JP2019041007A - Electronic component reception/delivery device - Google Patents

Abstract

To provide an electronic component reception/delivery device which stably adsorbs an electronic component by a collet.SOLUTION: In an electronic component reception/delivery device 10 in which an adsorption part 11 of a collet 12 is distributed at a reception position P of a front side of a wafer sheet S to which a plurality of electronic components W is adhered to a front surface, the device comprises: a paper pot 22 that is movably installed to a first direction approaching to the reception position P from a back side of the wafer sheet S and a second direction opposite thereto; and a needle-like member 23 which can be moved to the first and second directions, and of which a tip part can be projected from the paper pot 22. The paper pot 22 contacts one electronic component W to the adsorption part 11 of the collet 12 distributed to the reception position P by moving it to the first direction with the needle-like member 23 in a state where the plurality of electronic component W of the wafer sheet S is contacted to a region B of the back surface corresponding to a region A adheres to the surface, moves it to the second direction in a state of absorbing the wafer sheet S, and the needle-like member 23 is stopped and maintains a contact state to the adsorption part 11 of the electronic component W.SELECTED DRAWING: Figure 3

Description

The present invention relates to an electronic component delivery apparatus that adsorbs an electronic component affixed to a wafer sheet to a collet.

One electronic component to be delivered among many electronic components attached to the front surface of the wafer sheet is pressed by a needle-like member on the back surface of the wafer sheet corresponding to the position of the electronic component. The wafer sheet is projected to the front side and delivered to the collet. This is to facilitate peeling of the electronic component from the wafer sheet, and a specific example thereof is described in Patent Document 1, for example.
The pickup device described in Patent Document 1 pushes up the wafer sheet toward the collet with a push-up piece, brings an electronic component (chip) to be sucked into contact with the collet, and then lowers the push-up piece to form a needle shape from the push-up piece. The member (push-up needle) is in a protruding state.

Japanese Patent Laid-Open No. 11-186298

However, in the pickup device described in Patent Document 1, only the area for one electronic component to be attracted to the collet on the wafer sheet is pushed up by the push-up piece, so the position of the push-up piece and the position of the electronic component to be pushed up Does not match, the electronic component cannot be pushed up to a predetermined position, and the electronic component is not attracted to the collet.
This invention is made | formed in view of this situation, and it aims at providing the electronic component delivery apparatus which can adsorb | suck an electronic component to a collet stably.

An electronic component delivery apparatus according to the present invention that meets the above-described object includes a collet having a suction portion arranged at a receiving position on the front side of a wafer sheet having a large number of electronic components attached to the surface, and pressing the wafer sheet from the back side. In the electronic component delivery apparatus comprising sheet pressing means for bringing the electronic component closer to the collet, the sheet pressing means includes a plurality of the electronic components among the electronic components attached to the surface of the wafer sheet. A suction head that is in surface contact with the rear surface area B corresponding to the existing area A, and a second direction in the first direction approaching the receiving position from the back side of the wafer sheet and a second direction opposite to the first direction; A pepper pot movably provided in the direction, and a tip provided in the suction head and movably provided in the first and second directions. And the pepperpot moves in the first direction together with the needle-shaped member in a state where the suction head is in surface contact with the region B on the back surface of the wafer sheet. One electronic component in the area A is brought into contact with the suction portion of the collet arranged at the receiving position, and the wafer sheet is sucked by the suction head and moved in the second direction to move the electronic component. The needle-shaped member is moved away from the collet, and stops at the timing when the pepper pot starts to move in the second direction. The tip projects from the suction head to the suction portion of the one electronic component. Maintain contact.

In the electronic component delivery apparatus according to the present invention, the pepper pot is in surface contact with the rear surface region B corresponding to the region A where a plurality of electronic components are present among the electronic components attached to the front surface of the wafer sheet. In this state, it moves in the first direction together with the needle-like member to bring one electronic component in the region A into contact with the suction part of the collet arranged at the receiving position. The collet can be brought into contact with the adsorbing portion in a state of being arranged at the position.
Then, the pepper pot moves in the second direction while sucking the wafer sheet with the suction head and moves away from the collet, and the needle-like member stops at the timing when the pepper pot starts to move in the second direction. Since the tip part protrudes from the suction head and maintains the contact state of the electronic component to be delivered to the suction part, the wafer sheet can be easily peeled off from the electronic part in contact with the suction part. Can be stably adsorbed on the collet.

It is explanatory drawing of the electronic component delivery apparatus which concerns on one embodiment of this invention. It is explanatory drawing of the wafer sheet in which the electronic component was affixed. It is explanatory drawing of a sheet | seat pushing means. (A)-(C) is explanatory drawing which shows the mode of delivery of an electronic component, respectively. (A), (B) is explanatory drawing which shows the mode of delivery of an electronic component, respectively. (A) is explanatory drawing which shows the modification of a pickup unit, (B) is explanatory drawing which shows the example which arranges a wafer sheet horizontally.

Next, embodiments of the present invention will be described with reference to the accompanying drawings for understanding of the present invention.
As shown in FIGS. 1 and 3, an electronic component delivery apparatus 10 according to an embodiment of the present invention includes a collet 12 having a suction portion 11 disposed at a receiving position P on the front side of a wafer sheet S, and a wafer sheet. It is an apparatus comprising sheet pressing means 13 that pushes a part of S from the back side to bring the electronic component W closer to the collet 12. Details will be described below.

As shown in FIGS. 1 and 2, the electronic component delivery apparatus 10 includes a wafer ring 14 that supports a wafer sheet S having a large number of electronic components W attached to the surface thereof, a pickup unit 15 having a plurality of collets 12, and the like. It has.
Each electronic component W whose back surface is attached to the wafer sheet S is separated by dicing, and as shown in FIG. 2, the wafer sheet S is arranged along the vertical plane. On the surface of S, a row of a plurality of electronic components W in which the electronic components W are arranged in the left-right direction is arranged in the vertical direction (vertical direction). In the present embodiment, a gap of 30 to 100 μm is provided between the electronic components W.

As shown in FIGS. 1 and 2, the wafer ring 14 fixes the outer edge portion of the wafer sheet S and vertically arranges the wafer sheet S in a state where the orientation flat Q of the wafer sheet S is arranged on the lower side. The wafer ring 14 moves in the left-right direction and the vertical direction together with the wafer sheet S by the operation of the motor 14a.
As shown in FIG. 1, the pickup unit 15 is disposed on the front side (front side) of the wafer sheet S and includes a support base 17 to which a motor 16 is fixed. A horizontally-arranged rotating shaft 18 to which a rotational force is applied from the motor 16 is attached to the support base 17.

A collet support 20 having a plurality of arms 19 is fixed to the rotating shaft 18, and one collet 12 is attached to the tip side of each arm 19. The tips of the collets 12 are arranged at equal intervals along an imaginary circle, and each collet 12 is provided on the tip side where the suction part 11 having the air inlet 21 is tapered as shown in FIG. The suction part 11 can hold the electronic component W by vacuum pressure (negative pressure) and can release the suction of the electronic component W by opening to the atmosphere or by positive pressure.

As shown in FIG. 1, the collet 12 intermittently moves along an arc-shaped path by the operation of the motor 16, and is sequentially disposed facing the surface of the wafer sheet S and attached to the wafer sheet S. The electronic component W can be picked up. A position where the collet 12 is disposed to face the surface of the wafer sheet S is referred to as a “receiving position P”.
In the present embodiment, four collets 12 are provided, but the number of collets 12 is not limited to four.

As shown in FIGS. 1 and 3, the sheet pressing means 13 includes a paper pot 22 that is arranged on the back side (rear side) of the wafer sheet S and that is long in the front-rear direction, and a front-rear direction accommodated in the paper pot 22. And a long needle-like member 23. The pepper pot 22 and the needle-like member 23 are arranged in a direction in which the axis (longitudinal direction) is orthogonal to the wafer sheet S.
Each of the pepper pot 22 and the needle-like member 23 is provided so as to be able to advance and retreat by a known mechanism having a motor, a cam, and a cam follower, and moves forward (moves in the first direction) to approach the receiving position P and move backward. By moving (moving in the second direction opposite to the first direction), it moves away from the receiving position P.

As shown in FIG. 3, the pepper pot 22 includes a suction head 24 that is in surface contact with the back surface of the wafer sheet S, and a hollow member 25 that is long in the front-rear direction with the suction head 24 attached to the front side.
As shown in FIGS. 2 and 3, the suction head 24 has a cylindrical shape. The suction head 24 includes a through hole 28 along the axis of the suction head 24 and a front and rear direction around the through hole 28. A plurality of flow paths 26 penetrating therethrough are formed. The hollow member 25 is provided with an inner space portion 29 that accommodates the needle-like member 23, and each rear end of the through hole 28 and the plurality of flow paths 26 reaches the inner space portion 29. The tip of the needle-like member 23 is disposed in the through hole 28, and the tip of the needle-like member 23 projects forward from the suction head 24 as the needle-like member 23 moves forward with respect to the pepper pot 22. .

As shown in FIGS. 2 and 3, the suction head 24 is provided with a circular flat surface 27 in surface contact with the wafer sheet S at the front end, and the front ends of the through holes 28 and the plurality of flow paths 26 are flat surfaces 27. Has reached.
The flat surface 27 has the same size as the region A in which a plurality of electronic components W are bonded among all the electronic components W bonded to the wafer sheet S. Accordingly, when the pepper pot 22 advances in a state where the flat surface 27 of the suction head 24 is in surface contact with the region B on the back surface of the wafer sheet S corresponding to the region A, the region B of the wafer sheet S in surface contact with the flat surface 27. At the same time, the plurality of electronic components W in the region A are pushed forward.
The front end of each flow path 26 is in a state covered with the wafer sheet S in which the flat surface 27 of the suction head 24 is in surface contact, and sucks air in the inner space 29 and the plurality of flow paths 26 (not shown). By the operation of the vacuum pump, the suction head 24 sucks the wafer sheet S in surface contact.

Further, as shown in FIG. 1, the electronic component delivery apparatus 10 images a plurality of electronic components W attached to the region A on the surface of the wafer sheet S with which the suction head 24 is in surface contact via the prism 30. An image pickup means 31 and a control unit 32 that transmits a command signal for adjusting the position of the wafer ring 14 based on an image picked up by the electronic component W are provided. The control unit 32 can be configured to include a CPU and a memory. The control unit 32 detects the position of the electronic component W from the image captured by the imaging unit 31 and moves and moves the wafer ring 14 (hereinafter, “wafer ring 14” Is also referred to as “position correction” and a command signal is transmitted to the motor 14a.

Next, a process in which the collet 12 acquires the electronic component W from the wafer sheet S will be described.
First, the motor 14a is actuated by transmission of a command signal from the control unit 32, and the wafer ring 14 is moved. As shown in FIG. The electronic component W is referred to as “the electronic component W to be delivered”). The center of the flat surface 27 of the suction head 24, that is, the through hole 28 is formed in the region of the back surface of the wafer sheet S on which the surface is disposed. Place it in the correct position.
While the wafer ring 14 is moving, the suction of the wafer sheet S by the suction head 24 is released, and the tip of the needle-like member 23 is not protruding from the suction head 24.

After the movement of the wafer ring 14 is completed, the suction of the wafer sheet S by the suction head 24 is started, and the pepper pot 22 and the needle-like member 23 start moving forward. Hereinafter, the positions of the pepper pot 22 and the needle-like member 23 before the pepper pot 22 and the needle-like member 23 start to advance are referred to as “retreat positions”.
In the pepper pot 22, the suction head 24 sucks the back surface area B corresponding to the area A on which the plurality of electronic components W including the electronic components W to be transferred to the wafer sheet S are attached to the front surface. In this state, the needle-shaped member 23 moves forward together with the needle-shaped member 23 at the same speed.

Before the pepper pot 22 and the needle-like member 23 start moving forward, the one collet 12 moves along the arcuate path and approaches the receiving position P from another position.
Therefore, the pepper pot 22 and the needle-like member 23 start to advance at the timing when the collet 12 approaches the receiving position P. This is to shorten the time until the collet 12 acquires the electronic component W.

The pepper pot 22 and the needle-like member 23 move forward by a predetermined distance, and as shown in FIG. 4B, the electronic component W to be delivered (one electronic component W) of the collet 12 disposed at the receiving position P It is brought into contact with the suction part 11 and stopped. The collet 12 sucks the electronic component W to be delivered, which is in contact with the suction portion 11, by vacuum pressure.

Then, as shown in FIG. 4C, the pepper pot 22 moves backward while continuing the suction of the back surface of the wafer sheet S, and moves away from the collet 12 disposed at the receiving position P. On the other hand, the needle-like member 23 stops at the timing when the pepper pot 22 starts to retract, the tip protrudes from the suction head 24, and presses the electronic component W against the collet 12, that is, the collet 12 of the electronic component W. The state of contact with the adsorbing portion 11 is maintained.

Here, the tip of the needle-like member 23 is in contact with the wafer sheet S, and the contact area thereof is smaller than the area of the back surface of the electronic component W. Accordingly, in the region where the back surface of the electronic component W to be delivered is pasted on the wafer sheet S, the portion that is not in contact with the needle-like member 23 is pulled backward, that is, away from the electronic component W. Become. Therefore, the electronic component W to be delivered is in a state where it is easily peeled off from the wafer sheet S.

In addition, since the area of the wafer sheet S that is in contact with the outer peripheral portion of the flat surface 27 of the suction head 24 is attracted to the suction head 24, the suction head 24 is used by the needle-like member 23 as compared with the case where the wafer sheet S is not attracted to the suction head 24. The inclination angle with respect to the back surface of the electronic component W in the region separated from the 24 flat surfaces 27 increases. Therefore, the electronic component W to be delivered can be surely easily peeled off from the wafer sheet S.

Then, the suction force of the electronic component W by the collet 12 is such that the front surface portion corresponding to the portion where the tip of the needle-like member 23 of the wafer sheet S is in contact with the back surface is stuck to the electronic component W to be delivered. Therefore, when the needle-like member 23 moves backward, the electronic component W to be delivered that is attracted to the collet 12 is peeled from the wafer sheet S as shown in FIG. The needle-like member 23 is retracted to the retracted position, and the distal end portion is accommodated in the through hole 28 of the pepper pot 22 arranged at the retracted position (the distal end portion of the needle-like member 23 does not protrude from the pepper pot 22). State).

The collet 12 stops until the needle-like member 23 that has maintained the contact state of the electronic component W to the suction portion 11 after the electronic component W to be delivered contacts the suction portion 11 starts to move backward. Will be.
In the present embodiment, the collet 12 that has attracted the electronic component W moves away from the receiving position P before the needle-like member 23 moves back to the retracted position. This is to increase the number of collets 12 that acquire the electronic component W per unit time.

Here, the collet 12 is designed to be movable in the front-rear direction, and the tip of the needle-like member 23 protrudes from the pepper pot 22 after the electronic component W to be delivered comes into contact with the suction portion 11 of the collet 12. At the same time, the collet 12 moves forward (moves in a direction in which the suction part 11 of the collet 12 approaches the arm 19), thereby maintaining the state where the electronic component W is pressed against the collet 12 by the needle-like member 23. W can also be kept away from the pepper pot 22. However, in this case, since the collet 12 and the needle-like member 23 need to move at the same speed, the collet 12 and the needle-like member 23 are moved forward at the speed of the pepper pot 22 in the present embodiment. It becomes slower than the reverse speed of. Therefore, the time until the electronic component W is peeled from the wafer sheet S becomes longer, and the number of electronic components W that can be acquired by the collet 12 per unit time is reduced.

Then, after the needle-like member 23 starts to retract, the suction of the wafer sheet S by the suction head 24 is released, and a command signal is transmitted from the control unit 32, and as shown in FIG. In order to deliver the part W, the wafer ring 14 is moved.
In addition, description of the flow path 26 is abbreviate | omitted in FIG. 4 (A)-(C), FIG. 5 (A), and (B).

Therefore, the electronic component W delivery method for giving the electronic component W affixed to the surface of the wafer sheet S to the collet 12 using the electronic component delivery apparatus 10 includes the following steps.
Step S1: In the pepper pot 22, the suction head 24 is in surface contact with the rear surface region B corresponding to the region A where the plurality of electronic components W are present among the electronic components W attached to the front surface of the wafer sheet S. Thus, the electronic component W is moved forward together with the needle-like member 23 and brought into contact with the suction portion 11 of the collet 12 disposed at the receiving position P.
Step S2: The pepper pot 22 is retracted and moved away from the collet 12 while the wafer sheet S is sucked by the suction head 24, and the needle-like member 23 is stopped at the timing when the pepper pot 22 starts to retract, and the tip portion is sucked. It protrudes from the head 24 and maintains the contact state of the electronic component W with the suction portion 11.

Further, the imaging by the imaging means 31 is performed at a timing when the collet 12 is not arranged at the receiving position P and the collet 12 does not fall within the imaging range. At this time, the needle-like member 23 and the pepper pot 22 are disposed in the retracted position, and the wafer sheet S is adsorbed by the suction head 24.
Here, if the electronic component W acquired by the collet 12 is the first electronic component W, and the electronic component W acquired by the collet 12 is the second electronic component W, then the control unit 32 performs wafer processing. The relationship between the timing for calculating the position correction of the ring 14 and the position correction timing for the wafer ring 14 is as follows.

(1) After the wafer ring 14 completes the position correction for the first electronic component W and before the first electronic component W is acquired by the collet 12, the imaging means 31 An image capturing the second electronic component W is captured.
(2) While performing the acquisition process by the collet 12 of the first electronic component W, the image captured in (1) is transferred from the imaging unit 31 to the control unit 32, and the control unit 32 uses the image as a basis. Next, the position correction of the wafer ring 14 for the second electronic component W is calculated.
(3) A command signal is transmitted from the control unit 32, and the wafer ring 14 performs position correction for the second electronic component W.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and all changes in conditions and the like that do not depart from the gist are within the scope of the present invention.
For example, when the pepper pot moves in the first direction together with the needle-like member in a surface contact with the wafer sheet, the wafer pot may not attract the wafer sheet.

Further, the pickup unit may be provided with only one collet 12 as shown in FIG. In the pickup unit shown in FIG. 6A, the collet 12 that has acquired the electronic component W at the 3 o'clock position moves counterclockwise together with the arm 19, and the acquired electronic component W is delivered to another device at the 12 o'clock position. The electronic component W is newly acquired at the 3 o'clock position by moving clockwise. In the example shown in FIG. 6A (the same applies to the example shown in FIG. 6B), the same components as those of the electronic component delivery apparatus 10 are denoted by the same reference numerals and detailed description thereof is omitted.

And the wafer ring 14 may be provided so that the wafer sheet S may be arrange | positioned horizontally, as shown to FIG. 6 (B). In this case, the pepper pot 22 and the needle-like member 23 are raised, and the electronic component W is transferred to the collet 12 by pressing the electronic component W against the collet 12 disposed at the 6 o'clock position. The pickup unit shown in FIG. 6B has two collets 12 arranged on the same axis, and after one collet 12 acquires the electronic component W at the 6 o'clock position, the two collets 12 rotate counterclockwise. The collet 12 that has rotated 180 degrees and acquired the electronic component W delivers the electronic component W to another device at the 12 o'clock position, and the collet 12 disposed at the 6 o'clock position acquires the electronic component W.

Further, the flat surface of the suction head is not limited to a circle, and may be, for example, a polygonal shape.
The first and second directions need not be the forward direction and the backward direction, respectively. For example, the first and second directions may be the upward direction and the downward direction, respectively.
Further, the movement path of the collet is not limited to the arcuate path, and the pepperpot and the needle-like member may start moving in the first direction after the collet is arranged at the receiving position.
Further, the needle-like member may have a portion (for example, a base end portion) other than the tip portion outside the pepper pot in a state where the tip portion is accommodated in the inner space portion. There may be a plurality of needle-like members protruding from the pepper pot, or one electronic component may be sandwiched between the plurality of needle-like members and the collet.
Further, the collet does not need to have a tapered shape at the front end side. For example, a collet having a rectangular parallelepiped shape or a collet in which the periphery of the suction port protrudes toward the wafer sheet from the suction port may be employed.

10: Electronic component delivery device, 11: Suction unit, 12: Collet, 13: Sheet pressing means, 14: Wafer ring, 14a: Motor, 15: Pickup unit, 16: Motor, 17: Support base, 18: Rotating shaft, 19: Arm, 20: Collet support, 21: Suction port, 22: Pepper pot, 23: Needle member, 24: Suction head, 25: Hollow member, 26: Channel, 27: Flat surface, 28: Through hole , 29: inner space part, 30: prism, 31: imaging means, 32: control part, P: receiving position, Q: orientation flat, S: wafer sheet, W: electronic component

The present invention relates to an electronic component delivery apparatus that adsorbs an electronic component affixed to a wafer sheet to a collet.

One electronic component to be delivered among many electronic components attached to the front surface of the wafer sheet is pressed by a needle-like member on the back surface of the wafer sheet corresponding to the position of the electronic component. The wafer sheet is projected to the front side and delivered to the collet. This is to facilitate peeling of the electronic component from the wafer sheet, and a specific example thereof is described in Patent Document 1, for example.
The pickup device described in Patent Document 1 pushes up the wafer sheet toward the collet with a push-up piece, brings an electronic component (chip) to be sucked into contact with the collet, and then lowers the push-up piece to form a needle shape from the push-up piece. The member (push-up needle) is in a protruding state.

Japanese Patent Laid-Open No. 11-186298

However, in the pickup device described in Patent Document 1, only the area for one electronic component to be attracted to the collet on the wafer sheet is pushed up by the push-up piece, so the position of the push-up piece and the position of the electronic component to be pushed up Does not match, the electronic component cannot be pushed up to a predetermined position, and the electronic component is not attracted to the collet.
This invention is made | formed in view of this situation, and it aims at providing the electronic component delivery apparatus which can adsorb | suck an electronic component to a collet stably.

An electronic component delivery apparatus according to the present invention that meets the above-described object includes a collet having a suction portion arranged at a receiving position on the front side of a wafer sheet having a large number of electronic components attached to the surface, and pressing the wafer sheet from the back side. In the electronic component delivery apparatus comprising sheet pressing means for bringing the electronic component closer to the collet, the sheet pressing means includes a plurality of the electronic components among the electronic components attached to the surface of the wafer sheet. A suction head that is in surface contact with the rear surface area B corresponding to the existing area A, and a second direction in the first direction approaching the receiving position from the back side of the wafer sheet and a second direction opposite to the first direction; A pepper pot movably provided in the direction, and a tip provided in the suction head and movably provided in the first and second directions. And the pepperpot moves in the first direction together with the needle-shaped member in a state where the suction head is in surface contact with the region B on the back surface of the wafer sheet. One electronic component in the area A is brought into contact with the suction portion of the collet arranged at the receiving position, and the wafer sheet is sucked by the suction head and moved in the second direction to move the electronic component. The needle-shaped member is moved away from the collet, and stops at the timing when the pepper pot starts to move in the second direction. The tip projects from the suction head to the suction portion of the one electronic component. The collet has the needle-like member that has maintained the contact state of the electronic component with the suction portion after the one electronic component contacts the suction portion. Direction Stationary until the start of movement, moves from the receiving position the first, in a direction other than the second direction.

In the electronic component delivery apparatus according to the present invention, the pepper pot is in surface contact with the rear surface region B corresponding to the region A where a plurality of electronic components are present among the electronic components attached to the front surface of the wafer sheet. In this state, it moves in the first direction together with the needle-like member to bring one electronic component in the region A into contact with the suction part of the collet arranged at the receiving position. The collet can be brought into contact with the adsorbing portion in a state of being arranged at the position.
Then, the pepper pot moves in the second direction while sucking the wafer sheet with the suction head and moves away from the collet, and the needle-like member stops at the timing when the pepper pot starts to move in the second direction. Since the tip part protrudes from the suction head and maintains the contact state of the electronic component to be delivered to the suction part, the wafer sheet can be easily peeled off from the electronic part in contact with the suction part. Can be stably adsorbed on the collet.

It is explanatory drawing of the electronic component delivery apparatus which concerns on one embodiment of this invention. It is explanatory drawing of the wafer sheet in which the electronic component was affixed. It is explanatory drawing of a sheet | seat pushing means. (A)-(C) is explanatory drawing which shows the mode of delivery of an electronic component, respectively. (A), (B) is explanatory drawing which shows the mode of delivery of an electronic component, respectively. (A) is explanatory drawing which shows the modification of a pickup unit, (B) is explanatory drawing which shows the example which arranges a wafer sheet horizontally.

Next, embodiments of the present invention will be described with reference to the accompanying drawings for understanding of the present invention.
As shown in FIGS. 1 and 3, an electronic component delivery apparatus 10 according to an embodiment of the present invention includes a collet 12 having a suction portion 11 disposed at a receiving position P on the front side of a wafer sheet S, and a wafer sheet. It is an apparatus comprising sheet pressing means 13 that pushes a part of S from the back side to bring the electronic component W closer to the collet 12. Details will be described below.

As shown in FIGS. 1 and 2, the electronic component delivery apparatus 10 includes a wafer ring 14 that supports a wafer sheet S having a large number of electronic components W attached to the surface thereof, a pickup unit 15 having a plurality of collets 12, and the like. It has.
Each electronic component W whose back surface is attached to the wafer sheet S is separated by dicing, and as shown in FIG. 2, the wafer sheet S is arranged along the vertical plane. On the surface of S, a row of a plurality of electronic components W in which the electronic components W are arranged in the left-right direction is arranged in the vertical direction (vertical direction). In the present embodiment, a gap of 30 to 100 μm is provided between the electronic components W.

As shown in FIGS. 1 and 2, the wafer ring 14 fixes the outer edge portion of the wafer sheet S and vertically arranges the wafer sheet S in a state where the orientation flat Q of the wafer sheet S is arranged on the lower side. The wafer ring 14 moves in the left-right direction and the vertical direction together with the wafer sheet S by the operation of the motor 14a.
As shown in FIG. 1, the pickup unit 15 is disposed on the front side (front side) of the wafer sheet S and includes a support base 17 to which a motor 16 is fixed. A horizontally-arranged rotating shaft 18 to which a rotational force is applied from the motor 16 is attached to the support base 17.

A collet support 20 having a plurality of arms 19 is fixed to the rotating shaft 18, and one collet 12 is attached to the tip side of each arm 19. The tips of the collets 12 are arranged at equal intervals along an imaginary circle, and each collet 12 is provided on the tip side where the suction part 11 having the air inlet 21 is tapered as shown in FIG. The suction part 11 can hold the electronic component W by vacuum pressure (negative pressure) and can release the suction of the electronic component W by opening to the atmosphere or by positive pressure.

As shown in FIG. 1, the collet 12 intermittently moves along an arc-shaped path by the operation of the motor 16, and is sequentially disposed facing the surface of the wafer sheet S and attached to the wafer sheet S. The electronic component W can be picked up. A position where the collet 12 is disposed to face the surface of the wafer sheet S is referred to as a “receiving position P”.
In the present embodiment, four collets 12 are provided, but the number of collets 12 is not limited to four.

As shown in FIGS. 1 and 3, the sheet pressing means 13 includes a paper pot 22 that is arranged on the back side (rear side) of the wafer sheet S and that is long in the front-rear direction, and a front-rear direction accommodated in the paper pot 22. And a long needle-like member 23. The pepper pot 22 and the needle-like member 23 are arranged in a direction in which the axis (longitudinal direction) is orthogonal to the wafer sheet S.
Each of the pepper pot 22 and the needle-like member 23 is provided so as to be able to advance and retreat by a known mechanism having a motor, a cam, and a cam follower, and moves forward (moves in the first direction) to approach the receiving position P and move backward. By moving (moving in the second direction opposite to the first direction), it moves away from the receiving position P.

As shown in FIG. 3, the pepper pot 22 includes a suction head 24 that is in surface contact with the back surface of the wafer sheet S, and a hollow member 25 that is long in the front-rear direction with the suction head 24 attached to the front side.
As shown in FIGS. 2 and 3, the suction head 24 has a cylindrical shape. The suction head 24 includes a through hole 28 along the axis of the suction head 24 and a front and rear direction around the through hole 28. A plurality of flow paths 26 penetrating therethrough are formed. The hollow member 25 is provided with an inner space portion 29 that accommodates the needle-like member 23, and each rear end of the through hole 28 and the plurality of flow paths 26 reaches the inner space portion 29. The tip of the needle-like member 23 is disposed in the through hole 28, and the tip of the needle-like member 23 projects forward from the suction head 24 as the needle-like member 23 moves forward with respect to the pepper pot 22. .

As shown in FIGS. 2 and 3, the suction head 24 is provided with a circular flat surface 27 in surface contact with the wafer sheet S at the front end, and the front ends of the through holes 28 and the plurality of flow paths 26 are flat surfaces 27. Has reached.
The flat surface 27 has the same size as the region A in which a plurality of electronic components W are bonded among all the electronic components W bonded to the wafer sheet S. Accordingly, when the pepper pot 22 advances in a state where the flat surface 27 of the suction head 24 is in surface contact with the region B on the back surface of the wafer sheet S corresponding to the region A, the region B of the wafer sheet S in surface contact with the flat surface 27. At the same time, the plurality of electronic components W in the region A are pushed forward.
The front end of each flow path 26 is in a state covered with the wafer sheet S in which the flat surface 27 of the suction head 24 is in surface contact, and sucks air in the inner space 29 and the plurality of flow paths 26 (not shown). By the operation of the vacuum pump, the suction head 24 sucks the wafer sheet S in surface contact.

Further, as shown in FIG. 1, the electronic component delivery apparatus 10 images a plurality of electronic components W attached to the region A on the surface of the wafer sheet S with which the suction head 24 is in surface contact via the prism 30. An image pickup means 31 and a control unit 32 that transmits a command signal for adjusting the position of the wafer ring 14 based on an image picked up by the electronic component W are provided. The control unit 32 can be configured to include a CPU and a memory. The control unit 32 detects the position of the electronic component W from the image captured by the imaging unit 31 and moves and moves the wafer ring 14 (hereinafter, “wafer ring 14” Is also referred to as “position correction” and a command signal is transmitted to the motor 14a.

Next, a process in which the collet 12 acquires the electronic component W from the wafer sheet S will be described.
First, the motor 14a is actuated by transmission of a command signal from the control unit 32, and the wafer ring 14 is moved. As shown in FIG. The electronic component W is referred to as “the electronic component W to be delivered”). The center of the flat surface 27 of the suction head 24, that is, the through hole 28 is formed in the region of the back surface of the wafer sheet S on which the surface is disposed. Place it in the correct position.
While the wafer ring 14 is moving, the suction of the wafer sheet S by the suction head 24 is released, and the tip of the needle-like member 23 is not protruding from the suction head 24.

After the movement of the wafer ring 14 is completed, the suction of the wafer sheet S by the suction head 24 is started, and the pepper pot 22 and the needle-like member 23 start moving forward. Hereinafter, the positions of the pepper pot 22 and the needle-like member 23 before the pepper pot 22 and the needle-like member 23 start to advance are referred to as “retreat positions”.
In the pepper pot 22, the suction head 24 sucks the back surface area B corresponding to the area A on which the plurality of electronic components W including the electronic components W to be transferred to the wafer sheet S are attached to the front surface. In this state, the needle-shaped member 23 moves forward together with the needle-shaped member 23 at the same speed.

Before the pepper pot 22 and the needle-like member 23 start moving forward, the one collet 12 moves along the arcuate path and approaches the receiving position P from another position.
Therefore, the pepper pot 22 and the needle-like member 23 start to advance at the timing when the collet 12 approaches the receiving position P. This is to shorten the time until the collet 12 acquires the electronic component W.

The pepper pot 22 and the needle-like member 23 move forward by a predetermined distance, and as shown in FIG. 4B, the electronic component W to be delivered (one electronic component W) of the collet 12 disposed at the receiving position P It is brought into contact with the suction part 11 and stopped. The collet 12 sucks the electronic component W to be delivered, which is in contact with the suction portion 11, by vacuum pressure.

Then, as shown in FIG. 4C, the pepper pot 22 moves backward while continuing the suction of the back surface of the wafer sheet S, and moves away from the collet 12 disposed at the receiving position P. On the other hand, the needle-like member 23 stops at the timing when the pepper pot 22 starts to retract, the tip protrudes from the suction head 24, and presses the electronic component W against the collet 12, that is, the collet 12 of the electronic component W. The state of contact with the adsorbing portion 11 is maintained.

Here, the tip of the needle-like member 23 is in contact with the wafer sheet S, and the contact area thereof is smaller than the area of the back surface of the electronic component W. Accordingly, in the region where the back surface of the electronic component W to be delivered is pasted on the wafer sheet S, the portion that is not in contact with the needle-like member 23 is pulled backward, that is, away from the electronic component W. Become. Therefore, the electronic component W to be delivered is in a state where it is easily peeled off from the wafer sheet S.

In addition, since the area of the wafer sheet S that is in contact with the outer peripheral portion of the flat surface 27 of the suction head 24 is attracted to the suction head 24, the suction head 24 is used by the needle-like member 23 as compared with the case where the wafer sheet S is not attracted to the suction head 24. The inclination angle with respect to the back surface of the electronic component W in the region separated from the 24 flat surfaces 27 increases. Therefore, the electronic component W to be delivered can be surely easily peeled off from the wafer sheet S.

Then, the suction force of the electronic component W by the collet 12 is such that the front surface portion corresponding to the portion where the tip of the needle-like member 23 of the wafer sheet S is in contact with the back surface is stuck to the electronic component W to be delivered. Therefore, when the needle-like member 23 moves backward, the electronic component W to be delivered that is attracted to the collet 12 is peeled from the wafer sheet S as shown in FIG. The needle-like member 23 is retracted to the retracted position, and the distal end portion is accommodated in the through hole 28 of the pepper pot 22 arranged at the retracted position (the distal end portion of the needle-like member 23 does not protrude from the pepper pot 22). State).

The collet 12 stops until the needle-like member 23 that has maintained the contact state of the electronic component W to the suction portion 11 after the electronic component W to be delivered contacts the suction portion 11 starts to move backward. Will be.
In the present embodiment, the collet 12 that has attracted the electronic component W moves away from the receiving position P before the needle-like member 23 moves back to the retracted position. This is to increase the number of collets 12 that acquire the electronic component W per unit time.

Here, the collet 12 is designed to be movable in the front-rear direction, and the tip of the needle-like member 23 protrudes from the pepper pot 22 after the electronic component W to be delivered comes into contact with the suction portion 11 of the collet 12. At the same time, the collet 12 moves forward (moves in a direction in which the suction part 11 of the collet 12 approaches the arm 19), thereby maintaining the state where the electronic component W is pressed against the collet 12 by the needle-like member 23. W can also be kept away from the pepper pot 22. However, in this case, since the collet 12 and the needle-like member 23 need to move at the same speed, the collet 12 and the needle-like member 23 are moved forward at the speed of the pepper pot 22 in the present embodiment. It becomes slower than the reverse speed of. Therefore, the time until the electronic component W is peeled from the wafer sheet S becomes longer, and the number of electronic components W that can be acquired by the collet 12 per unit time is reduced.

Then, after the needle-like member 23 starts to retract, the suction of the wafer sheet S by the suction head 24 is released, and a command signal is transmitted from the control unit 32, and as shown in FIG. In order to deliver the part W, the wafer ring 14 is moved.
In addition, description of the flow path 26 is abbreviate | omitted in FIG. 4 (A)-(C), FIG. 5 (A), and (B).

Therefore, the electronic component W delivery method for giving the electronic component W affixed to the surface of the wafer sheet S to the collet 12 using the electronic component delivery apparatus 10 includes the following steps.
Step S1: In the pepper pot 22, the suction head 24 is in surface contact with the rear surface region B corresponding to the region A where the plurality of electronic components W are present among the electronic components W attached to the front surface of the wafer sheet S. Thus, the electronic component W is moved forward together with the needle-like member 23 and brought into contact with the suction portion 11 of the collet 12 disposed at the receiving position P.
Step S2: The pepper pot 22 is retracted and moved away from the collet 12 while the wafer sheet S is sucked by the suction head 24, and the needle-like member 23 is stopped at the timing when the pepper pot 22 starts to retract, and the tip portion is sucked. It protrudes from the head 24 and maintains the contact state of the electronic component W with the suction portion 11.

Further, the imaging by the imaging means 31 is performed at a timing when the collet 12 is not arranged at the receiving position P and the collet 12 does not fall within the imaging range. At this time, the needle-like member 23 and the pepper pot 22 are disposed in the retracted position, and the wafer sheet S is adsorbed by the suction head 24.
Here, if the electronic component W acquired by the collet 12 is the first electronic component W, and the electronic component W acquired by the collet 12 is the second electronic component W, then the control unit 32 performs wafer processing. The relationship between the timing for calculating the position correction of the ring 14 and the position correction timing for the wafer ring 14 is as follows.

(1) After the wafer ring 14 completes the position correction for the first electronic component W and before the first electronic component W is acquired by the collet 12, the imaging means 31 An image capturing the second electronic component W is captured.
(2) While performing the acquisition process by the collet 12 of the first electronic component W, the image captured in (1) is transferred from the imaging unit 31 to the control unit 32, and the control unit 32 uses the image as a basis. Next, the position correction of the wafer ring 14 for the second electronic component W is calculated.
(3) A command signal is transmitted from the control unit 32, and the wafer ring 14 performs position correction for the second electronic component W.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and all changes in conditions and the like that do not depart from the gist are within the scope of the present invention.
For example, when the pepper pot moves in the first direction together with the needle-like member in a surface contact with the wafer sheet, the wafer pot may not attract the wafer sheet.

Further, the pickup unit may be provided with only one collet 12 as shown in FIG. In the pickup unit shown in FIG. 6A, the collet 12 that has acquired the electronic component W at the 3 o'clock position moves counterclockwise together with the arm 19, and the acquired electronic component W is delivered to another device at the 12 o'clock position. The electronic component W is newly acquired at the 3 o'clock position by moving clockwise. In the example shown in FIG. 6A (the same applies to the example shown in FIG. 6B), the same components as those of the electronic component delivery apparatus 10 are denoted by the same reference numerals and detailed description thereof is omitted.

And the wafer ring 14 may be provided so that the wafer sheet S may be arrange | positioned horizontally, as shown to FIG. 6 (B). In this case, the pepper pot 22 and the needle-like member 23 are raised, and the electronic component W is transferred to the collet 12 by pressing the electronic component W against the collet 12 disposed at the 6 o'clock position. The pickup unit shown in FIG. 6B has two collets 12 arranged on the same axis, and after one collet 12 acquires the electronic component W at the 6 o'clock position, the two collets 12 rotate counterclockwise. The collet 12 that has rotated 180 degrees and acquired the electronic component W delivers the electronic component W to another device at the 12 o'clock position, and the collet 12 disposed at the 6 o'clock position acquires the electronic component W.

Further, the flat surface of the suction head is not limited to a circle, and may be, for example, a polygonal shape.
The first and second directions need not be the forward direction and the backward direction, respectively. For example, the first and second directions may be the upward direction and the downward direction, respectively.
Further, the movement path of the collet is not limited to the arcuate path, and the pepper pot and the needle-like member may start moving in the first direction after the collet is arranged at the receiving position.
Further, the needle-like member may have a portion (for example, a base end portion) other than the tip portion outside the pepper pot in a state where the tip portion is accommodated in the inner space portion. There may be a plurality of needle-like members protruding from the pepper pot, or one electronic component may be sandwiched between the plurality of needle-like members and the collet.
Further, the collet does not need to have a tapered shape at the front end side. For example, a collet having a rectangular parallelepiped shape or a collet in which the periphery of the suction port protrudes toward the wafer sheet from the suction port may be employed.

10: Electronic component delivery device, 11: Suction unit, 12: Collet, 13: Sheet pressing means, 14: Wafer ring, 14a: Motor, 15: Pickup unit, 16: Motor, 17: Support base, 18: Rotating shaft, 19: Arm, 20: Collet support, 21: Suction port, 22: Pepper pot, 23: Needle member, 24: Suction head, 25: Hollow member, 26: Channel, 27: Flat surface, 28: Through hole , 29: inner space part, 30: prism, 31: imaging means, 32: control part, P: receiving position, Q: orientation flat, S: wafer sheet, W: electronic component

Claims (4)

A collet having a suction portion disposed at a receiving position on the front side of a wafer sheet on which a large number of electronic components are bonded, and sheet pressing means for pressing the wafer sheet from the back side to bring the electronic component closer to the collet. In the electronic component delivery device provided,
The sheet pressing means has a suction head that is in surface contact with a back surface region B corresponding to a region A in which a plurality of the electronic components are present among the electronic components attached to the surface of the wafer sheet, A pepper pot movably provided in a first direction approaching the receiving position from the back side of the wafer sheet and in a second direction opposite to the first direction;
A needle-like member provided so as to be movable in the first and second directions, and having a tip portion accommodated in the suction head capable of protruding from the suction head;
The pepper pot moves in the first direction together with the needle-shaped member in a state where the suction head is in surface contact with the area B on the back surface of the wafer sheet, and moves the one electronic component in the area A, In contact with the suction portion of the collet disposed at the receiving position, the wafer sheet is sucked by the suction head and moved in the second direction to move away from the collet,
The needle-like member stops at a timing when the pepper pot starts to move in the second direction, the tip portion projects from the suction head, and the contact state of the one electronic component to the suction portion is established. An electronic component delivery device characterized by maintaining. 2. The electronic component delivery apparatus according to claim 1, wherein when the needle pot moves in the first direction together with the needle-like member, the pepper pot sucks the back surface of the wafer sheet in surface contact with the suction head. An electronic component delivery apparatus characterized by being provided. 3. The electronic component delivery apparatus according to claim 1 or 2, wherein the collet maintains the contact state of the electronic component with the suction portion after the one electronic component contacts the suction portion. The electronic component delivery apparatus, wherein the member is stationary until the member starts moving in the second direction. The electronic component delivery apparatus according to any one of claims 1 to 3, wherein the collet moves along an arc-shaped path from another position to approach the receiving position, and the pepper pot and the needle-shaped member are The electronic component delivery device according to claim 1, wherein the movement in the first direction is started at a timing when the collet approaches the receiving position.

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