TW201942992A - Adhesive tape sticking device including a supplying part, a sticking part, a conveying part, a lighting part, an imaging part and a determination part - Google Patents

Abstract

Provided is an adhesive tape sticking device capable of automatically leading an adhesive tape. The adhesive tape sticking device includes a supplying part for supplying a tape-like member with an adhesive tape stuck to a release tape; a sticking part for sticking a sticking surface of the adhesive tape on a side opposite to the releasing tape to a sticking object; a conveying part for feeding the tape-like member from the supplying part to the sticking part; a lighting part arranged on the adhesive tape side of the tape-like member, wherein an optical axis is directed toward an adhesive reference position set by the sticking part, and is obliquely disposed at a predetermined angle with respect to a perpendicular direction of the sticking surface of the adhesive tape positioned at the adhesive reference position; an imaging part arranged at the adhesive tape side of the tape-like member for aligning the optical axis to the adhesive reference position to image the tape-like member positioned at the adhesive reference position; and a determination part for determining whether or not a cutting state of the adhesive tape is good based on an image of the tape-like member obtained by the imaging part.

Description

Applicable device for adhesive tape

The invention relates to a bonding device for an adhesive tape.

In the manufacturing steps of a flat panel display such as a liquid crystal display or an organic electroluminescent (EL) display, electronic components need to be mounted on a substrate to be bonded. The mounting may be performed, for example, by temporarily crimping electronic components via a tape on a terminal portion provided on a peripheral edge upper surface of the substrate, and then applying heat and pressure for formal crimping.

The electronic components to be bonded are, for example, integrated circuit (IC) chips, tape carrier packages (TCP), or chip-on-film (COF). TCP is a package in which a chip such as an IC is mounted on a thin film. The adhesive tape is, for example, a tape using an anisotropic conductive film (ACF) as a raw material and having a width of several millimeters and a thickness of several tens of micrometers. ACF is an anisotropic conductive film made of resin containing metal particles.

In this way, the thin adhesive tape is constituted as a tape-shaped member attached to a release tape. After the tape-shaped member is sent out from a reel and the tape is pressure-bonded to the substrate, only the release tape is peeled and discharged.

When the tape-shaped member runs out of tape due to the bonding industry, it is manually replaced with a new tape-shaped member. Specifically, an operator performs the following operations. First, replace the reel that has run out of tape with an unused reel. And take out the new belt-shaped member from the replaced unused reel. The tape of a predetermined length is peeled from the front end of the drawn strip-shaped member, and it is set to a bonding apparatus. The reason why the tape at the front end is peeled off in this way is to prevent a situation in which the tape is attached to the downstream side of the conveying direction than the bonding position to the conveying roller that holds and conveys the belt-like member (release tape) from both sides And so on, resulting in poor conveyance of the belt-like member.
[Prior Art Literature]
[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2004-186387

[Problems to be Solved by the Invention]

When replacing the belt-shaped member as described above, in order to ensure the accuracy of bonding to the substrate, a heading operation of aligning the beginning portion of the tape (hereinafter also simply referred to as the "front end") with a predetermined position is performed. The conventional out-of-place operation is an operation in which the operator uses visual inspection to feed the belt-shaped member against a predetermined position, for example, a lamination position. From the perspective of the structure of the device, it is sometimes difficult to see the tape. The belt-shaped member is difficult to align with a predetermined position due to excessive feeding of the belt-shaped member and the like.

The present invention has been made to solve the problems described above, and an object of the present invention is to provide a tape bonding apparatus capable of automatically performing a tape advance.
[Means for solving problems]

The adhesive tape bonding device of the present invention is characterized in that it includes a supply unit that supplies a tape-shaped member to which a tape is bonded on a release tape, and a bonding unit that bonds the bonding surface of the tape to an object to be bonded, The bonding surface is opposite to the release tape; a conveying section feeds the belt-shaped member from the supply section to the bonding section; a lighting section, an adhesive tape disposed on the belt-shaped member Side, the optical axis of the illuminating part is oriented toward a bonding reference position set for the bonding part, and is set in advance with respect to a perpendicular direction of the bonding surface of the tape at the bonding reference position. The imaging unit is arranged obliquely; the imaging unit aligns the optical axis of the imaging unit with the bonding reference position, is disposed on the tape side of the belt-shaped member, and photographs all positions at the bonding reference position. The band-shaped member; and a determination unit that determines, based on the image of the band-shaped member obtained by the imaging unit, whether the state of the slit of the tape is good or not.

The tape bonding apparatus may further include a cutting section including a cutter provided between the supply section and the bonding section, and cutting the tape of the belt-shaped member to form a cutting section. The semi-tangent line of the slit, and the conveying section feeds the belt-like member such that the semi-tangent line reaches the bonding reference position, and the imaging section captures the tape including the semi-tangent line A shape-like member, the determination unit detects the half-tangent line based on the image obtained by the imaging unit, and determines whether the shape of the cut surface of the half-tangent line is good.

The determination unit may determine whether the detected half-tangent line is within an allowable range including the bonding reference position.

The apparatus for bonding the tape may further include a transport control unit that calculates a distance between the half-tangent line and the bonding reference position, and when the determination unit determines that the half-tangent line deviates from the allowable range, The conveyance unit feeds the belt-shaped member such that the half-tangent line is located at the bonding reference position based on the distance calculated by the conveyance control unit.

Alternatively, the bonding portion may bond the tape on the downstream side than the half tangent line to the bonding object, and the imaging portion may capture the image after the bonding is performed by the bonding portion. In the band-shaped member, the determination unit determines the presence or absence of the tape in a plurality of areas set along the width direction of the tape before and after the bonding reference position, and based on the determination result of the determination unit. It is judged whether the adhesiveness of the tape is good or not.

The determination unit may grayscale the image and detect the cut seam.

The illuminating unit may be arranged such that the optical axis is inclined by 60 ° to 85 ° with respect to a perpendicular direction of the bonding surface of the tape at the bonding reference position.

The illuminating unit may irradiate white light or green light.

The adhesive tape may be an anisotropic conductive film.
[Effect of the invention]

According to the present invention, it is possible to obtain an adhesive tape bonding device capable of automatically performing the advance of the adhesive tape.

An example of an embodiment (hereinafter referred to as an embodiment) of the present invention will be specifically described with reference to the drawings. As shown in FIG. 1, the belt-shaped member 2 used in the present embodiment is formed by, for example, bonding an adhesive tape 21 to a release tape 22. The adhesive tape 21 is, for example, an anisotropic conductive film (ACF). The release tape 22 is a tape which can be peeled from the adhesive tape 21, for example, it consists of resin films, such as polyimide. The width of the generally used band-shaped member 2 is about 0.5 mm to 3.5 mm.

[structure]
FIG. 1 is a schematic configuration diagram of a bonding apparatus 1 according to an embodiment. The bonding device 1 is a device for bonding the tape 21 of the band-shaped member 2 to a bonding target. The bonding target is, for example, a punch plate 112 described later or a substrate that is a member constituting a flat display.

As shown in FIG. 1, the bonding apparatus 1 includes a bonding section 11, a supply section 12, a recovery section 13, a conveying section 14, a peeling section 15, a cutting section 16, a lighting section 17, an imaging section 18, and a control section 19.

[Laminating Department]
The bonding section 11 applies the adhesive tape 21 of the belt-like member 2 to the object to be bonded. The bonding section 11 includes a pressure head 110 and a platform member 111.

The pressure head 110 is moved up and down by a lifting device (not shown), thereby heating and pressing the belt-like member 2 to the bonding object. Therefore, a heater (not shown) is provided in the pressure head 110 to heat the contact surface with the belt-shaped member 2 to a predetermined temperature. Further, a cushioning member 110 a is provided on a contact surface of the pressure head 110 with the belt-like member 2. This cushioning member 110 a is, for example, a sheet made of an elastomer, and prevents the adhesive tape 21 that is softened by heating from adhering to the pressure head 110. That is, in the band-shaped member 2, the surface of the tape 21 opposite to the release tape 22 becomes a bonding surface with a bonding object.

The platform member 111 is a member that supports the bonding target from below when the belt-shaped member 2 is heated and pressurized on the bonding target by the pressure head 110. The platform member 111 has a support surface 111 a on its upper surface as a flat surface for supporting the object to be bonded.

As described above, the bonding object placed on the platform member 111 is a punching plate 112 or a substrate to be a product. For example, the punching plate 112 is provided for attaching an unnecessary portion at the beginning of the tape 21. The blanking plate 112 is, for example, a metal plate, and has the same size as the substrate, and is arranged on the support surface 111 a of the platform member 111. In addition, the beater plate 112 may use a tape or a plastic plate instead of a metal plate. Alternatively, it is also possible to replace the cloth tape, the plastic plate, or the like by bonding on the punching plate 112.

A lamination reference position 10 is set on a conveyance path for conveying the belt-shaped member 2 at a lamination position where the tape 21 is attached to the lamination section 11. The bonding reference position 10 is a reference position for aligning the slits 20 of the tape 21 in the band-shaped member 2, and here is the position of the upstream end of the pressure head 110 in the transport direction of the band-shaped member 2. The slit 20 of the adhesive tape 21 is, for example, a beginning portion of the adhesive tape 21 in the band-shaped member 2 and a half-cut line 20 b described later formed by the cutting portion 16.

[Supply Department]
The supply section 12 supplies the band-shaped member 2 to the bonding section 11. The supply unit 12 includes a supply reel 120, a tension mechanism 121, and a path roller 122. The supply reel 120 is a reel that winds the belt-like member 2 and sends out the belt-like member 2 by rotation.

The tension mechanism 121 applies tension to the belt-like member 2. The tension mechanism 121 is a pair of rollers arranged to be spaced up and down to guide the movement of the belt-like member 2 drawn out from the supply reel 120. One of the rollers is a fixed roller 121a that does not move up and down, and the other roller is a movable roller 121b that moves up and down. The movable roller 121b is moved up and down by a lifting mechanism (not shown). That is, it moves in the direction of the black arrow in the figure.

The path roller 122 is a roller that changes the conveyance direction of the belt-like member 2 from the tension mechanism 121 and sends the belt-shaped member 2 to the cutting unit 16.

[Recycling Department]
The recovery unit 13 recovers the release tape 22 that has been peeled from the adhesive tape 21 that is bonded to the object to be bonded in the bonding unit 11. The recovery unit 13 includes a recovery reel 130 and a path roller 131.

The take-up reel 130 is a reel in which the release tape 22 is taken up and recovered. The path roller 131 is a roller which changes the conveyance direction of the release tape 22 from the side of the bonding part 11, and sends it to the collection reel 130.

[Transport Department]
The conveying section 14 is disposed between the bonding section 11 and the recovery section 13, and feeds the belt-shaped member 2 from the supply section 12 to the recovery section 13 through the bonding section 11. The conveyance unit 14 includes a pair of feed rollers 140 and a feed motor (not shown). The pair of feed rollers 140 sandwich the release tape 22, and the belt-like member 2 is moved from the supply reel 120 side to the recovery reel 130 side by the rotation of the roller. The feed motor is a drive source that rotates the feed roller 140. The rotation shaft of the feed motor is connected to the feed roller 140, and the rotation shaft is rotated about this axis by the drive of the motor, thereby rotating the feed roller 140 around the rotation axis.

The path of the belt-shaped member 2 sent from the supply reel 120 through the two rollers 121a, 121b, path roller 122, and path roller 131 of the tension mechanism 121 to the recovery reel 130 is the conveyance path of the belt-shaped member 2. . In addition, in order to explain the positional relationship of the respective sections, the supply section 12 side is referred to as the upstream side of the belt-like member 2, and the recovery section 13 side is also referred to as the downstream side of the belt-shaped member 2. The downstream side of the band-shaped member 2 with respect to the bonding reference position 10 is referred to as a front, and the upstream side of the band-shaped member 2 is also referred to as a rear.

[Peeling section]
The peeling part 15 peels the release tape 22 from the adhesive tape 21 stuck to the bonding target object. The peeling section 15 includes a peeling bar 150 and a peeling bar 151. The peeling bar 150 and the peeling bar 151 are round rods, for example, and are members which are in contact with the release tape 22. The release bar 150 is in contact with the surface of the release tape 22, that is, the surface on the tape 21 side, and the release bar 151 is in contact with the back surface of the release tape 22. The peeling bar 150 and the peeling bar 151 are moved horizontally from the downstream side to the upstream side of the bonding portion 11 in a state in which they are in contact with the release tape 22 as shown in FIG. (Arrow direction), thereby releasing the release tape 22 from the adhesive tape 21 which is pressure-bonded to the object to be bonded.

[Cutting section]
The cutting unit 16 cuts the adhesive tape 21 of the belt-like member 2. This cutting portion 16 may further cut into the release tape 22 to the extent that the release tape 22 is not cut. Hereinafter, a case where the tape 21 is cut in this way is referred to as a half cut, and a line formed by the cutting section 16 in the tape 21 is referred to as a half cut line 20b.

The cutting section 16 is provided between the supply section 12 and the bonding section 11, and includes a cutter 160 and a backup member 161. The cutter 160 is a member that comes into contact with the tape 21 and cuts it, and is provided between the supply portion 12 and the bonding portion 11. The cutter 160 uses a lifting mechanism (not shown), and a blade at the front end thereof is in contact with or separated from the support member 161. The blade of the front end of the cutter 160 extends in the width direction of the band-shaped member 2. The support member 161 is a rectangular parallelepiped block. The support member 161 has a flat surface 161 a on the lower surface of the block, which sandwiches the band-shaped member 2 with the cutter 160 and makes contact with the release tape 22 in the horizontal direction. In the present embodiment, the position of the cutting section 16 is set so that the distance between the cutter 160 and the bonding reference position 10 is shorter than the length of the tape 21 bonded to the substrate.

[Lighting Department]
The illuminating unit 17 is arranged on the tape 21 side of the band-shaped member 2 in the vicinity of the bonding reference position 10. Specifically, the illuminating unit 17 is disposed below the belt-like member 2 and illuminates the belt-like member 2 from the tape 21 side.

The illuminating unit 17 is provided with its optical axis directed toward the bonding reference position 10 and diagonally intersects with the perpendicular line of the band-shaped member 2. The vertical line is a straight line orthogonal to the surface of the band-shaped member 2, and more specifically, a straight line orthogonal to the bonding surface of the tape 21 in the band-shaped member 2 at the bonding reference position 10. . When the belt-like member 2 is transported horizontally with respect to the bonding reference position 10, the vertical line may be a vertical line with respect to the horizontal direction. The optical axis of the illuminating unit 17 is preferably inclined by 60 ° to 85 ° with respect to the perpendicular direction of the bonding surface of the tape 21 at the bonding reference position 10. The lighting unit 17 may be provided on the upstream side of the band-shaped member 2 or on the downstream side of the band-shaped member 2. The lighting unit 17 can use, for example, a light emitting diode (LED) that emits visible light, and among them, a white light or green light LED is preferably used. The optical axis of the illuminating unit 17 is oriented toward the bonding reference position 10, which means that the illuminating unit 17 is arranged toward the bonding reference position 10. At the position shown in FIG. 1, the optical axis may be aligned with the bonding reference position 10. Not completely crossed.

[Camera Department]
The imaging unit 18 images the band-shaped member 2 at the bonding reference position 10. The imaging unit 18 is, for example, a camera. The imaging unit 18 aligns the optical axis with the bonding reference position 10 and is disposed on the tape 21 side of the band-shaped member 2, and photographs the band-shaped member 2 with the illumination unit 17 illuminating the band-shaped member 2 from the tape 21 side. . Specifically, the imaging unit 18 is disposed below the band-shaped member 2 and directly below the bonding reference position 10, and the optical axis is orthogonal to the band-shaped member 2. That is, the imaging range of the imaging section 18 includes the bonding reference position 10. When the slit 20 of the tape 21 enters the imaging range by the feeding of the band-shaped member 2, the imaging section 18 photographs the strip-like shape including the slit 20. Component 2. The optical axis of the imaging unit 18 may not be orthogonal to the band-shaped member 2. For example, the optical axis of the imaging unit 18 may be viewed from the conveyance direction of the belt-like member 2 and may be diagonally inclined at about 15 ° with respect to the vertical line of the belt-like member 2. Furthermore, in the imaging unit 18, the optical axis does not need to be completely coincident with the bonding reference position 10, as long as the required portion of the band-shaped member 2 located at the bonding reference position 10 is within the imaging range.

[Control Department]
The control unit 19 is a control device that collectively controls each unit of the bonding apparatus 1. The control unit 19 may be composed of, for example, a dedicated electronic circuit or a computer that operates according to a predetermined program. That is, regarding the control of the bonding section 11, the tension mechanism 121, the conveying section 14, the peeling section 15, the cutting section 16, the lighting section 17, and the camera section 18, the control content is programmed and controlled by programmable logic Controller (Programmable Logic Controller, PLC) or central processing unit (Central Processing Unit, CPU).

FIG. 2 is a functional block diagram of the control unit 19. As shown in FIG. 2, the control unit 19 includes a bonding control unit 190, a tension mechanism control unit 191, a peeling control unit 192, a cutting control unit 193, a lighting control unit 194, an imaging control unit 195, a determination unit 196, and a transport control unit. 197.

The bonding control section 190 controls a heater and a lifting device provided in the bonding section 11 to cause the heater to heat the pressure head 110 and cause the lifting device to lift and lower the heated pressure head 110. The tension mechanism control unit 191 controls a lifting mechanism provided in the tension mechanism 121 to move the movable roller 121 b up and down, thereby applying tension to the belt-like member 2.

The peeling control section 192 controls a moving mechanism provided in the peeling section 15 to move the peeling bar 150 and the peeling bar 151 horizontally, thereby peeling the adhesive tape 21 crimped to the punch 112 from the release tape 22. The cutting control unit 193 controls a lifting mechanism provided in the cutting unit 16 to raise and lower the cutter 160.

The lighting control unit 194 controls lighting of the lighting unit 17. The imaging control unit 195 controls imaging by the imaging unit 18.

The determination unit 196 determines, based on the image of the belt-like member 2 obtained by the imaging unit 18, whether the position of the slit 20 of the tape 21 is good or whether the cut surface is good or not. The determination unit 196 gray-scales the image of the band-shaped member 2 and detects the position of the slit 20 of the tape 21. Then, the determination unit 196 determines whether the detected slit 20 is within the allowable range of the bonding reference position 10. When the slit 20 is within the allowable range, it is judged as good, and when the slit 20 is outside the allowable range, it is judged as bad. In addition, the so-called grayscale refers to, for example, converting the brightness of an image into a multi-level pixel value corresponding to the brightness, and typically uses a pixel value of 0 (black) to a pixel value of 255 (white) Conversion of 256 gray levels.

The determination unit 196 detects the half-tangent line 20b as the slit 20 based on the image of the band-shaped member 2 obtained by the imaging unit 18, and determines whether the shape of the cut surface is good or not. The shape of the cut surface of the half-tangent line 20b is a shape of a cutout formed by the cutter 160 when the band-shaped member 2 is viewed from the tape 21 side. The half tangent line 20b is judged to be good when it is detected as a straight line with a large (bright) pixel value in the width direction of the band-shaped member 2, and when the portion with a large pixel value is not straight and inclined, or becomes It was judged that it was bad when it was uneven | corrugated, such as a meander or a defect.

In addition, the determination unit 196 determines whether the advancement of the adhesive tape 21 is good or not based on the presence or absence of the adhesive tape 21 in the front and rear regions of the bonding reference position 10. The tape head 21 refers to the provision of a new supply reel 120 and a half tangent line 20 b formed by the front end of the tape 21 that can be attached to the beginning of a substrate to be a product. Within range. The predetermined range is a range that allows the half-tangent line 20 b to be positioned at the bonding reference position 10. The determination unit 196 may further divide each area before and after the bonding reference position 10 into a plurality of small areas to determine the presence or absence of the tape 21.

The conveyance control unit 197 calculates the distance (offset) between the slit 20 of the tape 21 and the bonding reference position 10 when it is determined by the determination unit 196 that the position of the slit 20 is defective. That is, when the position of the slit 20 is not good, the position of the slit 20 is shifted beyond the allowable range with respect to the bonding reference position 10, so the band-shaped member 2 needs to be corrected so that the position of the slit 20 is within the allowable range. s position. Therefore, the transport control unit 197 calculates the distance between the bonding reference position 10 and the position of the slit 20 based on the captured image of the imaging unit 18, and generates a control signal for driving the feed motor based on the calculated distance. That is, the control signal is a signal for feeding the belt-shaped member 2 at a calculated distance so that the half tangent line 20b reaches the bonding reference position 10, and is output to the feeding motor.

[action]
The operation of the bonding apparatus 1 having the tape 21 configured as described above will be described.

[Beginning of the tape]
FIG. 3 is a flowchart showing an example of a tip-out operation of the adhesive tape 21 of the bonding apparatus 1 according to the embodiment.

In addition, as a premise, a new supply reel 120 is provided in the supply unit 12, and the belt-like member 2 is pulled out from the supply reel 120, and passed through the tension mechanism 121, the path roller 122, the peeling portion 15, the path roller 131, and the feed The roll 140 is wound around the collection reel 130. In addition, before the tape 21 of the band-shaped member 2 is wound, the downstream side is peeled off by the operator, and the beginning portion 20a of the tape 21 as the slit 20 is positioned more than the imaging portion 18, that is, the bonding reference position 10 On the upstream side. That is, the tape 21 is peeled off further downstream than the said head part 20a, and the surface of the release tape 22 is exposed. The shape of the beginning portion 20a of the adhesive tape 21 is arbitrary because the peeling is performed by an operator. For example, it may be a line parallel to the width direction of the belt-like member 2, a line inclined with respect to the width direction of the belt-like member 2, or a valley shape with respect to the width direction of the belt-like member 2. Sinuous or bumpy lines.

In addition, a punch plate 112 is placed on the support surface 111 a of the platform member 111 in advance.

As shown in FIG. 3, the lighting unit 17 is turned on by the lighting control unit 194, and the band-shaped member 2 is illuminated by including the reference position 10 (step S01). As shown in FIG. 4 (a), the belt-like member 2 is sequentially fed at a predetermined pitch by the conveyance unit 14 (step S02), and the head portion 20 a of the adhesive tape 21 is determined by the imaging unit 18 and the determination unit 196 (the slit 20). The position is good or not (step S03). That is, when the image pickup section 18 feeds the belt-shaped member 2 by the conveying section 14, the belt-shaped member 2 is photographed in the shooting range including the bonding reference position 10, and the determination section 196 gray-scales the image obtained by the image pickup section 18, such as As shown in FIG. 4 (b), it is determined whether the leading portion 20 a of the tape 21 is included in the predetermined range R1 including the bonding reference position 10 based on the difference in shades. The portion with the adhesive tape 21 becomes darker, the portion without the adhesive tape 21 becomes brighter, and the junction between light and dark becomes the beginning portion 20a. The predetermined range R1 is, for example, an inspection area set within an imaging range.

The feed pitch of the conveyance part 14 is a space | interval which is the same as or shorter than the length of the conveyance direction of the belt-shaped member 2 of predetermined range R1. If the determination section 196 does not detect the first portion 20a (NO in step S03), it returns to step S02 and repeats steps S02 and S03 until the first portion 20a is detected.

When the head section 20a is detected by the determination section 196 (YES in step S03), the cutting is performed by the cutting control section 193 in a state where the band-shaped member 2 is stopped at the position where the head section 20a is detected. The device 160 rises and cuts the band-shaped member 2 in half (step S04). As shown in FIG. 4 (c), the tape 21 is cut to form a half-cut line 20 b as the slit 20. Then, the belt-like member 2 is fed by the conveyance part 14 by the distance of the cutting part 16 (cutter 160) and the bonding reference position 10 (step S05). Then, the band-shaped member 2 is imaged by the imaging unit 18, and the presence or absence of the half-tangent line 20b is detected by the determination unit 196 (step S06). When the half-tangent line 20b is not detected (NO in step S06), the process returns to step S04.

When the half-tangent line 20b is detected (YES in step S06), as shown in FIG. 4 (d), the determination unit 196 determines whether the detected half-tangent line 20b is within the range including the bonding reference position 10. Within the allowable range (step S07). When the half-tangent line 20b is not within the allowable range (NO in step S07), the feed correction of the band-shaped member 2 is performed. That is, the transfer control unit 197 calculates the distance between the half-tangent line 20b and the bonding reference position 10 based on the position of the half-tangent line 20b and the position of the bonding reference position 10 identified within the predetermined range R1 (step S08), and uses the transfer The unit 14 feeds the belt-like member 2 by the calculated distance so that the half-tangent line 20b reaches the bonding reference position 10 (step S09), and returns to step S07.

When the half-cut line 20b is within the allowable range (YES in step S07), the portion of the tape 21 from the beginning portion 20a to the half-cut line 20b is located between the pressure head 110 and the blanking plate 112. In this state, the belt-shaped member 2 is pushed down by the preheated pressure head 110, and the unnecessary tape 21 downstream of the half-cut line 20b is beaten on the blanking plate 112 (step S10, refer to (E) of Figure 4). That is, the pre-heated pressure head 110 is lowered by the bonding control unit 190, and the unnecessary tape 21 from the head portion 20a to the half-cut line 20b is bonded to the punching plate 112 to raise the pressure head 110. Then, the peeling stick 150 and the peeling stick 151 are horizontally moved to the bonding part 11 side by the peeling control part 192, and the release tape 22 is peeled from the adhesive tape 21 crimped to the punch 112 (step S11).

After the release tape 22 is peeled off, the band-shaped member 2 is imaged by the imaging unit 18 (step S12). Furthermore, at this time, the band-shaped member 2 is not fed, and therefore the position of the slit 20 of the tape 21 remaining on the upstream side of the bonding reference position 10 remains at the bonding reference position 10 without change. The determination unit 196 gray-scales the image obtained by the imaging unit 18, as shown in FIG. 4 (f1) and FIG. 4 (f2), setting 3 places each before and after the reference position 10 and a total of 6 places The presence or absence of the tape 21 is determined in each of the small area R11 to the small area R16 serving as the inspection area (step S13). The small regions R11, small regions R12, small regions R13, and small regions R14, small regions R15, and small regions R16 at the three front and rear positions are set in advance so as to be arranged side by side in the width direction of the band-shaped member 2. With regard to the determination of the presence or absence of the tape 21, for example, in each of the small regions R11 to R16, when the ratio of the pixel points (pixels) that are equal to or greater than the predetermined pixel value is equal to or greater than the predetermined ratio, in other words, When the ratio of pixel points is less than a predetermined ratio, it is determined that there is no tape 21 in the small region R11 to R16. When the ratio of pixel points that are equal to or greater than a predetermined pixel value is less than a predetermined ratio, in other words, it is less than a predetermined pixel value When the ratio of the pixel points is equal to or greater than a predetermined ratio, it is determined that the tape 21 exists in the small region R11 to the small region R16. Accordingly, the determination unit 196 determines whether the state (shape) of the tip (half tangent line 20 b) of the tape 21 remaining on the upstream side after peeling the unnecessary tape 21 is good, and determines whether the head is good or not.

As shown in (f1) of FIG. 4, the determination unit 196 determines that at least any one of the small region R14 to the small region R16 located in front of the bonding reference position 10 (downstream side) has the adhesive tape 21 (No in step S14 (No in step S14) NO)), it is deemed that the head is bad, and the process returns to step S04. Furthermore, it is thought at this time that part of the adhesive tape 21 does not peel off and remains on the release tape 22 at the time of peeling of the unnecessary adhesive tape 21, and peeling failure occurs.

On the other hand, as shown in (f2) of FIG. 4, when it is determined that there is no tape 21 in any of the small region R14 to the small region R16 in front of the bonding reference position 10 (downstream side) (YES in step S14 ( YES)), and if it is determined that there is no tape 21 in at least one of the small area R11 to small area R13 behind the bonding reference position 10 (upstream side) (NO in step S15), it is considered a bad start and Return to step S04. At this time, it is conceivable that when the unnecessary tape 21 is peeled off, a part of the front end of the tape 21 on the upstream side of the tape 21 that is the beginning is peeled together. The reason for this is that the half-cut by the cutter 160 is defective, and the unnecessary tape 21 in the half-cut line 20b is connected to a part of the tape 21 at the beginning.

In addition, as shown in (g) of FIG. 4, when it is determined that there is no tape 21 in any of the small region R14 to the small region R16 in front of the bonding reference position 10 (downstream side) (YES in step S14) ), And it is determined that there is an adhesive tape 21 in any of the small regions R11 to R13 located behind the bonding reference position 10 (upstream side) (YES in step S15), it is determined to be completed and ended.

Furthermore, it is also conceivable that the following situations occur repeatedly: return to step S04 due to a NO determination in step S06, step S14, or step S15, and become no again in the next step S06, step S14, or step S15 ( NO) judgment. In this case, the step of determining the number of repetitions may be set before step S06 or step S14. When the set number of times is repeated, the heading operation is interrupted as an error, and the operator is notified of the abnormality through an alarm or the like . In this case, it is thought that the half-cut failure by the cutter 160 is one cause. Therefore, the control unit 19 may prompt the maintenance operation of cleaning or replacing the cutter 160 by an alarm.

[effect]
Using FIGS. 5 (a) to 8 (b), a comparative example will be described, and the function of the bonding device 1 according to the embodiment will be described.

(Tilt of lighting section)
FIG. 5 (a) is a cross-sectional view showing the imaging state of the band-shaped member 2 in the bonding device of the comparative example. FIG. 5 (b) is an image of the band-shaped member 2 obtained by the bonding device of the comparative example. A graph of pixel values for each position of the image is superimposed on the image and described. The pixel value is expressed in 256 gray levels with black set to 0 and 255 set to white.

As shown in FIG. 5 (a), a half mirror M is provided inside the imaging unit 18. The optical axis of the illumination L is directed toward the half mirror M. The light of the illumination L is reflected by the half mirror M. The form of coaxial light parallel to the optical axis of the imaging section 18 is incident from a direction perpendicular to the band-shaped member 2.

As shown in FIG. 5 (b), the pixel values of the adhesive tape 21 and the release tape 22 are hardly different. Therefore, it is difficult to detect the slit 20 of the adhesive tape 21.

It has been found that it is difficult to detect the slit 20 of the adhesive tape 21 if the illumination L is provided only in this way.

FIG. 6 (a) is a cross-sectional view showing the imaging state of the band-shaped member 2 in the bonding device 1 according to the embodiment. FIG. 6B is an image of the band-shaped member 2 obtained by the bonding apparatus 1 according to the embodiment. A graph of pixel values for each position of the image is superimposed on the image and described. The pixel value is represented by 256 gray levels with black set to 0 and 255 set to white.

As shown in FIG. 6 (a), the optical axis of the illuminating unit 17 is diagonally intersected with respect to the perpendicular line of the band-like member 2, and the optical axis of the imaging unit 18 is orthogonal with respect to the band-like member 2. With this configuration, as shown in FIG. 6 (b), the pixel values of the adhesive tape 21 and the release tape 22 are greatly different, and the contrast between the portion with the adhesive tape 21 and the portion without the adhesive tape 21 becomes obvious. This is presumably caused by the shape of the fine unevenness on the surface of the release tape 22 and the shape of the fine metal fine particles contained in the tape 21. That is, the metal particles of the adhesive tape 21 are substantially spherical, and the amount of diffused light entering the imaging unit 18 does not change significantly regardless of whether the incident light from the illumination unit 17 is coaxial or oblique. On the other hand, the unevenness of the surface of the release tape 22 is random. Therefore, it is estimated that the amount of diffused light entering the imaging unit 18 is increased by diagonally intersecting the incident light from the illumination unit 17. For example, in FIG. 6, the angle θ that the optical axis of the illuminating portion 17 obliquely intersects with the vertical line of the belt-like member 2 is set to 75 °, and the pixel value of the portion with the tape 21 becomes about 97, and the pixel of the portion without the tape 21 The value becomes around 157. Thus, the shading difference becomes 50 or more, so that the slit 20 of the adhesive tape 21 can be stably detected.

Therefore, the inventors conducted experiments to study the relationship between the angle of the optical axis of the illumination section 17 and the amount of light entering the imaging section 18. FIG. 7 shows the detection results of the inclination angle θ of the optical axis of the illuminating unit 17 with respect to the perpendicular line of the belt-like member 2 and the slit 20 of the tape 21 at the angle. In addition, the detection result is that a white LED (model: SBR-15-50W) manufactured by Qinghe Optical Manufacturing Co., Ltd. is used as the illumination section 17 and a camera (model: FZ-S) manufactured by Omron Corporation is used as the imaging section 18, The result obtained by setting the distance between the band-shaped member 2 and the imaging unit 18 to 100 mm. In addition, regarding the band-shaped member 2 as a photographic subject, the slit 20 of the tape 21 is used, and the band-shaped member 2 provided in parallel with the width direction of the band-shaped member 2 is used.

As shown in FIG. 7, the inclination angle θ is changed to 30 °, 45 °, 60 °, 75 °, 85 °, and 90 ° to try to detect the slit 20. As a result, in the cases of 30 °, 45 °, and 90 °, the slit 20 cannot be detected well. On the other hand, when the inclination angle θ is 60 °, 75 °, or 85 °, the slit 20 can be detected well. That is, the pixel value difference between the portion with the tape 21 and the portion without the tape 21 is as large as 50 or more, and the detection accuracy of the presence or absence of the tape 21 is improved.

In this way, by setting the inclination angle θ to 60 ° to 85 °, it is possible to detect the beginning of the tape 21, the half-cut line 20b formed on the tape 21, and the presence of the tape 21 before and after the reference position 10 is attached. During the detection, the determination accuracy of the presence or absence of the tape 21 is jointly improved.

(Feed correction of the belt member)
The feed correction of the band-shaped member 2 will be described. As described above, the distance between the cutting portion 16 and the bonding reference position 10 is determined in advance. After the half-cut line 20b is formed, the belt-shaped member 2 is fed by the distance by the conveying portion 14 and the conveying control portion 197. This half tangent line 20b reaches the bonding reference position 10.

However, in practice, an error in the feed amount of the belt-like member 2 may occur due to a rotation error of the feeding motor or the feed roller 140 or expansion and contraction of the belt-like member 2. Regarding the expansion and contraction of the belt-like member 2, the narrower the width of the belt-like member 2 is, the easier it is to stretch under a certain tension, and the easier it is to get stuck on each roller or the like. Therefore, the band-shaped member 2 may have an inherent elongation for each type. When an error occurs in the feed amount of the belt-like member 2 in this manner, the error in the adhering direction of the tape 21 increases.

Therefore, in this embodiment, the imaging unit 18 and the determination unit 196 are used to determine whether or not the half-tangent line 20b is within the allowable range of the bonding reference position 10. The distance between the half tangent line 20b and the bonding reference position 10 is a correction amount for feeding the belt-shaped member 2 by the distance by the transport unit 14 so that the half tangent line 20b reaches the bonding reference position 10. In the bonding operation described later, the belt-shaped member 2 is fed to the bonding reference position 10 by a feed amount to which the correction amount is added.

That is, as shown in FIG. 8 (a), when the half-tangent line 20 b is shifted to the front of the bonding reference position 10 by the feeding of the belt-shaped member 2, the belt-shaped member 2 is bonded to each other by the offset distance D1. Section 11 side feed. On the other hand, as shown in FIG. 8 (b), when the half-cut line 20 b is shifted beyond the bonding reference position 10 by the feeding of the band-shaped member 2, the band-shaped member 2 is returned to the cutting portion 16 side. The method feeds at an offset distance D2.

In this way, the deviation of the half tangent line 20b from the bonding reference position 10 is detected, and the feeding of the band-shaped member 2 is corrected so as to eliminate the deviation, so that the advance of the tape 21 can be accurately performed. As a result, the The board | substrate provided in the bonding part 11 adheres the tape 21 accurately.

[Fitting action]
FIG. 9 is a flowchart illustrating an example of a bonding operation of the tape 21 to the substrate by the bonding apparatus 1. FIG. 10 is a diagram showing a bonding operation of the bonding device 1.

As a premise, as shown in FIG. 10 (a), the slit 20 (half tangent line 20 b) of the adhesive tape 21 is positioned at the bonding reference position 10 to complete the advance of the adhesive tape 21. That is, the cutter 160 has been checked during the heading operation, and the half-cut line 20 b that becomes the slit 20 is normally formed by the cutting portion 16 so as to be parallel to the width direction of the band-shaped member 2. In addition, the tape 21 does not remain on the downstream side of the slit 20, and the tape 21 is not adhered to a member such as the feed roller 140 that is in contact with the belt-shaped member 2, and it is possible to prevent the belt-shaped member 2 from being transported poorly.

In addition, on the support surface 111 a of the platform member 111, for example, a substrate 300 for a product that is a member constituting a flat display is placed instead of the die plate 112. In addition, the adhesive tape 21 is bonded to the substrate 300 with a desired length. Here, for the sake of convenience, it is assumed that the adhesive tape 21 is bonded in the entire conveying direction of the substrate 300, and the distance between the cutting portion 16 and the bonding reference position 10 is the length of the substrate 300 and the length of the pressure head 111. equal.

As shown in FIG. 10 (b), first, the band-shaped member 2 is cut in half by the cutting section 16 (step S21). Then, as shown in FIG. 10 (c), the belt-like member 2 is fed by the distance between the cutter 160 and the bonding reference position 10 by the conveyance unit 14 (step S22). With the feed, the half-tangent line 20 b formed in step S21 coincides with the bonding reference position 10. Then, the stage member 111 is moved so that the edge portion of the substrate 300 to which the adhesive tape 21 is to be attached is positioned under the band-shaped member 2. Then, the pressure head 110 heated in advance is lowered, the substrate 300 and the band-shaped member 2 are sandwiched and pressed by the pressure head 110 and the platform member 111, and the tape 21 of the band-shaped member 2 is attached to the substrate 300 ( Step S23). Then, the pressure head 110 is raised, and the peeling part 15 is horizontally moved to the bonding part 11 side, so that the release tape 22 is peeled from the adhesive tape 21 bonded to the board | substrate 300 as shown in FIG.10 (d) (step) S24), return the peeling part 15 to the original position.

When the adhesive tape 21 is to be attached to the substrate 300 without the adhesive tape 21 (YES in step S25), the attached substrate on the platform member 111 is replaced with a new substrate without the adhesive tape 21. 300. Return to step S21.

On the other hand, when there is no need to attach the tape 21 to the substrate 300 to which the tape 21 is not attached (NO in step S25), the process ends. In addition, in step S22 of feeding the band-shaped member 2, the feed correction of the band-shaped member 2 similar to that of the above-mentioned steps S06 to S09 can be performed.

[effect]
The bonding device 1 for the adhesive tape 21 according to the embodiment includes a supply unit 12 that supplies a belt-shaped member 2 to which the adhesive tape 21 is bonded on the release tape 22, and a bonding unit 11 that bonds the adhesive tape 21 to the object to be bonded. The release tape 22 is a bonding surface on the opposite side; the conveying section 14 feeds the belt-shaped member 2 from the supply section 12 to the bonding section 11; the lighting section 17 is arranged on the tape 21 side of the belt-shaped member 2 and the optical axis The camera 18 is oriented toward the bonding reference position 10 set for the bonding part 11 and diagonally intersects with a predetermined angle with respect to the perpendicular direction of the bonding surface of the adhesive tape 21 located at the bonding reference position 10; The alignment reference position 10 is axially aligned, and is disposed on the tape 21 side of the band-shaped member 2 to photograph the band-shaped member 2 at the adhesion reference position 10; and the determination unit 196 is based on the The image determines whether the state of the slit 20 of the tape is good or not.
Thereby, the slit 20 of the adhesive tape 21 can be recognized automatically, and therefore, it is possible to automatically advance the tape 21 without manually ejecting the tape 21. That is, when the illuminating section L is provided such that the optical axis is orthogonal to the band-shaped member 2 as in the comparative example, the image of the band-shaped member 2 becomes unclear and it is difficult to detect the slit 20. On the other hand, according to an intensive study by the present inventors, it has been found that the contrast of the image of the band-shaped member 2 becomes obvious by providing the illumination unit 17 diagonally with respect to the perpendicular line of the band-shaped member 2 . According to the present embodiment based on the findings, it is possible to automatically advance the tape 21.

The bonding apparatus 1 for the adhesive tape 21 according to the embodiment includes a cutting section 16 having a cutter 160 provided between the supply section 12 and the bonding section 11, and cutting the adhesive tape 21 of the band-shaped member 2. The half-cut line 20b that becomes the slit 20 is cut, and the conveying section 14 feeds the band-shaped member 2 such that the half-cut line 20b reaches the bonding reference position 10, and the imaging section 18 captures the band-shaped member 2 including the half-cut line 20b. The determination unit 196 detects the half-tangent line 20b based on the image obtained by the imaging unit 18, and determines whether the shape of the cut surface of the half-tangent line 20b is good.

Thereby, the consumption of the cutter 160 can be managed. That is, when it is determined that the half tangent line 20b is defective, it is thought that the blade of the cutter 160 is consumed. At this time, for example, a display device such as a display or a notification component such as a speaker may be connected to the control unit 19, and the operator may be prompted to replace the cutter 160 on the screen or by a sound.

The determination unit 196 determines whether the detected half tangent line 20 b is within the allowable range of the bonding reference position 10.

As a result, the alignment accuracy of the half-tangent pair bonding reference position 10 can be improved.

The bonding apparatus 1 of the adhesive tape 21 according to the embodiment includes a transport control unit 197 that calculates the distance between the half-tangent line 20b and the bonding reference position 10 and determines that the half-tangent line 20b deviates from the allowable range by the determination unit 196. Based on the distance calculated by the conveyance control unit 197, the conveyance unit 14 feeds the band-shaped member 2 such that the half-tangent line 20 b is located at the bonding reference position 10.

As a result, the accuracy of the advance of the adhesive tape 21 can be improved, and the accuracy of the bonding position of the adhesive tape 21 to the substrate to be bonded in the traveling direction of the belt-shaped member 2 can be improved.

The bonding section 11 applies the adhesive tape 21 on the downstream side than the half-cut line 20b to the object to be bonded, specifically, to the blanking plate 112, and the imaging section 18 captures the tape after bonding by the bonding section 11. In the shape member 2, the determination unit 196 determines the presence or absence of the tape 21 in a plurality of areas set along the width direction of the tape 21 before and after the bonding reference position 10, and determines whether the advancement of the tape 21 is good or not based on the determination result.

Thereby, the state where the adhesive tape 21 does not remain before the bonding reference position 10, and the adhesive tape 21 exists after bonding the reference position 10 can be set, and it is possible to perform the advance of the adhesive tape 21 accurately. In addition, it is possible to prevent the conveyance failure of the belt-like member 2 caused by the roll of the adhesive tape 21 remaining on the release tape 22 on a roller such as the conveying section 14 located downstream of the bonding section 11.

The determination unit 196 grayscales the image and detects the cut seam 20. Thereby, not only the presence or absence of the slit 20 can be accurately detected, but also whether the slit 20 is good or not can be accurately detected. For example, when the slit 20 is a half-cut line 20b, the following situations may occur: the tape 21 is not completely cut due to the blade contamination or knife passivation of the cutter 160, and the tape 21 is thicker than the original thickness. The thinner thickness remains locally, and the half tangent line 20b looks like a dotted line. If the image is subjected to binarization processing, it may be erroneously detected that the half tangent line 20b is normally formed. That is, since the thickness of the remaining tape 21 is thin, when the pixel value of the portion of the tape 21 is on the non-tape 21 side with respect to the binarization threshold, it is detected that the half-cut line 20b is good. Even in such a situation, by graying the image, it is possible to detect that the tape 21 on the half-cut line 20b remains without disappearing from the image, so that it can be detected that the half-cut line 20b is defective.

The illuminating unit 17 is provided with the optical axis inclined by 60 ° to 85 ° with respect to the vertical line of the band-shaped member 2. Accordingly, the contrast of the image of the band-shaped member 2 obtained by the imaging unit 18 and the determination unit 196 can be made more obvious, and the slit 20 can be accurately detected.

The illuminating unit 17 emits white light or green light. Accordingly, the contrast of the image of the band-shaped member 2 obtained by the imaging unit 18 and the determination unit 196 can be made more obvious, and the slit 20 can be accurately detected.

Especially when the illumination part 17 and the adhesive tape 21 of white light or green light are anisotropic conductive films, the contrast is more obvious, the detection accuracy of the slit 20 is improved, and as a result, the accuracy can be improved.

[Other embodiments]
The present invention is not limited to the embodiments described above, and includes other embodiments described below. The present invention also includes a combination of all or any of the above-mentioned embodiment and other embodiments described below. Furthermore, various omissions, substitutions, and changes to these embodiments can be made without departing from the scope of the invention, and modifications thereof are also included in the present invention.

In the said embodiment, although the illuminating part 17 is provided in the upstream side of the belt-like member 2 with respect to the bonding reference position 10, you may provide in the downstream side of the belt-like member 2 as shown in FIG. At this time, after the punching of the adhesive tape 21, the cross section of the slit 20 b of the adhesive tape 21 is exposed on the side of the illumination portion 17, so that the cross section is directly illuminated, and the contrast of the image of the band-shaped member 2 becomes obvious. Although it is not limited to the following mechanism, it is thought that the reason is that the light reflected by the metal particles in the end face of the slit 20b or in the tape 21 is reflected by the release tape 22 on the downstream side of the slit 20b and enters. The imaging unit 18 increases the amount of light received in the vicinity of the slit 20b.

In the above-mentioned embodiment, the feeding amount of the belt-like member 2 is corrected by the conveying section 14. However, a moving mechanism for moving the bonding section 11 may be separately provided, and the bonding section 11 may be caused by the moving mechanism By moving, the bonding reference position 10 is aligned with the half tangent line 20b.

In the above embodiment, the bonding reference position 10 is set to a position corresponding to the end portion on the upstream side of the pressure head 110, but may be set to another position, for example, more than the end portion on the upstream side of the pressure head 110. On the upstream side.

In the above-mentioned embodiment, when the new band-shaped member 2 is set on the bonding apparatus 1, the slit 20 which becomes the beginning of the adhesive tape 21 is set to an arbitrary shape formed by an operator, but it may be set in At time, a slit 20 is formed parallel to the width direction of the band-shaped member 2. At this time, the movement of the heading of the adhesive tape 21 only needs to be the above steps S01 to S03.

1‧‧‧ Adhesive device for tape

2‧‧‧ Band-shaped member

10‧‧‧ Fit reference position

11‧‧‧ Laminating Department

12‧‧‧Supply Department

13‧‧‧Recycling Department

14‧‧‧ Transport Department

15‧‧‧ stripping department

16‧‧‧ cutting section

17‧‧‧Lighting Department

18‧‧‧ Camera Department

19‧‧‧ Control Department

20‧‧‧ slitting of tape

20a‧‧‧ the beginning of the tape

20b‧‧‧half tangent

21‧‧‧Tape

22‧‧‧ Release tape

110‧‧‧Pressure head

110a‧‧‧ buffer member

111‧‧‧platform components

111a‧‧‧ support surface

112‧‧‧beating board

120‧‧‧ supply reel

121‧‧‧ tension mechanism

121a‧‧‧fixed roller

121b‧‧‧movable roller

122‧‧‧path roller

130‧‧‧Recycling reels

131‧‧‧path roller

140‧‧‧feed roller

150, 151‧‧‧ stripping stick

160‧‧‧ Cutter

161‧‧‧ support member

161a‧‧‧ flat surface

190‧‧‧Lamination Control Department

191‧‧‧Tension mechanism control department

192‧‧‧ Strip Control

193‧‧‧ Cut-off control unit

194‧‧‧Lighting Control Department

195‧‧‧camera control unit

196‧‧‧Judgment Division

197‧‧‧Transportation Control Department

300‧‧‧ substrate

D1, D2‧‧‧ distance

M‧‧‧ half mirror

L‧‧‧lighting

R1‧‧‧Required range

R11 ～ R16‧‧‧‧Small area

S01 ～ S15, S21 ～ S25‧‧‧step

θ‧‧‧ tilt angle

FIG. 1 is a schematic configuration diagram of a bonding apparatus according to an embodiment.

Fig. 2 is a functional block diagram of a control unit.

FIG. 3 is a flowchart showing an example of a tape-out operation of the sticking device of the embodiment.

(A) of FIG. 4 is a figure which shows the feed of a belt-shaped member. FIG. 4 (b) is a diagram for explaining a leading portion of the tape. FIG. 4 (c) is a diagram showing formation of a half tangent line. FIG. 4D is a diagram for explaining whether the position of the half tangent line is good or not. (E) of FIG. 4 is a figure for demonstrating the punching of an adhesive tape. (F1) of FIG. 4 is a figure which shows the form judged as having a tape further downstream than a bonding reference position, and was judged to be bad. (F2) of FIG. 4 is a diagram showing a form in which it is determined that there is no tape on the upstream side from the bonding reference position, and it is determined to be defective. (G) of FIG. 4 is a figure which shows that it is judged that it is a favorable form without tape on the downstream side rather than a lamination reference position, and it has tape on the upstream side from a lamination reference position.

FIG. 5 (a) is a cross-sectional view illustrating a photographing condition of the belt-shaped member in the bonding device of the comparative example. FIG. 5 (b) is an image of a band-shaped member obtained by the bonding device of the comparative example.

FIG. 6 (a) is a cross-sectional view showing the imaging state of the belt-shaped member in the bonding apparatus according to the embodiment. FIG. 6B is an image of a band-shaped member obtained by the bonding apparatus according to the embodiment.

FIG. 7 shows the detection results of the inclination angle θ of the optical axis of the illuminating unit with respect to the perpendicular line of the belt-like member and the slit at the angle.

FIG. 8 (a) is a schematic diagram showing the feed correction of the belt-shaped member when the half tangent line is shifted to the front of the bonding reference position. FIG. 8 (b) is a schematic diagram showing the feed correction of the belt-shaped member when the half-tangent line is shifted beyond the bonding reference position.

FIG. 9 is a flowchart showing an example of a bonding operation of a tape to a substrate by a bonding apparatus.

10 (a) to 10 (d) are diagrams showing the bonding operation of the bonding device according to the embodiment. FIG. 10 (a) shows a state where the advance of the tape is completed and a substrate is set. Fig. 10 (b) shows the half-cut state. FIG. 10 (c) shows a state where the belt-shaped member is fed. FIG. 10 (d) shows a state where the tape is attached to the substrate and the release tape is peeled.

FIG. 11 is a schematic diagram for explaining an arrangement form of the illumination section of the bonding apparatus according to another embodiment.

Claims (9)

A tape bonding device includes: A supply unit for supplying a belt-shaped member bonded with a tape on a release tape; A laminating part for laminating a laminating surface of the tape to a laminating object, the laminating surface and the release tape being opposite sides; A conveying section for feeding the belt-shaped member from the supply section to the bonding section; The illuminating portion is disposed on the tape side of the belt-shaped member, and the optical axis of the illuminating portion faces the bonding reference position set for the bonding portion, and is opposite to the tape positioned at the bonding reference position. The perpendicular direction of the bonding surface is set diagonally at a preset angle; An imaging unit that aligns the optical axis of the imaging unit with the bonding reference position, is disposed on the tape side of the belt-shaped member, and photographs the belt-shaped member at the bonding reference position; and The determination unit determines whether the state of the slit of the tape is good or not based on the image of the belt-shaped member obtained by the imaging unit. The application device for the adhesive tape according to item 1 of the patent application scope includes: The cutting portion includes a cutter provided between the supply portion and the bonding portion, and cuts the tape of the belt-shaped member to form a half-cut line that forms the slit, and The conveying section feeds the belt-shaped member such that the half-tangent line reaches the bonding reference position, The imaging unit photographs the band-shaped member including the half tangent line, The determination unit detects the half-tangent line based on the image obtained by the imaging unit, and determines whether the shape of the cut surface of the half-tangent line is good or not. The application device of the adhesive tape according to item 2 of the patent application scope, wherein The determination unit determines whether the detected half-tangent line is within an allowable range including the bonding reference position. The device for applying the adhesive tape according to item 3 of the patent application scope includes: The transport control unit calculates a distance between the half tangent line and the bonding reference position, and When it is determined by the judging unit that the half-tangent line deviates from the allowable range, the conveyance unit makes the half-tangent line be located at the bonding reference position based on the distance calculated by the conveyance control unit. The belt-shaped member is fed in a manner. The application device of the adhesive tape according to any one of the scope of claims 1 to 4, The bonding portion applies the tape on the downstream side than the half tangent line to the object to be bonded, The imaging unit photographs the band-shaped member bonded by the bonding unit, The determination unit determines the presence or absence of the tape in a plurality of areas set along the width direction of the tape before and after the bonding reference position, and determines the presence of the tape based on the determination result of the determination unit Be good or not. The application device of the adhesive tape according to any one of the scope of claims 1 to 5, wherein The determination section grayscales the image and detects the cut seam. The device for applying the adhesive tape according to any one of the scope of claims 1 to 6, wherein The illuminating unit is provided such that the optical axis is inclined by 60 ° to 85 ° with respect to a perpendicular direction of the bonding surface of the tape at the bonding reference position. The device for bonding the adhesive tape according to any one of the scope of claims 1 to 7, wherein The illuminating section radiates white light or green light. The application device of the adhesive tape according to any one of the scope of claims 1 to 8, in which The adhesive tape is an anisotropic conductive film.