JP7197853B1 - Electronic parts processing equipment - Google Patents

Abstract

An electronic component processing apparatus is provided in which the position and orientation of an electronic component with respect to a processing unit are set to predetermined positions and orientations. A projecting mechanism for projecting an electronic component W attached to a wafer sheet in a J direction, a pickup unit 13 having a component supporter 12 for acquiring the electronic component W projected in the J direction at a pickup position P1, and a receiving position P2. A conveying unit in which the component holding unit 14 moves to the processing positions P7 to P11 by rotation of the rotating body 15 to which the component holding unit 14 for acquiring the electronic component W from the pickup unit 13 is rotated, and the processing positions P7 to P11. In an electronic component processing apparatus 10 including processing units 17 to 21 for performing predetermined processing on electronic components W that have been processed, a first driving mechanism for moving a projecting mechanism parallel to the wafer sheet, and a pickup unit 13 for moving parallel to the wafer sheet. and a third moving mechanism for moving the wafer sheet along the wafer sheet. [Selection drawing] Fig. 2

Description

The present invention relates to an electronic component processing apparatus that performs predetermined processing on electronic components.

An electronic component processing apparatus that performs predetermined processing on electronic components by a processing unit such as an appearance inspection unit includes a pick-up unit (rotary type pick-up mechanism ) and a transport unit (a unit including a turntable or the like) that transports the electronic component obtained from the pickup unit to a processing position where the processing unit is arranged (see Patent Document 1).

The suction nozzle picks up and picks up an electronic component protruded to the front side of the wafer sheet as a result of the back surface of the wafer sheet being poked by a pin (push-up pin). The position of the electronic component sucked by the suction nozzle with respect to the suction nozzle is affected by the position of the projected electronic component before suction with respect to the suction nozzle. The position of the electronic component sucked by the suction nozzle with respect to the suction nozzle affects the position of the electronic component acquired by the transfer unit with respect to the transfer unit.

Here, if the position of the electronic component placed at the processing position by the transport unit with respect to the processing unit is not at a predetermined position, problems such as improper processing by the processing unit occur. Therefore, the position of the electronic component acquired by the transport unit is adjusted by the alignment unit before being transported to the processing position. The alignment unit retrieves the electronic component from the transport unit, adjusts the position of the electronic component, and then returns the electronic component to the transport unit.

JP 2012-119494 A

However, position adjustment of the electronic component by the alignment unit requires a longer time than processing by the processing unit, and as a result, there are problems such as hindering efficient processing of the electronic component.
The present invention has been made in view of such circumstances, and the position and orientation of the electronic component at the processing position with respect to the processing unit are determined in advance without using an alignment unit that acquires the electronic component from the transport unit and adjusts the position of the electronic component. An object of the present invention is to provide an electronic component processing apparatus that can be positioned and oriented in a predetermined position.

According to a first aspect of the present invention, there is provided an electronic component processing apparatus according to a first aspect of the present invention that meets the above object. A pick-up unit having a component support section that picks up the electronic component at a pick-up position facing the wafer sheet; In an electronic component processing apparatus comprising a transfer unit that moves together with a component to a processing position, and a processing unit that performs a predetermined process on the electronic component arranged at the processing position, the projecting mechanism is arranged on a virtual plane parallel to the wafer sheet. A first drive mechanism for moving along E, a second drive mechanism for moving the pickup unit supporting the electronic component by the component support portion along the imaginary plane F parallel to the wafer sheet, a third driving mechanism for moving the wafer sheet within a virtual plane Q containing the wafer sheet; a deviation deriving means for detecting a deviation from a reference position and a reference orientation of the electronic component acquired by the component support; By controlling the first drive mechanism, the second drive mechanism, and the third drive mechanism, the component support unit arranged at the pickup position, and then the electronic component acquired by the component support unit, and and control means for adjusting the position of the projecting mechanism, and the pickup unit rotates the component support portion from the pick-up position to the receiving position by one or more rotations. It has a rotating member for moving to a transfer position facing the component holding section, and the transport unit rotates the component holding section to adjust the orientation of the electronic component acquired by the component holding section with respect to the transport unit. The control means controls the second drive mechanism and the drive rotation mechanism based on the deviation detected by the deviation derivation means, so that the electronic component is at the processing position. It is arranged in a predetermined position and orientation with respect to the processing unit.

According to a second aspect of the present invention, there is provided an electronic component processing apparatus according to a second aspect of the present invention that meets the above object. A pick-up unit having a component support section that picks up the electronic component at a pick-up position facing the wafer sheet; An electronic component processing apparatus comprising: a transport unit that moves to a processing position together with a component; and a processing unit that performs a predetermined process on the electronic component placed at the processing position, wherein the electronic component is supported by the component support portion. A driving mechanism β for moving a pickup unit in a G direction parallel to the wafer sheet or in a direction opposite to the G direction, a driving mechanism γ for moving the wafer sheet within a virtual plane Q including the wafer sheet, and the pickup unit. moving the processing unit in the direction K perpendicular to the direction of the position adjustment of the electronic component made by the movement of , or in the direction opposite to the direction K, and moving the processing unit to the electronic component placed at the processing position A drive mechanism δ for adjusting the position in the K direction, a deviation deriving means for detecting a deviation from the reference position and the reference orientation of the electronic component acquired by the component support portion, and the drive mechanism β and the drive mechanism γ. a control means for controlling and adjusting the positions of the component support section arranged at the pick-up position and the position of the electronic component to be subsequently acquired by the component support section, wherein the transport unit moves the component support section; a drive rotation mechanism that rotates to adjust the orientation of the electronic component acquired by the component holding unit with respect to the transport unit; The mechanism β, the drive mechanism δ and the drive rotation mechanism are controlled such that the electronic component is positioned and oriented with respect to the processing unit at the processing position.

According to the electronic component processing apparatus according to the first and second inventions, the position and orientation of the electronic component can be adjusted in a state where the electronic component is acquired (supported) by the component support section or the component holding section, and the electronic component can be transported from the conveying unit. It is possible to set the position and orientation of the electronic component at the processing position to a predetermined position and orientation with respect to the processing unit without using an alignment unit that obtains and aligns the electronic component.

BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing of the electronic component processing apparatus which concerns on the 1st Embodiment of this invention. FIG. 4 is an explanatory diagram showing the arrangement of processing units and pickup units with respect to a rotating body; FIG. 4 is an explanatory diagram of acquisition and delivery of an electronic component by a pickup unit; 4 is a block diagram showing connections of control means; FIG. (A) and (B) are an explanatory diagram showing the position of the pickup unit with respect to the electronic component arranged at the transfer position and an explanatory diagram of the projecting mechanism, respectively. FIG. 5 is an explanatory diagram showing rotation of a component support portion of the pickup unit; It is a flow figure which shows the flow of an electronic component acquisition process. FIG. 4 is a flow chart showing the flow of electronic component delivery processing; It is explanatory drawing of the electronic component processing apparatus which concerns on the 2nd Embodiment of this invention. FIG. 4 is an explanatory diagram showing the arrangement of processing units and pickup units with respect to a rotating body; FIG. 4 is an explanatory diagram of acquisition and delivery of an electronic component by a pickup unit; 4 is a block diagram showing connections of control means; FIG. FIG. 4 is an explanatory diagram showing directions in which the pickup unit moves; FIG. 5 is an explanatory diagram showing rotation of a component support portion of the pickup unit; It is a flow figure which shows the flow of an electronic component acquisition process. FIG. 4 is a flow chart showing the flow of electronic component delivery processing; FIG. 4 is a flow diagram showing a flow of processing electronic components by a processing unit; It is explanatory drawing of the modification which has a drive rotation mechanism.

Next, specific embodiments of the present invention will be described with reference to the attached drawings for better understanding of the present invention.

As shown in FIGS. 1, 2 and 3, the electronic component processing apparatus 10 according to the first embodiment of the present invention removes the electronic components W attached to the surface (front surface) of the wafer sheet H from the wafer sheet H. A pickup having a projecting mechanism 11 projecting from the back surface (rear surface) side of the wafer sheet H in the J direction perpendicular to , and a component support portion 12 that acquires the electronic component W projected in the J direction at a pickup position P1 facing the wafer sheet H. The rotating body 15 to which the component holding part 14 for acquiring the electronic component W from the pickup unit 13 at the receiving position P2 of the unit 13 is rotated, so that the component holding part 14 moves along with the electronic component W to the processing positions P7, P8, P9, P10, Equipped with a transport unit 16 that moves to P11, and processing units 17, 18, 19, 20, and 21 that perform predetermined processing on electronic components W placed at processing positions P7, P8, P9, P10, and P11, respectively. . A detailed description will be given below.

As shown in FIGS. 1, 2, and 3, the pickup unit 13 is provided below the rotating body 15, and is a disk-shaped rotating member 23 that rotates together with a rotating shaft 22 that is rotatably supported by a supporting body 21a. Each has a plurality of component support portions 12 which are provided so as to be able to advance and retreat in the radial direction with respect to the rotating member 23 . There are a plurality of component support portions 12, each of which has a tubular shape. Each component support portion 12 is radially provided so that the axial center is aligned with the advance/retreat direction of the component support portion 12, and is arranged at equal intervals along the outer edge of a virtual circle centered on the rotation shaft 22. Needless to say, the component support portion 12 is not limited to a cylindrical shape, and may be rectangular parallelepiped or cubic, for example.

In this embodiment, the four component support portions 12 are positioned at 3 o'clock position, 6 o'clock position (180° position), 9 o'clock position, and 12 o'clock position (0° position) at 90° intervals around the rotating member 23 . is provided in As shown in FIG. 3, coil springs 24 are attached in the vicinity of the component support portions 12 to apply force in the direction opposite to the moving direction to the component support portions 12 moved toward the center of the rotating member 23. It is 2 and 5A, illustration of the coil spring 24 and the like of the component support portion 12 is omitted.

In the present embodiment, each component support portion 12 is a suction nozzle that sucks the electronic component W by vacuum pressure (negative pressure) and cancels the sucked state of the electronic component W by release to the atmosphere or positive pressure. Each component support portion 12 intermittently rotates along an arc-shaped path by 90° as the rotating member 23 is intermittently rotated by repeating the operation and stop of the motor 51 shown in FIG. It is moved and sequentially placed at a pickup position P1 (6 o'clock position, 180° position) facing the wafer sheet H having a large number (plurality) of electronic components W attached to its surface.

In the present embodiment, the wafer sheet H is horizontally arranged at a position that is a distance from the pickup unit 13 immediately below the pickup unit 13 . Electronic components W are, for example, diodes, transistors, capacitors, inductors, and ICs (Integrated Circuits). As shown in FIGS. 3 and 6, the electronic component W has two parallel surfaces W1 and W2, and is attached to the wafer sheet H with the surface W1 in close contact with the surface of the wafer sheet H. As shown in FIGS.

As shown in FIGS. 3 and 5A, the pickup unit 13 and the support 21a are moved parallel to the wafer sheet H (in this embodiment, horizontally) by the operation of the X-axis driving means 25 attached to the support 21a. ), and moves along with the X-axis driving means 25 by the operation of the Y-axis driving means 26 attached to the X-axis driving means 25, and by the operation of the X-axis driving means 25, the pickup unit 13 and the support body. It moves (horizontally moves in this embodiment) in a direction perpendicular to the moving direction of 21a (Y-axis direction in a plane parallel to the wafer sheet H). Therefore, a virtual plane parallel to the wafer sheet H and passing through the pickup unit 13 is defined as a virtual plane F, and in the present embodiment, the pickup unit 13 is freely moved along the virtual plane F (within the virtual plane F). is configured to have an X-axis drive means 25 and a Y-axis drive means 26 .

3, the wafer sheet H and the wafer ring 29 with the wafer sheet H mounted thereon are moved within a virtual plane Q including the wafer sheet H ( In this embodiment, it moves in the X-axis direction (horizontally). Further, the wafer sheet H and the wafer ring 29 are moved together with the X-axis driving means 30 by the operation of the Y-axis driving means 31 attached to the X-axis driving means 30, and the wafer sheet H and the wafer ring 29 are moved by the operation of the X-axis driving means 30. It moves within the virtual plane Q in the Y-axis direction perpendicular to the direction of movement (horizontal movement in this embodiment). In the present embodiment, the third driving mechanism 35 for freely moving the wafer sheet H within the virtual plane Q is configured with X-axis driving means 30 and Y-axis driving means 31 .

Inside the cylindrical member 32 provided directly under the wafer sheet H, a drive source 33 is operated to advance and retreat in a direction perpendicular to the wafer sheet H (in this embodiment, it moves in the vertical direction or in the opposite vertical direction). A pin 34 is provided. As shown in FIGS. 3 and 5B, the drive source 33 includes a cylindrical member 32, a drive source 33, and a pin 34 arranged in an X plane parallel (horizontal in this embodiment) to the wafer sheet H. An X-axis driving means 46 for axial movement is attached. In the X-axis driving means 46, the cylindrical member 32, the driving source 33, and the pin 34 are moved in the Y-axis direction perpendicular to the direction in which the cylindrical member 32, the driving source 33, and the pin 34 are moved by the operation of the X-axis driving means 46. A Y-axis driving means 47 for moving (in this embodiment, horizontally moving) (parallel to the wafer sheet H) is attached.

In the present embodiment, the protruding mechanism 11 is formed with the cylindrical member 32, the drive source 33 and the pin 34. As shown in FIG. A first drive mechanism 49 moves the projection mechanism 11 along the virtual plane E (within the virtual plane E), with a virtual plane parallel to the wafer sheet H and the virtual plane F and passing through the projection mechanism 11 as a virtual plane E. is formed with X-axis drive means 46 and Y-axis drive means 47 .
3, the wafer sheet H, the wafer ring 29, and the X-axis driving means 30 are shown as cross-sectional views, and FIGS. W, the wafer ring 29, the X-axis driving means 30, etc. are omitted.

By the operation of the X-axis driving means 30 and the Y-axis driving means 31, one electronic component W out of many electronic components W attached to the surface of the wafer sheet H is sequentially picked up at the pick-up position P1. It is arranged at a position to be acquired by the support portion 12 (hereinafter referred to as a “picked-up position”). The pin 34 is located on the back side (lower side in this embodiment) of the wafer sheet H, and is arranged at the position to be picked up by moving (raising in this embodiment) in the J direction toward the front side. The electronic component W picked up is moved to the front side of the wafer sheet H and brought into contact with the component support portion 12 arranged at the pickup position P1.

The component support portion 12 arranged at the pickup position P1 sucks the surface W2 of the electronic component W that is in contact with the component support portion 12, and by moving the pin 34 in the direction opposite to the J direction (vertical direction in this embodiment), The electronic component W is obtained from the wafer sheet H by separating the electronic component W from the wafer sheet H.

In the vicinity of the pickup unit 13, there is provided an imaging means 28 that moves together with the component support portion 12 that has picked up the electronic component W at the pickup position P1 and captures an image of the surface W1 of the electronic component W placed at the 9 o'clock position. ing. Hereinafter, the position where the image of the electronic component W is imaged by the imaging means 28 is also referred to as the "imaging position". An imaging means 28 supported by a support member (not shown) images the surface W1 of the electronic component W arranged at the imaging position to obtain an image of the surface W1 of the electronic component W captured from the front. The imaging means 28 only needs to be able to image the surface W1 of the electronic component W supported by the component support section 12. For example, when the electronic component W temporarily stops at the 7:30 position, the imaging means 28 is arranged at the 7:30 position. The image capturing means 28 may be arranged so as to image the surface W1 of the electronic component W which is mounted.

As shown in FIG. 4, the imaging means 28 is connected with a deviation derivation means 28a for obtaining an image captured by the imaging means 28. As shown in FIG. The deviation deriving means 28a can detect the position and orientation of the electronic component W from the image captured by the image capturing means 28 . Electronic components W arranged at processing positions P7, P8, P9, P10, and P11 are arranged in predetermined positions and orientations with respect to processing units 17, 18, 19, 20, and 21, respectively, in deviation deriving means 28a. The position and orientation of the electronic component W at the imaging position to be captured (hereinafter referred to as "reference position and reference orientation of the electronic component W") are stored.

Each time the imaging means 28 captures an image of the electronic component W placed at the imaging position, the deviation deriving means 28a calculates the electronic components captured by the imaging means 28 while being acquired (supported) by the component support section 12 from the image captured by the imaging means 28 . The position and orientation of the component W are detected, the detected position and orientation of the electronic component W are compared with the stored reference position and reference orientation of the electronic component W, and the reference position and reference orientation of the electronic component W are determined. (positional deviation of the electronic component W relative to the reference position and orientation deviation of the electronic component W relative to the reference orientation) are detected, and the deviation is associated with the corresponding electronic component W and stored.

The pickup unit 13 has a driving rotating portion 56 between the center of the rotating member 23 and the component supporting portion 12, as shown in FIG. The drive rotation section 56 can rotate the component support section 12 around a virtual rotation axis R passing through the axis of the component support section 12 . Since the axial center of the component support portion 12 is arranged in the J direction when the component support portion 12 is arranged at the pickup position P1, the driving rotation portion 56 is arranged to rotate when the component support portion 12 is arranged at the pickup position P1. In this state, the component support portion 12 is rotated around the virtual rotation axis R arranged in the J direction.

As shown in FIGS. 1 and 2, the transport unit 16 has a motor 36 fixed to a base 45 and a plurality of component holders 14 attached at equal pitches along the outer circumference. It has a rotary body 15 that rotates. The motor 36 intermittently rotationally drives the rotor 15 to intermittently move the plurality of component holders 14 . One rotation of the rotating body 15 moves each of the component holders 14 by the arrangement pitch of the component holders 14 .

Each component holding part 14 is elongated in the vertical direction and attached to the rotating body 15 so as to be able to move up and down while passing through the rotating body 15 . Each component holding portion 14 is a suction nozzle that sucks the electronic component W at its lower end, sucks the electronic component W by vacuum pressure (negative pressure), and releases the electronic component W from the sucked state by opening to the atmosphere or by positive pressure. A coil spring 37 is attached to each component holding portion 14 in a region above the rotating body 15 to apply an upward force to the component holding portion 14 that has been lowered.

A disc-shaped plate member 39 fixed to a support member 38 passing through the motor 36 and the rotating body 15 is provided above the rotating body 15 . A plurality of holding members 41 to which motors 40 are fixed are attached to the outer periphery of the plate member 39 arranged horizontally. there is A coil spring 43 is provided below each motor 40 to apply an upward force to the lowered movable body 42 . As shown in FIG. 4, the motor 40 includes X-axis driving means 25, 30, 46, Y-axis driving means 26, 31, 47, imaging means 28, displacement deriving means 28a, driving source 33, motors 36, 51 and driving means. It is connected to the control means 57 together with the rotating part 56 .

In this embodiment, the motor 40 is connected to an output shaft 44 that moves up and down when driven by the motor 40, and the movable body 42 is pushed down by the output shaft 44 that moves down. The rotating body 15 and the plurality of component holders 14 rotate by an angle corresponding to the arrangement pitch of the component holders 14 each time the motor 36 is driven. Each movable body 42 is arranged above the position where the component holding portion 14 is temporarily stopped, and is lowered by the operation of the corresponding motor 40 to push down the component holding portion 14 that is temporarily stopped. In FIG. 1, two each of the component holding portion 14, the motor 40, the holding member 41, the movable body 42, the output shaft 44, and the like are shown. is provided.

One of the plurality of positions where the component holding portion 14 temporarily stops is the receiving position P2 above the pickup unit 13, as shown in FIGS. After picking up the electronic components W from the wafer sheet H at the pick-up position P1, the component support section 12 intermittently moves together with the electronic components W by repeating the operation and stop of the motor 51 to reach the transfer position P3 directly below the receiving position P2. It will be in a stopped state.

In the present embodiment, the transfer position P3 is at the 12 o'clock position (0° position) about the rotating member 23 (rotating shaft), and the rotating member 23 rotates twice (an example of a plurality of times) by 90°. By rotating 180° around the rotary shaft 22, the component support section 12 arranged at the pick-up position P1 is moved to the transfer position P3 facing the component holding section 14 arranged at the receiving position P3, and the transfer position P3 is moved. , is moved to the pick-up position P1. In the case where there are two component support sections 12, the rotation member 23 rotates 180° in one rotation, thereby moving the component support section 12 from the pick-up position P1 to the transfer position P3, and then to the transfer position P3. The component support portion 12 that has been placed can be moved to the pickup position P1.

The component holding portion 14 arranged at the receiving position P2 descends together with the movable body 42 by the operation of the motor 40, and contacts the surface W1 of the electronic component W attracted to the component supporting portion 12 arranged at the transfer position P3. and the surface W1 of the electronic component W is sucked. The component holding portion 14 that has sucked the electronic component W at the receiving position P2 acquires the electronic component W from the component support portion 12 that has released the electronic component W, and rises together with the movable body 42 by the operation of the motor 40 .

As shown in FIG. 2, a processing unit 17 for performing predetermined processing (visual inspection, electrical property inspection, laser marking, etc.) on each electronic component W attracted to the component holding unit 14 is provided near the transport unit 16 . , 18, 19, 20, 21 are provided.
The electronic component W attracted to the component holding portion 14 and the component holding portion 14 are intermittently moved by repeating the operation and stop of the motor 36, and are moved to the processing position P7 where the processing by the processing unit 17 is performed, and It stops sequentially at a processing position P8 where processing is performed, a processing position P9 where processing is performed by the processing unit 19, a processing position P10 where processing is performed by the processing unit 20, and a processing position P11 where processing by the processing unit 21 is performed.

4, the control means 57 controls the electronic components W attached to the wafer sheet H and arranged at or near the position to be picked up and the electronic components W around them on the surface of the wafer sheet H. An imaging means 58 for imaging from the side and a position detection means 59 for detecting the position of the electronic component W arranged at or near the pick-up position based on the image captured by the imaging means 58 are also connected.

The control means 57 can be composed of, for example, a CPU and a memory, and includes X-axis driving means 25, 30, 47, Y-axis driving means 26, 31, 46, driving source 33, motors 36, 40, 51, imaging means 28, 58 and the drive rotator 56, and electronic data can be obtained from the deviation derivation means 28a and the position detection means 59. FIG.

Here, on the premise that the electronic component W arranged at the processing position P7 is arranged in a predetermined position and orientation with respect to the processing unit 17, the processing unit 17 is arranged with respect to the electronic component W Designed to handle. Therefore, if the electronic component W arranged at the processing position P7 is not arranged in a predetermined position and orientation with respect to the processing unit 17, the processing unit 17 cannot properly process the electronic component W. occurs. In this regard, the electronic component W and the processing unit 18 arranged at the processing position P8, the electronic component W and the processing unit 19 arranged at the processing position P9, the electronic component W and the processing unit 20 arranged at the processing position P10, and The same applies to the electronic component W and the processing unit 21 arranged at the processing position P11.

Therefore, in the present embodiment, the electronic component W is placed at the processing positions P7, P8, P9, P10, and P11 at predetermined positions and orientations with respect to the processing units 17, 18, 19, 20, and 21, respectively, by the steps described below. be distributed to

<Preparation processing>
In a state in which the pickup unit 13 is arranged at a predetermined standard position and none of the component support sections 12 are picking up the electronic component W, the intermittent operation of the motor 51 sequentially moves the component support section 12 to the imaging position. , and the imaging means 28 images the component support portion 12 arranged at the imaging position. Based on the image captured by the imaging means 28, the control means 57 derives and stores the position of the center of the component support portion 12 when the component support portion 12 is placed at the pick-up position P1.

This processing is performed because it was confirmed that the center positions of the component support portions 12 differ among the individual component support portions 12 due to manufacturing errors of the component support portions 12 or the like. However, since the difference in the central positions of the individual component support portions 12 is very slight, this preparatory process may be omitted depending on the requirements of the electronic component processing apparatus 10 .
It should be noted that the control of the motor 51, the imaging means 28, etc. in the preparatory process by the control means 57 is omitted. In this respect, the same may be applied to the following description.

<Electronic component acquisition processing>
After the preparation process is completed, the pickup unit 13 picks up the electronic components W from the wafer sheet H in steps S1 to S6 shown in FIG.

Step S1: As shown in FIG. 7, the control means 57 controls the X-axis driving means 30 and the Y-axis driving means 31 so that one electronic component W faces the component support portion 12 arranged at the pick-up position P1. The wafer sheet H is moved by a predetermined pitch with the wafer ring 29 so as to be arranged at the pick-up position, and the electronic component W is imaged by the imaging means 58 . Note that the electronic component W may be imaged by the imaging means 58 before the wafer ring 29 and the wafer sheet H are moved by a predetermined pitch.

Step S2: Since the positions of the individual electronic components W attached to the wafer sheet H have some variations, it is possible that the electronic components W are not arranged at the pick-up position. Therefore, the position detection means 59 detects the position of the electronic component W based on the captured image of the imaging means 58, and determines whether or not the electronic component W is arranged at the position to be picked up.
Step S3: When the position detecting means 59 determines that the electronic component W is arranged at the position to be picked up, the electronic component W is not moved.

Step S4: On the other hand, if the position detection means 59 determines that the electronic component W is not located at the position to be picked up, the control means 57 moves the electronic component W so that the electronic component W is located at the position to be picked up. By controlling the driving means 30 and the Y-axis driving means 31, the electronic component W is moved together with the wafer ring 29 and the wafer sheet H so that the electronic component W is arranged at the pickup position.

Step S5: Based on the stored center position of the component support portion 12 at the pickup position P1 that is linked to the component support portion 12 facing the pickup position P1 (6 o'clock position), the control means 57 By operating the drive means 25 and the Y-axis drive means 26, the pickup unit 13 arranged at the standard position is moved along the virtual plane F, and when the component support portion 12 is arranged at the pickup position P1, the The center of the component support portion 12, the center of the electronic component W arranged at the position to be picked up, and the center of the pin 34 are arranged on an imaginary straight line (in this embodiment, an imaginary straight line along the J direction). do.

Note that the movement of the pickup unit 13 along the virtual plane F may be performed while the component support portion 12 is arranged at the pickup position P1. In the present embodiment, the center of the electronic component W arranged at the pick-up position and the center of the pin 34 are designed to be arranged on an imaginary straight line along the J direction. Although the mechanism 11 is not moved, if the center of the electronic component W and the center of the pin 34 are not arranged on an imaginary straight line along the J direction, the center of the electronic component W and the center of the pin 34 are aligned along the J direction. The position of the protruding mechanism 11 is adjusted by the operation of the X-axis driving means 46 and the Y-axis driving means 47 so as to be arranged on the virtual straight line.

That is, the control means 57 controls the first driving mechanism 49, the second driving mechanism 27 and the third driving mechanism 35 (the first driving mechanism 49, the second driving mechanism 27 and the third driving mechanism 35 ) to adjust the positions of the component supporter 12 placed at the pick-up position P1, the electronic component W to be acquired by the component supporter 12, and the projecting mechanism 11. FIG.

Here, steps S1 to S5 are based on the center of the electronic component W placed at the pick-up position, and the component support portion 12 placed at the pick-up position P1 is placed at the pick-up position (that is, the component is placed next to the pick-up position). The procedure for adjusting the position of the electronic component W and the protruding mechanism 11 (obtained by the support portion 12) is performed with reference to the center of the component support portion 12 arranged at the pick-up position P1. can also In that case, the following steps S2' to S3' are performed instead of steps S2 to S5.

Step S2': The position detection means 59 detects the position of the electronic component W based on the captured image of the electronic component W captured by the imaging means 58 in step S1, and stores the position of the center of the electronic component W.

Step S3': The control means 57 stores the center position of the component support portion 12 at the pickup position P1, which is linked to the component support portion 12 arranged at the pickup position P1, and the position detection means 59. Next, based on the center position of the electronic component W obtained by the component support portion 12, the X-axis driving means 30, the Y-axis driving means 31, the X-axis driving means 46 and the Y-axis driving means 47 are operated to pick up. With respect to the center of the component support portion 12 arranged at the pickup position P1 with the unit 13 arranged at the standard position, the center position of the electronic component W and the center position of the pin 34 next to be picked up by the component support portion 12 are are arranged on an imaginary straight line along the J direction.

Step S6: After completing the position adjustment of the component support portion 12 arranged at the pickup position P1, the electronic component W arranged at the position to be picked up, and the projecting mechanism 11, the control means 57 operates the drive source 33 to The pin 34 is moved in the J direction to bring the electronic component W arranged at the pick-up position closer to the component support portion 12 arranged at the pick-up position P1 to attract the electronic component W, and the pin 34 is moved in the opposite direction to the J direction. The electronic component W is acquired by the component support section 12 . Since the electronic component W is acquired by the component supporter 12 in a state in which the center of the component supporter 12, the center of the electronic component W, and the center of the pin 34 are aligned linearly, the component supporter 12 stabilizes the electronic component W. can be acquired

Step S7: After completion of acquisition of the electronic component W by the component support section 12 arranged at the pickup position P1, if the pickup unit 13 is not arranged at the standard position, the X-axis driving means 25 and the Y-axis driving means 26 are By the operation, the pickup unit 13 is returned to the standard position. If the wafer sheet H is not placed in the standard position, the X-axis driving means 30 and the Y-axis driving means 31 are actuated to return the wafer sheet H to the standard position and protrude. When the mechanism 11 is not placed at the standard position, the X-axis driving means 46 and the Y-axis driving means 47 are operated to return the protruding mechanism 11 to the standard position.

Here, step S1 is performed in a state in which the pickup unit 13 and the wafer sheet H are arranged at their standard positions.

<Electronic parts delivery process>
The electronic component W picked up from the wafer sheet H by the component supporter 12 arranged at the pickup position P1 is transferred from the pickup unit 13 to the transfer unit 16 through steps S11 to S16 shown in FIG.

Step S11: With the pickup unit 13 placed at the standard position, the imaging means 28 images the electronic component W stationary at the imaging position, as shown in FIG.
Step S12: The deviation deriving means 28a detects the position and orientation of the electronic component W imaged while being acquired (supported) by the component support section 12 based on the captured image of the imaging means 28, and detects the position and orientation of the detected electronic component W. By comparing the position and orientation with the stored reference position and reference orientation of the electronic component W, the deviation of the electronic component W from the reference position and reference orientation is detected, and the detected deviation from the reference position and reference orientation is detected. It is stored in association with the electronic component W.

Step S13: Based on the deviation of the electronic component W with respect to the reference position and the reference orientation stored in association with the electronic component W by the deviation deriving means 28a, the control means 57 determines the position of the electronic component W arranged at the 12 o'clock position. Adjust position and orientation. Specifically, the control means 57 operates the X-axis drive means 25 and the Y-axis drive means 26 to move the pickup unit 13 supporting the electronic component W by the component support portion 12 along the virtual plane F, The position of the electronic component W supported by the component support portion 12 and arranged at the 12 o'clock position is adjusted and arranged at a predetermined position, and a drive rotation portion corresponding to the component support portion 12 supporting the electronic component W. 56 is operated to rotate the electronic component W around the virtual rotation axis R, and the orientation of the electronic component W is adjusted to arrange it in a predetermined orientation.

The position after position adjustment of the electronic component W arranged at the 12 o'clock position is the transfer position P3.
This step S13 may be performed after step S6 or before step S6. When step S13 is performed after step S6, the orientation of the electronic component W can be adjusted by operating the drive rotating portion 56 before the electronic component W is placed at the 12 o'clock position. When step S13 is performed before step S6, the position and orientation of the electronic component W are adjusted by operating the X-axis driving means 25, the Y-axis driving means 26, and the drive rotating portion 56. can be done at any time.

Step S14: The control means 57 operates the motor 40 provided above the receiving position P2 to lower the component holding section 14 which has been stationary at the receiving position P2, thereby supporting the component which is stationary at the 12 o'clock position. The surface W1 of the electronic component W supported by the portion 12 is brought into contact.
Step S15: The component holding portion 14 sucks the surface W1 of the electronic component W, and the component support portion 12 releases the surface W2 of the electronic component W from being sucked. The pickup unit 13 is returned to the standard position after the component supporter 12 releases the suction of the surface W2 of the electronic component W. As shown in FIG.

Step S<b>16 : The component holding section 14 acquires the electronic component W from the component supporting section 12 by the control means 57 operating the motor 40 to raise the component holding section 14 . This completes the delivery of the electronic component W from the pickup unit 13 to the transport unit 16 .

As shown in FIG. 2, the component holding portion 14 that has acquired the electronic component W from the component support portion 12 at the receiving position P2 receives an electronic It moves together with the part W and is arranged at the processing position P7. Here, by adjusting the position and orientation of the electronic component W by operating the X-axis driving means 25, the Y-axis driving means 26, and the drive rotating portion 56 in step S7, the electronic component W arranged at the processing position P7 can be processed. It is arranged in a predetermined position and orientation with respect to the unit 17 . Therefore, the control means 57 controls the second driving mechanism 27 and the drive rotating part 56 based on the deviation detected by the deviation deriving means 28a so that the electronic component W is positioned at a predetermined position with respect to the processing unit 17 at the treatment position P7. and direction.

Thereafter, the processing unit 17 performs predetermined processing on the electronic component W placed at the processing position P7.
The rotation of the rotor 15 by the operation of the motor 36 is, in principle, performed at the same timing as the rotation of the rotating member 23 .

Processing by the processing unit 18 for the electronic component W placed at the processing position P8, processing by the processing unit 19 for the electronic component W placed at the processing position P9, and processing by the processing unit 20 for the electronic component W placed at the processing position P10. And the processing by the processing unit 21 for the electronic component W arranged at the processing position P11 is performed at the same timing as the processing by the processing unit 17 for the electronic component W arranged at the processing position P7. Some of the processing units 17, 18, 19, 20, and 21 perform processing on the electronic component W while the electronic component W is supported by the component holding unit 14, and the rest after acquiring the electronic component W from the component holding unit 14. , the electronic component W is processed, and the electronic component W is returned to the component holding portion 14 .

Next, an electronic component processing apparatus 70 according to a second embodiment of the present invention will be described with reference to FIGS. 9 to 17. FIG. In the electronic component processing apparatus 70, the same components as those of the electronic component processing apparatus 10 are denoted by the same reference numerals, and detailed description thereof will be omitted.
As shown in FIGS. 9, 10, and 11, the electronic component processing apparatus 70 protrudes the electronic components W attached to the front surface of the wafer sheet H from the back surface side of the wafer sheet H in the direction J perpendicular to the wafer sheet H. A projecting mechanism 11, a pickup unit 13 having a component support portion 12 for acquiring the electronic component W projected in the J direction at a pickup position P1 facing the wafer sheet H, and acquiring the electronic component W from the pickup unit 13 at a receiving position P2. A conveying unit 16 in which the component holder 14 moves together with the electronic component W to the processing positions P7, P8, P9, P10, and P11 by rotation of the rotating body 15 to which the component holder 14 is attached, and the processing positions P7, P8, and P9. , P10 and P11 are provided with processing units 17, 18, 19, 20 and 21 for performing predetermined processing, respectively.

The pickup unit 13 is provided below the rotating body 15 and has a rotating shaft 22 supported by a supporting body 71 and four (plurality) of component supporting portions 12 provided so as to move forward and backward relative to the rotating member 23 . doing. In this embodiment, the wafer sheet H is arranged vertically at substantially the same height position as the pickup unit 13 . Each component support portion 12 moves 90 degrees with intermittent rotation of the rotating member 23 due to repeated operation and stop of the motor 51 shown in FIG. They are arranged at the opposing pickup position P1 (3 o'clock position). 10 and 13 omit the description of the coil spring 24 and the like that apply force to the component support portion 12. As shown in FIG.

As shown in FIGS. 9 and 11, the support 71 is movably mounted on guide rails 73 and 74 provided in parallel on a base 72 . In the vicinity of the support 71, as shown in FIGS. 10 and 13, a force is applied to the support 71 through a power transmission section 75 by operation to horizontally move the pickup unit 13 along the guide rails 73 and 74. A drive source 76 is installed.

In this embodiment, the pickup unit 13 moves in the G direction parallel to the wafer sheet H or in the direction opposite to the G direction. In plan view (along the rotation axis of the rotor 15), the G direction is perpendicular to the imaginary straight line N passing through the center of rotation of the rotor 15 and the receiving position P2, as shown in FIG. A drive mechanism 77 , which is an example of a drive mechanism β for moving the pickup unit 13 in the G direction or in a direction opposite to the G direction, includes guide rails 73 and 74 , a power transmission section 75 and a drive source 76 .

As shown in FIG. 11, the wafer sheet H and the wafer ring 29 on which the wafer sheet H is mounted are moved to the positive and negative sides in the vertical direction by the operation of the vertical drive means 78 that supports the wafer ring 29 . Further, the wafer sheet H and wafer ring 29 are horizontally moved together with the vertical drive means 78 by the operation of the horizontal drive means 79 attached to the vertical drive means 78 . Inside the cylindrical member 32 attached to the vertical driving means 78, a pin 34 is provided which advances and retreats horizontally by the operation of the driving source 33. As shown in FIG. In the present embodiment, a drive mechanism 80 (an example of a drive mechanism γ) for freely moving the wafer sheet H within the virtual plane Q containing the wafer sheet H is configured with vertical drive means 78 and horizontal drive means 79 . ing.

11, the wafer sheet H, the wafer ring 29 and the vertical driving means 78 are shown as cross-sectional views. By the operation of the vertical driving means 78 and the horizontal driving means 79, one electronic component W among the many electronic components W attached to the surface of the wafer sheet H is sequentially moved to the component support portion arranged at the pick-up position P1. 12 is placed at the pick-up position.

Inside the cylindrical member 32 provided in the vicinity of the wafer sheet H, a driving source 33 is operated to advance and retreat in a direction (horizontal direction) perpendicular to the wafer sheet H (moving in the J direction or in the opposite direction to the J direction). A pin 34 is provided. The pin 34 is positioned on the back side of the wafer sheet H, and moves forward (moves in the J direction) to move the electronic component W arranged at the pickup position to the front side of the wafer sheet H (projects in the J direction), It is brought into contact with the component support portion 12 arranged at the pick-up position P1.

As shown in FIGS. 11 and 13, the drive source 33 has a projecting mechanism 11 formed with a cylindrical member 32, a drive source 33 and a pin 34, which is arranged in the G direction or G direction parallel to the wafer sheet H. A horizontal driving means 81 (an example of a driving mechanism α) for moving in the opposite direction is attached.

In the vicinity of the pickup unit 13, there is provided an imaging means 82 that moves together with the component support section 12 that has picked up the electronic component W at the pickup position P1 and captures an image of the surface W1 of the electronic component W placed at the 6 o'clock position. ing. Hereinafter, the "6 o'clock position" is also referred to as the "imaging position". The imaging means 82 images the surface W1 of the electronic component W placed at the imaging position via the prism 83 to obtain an image of the surface W1 of the electronic component W captured from the front. The imaging means 82 only needs to be able to image the surface W1 of the electronic component W supported by the component support section 12. For example, the imaging means 82 is arranged so as to image the surface W1 of the electronic component W placed at the 9 o'clock position. may

As shown in FIG. 12, the imaging means 82 is connected with a deviation derivation means 84 for obtaining an image captured by the imaging means 82 . The deviation deriving means 84 can detect the position and orientation of the electronic component W from the image captured by the imaging means 82 . A reference position and a reference orientation of the electronic component W are stored in the deviation deriving means 84 . Every time the imaging means 82 takes an image of the electronic component W arranged at the imaging position, the deviation derivation means 84 detects the detected position and orientation of the electronic component W with respect to the imaged electronic component W, and the stored electronic component W are compared with the reference position and orientation of the electronic component W to detect the deviation of the electronic component W from the reference position and orientation, and the detected deviation from the reference position and orientation is linked to the corresponding electronic component W and stored.

As shown in FIG. 14, the driving rotation section 56 can rotate the component support section 12 around the virtual rotation axis R arranged in the J direction in a state where the component support section 12 is arranged at the pick-up position P1.
In this embodiment, as shown in FIGS. 11 and 14, the transfer position P3 is at the 12 o'clock position about the rotating member 23 (rotating shaft 22), and the rotating member 23 rotates 90° three times to rotate 270 degrees. By rotating by degrees, the component support portion 12 arranged at the pick-up position P1 is arranged at the transfer position P3.

Further, as shown in FIG. 10, a virtual straight line passing through the center of the rotating body 15 and the processing position P7 in plan view (along the rotation axis of the rotating body 15) is defined as a virtual straight line M, and along the virtual straight line M Assuming that the direction from the processing position P7 toward the center of the rotating body 15 is the K direction (that is, the K direction is the direction along the imaginary straight line M), the processing unit 17 has the K direction or the direction opposite to the K direction. A driving mechanism 87 (an example of the driving mechanism δ) for moving is connected.

Similarly, a horizontal virtual straight line passing through the center of the rotating body 15 and the processing position P8 in plan view is defined as a virtual straight line M, and the direction along the virtual straight line M from the processing position P8 toward the center of the rotating body 15 is K A horizontal imaginary straight line passing through the center of the rotating body 15 and the processing position P9 in plan view is assumed to be an imaginary straight line M, and the direction along the imaginary straight line M from the processing position P9 toward the center of the rotating body 15 is K. A horizontal imaginary straight line passing through the center of the rotating body 15 and the processing position P10 in plan view is assumed to be an imaginary straight line M, and the direction from the processing position P10 toward the center of the rotating body 15 along the imaginary straight line M is K. A horizontal imaginary straight line passing through the center of the rotating body 15 and the processing position P11 in plan view is assumed to be an imaginary straight line M, and the direction along the imaginary straight line M from the processing position P11 toward the center of the rotating body 15 is K. In terms of direction, the processing units 18, 19, 20, and 21 are connected to drive mechanisms 88, 89, 90, and 91 (each an example of a drive mechanism δ) for moving in the K direction or in the direction opposite to the K direction, respectively. Note that in FIG. 10, description of the virtual straight lines M other than the virtual straight lines M corresponding to the processing unit 17 and the processing position P7 is omitted.

12, the drive mechanisms 87, 88, 89, 90 and 91 include a drive source 76, vertical drive means 78, horizontal drive means 79, drive source 33, motors 36, 40 and 51, imaging means 58 and 82. , the position detecting means 59, the displacement deriving means 84 and the drive rotating portion 56 are connected to the control means 57a.
The control means 57a includes drive sources 33 and 76, motors 36, 40 and 51, drive rotation section 56, imaging means 58 and 82, vertical drive means 78, horizontal drive means 79 and 81, drive mechanisms 87, 88, 89 and 90. , 91 and electronic data can be obtained from the position detection means 59 and the displacement derivation means 84 .

In the present embodiment, after performing the same preparatory processing as that performed on the electronic component processing apparatus 10, the electronic components W are processed at the processing positions P7, P8, P9, P10, and P11 by the processing described below. 17, 18, 19, 20 and 21 are arranged in predetermined positions and orientations, respectively.

<Electronic component acquisition processing>
After the preparation process is completed, the pickup unit 13 picks up the electronic components W from the wafer sheet H in steps S21 to S27 shown in FIG.

Step S21: As shown in FIG. 15, the control means 57a controls the vertical driving means 78 and the horizontal driving means 79 to move one electronic component W to the part to be picked up facing the component support portion 12 arranged at the pickup position P1. The wafer sheet H is moved by a predetermined pitch along with the wafer ring 29 so as to arrange the electronic component W at the position, and the electronic component W is imaged by the imaging means 58 . Note that the electronic component W may be imaged by the imaging means 58 before the wafer ring 29 and the wafer sheet H are moved by a predetermined pitch.

Step S22: The position detection means 59 detects the position of the electronic component W based on the captured image of the imaging means 58, and determines whether or not the electronic component W is arranged at the pickup position.
Step S23: When the position detecting means 59 determines that the electronic component W is arranged at the position to be picked up, the electronic component W is not moved.

Step S24: On the other hand, if the position detecting means 59 determines that the electronic component W is not located at the position to be picked up, the control means 57a vertically drives the electronic component W so that it is located at the position to be picked up. By controlling the means 78 and the horizontal driving means 79, the electronic component W is moved together with the wafer ring 29 and the wafer sheet H so that the electronic component W is arranged at the position to be picked up.

Step S25: The control means 57a controls the drive source based on the center position of the component support portion 12 at the pickup position P1, which is linked to and stored with the component support portion 12 facing the pickup position P1 (3 o'clock position). 76 is operated to move the pickup unit 13 arranged at the standard position in the G direction or in the direction opposite to the G direction, and when the component support portion 12 is arranged at the pickup position P1, the component support portion 12 is moved. The center, the center of the electronic component W arranged at the pick-up position, and the center of the pin 34 are arranged on an imaginary straight line (in this embodiment, an imaginary straight line along the J direction).

Note that the movement of the pickup unit 13 in the G direction or in the direction opposite to the G direction may be performed while the component support portion 12 is arranged at the pickup position P1. In the present embodiment, the center of the electronic component W arranged at the pick-up position and the center of the pin 34 are designed to be arranged on an imaginary straight line along the J direction. Although the mechanism 11 is not moved, if the center of the electronic component W and the center of the pin 34 are not arranged on an imaginary straight line along the J direction, the center of the electronic component W and the center of the pin 34 are aligned along the J direction. The position of the protruding mechanism 11 is adjusted by the operation of the horizontal driving means 81 so that it is arranged on the imaginary straight line.

That is, the control means 57a controls the drive mechanism α, the drive mechanism β, and the drive mechanism γ (activates any one or more of the drive mechanism α, the drive mechanism β, and the drive mechanism γ) to place the pickup at the pickup position P1. Then, the positions of the electronic component W and the protruding mechanism 11 to be acquired by the component supporting portion 12 are adjusted.

In steps S21 to S25, the center of the electronic component W placed at the pick-up position is used as a reference, and the component support portion 12 placed at the pick-up position P1 is placed at the pick-up position (that is, the component is placed next to the pick-up position). The procedure for adjusting the position of the electronic component W and the protruding mechanism 11 (obtained by the support portion 12) is performed with reference to the center of the component support portion 12 arranged at the pick-up position P1. can also In that case, the following steps S22' to S23' are performed instead of steps S22 to S25.

Step S22': The position detection means 59 detects the position of the electronic component W based on the captured image of the electronic component W captured by the imaging means 58 in step S21, and stores the position of the center of the electronic component W.

Step S23′: The control means 57a determines the center position of the component support portion 12 at the pickup position P1 stored in association with the component support portion 12 placed at the pickup position P1, and the position detection means 59 stores the position. Next, based on the center position of the electronic component W obtained by the component support portion 12, the horizontal driving means 79 and 81 are operated, and the pickup unit 13 is arranged at the pickup position P1 in a state of being arranged at the standard position. With respect to the center of the component support portion 12, the center position of the electronic component W and the center position of the pin 34, which are to be obtained in the component support portion 12 next, are arranged on an imaginary straight line along the J direction.

Step S26: After completing the position adjustment of the component support portion 12 arranged at the pickup position P1, the electronic component W arranged at the position to be picked up, and the projecting mechanism 11, the control means 57a operates the drive source 33 to The pin 34 is moved in the J direction to bring the electronic component W arranged at the pick-up position closer to the component support portion 12 arranged at the pick-up position P1 to attract the electronic component W, and the pin 34 is moved in the opposite direction to the J direction. The electronic component W is acquired by the component support section 12 .

Step S27: After completion of picking up the electronic component W by the component support section 12 placed at the pickup position P1, if the pickup unit 13 is not placed at the standard position, the drive source 76 operates to move the pickup unit 13 to the standard position. If the wafer sheet H is not placed at the standard position, the horizontal driving means 79 is operated to return the wafer sheet H to the standard position. Actuation of 81 returns the projection mechanism 11 to the standard position.

Here, step S21 is performed in a state in which the pickup unit 13 and the wafer sheet H are placed at their standard positions.

<Electronic parts delivery process>
The electronic component W picked up from the wafer sheet H by the component supporter 12 arranged at the pickup position P1 is transferred from the pickup unit 13 to the transfer unit 16 through steps S31 to S36 shown in FIG.

Step S31: With the pickup unit 13 placed at the standard position, the imaging means 82 images the electronic component W stationary at the imaging position, as shown in FIG.
Step S32: The deviation deriving means 84 detects the position and orientation of the electronic component W imaged while being acquired (supported) by the component support section 12 based on the captured image of the imaging means 82, and detects the detected electronic component W is compared with the stored reference position and reference orientation of the electronic component W to detect the deviation of the electronic component W from the reference position and reference orientation, and the deviation is linked to the electronic component W memorize.

Step S33: Based on the deviation of the electronic component W from the reference position and the reference orientation stored in association with the electronic component W by the deviation deriving means 84, the control means 57a determines whether the electronic component W placed at the 12 o'clock position is Adjust position and orientation. Specifically, the control means 57a operates the drive source 76 to move the pickup unit 13 supporting the electronic component W by the component support portion 12 in the G direction or in the direction opposite to the G direction. The position of the electronic component W supported and arranged at the 12 o'clock position in the G direction is adjusted to place it at a predetermined position, and a drive rotating portion 56 corresponding to the component support portion 12 supporting the electronic component W. is operated to rotate the electronic component W around the virtual rotation axis R, and the direction of the electronic component W is adjusted to arrange it in a predetermined direction.

The position after position adjustment of the electronic component W arranged at the 12 o'clock position is the transfer position P3.
This step S33 may be performed after step S26, or may be performed before step S26. When step S33 is performed after step S26, the direction adjustment of the electronic component W by the operation of the drive rotating portion 56 can be performed before the electronic component W is arranged at the 12 o'clock position. When step S33 is performed before step S26, the position and orientation of the electronic component W can be adjusted by the operation of the drive source 76 and the drive rotating portion 56 at the timing when the electronic component W is moving toward the 12 o'clock position. .

The electronic component W whose position and orientation have been adjusted at the 12 o'clock position is processed in the same manner as the electronic component W by the electronic component processing apparatus 10, and is transferred from the component support portion 12 of the pickup unit 13 to the component holding portion of the transport unit 16. 14 and supported by the component holder 14 of the transport unit 16, the electronic components W are subjected to predetermined processing by the processing units 17, 18, 19, 20, and 21 in the following steps.

<Processing of the processing unit>
The component holding unit 14 that has acquired the electronic component W from the component supporting unit 12 at the receiving position P2 moves together with the electronic component W by the operation of the motor 36 and is arranged in the stop area one upstream of the processing position P7. After that, in steps S41 and S42 shown in FIG. 17, the positions of the electronic component W and the rotating body 15 of the processing unit 17 are adjusted in the radial direction. The rotation of the rotary member 15 and the movement of the component holder 14 by the operation of the motor 36 are, in principle, performed at the same timing as the rotation of the rotary member 23 and the movement of the component supporter 12 .

Step S41: The control means 57a operates the motor 36 to move the electronic component W and the component holding section 14 to the processing position P7, and the deviation derivation means 84 stores the reference associated with the electronic component W in step S26. Based on the position and deviation from the reference orientation, it is determined whether the processing unit 17 should be moved in the K direction or in the direction opposite to the K direction, and the movement distance is determined, and the drive mechanism 87 is operated.

By the operation of the driving mechanism 87, the processing unit 17 moves in the K direction or in the direction opposite to the K direction, and the processing unit 17 moves the electronic component W disposed at the processing position P7 at the position in the direction of the imaginary straight line M. placed in the designated position. Therefore, the driving mechanism 87 moves in the direction K orthogonal to the direction of the position adjustment of the electronic component W performed by the movement of the pickup unit 13 or in the direction opposite to the direction K, and moves the electronic component W arranged at the processing position P7. , the position of the processing unit 17 in the K direction is adjusted.

As a result, the electronic component W arranged at the processing position P7 is arranged at a predetermined position and orientation with respect to the processing unit 17. FIG. Therefore, the control means 57a controls the driving mechanisms 77 and 87 and the drive rotating part 56 based on the deviation detected by the deviation deriving means 84 so that the electronic component W is positioned at the processing position P7 with respect to the processing unit 17. Make sure it is oriented.
In this embodiment, the movement of the processing unit 17 in the K direction or in the direction opposite to the K direction is completed before the electronic component W is placed at the processing position P7. After being placed, the movement of the processing unit 17 in the K direction or in the direction opposite to the K direction may be completed.

Here, at the timing when the position adjustment of the processing unit 17 is being performed with respect to the electronic component W arranged at the processing position P7, the processing unit 18 is moved to the electronic component W arranged at the processing position P8. Positional adjustment of the processing unit 19 is performed with respect to the electronic component W disposed at the processing position P9, and processing unit 20 is positioned with respect to the electronic component W disposed at the processing position P10. Position adjustment is performed, and the position adjustment of the processing unit 21 is performed with respect to the electronic component W arranged at the processing position P11.

Further, in the present embodiment, the position adjustment of the electronic component W in the G direction and the orientation adjustment of the electronic component W around the virtual rotation axis R are performed at the same timing by moving the pickup unit 13 in step S27. Therefore, it is possible to effectively carry out each processing for arranging the processing unit 17 in a predetermined position and orientation with respect to the electronic component W arranged at the processing position P7, and as a result, the electronic component processing apparatus It is possible to increase the number of electronic components W processed per unit time by 70 .

In addition, since there is no sufficient space between the processing units 17, 18, 19, 20, and 21 arranged around the motor 36 in plan view, the processing units 17, 18, 19, and 20 , 21 in the direction perpendicular to the K direction causes a spatial problem. can avoid the problem.

Step S42: The processing unit 17, which has finished moving the rotating body 15 in the radial direction, performs a predetermined processing on the electronic component W placed at the processing position P7 and stationary. Predetermined processes are performed by the processing units 18, 19, 20, and 21 on the electronic components W placed at the processing positions P8, P9, P10, and P11 at the timing.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and all modifications of conditions that do not deviate from the gist of the present invention are within the scope of the present invention.
For example, the wafer sheets need not be oriented vertically or horizontally.

Further, instead of the pick-up unit having a drive rotation section, the transfer unit 100 has a drive rotation mechanism 102 for rotating the component holding section 101, as in the modification shown in FIG. You may make it As shown in FIG. 18 , the drive rotation mechanism 102 rotates the component holding unit 101 that has acquired the electronic component W before the component holding unit 101 is placed at the processing position, and the electronic component W acquired by the component holding unit 101 is rotated. The orientation of the electronic component W (supported by the component support section 12) with respect to the transport unit is adjusted.

In this case, the control means controls the second drive mechanism and the drive rotation mechanism 102 (or the drive mechanism β, the drive mechanism δ, and the drive rotation mechanism 102) based on the deviation detected by the deviation derivation means, and the electronic component W is positioned and oriented with respect to the processing unit at the processing position. When the drive rotation mechanism 102 is employed, the pickup unit 103 does not need to be provided with a drive rotation section.

Here, the most upstream processing position along the rotation direction of the rotor does not require accurate adjustment of the orientation of the electronic component (for example, a processing unit that performs visual inspection of electronic components using imaging means). , and the second processing position from the upstream side corresponds to a processing unit that requires accurate adjustment of the orientation of the electronic component (for example, a processing unit that performs electrical property inspection of the electronic component). The orientation of the component W is adjusted before it is placed at the second processing position from the upstream side (for example, at the timing when the component holding unit 101 moves from the most upstream processing position to the second processing position). Alternatively, it may be performed in a state where it is placed at the second processing position from the upstream side.
In addition, the drive rotation mechanism 102 can be configured to have a motor, for example. In the modification shown in FIG. 18, the same components as those of the electronic component processing apparatuses 10 and 70 are denoted by the same reference numerals, and detailed description thereof is omitted.

Furthermore, the first driving mechanism only needs to have two driving means for moving the projecting mechanism in different directions, and does not need to have X-axis driving means and Y-axis driving means for moving the projecting mechanism in orthogonal directions. . The same applies to the second driving mechanism for moving the pickup unit, the third driving mechanism for moving the wafer sheet, and the driving mechanism γ for moving the wafer sheet.

Further, the rotating body of the transport unit does not need to rotate about a vertical rotating shaft, and for example, the rotating body of the transport unit may rotate about a horizontal rotating shaft. When the rotator of the transport unit rotates about a horizontal axis of rotation, an imaginary straight line M passing through the center of the rotator and the processing position when viewed along the axis of rotation of the rotator is the imaginary line M on which the processing position is arranged. It will be arranged on the vertical plane.

Furthermore, a relay unit may be provided between the pickup unit and the transport unit to obtain the electronic component from the pickup unit and provide it to the transport unit.
Further, it is not necessary to detect the position and orientation of the electronic component acquired by the component support portion based on the image captured by the imaging means. good too.

10: electronic component processing device, 11: protruding mechanism, 12: component support section, 13: pickup unit, 14: component holding section, 15: rotating body, 16: transport unit, 17, 18, 19, 20, 21: processing Unit 21a: Support 22: Rotating shaft 23: Rotating member 24: Coil spring 25: X-axis driving means 26: Y-axis driving means 27: Second driving mechanism 28: Imaging means 28a : deviation leading means, 29: wafer ring, 30: X-axis driving means, 31: Y-axis driving means, 32: cylindrical member, 33: driving source, 34: pin, 35: third driving mechanism, 36: motor , 37: coil spring, 38: support member, 39: plate material, 40: motor, 41: holding member, 42: movable body, 43: coil spring, 44: output shaft, 45: base, 46: X-axis driving means , 47: Y-axis driving means, 49: First driving mechanism, 51: Motor, 56: Driving rotating part, 57, 57a: Control means, 58: Imaging means, 59: Position detecting means, 70: Electronic component processing device , 71: support, 72: base, 73, 74: guide rail, 75: power transmission unit, 76: drive source, 77: drive mechanism, 78: vertical drive means, 79: horizontal drive means, 80: drive mechanism , 81: horizontal driving means, 82: imaging means, 83: prism, 84: deviation deriving means, 87, 88, 89, 90, 91: driving mechanism, 100: conveying unit, 101: component holder, 102: drive rotation Mechanism 103: Pick-up unit H: Wafer sheet M, N: Virtual straight line P1: Pick-up position P2: Receiving position P3: Transfer position P7, P8, P9, P10, P11: Processing position R: Virtual Axis of rotation, W: electronic component, W1, W2: surface

Claims (4)

A pickup having a projecting mechanism for projecting an electronic component attached to a wafer sheet in a direction J perpendicular to the wafer sheet, and a component support section for acquiring the electronic component projecting in the J direction at a pickup position facing the wafer sheet. a conveying unit in which the component holder moves to a processing position together with the electronic component by rotation of a rotating body attached with a component holder that acquires the electronic component from the pick-up unit at the receiving position; In an electronic component processing apparatus comprising a processing unit that performs predetermined processing on the arranged electronic components,
a first driving mechanism for moving the protruding mechanism along an imaginary plane E parallel to the wafer sheet;
a second drive mechanism for moving the pickup unit supporting the electronic component by the component support portion along a virtual plane F parallel to the wafer sheet;
a third driving mechanism for moving the wafer sheet within a virtual plane Q containing the wafer sheet;
a deviation deriving means for detecting a deviation from a reference position and a reference orientation of the electronic component acquired by the component support;
By controlling the first drive mechanism, the second drive mechanism, and the third drive mechanism, the component support unit arranged at the pickup position, and then the electronic component acquired by the component support unit and control means for adjusting the position of the projection mechanism,
The pick-up unit includes a rotating member that rotates once or multiple times to move the component support portion arranged at the pick-up position to a transfer position facing the component holding portion arranged at the receiving position. have
The transport unit has a drive rotation mechanism that rotates the component holding unit to adjust the orientation of the electronic component acquired by the component holding unit with respect to the transport unit,
The control means controls the second drive mechanism and the drive rotation mechanism based on the deviation detected by the deviation deriving means, so that the electronic component is positioned at the processing position at a predetermined position relative to the processing unit. An electronic component processing apparatus characterized by being arranged in an orientation. A pickup having a projecting mechanism for projecting an electronic component attached to a wafer sheet in a direction J perpendicular to the wafer sheet, and a component support section for acquiring the electronic component projecting in the J direction at a pickup position facing the wafer sheet. a conveying unit in which the component holder moves to a processing position together with the electronic component by rotation of a rotating body attached with a component holder that acquires the electronic component from the pick-up unit at the receiving position; In an electronic component processing apparatus comprising a processing unit that performs predetermined processing on the arranged electronic components,
a drive mechanism β for moving the pickup unit supporting the electronic component by the component support portion in a G direction parallel to the wafer sheet or in a direction opposite to the G direction;
a drive mechanism γ for moving the wafer sheet within a virtual plane Q containing the wafer sheet;
By moving the processing unit in a direction K perpendicular to the direction of position adjustment of the electronic component made by moving the pickup unit or in a direction opposite to the direction K, a driving mechanism δ for adjusting the position of the processing unit in the K direction;
a deviation deriving means for detecting a deviation from a reference position and a reference orientation of the electronic component acquired by the component support;
a control means for controlling the drive mechanism β and the drive mechanism γ to adjust the position of the component support section arranged at the pick-up position and the position of the electronic component to be subsequently acquired by the component support section;
The transport unit has a drive rotation mechanism that rotates the component holding unit to adjust the orientation of the electronic component acquired by the component holding unit with respect to the transport unit,
The control means controls the drive mechanism β, the drive mechanism δ, and the drive rotation mechanism based on the deviation detected by the deviation deriving means, so that the electronic component moves to the processing unit at the processing position in a predetermined position. An electronic component processing apparatus characterized in that it is arranged in the position and orientation of 3. The electronic component processing apparatus according to claim 2, wherein when viewed along the rotation axis of said rotor, said direction G is perpendicular to an imaginary straight line N passing through said center of rotation of said rotor and said receiving position, and said An electronic component processing apparatus, wherein the K direction is a direction along an imaginary straight line M passing through the center of rotation of the rotating body and the processing position. 3. The electronic component processing apparatus according to claim 1, further comprising imaging means for capturing an image of said electronic component acquired by said component supporter, wherein said deviation derivation means determines said deviation based on the image captured by said imaging means. An electronic component processing apparatus characterized by detecting.

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