JP4032481B2 - Crimping method and crimping apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a pressure-bonding method and a pressure-bonding apparatus for pressure-bonding an object to be bonded such as an IC to a substrate such as a PCB (Printed Circuit Board) or an FPC (Flexible Printed Circuit).
[0002]
[Prior art]
Conventionally, it is widely known to use a bonding agent such as ACF (Anisotropic Conductive Film) or the like when an IC or the like is fixed to a substrate such as PCB or FPC, that is, mounted. Specifically, an ACF is attached to a predetermined mounting position on the substrate, an IC or the like is temporarily bonded thereon, and the IC or the like is fixed to the substrate by pressing the IC or the like onto the substrate using a crimping head. .
[0003]
Conventionally, for example, methods disclosed in Japanese Patent Laid-Open Nos. 5-281564 and 7-230873 are known as pressure bonding methods using a bonding agent such as ACF. More specifically, in these conventional documents, a substrate constituting a liquid crystal device is placed on a cradle, an ACF is further placed on the substrate, and a TCP as an object to be bonded is placed on the ACF. A method is disclosed in which TCP is fixed to a substrate by ACF by pressing TCP with a pressure bonding head.
[0004]
Each of the above documents also discloses a technique of interposing a Teflon sheet, that is, an adhesion preventing tape, between the substrate and the pressure-bonding head when the TCP is pressure-bonded to the substrate. When the liquid crystal substrate and the TCP are pressed against each other using the pressure bonding head with the ACF interposed therebetween, the pressed ACF may protrude outside the TCP, and the protruding ACF may adhere to the surface of the pressure bonding head. The Teflon sheet is used mainly for preventing the protruding ACF from adhering to the surface of the pressure-bonding head even when the ACF protrudes in such a manner.
[0005]
[Problems to be solved by the invention]
However, in the above conventional crimping method, the Teflon sheet is arranged only on the crimping head side, and no Teflon sheet is provided on the cradle side. The reason for this is that when a translucent substrate of a liquid crystal device is considered as a substrate, in many cases, the translucent substrate is not formed with a through hole such as a through hole. This is probably because there is no need to provide a Teflon sheet on the side.
[0006]
However, when considering PCB, FPC, etc. as substrates, they usually have through holes for electrically connecting the wiring patterns provided on the front and back sides, and when an IC or the like is bonded to these using ACF. When the substrate and the IC or the like are pressed against each other with the ACF interposed therebetween, the ACF pressed by the IC or the like protrudes through the through hole to the back side of the substrate, that is, the cradle side. As a result, the protruding ACF The problem of adhering to the cradle that supports the plate has come to arise.
[0007]
Even when a through-hole is not used, if a sufficiently large area for mounting an IC or the like cannot be secured on the substrate because the shape of the substrate such as a PCB is small, the ACF is also formed on the back side of the substrate. There has been a problem of protruding and sticking to the cradle.
[0008]
The present invention has been made in view of the above-described problems. When a material to be bonded such as an IC is pressure-bonded to a substrate such as a PCB or FPC using a bonding agent such as ACF, a pressure-bonding head and a cradle are provided. The object is to reliably prevent the bonding agent from adhering to the crimping tool such as.
[0009]
[Means for Solving the Problems]
(1) In order to achieve the above object, the crimping method according to the present invention supports a substrate in a state in which an object to be bonded is temporarily mounted by a bonding agent, by a cradle, and is disposed to face the cradle. In the pressure-bonding method in which the object to be bonded is fixed to the substrate by the bonding agent by pressing the object to be bonded with the pressure-bonding head, a first adhesion prevention tape is provided between the pressure-bonding head and the object to be bonded. Supplying a second adhesion preventing tape between the cradle and the substrate; and the second adhesion preventing tape is With the substrate mounted, By moving integrally with the substrate, the material to be bonded and the substrate are continuously discharged from the cradle.
According to this pressure bonding method, when the object to be bonded is pressed by the pressure bonding head while the substrate is supported by the cradle, the bonding agent interposed between the substrate and the object to be bonded may protrude outward. Thus, even when the bonding agent protrudes, it is possible to prevent the bonding agent from adhering to the surface of the pressure-bonding head by providing the first adhesion preventing tape on the pressure-bonding head side. Further, by providing the second adhesion preventing tape on the cradle side, the bonding agent can be prevented from adhering to the surface of the cradle. That is, according to the present invention, it is possible to reliably prevent the bonding agent from adhering to both the crimping head and the cradle by the action of the pair of adhesion preventing tapes provided on both the front and back sides of the substrate.
[0010]
In particular, even if a through hole such as a through hole is formed at an appropriate position on the substrate by providing an adhesion preventing tape on the cradle side, the bonding agent that protrudes to the back side of the substrate through the through hole is not contained in the cradle. It can prevent adhering to the surface.
[0011]
In the present invention, since the second adhesion preventing tape provided on the cradle side is moved together with the substrate, there is no problem even when a plurality of substrates are continuously fed to the cradle. The adhesion preventing tape can be disposed between the cradle and the substrate.
[0012]
In the crimping method having the above-described configuration, for example, ACF can be considered as the “bonding agent”. Further, as the “bonded object”, for example, various parts such as IC, TCP (Tape Carrier Package), FPC (Flexible Printed Circuit) and the like that need to be bonded to the substrate can be considered. As the “substrate”, for example, PCB, FPC, a pair of translucent substrates constituting a liquid crystal device, for example, a glass substrate, a plastic substrate, and the like are conceivable.
[0013]
(2) In the crimping method having the above-described configuration, the first adhesion preventing tape disposed on the crimping head side and the second adhesion preventing tape disposed on the cradle side can be supplied separately from each other.
[0014]
(3) In that case, the substrate on which the object to be bonded is temporarily bonded can be supplied and removed from the receiving base and the pressure bonding head by using a dedicated conveying device, or such dedicated conveying. It can also convey by the 2nd adhesion prevention tape supplied to the receiving stand side, without using an apparatus. If the substrate is transported using the second adhesion preventing tape, the crimping device can be manufactured with a simple structure at a low cost.
[0015]
(4) In the pressure-bonding method described in (1) above, the first adhesion preventing tape and the second adhesion preventing tape are bonded to each other on both the front and rear sides of the substrate, whereby the substrate can be sandwiched between the pair of tapes. And by moving those tapes, a board | substrate with a to-be-bonded object can be supplied and removed with respect to a receiving stand. According to this configuration, the substrate with the object to be bonded can be continuously discharged to the cradle or the like by continuously conveying the pair of adhesion preventing tapes to the cradle and the crimping head. it can.
[0016]
(5) In each of the crimping methods described in (1) to (4) above, at least one of the first adhesion preventing tape and the second adhesion preventing tape or both of them can be constituted by a tape mainly composed of a fluororesin. . The properties required for the anti-adhesion tape used in the present invention are as follows: (1) it is difficult for an adhesive such as ACF to adhere to the tape, and (2) it is hard enough not to be deformed excessively when pressed by the crimping head. It is conceivable to have a thickness. The hardness characteristic (2) is a characteristic required to prevent the positional displacement of the object to be bonded.
[0017]
The anti-adhesion tape used in the present invention desirably satisfies the above characteristics, and at present, it is desirable to use a material mainly composed of a fluororesin, for example, a material mainly composed of Teflon (trade name). Instead of the fluororesin, an adhesion preventing tape can be constituted by using polyimide as a main component. However, although the polyimide tape has an advantage that it is difficult to be deformed as compared with the Teflon tape, it has drawbacks such as easy adhesion of the adhesive and high cost.
[0018]
When a tape mainly composed of a fluororesin such as Teflon is used as the adhesion preventing tape, the thickness of the tape is preferably about 30 μm to 50 μm. If the thickness of the Teflon tape is formed so thin, the deformation of the fluororesin tape when pressed by the pressure-bonding head can be suppressed to an extent that there is no practical problem.
[0019]
(6) Next, the pressure bonding apparatus according to the present invention includes a pressure bonding head disposed on one side of a conveyance path for conveying a substrate in a state in which an object to be bonded is temporarily mounted by a bonding agent, and the pressure bonding thereof. A pedestal disposed on the other side of the transport path facing the head, and pressing the object to be bonded by the pressure-bonding head in a state where the substrate is supported by the pedestal, A pressure bonding apparatus for fixing the object to be bonded to the substrate with an adhesive. And this crimping | compression-bonding apparatus has the 1st adhesion prevention tape supplied between the said crimping | compression-bonding head and the said to-be-bonded object, and the 2nd adhesion prevention tape supplied between the said base and the said board | substrate. Furthermore, the second adhesion preventing tape is With the substrate mounted, By moving integrally with the substrate, the material to be bonded and the substrate are continuously discharged from the cradle.
[0020]
According to this crimping apparatus, since a pair of adhesion preventing tapes are supplied to both the front and back sides of the substrate with the object to be bonded, when the substrate and the object to be bonded are pressed using the pressure bonding head and the cradle, It is possible to reliably prevent the bonding agent protruding outside from adhering to both the pressure-bonding head and the cradle.
[0021]
In particular, since the anti-adhesive tape is also supplied to the cradle side, even when a through hole such as a through hole is formed at an appropriate position on the substrate, the bonding agent that protrudes to the back side of the substrate through the through hole is not contained in the cradle. It can prevent adhering to the surface.
[0022]
(7) In the crimping method having the above-described configuration, the first adhesion prevention tape supplied to the crimping head side and the second adhesion prevention tape supplied to the cradle side can be separately supplied.
[0023]
(8) In that case, the substrate on which the object to be bonded is temporarily bonded can be supplied and removed from the receiving base and the pressure bonding head by using a dedicated conveying device, or such dedicated conveying. It can also convey by the 2nd adhesion prevention tape supplied to the receiving stand side, without using an apparatus. In this way, the crimping device can be manufactured at a low cost with a simple structure.
[0024]
(9) In the crimping apparatus according to (6), the substrate can be sandwiched between the pair of tapes by bonding the first adhesion preventing tape and the second adhesion preventing tape to each other on the front and rear sides of the substrate. And by moving those tapes, a board | substrate with a to-be-bonded object can be supplied and removed with respect to a receiving stand. According to this configuration, the substrate with the object to be bonded can be continuously discharged to the cradle or the like by continuously conveying the pair of adhesion preventing tapes to the cradle and the crimping head. it can.
[0025]
(10) In the crimping apparatus described in (6) to (9) above, one or both of the first adhesion preventing tape and the second adhesion preventing tape can be constituted by a tape mainly composed of a fluororesin.
[0026]
DETAILED DESCRIPTION OF THE INVENTION
(First embodiment)
FIG. 1 shows an embodiment of a crimping apparatus according to the present invention. The main purpose of the crimping apparatus 1 shown here is to crimp an IC 6 as an object to be bonded to a predetermined position of a PCB (Printed Circuit Board) 2 as a substrate, that is, press and fix it. The PCB 2 is a PCB having a very general structure. For example, as shown in FIG. 2, wiring patterns 12a and 12b are formed on both front and back surfaces, and a through hole 13 is formed at a predetermined position. The wiring patterns 12a and 12b are electrically connected to each other through the through holes 13. In the present embodiment, it is assumed that a through hole 13 is formed in an internal region of an IC mounting region S described later. The wiring patterns 12a and 12b are actually formed in a complicated pattern, but are omitted from the drawing.
[0027]
In FIG. 1, a crimping apparatus 1 includes a crimping head 3 disposed on one side (upper side in the drawing) of a transport path A for transporting a PCB 2, and the other of the transport paths A facing the crimping head 3. And a cradle 4 disposed on the side (the lower side of the figure). The pressure bonding head 3 is heated to a predetermined temperature as necessary.
[0028]
The cradle 4 is arranged in a fixed position, and the crimping head 3 moves forward and backward as indicated by an arrow B with respect to the cradle 4. When the crimping head 3 moves toward the cradle 4 while the PCB 2 is placed on the cradle 4, the IC 6 is pressed by the crimping surface 3 a of the crimping head 3.
[0029]
Between the pressure bonding head 3 and the PCB 2, a first Teflon tape 7 is disposed as a first adhesion preventing tape that is stretched around the reels 9a and 9b. The first Teflon tape 7 is taken up by the take-up reel 9b, thereby moving at the same speed in the same direction as the PCB 2 transport direction.
[0030]
Further, a second Teflon tape 8 as a second adhesion preventing tape that is stretched around the reels 11a and 11b is disposed between the cradle 4 and the PCB 2. The second Teflon tape 8 is taken up by the take-up reel 11b, and moves at the same speed in the same direction as the PCB 2 transport direction.
[0031]
The operation of transporting the PCB 2 along the transport path A may be realized by using a dedicated transport device, or may be performed by the second Teflon tape 8 itself that is wound and moved by the take-up reel 11b. May be.
[0032]
When performing an IC crimping operation using the crimping apparatus 1 shown in FIG. 1, first, an ACF (Anisotropic Conductive Film) 27 is attached to the IC mounting region S in FIG. IC6 is placed at a predetermined position on the substrate and temporarily bonded. The ACF 27 is generally formed by dispersing conductive particles in an adhesive.
[0033]
Thereafter, as shown in FIG. 3, a plurality of PCBs 2 are mounted by a dedicated conveying device or by the second Teflon tape 8 itself with the portion where the IC 6 of the PCB 2 is temporarily bonded on the second Teflon tape 8. Are transported along the transport path A at substantially equal intervals.
[0034]
The PCB 2 thus transported reaches the top of the cradle 4 in FIG. 1, and stops on the cradle 4 with the second Teflon tape 8 sandwiched therebetween. Thereafter, the crimping head 3 moves in the direction of the cradle 4, and as a result, the IC 6 is pressed against the PCB 2 with the crimping surface 3 a of the crimping head 3 sandwiching the first Teflon tape 7 therebetween.
[0035]
By this pressing operation, the ACF 27 is spread and spreads evenly between the PCB 2 and the IC 6, and as a result, the bumps 28 (see FIG. 2) of the IC 6 and the terminal portions of the wiring pattern 12 a on the PCB 2 are electrically conductive particles in the ACF 27. Conduct through. During this pressing operation, the pressed ACF 27 may protrude to the outside of the IC 6 and may further protrude to the back side of the PCB 2 through the through hole 13. If no countermeasure is taken, the protruding ACF 27 may adhere to the surface of the pressure-bonding head 3, particularly the surface of the pressure-bonding surface 3 a and the cradle 4. When such adhesion of the ACF 27 occurs, the subsequent crimping operation using the crimping head 3 and the cradle 4 cannot be performed normally.
[0036]
However, in the present embodiment, since the first Teflon tape 7 is disposed between the crimping head 3 and the PCB 2, it is possible to reliably prevent the protruding ACF 27 from adhering to the surface of the crimping head 3 by the second Teflon tape 7. . Furthermore, since the second Teflon tape 8 is disposed between the cradle 4 and the PCB 2, it is possible to reliably prevent the ACF 27 protruding from the through hole 13 (see FIG. 2) from adhering to the surface of the cradle 4.
[0037]
Further, since the first Teflon tape 7 and the second Teflon tape 8 are conveyed in the same direction at the same speed as the PCB 2, the individual Teflon tape 7 is always supplied when the individual PCBs 2 are sequentially fed to the cradle 4. , 8 are fed out in front of the crimping head 3 and in front of the cradle 4, and as a result, the PCB 2 can be reliably prevented from being soiled by the ACF 27.
[0038]
When the above crimping operation is completed, the PCB 2 is transported to the right side of FIG. 1 by a dedicated transport device or by the second Teflon tape 8 itself, and thereby the PCB 2 is removed from the cradle 4 and the crimping head 3. The PCB 2 thus removed is discharged onto a collection stage 19 disposed in the vicinity of the take-up reel 11b. An air suction device 18 that can move up and down as indicated by an arrow C and can be moved and moved as indicated by an arrow D is disposed on the collection stage 19. The PCBs 2 discharged to the collection stage 19 are arranged on the collection tray 17 by the action of the air suction device 18.
[0039]
(Second embodiment)
FIG. 4 shows another embodiment of the crimping apparatus according to the present invention. The main purpose of the crimping device 31 shown here is to crimp the IC 6 as an object to be crimped onto a predetermined position of the PCB 2 as in the case of FIG. Also, in this embodiment, the PCB 2 to be processed is the PCB 2 having the structure shown in FIG. 2 as in the previous embodiment.
[0040]
The crimping apparatus 31 shown here includes a crimping head 3 disposed on one side (upper side in the figure) of the transport path A that transports the PCB 2, and the other side of the transport path A facing the crimping head 3 (in the figure). And a cradle 4 disposed on the lower side. This configuration is the same as that of the previous embodiment shown in FIG. The pressure bonding head 3 is heated to a predetermined temperature as necessary.
[0041]
This embodiment differs from the embodiment shown in FIG. 1 in that, as shown in FIG. 5, a first Teflon tape 7 disposed on the crimping head 3 side and a second Teflon tape 8 disposed on the cradle 4 side are provided. The PCB 2 is sandwiched between the tapes 7 and 8 by being coupled to each other at positions P on both front and rear sides of the PCB 2. In this way, the plurality of PCBs 2 are sandwiched by the first Teflon tape 7 and the second Teflon tape 8 so as not to be misaligned in a state where they are separated by a certain distance K.
[0042]
As a method for bonding the first Teflon tape 7 and the second Teflon tape 8 to each other, various methods such as a method of bonding with an adhesive and a method of bonding mechanically with a stapler are conceivable.
[0043]
As described above, the first Teflon tape 7 and the second Teflon tape 8 that support the plurality of PCBs 2 at a constant interval K are arranged along the conveyance path A by a tape conveyance device (not shown) having an appropriate configuration in FIG. The plurality of PCBs 2 are sequentially fed to the cradle 4 by the conveyance. The tape transport device can be variously configured. For example, a take-up reel (not shown) is disposed on the upstream side (right side in FIG. 4) of the transport path A, and the downstream side (left side in the figure) of the transport path A. ) Is provided with a take-up reel (not shown), and a long tape comprising a first Teflon tape 7 and a second Teflon tape 8 supporting a plurality of PCBs 2 at a constant interval K is wound around the take-up reel. A plurality of PCBs 2 can be conveyed by winding the long tape at a predetermined speed with the above-described take-up reel.
[0044]
A long tape (see FIG. 5) in which a plurality of PCBs 2 are supported at a constant interval K is previously wound around an unwinding reel, and the long tape is unwound at a constant speed from the unwinding reel. In place of the above-described conveying method of supplying the material to the pressure bonding head 3, a first tape Teflon is provided in which a long tape forming device is disposed at a position before the pressure bonding head 3 in FIG. It is also possible to adopt a method in which the tape 2 and the PCB 2 and the second Teflon tape 8 temporarily mounted with the IC 6 are assembled into a long tape (see FIG. 5) by a long tape creating apparatus and then supplied to the cradle 4. it can.
[0045]
According to the pressure bonding apparatus of the present embodiment having the above configuration, even when the ACF 27 protrudes to the outside of the IC 6 and the back side of the PCB 2 when the IC 6 is pressed by the pressure bonding head 3, the ACF 27 is applied to the pressure bonding surface 3 a of the pressure bonding head 3. Adhesion can be prevented by the first Teflon tape 7, and the protruding ACF 27 can be prevented from adhering to the surface of the cradle 4 by the second Teflon tape 8. Therefore, with respect to the PCB 2 that is successively supplied to the cradle 4, the crimping operation can be continuously performed without contaminating the PCB 2 with the ACF 27.
[0046]
In the present embodiment, since a long tape having a structure in which a plurality of PCBs 2 are sandwiched by a predetermined interval K is formed by a pair of Teflon tapes 7 and 8, PCB 2 is formed only by these Teflon tapes 7 and 8. Therefore, it is possible to automatically and stably supply and remove the PCB 2 with respect to the cradle 4 and the crimping head 3 with a simple structure.
[0047]
(Third embodiment)
In the above embodiment, the case where a PCB is considered as a substrate and an IC as an object to be bonded is mounted thereon is exemplified. However, in the crimping method according to the present invention, various members other than PCB can be considered as the substrate. For example, one of the pair of translucent substrates 22a and 22b constituting the liquid crystal device 20 as shown in FIG. 6 is considered as a substrate, and a liquid crystal driving IC 25 as an object to be bonded is pressure-bonded at an appropriate position using an ACF 27. In some cases, the crimping method according to the present invention can be applied.
[0048]
First, the structure of the liquid crystal device 20 will be described as follows. As shown in FIG. 6, the liquid crystal device 20 includes a pair of translucent substrates 22 a and 22 b that are bonded to each other with an annular sealing material 21. These translucent substrates can be formed by, for example, a glass substrate or a plastic substrate.
[0049]
A gap, a so-called cell gap, is formed in a region between the pair of translucent substrates 22a and 22b and surrounded by the sealing material 21, and liquid crystal is sealed in the cell gap. A plurality of linear electrodes 23 arranged in parallel to each other are formed on the inner surface (that is, the upper surface in the figure) of one translucent substrate 22a, and the inner surface (that is, the other translucent substrate 22b) A plurality of linear electrodes 24 arranged in parallel to each other are formed on the lower surface in the drawing. These linear electrodes 23 and 24 are arranged in a positional relationship orthogonal to each other, and the orthogonal portion constitutes one pixel for displaying a visible image.
[0050]
In an actual liquid crystal device, a large number of linear electrodes 23 and 24 are formed on the surfaces of the substrates 22a and 22b at a constant minute interval. In FIG. 6, these electrodes 23 are shown for easy understanding of the structure. , 24 are schematically shown in an enlarged manner than the actual dimensions, and all of the electrodes 23 and 24 are not shown, but a part thereof is omitted.
[0051]
An IC mounting area S for mounting a liquid crystal driving IC 25 as an object to be bonded is set in a portion of one of the translucent substrates 22a that protrudes outside the counterpart substrate 22b. The linear wiring pattern 16 extends. A large number of these wiring patterns 16 are also formed at appropriate minute intervals, but in the drawing, in order to make each wiring pattern 16 easy to understand, a part of those wiring patterns is omitted and the wiring patterns 16 are not shown. The distance dimension is also enlarged and schematically shown.
[0052]
The linear electrode 23 formed on the surface of the substrate 22 a is directly connected to the wiring pattern 16. On the other hand, the linear electrode 24 formed on the surface of the substrate 22b is electrically connected to the wiring pattern 16 via a conductive material disposed between the substrate 22a and the substrate 22b. A terminal 26 indicates an external connection terminal for conducting with an external circuit. Actually, a large number of terminals 26 are formed with minute spacing dimensions, but the spacing dimensions are enlarged and schematically shown in the figure.
[0053]
A liquid crystal driving IC 25 is fixed to the IC mounting area S using the ACF 27. The ACF 27 is generally formed by dispersing conductive particles in an adhesive, and the output bumps 28 of the liquid crystal driving IC 25 pass through the conductive particles while the liquid crystal driving IC 25 is fixed on the substrate 22a. 16, and as a result, is connected to each of the linear electrodes 23 and 24.
[0054]
When the liquid crystal driving IC 25 is fixed to the projecting portion of the translucent substrate 22a using the ACF 27 as shown in FIG. 6 using the crimping apparatus 1 shown in FIG. 6, the IC mounting region S in FIG. The ACF 27 is attached, and a liquid crystal driving IC 25 is placed at a predetermined position on the ACF 27 and temporarily bonded. After that, as shown in FIG. 7, the portion of the translucent substrate 22a to which the liquid crystal driving IC 25 is temporarily bonded is placed on the second Teflon tape 8 by a dedicated transport device or the second Teflon tape 8 By itself, the plurality of liquid crystal devices 20 are transported along the transport path A at substantially equal intervals. The crimping operation performed by the crimping apparatus 1 of FIG. 1 on the liquid crystal device 20 thus transported is the same as that of the previous embodiment when the PCB 2 shown in FIGS. .
[0055]
In addition, as shown in FIG. 6, the crimping | compression-bonding operation | work which adheres liquid crystal drive IC25 to the overhang | projection part of the translucent board | substrate 22a using ACF27 can also be performed using the crimping | compression-bonding apparatus 31 shown in FIG.
[0056]
(Other embodiments)
In the above description, the IC 6 and the liquid crystal driving IC 25 are considered as objects to be bonded, but the object to be bonded can be any electronic component as necessary. For example, chip electronic components such as TCP (Tape Carrier Package), FPC (Flexible Printed Circuit), CSP (Chip Size Pacage), chip resistor, and chip capacitor can be used as the objects to be bonded.
[0057]
Moreover, the board | substrate as a crimping | compression-bonding object can be used as various wiring boards other than the translucent board | substrate 22a which is a component of PCB2 or a liquid crystal device. For example, an FPC, a ceramic substrate, a metal laminated substrate, or the like can be used as the substrate as necessary.
[0058]
【The invention's effect】
According to the pressure-bonding method and pressure-bonding apparatus according to the present invention, since the first adhesion preventing tape is provided on the pressure-bonding head side, even when the bonding agent protrudes outside the object to be bonded and the substrate, the bonding material remains on the surface of the pressure-bonding head. Can be prevented. Furthermore, since the second adhesion preventing tape is provided on the cradle side, it is possible to prevent the protruding bonding agent from adhering to the surface of the cradle. That is, according to the present invention, it is possible to reliably prevent the bonding agent from adhering to both the crimping head and the cradle by the action of the pair of adhesion preventing tapes provided on both the front and back sides of the substrate.
[0059]
Further, in the present invention, since the adhesion preventing tape is also provided on the cradle side, even when a through hole such as a through hole is formed at an appropriate position of the substrate, a bonding agent that protrudes to the back side of the substrate through the through hole is provided. It can prevent adhering to the surface of the cradle.
[0060]
Furthermore, in the present invention, since the second adhesion preventing tape provided on the cradle side is moved integrally with the substrate, there is no problem even when a plurality of substrates are continuously fed to the cradle. The adhesion preventing tape can be supplied between the cradle and the substrate.
[Brief description of the drawings]
FIG. 1 is a front view showing an embodiment of a crimping apparatus according to the present invention.
FIG. 2 is a perspective view showing an embodiment of a substrate and an object to be bonded.
FIG. 3 is a perspective view showing a main part of the apparatus shown in FIG. 1;
FIG. 4 is a front view showing another embodiment of the crimping apparatus according to the present invention.
5 is a perspective view showing a main part of the apparatus shown in FIG. 4. FIG.
FIG. 6 is a perspective view showing a liquid crystal device which is a structure including another embodiment of a substrate and an object to be bonded.
7 is a perspective view showing a main part of the crimping device when the crimping operation shown in FIG. 1 is performed on the liquid crystal device shown in FIG. 6;
[Explanation of symbols]
1 Crimping device
2 PCB (substrate)
3 Crimp head
3a Crimp surface
4 cradle
6 IC (bonded object)
7 First Teflon tape (first anti-adhesion tape)
8 Second Teflon tape (second adhesion prevention tape)
9a, 9b reel
11a, 11b reel
12a, 12b Wiring pattern
13 Through hole
17 Collection tray
18 Air suction device
19 Collection stage
20 Liquid crystal device
21 Sealing material
22a Translucent substrate (substrate)
22b Translucent substrate
23, 24 Linear electrode
25 Liquid crystal drive IC (bonded object)
27 ACF (bonding agent)
31 Crimping device
A Transport path of liquid crystal device
B Moving direction of crimping head
C Up and down movement direction of air suction device
D Transport direction of air suction device
K PCB support interval
P Teflon tape bonding position
S IC mounting area

Claims (10)

The substrate to which the object to be bonded is temporarily attached by the bonding agent is supported by a cradle, and the object to be bonded is pressed by the pressure bonding head disposed so as to face the cradle. In the pressure bonding method for fixing the object to be bonded to the substrate,
Supplying a first adhesion preventing tape between the pressure bonding head and the object to be bonded, supplying a second adhesion preventing tape between the cradle and the substrate,
Further, the second adhesion prevention tape moves together with the substrate in a state where the substrate is placed, thereby continuously removing the material to be bonded and the substrate from the cradle. A crimping method characterized by that.   2. The crimping method according to claim 1, wherein the first adhesion preventing tape and the second adhesion preventing tape are supplied separately from each other.   3. The press-bonding method according to claim 2, wherein the substrate is conveyed by the second anti-adhesion tape and supplied and removed from the cradle.   2. The crimping method according to claim 1, wherein the first adhesion preventing tape and the second adhesion preventing tape are bonded to each other on both front and rear sides of the substrate to sandwich the substrate, and the tape is held in the sandwiched state. The substrate is fed and removed from the cradle by conveying the substrate.   5. The pressure-bonding method according to claim 1, wherein at least one of the first adhesion preventing tape and the second adhesion preventing tape is a tape mainly composed of a fluororesin. A crimping method characterized by comprising. A crimping head disposed on one side of the transport path for transporting the substrate on which the object to be bonded is temporarily mounted by the bonding agent, and disposed on the other side of the transport path facing the crimping head. A pressing base that presses the object to be bonded by the pressure-bonding head in a state in which the substrate is supported by the receiving base, and is bonded to the substrate by the adhesive. In the device
A first adhesion preventing tape supplied between the pressure bonding head and the object to be bonded; a second adhesion preventing tape supplied between the cradle and the substrate; and the second adhesion. The prevention tape is configured to move together with the substrate in a state where the substrate is placed , and thereby continuously remove the material to be bonded and the substrate from the cradle. Crimping device.   7. The pressure bonding apparatus according to claim 6, wherein the first adhesion prevention tape and the second adhesion prevention tape are supplied separately from each other.   8. The crimping apparatus according to claim 7, wherein the substrate is transported by the second adhesion preventing tape and supplied and removed from the cradle.   7. The crimping apparatus according to claim 6, wherein the first adhesion preventing tape and the second adhesion preventing tape are bonded to each other on both the front and rear sides of the substrate to sandwich the substrate, and the tape is held in the sandwiched state. A crimping apparatus characterized by transporting.   10. The crimping apparatus according to claim 6, wherein at least one of the first adhesion preventing tape and the second adhesion preventing tape is a tape mainly composed of a fluororesin. A crimping apparatus characterized by comprising.

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