal substrate transport mechanism 12 and the temporary pressure bonding mechanism. 13 is controlled.
[0032]
The crimping device 20 includes a table 21, a liquid crystal substrate transport mechanism 22 disposed on the table 21, a crimping mechanism 23, a crimping controller 24, and a sensor 25 as a detection unit connected to the crimping controller 24. A storage unit 26 that is connected to the crimping control unit 24 and stores basic data and correction data, which will be described later, and a defective product transporting mechanism 27 that transports the liquid crystal substrate Q to the temporary crimping apparatus 10 when the TAB component T falls off. ing.
[0033]
The liquid crystal substrate transport mechanism 22 includes a guide 22a, a liquid crystal substrate support mechanism 22b that is slidable in the direction α in FIG. 1 along the guide 22a, and a drive mechanism (not shown) that drives the liquid crystal substrate support mechanism 22b. ).
[0034]
As shown in FIG. 2, the crimping mechanism 23 includes a bonding tool 23a that pressurizes and heats the TAB component T temporarily attached to the liquid crystal substrate Q, and a backup tool 23b that is disposed to face the bonding tool 23a. ing. The bonding tool 23a and the backup tool 23b are provided so as to reciprocate in the direction of arrow D in FIG. 2 by a drive mechanism (not shown). A position between the bonding tool 23a and the backup tool 23b is referred to as a crimping position M.
[0035]
The crimp control unit 24 is a drive control unit 30 that controls the drive of the liquid crystal substrate transport mechanism 22, a first control unit 31 that controls the drive of the crimp mechanism 23, and a second control unit that controls the drive of the defective product transport mechanism 27. 32.
[0036]
The drive control unit 30 drives the liquid crystal substrate transport mechanism 22 by reading out basic data such as the type of the liquid crystal substrate, the position where the TAB component is mounted, and the type of the TAB component from a basic data storage unit 26a, which will be described later. Positioning of the pressure bonding position M of the liquid crystal substrate Q is performed.
[0037]
When the liquid crystal substrate transport mechanism 22 positions the liquid crystal substrate Q, the first control unit 31 determines whether the TAB component T is present based on basic data from the basic data storage unit 26a and input from the sensor 25 described later. When the TAB component T is present, it has a function of performing control to operate the crimping mechanism 23.
[0038]
The second control unit 32 recognizes the presence or absence of the TAB component T based on the basic data from the basic data storage unit 26 a and the input from the sensor 25 when the liquid crystal substrate transport mechanism 22 positions the liquid crystal substrate Q. If there is no TAB component T, the type of liquid crystal substrate, the position information of the drop-off position, the type of TAB component, etc. are stored as correction data in the correction data storage unit 26b described later, and a monitor screen (not shown), etc. It has the function to perform control which warns an operator.
[0039]
The sensor 25 is disposed in the vicinity of the crimping mechanism 23 and below the TAB component T when the liquid crystal substrate Q is positioned. The sensor 25 is arranged so as to reciprocate in the direction of arrow β in FIG. The sensor 25 has a function of detecting the presence or absence of the TAB component T positioned at the crimping position M when the liquid crystal substrate Q is transported to the crimping mechanism 23 by the liquid crystal substrate transport mechanism 22 and transferring the detection result to the crimping controller 24. have.
[0040]
The storage unit 26 includes a basic data storage unit 26a and a correction data storage unit 26b. In the basic data storage unit 26a, the type of liquid crystal substrate, the position where the TAB component is mounted, the type of TAB component, and the like are stored as basic data in advance, and the correction data storage unit 26b includes the second control unit 32 described above. The type of the transferred liquid crystal substrate, the position information of the drop-off position, the type of the TAB component, etc. are stored as correction data.
[0041]
The defective product transport mechanism 27 has a function of transporting the liquid crystal substrate Q that has not been crimped because the TAB component T has dropped out based on the correction data stored in the correction data storage unit 26b to the temporary crimping apparatus 10 described above. doing.
[0042]
The thus configured bonding apparatus mounts the TAB component T on the liquid crystal substrate Q as follows. That is, in the temporary press-bonding device 10, the liquid crystal substrate Q on which the anisotropic conductive film P is previously attached at a predetermined position is taken out from the magazine (not shown) by the liquid crystal substrate support mechanism 12b of the liquid crystal substrate transport mechanism 12, and the guide 12a And is positioned at the temporary pressure bonding position L of the temporary pressure bonding mechanism 13. This positioning is performed by the provisional pressure bonding control unit 14 based on the basic data stored in the basic data storage unit 26a.
[0043]
In the temporary pressure bonding mechanism 13, the TAB component T is supplied by a TAB component supply mechanism (not shown) based on the basic data stored in the basic data storage unit 26 a described above, and the anisotropic conductive film P is formed by the temporary pressure bonding mechanism 13. The TAB component T is temporarily bonded to the liquid crystal substrate Q. When all the TAB components T are temporarily pressure-bonded to the liquid crystal substrate Q based on the basic data described above, the liquid crystal substrate transport mechanism 12 transports the liquid crystal substrate Q to the pressure bonding device 20 side.
[0044]
In the pressure bonding apparatus 20, the liquid crystal substrate Q on which the TAB component T is temporarily bonded is transferred from the liquid crystal substrate support mechanism 12 b to the liquid crystal substrate support mechanism 22 b of the liquid crystal substrate transport mechanism 22 by a transfer mechanism (not shown). The liquid crystal substrate support mechanism 22 b transports the liquid crystal substrate Q along the guide 22 a and positions the liquid crystal substrate Q at the crimping position M of the crimping mechanism 23. This positioning is performed by the drive control unit 30 of the crimping control unit 24 based on the basic data stored in the basic data storage unit 26a.
[0045]
When the liquid crystal substrate Q is positioned, the sensor 25 detects the presence or absence of the TAB component T at a predetermined position. When the TAB component T is present, the first control unit 31 operates the crimping mechanism 23. By the operation of the crimping mechanism 23, the bonding tool 23a is lowered in the direction of arrow D1 in FIG. 2, and the backup tool 23b is raised in the direction of arrow D2 in FIG. The bonding tool 23a is heated, and the TAB component T and the liquid crystal substrate Q are sandwiched together with the backup tool 23b with a predetermined pressure. After the elapse of a predetermined time, the anisotropic conductive film P is melted, whereby the outer lead of the TAB component T and the lead of the liquid crystal substrate Q are brought into conduction and the crimping is completed.
[0046]
On the other hand, when there is no TAB component T, the crimping mechanism 23 does not operate, and the second control unit 32 sends the type of liquid crystal substrate, the position information of the drop-off position, and the type of TAB component to the correction data storage unit 26b. This correction data storage unit 26b stores the correction data.
[0047]
Thus, based on the basic data stored in advance in the basic data storage unit 26a, all the TAB parts T that have been normally temporarily press-bonded are press-bonded to the liquid crystal substrate Q, and the TAB that has fallen off after being temporarily press-bonded is used. When the correction data of the component T is stored in the correction data storage unit 26b, the liquid crystal substrate Q is unloaded in the α direction in FIG.
[0048]
Here, the normal liquid crystal substrate Q in which the TAB component T is not dropped is sent to a subsequent process (not shown). Further, the liquid crystal substrate Q on which the TAB component T is dropped is transported to the provisional pressure bonding apparatus 10 by the defective product transport mechanism 27.
[0049]
In the temporary crimping apparatus 10, the liquid crystal substrate Q transported by the defective product transport mechanism 27 is taken out by the liquid crystal substrate support mechanism 12 b of the liquid crystal substrate transport mechanism 12 and transported along the guide 12 a, and the temporary crimping position of the temporary crimp mechanism 13. Position to L. This positioning is performed by the temporary pressure bonding control unit 14 based on the correction data stored in the correction data storage unit 26a described above.
[0050]
The temporary press-bonding mechanism 13 temporarily presses the TAB component T again only at the drop-off position based on the type of liquid crystal substrate, the position information of the drop-off position, and the type of TAB component. When the temporary crimping is completed again, the liquid crystal substrate Q is conveyed to the crimping device 20 and crimped in the same manner, and the TAB component T is not dropped off.
[0051]
When the TAB component T is removed again in the crimping device 20, the correction data is stored in the same manner, and is transported to the temporary crimping device 10 by the defective product transport mechanism 27 to be temporarily crimped. Until all the TAB parts T are mounted at the predetermined position, the temporary pressure bonding and the pressure bonding are repeated.
[0052]
As described above, in the bonding apparatus according to the present embodiment, when the TAB component T temporarily attached to the liquid crystal substrate Q in the temporary pressure bonding apparatus is dropped for some reason before the pressure bonding is performed in the pressure bonding apparatus, the pressure bonding is not performed. Like that. For this reason, when the TAB component T falls off, the bonding tool 23a of the crimping mechanism 23 directly contacts the anisotropic conductive film P previously attached to the liquid crystal substrate Q, thereby preventing the bonding tool 23a from becoming dirty. be able to. Therefore, the dirty TAB component T is not soiled by the dirty bonding tool 23a, and it does not take time to clean the bonding tool 23a.
[0053]
On the other hand, since the sensor 25 can be moved as appropriate, it is possible to detect the drop of the TAB component T even when the shape and dimensions of the liquid crystal substrate Q and the TAB component T are changed.
FIG. 3 is a side view schematically showing a modification of the first embodiment. In other words, the present modification is different from the above-described embodiment in that the sensor 25 is disposed in the backup tool 40 formed of a transparent material. That is, the sensor 25 transmits the backup tool 40 from the backup tool 40 and detects the presence or absence of the TAB component T.
[0054]
According to this modification, it is not necessary to move the position of the sensor 25 even if the size of the liquid crystal substrate Q or the TAB component T is changed, so that it is not necessary to provide a sensor moving device, and the crimping device 20 can be reduced in size and cost. Can contribute to
[0055]
In this embodiment, the type of the liquid crystal substrate, the position information of the dropped TAB component, and the type of the TAB component are stored in the storage unit, but only the position information of the dropped TAB component may be stored. Good. That is, in the case where the same liquid crystal substrate is used, if the TAB component can be specified from the dropped position information, the temporary attachment can be performed again only with the position information of the dropped TAB component. In the first embodiment, the sensor 25 can be moved according to the size of the liquid crystal substrate Q and the TAB component T. However, if the size of the liquid crystal substrate Q and the TAB component T is within a certain range, the sensor 25 There is no need to install mobile equipment.
[0056]
FIG. 4 is a perspective view showing a bonding apparatus incorporating a bonding state inspection apparatus according to a second embodiment of the present invention, and FIGS. 5A and 5B are explanatory views showing the inspection principle of the bonding state inspection apparatus. It is.
[0057]
The bonding apparatus includes a table 50 in which a control device and a driving device (not shown) are accommodated, a liquid crystal substrate transport mechanism 60 that transports a liquid crystal substrate Q as a light-transmitting substrate, and a TAB component T that has an anisotropic conductive film P in advance. And a bonding state inspection device 80 for inspecting the bonding state between the bonded TAB component T and the liquid crystal substrate Q. .
[0058]
The liquid crystal substrate transport mechanism 60 includes a guide 61 incorporating a driving device, a transfer table 62 that is reciprocally movable along the guide 61 in the direction of the arrow X in FIG. 4, and the transfer table 62. 4 includes a rotation support portion 63 that is rotationally driven in the direction of arrow R in FIG. 4 and a cross-shaped suction arm 64 that is provided on the rotation support portion 63 and holds the liquid crystal substrate Q by suction.
[0059]
The crimping mechanism 70 includes a first crimping part 71 and a second crimping part 72. In addition, since the 1st crimping | compression-bonding part 71 and the 2nd crimping | compression-bonding part 72 are formed identically, only the 1st crimping | compression-bonding part 71 is demonstrated and the same code | symbol is attached | subjected to the same function part about the 2nd crimping | compression-bonding part 72. Detailed description thereof is omitted. The first crimping portion 71 is disposed opposite the pressure tool 73, a bonding tool 74 provided below the pressure cylinder 73 so as to be reciprocable in the direction of arrow E in FIG. 4, and the bonding tool 74. And a backup tool (not shown) that sandwiches the TAB component T and the liquid crystal substrate Q by the bonding tool 74. In FIG. 4, reference numeral 75 denotes a heating device that performs heating and temperature adjustment of the bonding tool 74.
[0060]
The bonding state inspection device 80 is disposed adjacent to the pressure-bonding mechanism 70 and irradiates a predetermined amount of light, an optical sensor 82 disposed opposite the irradiation unit 81, the irradiation unit 81 and the light. And a control unit 83 that controls the sensor 82.
[0061]
The irradiation unit 81 emits light as shown in FIGS. 5A and 5B in the bonding state of the press-bonded portion where the liquid crystal substrate Q and the TAB component T are thermocompression bonded through the anisotropic conductive film P. To do. In addition, the range enclosed with the dashed-two dotted line S in (a) of FIG. 5 has shown the range irradiated with light by the irradiation part 81. FIG.
[0062]
The optical sensor 82 detects the amount of light transmitted by the irradiation unit 81 and transmitted through the crimped portion of the liquid crystal substrate Q.
From the comparison circuit 83a and the comparison circuit 83a, the control unit 83 compares the detected light transmission amount detected by the optical sensor 82 with the reference light transmission amount stored in the control unit 83 in advance and normally pressed. Is provided with a determination circuit 83b for determining whether the pressure bonding is normal or defective, and a drive circuit 83c for driving the irradiation unit 81. In the determination circuit 83b, when the detected light transmission amount is substantially equal to the reference light transmission amount, it is determined that the bonding state is normal, and when the detection light transmission amount is smaller than the reference light transmission amount, it is determined that the crimping is defective. That is, since the anisotropic conductive film P that is normally thermocompression bonded is almost transparent, the amount of light transmission is increased. On the other hand, the anisotropic conductive film P incompletely heat-bonded has a significantly reduced light transmission amount due to bubbles B and the like as shown in FIG. The result of the determination is displayed on a monitor screen (not shown) to the operator.
[0063]
In the bonding apparatus configured as described above, the TAB component T temporarily attached to the liquid crystal substrate Q and the bonding state are inspected as follows. That is, the liquid crystal substrate transport mechanism 60 transports the liquid crystal substrate Q temporarily attached with the TAB component T from the temporary crimping apparatus (not shown) to the crimping mechanism 70. Further, positioning is performed so that the TAB parts T temporarily attached to the crimping positions of the first crimping part 71 and the second crimping part 72 correspond to each other.
[0064]
The bonding tool 74 is pressed against the outer lead of the TAB component T by operating the pressure cylinder 73. At this time, the bonding tool 74 is heated by the heating device 75. By this pressurization and heating, the outer lead of the TAB component T and the lead of the liquid crystal substrate Q are conducted through the anisotropic conductive film P. In this way, all the TAB parts T temporarily attached to the liquid crystal substrate Q are pressure-bonded. Note that a portion where the TAB component T is pressure-bonded is referred to as a pressure-bonded portion.
[0065]
The liquid crystal substrate Q that has been crimped is transported to the bonding state inspection device 80 by the liquid crystal substrate transport mechanism 60. Further, the liquid crystal substrate Q is positioned so that the press-bonded portion of the liquid crystal substrate Q is positioned above the irradiation unit 81 of the bonding state inspection device 80. The light emitted from the irradiation unit 81 passes through the press-bonded portion of the liquid crystal substrate Q and enters the optical sensor 82.
[0066]
The optical sensor 82 detects the light transmission amount from the incident light, and transfers it to the comparison circuit 83a of the control unit 83 as the detected light transmission amount. The comparison circuit 83a compares the transferred detection light transmission amount with the reference light transmission amount stored in advance, and transfers the comparison result to the determination circuit 83b. In the determination circuit 83b, when the detected light transmission amount and the reference light transmission amount are substantially equal, it is determined that the bonding state is normal. The result of this determination is displayed to the operator.
[0067]
Next, the liquid crystal substrate transport mechanism 60 is operated so that the adjacent crimping portion is located above the irradiation unit 81. Similarly, the bonding state is inspected, and the result of determination is displayed to the operator. When the inspection of the crimped portion on the X1 side of the liquid crystal substrate Q is thus completed, the rotation support portion 63 of the liquid crystal substrate transport mechanism 60 is operated to rotate the liquid crystal substrate Q by 90 ° in the direction of arrow R in FIG. , The Y1 side crimping part is inspected. Finally, the rotation support part 63 is rotated by 90 ° in the direction of the arrow R, and the crimping part on the X2 side is inspected.
[0068]
As described above, in the bonding apparatus in which the bonding state inspection apparatus of this embodiment is incorporated, the bonding state between the TAB component T and the anisotropic conductive film can be automatically monitored. For this reason, since it is not necessary to stop a board | substrate conveyance mechanism for the visual inspection by an operator, the test | inspection of a bonding state can be performed efficiently.
[0069]
FIG. 7 is a plan view showing a modification of the second embodiment. In this figure, the same reference numerals are given to the same functional parts as those in FIG. Therefore, the detailed description of the overlapping part is omitted.
[0070]
This modification is different from the second embodiment described above in that two sets of bonding state inspection devices 80 are provided. That is, the set of the irradiation unit 81 and the optical sensor 82 of the bonding state inspection device 80 is disposed so as to face the X1 side and the X2 side of the liquid crystal substrate Q, respectively. With this configuration, in this modification, the liquid crystal substrate Q that has been subjected to pressure bonding is simultaneously inspected on the X1 side and the X2 side of the liquid crystal substrate Q by the two sets of bonding state inspection devices 80, and then the liquid crystal substrate Q Q is rotated, and one of the bonding state inspection devices 80 inspects the Y1 side of the liquid crystal substrate Q. For this reason, the inspection efficiency is further improved as compared with the second embodiment.
[0071]
In addition, this invention is not limited to the Example mentioned above. That is, in the above-described embodiment, the case where one or two bonding state inspection devices are provided has been described, but there may be three or more sets. Further, the bonding state inspection apparatus according to the second embodiment may be incorporated into the bonding apparatus according to the first embodiment. Of course, various modifications can be made without departing from the scope of the present invention.
[0072]
【The invention's effect】
According to the present invention, the presence or absence of an electronic component at a predetermined position of the substrate is detected before the terminal of the temporarily attached substrate and the terminal of the electronic component are crimped, and only when the electronic component is at the predetermined position of the substrate. By operating the crimping portion, it is possible to prevent the crimping portion from being stained or broken by the adhesive by performing the crimping when the electronic component is dropped.
[Brief description of the drawings]
FIG. 1 is a front view showing an outline of a bonding apparatus according to a first embodiment of the present invention.
FIG. 2 is a side view showing a main part of a crimping apparatus incorporated in the apparatus.
FIG. 3 is a side view showing a modification of the embodiment.
FIG. 4 is a perspective view showing a bonding apparatus incorporating a bonding state inspection apparatus according to a second embodiment of the present invention.
FIG. 5 is an explanatory diagram showing an inspection principle in a bonding state inspection apparatus incorporated in the bonding apparatus.
FIG. 6 is a plan view showing an example of an abnormal bonding state.
FIG. 7 is a plan view showing a modification of the bonding apparatus.
FIG. 8 is a front view showing an outline of a conventional bonding apparatus.
FIG. 9 is a side view showing the main part of the crimping apparatus incorporated in the apparatus.
[Explanation of symbols]
10 ... Temporary crimping device 11 ... Table
12 ... Liquid crystal substrate transport mechanism 12a ... Guide
12b ... Liquid crystal substrate support mechanism 13 ... Temporary pressure bonding mechanism
14 ... Temporary crimping controller
20 ... crimping device 21 ... table
22 ... Liquid crystal substrate transport mechanism 22a ... Guide
22b ... Liquid crystal substrate support mechanism 23 ... Crimping mechanism
23a ... Bonding tool 23b ... Backup tool
24 ... Crimping control unit 25 ... Sensor
26 ... Storage unit 26a ... Basic data storage unit
26b ... correction data storage unit 27 ... defective product transport mechanism
30 ... Drive control unit 31 ... First control unit
32 ... 2nd control part
50 ... Table 60 ... Liquid crystal substrate transfer mechanism
61 ... Guide 62 ... Transfer table
63 ... Rotation support 64 ... Suction arm
70 ... crimping mechanism 71 ... first crimping part
72 ... Second pressure bonding part 73 ... Pressure cylinder
74: Bonding tool 75 ... Heating device
80 ... Bonding state inspection device 81 ... Irradiation unit
82: Optical sensor 83: Control unit
83a: Comparison circuit 83b: Determination circuit
83c ... Driving circuit

Claims (6)

In a bonding apparatus for connecting by connecting the terminals of the electronic component and the terminals of the substrate from a state where the electronic component is temporarily attached to the predetermined position of the substrate via an adhesive,
A crimping portion for crimping the terminal of the substrate temporarily attached and the terminal of the electronic component;
Detecting means for detecting the presence or absence of the electronic component definitive to the predetermined position of the substrate prior to bonding the electronic component in the arrangement state to the crimping portion,
A bonding apparatus comprising: a control unit that operates the crimping unit only when the electronic component is at the predetermined position of the substrate based on the output of the detection means. The bonding apparatus according to claim 1, wherein the detection unit is movably provided based on a size of the substrate or the electronic component. In a bonding apparatus for connecting by connecting the terminals of the electronic component and the terminals of the substrate from a state where the electronic component is temporarily attached to the predetermined position of the substrate via an adhesive,
A crimping portion for crimping the terminal of the substrate temporarily attached and the terminal of the electronic component;
Detecting means for detecting the presence or absence of the electronic component at the predetermined position of the substrate before the electronic component is crimped in a state of being disposed in the crimping portion;
A controller that activates the crimping part only when the electronic component is at the predetermined position of the substrate based on the output of the detection means;
It said detecting means, a bonding apparatus characterized by being provided integrally with the crimped portion. A storage unit that stores the position where electronic components are mounted on the board as the basic data,
A temporary attachment unit that performs a temporary attachment operation of the electronic component to the predetermined position of the substrate through an adhesive based on the basic data stored in the storage unit;
A crimping part for crimping the terminal of the substrate and the terminal of the electronic component on which the tacking work was performed;
The presence or absence of the electronic component definitive to the predetermined position of the substrate conveyed to the crimp portion detecting means for detecting on the basis of the basic data stored in the storage unit,
A first control unit that activates the crimping operation of the crimping unit to the substrate only when the electronic component is at the predetermined position of the substrate based on the output of the detection means ;
Bonding apparatus characterized by comprising a. Based on the output of the detecting means, when the electronic component is not at the predetermined position of the substrate, the electronic component is temporarily attached to the predetermined position of the substrate through the adhesive at the temporary attachment portion. The bonding apparatus according to claim 4, further comprising a second control unit. In a bonding method in which an electronic component is temporarily attached to a predetermined position of a substrate via an adhesive, and the terminal of the electronic component temporarily attached and the terminal of the substrate are connected by pressure bonding.
Receiving the temporarily attached substrate from a conveying means;
At least tack has been the substrate of the predetermined position recognizing the presence or absence of the electronic component definitive in step,
Bonding method characterized by and a crimping step for crimping the terminals of the terminal and the electronic component of the upper Symbol substrate when it is recognized the electronic components are temporarily attached by the recognition process.

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