KR100292057B1 - Apparatus for pressing anisotropic conductive film and cutting device for anisotropic conductive film - Google Patents

Abstract

The present invention provides a pressure bonding device for anisotropic conductive films to TMA and a cutting device for anisotropic conductive films.

The pressure bonding device is for pressing the anisotropic conductive film 4 having a predetermined length onto the pad portion 1 'of the TMA 1, and the protective film 5 and the peeling film 5 are protected above and below the anisotropic conductive film 4. Peeling only the protective cover film 3 from the supplying reel 20 for mounting and supplying the anisotropic conductive film tape 2 in which the cover film 3 is superimposed in roll form, and the anisotropic conductive film tape 2 supplied, Scrap film winding reel for winding the protective cover film winding reel 21 for winding up and the peeling film 5 which is the scrap after the anisotropic conductive film 4 is crimped | bonded by the crimping head 22 via a guide roller. In the pressure-adhering apparatus for anisotropic conductive film comprising (23), the protective cover film (3) is peeled off and conveyed by a predetermined length. Cutting only the anisotropic conductive film 4 of the predetermined length pressed by cutting in position The cutting device 30 for cutting, the planar crimping head 22 for pressing the cut anisotropic conductive film 4 to the pad portion 1 'of the TMA 1, and the TMA 1 on the top. Only the anisotropic conductive film 4 of a predetermined length is provided by having an XYΘ unit 25 for positioning the pad portion 1 'of the TMA 1 at a position that is loaded and compressed by the crimping head 22. The pad portion 1 'of (1) is pressed.

Description

Pressing device for anisotropic conductive film and cutting device for anisotropic conductive film

The present invention relates to a pressure-adhering device for anisotropic conductive film and a cutting device for anisotropic conductive film, and more particularly, to anisotropic from anisotropic conductive film tape to connect a pad portion of a tape carrier package (TCP) to a pad portion of a TMA. The present invention relates to a compression bonding device for anisotropic conductive films for pressing only the conductive film onto a TMA and a cutting device for the anisotropic conductive film.

An example of a tape carrier package is shown in FIG. 1, and in FIG. 2, a plurality of tape carrier packages are manufactured to be arranged in a line, and a protective cover part TCP film to which a protective cover is attached is shown as a top view.

The TCP 10 is used as a thin film micro-mirror array actuated (TMA) 1 or a driving IC chip of an LCD, and the IC chip 11 is attached to the film 12 at the center in FIG. A pad portion 14 for electrical connection is formed from the IC chip 11 to an external device, and is mounted on another device via an anisotropic conductive film by tape automated bonding (TAB) at an end thereof. A pad portion 14 having a plurality of exposed lead portions 14 'is formed. The TCP 10 configured as described above is pressed and adhered to the TMA 1 at its pads 1 ′ and 14 via the anisotropic conductive film 4 of the anisotropic conductive film tape 2 shown in FIG. 2. Allow electrical conduction between each lead.

The structure of the anisotropic conductive film tape 2 is shown in FIG.

In FIG. 2, the anisotropic conductive film tape 2 has a transparent protective cover film 3 and a white release film 5 formed above and below the anisotropic conductive film 4. The protective cover film 3 and the peeling film 5 are removed from the anisotropic conductive film tape 2 configured as described above, and only the anisotropic conductive film 4 is cut by a hand gripper to a predetermined length so that the pad portion of the TMA 1 ( 1 '), and then, the pad portion 14 of the TCP 10 is pressed to be mounted.

However, as described above, the protective cover film 3 and the peeling film 5 are removed from the anisotropic conductive film tape 2, and only the anisotropic conductive film 4 is cut by a hand gripper to a certain length so that the TMA 1 can be cut. The process of compressing the pad portion 1 'has a problem that it is cumbersome and the productivity is lowered. Also, automating with the existing tape feeder and cutting device peels and cuts the protective cover film 3 and the peeling film 5. After the anisotropic conductive film 4 is cut by the device, a device for transferring the cut anisotropic conductive film 4 is required separately. In order to eliminate the transfer device, the extra anisotropic conductive film 4 is again removed after pressing. There is a problem in that it needs to be cut off.

Accordingly, the present invention is to solve this problem, by removing the protective cover film from the anisotropic conductive film tape and cutting only the anisotropic conductive film to compress the cut anisotropic conductive film to the pad portion of the TMA, the scrap release film An object of the present invention is to provide a pressing device for anisotropic conductive films that can be wound and removed, and a cutting device of the anisotropic conductive film only.

1 is a plan view illustrating a state in which a tape carrier package is mounted on a TMA using an anisotropic conductive film;

2 is a cross-sectional view showing the structure of an anisotropic conductive film tape for mounting a tape carrier package on a TMA,

FIG. 3 is a schematic process diagram illustrating a process for pressing the pad portions of each TMA from the roll of the anisotropic conductive film tape of FIG. 2 according to one embodiment of the present invention; FIG.

Figure 4 is a schematic diagram showing the configuration of a cutting device of the anisotropic conductive film according to another embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

F: TCP film tape C: Protective cover

FC: Protective cover TCP film tape

1: TMA (thin film micro-mirror array actuated)

1 ', 14: pad portion 2: anisotropic conductive film tape

3: protective cover film 4: anisotropic conductive film

5: release film 10: TCP (tape carrier package)

11: IC chip 12: film

13: pattern portion 14 ': lead portion

20: Supply reel 21: Protective cover film reel

22: crimping head 23: scrap film winding reel

25: XYΘ unit 30: cutting device

31: blade 32: fixed block

33: Reciprocating plate 34: Fixed plate

35: Stroke adjusting rod 35 ': Fixing means

36: stopper

In order to achieve the above object, the pressure-adhering apparatus for anisotropic conductive film according to an embodiment of the present invention, the peeling film and the protective cover up and down of the anisotropic conductive film in order to press the anisotropic conductive film of a predetermined length to the pad portion of the TMA. The film is laminated with anisotropic conductive film tape in the form of a roll to interpose and feed the supply reel, and through the guide roller from the anisotropic conductive film tape supplied from the supply reel through only the protective cover film for winding A pressure-sensitive device for anisotropic conductive film comprising: a protective cover film winding reel; and a scrap film winding reel for winding a release film, which is a scrap after the anisotropic conductive film is pressed by the pressing head, through a guide roller: Carver film is peeled off and conveyed by a predetermined length. A cutting device for cutting only the anisotropic conductive film of a predetermined length pressed by cutting at a predetermined position, a flat pressing head for pressing the anisotropic conductive film cut by the cutting device to the pad portion of the TMA, and the TMA It is characterized in that the anisotropic conductive film of a predetermined length is pressed to the pad portion of the TMA by having a XYΘ unit for positioning the pad portion of the TMA in the position that is pressed by the pressing head by loading the upper portion.

In addition, the device for cutting an anisotropic conductive film according to another embodiment of the present invention, the anisotropic conductive film tape overlapping the peeling film and the protective cover film to the top and bottom of the anisotropic conductive film to remove the peeling film tape to peel the protective cover film A fixed plate in contact with the release film side of the release film tape, the reciprocating plate reciprocating under the anisotropic conduction film side of the release film tape, and the reciprocation thereof in order to further convey and press only the anisotropic conductive film to the pad portion of the TMA. In the cutting device of the anisotropic conductive film comprising a blade which is fixed on the plate via a fixed block and is provided to cut only the anisotropic conductive film of the peeling film tape when advancing the reciprocating plate to enable the pressing of the release film. The peeling peel is limited by limiting an upper limit of the reciprocation movement of the reciprocating plate. It comprises a stroke adjusting rod which is fixed to the reciprocating plate by the fixing means so that only the anisotropic conductive film of the tape is cut, and a stopper which contacts the stroke adjusting rod to limit the upper limit when the reciprocating plate moves forward. As a result, only the anisotropic conductive film can be cut precisely.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is a schematic process diagram illustrating a process for compressing the pad portion of each TMA from the roll of the anisotropic conductive film tape of FIG. 2 according to one embodiment of the present invention.

The press-fitting apparatus of the anisotropic conductive film includes a supply reel 20, a protective cover film reel 21, a cutting device 30, a pressing head 22, an XYΘ unit 25 and a scrap film winding reel 23. It is configured to include a plurality of guide rollers in the middle is interposed, the supply reel 20, protective cover film winding reel 21 and scrap film winding reel 23 may be driven by an induction motor, After peeling of the protective cover film 3 from the guide rollers of the guide roller for transporting the peeling film tape 4 'to the cutting device 30 and the pressing head 22, the guide roller is driven by a pulse motor to remove the film at precise intervals. The tape 4 'is configured to be conveyed.

Anisotropic conductive film tape 2 shown in Figure 2 is mounted to the feed reel 20 in the form of a roll

It is supplied via the guide roller. As described above, the anisotropic conductive film tape 2 supplied from the supply reel 20 is peeled and wound around the protective cover film winding reel 21 through the guide roller, and the anisotropic conductive film tape ( 2) is configured such that the protective cover film 3 is peeled off so that only the peeling conductive film 4 'made of the peeling film 5 and the anisotropic conductive film 4 is transferred to the cutting device 30.

The cutting device 30 cuts only the anisotropic conductive film 4 from the peeling film tape 4 'from which the protective cover film 3 has been peeled off, and then, after the pressing, the anisotropic conductive film 4 is compressed. It is maintained, and the peeling conductive film 4 'can be transferred for the next compression.

Therefore, the cutting device 30 is preferably capable of adjusting the cutting speed to cut only the anisotropic conductive film 4 without cutting the release film 5, as shown in Figure 4 blade 31 and the fixed plate It is desirable to be able to adjust the gap between (34) (described later).

After only the anisotropic conductive film 4 is cut in the cutting device 30, the XYΘ unit 25 loads the TMA 1 on the top of the TMA 1 to compress the anisotropic conductive film 4. The pad portion 1 'is configured to be movable in the Θ direction (rotation direction) and the X direction (radial direction) so as to be positioned under the cut anisotropic conductive film 4, and the upper surface of the peeling conductive film 4'. The XYΘ unit 25 is configured to reciprocate in the Y direction so as to press the TMA 1 toward the crimping head 22 provided to be in contact with the contact surface.

In this case, the XYΘ unit 25 is configured to adjust the pressing speed and the pressing force toward the pressing head 22 side so that the pressing is easy and effective, and the front, rear, left, and right sides are adjustable so that the parallelism can be adjusted. It is preferable.

The XYΘ unit 25 for positioning the pad portion 1 'of the TMA 1 at the position pressed by the crimping head 22 is preferably configured for remote control and has an offset input function.

After the anisotropic conductive film 4 is cut and compressed in this manner, only the peeling film 5 remains as scrap, and the scrap film winding reel 23 guides the peeling film 5 through a guide or feed roller. It is comprised so that it may be wound up, and it is comprised so that removal and removal of the peeling film 5 of the rolled form rolled up are possible.

The press-bonding apparatus of the anisotropic conductive film configured as described above is a control unit not shown, in which each induction motor and pulse motor, the XYΘ unit 25 and the crimping head 22 are controlled in the operation sequence described below as an example. It is configured to include.

That is, when the anisotropic conductive film tape 2 is mounted on the feed reel 20 in a roll form and is set along each transfer line (the part for initial setting is anisotropic conductive film tape 2 without the anisotropic conductive film 4). The induction motor for the supply reel 20, the protective cover film reel 21 and the scrap film reel 23, and the pulse motor for the precise transfer of the peeling conductive film 4 'by the controller. After the peeling conductive film 4 'is controlled to be transferred by a predetermined length,

The cutting device 30 operates to cut only the anisotropic conductive film 4 from the peeling conductive film 4 'to a predetermined length, and then the pad portion 1 of the TMA 1 by the XYΘ unit 25. ') Is moved below the crimping head 22, the anisotropic conductive film 4 cut by raising and pressing the pad portion (1') of the TMA (1) by the XYΘ unit 25 to the crimping head 22 The pad portion 1 'is pressed. Thereafter, when the XYΘ unit 25 descends, the induction motor and the pulse motor are driven again to transfer the peeling conductive film 4 'by a predetermined length. At this time, the XYΘ unit 25 is transferred in the XΘ direction for the other pad portion 1 'of the TMA 1 or the pad portion 1' of the other TMA 1, and the transferred peeling conductive film 4 When the anisotropic conductive film 4 is cut at '), the other pad portion 1' is positioned under the crimping head 22 by the XYΘ unit 25, and the above steps are repeated.

In the above-mentioned pressure-adhering apparatus of the anisotropic conductive film, the TMA 1 is loaded or transferred to the XYΘ unit 25 so that the anisotropic conductive film 4 is pressed onto the required number of pad portions 1 ', and then unloaded. It is preferable that the control unit be configured together with the transporting-loading and unloading device of the TMA so that the TMA 1 is discharged and the next TMA 1 is unloaded or transported.

On the other hand, the protective cover film (3) of the anisotropic conductive film tape (2) supplied from the supply reel (20) is peeled off and is intermittently wound on the protective cover film reel (21), the scrap release film (5) Silver is wound by the scrap film winding reel 23, and the supply reel 20, the protective cover film winding reel 21, and the scrap film winding reel 23 replenish the roll of the anisotropic conductive film tape 2. It is preferable to provide a sensor so as to know the time point or the time of removal of the protective cover film 3 or the scrap film.

Figure 4 is shown as a schematic configuration of a cutting device of the anisotropic conductive film suitable for use in the pressure bonding device of the anisotropic conductive film according to another embodiment of the present invention.

The cutting device 30 is configured to cut only the anisotropic conductive film 4 from the release film tape 4 'having the release film 5 attached to the upper surface of the anisotropic conductive film 4.

The cutting device 30 of the present invention is configured to cut only the anisotropic conductive film 4 without cutting the peeling film 5 among the thin flexible anisotropic conductive film 4 and the peeling film 5. Roughly, even if the anisotropic conductive film 4 is cut in half, the anisotropic conductive film 4 is completely broken when the anisotropic conductive film 4 is compressed or when the release film 5 is transported.

As described above, the cutting device 30 for cutting only the anisotropic conductive film 4 in the peeling conductive film 4 'is fixed to contact with the peeling film 5 side of the peeling film tape 4' in FIG. And a reciprocating plate 33 reciprocating below the side of the anisotropic conductive film 4 of the release film tape 4 ', the fixed block 32 on the reciprocating plate 33. The blade 31 is fixed through it. When the reciprocating plate 33 is advanced, the anisotropic conductive film 4 of the release film tape 4 'is cut so that the compression of the anisotropic conductive film 4 and the transfer of the release film 5 are possible. The clearance between the lower surface of the fixed plate 34 and the upper end of the blade 31, which form the opposite die of the blade 31 when advancing, must be precisely maintained.

To this end, the reciprocating plate 33 is configured to ascend to a position that is smaller than the gap, the stroke distance adjustment rod 35 is adjustable to adjust the amount of advance by the reciprocating plate 33 to be adjustable. The stopper 36 is fixed to the reciprocating plate 33 by the fixing means 35 ′, and the stopper 36 is in contact with the stroke length adjusting rod 35 when it is moved forward.

As an example of the gap, when the release film 5 of the release film tape 4 ′ is 53 ± 5 μm, the upper surface of the blade 31 and the lower surface of the upper plate 34 when the reciprocating plate 33 is advanced. It is preferable that the clearance gap is 0.04 ± 0.01 mm.

In this manner, the advance (rising) limit of the reciprocating plate 33 and the blade 31 can be adjusted by the adjustment of the stroke distance adjusting rod 35 so that the blades can be cut to a gap where only the anisotropic conductive film 4 can be cut. 31) can be raised.

According to the configuration and function of the pressure-adhering device of the anisotropic conductive film to the TMA and the cutting device of the anisotropic conductive film according to the embodiments of the present invention described above, the roll on the pad portion 1 'of the TMA (1) continuously By supplying the anisotropic conductive film tape 2 of the form can be compressed only the anisotropic conductive film 4 can improve the productivity and precision, and the lower surface and the blade of the fixed plate 34 that is the die of the cutting device 30 ( By adjusting the gap between the upper ends of 31), it is possible to easily cut only the anisotropic conductive film 4 from the peeling conductive film 4 '.

Claims (3)

In order to compress the anisotropic conductive film 4 having a predetermined length to the pad portion 1 ′ of the TMA 1, the release film 5 and the protective cover film 3 overlap the upper and lower portions of the anisotropic conductive film 4. The anisotropic conductive film tape 2 is mounted in a roll form to protect the feed reel 20 through the guide roller and the anisotropic conductive film tape 2 supplied from the feed reel 20 via the guide roller. The protective cover film winding reel 21 for peeling and winding only the cover film 3 and the peeling film 5 which is a scrap after the anisotropic conductive film 4 is crimped | bonded by the crimping head 22 through a guide roller. In the pressure bonding device of the anisotropic conductive film comprising a scrap film winding reel (23) for winding up by: The predetermined anisotropic conductive film press-bonded by cutting the protective cover film 3 at a predetermined position adjacent to the pressing head 22 from the peeling film tape 4 'which is peeled and transferred by a predetermined length ( 4) a cutting device 30 for cutting only, and a flat pressing head 22 for pressing the anisotropic conductive film 4 cut by the cutting device 30 to the pad portion 1 'of the TMA 1. ) And an XYΘ unit 25 for positioning the pad portion 1 'of the TMA 1 at a position where the TMA 1 is loaded on the top and pressed by the crimping head 22. Pressing device of the anisotropic conductive film, characterized in that the length of the anisotropic conductive film (4) is pressed to the pad portion (1 ') of the TMA (1). A peeling film tape (4 ') in which the anisotropic conductive film tape (2) in which the peeling film (5) and the protective cover film (3) are overlapped is transferred to the top and bottom of the anisotropic conductive film (4), and the protective cover film (3) is peeled off. A fixed plate 34 in contact with the peeling film 5 side of the peeling film tape 4 'in order to further transport the film to compress the anisotropic conductive film 4 only to the pad portion 1' of the TMA 1; A reciprocating plate 33 reciprocating below the anisotropic conductive film 4 side of the release film tape 4 ', and fixed on the reciprocating plate 33 via a fixing block 32, and a reciprocating plate ( 33, the anisotropic conductive film 4 including a blade 31 which is installed to cut only the anisotropic conductive film 4 of the release film tape 4 'to enable the pressing of the release film 5 when advancing. In the cutting device of only): The upper limit of the reciprocating movement of the reciprocating plate 33 is fixed to the reciprocating plate 33 by the fixing means 35 'so that only the anisotropic conductive film 4 of the release film tape 4' is cut. Stroke adjustment rod 35 is formed, and the stopper 36 in contact with the stroke distance adjusting rod 35 so as to limit the upper limit when the reciprocating plate 33 is moved forward, so that the anisotropic conductive film 4 precisely Cutting device of the anisotropic conductive film, characterized in that can be cut only). According to claim 2, wherein when the release film 5 of the release film tape (4 ') is 53 ± 5㎛, when the reciprocating plate 33 advances the upper end of the blade 31 and the upper plate 34 Cutting device for anisotropic conductive film, characterized in that the gap between the lower surface and 0.04 ± 0.01 mm