TW201923928A - Electronic component delivery device - Google Patents

Abstract

An electronic component delivery device (10) for which a vacuum-chucking unit (11) of a collet (12) is arranged at a receiving position (P) on the front side of a wafer sheet (S) having a large number of electronic components (W) adhered to the surface thereof, wherein the electronic component delivery device (10) comprises: a pepper pot (22) provided to be able to move in a first direction approaching the receiving position (P) from the rear side of the wafer sheet (S) and a second direction that is the direction opposite the first direction; and a needle-form member (23) that can move in the first and second directions, it being possible for the tip part of the needle-form member (23) to protrude from the pepper pot (22). In a state in which planar contact is is made with a region B of the rear surface corresponding to a region A for which a plurality of the electronic components (W) of the wafer sheet (S) are adhered to the front surface, the pepper pot (22): moves in the first direction together with the needle-form member (23) so that one of the electronic components (W) is made to contact the vacuum-chucking unit (11) of the collet (12) arranged at the receiving position (P); and, once the wafer sheet (S) has been suctioned, moves in the second direction, and the needle-like member (23) becomes static and preserves the state of contact of the electronic component (W) on the vacuum-chucking unit (11).

Description

Electronic parts receiving device

The present invention relates to an electronic component receiving / sending device for attaching an electronic component attached to a wafer sheet to a collet.

One of the electronic components to be received and received among the plurality of electronic components attached to the surface of the wafer sheet is pressed by a needle-like member on the inside of the wafer sheet corresponding to the position of the electronic part, and becomes more inferior to other electronics. The part is more protruded from the front side of the wafer sheet, and is received by the chuck. This is to make the electronic component easily peeled from the wafer sheet, and a specific example thereof is described in Patent Document 1, for example. The pick-up device described in Patent Document 1 pushes a wafer sheet toward a chuck with a top block, and after the electronic component (wafer) as a target of adsorption is brought into contact with the chuck, the top block is lowered into a needle shape. The state where the member (thimble) protrudes from the top block. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Application Laid-Open No. 11-186298

[Technical problem to be solved by the invention]

However, with the pick-up device described in Patent Document 1, the area of the range of one electronic component that is only the target of the chuck adsorption on the wafer sheet is pushed up by the top block, so it is at the position of the top block. When the position of the electronic part to be pushed is not consistent, there is a problem that the electronic part cannot be pushed to a predetermined position, and the electronic part cannot be attracted to the chuck. The present invention has been made in view of such circumstances, and it is an object of the present invention to provide an electronic component receiving device capable of stably attracting electronic components to a chuck. [Technical solution to solve the problem]

The electronic component receiving and receiving device according to the present invention in accordance with the foregoing object is: a chuck having a suction portion provided at a receiving position on a front side of a wafer sheet to which a plurality of electronic components are attached; and a sheet pressing means, An electronic part receiving and delivering device is characterized in that said wafer pressing means is provided with a pepper pot, which has a surface contact in the A suction head corresponding to a region B inside a region A of a plurality of the electronic components among the electronic components attached to the surface of the wafer sheet is provided so as to be able to approach the receiver from the back side of the wafer sheet. The first direction of the position and the second direction opposite to the first direction are moved; and the needle-like member is provided so as to be movable toward the first and second directions, and is accommodated in the front end portion of the suction head. Protrudes from the suction head; the ejector canister is in a state where the suction head surface is in contact with the area B inside the wafer sheet, and the needle-shaped structure Moving toward the first direction together, bringing one of the electronic components in the area A into contact with the suction portion of the chuck arranged at the receiving position, and sucking the wafer sheet by the suction head Moving toward the second direction and away from the chuck, the needle-shaped member is stationary at the timing when the thimble can starts moving in the second direction, the front end portion protrudes from the suction head, and maintains the adsorption of the one electronic component to the suction. The contact status of the department. [Effect of the invention]

In the electronic component receiving and dispensing device of the present invention, the thimble can is in a state where the head surface is in contact with the area B inside the area A corresponding to the plurality of electronic components among the electronic components that are attached to the surface of the wafer sheet. Since the electronic component is moved in the first direction together with the needle-shaped member, and an electronic component in the area A is brought into contact with the suction portion of the chuck arranged at the receiving position, the electronic component as the receiving object can be reliably arranged in the The state of the predetermined position is in contact with the suction part of the chuck. In addition, the thimble can is moved away from the chuck in a state where the wafer sheet is attracted by the suction head, and the needle-shaped member is stationary at the timing when the thimble can starts moving in the second direction, and the tip end is moved from the suction head. It protrudes and maintains the contact state of the receiving and receiving electronic parts with the suction part, so that the electronic parts contacting the suction part can be easily peeled from the wafer sheet, and the electronic parts can be stably sucked into the chuck.

Next, specific embodiments will be described with reference to the accompanying drawings to understand the present invention. As shown in FIGS. 1 and 3, an electronic component receiving and dispensing device 10 according to an embodiment of the present invention is a device including a chuck 12 having a receiving position P disposed on the front side of a wafer sheet S. The suction section 11 and the sheet pressing means 13 press a part of the wafer sheet S from the back side to bring the electronic component W close to the chuck 12. The details are described below.

The electronic component receiving and dispensing device 10 includes, as shown in FIGS. 1 and 2, a wafer ring 14 for supporting a wafer sheet S having a plurality of electronic components W attached to its surface, and a pickup unit 15. , Has a plurality of chucks 12. Each electronic component W attached to the wafer sheet S on the inside is singulated and singulated, and as shown in FIG. 2, the wafer sheet S is arranged on the wafer sheet in a state where the wafer sheet S is arranged along a vertical plane. The surface of S is aligned in the vertical direction (up-down direction), and a plurality of electronic parts W are arranged in which the electronic parts W are arranged in the left-right direction. In this embodiment, a gap of 30 to 100 μm is provided between the electronic components W.

As shown in FIGS. 1 and 2, the wafer ring 14 fixes the outer edge portion of the wafer sheet S, and arranges the wafer sheet S with the orientation plane Q of the wafer sheet S on the lower side. For vertical. The wafer ring 14 is moved in the left-right direction and the vertical direction together with the wafer sheet S by the operation of the motor 14a. The pick-up unit 15 includes, as shown in FIG. 1, a support base portion 17 which is arranged on the front side (front side) of the wafer sheet S and has a motor 16 fixed thereto. A rotary shaft 18 is mounted on the support base 17 in a horizontal arrangement to which a rotational force from the motor 16 is applied.

A chuck support 20 is fixed to the rotation shaft 18. The chuck support 20 includes a plurality of arm portions 19, and a chuck 12 is mounted on a front end side of each arm portion 19. The distal ends of the chucks 12 are arranged at equal intervals along an imaginary circle. As shown in FIG. 3, each of the chucks 12 is provided with an adsorption portion 11 including an air suction port 21 on the tapered distal end side. The suction unit 11 holds and holds the electronic component W by vacuum pressure (negative pressure), and releases the suction of the electronic component W by the atmosphere opening or positive pressure.

As shown in FIG. 1, the chuck 12 is intermittently moved in an arc-like path by the operation of the motor 16, and is sequentially arranged opposite to the surface of the wafer sheet S so as to be capable of being adsorbed and attached to the chuck 12. The state of the electronic component W of the wafer sheet S. The position where the chuck 12 is arranged with respect to the surface of the wafer sheet S is referred to as a "receiving position P". In this embodiment, although four chucks 12 are provided, the number of chucks 12 is not limited to four.

In addition, as shown in FIG. 1 and FIG. 3, the sheet pressing means 13 includes a thimble can 22 that is disposed on the back side (rear side) of the wafer sheet S and is long in the front-rear direction, and is accommodated in the thimble can 22 and front and rear. Directionally long needle-like member 23. The thimble cans 22 and the needle-like members 23 are respectively arranged in directions whose axis (length direction) is orthogonal to the wafer sheet S. The thimble tank 22 and the needle-like member 23 are each provided with a conventional mechanism having a motor, a cam, and a cam follower so as to be able to advance and retreat, approach the receiving position P by moving forward (moving in the first direction), and retreating by (Moves in the second direction opposite to the first direction) and moves away from the receiving position P.

As shown in FIG. 3, the thimble can 22 includes a suction head 24 that is in surface contact with the back surface of the wafer sheet S, and a hollow member 25 with the suction head 24 mounted on the front side and long in the front-rear direction. The suction head 24 is cylindrical as shown in FIG. 2 and FIG. 3, and a through hole 28 is formed in the suction head 24 along the axis of the suction head 24, and the periphery of the through hole 28 is penetrated in the front-rear direction, respectively. Of a plurality of flow paths 26. The hollow member 25 is provided with an inner space portion 29 accommodating the needle-like member 23, and each rear end of the through-hole 28 and the plurality of flow paths 26 reaches the inner space portion 29. The front end portion of the needle-shaped member 23 is disposed in the through hole 28, and the needle-shaped member 23 advances toward the thimble can 22, whereby the front end portion of the needle-shaped member 23 protrudes forward from the suction head 24.

As shown in Figs. 2 and 3, the suction head 24 is provided with a circular flat surface 27 in contact with the wafer sheet S surface at the front end, and the front ends of the through-holes 28 and the plurality of flow paths 26 reach平面 面 27。 Flat surface 27. The flat surface 27 is the same size as the area A to which the plurality of electronic components W are attached out of all the electronic components W attached to the wafer sheet S. Therefore, in a state where the flat surface 27 of the suction head 24 is in surface contact with the area B inside the wafer sheet S corresponding to the area A, when the thimble can 22 advances, the plurality of electronic components W in the area A will be in surface contact with The regions B of the wafer sheet S on the flat surface 27 are pushed out together. The front ends of the respective flow paths 26 are in a state where the flat surface 27 of the suction head 24 is covered by the wafer sheet S in contact with each other, and the air in the inner space portion 29 and the plurality of flow paths 26 are not shown. With the action of the vacuum pump, the suction head 24 will adsorb the wafer sheet S in contact with the surface.

In addition, as shown in FIG. 1, the electronic component receiving and receiving device 10 includes: a photographing means 31 that photographs a plurality of areas A attached to the surface of the wafer sheet S that the suction head 24 is in contact with through the ridge 30. An electronic component W; and a control unit 32, which issues a command signal for adjusting the position of the wafer ring 14 based on an image photographed by the electronic component W. The control unit 32 is configured to have a CPU and a memory, and detects the position of the electronic component W from an image captured by the imaging means 31, and calculates a direction and a distance (hereinafter, referred to as a movement distance) of the wafer ring 14 to be moved. "Position correction of the wafer ring 14"), and sends a command signal to the motor 14a.

Next, a procedure for obtaining the electronic component W from the wafer sheet S by the chuck 12 will be described. First, the motor 14a is operated by the command signal sent from the control unit 32 to move the wafer ring 14, and as shown in FIG. 4 (A), an electronic component W that is the subject of receiving and receiving in the area A will be used. (Hereinafter, this electronic component W is referred to as "the electronic component W to be received".) The inner area of the wafer sheet S disposed on the surface is disposed at the center of the flat surface 27 of the suction head 24, that is, a through hole is formed. 28 position. (2) When the wafer ring 14 is moved, the suction of the wafer sheet S by the suction head 24 is released, and the tip of the needle-like member 23 is not protruding from the suction head 24.

After the movement of the wafer ring 14 is completed, the suction of the wafer sheet S by the suction head 24 starts, and the thimble can 22 and the needle-like member 23 start to advance. The positions of the thimble tank 22 and the needle-shaped member 23 before the thimble tank 22 and the needle-shaped member 23 start to advance are hereinafter referred to as "retracted positions". The thimble tank 22 is in a state in which the suction head 24 is in contact with the area B inside the corresponding area A and is adsorbed. The thimble can 22 advances with the needle-shaped member 23 at the same speed as the needle-shaped member 23. A plurality of electronic components W of the electronic components W of the wafer sheet S to be received and received.

Before the thimble can 22 and the needle-like member 23 start to advance, one chuck 12 moves in an arc-like path to approach the receiving position P from a different position. Therefore, the timing when the thimble can 22 and the needle-like member 23 are tied to the chuck 12 near the receiving position P starts to advance. This is to shorten the time for the chuck 12 to obtain the electronic component W.

The thimble can 22 and the needle-like member 23 advance a predetermined distance, as shown in FIG. 4 (B), so that the electronic component W (one electronic component W) of the receiving target contacts the chuck 12 arranged at the receiving position P. The suction section 11 is stationary. The chuck 12 is an electronic component W which is in contact with the receiving target of the suction section 11 by vacuum pressure suction.

Next, as shown in FIG. 4 (C), the thimble can 22 continuously sucks the inside of the wafer sheet S and moves backward, away from the chuck 12 arranged at the receiving position P. On the other hand, the needle-like member 23 is stationary at the timing when the thimble can 22 starts to retract, and the front end portion protrudes from the suction head 24, and maintains the state in which the electronic component W is pressed against the chuck 12, that is, the position of the electronic component W on the chuck 12 The contact state of the suction part 11.

Here, the tip of the needle-like member 23 is in contact with the wafer sheet S, and the contact area thereof is smaller than the area of the back surface of the electronic component W. Therefore, in the wafer sheet S, a portion of the area where the needle-shaped member 23 is not in contact with the receiving electronic component W is pulled away from the electronic component W toward the rear, that is, away from the electronic component W. Therefore, the electronic component W to be received and received will be easily peeled from the wafer sheet S.

In addition, the region of the wafer sheet S that is in contact with the outer peripheral portion of the flat surface 27 of the suction head 24 is attracted by the suction head 24. Therefore, compared with a case where the suction head 24 is not attracted, The inclination angle of the inside of the electronic component W in a region where the flat surface 27 of the suction head 24 is pulled away is larger. Therefore, the electronic component W to be received can be reliably brought into a state of being easily peeled from the wafer sheet S.

In addition, due to the attractive force of the chuck 12 on the electronic component W, the force applied by the receiving electronic component W to the front surface portion of the portion where the front end portion of the needle-like member 23 corresponding to the wafer sheet S comes into contact with As the needle-shaped member 23 is moved backward, as shown in FIG. 5 (A), the electronic component W to be received by the chuck 12 is peeled from the wafer sheet S. The needle-like member 23 is retracted to the retracted position, and the front end portion is accommodated in the through-hole 28 of the thimble can 22 disposed in the retracted position (the front end portion of the needle-like member 23 does not protrude from the thimble can 22).

The chuck 12 is stationary after the receiving electronic component W comes into contact with the suction section 11 until the needle-shaped member 23 that maintains the contact state of the electronic component W with the suction section 11 starts to retract. In the present embodiment, before the needle-like member 23 is retracted to the retracted position, the chuck 12 that sucks the electronic component W is separated from the receiving position P. This is to increase the number of electronic parts W obtained by the chuck 12 per unit time.

Here, the chuck 12 may be designed to be movable in the front-rear direction, and after the electronic component W to be received is in contact with the suction portion 11 of the chuck 12, the tip portion of the needle-like member 23 is removed from the thimble can 22. The protrusion 12 starts to move forward and the chuck 12 moves forward (moves the suction section 11 of the chuck 12 toward the arm portion 19), thereby maintaining the state in which the electronic component W is pressed against the chuck 12 with the needle member 23 The electronic part W is far from the thimble can 22. However, in this case, since it is necessary to make the chuck 12 and the needle-like member 23 move forward at the same speed, the chuck 12 and the needle-like member 23 move forward at a faster speed than the thimble can 22 of this embodiment. Slower. Therefore, the time for peeling the electronic component W from the wafer sheet S increases, and the number of electronic components W that can be obtained per unit time of the chuck 12 decreases.

Next, after the needle-like member 23 starts to retract, the wafer sheet S caused by the suction head 24 is released from the adsorption, and a command signal is issued from the control unit 32. As shown in FIG. 5 (B), in order to perform the next electronic part When W is received, the wafer ring 14 is moved. In addition, in FIGS. 4 (A) to (C) and FIGS. 5 (A) and (B), the description of the flow path 26 is omitted.

Therefore, using the electronic component receiving and dispensing device 10, a method of receiving and delivering the electronic component W attached to the surface of the wafer sheet S to the electronic component W of the chuck 12 includes the following steps. Step S1: The thimble can 22 is in a state in which the suction head 24 is in contact with the area B inside the area A corresponding to the plurality of electronic parts W among the electronic parts W attached to the surface of the wafer sheet S, and The needle-shaped member 23 advances together, and one electronic component W in the area A is brought into contact with the suction portion 11 of the chuck 12 arranged at the receiving position P. Step S2: The thimble can 22 is retracted away from the chuck 12 and the needle-shaped member 23 when the wafer sheet S is attracted by the suction head 24, and is stopped at the timing when the thimble can 22 starts to retract, and the front end is moved from the suction head 24 protrudes, and maintains the contact state of the electronic component W with the suction portion 11.

The photography performed by the photographing means 31 is performed at a timing when the chuck 12 is not disposed at the receiving position P and the chuck 12 does not enter the imaging range. At this time, the needle-like member 23 and the ejector can 22 are arranged at the retracted positions, and the wafer sheet S is attracted by the suction head 24. Here, if the next electronic component W obtained by the chuck 12 is regarded as the first electronic component W, and the next electronic component W obtained by the chuck 12 is regarded as the second electronic component W, the control unit 32 The relationship between the timing of calculating the position correction of the wafer ring 14 and the timing of the position correction of the wafer ring 14 will be described below.

(1) After the wafer ring 14 completes the position correction for the first electronic component W, and before the chuck 12 obtains the first electronic component W, the photographing means 31 photographs the first electronic component W and the second electronic component W. Image of electronic part W. (2) During the acquisition process of the first electronic component W for the chuck 12, the image captured in (1) is transmitted from the photographing means 31 to the control section 32, and the control section 32 uses The position correction of the wafer ring 14 for the second electronic component W is calculated. (3) A command signal is sent from the control unit 32, and the wafer ring 14 performs position correction for the second electronic component W.

The embodiments of the present invention have been described above. However, the present invention is not limited to the aforementioned forms, and condition changes made without departing from the gist are within the scope of application of the present invention. For example, when the thimble can is moved in the first direction together with the needle-like member in a state where it is in contact with the wafer sheet, the wafer sheet may not be adsorbed.

In addition, as shown in FIG. 6 (A), the pick-up unit may include only one chuck 12. The pickup unit shown in FIG. 6 (A) moves the chuck 12 for acquiring the electronic component W at the 3 o'clock position together with the arm portion 19 counterclockwise, and delivers the obtained electronic part W at the 12 o'clock position. Other devices move clockwise to obtain new electronic parts W at 3 o'clock. In the example shown in FIG. 6 (A) (the same as the example shown in FIG. 6 (B)), the same components as those of the electronic component receiving and receiving device 10 are denoted by the same reference numerals, and detailed descriptions thereof are omitted.

Further, the wafer ring 14 may be provided with the wafer sheet S arranged horizontally as shown in FIG. 6 (B). At this time, the thimble can 22 and the needle-like member 23 are raised, and the electronic component W is pressed against the chuck 12 arranged at the 6 o'clock position, whereby the electronic component W is delivered to the chuck 12. The picking unit shown in FIG. 6 (B) has two chucks 12 arranged on the same axis. After one of the chucks 12 obtains the electronic component W at the 6 o'clock position, the two chucks 12 rotate 180 counterclockwise. The chuck 12 obtained the electronic component W delivers the electronic component W to another device at the 12 o'clock position, and the chuck 12 arranged at the 6 o'clock position obtains the electronic component W.

The flat surface of the suction head is not limited to a circular shape, and may be, for example, a polygon. Also, the first and second directions need not be the forward and rear directions, for example, the first and second directions may be the upward and downward directions, respectively. In addition, the movement path of the chuck is not limited to an arc-shaped path, and the ejector can and the needle-like member may be moved in the first direction after the chuck is disposed at the receiving position. In addition, in a state where the needle-shaped member is accommodated in the inner space portion at the front end portion, a portion other than the front end portion (for example, the base end portion) may be exposed from the thimble can. In addition, a plurality of needle-like members protruding from the thimble can may be used, and a state in which one electronic component is sandwiched by the plurality of needle-like members and the collet may be used. What's more, the front end side of the chuck need not be tapered, for example, a cuboid chuck or a chuck that protrudes toward the wafer sheet side around the suction port than the suction port may be used.

10‧‧‧Electronic parts receiving and receiving device

11‧‧‧ Adsorption Department

12‧‧‧ chuck

13‧‧‧ sheet pressing means

14‧‧‧wafer ring

14a‧‧‧Motor

15‧‧‧Pick up unit

16‧‧‧ Motor

17‧‧‧ support base

18‧‧‧rotation axis

19‧‧‧ arm

20‧‧‧ Collet support

21‧‧‧Suction port

22‧‧‧ thimble can

23‧‧‧ Needle-shaped member

24‧‧‧ Attraction

25‧‧‧ hollow member

26‧‧‧flow

27‧‧‧ flat surface

28‧‧‧through hole

29‧‧‧Inside Space Department

30‧‧‧ 稜鏡

31‧‧‧Photographic means

32‧‧‧Control Department

P‧‧‧Receiving location

Q‧‧‧ Orientation Plane

S‧‧‧ Wafer sheet

W‧‧‧Electronic parts

[Fig. 1] An explanatory diagram of an electronic component receiving and receiving device according to an embodiment of the present invention. [Fig. 2] is an explanatory diagram of a wafer sheet to which electronic components are attached.第 [Fig. 3] is an explanatory diagram of a sheet pressing means.第 [Fig. 4] (A) to (C) are explanatory diagrams respectively showing the receiving and giving of electronic parts.第 [Fig. 5] (A) and (B) are explanatory diagrams respectively showing the receiving and giving of electronic parts. [FIG. 6] (A) is an explanatory diagram showing a modified example of the pick-up unit, and (B) is an explanatory diagram showing an example of arranging the wafer sheet horizontally.

Claims (4)

An electronic component receiving / sending device includes a chuck having a suction portion arranged at a receiving position on a front side of a wafer sheet to which a plurality of electronic components are attached, and a sheet pressing means for pressing the wafer from the back side. The electronic part is brought closer to the chuck by a sheet; characterized in that: the sheet pressing means is provided with: a thimble can having surface contact among a plurality of the electronic parts corresponding to the surface on which the wafer sheet is attached; The suction head of the area B inside the area A of the aforementioned electronic component, and is arranged to be movable in a first direction approaching the receiving position from the back side of the wafer sheet and a second direction opposite to the first direction; And the needle-shaped member is provided so as to be movable in the first and second directions, and the front end portion accommodated in the suction head can protrude from the suction head; the thimble can, the surface of the suction head is in contact with the crystal The state of the area B on the inner side of the circular sheet is moved in the first direction together with the needle-shaped member, One of the electronic components in the area A is brought into contact with the suction part of the chuck arranged at the receiving position, and moved away from the second direction in a state where the wafer sheet is attracted by the suction head. The chuck the needle-shaped member is stationary when the thimble can starts moving in the second direction, the front end portion protrudes from the suction head, and maintains the contact state of the one electronic component with the suction portion. The electronic component receiving and receiving device according to claim 1, wherein: the thimble can is moved in the first direction together with the needle-shaped member when the suction head attracts the suction head to contact the suction head. The state of the inside of the wafer sheet. The electronic component receiving and receiving device according to claim 1 or 2, wherein: the chuck, after the one electronic component contacts the adsorption portion, to the needle-shaped member that maintains the contact state of the electronic component with the adsorption portion It is stationary before starting to move in the second direction. The electronic component receiving and receiving device according to any one of claims 1 to 3, wherein: the chuck moves in an arc-like path to approach the receiving position from a different position, the thimble can and the needle-shaped member are When the chuck approaches the receiving position, the chuck starts moving toward the first direction.