KR20190051554A - Laminating apparatus and method of printed circuit board - Google Patents

Abstract

According to an embodiment of the present invention, an apparatus for tacking a printed circuit board comprises: a first board stage; a second board stage; a board loader unit connected to a rail to move and moving a board stacked on the first board stage above the second board stage; a material loader unit on which a material to be attached onto the board is stacked; and an adsorption header connected to the rail to move, adsorbing a material stacked on the material loader unit, and attaching the adsorbed material on the board stacked on the second board stage. The adsorption header includes: an adsorption unit for adsorbing the material; and a heating plate applying heat to the adsorption unit.

Description

TECHNICAL FIELD [0001] The present invention relates to a printed circuit board (PCB)

An embodiment relates to a printed circuit board connecting apparatus and a connecting method.

BACKGROUND ART [0002] A conductive pattern constituting a circuit is printed on a substrate such as a printed circuit board (PCB) and a flexible printed circuit board (FPCB).

A coverlay film such as a polyimide film is pre-attached to the surface of the substrate to protect the pattern during the manufacturing process and use of the substrate.

One side of the coverlay is coated with an adhesive, which melts when adhered to the surface of the substrate. The coverlay sheet is covered with a roll, and the coverlay sheet is covered by a release film. The coverlay sheet is composed of a coverlay film, a pressure-sensitive adhesive and a release film.

Conventionally, the folding of the conventional coverlay film is performed by manual operation. However, since a large amount of labor and time are required, the production cost of the substrate is greatly increased and the productivity is lowered.

1 is a flowchart showing a method of attaching a coverlay attaching apparatus according to the prior art in a process order.

Referring to FIG. 1, the coverlay bonding method according to the related art can roughly be divided into a bonding process, a thermocompression bonding process, and a carrier film removing process.

First, a joining process is performed, and the joining process is started by putting a product into a joining stage (Step 11). At this time, the operator inserts the product manually by hand.

Thereafter, the cover rails are brought into contact with the inserted product by the attaching device (step 12). At this time, a plurality of single cover rails are attached on one carrier film, and the holding device places the carrier film on the inserted product, thereby proceeding the bonding process.

When the folding is completed, the coverlay is passed through the carrier film to discharge the product (step 13). At this time, the discharge of the product proceeds manually by the operator like the input of the product.

Thereafter, a thermocompression bonding process is performed, and the thermocompression bonding process starts by replacing the chipboard (step 21).

When the kanji is replaced, a new product is introduced into the pressing stage (Step 22). When the product is inserted into the pressing stage, the thermo compression bonding device thermally presses the carrier film to stably attach the coverlay attached to the carrier film on the product (step 23).

When the thermocompression process is completed, the thermocompression-finished product is discharged (step 24).

When the thermocompression bonding is completed, a carrier film removing process is performed, and the carrier film removing process is a process of removing a carrier film attached to the coverlay (step 30). In addition, the carrier film removal process is performed manually by the operator.

Wherein the carrier film is disposed on the protective film of the coverlay to attach the plurality of coverlay films at one time in a manner independent of the protective film that is attached to the coverlay. The carrier film is disposed on the cover rails because the cover rails are bonded to each other and thermocompression bonding is performed through separate processes.

As described above, in the conventional cover-laying apparatus, the process of placing the cover-lay film on the carrier film and the process of thermocompression bonding the cover-lay film are performed separately, have.

In addition, the conventional coverlay attaching apparatus has a problem that a separate operation and personnel are required to remove the carrier film.

According to an embodiment of the present invention, there is provided a printed circuit board connecting apparatus and a connecting method capable of concurrently carrying out bonding and thermocompression of a material.

In addition, the embodiment of the present invention provides a printed circuit board connecting apparatus and a bonding method which can improve productivity by eliminating necessary processes at the time of attaching a material.

It is to be understood that the technical objectives to be achieved by the embodiments are not limited to the technical matters mentioned above and that other technical subjects not mentioned are apparent to those skilled in the art to which the embodiments proposed from the following description belong, It can be understood.

According to an embodiment of the present invention, there is provided a holding device for a printed circuit board, comprising: a first substrate stage; A second substrate stage; A substrate loader connected to the rail and moving the substrate loaded on the first substrate stage onto the second substrate stage; A material loader for loading a material to be adhered onto the substrate; And an adsorption header that is connected to and moves to the rails and adsorbs the material loaded on the material loader portion and attaches the adsorbed material onto the substrate mounted on the second substrate stage, And a heat plate for applying heat to the adsorption unit.

In addition, the suction header thermally compresses the material by using heat applied through the heat plate in a state where the material is in contact with the substrate.

The adsorption header may include a first adsorption header disposed on one side of the second substrate stage and a second adsorption header disposed on the other side of the second substrate stage.

The material loader portion includes a first material loader for loading the material to be absorbed by the first adsorption header and a second material load for loading the material to be adsorbed by the second adsorption header.

A first vision module for aligning the substrate adsorbed by the first adsorption header and the substrate loaded on the second substrate stage; And a second vision module for aligning the substrate adsorbed by the second adsorption header and the substrate loaded on the second substrate stage.

In addition, the substrate loader moves along the rail and discharges the substrate stacked on the second substrate stage when the material is thermally compressed through the suction header.

In addition, the method of attaching the printed circuit board is a method in which the substrate loader moves along the first rail to load the substrate on the bonded stage, the adsorption header adsorbs the material loaded on the material loader portion, and the adsorption header moves along the second rail Moves the adsorbed material onto the substrate placed on the contact stage, and the adsorption head is thermocompression-bonded while the material is placed on the substrate.

Further, the suction headers are composed of a plurality of suction heads, and the thermal compression of the materials proceeds simultaneously through a plurality of suction heads.

Further, when the material is thermally pressed, the substrate loader moves along the first rail to discharge the substrate loaded on the bonded stage.

Further, the first alignment mark formed on the material and the second alignment mark formed on the substrate are aligned to move the suction headers.

According to the embodiment of the present invention, by performing the thermocompression bonding process together with the joining of materials such as cover rails and EMI tapes, the joining process of the material can be simplified and the productivity can be improved accordingly.

Further, according to the embodiment of the present invention, it is possible to minimize the manpower required for the manufacturing operation by automatically feeding the substrate and the separator through the rails and the loader unit, minimizing the time required for the manufacturing process and the defect rate High tolerance accuracy can be ensured.

In addition, according to the embodiment of the present invention, it is possible to eliminate the step of attaching the material on the carrier film and removing the carrier film upon completion of the thermo-compression process of the material.

1 is a flowchart showing a method of attaching a coverlay attaching apparatus according to the prior art in a process order.
FIG. 2 is a view showing a connecting device of a printed circuit board according to an embodiment of the present invention.
FIG. 3 is a view showing the first and second adsorption headers shown in FIG. 2. FIG.
4 is a flowchart illustrating a method of bonding a printed circuit board according to an embodiment of the present invention in the order of steps.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The following terms are defined in consideration of the functions in the embodiments of the present invention, which may vary depending on the intention of the user, the intention or the custom of the operator. Therefore, the definition should be based on the contents throughout this specification.

FIG. 2 is a view showing a connection device of a printed circuit board according to an embodiment of the present invention, and FIG. 3 is a view showing the first and second adsorption headers shown in FIG.

Referring to FIGS. 2 and 3, the connecting apparatus of the printed circuit board includes a substrate and interleaving loading stage 101, a contact stage 102, a first material loader 103, a second material loader 105, The second rail 108, the first adsorption header 109, the second adsorption header 110, the third rail 111, the first vision module 112, and the second And a vision module 113.

The substrate and interleaving stage 101 includes a plurality of substrates and interleaving boards interposed between the plurality of substrates. In addition, the substrate and interleaving loading stage 101 includes a substrate loader (not shown), thereby loading the interleaving substrate on the substrate and interleaving loading stage 101.

The contact stage 102 is loaded with a substrate to which a material is to be bonded. The attachment stage 102 may include a clamp (not shown). The clamp may clamp the end of the loaded substrate to limit movement of the substrate when the substrate is loaded on the bonded stage 102. [

The first material rod 103 includes a material stage (not shown) on which the material to be adhered to the substrate is placed, and a roller (not shown) for rolling the material on the material stage .

The material may be a cover-lay film, an EMI (Electro Magnetic Interference) film, or a photoresist film.

A coverlay film is used by being pre-attached to a surface of a substrate such as a polyimide film in order to protect the pattern during manufacturing process and use of the substrate. The photosensitive dry film is referred to as a dry film resist (DFR) or a photosensitive film, and may be a lead frame used for mounting a semiconductor integrated circuit or a photosensitive layer used as an etching resist in manufacturing a printed wiring board / RTI > The EMI film may be a tape used for shielding electromagnetic waves.

Further, the material to be stacked on the first material rod 103 is conveyed by the first adsorption head 109, and thus is adhered onto the substrate mounted on the attachment stage 102.

 The second material rod 105 includes a material stage (not shown) on which a material to be adhered to the substrate is placed, and a roller (not shown) for rolling the material on the material stage .

In addition, the material to be loaded on the second material rod 105 is transferred by the second adsorption head 110, and is thus deposited on the substrate loaded on the contact stage 102. [

The substrate loader section 106 transfers the substrate and the substrate loaded on the interlevel loading stage 101 onto the bonded stage 102. The substrate loader portion 106 moves along the first rail 107 and the second rail 108.

That is, the substrate loader section 106 can move along the first rail 107 to the substrate and interleaving loading stage 101. In addition, the substrate loader section 106 may move to the attachment stage 102 along the second rail 108.

Accordingly, the substrate loader unit 106 moves along the first rail 107 to absorb the substrate loaded on the substrate and the interlevel loading stage 101. The substrate loader unit 106 moves along the second rail 108 to load the adsorbed substrate on the bonded stage 102.

In addition, when the substrate loading process of the substrate loaded on the attachment stage 102 is completed, the substrate loader unit 106 adsorbs the substrate on which the joining process is completed, and thereby, the first and second rails And then the adsorbed substrate can be discharged to an end product stage (not shown).

The first adsorption header 109 is disposed on one side of the attachment stage 102.

The first adsorption header 109 adheres the material onto the substrate stacked on the above-mentioned contact stage 102. At this time, a plurality of substrates may be stacked on the connection stage 102. The substrate may be divided into a first substrate group disposed on the left side region and a second substrate group disposed on the right side region with respect to the stacking region of the attachment stage 102.

Then, the first adsorption header 109 advances the process of joining the material to the first substrate group. To this end, the first adsorption header 109 moves along the third rail 111 to absorb the material loaded on the first material loader 103. The first adsorption header 109 contacts the adsorbed material on one of the first substrate groups.

3, the first adsorption header 109 includes an adsorption plate 120 and a heat plate 130 disposed under the adsorption plate 120. As shown in FIG. Accordingly, the first adsorption header 109 puts the adsorbed material on the substrate to be contacted, and then pressurizes the adsorbed material for a predetermined period of time. At this time, heat is generated through the heat plate 130, so that the first suction header 109 thermally compresses the material.

That is, the first adsorption header 109 adheres the material on the substrate and presses the material by applying pressure through the heat plate 130 for a predetermined period of time.

The second adsorption header 110 is disposed on the other side of the attachment stage 102.

A second adsorption header (110) attaches the material onto a substrate loaded on the attachment stage (102). At this time, a plurality of substrates may be stacked on the connection stage 102. The substrate may be divided into a first substrate group disposed on the left side region and a second substrate group disposed on the right side region with respect to the stacking region of the attachment stage 102.

Then, the second adsorption header 110 advances the process of joining the material to the second substrate group. To this end, the second adsorption header 110 moves along the third rail 111 to absorb the material loaded on the second material loader 105. The second adsorption header 110 contacts the adsorbed material on one of the second substrate groups.

At this time, the second adsorption header 110 also includes a sucking plate 120 and a heat plate 130 disposed under the sucking plate 120. Accordingly, the second adsorption header 110 puts the adsorbed material on the substrate to be contacted, and then pressurizes the adsorbed material for a predetermined period of time. At this time, heat is generated through the heat plate 130, so that the second adsorption header 110 thermally compresses the material.

That is, the second adsorption header 110 adheres the material on the substrate and presses the material by applying pressure through the heat plate 130 for a predetermined period of time.

The first vision module 112 is provided for aligning the material adhered by the first adsorption header 109.

The second vision module 113 is provided for aligning the material adhered by the second adsorption header 110.

At this time, a first alignment mark is formed on the material, and a second alignment mark may be formed on the substrate.

When the first vision module 112 moves the material by the first suction header 109 and is disposed on the substrate, the first alignment mark formed on the material and the second alignment mark formed on the substrate Take a mark.

The first vision module 112 controls the movement of the first absorption header 109 so that the first alignment mark taken and the second alignment mark are aligned. In another embodiment, the first vision module 112 may move the attachment stage 102 rather than the substrate so that the first alignment mark and the second alignment mark are aligned.

When the second vision module 113 moves the material by the second absorption header 110 and is disposed on the substrate, the first alignment mark formed on the material and the second alignment mark formed on the substrate, Take a mark.

The second vision module 113 controls the movement of the second absorption header 110 so that the first alignment mark taken and the second alignment mark are aligned. In another embodiment, the second vision module 113 may move the attachment stage 102, not the substrate, so that the first alignment mark and the second alignment mark are aligned.

According to the embodiment of the present invention, by performing the thermocompression bonding process together with the joining of materials such as cover rails and EMI tapes, the joining process of the material can be simplified and the productivity can be improved accordingly.

Further, according to the embodiment of the present invention, it is possible to minimize the manpower required for the manufacturing operation by automatically feeding the substrate and the separator through the rails and the loader unit, minimizing the time required for the manufacturing process and the defect rate High tolerance accuracy can be ensured.

In addition, according to the embodiment of the present invention, it is possible to eliminate the step of attaching the material on the carrier film and removing the carrier film upon completion of the thermo-compression process of the material.

4 is a flowchart illustrating a method of bonding a printed circuit board according to an embodiment of the present invention in the order of steps.

First, the substrate loader section 106 moves along the first rail 107 and the second rail 108 to adsorb the substrate loaded on the substrate and the interlevel loading stage 101, Is loaded on the contact stage 102 (Step 101).

At this time, the substrate and interleaving loading stage 101 includes a substrate loader (not shown), thereby loading the interleaving substrate on the substrate and interleaving loading stage 101, (Step 102)

The first adsorption header 109 and the second adsorption header 110 are disposed on the first substrate 101 and the second substrate 101. The first adsorption headers 109 and the second adsorption headers 110 are disposed on the first substrate loader 103 and the second substrate loader 105, (Step 103).

To this end, the first adsorption header 109 and the second adsorption header 110 move over the first material loader 103 and the second material loader 105, respectively. The first adsorption header 109 and the second adsorption header 110 adsorb the material loaded on the first material loader 103 and the second material loader 105. Then, the first adsorption header 109 and the second adsorption header 110 move over the adhesion stage 102 in a state of adsorbing the material. Then, the first adsorption header 109 and the second adsorption header 110 put the adsorbed material on the substrate stacked on the contact stage 102. At this time, the first vision module 112 controls the movement of the first adsorption header 109 to align the material moved by the first adsorption header 109. In addition, the second vision module 113 controls the movement of the second adsorption header 110 to align the material moved by the second adsorption header 110.

The first adsorption header 109 and the second adsorption header 110 then align the alignment between the substrate and the material through the control of the first and second vision modules, Is attached to the substrate.

At this time, heat is applied to the first adsorption header 109 and the second adsorption header 110, and the pressure is applied for a predetermined time while the material is placed on the substrate for pressing.

The first material loader 103 and the second material loader 105 periodically move the material through the first adsorption header 109 and the second adsorption header 110 so that the material is smoothly folded (Step 104).

Subsequently, the substrate loader unit 106 discharges the material stacked on the bonded stage 102 to the outside when the material is completely connected through the first adsorption header 109 and the second adsorption header 110 (Step 105).

According to the embodiment of the present invention, by performing the thermocompression bonding process together with the joining of materials such as cover rails and EMI tapes, the joining process of the material can be simplified and the productivity can be improved accordingly.

Further, according to the embodiment of the present invention, it is possible to minimize the manpower required for the manufacturing operation by automatically feeding the substrate and the separator through the rails and the loader unit, minimizing the time required for the manufacturing process and the defect rate High tolerance accuracy can be ensured.

In addition, according to the embodiment of the present invention, it is possible to eliminate the step of attaching the material on the carrier film and removing the carrier film upon completion of the thermo-compression process of the material.

The features, structures, effects and the like described in the foregoing embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Further, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified in other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the present invention. It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments may be modified and implemented. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

101: substrate and sheet feeding loading stage
102: Welding stage
103, 105: Material loader
106: Substrate loader section
107, 108, 111: rail
109, 110: Adsorption headers
112, 113: Vision module

Claims (10)

A first substrate stage;
A second substrate stage;
A substrate loader connected to the rail and moving the substrate loaded on the first substrate stage onto the second substrate stage;
A material loader for loading a material to be adhered onto the substrate; And
And an adsorption header connected to the rail and adsorbing the material loaded on the material loader portion and attaching the adsorbed material onto the substrate mounted on the second substrate stage,
The adsorption head
An adsorption unit for adsorbing the material;
And a heat plate for applying heat to the adsorption unit
A device for inserting a printed circuit board. The method according to claim 1,
The adsorption head
The material is thermally compressed by using the heat applied through the heat plate in a state where the material is in contact with the substrate
A device for inserting a printed circuit board. The method according to claim 1,
The adsorption head
A first adsorption header disposed on one side of the second substrate stage,
And a second adsorption header disposed on the other side of the second substrate stage
A device for inserting a printed circuit board. The method according to claim 1,
The material loader section,
A first material loader for loading a material to be adsorbed by the first adsorption header;
And a second material rod for loading the material to be adsorbed by the second adsorption header
A device for inserting a printed circuit board. 3. The method of claim 2,
A first vision module for aligning the substrate adsorbed by the first adsorption header and the substrate loaded on the second substrate stage; And
Further comprising a second vision module for aligning the substrate adsorbed by the second adsorption header and the substrate loaded on the second substrate stage
A device for inserting a printed circuit board. The method according to claim 1,
The substrate loader portion,
When the thermal compression of the material is completed through the suction header, the substrate moves along the rail and discharges the substrate stacked on the second substrate stage
A device for inserting a printed circuit board. The substrate loader portion moves along the first rail to load the substrate on the contact stage,
The adsorption header adsorbs the material loaded on the material loader portion,
The suction head moves along the second rail to move the adsorbed material onto the substrate mounted on the contact stage,
And the suction head is thermocompression-bonded in a state where the material is placed on the substrate
A method of attaching a printed circuit board. 8. The method of claim 7,
Wherein the suction head is composed of a plurality of suction heads,
The thermal compression of the material proceeds simultaneously through a plurality of adsorption heads
A method of attaching a printed circuit board. 8. The method of claim 7,
When the material is thermally pressed, the substrate loader portion moves along the first rail to discharge the substrate loaded on the bonded stage
A method of attaching a printed circuit board. 8. The method of claim 7,
Aligning a first alignment mark formed on the material and a second alignment mark formed on the substrate to move the suction header
A method of attaching a printed circuit board.

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