JP3816434B2 - Component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting method, and more particularly to a component mounting method suitable for manufacturing a liquid crystal panel by connecting a printed circuit board to a tab component attached to a liquid crystal glass substrate.
[0002]
[Prior art]
Conventionally, in the manufacturing process of a liquid crystal panel, as shown in FIG. 12A, first, an OLB (outer leader bonder) is used to mount tabs 102 on which liquid crystal driving ICs are mounted on the four sides of the outer periphery of the liquid crystal cell 101. Then, the tabbed cell 101A is manufactured, and then the printed circuit board 103 is electrically connected to the tab 102 portion of the tabbed cell 101A as shown in FIGS. Panel 100 was manufactured.
[0003]
When the printed circuit board 103 is connected to the tab-attached cell 101A, the predetermined position of the pre-soldered printed circuit board 103 is made to correspond to the predetermined position of the tab 102, and the solder 104 is melted by heating in this state. And soldered.
[0004]
[Problems to be solved by the invention]
However, in recent years, the pitch between the leads of the printed circuit board 103 and the tab 102 has been narrowed (for example, 0.3 mm), and in the conventional electrical connection method by soldering, there is a risk of causing a short circuit between adjacent leads. I came.
[0005]
Accordingly, an object of the present invention is to provide a component mounting method that can automatically perform reliable electrical connection between predetermined leads even when, for example, a printed circuit board and a tab are electrically connected. And
[0006]
[Means for Solving the Problems]
The invention according to claim 1 is a step of supplying a circuit board, a step of supplying a display panel to which an electronic component is connected, a step of attaching an anisotropic conductive film tape to the supplied circuit board, Aligning the predetermined portion of the supplied display panel with electronic components and the predetermined portion of the circuit board on which the anisotropic conductive film tape is affixed, and the electronic components and anisotropy of the aligned display panel possess a step of discharging the step of crimping and a circuit board conductive tape is attached, and the display panel and the circuit board which is crimped, by attaching the anisotropic conductive film tape to the circuit board While supplying the display panel to which the electronic component is connected, the next circuit board is being crimped between the electronic component of the display panel and the circuit board to which the anisotropic conductive film tape is attached. and characterized in that the supply That.
The invention according to claim 2 is characterized in that the step of applying the anisotropic conductive film tape to the circuit board is performed immediately before the step of pressure-bonding the electronic component of the display panel and the circuit board. .
In the invention according to claim 3, before the step of crimping the combination of the previous circuit board and the display panel with electronic components is completed, the operation of applying the anisotropic conductive film tape to the next circuit board is started. It is characterized by being.
According to a fourth aspect of the present invention, the circuit board is a printed board, the electronic component is a tab on which a liquid crystal driving element is mounted, and the display panel is a liquid crystal glass board.
[0007]
According to the present invention, an anisotropic conductive film tape is affixed to a circuit board such as a printed circuit board, and a predetermined portion of a display panel with an electronic component such as a liquid crystal glass substrate with a tab is adhered to the anisotropic conductive film tape. After the predetermined position of the circuit board is aligned, the operation of automatically pressing and discharging the circuit board and the electronic components in the display panel is automatically performed via the anisotropic conductive film tape.
While supplying the anisotropic conductive film tape to the circuit board, the display panel to which the electronic components are connected is supplied, and the electronic component of the display panel and the anisotropic conductive film tape are attached. Since the next circuit board is supplied while being bonded to the board, the printed board can be efficiently mounted on the tabbed cell.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a component mounting apparatus to which a component mounting method of the present invention is applied will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected to the already demonstrated part and duplication description is abbreviate | omitted.
[0009]
FIG. 1 is an external perspective view of an ACF crimping apparatus according to the present embodiment, and FIG. 2 is an exploded perspective view of a main part of the ACF crimping apparatus.
[0010]
As shown in FIG. 1, in the ACF crimping apparatus M, each part described below is attached on a pedestal 1, and each part is covered with a lid 2. A monitor 3 for observing the positioning status of the printed circuit board or the like is disposed on the upper surface of the lid 2, and a touch panel 4 for inputting various operations is disposed below the monitor 3. A window 5 is provided on the front side of the lid 2 so that the inside of the apparatus can be observed.
[0011]
As shown in FIGS. 1 and 2, on the pedestal 1, a pallet supply unit 10 that supplies a printed circuit board 103, and a substrate transfer unit 20 that moves the supplied printed circuit board 103 to a predetermined position, , An ACF attaching part 30 for attaching an ACF tape (anisotropic conductive film tape) to the printed circuit board 103, and a cell supply part 40 for supplying the tab-attached cell 101A supplied from the previous process to a predetermined position inside the crimping apparatus; , And a main press-bonding section 50 that press-bonds the printed circuit board 103 temporarily attached with the ACF tape and the tab-attached cell 101A.
[0012]
First, the schematic operation of the ACF crimping apparatus M will be described based on the flowchart shown in FIG. 3, and then the detailed operation of each component will be described based on the flowcharts shown in FIGS.
(1) Schematic operation of ACF crimping apparatus As shown in FIG. 3, a tab-attached cell 101A (see FIG. 11 (a)) is manufactured by a tab final crimping apparatus (not shown) in the previous process, and this tab-attached cell 101A. Is transferred to the ACF tape crimping apparatus M (step S1).
[0013]
On the other hand, the printed circuit board 103 that has completed the previous process is manually transferred to the ACF crimping apparatus M while being placed on the pallet (step S2). The printed circuit boards 103 are taken out one by one by the substrate transfer section 20 and transferred to the ACF attaching section 30 for positioning (step S3), and the ACF tape is attached (step S4).
[0014]
Next, in step S5, both the tab-attached cell 101A in which step S1 has been completed and the printed circuit board 103 to which the ACF tape has been applied in step S4 are moved to the main crimping section 50 (step S5). Then, the positions of the printed circuit board 103 and the tabbed cell 101A are corrected by the alignment (position correction) cameras 52, 53a, 53b (step S6). The liquid crystal panel 100 is completed by simultaneously pressing the tabs together (step S7). The liquid crystal panel 100 is transferred from the ACF crimping apparatus M to the outside, and the series of operations is completed (step S8).
(2) Configuration and Operation of Each Part Next, the configuration and operation of each part described above will be described in detail with reference to FIGS. 2 and 4 to 8.
(1) Pallet supply unit (Fig. 4 (a))
The pallet supply unit 10 is stacked in a state where a plurality of (for example, eight) printed boards 103 are placed on the pallet P, and the stacked pallets P are manually placed on the elevator 11 (step S11). ). The elevator 11 is raised to a predetermined height (step S12), and only one uppermost pallet P is taken out (cut out) by the claws 12a to 12d arranged along the four sides of the pallet P, and a predetermined position of the rail 13 is set. (Step S13). After this step S13 is completed, the processing of the substrate transfer unit 20 shown in FIG. 4B is performed, and after the above-mentioned [Step S12 to processing A to F of the substrate transfer unit] are repeated, the pallet P Is empty, the empty pallet is discharged to the empty pallet discharging unit 14 (step S14), and after a predetermined number of empty pallets have accumulated, the empty pallet is manually removed (step S15).
(2) Substrate transfer section (Fig. 4 (b))
The arm 21 of the substrate transfer unit 20 is moved in the arrow R1 direction along the rail 22 with respect to the single pallet P cut out in step S13, and the claw 23 provided on the arm 21 is moved in the arrow T1 direction. Then, only one printed circuit board 103 on the pallet P is grasped and taken out (step S21). The printed circuit board 103 held by the claw 23 is placed at a predetermined position of the ACF backup (mounting table) 31 by the movement of the arm 21 in the direction of arrow R2 (step S22). After step S22 is completed, the ACF backup 31 shown in FIG. 5A is performed. After the processes B to E of the backup 31 are completed, the printed circuit board 103 to which the ACF tape has been attached is transferred to the backup 51 for main pressure bonding (step S23).
(3) ACF backup (Figure 5 (a))
In step S22, an alignment device (not shown) positions the single printed circuit board 103 placed on the ACF backup 31 (step S31). The positioned backup 31 is an arrow. It advances to the ACF sticking position in the U2 direction (step S32). After step S32 is completed, the ACF tape supply process shown in FIG. 5B is performed. After the ACF supply processes C to D are completed, the backup 31 is retracted in the direction of the arrow U1 to the receiving position of the next printed circuit board 103 (step S33).
(4) ACF supply (Fig. 5 (b))
The ACF tape 33 is pulled out from the supply reel 32 by the chuck 35 in a state where the backup 31 is advanced to the ACF tape application position by the step S32. Then, the ACF tape 33 is half-cut by the cutter 34 (step S41), and the ACF tape 33 is thermocompression bonded to the printed circuit board 103 on the backup 31 by the ACF pressure bonding head 36 (step S42). Is peeled off (step S43).
(5) Main pressure bonding backup and main pressure bonding (FIGS. 6A and 6B)
In step S23, the printed circuit board 103 to which the ACF tape 33 placed on the backup 51 worn by Honjo is attached is positioned on the backup 51 (step S51), and a mark on the printed circuit board 103 is formed by the substrate recognition camera 52. Is recognized (step S52) and moved to the final crimping position (step S53). Thermocompression bonding is performed by the main crimping head 54 at the final crimping position (step S61), and after completion of the thermocompression bonding, the backup 51 worn by Honjo is moved to the receiving position (step S54). As described above, the tab portion of the tab-attached cell 101A and the printed circuit board 103 are thermocompression-bonded by the ACF tape, so that they are sandwiched between the lead 102a of the tab 102 and the lead 103a of the printed circuit board 103 as shown in FIG. Since only part of the conductive particles has conductivity, there is no short circuit between adjacent leads 102a or between leads 103a.
(6) Cell transfer table and cell transfer arm (FIG. 7 (a))
On the other hand, the tab-attached cell 101A supplied from the outside is placed at the cell receiving position N of the cell transfer table 42 by the cell transfer arm 41a (step S71), and then transferred to the cell delivery position Q by the cell transfer table 42. (Step S72). Next, the cell transfer arms 42b and 41c are used to transfer the tab-attached cell 101A from the delivery position Q of the cell transfer table 42 to the cell stage 43, and the liquid crystal panel 100 that has been subjected to final pressure bonding from the cell stage 43 to the cell discharge table 44. The conveyance is performed simultaneously (steps S82 and S83).
(7) Cell stage and cell discharge (Fig. 8 (a), Fig. 8 (b))
The cell stage 43 receives the tab-attached cell 101A for which step S82 has been completed (step S91), and the cell stage 43 on which the tab-attached cell 101A is placed is transported by the transport unit 45 to a predetermined position in the arrow D1 direction. At this position, the cell stage 43 is moved in the X, Y, and θ directions, and adjustment is performed while recognizing the cell mark by the cell recognition cameras 53a and 53b (step S92), and the position for performing the final pressure bonding is determined (step S93). ). After the position of the main press-bonding is determined, the processes J to K (FIG. 6B) of the main press-bonding head 54 are performed, and the tabbed cell 101A and the printed circuit board 103 with the ACF tape are permanently attached to the liquid crystal panel 100. As shown in FIG. 12B, the liquid crystal panel 100 is placed on the cell stage 43 and conveyed in the direction of arrow D2.
[0015]
The cell transfer arm 41b and the cell transfer arm 41c are used to transfer the tabbed cell 101A from the transfer position Q of the cell transfer table 42 to the cell stage 43, and to discharge the cell from the cell stage 43 to the cell discharge table 44. Are simultaneously performed (step S94 (S83)). The liquid crystal panel (cell) 100 discharged in step S83 is received by the cell discharge table 44 (step S101) and taken out manually (step S102).
[0016]
As described above, in one ACF crimping apparatus (see FIG. 1), from the supply of the printed circuit board and the liquid crystal glass substrate with a tab to the attachment of the ACF and the crimping of the printed circuit board and the tab through the ACF. All steps can be performed.
(3) Parallel use of ACF crimping apparatus As shown in FIG. 10, it is possible to efficiently manufacture a liquid crystal panel by using an ACF crimping apparatus in parallel.
[0017]
That is, first, the first printed board 103 is supplied from the pallet P at the timing T1, and the ACF tape 33 is attached to the printed board 103 supplied at the timing T2. The first cell is supplied from the outside at the timing T3 while the ACF tape is being applied, and the first tabbed cell 101A is conveyed by the cell stage 43 to the position where the final pressure bonding is performed at the timing T4.
[0018]
Then, the first printed circuit board on which the ACF tape has been pasted and the first cell 101A are subjected to main pressure bonding by the main pressure bonding head 54 at timing T6, and the second print is performed at timing T5 simultaneously with timing T6. The substrate 103 is supplied, and the ACF tape is applied to the second printed substrate 103 at timing T7. The second tabbed cell 101A is supplied at timing T8 while the ACF tape is being applied, and the second tabbed cell 101A is conveyed at timing T9, and at the same time, the first tabbed cell 101A is discharged. To do. At the end of this timing T9, the first cycle is completed, and the mounting of the printed circuit board 103 on one side of the first tabbed cell 101A is completed.
[0019]
Then, the second printed circuit board 103 on which the second ACF tape is pasted and the second tabbed cell 101A are subjected to main pressure bonding at timing T11, and the third sheet is synchronized at this timing T11 and at the same timing T10. The printed circuit board 103 is supplied, and the ACF tape is applied at timing T12. The third tabbed cell 101A is supplied at timing T13 while the ACF tape is being applied, and the third tabbed cell 101A is conveyed at timing T14, and at the same time, the second tabbed cell 101A is discharged. To do. At the end of this timing T14, the second cycle ends.
[0020]
Also, the third printed circuit board 103 is supplied at the timing T10 at the end of the first cycle, the ACF tape is applied at the timing T12, and the timing of the third tabbed cell 101A at the timing T13 between the timing T12. Supply is performed, and the third tabbed cell 101A is transported at timing T14, and main press-bonding is performed at timing T15.
[0021]
Also, the fourth tabbed cell 101A is supplied at timing T16 and conveyed at timing T17. At the same time, the third tabbed cell 101A is discharged. At the end of this timing T17, the third cycle ends.
[0022]
As described above, when the ACF tape application to the first printed circuit board is completed, the ACF pressure bonding apparatus M starts preparation for applying the ACF tape to the second printed circuit board, and the ACF to the second printed circuit board. Since the time for which each component (for example, ACF sticking part, cell conveyance part, etc.) waits wastefully does not arise so that tape sticking is performed, a printed circuit board can be efficiently mounted on a cell with a tab.
(4) Continuous Arrangement of ACF Crimping Device FIG. 11 is a diagram showing a case where four ACF crimping devices are continuously arranged.
[0023]
With this arrangement, the first printed circuit board 103A is mounted on the first side V of the tab-attached cell 101A by the first ACF crimping apparatus M1, and the tab-attached cell is installed by the second ACF crimping apparatus M2. The second printed circuit board 103B is mounted on the second side W of 101A, and the third printed circuit board 103C is mounted on the third side X of the tab-attached cell 101A by the third ACF crimping apparatus M3. The fourth printed circuit board 103D is mounted on the fourth side Y of the tab-attached cell 101A by the fourth ACF crimping apparatus M4. Therefore, the printed circuit board can be efficiently mounted on the four sides of the rectangular tabbed cell 101A.
[0024]
【The invention's effect】
According to the present invention, for example, even when a printed circuit board and a tab are electrically connected, a reliable electrical connection can be automatically made between each predetermined lead.
[Brief description of the drawings]
FIG. 1 is an external perspective view of an embodiment of a component mounting apparatus to which a component mounting method of the present invention is applied.
FIG. 2 is an exploded perspective view of a main part of the embodiment.
FIG. 3 is a flowchart showing a schematic operation of the embodiment.
4A and 4B are flowcharts showing detailed operations of each part of the embodiment, wherein FIG. 4A is a flowchart of a pallet supply unit, and FIG. 4B is a flowchart of a substrate transfer unit.
FIGS. 5A and 5B are flowcharts showing detailed operations of each part of the embodiment, wherein FIG. 5A is a flowchart of ACF tape backup, and FIG. 5B is a flowchart of ACF tape supply;
6A and 6B are flowcharts showing detailed operations of respective parts of the embodiment, wherein FIG. 6A is a main-compression backup and FIG. 6B is a main-compression head flowchart.
7 is a flowchart showing the detailed operation of each part of the embodiment, wherein (a) is a cell transfer table and (b) is a flowchart of a cell transfer arm. FIG.
FIGS. 8A and 8B are flowcharts showing detailed operations of respective units in the embodiment, wherein FIG. 8A is a cell stage, and FIG. 8B is a flowchart of a cell discharge unit;
FIG. 9 is a diagram for explaining a conduction state by an ACF.
FIG. 10 is a time chart showing the operation timing of the embodiment.
FIG. 11 is a conceptual diagram when four ACF crimping apparatuses according to the embodiment are continuously arranged.
12A and 12B are diagrams for explaining mounting of a printed circuit board on a conventional tabbed cell, where FIG. 12A is a plan view of the cell with tab and FIG. 12B is completed by mounting the printed circuit board on the cell with tab. FIG. 3C is a cross-sectional view taken along line CC in the liquid crystal panel.
[Explanation of symbols]
M ACF pressure bonding apparatus 10 Pallet supply part 20 Substrate transfer part 30 ACF sticking part 33 ACF tape (anisotropic conductive film tape)
40 Cell supply part 50 Main pressure bonding part 100 Liquid crystal panel 101 Liquid crystal glass substrate (cell)
101A Cell with Tab 102 Tab 102a Lead 103 Printed Circuit Board 103a Lead

Claims (4)

A step of supplying a circuit board; a step of supplying a display panel to which an electronic component is connected; a step of attaching an anisotropic conductive film tape to the supplied circuit board; and the supplied display panel with an electronic component A predetermined position of the circuit board to which the anisotropic conductive film tape is attached, and a circuit board to which the electronic component of the aligned display panel and the anisotropic conductive tape are attached a step of crimping the door, have a the step of discharging the crimped the display panel and the circuit board, the anisotropic conductive film tape while attached to the circuit board, the electronic component is connected And supplying the next circuit board while pressing the electronic component of the display panel and the circuit board to which the anisotropic conductive film tape is attached. Implementation method. The component mounting method according to claim 1, wherein the step of attaching the anisotropic conductive film tape to the circuit board is performed immediately before the step of pressure-bonding the electronic component of the display panel and the circuit board. The anisotropic conductive film tape sticking operation to the next circuit board is started before the step of crimping the combination of the previous circuit board and the display panel with electronic parts is completed. 2. The component mounting method according to 2. 4. The component mounting method according to claim 1, wherein the circuit board is a printed board, the electronic component is a tab on which a liquid crystal driving element is mounted, and the display panel is a liquid crystal glass substrate. .

Images