JP5448096B2 - Rotary pickup mechanism and semiconductor processing apparatus having the same - Google Patents

Description

  The present invention relates to a rotary pickup mechanism having a wafer position correcting function by capturing an image of a device, and more particularly to a rotary pickup mechanism in which an arrangement configuration of a pickup member of a device is improved and a semiconductor processing apparatus including the rotary pickup mechanism. It is.

  2. Description of the Related Art Conventionally, there has been known a semiconductor processing apparatus that supplies devices such as electronic components from a wafer to a test handler and performs complex inspection and packaging by the test handler. Usually, the device is mounted on the wafer with the electrode surface facing up, but the test handler must face the electrode surface downward for various inspections.

  Therefore, a semiconductor processing apparatus is known that includes a pickup mechanism that receives a device from a wafer and delivers the device to a test handler while inverting the front and back of the device (for example, Patent Document 1). However, in the pickup mechanism in which one pickup member is reciprocated between the wafer and the test handler, the reception of the device from the wafer and the delivery to the test handler are sequentially performed. For this reason, the trouble that processing time became long occurred.

  Therefore, a rotary pickup mechanism has been proposed as a mechanism capable of processing device reception and delivery simultaneously in parallel. Hereinafter, a conventional example of a semiconductor processing apparatus provided with a rotary pickup mechanism will be specifically described with reference to FIGS. 5 is a plan view showing a schematic configuration of the conventional semiconductor processing apparatus of FIG. 5, FIG. 6 is a side view of a main part of the conventional semiconductor processing apparatus, and FIG. 7 is a side view of a rotary pickup mechanism including a cross-sectional view of the main part.

  A semiconductor processing apparatus 1 shown in FIG. 5 is an apparatus that supplies a device S from a wafer W to a test handler 5 and performs an appearance inspection and tape packing by the test handler 5. The test handler 5 is provided with a turntable 51 (illustrated by a two-dot chain line in FIG. 5) that rotates intermittently, and a plurality of suction nozzles 52 are attached to the circumferentially equidistant positions of the outer periphery of the turntable 51. The center of the turntable 51 is supported by a drive shaft of a direct drive motor disposed below, and intermittent rotation is performed as the direct drive motor is driven.

  The suction nozzle 52 can be moved up and down with respect to the turntable 51 by a support portion attached to the outer peripheral end of the turntable 51. A drive unit (not shown) for moving the suction nozzle 52 up and down is disposed immediately above the suction nozzle 52. The suction nozzle 52 communicates with the pneumatic circuit of a vacuum generator (not shown) inside the suction nozzle 52. The suction nozzle 52 sucks the device S when negative pressure is generated and releases the device S when vacuum breaks. Note that the arrangement interval of the suction nozzles 52 is set to be equal to the rotation angle of one pitch of the turntable 51.

  In addition, seven units 53 to 56 for performing various process processes on the device S are arranged on the outer periphery of the turntable 51. As the process processing unit, a defective product discharge unit 53, an appearance inspection unit 54, a direction rotation unit 55, an appearance inspection unit 54, and a defective product discharge unit along the rotation direction of the turntable 51 (counterclockwise rotation direction in FIG. 5). 53, a taping unit 56, and a defective product discharge unit 53 are arranged.

  As shown in FIGS. 5 and 6, the rotary pickup mechanism 4 is disposed below the periphery of the turntable 51 of the test handler 5. Further, a wafer moving mechanism 2 and a device peeling mechanism 3 are installed adjacent to the rotary pickup mechanism 4. The wafer moving mechanism 2 holds the wafer ring R and moves it with a pitch. A wafer W is attached to the wafer ring R. An adhesive surface is formed on the wafer W, and a plurality of devices S are arranged with the electrode surface facing upward.

  The wafer moving mechanism 2 moves the wafer ring R by pitch to position the device S on the wafer W to a preset device peeling position P. On the back surface of the device peeling position P, a push-up pin 31 of the device peeling mechanism 3 is installed so as to reciprocate linearly. The push-up pins 31 peel the device S from the wafer W by pushing up the device S from the back side of the wafer W.

  As shown in FIGS. 6 and 7, the rotary pickup mechanism 4 is provided with a drive shaft 40 extending in a direction orthogonal to the moving direction of the push-up pin 31. Four pickup heads 41 are attached to the drive shaft 40 so as to extend in a cross shape. The pickup head 41 is a pickup member that includes a pickup nozzle 44 at the tip, and holds the device S on the wafer W by suction with the pickup nozzle 44. The four pickup nozzles 44 are arranged at circumferentially equidistant positions, that is, every 90 degrees, in a circle centered on the drive shaft 40 (illustrated by a one-dot chain line in FIG. 6).

  The pick-up head 41 is shown in a substantially cylindrical shape in FIGS. 5 and 6, but specifically has the configuration shown in FIG. That is, the pickup head 41 is provided with a nozzle holding arm 42 fixed to the drive shaft 40, and a nozzle holder 43 is attached to the tip of the nozzle holding arm 42. The pickup nozzle 44 is held by the nozzle holding arm 42 via the nozzle holder 43.

  The nozzle holding arm 42 is provided with a ball spline 45 having a shaft and a bearing. The ball spline 45 is a portion that supports the pickup nozzle 44 in the axial direction. When the pickup head 41 is shown in a substantially cylindrical shape, a central axis extending in the longitudinal direction of the substantially cylindrical shape coincides with a radius in a circle (shown by a one-dot chain line in FIG. 6) drawn around the drive shaft 40. So that it is arranged.

  In such a rotary pickup mechanism 4, when the pickup nozzle 44 faces the device peeling position P, the device S pushed up by the push-up pin 31 is received from the wafer W and is sucked and held. When the pickup head 41 rotates 270 degrees in the clockwise direction in FIGS. 6 and 7 along with the rotation of the drive shaft 40, the pickup nozzle 44 faces the suction nozzle 52 of the test handler 5, and the suction nozzle 52 Device S is delivered to.

  According to the rotary pickup mechanism 4 as described above, the device S can be received from the wafer W and continuously supplied to the test handler 5 side while the front and back of the device S are reversed. Moreover, the four pickup nozzles 44 can simultaneously perform the operation of receiving the device S from the wafer W and the operation of delivering to the suction nozzle 52 in parallel. Therefore, the processing time can be greatly shortened as compared with the case where the receiving and delivery are performed by the reciprocating motion of a single pickup nozzle.

  By the way, the rotary pickup mechanism 4 has a function of taking an image of the device S at the device peeling position P and correcting the position of the wafer W. This position correction function is realized by the pickup camera C and the prism PR. The prism PR is disposed in the vicinity of the device peeling position P in the vicinity of the drive shaft 40 of the rotary pickup mechanism 4.

  The prism PR is disposed at a point where the central axis of the pickup head 41 and the drive shaft 40 intersect to bend the optical path L by 90 degrees. Further, the prism PR is supported from the fixed portion so as not to move due to the rotation of the pickup head 41, and is disposed at a position where it does not interfere with the pickup head 41. However, although there may be a case where the center line of the pickup camera C and the drive shaft 40 do not coincide (camera C is disposed obliquely), in this case, the reflection angle of the prism PR is adjusted.

  The pickup camera C is provided on a line orthogonal to the straight line connecting the prism PR and the device peeling position P and at a position where it does not interfere with the turntable 51 of the test handler 5. The pickup camera C acquires the image data of the device S at the device peeling position P in the gap between the two pickup nozzles 44 that is formed when the pickup head 41 is rotated by turning the optical path L 90 degrees by the prism PR. It has become.

  The image data of the device S acquired by the pickup camera C is used to calculate a deviation amount for positioning the device S to the device peeling position P in the wafer moving mechanism 2, that is, a wafer position correction amount. The wafer moving mechanism 2 takes in the wafer position correction amount and moves the wafer ring R based on the wafer position correction amount. By performing such position correction of the wafer W, the pickup accuracy can be increased.

JP 2009-141025 A

  In the rotary pickup mechanism 4, the following series of operations are performed after a pickup nozzle 44 finishes the pickup operation and before the next pickup nozzle 44 starts the pickup operation. First, when the pickup operation of the device S is completed by the pickup nozzle 44, the rotary head 41 starts to rotate. At the same time, the pitch of the wafer ring R is moved by the wafer moving mechanism 2.

  Next, the pickup camera C captures the image data of the device S at the device peeling position P from the gap between the two pickup nozzles 44, and acquires the wafer position correction amount. Subsequently, the wafer moving mechanism 2 moves the wafer ring R based on the wafer position correction amount. Thereafter, the rotary head 41 finishes rotating 90 degrees, and the pickup nozzle 44 in the next rotary head 41 starts the pickup operation of the device S.

  If the rotation angle of the pickup head 41 exceeds a predetermined angle between such two pickup operations, the pickup head 41 itself blocks the optical path L of the pickup camera C. Taking the rotary pickup mechanism 4 shown in FIGS. 5 to 7 as an example, when the rotation angle of the pickup head 41 exceeds about 65 degrees, the edge of the pickup head 41 on the rotation direction side is the pickup camera C. The optical path L is blocked (see FIG. 8).

  That is, in a rotary pickup mechanism having a wafer position correction function by capturing an image of a device, even if the pickup camera C captures an image of the device S between two pickup operations, the subsequent pickup nozzle 44 picks up the image. It does not mean that you can afford to start moving. Actually, before the pickup head 41 blocks the optical path L of the pickup camera C, it is necessary to finish capturing the device image by the pickup camera C.

  Therefore, if the pickup head 41 rotates at a high speed and the optical path L of the pickup camera C is not secured for a short time, the time taken for capturing the device by the pickup camera is insufficient. For this reason, the acquisition of the wafer position correction amount based on the photographing data is not in time.

  In order for the pickup camera C to reliably acquire device image data in the gap between the two pickup nozzles 44, there is no problem if the rotational speed of the rotary head 41 is slowed down, but this increases the cycle time. This led to a decline in productivity. In other words, in the rotary pickup mechanism, when wafer position correction is performed by capturing an image of a device, the rotational speed of the pickup member is increased to shorten the cycle time, and the device image data is reliably acquired to pick up the device. It has been difficult to achieve both accuracy and accuracy.

  The present invention has been proposed in order to solve such a problem. The object of the present invention is to increase the rotation angle of the pickup member until the pickup member interrupts the optical path of the pickup camera, thereby increasing the rotation speed of the pickup member. An object of the present invention is to provide a rotary pick-up mechanism excellent in operation reliability and productivity, and a semiconductor processing apparatus including the same, which can surely capture an image of a device by a pick-up camera even if the speed is increased.

  In order to achieve the above object, a rotary pickup mechanism according to the present invention is configured such that a plurality of pickup members for picking up a device placed on a wafer are circular with respect to the drive shaft as a center. A pickup camera is provided that is mounted at a circumferentially equidistant position and takes in image data of a device before being picked up by the pickup member, and at least a center line of the pickup member is an extension line of a radius of a circle centering on the drive shaft It is characterized by being arranged so as to be shifted in the direction opposite to the rotational direction.

  As another aspect of the present invention, the rotary pickup mechanism, a wafer moving mechanism that holds a wafer on which the device is placed and moves the wafer in a predetermined direction, and a device that receives the device from the rotary pickup mechanism. A test handler for sequentially transporting the device to a process processing unit that performs various process processes on the device is provided, and the wafer moving mechanism performs position correction of the wafer based on image data of the device captured by the pickup camera. The semiconductor processing apparatus comprised in this may be sufficient.

  According to the rotary type pickup mechanism of the present invention, at least the center line on the rotation direction side of the pickup member is shifted in the direction opposite to the rotation direction from the extension line of the radius of the circle around the drive shaft of the pickup member. Any pick-up member at the circumferentially equidistant position may have a very small portion protruding in the rotation direction of the pick-up member as viewed from the extension line. Therefore, the rotation angle until the pickup member blocks the optical path of the pickup camera can be expanded, and thus the pickup camera can reliably capture the image of the device even if the rotation speed of the pickup member is increased. .

The side view including principal part sectional drawing of typical embodiment of this invention. The principal part side view which shows operation | movement of this embodiment. Explanatory drawing which shows the rotation angle of the pickup member until the pickup member in this embodiment interrupts the optical path of a pickup camera. The side view which shows the structure of the semiconductor processing apparatus which concerns on this embodiment. The top view which shows schematic structure of the conventional semiconductor processing apparatus. The principal part side view in the conventional semiconductor processing apparatus. The side view including principal part sectional drawing in the conventional rotary pick-up mechanism. Explanatory drawing which shows the rotation angle of a pick-up member until a pick-up member interrupts the optical path of a pick-up camera in the conventional rotary pick-up mechanism.

  Hereinafter, typical embodiments of the present invention will be specifically described with reference to FIGS. This embodiment is a semiconductor processing apparatus having a rotary pickup mechanism as in the conventional example, and the rotary pickup mechanism has a wafer position correcting function by capturing an image of a device. For this reason, the same members as those in the conventional example shown in FIGS.

[Configuration of Rotary Pickup Mechanism in this Embodiment]
As shown in FIG. 1, in the rotary pickup mechanism 6 according to the present embodiment, four pickup heads 61 as pickup members are arranged at circumferentially equidistant positions with respect to the drive shaft 60 (that is, every 90 degrees). It is attached to extend in a shape. Each pickup head 61 is arranged such that at least the center line is shifted in the direction opposite to the rotational direction from the extended line of the radius of the circle centered on the drive shaft 60 (shown by a one-dot chain line in FIG. 2). There are features.

  This is because when the pickup head 61 is shown in a substantially cylindrical shape, the edge of the substantially cylindrical shape (rotation direction side) has a radius in a circle (shown by a one-dot chain line in FIG. 2) drawn around the drive shaft 60. It means that they are arranged close to each other. That is, if the pickup head 61 is defined as a substantially cylindrical shape, the pickup head 61 is offset in the direction opposite to the rotation direction of the pickup head 61 as compared with the conventional example in which the central axis of the substantially cylindrical shape coincides with the extension line of the radius. It will be done. If the edge on the rotational direction side of the pickup head 61 is arranged on an extension line of the circle radius centered on the drive shaft 60, the substantially cylindrical shape makes the pickup head 61 only half the width of the substantially cylindrical shape. Will be offset.

  Such a pickup head 61 basically includes a nozzle holding arm 62, a nozzle holder 63, a pickup nozzle 64, and a ball spline 65 as in the conventional pickup head 41, but the arrangement thereof is different. That is, these members included in the pickup head 61 are in a direction opposite to the rotation direction of the pickup head 61 when viewed from the extended line of the radius of the circle centered on the drive shaft 60 (shown by a one-dot chain line in FIG. 2). It is arranged close to the side.

  Further, since the rotary pickup mechanism 6 has a wafer position correction function, a pickup camera C and a prism PR are provided. Although not shown in FIG. 2, the pickup camera C is disposed at a position similar to the position shown in FIG. The prism PR is disposed in the vicinity of the drive shaft 60 of the rotary pickup mechanism 6 so as to face the device peeling position P (shown in FIG. 2). Since the position correction function of the wafer W is used in combination with the wafer moving mechanism 2, it is assumed that the rotary pickup mechanism 6 is incorporated in the semiconductor processing apparatus 10 including the wafer moving mechanism 2.

[Configuration of Semiconductor Processing Apparatus in the Present Embodiment]
A semiconductor processing apparatus 10 (shown in FIG. 2) according to the present embodiment includes a wafer moving mechanism 2, a device peeling mechanism 3, and a test handler 5 as in the conventional example shown in FIGS. In the semiconductor processing apparatus 10 of this embodiment, the rotary pickup mechanism 6 receives the device S from the wafer moving mechanism 2 and transfers it to the suction nozzle 52 of the test handler 5. As shown in FIG. 2, a suction nozzle drive mechanism 50 that moves the suction nozzle 52 up and down is attached to the top of each suction nozzle 52 of the test handler 5. When the turntable 51 rotates intermittently, the suction nozzle 52 is held in the transport line that is the raised position.

[Operation of this embodiment]
Next, the operation of this embodiment will be described. In the rotary pickup mechanism 6, when the pickup nozzle 64 faces the device peeling position P, the device S pushed up by the push-up pin 31 is received from the wafer W and is sucked and held. When the pickup operation of the device S by the pickup nozzle 64 is completed, the pickup head 61 starts to rotate. In addition, the pitch of the wafer ring R is moved by the wafer moving mechanism 2.

  After the pickup head 61 passes through the optical path L of the pickup camera C (state (A) in FIG. 3), the pickup camera C captures the image data of the device S at the device peeling position P. The wafer position correction amount is acquired. Subsequently, the wafer moving mechanism 2 moves the wafer ring R by a predetermined wafer position correction amount based on the image data captured by the pickup camera C.

  When the pickup head 61 further rotates and the rotation angle exceeds a predetermined angle, the pickup head 61 blocks the optical path L of the pickup camera C (state (B) in FIG. 3). Then, when the first pickup head 61 is rotated up to 90 degrees in the clockwise direction in FIG. 2, the second pickup nozzle 64 is pushed up by the push-up pin 31 so as to face the device peeling position P. The device S is received from the wafer W and sucked and held. Thereafter, every time the pickup head 61 rotates 90 degrees, the pickup nozzle 64 in the next pickup head 61 starts the pickup operation of the device S.

  More specifically, after the first pickup head 61 passes the optical path L of the pickup camera C between the pickup operation by the first pickup nozzle 64 and the pickup operation by the second pickup nozzle 64 (FIG. 3). (From the state (A) of FIG. 3) The following series of operations are performed until the second pickup head 61 blocks the optical path L of the pickup camera C (until the state (B) in FIG. 3).

  That is, between the two pick-up operations, the wafer movement mechanism 2 moves the pitch of the wafer ring R, the pick-up camera C acquires the wafer position correction amount by capturing the image data of the device S, and the wafer position correction amount further The position of the ring R is corrected.

  When the pick-up operation by the pick-up nozzle 64 proceeds sequentially, the first pick-up nozzle 64 is rotated 270 degrees from the first position when the fourth pick-up nozzle 64 faces the device peeling position P. Opposite the nozzle 52. When the first pickup nozzle 64 faces the suction nozzle 52 of the test handler 5, the suction nozzle drive mechanism 50 operates and the suction nozzle 52 descends from the transport line. Accordingly, the upper surface (non-electrode surface) of the device S held by suction by the first pickup nozzle 64 is in contact with the suction nozzle 52.

  The suction nozzle 52 sucks and holds the device S with the electrode surface facing downward, and at the same time, the first pickup nozzle 64 releases the suction force to the device S. Further, the suction nozzle drive mechanism 50 operates, and the suction nozzle 52 moves up to the transport line while holding the device S by suction. In this way, the device S is delivered from the first pickup head 61 to the suction nozzle 52 on the test handler 5 side.

  After the first pickup nozzle 64 delivers the device S to the suction nozzle 52, it rotates 90 degrees in the clockwise direction in FIG. 2 along with the rotation of the drive shaft 60, thereby again facing the device peeling position P. Here, the first pickup nozzle 64 receives the device S pushed up by the push-up pin 31 from the wafer W, and holds it by suction. At this time, the second pickup nozzle 45B faces the suction nozzle 52 of the test handler 5 and transfers the device S to the suction nozzle 52.

[Function and effect]
According to the rotary pickup mechanism 6 as described above, the device S can be received from the wafer W and continuously supplied to the test handler 5 while turning the device S upside down. In addition, since the device S can be received and delivered in parallel, the processing time can be shortened.

  In addition to this, the rotary pickup mechanism 6 of the present embodiment has the following unique effects. In other words, the pickup head 61 is arranged with an offset in the direction opposite to the rotation direction of the pickup head 61 when viewed from the extended line of the radius of the circle centered on the drive shaft 60 (shown by a one-dot chain line in FIG. 2). ing.

  Therefore, the pickup head 61 does not protrude greatly in the rotation direction when viewed from the extended line of the radius of the circle around the drive shaft 60. For this reason, the rotation angle until the pickup head 61 blocks the optical path L of the pickup camera C can be increased. Specifically, when the rotation angle of the conventional pickup head 41 exceeds 65 degrees, the pickup head 41 blocks the optical path L of the pickup camera C, whereas in the pickup head 61 according to this embodiment, Until the rotation angle exceeds 80 degrees, the edge of the pickup head 61 on the rotation direction side does not block the optical path L of the pickup camera C (see FIG. 4).

  As described above, the position of the wafer ring R is corrected based on the wafer position correction amount between the two pickup operations by the pickup nozzle 64. In order to obtain the wafer position correction amount, the device S of the pickup camera C is used. Image data capture is essential. Therefore, if there is even a little time between pickup operations, the pickup camera C can reliably capture the image of the device while increasing the rotational speed of the pickup head 61.

  According to the rotary pickup mechanism 6 of the present embodiment that does not block the optical path L of the pickup camera C until the rotation angle of the pickup head 61 reaches 80 degrees, there is a difference of 15 degrees in the rotation angle compared to the conventional one. is there. This can be said to be a dramatic increase in the rotation angle considering that the rotation angle of the pickup head 61 per pickup operation is 90 degrees.

  According to such an embodiment, the pickup camera C can reliably capture the image of the device S while increasing the rotational speed of the pickup head 61. Therefore, the pick-up accuracy can be improved by correcting the wafer position, and at the same time, the cycle time can be shortened, and the operation reliability and productivity can be improved.

[Other Embodiments]
The above embodiments are presented as examples and can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. And this embodiment and its deformation | transformation are included in the range and the summary of invention, and are included in the invention described in the claim, and its equivalent range.

Specifically, the number and shape of the pickup members, the arrangement position of the pickup camera C, and the like can be changed as appropriate, and the types and combinations of each processing process unit in the test handler, the arrangement order, etc. Depending on the above, the order can be changed or changed as appropriate.

DESCRIPTION OF SYMBOLS 1, 10 ... Semiconductor processing apparatus 2 ... Wafer moving mechanism 3 ... Device peeling mechanism 3
31 ... Push-up pins 4, 6 ... Rotary pickup mechanism 40, 60 ... Drive shaft 41, 61 ... Pickup head 42, 62 ... Nozzle holding arm 43, 63 ... Nozzle holder 44, 64 ... Pickup nozzle 45, 65 ... Ball spline DESCRIPTION OF SYMBOLS 5 ... Test handler 50 ... Adsorption nozzle drive mechanism 51 ... Turntable 52 ... Adsorption nozzle 53 ... Defective product discharge unit 54 ... Appearance inspection unit 55 ... Direction rotation unit 56 ... Taping unit 61 ... Pickup head 62 ... Nozzle holding arm 63 ... Nozzle Holder 64 ... Pickup nozzle C ... Pickup camera P ... Device peeling position PR ... Prism R ... Wafer ring S ... Device W ... Wafer

Claims (2)

A plurality of pickup members for picking up devices mounted on the wafer are attached to the drive shaft at circumferentially equidistant positions around the drive shaft, and an image of the device before the pickup member picks up In the rotary pickup mechanism equipped with a pickup camera that captures data,
A rotary pickup mechanism, wherein at least a center line of the pickup member is arranged so as to be shifted in a direction opposite to a rotation direction with respect to an extended line of a radius of a circle around the drive shaft. A rotary pickup mechanism according to claim 1;
A wafer moving mechanism for holding a wafer on which the device is placed and moving the wafer in a predetermined direction;
A test handler is provided that sequentially conveys the device to a process processing unit that receives the device from the rotary pickup mechanism and performs various process processes on the device.
The semiconductor processing apparatus, wherein the wafer moving mechanism is configured to correct the position of the wafer based on image data of a device captured by the pickup camera.

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